Wistron NeWeb UMC-6055Q module User Manual HiLo3G technical specification
Wistron NeWeb Corporation module HiLo3G technical specification
Users Manual
Product specification
1
Wistron NeWeb Corp.
CONFIDENTIAL
THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION, WHICH IS THE PROPERTY OF
THE WISTRON NEWEB CORPORATION AND SHALL NOT BE DISCLOSED TO OTHERS IN WHOLE OR IN
PART, REPRODUCED, COPIED, OR USED AS THE BASIS FOR DESIGN, MANUFACTURING, OR SALE OF
APPARATUS WITHOUT WRITTEN PERMISSION OF WISTRON NEWEB CORPORATION.
UMC-6055QV
User Guide
Product specification
2
CONTENTS
CONTENTS .......................................................................................................................................................................... 2
1. INTRODUCTION ...................................................................................................................................................... 3
1.1 PRODUCT CONCEPT ........................................................................................................................................ 3
1.2 STANDARDS ....................................................................................................................................................... 3
1.3 TERMS AND ABBREVIATION ......................................................................................................................... 4
1.4 CONVENTIONS ................................................................................................................................................... 4
1.5 PRODUCT FEATURES OVERVIEW ............................................................................................................... 4
2. BLOCK DIAGRAM & PIN ASSIGNMENT ........................................................................................................... 7
3. RF AIR INTERFACES AND PERFORMANCE ................................................................................................ 14
3.1 RF AIR INTERFACE AND BAND CONFIGURATION ................................................................................ 14
3.1.1 Air interfaces ............................................................................................................................................. 14
3.2 RF PERFORMANCE ......................................................................................................................................... 14
3.3 TRANSMITTER POWER CLASS ................................................................................................................... 14
4. OPERATING CONDITIONS ................................................................................................................................ 15
4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 15
4.2 RECOMMENDED OPERATING CONDITION .............................................................................................. 16
5. CURRENT CONSUMPTION ................................................................................................................................ 17
6. APPLCATION DESIGN NOTES ......................................................................................................................... 18
6.1 LAYOUT NOTES .................................................................................................................................. 18
6.2 RF PIN INPUT IMPEDANCE MATCHING ........................................................................................... 18
6.3 HANDING REQUIREMENTS .......................................................................................................................... 18
6.4 SOLDING REQUIREMENTS ........................................................................................................................... 18
7. MECHANICAL REQUIREMENTS ...................................................................................................................... 20
7.1 MODULE DIMENSION AND FOOTPRINT.................................................................................................... 20
8. CERTIFICATION REQUIREMENTS ................................................................................................................ 22
8.1 CARRIER CERTIFICATION REQUIREMENTS ........................................................................................... 22
8.2 REGULATORY COMPLIANCE ..................................................................................................................... 22
8.3 FCC WARNING STATEMENT ........................................................................................................................ 22
Revision history
Revision
Date
Description
V1.0
April 7 2014
Initial release
V2.0
May 13 2014
Modify recommended operating condition
Product specification
3
1. INTRODUCTION
This document describes the hardware interface of the WNC Small Form Factor (SFF) module used to connect
the device application and the air interface.
Two versions of Small Form Factor (SFF) module are described in this specification document as follows:
UMC-6055QV - CDMA2000 1X
1.1 PRODUCT CONCEPT
The SFF module is one of the smallest available CDMA2000 1X modules of the market. The target application
is the Machine to Machine (M2M) market including automotive, AMM (Automatic Metering Management),
tracking system, Alarm, Healthcare/monitoring, Telematics etc. Despite its small size and cost,
In addition to its size it has the following outstanding characteristics:
Minimum low power consumption in idle mode: 1.4mA
High input voltage range: 3.4 V to 4.2 V
USB High Speed
Digital Audio PCM
Full set of AT commands as well as analogue and Digital audio interface.
In addition to the module, a complete development kit can be provided for customers.
1.2 STANDARDS
This product, together with its evaluation board, is in compliance with the directives and standards listed below:
Directives
FCC
RF : FCC Part 22H (850 Band )
FCC Part 24E (for 1900 Band)
FCC Part 22 Subpart H:
Cellular Radiotelephone Service; Subpart I: Offshore
Radiotelephone Service;
FCC Part 24 E: Personal Communications Service; Subpart E:
Broadband PCS.
