Top Victory Electronics WL211 Wi-Fi SIP Module User Manual rev
Top Victory Electronics (Taiwan) Co Ltd Wi-Fi SIP Module rev
User Manual rev.pdf
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| Document ID | 2887785 |
| Application ID | uhTVqdYEEgq6r30QOaisqA== |
| Document Description | User Manual rev.pdf |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 129.62kB (1620220 bits) |
| Date Submitted | 2016-01-28 00:00:00 |
| Date Available | 2016-01-28 00:00:00 |
| Creation Date | 2012-11-09 11:56:52 |
| Producing Software | doPDF Ver 7.2 Build 361 (Windows 7 Business Edition - Version: 6.1.7600 (x64)) |
| Document Lastmod | 2016-01-27 11:56:11 |
| Document Title | User Manual rev.pdf |
正基科技股份有限公司 SPECIFICATION REV： SPEC. NO.： 07.20. 2012 TP V. DATE： 1.9 WL-211 On ly for PRODUCT NAME： APPROVED CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information AMPAK WL-211 On ly for TP V. Wi-Fi SIP Module Spec Sheet AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information Revision History Date Revised By Version Revision Content -Initial released Andy 1.0 2011/09/27 -Modify physical dimensions Andy 1.1 2011/10/19 -Modify block diagram Andy 1.2 2011/12/23 -Add Power Consumption Andy 1.3 2012/01/12 -Modify dimension Andy 1.4 2012/03/09 -Add packing information Andy 1.5 2012/03/19 -More info to recommended footprint Andy 1.6 2012/05/03 -Pin description revised Bart 1.7 2012/05/18 -Modify Recommended Footprint -Modify Physical Dimensions Bart 1.8 2012/07/20 -Modify Physical Dimensions Bart 1.9 On ly for TP V. 2011/08/22 AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information Contents TP V. Revision History ......................................................................................................... 1 Contents..................................................................................................................... 2 1. Introduction........................................................................................................... 3 2. Features ............................................................................................................... 4 3. Deliverables.......................................................................................................... 5 3.1 Deliverables.................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification............................................................................................ 6 4.1 Wi-Fi RF Specification .................................................................................... 6 4.2 Voltages.......................................................................................................... 7 4.2.1 Absolute Maximum Ratings.................................................................... 7 4.2.2 Recommended Operating Ratings ......................................................... 7 On ly for 5. Pin Assignments ................................................................................................... 8 5.1 PCB Pin Outline.............................................................................................. 8 5.2 Pin Definition .................................................................................................. 8 6. Dimensions......................................................................................................... 11 6.1 Physical Dimensions..................................................................................... 11 6.2 Recommended Footprint .............................................................................. 12 7. External clock reference ..................................................................................... 13 7.1 SDIO Pin Description.................................................................................... 13 8. Host Interface Timing Diagram ........................................................................... 14 8.1 Power-up Sequence Timing Diagram ........................................................... 14 8.2 SDIO Default Mode Timing Diagram............................................................. 14 8.3 SDIO High Speed Mode Timing Diagram ..................................................... 15 9. Recommended Reflow Profile ............................................................................ 