Unication Co UNIGM601 GSM Module User Manual GM601 module V1 0

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盟訊實業股份有限公司
機密等級：□極機密 ■機密 □普通
Unication CO., LTD.
GM601 Module User Manual
Rev: V1.0
FCC Regulations:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
Notice
The changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
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Contents
Introduction .............................................................................................................................................................. 4
1.1
Revision History............................................................................................................................................ 4
1.2
Purpose .......................................................................................................................................................... 4
1.3
Scope .............................................................................................................................................................. 4
1.4
Target audience ............................................................................................................................................. 4
1.5
Abbreviations ................................................................................................................................................ 4
1.6
Related documents........................................................................................................................................ 5
GM601 Module introduction ................................................................................................................................... 5
2.1
Key feature .................................................................................................................................................... 5
2.2
Application diagram..................................................................................................................................... 6
2.3
Package information..................................................................................................................................... 7
2.4
Pin define and description............................................................................................................................ 8
Module application description ............................................................................................................................. 12
3.1
Power supply ................................................................................................................................................ 12
3.3.1
Requirement...................................................................................................................................... 12
3.3.2
Power up sequence............................................................................................................................ 12
3.3.3
Power up mode ................................................................................................................................. 12
3.2
RF Antenna ................................................................................................................................................... 12
3.3
Design rule for EMC .................................................................................................................................... 13
3.4
Design rule for ESD...................................................................................................................................... 13
3.5
UART port and application........................................................................................................................... 14
3.5.1
UART function and parameter.......................................................................................................... 14
3.5.2
UART pin define............................................................................................................................... 14
3.5.3
UART2 Typical application circuit ................................................................................................... 15
3.6
Analogy Audio.............................................................................................................................................. 16
3.6.1
Interface define ................................................................................................................................. 16
3.6.2
Electro-acoustic devices reference specification .............................................................................. 17
3.7
SIM interface description and application .................................................................................................... 18
3.7.1
SIM interface define ......................................................................................................................... 18
SIM interface reference application circuit....................................................................................... 19
3.7.2
3.7.3
Design recommendation ................................................................................................................... 19
3.8
GPIO description and application................................................................................................................. 19
3.8.1
GPIO description ............................................................................................................................ 19
3.8.2
GPIO electrical characteristics...................................................................................................... 19
3.9
Mounting the GM601 on the Board.............................................................................................................. 21
3.9.1
General............................................................................................................................................. 21
3.9.2
Module finish& Dimensions........................................................................................................... 21
3.9.3
Suggest Inhibit Area ....................................................................................................................... 21
3.9.4
Debug of the GM601 in Production .............................................................................................. 22
3.9.5
Stencil............................................................................................................................................... 22
3.9.6
PCB Pad Design .............................................................................................................................. 22
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3.9.7
Solder Paste ..................................................................................................................................... 24
3.9.8
Solder Reflow .................................................................................................................................. 24
RF Exposure Information ...................................................................................................................................... 25
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1 Introduction
1.1 Revision History
Revision
Date
Description
1.0
2010-6-9
Initial release
1.2 Purpose
This document describes the product design and specification for GM601. GM601 supports GSM/GPRS quad-band
(GSM850, EGSM900, DCS1800, and PCS1900).
1.3 Scope
This document describes: the platform architecture, the hardware/software interactions, Technical/Electrical
specifications.
1.4 Target audience
This document is intended to provide a design specification for the teams involved in and an introduction to the
platform for product integration teams.
1.5 Abbreviations
PPP
Point-to-Point protocol
PSU
Power Supply Unit
R&TTE
Radio and Telecommunication Terminal Equipment
RAM
Random Access Memory
SRAM
Static Random Access Memory
NAND
Not AND (electronic logic gate)
ROM
Read-Only Memory
RMS
Root Mean Square(value)
RTC
Real Time Clock
Rx
Receive Direction
Tx
Transmit Direction
SAR
Specific Absorption Rate
SIM
Subscriber Identity Module
SMS
Short Message Service
TA
Terminal Adapter(e.g. GSM engine)
TDMA
Time Division Multiple Access
TE
Terminal Equipment, also referred to as DTE
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UART
Universal Asynchronous Receiver-Transmitter
VSWR
Voltage Standing Wave Radio
GPRS
General Packet Radio Service
FR
Full Rate
EFR
Enhanced Full Rate
HR
Half Rate
AP
Applications Processor
BB
Baseband
IMEI
International Mobile Equipment Identity
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1.6 Related documents
[1] AT_Command_Set_For_GM601_V1.0
[2] GM601_module_BOM_V1.0
[3] GM601_module_EVB_User_Manual_V10
[4] Operation Description of GM601 Module_V1.0
2 GM601 Module introduction
2.1 Key feature
GM601 is a self-contained GSM/GPRS quad-band（850/900/1800/1900） module including the following feature:
Feature
Implementation
Power supply
Single supply voltage:3.6~4.2V
Power saving
Typical power consumption in SLEEP mode less than 2.5mA(BS-PA-MFRMS=5)
Frequency bands


