Telit Communications S p A HE910GL 2G/3.5G Module User Manual 1vv0300925 HE910 Hardware User Guide r28

Telit Communications S.p.A. 2G/3.5G Module 1vv0300925 HE910 Hardware User Guide r28

User Manual

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HE910 Hardware User Guide
1vv03700925 Rev.28 – 2015-06-24
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
Applicability Table
PRODUCT
HE910 (*)
HE910-D
HE910-GL
HE910-EUR
HE910-EUD
HE910-EUG
HE910-NAR
HE910-NAD
HE910-NAG
(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in
the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs
contained in the Telit products described in this instruction manual may not be copied (reverse
engineered) or reproduced in any manner without the express written permission of Telit or the
3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant
either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal
non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
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page 3 of 3
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished
by express license agreement only and may be used only in accordance with the terms of such
an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment
in the following hazardous environments requiring fail-safe controls: the operation of Nuclear
Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life
Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically
disclaim any expressed or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2011, 2013
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
Contents
INTRODUCTION ......................................................................................................................................................... 8
1.1 SCOPE ................................................................................................................................................................................ 8
1.2 AUDIENCE ........................................................................................................................................................................... 8
1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 8
1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 9
1.5 TEXT CONVENTIONS ............................................................................................................................................................ 10
1.6 RELATED DOCUMENTS......................................................................................................................................................... 10
1.7 DOCUMENT HISTORY .......................................................................................................................................................... 11
OVERVIEW .............................................................................................................................................................. 12
HE910 MODULE CONNECTIONS ............................................................................................................................... 13
3.1 PIN-OUT ......................................................................................................................................................................... 13
3.1.1 LGA Pads Layout (HE910) ....................................................................................................................................... 19
3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 20
3.1.3 LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and HE910-GL) ................................................................ 21
3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG) .................................................................................................... 22
HARDWARE COMMANDS ........................................................................................................................................ 23
4.1 TURNING ON THE HE910 ................................................................................................................................................... 23
4.2 TURNING OFF THE HE910 .................................................................................................................................................. 28
4.3 HE910 UNCONDITIONAL SHUTDOWN .................................................................................................................................... 30
POWER SUPPLY ....................................................................................................................................................... 33
5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 33
5.2 POWER CONSUMPTION ....................................................................................................................................................... 34
5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 35
5.3.1 Electrical Design Guidelines ................................................................................................................................... 35
5.3.2 Thermal Design Guidelines ..................................................................................................................................... 39
5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 40
GSM/WCDMA RADIO SECTION ............................................................................................................................... 42
6.1 HE910 PRODUCT VARIANTS ................................................................................................................................................ 42
6.2 TX OUTPUT POWER ............................................................................................................................................................ 42
6.3 SENSITIVITY ....................................................................................................................................................................... 43
6.4 GSM/WCDMA ANTENNA REQUIREMENTS ............................................................................................................................ 43
6.5 GSM/WCDMA - PCB LINE GUIDELINES ................................................................................................................................ 44
6.6 PCB GUIDELINES IN CASE OF FCC CERTIFICATION...................................................................................................................... 46
6.6.1 Transmission line design ........................................................................................................................................ 46
6.6.2 Transmission line measurements ........................................................................................................................... 47
6.7 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES ........................................................................................................... 49
6.8 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 50
GPS RECEIVER .......................................................................................................................................................... 51
7.1 GPS PERFORMANCES .......................................................................................................................................................... 51
7.2 GPS SIGNALS PINOUT ......................................................................................................................................................... 52
7.3 RF FRONT END DESIGN ....................................................................................................................................................... 52
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
7.3.1 RF Signal Requirements .......................................................................................................................................... 52
7.3.2 GPS Antenna Polarization ...................................................................................................................................... 53
7.3.3 GPS Antenna Gain .................................................................................................................................................. 54
7.3.4 Active versus Passive Antenna ............................................................................................................................... 54
7.3.5 GPS Antenna - PCB Line Guidelines ........................................................................................................................ 55
7.3.6 RF Trace Losses....................................................................................................................................................... 55
7.3.7 Implications of the Pre-select SAW Filter ............................................................................................................... 56
7.3.8 External LNA Gain and Noise Figure....................................................................................................................... 56
7.3.9 Powering the External LNA (active antenna) ......................................................................................................... 56
7.3.10 External LNA Enable ............................................................................................................................................. 57
7.3.11 Shielding ............................................................................................................................................................... 58
7.3.12 GPS Antenna - Installation ................................................................................................................................... 58
LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 59
8.1 UNCONDITIONAL SHUTDOWN ............................................................................................................................................... 60
USB PORT ................................................................................................................................................................ 61
9.1 USB 2.0 HS DESCRIPTION ................................................................................................................................................... 61
10
SPI PORT ................................................................................................................................................................. 62
10.1 SPI CONNECTIONS ............................................................................................................................................................ 63
11
USB HSIC ................................................................................................................................................................. 64
12
SERIAL PORTS .......................................................................................................................................................... 65
12.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 66
12.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 68
12.3 RS232 LEVEL TRANSLATION................................................................................................................................................ 69
13
AUDIO SECTION OVERVIEW .................................................................................................................................... 71
13.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 71
13.1.1 CODEC Examples .................................................................................................................................................. 71
14
GENERAL PURPOSE I/O ........................................................................................................................................... 72
14.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 73
14.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 74
14.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 74
14.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 75
14.5 RTC BYPASS OUT ............................................................................................................................................................. 76
14.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 76
14.7 VAUX POWER OUTPUT..................................................................................................................................................... 76
14.8 ADC CONVERTER ............................................................................................................................................................. 77
14.8.1 Description ........................................................................................................................................................... 77
14.8.2 Using ADC Converter ............................................................................................................................................ 77
15
MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 78
15.1 GENERAL ........................................................................................................................................................................ 78
15.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 78
15.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 80
15.4 STENCIL .......................................................................................................................................................................... 81
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
15.5 PCB PAD DESIGN .............................................................................................................................................................. 81
15.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 82
15.7 SOLDER PASTE.................................................................................................................................................................. 84
15.7.1 HE910 Solder reflow ............................................................................................................................................. 84
15.8 PACKING SYSTEM (TRAY) .................................................................................................................................................... 86
15.9 PACKING SYSTEM (REEL) .................................................................................................................................................... 88
15.9.1 Carrier Tape Detail ............................................................................................................................................... 88
15.9.2 Reel Detail ............................................................................................................................................................ 89
15.9.3 Packaging Detail .................................................................................................................................................. 90
15.10 MOISTURE SENSITIVITY .................................................................................................................................................... 90
16
SAFETY RECOMMANDATIONS ................................................................................................................................. 91
17
CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 92
17.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 92
17.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 96
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
1 Introduction
1.1 Scope
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit HE910 module.
1.2 Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our HE910 modules.
1.3 Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 8 of 8
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
1.4 Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter3: “HE910 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate on the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the
most important parts in the full product design.
Chapter 7: “GPS Receiver” This section describes the GPS receiver.
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic
levels for this module.
Chapter 9: “USB Port” The USB port on the Telit HE910 is the core of the interface between the
module and OEM hardware
Chapter 10: “SPI port” Refers to the SPI port of the Telit HE910
Chapter 11: “USB HSIC” Refers to the USB HSIC port of the Telit HE910
Chapter 12: “Serial ports” Refers to the serial ports of the Telit HE910
Chapter 13: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
HE910 Telit Modules.
Chapter 14: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 15: “Mounting the HE910 on the application board” Mechanical dimensions and
recommendations on how to mount the module on the user’s board.
Chapter 16: “Safety Recommendations” Information related to the Safety topics.
Chapter 17: “Conformity Assessment Issues” Information related to the Conformity
Assessments.
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
1.5 Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating
the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6 Related Documents
•
•
•
•
•
•
•
Digital Voice Interface Application Note
SPI Port Application Note
Product description
SIM Holder Design Guides
USB HSIC Port Application Note
AT Commands Reference Guide
Telit EVK2 User Guide
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
80000NT10050A
80000NT10053A
80378ST10085A
80000NT10001A
80000NT10071A
80378ST10091A
1vv0300704
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
1.7 Document History
Revision
Da t e
2011-03-31
2011-05-19
2011-05-25
2011-07-25
2011-07-29
2011-10-18
2011-12-22
2012-01-16
2012-02-03
2012-02-07
10
2012-03-16
11
12
13
2012-03-26
2012-03-27
2012-03-28
14
2012-05-08
15
16
17
18
19
20
21
22
23
2012-05-30
2012-06-06
2012-06-14
2012-06-15
2012-06-26
2012-08-09
2013-04-29
2013-08-02
2013-08-30
24
2013-12-20
25
26
27
28
2015-03-03
2015-04-09
2015-05-25
2015-06-24
Changes
Preliminary Version
Updated pinout on UART1
Update chapter 13
Added DVI app note references; chapter 4.1
Updated audio, on_off/reset and digital sections
Added STAT_LED info, Updated SPI pinout
Pads A8, A9, D14, A14 now reserved
Power supply extended to 3.3 V
par 4.3 renamed as “unconditional shutdown”
USIF0 USIF1 names added to Main and AUX serial ports
Updated IO logic levels
Updated module’s mechanical drawing
IO levels selection 1.8/1.2 removed (now only 1.8)
Added HE910-GA and –D; added Conformity assessment chapter
Chapter 5.1 updated
Chapter 4.2 updated
Added ADC in pinout description; added GPS specification; updated Chapter
13 and 14;
Chapter 2.1, 2.1.2, 3.3, 5.4, 14.9
Added HE910-EU and NA products
Updated paragraph 14.9
Added EUR, EUD, NAR, NAD variants; added Sensitivity and TX Power
Class specifications. Updated par 14.7.1 and 14.3
Updated Chapter 16.2; 7.3.8
Pin R13 renamed as HW_SHUTDOWN*, Pin P11 renamed
Updated RTT&E info on HE910-NAG, NAR, NAD
Updated RTT&E info on HE910-NAG, NAR, NAD ; updated par 3.1;
Pin P11 now reserved; updated par 3.1; par 4.2
Updated par 9,1 5.3.2, 13.4, 3.1, 13.5
Updated par 3.1, 5.1, 5.3.2, 6.4, 7, 9.1 ; added 14.8
Updated Chapter 4, 13.4
Updated Chapter 3.1, 4.1, 5.2, 5.3.3, 8, 9.1, 11, 13.1
Updated Chapter 4.1, 4.2, 5.3.1.1, 5.3.1.2, 8; added USB_HSIC, Updated the
Stat Led schematic example; updated packaging tray drawing; added PCB
Guidelines for FCC.
