Wistron NeWeb UMC-6055Q module User Manual HiLo3G technical specification
Wistron NeWeb Corporation module HiLo3G technical specification
Users Manual
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| Document ID | 2335342 |
| Application ID | rP4APyIVyU9cklkWDuleZA== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 155.12kB (1938972 bits) |
| Date Submitted | 2014-07-25 00:00:00 |
| Date Available | 2015-01-21 00:00:00 |
| Creation Date | 2014-07-17 14:58:14 |
| Producing Software | Microsoft® Office Word 2007 |
| Document Lastmod | 2014-07-24 18:19:03 |
| Document Title | HiLo3G technical specification |
| Document Creator | Microsoft® Office Word 2007 |
| Document Author: | AMMARI Mohamed |
Product specification UMC-6055QV User Guide Wistron NeWeb Corp. CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION, WHICH IS THE PROPERTY OF THE WISTRON NEWEB CORPORATION AND SHALL NOT BE DISCLOSED TO OTHERS IN WHOLE OR IN PART, REPRODUCED, COPIED, OR USED AS THE BASIS FOR DESIGN, MANUFACTURING, OR SALE OF APPARATUS WITHOUT WRITTEN PERMISSION OF WISTRON NEWEB CORPORATION. Product specification CONTENTS CONTENTS .......................................................................................................................................................................... 2 1. INTRODUCTION...................................................................................................................................................... 3 1.1 PRODUCT CONCEPT ........................................................................................................................................ 3 1.2 STANDARDS ....................................................................................................................................................... 3 1.3 TERMS AND ABBREVIATION ......................................................................................................................... 4 1.4 CONVENTIONS ................................................................................................................................................... 4 1.5 PRODUCT FEATURES OVERVIEW ............................................................................................................... 4 2. BLOCK DIAGRAM & PIN ASSIGNMENT........................................................................................................... 7 3. RF AIR INTERFACES AND PERFORMANCE ................................................................................................ 14 3.1 RF AIR INTERFACE AND BAND CONFIGURATION ................................................................................ 14 3.1.1 Air interfaces ............................................................................................................................................. 14 3.2 RF PERFORMANCE......................................................................................................................................... 14 3.3 TRANSMITTER POWER CLASS ................................................................................................................... 14 4. OPERATING CONDITIONS ................................................................................................................................ 15 4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 15 4.2 RECOMMENDED OPERATING CONDITION .............................................................................................. 16 5. CURRENT CONSUMPTION ................................................................................................................................ 17 6. APPLCATION DESIGN NOTES ......................................................................................................................... 18 6.1 LAYOUT NOTES .................................................................................................................................. 