Telit Communications S p A HE910NAV2 2G/3.5G module, HE910-NAG V2, HE910-NA V2 User Manual HE910 V2 Hardware User Guide
Telit Communications S.p.A. 2G/3.5G module, HE910-NAG V2, HE910-NA V2 HE910 V2 Hardware User Guide
Contents
- 1. updated SW manual
- 2. Updated Hardware manual
Updated Hardware manual
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.
Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2013.
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit HE910-EU/EUG V2 HE910-NA/NAG V2 module. All the features
and solutions detailed are applicable to all HE910 V2, whereas “HE910 V2” is intended the
modules listed in the applicability table.
When a specific feature is applicable to a specific product, it will be clearly highlighted.
This document is intended for Telit customers who are about to implement their applications
using our HE910 V2 modules.
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where to buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Please keep us informed of comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “General Product Description” gives an overview of the features of the product.
Chapter 3: “HE910 V2 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “Antenna” The antenna connection and board layout design are the most important
parts in the full product design.
Chapter 7: “USB Port” The USB port on the Telit HE910 V2 is the core of the interface
between the module and OEM hardware.
Chapter 8: “Serial ports” Refers to the serial ports of the Telit HE910 V2.
Chapter 9: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
HE910 V2 Telit Module.
Chapter 10: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 11: “DAC and ADC section” Deals with these two kinds of converters.
Chapter 12: “Mounting the Module on the application board” Mechanical dimensions and
recommendations on how to mount the module on the user’s board.
Chapter 13: “Packing System” Deals with packing system.
Chapter 14: “Application Design Guide” Deals with the application design of host system.
Chapter 15: “Conformity Assessment Issues” provides some fundamental hints about the
conformity assessment that the final application might need.
Chapter 16: “Safety Recommendation” provides some safety recommendations that must be
followed by the customer in the design of the application that makes use of the Telit HE910
V2.
Chapter 17: “Document History”
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module. If
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
HE910 V2 Product Description, 80418ST10602A
HE910 V2 Software User guide, 1vv0301071
HE910 V2 AT command reference guide, 80428ST10592A
HE910 V2 Digital Voice Interface Application Note, 80000NT10101A
Telit EVK2 User Guide, 1vv0300704
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit HE10 V2 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace the whole hardware solutions and products that may be designed. The wrong
solutions to be avoided must be considered as mandatory, while the suggested hardware
configurations must not be considered mandatory, instead the information given must be used
as a guide and a starting point for properly developing your product with the Telit HE10 V2
module.
NOTE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+ HE910 V2 cellular module
within user application must be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communication S.p.A. for its use, such as any
infringement of patents or other rights of third parties. No license is granted by implication or
otherwise under any patent rights of Telit Communication S.p.A. other than for circuitry
embodied in Telit products. This document is subject to change without notice.
HE910 V2 Variants
Variant name
Upload
Download
Frequencies
Features
HSUPA
(Mbps)
HSDPA
(Mbps)
UMTS/HSPA+
bands(MHz)
GSM/GPRS/EDGE
Quad-band
Data
Voice
GPS
EMEA/APAC/Latin American markets
HE910-EU V2
5.76
14.4
900, 2100
■
■
■
HE910-EUG V2
5.76
14.4
900, 2100
■
■
■
■
North American markets
HE910-NA V2
5.76
14.4
850, 1900
■
■
■
HE910-NAG V2
5.76
14.4
850, 1900
■
■
■
■
The Telit HE910 V2 module overall dimensions are:
• Length: 28.2 mm
• Width: 28.2 mm
• Thickness: 2.2 mm
The module weight of HE910 V2 is about 4.0 gram.
Operating Temperature Range
–40°C ~ +85°C
Storage and non-operating
Temperature Range
–40°C ~ +90°C
As a part of Telit’s corporate policy of environmental protection, the HE910 V2 complies
with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU
directive 2011/65/EU).
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA modes are
conformed to the 3GPP specifications.
Mode
Freq. TX (MHz)
Freq. RX (MHz)
Channels
TX - RX offset
GSM850
824.2 ~ 848.8
869.2 ~ 893.8
128 ~ 251
45 MHz
EGSM900
890.0 ~ 914.8
935.0 ~ 959.8
0 ~ 124
45 MHz
880.2 ~ 889.8
925.2 ~ 934.8
975 ~ 1023
45 MHz
DCS1800
1710.2 ~ 1784.8
1805.2 ~ 1879.8
512 ~ 885
95MHz
PCS1900
1850.2 ~ 1909.8
1930.2 ~ 1989.8
512 ~ 810
80MHz
WCDMA850
(HE910-NA/NAG
V2 only)
826.4 ~ 846.6
871.4 ~ 891.6
Tx: 4132 ~ 4233
Rx: 4357 ~ 4458
45MHz
WCDMA900
(HE910-EU/EUG
V2 only)
882.4 ~ 912.6
927.4 ~ 957.6
Tx: 2712 ~ 2863
Rx: 2937 ~ 3088
45MHz
WCDMA1900
(HE910-NA/NAG
V2 only)
1852.4 ~ 1907.6
1932.4 ~ 1987.6
Tx: 9262 ~ 9538
Rx: 9662 ~ 9938
80MHz
WCDMA2100
(HE910-EU/EUG
V2 only)
1922.4 ~ 1977.6
2112.4 ~ 2167.6
Tx: 9612 ~ 9888
Rx: 10562 ~ 10838
190MHz
Pin
Signal
I/O
Function
Type
USB HS 2.0 Communication Port
B15
USB_D+
I/O
USB differential Data(+)
C15
USB_D-
I/O
USB differential Data(-)
A13
VBUS
I
Power sense for the internal USB transceiver
5V
Asynchronous UART – Prog. / data +HW Flow Control
N15
C103/TXD
I
Serial data input from DTE
CMOS 1.8V
M15
C104/RXD
O
Serial data output to DTE
CMOS 1.8V
M14
C108/DTR
I
Input for Data terminal ready signal (DTR) from DTE
CMOS 1.8V