Add new product HE910-GL
Removed product HE910-GA
Updated Chapter 15.8 Packing system (Tray)
Updated Chapters 17.1 and 17.2
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page 11 of 11
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
2 Overview
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit HE910 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot embrace
the whole hardware solutions and products that may be designed. The wrong solutions to be
avoided shall be considered as mandatory, while the suggested hardware configurations shall not
be considered mandatory, instead the information given shall be used as a guide and a starting
point for properly developing your product with the Telit HE910 module. For further hardware
details that may not be explained in this document refer to the Telit HE910 Product Description
document where all the hardware information is reported.
NOTICE:
(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall
be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA HE910 all’interno dell’applicazione
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der
in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los
cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910 dans l’application de l’utilisateur
sera faite selon les règles de conception décrites dans ce manuel.
(HE)
HE910
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in
Telit products. This document is subject to change without notice.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
3 HE910 module connections
3.1 PIN-OUT
PAD
Signal
I/O
Function
USB differential Data (+)
Type
COMMENT
USB HS 2.0 COMMUNICATION PORT
B15
USB_D+
I/O
C15
USB_D-
I/O
USB differential Data (-)
Power sense for the internal USB
transceiver.
VUSB
A13
Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control
N15
C103/TXD
Serial data input from DTE
CMOS 1.8V
M15
C104/RXD
M14
C108/DTR
Serial data output to DTE
CMOS 1.8V
Input for (DTR) from DTE
CMOS 1.8V
Input for Request to send signal
(RTS) from DTE
Output for Clear to Send signal
(CTS) to DTE
L14
C105/RTS
CMOS 1.8V
P15
C106/CTS
N14
C109/DCD
Output for (DCD) to DTE
CMOS 1.8V
P14
C107/DSR
Output for (DSR) to DTE
CMOS 1.8V
R14
C125/RING
Output for Ring (RI) to DTE
CMOS 1.8V
Auxiliary UART (TX Data to DTE)
CMOS 1.8V
RX_AUX
Auxiliary UART (RX Data from
DTE)
CMOS 1.8V
A12
HSIC_USB_DATA
I/O
USB HSIC data signal
CMOS 1.2V
A11
HSIC_USB_STRB
I/O
USB HSIC strobe signal
CMOS 1.2V
H15
HSIC_SLAVE_WAKEUP
Slave Wake Up
CMOS 1.8V
Shared with SPI_MRDY
F15
HSIC_HOST_WAKEUP
Host Wake Up
CMOS 1.8V
Shared with SPI CLK
K15
HSIC_SUSPEND_REQUEST
Slave Suspend Request
CMOS 1.8V
Shared with GPIO08
J15
HSIC_HOST_ACTIVE
Active Host Indication
CMOS 1.8V
Shared with SPI_SRDY
D13
VDD_IO1
VDD_IO1 Input
To be connected to E13
E13
1V8_SEL
1V8 SEL for VDD_IO1
To be connected to D13
CMOS 1.8V
Asynchronous Auxiliary Serial Port (USIF1)
TX_AUX
D15
E15
USB HSIC
SIM card interface
A6
SIMCLK
External SIM signal – Clock
1.8 / 3V
A7
SIMRST
External SIM signal – Reset
1.8 / 3V
A5
SIMIO
I/O
External SIM signal – Data I/O
1.8 / 3V
External SIM signal – Presence
(active low)
CMOS 1.8
A4
SIMIN
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HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
SIMVCC
A3
External SIM signal – Power supply
for the SIM
1.8 / 3V
Digital Voice Interface (DVI)
16K pull down
when in Input
Input with 16K
1.8V)
16K pull down
when in Input
Input with 16K
1.8V)
(typical at 1.8V)
B9
DVI_WA0
I/O
Digital Audio Interface (WA0)
1.8V
B6
DVI_RX
Digital Audio Interface (RX)
1.8V
B7
DVI_TX
I/O
Digital Audio Interface (TX)
1.8V
B8
DVI_CLK
I/O
Digital Audio Interface (CLK)
1.8V
D15
SPI_MOSI
SPI MOSI
CMOS 1.8V
Shared with TX_AUX
E15
SPI_MISO
SPI_MISO
CMOS 1.8V
Shared with RX_AUX
F15
SPI_CLK
SPI Clock
CMOS 1.8V
H15
SPI_MRDY
SPI_MRDY
CMOS 1.8V
J15
SPI_SRDY
SPI_SRDY
CMOS 1.8V
C8
GPIO_01
I/O
GPIO_01 /STAT LED
CMOS 1.8V
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
C13
GPIO_07
I/O
GPIO_07
CMOS 1.8V
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
ADC_IN1
AI
Analog / Digital converter input
A/D
K1
ANTENNA
I/O
F1
ANT_DIV
pull down (typical at
(typical at 1.8V)
pull down (typical at
SPI
Shared with
HSIC_HOST_WAKEUP
Shared with
HSIC_SLAVE_WAKEUP
Shared with
HSIC_HOST_ACTIVE
DIGITAL IO
Alternate Function STAT LED
Shared with
HSIC_SUSPEND_REQUEST
ADC
B1
Accepted values 0 to 1.2V DC
RF SECTION
GSM/EDGE/UMTS Antenna
(50 ohm)
Antenna Diversity Input
(50 ohm)
RF
RF
See NOTE 1
GPS SECTION (see NOTE1)
R9
R7
ANT_GPS
GPS_LNA_EN
GPS Antenna (50 ohm)
RF
Output enable for External LNA
supply
CMOS 1.8V
Miscellaneous Functions
R13
HW_SHUTDOWN*
HW Unconditional Shutdown
1.8V
Active low
R12
ON_OFF*
Input command for power ON
1.8V
Active low
C14
VRTC
VRTC Backup capacitor
Power
backup for the embedded RTC supply
(1.8V)
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page 14 of 14
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
VAUX/PWRMON
Supply Output for external
accessories / Power ON Monitor
1.8V
VBATT
Main power supply (Baseband)
Power
M2
VBATT
Main power supply (Baseband)
Power
N1
VBATT_PA
Main power supply (Radio PA)
Power
N2
VBATT_PA
Main power supply (Radio PA)
Power
P1
VBATT_PA
Main power supply (Radio PA)
Power
P2
VBATT_PA
Main power supply (Radio PA)
Power
E1
GND
Ground
Power
G1
GND
Ground
Power
H1
GND
Ground
Power
R11
Power Supply
M1
J1
GND
Ground
Power
L1
GND
Ground
Power
A2
GND
Ground
Power
E2
GND
Ground
Power
F2
GND
Ground
Power
G2
GND
Ground
Power
H2
GND
Ground
Power
J2
GND
Ground
Power
K2
GND
Ground
Power
L2
GND
Ground
Power
R2
GND
Ground
Power
M3
GND
Ground
Power
N3
GND
Ground
Power
P3
GND
Ground
Power
R3
GND
Ground
Power
D4
GND
Ground
Power
M4
GND
Ground
Power
N4
GND
Ground
Power
P4
GND
Ground
Power
R4
GND
Ground
Power
N5
GND
Ground
Power
P5
GND
Ground
Power
R5
GND
Ground
Power
N6
GND
Ground
Power
P6
GND
Ground
Power
R6
GND
Ground
Power
P8
GND
Ground
Power
R8
GND
Ground
Power
P9
GND
Ground
Power
P10
GND
Ground
Power
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page 15 of 15
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
R10
GND
Ground
Power
M12
GND
Ground
Power
B13
GND
Ground
Power
P13
GND
Ground
Power
E14
GND
Ground
Power
C1
RESERVED
RESERVED
D1
RESERVED
RESERVED
B2
RESERVED
RESERVED
C2
RESERVED
RESERVED
D2
RESERVED
RESERVED
B3
RESERVED
RESERVED
C3
RESERVED
RESERVED
D3
RESERVED
RESERVED
E3
RESERVED
RESERVED
RESERVED
F3
RESERVED
RESERVED
G3
RESERVED
RESERVED
H3
RESERVED
RESERVED
J3
RESERVED
RESERVED
K3
RESERVED
RESERVED
L3
RESERVED
RESERVED
B4
RESERVED
RESERVED
C4
RESERVED
RESERVED
B5
RESERVED
RESERVED
C5
RESERVED
RESERVED
C6
RESERVED
RESERVED
C7
RESERVED
RESERVED
N7
RESERVED
RESERVED
P7
RESERVED
RESERVED
N8
RESERVED
RESERVED
N9
RESERVED
RESERVED
A10
RESERVED
RESERVED
N10
RESERVED
RESERVED
N11
RESERVED
RESERVED
P11
RESERVED
RESERVED
B12
RESERVED
RESERVED
D12
RESERVED
RESERVED
N12
RESERVED
RESERVED
P12
RESERVED
RESERVED
F14
RESERVED
RESERVED
G14
RESERVED
RESERVED
H14
RESERVED
RESERVED
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page 16 of 16
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
J14
RESERVED
RESERVED
K14
RESERVED
RESERVED
N13
RESERVED
RESERVED
L13
RESERVED
RESERVED
J13
RESERVED
RESERVED
M13
RESERVED
RESERVED
K13
RESERVED
RESERVED
H13
RESERVED
RESERVED
G13
RESERVED
RESERVED
F13
RESERVED
RESERVED
B11
RESERVED
RESERVED
B10
RESERVED
RESERVED
A9
RESERVED
RESERVED
A8
RESERVED
RESERVED
D14
RESERVED
RESERVED
A14
RESERVED
RESERVED
WARNING:
Reserved pins must not be connected.
