Telit Communications S p A HE910GL 2G/3.5G Module User Manual 1vv0300925 HE910 Hardware User Guide r28

Telit Communications S.p.A. 2G/3.5G Module 1vv0300925 HE910 Hardware User Guide r28

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HE910GL User Manual HTML Version

User Manual

HE910 Hardware User Guide

1vv03700925 Rev.28

– 2015-06-24

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

Applicability Table

PRODUCT

HE910 (*)

HE910-D

HE910-GL

HE910-EUR

HE910-EUD

HE910-EUG

HE910-NAR

HE910-NAD

HE910-NAG

(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes

no liability resulting from any inaccuracies or omissions in this document, or from use of the

information obtained herein. The information in this document has been carefully checked and is

believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or

omissions. Telit reserves the right to make changes to any products described herein and

reserves the right to revise this document and to make changes from time to time in content

hereof with no obligation to notify any person of revisions or changes. Telit does not assume

any liability arising out of the application or use of any product, software, or circuit described

herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products

(machines and programs), programming, or services that are not announced in your country.

Such references or information must not be construed to mean that Telit intends to announce

such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be,

include or describe copyrighted Telit material, such as computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit

and its licensors certain exclusive rights for copyrighted material, including the exclusive right

to copy, reproduce in any form, distribute and make derivative works of the copyrighted

material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in

the Telit products described in this instruction manual may not be copied, reproduced,

distributed, merged or modified in any manner without the express written permission of Telit.

Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by

implication, estoppel, or otherwise, any license under the copyrights, patents or patent

applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual

may include copyrighted Telit and other 3rd Party supplied computer programs stored in

semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit

and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,

including the exclusive right to copy or reproduce in any form the copyrighted computer

program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs

contained in the Telit products described in this instruction manual may not be copied (reverse

engineered) or reproduced in any manner without the express written permission of Telit or the

3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant

either directly or by implication, estoppel, or otherwise, any license under the copyrights,

patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal

non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished

by express license agreement only and may be used only in accordance with the terms of such

an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is

prohibited by law. No part of the software or documentation may be reproduced, transmitted,

transcribed, stored in a retrieval system, or translated into any language or computer language,

in any form or by any means, without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-

tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment

in the following hazardous environments requiring fail-safe controls: the operation of Nuclear

Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life

Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically

disclaim any expressed or implied warranty of fitness for such High Risk Activities.

Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service

names are the property of their respective owners.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

Contents

INTRODUCTION ......................................................................................................................................................... 8

1.1

COPE

................................................................................................................................................................................ 8

1.2

UDIENCE

........................................................................................................................................................................... 8

1.3

ONTACT

NFORMATION

UPPORT

.......................................................................................................................................... 8

1.4

OCUMENT

RGANIZATION

................................................................................................................................................... 9

1.5

EXT

ONVENTIONS

............................................................................................................................................................ 10

1.6

ELATED

OCUMENTS

......................................................................................................................................................... 10

1.7

OCUMENT

ISTORY

.......................................................................................................................................................... 11

OVERVIEW .............................................................................................................................................................. 12

HE910 MODULE CONNECTIONS ............................................................................................................................... 13

3.1

PIN-OUT ......................................................................................................................................................................... 13

3.1.1 LGA Pads Layout (HE910) ....................................................................................................................................... 19

3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 20

3.1.3 LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and HE910-GL) ................................................................ 21

3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG) .................................................................................................... 22

HARDWARE COMMANDS ........................................................................................................................................ 23

4.1

URNING

THE

HE910 ................................................................................................................................................... 23

4.2

URNING

OFF

THE

HE910 .................................................................................................................................................. 28

4.3

HE910

NCONDITIONAL

HUTDOWN

.................................................................................................................................... 30

POWER SUPPLY ....................................................................................................................................................... 33

5.1

OWER

UPPLY

EQUIREMENTS

............................................................................................................................................ 33

5.2

OWER

ONSUMPTION

....................................................................................................................................................... 34

5.3

ENERAL

ESIGN

ULES

...................................................................................................................................................... 35

5.3.1 Electrical Design Guidelines ................................................................................................................................... 35

5.3.2 Thermal Design Guidelines ..................................................................................................................................... 39

5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 40

GSM/WCDMA RADIO SECTION ............................................................................................................................... 42

6.1

HE910

RODUCT

ARIANTS

................................................................................................................................................ 42

6.2

UTPUT

OWER

............................................................................................................................................................ 42

6.3

ENSITIVITY

....................................................................................................................................................................... 43

6.4

GSM/WCDMA

NTENNA

EQUIREMENTS

............................................................................................................................ 43

6.5

GSM/WCDMA

PCB

LINE

UIDELINES

................................................................................................................................ 44

6.6

PCB

UIDELINES IN CASE OF

FCC

CERTIFICATION

...................................................................................................................... 46

6.6.1 Transmission line design ........................................................................................................................................ 46

6.6.2 Transmission line measurements ........................................................................................................................... 47

6.7

GSM/WCDMA

NTENNA

NSTALLATION

UIDELINES

........................................................................................................... 49

6.8

NTENNA

IVERSITY

EQUIREMENTS

..................................................................................................................................... 50

GPS RECEIVER .......................................................................................................................................................... 51

7.1

GPS

ERFORMANCES

.......................................................................................................................................................... 51

7.2

GPS

IGNALS

INOUT

......................................................................................................................................................... 52

7.3

RONT

ESIGN

....................................................................................................................................................... 52

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

7.3.1 RF Signal Requirements .......................................................................................................................................... 52

7.3.2 GPS Antenna Polarization ...................................................................................................................................... 53

7.3.3 GPS Antenna Gain .................................................................................................................................................. 54

7.3.4 Active versus Passive Antenna ............................................................................................................................... 54

7.3.5 GPS Antenna - PCB Line Guidelines ........................................................................................................................ 55

7.3.6 RF Trace Losses....................................................................................................................................................... 55

7.3.7 Implications of the Pre-select SAW Filter ............................................................................................................... 56

7.3.8 External LNA Gain and Noise Figure....................................................................................................................... 56

7.3.9 Powering the External LNA (active antenna) ......................................................................................................... 56

7.3.10 External LNA Enable ............................................................................................................................................. 57

7.3.11 Shielding ............................................................................................................................................................... 58

7.3.12 GPS Antenna - Installation ................................................................................................................................... 58

LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 59

8.1

NCONDITIONAL

HUTDOWN

............................................................................................................................................... 60

USB PORT ................................................................................................................................................................ 61

9.1

USB

2.0

ESCRIPTION

................................................................................................................................................... 61

SPI PORT ................................................................................................................................................................. 62

10.1

SPI

ONNECTIONS

............................................................................................................................................................ 63

USB HSIC ................................................................................................................................................................. 64

SERIAL PORTS .......................................................................................................................................................... 65

12.1

MODEM

SERIAL

PORT

(USIF0) ................................................................................................................................... 66

12.2

MODEM

SERIAL

PORT

(USIF1) ................................................................................................................................... 68

12.3

RS232

LEVEL TRANSLATION

................................................................................................................................................ 69

AUDIO SECTION OVERVIEW .................................................................................................................................... 71

13.1

LECTRICAL

HARACTERISTICS

............................................................................................................................................. 71

13.1.1 CODEC Examples .................................................................................................................................................. 71

GENERAL PURPOSE I/O ........................................................................................................................................... 72

14.1

GPIO

OGIC LEVELS

.......................................................................................................................................................... 73

14.2

SING A

GPIO

AD AS

INPUT ........................................................................................................................................... 74

14.3

SING A

GPIO

AD AS

OUTPUT ........................................................................................................................................ 74

14.4

NDICATION OF NETWORK SERVICE AVAILABILITY

..................................................................................................................... 75

14.5

RTC

YPASS OUT

............................................................................................................................................................. 76

14.6

XTERNAL

SIM

OLDER

MPLEMENTATION

........................................................................................................................... 76

14.7

VAUX

OWER

UTPUT

..................................................................................................................................................... 76

14.8

ADC

ONVERTER

............................................................................................................................................................. 77

14.8.1 Description ........................................................................................................................................................... 77

14.8.2 Using ADC Converter ............................................................................................................................................ 77

MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 78

15.1

ENERAL

........................................................................................................................................................................ 78

15.2

ODULE FINISHING

DIMENSIONS

..................................................................................................................................... 78

15.3

ECOMMENDED FOOT PRINT FOR THE APPLICATION

................................................................................................................. 80

15.4

TENCIL

.......................................................................................................................................................................... 81

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

15.5

PCB

PAD DESIGN

.............................................................................................................................................................. 81

15.6

PCB

PAD DIMENSIONS

....................................................................................................................................................... 82

15.7

OLDER PASTE

.................................................................................................................................................................. 84

15.7.1 HE910 Solder reflow ............................................................................................................................................. 84

15.8

ACKING SYSTEM

RAY

) .................................................................................................................................................... 86

15.9

ACKING

YSTEM

EEL

) .................................................................................................................................................... 88

15.9.1 Carrier Tape Detail ............................................................................................................................................... 88

15.9.2 Reel Detail ............................................................................................................................................................ 89

15.9.3 Packaging Detail .................................................................................................................................................. 90

15.10

OISTURE SENSITIVITY

.................................................................................................................................................... 90

SAFETY RECOMMANDATIONS ................................................................................................................................. 91

CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 92

17.1

1999/5/EC

IRECTIVE

..................................................................................................................................................... 92

17.2

FCC/IC

EGULATORY NOTICES

............................................................................................................................................ 96

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

1 Introduction

1.1 Scope

The aim of this document is the description of some hardware solutions useful for developing a

product with the Telit HE910 module.

1.2 Audience

This document is intended for Telit customers, who are integrators, about to implement their

applications using our HE910 modules.

1.3 Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit’s Technical Support Center (TTSC) at:

TS-EMEA@telit.com

TS-NORTHAMERICA@telit.com

TS-LATINAMERICA@telit.com

TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on

accessories and components visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvements.

Telit appreciates feedback from the users of our information.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

1.4 Document Organization

This document contains the following chapters:

Chapter 1: “Introduction” provides a scope for this document, target audience, contact and

support information, and text conventions.

Chapter 2: “Overview” provides an overview of the document.

Chapter3: “HE910 Module Connections” deals with the pin out configuration and layout.

Chapter 4: “Hardware Commands” How to operate on the module via hardware.

Chapter 5: “Power supply” Power supply requirements and general design rules.

Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the

most important parts in the full product design.

Chapter 7: “GPS Receiver” This section describes the GPS receiver.

Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic

levels for this module.

