Telit Communications S p A WE865D Wi-Fi 802.11 b/g Module User Manual Gxzzz Product Description

Telit Communications S.p.A. Wi-Fi 802.11 b/g Module Gxzzz Product Description

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Document Author: TELIT

WE865-DUAL Hardware User Guide
1vv0300787 Rev. 1 - 03/10/08
WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
This document is relating to the following products:
WE865DUA000-001
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WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
Contents
Overview ...........................................................................................................................6
1.1
Related documents ................................................................................................................7
Mechanical description....................................................................................................8
Pin-out.............................................................................................................................10
3.1
Pin table.................................................................................................................................10
3.2
Ball grid .................................................................................................................................12
Electrical description .....................................................................................................13
4.1
Power supply ........................................................................................................................13
4.2
Power supply design guidelines.........................................................................................16
4.1.1
Unique supply voltage for WE865-DUAL and GE863-PRO3 ......................................................... 13
4.1.1.1 Current consumption ................................................................................................................. 15
4.1.1.2 Shut-down mode........................................................................................................................ 15
4.2.1
4.2.2
4.2.3
4.3
Reset signals ........................................................................................................................20
4.3.1
4.3.2
4.4
+5V input source............................................................................................................................ 17
+12V input source.......................................................................................................................... 18
Battery source................................................................................................................................ 20
Reset.............................................................................................................................................. 21
Manual reset .................................................................................................................................. 22
SDIO signals .........................................................................................................................23
Thermal design guidelines ............................................................................................24
PCB layout design guidelines .......................................................................................25
Antenna...........................................................................................................................26
7.1
Wi-Fi antenna guidelines .....................................................................................................26
7.2
Wi-Fi antenna PCB trace guidelines ...................................................................................27
7.3
Wi-Fi antenna installation guidelines .................................................................................28
Integration with the GE863-PRO3 ..................................................................................29
8.1
Power supply ........................................................................................................................30
8.2
SDIO signals .........................................................................................................................31
WE865-DUAL - Evaluation kit........................................................................................32
9.1
WE865-DUAL Interface board..............................................................................................35
9.1.1
9.1.2
9.1.3
Mechanical description .................................................................................................................. 35
Main components .......................................................................................................................... 36
Jumpers settings............................................................................................................................ 38
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9.1.4
Pin table ......................................................................................................................................... 39
10 Mounting the WE865-DUAL on the application board ................................................40
10.1
Stencil....................................................................................................................................40
10.2
PCB pad design ....................................................................................................................40
10.3
Solder paste ..........................................................................................................................43
10.4
Solder reflow.........................................................................................................................43
11 Moisture sensitivity........................................................................................................45
12 Conformity assessment issues ....................................................................................46
13 Safety recommendations...............................................................................................47
14 Document change log....................................................................................................48
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WE865-DUAL HW User Guide
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DISCLAIMER
The information contained in this document is proprietary information of Telit Communications S.p.A.
including its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than
the Officers, employees, agents or subcontractors of the owner or licensee of this document, without
the prior written consent of Telit, is strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the
foregoing, Telit does not make any warranty as to the information contained herein, and does not
accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the
information.
Telit disclaims any and all responsibility for the application of the devices characterized in this
document, and notes that the application of the device must comply with the safety standards of the
applicable country, and where applicable, with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this document due to
typographical errors, inaccurate information, or improvements to programs and/or equipment at any
time without a notice. Such changes will, nevertheless be incorporated into new editions of this
document.
All rights reserved.
© 2008 Telit Communications S.p.A.
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WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
1 Overview
This document is a user guide for developing a wireless application which integrates the Telit WE865DUAL with the GE863-PRO3 GSM/GPRS module creating a unique solution for a short and long
range.
This document cannot embrace the whole hardware solutions and products that may be designed.
The information given is a guide line and a starting point for properly developing products with the Telit
WE865-DUAL module.
For further hardware details please refer to the Telit “WE865-DUAL Product Description” document.
NOTICE
(EN) The integration of the Wi-Fi WE865-DUAL module within user application shall be done according
to the design rules described in this manual.