EMI: FCC Part 15B
Subpart B - Radio frequency devices subpart B – Unintentional
Radiators
SAR(MPE) : OET65C
Product specification
4
1.3 TERMS AND ABBREVIATION
ADC Analog to Digital Converter
CODEC Coder-Decoder
CLIP Calling Line Identification Presentation
COLP Connected Line Identification Presentation
CLIR Calling Line Identification Restriction
COLR Connected Line Identification Restriction
CTS Clear To Send
CSD Circuit Switched Data
CS Codec Scheme
DSR Data Set Ready
ENS Enhanced network selection
EONS Enhanced operator name string
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FAX Facsimile
IC Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
I/O Input / Output
ISO International Standards Organization
ITU International Telecommunication Union
JTAG Joint Test Action Group
Kbps kilobit per second
LCD Liquid Crystal Display
LED Light Emitting Diode
Mbps Megabit per second
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCS Personal Communication System
PWM Pulse Width Modulation
RAM Random Access Memory
RF Radio Frequency
RI Ring Indication
RMS Root Mean Square
RTS Ready To Send
RX Reception
SMS Short Message Service
TBC To Be Confirmed
TBD To Be Defined
TX Transmission
UART Universal Asynchronous Receiver and Transmitter
USB Universal Serial Bus
USSD Unstructured Supplementary Service Data
1.4 CONVENTIONS
Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls
the module device by sending AT commands via its serial interface.
DCE (data communication equipment) indicates the module device.
1.5 PRODUCT FEATURES OVERVIEW
Temperature range
Operation Temperature: -25°C to +85°C
Storage: -40°C to +85°C
Weight
6 g (typ.)
ESD
ESD protection >= 2 kV
Product specification
5
Physical dimensions
22.1 x 25.1 x 2.65 mm (typical)
Connection
141 pin LGA type
Power supply
3.4V to 4.2V range, 3.8V nominal
Power consumption*
Off mode: 50 µA typical
Registered idle mode:
CDMA2000: 1.3 mA
Peak Current
CDMA2000: up to 700 mA
Antenna /RF interface
Both GPS and transmitter/receiver RF are LGA Pad.
Frequency bands
UMC-6055QV module supports
CDMA2000 BC0/BC1
Transmit power
Class 3 for CDMA2000 BC0/BC1
PWM
Signal for LED, vibrating device and Buzzer management is provided
on the PWM pin
Digital audio link
A digital audio interface PCM bus is provided. Master mode with 16
bits and a frequency of 2048 KHz.
Data/command multiplexing
Software management of data/command multiplexing on the serial
link UART.
USB
Supports USB High speed 480Mbps and full speed 12Mbps, with 3
logical Channels. Battery charging is achieved through USB
Module Hardware Configuration
The SFF LGA module will support the QSC6055 chipset with the configuration described below.
For UMC-6055QV module:
Key Features
• Compliant with 3GPP for CDMA 1xRTT
• Max. Data Rate : 153kbps FL; 153kbps RL
• Support OS: Brew Mobile Platform
• ARM9 operating at 192Mhz maximum frequency
• Data interface: USB2.0 Host High Speed
• Form Factor: LGA module
Specification
• Communication Interface: (I2C x1/UART x1/USB2.0 x1/SDIO x1)
• Supported SIM cards (3V and 1.8V SIM cards)
• General purpose I/O pins ( x25 )
• Audio Interface (PCM/ I2S)
• MCP (DDR 512Mb + 1Gb NAND)
• Support GPS
• RF interface: 2 RF pads for CDMA TX/RX, and GPS.
CDMA2000 Support Bands
• Band BC0
* The power consumption is highly dependent on the customer’s product design and the module environment.
Product specification
6
• Band BC1
Product specification
7
2. BLOCK DIAGRAM & PIN ASSIGNMENT
Pin Definition 4
This section is intended to capture the final LGA pin out for the SFF Module.
The interfaces with a SFF module are all through a 141-pin surface LGA pad, as shown in Figure 2-1.
