Unication Co UNIGM601 GSM Module User Manual GM601 module V1 0

Unication Co Ltd GSM Module GM601 module V1 0

User Manual

盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 1 页 共 25 页 GM601 Module User Manual Rev: V1.0 FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. Notice The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 2 页 共 25 页 Contents 1 Introduction ..............................................................................................................................................................4 1.1 Revision History............................................................................................................................................ 4 1.2 Purpose ..........................................................................................................................................................4 1.3 Scope ..............................................................................................................................................................4 1.4 Target audience............................................................................................................................................. 4 1.5 Abbreviations................................................................................................................................................ 4 1.6 Related documents........................................................................................................................................5 2 GM601 Module introduction...................................................................................................................................5 2.1 Key feature ....................................................................................................................................................5 2.2 Application diagram.....................................................................................................................................6 2.3 Package information..................................................................................................................................... 7 2.4 Pin define and description............................................................................................................................ 8 3 Module application description.............................................................................................................................12 3.1 Power supply ................................................................................................................................................12 3.3.1 Requirement...................................................................................................................................... 12 3.3.2 Power up sequence............................................................................................................................12 3.3.3 Power up mode .................................................................................................................................12 3.2 RF Antenna ...................................................................................................................................................12 3.3 Design rule for EMC ....................................................................................................................................13 3.4 Design rule for ESD......................................................................................................................................13 3.5 UART port and application........................................................................................................................... 14 3.5.1 UART function and parameter.......................................................................................................... 14 3.5.2 UART pin define...............................................................................................................................14 3.5.3 UART2 Typical application circuit ...................................................................................................15 3.6 Analogy Audio.............................................................................................................................................. 16 3.6.1 Interface define ................................................................................................................................. 16 3.6.2 Electro-acoustic devices reference specification .............................................................................. 17 3.7 SIM interface description and application .................................................................................................... 18 3.7.1 SIM interface define ......................................................................................................................... 18 3.7.2 SIM interface reference application circuit....................................................................................... 19 3.7.3 Design recommendation ...................................................................................................................19 3.8 GPIO description and application................................................................................................................. 