Trimble 613 HANDHELD GPS WITH BLUETOOTH User Manual WM BG MR 01 22 042805
Trimble Navigation Ltd HANDHELD GPS WITH BLUETOOTH WM BG MR 01 22 042805
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Contents
- 1. USERS MANUAL 1 OF 2
- 2. USERS MANUAL 2 OF 2
- 3. users manual 1
- 4. users manual 2
users manual 2
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Preliminary release for evaluation, Subject to be changed without Notice
PRODUCT SPECIFICATION
of 802.11g
WM-BG-MR -01 B2B Wireless Lan +BT Combo Module
Data Sheet
Apr
28
’
th
.
2005 Rev
2
.2
802.11
g
Wireless LAN SiP Module
(
WM
-
B
G
-
MR
-
01)
www.usi.com.tw
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
Introduction
The 802.11 Wireless SiP module WM-BG-MR-01
which refers as “SiP-g combo module” is a small
size module that provides full function of 802.11g/b
and Bluetooth class 2 on a tiny module via 60 pins
board to board connector.
This multi- functionality and board to board physical
interface provides
16 bit PC Card /CF+ bus interface
for WiFi and UART for Bluetooth.
The small size & low profile physical design make it
easier for system design to
enable high performance
wireless connectivity without space constrain. The
low power consumption (Sleep mode 1 mA) and
excellent radio performance make it the best
solution for OEM customers who require embedded
802.11g Wi-Fi + Bluetooth featuress, such as,
Wireless PDA, Scanner Smart phone, Media player
slim type Notebook, barcode ,mini-Printer, VoIP
phone etc.
For 802.11g feature, Marvell “Libertas” chipset
solution is adopted and CSR BlueCore 03-ROM for
Bluetooth. The Radio architecture & high integration
MAC/BB chip provide excellent sensitivity with rich
system performance. Two antenna connectors
provide antenna connectivity for each function.
WM-BG-AG-01 provides outstanding BT WiFi co-
existence solution through internal 2 wires ,
hardware interface to optimized connection with
CSR Bluetooth solution even without good antenna
isolation between BT & WiFi module.
In addition to WEP 64/128, WPA and TKIP, AES is
supported to provide the latest security requirement
on your network.
For the software and driver development, USI
provides extensive technical document and
reference software code for the system integration
under the agreement of Marvell International Ltd.
Features
l
Lead Free design which supporting Green
design requirement.
l 2 wires, hardware signaling BT WiFi co-
existence supported.
l
Small size suitable for low volume system
integration.PCM audio interface
supported.
l Low power consumption & excellent
power management performance, extend
battery life.
l 2.412-2.484 GHz two SKUs for worldwide
market.
l Easy for integration into mobile and
handheld device with flexible system
configuration and antenna design.
802.11g Wireless LAN+BT SiP combo Module V2.2
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Change Sheet
Rev.
Date
Description of change
Approval & Date
Page Par Change(s)
1.0 10/1/04 All All Draft version for Review
2.0 04/11/05 6,15,
17,22
,23,
25~2
7
1.
Executive summary for target available
date from “the middle of 1Q 2005”
to
“ the end of 2Q”
2. Output power for 11g is 13 +/- 1dBm
3. Update the mech. Drawing .
4.
Modify the function description for
Marvell Transceiver from ”8010”
to
“8015”
5.
Correct the Pin Definition for xxx_B is
for “active_high”
6.
add description for Pin 28;36;43;58 ;
which reserved for BT’
s PCM interface ,
make it no confuse in customer reading.
2.1 04/18/05 25
1. correct the pin definition for Pin24 from
“Control si
gnal to enable engineer testing
mode “ to “Output signal to indicate 16 bit IO
operation. This signal is connected to ground at module
side to indicate 16 bit IO..”
then Type is for GND to
indicate the module under the mode for 16bit IO.
2.2 04/28/05 24 1. Pin A10 pin definition change from “
the pin
is open to “
This address range is mainly used
for accessing the CIS in Memory Mode. Signal
HA0 is not used in word access mode.”