(IT) L’integrazione del modulo Wi-Fi WE865-DUAL all’interno dell’applicazione dell’utente dovrà
rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die integration des Wi-Fi WE865-DUAL Moduls in ein Gerät muß gemäß der in diesem Dokument
beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija Wi-Fi WE865-DUAL modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem piročniku.
(SP) La utilización del modulo Wi-Fi WE865-DUAL debe ser conforme a los usos para los cuales ha
sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module Wi-Fi WE865-DUAL dans l’application de l’utilisateur
sera faite selon les règles de conception décri tes dans ce manuel.
Wi-Fi WE865-DUAL – ‫האינטגרטור מתבקש ליישם את ההנחיות המפורטות במסמך זה בהתהליך האינטגרציה של מודם ה‬
‫עם המוצר‬
The information presented in this document is believed to be accurate and reliable. However, no responsibility is
Assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent rights of
Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to
change without notice.
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WE865-DUAL HW User Guide
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1.1 Related documents
The following documents are related to this user guide:
[1] Telit WE865-DUAL Product Description 80312ST10046A
[2] Telit WE865-DUAL Software User Guide 1vv0300788
[3] Telit GE863-PRO³ Hardware User Guide 1vv0300773a
[4] Telit GE863-PRO³ Software User Guide 1vv0300788
[5] Telit GE863PRO3 EVK User Guide 1vv0300776
[6] Telit GE863PRO3 Linux SW User Guide 1vv0300781
[7] Telit GE863PRO3Linux Development Environment User Guide1vv0300780
All documentation can be downloaded from Telit’s official web site www.telit.com if not otherwise
indicated.
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2 Mechanical description
The Telit WE865-DUAL module overall dimensions are:
•
•
•
•
Length:
Width:
Thickness:
Weight
22.15 mm (max)
22.15 mm (max)
3.48 mm (max)
3.5 g
Figure 1
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Figure 2 (Bottom side)
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3 Pin-out
3.1 Pin table
Ball
Signal
I/O
SDIO[0]
I/O
Internal PULL
UP/DOWN
Type
SDIO DATA[0] (or SPI MISO)
SDIO DATA[1]
(or SPI INTERRUPT)
10KOhm pull-up
SDIO (or SPI)
10KOhm pull-up
SDIO (or SPI)
SDIO DATA[2]
SDIO DATA[3]
(or SPI CHIP SELECT)
SDIO CLOCK
(or SPI CLOCK)
10KOhm pull-up
SDIO
10KOhm pull-up
SDIO (or SPI)
SDIO (or SPI)
10KOhm pull-up
SDIO (or SPI)
Function
SDIO
A1
I/O
B2
A2
SDIO[1]
SDIO[2]
I/O
I/O
B3
SDIO[3]
I/O
A3
SDIO_CLK
A4
SDIO_CMD
I/O
SDIO CMD (or SPI MOSI )
C3
TEST_1
Test line n. 1
TEST
C4
TEST_2
Test line n. 2
TEST
C5
TEST_3
Test line n. 3
TEST
D5
TEST_4
Test line n. 4
Miscellaneous Functions
TEST
B1
EN_A*
Enable/shut-down
control
C1
MR_RESET*
Manual reset
10KOhm pull-up
100KOhm pullup
D1
EN_B*
Enable/shut-down
control
D2
RESET
Reset for host processor
10KOhm pull-up
47KOhm pulldown
H5
RF_ANT
RF
antenna
Testing and Certification
RF output
control
control
Power Supply
E1
VDD
PWR
Power input pin
power supply
E2
VDD
PWR
Power input pin
power supply
F1
VCC_A
PWR
power supply
F2
VCC_A
PWR
Power input pin
Power input pin
power supply
power supply
F3
VCC_A
PWR
Power input pin
RESERVED
A5
N.C.
A6
N.C.
All the reserved pins must be kept not connected (N.C.)
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Ball
Signal
I/O
Function
A7
N.C.
A8
N.C.
B4
N.C.
B5
N.C.
B6
N.C.
B7
N.C.
B8
N.C.
C5
N.C.
C6
N.C.
C8
N.C.
D3
N.C.
D4
N.C.
D6
N.C.
D7
N.C.
D8
N.C.
E3
N.C.
E4
N.C.
E6
N.C.