Chapter 9: “USB Port” The USB port on the Telit HE910 is the core of the interface between the

module and OEM hardware

Chapter 10: “SPI port” Refers to the SPI port of the Telit HE910

Chapter 11: “USB HSIC” Refers to the USB HSIC port of the Telit HE910

Chapter 12: “Serial ports” Refers to the serial ports of the Telit HE910

Chapter 13: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the

HE910 Telit Modules.

Chapter 14: “General Purpose I/O” How the general purpose I/O pads can be configured.

Chapter 15: “Mounting the HE910 on the application board” Mechanical dimensions and

recommendations on how to mount the module on the user’s board.

Chapter 16: “Safety Recommendations” Information related to the Safety topics.

Chapter 17: “Conformity Assessment Issues” Information related to the Conformity

Assessments.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

1.5 Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily

injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if

these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating

the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.6 Related Documents

• Digital Voice Interface Application Note 80000NT10050A

• SPI Port Application Note 80000NT10053A

• Product description 80378ST10085A

• SIM Holder Design Guides 80000NT10001A

• USB HSIC Port Application Note 80000NT10071A

• AT Commands Reference Guide 80378ST10091A

• Telit EVK2 User Guide 1vv0300704

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

1.7 Document History

0 2011-03-31 Preliminary Version

1 2011-05-19 Updated pinout on UART1

2 2011-05-25 Update chapter 13

3 2011-07-25 Added DVI app note references; chapter 4.1

4 2011-07-29 Updated audio, on_off/reset and digital sections

5 2011-10-18 Added STAT_LED info, Updated SPI pinout

6 2011-12-22

Pads A8, A9, D14, A14 now reserved

Power supply extended to 3.3 V

par 4.3 renamed as “unconditional shutdown”

USIF0 USIF1 names added to Main and AUX serial ports

Updated IO logic levels

Updated module’s mechanical drawing

IO levels selection 1.8/1.2 removed (now only 1.8)

7 2012-01-16 Added HE910-GA and –D; added Conformity assessment chapter

8 2012-02-03 Chapter 5.1 updated

9 2012-02-07 Chapter 4.2 updated

10 2012-03-16 Added ADC in pinout description; added GPS specification; updated Chapter

13 and 14;

11 2012-03-26 Chapter 2.1, 2.1.2, 3.3, 5.4, 14.9

12 2012-03-27 Added HE910-EU and NA products

13 2012-03-28 Updated paragraph 14.9

14 2012-05-08 Added EUR, EUD, NAR, NAD variants; added Sensitivity and TX Power

Class specifications. Updated par 14.7.1 and 14.3

15 2012-05-30 Updated Chapter 16.2; 7.3.8

16 2012-06-06 Pin R13 renamed as HW_SHUTDOWN*, Pin P11 renamed

17 2012-06-14 Updated RTT&E info on HE910-NAG, NAR, NAD

18 2012-06-15 Updated RTT&E info on HE910-NAG, NAR, NAD ; updated par 3.1;

19 2012-06-26 Pin P11 now reserved; updated par 3.1; par 4.2

20 2012-08-09 Updated par 9,1 5.3.2, 13.4, 3.1, 13.5

21 2013-04-29 Updated par 3.1, 5.1, 5.3.2, 6.4, 7, 9.1 ; added 14.8

22 2013-08-02 Updated Chapter 4, 13.4

23 2013-08-30 Updated Chapter 3.1, 4.1, 5.2, 5.3.3, 8, 9.1, 11, 13.1

24 2013-12-20 Updated Chapter 4.1, 4.2, 5.3.1.1, 5.3.1.2, 8; added USB_HSIC, Updated the

Stat Led schematic example; updated packaging tray drawing; added PCB

Guidelines for FCC.

25 2015-03-03 Add new product HE910-GL

26 2015-04-09 Removed product HE910-GA

27 2015-05-25 Updated Chapter 15.8 Packing system (Tray)

28 2015-06-24 Updated Chapters 17.1 and 17.2

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

2 Overview

The aim of this document is the description of some hardware solutions useful for developing a

product with the Telit HE910 module.

In this document all the basic functions of a mobile phone will be taken into account; for each

one of them a proper hardware solution will be suggested and eventually the wrong solutions

and common errors to be avoided will be evidenced. Obviously this document cannot embrace

the whole hardware solutions and products that may be designed. The wrong solutions to be

avoided shall be considered as mandatory, while the suggested hardware configurations shall not

be considered mandatory, instead the information given shall be used as a guide and a starting

point for properly developing your product with the Telit HE910 module. For further hardware

details that may not be explained in this document refer to the Telit HE910 Product Description

document where all the hardware information is reported.

NOTICE:

(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall

be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA HE910 all’interno dell’applicazione

dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der

in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati

projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los

cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910 dans l’application de l’utilisateur

sera faite selon les règles de conception décrites dans ce manuel.

(HE)

The information presented in this document is believed to be accurate and reliable. However, no

responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or

other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in

Telit products. This document is subject to change without notice.

HE910

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

3 HE910 module connections

3.1 PIN-OUT

PAD

Signal I/O Function Type COMMENT

USB HS 2.0 COMMUNICATION PORT

B15 USB_D+ I/O USB differential Data (+)

C15 USB_D- I/O USB differential Data (-)

A13 VUSB I Power sense for the internal USB

transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15 C103/TXD I Serial data input from DTE CMOS 1.8V

M15

C104/RXD O Serial data output to DTE CMOS 1.8V

M14

C108/DTR I Input for (DTR) from DTE CMOS 1.8V

L14 C105/RTS I Input for Request to send signal

(RTS) from DTE CMOS 1.8V

P15 C106/CTS O Output for Clear to Send signal

(CTS) to DTE

CMOS 1.8V

N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V

P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V

R14 C125/RING O Output for Ring (RI) to DTE CMOS 1.8V

Asynchronous Auxiliary Serial Port (USIF1)

D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V

E15 RX_AUX I Auxiliary UART (RX Data from

DTE) CMOS 1.8V

USB HSIC

A12 HSIC_USB_DATA I/O USB HSIC data signal CMOS 1.2V

A11 HSIC_USB_STRB I/O USB HSIC strobe signal CMOS 1.2V

H15 HSIC_SLAVE_WAKEUP I Slave Wake Up CMOS 1.8V Shared with SPI_MRDY

F15 HSIC_HOST_WAKEUP O Host Wake Up CMOS 1.8V Shared with SPI CLK

K15 HSIC_SUSPEND_REQUEST O Slave Suspend Request CMOS 1.8V Shared with GPIO08

J15 HSIC_HOST_ACTIVE I Active Host Indication CMOS 1.8V Shared with SPI_SRDY

D13 VDD_IO1 I VDD_IO1 Input To be connected to E13

E13 1V8_SEL O 1V8 SEL for VDD_IO1 To be connected to D13

SIM card interface

A6 SIMCLK O External SIM signal – Clock 1.8 / 3V

A7 SIMRST O External SIM signal – Reset 1.8 / 3V

A5 SIMIO I/O External SIM signal – Data I/O 1.8 / 3V

A4 SIMIN I External SIM signal – Presence

(active low) CMOS 1.8

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

A3 SIMVCC - External SIM signal – Power supply

for the SIM 1.8 / 3V

Digital Voice Interface (DVI)

B9 DVI_WA0 I/O Digital Audio Interface (WA0) 1.8V 16K pull down (typical at 1.8V)

when in Input

B6 DVI_RX I Digital Audio Interface (RX) 1.8V Input with 16K pull down (typical at

1.8V)

B7 DVI_TX I/O Digital Audio Interface (TX) 1.8V 16K pull down (typical at 1.8V)

when in Input

B8 DVI_CLK I/O Digital Audio Interface (CLK) 1.8V Input with 16K pull down (typical at

1.8V)

SPI

D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX

E15 SPI_MISO O SPI_MISO CMOS 1.8V Shared with RX_AUX

F15 SPI_CLK I SPI Clock CMOS 1.8V Shared with

HSIC_HOST_WAKEUP

H15 SPI_MRDY I SPI_MRDY CMOS 1.8V Shared with

HSIC_SLAVE_WAKEUP

J15 SPI_SRDY O SPI_SRDY CMOS 1.8V Shared with

HSIC_HOST_ACTIVE

DIGITAL IO

C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V Alternate Function STAT LED

C9 GPIO_02 I/O GPIO_02 CMOS 1.8V

C10 GPIO_03 I/O GPIO_03 CMOS 1.8V

C11 GPIO_04 I/O GPIO_04 CMOS 1.8V

B14 GPIO_05 I/O GPIO_05 CMOS 1.8V

C12 GPIO_06 I/O GPIO_06 CMOS 1.8V

C13 GPIO_07 I/O GPIO_07 CMOS 1.8V

K15 GPIO_08 I/O GPIO_08 CMOS 1.8V Shared with

HSIC_SUSPEND_REQUEST

L15 GPIO_09 I/O GPIO_09 CMOS 1.8V

G15 GPIO_10 I/O GPIO_10 CMOS 1.8V

ADC

B1 ADC_IN1 AI Analog / Digital converter input A/D Accepted values 0 to 1.2V DC

RF SECTION

K1 ANTENNA I/O GSM/EDGE/UMTS Antenna

(50 ohm) RF

F1 ANT_DIV I Antenna Diversity Input

(50 ohm) RF See NOTE 1

GPS SECTION (see NOTE1)

R9 ANT_GPS I GPS Antenna (50 ohm) RF

R7 GPS_LNA_EN O Output enable for External LNA

supply CMOS 1.8V

Miscellaneous Functions

R13 HW_SHUTDOWN* I HW Unconditional Shutdown 1.8V Active low

R12 ON_OFF* I Input command for power ON 1.8V Active low

C14 VRTC I VRTC Backup capacitor Power backup for the embedded RTC supply

(1.8V)