, Type
change from “ No connection” to “
Input ,
PD,5VT”
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
TABLE OF CONTENTS
1. EXECUTIVE SUMMARY................................................................................................................ 6
2. DELIVERABLES............................................................................................................................. 6
3. REFERENCE DOCUMENTS......................................................................................................... 7
4. TECHNICAL SPECIFICATION..................................................................................................... 8
4.1. ABSOLUTE MAXIMUM RATING............................................................................................... 8
4.2. RECOMMENDABLE OPERATION CONDITION ...................................................................... 8
4.2.1. TEMPERATURE, HUMIDITY............................................................................................. 8
4.2.1. VOLTAGE AND CURRENT ............................................................................................... 8
BLUETOOTH...................................................................................................................................... 8
4.3. COMPACTFLASH SPECIFICATION ......................................................................................... 9
4.3.1. DC ELECTRICALS............................................................................................................. 9
4.3.2. AC ELECTRICALS............................................................................................................. 9
4.3.3. COMPACTFLASH PROTOCAL TIMING......................................................................... 10
4.4. WIRELESS SPECIFICATIONS ................................................................................................ 14
4.5. RADIO SPECIFICATIONS 802.11G........................................................................................ 15
4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH................................................................... 15
4.7. BLUETOOTH RADIO CHARACTERISTICS............................................................................ 16
4.8. DIMENSIONS, WEIGHT AND MOUNTING............................................................................. 17
4.8.1. DIMENSIONS ................................................................................................................... 17
4.8.2. WEIGHT............................................................................................................................ 17
4.8.3. MOUNTING ...................................................................................................................... 17
4.9. SHOCK AND VIBRATION........................................................................................................ 17
5. COMPATIBILITY AND INTEROPERABILITY......................................................................... 18
5.1. WI-FI LOGO .............................................................................................................................. 18
5.2. WHQL COMPLIANCE .............................................................................................................. 18
6. CONFIGURABILITY..................................................................................................................... 18
7. SECURITY...................................................................................................................................... 18
8. OPERATING SYSTEM COMPATIBILITY................................................................................. 18
9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS..................................... 18
9.1. EMC .......................................................................................................................................... 19
9.2. PRODUCT SAFETY SPECIFICATION.................................................................................... 19
9.3. COMPONENT SPECIFICATION ............................................................................................. 19
9.4. RADIO REQUIREMENTS AND APPROVALS ........................................................................ 20
9.5. PRODUCT MARKING .............................................................................................................. 21
9.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS .................................................... 21
10. FUNCTIONAL DESCRIPTION................................................................................................ 22
10.1. HARDWARE............................................................................................................................. 22
10.2. HOST INTERFACE.................................................................................................................. 23
802.11g Wireless LAN+BT SiP combo Module V2.2
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10.2.1. LED INTERFACE ............................................................................................................. 27
10.2.2. ANTENNA INTERFACE................................................................................................... 27
10.2.3. BLUETOOTH INTERFACE .............................................................................................. 28
10.3. SOFTWARE.............................................................................................................................. 28
11. DESIGN FOR EXCELLENCE (DFX)...................................................................................... 28
11.1. TESTABILITY........................................................................................................................... 28
11.2. LOGISTICS............................................................................................................................... 28
12. HUMAN FACTORS................................................................................................................... 29
13. INDUSTRIAL DESIGN.............................................................................................................. 29
14. RELIABILITY.............................................................................................................................. 29
15. PACKAGE.................................................................................................................................. 29
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
1. EXECUTIVE SUMMARY
The WM-BG-MR -01 module - is one of the product families in USI’s product offering, targeting for
system integration requiring a smaller form factor. It also provides the standard migration to high
data rate to USI’s current SIP customers. The WM-BG-MR-01 module providing B to B type
connector is provided as option for customers, who want to have Board to board type assembly.
This document outlines the product requirements for a “system in Package” 802.11g/(b) combo module –
here after referred as WM-BG-MR-01 Module.