16 10. Packing Information............................................................................................ 17 10.1 Label........................................................................................................... 17 10.2 Dimension................................................................................................... 18 10.3 MSL Level / Storage Condition ................................................................... 20 AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi functionalities. The highly integrated WL-211 module makes the possibilities of web browsing, VoIP, headsets and other applications. With seamless roaming capabilities and advanced security, WL-211 can also interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN. TP V. This wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi. On ly for This compact module is a total solution for Wi-Fi technologies. The module is specifically developed for Smart phones and Portable devices. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 2. Features Single-band 2.4GHz IEEE 802.11b/g/n Supports standard interfaces SDIO v2.0(50MHz, 4-bit and 1-bit) and generic SPI(up to 50MHz) Integrated ARM Cortex-M3TM CPU with on-chip memory enables running IEEE802.11 firmware that can be field-upgraded with future features. Supports per packet Rx antenna diversity Security: i. Hardware WAPI acceleration engine ii. AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility iii. WPATM – and WPA2TM - (Personal) support for powerful encryption and authentication TP V. On ly for A simplified block diagram of the module is depicted in the figure below. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications TP V. The product delivery is a pre-tested module, without the module level certification. For On ly for module approval, the platform’s antennas are required for the certification. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 4. General Specification 4.1 Wi-Fi RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Description Product Name WL-211 Wi-Fi SIP Module WLAN Standard IEEE 802.11b/g/n, WiFi compliant Host Interface SDIO Dimension L x W x H: 9.5 x 9.5 x 1.5 (typical) mm Frequency Range 2.412 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 11 for North America, 13 for Europe, and 14 for Japan Modulation TP V. Feature 802.11b : DQPSK, DBPSK, CCK 802.11g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM -9dB Output Power 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM -25dB 802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM -28dB MCS=0 PER @ -85 ± 1dBm, typical MCS=1 PER @ -84 ± 1dBm, typical MCS=2 PER @ -82 ± 1dBm, typical MCS=3 PER @ -80 ± 1dBm, typical MCS=4 PER @ -77 ± 1dBm, typical MCS=5 PER @ -73 ± 1dBm, typical MCS=6 PER @ -71 ± 1dBm, typical MCS=7 PER @ -69 ± 1dBm, typical 6Mbps PER @ -87 ± 1dBm, typical 9Mbps PER @ -86 ± 1dBm, typical 12Mbps PER @ -85 ± 1dBm, typical Receive Sensitivity (11g) @10% PER 18Mbps PER @ -83 ± 1dBm, typical 24Mbps PER @ -81 ± 1dBm, typical 36Mbps PER @ -78 ± 1dBm, typical 48Mbps PER @ -74 ± 1dBm, typical 54Mbps PER @ -72 ± 1dBm, typical 1Mbps PER @ -90 ± 1dBm, typical Receive Sensitivity (11b) - 2Mbps PER @ -89 ± 1dBm, typical @8% PER 5.5Mbps PER @ -87 ± 1dBm, typical 11Mbps PER @ -84 ± 1dBm, typical On ly Receive Sensitivity (11n,20MHz) @10% PER for AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 802.11b : 1, 2, 5.5, 11Mbps Data Rate 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps Data Rate (20MHz ,Long GI,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps 802.11b : -10 dBm Maximum Input Level 802.11g/n : -20 dBm -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing TP V. Operating temperature 4.2 Voltages 4.2.1 Absolute Maximum Ratings VBAT Min. Max. Unit Input supply Voltage -0.5 6.5 Digital/Bluetooth/SDIO/SPI I/O Voltage -0.5 4.1 On ly VDDIO Description for Symbol 4.2.2 Recommended Operating Ratings Test conditions: At room temperature 25°C Symbol Min. Typ. Max. Unit VBAT 3.0 3.6 4.8 1.7 1.8 1.92 2.97 3.3 3.6 VDDIO Note: The voltage of VDDIO is depended on system I/O voltage. Test conditions: At operating temperature -10°C ~65°C Symbol Min. Typ. Max. Unit VBAT 3.0 3.6 4.8 VDDIO 1.7 3.35 Note: VDDIO operating voltage range from 1.7V to 3.35V at operating temperature is guaranteed. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 5. Pin Assignments TP V. 5.1 PCB Pin Outline for < TOP VIEW > 5.2 Pin Definition Name WLAN_ANT Type Description RF signal I/O port GND I/O － JTAG_TRST_L JTAG interface, if JTAG not used unconnected (NC) JTAG interface, if JTAG not used unconnected (NC) this pin. This pin is also muxed with UART_TX, which can be enabled by software On ly NO 4 JTAG_TDO_UART_TX Ground JTAG_TDI_UART_RX JTAG interface, if JTAG not used unconnected (NC) this pin. This pin is also muxed with UART_RX, which can be enabled by software JTAG_TCK JTAG interface, if JTAG not used unconnected (NC) JTAG_TMS JTAG interface, if JTAG not used unconnected (NC) GND － OSC_IN XTAL oscillator input 10 OSC_OUT XTAL oscillator output 11 GND I/O － 12 RF_SW_CTRL0 － Floating (Don’t connected to ground) 13 RF_SW_CTRL3 － Floating (Don’t connected to ground) AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Ground Ground Proprietary & Confidential Information GND － Ground 15 GND － Ground 16 GND － Ground 17 GND － Ground 18 VIO Digital I/O Voltage input 19 CLK_32K Sleep clock (32.768KHz) input 20 SDIO_DATA_2 I/O SDIO data line 2 21 SDIO_DATA_0 I/O SDIO data line 0 22 SDIO_CLK SDIO clock 23 SDIO_CMD I/O SDIO command line 24 SDIO_DATA_1 I/O SDIO data line 1 25 SDIO_DATA_3 I/O SDIO data line 3 26 VIN_LDO Internal DC-DC regulator input 27 GND － 28 SR_VLX 29 GND － 30 VBAT 31 WL_RST_N 32 GND － 33 GND 34 GND 35 TP V. 14 Ground Internal DC-DC regulator output Ground DC voltage input for Active low WLAN reset signal Ground Ground － Ground GND － Ground XTAL_PU Floating (Don’t connected to ground) GND － GND － Ground GND － Ground 40 GND － Ground 41 GND － Ground 42 GND － Ground 43 VDD_TCXO － Floating (Don’t connected to ground) 44 GND － Ground 45 TCXO_IN － Floating (Don’t connected to ground) 46 GPIO_5 － Floating (Don’t connected to ground) 47 GPIO_4 － Floating (Don’t connected to ground) 48 GPIO_3 － Floating (Don’t connected to ground) 49 GPIO_1 WL_Host Wake, 50 GPIO_0 － Mode selection, Low for SDIO, High for SPI mode 51 WRF_GPIO_OUT － Floating (Don’t connected to ground) 36 37 38 39 On ly － AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Ground Proprietary & Confidential Information GND － Ground 53 GND － Ground 54 GND － Ground 55 GND － Ground 56 GND － Ground 57 GND － Ground 58 GND － Ground 59 GND － Ground 60 GND － Ground 61 GND － Ground On ly for TP V. 52 AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 10 6. Dimensions 6.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > TP V. 1.7 (MAX) On ly for < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 11 6.2 Recommended Footprint (Unit: mm) On ly for TP V. < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 12 7. External clock reference External LPO signal characteristics Parameter LPO Clock Units 32.768 kHz 30 ppm 30 - 70 1600 to 3300 mV, p-p Square-wave or sine-wave Nominal input frequency Frequency accuracy Duty cycle Input signal amplitude Signal type >100k <5 pF Clock jitter (integrated over 300Hz – 15KHz) <1 Hz 7.1 SDIO Pin Description TP V. Input impedance On ly for The WL-211 supports SDIO version 1.2 for both 1-bit (25 Mbps), 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. ※ Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B) ※ Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B) ※ Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize / ByteCount = 512B) SDIO Pin Description SD 4-Bit Mode SD 1-Bit Mode DATA0 Data Line 0 SPI Mode DATA Data Line DO Data Output DATA1 Data Line 1 or Interrupt IRQ Interrupt IRQ Interrupt DATA2 Data Line 2 or Read Wait RW Read Wait NC Not Used DATA3 Data Line 3 NC Not Used CS Card Select CLK Clock CLK Clock SCLK Clock CMD Command Line CMD Command Line DI Data Input AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 13 8. Host Interface Timing Diagram 8.1 Power-up Sequence Timing Diagram ※ WL_RST_N: Low asserting Reset for WLAN Core. This pin must be driven high or low (not left floating). On ly for TP V. 8.2 SDIO Default Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 14 On ly for TP V. 8.3 SDIO High Speed Mode Timing Diagram AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 15 9. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 10 250℃ On ly for TP V. 2.5°C/sec 40~70 sec 2.5℃/sec AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 16 10. Packing Information 10.1 Label Label A Anti-static and humidity notice On ly for TP V. Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label . AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 17 On ly for TP V. 10.2 Dimension AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 18 B Humidity indicator Desiccant TP V. On ly for AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 19 On ly for TP V. 10.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 20 F Federal Co ommunicatiion Commission Interrference Sttatement This deevice compllies with Paart 15 of th he FCC Rules. Operatioon is subject to the folllowing two conditionns: (1) Th his device may not cause harm mful interferrence, and (2) this ddevice musst accept any interferrence receiived, includinng interference that maay cause und desired operration. This eqquipment haas been tessted and fo ound to com mply with tthe limits for f a Class B digital device, pursuuant to Part 15 of the FCC Rules . These liimits are desiigned to pro ovide reasonnable protecction againsst harmful iinterferencee in a residenttial installation. This eequipment generates, uses and caan radiate radio frequenncy energy and, if noot installed d and used d in accorddance with the instructtions, may cause haarmful inteerference to o radio coommunicatiions. Howeveer, there is no guaranteee that interrference wiill not occurr in a particcular installattion. If th his equipmeent does caause harmfu ul interferennce to radiio or televisioon receptio on, which ccan be deterrmined by turning thee equipment off and on,, the user iss encourageed to try to correct the interferencce by one off the followinng measurees: - Reorrient or reloccate the rec eiving anten nna. - Increease the separation betw ween the eq quipment and receiver. - Connnect the equ uipment intoo an outlet on o a circuit different froom that to whhich the receiver is connnected. - Conssult the dealler or an expperienced raadio/TV tecchnician forr help. FCC Caution: Any y changes oor modificaations not expressly appproved by y the party reesponsible for f compliannce could void the user's authorityy to operatee this equipm ment. This traansmitter must m not be co-located or operatin ng in conjunnction with h any other anntenna or traansmitter. 21 This devicce is intended d only for O OEM integra ators under the followinng condition ns: 1) Thee antenna must m be instaalled such th hat 20 cm is maintainedd between th he anteenna and users, and 2) Thee transmitterr module m may not be co o-located with w any otheer transmittter or antenna. As longg as 2 conditions abovee are met, fu urther transm mitter test w will not be requiredd. Howeverr, the OEM integrator is still responsible for teesting their end-prooduct for an ny additionaal compliancce requirem ments requireed with this modulee installed IMPOR RTANT NO OTE: In thee event that these condiitions can nnot be met (ffor example certain lap ptop configgurations or co-location n with anothher transmittter), then thee FCC autho orization is no longer considered valid and thhe FCC ID can not be used on the final produuct. In these circumstan nces, the OE EM integrato or will be responsiblee for re-evalluating the end product (includingg the transm mitter) and obttaining a sep parate FCC authorization. End Prooduct Labeling FOR MOBILE DEVICE US SAGE (>20 0cm/low pow wer) This traansmitter mo odule is autthorized onlly for use in n device whhere the anteenna may be installed su uch that 20 cm may be maintained d between thhe antenna and users. The T final end d product m must be labeeled in a visible area wiith the followinng: “Contaiins FCC ID :ARS-WL211 ”. The grantee's FCC ID can be used onnly when alll FCC comppliance requ uirements arre met. Manuaal Informattion To the End User The OE EM integrator has to be aware not to provide informationn to the end user regardinng how to install or remove this RF module in the user’ss manual of the end prooduct which integrates t his modulee. The endd user manu ual shall inc lude all req quired regulatory inform mation/warn ning as show w in this man nual. 22
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