19 3.8.1 GPIO description............................................................................................................................19 3.8.2 GPIO electrical characteristics......................................................................................................19 3.9 Mounting the GM601 on the Board..............................................................................................................21 3.9.1 General.............................................................................................................................................21 3.9.2 Module finish& Dimensions........................................................................................................... 21 3.9.3 Suggest Inhibit Area .......................................................................................................................21 3.9.4 Debug of the GM601 in Production ..............................................................................................22 3.9.5 Stencil............................................................................................................................................... 22 3.9.6 PCB Pad Design.............................................................................................................................. 22
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 3 页 共 25 页 3.9.7 Solder Paste..................................................................................................................................... 24 3.9.8 Solder Reflow ..................................................................................................................................24 4 RF Exposure Information......................................................................................................................................25
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 4 页 共 25 页 1 Introduction 1.1 Revision History Revision Date Description 1.0 2010-6-9 Initial release 1.2 Purpose This document describes the product design and specification for GM601. GM601 supports GSM/GPRS quad-band (GSM850, EGSM900, DCS1800, and PCS1900). 1.3 Scope This document describes: the platform architecture, the hardware/software interactions, Technical/Electrical specifications. 1.4 Target audience This document is intended to provide a design specification for the teams involved in and an introduction to the platform for product integration teams. 1.5 Abbreviations PPP Point-to-Point protocol PSU Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory SRAM Static Random Access Memory NAND Not AND (electronic logic gate) ROM Read-Only Memory RMS Root Mean Square(value) RTC Real Time Clock Rx Receive Direction Tx Transmit Direction SAR Specific Absorption Rate SIM Subscriber Identity Module SMS Short Message Service TA Terminal Adapter(e.g. GSM engine) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 5 页 共 25 页 UART Universal Asynchronous Receiver-Transmitter VSWR Voltage Standing Wave Radio GPRS General Packet Radio Service FR Full Rate EFR Enhanced Full Rate HR Half Rate AP Applications Processor BB Baseband IMEI International Mobile Equipment Identity 1.6 Related documents [1] AT_Command_Set_For_GM601_V1.0 [2] GM601_module_BOM_V1.0 [3] GM601_module_EVB_User_Manual_V10 [4] Operation Description of GM601 Module_V1.0 2 GM601 Module introduction 2.1 Key feature GM601 is a self-contained GSM/GPRS quad-band（850/900/1800/1900） module including the following feature: Feature Implementation Power supply Single supply voltage:3.6~4.2V Power saving Typical power consumption in SLEEP mode less than 2.5mA(BS-PA-MFRMS=5) Frequency bands  GM601 quad-band: GSM850,EGSM900,DCS1800,PCS1900  Compliant to GSM phase 2/2+ GSM class Small MS Transmitting power  Class 4 (2W) at GSM850, EGSM900  Class 1(1W) at DCS1800, PCS1900 GPRS connectivity  GPRS Class 12 capability：UL: 53.6 kbps/DL: 53.6 k  Coding Scheme 1 – 4  Mobile station Class B Temperature range  Normal operation: -10℃~+55℃；  Restricted operation: -20℃~-10℃ and +55℃ ~ +65℃  Storage:-30℃ to 85℃ Audio interface  Two groups of analog audio interfaces；  one digital audio interface(DAI) Firmware upgrade Firmware upgraded over serial interface Real Time Clock Implemented
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 6 页 共 25 页 Assemblage Connected to mother board Through BGA balls Application interface Use BGA balls as application interface:  Power supply  Serial links(UART1,UART2)  SIM interface: 1.8V/3V  EINT/ADC  Power key /Reset  GPIO  Status LED driver output Antenna interface  BGA ball  Antenna PAD 2.2 Application diagram Figure 1 – Application Diagram
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 7 页 共 25 页 2.3 Package information Figure2 – package and size Figure3 - GM601 Side view of Package