This product is targeted for first shipments by end of 2Q 2005 and is designated for use in
embedded applications mainly in the mobile device, which required, small size and high data rate
wireless connectivity. The application such as, Wireless PDA, slim type Notebook, Media Adapter,
Barcode scanner, mini-Printer, VoIP phone, Data storage device could be the potential application
for wireless WM-BG-MR-01.
2. DELIVERABLES
The following products and software will be part of the product.
• WM-BG-MR-01 Module with packaging
• Evaluation kits, including application (CF, PCMCIA Adapter card, RF cable with SMA
connector, antenna),
• Software utility which supporting customer for integration, performance test, and
homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the
WM-BG-MR-01 module.
• Unit Test / Qualification report
• Product Specifications.
• Agency certification pre-test report base on adapter boards
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
3. REFERENCE DOCUMENTS
C.I.S.P.R.
Pub. 22 "Limits and methods of measurement of radio interference
characteristics of information technology equipment." International
Special Committee on Radio Interference (C.I.S.P.R.), Third Edition,
1997.
CB Bulletin
No. 96A "Adherence to IEC Standards: “Requirements for IEC 950, 2
nd Edition
and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product
Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing
to Standards for Safety of Electrical Equipment (IECEE), April 2000.
CFR 47,
Part 15-B "Unintentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Radio Frequency Devices, Subpart B.
CFR 47,
Part 15-C "Intentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Subpart C. URL:
http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html
CSA C22.2
No. 950-95 "Safety of Information Technology Equipment including Electrical
Business Equipment, Third Edition." Canadian Standards Association,
1995, including revised pages through July 1997.
EN 60 950 "Safety of Information Technology Equipment Including Electrical
Business Equipment." European Committee for Electrotechnical
Standardization (CENELEC), 1996, (IEC 950, Second Edition, including
Amendment 1, 2, 3 and 4).
IEC 950 "Safety of Information Technology Equipment Including Electrical
Business Equipment." European Committee for Electrotechnical
Standardization, Intentional Electrotechnical Commission. 1991, Second
Edition, including Amendments 1, 2, 3, and 4.
IEEE 802.11 “Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY)
Specifications.” Institute of Electrical and Electronics Engineers. 1999.
802.11g Wireless LAN+BT SiP combo Module V2.2
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4. TECHNICAL SPECIFICATION
The WM-BG-MR-01 is a B2B type assembly part, technical supporting, package
requirement needs to be taken into consideration.
4.1. ABSOLUTE MAXIMUM RATING
Supply Power Max +3.6 Volt
Non Operating Temperature - 40° to 85° Celsius
Voltage ripple +/- 2% Max. Values not exceeding Operating
voltage
4.2. RECOMMENDABLE OPERAT ION CONDITION
4.2.1. TEMPERATURE, HUMIDITY
The WM-BG-MR-01 module has to withstand the operational requirements as listed in the
table below.
Operating Temperature -20° to 60° Celsius
Humidity range Max 95% Non condensing, relative humidity
4.2.1. VOLTAGE AND CURRENT
Power supply for the WM-BG-MR-01 module will be provided by the host via the power pins
There will be separated power source for WiFi and Bluetooth.
802.11 g(b)
Voltage : VDD
Operating Voltage 3.3 Volt +- 10%
Current
Transmit 450 mA Typical
Receive 275 mA
Sleep connected 1mA Average
Inrush current 3000 mA Max.
The power consumption is standard related.
