Unication Co UNIGM601 GSM Module User Manual GM601 module V1 0

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User Manual

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GM601 Module User Manual

Rev: V1.0

FCC Regulations:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the

FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in

accordance with the instructions, may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference

to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to

try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

Notice

The changes or modifications not expressly approved by the party responsible for compliance could void the user’s

authority to operate the equipment.

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Contents

1 Introduction ..............................................................................................................................................................4

1.1 Revision History............................................................................................................................................ 4

1.2 Purpose ..........................................................................................................................................................4

1.3 Scope ..............................................................................................................................................................4

1.4 Target audience............................................................................................................................................. 4

1.5 Abbreviations................................................................................................................................................ 4

1.6 Related documents........................................................................................................................................5

2 GM601 Module introduction...................................................................................................................................5

2.1 Key feature ....................................................................................................................................................5

2.2 Application diagram.....................................................................................................................................6

2.3 Package information..................................................................................................................................... 7

2.4 Pin define and description............................................................................................................................ 8

3 Module application description.............................................................................................................................12

3.1 Power supply ................................................................................................................................................12

3.3.1 Requirement...................................................................................................................................... 12

3.3.2 Power up sequence............................................................................................................................12

3.3.3 Power up mode .................................................................................................................................12

3.2 RF Antenna ...................................................................................................................................................12

3.3 Design rule for EMC ....................................................................................................................................13

3.4 Design rule for ESD......................................................................................................................................13

3.5 UART port and application........................................................................................................................... 14

3.5.1 UART function and parameter.......................................................................................................... 14

3.5.2 UART pin define...............................................................................................................................14

3.5.3 UART2 Typical application circuit ...................................................................................................15

3.6 Analogy Audio.............................................................................................................................................. 16

3.6.1 Interface define ................................................................................................................................. 16

3.6.2 Electro-acoustic devices reference specification .............................................................................. 17

3.7 SIM interface description and application .................................................................................................... 18

3.7.1 SIM interface define ......................................................................................................................... 18

3.7.2 SIM interface reference application circuit....................................................................................... 19

3.7.3 Design recommendation ...................................................................................................................19

3.8 GPIO description and application................................................................................................................. 19

3.8.1 GPIO description............................................................................................................................19

3.8.2 GPIO electrical characteristics......................................................................................................19

3.9 Mounting the GM601 on the Board..............................................................................................................21

3.9.1 General.............................................................................................................................................21

3.9.2 Module finish& Dimensions........................................................................................................... 21

3.9.3 Suggest Inhibit Area .......................................................................................................................21

3.9.4 Debug of the GM601 in Production ..............................................................................................22

3.9.5 Stencil............................................................................................................................................... 22

3.9.6 PCB Pad Design.............................................................................................................................. 22

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3.9.7 Solder Paste..................................................................................................................................... 24

3.9.8 Solder Reflow ..................................................................................................................................24

4 RF Exposure Information......................................................................................................................................25

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1 Introduction

1.1 Revision History

Revision Date Description

1.0 2010-6-9 Initial release

1.2 Purpose

This document describes the product design and specification for GM601. GM601 supports GSM/GPRS quad-band

(GSM850, EGSM900, DCS1800, and PCS1900).

1.3 Scope

This document describes: the platform architecture, the hardware/software interactions, Technical/Electrical

specifications.

1.4 Target audience

This document is intended to provide a design specification for the teams involved in and an introduction to the

platform for product integration teams.