NOTE 1:
The following table is listing the main Pinout differences between the HE910 variants
Product
GPS
HE910 (*)
HE910-D
HE910-GL
HE910-EUR
HE910-EUD
HE910-EUG
HE910-NAR
HE910-NAD
HE910-NAG
YES
NO
NO
NO
NO
YES
NO
NO
YES
Antenna
Diversity
YES
YES
NO
NO
NO
NO
NO
NO
NO
Notes
Reserved Pads: R7, R9
Reserved Pads:,F1, R7, R9
Reserved Pads:,F1, R7, R9
Reserved Pads:,F1, R7, R9
Reserved Pads: F1
Reserved Pads: F1, R7, R9
Reserved Pads: F1, R7, R9
Reserved Pads: F1
(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG
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page 17 of 17
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
PAD
M1,M2,N1,N2,P1,P2
E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,
J2,K2,L2,R2,M3,N3,P3,R3,D4,M4,
N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,
R8,P9,P10,R10,M12,B13,P13,E14
R12
R13
B15
Signal
VBATT & VBATT_PA
C15
USB_D-
A13
VUSB
N15
M15
Notes
GND
ON/OFF*
HW_SHUTDOWN*
USB_D+
C103/TXD
C104/RXD
L14
C105/RTS
P15
C106/CTS
D15
TXD_AUX
E15
RXD_AUX
D13
VDD_IO1
E13
1V8_SEL
K1
MAIN ANTENNA
F1
ANT_DIV (if supported by the
product)
R9
ANT_GPS (if supported by the
product)
If not used should be connected to a
Test Point or an USB connector
If not used should be connected to a
Test Point or an USB connector
If not used should be connected to a
Test Point or an USB connector
If not used should be connected to a
Test Point
If not used should be connected to a
Test Point
If the flow control is not used it
should be connected to GND
If not used should be connected to a
Test Point
If not used should be connected to a
Test Point
If not used should be connected to a
Test Point
It has always to be connected to
1V8_SEL
It has always to be connected to
VDD_IO1
If not used it could left unconnected
but has to be disabled by the related
AT Command (AT#RXDIV);
please refer to the At User guide for
the related syntax
If the GPS is not used it could be
left unconnected
RTS pin should be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application when the module is assembled on it so we
recommend connecting them also to dedicated test point.
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page 18 of 18
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
3.1.1 LGA Pads Layout (HE910)
TOP VIEW
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
DVI_RX
RES
GND
GND
GND
SIMRS
DVI_TX
RES
RES
RES
GPS_LN
A_EN
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
ANT_GP
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SH
UTDOW
N*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MR
DY
SPI_SR
DY
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin in the
application.
HE910 is the “type name” of the products marketed as HE910-G & HE910-DG.
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page 19 of 19
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
3.1.2 LGA Pads Layout (HE910-D)
TOP VIEW
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
DVI_RX
RES
GND
GND
GND
SIMRS
DVI_TX
RES
RES
RES
RES
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
RES
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SH
UTDOW
N*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MR
DY
SPI_SR
DY
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin in the
application.
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page 20 of 20
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
3.1.3 LGA Pads Layout (HE910-EUD/EUR,
and HE910-GL)
HE910-NAD/NAR
TOP VIEW
ADC_IN1
RES
RES
GND
RES
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
DVI_RX
RES
GND
GND
GND
SIMRS
DVI_TX
RES
RES
RES
RES
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
RES
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SH
UTDOW
N*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MR
DY
SPI_SR
DY
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin in the
application.
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page 21 of 21
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG)
TOP VIEW
ADC_IN1
RES
RES
GND
RES
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
DVI_RX
RES
GND
GND
GND
SIMRS
DVI_TX
RES
RES
RES
GPS_LN
A_EN
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
ANT_GP
10
RES
RES
GPIO_03
RES
GND
GND
11
HSIC_U
SB_ST
RB
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
HSIC_U
SB_DA
TA
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SH
UTDOW
N*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MR
DY
SPI_SR
DY
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin in the
application.
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page 22 of 22
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
4 Hardware Commands
4.1 Turning ON the HE910
To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then
released.
The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.
A simple circuit to do it is:
NOTE:
Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up
resistor may bring to latch up problems on the HE910 power regulator and improper power
on/off of the module. The line ON_OFF* must be connected only in open collector or open
drain configuration.
NOTE:
In this document all the lines that are inverted, hence have active low signals are labelled with a
name that ends with”#",”*” or with a bar over the name.
TIP:
To check if the device has powered on, the hardware line PWRMON should be monitored.
NOTE:
It is mandatory to avoid sending data to the serial ports during the first 200ms of the module
start-up.
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page 23 of 23
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
A flow chart showing the proper turn on procedure is displayed below:
“Modem ON Proc”
START
VBATT > 3.22V ?
PWMON = ON ?
ON_OFF* = LOW
GOTO
“HW SHUTDOWN
unconditional”
Delay = 5 Sec
ON_OFF* = HIGH
PWMON = ON ?
Delay 1s
GOTO
“Start AT CMD.”
“Modem ON Proc”
END
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page 24 of 24
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
A flow chart showing the AT commands managing procedure is displayed below:
“Start AT CMD.”
START
DELAY 300msec
Enter AT
AT answer in
1 sec ?
GOTO
“HW SHUTDOWN
unconditional”
“Start AT CMD.”
GOTO
END
“Modem ON Proc.”
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 when the module is powered off or during
an ON/OFF transition.
For example:
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page 25 of 25
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT1):
2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button:
WARNING
It is recommended to set the ON_OFF* line LOW to power on the module only after VBATT is higher
than 3.22V.
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page 26 of 26
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and
then restart the power on activity using the ON_OFF * line.
An example of this is described in the following diagram:
After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on the
module.
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page 27 of 27
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
4.2 Turning OFF the HE910
Turning off of the device can be done in two ways:
•
via AT command (see HE910 Software User Guide, AT#SHDN)
•
by tying low pin ON_OFF*
Either ways, the device issues a detach request to network informing that the device will not be
reachable any more.
To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 3 seconds and then
released.
TIP:
To check if the device has been powered off, the hardware line PWRMON must be monitored.
The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 when the module is powered off or during
an ON/OFF transition.
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page 28 of 28
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
The following flow chart shows the proper turn off procedure:
Modem OFF Proc.
START
PWRMON=ON?
AT
Key
OFF Mode
ON_OFF* = LOW
AT#SHDN
Delay >= 3 Sec
ON_OFF* = HIGH
PWMON = ON ?
“Modem OFF Proc”
END
Looping for more
than 15s ?
GOTO
“HW Shutdown
Unconditional”
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page 29 of 29
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
4.3 HE910 Unconditional Shutdown
The Unconditional Shutdown of the module could be activated using the
HW_SHUTDOWN* line (pad R13).
WARNING:
The hardware unconditional Shutdown must not be used during normal operation of the device
since it does not detach the device from the network. It shall be kept as an emergency exit
procedure.
To unconditionally shutdown the HE910, the pad HW_SHUTDOWN* must be tied low for at
least 200 milliseconds and then released.
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital
output. Using pull up resistor may bring to latch up problems on the HE910 power regulator and
improper functioning of the module. The line HW_SHUTDOWN* must be connected only in
open collector configuration.
The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an
automatic restart.
The module will shutdown, but will NOT perform the detach from the cellular network.
To proper power on again the module please refer to the related paragraph (“Powering ON the
HE910”)
TIP:
The unconditional hardware shutdown must always be implemented on the boards and should be
used only as an emergency exit procedure.
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page 30 of 30
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
A typical circuit is the following:
For
example:
1- Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of
a +3/5 V microcontroller (uP_OUT2):
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 when the module is powered off or during
an ON/OFF transition.
In the following flow chart is detailed the proper restart procedure:
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page 31 of 31
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
“HW SHUTDOWN
Unconditional”
START
HW_SHDN = LOW
Delay 1s
Delay 200ms
Disconnect
VBATT
HW_SHDN = HIGH
PWRMON = ON
“HW SHUTDOWN
Unconditional”
END
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page 32 of 32
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
5 Power Supply
The power supply circuitry and board layout are a very important part in the full product design
and they strongly reflect on the product overall performances, hence read carefully the
requirements and the guidelines that will follow for a proper design.
5.1 Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil
the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage Range
Extended Operating Voltage Range
3.8 V
3.40 V÷ 4.20 V
3.10 V÷ 4.50 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken when designing the
application’s power supply section to avoid having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off of the module.