Bluetooth
Voltage : VDD
Operating Voltage 3.3 Volt +- 10%
802.11g Wireless LAN+BT SiP combo Module V2.2
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Current
Transmit 50 mA Typical
Receive ?40 mA
Sleep connected ? mA Average
4.3. COMPACTFLASH SPECIFICATION
4.3.1. DC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD=3.3V
Symbol Parameter Condition Min Typ Max Units
VIH Input high voltage 0.5 VDD - VDD+0.5 V
VIL Input low voltage -0.5 - 0.35VDD V
VOH Output high voltage 2.4 - - V
VOL Output low voltage - - 0.4 V
4.3.2. AC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD = 3.3V
Symbol Parameter Condition Min Typ Max Units
IOH Input high voltage =0.7 VDD 11.3 - 32 mA
IOL Input low voltage =0.18VDD 10.5 - 38 mA
VOH Output high voltage 0.2VDD- 0.6VDD 2.4 0.518 4.0 V/ns
VOL Output low voltage 0.6VDD-0.2VDD - 0.592 4.0 V/ns
802.11g Wireless LAN+BT SiP combo Module V2.2
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4.3.3. COMPACTFLASH PROTOCAL TIMING
4.3.3.1. RESET SPECIFICATION
802.11g Wireless LAN+BT SiP combo Module V2.2
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4.3.3.2. ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN+BT SiP combo Module V2.2
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802.11g Wireless LAN+BT SiP combo Module V2.2
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4.3.3.3. I/O READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN+BT SiP combo Module V2.2
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4.4. WIRELESS SPECIFICATIONS
The WM-BG-MR -01 module comply with the following features and standards;
802.11g Wireless LAN+BT SiP combo Module V2.2
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Features Description
WLAN Standards IEEE 802 Part 11G (802.11G)
Bluetooth BluetoothTM 1.1 and 1.2 compliance
Antenna Connector Two antenna connectors support 802.11 and BT one for each.
Coexistence Hardware signaling
Frequency Band 2.400 – 2.484 GHz
4.5. RADIO SPECIFICATIONS 802.11G
Features Description
Frequency Band 2.4000 – 2.497 GHz (2.4 GHz ISM Band)
Number of selectable Sub
channels 14 channels
Modulation OFDM, DSSS (Direct Sequence Spread Spectrum),
DBPSK, DQPSK, CCK , 16QAM, 64QAM
Supported rates 1,2, 5.5,11,6,9,12,24,36,48,54 Mbps
Maximum receive level - 10dBm (with PER < 8%)
Output Power 15 dBm +/- 1 dBm 802.11b
13 dBm +/- 1 dBm 802.11g
Receive
Sensitivity Data Rate
-72 dBm 54Mbps
48 Mbps
36Mbps
24Mbps
18Mbps
12Mbps
- 85 dBm 11 Mbps
9 Mbps
6 Mbps
- 89 dBm 5.5 Mbps
- 91 dBm 2.0 Mbps
- 93 dBm 1.0 Mbps
4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH
The Radio specification is compliant with the BluetoothTM 1.1 and 1.2 class 2 specification
Features Description
Frequency Band 2400 ~ 2483.5 MHz
802.11g Wireless LAN+BT SiP combo Module V2.2
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Number of Channels 79 channels
Modulation FHSS (Frequency Hopping Spread Spectrum) ,
GFSK
Antenna Connector One Hirose W.FL –R –SMT(10) RF connector
4.7. BLUETOOTH RADIO CHARACTERISTICS
Features Description
Maximum Receive Level 3 dBm ( Typical )
Output Power 1 dBm ( Typical )
Sensitivity -81 dbm @ 0.1% BER @ 25 ° Celsius ( Typical )
802.11g Wireless LAN+BT SiP combo Module V2.2
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4.8. DIMENSIONS, WEIGHT AND MOUNTING
The following paragraphs provide the requirements for the size, weight and mounting of the
WM-BG-MR -01 module.
4.8.1. DIMENSIONS
The size and thickness of the WM-BG-MR -01 module is listed below:
The height – will be finalized after the module design is frozen.
4.8.2. WEIGHT
Weight shall not exceed 10 gram including the shielding.
4.8.3. MOUNTING
The WM-BG-MR-01 module is B2B mounted type component. The B2B connector and additional
screw hole provide mounting mechanism to secure the WM-BG-MR-01 module against vibration and
shock on the host system.