E8
N.C.
F4
N.C.
F5
N.C.
F6
N.C.
F7
N.C.
F8
N.C.
G2
N.C.
G6
N.C.
G7
N.C.
G8
N.C.
H1
N.C.
H2
N.C.
H4
H7
N.C.
N.C.
H8
N.C.
Internal PULL
UP/DOWN
Type
Table 1
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3.2 Ball grid
SDIO[0]
EN_A*
MR_RESET*
EN_B*
VDD
VCC_A
GND
NC
SDIO[2]
SDIO[1]
GND
RESET
VDD
VCC_A
NC
NC
SDIO_CLK
SDIO[3]
TEST_1
NC
NC
VCC_A
GND
GND
SDIO_CMD
NC
TEST_2
NC
NC
NC
GND
NC
NC
NC
TEST_3
TEST_4
GND
NC
GND
RF_ANT
NC
NC
NC
NC
NC
NC
NC
GND
NC
NC
GND
NC
GND
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Table 2
NOTE: The drawing above is a top view.
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WE865-DUAL HW User Guide
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4 Electrical description
The power supply circuitry and board layout are a very important part in the full product design and
they strongly reflect on the product overall performances, hence read carefully the requirements and
the guidelines that will follow for a proper design.
4.1 Power supply
Powering of the module:
•
wide range voltage operation from 3.4V up to 4.2V (typical voltage 3.8V) the same as
for GE863-PRO3.
The above voltage range is chosen in order to use the same voltage range for the Wi-Fi module
WE865-DUAL and the GE863-PRO3.
4.1.1 Unique supply voltage for WE865-DUAL and GE863-PRO3
In order to get the suitable voltage range valid for both WE865-DUAL and GE863-PRO3 certain balls
need to be connected as described below.
signal
VCC_A
VDD
ball
3.8V (typ)
F1
F2
F3
E1
E2
√
√
√
√
√
Table 3
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WE865-DUAL HW User Guide
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3.8 V (typ)
WE865-DUAL
VCC_A (F1)
VCC_A (F2)
VCC_A (F3)
VDD (E1)
VDD (E2)
Figure 3
The table below shows the operating and absolute voltage ranges.
VOLTAGE RANGES @ 25 °C
Operating range
Min [V]
Typ [V]
Max [V]
3.4
3.8
4.2
Table 4
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4.1.1.1 Current consumption
CURRENT CONSUMPTION @ 3.8V at 25 °C
Operating mode
Continuous Receive
Continuous Transmit (maximum output power)
Stand-by (receive beacons every 100 ms)
Deep Sleep
Shut-down mode
Typ
100
180
<1
Unit
mA
mA
mA
mA
mA
Table 5
NOTE: continuous receive and transmit mode measures were taken at channel 6.
4.1.1.2 Shut-down mode
In order to minimize the current consumption it is possible to completely shut-down the WE865-DUAL.
That is achieved by acting on the relevant signal outside the module, which directly acts on the power
device enable/Shut-down signals.
The shut-down is achievable by driving low both the EN_B* (ball D1) and EN_A* (ball B1) signals, to
be connected together.
As EN_B* (ball D1) and EN_A* (ball B1) are internally connected to pull-up, do not drive these signals
during normal operation.
signal
EN_A*
EN_B*
ball
B1
D1
LOGIC CONFIGURATION
Shut-down mode
Operating mode
to be driven low
internally pulled-up 2
to be driven low
internally pulled-up 1
Table 6
If the shut-down mode is not used, no external connection is needed.
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VOLTAGE LEVELS @ 25 °C
VIL
SIGNAL
Min [V]
Max [V]
EN_A*, EN_B*
0.20
Table 7
EN_A*
WE865-DUAL
EN_B*
Figure 4
4.2 Power supply design guidelines
The power supply circuitry is a very important part in the full product design and it strongly affects the
product overall performances, hence read carefully the requirements and the guidelines that will follow
for a proper design.
The table below shows the WE865-DUAL operating voltage range:
VOLTAGE RANGE
Nominal Supply Voltage
Minimum Supply Voltage
3.8V
3.4V
Max Supply Voltage
4.2V
Table 8
The electrical design of the power supply strongly depends on the power source the current is drained
from. Please refer to electrical design guidelines in the GE863-PRO3 Hardware User Guide for further
information.