The Power supply must be higher than 3.22 V to power on the module
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only with completely assumption and
application of the HW User guide suggestions.
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5.2 Power Consumption
HE910
Mode
Average
(mA)
SWITCHED OFF
Switched Off
40uA
AT+CFUN=1
12.2
AT+CFUN=5
AT+CFUN=1
AT+CFUN=4
AT+CFUN=5
WCDMA Voice
WCDMA HSDPA (0dBm)
WCDMA HSDPA (22dBm)
EDGE 4TX+2RX
GSM900 PL5
DCS1800 PL0
Mode description
Module supplied but Switched Off
IDLE mode (WCDMA)
Normal mode: full functionality of the module
Full functionality with power saving; DRX7;
1.2
Module registered on the network can receive incoming calls
and SMS
IDLE mode (GSM/EDGE)
19
Normal mode: full functionality of the module
16.5
Disabled TX and RX; module is not registered on the network
Full functionality with power saving;
0.8
DRX9 (1.3mA in case of DRX5).
Operative mode (WCDMA)
152
WCDMA voice call (TX = 10dBm)
187
WCDMA data call (Cat 14, TX = 0dBm)
494
WCDMA data call (Cat 14, TX = 22dBm)
Operative mode (EDGE)
495
484
EDGE Sending data mode
Operative mode (GSM)
CSD TX and RX mode
GSM900 CSD PL5
DCS1800 CSD PL0
GPRS 4TX+2RX
GSM900 PL5
DCS1800 PL0
220
167
GSM VOICE CALL
580
438
GPRS Sending data mode
The GSM system is made in a way that the RF transmission is not continuous, else it is packed
into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as
about 2A. Therefore the power supply has to be designed in order to withstand with these
current peaks without big voltage drops; this means that both the electrical design and the board
layout must be designed for this current flow. If the layout of the PCB is not well designed a
strong noise floor is generated on the ground and the supply; this will reflect on all the audio
paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current
absorption is too much, then the device may even shutdown as a consequence of the supply
voltage drop.
NOTE:
The electrical design for the Power supply should be made ensuring it will be capable of a peak
current output of at least 2 A.
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5.3 General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
• the electrical design
• the thermal design
• the PCB layout.
5.3.1 Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where this
power is drained. We will distinguish them into three categories:
• +5V input (typically PC internal regulator output)
• +12V input (typically automotive)
• Battery
5.3.1.1
+ 5V input Source Power Supply Design Guidelines
• The desired output for the power supply is 3.8V, hence there's not a big difference between
the input source and the desired output and a linear regulator can be used. A switching
power supply will not be suited because of the low drop out requirements.
• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the
power generated.
• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks close to the HE910, a 100µF tantalum capacitor is usually suited.
• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
• A protection diode should be inserted close to the power input, in order to save the HE910
from power polarity inversion.
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An example of linear regulator with 5V input is:
5.3.1.2
12V
Guidelines
input
Source
Power
Supply
Design
• The desired output for the power supply is 3.8V, hence due to the big difference between the
input source and the desired output, a linear regulator is not suited and shall not be used. A
switching power supply will be preferable because of its better efficiency especially with the
2A peak current load represented by the HE910.
• When using a switching regulator, a 500kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This allows
the regulator to respond quickly to the current peaks absorption.
• In any case the frequency and Switching design selection is related to the application to be
developed due to the fact the switching frequency could also generate EMC interferences.
• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind
when choosing components: all components in the power supply must withstand this
voltage.
• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100µF tantalum capacitor is usually suited.
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• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
• For Car applications a spike protection diode should be inserted close to the power input, in
order to clean the supply from spikes.
• A protection diode should be inserted close to the power input, in order to save the HE910
from power polarity inversion. This can be the same diode as for spike protection.
An example of switching regulator with 12V input is in the below schematic:
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5.3.1.3
Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit HE910 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE
USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage
for the HE910 and damage it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910. Their use
can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types.
•
•
•
•
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current
absorption peaks, a 100µF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the HE910 from
power polarity inversion. Otherwise the battery connector should be done in a way to avoid
polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the
suggested capacity is from 500mAh to 1000mAh.
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5.3.2 Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:
• Average current consumption during HSDPA transmission @PWR level max :
600 mA
• Average current during idle:
1.5 mA
NOTE:
The average consumption during transmissions depends on the power level at which the device
is requested to transmit by the network. The average current consumption hence varies
significantly.
Considering the very low current during idle, especially if Power Saving function is enabled, it
is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let's say few
minutes) and then remains for a quite long time in idle (let's say one hour), then the power
supply has always the time to cool down between the calls and the heat sink could be smaller
than the calculated one for 600mA maximum RMS current, or even could be the simple chip
package (no heat sink).
Moreover in the average network conditions the device is requested to transmit at a lower power
level than the maximum and hence the current consumption will be less than the 600mA, being
usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground plane where the
power supply chip is placed can be enough to ensure a good thermal condition and avoid
overheating.
For the heat generated by the HE910, you can consider it to be during transmission 1W max
during CSD/VOICE calls and 2W max during GPRS upload.
This generated heat will be mostly conducted to the ground plane under the HE910; you must
ensure that your application can dissipate it.
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5.3.3 Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on
the output to cut the current peaks and a protection diode on the input to protect the supply from
spikes and polarity inversion. The placement of these components is crucial for the correct
working of the circuitry. A misplaced component can be useless or can even decrease the power
supply performances.
•
The Bypass low ESR capacitor must be placed close to the Telit HE910 power
input pads or in the case the power supply is a switching type it can be placed close
to the inductor to cut the ripple provided the PCB trace from the capacitor to the
HE910 is wide enough to ensure a dropless connection even during the 2A current
peaks.
•
The protection diode must be placed close to the input connector where the power
source is drained.
•
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when the 2A current peaks are absorbed.
Note that this is not made in order to save power loss but especially to avoid the
voltage drops on the power line at the current peaks frequency of 216 Hz that will
reflect on all the components connected to that supply, introducing the noise floor at
the burst base frequency. For this reason while a voltage drop of 300-400 mV may
be acceptable from the power loss point of view, the same voltage drop may not be
acceptable from the noise point of view. If your application doesn't have audio
interface but only uses the data feature of the Telit HE910, then this noise is not so
disturbing and power supply layout design can be more forgiving.
•
The PCB traces to the HE910 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur when the 2A current peaks are absorbed.
This is for the same reason as previous point. Try to keep this trace as short as
possible.
•
The PCB traces connecting the Switching output to the inductor and the switching
diode must be kept as short as possible by placing the inductor and the diode very
close to the power switching IC (only for switching power supply). This is done in
order to reduce the radiated field (noise) at the switching frequency (100-500 kHz
usually).
•
The use of a good common ground plane is suggested.
•
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped
to any noise sensitive circuitry as the microphone amplifier/buffer or earphone
amplifier.
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•
The power supply input cables should be kept separate from noise sensitive lines
such as microphone/earphone cables.
•
The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines.
A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N
FBMH1608HM101 can be used for this purpose.
The below figure shows the recommended circuit:
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6 GSM/WCDMA Radio Section
6.1 HE910 Product Variants
The following table is listing the main differences between the HE910 variants:
Product
HE910
HE910-D
HE910-GL
HE910-EUR
HE910-EUD
HE910-EUG
HE910-NAR
HE910-NAD
HE910-NAG
Supported 2G Bands
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
GSM 850, GSM 900,
DCS1800, PCS 1900
Supported 3G bands
FDD B1, B2, B4, B5, B8
FDD B1, B2, B4, B5, B8
FDD B1, B2, B4, B5, B8
Antenna Diversity
FDD B1, B2, B5, B8 GSM
850, GSM 900, PCS 1900
FDD B1, B2, B5, B8 GSM
850, GSM 900, PCS 1900
FDD B1, B2, B5, B8 GSM
850, GSM 900, PCS 1900
FDD B1, B5, B8
NO
FDD B1, B5, B8
NO
FDD B1, B5, B8
NO
FDD B2, B4, B5
NO
FDD B2, B4, B5
NO
FDD B2, B4, B5
NO
6.2 TX Output Power
Band
GSM 850 / 900
DCS1800 / PCS 1900
EDGE, 850/900 MHz
EDGE, 1800/1900 MHz
WCDMA FDD B1, B2, B4, B5, B8
Power Class
4 (2W)
1 (1W)
E2 (0.5W)
Class E2 (0.4W)
Class 3 (0.25W)
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6.3 Sensitivity
Band
GSM 850
GSM 900
DCS1800
PCS 1900
WCDMA FDD B1
WCDMA FDD B2
WCDMA FDD B4
WCDMA FDD B5
WCDMA FDD B8
Typical
(without Diversity)
Note
-109.5 dBm
-109 dBm
-110 dBm
-109.5 dBm
-111 dBm
-110 dBm
-111 dBm
-111 dBm
-110 dBm
BER Class II <2.44%
BER Class II <2.44%
BER Class II <2.44%
BER Class II <2.44%
BER <0.1%
BER <0.1%
BER <0.1%
BER <0.1%
BER <0.1%
6.4 GSM/WCDMA Antenna Requirements
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read carefully
and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the
following requirements:
Frequency range
Bandwidth (GSM/EDGE)
Bandwidth
(WCDMA)
Impedance
Input power
VSWR absolute max
VSWR recommended
ANTENNA REQUIREMENTS
Depending by frequency band(s) provided by the network operator, the
customer shall use the most suitable antenna for that/those band(s)
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140
MHz PCS band
70 MHz in WCDMA Band V
80 MHz in WCDMA Band VIII
460 MHz in WCDMA Band IV
140 MHz in WCDMA Band II
250 MHz in WCDMA Band I
50 ohm
> 33dBm(2 W) peak power in GSM
> 24dBm Average power in WCDMA
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
When using the HE910, since there's no antenna connector on the module, the antenna must
be connected to the HE910 antenna pad (K1) by means of a transmission line implemented
on the PCB.