Product specification
8
For UMC-6055QV module:
Figure 2-1: UMC-6055QV module
Product specification
9
Pin
number
Category
pin name
Pad
group
Pad
type
Description
Drivn
capacity
1
RF
CDMA_AN
T
AI,AO
CDMA antenna signal
2
GND
GND
GND
Ground.
3
GPIO
GPIO9
1.8V
I/O,
PD
Configurable I/O.
2-16mA
4
GPIO
GPIO2
1.8V
I/O,
PD
Configurable I/O.
2-16mA
5
GPIO
GPIO5
1.8V
I/O,
PD
Configurable I/O.
2-16mA
6
GPIO
GPIO8
1.8V
I/O,
PD
Configurable I/O.
2-16mA
7
I2C
I2C_SCL
1.8V
I/O
Serial bus clock.
8
PCM
PCM_BCLK
1.8V
DO
PCM clock for external
Bluetooth module.
9
PCM
PCM_SYNC
1.8V
DO
PCM sync to external Bluetooth
module.
10
PCM
PCM_DIN
1.8V
DI
PCM data from external
Bluetooth module.
11
PCM
PCM_DOU
T
1.8V
DO
PCM data to external Bluetooth
module.
12
GPIO
GPS_LNA_
EN
1.8V
I/O,
PU
Configurable I/O.
2-16mA
13
NC
14
NC
15
GND
GND
GND
Ground.
16
GND
GND
GND
Ground.
17
RF
GPS_ANT
AI
GPS antenna signal.
18
GND
GND
GND
Ground.
19
GPIO
GPIO21
1.8V
I/O,
PU
Configurable I/O.
2-16mA
20
GND
GND
GND
Ground.
21
GPIO
GPIO20
1.8V
I/O,
PU
Configurable I/O.
2-16mA
22
GPIO
GPIO16
1.8V
I/O,
PU
Configurable I/O.
2-16mA
23
GPIO
GPIO17
1.8V
I/O,
PU
Configurable I/O.
2-16mA
24
NC
25
NC
26
SDIO1
SDCC1_CM
D
2.6V
I/O
SD command.
2-8mA
27
SDIO1
SDCC1_DA
TA3
2.6V
I/O
SD data bit 3.
2-8mA
28
SDIO1
SDCC1_DA
2.6V
I/O
SD data bit 2.
2-8mA
Product specification
10
TA2
29
GPIO
GPIO10
1.8V
I/O,
PU
Configurable I/O.
2-16mA
30
GND
GND
GND
Ground.
31
SIM
USIM_CLK
1.8V/2.8
5V
DO
UIM clock.
32
NC
33
power
input/output
VBAT_BB
3.7V~4.
2V
P
Input power for BB section,
could connect this pin with
VBAT_RF.
voltage or as an analog output
that sources trickle-charging
current for the battery.
34
JTAG
JTAG_TMS
2.6V
DI, PU
Test mode select.
35
JTAG
JTAG_RTC
K
2.6V
DO
Return clock.
36
JTAG
JTAG_TCK
2.6V
DI, PU
Clock input.
37
SIM
USIM_DAT
1.8V/2.8
5V
I/O
UIM data.
38
power input
USB_VBUS
P
This pin is configured as an
analog input or an analog output,
depending upon the type of
peripheral device connected.
39
power output
USIM_VRE
G
1.8V/2.8
5V
P
RUIM circuits and interface.
150mA
40
GND
GND
GND
Ground.
41
GND
GND
GND
Ground.
42
NC
43
NC
44
power output
VREG_MS
ME1
1.8V
300m
A
EBI circuits and external
memory, pads.
45
GND
GND
GND
Ground.
46
power
input/output
VCOIN
P
Used as an analog input from the
3 V coin cell for SMPL, RTC,
and crystal oscillator backup.
47
GND
GND
GND
Ground.
48
ADC in
MPP3
AO
Multipurpose pin.
49
other
PON_REST
_N
1.8V
DO
logic low causes the baseband
circuits to reset.
50
GND
GND
GND
Ground.
51
ADC in
BATT_THE
RM
AI
Connect to battery package
thermal pin.
52
GND
GND
GND
Ground.