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

R11 VAUX/PWRMON O Supply Output for external

accessories / Power ON Monitor 1.8V

Power Supply

M1 VBATT - Main power supply (Baseband) Power

M2 VBATT - Main power supply (Baseband) Power

N1 VBATT_PA - Main power supply (Radio PA) Power

N2 VBATT_PA - Main power supply (Radio PA) Power

P1 VBATT_PA - Main power supply (Radio PA) Power

P2 VBATT_PA - Main power supply (Radio PA) Power

E1 GND - Ground Power

G1 GND - Ground Power

H1 GND - Ground Power

J1 GND - Ground Power

L1 GND - Ground Power

A2 GND - Ground Power

E2 GND - Ground Power

F2 GND - Ground Power

G2 GND - Ground Power

H2 GND - Ground Power

J2 GND - Ground Power

K2 GND - Ground Power

L2 GND - Ground Power

R2 GND - Ground Power

M3 GND - Ground Power

N3 GND - Ground Power

P3 GND - Ground Power

R3 GND - Ground Power

D4 GND - Ground Power

M4 GND - Ground Power

N4 GND - Ground Power

P4 GND - Ground Power

R4 GND - Ground Power

N5 GND - Ground Power

P5 GND - Ground Power

R5 GND - Ground Power

N6 GND - Ground Power

P6 GND - Ground Power

R6 GND - Ground Power

P8 GND - Ground Power

R8 GND - Ground Power

P9 GND - Ground Power

P10 GND - Ground Power

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

R10 GND - Ground Power

M12

GND - Ground Power

B13 GND - Ground Power

P13 GND - Ground Power

E14 GND - Ground Power

RESERVED

C1 RESERVED - RESERVED

D1 RESERVED - RESERVED

B2 RESERVED - RESERVED

C2 RESERVED - RESERVED

D2 RESERVED - RESERVED

B3 RESERVED - RESERVED

C3 RESERVED - RESERVED

D3 RESERVED - RESERVED

E3 RESERVED - RESERVED

F3 RESERVED - RESERVED

G3 RESERVED - RESERVED

H3 RESERVED - RESERVED

J3 RESERVED - RESERVED

K3 RESERVED - RESERVED

L3 RESERVED - RESERVED

B4 RESERVED - RESERVED

C4 RESERVED - RESERVED

B5 RESERVED - RESERVED

C5 RESERVED - RESERVED

C6 RESERVED - RESERVED

C7 RESERVED - RESERVED

N7 RESERVED - RESERVED

P7 RESERVED - RESERVED

N8 RESERVED - RESERVED

N9 RESERVED - RESERVED

A10 RESERVED - RESERVED

N10 RESERVED - RESERVED

N11 RESERVED - RESERVED

P11 RESERVED - RESERVED

B12 RESERVED - RESERVED

D12 RESERVED - RESERVED

N12 RESERVED - RESERVED

P12 RESERVED - RESERVED

F14 RESERVED - RESERVED

G14 RESERVED - RESERVED

H14 RESERVED - RESERVED

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

J14 RESERVED - RESERVED

K14 RESERVED - RESERVED

N13 RESERVED - RESERVED

L13 RESERVED - RESERVED

J13 RESERVED - RESERVED

M13

RESERVED - RESERVED

K13 RESERVED - RESERVED

H13 RESERVED - RESERVED

G13 RESERVED - RESERVED

F13 RESERVED - RESERVED

B11 RESERVED - RESERVED

B10 RESERVED - RESERVED

A9 RESERVED - RESERVED

A8 RESERVED - RESERVED

D14 RESERVED - RESERVED

A14 RESERVED - RESERVED

WARNING:

Reserved pins must not be connected.

NOTE 1:

The following table is listing the main Pinout differences between the HE910 variants

Product GPS Antenna

Diversity

Notes

HE910 (*) YES YES

HE910-D NO YES

Reserved Pads: R7, R9

HE910-GL NO NO

Reserved Pads:,F1, R7, R9

HE910-EUR NO NO

Reserved Pads:,F1, R7, R9

HE910-EUD NO NO

Reserved Pads:,F1, R7, R9

HE910-EUG YES NO

Reserved Pads: F1

HE910-NAR NO NO

Reserved Pads: F1, R7, R9

HE910-NAD NO NO

Reserved Pads: F1, R7, R9

HE910-NAG YES NO

Reserved Pads: F1

(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

NOTE:

If not used, almost all pins should be left disconnected. The only exceptions are the following

pins:

RTS pin should be connected to the GND (on the module side) if flow control is not used.

The above pins are also necessary to debug the application when the module is assembled on it so we

recommend connecting them also to dedicated test point.

PAD Signal Notes

M1,M2,N1,N2,P1,P2 VBATT & VBATT_PA

E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,

J2,K2,L2,R2,M3,N3,P3,R3,D4,M4,

N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,

R8,P9,P10,R10,M12,B13,P13,E14

GND

R12 ON/OFF*

R13 HW_SHUTDOWN*

B15 USB_D+ If not used should be connected to a

Test Point or an USB connector

C15 USB_D- If not used should be connected to a

Test Point or an USB connector

A13 VUSB If not used should be connected to a

Test Point or an USB connector

N15 C103/TXD If not used should be connected to a

Test Point

M15 C104/RXD If not used should be connected to a

Test Point

L14 C105/RTS If the flow control is not used it

should be connected to GND

P15 C106/CTS If not used should be connected to a

Test Point

D15 TXD_AUX If not used should be connected to a

Test Point

E15 RXD_AUX If not used should be connected to a

Test Point

D13 VDD_IO1 It has always to be connected to

1V8_SEL

E13 1V8_SEL It has always to be connected to

VDD_IO1

K1 MAIN ANTENNA

F1 ANT_DIV (if supported by the

product)

If not used it could left unconnected

but has to be disabled by the related

AT Command (AT#RXDIV);

please refer to the At User guide for

the related syntax

R9 ANT_GPS (if supported by the

product) If the GPS is not used it could be

left unconnected

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

3.1.1 LGA Pads Layout (HE910)

TOP VIEW

A B C D E F G H J K L M N P R

1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_

PA VBATT_

2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_

PA VBATT_

PA GND

3 SIMVC

C RES RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN RES RES GND GND GND GND GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GND

7 SIMRS

T DVI_TX RES RES RES GPS_LN

A_EN

8 RES DVI_CLK GPIO_01 RES GND GND

9 RES DVI_WA

0 GPIO_02 RES GND ANT_GP

10 RES RES GPIO_03 RES GND GND

11 HSIC_U

SB_ST

RB RES GPIO_04 RES RES VAUX/P

WRMON

12 HSIC_U

SB_DA

TA RES GPIO_06 RES GND RES RES ON_OFF

13 VUSB GND GPIO_07 VDD_IO

1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH

UTDOW

14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT

S C108/DT

R C109/DC

D C107/DS

R C125/RI

15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR

DY SPI_SR

DY GPIO_08 GPIO_09 C104/RX

D C103/TX

D C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 is the “type name” of the products marketed as HE910-G & HE910-DG.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

3.1.2 LGA Pads Layout (HE910-D)

TOP VIEW

A B C D E F G H J K L M N P R

1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_

PA VBATT_

2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_

PA VBATT_

PA GND

3 SIMVC

C RES RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN RES RES GND GND GND GND GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GND

7 SIMRS

T DVI_TX RES RES RES RES

8 RES DVI_CLK GPIO_01 RES GND GND

9 RES DVI_WA

0 GPIO_02 RES GND RES

10 RES RES GPIO_03 RES GND GND

11 HSIC_U

SB_ST

RB RES GPIO_04 RES RES VAUX/P

WRMON

12 HSIC_U

SB_DA

TA RES GPIO_06 RES GND RES RES ON_OFF

13 VUSB GND GPIO_07 VDD_IO

1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH

UTDOW

14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT

S C108/DT

R C109/DC

D C107/DS

R C125/RI

15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR

DY SPI_SR

DY GPIO_08 GPIO_09 C104/RX

D C103/TX

D C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

3.1.3 LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR

and HE910-GL)

TOP VIEW

A B C D E F G H J K L M N P R

1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_

PA VBATT_

2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_

PA VBATT_

PA GND

3 SIMVC

C RES RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN RES RES GND GND GND GND GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GND

7 SIMRS

T DVI_TX RES RES RES RES

8 RES DVI_CLK GPIO_01 RES GND GND

9 RES DVI_WA

0 GPIO_02 RES GND RES

10 RES RES GPIO_03 RES GND GND

11 HSIC_U

SB_ST

RB RES GPIO_04 RES RES VAUX/P

WRMON

12 HSIC_U

SB_DA

TA RES GPIO_06 RES GND RES RES ON_OFF

13 VUSB GND GPIO_07 VDD_IO

1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH

UTDOW

14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT

S C108/DT

R C109/DC

D C107/DS

R C125/RI

15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR

DY SPI_SR

DY GPIO_08 GPIO_09 C104/RX

D C103/TX

D C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG)

TOP VIEW

A B C D E F G H J K L M N P R

1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_

PA VBATT_

2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_

PA VBATT_

PA GND

3 SIMVC

C RES RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN RES RES GND GND GND GND GND

5 SIMIO RES RES GND GND GND

6 SIMCLK DVI_RX RES GND GND GND

7 SIMRS

T DVI_TX RES RES RES GPS_LN

A_EN

8 RES DVI_CLK GPIO_01 RES GND GND

9 RES DVI_WA

0 GPIO_02 RES GND ANT_GP

10 RES RES GPIO_03 RES GND GND

11 HSIC_U

SB_ST

RB RES GPIO_04 RES RES VAUX/P

WRMON

12 HSIC_U

SB_DA

TA RES GPIO_06 RES GND RES RES ON_OFF

13 VUSB GND GPIO_07 VDD_IO

1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH

UTDOW

14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT

S C108/DT

R C109/DC

D C107/DS

R C125/RI

15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR

DY SPI_SR

DY GPIO_08 GPIO_09 C104/RX

D C103/TX

D C106/CT

NOTE:

The pin defined as RES has to be considered RESERVED and not connected on any pin in the

application.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

4 Hardware Commands

4.1 Turning ON the HE910

To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then

released.

The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.

A simple circuit to do it is:

NOTE:

Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up

resistor may bring to latch up problems on the HE910 power regulator and improper power

on/off of the module. The line ON_OFF* must be connected only in open collector or open

drain configuration.

NOTE:

In this document all the lines that are inverted, hence have active low signals are labelled with a

name that ends with”#",”*” or with a bar over the name.

TIP:

To check if the device has powered on, the hardware line PWRMON should be monitored.

NOTE:

It is mandatory to avoid sending data to the serial ports during the first 200ms of the module

start-up.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

A flow chart showing the proper turn on procedure is displayed below:

“Modem ON Proc”

START

GOTO

“HW SHUTDOWN

unconditional”

GOTO

“Start AT CMD

.”

PWMON = ON

Delay 1s

ON_OFF* = LOW

Delay = 5 Sec

ON_OFF* = HIGH

“Modem ON Proc”

END

ATT

3.22V

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

A flow chart showing the AT commands managing procedure is displayed below:

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

For example:

AT answer in

1 sec ?

“Start AT CMD.”

START

DELAY 300msec

Enter AT<CR>

“Start AT CMD.”

END

GOTO

“HW SHUTDOWN

unconditional

”

GOTO

“Modem ON Proc.”

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V

microcontroller (uP_OUT1):

2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button:

WARNING

It is recommended to set the ON_OFF* line LOW to power on the module only after VBATT is higher

than 3.22V.