In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB
line is needed in order to connect with it or with its connector.
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This transmission line shall fulfil the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic Impedance
50 ohm
Max Attenuation
0,3 dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to
the HE910 ground pins
Furthermore if the device is developed for the US market and/or Canada market, it shall
comply with the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the Telit
FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be co-located or operating
in conjunction with any other antenna or transmitter. If antenna is installed with a separation
distance of less than 20 cm from all persons or is co-located or operating in conjunction with
any other antenna or transmitter then additional FCC/IC testing may be required. End-Users
must be provided with transmitter operation conditions for satisfying RF exposure
compliance.
Antennas used for this OEM module must not exceed the gains for mobile and fixed
operating configurations as described in “FCC/IC Regulatory notices” chapter.
6.5 GSM/WCDMA - PCB line Guidelines
• Make sure that the transmission line’s characteristic impedance is 50ohm ;
• Keep line on the PCB as short as possible, since the antenna line loss shall be less than
around 0,3 dB;
• Line geometry should have uniform characteristics, constant cross section, avoid meanders
and abrupt curves;
• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide...) can be used for implementing the printed transmission line afferent
the antenna;
• If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended, so the geometry can be as similar as possible to the related canonical
model;
• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible,
use this layer as reference Ground plane for the transmission line;
• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having
other signal tracks facing directly the antenna line track.
• Avoid crossing any un-shielded transmission line footprint with other signal tracks on
different layers;
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• The ground surrounding the antenna line on PCB has to be strictly connected to the main
Ground Plane by means of via holes (once per 2mm at least), placed close to the ground
edges facing line track;
• Place EM noisy devices as far as possible from HE910 antenna line;
• Keep the antenna line far away from the HE910 power supply lines;
• If EM noisy devices are present on the PCB hosting the HE910, such as fast switching ICs,
take care of the shielding of the antenna line by burying it inside the layers of PCB and
surround it with Ground planes, or shield it with a metal frame cover.
• If EM noisy devices are not present around the line, the use of geometries like Microstrip or
Grounded Coplanar Waveguide has to be preferred, since they typically ensure less
attenuation if compared to a Stripline having same length;
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6.6 PCB
Guidelines
in
case
of
FCC
certification
In the case FCC certification is required for an application using HE910, HE910-D, HE910NAx, according to FCC KDB 996369 for modular approval requirements, the transmission line
has to be similar to that implemented on module’s interface board and described in the following
chapter.
6.6.1 Transmission line design
During the design of the interface board, the placement of components has been chosen properly,
in order to keep the line length as short as possible, thus leading to lowest power losses possible.
A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of
transmission line ensures good impedance control and can be implemented in an outer PCB layer
as needed in this case. A SMA female connector has been used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by
relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance
from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer
3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane
is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1
dB. The line geometry is shown below:
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6.6.2 Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated
coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has
been soldered to the board in order to characterize the losses of the transmission line including
the connector itself. During Return Loss / impedance measurements, the transmission line has
been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is
shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
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6.7 GSM/WCDMA
Antenna
Installation
Guidelines
• Install the antenna in a place covered by the GSM signal.
• If the device antenna is located greater then 20cm from the human body and there are no colocated transmitter then the Telit FCC/IC approvals can be re-used by the end product
• If the device antenna is located less then 20cm from the human body or there are no colocated transmitter then the additional FCC/IC testing may be required for the end product
(Telit FCC/IC approvals cannot be reused)
• Antenna shall not be installed inside metal cases
• Antenna shall be installed also according Antenna manufacturer instructions.
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6.8 Antenna Diversity Requirements
This product is including an input for a second RX antenna to improve the radio sensitivity. The
function is called Antenna Diversity.
Frequency range
Bandwidth (GSM/EDGE)
Bandwidth
(WCDMA)
Impedance
ANTENNA REQUIREMENTS
Depending by frequency band(s) provided by the network
operator, the customer shall use the most suitable antenna for
that/those band(s)
70 MHz in GSM850, 80 MHz in GSM900 & 140 MHz PCS
band
70 MHz in WCDMA Band V
80 MHz in WCDMA Band VIII
140 MHz in WCDMA Band II
250 MHz in WCDMA Band I
50 ohm
When using the HE910, since there's no antenna connector on the module, the antenna must be
connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the
PCB.
In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB
line is needed in order to connect with it or with its connector.
The second Rx antenna should not be located in the close vicinity of main antenna. In order to
improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be
located at the maximum reciprocal distance possible, taking into consideration the available
space into the application.
NOTE1:
The Diversity is not supported on DCS 1800 in 2G and FDD BAND IV in 3G
NOTE:
If the RX Diversity is not used/connected, disable the Diversity functionality using the
AT#RXDIV command (ref to the AT User guide for the proper syntax) and leave the pad F1
unconnected.
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7 GPS Receiver
The HE910 module is integrating a GPS receiver that could be used in Autonomous or in A-GPS
(assisted GPS) mode.
With the help of advanced digital signal processing algorithms and the use of A-GPS data, the receiver
is capable to achieve sensitivity values of better than -165 dBm as is required for indoor applications.
The following table is listing the HE910 variants that support the GPS receiver:
Product
HE910
HE910-D
HE910-GL
HE910-EUR
HE910-EUD
HE910-EUG
HE910-NAR
HE910-NAD
HE910-NAG
GPS Receiver
YES
NO
NO
NO
NO
YES
NO
NO
YES
7.1 GPS Performances
•
•
•
•
•
Advanced real time hardware correlation engine for enhanced sensitivity (better than -165 dBm for
A-GPS).
Fast Acquisition giving rapid Time-to-First-Fix (TTFF)
Capability to monitor up to 28 channels
Stand Alone and Assisted mode
Integrated LNA
The following Table is listing the main characteristics:
Characteristic
GPS RX Sensitivity
GPS Cold Start Autonomous
GPS Hot Start Autonomous
GPS tracking mode
GPS Accuracy
TTFF from Cold Start
TTF from Warm Start
TTF from Hot Start
Power Consumption in Acquisition
Power Consumption in Tracking
Power Consumption in Low Power Tracking
Typical Values
-164dBm
-147dBm
-161dBm
-166 dBm
3m
42 sec
30sec
1.8 sec
46.4 mA @3.8V
37.8 mA @3.8V
25.7 mA @3.8V
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7.2 GPS Signals Pinout
The Pads related to this function are the following:
PAD
Signal
I/O
Function
Type
R9
ANT_GPS
GPS Antenna (50 ohm)
RF
R7
GPS_LNA_EN
Output enable for External LNA supply
CMOS 1.8V
7.3 RF Front End Design
The HE910 Module contains an integrated LNA and pre-select SAW filter. This allows the module to
work well with a passive GPS antenna. If the antenna cannot be located near the HE910, then an active
antenna (that is, an antenna with a low noise amplifier built in) can be used.
7.3.1 RF Signal Requirements
The HE910 can achieve Cold Start acquisition with a signal level of -147 dBm at its input. This means
the GPS receiver can find the necessary satellites, download the necessary ephemeris data and compute
the location within a 5 minute period.
In the GPS signal acquisition process, downloading and decoding the data is the most difficult task,
which is why Cold Start acquisition requires a higher signal level than navigation or tracking signal
levels. For the purposes of this discussion, autonomous operation is assumed, which makes the Cold
Start acquisition level the important design constraint. If assistance data in the form of time or
ephemeris aiding is available, then even lower signal levels can be used to compute a navigation
solution.
Each GPS satellite presents its own signal to the HE910, and best performance is obtained when the
signal levels are between -125 dBm and -117 dBm. These received signal levels are determined by :
• GPS satellite transmit power
• GPS satellite elevation and azimuth
• Free space path loss
• Extraneous path loss such as rain
• Partial or total path blockage such as foliage or building
• Multipath caused by signal reflection
• GPS antenna
• Signal path after the GPS antenna
The first three items in the list above are specified in IS-GPS-200E, readily available multiple sources
online. IS-GPS-200E specifies a signal level minimum of -130 dBm will be presented to the receiver
when using a linearly polarized antenna with 3 dBi gain.
The GPS signal is relatively immune to rainfall attenuation and does not really need to be considered.
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However, the GPS signal is heavily influenced by attenuation due to foliage such as tree canopies, etc.,
as well as outright blockage caused by building, terrain or other items in the line of sight to the specific
GPS satellite. This variable attenuation is highly dependent upon GPS satellite location. If enough
satellites are blocked, say at a lower elevation, or all in a general direction, the geometry of the
remaining satellites will result is a lower accuracy of position. The HE910 reports this geometry in the
form of PDOP, HDOP and VDOP.
For example, in a vehicular application, the GPS antenna may be placed embedded into the dashboard
or rear package tray of an automobile. The metal roof of the vehicle will cause significant blockage,
plus any thermal coating applied to the vehicle glass can attenuate the GPS signal by as much as 15 dB.
Again, both of these factors will affect the performance of the receiver.