1.5 Abbreviations

PPP Point-to-Point protocol

PSU Power Supply Unit

R&TTE Radio and Telecommunication Terminal Equipment

RAM Random Access Memory

SRAM Static Random Access Memory

NAND Not AND (electronic logic gate)

ROM Read-Only Memory

RMS Root Mean Square(value)

RTC Real Time Clock

Rx Receive Direction

Tx Transmit Direction

SAR Specific Absorption Rate

SIM Subscriber Identity Module

SMS Short Message Service

TA Terminal Adapter(e.g. GSM engine)

TDMA Time Division Multiple Access

TE Terminal Equipment, also referred to as DTE

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UART Universal Asynchronous Receiver-Transmitter

VSWR Voltage Standing Wave Radio

GPRS General Packet Radio Service

FR Full Rate

EFR Enhanced Full Rate

HR Half Rate

AP Applications Processor

BB Baseband

IMEI International Mobile Equipment Identity

1.6 Related documents

[1] AT_Command_Set_For_GM601_V1.0

[2] GM601_module_BOM_V1.0

[3] GM601_module_EVB_User_Manual_V10

[4] Operation Description of GM601 Module_V1.0

2 GM601 Module introduction

2.1 Key feature

GM601 is a self-contained GSM/GPRS quad-band（850/900/1800/1900） module including the following feature:

Feature Implementation

Power supply Single supply voltage:3.6~4.2V

Power saving Typical power consumption in SLEEP mode less than 2.5mA(BS-PA-MFRMS=5)

Frequency bands  GM601 quad-band: GSM850,EGSM900,DCS1800,PCS1900

 Compliant to GSM phase 2/2+

GSM class Small MS

Transmitting power  Class 4 (2W) at GSM850, EGSM900

 Class 1(1W) at DCS1800, PCS1900

GPRS connectivity  GPRS Class 12 capability：UL: 53.6 kbps/DL: 53.6 k

 Coding Scheme 1 – 4

 Mobile station Class B

Temperature range  Normal operation: -10℃~+55℃；

 Restricted operation: -20℃~-10℃ and +55℃ ~ +65℃

 Storage:-30℃ to 85℃

Audio interface  Two groups of analog audio interfaces；

 one digital audio interface(DAI)

Firmware upgrade Firmware upgraded over serial interface

Real Time Clock Implemented

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Assemblage Connected to mother board Through BGA balls

Application interface Use BGA balls as application interface:

 Power supply

 Serial links(UART1,UART2)

 SIM interface: 1.8V/3V

 EINT/ADC

 Power key /Reset

 GPIO

 Status LED driver output

Antenna interface  BGA ball

 Antenna PAD

2.2 Application diagram

Figure 1 – Application Diagram

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2.3 Package information

Figure2 – package and size

Figure3 - GM601 Side view of Package

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2.4 Pin define and description