GSM class
Small MS
Transmitting power


Class 4 (2W) at GSM850, EGSM900
Class 1(1W) at DCS1800, PCS1900
GPRS connectivity

GPRS Class 12 capability：UL: 53.6 kbps/DL: 53.6 k

Coding Scheme 1 – 4

Mobile station Class B



Normal operation: -10℃~+55℃；
Restricted operation: -20℃~-10℃ and +55℃ ~ +65℃
Storage:-30℃ to 85℃
Temperature range
Audio interface


GM601 quad-band: GSM850,EGSM900,DCS1800,PCS1900
Compliant to GSM phase 2/2+
Two groups of analog audio interfaces；
one digital audio interface(DAI)
Firmware upgrade
Firmware upgraded over serial interface
Real Time Clock
Implemented
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Assemblage
Connected to mother board Through BGA balls
Application interface
Use BGA balls as application interface:
 Power supply
 Serial links(UART1,UART2)
 SIM interface: 1.8V/3V
 EINT/ADC
 Power key /Reset
 GPIO
 Status LED driver output
Antenna interface


BGA ball
Antenna PAD
2.2 Application diagram
Figure 1 – Application Diagram
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2.3 Package information
Figure2 – package and size
Figure3 - GM601 Side view of Package
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2.4 Pin define and description
Ball
Signal
I/O
Function
Pull
Up/Down
Type
UART Interface
E7
C103/TXD
Serial data input (TXD) from DTE
CMOS 2.8V
H8
C104/RXD
Serial data output to DTE
CMOS 2.8V
B7
C108/DTR
Input for Data terminal ready signal (DTR) from DTE
CMOS 2.8V
F7
C105/RTS
Input for Request to send signal (RTS) from DTE
CMOS 2.8V
F6
C106/CTS
Output for Clear to send signal (CTS) to DTE
CMOS 2.8V
D9
C109/DCD
Output for Data carrier detect signal (DCD) to DTE
CMOS 2.8V
E11
C107/DSR
Output for Data set ready signal (DSR) to DTE
CMOS 2.8V
B6
C125/RING
Output for Ring indicator signal (RI) to DTE
CMOS 2.8V
SIM card interface
C10
SIMCLK
External SIM signal – Clock
1,8 / 3V
E9
SIMRST
External SIM signal – Reset
1,8 / 3V
D10
SIMIO
I/O
External SIM signal – Data I/O
1,8 / 3V
E11
SIMIN
External SIM signal – Presence (active low)
1,8 / 3V
D4
SIMVCC
AO
External SIM signal – Power supply for the
SIM
1,8 / 3V
Debug Interface
D11
TX_TRACE
TX Data for debug monitor
F10
RX_TRACE
RX Data for debug monitor
CMOS
2.8V
CMOS
2.8V
Audio Interface
H9
EAR_MT-
Headset single end right channel
audio
G10
EAR_MT+
Headset single end left channel
audio
H10
EAR_HF+
Handset ear output, phase+
audio
J10
EAR_HF-
Handset ear output, phase-
audio
J8
MIC_MT+
Headset MIC. signal input: phase+
audio
G9
MIC_MT-
Headset MIC. signal input: phase-
audio
G8
MIC_HF+
Handset MIC. Input: phase+
audio
J9
MIC_HF-
Handset MIC. Input: phase-
audio
F9
AXE
Handset switching
CMOS
2.8V
DAC and ADC
C7
NC
AO
No defined
J11
ADC_IN1
AI
Analog/Digital converter input
A/D
H11
ADC_IN2
AI
Analog/Digital converter input
A/D
G11
ADC_IN3
AI
Analog/Digital converter input
A/D
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Miscellaneous Functions
A2
RESET*
Reset input
Power
E2
VRTC
AI
VRTC Backup
Power
D8
STAT_LED
AO
Status indicator led
G1
CHARGE
AI
Charger input
Power
G2
CHARGE
AI
Charger input
Power
J5
ON_OFF*
D5
VAUX1
AO
L8
PWRMON
Power ON Monitor
L4
Antenna
Antenna output – 50 ohm
D7
DVI2_CLK
DVI2_CLK (Digital Voice Interface)
OD
Input command for switching power ON or
Pull up to
OFF (toggle command).
VBATT