4.9. SHOCK AND VIBRATION
All shock and vibration test will be performed by using an interface adapter card. Additional
shock and vibration tests can be performed – on request – by using the real host being PDA,
Textbook or any other application. The interface card will provide mounting facility base on the
recommendation /application guide provided.
802.11g Wireless LAN+BT SiP combo Module V2.2
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Vibration
Operating Frequency sweep from 3-150-3 Hz with a constant 0.25 G
input
Non-Operational Frequency sweep from 3-150-3 Hz with a constant 0.5 G input
Shock
Operational 25 G peak within 3.75 msec in normal base position
Non-Operational 65 G peak in 3.75 msec in normal base position.
30 G within 8 msec square or trapezoidal shock in + and -
direction along the 3 axis. (Total 6 shocks)
Note: Above tests are executed without packaging material.
5. COMPATIBILITY AND INTEROPERABILITY
5.1. WI-FI LOGO
The product needs to be verified with Wi-Fi certification base on CF form factor to prove the
hardware compatibility. For the other specific application, Wi-Fi certification is dependent on
the capability and application of the host system.
5.2. WHQL COMPLIANCE
Not required for WM-BG-MR-01 module
6. CONFIGURABILITY
No user configuration needed. The CIS and MAC Address will be loaded during production of
the WM-BG-MR-01 module.
7. SECURITY
The WM-BG-MR-01 module supports WEP64/128,WPA , AES-CCM which including TKIP (full
version TKIP SSN /WPA) . Refer to Marvell Libertas solution.
8. OPERATING SYSTEM COMPATIBILITY
Drivers are supported for the following OS:
• Windows CE 3.0 /.NET , Win CE 5.0 ( 2005)
• Linux.
• Pocket PC 2003.2004
9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS
The WM-BG-MR-01 module is pre-tested to ensure that all requirements met as set forth in the
following sections.
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
Final certification (module certification) requires the antenna of targeted system with a lead-
time of 6 weeks. The product deliverable shall be a pre-tested WM-BG-MR -01 module. No
module level certification on WM-BG-MR-01 module.
9.1. EMC
The module will be pre-tested to ensure that we can certify the product in the following
countries when final certification will be performed on products and or platforms.
• US. FCC CFR47 Part 15-B, Class B
• Canada. CSA C22.2, Class B
• Europe. 89/336/EEC, EMC Directive, including CE Mark
• ETS300 826, EMC standard for 2.4GHz wideband transmission systems
• EN55022, Class B (Emissions)
EN50082-1 (Immunity)
EN61000-3-2 (Harmonic AC current emissions)
• Japan. VCCI Standard, Class 2 (Emissions)
• Korea (MIC)
9.2. PRODUCT SAFETY SPECIFICATION
The WM-BG-MR -01 module is tested and pass successfully the following criteria;
The testing is to assure the quality of safety requirement on module. Final certification will
be conducted on system level.
• UL1950 /CSA C22.2.950
• EN60 950 (IEC 950)
• CB scheme certification from National certification body as listed in CB bulletin No. 96A.
•
9.3. COMPONENT SPECIFICATION
All components used in this device meet the following component approval requirements.
PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters
Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed
Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board
material shall be rated 130°C minimum.
CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc.
"Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard
for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated
UL 94V-2 or less flammable when tested to UL 94.
802.11g Wireless LAN+BT SiP combo Module V2.2
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WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance
Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105°C.
PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL
"Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94.
“PB FREE” - The entire component Suppliers has to support Green requirement base on
USI’s policy. All of the components which including process and materials has to be Lead
Free.
9.4. RADIO REQUIREMENTS AND AP PROVALS
The WM-BG-MR -01 module is tested with adapter card to comply with following standard.
The testing is to assure the performance of regulatory requirement on module. Final
certification will be conducted on system level.