53
microphone
MIC_P
AI
Microphone #1 input (+).
54
microphone
MIC_M
AI
Microphone #1 input (-).
55
GND
GND
GND
Ground.
Product specification
11
56
GPIO
GPIO4
1.8V
I/O,
PD
Configurable I/O.
2-16mA
57
GPIO
GPIO6
1.8V
I/O,
PU
Configurable I/O.
2-16mA
58
GPIO
GPIO11
1.8V
I/O,
PD
Configurable I/O.
2-16mA
59
GPIO
GPIO24
1.8V
I/O,
PD
Configurable I/O.
2-16mA
60
GND
GND
GND
Ground.
61
GPIO
GPIO18
1.8V
I/O,
PD
Configurable I/O.
2-16mA
62
GPIO
GPIO15
1.8V
I/O,
PD
Configurable I/O.
2-16mA
63
GPIO
GPIO7
1.8V
I/O,
PD
Configurable I/O.
2-16mA
64
GPIO
GPIO1
1.8V
I/O,
PD
Configurable I/O.
2-16mA
65
I2C
I2C_SDA
1.8V
I/O
I2C serial bus data.
66
UART
UART_TX
1.8V
DO
UART1 bits: receive serial data
input.
67
UART
UART_RFR
1.8V
DO
UART Ready to receive flow.
68
UART
UART_RX
1.8V
DI
UART1 bits: receive serial data
input.
69
UART
UART_CTS
1.8V
DI
UART Clear to send flow.
70
power input
VBAT_RF
3.7V~4.
2V
P
Input power for RF section,
could connect this pin with
VBAT_BB.
71
power input
VBAT_RF
3.7V~4.
2V
P
Input power for RF section,
could connect this pin with
VBAT_BB.
72
NC
73
NC
74
GND
GND
GND
Ground.
75
GND
GND
GND
Ground.
76
GND
GND
GND
Ground.
77
GND
GND
GND
Ground.
78
GND
GND
GND
Ground.
79
GPIO
GPIO22
1.8V
I/O,
PU
Configurable I/O.
2-16mA
80
GPIO
GPIO23
1.8V
I/O,
PU
Configurable I/O.
2-16mA
81
GPIO
GPIO19
1.8V
I/O,
PU
Configurable I/O.
2-16mA
82
GPIO
GPIO14
1.8V
I/O,
PU
Configurable I/O.
2-16mA
83
NC
84
NC
Product specification
12
85
NC
86
NC
87
SDIO1
SDCC1_DA
TA0
2.6V
I/O
SD data bit 0.
2-8mA
88
SDIO1
SDCC1_DA
TA1
2.6V
I/O
SD data bit 1.
2-8mA
89
SDIO1
SDCC1_CL
K
2.6V
DO
SD clock.
2-16mA
90
GPIO
GPIO3
1.8V
I/O,
PU
Configurable I/O.
2-16mA
91
GND
GND
GND
Ground.
92
NC
93
SIM
USIM_RST
1.8V/2.8
5V
DO
UIM reset.
94
JTAG
JTAG_TDO
2.6V
Z
Test data output.
95
JTAG
JTAG_TDI
2.6V
DI, PU
Test data input.
96
power output
VREG_MS
MP
2.6V
Pad voltage for digital I/Os.
300mA
97
JTAG
JTAG_TRS
T_N
2.6V
DI, PD
Reset.
98
NC
99
NC
100
GND
GND
GND
Ground.
101
USB
USB_D_M
AI,AO
USB differential data I/O, (-)
side.
102
USB
USB_D_P
AI,AO
USB differential data I/O, (+)
side.
103
GND
GND
GND
Ground.
104
power on key
MSM_PON
1.8V
AI.PU
Connect to the keypad power
button.
105
ADC in
MPP4
AI
Multipurpose pin.
106
other
D2D_PS_H
OLD
DI
Baseband circuits drive this
input high to keep power on, low
to
shut down.
107
GND
GND
GND
Ground.
108
GND
GND
GND
Ground.
109
Speaker
SPKR_OUT
_P
AO
Speaker driver (+) output.
Connect directly to the speaker.
500mW
110
Speaker
SPKR_OUT
_M
AO
Speaker driver (-) output.