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 8 页 共 25 页 2.4 Pin define and description Ball Signal I/O Function Pull Up/Down Type UART Interface E7 C103/TXD I Serial data input (TXD) from DTE CMOS 2.8VH8 C104/RXD O Serial data output to DTE CMOS 2.8VB7 C108/DTR I Input for Data terminal ready signal (DTR) from DTE CMOS 2.8VF7 C105/RTS I Input for Request to send signal (RTS) from DTE CMOS 2.8VF6 C106/CTS O Output for Clear to send signal (CTS) to DTE CMOS 2.8VD9 C109/DCD O Output for Data carrier detect signal (DCD) to DTE CMOS 2.8VE11 C107/DSR O Output for Data set ready signal (DSR) to DTE CMOS 2.8VB6 C125/RING O Output for Ring indicator signal (RI) to DTE CMOS 2.8VSIM card interface C10 SIMCLK O External SIM signal – Clock 1,8 / 3V E9 SIMRST O External SIM signal – Reset 1,8 / 3V D10 SIMIO I/O External SIM signal – Data I/O 1,8 / 3V E11 SIMIN I External SIM signal – Presence (active low) 1,8 / 3V D4 SIMVCC AO External SIM signal – Power supply for the SIM 1,8 / 3V Debug Interface D11 TX_TRACE O TX Data for debug monitor CMOS 2.8V F10 RX_TRACE I RX Data for debug monitor CMOS 2.8V Audio Interface H9 EAR_MT- O Headset single end right channel audio G10 EAR_MT+ O Headset single end left channel audio H10 EAR_HF+ O Handset ear output, phase+ audio J10 EAR_HF- O Handset ear output, phase- audio J8 MIC_MT+ I Headset MIC. signal input: phase+ audio G9 MIC_MT- I Headset MIC. signal input: phase- audio G8 MIC_HF+ I Handset MIC. Input: phase+ audio J9 MIC_HF- I Handset MIC. Input: phase- audio F9 AXE I Handset switching CMOS 2.8V DAC and ADC C7 NC AO No defined / J11 ADC_IN1 AI Analog/Digital converter input A/D H11 ADC_IN2 AI Analog/Digital converter input A/D G11 ADC_IN3 AI Analog/Digital converter input A/D
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 9 页 共 25 页 Miscellaneous Functions A2 RESET* I Reset input Power E2 VRTC AI VRTC Backup Power D8 STAT_LED AO Status indicator led OD G1 CHARGE AI Charger input Power G2 CHARGE AI Charger input Power J5 ON_OFF* I Input command for switching power ON or OFF (toggle command). Pull up to VBATT D5 VAUX1 AO Power output for external accessories Power L8 PWRMON O Power ON Monitor CMOS 2.8V L4 Antenna O Antenna output – 50 ohm RF D7 DVI2_CLK - DVI2_CLK (Digital Voice Interface) CMOS 2.8V GPIO G4 TGPIO_12 I/O GPIO12 Configurable GPIO Pull Up CMOS 2.8V C2 TGPIO_03 I/O GPIO03 Configurable GPIO Pull Down CMOS 2.8V B3 TGPIO_04 I/O GPIO04 Configurable GPIO / RF Transmission Control Pull Down CMOS 2.8V C3 TGPIO_20 I/O GPIO20 Configurable GPIO Pull Down CMOS 2.8V B4 TGPIO_14 I/O GPIO14 Configurable GPIO Pull Up CMOS 2.8V D1 TGPIO_11 I/O GPIO11 Configurable GPIO Pull Down CMOS 2.8V B1 TGPIO_19 I/O GPIO19 Configurable GPIO Pull Up CMOS 2.8V C1 TGPIO_01 I/O GPIO01 Configurable GPIO Pull Down CMOS 2.8V K7 TGPIO_18 I/O GPIO18 Configurable GPIO/ DVI2_RX (Digital Voice Interface) Pull Up CMOS 2.8V H5 TGPIO_17 I/O GPIO17 Configurable GPIO / DVI2_WA(Digital Voice Interface) Pull Up CMOS 2.8V F5 TGPIO_15 I/O GPIO15 Configurable GPIO Pull Up CMOS 2.8V K11 TGPIO_08 I/O GPIO08 Configurable GPIO Pull Down CMOS 2.8V B5 TGPIO_06 / ALARM I/O GPIO06 Configurable GPIO / ALARM Pull Down CMOS 2.8V C9 TGPIO_09 I/O GPIO09 GPIO I/O pin Pull Up CMOS
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 10 页 共 25 页 2.8V E6 TGPIO_02 / JDR I/O GPIO02 I/O pin Pull Down CMOS 2.8V L9 TGPIO_07 / BUZZER I/O GPIO07 Configurable GPIO / Buzzer Pull Down CMOS 2.8V K10 TGPIO_13 I/O GPIO13 Configurable GPIO Pull Up CMOS 2.8V K8 TGPIO_05 / RFTXMON I/O GPIO05 Configurable GPIO / Transmitter ON monitor Pull Down CMOS 2.8V L10 TGPIO_21 I/O GPIO21 Configurable GPIO Pull Down CMOS 2.8V E8 TGPIO_22 I/O GPIO22 Configurable GPIO Pull Up CMOS 2.8V H3 TGPIO_10 I/O GPIO10 Configurable GPIO / DVI2_TX (Digital Voice Interface) Pull Up CMOS 2.8V Power Supply J1 VBATT - Main power supply Power K1 VBATT - Main power supply Power J2 VBATT - Main power supply Power K2 VBATT - Main power supply Power A1 GND - Ground Power F1 GND - Ground Power H1 GND - Ground Power L1 GND - Ground Power H2 GND - Ground Power L2 GND - Ground Power J3 GND - Ground Power K3 GND - Ground Power L3 GND - Ground Power K4 GND - Ground Power K5 GND - Ground Power D6 GND - Ground Power K6 GND - Ground Power L6 GND - Ground Power A11 GND - Ground Power F11 GND - Ground Power L11 GND - Ground Power Reserved Pins C4 - C6 - C5 - C8 -
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 11 页 共 25 页 D2 - D3 - A10 - A3 - A4 - A5 - A6 - A7 - A8 - A9 - B10 - B11 - B2 - B8 - B9 - E1 - E10 - E3 - E4 - F2 - F3 - F4 - F8 - G5 - G3 - G6 - G7 - H4 - H7 - J4 - J6 - J7 - K9 - L5 - E5 - L7 - H6
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 12 页 共 25 页 3 Module application description 3.1 Power supply 3.3.1 Requirement  Input power voltage range: 3.6~4.2V;  Max Current: 2A;  Internal resistance<180mΩ 3.3.2 Power up sequence Insert battery-> Pull down ON_OFF signal and hold more than 3 seconds-> start the module. 3.3.3 Power up mode This module can be started by 3 ways:  Press ON_OFF signal;  Plug in charger and the module is auto started ;  Start by RTC 3.2 RF Antenna  Impedance of Signal connected to RF antenna pin should be 50ohm;  GND pins around RF antenna output pad should be well connected to mother board. It help to control impedance and conducted hot from PA  The line connected to module’s RF antenna pad on the mother board should be routed as a strip line to help controlling EMC and preventing the impendence acutely change  Pads of no connect define could be connected to GND to improve RF performances
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 13 页 共 25 页 Figure4 – RF antenna Pad 3.3 Design rule for EMC  Please connect GND pins directly to motherboard GND, don’t through via or line;  Connect line between module power pins and battery connector on motherboard should be short and wide;  Add a 22uF and a 22pF capacitor close to battery connector;  Add a 1uF、a 100nF and a 22pF capacitor on charger connector. 3.4 Design rule for ESD  Add a zener Diode (ON SEMICON:NZL5V6ATT1G) at VBATT input port on motherboard;  Add a 1uF/16V capacitor at VCHG input port on motherboard;  Add TVS components on all audio channels.