Multipath is a phenomena where the signal from a particular satellite is reflected and is received by the
GPS antenna in addition to or in place of the original line of sight signal. The multipath signal has a
path length that is longer than the original line of sight path and can either attenuate the original signal,
or if received in place of the original signal add additional error in determining a solution because the
distance to the particular GPS satellite is actually longer than expected. It is this phenomena that makes
GPS navigation in urban canyons (narrow roads surround by high rise buildings) so challenging. In
general, the reflecting of the GPS signal causes the polarization to reverse. The implications of this are
covered in the next section.
7.3.2 GPS Antenna Polarization
The GPS signal as broadcast is a right hand circularly polarized signal. The best antenna to receive the
GPS signal is a right hand circularly (RHCP) polarized antenna.
Remember that IS-GPS-200E specifies the receive power level with a linearly polarized antenna. A
linearly polarized antenna will have 3 dB loss as compared to an RHCP antenna assuming the same
antenna gain (specified in dBi and dBic respectively).
An RHCP antenna is better at rejecting multipath than a linearly polarized antenna.
This is because the reflected signal changes polarization to LHCP, which would be rejected by the
RHCP antenna by typically 20 dB or so. If the multipath signal is attenuating the line of sight signal,
then the RHCP antenna would show a higher signal level than a linearly polarized antenna because the
interfering signal is rejected.
However, in the case where the multipath signal is replacing the line of sight signal, such as in an
urban canyon environment, then the number of satellites in view could drop below that needed to
determine a 3D solution. This is a case where a bad signal may be better than no signal. The system
designer needs to make tradeoffs in their application to determine which is the better choice.
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7.3.3 GPS Antenna Gain
Antenna gain is defined as the extra signal power from the antenna as compared to a theoretical
isotropic antenna (equally sensitive in all directions).
For example, a 25mm by 25m square patch antenna on a reference ground plane (usually 70mm by
70mm) will give an antenna gain at zenith of 5 dBic. A smaller 18mm by 18mm square patch on a
reference ground plane (usually 50mm by 50mm) will give an antenna gain at zenith of 2 dBic.
While an antenna vendor will specify a nominal antenna gain (usually at zenith, or directly overhead)
they should supply antenna pattern curves specifying gain as a function of elevation, and gain at a fixed
elevation as a function of azimuth. Pay careful attention to the requirement to meet these specifications,
such as ground plane required and any external matching components. Failure to follow these
requirements could result in very poor antenna performance.
It is important to note that GPS antenna gain is not the same thing as external LNA gain. Most antenna
vendors will specify these numbers separately, but some combine them into a single number. It is
important to know both numbers when designing and evaluating the front end of a GPS receiver.
For example, antenna X has an antenna gain of 5 dBiC at azimuth and an LNA gain of 20 dB for a
combined total of 25 dB. Antenna Y has an antenna gain of -5 dBiC at azimuth and an LNA gain of 30
dB for a combined total of 25 dB. However, in the system, antenna X will outperform antenna Y by
about 10 dB (refer to next chapter for more details on system noise floor).
An antenna with higher gain will generally outperform an antenna with lower gain. Once the signals
are above about -130 dBm for a particular satellite, no improvement in performance would be gained.
However, for those satellites that are below about -125 dBm, a higher gain antenna would improve the
gain and improve the performance of the GPS receiver. In the case of really weak signals, a good
antenna could mean the difference between being able to use a particular satellite signal or not.
7.3.4 Active versus Passive Antenna
If the GPS antenna is placed near the HE910 and the RF traces losses are not excessive (nominally 1
dB), then a passive antenna can be used. This would normally be the lowest cost option and most of the
time the simplest to use. However, if the antenna needs to be located away from the HE910 then an
active antenna may be required to obtain the best system performance. The active antenna has its own
built in low noise amplifier to overcome RF trace or cable losses after the active antenna.
However, an active antenna has a low noise amplifier (LNA) with associated gain and noise figure. In
addition, many active antennas have either a pre-select filter, a post-select filter, or both.
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7.3.5 GPS Antenna - PCB Line Guidelines
•
Ensure that the antenna line impedance is 50ohm.
•
Keep the antenna line on the PCB as short as possible to reduce the loss.
•
Antenna line must have uniform characteristics, constant cross section, avoid meanders and
abrupt curves.
•
Keep one layer of the PCB used only for the Ground plane, if possible.
•
Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having
other signal tracks facing directly the antenna line of track.
•
The ground around the antenna line on PCB has to be strictly connected to the Ground Plane
by placing vias once per 2mm at least.
•
Place EM noisy devices as far as possible from HE910 antenna line.
•
Keep the antenna line far away from the HE910 power supply lines.
•
Keep the antenna line far away from the HE910 GSM RF lines.
•
If you have EM noisy devices around the PCB hosting the HE910, such as fast switching ICs,
take care of the shielding of the antenna line by burying it inside the layers of PCB and
surround it with Ground planes, or shield it with a metal frame cover.
•
If you do not have EM noisy devices around the PCB of HE910, use a strip-line on the
superficial copper layer for the antenna line. The line attenuation will be lower than a buried
one.
7.3.6 RF Trace Losses
RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF
simulation software to estimate what the losses would be. A good rule of thumb would be to keep the
RF traces as short as possible, make sure they are 50 ohms impedance and don’t contain any sharp
bends.
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7.3.7 Implications of the Pre-select SAW Filter
The HE910 module contains a SAW filter used in a pre-select configuration with the built-in LNA, that
is, the RF input of the HE910 ties directly into the SAW filter. Any circuit connected to the input of the
HE910 would see complex impedance presented by the SAW filter, particularly out of band, rather
than the relatively broad and flat return loss presented by the LNA. Filter devices pass the desired in
band signal to the output, resulting in low reflected energy (good return loss), and reject the out of band
signal by reflecting it back to the input, resulting in high reflected energy (bad return loss).
If an external amplifier is to be used with the HE910, the overall design should be checked for RF
stability to prevent the external amplifier from oscillating. Amplifiers that are unconditionally stable at
the output will be fine to use with the HE910.
If an external filter is to be connected directly to the HE910, care needs to be used in making sure
neither the external filter nor the internal SAW filter performance is compromised. These components
are typically specified to operate into 50 ohms impedance, which is generally true in band, but would
not be true out of band. If there is extra gain associated with the external filter, then a 6 dB Pi or T
resistive attenuator is suggested to improve the impedance match between the two components.
7.3.8 External LNA Gain and Noise Figure
The HE910 can be used with an external LNA such as what might be found in an active antenna.
Because of the internal LNA, the overall gain (including signal losses past the external LNA) should
not exceed 14 dB. Levels higher than that can affect the jamming detection capability of the HE910. If
a higher gain LNA is used, either a resistive Pi or T attenuator can be inserted after the LNA to bring
the gain down to 14 dB .
The external LNA should have a noise figure better than 1 dB. This will give an overall system noise
figure of around 2 dB assuming the LNA gain is 14 dB, or if higher the low gain mode is automatically
managed by the HE910 with its internal AGC.
The external LNA, if having no pre-select filter, needs to be able to handle other signals other than the
GPS signal. These signals are typically at much higher levels. The amplifier needs to stay in the linear
region when presented with these other signals. Again, the system designer needs to determine all of
the unintended signals and their possible levels that can be presented and make sure the external LNA
will not be driven into compression. If this were to happen, the GPS signal itself would start to be
attenuated and the GPS performance would suffer.
7.3.9 Powering the External LNA (active antenna)
The external LNA needs a source of power. Many of the active antennas accept a 3 volt or 5 volt DC
voltage that is impressed upon the RF signal line. This voltage is not supplied by the HE910, but can
be easily supplied by the host design.
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7.3.10 External LNA Enable
The HE910 is already provided by an internal LNA. In case the Application needs to include an
additional LNA stage, the module is provided by a digital signal usable to enable the power
supply of the external amplifier. The signal is set to High only when the GPS receiver is active.
The electrical characteristics of the GPS_LNA_EN signal are:
Level
Min
Max
Output high level
1.6V
1.9
Output low level
0V
0.2V
An example of GPS Antenna Supply circuit is shown in the following image:
NOTE:
The maximum DC voltage applicable to the ANT_GPS pin is 5V. In case this is exceeded, a
series capacitor has to be included in the design to avoid exceeding the maximum input DC
level.
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7.3.11 Shielding
Shielding the RF circuitry generally is ineffective because the interference is getting into the GPS
antenna itself, the most sensitive portion of the RF path. The antenna cannot be shielded because then
it can’t receive the GPS signals.
There are two solutions, one is to move the antenna away from the source of interference or the second
is to shield the digital interference to prevent it from getting to the antenna.
7.3.12 GPS Antenna - Installation
•
The HE910 due to its characteristics of sensitivity is capable to perform a Fix inside the
buildings. (In any case the sensitivity could be affected by the building characteristics i.e.
shielding).
•
The Antenna must not be co-located or operating in conjunction with any other antenna or
transmitter.
•
Antenna must not be installed inside metal cases.
•
Antenna must be installed also according to the Antenna manufacturer instructions.
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8 Logic level specifications
The following table shows the logic level specifications used in the HE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with respect to ground
-0.3V
2.1V
Input level on any digital pin (CMOS 1.2) with respect to ground
-0.3V
1.4V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9V
Output low level
0V
0.2V
Operating Range - Interface levels (1.2V CMOS)
Level
Min
Max
Input high level
0.9V
1.3V
Input low level
0V
0.3V
Output high level
1V
1.3V
Output low level
0V
0.1V
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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8.1 Unconditional Shutdown
Signal
Function
I/O
PAD
HW_SHUTDOWN*
Unconditional Shutdown of the Module
R13
HW_SHUTDOWN* is used to unconditionally shutdown the HE910. Whenever this signal is
pulled low, the HE910 is reset. When the device is reset it stops any operation. After the release
of the line, the HE910 is unconditionally shut down, without doing any detach operation from
the network where it is registered. This behaviour is not a proper shut down because any GSM
device is requested to issue a detach request on turn off. For this reason the HW_SHUTDOWN*
signal must not be used to normally shutting down the device, but only as an emergency exit in
the rare case the device remains stuck waiting for some network response.