Connect directly to the speaker.
500mW
111
NC
112
NC
113
ADC in
MPP2
AI
Multipurpose pin.
114
current sink
VIB_DRV_
N
AO
Connect to the vibration motor (-
) terminal. The (+) terminal of
the
Product specification
13
motor connects to VDD.
115
ADC in
PA_THERM
AI
Connect to thermistor for PA.
116
current sink
LCD_DRV_
N
AO
LCD backlight current driver.
150mA
117
GND
GND
GND
Ground.
118
GPIO
GPIO13
1.8V
I/O,
PD
Configurable I/O.
2-16mA
119
GPIO
GPIO0
1.8V
I/O,
PD
Configurable I/O.
2-16mA
120
GPIO
GPIO12
1.8V
I/O,
PD
Configurable I/O.
2-16mA
121
PWM
GP_PDM_0
1.8V
DO,P
D
"Backlight"12-bit PDM;XO/4
clock.
2-16mA
122
GND
GND
GND
Ground.
123
GND
GND
GND
Ground.
124
GND
GND
GND
Ground.
125
GND
GND
GND
Ground.
126
GND
GND
GND
Ground.
127
GND
GND
GND
Ground.
128
GND
GND
GND
Ground.
129
GND
GND
GND
Ground.
130
GND
GND
GND
Ground.
131
GND
GND
GND
Ground.
132
GND
GND
GND
Ground.
133
GND
GND
GND
Ground.
134
GND
GND
GND
Ground.
135
GND
GND
GND
Ground.
136
GND
GND
GND
Ground.
137
GND
GND
GND
Ground.
138
GND
GND
GND
Ground.
139
GND
GND
GND
Ground.
140
GND
GND
GND
Ground.
141
GND
GND
GND
Ground.
Product specification
14
3. RF AIR INTERFACES AND PERFORMANCE
3.1 RF AIR INTERFACE AND BAND CONFIGURATION
3.1.1 Air interfaces
UMC-6055QV module supports CDMA 1xRTT and GPS
3.2 RF PERFORMANCE
The UMC-6055QV modules RF transmitter/receiver is fully compliant with the applicable standards. The
sensitivity and max output power are listed in Table 3-2-1 and Table 3-2-2
Specification
Min
Typ
Max
Units
CDMA2000 1X Sensitivity
BC1 (1930-1990MHz Rx)
-104.7
-108
dBm
BC0 (869-894MHz Rx)
-106.7
-110
dBm
GPS Sensitivity
-155
dBm
Table 3-2-1 Conducted Receiver Sensitivity
Specification
Min
Typ
Max
Units
CDMA2000 1X Output Power
BC1 (1850-1910MHz Tx)
23.5
dBm
BC0 (824-849MHz Tx)
23.5
dBm
GPS Sensitivity
-155
dBm
Table 3-2-2 Conducted Transmitter Max Output Power
3.3 TRANSMITTER POWER CLASS
The UMC-6055QV Modules support the power classes listed in Table 3-3
Mode
Band
Power Class
CDMA2000 1X
BC1/BC0
3
Table 3-3 Supported Power Classes
Product specification
15
4. OPERATING CONDITIONS
4.1 ABSOLUTE MAXIMUM RATINGS
Operating UMC-6055QV Modules under conditions beyond its absolute maximum ratings (Table 4-1) may
damage the device. Absolute maximum ratings are limiting values to be considered individually when all other
parameters are within their specified operating ranges. Functional operation and specification compliance under
any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied.
Exposure may affect device reliability.
Symbol
Parameter
Min
Max
Unit
Ts
Storage temperature
-40
85
C
USB_VBUS
DC power supply voltage
4.5
5.5
V
VBAT
Battery input voltage
3.4
4.2
V
VESD_HBM
Eletrostatic discharging voltage rating
(human body model)
*
V
VESD_CDM
Electrostatic discharge voltage rating
(charge device model)
*
V
RH_Operating
Operating humidity range
10
90
%
RH_Non-OP
Nonoperating humidity range
5
95
%
*NOTE: ESD protection should be provided external to the module.