L14
C105/RTS
I
Input for Request to send signal (RTS) from DTE
CMOS 1.8V
P15
C106/CTS
O
Output for Clear to send signal (CTS) to DTE
CMOS 1.8V
N14
C109/DCD
O
Output for Data carrier detect signal (DCD) to DTE
CMOS 1.8V
P14
C107/DSR
O
Output for Data set ready signal (DSR) to DTE
CMOS 1.8V
R14
C125/RING
O
Output for Ring indicator signal (RI) to DTE
CMOS 1.8V
Asynchronous Auxiliary UART
D15
TX_AUX
O
Auxillary UART (TX Data to DTE)
CMOS 1.8V
E15
RX_AUX
I
Auxillary UART (RX Data from DTE)
CMOS 1.8V
RUIM Card Interface(*)
A3
SIMVCC
-
External SIM signal - Power supply for the SIM
1.8/2.85V
A4
SIMIN
I
External SIM signal – Presence(active low)
CMOS 1.8V
A5
SIMIO
I/O
External SIM signal – Data I/O
1.8/2.85V
A6
SIMCLK
O
External SIM signal - Clock
1.8/2.85V
A7
SIMRST
O
External SIM signal - Reset
1.8/2.85V
Digital Voice interface (DVI)
B9
DVI_WA0
I/O
Digital Voice interface (WA0)
CMOS 1.8V
B6
DVI_RX
I
Digital Voice interface (RX)
CMOS 1.8V
B7
DVI_TX
O
Digital Voice interface (TX)
CMOS 1.8V
B8
DVI_CLK
I/O
Digital Voice interface (CLK)
CMOS 1.8V
Digital IO
C8
GPIO_01
I/O
GPIO_01 / STAT LED
CMOS 1.8V
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
C13
GPIO_07
I/O
GPIO_07 / DAC_OUT
CMOS 1.8V
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
ADC Section
B1
ADC_IN1
AI
Analog/Digital converter input
A/D
Pin
Signal
I/O
Function
Type
RF Section
K1
ANTENNA
I/O
CDMA Antenna (50Ohm)
RF
GPS Section
R9
ANT_GPS
I
GPS Antenna (50Ohm)
RF
R7
GPS_LNA_EN
O
Output enable for External LNA supply
CMOS 1.8V
Miscellaneous Function
R13
HW_SHUTDOWN*
I
Hardware unconditional shutdown
CMOS 1.8V
Open collector
R12
ON_OFF*
I
Input Command for Power ON/Software shutdown
CMOS 1.8V
Open collector
C14
VRTC
I
VRTC Backup Capacitor
Power
R11
VAUX/PWRMON
O
Supply Output for external accessories / Power ON
Monitor
1.8V
Power Supply
M1
VBATT
-
Main Power Supply (Baseband)
Power
M2
VBATT
-
Main Power Supply (Baseband)
Power
N1
VBATT_PA
-
Main Power Supply (PAM)
Power
N2
VBATT_PA
-
Main Power Supply (PAM)
Power
P1
VBATT_PA
-
Main Power Supply (PAM)
Power
P2
VBATT_PA
-
Main Power Supply (PAM)
Power
E1
GND
-
Ground
G1
GND
-
Ground
H1
GND
-
Ground
J1
GND
-
Ground
L1
GND
-
Ground
A2
GND
-
Ground
E2
GND
-
Ground
F2
GND
-
Ground
G2
GND
-
Ground
H2
GND
-
Ground
J2
GND
-
Ground
K2
GND
-
Ground
L2
GND
-
Ground
R2
GND
-
Ground
M3
GND
-
Ground
N3
GND
-
Ground
P3
GND
-
Ground
R3
GND
-
Ground
D4
GND
-
Ground
M4
GND
-
Ground
N4
GND
-
Ground
P4
GND
-
Ground
R4
GND
-
Ground
N5
GND
-
Ground
P5
GND
-
Ground
R5
GND
-
Ground
N6
GND
-
Ground
Pin
Signal
I/O
Function
Type
P6
GND
-
Ground
R6
GND
-
Ground
P8
GND
-
Ground
R8
GND
Ground
P9
GND
-
Ground
P10
GND
-
Ground
R10
GND
-
Ground
M12
GND
-
Ground
B13
GND
-
Ground
P13
GND
-
Ground
E14
GND
-
Ground
Reserved
C1
Reserved
-
Reserved
D1
Reserved
-
Reserved
B2
Reserved
-
Reserved
C2
Reserved
-
Reserved
D2
Reserved
-
Reserved
B3
Reserved
-
Reserved
C3
Reserved
-
Reserved
D3
Reserved
-
Reserved
E3
Reserved
-
Reserved
F1
Reserved
-
Reserved
F3
Reserved
-
Reserved
G3
Reserved
-
Reserved
H3
Reserved
-
Reserved
J3
Reserved
-
Reserved
K3
Reserved
-
Reserved
L3
Reserved
-
Reserved
B4
Reserved
-
Reserved
C4
Reserved
-
Reserved
B5
Reserved
-
Reserved
C5
Reserved
-
Reserved
C6
Reserved
-
Reserved
C7
Reserved
-
Reserved
N7
Reserved
-
Reserved
P7
Reserved
-
Reserved
A8
Reserved
-
Reserved
N8
Reserved
-
Reserved
A9
Reserved
-
Reserved
N9
Reserved
-
Reserved
A10
Reserved
-
Reserved
B10
Reserved
-
Reserved
B11
Reserved
-
Reserved
N10
Reserved
-
Reserved
A11
Reserved
-
Reserved
N11
Reserved
-
Reserved
P11
Reserved
-
Reserved
Pin
Signal
I/O
Function
Type
A12
Reserved
-
Reserved
B12
Reserved
-
Reserved
D12
Reserved
-
Reserved
N12
Reserved
-
Reserved
P12
Reserved
-
Reserved
D13
Reserved
-
Reserved
E13
Reserved
-
Reserved
F13
Reserved
-
Reserved
G13
Reserved
-
Reserved
H13
Reserved
-
Reserved
J13
Reserved
-
Reserved
K13
Reserved
-
Reserved
L13
Reserved
-
Reserved
M13
Reserved
-
Reserved
N13
Reserved
-
Reserved
A14
Reserved
-
Reserved
D14
Reserved
-
Reserved
F14
Reserved
-
Reserved
G14
Reserved
-
Reserved
H14
Reserved
-
Reserved
J14
Reserved
-
Reserved
K14
Reserved
-
Reserved
F15
Reserved
-
Reserved
H15
Reserved
-
Reserved
J15
Reserved
-
Reserved
WARNING:
Reserved pins must not be connected.
NOTE:
The following table is listing the main Pinout differences between the HE910 V2 variants.
Product
GPS
Notes
HE910-EUG V2
Yes
HE910-EU V2
NO
Reserved pads: R7, R9
HE910-NAG V2
Yes
HE910-NA V2
NO
Reserved pads: R7, R9
NOTE:
DTR pin must be connected in order to enter HE910 V2’s power saving mode.
RI pin must be connected in order to wake up the host when a call is coming in sleep mode of
host.
NOTE:
Almost all pins not in use must be left disconnected. The only exceptions are the following
pins:
PAD
Signal
M1,M2,N1,N2,P1,P2
VBATT&VBATT_PA
E1,G1,H1,J1,L1,A2,
E2,F2,G2,H2,J2,K2,
L2,R2,M3,N3,P3,R3,
D4,M4,N4,P4,R4,N5
,P5,R5,N6,P6,R6,P8,
R8,P9,P10,R10,M12,
B13,P13,E14
GND
R12
ON_OFF*
R13
HW_SHUTDOWN*
B15
USB_D+
If not used should be connected to
a Test Point
C15
USB_D-
If not used should be connected to
a Test Point
A13
VBUS
If not used should be connected to
a Test Point
N15
C103/TXD
If not used should be connected to
a Test Point
M15
C104/RXD
If not used should be connected to
a Test Point
L14
C105/RTS
If the flow control is not used it
should be connected to GND
P15
C106/CTS
If not used should be connected to
a Test Point
D15
TXD_AUX
If not used should be connected to
a Test Point
E15
RXD_AUX
If not used should be connected to
a Test Point
K1
Main Antenna
R9
ANT_GPS (If supported by
the product)
If the GPS is not used it could be
left unconnected
RTS must be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application when the module is assembled on
it so we recommend connecting them also to dedicated test point.