The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper poweron reset sequence, so there's no need to control this pin on start-up.
It may only be used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the HE910. Use the ON/OFF signal to perform this function
or the AT#SHDN command.
Unconditional Shutdown Signal Operating levels:
Signal
Min
Max
HW_SHUTDOWN*
Input high
HW_SHUTDOWN*
Input low
1.5V
1.9V
0V
0.35V
* this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be connected with
an open collector transistor, to permit to the internal circuitry the power on reset and under
voltage lockout functions.
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9 USB Port
The HE910 includes one integrated universal serial bus (USB 2.0 HS) transceiver.
9.1 USB 2.0 HS Description
This port is compliant with the USB 2.0 HS.
The USB FS is supported for AT interface and data communication.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
B15
USB_D+
I/O
USB differential Data (+)
3.3V
C15
USB_D-
I/O
USB differential Data (-)
3.3V
A13
VUSB
AI
Power sense for the internal USB
transceiver.
5V
NOTE
Accepted range:
4.4V to 5.25V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.
The signal traces should be routed carefully. Trace lengths, number of vias and capacitive
loading should be minimized. The characteristic impedance value should be as close as
possible to 90 Ohms differential.
In case there is a need to add an ESD protection the suggested connection is the following:
NOTE:
VUSB pin should be disconnected before activating the Power Saving Mode.
In case of a Firmware upgrade using the USB port, it could be done only using an USB 2.0 HS
device.
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10 SPI port
The HE910 Module is provided by one SPI interface.
The SPI interface defines two handshake lines for flow control and mutual wake-up of the
modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).
The AP has the master role, that is, it supplies the clock.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
COMMENT
D15
SPI_MOSI
SPI MOSI
CMOS 1.8V
Shared with TX_AUX
E15
SPI_MISO
SPI MISO
CMOS 1.8V
Shared with RX_AUX
F15
SPI_CLK
SPI Clock
CMOS 1.8V
H15
SPI_MRDY
SPI_MRDY
CMOS 1.8V
J15
SPI_SRDY
SPI_SRDY
CMOS 1.8V
The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this
digital section.
NOTE:
Due to the shared functions, when the SPI port is used, it is not possible to use the AUX_UART
port.
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10.1 SPI Connections
SPI_MISO
E15
SPI_MOSI
D15
SPI_CLK
F15
SPI_MRDY
H15
HE910
SPI_SRDY
J15
VDD_IO1
D13
1V8_SEL
E13
D14
AP
nc
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11 USB HSIC
The HE910 Module is provided by one USB HSIC interface.
The USB HSIC (High Speed Inter Processor) Interface allows supporting the inter-processor
communication between an application processor (AP) – the host, and the modem processor
(CP) – the HE910.
The following table is listing the available signals:
Pad
Signal
A12
Direction
Function
Type
HSIC_USB_DATA
I/O
USB HSIC data signal
CMOS 1.2V
COMMENT
A11
HSIC_USB_STRB
I/O
USB HSIC strobe signal
CMOS 1.2V
H15
HSIC_SLAVE_WAKEUP
Slave Wake Up
CMOS 1.8V
Shared with SPI_MRDY
F15
HSIC_HOST_WAKEUP
Host Wake Up
CMOS 1.8V
Shared with SPI CLK
K15
HSIC_SUSPEND_REQUEST
Slave Suspend Request
CMOS 1.8V
Shared with GPIO08
J15
HSIC_HOST_ACTIVE
Active Host Indication
CMOS 1.8V
Shared with SPI_SRDY
D13
VDD_IO1
VDD_IO1 Input
To be connected to E13
E13
1V8_SEL
1V8 SEL for VDD_IO1
To be connected to D13
The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this
digital section.
For the detailed use of USB HSIC port please refer to the related Application Note.
NOTE:
Due to the shared functions, when the USB_HSIC port is used, it is not possible to use the SPI
and the GPIO_08.
The USB_HSIC is not active by default but it has to be enabled using the AT#PORTCFG
command (refer to the AT User guide for the detailed syntax description).
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12 Serial Ports
The HE910 module is provided with by 2 Asynchronous serial ports:
• MODEM SERIAL PORT 1 (Main)
• MODEM SERIAL PORT 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware, but the most
common are:
• RS232 PC com port
• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
• microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may be
needed to make the system work.
On the HE910 the ports are CMOS 1.8.
The electrical characteristics of the Serial ports are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Input level on any digital pin (CMOS 1.8) with
respect to ground
Min
Max
-0.3V
2.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
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12.1 MODEM SERIAL PORT 1 (USIF0)
The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
RS232
Pin #
Signal
C109/DCD
HE910
Pad Number
N14
Name
Usage
Data Carrier Detect
Transmit line *see
Note
Receive line *see
Note
Data Terminal Ready
Output from the HE910 that indicates the carrier presence
C104/RXD
M15
C103/TXD
N15
C108/DTR
Input to the HE910 that controls the DTE READY condition
GND
C107/DSR
M14
M12, B13, P13,
E14 …
P14
Ground
Ground
C106/CTS
P15
Data Set Ready
Clear to Send
Output from the HE910 that indicates the module is ready
Output from the HE910 that controls the Hardware flow
control
Input to the HE910 that controls the Hardware flow control
Output from the HE910 that indicates the incoming call
condition
C105/RTS
L14
Request to Send
C125/RING
R14
Ring Indicator
Output transmit line of HE910 UART
Input receive of the HE910 UART
The following table shows the typical input value of internal pull-up resistors for RTS DTR
and TXD input lines and in all module states:
RTS DTR TXD
STATE
ON
OFF
RESET
POWER
SAVING
5K to 12K
Schottky diode
Schottky diode
Pull up tied to
1V8
5K to 12K
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The input line ON_OFF and RESET state can be treated as in picture below
NOTE:
According to V.24, some signal names are referred to the application side, therefore on the
HE910 side these signal are on the opposite direction:
TXD on the application side will be connected to the receive line (here named C103/TXD)
RXD on the application side will be connected to the transmit line (here named C104/RXD)
NOTE:
For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can
be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 when the module is powered off or during
an ON/OFF transition.
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12.2 MODEM SERIAL PORT 2 (USIF1)
The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX
signals.
The signals of the HE910 serial port are:
PAD
Signal
I/O
Function
Type
COMMENT
D15
TX_AUX
Auxiliary UART (TX Data to
DTE)
CMOS 1.8V
SHARED WITH
SPI_MTSR
E15
RX_AUX
Auxiliary UART (RX Data from
DTE)
CMOS 1.8V
SHARED WITH
SPI_MRST
The signal 1V8_SEL must be connected to the VDD_IO1 input pin in order to use this port.
NOTE:
Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI
functions.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 when the module is powered off or during
an ON/OFF transition.
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12.3 RS232 level translation
In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a
level translator is required. This level translator must:
•
invert the electrical signal in both directions;
•
Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level
translator. Note that the negative signal voltage must be less than 0V and hence some sort of
level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and in
the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The
receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
• 5 drivers
• 3 receivers
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An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver
(MAX218)
In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example
done on 4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
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HE910 Hardware User Guide
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13 Audio Section Overview
The Audio of the HE910 Module is carried by DVI digital audio interface.
The audio port can be directly connected to end device using digital interface, or via one of the
several compliant codecs (in case an analog audio is needed).
13.1 Electrical Characteristics
The product is providing the Digital Audio Interface (DVI) on the following Pins:
Digital Voice Interface (DVI)
PAD
Signal
I/O
B9
DVI_WA0
I/O
B6
DVI_RX
Function
Digital Audio Interface (Word Alignment /
LRCLK)
Digital Audio Interface (RX)
Note
Type
B7
DVI_TX
Digital Audio Interface (TX)
CMOS 1.8V
B8
DVI_CLK
I/O
Digital Audio Interface (BCLK)
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
13.1.1 CODEC Examples
Please refer to the HE910 Digital Audio Application note.
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14 General Purpose I/O
The HE910 module is provided by a set of Digital Input / Output pins
Input pads can only be read; they report the digital value (high or low) present on the pad at the
read time.
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the HE910 firmware and acts depending on
the function implemented.
The following table shows the available GPIO on the HE910:
PAD
Signal
I/O
Function
Type
Drive
strength
Default
State
Note
Alternate function STAT
LED
C8
GPIO_01 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C9
GPIO_02 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C10
GPIO_03 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C11
GPIO_04 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
B14
GPIO_05 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C12
GPIO_06 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
C13
GPIO_07 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
K15
GPIO_08 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
L15
GPIO_09 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
G15
GPIO_10 I/O Configurable GPIO
CMOS 1.8V
1 mA
INPUT
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VDD_IO1 has to be
connected to 1V8_SEL
VDD_IO1 has to be
connected to 1V8_SEL
VDD_IO1 has to be
connected to 1V8_SEL
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14.1 GPIO Logic levels
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the HE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with respect
to ground
-0.3V
2.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
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14.2 Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another device and
report its status, provided this device has interface levels compatible with the 1.8V CMOS levels
of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface levels
different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a
47K pull up to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 when the module is powered off or during
an ON/OFF transition.