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 14 页 共 25 页 3.5 UART port and application GM601 possesses of two UART ports: UART1 and UART2 3.5.1 UART function and parameter UART1 function and parameter PORT Wires used Baud rate(bps) Word length(bit) Parity Check Hardware flow control Function UART1 RS232C 3-Wires 115200 8 No No Software download and debug UART2 RS232C 9-wires 115200 8 No Yes Communication with AP or PC 3.5.2 UART pin define UART1 pin define (not include GND): BGA Ball Name I/O Function Pull up/down Type D11 TX_TRACE O Transmit data line Pull up CMOS 2.8V F10 RX_TRACE I Receive data line Pull down CMOS 2.8V UART2 pin define (not include GND): BGA Ball Name I/O Function Pull up/down Type E7 C103/TXD I DCE receive data line Pull up CMOS 2.8V H8 C104/RXD O DCE transmit data line Pull up CMOS 2.8V B7 C108/DTR I Data terminal ready(from DTE) Pull up CMOS 2.8V F7 C105/RTS I Request to send (from DTE) Pull up CMOS 2.8V F6 C106/CTS O Clear to send ( to DTE) Pull up CMOS 2.8V D9 C109/DCD O Data carrier detect ( to DTE ) Pull up CMOS 2.8V E11 C107/DSR O Data set ready ( to DTE) Pull up CMOS 2.8V B6 C125/RING O Ring indicator (to DTE) Pull up CMOS 2.8V
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 15 页 共 25 页 3.5.3 UART2 Typical application circuit Figure 5 – UART2 typical application circuit 1
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 16 页 共 25 页 Figure 6 – UART2 typical application circuit 1 3.6 Analogy Audio GM601 provide 4 audio channels: one for handset microphone, one for handset receiver, one for headset earphone, one for headset microphone. 3.6.1 Interface define Figure7 – Analogy audio interface Audio pin define as follow (not include GND): BGA BALL Name I/O Function Pull up/down Type H9 EAR_MT- O Headset single end right channel audio G10 EAR_MT+ O Headset single end left channel audio H10 EAR_HF+ O Handset ear output, phase+ audio J10 EAR_HF- O Handset ear output, phase- audio
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 17 页 共 25 页 J8 MIC_MT+ I Headset MIC. signal input: phase+ audio G9 MIC_MT- I Headset MIC. signal input: phase- audio G8 MIC_HF+ I Handset MIC. Input: phase+ audio J9 MIC_HF- I Handset MIC. Input: phase- audio 3.6.2 Electro-acoustic devices reference specification We list the reference specification for engineers to choice electro-acoustic for GM601 module. 3.6.2.1 Stereo earphone 3.6.2.2 Handset receiver Symbol Parameter Min Typical Max Unit SINAD Signal to Noise and Distortion Ratio Input Level: -40dBm0 Input Level: 0 dBm0 29 69 dB dB RLOAD Output Resistor Load (Differential) 28 Ω CLOAD Output capacitor load 200 pF ICN Idle channel noise of transmit path -67 dBm0 XT Crosstalk level on transmit path -66 dBm0
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 18 页 共 25 页 3.6.2.3 Earphone microphone and handset microphone 3.7 SIM interface description and application 3.7.1 SIM interface define SIM interface include 4 signals: SIMVCC，SIMRST，SIMCLK，SIMIO。Additionally, we define SIMIN to indicate the SIM card’s inserting (low active) SIM interface support 1.8V and 3V voltage and is auto identified according to SIM type.