NOTE:
The pin defined as RES must be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
NOTE:
The pin defined as RES must be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
To turn on the HE910 V2, the pad ON_OFF* must be tied low for at least 1 second and then
released.
The maximum current that can be drained from the ON_OFF* pad is 0.1 mA.
A simple circuit to power on the module is illustrated below:
Upon turning on HE910 V2 module, the HE910 V2 module is not active yet because the boot
sequence of HE910 V2 is still executing internally. It takes about 10 seconds to complete the
initialization of the module internally.
For this reason, it would be useless to try to access HE910 V2 during the Initialization state as
below. The HE910 V2 module needs at least 10 seconds after the PWRMON goes High to
become operational by reaching the activation state.
During the Initialization state, any kind of AT-command is not available. DTE must wait for
the Activation state to communicate with HE910 V2.
To check if the HE910 V2 has powered on, the hardware line PWRMON must be monitored.
When PWRMON goes high, the module has powered on.
NOTE:
Do not use any pull up resistor on the ON_OFF* line. It is pulled up internally. Using a pull
up resistor may bring latch up problems on the HE910 V2 power regulator and improper
power on/off of the module. The line ON_OFF* must be connected only in open collector
configuration.
NOTE:
In this document all the lines are inverted. Active low signals are labeled with a name that
ends with "*" or with a bar over the name.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 V2 module when the module is powered
OFF or during an ON/OFF transition.
For example:
1. To drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller
(uP_OUT1):
2. To drive the ON_OFF* pad directly with an ON/OFF button:
Turning off the device can be done in two ways:
By software command (see HE910 V2 Software User Guide)
By hardware shutdown (pad ON_OFF*)
When the device is shut down by software command or by hardware shutdown, it issues a
detach request to the network that informs the network that the device will no longer be
reachable.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 V2 when the module is powered OFF or
during an ON/OFF transition.
The following flow chart shows the proper turnoff procedure:
The HE910 V2 can be shut down by a software command.
When a shutdown command is sent, the HE910 V2 goes into the finalization state and will
shut down PWRMON at the end of this state.
The period of the finalization state can vary according to the state of the HE910 V2 so it
cannot be fixed definitely.
Normally it will be above 10 seconds after sending a shutdown command and DTE should
monitor the status of PWRMON to see the actual power off.
TIP:
To check if the device has powered off hardware line PWRMON must be monitored. When
PWRMON goes low, the device has powered off.
4.2.2. Hardware Shutdown
To turn OFF the HE910 V2 the pad ON_OFF* must be tied low for at least 2 seconds and
then released. The same circuitry and timing for the power on must be used.
When the hold time of ON_OFF* is above 2 seconds, the HE910 V2 goes into the finalization
state and will shut down PWRMON at the end of this state.
The period of the finalization state can vary according to the state of the HE910 V2 so it
cannot be fixed definitely.
Normally it will be above 10 seconds after releasing ON_OFF* and DTE should monitor the
status of PWRMON to see the actual power off.
TIP:
To check if the device has powered off, hardware line PWRMON must be monitored. When
PWRMON goes low, the device has powered off.
WARNING:
The Hardware Reset must not be used during normal operation of the device since it does not
detach the device from the network. It shall be kept as an emergency exit procedure to be
done in the rare case that the device gets stuck waiting for some network.
To unconditionally shutdown the HE910 V2, the pad HW_SHUTDOWN* must be tied low
for at least 200 milliseconds and then released.
A simple circuit to unconditionally shutdown the module is illustrated below:
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line or any totem pole digital
output. Using a pull up resistor may bring latch up problems on the HE910 V2 power
regulator and result in improper functioning of the module. The line HW_SHUTDOWN*
must be connected only in open collector configuration.
TIP:
The unconditional hardware Shutdown must always be implemented on the boards and the
software must use it only as an emergency exit procedure.
For example:
To drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller
(uP_OUT2):
The chart below describes the overall sequences for turning the module ON and OFF.
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product’s overall performance. Read carefully the
requirements and the guidelines that follow for a proper design.
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfill the following requirements:
Power Supply
Nominal Supply Voltage
3.8V
Normal Operating Voltage Range
3.4V ~ 4.2V
Extended Operating Voltage Range
3.3V ~ 4.5V
HE910 V2
Mode
Average(mA)
Mode Description
SWITCHED OFF
Module supplied but Switched Off
Switched Off
30uA (*1)
IDLE mode
Standby mode; no call in progress
AT+CFUN=1
WCDMA
15
Normal mode; full functionality of the module
GSM
15
AT+CFUN=4
WCDMA
13
Disabled TX and RX; modules is not registered on the
network
GSM
13
AT+CFUN=0 or
AT+CFUN=5
WCDMA
3.2 (512frame)
1.0 (64frame) (*2)
Power saving; CFUN=0 module registered on the
network and can receive voice call or an SMS; but it is
not possible to send AT commands; module wakes up
with an unsolicited code (call or SMS) or rising RTS
line.
CFN=5 full functionality with power saving;
Module registered on the network can receive
incoming call sand SMS
GSM
3.2 (DRX2)
1.7 (DRX5)
1.3 (DRX9) (*2)
GPRS
1.7 (DRX5) (*3)
WCDMA TX and RX mode
Operating mode
WCDMA Voice
630
WCDMA voice channel
HSPA
640
HSPA data channel
GSM TX and RX mode
Operating mode
GSM Voice(CSD)
230
GSM850/GSM900
185
DCS1800/PCS1900
GPRS 2TX/3RX
390
GSM850/GSM900, class10
300
DCS1800/PCS1900, class10
Mode
Average(mA)
Mode Description
GSM TX and RX mode
Operating mode
GPRS 4TX/2RX
600
GSM850/GSM900, class33
450
DCS1800/PCS1900, class33
EDGE 4TX/2RX
400
GSM850/GSM900, class33
350
DCS1800/PCS1900, class33
GSM peak current
1800
(*1) The off current is the total supply current from the main battery with the PMIC off and
the 32 kHz XTAL oscillator on.
(*2) Worst/best case depends on network configuration and is not under module control.
(*3) GPRS with PDP context active
NOTE:
The Operating Voltage Range MUST never be exceeded. Special care must be taken when
designing the application’s power supply section to avoid having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off of the module.
Behavior in the extended operating voltage range might deviate from 3GPP3 specification.
NOTE:
The electrical design for the Power supply must be made ensuring that it will be capable of a
peak current output of at least 2A.
In GSM/GPRS mode, RF transmission is not continuous and it is packed into bursts at a base
frequency of about 216 Hz, and the relative current peaks can be as high as about 2A.