Power output for external accessories
Power
CMOS
2.8V
RF
CMOS
2.8V
GPIO
G4
TGPIO_12
I/O
GPIO12 Configurable GPIO
Pull Up
C2
TGPIO_03
I/O
GPIO03 Configurable GPIO
Pull Down
B3
TGPIO_04
I/O
C3
TGPIO_20
I/O
GPIO20 Configurable GPIO
Pull Down
B4
TGPIO_14
I/O
GPIO14 Configurable GPIO
Pull Up
D1
TGPIO_11
I/O
GPIO11 Configurable GPIO
Pull Down
B1
TGPIO_19
I/O
GPIO19 Configurable GPIO
Pull Up
C1
TGPIO_01
I/O
GPIO01 Configurable GPIO
Pull Down
K7
TGPIO_18
I/O
H5
TGPIO_17
I/O
F5
TGPIO_15
I/O
GPIO15 Configurable GPIO
Pull Up
K11
TGPIO_08
I/O
GPIO08 Configurable GPIO
Pull Down
I/O
GPIO06 Configurable GPIO / ALARM
Pull Down
I/O
GPIO09 GPIO I/O pin
B5
C9
TGPIO_06 /
ALARM
TGPIO_09
GPIO04 Configurable GPIO / RF
Transmission Control
GPIO18 Configurable GPIO/ DVI2_RX
(Digital Voice Interface)
GPIO17 Configurable GPIO /
DVI2_WA(Digital Voice Interface)
Pull Down
Pull Up
Pull Up
Pull Up
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
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2.8V
E6
L9
K10
K8
TGPIO_02 /
JDR
TGPIO_07 /
BUZZER
TGPIO_13
I/O
GPIO02 I/O pin
Pull Down
I/O
GPIO07 Configurable GPIO / Buzzer
Pull Down
I/O
GPIO13 Configurable GPIO
TGPIO_05 /
GPIO05 Configurable GPIO / Transmitter
Pull Up
Pull Down
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
RFTXMON
I/O
ON monitor
L10
TGPIO_21
I/O
GPIO21 Configurable GPIO
Pull Down
E8
TGPIO_22
I/O
GPIO22 Configurable GPIO
Pull Up
H3
TGPIO_10
I/O
J1
VBATT
Main power supply
Power
K1
VBATT
Main power supply
Power
J2
VBATT
Main power supply
Power
K2
VBATT
Main power supply
Power
A1
GND
Ground
Power
F1
GND
Ground
Power
H1
GND
Ground
Power
L1
GND
Ground
Power
H2
GND
Ground
Power
L2
GND
Ground
Power
J3
GND
Ground
Power
K3
GND
Ground
Power
L3
GND
Ground
Power
K4
GND
Ground
Power
K5
GND
Ground
Power
D6
GND
Ground
Power
K6
GND
Ground
Power
L6
GND
Ground
Power
A11
GND
Ground
Power
F11
GND
Ground
Power
L11
GND
Ground
Power
GPIO10 Configurable GPIO / DVI2_TX
(Digital Voice Interface)
Pull Up
2.8V
CMOS
2.8V
CMOS
2.8V
CMOS
2.8V
Power Supply
Reserved Pins
C4
C6
C5
C8
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D2
D3
A10
A3
A4
A5
A6
A7
A8
A9
B10
B11
B2
B8
B9
E1
E10
E3
E4
F2
F3
F4
F8
G5
G3
G6
G7
H4
H7
J4
J6
J7
K9
L5
E5
L7
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H6
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Module application description
3.1
Power supply
3.3.1 Requirement



Input power voltage range: 3.6~4.2V;
Max Current: 2A;
Internal resistance<180mΩ
3.3.2 Power up sequence
Insert battery-> Pull down ON_OFF signal and hold more than 3 seconds-> start the module.
3.3.3 Power up mode



This module can be started by 3 ways:
Press ON_OFF signal;
Plug in charger and the module is auto started ;
Start by RTC
3.2




RF Antenna
Impedance of Signal connected to RF antenna pin should be 50ohm;
GND pins around RF antenna output pad should be well connected to mother board. It help to control impedance
and conducted hot from PA
The line connected to module’s RF antenna pad on the mother board should be routed as a strip line to help
controlling EMC and preventing the impendence acutely change
Pads of no connect define could be connected to GND to improve RF performances
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Figure4 – RF antenna Pad
3.3