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4.2.1 +5V input source
A linear regulator can be used to generate the 3.8V output voltage. When using a linear regulator, a
proper heat sink shall be provided in order to dissipate the generated power. A protection diode should
be inserted close to the power input, in order to save the WE865-DUAL from power polarity inversion.
This can be the same diode as for spike protection.
The figure below shows a possible solution for the switching power supply. It must be taken into
account that the power supply performance strongly depends on the layout design.
Figure 5
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4.2.2 +12V input source
Due to the big difference between the input source and the desired output voltage, a linear voltage
regulator is not suited and not recommended. A switching power supply will be preferable because of
its better efficiency especially in presence of peak current load.
When using a switching regulator, 500 kHz switching frequency (or more) is preferable because of its
smaller inductor size and its faster transient response. This allows the regulator to respond quickly to
any current peak absorption.
A protection diode should be inserted close to the power input, in order to save the WE865-DUAL from
power polarity inversion. This can be the same diode as for spike protection.
The figure below shows a possible solution for the switching power supply. It must be taken into
consideration that the switching power supply performances strongly depend on the layout design.
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Figure 6
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4.2.3 Battery source
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V,
thus a single 3.7V Li-Ion cell battery type is suited for supplying the power to the WE865-DUAL
module.
Please refer to GE863-PRO3 electrical design guidelines for further information regarding type
and battery usage.
A protection diode should be inserted close to the power input, in order to save the WE865-DUAL from
power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity
inversions when connecting the battery.
When integrating the GE863-PRO3 with the WE865-DUAL modules together in the user application,
take into account that battery charger control circuitry is embedded inside the GE863-PRO3 (please
refer to GE863-PRO3 Hardware User Guide for more details) and can be used with Li-ION batteries
only. Using other type of batteries, an external charger will be needed.
The battery capacity should be suitable chosen dependently on the customer’s application current
consumption and the battery life requirements. When integrating the GE863-PRO3 with the WE865DUAL modules together in the user application, the battery capacity must be at least 800mAh in order
to withstand any current peak (please refer to GE863-PRO3 Hardware User Guide for more details).
4.3 Reset signals
The WE865-DUAL has a power-on-reset (POR) circuit inside, so no specific reset is required in the
initialization phase.
Two signals are available to reset the module:
•
•
an active high host reset (RESET)
an active low manual reset (MR_RESET*)
In addition to the active high RESET signal issued by the host system (GE863-PRO3), a reset button
can be integrated in the customer application.
Even if it is not mandatory to drive the available reset lines in the module, it is recommended to
employ those signals to prevent critical situations.
When resetting during normal operation, after the release of the reset the module is unconditionally
shut down, without doing any detach operation from the network where it is associated.
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4.3.1 Reset
An active high host reset (RESET, ball D2), allowing the WE865-DUAL to be reset by an external
device (host).
This pin is internally pulled-down, do not drive the signal during normal operation.
The signal must be asserted for a period greater than 1ms.
VOLTAGE LEVELS @ 25 °C
VIH
Min [V]
2,0
Max [V]
3,0
Remark
Table 9
WE865-DUAL
RESET
Figure 7
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4.3.2 Manual reset
An active low manual reset (MR_RESET*, ball C1), see the table below for the allowed voltage levels.
As the pin is internally pulled-up, do not drive the signal during normal operation.
The signal must be asserted for a period greater than 1ms.
VOLTAGE LEVELS @ 25 °C
VIL
Min [V]
-0,3
Max [V]
0,825
Remark
Table 10
WE865-DUAL
MR_RESET*
Figure 8
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4.4 SDIO signals
A 4-data bit SDIO interface is available on the WE865-DUAL that must be connected to the host
processor (Telit GE863-PRO3).
WE865-DUAL SDIO voltage levels are fully compatible with the GE863-PRO3 I/O voltage levels.
47 Ohm series resistor on each SDIO line and 12pF capacitor on clock line must be inserted in order
to avoid noise (see Electrical design guidelines chapter). Refer to §8.2.