Therefore the power supply has to be designed in order to withstand these current peaks
without big voltage drops; this means that both the electrical design and the board layout must
be designed for this current flow. If the layout of the PCB is not well designed, a strong noise
floor is generated on the ground; this will reflect on all the audio paths producing an audible
annoying noise at 216 Hz; if the voltage drops during the peak, current absorption is too much.
The device may even shut down as a consequence of the supply voltage drop.
The principal guidelines for the Power Supply Design embrace three different design steps:
the electrical design
the thermal design
the PCB layout
The electrical design of the power supply depends strongly on the power source where this
power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
The desired output for the power supply is 3.8V, hence there is not a big
difference between the input source and the desired output so a linear regulator
can be used. A switching power supply will not be suitable because of the low
drop-out requirements.
When using a linear regulator, a proper heat sink must be provided in order to
dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to
cut the current absorption peaks close to the HE910 V2. A 100μF tantalum
capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.
A protection diode must be inserted close to the power input in order to save the
HE910 V2 from power polarity inversion.
An example of a linear regulator with 5V input:
The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suited
and must not be used. A switching power supply will be preferable because of its
better efficiency especially with the 2A peak current load represented by HE910
V2.
When using a switching regulator, a 500kHz or more switching frequency
regulator is preferable because of its smaller inductor size and its faster transient
response. This allows the regulator to respond quickly to the current peaks
absorption.
In any case, the frequency and Switching design selection is related to the
application to be developed due to the fact the switching frequency could also
generate EMC interferences.
For car PB battery the input voltage can rise up to 15.8V and this must be kept in
mind when choosing components: all components in the power supply must
withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to
cut the current absorption peaks. A 100μF tantalum capacitor is usually suited for
this.
Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.
For Car applications a spike protection diode must be inserted close to the power
input, in order to clean the supply from spikes.
A protection diode must be inserted close to the power input, in order to save
HE910 V2 from power polarity inversion. This can be the same diode as for spike
protection.
An example of switching regulator with 12V input is in the schematic below:
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is
4.2V. A single 3.7V lithium-ion cell battery type is ideal to supply power to the Telit HE910
V2 module.
WARNING:
The three battery cells (Ni/Cd or Ni/MH 3.6V nom. battery types or 4V PB types) MUST
NOT be used directly because their maximum voltage can rise over the absolute maximum
voltage for the HE910 V2 and cause damage. USE only Li-Ion battery types.
NOTE:
Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910 V2. Their
use can lead to overvoltage on HE910 V2 and damage it. Use only Li-Ion battery types.
A Bypass low ESR capacitor of adequate capacity must be provided in order to
cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode must be inserted close to the power input, in order to save
HE910 V2 from power polarity inversion. Otherwise the battery connector must
be done in a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current
peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.
The thermal design for the power supply heat sink must be done with the following
specifications:
Average current consumption during HSPA transmission @PWR level max in
HE910 V2: 640mA
Average current consumption during class10 GPRS transmission @PWR level
max: 390mA
Average current consumption during class33 GPRS transmission @PWR level
max: 600mA
Average GPS current during GPS ON (Power Saving disabled) : 65mA
NOTE:
The average consumption during transmissions depends on the power level at which the
device is requested to transmit via the network. The average current consumption hence varies
significantly.
NOTE:
The thermal design for the Power supply must be made keeping an average consumption at
the max transmitting level during calls of 640mA(HSPA)/600mA(class33 GPRS)
/390mA(class10 GPRS) rms plus 65mA rms for GPS in tracking mode.
Considering the very low current during idle, especially if Power Saving function is enabled,
it is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
If we assume that the device stays in transmission for short periods of time (let us say few
minutes) and then remains for quite a long time in idle (let us say one hour), then the power
supply has always the time to cool down between the calls and the heat sink could be smaller
than the calculated for 640mA (HSPA)/ 600mA (class33 GPRS)/ 390mA (class10 GPRS)
maximum RMS current. There could even be a simple chip package (no heat sink).
Moreover in average network conditions the device is requested to transmit at a lower power
level than the maximum and hence the current consumption will be less than 640mA (HSPA)
/ 600mA (class33 GPRS) /390mA (class10 GPRS) (being usually around 250mA).
For these reasons the thermal design is rarely a concern and the simple ground plane where
the power supply chip is placed can be enough to ensure a good thermal condition and avoid
overheating.
For the heat generated by the HE910 V2, you can consider it to be during transmission 2W
max during class10 GPRS/class33 GPRS upload. This generated heat will be mostly
conducted to the ground plane under the HE910 V2; you must ensure that your application
can dissipate heat.
In the WCDMA/HSPA mode, since HE910 V2 emits RF signals continuously during
transmission, you must pay special attention how to dissipate the heat generated.
The current consumption will be up to about 640mA in HSPA (630mA in WCDMA)
continuously at the maximum TX output power (23dBm). Thus, you must arrange the PCB
area as large as possible under HE910 V2 which you will mount. You must mount HE910 V2
on the large ground area of your application board and make many ground vias to dissipate
the heat.
The peak current consumption in the GSM mode is higher than that in WCDMA. However,
considering the heat sink is more important in case of WCDMA.
As mentioned before, a GSM signal is bursty, thus, the temperature drift is more insensible
than WCDMA. Consequently, if you prescribe the heat dissipation in the WCDMA mode,
you don’t need to think more about the GSM mode.
As seen in the electrical design guidelines, the power supply must have a low ESR capacitor
on the output to cut the current peaks and a protection diode on the input to protect the supply
from spikes and polarity inversion. The placement of these components is crucial for the
correct working of the circuitry. A misplaced component can be useless or can even decrease
the power supply performances.
The Bypass low ESR capacitor must be placed close to the Telit HE910 V2
power input pads, or in the case the power supply is a switching type, it can be
placed close to the inductor to cut the ripple if the PCB trace from the capacitor to
HE910 V2 is wide enough to ensure a drop-less connection even during the 2A
current peaks.
The protection diode must be placed close to the input connector where the power
source is drained.
The PCB traces from the input connector to the power regulator. IC must be wide
enough to ensure no voltage drops to occur when the 2A current peaks are
absorbed. Note that this is not made in order to save power loss but especially to
avoid the voltage drops on the power line at the current peaks frequency of 216
Hz that will reflect on all the components connected to that supply (also
introducing the noise floor at the burst base frequency.) For this reason while a
voltage drop of 300-400 mV may be acceptable from the power loss point of
view, the same voltage drop may not be acceptable from the noise point of view.
If your application does not have audio interface but only uses the data feature of
the Telit HE910 V2, then this noise is not so disturbing and power supply layout
design can be more forgiving.
The PCB traces to HE910 V2 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops to occur when the 2A current peaks are
absorbed. This is a must for the same above-mentioned reasons. Try to keep this
trace as short as possible.
The PCB traces connecting the Switching output to the inductor and the
switching diode must be kept as short as possible by placing the inductor and the
diode very close to the power switching IC (only for switching power supply).
This is done in order to reduce the radiated field (noise) at the switching
frequency (usually 100-500 kHz).