3.4



Design rule for EMC
Please connect GND pins directly to motherboard GND, don’t through via or line;
Connect line between module power pins and battery connector on motherboard should be short and wide;
Add a 22uF and a 22pF capacitor close to battery connector;
Add a 1uF、a 100nF and a 22pF capacitor on charger connector.
Design rule for ESD
Add a zener Diode (ON SEMICON:NZL5V6ATT1G) at VBATT input port on motherboard;
Add a 1uF/16V capacitor at VCHG input port on motherboard;
Add TVS components on all audio channels.
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3.5
UART port and application
GM601 possesses of two UART ports: UART1 and UART2
3.5.1 UART function and parameter
UART1 function and parameter
PORT
Wires used
Baud
rate(bps)
Word length(bit)
Parity Check
Hardware
flow control
Function
UART1
RS232C 3-Wires
115200
No
No
Software
download
debug
UART2
RS232C 9-wires
115200
No
Yes
and
Communication
with AP or PC
3.5.2 UART pin define
UART1 pin define (not include GND):
BGA Ball
Name
I/O
Function
Pull up/down
Type
D11
TX_TRACE
Transmit data line
Pull up
CMOS 2.8V
F10
RX_TRACE
Receive data line
Pull down
CMOS 2.8V
UART2 pin define (not include GND):
BGA Ball
Name
I/O
Function
Pull up/down
Type
E7
C103/TXD
DCE receive data line
Pull up
CMOS 2.8V
H8
C104/RXD
DCE transmit data line
Pull up
CMOS 2.8V
B7
C108/DTR
Data terminal ready(from DTE)
Pull up
CMOS 2.8V
F7
C105/RTS
Request to send (from DTE)
Pull up
CMOS 2.8V
F6
C106/CTS
Clear to send ( to DTE)
Pull up
CMOS 2.8V
D9
C109/DCD
Data carrier detect ( to DTE )
Pull up
CMOS 2.8V
E11
C107/DSR
Data set ready ( to DTE)
Pull up
CMOS 2.8V
B6
C125/RING
Ring indicator (to DTE)
Pull up
CMOS 2.8V
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3.5.3 UART2 Typical application circuit
Figure 5 – UART2 typical application circuit 1
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Figure 6 – UART2 typical application circuit 1
3.6
Analogy Audio
GM601 provide 4 audio channels: one for handset microphone, one for handset receiver, one for headset
earphone, one for headset microphone.
3.6.1 Interface define
Figure7 – Analogy audio interface
Audio pin define as follow (not include GND):
BGA BALL
Name
I/O
Function
Pull up/down
Type
H9
EAR_MT-
Headset single end right channel
audio
G10
EAR_MT+
Headset single end left channel
audio
H10
EAR_HF+
Handset ear output, phase+
audio
J10
EAR_HF-
Handset ear output, phase-
audio
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J8
MIC_MT+
Headset MIC. signal input: phase+
audio
G9
MIC_MT-
Headset MIC. signal input: phase-
audio
G8
MIC_HF+
Handset MIC. Input: phase+
audio
J9
MIC_HF-
Handset MIC. Input: phase-
audio
3.6.2 Electro-acoustic devices reference specification
We list the reference specification for engineers to choice electro-acoustic for GM601 module.
3.6.2.1 Stereo earphone
3.6.2.2 Handset receiver
Symbol
Parameter
Min
Typical
Max
Unit
SINAD
Signal to Noise and Distortion Ratio
Input Level: -40dBm0
Input Level: 0 dBm0
29
RLOAD
Output Resistor Load (Differential)
28
CLOAD
Output capacitor load
200
pF
ICN
Idle channel noise of transmit path
-67
dBm0
XT
Crosstalk level on transmit path
-66
dBm0
dB
dB
69
Ω
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3.6.2.3 Earphone microphone and handset microphone
3.7
SIM interface description and application
3.7.1 SIM interface define
SIM interface include 4 signals: SIMVCC，SIMRST，SIMCLK，SIMIO。Additionally, we define SIMIN
to indicate the SIM card’s inserting (low active)
SIM interface support 1.8V and 3V voltage and is auto identified according to SIM type.
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3.7.2 SIM interface reference application circuit
Figure 8 – SIM interface reference circuit
Note: recommend adding ESD components on every SIM signals.
3.7.3 Design recommendation