18 6.2 RF PIN INPUT IMPEDANCE MATCHING ........................................................................................... 18 6.3 HANDING REQUIREMENTS .......................................................................................................................... 18 6.4 SOLDING REQUIREMENTS ........................................................................................................................... 18 7. MECHANICAL REQUIREMENTS ...................................................................................................................... 20 7.1 MODULE DIMENSION AND FOOTPRINT.................................................................................................... 20 8. CERTIFICATION REQUIREMENTS ................................................................................................................ 22 8.1 CARRIER CERTIFICATION REQUIREMENTS ........................................................................................... 22 8.2 REGULATORY COMPLIANCE ..................................................................................................................... 22 8.3 FCC WARNING STATEMENT ........................................................................................................................ 22 Revision history Revision V1.0 V2.0 Date April 7 2014 May 13 2014 Description Initial release Modify recommended operating condition Product specification 1. INTRODUCTION This document describes the hardware interface of the WNC Small Form Factor (SFF) module used to connect the device application and the air interface. Two versions of Small Form Factor (SFF) module are described in this specification document as follows: 1.1 UMC-6055QV - CDMA2000 1X PRODUCT CONCEPT The SFF module is one of the smallest available CDMA2000 1X modules of the market. The target application is the Machine to Machine (M2M) market including automotive, AMM (Automatic Metering Management), tracking system, Alarm, Healthcare/monitoring, Telematics etc. Despite its small size and cost, In addition to its size it has the following outstanding characteristics: Minimum low power consumption in idle mode: 1.4mA High input voltage range: 3.4 V to 4.2 V USB High Speed Digital Audio PCM Full set of AT commands as well as analogue and Digital audio interface. In addition to the module, a complete development kit can be provided for customers. 1.2 STANDARDS This product, together with its evaluation board, is in compliance with the directives and standards listed below: Directives FCC RF : FCC Part 22H (850 Band ) FCC Part 24E (for 1900 Band) EMI: FCC Part 15B SAR(MPE) : OET65C FCC Part 22 Subpart H: Cellular Radiotelephone Service; Subpart I: Offshore Radiotelephone Service; FCC Part 24 E: Personal Communications Service; Subpart E: Broadband PCS. Subpart B - Radio frequency devices subpart B – Unintentional Radiators Product specification 1.3 TERMS AND ABBREVIATION ADC CODEC CLIP COLP CLIR COLR CTS CSD CS DSR ENS EONS ESD ETS FAX IC IEEE I/O ISO ITU JTAG Kbps LCD LED Mbps PCB PCM PCS PWM RAM RF RI RMS RTS RX SMS TBC TBD TX UART USB USSD 1.4 Analog to Digital Converter Coder-Decoder Calling Line Identification Presentation Connected Line Identification Presentation Calling Line Identification Restriction Connected Line Identification Restriction Clear To Send Circuit Switched Data Codec Scheme Data Set Ready Enhanced network selection Enhanced operator name string Electrostatic Discharge European Telecommunication Standard Facsimile Integrated Circuit Institute of Electrical and Electronics Engineers Input / Output International Standards Organization International Telecommunication Union Joint Test Action Group kilobit per second Liquid Crystal Display Light Emitting Diode Megabit per second Printed Circuit Board Pulse Code Modulation Personal Communication System Pulse Width Modulation Random Access Memory Radio Frequency Ring Indication Root Mean Square Ready To Send Reception Short Message Service To Be Confirmed To Be Defined Transmission Universal Asynchronous Receiver and Transmitter Universal Serial Bus Unstructured Supplementary Service Data CONVENTIONS Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls the module device by sending AT commands via its serial interface. DCE (data communication equipment) indicates the module device. 