The use of a good common ground plane is suggested.
The placement of the power supply on the board must be done in a way to
guarantee that the high current return paths in the ground plane are not
overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or
earphone amplifier.
The power supply input cables must be kept separately from noise sensitive lines
such as microphone/earphone cables.
The antenna connection and board layout design are the most important parts in the full
product design and they strongly reflect on the product’s overall performances. Read carefully
and follow the requirements and the guidelines for a proper design.
The antenna for a Telit HE910 V2 device must fulfill the following requirements:
When using the Telit HE910 V2, since there’s no antenna connector on the module, the
antenna must be connected to the HE910 V2 antenna pad (K1) by means of a transmission
line implemented in the PCB.
In the case that the antenna is not directly connected at the antenna pad of the HE910 V2, then
a PCB line is required in order to connect with it or with its connector.
This transmission line shall fulfill the following requirements:
Antenna Line on PCB Requirements
Characteristic Impedance
50Ohm
Max Attenuation
0.3dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the HE910 V2 ground pads
GSM / WCDMA Antenna Requirements
Frequency
range
Depending by frequency band(s) provided by the network operator, the
customer must use the most suitable antenna for that/those band(s)
Bandwidth
HE910-EU/EUG V2
HE910-NA/NAG V2
GSM850 : 70 MHz
GSM900 : 80 MHz
GSM1800(DCS) : 170 MHz
GSM1900(PCS) : 140 MHz
WCDMA band I(2100) : 250 MHz
WCDMA band VIII(900) : 80 MHz
GSM850 : 70 MHz
GSM900 : 80 MHz
GSM1800(DCS) : 170 MHz
GSM1900(PCS) : 140 MHz
WCDMA band II(1900) : 140 MHz
WCDMA band V(850) : 70 MHz
Impedance
50 Ohm
Input power
> 33dBm(2 W) peak power in GSM
> 24dBm Average power in WCDMA
VSWR
absolute max
<= 5:1(limit to avoid permanent damage)
VSWR
recommended
<= 2:1(limit to fulfill all regulatory requirements)
Furthermore if the device is developed for the US and/or Canada market, it must comply with
the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the Telit
FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be co-located or operating
in conjunction with any other antenna or transmitter. If antenna is installed with a separation
distance of less than 20 cm from all persons or is co-located or operating in conjunction with
any other antenna or transmitter then additional FCC/IC testing may be required. End-Users
must be provided with transmitter operation conditions for satisfying RF exposure compliance.
OEM integrators must ensure that the end user has no manual instructions to remove or install
the HE910 V2 module. Antennas used for this OEM module must not exceed 7.43dBi gain
for 850MHz bands and 3dBi for 1900MHz bands for mobile and fixed operating
configurations.
Make sure that the transmission line’s characteristic impedance is 50ohm.
Keep line on the PCB as short as possible since the antenna line loss shall be less than
around 0.3dB.
Line geometry should have uniform characteristics, constant cross section, avoid
meanders and abrupt curves.
Any kind of suitable geometry/structure can be used for implementing the printed
transmission line afferent the antenna.
If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended so the geometry can be as similar as possible to the related
canonical model.
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If
possible, use this layer as reference Ground plane for the transmission line.
It is wise to surround (on both sides) of the PCB transmission line with Ground. Avoid
having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other tracks on
different layers.
The Ground surrounding the antenna line on PCB has to be strictly connected to the
main Ground plane by means of via holes (once per 2mm at least) placed close to the
ground edges facing line track.
Place EM noisy devices as far as possible from HE910 V2 antenna line.
Keep the antenna line far away from the HE910 V2 power supply lines.
If EM noisy devices are present on the PCB hosting the HE910 V2, such as fast
switching ICs, take care of shielding them with a metal frame cover.
If EM noisy devices are not present around the line use of geometries like Micro strip
or Grounded Coplanar Waveguide are preferred since they typically ensure less
attenuation when compared to a Strip line having same length.
Install the antenna in a place covered by the GSM/WCDMA signal.
The Antenna shall be installed to provide a separation distance of at least 20 cm
from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter;
If the device antenna is located greater then 20cm from the human body and there
are no co-located transmitter then the Telit FCC/IC approvals can be re-used by
the end product.
If the device antenna is located less then 20cm from the human body or there are
no co-located transmitter then the additional FCC/IC testing may be required for
the end product (Telit FCC/IC approvals cannot be reused)
Antenna shall not be installed inside metal cases;
Antenna shall be installed also according Antenna manufacturer instructions.
The use of an active GPS/GNSS antenna is required to achieve better performance.
The module is provided with a Digital Output signal to enable the external LNA (pad R7).
Parameter
Min
Max
Output high level
1.35V
1.8V
Output low level
0V
0.45V
The use of combined RF/GPS/GNSS antenna is NOT recommended. This solution could
generate extremely poor GPS/GNSS reception and also the combined antenna requires
additional diplexer and adds a loss in the RF route.
In addition, the combination of antennas requires an additional diplexer, which adds
significant power losses in the RF path.
Using this type of antenna introduces at least 3dB of loss if compared to a circularly polarized
(CP) antenna. Having a spherical gain response instead of a hemispherical gain response
could aggravate the multipath behaviour & create poor position accuracy.
Depending on the characteristics and requirements unique to the customer’s designs, the use
of an external LNA or an external active antenna may be required to achieve best
performance.
The optional external LNA should be dimensioned to avoid an excessive LNA gain that can
introduce jamming, spurious, degrade IIP3, and saturate the receiver.
The configurations of an external device must fulfill the following requirements:
An external passive antenna (GPS only)
An external active antenna (GPS or GNSS)
An external passive antenna, GNSS pre-Filter and GNSS LNA (GPS or GNSS)
NOTE:
The external GNSS LNA and GNSS pre-Filter shall be required for GLONASS application.
GNSS LNA requirement shall fulfill the following specifications.
Frequency = 1565 – 1606MHz
Power Gain|S21|2 = 14 – 17dB
NF < 1dB
GNSS pre-Filter requirement shall fulfill the following requirements.
Source and Load Impedance = 50Ohm
Insertion Loss (1575.42 – 1576.42MHz) = 1.4dB (Max)
Insertion Loss (1565.42 – 1585.42MHz) = 2.0dB (Max)
Insertion Loss (1597.5515 – 1605.886MHZ) = 2.0dB (Max)
WARNING:
The HE910 V2 software is implemented differently depending on the configurations of an
external device. Please refer to the AT command User Guide in detail.
The external active antenna for the Telit HE910 V2 device must fulfill the following
requirements:
ACTIVE GPS/GNSS Antenna Requirements
Frequency range
GNSS(GPS L1 & GLONASS) : 1565 MHz ~ 1606 MHz
GPS L1 : 1575.42MHz
GLONASS : 1597.55 – 1605.89MHz
Bandwidth
GPS L1 : +/- 1.023MHz
GLONASS : 8.34MHz
Impedance
50 Ohm
LNA NF
< 1dB
LNA Gain
14 ~ 17dB
LNA Input Voltage
3.0V or 5.0V
NOTE:
The maximum DC voltage applicable to ANT_GPS pin is 5V. In case this is exceeded, a
series capacitor has to be included in the design to avoid exceeding the maximum input DC
level.