• US/CAN: FCC CFR47 Part 15.247
• Japan: TELEC
• Korea: MIC
802.11g Wireless LAN+BT SiP combo Module V2.2
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9.5. PRODUCT MARKING
The Module is marked by laser marking which containing the following information:
Description: WM-BG-XX-XX
Serial number: yyllwkxxxx
Revision: format to follow USI revision level in PDM System
For the serial number the following format will be followed:
yy = last two digits of current year
ll = Assembly Location:
UT = USI Taiwan
UM = USI Mexico
UC = USI China
wk = current week (week period = starting on Monday)
xxxx = consecutive number, starting at 0000 at beginning of each week.
9.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS
The use of polychlorinated biphenyls (PCB’s) is prohibited (specifically) as dielectric in
capacitors or transformers.
Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or
gamma-butyrolactone (i.e. no el caps allowed).
No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product.
The use of tantalum capacitors should be minimized in any product of the product family
[including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions
must be made in the manufacturing process to prevent reverse polarization.
The WM-BG-MR-01 module hardware design should take the safety of operation into
consideration and prevent the potential risk on Labor safety for manufacturing process.
802.11g Wireless LAN+BT SiP combo Module V2.2
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10. FUNCTIONAL DESCRIPTION
The WM-BG-MR-01 module provides and interfaces between Compaq Flash or PC Card
Interface, SDIO , SPI which suitable for wide range high-end processors or low cost ARM7 or
other similar type of processors.
The core of the WM-BG-MR-01 module is the Marvell 88W83 Chipset solution.
The module is design base on the Marvell Libertas solution which contain the flip chip package
MAC/BB chip - 88W8385 , The transceiver 88W8015 low profile package IC to reduce the size
of module. All the other components can be implement by all means to reach the mechanical
specification.
A simplified block diagram of the WM-BG-MR-01 module is depicted in the Fig. below.
To be updated with BT
10.1. HARDWARE
The following sections provide the requirements for the different physical interfaces of the
wireless module :
• Host Interface
• Antenna connections
• LED control signal
• Bluetooth WiFi coexistence control signals
88W8385
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
• Power
• GND
10.2. HOST INTERFACE
The host interface will be compatible with CompactFlash (PCMCIA) standard, 16 bit I/O bus.
Signals which are not used won’t be routed to the physical interface (connector). The host
interface of Combo SiP Bluetooth portion is compliant with UART interface, the default baud
rate setting is 115.2kbps and the optional range is from 9.6kbps to 921.6kbps.
On Board connector
Molex 53794-0608 or 55560-0607 [Socket, 60 pins, with positioning protection, stack
height which is able to support 1.5 mm]
Datasheet_Molex_53
794-0608.pdf Datasheet_Molex_55
560-0607.pdf
Host System:
Host System Connector
Molex 54722-0607 [Header, 60 pins, with positioning protection, stack height 1.5mm]
Datasheet_Molex_54
722-0607.pdf
Pin definition
[ …] means optional function of the pin.
PD : Signal pull down internally in the chip by 50K ohm while initialization.
PU : Signal pull up internally in the chip by 100K ohm while initialization.
5VT: 5 Volt tolerance pin
xxx_B : Signal pins end with _B are “active high”
Pin
Number
Definition
Draft Description Type
WM-BG-
MR-01
CF+ interface
1 GND GND GND
2 D03 HD3
Data Input/Output line constitute a bi
-
directional
bus. HD[15:0] are used to access the MODULE
O, PD, 5VT, 4mA
802.11g Wireless LAN+BT SiP combo Module V2.2
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Preliminary release for evaluation, Subject to be changed without Notice
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register Databus
3 D04 HD4 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
O, PD, 5VT, 4mA
Databus
4 D05 HD5 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
Databus
5 D06 HD6 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
6 D07 HD7 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
7 -CE_1 HCE1_B Card Enable1 is driven by the host system and is
used as select strobe in both I/O and memory
mode. Enables even numbered address bytes.
Input, PU, 5VT
8 A10 A10 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.The pin is open in
B2B module.