HE910 Hardware User Guide

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In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and

then restart the power on activity using the ON_OFF * line.

An example of this is described in the following diagram:

After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on the

module.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

4.2 Turning OFF the HE910

Turning off of the device can be done in two ways:

• via AT command (see HE910 Software User Guide, AT#SHDN)

• by tying low pin ON_OFF*

Either ways, the device issues a detach request to network informing that the device will not be

reachable any more.

To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 3 seconds and then

released.

TIP:

To check if the device has been powered off, the hardware line PWRMON must be monitored.

The device is powered off when PWRMON goes low.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

The following flow chart shows the proper turn off procedure:

Modem OFF Proc.

START

PWMON = ON

OFF Mode

ON_OFF* = LOW

Delay >= 3 Sec

ON_OFF* = HIGH

“Modem OFF Proc”

END

PWRMON=ON?

Key

AT#SHDN

GOTO

“HW Shutdown

Unconditional”

Looping for more

than 15s ?

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

4.3 HE910 Unconditional Shutdown

The Unconditional Shutdown of the module could be activated using the

HW_SHUTDOWN* line (pad R13).

WARNING:

The hardware unconditional Shutdown must not be used during normal operation of the device

since it does not detach the device from the network. It shall be kept as an emergency exit

procedure.

To unconditionally shutdown the HE910, the pad

HW_SHUTDOWN*

must be tied low for at

least 200 milliseconds and then released.

NOTE:

Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital

output. Using pull up resistor may bring to latch up problems on the HE910 power regulator and

improper functioning of the module. The line HW_SHUTDOWN* must be connected only in

open collector configuration.

The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an

automatic restart.

The module will shutdown, but will NOT perform the detach from the cellular network.

To proper power on again the module please refer to the related paragraph (“Powering ON the

HE910”)

TIP:

The unconditional hardware shutdown must always be implemented on the boards and should be

used only as an emergency exit procedure.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

A typical circuit is the following:

For example:

1- Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of

a +3/5 V microcontroller (uP_OUT2):

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

In the following flow chart is detailed the proper restart procedure:

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

“HW SHUTDOWN

Unconditional”

START

HW_SHDN = LOW

Delay 200ms

HW_SHDN = HIGH

PWRMON = ON

Delay 1s

Disconnect

VBATT

“HW SHUTDOWN

Unconditional”

END

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

5 Power Supply

The power supply circuitry and board layout are a very important part in the full product design

and they strongly reflect on the product overall performances, hence read carefully the

requirements and the guidelines that will follow for a proper design.

5.1 Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil

the following requirements:

POWER SUPPLY

Nominal Supply Voltage

3.8 V

Normal Operating Voltage Range

3.40 V÷ 4.20 V

Extended Operating Voltage Range

3.10 V÷ 4.50 V

NOTE:

The Operating Voltage Range MUST never be exceeded; care must be taken when designing the

application’s power supply section to avoid having an excessive voltage drop.

If the voltage drop is exceeding the limits it could cause a Power Off of the module.

The Power supply must be higher than 3.22 V to power on the module

NOTE:

Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage

(regarding MIN Extended Operating Voltage) MUST never be exceeded;

The “Extended Operating Voltage Range” can be used only with completely assumption and

application of the HW User guide suggestions.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

5.2 Power Consumption

HE910

Mode Average

(mA) Mode description

SWITCHED OFF Module supplied but Switched Off

Switched Off 40uA IDLE mode (WCDMA)

AT+CFUN=1 12.2 Normal mode: full functionality of the module

AT+CFUN=5 1.2 Full functionality with power saving; DRX7;

Module registered on the network can receive incoming calls

and SMS

IDLE mode (GSM/EDGE)

AT+CFUN=1 19 Normal mode: full functionality of the module

AT+CFUN=4 16.5 Disabled TX and RX; module is not registered on the network

AT+CFUN=5 0.8 Full functionality with power saving;

DRX9 (1.3mA in case of DRX5).

Operative mode (WCDMA)

WCDMA Voice 152 WCDMA voice call (TX = 10dBm)

WCDMA HSDPA (0dBm) 187 WCDMA data call (Cat 14, TX = 0dBm)

WCDMA HSDPA (22dBm) 494 WCDMA data call (Cat 14, TX = 22dBm)

Operative mode (EDGE)

EDGE 4TX+2RX EDGE Sending data mode GSM900 PL5 495

DCS1800 PL0 484 Operative mode (GSM)

CSD TX and RX mode GSM VOICE CALL GSM900 CSD PL5 220

DCS1800 CSD PL0 167

GPRS 4TX+2RX GPRS Sending data mode GSM900 PL5 580

DCS1800 PL0 438

The GSM system is made in a way that the RF transmission is not continuous, else it is packed

into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as

about 2A. Therefore the power supply has to be designed in order to withstand with these

current peaks without big voltage drops; this means that both the electrical design and the board

layout must be designed for this current flow. If the layout of the PCB is not well designed a

strong noise floor is generated on the ground and the supply; this will reflect on all the audio

paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current

absorption is too much, then the device may even shutdown as a consequence of the supply

voltage drop.

NOTE:

The electrical design for the Power supply should be made ensuring it will be capable of a peak

current output of at least 2 A.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

5.3 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout.

5.3.1 Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this

power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

5.3.1.1 + 5V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference between

the input source and the desired output and a linear regulator can be used. A switching

power supply will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the

power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks close to the HE910, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is

rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the HE910

from power polarity inversion.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

An example of linear regulator with 5V input is:

5.3.1.2 + 12V input Source Power Supply Design

Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between the

input source and the desired output, a linear regulator is not suited and shall not be used. A

switching power supply will be preferable because of its better efficiency especially with the

2A peak current load represented by the HE910.

• When using a switching regulator, a 500kHz or more switching frequency regulator is

preferable because of its smaller inductor size and its faster transient response. This allows

the regulator to respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the application to be

developed due to the fact the switching frequency could also generate EMC interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind

when choosing components: all components in the power supply must withstand this

voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the

current absorption peaks, a 100µF tantalum capacitor is usually suited.

HE910 Hardware User Guide

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• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is

rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power input, in

order to clean the supply from spikes.

• A protection diode should be inserted close to the power input, in order to save the HE910

from power polarity inversion. This can be the same diode as for spike protection.

An example of switching regulator with 12V input is in the below schematic:

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

5.3.1.3 Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage

allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the

power to the Telit HE910 module.

WARNING:

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE

USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage

for the HE910 and damage it.

NOTE:

DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910. Their use

can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current

absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the HE910 from

power polarity inversion. Otherwise the battery connector should be done in a way to avoid

polarity inversions when connecting the battery.

• The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the

suggested capacity is from 500mAh to 1000mAh.

HE910 Hardware User Guide

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5.3.2 Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following

specifications:

• Average current consumption during HSDPA transmission @PWR level max :

600 mA

• Average current during idle:

1.5 mA

NOTE:

The average consumption during transmissions depends on the power level at which the device

is requested to transmit by the network. The average current consumption hence varies

significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it

is possible to consider from the thermal point of view that the device absorbs current

significantly only during calls.

If we assume that the device stays into transmission for short periods of time (let's say few

minutes) and then remains for a quite long time in idle (let's say one hour), then the power

supply has always the time to cool down between the calls and the heat sink could be smaller

than the calculated one for 600mA maximum RMS current, or even could be the simple chip

package (no heat sink).

Moreover in the average network conditions the device is requested to transmit at a lower power

level than the maximum and hence the current consumption will be less than the 600mA, being

usually around 150mA.

For these reasons the thermal design is rarely a concern and the simple ground plane where the

power supply chip is placed can be enough to ensure a good thermal condition and avoid

overheating.

For the heat generated by the HE910, you can consider it to be during transmission 1W max

during CSD/VOICE calls and 2W max during GPRS upload.

This generated heat will be mostly conducted to the ground plane under the HE910; you must

ensure that your application can dissipate it.

HE910 Hardware User Guide

1vv0300925 Rev.28 – 2015-06-24

5.3.3 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on

the output to cut the current peaks and a protection diode on the input to protect the supply from

spikes and polarity inversion. The placement of these components is crucial for the correct

working of the circuitry. A misplaced component can be useless or can even decrease the power

supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit HE910 power

input pads or in the case the power supply is a switching type it can be placed close

to the inductor to cut the ripple provided the PCB trace from the capacitor to the

HE910 is wide enough to ensure a dropless connection even during the 2A current

peaks.

• The protection diode must be placed close to the input connector where the power

source is drained.

• The PCB traces from the input connector to the power regulator IC must be wide

enough to ensure no voltage drops occur when the 2A current peaks are absorbed.

Note that this is not made in order to save power loss but especially to avoid the

voltage drops on the power line at the current peaks frequency of 216 Hz that will

reflect on all the components connected to that supply, introducing the noise floor at

the burst base frequency. For this reason while a voltage drop of 300-400 mV may

be acceptable from the power loss point of view, the same voltage drop may not be

acceptable from the noise point of view. If your application doesn't have audio

interface but only uses the data feature of the Telit HE910, then this noise is not so

disturbing and power supply layout design can be more forgiving.

• The PCB traces to the HE910 and the Bypass capacitor must be wide enough to

ensure no significant voltage drops occur when the 2A current peaks are absorbed.

This is for the same reason as previous point. Try to keep this trace as short as

possible.

• The PCB traces connecting the Switching output to the inductor and the switching

diode must be kept as short as possible by placing the inductor and the diode very

close to the power switching IC (only for switching power supply). This is done in

order to reduce the radiated field (noise) at the switching frequency (100-500 kHz

usually).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to

guarantee that the high current return paths in the ground plane are not overlapped

to any noise sensitive circuitry as the microphone amplifier/buffer or earphone

amplifier.

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• The power supply input cables should be kept separate from noise sensitive lines

such as microphone/earphone cables.

• The insertion of EMI filter on VBATT pins is suggested in those designs where

antenna is placed close to battery or supply lines.

A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N

FBMH1608HM101 can be used for this purpose.