3.8
add ESD components on every SIM signals
SIMCLK is a 3.25MHZ clock signal and should be carefully treated with.
GPIO description and application
GPIOs (General Purpose I/Os) in GM601 are supplied by 2.8V voltage. GPIOs can be defined as input or
output mode and also can be multiplexed with other functionalities to reduce the pin number.
3.8.1 GPIO description
Reference to chapter 2.2 description about GPIOs
3.8.2 GPIO electrical characteristics
3.8.2.1 GPIO electrical characteristic correspond to CPU port
PU/PD resistor (Kohm)
Signal
CPU port
Driving (mA)
Pull
TGPIO_12
GPIO1
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_03
GPIO2
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_04
GPIO3
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_20
GPIO4
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_14
GPIO5
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_11
GPIO6
max 16, min 2
PD
40, 75, 190
5.2
(Min, typical, max)
Cin (pF)
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TGPIO_19
GPIO7
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_01
GPIO11
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_18
GPIO17
PU
40, 75, 190
5.2
TGPIO_17
GPIO19
PU
40, 75, 190
5.2
TGPIO_15
GPIO18
PU
40, 75, 190
5.2
TGPIO_08
GPIO8
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_06
GPIO24
PD
40, 75, 190
5.2
TGPIO_09
GPIO9
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_02
GPIO10
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_07
GPIO28
PU
40, 75, 190
5.2
TGPIO_13
GPIO13
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_05
GPIO12
max 16, min 2
PD
40, 75, 190
5.2
TGPIO_21
GPIO25
PD
40, 75, 190
5.2
TGPIO_22
GPIO22
PU
TGPIO_10
GPIO16
PD
TGPIO_16
5.2
40, 75, 190
5.2
3.8.2.2 GPIO Absolute Maximum Ratings
Item
Symbol
Min
Max
Unit
IO power supply
VDD33
-0.3
VDD33+0.3
IO Input voltage
VDD33I
-0.3
VDD33+0.3
Operating temperature
Topr
-20
80
Celsius
Storage temperature
Tstg
-55
125
Celsius
Remark: VDD33=2.8V
3.8.2.3 GPIO logic level ratings
Levels
Min
Max
Unit
Input low level
0.8
Input high level
2.0
Output low level
0.4
Output high level
2.4
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3.9 Mounting the GM601 on the Board
3.9.1
General
The GM601 modules have been designed in order to be compliant with a standard lead-free SMT
process.
3.9.2
Module finish& Dimensions
Figure 9 –Module finish&Dimensions
3.9.3
Suggest Inhibit Area
In order to easily rework the GM601 is suggested to consider on the application a 1.5mm inhibit area
around the module.
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Figure 10 –Suggest Inhibit Area
3.9.4
Debug of the GM601 in Production
To test and debug the mounting of the GM601, we strongly recommend to foreseen test pads on the
host PCB, in order to check the connection between the GM601 itself and the application and to test the performance of
the module connecting it with an external computer. Depending by the customer application, these pads include, but are
not limited to the following signals:
 • TXD
 • RXD
 • ON/OFF
 • RESET
 • GND
 • VBATT
 • TX_TRACE
 • RX_TRACE
 • PWRMON
3.9.5
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120μm.
PCB Pad Design
3.9.6
Non solder mask defined type is recommended for the solder pads on the PCB.
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Figure 11 –PCB pad design
Recommendation for PCB pad dimensions:
Ball pitch(mm)
2.5
Solder resist opening diameter A (mm)
1.150
Metal pad diameter B (mm)
1+/-0.05
It is recommended no microvia without solder resist cover under the module and no microvia around the pads
(see following figure):
Figure 12 –microvia without solder resist cover area
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness(um)
Properties
Electro-less Ni/Immersion Au
3-7/0.05-0.15
Good solder ability protection, high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.
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3.9.7
Solder Paste
Lead free
Solder paste
3.9.8
Sn/Ag/Cu
Solder Reflow
Recommend classification reflow profile:
Figure13 – Classification Reflow Profile
Table 4-1
Notes:
Parameters requirement described is only suitable for lead-free process.
Lead-free process means：Use Lead-free alloy Solder paste (for example 95.5Sn3.0Ag0.5Cu) .
All temperature refers to top side of the package. Measured on the package body surface:
Peak temperature C1
235℃~255℃
Time above 220℃ T1
30~75s
Time between 50℃ and 100℃ T2
>16s
Time between 220℃ and 235℃ T3
>5s
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RF Exposure Information
This device meets the government’s requirements for exposure to radio waves.
This device is designed and manufactured not to exceed the emission limits for exposure to radio frequency (RF)
energy set by the Federal Communications Commission of the U.S. Government.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid
the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less
than 20cm (8 inches) during normal operation.
Maximum antenna gain allowed for use with this device is GSM850 3.8 dBi,GSM1900 2.4 dBi.
When the module is installed in the host device, the FCC ID label must be visible through a window on the final device
or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on
the outside of the final device that contains the following text: “Contains FCC ID: LEAUNIGM601”
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