Input, PD,5VT
9 -OE HOE_B OUTPUT ENABLE is driven by the host during a
memory Read Access. Input, PU,5VT
10 A09 HA9 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD,5VT
11 A08 HA8 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD,5VT
12 A07 HA7 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD,5VT
13 VCC VCC_WLAN Power, 3.3V_WLAN Input
14 A06 HA6 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD, 5VT
15 A05 HA5 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD, 5VT
16 A04 HA4
ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
Input, PD, 5VT
802.11g Wireless LAN+BT SiP combo Module V2.2
All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
17 A03 HA3 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC . This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD, 5VT
18 A02 HA2 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD, 5VT
19 A01 HA1 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD, 5VT
20 A00 HA0 ADDRESS BUS lines driven by the host system
which enables addressing of 0.5K address range
within MAC. This address range is mainly used for
accessing the CIS in Memory Mode. Signal HA0 is
not used in word access mode.
Input, PD, 5VT
21 D00 HD0 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
22 D01 HD1 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
23 D02 HD2 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
24 -IOIS16 IOIS16_B Output signal to indicate 16 bit IO operation. This
signal is connected to ground at module side to
indicate 16 bit IO..
GND
25 -CD2 CD2 Normal operation, this pin is functionally for card
detection. Out, 6mA, 5VT.
26 N/A TXD_B UART CMOS output data line Output,WPU, 1µ
A
27 N/A RTS_B UART CMOS output signal, request to sent Output ,WPU, 1µ
A
28 N/A PCM_In Reserved for BT portion , keep its open on host
side if no use.
29 N/A VCC_WLAN Power_WLAN Input
30 GND GND
31 GND GND
32 D10 HD10 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
33 D09 HD9 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
802.11g Wireless LAN+BT SiP combo Module V2.2
All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
34 D08 HD8 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
35 -STSCHG HSTSCHG_B STATUS CHANGE indication to the host. This
signal gets active when one of the bits in the PRR
or CSR registers are set
Output, 4mA
36 -SPKR PCM_Sync Reserved for BT portion , keep its open on host
side if no use.
37 -REG HREG_B ATTRIBUTE MEMORY SELECT is driven by the
host system and is used to access the Attribute
Memory
Input, PU, 5VT
38 -INPACK HINPACK_B INPUT ACKNOWLEDGE is driven by MAC. Is
asserted when the device is selected and the
device is responding to an I/O Read command.
Output, 2mA
39 -WAIT HWAIT_B HWAIT_B is driven by MAC and allows for
extending the memory or I/O cycle Output, 4mA
40 RESET HRESET Used to asynchronously reset the complete Module Input, PU,5VT
41 -VS2 VS2_B Voltage sense signal Output , 5VT 4mA
42 N/A WLAN_LED_B
WLAN LED control signal, driven the LED
indicating the link status of WLAN Output, 4mA
43 N/A PCM_OUT Reserved for BT portion , keep its open on host
side if no use.
44 IREQ
IREQ_B INTERRUPT REQUEST to the host. In Memory
mode this pin signifies RDY/BSY_typically used
during card initialization immediately after reset or
power on. Indicates to the host that the device is
not able to transfer data
Output, 4mA
45 -WE HWE_B WRITE ENABLE is driven by the host during a
memory Write Access Input, PU,5VT
46 -IOWR HIOWR_B I/O Write Strobe is driven by the host and is
asserted when the host wants to write to an on-chip
I/O register
Input, PU,5VT
47 -IORD HIORD_B I/O Read Strobe is driven by the host and is
asserted when the host wants to read from an on-
chip I/O register
Input, PU,5VT
48 -VS1 -VS1 Reserved Output , 5VT
49 -CE2 HCE2_B CARD ENABLE2 is driven by the host system and
is used as select strobe in both I/O and memory
mode. Enables odd numbered address bytes
Input, PU,5VT
50 D15 HD15 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
51 D14 HD14 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
52 D13 HD13 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
53 D12 HD12 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
802.11g Wireless LAN+BT SiP combo Module V2.2
All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
54 D11 HD11 Data Input/Output line constitute a bi-directional
bus. HD[15:0] are used to access the MODULE
MAC Host Interface register
IO, PD, 5VT, 4mA
55 N/A BT_LED_B BT LED control signal which drive the LED to
indicate the activity of Bluetooth Output 4mA
56 N/A RXD_B UART data line CMOS input signal Input, WPD, 1µA
57 N/A CTS_B UART clear to sent COMS input signal Input, WPD, 1µA
58 N/A PCM_CLK Reserved for BT portion , keep its open on host
side if no use.