Voltage levels for all the SDIO pins are reported in the table:
VOLTAGE LEVELS @ 25 °C
VIL
VIH
VOL
VOH
Min [V]
-0,3
2,0625
2,475
Max [V]
0,825
3,6
0,125
3,3
Remark
I = 4mA
I = 4mA
Table 11
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5 Thermal design guidelines
The thermal design for the power supply heat sink should be done taking into account the current
consumption involved in the appropriate power supply configuration. Please refer to §4.1.1.1 for
detailed information on the current consumption.
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6 PCB layout design guidelines
In case of implementing the input power supply circuitry as described in the previous §4.2.2, the PCB
traces connecting the switching output to the inductor and the switching diode must be as short as
possible. It is recommended to place the inductor and the diode very close to the power switching IC.
This is done in order to reduce the radiated field (noise) of the switching frequency (100-500 kHz
usually).
The use of a good common ground plane is generally suggested.
The placement of the power supply on the board should be done in such a way to guarantee that the
high current return paths in the ground plane are not overlapped to any noise sensitive lines.
The power supply input cables should be kept separate from noise sensitive lines.
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7 Antenna
The antenna connection and board layout design are the most important part in the full product design
and they strongly reflect on the product overall performances, hence read carefully and follow the
requirements and the guidelines for a proper design.
7.1 Wi-Fi antenna guidelines
General guidelines for an antenna and antenna line on PCB for a Telit WE865-DUAL device
ANTENNA REQUIREMENTS
Frequency range [MHz]
Gain [dBi]
Impedance [Ohm]
Maximum Input Power [mW]
VSWR recommended
2400-2500
≤2
50
>100
≤2
Table 12
Frequency range indicated in order to support 14 Wi-Fi channels. Smaller ranges are allowed or
requested for application over 11 or 13 channels.
Please refer to IEEE specifications and to the proper regulatory body directives about 802.11
channels and antenna specifications in different countries.
When using the Telit WE865-DUAL, since there's no antenna connector on the module, the antenna
must be connected to the WE865-DUAL through the PCB with the antenna pad.
Please consider that antenna design and choice is dependent on the specific application.
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This transmission line shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Impedance [Ohm]
50
Maximum Attenuation [dB]
0.3
Coupling with other signals is not allowed
Table 13
7.2 Wi-Fi antenna PCB trace guidelines
•
•
•
•
•
•
•
•
•
•
Ensure that the antenna line impedance is 50 ohm.
Keep the antenna line on the PCB as short as possible in order to limit losses.
Antenna line must have uniform characteristics, constant cross section, avoid meanders
and abrupt curves.
Keep, if possible, one layer of the PCB used only for the Ground plane.
Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid
having other signal tracks facing directly the antenna line track.
The ground around the antenna line on PCB has to be strictly connected to the Ground
Plane by placing vias once per 2mm at least.
Place EM noisy devices as far as possible from WE865-DUAL antenna line.
Keep the antenna line far away from the WE865-DUAL power supply lines.
If you have EM noisy devices around the PCB hosting the WE865-DUAL, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the layers
of PCB and surround it with Ground planes, or shield it with a metal frame cover.
If you don't have EM noisy devices around the PCB of WE865-DUAL, by using a strip-line
on the superficial copper layer for the antenna line, the line attenuation will be lower than
a buried one.
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7.3 Wi-Fi antenna installation guidelines
•
•
•
•
Install the antenna in a place covered by the Wi-Fi signal.
The antenna must be installed to provide a separation distance of at least 20 cm
from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter.
Antenna shall not be installed inside metal cases.
Antenna shall be installed also according Antenna manufacturer instructions.
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8 Integration with the GE863-PRO3
Figure 9 (Block diagram)
NOTE: It is mandatory to leave available the TEST lines in the customer design:
• TEST_1
• TEST_2
• TEST_3
• TEST_4
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8.1
Power supply
When integrating the WE865-DUAL with the Telit GE863-PRO3 module, as described in previous
chapters a 3.8V (typ) voltage must be provided to the WE865-DUAL.
The WE865-DUAL power enable signals (EN_A* and EN_B*) must be connected together and be
driven by the GE863-PRO3 GPIO PC29 (ball F5) through a N-channel MOSFET.