The below figure shows the recommended circuit:

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6 GSM/WCDMA Radio Section

6.1 HE910 Product Variants

The following table is listing the main differences between the HE910 variants:

Product Supported 2G Bands

Supported 3G bands

Antenna Diversity

HE910 GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B1, B2, B4, B5, B8 FDD B1, B2, B5, B8 GSM

850, GSM 900, PCS 1900

HE910-D GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B1, B2, B4, B5, B8 FDD B1, B2, B5, B8 GSM

850, GSM 900, PCS 1900

HE910-GL GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B1, B2, B4, B5, B8 FDD B1, B2, B5, B8 GSM

850, GSM 900, PCS 1900

HE910-EUR GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B1, B5, B8 NO

HE910-EUD GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B1, B5, B8 NO

HE910-EUG GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B1, B5, B8 NO

HE910-NAR GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B2, B4, B5 NO

HE910-NAD GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B2, B4, B5 NO

HE910-NAG GSM 850, GSM 900,

DCS1800, PCS 1900 FDD B2, B4, B5 NO

6.2 TX Output Power

Band Power Class

GSM 850 / 900 4 (2W)

DCS1800 / PCS 1900 1 (1W)

EDGE, 850/900 MHz E2 (0.5W)

EDGE, 1800/1900 MHz Class E2 (0.4W)

WCDMA FDD B1, B2, B4, B5, B8 Class 3 (0.25W)

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6.3 Sensitivity

6.4 GSM/WCDMA Antenna Requirements

The antenna connection and board layout design are the most important aspect in the full

product design as they strongly affect the product overall performances, hence read carefully

and follow the requirements and the guidelines for a proper design.

The antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the

following requirements:

ANTENNA REQUIREMENTS

Frequency range Depending by frequency band(s) provided by the network operator, the

customer shall use the most suitable antenna for that/those band(s)

Bandwidth (GSM/EDGE) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140

MHz PCS band

Bandwidth

(WCDMA)

70 MHz in WCDMA Band V

80 MHz in WCDMA Band VIII

460 MHz in WCDMA Band IV

140 MHz in WCDMA Band II

250 MHz in WCDMA Band I

Impedance 50 ohm

Input power > 33dBm(2 W) peak power in GSM

> 24dBm Average power in WCDMA

VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)

VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements)

When using the HE910, since there's no antenna connector on the module, the antenna must

be connected to the HE910 antenna pad (K1) by means of a transmission line implemented

on the PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB

line is needed in order to connect with it or with its connector.

Band Typical

(without Diversity)

Note

GSM 850

109.5 dBm

BER Class II <2.44%

GSM 900

109 dBm

BER Class II <2.44%

DCS1800

110 dBm

BER Class II <2.44%

PCS 1900

109.5 dBm

BER Class II <2.44%

WCDMA FDD B1

111 dBm

BER <0.1%

WCDMA FDD B2

110 dBm

BER <0.1%

WCDMA FDD B4

111 dBm

BER <0.1%

WCDMA FDD B5

111 dBm

BER <0.1%

WCDMA FDD B8

110 dBm

BER <0.1%

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This transmission line shall fulfil the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Characteristic Impedance 50 ohm

Max Attenuation 0,3 dB

Coupling with other signals shall be avoided

Cold End (Ground Plane) of antenna shall be equipotential to

the HE910 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall

comply with the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. In order to re-use the Telit

FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a

separation distance of at least 20 cm from all persons and must not be co-located or operating

in conjunction with any other antenna or transmitter. If antenna is installed with a separation

distance of less than 20 cm from all persons or is co-located or operating in conjunction with

any other antenna or transmitter then additional FCC/IC testing may be required. End-Users

must be provided with transmitter operation conditions for satisfying RF exposure

compliance.

Antennas used for this OEM module must not exceed the gains for mobile and fixed

operating configurations as described in “FCC/IC Regulatory notices” chapter.

6.5 GSM/WCDMA - PCB line Guidelines

• Make sure that the transmission line’s characteristic impedance is 50ohm ;

• Keep line on the PCB as short as possible, since the antenna line loss shall be less than

around 0,3 dB;

• Line geometry should have uniform characteristics, constant cross section, avoid meanders

and abrupt curves;

• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded

Coplanar Waveguide...) can be used for implementing the printed transmission line afferent

the antenna;

• If a Ground plane is required in line geometry, that plane has to be continuous and

sufficiently extended, so the geometry can be as similar as possible to the related canonical

model;

• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible,

use this layer as reference Ground plane for the transmission line;

• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having

other signal tracks facing directly the antenna line track.

• Avoid crossing any un-shielded transmission line footprint with other signal tracks on

different layers;

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• The ground surrounding the antenna line on PCB has to be strictly connected to the main

Ground Plane by means of via holes (once per 2mm at least), placed close to the ground

edges facing line track;

• Place EM noisy devices as far as possible from HE910 antenna line;

• Keep the antenna line far away from the HE910 power supply lines;

• If EM noisy devices are present on the PCB hosting the HE910, such as fast switching ICs,

take care of the shielding of the antenna line by burying it inside the layers of PCB and

surround it with Ground planes, or shield it with a metal frame cover.

• If EM noisy devices are not present around the line, the use of geometries like Microstrip or

Grounded Coplanar Waveguide has to be preferred, since they typically ensure less

attenuation if compared to a Stripline having same length;

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6.6 PCB Guidelines in case of FCC

certification

In the case FCC certification is required for an application using HE910, HE910-D, HE910-

NAx, according to FCC KDB 996369 for modular approval requirements, the transmission line

has to be similar to that implemented on module’s interface board and described in the following

chapter.

6.6.1 Transmission line design

During the design of the interface board, the placement of components has been chosen properly,

in order to keep the line length as short as possible, thus leading to lowest power losses possible.

A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of

transmission line ensures good impedance control and can be implemented in an outer PCB layer

as needed in this case. A SMA female connector has been used to feed the line.

The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by

relative permittivity ε

= 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.

A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance

from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer

3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane

is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1

dB. The line geometry is shown below:

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6.6.2 Transmission line measurements

HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated

coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has

been soldered to the board in order to characterize the losses of the transmission line including

the connector itself. During Return Loss / impedance measurements, the transmission line has

been terminated to 50 Ω load.

Return Loss plot of line under test is shown below:

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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is

shown in the following figure:

Insertion Loss of G-CPW line plus SMA connector is shown below:

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6.7 GSM/WCDMA Antenna - Installation

Guidelines

• Install the antenna in a place covered by the GSM signal.

• If the device antenna is located greater then 20cm from the human body and there are no co-

located transmitter then the Telit FCC/IC approvals can be re-used by the end product

• If the device antenna is located less then 20cm from the human body or there are no co-

located transmitter then the additional FCC/IC testing may be required for the end product

(Telit FCC/IC approvals cannot be reused)

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

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6.8 Antenna Diversity Requirements

This product is including an input for a second RX antenna to improve the radio sensitivity. The

function is called Antenna Diversity.

ANTENNA REQUIREMENTS

Frequency range Depending by frequency band(s) provided by the network

operator, the customer shall use the most suitable antenna for

that/those band(s)

Bandwidth (GSM/EDGE) 70 MHz in GSM850, 80 MHz in GSM900 & 140 MHz PCS

band

Bandwidth

(WCDMA)

70 MHz in WCDMA Band V

80 MHz in WCDMA Band VIII

140 MHz in WCDMA Band II

250 MHz in WCDMA Band I

Impedance 50 ohm

When using the HE910, since there's no antenna connector on the module, the antenna must be

connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the

PCB.

In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB

line is needed in order to connect with it or with its connector.

The second Rx antenna should not be located in the close vicinity of main antenna. In order to

improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be

located at the maximum reciprocal distance possible, taking into consideration the available

space into the application.

NOTE1:

The Diversity is not supported on DCS 1800 in 2G and FDD BAND IV in 3G

NOTE:

If the RX Diversity is not used/connected, disable the Diversity functionality using the

AT#RXDIV command (ref to the AT User guide for the proper syntax) and leave the pad F1

unconnected.

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7 GPS Receiver

The HE910 module is integrating a GPS receiver that could be used in Autonomous or in A-GPS

(assisted GPS) mode.

With the help of advanced digital signal processing algorithms and the use of A-GPS data, the receiver

is capable to achieve sensitivity values of better than -165 dBm as is required for indoor applications.

The following table is listing the HE910 variants that support the GPS receiver:

Product GPS Receiver

HE910 YES

HE910-D NO

HE910-GL NO

HE910-EUR NO

HE910-EUD NO

HE910-EUG YES

HE910-NAR NO

HE910-NAD NO

HE910-NAG YES

7.1 GPS Performances

• Advanced real time hardware correlation engine for enhanced sensitivity (better than -165 dBm for

A-GPS).

• Fast Acquisition giving rapid Time-to-First-Fix (TTFF)

• Capability to monitor up to 28 channels

• Stand Alone and Assisted mode

• Integrated LNA

The following Table is listing the main characteristics:

Characteristic Typical Values

GPS RX Sensitivity -164dBm

GPS Cold Start Autonomous -147dBm

GPS Hot Start Autonomous -161dBm

GPS tracking mode -166 dBm

GPS Accuracy 3m

TTFF from Cold Start 42 sec

TTF from Warm Start 30sec

TTF from Hot Start 1.8 sec

Power Consumption in Acquisition 46.4 mA @3.8V

Power Consumption in Tracking 37.8 mA @3.8V

Power Consumption in Low Power Tracking 25.7 mA @3.8V

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7.2 GPS Signals Pinout

The Pads related to this function are the following:

PAD

Signal I/O Function Type

R9 ANT_GPS I GPS Antenna (50 ohm) RF

R7 GPS_LNA_EN O Output enable for External LNA supply CMOS 1.8V

7.3 RF Front End Design

The HE910 Module contains an integrated LNA and pre-select SAW filter. This allows the module to

work well with a passive GPS antenna. If the antenna cannot be located near the HE910, then an active

antenna (that is, an antenna with a low noise amplifier built in) can be used.

7.3.1 RF Signal Requirements

The HE910 can achieve Cold Start acquisition with a signal level of -147 dBm at its input. This means

the GPS receiver can find the necessary satellites, download the necessary ephemeris data and compute

the location within a 5 minute period.

In the GPS signal acquisition process, downloading and decoding the data is the most difficult task,

which is why Cold Start acquisition requires a higher signal level than navigation or tracking signal

levels. For the purposes of this discussion, autonomous operation is assumed, which makes the Cold

Start acquisition level the important design constraint. If assistance data in the form of time or

ephemeris aiding is available, then even lower signal levels can be used to compute a navigation

solution.

Each GPS satellite presents its own signal to the HE910, and best performance is obtained when the

signal levels are between -125 dBm and -117 dBm. These received signal levels are determined by :

• GPS satellite transmit power

• GPS satellite elevation and azimuth

• Free space path loss

• Extraneous path loss such as rain

• Partial or total path blockage such as foliage or building

• Multipath caused by signal reflection

• GPS antenna

• Signal path after the GPS antenna

The first three items in the list above are specified in IS-GPS-200E, readily available multiple sources

online. IS-GPS-200E specifies a signal level minimum of -130 dBm will be presented to the receiver

when using a linearly polarized antenna with 3 dBi gain.