Ball Signal I/O Function Pull

Up/Down Type

UART Interface

E7 C103/TXD I Serial data input (TXD) from DTE CMOS 2.8V

H8 C104/RXD O Serial data output to DTE CMOS 2.8V

B7 C108/DTR I Input for Data terminal ready signal (DTR) from DTE CMOS 2.8V

F7 C105/RTS I Input for Request to send signal (RTS) from DTE CMOS 2.8V

F6 C106/CTS O Output for Clear to send signal (CTS) to DTE CMOS 2.8V

D9 C109/DCD O Output for Data carrier detect signal (DCD) to DTE CMOS 2.8V

E11 C107/DSR O Output for Data set ready signal (DSR) to DTE CMOS 2.8V

B6 C125/RING O Output for Ring indicator signal (RI) to DTE CMOS 2.8V

SIM card interface

C10 SIMCLK O External SIM signal – Clock 1,8 / 3V

E9 SIMRST O External SIM signal – Reset 1,8 / 3V

D10 SIMIO I/O External SIM signal – Data I/O 1,8 / 3V

E11 SIMIN I External SIM signal – Presence (active low) 1,8 / 3V

D4 SIMVCC AO

External SIM signal – Power supply for the

SIM 1,8 / 3V

Debug Interface

D11 TX_TRACE O TX Data for debug monitor CMOS

2.8V

F10 RX_TRACE I RX Data for debug monitor CMOS

2.8V

Audio Interface

H9 EAR_MT- O Headset single end right channel audio

G10 EAR_MT+ O Headset single end left channel audio

H10 EAR_HF+ O Handset ear output, phase+ audio

J10 EAR_HF- O Handset ear output, phase- audio

J8 MIC_MT+ I Headset MIC. signal input: phase+ audio

G9 MIC_MT- I Headset MIC. signal input: phase- audio

G8 MIC_HF+ I Handset MIC. Input: phase+ audio

J9 MIC_HF- I Handset MIC. Input: phase- audio

F9 AXE I Handset switching CMOS

2.8V

DAC and ADC

C7 NC AO No defined /

J11 ADC_IN1 AI Analog/Digital converter input A/D

H11 ADC_IN2 AI Analog/Digital converter input A/D

G11 ADC_IN3 AI Analog/Digital converter input A/D

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Miscellaneous Functions

A2 RESET* I Reset input Power

E2 VRTC AI VRTC Backup Power

D8 STAT_LED AO Status indicator led OD

G1 CHARGE AI Charger input Power

G2 CHARGE AI Charger input Power

J5 ON_OFF* I Input command for switching power ON or

OFF (toggle command). Pull up to

VBATT

D5 VAUX1 AO Power output for external accessories Power

L8 PWRMON O Power ON Monitor CMOS

2.8V

L4 Antenna O Antenna output – 50 ohm RF

D7 DVI2_CLK - DVI2_CLK (Digital Voice Interface) CMOS

2.8V

GPIO

G4 TGPIO_12 I/O GPIO12 Configurable GPIO Pull Up CMOS

2.8V

C2 TGPIO_03 I/O GPIO03 Configurable GPIO Pull Down CMOS

2.8V

B3 TGPIO_04 I/O

GPIO04 Configurable GPIO / RF

Transmission Control Pull Down CMOS

2.8V

C3 TGPIO_20 I/O GPIO20 Configurable GPIO Pull Down CMOS

2.8V

B4 TGPIO_14 I/O GPIO14 Configurable GPIO Pull Up CMOS

2.8V

D1 TGPIO_11 I/O GPIO11 Configurable GPIO Pull Down CMOS

2.8V

B1 TGPIO_19 I/O GPIO19 Configurable GPIO Pull Up CMOS

2.8V

C1 TGPIO_01 I/O GPIO01 Configurable GPIO Pull Down CMOS

2.8V

K7 TGPIO_18 I/O

GPIO18 Configurable GPIO/ DVI2_RX

(Digital Voice Interface) Pull Up CMOS

2.8V

H5 TGPIO_17 I/O

GPIO17 Configurable GPIO /

DVI2_WA(Digital Voice Interface) Pull Up CMOS

2.8V

F5 TGPIO_15 I/O GPIO15 Configurable GPIO Pull Up CMOS

2.8V

K11 TGPIO_08 I/O GPIO08 Configurable GPIO Pull Down CMOS

2.8V

B5 TGPIO_06 /

ALARM I/O GPIO06 Configurable GPIO / ALARM Pull Down CMOS

2.8V

C9 TGPIO_09 I/O GPIO09 GPIO I/O pin Pull Up CMOS

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2.8V

E6 TGPIO_02 /

JDR I/O GPIO02 I/O pin Pull Down CMOS

2.8V

L9 TGPIO_07 /

BUZZER I/O GPIO07 Configurable GPIO / Buzzer Pull Down CMOS

2.8V

K10 TGPIO_13 I/O GPIO13 Configurable GPIO Pull Up CMOS