1.5 PRODUCT FEATURES OVERVIEW Temperature range Operation Temperature: -25°C to +85°C Storage: -40°C to +85°C Weight 6 g (typ.) ESD ESD protection >= 2 kV Product specification Physical dimensions 22.1 x 25.1 x 2.65 mm (typical) Connection 141 pin LGA type Power supply 3.4V to 4.2V range, 3.8V nominal Power consumption Off mode: 50 µA typical Registered idle mode: CDMA2000: 1.3 mA Peak Current CDMA2000: up to 700 mA Antenna /RF interface Both GPS and transmitter/receiver RF are LGA Pad. Frequency bands UMC-6055QV module supports CDMA2000 BC0/BC1 Class 3 for CDMA2000 BC0/BC1 Transmit power PWM Digital audio link Data/command multiplexing USB Signal for LED, vibrating device and Buzzer management is provided on the PWM pin A digital audio interface PCM bus is provided. Master mode with 16 bits and a frequency of 2048 KHz. Software management of data/command multiplexing on the serial link UART. Supports USB High speed 480Mbps and full speed 12Mbps, with 3 logical Channels. Battery charging is achieved through USB Module Hardware Configuration The SFF LGA module will support the QSC6055 chipset with the configuration described below. For UMC-6055QV module: Key Features • • • • • • Specification • • • • • • • Compliant with 3GPP for CDMA 1xRTT Max. Data Rate : 153kbps FL; 153kbps RL Support OS: Brew Mobile Platform ARM9 operating at 192Mhz maximum frequency Data interface: USB2.0 Host High Speed Form Factor: LGA module Communication Interface: (I2C x1/UART x1/USB2.0 x1/SDIO x1) Supported SIM cards (3V and 1.8V SIM cards) General purpose I/O pins ( x25 ) Audio Interface (PCM/ I2S) MCP (DDR 512Mb + 1Gb NAND) Support GPS RF interface: 2 RF pads for CDMA TX/RX, and GPS. CDMA2000 Support Bands • Band BC0 The power consumption is highly dependent on the customer’s product design and the module environment. Product specification • Band BC1 Product specification 2. BLOCK DIAGRAM & PIN ASSIGNMENT Pin Definition 4 This section is intended to capture the final LGA pin out for the SFF Module. The interfaces with a SFF module are all through a 141-pin surface LGA pad, as shown in Figure 2-1. Product specification For UMC-6055QV module: Figure 2-1: UMC-6055QV module Product specification Pin number Category RF GND CDMA_AN GND GPIO GPIO9 1.8V GPIO GPIO2 1.8V GPIO GPIO5 1.8V GPIO GPIO8 1.8V I2C I2C_SCL 1.8V PCM PCM_BCLK 1.8V PCM PCM_SYNC 1.8V 10 PCM PCM_DIN 1.8V 11 PCM 12 GPIO 13 14 15 16 17 18 NC NC GND GND RF GND 19 GPIO GPIO21 20 GND GND 21 GPIO GPIO20 1.8V 22 GPIO GPIO16 1.8V 23 GPIO GPIO17 1.8V 24 25 NC NC 26 SDIO1 27 SDIO1 28 SDIO1 pin name PCM_DOU GPS_LNA_ EN Pad group Description Drivn capacity AI,AO CDMA antenna signal 1.8V 1.8V GND GND GPS_ANT GND SDCC1_CM SDCC1_DA TA3 SDCC1_DA Pad type 1.8V GND I/O, PD I/O, PD I/O, PD I/O, PD I/O Ground. Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Serial bus clock. PCM clock for external DO Bluetooth module. PCM sync to external Bluetooth DO module. PCM data from external DI Bluetooth module. PCM data to external Bluetooth DO module. I/O, Configurable I/O. PU GND GND AI GND I/O, PU GND I/O, PU I/O, PU I/O, PU 2-16mA Ground. Ground. GPS antenna signal. Ground. Configurable I/O. 2-16mA Ground. Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA 2.6V I/O SD command. 2-8mA 2.6V I/O SD data bit 3. 2-8mA 2.6V I/O SD data bit 2. 