The GPS signal is relatively immune to rainfall attenuation and does not really need to be considered.

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However, the GPS signal is heavily influenced by attenuation due to foliage such as tree canopies, etc.,

as well as outright blockage caused by building, terrain or other items in the line of sight to the specific

GPS satellite. This variable attenuation is highly dependent upon GPS satellite location. If enough

satellites are blocked, say at a lower elevation, or all in a general direction, the geometry of the

remaining satellites will result is a lower accuracy of position. The HE910 reports this geometry in the

form of PDOP, HDOP and VDOP.

For example, in a vehicular application, the GPS antenna may be placed embedded into the dashboard

or rear package tray of an automobile. The metal roof of the vehicle will cause significant blockage,

plus any thermal coating applied to the vehicle glass can attenuate the GPS signal by as much as 15 dB.

Again, both of these factors will affect the performance of the receiver.

Multipath is a phenomena where the signal from a particular satellite is reflected and is received by the

GPS antenna in addition to or in place of the original line of sight signal. The multipath signal has a

path length that is longer than the original line of sight path and can either attenuate the original signal,

or if received in place of the original signal add additional error in determining a solution because the

distance to the particular GPS satellite is actually longer than expected. It is this phenomena that makes

GPS navigation in urban canyons (narrow roads surround by high rise buildings) so challenging. In

general, the reflecting of the GPS signal causes the polarization to reverse. The implications of this are

covered in the next section.

7.3.2 GPS Antenna Polarization

The GPS signal as broadcast is a right hand circularly polarized signal. The best antenna to receive the

GPS signal is a right hand circularly (RHCP) polarized antenna.

Remember that IS-GPS-200E specifies the receive power level with a linearly polarized antenna. A

linearly polarized antenna will have 3 dB loss as compared to an RHCP antenna assuming the same

antenna gain (specified in dBi and dBic respectively).

An RHCP antenna is better at rejecting multipath than a linearly polarized antenna.

This is because the reflected signal changes polarization to LHCP, which would be rejected by the

RHCP antenna by typically 20 dB or so. If the multipath signal is attenuating the line of sight signal,

then the RHCP antenna would show a higher signal level than a linearly polarized antenna because the

interfering signal is rejected.

However, in the case where the multipath signal is replacing the line of sight signal, such as in an

urban canyon environment, then the number of satellites in view could drop below that needed to

determine a 3D solution. This is a case where a bad signal may be better than no signal. The system

designer needs to make tradeoffs in their application to determine which is the better choice.

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7.3.3 GPS Antenna Gain

Antenna gain is defined as the extra signal power from the antenna as compared to a theoretical

isotropic antenna (equally sensitive in all directions).

For example, a 25mm by 25m square patch antenna on a reference ground plane (usually 70mm by

70mm) will give an antenna gain at zenith of 5 dBic. A smaller 18mm by 18mm square patch on a

reference ground plane (usually 50mm by 50mm) will give an antenna gain at zenith of 2 dBic.

While an antenna vendor will specify a nominal antenna gain (usually at zenith, or directly overhead)

they should supply antenna pattern curves specifying gain as a function of elevation, and gain at a fixed

elevation as a function of azimuth. Pay careful attention to the requirement to meet these specifications,

such as ground plane required and any external matching components. Failure to follow these

requirements could result in very poor antenna performance.

It is important to note that GPS antenna gain is not the same thing as external LNA gain. Most antenna

vendors will specify these numbers separately, but some combine them into a single number. It is

important to know both numbers when designing and evaluating the front end of a GPS receiver.

For example, antenna X has an antenna gain of 5 dBiC at azimuth and an LNA gain of 20 dB for a

combined total of 25 dB. Antenna Y has an antenna gain of -5 dBiC at azimuth and an LNA gain of 30

dB for a combined total of 25 dB. However, in the system, antenna X will outperform antenna Y by

about 10 dB (refer to next chapter for more details on system noise floor).

An antenna with higher gain will generally outperform an antenna with lower gain. Once the signals

are above about -130 dBm for a particular satellite, no improvement in performance would be gained.

However, for those satellites that are below about -125 dBm, a higher gain antenna would improve the

gain and improve the performance of the GPS receiver. In the case of really weak signals, a good

antenna could mean the difference between being able to use a particular satellite signal or not.

7.3.4 Active versus Passive Antenna

If the GPS antenna is placed near the HE910 and the RF traces losses are not excessive (nominally 1

dB), then a passive antenna can be used. This would normally be the lowest cost option and most of the

time the simplest to use. However, if the antenna needs to be located away from the HE910 then an

active antenna may be required to obtain the best system performance. The active antenna has its own

built in low noise amplifier to overcome RF trace or cable losses after the active antenna.

However, an active antenna has a low noise amplifier (LNA) with associated gain and noise figure. In

addition, many active antennas have either a pre-select filter, a post-select filter, or both.

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7.3.5 GPS Antenna - PCB Line Guidelines

• Ensure that the antenna line impedance is 50ohm.

• Keep the antenna line on the PCB as short as possible to reduce the loss.

• Antenna line must have uniform characteristics, constant cross section, avoid meanders and

abrupt curves.

• Keep one layer of the PCB used only for the Ground plane, if possible.

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having

other signal tracks facing directly the antenna line of track.

• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane

by placing vias once per 2mm at least.

• Place EM noisy devices as far as possible from HE910 antenna line.

• Keep the antenna line far away from the HE910 power supply lines.

• Keep the antenna line far away from the HE910 GSM RF lines.

• If you have EM noisy devices around the PCB hosting the HE910, such as fast switching ICs,

take care of the shielding of the antenna line by burying it inside the layers of PCB and

surround it with Ground planes, or shield it with a metal frame cover.

• If you do not have EM noisy devices around the PCB of HE910, use a strip-line on the

superficial copper layer for the antenna line. The line attenuation will be lower than a buried

one.

7.3.6 RF Trace Losses

RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF

simulation software to estimate what the losses would be. A good rule of thumb would be to keep the

RF traces as short as possible, make sure they are 50 ohms impedance and don’t contain any sharp

bends.

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7.3.7 Implications of the Pre-select SAW Filter

The HE910 module contains a SAW filter used in a pre-select configuration with the built-in LNA, that

is, the RF input of the HE910 ties directly into the SAW filter. Any circuit connected to the input of the

HE910 would see complex impedance presented by the SAW filter, particularly out of band, rather

than the relatively broad and flat return loss presented by the LNA. Filter devices pass the desired in

band signal to the output, resulting in low reflected energy (good return loss), and reject the out of band

signal by reflecting it back to the input, resulting in high reflected energy (bad return loss).

If an external amplifier is to be used with the HE910, the overall design should be checked for RF

stability to prevent the external amplifier from oscillating. Amplifiers that are unconditionally stable at

the output will be fine to use with the HE910.

If an external filter is to be connected directly to the HE910, care needs to be used in making sure

neither the external filter nor the internal SAW filter performance is compromised. These components

are typically specified to operate into 50 ohms impedance, which is generally true in band, but would

not be true out of band. If there is extra gain associated with the external filter, then a 6 dB Pi or T

resistive attenuator is suggested to improve the impedance match between the two components.

7.3.8 External LNA Gain and Noise Figure

The HE910 can be used with an external LNA such as what might be found in an active antenna.

Because of the internal LNA, the overall gain (including signal losses past the external LNA) should

not exceed 14 dB. Levels higher than that can affect the jamming detection capability of the HE910. If

a higher gain LNA is used, either a resistive Pi or T attenuator can be inserted after the LNA to bring

the gain down to 14 dB .

The external LNA should have a noise figure better than 1 dB. This will give an overall system noise

figure of around 2 dB assuming the LNA gain is 14 dB, or if higher the low gain mode is automatically

managed by the HE910 with its internal AGC.

The external LNA, if having no pre-select filter, needs to be able to handle other signals other than the

GPS signal. These signals are typically at much higher levels. The amplifier needs to stay in the linear

region when presented with these other signals. Again, the system designer needs to determine all of

the unintended signals and their possible levels that can be presented and make sure the external LNA

will not be driven into compression. If this were to happen, the GPS signal itself would start to be

attenuated and the GPS performance would suffer.

7.3.9 Powering the External LNA (active antenna)

The external LNA needs a source of power. Many of the active antennas accept a 3 volt or 5 volt DC

voltage that is impressed upon the RF signal line. This voltage is not supplied by the HE910, but can

be easily supplied by the host design.

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7.3.10 External LNA Enable

The HE910 is already provided by an internal LNA. In case the Application needs to include an

additional LNA stage, the module is provided by a digital signal usable to enable the power

supply of the external amplifier. The signal is set to High only when the GPS receiver is active.

The electrical characteristics of the GPS_LNA_EN signal are:

Level Min Max

Output high level 1.6V 1.9

Output low level 0V 0.2V

An example of GPS Antenna Supply circuit is shown in the following image:

NOTE:

The maximum DC voltage applicable to the ANT_GPS pin is 5V. In case this is exceeded, a

series capacitor has to be included in the design to avoid exceeding the maximum input DC

level.

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7.3.11 Shielding

Shielding the RF circuitry generally is ineffective because the interference is getting into the GPS

antenna itself, the most sensitive portion of the RF path. The antenna cannot be shielded because then

it can’t receive the GPS signals.

There are two solutions, one is to move the antenna away from the source of interference or the second

is to shield the digital interference to prevent it from getting to the antenna.

7.3.12 GPS Antenna - Installation

• The HE910 due to its characteristics of sensitivity is capable to perform a Fix inside the

buildings. (In any case the sensitivity could be affected by the building characteristics i.e.

shielding).

• The Antenna must not be co-located or operating in conjunction with any other antenna or

transmitter.

• Antenna must not be installed inside metal cases.

• Antenna must be installed also according to the Antenna manufacturer instructions.

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8 Logic level specifications

The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V

Input level on any digital pin (CMOS 1.2) with respect to ground -0.3V 1.4V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9V

Output low level 0V 0.2V

Operating Range - Interface levels (1.2V CMOS)

Level Min Max

Input high level 0.9V 1.3V

Input low level 0V 0.3V

Output high level 1V 1.3V

Output low level 0V 0.1V

Current characteristics

Level Typical

Output Current 1mA

Input Current 1uA

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8.1 Unconditional Shutdown

Signal Function I/O PAD

HW_SHUTDOWN*

Unconditional Shutdown of the Module I R13

HW_SHUTDOWN* is used to unconditionally shutdown the HE910. Whenever this signal is

pulled low, the HE910 is reset. When the device is reset it stops any operation. After the release

of the line, the HE910 is unconditionally shut down, without doing any detach operation from

the network where it is registered. This behaviour is not a proper shut down because any GSM

device is requested to issue a detach request on turn off. For this reason the HW_SHUTDOWN*

signal must not be used to normally shutting down the device, but only as an emergency exit in

the rare case the device remains stuck waiting for some network response.