In the GE863-PRO3 the power supply inputs of the GSM engine and the ARM processor part have
been kept separate, VBATT is the input for the GSM part, VBATT2 is the input for ARM.
It is possible to connect together the two power inputs since they have compatible ranges, but if it is
desired the two power supplies can be kept separate.
If keeping separated VBATT and VBATT2 is the chosen solution, the WE865-DUAL 3.8V power balls
(VCC_A) should be connected to the same voltage source feeding VBATT2.
3V8 (typ)
3V8 (typ)
VBATT
VBATT2
3V8 (typ)
3V8 (typ)
VCC_A
VDD
EN_A*
WE865-DUAL
PC29
EN_B*
GE863-PRO3
GND
GND
Figure 10
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8.2
SDIO signals
A 4-data bit SDIO interface is available on the WE865-DUAL that must be connected to the host
processor (Telit GE863-PRO3).
The WE865-DUAL SDIO voltage levels are fully compatible with the GE863-PRO3 I/O voltage levels.
47 Ohm series resistor on each SDIO line and 12pF capacitor on clock line must be inserted in order
to avoid noise (see Electrical design guidelines chapter). Refer to block diagram in Figure 7.
Figure 11
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9 WE865-DUAL - Evaluation kit
The WE865-DUAL can be provided with an evaluation/testing kit.
The kit consists of:
•
•
EVK-PRO3 evaluation kit for GE863-PRO3 module
(EVK-PRO3 main board + GE863-PRO3 interface board)
WE865-DUAL interface board
In such a case, the WE865-DUAL module is directly soldered on its interface board. The figure below
shows how the boards must be assembled in order to allow the system working.
WE865-DUAL interface board
GE863-PRO3 interface board
EVK-PRO3 main board
Figure 12
All the boards are connected each other via 40-pins connectors.
The core of the evaluation system is the EVK-PRO3 EVALUATION KIT, which can be split into several
functional blocks depending on the implemented function. Refer to the “EVK-PRO3 User Guide” for
additional information on the EVK-PRO3 description and usage.
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GE863-PRO3
WE865-DUAL
interface board
WE865-DUAL
EVK-PRO3
Figure 13
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EVK-PRO3
WE865-DUAL
interface board
WE865-DUAL
GE863-PRO3
Figure 14
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9.1
WE865-DUAL Interface board
9.1.1 Mechanical description
Figure 15
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9.1.2 Main components
Main components TOP side list:
WE865-DUAL module
PL101:
2 pin jumper
PL102:
2 pin jumper
SW101:
Reset button – Push to drive MR_RESET* low)
SO104:
RF connector (alternative to AT101)
PL103:
5 pin header - SPI for test
Figure 16
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Main components BOTTOM side list:
SO101:
SO102:
SO103:
Interface connector
Interface connector
Interface connector
Figure 17
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9.1.3 Jumpers settings
The figure below shows the PL101 and PL102 jumpers on the TOP side in the interface board
Figure 18
PL101 - Short the jumper to drive EN_A* low
PL102 - Short the jumper to drive EN_B* low
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9.1.4 Pin table
Pin n.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
SO101
SO102
SO103
PL103
Signal name
Signal name
Signal name
Signal name
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
SDIO[0]
SDIO_CMD
SDIO_CLK
SDIO[1]
SDIO[2]
SDIO[3]
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
VBATT
RESERVED
RESERVED
GND
GND
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
GND
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESET
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
RESERVED
GND
RESERVED
TEST_1
TEST_2
TEST_3
TEST_4
GND
Table 14
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10 Mounting the WE865-DUAL on the
application board
The Telit WE865-DUAL module has been designed in order to be compliant with a standard lead-free
SMT process.
10.1 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120μm.
10.2 PCB pad design
"Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Figure 19
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Figure 20
Recommendations for PCB pad dimensions
Dimension
Ball pitch
Solder resist opening diameter A
Metal PAD diameter B
Value [mm]
1,150
1 +/- 0,05
Table 15
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
Opening”,unless the microvia carry the same signal of the pad itself.