Table 4-1 : Absolute maximum ratings
Product specification
16
4.2 RECOMMENDED OPERATING CONDITION
The devices meet all performance specifications when used within the recommended operating conditions as
described in Table 4-2
Symbol
Parameter
Min
Typ.
Max
Unit
T
Operating Temperature
-25
+85
Normal operating temperature range
See section 4.2.1
-20
+65
Extended operating temperature range 1
See section 4.2.2
-25
-20
Extended operating temperature range 2
See section 4.2.3
+65
+85
USB_VBUS
DC Power Supply Voltage
4.75
5
5.25
V
VBAT (Battery)
DC Power Supply Voltage
3.4
3.8
4.2
V
Table 4-2
4.2.1 Normal operating temperature range
The wireless module is fully functional and meets the 3GPP specification across the specified temperature
range.
4.2.2 Extended operating temperature range 1
The wireless module is fully functional across the specified temperature range. Occasional deviations from the
3GPP specification may occur.
4.2.3 Extended operating temperature range 2
The wireless module is functional across the specified temperature range. Occasional deviations from the 3GPP
specification may occur. Thermal protection including automatic shutdown is implemented for protection against
overheating.
Product specification
17
5. CURRENT CONSUMPTION
The specified supply currents in Table 5-1 are based operation at room temperature. Current measurements
are taken with default parameter settings, nominal supply voltage. The DUT is mounted on a module test board
and the accelerometer on, unless otherwise noted.
Operating Modes
Description
Conditions
Average Current
Min
Typ
Max
Unit
Power Down(OFF)
VBAT voltage applied
Power Down*1,2
22
µA
CDMA2000 1X
Between Rx wakeups
Sleep*1,2
1
mA
Rx awake current
Rx Idle
70
mA
Average Sleep and Rx
Standby*3
1.4
mA
Average GPS only
Average GPS only
42
mA
TX/RX (0dBm)
180
mA
Tx/Rx (23.5dBm)
550
mA
Table 5-1 Typical Power Consumption
Note 1 Measurement taken without Test Board
Note 2 Measurement taken without Accelerometer
Note 3 Value calculated from measured IUSB_AVG subtacted from
ITOTAL_GPS_AVG, I-GPS = I-Total_GPS_AVG – IUSB_AVG
Product specification
18
6. APPLICATION DESIGN NOTES
6.1 Layout Notes
6.2 RF Pin Input Impedance Matching
Applications utilizing the module must ensure that a 50Ω controlled impedance trace is used. Shown in the
accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for
Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the
Description column in the table below.
Layer
Material
Type
Dielectric
Thickness
Trace
Width
Copper
Thickness
Dielectric
Constant
Char.
Impedance
Description
1
Conductive
-
27
2.1
-
50
Microstrip
Dielectric
16
-
-
4.3
-
Prepreg
2
Conductive
-
-
1.4
-
Plane
Dielectric
20
4.3
-
Prepreg
3
Conductive
-
-
1.4
-
-
Plane
Dielectric
16
-
-
4.3
-
Prepreg
4
Conductive
-
27
2.1
-
50
Microstrip
Table 6-1-1-1 Application Board Characteristic Impedance
Figure 6-1-1-1 Application Board Layer Stack Up
6.3 Handling Requirements
DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING.
6.4 Soldering Requirements
Soldering Iron Soldering
Solder Temperature: 350oC
Immersion Duration: 2 ~ 3 seconds
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6.1.3 Reflow Profile
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7. MECHANICAL REQUIREMENTS
7.1 Module Dimension and Footprint
The dimension of this module:
Figure 7-1-1 Dimension of SFF Module
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Figure 7-1-2 Recommended Footprint of SFF Module
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8 Certification Requirements
8.1 Carrier Certification Requirements
The SFF Development Kit will be used to demonstrate Safe for Network (SFN) compliance for the SFF module on
selected cellular carriers.
8.2 Regulatory Compliance 5
8.3 FCC warning statement
FCC Regulations:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee
that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
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Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the antenna type
and gain allowed for use with this device is type: fixed external; max. gain: 2dBi.
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-
location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID: NKRUMC-6055Q”. The grantee's FCC ID can be used only when all FCC compliance requirements
are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.