The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper power-

on reset sequence, so there's no need to control this pin on start-up.

It may only be used to reset a device already on that is not responding to any command.

NOTE:

Do not use this signal to power off the HE910. Use the ON/OFF signal to perform this function

or the AT#SHDN command.

Unconditional Shutdown Signal Operating levels:

Signal Min Max

HW_SHUTDOWN*

Input high 1.5V 1.9V

HW_SHUTDOWN*

Input low 0V 0.35V

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with

an open collector transistor, to permit to the internal circuitry the power on reset and under

voltage lockout functions.

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9 USB Port

The HE910 includes one integrated universal serial bus (USB 2.0 HS) transceiver.

9.1 USB 2.0 HS Description

This port is compliant with the USB 2.0 HS.

The USB FS is supported for AT interface and data communication.

The following table is listing the available signals:

PAD

Signal I/O Function Type NOTE

B15 USB_D+ I/O USB differential Data (+) 3.3V

C15 USB_D- I/O USB differential Data (-) 3.3V

A13 VUSB AI Power sense for the internal USB

transceiver. 5V

Accepted range:

4.4V to 5.25V

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.

The signal traces should be routed carefully. Trace lengths, number of vias and capacitive

loading should be minimized. The characteristic impedance value should be as close as

possible to 90 Ohms differential.

In case there is a need to add an ESD protection the suggested connection is the following:

NOTE:

VUSB pin should be disconnected before activating the Power Saving Mode.

In case of a Firmware upgrade using the USB port, it could be done only using an USB 2.0 HS

device.

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10 SPI port

The HE910 Module is provided by one SPI interface.

The SPI interface defines two handshake lines for flow control and mutual wake-up of the

modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).

The AP has the master role, that is, it supplies the clock.

The following table is listing the available signals:

PAD

Signal I/O Function Type COMMENT

D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX

E15 SPI_MISO O SPI MISO CMOS 1.8V Shared with RX_AUX

F15 SPI_CLK I SPI Clock CMOS 1.8V

H15 SPI_MRDY I SPI_MRDY CMOS 1.8V

J15 SPI_SRDY O SPI_SRDY CMOS 1.8V

The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this

digital section.

NOTE:

Due to the shared functions, when the SPI port is used, it is not possible to use the AUX_UART

port.

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10.1 SPI Connections

SPI_MISO

E15

D15

F15

H15

J15

D13

E13

D14

HE910

SPI_MOSI

SPI_CLK

SPI_MRDY

SPI_SRDY

VDD_IO1

1V8_SEL

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11 USB HSIC

The HE910 Module is provided by one USB HSIC interface.

The USB HSIC (High Speed Inter Processor) Interface allows supporting the inter-processor

communication between an application processor (AP) – the host, and the modem processor

(CP) – the HE910.

The following table is listing the available signals:

Pad Signal Direction Function Type COMMENT

A12 HSIC_USB_DATA I/O USB HSIC data signal CMOS 1.2V

A11 HSIC_USB_STRB I/O USB HSIC strobe signal CMOS 1.2V

H15 HSIC_SLAVE_WAKEUP I Slave Wake Up CMOS 1.8V Shared with SPI_MRDY

F15 HSIC_HOST_WAKEUP O Host Wake Up CMOS 1.8V Shared with SPI CLK

K15 HSIC_SUSPEND_REQUEST O Slave Suspend Request CMOS 1.8V Shared with GPIO08

J15 HSIC_HOST_ACTIVE I Active Host Indication CMOS 1.8V Shared with SPI_SRDY

D13 VDD_IO1 I VDD_IO1 Input To be connected to E13

E13 1V8_SEL O 1V8 SEL for VDD_IO1 To be connected to D13

The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this

digital section.

For the detailed use of USB HSIC port please refer to the related Application Note.

NOTE:

Due to the shared functions, when the USB_HSIC port is used, it is not possible to use the SPI

and the GPIO_08.

The USB_HSIC is not active by default but it has to be enabled using the AT#PORTCFG

command (refer to the AT User guide for the detailed syntax description).

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12 Serial Ports

The HE910 module is provided with by 2 Asynchronous serial ports:

• MODEM SERIAL PORT 1 (Main)

• MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the most

common are:

• RS232 PC com port

• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

• microcontroller UART @ 5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be

needed to make the system work.

On the HE910 the ports are CMOS 1.8.

The electrical characteristics of the Serial ports are explained in the following tables:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital pin (CMOS 1.8) with

respect to ground -0.3V 2.1V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9

Output low level 0V 0.2V

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12.1 MODEM SERIAL PORT 1 (USIF0)

The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals.

It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

RS232

Pin # Signal HE910

Pad Number Name Usage

1 C109/DCD N14

Data Carrier Detect Output from the HE910 that indicates the carrier presence

2 C104/RXD M15 Transmit line *see

Note Output transmit line of HE910 UART

3 C103/TXD N15 Receive line *see

Note Input receive of the HE910 UART

4 C108/DTR M14

Data Terminal Ready Input to the HE910 that controls the DTE READY condition

5 GND M12, B13, P13,

E14 … Ground Ground

6 C107/DSR P14 Data Set Ready Output from the HE910 that indicates the module is ready

7 C106/CTS P15 Clear to Send Output from the HE910 that controls the Hardware flow

control

8 C105/RTS L14

Request to Send Input to the HE910 that controls the Hardware flow control

9 C125/RING R14 Ring Indicator Output from the HE910 that indicates the incoming call

condition

The following table shows the typical input value of internal pull-up resistors for RTS DTR

and TXD input lines and in all module states:

STATE RTS DTR TXD

Pull up tied to

ON 5K to 12K 1V8

OFF Schottky diode

RESET Schottky diode

POWER

SAVING 5K to 12K 1V8

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The input line ON_OFF and RESET state can be treated as in picture below

NOTE:

According to V.24, some signal names are referred to the application side, therefore on the

HE910 side these signal are on the opposite direction:

TXD on the application side will be connected to the receive line (here named C103/TXD)

RXD on the application side will be connected to the transmit line (here named C104/RXD)

NOTE:

For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can

be left open provided a software flow control is implemented.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

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12.2 MODEM SERIAL PORT 2 (USIF1)

The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX

signals.

The signals of the HE910 serial port are:

PAD Signal I/O Function Type COMMENT

D15 TX_AUX O Auxiliary UART (TX Data to

DTE) CMOS 1.8V SHARED WITH

SPI_MTSR

E15 RX_AUX I Auxiliary UART (RX Data from

DTE) CMOS 1.8V SHARED WITH

SPI_MRST

The signal 1V8_SEL must be connected to the VDD_IO1 input pin in order to use this port.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

NOTE:

Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI

functions.

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12.3 RS232 level translation

In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a

level translator is required. This level translator must:

• invert the electrical signal in both directions;

• Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower

levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level

translator. Note that the negative signal voltage must be less than 0V and hence some sort of

level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip level

translator. There are a multitude of them, differing in the number of drivers and receivers and in

the levels (be sure to get a true RS232 level translator not a RS485 or other standards).

By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The

receiver is the translator from the RS232 level to 0-1.8V UART.

In order to translate the whole set of control lines of the UART you will need:

• 5 drivers

• 3 receivers

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An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver

(MAX218)

In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example

done on 4 signals only).

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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13 Audio Section Overview

The Audio of the HE910 Module is carried by DVI digital audio interface.

The audio port can be directly connected to end device using digital interface, or via one of the

several compliant codecs (in case an analog audio is needed).

13.1 Electrical Characteristics

The product is providing the Digital Audio Interface (DVI) on the following Pins:

Digital Voice Interface (DVI)

PAD Signal I/O Function Note Type

B9 DVI_WA0 I/O Digital Audio Interface (Word Alignment /

LRCLK) CMOS 1.8V

B6 DVI_RX I Digital Audio Interface (RX) CMOS 1.8V

B7 DVI_TX O Digital Audio Interface (TX) CMOS 1.8V

B8 DVI_CLK I/O Digital Audio Interface (BCLK) CMOS 1.8V

13.1.1 CODEC Examples

Please refer to the HE910 Digital Audio Application note.

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14 General Purpose I/O

The HE910 module is provided by a set of Digital Input / Output pins

Input pads can only be read; they report the digital value (high or low) present on the pad at the

read time.

Output pads can only be written or queried and set the value of the pad output.

An alternate function pad is internally controlled by the HE910 firmware and acts depending on

the function implemented.

The following table shows the available GPIO on the HE910:

PAD

Signal I/O

Function Type Drive

strength Default

State Note

C8 GPIO_01

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT Alternate function STAT

LED

C9 GPIO_02

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT

C10 GPIO_03

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT

C11 GPIO_04

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT

B14 GPIO_05

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT

C12 GPIO_06

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT

C13 GPIO_07

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT

K15 GPIO_08

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT VDD_IO1 has to be

connected to 1V8_SEL

L15 GPIO_09

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT VDD_IO1 has to be

connected to 1V8_SEL

G15 GPIO_10

I/O

Configurable GPIO

CMOS 1.8V 1 mA INPUT VDD_IO1 has to be

connected to 1V8_SEL

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14.1 GPIO Logic levels

Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.

The following table shows the logic level specifications used in the HE910 interface circuits:

Absolute Maximum Ratings -Not Functional

Parameter Min Max

Input level on any digital pin (CMOS 1.8) with respect

to ground -0.3V 2.1V

Operating Range - Interface levels (1.8V CMOS)

Level Min Max

Input high level 1.5V 1.9V

Input low level 0V 0.35V

Output high level 1.6V 1.9

Output low level 0V 0.2V

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14.2 Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and

report its status, provided this device has interface levels compatible with the 1.8V CMOS levels

of the GPIO.

If the digital output of the device to be connected with the GPIO input pad has interface levels

different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a

47K pull up to 1.8V.

NOTE:

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic

level signal applied to the digital pins of the HE910 when the module is powered off or during

an ON/OFF transition.

14.3 Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible

hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up

resistor may be omitted.

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14.4 Indication of network service

availability

The STAT_LED pin status shows information on the network service availability and Call

status. The function is available as alternate function of GPIO_01 (to be enabled using the

AT#GPIO=1,0,2 command).

In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED.

Therefore, the status indicated in the following table is reversed with respect to the pin status.