2.8V

K8 TGPIO_05 /

RFTXMON

I/O

GPIO05 Configurable GPIO / Transmitter

ON monitor Pull Down CMOS

2.8V

L10 TGPIO_21 I/O GPIO21 Configurable GPIO Pull Down CMOS

2.8V

E8 TGPIO_22 I/O GPIO22 Configurable GPIO Pull Up CMOS

2.8V

H3 TGPIO_10 I/O

GPIO10 Configurable GPIO / DVI2_TX

(Digital Voice Interface) Pull Up CMOS

2.8V

Power Supply

J1 VBATT - Main power supply Power

K1 VBATT - Main power supply Power

J2 VBATT - Main power supply Power

K2 VBATT - Main power supply Power

A1 GND - Ground Power

F1 GND - Ground Power

H1 GND - Ground Power

L1 GND - Ground Power

H2 GND - Ground Power

L2 GND - Ground Power

J3 GND - Ground Power

K3 GND - Ground Power

L3 GND - Ground Power

K4 GND - Ground Power

K5 GND - Ground Power

D6 GND - Ground Power

K6 GND - Ground Power

L6 GND - Ground Power

A11 GND - Ground Power

F11 GND - Ground Power

L11 GND - Ground Power

Reserved Pins

C4 -

C6 -

C5 -

C8 -

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D2 -

D3 -

A10 -

A3 -

A4 -

A5 -

A6 -

A7 -

A8 -

A9 -

B10 -

B11 -

B2 -

B8 -

B9 -

E1 -

E10 -

E3 -

E4 -

F2 -

F3 -

F4 -

F8 -

G5 -

G3 -

G6 -

G7 -

H4 -

H7 -

J4 -

J6 -

J7 -

K9 -

L5 -

E5 -

L7 -

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3 Module application description

3.1 Power supply

3.3.1 Requirement

 Input power voltage range: 3.6~4.2V;

 Max Current: 2A;

 Internal resistance<180mΩ

3.3.2 Power up sequence

Insert battery-> Pull down ON_OFF signal and hold more than 3 seconds-> start the module.

3.3.3 Power up mode

This module can be started by 3 ways:

 Press ON_OFF signal;

 Plug in charger and the module is auto started ;

 Start by RTC

3.2 RF Antenna

 Impedance of Signal connected to RF antenna pin should be 50ohm;

 GND pins around RF antenna output pad should be well connected to mother board. It help to control impedance

and conducted hot from PA

 The line connected to module’s RF antenna pad on the mother board should be routed as a strip line to help

controlling EMC and preventing the impendence acutely change

 Pads of no connect define could be connected to GND to improve RF performances

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Figure4 – RF antenna Pad

3.3 Design rule for EMC

 Please connect GND pins directly to motherboard GND, don’t through via or line;

 Connect line between module power pins and battery connector on motherboard should be short and wide;

 Add a 22uF and a 22pF capacitor close to battery connector;

 Add a 1uF、a 100nF and a 22pF capacitor on charger connector.

3.4 Design rule for ESD

 Add a zener Diode (ON SEMICON:NZL5V6ATT1G) at VBATT input port on motherboard;

 Add a 1uF/16V capacitor at VCHG input port on motherboard;

 Add TVS components on all audio channels.

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3.5 UART port and application

GM601 possesses of two UART ports: UART1 and UART2

3.5.1 UART function and parameter

UART1 function and parameter

PORT Wires used Baud

rate(bps)

Word length(bit) Parity Check Hardware

flow control

Function

UART1 RS232C 3-Wires 115200 8 No No Software

download and

debug

UART2 RS232C 9-wires 115200 8 No Yes Communication

with AP or PC

3.5.2 UART pin define

UART1 pin define (not include GND):

BGA Ball Name I/O Function Pull up/down Type

D11 TX_TRACE O Transmit data line Pull up CMOS 2.8V

F10 RX_TRACE I Receive data line Pull down CMOS 2.8V

UART2 pin define (not include GND):