59 VCC VCC_BT Power 3.3V_BT Input
60 GND GND
Fig 1: Pin 1 assignment and indication Drawing
( To be updated with latest design)
10.2.1. LED INTERFACE
The Wireless Module will provide two control signals to the host and capable to drive an LED
to indicate the connectivity and operating status.
The WM-BG-MR -01 have 2 LED’s (output) via 60 pins connector for feedback to the user on
the current WLAN activity state. The signaling will reflect status / activity as described in the
table below. Those two signals are provided via the board to board connector with the
following pin assignment.
Pin No Pin description Function description
42 WLAN_LED Link activity of Wireless LAN
55 BT Power status indication
LED code to be defined !
10.2.2. ANTENNA INTERFACE
No antenna diversity supported on the Wireless Module.
The output impedance of the cable is 50 Ohms.
Antenna Connector: Hirose W-FL-R-SMT(10)
Pin 1
Pin 59
Pin 60
802.11g Wireless LAN+BT SiP combo Module V2.2
All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
10.2.3. BLUETOOTH INTERFACE
There are interfaces signal to routed between WiFi and Bluetooth to provide coexistence with
802.15 Bluetooth modules.
The BT co-existence interface supported, which is 2 Wire CSR co-existence.
The control signals are provided via the 60 pins B2B connector with the interface defined as
below:
Symbol Interface “Signal name” & description
BTACT
2 Wire-CSR
“BT _Priority”
This pin indicates to WLAN BCA de
vice that BT module is
active or will soon be active to TX/RX stage.
WLAN_active
2 Wire-CSR
“Wlan_Active”
, This pin indicates to BT module that WLAN
is active or will soon be active to TX/RX stage.
Note 1: “WLAN BCA” device is a functional block in 88W8385 works as Bluetooth co-existence management .
10.3. SOFTWARE
The following source code will be provided for porting to the embedded system under the SLA
with chipset supplier
• Linux source code
• Source code of development utility base on Windows CE
11. DESIGN FOR EXCELLENCE (DFX)
11.1. TESTABILITY
The WM-BG-MR-01 module can be tested on the by using adapter card or similar interface.
The adapter card must be such that from the FTS the WM-BG-MR -01 module is seen and
recognized as PC Card or Compaq Flash.
Ÿ No additional test pins are required to support in-circuit testing.
11.2. LOGISTICS
All customer specific requirements – customization – will be implemented at the highest
possible level to support build to order and keep the number of modules in SMT to a minimum.
Additional module variants might be added base on business potential.
802.11g Wireless LAN+BT SiP combo Module V2.2
All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
12. HUMAN FACTORS
Due to the nature of this product (embedded module) no human factors required
13. INDUSTRIAL DESIGN
Due to the nature of this product (embedded module) no industrial design requirements are
required.
14. RELIABILITY
The WM-BG-MR-01 module guarantee an MTBF of 150,000 hrs based on an ambient
temperature and workload of 2,920 hours. The workload is based on a unit working for 8 hours
per day, 365 days per year.
The MTBF estimation base on is Bell code standard, Class II.
15. PACKAGE
To be updated.
802.11g Wireless LAN+BT SiP combo Module V2.2
All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
Marvell is Trademark of 3’rd Party.
For Additional information, please contact the following:
Universal Scientific Industrial Co., Ltd.
Headquarters
141, Lane 351, Taiping Road, Sec. 1, Tsao-Tuen, Taiwan,
Http://www.usi.com.tw
Tel: + 886-49-2350876, 2325876
Fax: +886-49-3439561, 2337360,2351093
E-mail:usi@ms.usi.com.tw