An example of GNSS antenna supply circuit is shown in the following image:
When using the Telit HE910 V2, since there’s no antenna connector on the module, the
antenna must be connected to the HE910 V2 through the PCB with the antenna pad.
In the case that the antenna is not directly connected at the antenna pad of the HE910 V2, then
a PCB line is required.
This line of transmission shall fulfill the following requirements:
Antenna Line on PCB Requirements
Characteristic Impedance
50Ohm
Max Attenuation
0.3dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the HE910 V2 ground pads
Furthermore if the device is developed for the US and/or Canada market, it must comply with
the FCC and/or IC requirements.
This device is to be used only for mobile and fixed application.
Ensure that the antenna line impedance is 50ohm.
Keep line on the PCB as short as possible to reduce the loss.
Antenna line must have uniform characteristics, constant cross section, avoid meanders
and abrupt curves.
Keep one layer of the PCB used only for the Ground plane; if possible.
Surround (on the sides, over and under) the antenna line on PCB with Ground. Avoid
having other signal tracks directly facing the antenna line track.
The Ground around the antenna line on PCB has to be strictly connected to the main
Ground plane by placing vias once per 2mm at least.
Place EM noisy devices as far as possible from HE910 V2 antenna line.
Keep the antenna line far away from the HE910 V2 power supply lines.
If EM noisy devices are around the PCB hosting the HE910 V2, such as fast switching
ICs, take care of shielding of antenna line by burying it inside the layers of PCB and
surround it with Ground planes; or shield it with a metal frame cover.
If you do not have EM noisy devices around the PCB of HE910 V2, use a strip line on
the superficial copper layer for the antenna line. The line attenuation will be lower than
a buried one.
The HE910 V2, due to its sensitivity characteristics, is capable of performing a fix
inside buildings. (In any case the sensitivity could be affected by the building
characteristics i.e. shielding)
The Antenna must not be co-located or operating in conjunction with any other antenna
or transmitter.
Antenna shall not be installed inside metal cases.
Antenna shall be installed also according antenna manufacture instructions.
The HE910 V2 module includes a Universal Serial Bus (USB) transceiver, which operates at
USB high-speed (480Mbits/sec).
It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring,
control and data transfers.
The table below describes the USB interface signals:
Pin
Signal
I/O
Function
Type
B15
USB_D+
I/O
USB differential Data(+)
C15
USB_D-
I/O
USB differential Data(+)
A13
VBUS
I
Power sense for the internal USB transceiver
5V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480MHz. The signal
traces should be routed carefully. Trace lengths, number of vias and capacitive loading should
be minimized. The impedance value should be as close as possible to 90 Ohms differential.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect HE910
V2 or customer specific requirements from ESD event to USB lines (B15, C15 and A13).
The serial ports on the Telit HE910 V2 are the interface between the module and OEM
hardware.
2 serial ports are available on the module:
Modem Serial Port 1 (Main)
Modem Serial Port 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware.
The most common are:
RS232 PC comport
Microcontroller UART@1.8V(Universal Asynchronous Receiver Transmit)
Microcontroller UART@5V or other voltages different from 1.8V
Depending on the type of serial port on the OEM hardware, a level translator circuit may be
needed to make the system work.
Serial port 1 is a +1.8V UART with all the 7 RS232 signals.
Serial port 2 is a +1.8V Auxiliary UART.
The electrical characteristics of the serial port are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on non-power pin with respect to ground
-0.3
+2.3V
Operating Range - Interface levels
Parameter
Min
Max
Input high level
1.5V
2.1 V
Input low level
-0.3V
0.35V
Output high level
1.35V
1.8V
Output low level
0V
0.45V
Serial port 1 on the HE910 V2 is a +1.8V UART with all 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
Pin
Signal
I/O
Function
Type
N14
DCD - dcd_uart
O
Data Carrier Detect
1.8V
M15
RXD - Tx_uart
O
Transmit line *see Note
1.8V
N15
TXD - Rx_uart
I
Receive line *see Note
1.8V
M14
DTR - dtr_uart
I
Data Terminal Ready
1.8V
P14
DSR - dsr_uart
O
Data Set Ready
1.8V
L14
RTS - rts_uart
I
Request to Send
1.8V
P15
CTS - cts_uart
O
Clear to Send
1.8V
R14
RI - ri_uart
O
Ring Indicator
1.8V
NOTE:
For minimum implementation, only the TXD and RXD lines must be connected, the other
lines can be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 V2 when the module is powered off or
during an ON/OFF transition.
NOTE:
According to V.24, RX/TX signal names are referred to the application side. Therefore, on the
HE910 V2 side these signals are in the opposite direction: TXD on the application side will
be connected to the receive line (here named TXD/ rx_uart) of the HE910 V2 serial port and
vice versa for RX.
NOTE:
High-speed UART supports up to 4Mbps. Please refer to the AT command User Guide in
detail.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect HE910
V2 or customer specific requirements from ESD event to UART port (M15, N15, P15 and
L14).
Serial port 2 on the HE910 V2 is a +1.8V UART with only the RX and TX signals.
The signals of the HE910 V2 serial port are:
PAD
Signal
I/O
Function
Type
D15
TX_AUX
O
Auxillary UART (TX Data to DTE)
1.8V
E15
RX_AUX
I
Auxillary UART (RX Data from DTE)
1.8V
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the HE910 V2 when the module is powered off or
during an ON/OFF transition.
In order to interface the Telit HE910 V2 with a PC com port or a RS232 (EIA/TIA-232)
application, a level translator is required. This level translator must:
Invert the electrical signal in both directions
Change the level from 0/1.8V to +/-15V
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the
level translator. Note that the negative signal voltage must be less than 0V and hence some
sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and
in the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
5 drivers
3 receivers
An example of RS232 level adaption circuitry could be accomplished using a MAXIM
transceiver (MAX218).
In this case the chipset is capable of translating directly from 1.8V to the RS232 levels
(Example on 4 signals only).
NOTE:
In this case the length of the lines on the application has to be taken into account to avoid
problems in case of High-speed rates on RS232.
The RS232 serial port lines are usually connected to a DB9 connector with the following
layout:
The HE910 V2 module doesn’t support an analog audio interface and supports one Digital
Audio bus.
In order to develop an application including an Analog Audio it is necessary to add a
dedicated CODEC on the Application design.
For further information, please refer to the “Digital Voice Interface Application Note”.
The product is providing one Digital Audio Interface (DVI) on the following Pins:
Pin
Signal
I/O
Function
Type
B9
DVI_WA0
I/O
Digital Voice interface (WA0)
1.8V
B6
DVI_RX
I
Digital Voice interface (RX)
B7
DVI_TX
O
Digital Voice interface (TX)
B8
DVI_CLK
I/O
Digital Voice interface (CLK)
Please refer to the Digital Voice Interface Application note.