2-8mA Product specification TA2 29 GPIO GPIO10 30 GND GND 31 SIM USIM_CLK 32 NC 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 1.8V 1.8V/2.8 5V I/O, Configurable I/O. PU GND Ground. 2-16mA DO UIM clock. Input power for BB section, could connect this pin with power 3.7V~4. VBAT_RF. VBAT_BB input/output 2V voltage or as an analog output that sources trickle-charging current for the battery. JTAG JTAG_TMS 2.6V DI, PU Test mode select. JTAG_RTC JTAG 2.6V DO Return clock. JTAG JTAG_TCK 2.6V DI, PU Clock input. 1.8V/2.8 SIM USIM_DAT I/O UIM data. 5V This pin is configured as an analog input or an analog output, power input USB_VBUS depending upon the type of peripheral device connected. USIM_VRE 1.8V/2.8 power output P RUIM circuits and interface. 5V GND GND GND Ground. GND GND GND Ground. NC NC VREG_MS 300m EBI circuits and external power output 1.8V ME1 A memory, pads. GND GND GND Ground. Used as an analog input from the power VCOIN P 3 V coin cell for SMPL, RTC, input/output and crystal oscillator backup. GND GND GND Ground. ADC in MPP3 AO Multipurpose pin. PON_REST logic low causes the baseband other 1.8V DO _N circuits to reset. GND GND GND Ground. BATT_THE Connect to battery package ADC in AI RM thermal pin. GND GND GND Ground. microphone MIC_P AI Microphone #1 input (+). microphone MIC_M AI Microphone #1 input (-). GND GND GND Ground. 10 150mA Product specification 56 GPIO GPIO4 1.8V 57 GPIO GPIO6 1.8V 58 GPIO GPIO11 1.8V 59 GPIO GPIO24 1.8V 60 GND GND 61 GPIO GPIO18 1.8V 62 GPIO GPIO15 1.8V 63 GPIO GPIO7 1.8V 64 GPIO GPIO1 1.8V 65 I2C I2C_SDA 1.8V 66 UART UART_TX 1.8V 67 UART UART_RFR 1.8V 68 UART UART_RX 1.8V 69 UART UART_CTS 1.8V 70 power input VBAT_RF 3.7V~4. 2V 71 power input VBAT_RF 3.7V~4. 2V 72 73 74 75 76 77 78 NC NC GND GND GND GND GND GND GND GND GND GND 79 GPIO GPIO22 1.8V 80 GPIO GPIO23 1.8V 81 GPIO GPIO19 1.8V 82 GPIO GPIO14 1.8V 83 84 NC NC I/O, PD I/O, PU I/O, PD I/O, PD GND I/O, PD I/O, PD I/O, PD I/O, PD I/O Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Ground. Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA I2C serial bus data. UART1 bits: receive serial data DO input. DO UART Ready to receive flow. UART1 bits: receive serial data DI input. DI UART Clear to send flow. Input power for RF section, P could connect this pin with VBAT_BB. Input power for RF section, P could connect this pin with VBAT_BB. GND GND GND GND GND I/O, PU I/O, PU I/O, PU I/O, PU 11 Ground. Ground. Ground. Ground. Ground. Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA Product specification 85 86 NC NC 87 SDIO1 88 SDIO1 89 SDIO1 90 GPIO GPIO3 91 92 GND NC GND SIM USIM_RST 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 SDCC1_DA TA0 SDCC1_DA TA1 SDCC1_CL 2.6V I/O SD data bit 0. 2-8mA 2.6V I/O SD data bit 1. 2-8mA 2.6V DO SD clock. 1.8V I/O, Configurable I/O. PU GND Ground. 1.8V/2.8 DO UIM reset. 5V JTAG JTAG_TDO 2.6V Z Test data output. JTAG JTAG_TDI 2.6V DI, PU Test data input. VREG_MS power output 2.6V Pad voltage for digital I/Os. MP JTAG_TRS JTAG 2.6V DI, PD Reset. T_N NC NC GND GND GND Ground. USB differential data I/O, (-) USB USB_D_M AI,AO side. USB differential data I/O, (+) USB USB_D_P AI,AO side. GND GND GND Ground. Connect to the keypad power power on key MSM_PON 1.8V AI.PU button. ADC in MPP4 AI Multipurpose pin. Baseband circuits drive this D2D_PS_H input high to keep power on, low other DI OLD to shut down. GND GND GND Ground. GND GND GND Ground. SPKR_OUT Speaker driver (+) output. Speaker AO _P Connect directly to the speaker. SPKR_OUT Speaker driver (-) output. Speaker AO _M Connect directly to the speaker. NC NC ADC in MPP2 AI Multipurpose pin. Connect to the vibration motor (VIB_DRV_ current sink AO ) terminal. The (+) terminal of the 12 2-16mA 2-16mA 300mA 500mW 500mW Product specification motor connects to VDD. 115 116 117 ADC in PA_THERM LCD_DRV_ current sink GND GND AI Connect to thermistor for PA. AO LCD backlight current driver. 