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 19 页 共 25 页 3.7.2 SIM interface reference application circuit Figure 8 – SIM interface reference circuit Note: recommend adding ESD components on every SIM signals. 3.7.3 Design recommendation  add ESD components on every SIM signals  SIMCLK is a 3.25MHZ clock signal and should be carefully treated with. 3.8 GPIO description and application GPIOs (General Purpose I/Os) in GM601 are supplied by 2.8V voltage. GPIOs can be defined as input or output mode and also can be multiplexed with other functionalities to reduce the pin number. 3.8.1 GPIO description Reference to chapter 2.2 description about GPIOs 3.8.2 GPIO electrical characteristics 3.8.2.1 GPIO electrical characteristic correspond to CPU port Signal CPU port Driving (mA) Pull PU/PD resistor (Kohm) (Min, typical, max) Cin (pF) TGPIO_12 GPIO1 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_03 GPIO2 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_04 GPIO3 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_20 GPIO4 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_14 GPIO5 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_11 GPIO6 max 16, min 2 PD 40, 75, 190 5.2
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 20 页 共 25 页 TGPIO_19 GPIO7 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_01 GPIO11 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_18 GPIO17 6 PU 40, 75, 190 5.2 TGPIO_17 GPIO19 6 PU 40, 75, 190 5.2 TGPIO_15 GPIO18 6 PU 40, 75, 190 5.2 TGPIO_08 GPIO8 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_06 GPIO24 4 PD 40, 75, 190 5.2 TGPIO_09 GPIO9 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_02 GPIO10 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_07 GPIO28 2 PU 40, 75, 190 5.2 TGPIO_16 TGPIO_13 GPIO13 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_05 GPIO12 max 16, min 2 PD 40, 75, 190 5.2 TGPIO_21 GPIO25 4 PD 40, 75, 190 5.2 TGPIO_22 GPIO22 2 PU 5.2 TGPIO_10 GPIO16 6 PD 40, 75, 190 5.2 3.8.2.2 GPIO Absolute Maximum Ratings Item Symbol Min Max Unit IO power supply VDD33 -0.3 VDD33+0.3 V IO Input voltage VDD33I -0.3 VDD33+0.3 V Operating temperature Topr -20 80 Celsius Storage temperature Tstg -55 125 Celsius Remark: VDD33=2.8V 3.8.2.3 GPIO logic level ratings Levels Min Max Unit Input low level - 0.8 V Input high level 2.0 - V Output low level - 0.4 V Output high level 2.4 - V
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 21 页 共 25 页 3.9 Mounting the GM601 on the Board 3.9.1 General The GM601 modules have been designed in order to be compliant with a standard lead-free SMT process. 3.9.2 Module finish& Dimensions Figure 9 –Module finish&Dimensions 3.9.3 Suggest Inhibit Area In order to easily rework the GM601 is suggested to consider on the application a 1.5mm inhibit area around the module.
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 22 页 共 25 页 Figure 10 –Suggest Inhibit Area 3.9.4 Debug of the GM601 in Production To test and debug the mounting of the GM601, we strongly recommend to foreseen test pads on the host PCB, in order to check the connection between the GM601 itself and the application and to test the performance of the module connecting it with an external computer. Depending by the customer application, these pads include, but are not limited to the following signals:  • TXD  • RXD  • ON/OFF  • RESET  • GND  • VBATT  • TX_TRACE  • RX_TRACE  • PWRMON 3.9.5 Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120μm. 3.9.6 PCB Pad Design Non solder mask defined type is recommended for the solder pads on the PCB.
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 23 页 共 25 页 Figure 11 –PCB pad design Recommendation for PCB pad dimensions: Ball pitch(mm) 2.5 Solder resist opening diameter A (mm) 1.150 Metal pad diameter B (mm) 1+/-0.05 It is recommended no microvia without solder resist cover under the module and no microvia around the pads (see following figure): Figure 12 –microvia without solder resist cover area Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer thickness(um) Properties Electro-less Ni/Immersion Au 3-7/0.05-0.15 Good solder ability protection, high shear force valuesThe PCB must be able to resist the higher temperatures which are occurring at the lead-free process.
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 24 页 共 25 页 3.9.7 Solder Paste Lead free Solder paste Sn/Ag/Cu 3.9.8 Solder Reflow Recommend classification reflow profile: Figure13 – Classification Reflow Profile Table 4-1 Notes: Parameters requirement described is only suitable for lead-free process. Lead-free process means：Use Lead-free alloy Solder paste (for example 95.5Sn3.0Ag0.5Cu) . All temperature refers to top side of the package. Measured on the package body surface: Peak temperature C1 235℃~255℃ Time above 220℃ T1 30~75s Time between 50℃ and 100℃ T2 >16s Time between 220℃ and 235℃ T3 >5s
盟訊實業股份有限公司 Unication CO., LTD. 機密等級：□極機密 ■機密 □普通 第 25 页 共 25 页 4 RF Exposure Information This device meets the government’s requirements for exposure to radio waves. This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF) energy set by the Federal Communications Commission of the U.S. Government. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. Maximum antenna gain allowed for use with this device is GSM850 3.8 dBi,GSM1900 2.4 dBi. When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: LEAUNIGM601”

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