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Figure 21
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer tickness [um]
Properties
Electro-less Ni /
Immersion Au
3-7 /
0,05-0,15
good solder ability protection,
high shear force values
Table 16
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
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10.3 Solder paste
Lead free
Solder paste
Sn / Ag / Cu
Table 17
10.4 Solder reflow
The following is the recommended solder reflow profile
Figure 22
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Profile Feature
Average ramp-up rate (TL to TP)
Preheat:
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL:
- Ramp-up rate
Time maintaned above:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp):
Time within 5 °C of actual Peak
Temperature (tp)
Ramp-down rate
Time 25 °C to Peak Temperature
Pb-Free
Assembly
3 °C / second
max
150 °C
200 °C
60-180
seconds
3 °C / second
max
217 °C
60-150
seconds
245 + 0/-5 °C
10-30 seconds
6 °C/second
max
8 minutes max
Table 18
NOTE: All temperatures refer to topside of the package, measured on the package body surface.
IMPORTANT: WE865-DUAL module can accept only one reflow process
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11 Moisture sensitivity
The level of moisture sensibility of Telit WE865-DUAL modules is “3”, according with standard
IPC/JEDEC J-STD-020, take care of all the relative requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
• The shelf life of WE865 inside of the dry bag shall be 12 month from the bag seal date, when
stored in a non-condensing atmospheric environment of <40°C / 90% RH
• Environmental condition during the production: ≤ 30°C / 60% RH according to IPC/JEDEC JSTD-033A paragraph 5
• The maximum time between the opening of the sealed bag and the reflow process shall be 168
• Hours if the condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
• A baking is required if conditions b) or c) are not respected
• A baking is required if the humidity indicator inside the bag indicates 10% RH or more
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WE865-DUAL HW User Guide
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12 Conformity assessment issues
Assessment of the final product must be made against the Essential requirements of the R&TTE
Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3
requirements.
The WE865-DUAL module is conform with the following European Union Directives:
•
•
•
R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)
Low Voltage Directive 73/23/EEC and product safety
Directive 89/336/EEC for conformity for EMC
In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the WE865-DUAL module is
compliant with the following standards:
• Use of RF Spectrum. Standard: EN 300 328 v1.7.1 (2006-10)
• EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-17
• LVD (Low Voltage Directive) Standards: EN 60 950
The WE865-DUAL module is conform with the following US Directives:
•
•
Use of RF Spectrum. Standards: FCC 47 Part 15
EMC (Electromagnetic Compatibility). Standards: FCC 47 Part 15
To meet the FCC's RF exposure rules and regulations:
The system antenna(s) used for this transmitter must be installed to provide a separation
distance of at least 20 cm from all the persons and must not be co-located or operating in
conjunction with any other antenna or transmitter.
The system antenna(s) used for this module must not exceed 2 dBi for all operating
configurations.
Users and installers must be provided with antenna installation instructions and transmitter
operating conditions for satisfying RF exposure compliance.
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify
any regulatory questions and to have their complete product tested and approved for FCC
compliance.
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13 Safety recommendations
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The use of
this product may be dangerous and has to be avoided in the following areas:
ƒ Where it can interfere with other electronic devices in environments such as hospitals, airports,
aircrafts, etc
ƒ Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity.
We recommend following the instructions of the hardware user guides for a correct wiring of the
product. The product has to be supplied with a stabilized voltage source and the wiring has to be
conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself.
The system integrator is responsible of the functioning of the final product; therefore, care has to be
taken to the external components of the module, as well as of any project or installation issue,
because the risk of disturbing the external networks or devices or having impact on the security.
Should there be any doubt, please refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The antenna has
to be installed with care in order to avoid any interference with other electronic devices and has to
guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied,
the system integrator has to assess the final product against the SAR regulation EN 50360.
The European Community provides some Directives for the electronic equipments introduced on the
market. All the relevant information’s are available on the European Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available, while the
applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
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14 Document change log
Revision
ISSUE#0
ISSUE#1
Date
20/08/08
03/10/08
Changes
Preliminary Release
Updated mechanical dimensions
Updated pin-out and ball grid
Updated power configuration section
Added current consumption
Updated reset section
Updated antenna section
Updated integration section with GE863-PRO3
Updated evaluation kit section
Added conformity assessment issues section
Added safety recommendations section
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