BGA Ball Name I/O Function Pull up/down Type

E7 C103/TXD I DCE receive data line Pull up CMOS 2.8V

H8 C104/RXD O DCE transmit data line Pull up CMOS 2.8V

B7 C108/DTR I Data terminal ready(from DTE) Pull up CMOS 2.8V

F7 C105/RTS I Request to send (from DTE) Pull up CMOS 2.8V

F6 C106/CTS O Clear to send ( to DTE) Pull up CMOS 2.8V

D9 C109/DCD O Data carrier detect ( to DTE ) Pull up CMOS 2.8V

E11 C107/DSR O Data set ready ( to DTE) Pull up CMOS 2.8V

B6 C125/RING O Ring indicator (to DTE) Pull up CMOS 2.8V

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3.5.3 UART2 Typical application circuit

Figure 5 – UART2 typical application circuit 1

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Figure 6 – UART2 typical application circuit 1

3.6 Analogy Audio

GM601 provide 4 audio channels: one for handset microphone, one for handset receiver, one for headset

earphone, one for headset microphone.

3.6.1 Interface define

Figure7 – Analogy audio interface

Audio pin define as follow (not include GND):

BGA BALL Name I/O Function Pull up/down Type

H9 EAR_MT- O Headset single end right channel audio

G10 EAR_MT+ O Headset single end left channel audio

H10 EAR_HF+ O Handset ear output, phase+ audio

J10 EAR_HF- O Handset ear output, phase- audio

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J8 MIC_MT+ I Headset MIC. signal input: phase+ audio

G9 MIC_MT- I Headset MIC. signal input: phase- audio

G8 MIC_HF+ I Handset MIC. Input: phase+ audio

J9 MIC_HF- I Handset MIC. Input: phase- audio

3.6.2 Electro-acoustic devices reference specification

We list the reference specification for engineers to choice electro-acoustic for GM601 module.

3.6.2.1 Stereo earphone

3.6.2.2 Handset receiver

Symbol Parameter Min Typical Max Unit

SINAD Signal to Noise and Distortion Ratio

Input Level: -40dBm0

Input Level: 0 dBm0

RLOAD Output Resistor Load (Differential) 28 Ω

CLOAD Output capacitor load 200 pF

ICN Idle channel noise of transmit path -67 dBm0

XT Crosstalk level on transmit path -66 dBm0

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3.6.2.3 Earphone microphone and handset microphone

3.7 SIM interface description and application

3.7.1 SIM interface define

SIM interface include 4 signals: SIMVCC，SIMRST，SIMCLK，SIMIO。Additionally, we define SIMIN

to indicate the SIM card’s inserting (low active)

SIM interface support 1.8V and 3V voltage and is auto identified according to SIM type.

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3.7.2 SIM interface reference application circuit

Figure 8 – SIM interface reference circuit

Note: recommend adding ESD components on every SIM signals.

3.7.3 Design recommendation

 add ESD components on every SIM signals

 SIMCLK is a 3.25MHZ clock signal and should be carefully treated with.

3.8 GPIO description and application

GPIOs (General Purpose I/Os) in GM601 are supplied by 2.8V voltage. GPIOs can be defined as input or

output mode and also can be multiplexed with other functionalities to reduce the pin number.

3.8.1 GPIO description

Reference to chapter 2.2 description about GPIOs

3.8.2 GPIO electrical characteristics

3.8.2.1 GPIO electrical characteristic correspond to CPU port

Signal CPU port Driving (mA) Pull PU/PD resistor (Kohm)

(Min, typical, max) Cin (pF)

TGPIO_12 GPIO1 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_03 GPIO2 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_04 GPIO3 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_20 GPIO4 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_14 GPIO5 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_11 GPIO6 max 16, min 2 PD 40, 75, 190 5.2

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TGPIO_19 GPIO7 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_01 GPIO11 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_18 GPIO17 6 PU 40, 75, 190 5.2

TGPIO_17 GPIO19 6 PU 40, 75, 190 5.2

TGPIO_15 GPIO18 6 PU 40, 75, 190 5.2

TGPIO_08 GPIO8 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_06 GPIO24 4 PD 40, 75, 190 5.2