14.3 Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
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14.4 Indication
availability
of
network
service
The STAT_LED pin status shows information on the network service availability and Call
status. The function is available as alternate function of GPIO_01 (to be enabled using the
AT#GPIO=1,0,2 command).
In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED.
Therefore, the status indicated in the following table is reversed with respect to the pin status.
Device Status
LED status
Device off
Permanently off
Not Registered
Registered in idle
Registered in idle + power saving
Permanently on
Blinking 1sec on + 2 sec off
It depends on the event that triggers the wakeup (In
sync with network paging)
Voice Call Active
Dial-Up
Permanently on
Blinking 1 sec on + 2 sec off
A schematic example could be:
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14.5 RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing having only RTC going on when all the other parts of the device are off.
To this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery. NO Devices must be powered from this pin.
In order to keep the RTC active when VBATT is not supplied it is possible to back up the RTC
section connecting a backup circuit to the related VRTC signal (pad C14 on module’s Pinout).
For additional details on the Backup solutions please refer to the related application note (xE910
RTC Backup Application Note)
14.6 External SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
14.7 VAUX Power Output
A regulated power supply output is provided in order to supply small devices from the module.
The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON
indication) function.
This output is always active when the module is powered ON.
The operating range characteristics of the supply are:
Level
Output voltage
Output current
Output bypass capacitor
(inside the module)
Min
Typical
Max
1.78V
1.80V
1.82V
60mA
1uF
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14.8
ADC Converter
14.8.1 Description
The HE910 is provided by one AD converter. It is able to read a voltage level in the range of
0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.
The following table is showing the ADC characteristics:
Input Voltage range
AD conversion
Input Resistance
Input Capacitance
Min
Typical Max
1.2
10
Units
Volt
bits
Mohm
pF
The input line is named as ADC_IN1 and it is available on Pad B1
14.8.2 Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
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15 Mounting the
application
HE910
on
the
15.1 General
The HE910 modules have been designed in order to be compliant with a standard lead-free
SMT process.
15.2 Module finishing & dimensions
Pin B1
Bottom view
Dimensions in mm
Lead-free Alloy:
Surface finishing Ni/Au for all solder pads
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15.3 Recommended
foot
print
for
the
application
TOP
VIEW
In
order to
easily rework the HE910 is suggested to consider on the application a 1.5 mm placement
inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see figure above) must
be clear from signal or ground paths.
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15.4 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
15.5 PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
Copper Pad
Pad
Solder Mask
PCB
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
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15.6 PCB pad dimensions
The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)
Solder resist openings
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It is not recommended to place via or micro-via not covered by solder resist in an
area of 0,3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
Inhibit area for micro-via
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Electro-less Ni / Immersion
Au
Layer thickness [µm]
3 –7 / 0.05 – 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is
suggested to use milled contours and predrilled board breakouts; scoring or v-cut
solutions are not recommended.
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15.7 Solder paste
Solder paste
Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules
after assembly.
15.7.1 HE910 Solder reflow
Recommended solder reflow profile:
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Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Pb-Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body surface
WARNING:
The HE910 module withstands one reflow process only.
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15.8 Packing system (Tray)
The HE910 modules are packaged on trays of 36 pieces each. These trays can be used in
SMT processes for pick & place handling.
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15.9 Packing System (Reel)
The HE910 can be packaged on reels of 200 pieces each.
See figure for module positioning into the carrier.
15.9.1 Carrier Tape Detail
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15.9.2 Reel Detail
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15.9.3 Packaging Detail
15.10 Moisture sensitivity
The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC JSTD-020, take care all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH
or more
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16 SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The use of this
product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as hospitals, airports,
aircrafts, etc
Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity.
We recommend following the instructions of the hardware user guides for a correct wiring of the product.
The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the
security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully
the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has to be taken
to the external components of the module, as well as of any project or installation issue, because the risk
of disturbing the GSM network or external devices or having impact on the security. Should there be any
doubt, please refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to
be installed with care in order to avoid any interference with other electronic devices and has to guarantee
a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system
integrator has to assess the final product against the SAR regulation.
The European Community provides some Directives for the electronic equipments introduced on the
market. All the relevant information’s are available on the European Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable
Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
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17 Conformity assessment issues
17.1 1999/5/EC Directive
The HE910, HE910-D, HE910-EUG, HE910-EUR, HE910-EUD, HE910-GL, HE910-NAG, HE910NAR, HE910-NAD modules have been evaluated against the essential requirements of the 1999/5/EC
Directive.
Bulgarian
Czech
Danish
Dutch
English
Estonian
German
Greek
Hungarian
Finnish
French
Icelandic
Italian
С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на
съществените изисквания и другите приложими изисквания на Директива
1999/5/ЕС.
Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se
základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.
Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G
module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.
Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in
overeenstemming is met de essentiële eisen en de andere relevante bepalingen van
richtlijn 1999/5/EG.
Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance
with the essential requirements and other relevant provisions of Directive 1999/5/EC.
Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust
direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele
asjakohastele sätetele.
Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in
Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen
Bestimmungen der Richtlinie 1999/5/EG befindet.
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ∆ΗΛΩΝΕΙ ΟΤΙ 2G/3G module
ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ
∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ.
Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a
vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.
Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on
direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen
mukainen.
Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est
conforme aux exigences essentielles et aux autres dispositions pertinentes de la
directive 1999/5/CE.
Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við
grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC
Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è
conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva
1999/5/CE.
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Latvian
Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas
1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.
Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius
reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Maltese
Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma
mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva
1999/5/EC.
Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar
med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.
Polish
Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z
zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy
1999/5/EC
Portuguese Telit Communications S.p.A. declara que este 2G/3G module está conforme com os
requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Slovak
Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné
požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.
Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi
zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.
Spanish
Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module
cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o
exigibles de la Directiva 1999/5/CE.
Swedish
Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I
överensstämmelse med de väsentliga egenskapskrav och övriga relevanta
bestämmelser som framgår av direktiv 1999/5/EG.
In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910, HE910-EUG
modules are compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EN 301 908-1 V6.2.1
EN 301 908-2 V6.2.1
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.9.2
EN 301 489-3 V1.6.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
+AC:2011
In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-NAG module are
compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.9.2
EN 301 489-3 V1.4.1
EN 301 489-7 V1.3.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
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The HE910-D, HE910-GL, HE910-EUR, HE910-EUD modules are compliant with the following
standards:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
Health & Safety (R&TTE art. 3.1a)
EN 301 511 V9.02
EN 301 908-1 V6.2.1
EN 301 908-2 V6.2.1
EN 301 489-1 V1.9.2
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 +
AC:2011
The HE910-NAR, HE910-NAD modules are compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 301 511 V9.02
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.9.2
EN 301 489-7 V1.3.1
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
Health & Safety (R&TTE art. 3.1a)
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive
1999/5/EC has been followed with the involvement of the following Notified Body:
AT4 wireless, S.A.
Parque Tecnologico de Andalucía
C/ Severo Ochoa 2
29590 Campanillas – Málaga
SPAIN
Notified Body No: 1909
Thus, the following marking is included in the product:
1909
The full declaration of conformity can be found on the following address:
http://www.telit.com/
There is no restriction for the commercialisation of the HE910, HE910-D, HE910-GL, HE910-EUG,
HE910-EUR, HE910-EUD, HE910-NAG, HE910-NAR, HE910-NAD modules in all the countries of the
European Union.
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Final product integrating this module must be assessed against essential requirements of the 1999/5/EC
(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit
Communications S.p.A. recommends carrying out the following assessments:
RF spectrum use (R&TTE art. 3.2)
It will depend on the antenna used on the final product.
EMC (R&TTE art. 3.1b)
Testing
Health & Safety (R&TTE art. 3.1a)
Testing
Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a)
essential requirements can be done against the essential requirements of the EMC and the LVD Directives:
• Low Voltage Directive 2006/95/EC and product safety
• Directive EMC 2004/108/EC for conformity for EMC
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17.2 FCC/IC Regulatory notices
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications
could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout
changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
RF exposure
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled
environment. The antenna should be installed and operated with minimum distance of 20 cm between
the radiator and your body. Antenna gain must be below:
Frequency band Antenna gain
850 MHz
4.14 dBi
1700 MHz
6.30 dBi
1900 MHz
3.01 dBi
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non
contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source
de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:
Bande de fréquence Gain de l'antenne
850 MHz
4.14 dBi
1700 MHz
6.30 dBi
1900 MHz
3.01 dBi
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 96 of 96
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The certification label
of the module shall be clearly visible at all times when installed in the host device, otherwise the host device
must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter
module", or the word "Contains", or similar wording expressing the same meaning, as follows:
HE910, HE910-D
Contains FCC ID: RI7HE910
Contains IC: 5131A-HE910
HE910-GL
Contains FCC ID: RI7HE910GL
Contains IC: 5131A-HE910GL
HE910-NAR, HE910-NAD, HE910-NAG
Contains FCC ID: RI7HE910NA
Contains IC: 5131A-HE910NA
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent.
L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout
temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module,
précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire
exprimant le même sens, comme suit :
HE910, HE910-D
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 97 of 97
HE910 Hardware User Guide
1vv0300925 Rev.28 – 2015-06-24
Contains FCC ID: RI7HE910
Contains IC: 5131A-HE910
HE910-GL
Contains FCC ID: RI7HE910GL
Contains IC: 5131A-HE910GL
HE910-NAR, HE910-NAD, HE910-NAG
Contains FCC ID: RI7HE910NA
Contains IC: 5131A-HE910NA
CAN ICES-3 (B) / NMB-3 (B)
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 98 of 98
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