The general-purpose I/O pads can be configured to act in three different ways:
Input
Output
Alternate function (internally controlled)
Input pads can only be read and report the digital value (high or low) present on the pad at the
read time.
Output pads can only be written to set the value of the pad or queried.
An alternate function pad is internally controlled by the HE910 V2 firmware and acts
depending on the function implemented.
The following GPIOs are available on the HE910 V2.
Pin
Signal
I/O
Function
Drive Strength
Type
C8
GPIO_01
I/O
Configurable GPIO
2 mA
1.8V
C9
GPIO_02
I/O
Configurable GPIO
2 mA
1.8V
C10
GPIO_03
I/O
Configurable GPIO
2 mA
1.8V
C11
GPIO_04
I/O
Configurable GPIO
2 mA
1.8V
B14
GPIO_05
I/O
Configurable GPIO
2 mA
1.8V
C12
GPIO_06
I/O
Configurable GPIO
2 mA
1.8V
C13
GPIO_07
I/O
Configurable GPIO
2 mA
1.8V
K15
GPIO_08
I/O
Configurable GPIO
2 mA
1.8V
L15
GPIO_09
I/O
Configurable GPIO
2 mA
1.8V
G15
GPIO_10
I/O
Configurable GPIO
2 mA
1.8V
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the HE910 V2 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with respect to ground
-0.3V
2.3V
Operating Range - Interface levels (1.8V CMOS)
Parameter
Min
Max
Input high level
1.5V
2.1V
Input low level
0.0V
0.35V
Output high level
1.35V
1.8V
Output low level
0.0V
0.45V
Current characteristics
Parameter
Typical
Output Current
2mA
Input Current
30uA
The GPIO pads, when used as inputs, can be connected to a digital output of another device
and report its status, provided this device has interface levels compatible with the 1.8V
CMOS levels of the GPIO.
If the digital output of the device is connected with the GPIO input, the pad has interface
levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with
a 4.7KΩ pull-up resistor to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the module when it is powered OFF or during an
ON/OFF transition.
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
The Temperature Monitor is a function of the module that permits control of its internal
temperature and if properly set (see the #TEMPMON command on AT Interface guide) raises
to High Logic level a GPIO when the maximum temperature is reached.
The STAT_LED pin status shows information on the network service availability and Call
status. In the HE910 V2 modules, the STAT_LED usually needs an external transistor to
drive an external LED. Because of the above, the status indicated in the following table is
reversed with respect to the pin status:
Device Status
LED status
Device off
Permanently off
Not registered
Permanently on
Registered in idle
Blinking 1 sec on + 2 sec off
Registered in idle + power saving
It depends on the event that triggers the wakeup
(In sync with network paging)
Voice Call Active
Permanently on
Dial-Up
Blinking 1 sec on + 2 sec off
A schematic example could be:
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing only RTC to be active when all the other parts of the device are off. To
this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery.
NOTE:
NO devices must be powered from this pin.
A regulated power supply output is provided in order to supply small devices from the
module. This output is active when the module is ON and goes OFF when the module is shut
down. The operating range characteristics of the supply are:
Operating Range – VAUX/PWRMON power supply
Parameter
Min
Typical
Max
Output voltage
1.77V
1.8V
1.83V
Output current
100mA
Output bypass capacitor
(Inside the module)
1.0μF
The HE910 V2 module provides a Digital to Analog Converter. The signal (named
DAC_OUT) is available on pin C13 of the HE910 V2 module and on pin 6 of PL302 on
Interface Board (CS1467D).
The on board DAC is in the range from 0 to 1023. However, an external low-pass filter is
necessary.
Parameter
Min
Max
Units
Voltage range (filtered)
0
1.8
Volt
Range
0
1023
Steps
The precision is 1023 steps, so since the maximum voltage is 2V, the integrated voltage could
be calculated with the following formula:
Integrated output voltage = 2 * value / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain
an analog voltage.
An AT command is available to use the DAC function.
The command is: AT#DAC[=<enable>[,<value>]]
<value> - scale factor of the integrated output voltage (0..1023 ~ 10 bit precision)
it must be present if <enable>=1
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
NOTE:
The DAC frequency is selected internally. D/A converter must not be used during
POWERSAVING.
The on board ADC is 8-bit converter. It is able to read a voltage level in the range of 0 ~ 1.2
volts applied on the ADC pin input and store and convert it into 8 bit word.
Parameter
Min
Max
Units
Input Voltage range
0
1.2
Volt
AD conversion
-
8
bits
Resolution
-
< 10
mV
Input Resistance
1
Mohm
The HE910 V2 provides one Analog to Digital Converter.
The input lines are:
ADC available on pin B1 and Pin 7 of PL102 on Interface Board (CS1467D)
An AT command is available to use the ADC function.
The command is AT#ADC=1,2. The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
The HE910 V2 has been designed in order to be compliant with a standard lead-free SMT
process.
Top view Bottom view
(Dimensions in mm)
144 pins
< Top View >
In order to easily rework the HE910 V2 it is suggested to consider having a 1.5 mm
placement inhibit area around the module on the application.
It is also suggested, as a common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see figure) must be clear
from signal or ground paths.
Stencil’s apertures layout can be the same as the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120 µm.
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)
It is not recommended to place via or micro-via not covered by solder resist in an
area of 0,3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish
Layer thickness (um)
Properties
Electro-less Ni / Immersion Au
3 ~ 7 / 0.05 ~ 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is better compared to lead-free solder
paste.
It is not necessary to panel the application’s PCB, however in that case it is suggested to use
milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.
Lead free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Recommended solder reflow profile:
Profile Feature
Pb-Free Assembly
Average ramp-up rate(TL to Tp)
3℃/second max
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time (min to max) (ts)
150℃
200℃
60 - 180 seconds
Tsmax to TL
- Ramp-up Rate
3℃/second max
Time maintained above:
- Temperature (TL)
- Time(tL)
217℃
60 - 150 seconds
Peak Temperature (Tp)
245 +0/-5℃
Time within 5℃ of actual Peak Temperature(tp)
10 - 30 seconds
Ramp-down Rate
6℃/sec max
Time 25℃ to Peak Temperature
8 minutes max
NOTE:
All temperatures refer to topside of the package, measured on the package body surface.
WARNING:
The HE910 V2 module withstands one reflow process only.
The HE910 V2 modules are packaged on trays of 20 pieces each. These trays can be used in
SMT processes for pick & place handling.
WARNING:
These trays can withstand a maximum temperature of 65℃.
The HE910 V2 is a Moisture Sensitive Device level 3, in accordance with standard
IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of
components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
To test and debug the mounting of HE910 V2, we strongly recommend foreseeing test pads
on the host PCB, in order to check the connection between the HE910 V2 itself and the
application and to test the performance of the module connecting it with an external computer.