TGPIO_09 GPIO9 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_02 GPIO10 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_07 GPIO28 2 PU 40, 75, 190 5.2

TGPIO_16

TGPIO_13 GPIO13 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_05 GPIO12 max 16, min 2 PD 40, 75, 190 5.2

TGPIO_21 GPIO25 4 PD 40, 75, 190 5.2

TGPIO_22 GPIO22 2 PU 5.2

TGPIO_10 GPIO16 6 PD 40, 75, 190 5.2

3.8.2.2 GPIO Absolute Maximum Ratings

Item Symbol Min Max Unit

IO power supply VDD33 -0.3 VDD33+0.3 V

IO Input voltage VDD33I -0.3 VDD33+0.3 V

Operating temperature Topr -20 80 Celsius

Storage temperature Tstg -55 125 Celsius

Remark: VDD33=2.8V

3.8.2.3 GPIO logic level ratings

Levels Min Max Unit

Input low level - 0.8 V

Input high level 2.0 - V

Output low level - 0.4 V

Output high level 2.4 - V

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3.9 Mounting the GM601 on the Board

3.9.1 General

The GM601 modules have been designed in order to be compliant with a standard lead-free SMT

process.

3.9.2 Module finish& Dimensions

Figure 9 –Module finish&Dimensions

3.9.3 Suggest Inhibit Area

In order to easily rework the GM601 is suggested to consider on the application a 1.5mm inhibit area

around the module.

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Figure 10 –Suggest Inhibit Area

3.9.4 Debug of the GM601 in Production

To test and debug the mounting of the GM601, we strongly recommend to foreseen test pads on the

host PCB, in order to check the connection between the GM601 itself and the application and to test the performance of

the module connecting it with an external computer. Depending by the customer application, these pads include, but are

not limited to the following signals:

 • TXD

 • RXD

 • ON/OFF

 • RESET

 • GND

 • VBATT

 • TX_TRACE

 • RX_TRACE

 • PWRMON

3.9.5 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a

thickness of stencil foil ≥ 120μm.

3.9.6 PCB Pad Design

Non solder mask defined type is recommended for the solder pads on the PCB.

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Figure 11 –PCB pad design

Recommendation for PCB pad dimensions:

Ball pitch(mm) 2.5

Solder resist opening diameter A (mm) 1.150

Metal pad diameter B (mm) 1+/-0.05

It is recommended no microvia without solder resist cover under the module and no microvia around the pads

(see following figure):

Figure 12 –microvia without solder resist cover area

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer thickness(um) Properties

Electro-less Ni/Immersion Au 3-7/0.05-0.15 Good solder ability protection, high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.

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3.9.7 Solder Paste

Lead free

Solder paste Sn/Ag/Cu

3.9.8 Solder Reflow

Recommend classification reflow profile:

Figure13 – Classification Reflow Profile

Table 4-1

Notes:

Parameters requirement described is only suitable for lead-free process.

Lead-free process means：Use Lead-free alloy Solder paste (for example 95.5Sn3.0Ag0.5Cu) .

All temperature refers to top side of the package. Measured on the package body surface:

Peak temperature C1 235℃~255℃

Time above 220℃ T1 30~75s

Time between 50℃ and 100℃ T2 >16s

Time between 220℃ and 235℃ T3 >5s

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4 RF Exposure Information

This device meets the government’s requirements for exposure to radio waves.

This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF)

energy set by the Federal Communications Commission of the U.S. Government.

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid

the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less

than 20cm (8 inches) during normal operation.

Maximum antenna gain allowed for use with this device is GSM850 3.8 dBi,GSM1900 2.4 dBi.

When the module is installed in the host device, the FCC ID label must be visible through a window on the final device

or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on

the outside of the final device that contains the following text: “Contains FCC ID: LEAUNIGM601”

Unication Co UNIGM601 GSM Module User Manual GM601 module V1 0

Unication Co Ltd GSM Module GM601 module V1 0

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