Device Status LED status

Device off Permanently off

Not Registered Permanently on

Registered in idle Blinking 1sec on + 2 sec off

Registered in idle + power saving

It depends on the event that triggers the wakeup (In

sync with network paging)

Voice Call Active Permanently on

Dial-Up Blinking 1 sec on + 2 sec off

A schematic example could be:

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14.5 RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the

digital part, allowing having only RTC going on when all the other parts of the device are off.

To this power output a backup capacitor can be added in order to increase the RTC autonomy

during power off of the battery. NO Devices must be powered from this pin.

In order to keep the RTC active when VBATT is not supplied it is possible to back up the RTC

section connecting a backup circuit to the related VRTC signal (pad C14 on module’s Pinout).

For additional details on the Backup solutions please refer to the related application note (xE910

RTC Backup Application Note)

14.6 External SIM Holder Implementation

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

14.7 VAUX Power Output

A regulated power supply output is provided in order to supply small devices from the module.

The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON

indication) function.

This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

Level Min Typical Max

Output voltage 1.78V 1.80V 1.82V

Output current - - 60mA

Output bypass capacitor

(inside the module) 1uF

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14.8 ADC Converter

14.8.1 Description

The HE910 is provided by one AD converter. It is able to read a voltage level in the range of

0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.

The following table is showing the ADC characteristics:

Min Typical

Max Units

Input Voltage range 0 - 1.2 Volt

AD conversion - - 10 bits

Input Resistance 1 - - Mohm

Input Capacitance - 1 - pF

The input line is named as ADC_IN1 and it is available on Pad B1

14.8.2 Using ADC Converter

An AT command is available to use the ADC function.

The command is AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this

function.

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15 Mounting the HE910 on the

application

15.1 General

The HE910 modules have been designed in order to be compliant with a standard lead-free

SMT process.

15.2 Module finishing & dimensions

Pin B1

Dimensions in mm

Bottom view

Lead-free Alloy:

Surface finishing Ni/Au for all solder pads

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15.3 Recommended foot print for the

application

TOP VIEW

In order to

easily rework the HE910 is suggested to consider on the application a 1.5 mm placement

inhibit area around the module.

It is also suggested, as common rule for an SMT component, to avoid having a mechanical

part of the application in direct contact with the module.

NOTE:

In the customer application, the region under WIRING INHIBIT (see figure above) must

be clear from signal or ground paths.

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15.4 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we

suggest a thickness of stencil foil ≥ 120 µm.

15.5 PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the

PCB.

PCB

Copper Pad

Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)

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15.6 PCB pad dimensions

The recommendation for the PCB pads dimensions are described in the following image

(dimensions in mm)

Solder resist openings

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It is not recommended to place via or micro-via not covered by solder resist in an

area of 0,3 mm around the pads unless it carries the same signal of the pad itself

(see following figure).

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer thickness [µm] Properties

Electro-less Ni / Immersion

Au 3 –7 / 0.05 – 0.15 good solder ability protection,

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the

lead-free process. This issue should be discussed with the PCB-supplier. Generally,

the wettability of tin-lead solder paste on the described surface plating is better

compared to lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is

suggested to use milled contours and predrilled board breakouts; scoring or v-cut

solutions are not recommended.

Inhibit area for micro-via

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15.7 Solder paste

Lead free

Solder paste Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules

after assembly.

15.7.1 HE910 Solder reflow

Recommended solder reflow profile:

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Profile Feature Pb-Free Assembly

Average ramp-up rate (T

to T

) 3°C/second max

Preheat

– Temperature Min (Tsmin)

– Temperature Max (Tsmax)

– Time (min to max) (ts)

150°C

200°C

60-180 seconds

Tsmax to TL

– Ramp-up Rate

3°C/second max

Time maintained above:

– Temperature (TL)

– Time (tL)

217°C

60-150 seconds

Peak Temperature (Tp) 245 +0/-5°C

Time within 5°C of actual Peak

Temperature (tp) 10-30 seconds

Ramp-down Rate 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

NOTE:

All temperatures refer to topside of the package, measured on the package body surface

WARNING:

The HE910 module withstands one reflow process only.

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15.8 Packing system (Tray)

The HE910 modules are packaged on trays of 36 pieces each. These trays can be used in

SMT processes for pick & place handling.

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15.9 Packing System (Reel)

The HE910 can be packaged on reels of 200 pieces each.

See figure for module positioning into the carrier.

15.9.1 Carrier Tape Detail

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15.9.2 Reel Detail

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15.9.3 Packaging Detail

15.10 Moisture sensitivity

The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-

STD-020, take care all the relatives requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).

b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC

J-STD-033A paragraph 5.

c) The maximum time between the opening of the sealed bag and the reflow process must be

168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

d) Baking is required if conditions b) or c) are not respected

e) Baking is required if the humidity indicator inside the bag indicates 10% RH

or more

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16 SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this

product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the product.

The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the

security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic

discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully

the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken

to the external components of the module, as well as of any project or installation issue, because the risk

of disturbing the GSM network or external devices or having impact on the security. Should there be any

doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to

be installed with care in order to avoid any interference with other electronic devices and has to guarantee

a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system

integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the

market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable

Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

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17 Conformity assessment issues

17.1 1999/5/EC Directive

The HE910, HE910-D, HE910-EUG, HE910-EUR, HE910-EUD, HE910-GL, HE910-NAG, HE910-

NAR, HE910-NAD modules have been evaluated against the essential requirements of the 1999/5/EC

Directive.

Bulgarian С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на

съществените изисквания и другите приложими изисквания на Директива

1999/5/ЕС.

Czech Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se

základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.

Danish Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G

module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Dutch Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in

overeenstemming is met de essentiële eisen en de andere relevante bepalingen van

richtlijn 1999/5/EG.

English Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance

with the essential requirements and other relevant provisions of Directive 1999/5/EC.

Estonian Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust

direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele

asjakohastele sätetele.

German Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in

Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen

Bestimmungen der Richtlinie 1999/5/EG befindet.

Greek ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ∆ΗΛΩΝΕΙ ΟΤΙ 2G/3G module

ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ

∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ.

Hungarian Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a

vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.

Finnish Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on

direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen

mukainen.

French Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est

conforme aux exigences essentielles et aux autres dispositions pertinentes de la

directive 1999/5/CE.

Icelandic Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við

grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC

Italian Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è

conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva

1999/5/CE.

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Latvian Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas

1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.

Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius

reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Maltese Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma

mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva

1999/5/EC.

Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar

med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.

Polish Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z

zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy

1999/5/EC

Portuguese

Telit Communications S.p.A. declara que este 2G/3G module está conforme com os

requisitos essenciais e outras disposições da Directiva 1999/5/CE.

Slovak Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné

požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.

Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi

zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.

Spanish Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module

cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o

exigibles de la Directiva 1999/5/CE.

Swedish Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I

överensstämmelse med de väsentliga egenskapskrav och övriga relevanta

bestämmelser som framgår av direktiv 1999/5/EG.

In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910, HE910-EUG

modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EN 301 908-1 V6.2.1

EN 301 908-2 V6.2.1

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2

EN 301 489-3 V1.6.1

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

+AC:2011

In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-NAG module are

compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1

EN 301 511 V9.0.2

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2

EN 301 489-3 V1.4.1

EN 301 489-7 V1.3.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

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The HE910-D, HE910-GL, HE910-EUR, HE910-EUD modules are compliant with the following

standards:

RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.02

EN 301 908-1 V6.2.1

EN 301 908-2 V6.2.1

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2

EN 301 489-7 V1.3.1

EN 301 489-24 V1.5.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 +

AC:2011

The HE910-NAR, HE910-NAD modules are compliant with the following standards:

RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.02

EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2

EN 301 489-7 V1.3.1

Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011

The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive

1999/5/EC has been followed with the involvement of the following Notified Body:

AT4 wireless, S.A.

Parque Tecnologico de Andalucía

C/ Severo Ochoa 2

29590 Campanillas – Málaga

SPAIN

Notified Body No: 1909

Thus, the following marking is included in the product:

The full declaration of conformity can be found on the following address:

http://www.telit.com/

There is no restriction for the commercialisation of the HE910, HE910-D, HE910-GL, HE910-EUG,

HE910-EUR, HE910-EUD, HE910-NAG, HE910-NAR, HE910-NAD modules in all the countries of the

European Union.

1909

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Final product integrating this module must be assessed against essential requirements of the 1999/5/EC

(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit

Communications S.p.A. recommends carrying out the following assessments:

RF spectrum use (R&TTE art. 3.2) It will depend on the antenna used on the final product.

EMC (R&TTE art. 3.1b) Testing

Health & Safety (R&TTE art. 3.1a) Testing

Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a)

essential requirements can be done against the essential requirements of the EMC and the LVD Directives:

• Low Voltage Directive 2006/95/EC and product safety

• Directive EMC 2004/108/EC for conformity for EMC

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17.2 FCC/IC Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications

could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout

changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this

device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de

brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

RF exposure

This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled

environment. The antenna should be installed and operated with minimum distance of 20 cm between

the radiator and your body.

Antenna gain must be below:

Frequency band

Antenna gain

850 MHz 4.14 dBi

1700 MHz 6.30 dBi

1900 MHz 3.01 dBi

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non

contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source

de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

Bande de fréquence

Gain de l'antenne

850 MHz 4.14 dBi

1700 MHz 6.30 dBi

1900 MHz 3.01 dBi

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L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can radiate

radio frequency energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Labelling Requirements for the Host device

The host device shall be properly labelled to identify the modules within the host device. The certification label

of the module shall be clearly visible at all times when installed in the host device, otherwise the host device

must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter

module", or the word "Contains", or similar wording expressing the same meaning, as follows:

HE910, HE910-D

Contains FCC ID: RI7HE910

Contains IC: 5131A-HE910

HE910-GL

Contains FCC ID: RI7HE910GL

Contains IC: 5131A-HE910GL

HE910-NAR, HE910-NAD, HE910-NAG

Contains FCC ID: RI7HE910NA

Contains IC: 5131A-HE910NA

L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent.

L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout

temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module,

précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire

exprimant le même sens, comme suit :

HE910, HE910-D

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Contains FCC ID: RI7HE910

Contains IC: 5131A-HE910

HE910-GL

Contains FCC ID: RI7HE910GL

Contains IC: 5131A-HE910GL

HE910-NAR, HE910-NAD, HE910-NAG

Contains FCC ID: RI7HE910NA

Contains IC: 5131A-HE910NA

CAN ICES-3 (B) / NMB-3 (B)

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

Telit Communications S p A HE910GL 2G/3.5G Module User Manual 1vv0300925 HE910 Hardware User Guide r28

Telit Communications S.p.A. 2G/3.5G Module 1vv0300925 HE910 Hardware User Guide r28

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