Depending on the customer application, these pads include, but are not limited to the
following signals:
TXD
RXD
ON_OFF
HW_SHUTDOWN
GND
VBATT and VBATT_PA
TX_AUX
RX_AUX
VAUX/PWRMON
VBUS
USB_D+
USB_D-
When a sudden voltage is asserted to or cut from the power supplies,
The steep transition makes some reactions such as the overshoot and undershoot.
This abrupt voltage transition can affect the device not to work or make it malfunction.
The bypass capacitors are needed to alleviate this behavior and it can be affected
differently according to the various applications. The customers have to pay special
attention to this when they design their application board.
The length and width of the power lines need to be considered carefully and the
capacitance of the capacitors needs to be selected accordingly.
The capacitor will also avoid the ripple of the power supplies and the switching noise
caused in TDMA system like GSM.
Especially the suitable bypass capacitor must be mounted on the VBATT and VBATT_PA
lines in the application board.
The recommended values can be presented as;
100uF for VBATT and VBATT_PA
But the customers still have to consider that the capacitance mainly depends on the
conditions of their application board.
Generally more capacitance is required as the power line is longer.
This section deals with the recommended schematics for the design of SIM interfaces on the
application boards.
Figure 1 illustrates in particular how the application side should be designed, and what values
the components should have.
NOTE FOR R1:
The resistor value on SIMIO pulled up to SIMVCC should be defined accordingly in order to
be compliant to 3GPP specification.
For HE910-EUG V2/NAG V2/EU V2/NA V2 contain an internal pull-up resistor on SIMIO.
However, the un-mounted option in application design can be recommended in order to tune
R1 if necessary.
The following Table lists the values of C1 to be adopted with the HE910 V2 product:
Product P/N
C1 range (nF)
HE910-EUG/NAG V2
100 nF
HE910-EU/NA V2
Refer to the following document for the detail;
Telit_SIM_Integration_Design_Guide_Application_Note
One of the following options should be chosen in the design of host system in order to
download or upgrade the Telit’s software and debug HE910 V2 when HE910 V2 is already
mounted on a host system.
Users who use both of UART and USB interfaces to communicate HE910 V2
- Must implement a download method in a host system for upgrading HE910 V2 when it’s
mounted.
Users who use USB interface only to communicate HE910 V2
- Must arrange UART port in a host system for debugging or upgrading HE910 V2 when
it’s mounted.
Users who use UART interface only to communicate HE910 V2
- Must arrange USB port in a host system for debugging or upgrading HE910 V2 when it’s
mounted.
The HE910-EU V2 and HE910-EUG V2 modules have been assessed in order to satisfy the essential
requirements of the R&TTE Directive 1999/05/EC (Radio Equipment & Telecommunications Terminal
Equipments) to demonstrate the conformity against the harmonized standards with the final involvement of a
Notified Body.
In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910-EUG V2 is compliant with
the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EN 301 908-1 V5.2.1
EN 301 908-2 V5.2.1
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.9.2
EN 301 489-3 V1.4.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011+AC:2011
The HE910-EU V2 module is compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EN 301 511 V9.0.2
EN 301 908-1 V5.2.1
EN 301 908-2 V5.2.1
EMC (R&TTE art. 3.1b)
EN 301 489-1 V1.9.2
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
Health & Safety (R&TTE art. 3.1a)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011+AC:2011
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive
1999/5/EC has been followed with the involvement of the following Notified Body:
AT4 wireless, S.A.
Parque Tecnologico de Andalucía
C/ Severo Ochoa 2
29590 Campanillas – Málaga
SPAIN
Notified Body No: 1909
Thus, the following marking is included in the product:
The full declaration of conformity can be found on the following address:
http://www.telit.com
There is no restriction for the commercialization of the HE910-EU V2 and HE910-EUG V2 modules in all the
countries of the European Union.
Final product integrating this module must be assessed against essential requirements of the 1999/5/EC
(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit
Communications S.p.A. recommends carrying out the following assessments:
RF spectrum use (R&TTE art. 3.2)
It will depend on the antenna used on the final product.
EMC (R&TTE art. 3.1b)
Testing
Health & Safety (R&TTE art. 3.1a)
Testing
Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a) essential
requirements can be done against the essential requirements of the EMC and the LVD Directives:
Low Voltage Directive 2006/95/EC and product safety
Directive EMC 2004/108/EC for conformity for EMC
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications
could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout
changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
This Class B digital apparatus complies with Canadian ICES-0003.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
Wireless notice
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment.
The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your
body. Antenna gain must be below:
Frequency band
HE910-NA V2
HE910-NAG V2
GSM/GPRS850
7.43 dBi
7.43 dBi
FDD V
8.45 dBi
8.45 dBi
GSM/GPRS1900 / FDD II
3.0 dBi
3.0 dBi
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non
contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la
source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:
Bande de fréquence
HE910-NA V2
HE910-NAG V2
GSM/GPRS850
7.43 dBi
7.43 dBi
FDD V
8.45 dBi
8.45 dBi
GSM/GPRS1900 / FDD II
3.0 dBi
3.0 dBi
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Information To Be Supplied to the End User by the OEM or Integrator notice
Modular information form OEM Information to Be Supplied to the End User by the OEM or Integrator
The following regulatory and safety notices must be published in documentation supplied to the end user of
the product or system incorporating an adapter in compliance with local regulations. Host system must be
labeled with "Contains IC: 5131A-HE910NAV2 " or "Contains FCCID:RI7HE910NAV2 ", FCC ID/IC
displayed on label.
READ CAREFULLY
Be sure about that the use of this product is allowed in your country and in the environment
required. The use of this product may be dangerous and has to be avoided in the following
areas:
Where it can interfere with other electronic devices in environments such as
hospitals, airports, aircrafts, etc.
Where there is risk of explosion such as gasoline stations, oil refineries, etc.
It is responsibility of the user to enforce the country regulation and the specific environment
regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty
validity.
We recommend following the instructions of the hardware user guides for a correct wiring of
the product. The product has to be supplied with a stabilized voltage source and the wiring
has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be taken for the
SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the
product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has
to be taken to the external components of the module, as well as of any project or installation
issue, because the risk of disturbing the GSM network or external devices or having impact
on the security. Should there be any doubt, please refer to the technical documentation and the
regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The
antenna has to be installed with care in order to avoid any interference with other electronic
devices and has to be installed with the guarantee of a minimum 20 cm distance from the
body. In case of this requirement cannot be satisfied, the system integrator has to assess the
final product against the SAR regulation.
The European Community provides some Directives for the electronic equipments introduced
on the market. All the relevant information are available on the European Community
website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available, while
the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
Revision
Date
Changes
0
2013-05-14
First issue
1
2013-11-08
Updated 6.1 GSM/WCDMA Antenna Requirements
Updated 8.1 Modem Serial Port 1
Updated 10.5 Indication of Network Service Availability
Updated 14.3 SIM Interface
Updated 15 Conformity Assessment Issues
2
2013-11-27
Updated 2.5 Environmental requirements
Updated 6.1 GSM/WCDMA Antenna Requirements
Updated 15.2 FCC/IC Regulatory notices