118 GPIO GPIO13 1.8V 119 GPIO GPIO0 1.8V 120 GPIO GPIO12 1.8V 121 PWM GP_PDM_0 1.8V 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND I/O, PD I/O, PD I/O, PD DO,P GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 13 150mA Ground. Configurable I/O. 2-16mA Configurable I/O. 2-16mA Configurable I/O. 2-16mA "Backlight"12-bit PDM;XO/4 clock. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. Ground. 2-16mA Product specification 3. RF AIR INTERFACES AND PERFORMANCE 3.1 RF AIR INTERFACE AND BAND CONFIGURATION 3.1.1 Air interfaces UMC-6055QV module supports CDMA 1xRTT and GPS 3.2 RF PERFORMANCE The UMC-6055QV modules RF transmitter/receiver is fully compliant with the applicable standards. The sensitivity and max output power are listed in Table 3-2-1 and Table 3-2-2 Specification Min Typ Max Units BC1 (1930-1990MHz Rx) -104.7 -108 dBm BC0 (869-894MHz Rx) -106.7 -110 dBm -155 dBm CDMA2000 1X Sensitivity GPS Sensitivity Table 3-2-1 Conducted Receiver Sensitivity Specification Min Typ Max Units CDMA2000 1X Output Power BC1 (1850-1910MHz Tx) 23.5 dBm BC0 (824-849MHz Tx) 23.5 dBm -155 dBm GPS Sensitivity Table 3-2-2 Conducted Transmitter Max Output Power 3.3 TRANSMITTER POWER CLASS The UMC-6055QV Modules support the power classes listed in Table 3-3 Mode CDMA2000 1X Band Power Class BC1/BC0 Table 3-3 Supported Power Classes 14 Product specification 4. OPERATING CONDITIONS 4.1 ABSOLUTE MAXIMUM RATINGS Operating UMC-6055QV Modules under conditions beyond its absolute maximum ratings (Table 4-1) may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied. Exposure may affect device reliability. Symbol Parameter Min Max Unit Ts Storage temperature -40 85 USB_VBUS DC power supply voltage 4.5 5.5 VBAT Battery input voltage 3.4 4.2 VESD_HBM Eletrostatic discharging voltage rating (human body model) VESD_CDM Electrostatic discharge voltage rating (charge device model) RH_Operating Operating humidity range 10 90 RH_Non-OP Nonoperating humidity range *NOTE: ESD protection should be provided external to the module. 95 Table 4-1 : Absolute maximum ratings 15 Product specification 4.2 RECOMMENDED OPERATING CONDITION The devices meet all performance specifications when used within the recommended operating conditions as described in Table 4-2 Symbol Parameter Min Typ. Max -25 +85 -20 +65 -25 -20 +65 +85 Unit USB_VBUS Operating Temperature Normal operating temperature range See section 4.2.1 Extended operating temperature range 1 See section 4.2.2 Extended operating temperature range 2 See section 4.2.3 DC Power Supply Voltage 4.75 5.25 VBAT (Battery) DC Power Supply Voltage 3.4 3.8 4.2 Table 4-2 4.2.1 Normal operating temperature range The wireless module is fully functional and meets the 3GPP specification across the specified temperature range. 4.2.2 Extended operating temperature range 1 The wireless module is fully functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. 4.2.3 Extended operating temperature range 2 The wireless module is functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. Thermal protection including automatic shutdown is implemented for protection against overheating. 16 Product specification 5. CURRENT CONSUMPTION The specified supply currents in Table 5-1 are based operation at room temperature. Current measurements are taken with default parameter settings, nominal supply voltage. The DUT is mounted on a module test board and the accelerometer on, unless otherwise noted. Operating Modes Description Average Current Conditions Min Typ Max Unit Power Down(OFF) VBAT voltage applied Power Down*1,2 22 µA CDMA2000 1X Between Rx wakeups Sleep*1,2 mA Rx awake current Rx Idle 70 mA Average Sleep and Rx Standby*3 1.4 mA Average GPS only 42 mA TX/RX (0dBm) 180 mA Tx/Rx (23.5dBm) 550 mA Average GPS only Table 5-1 Typical Power Consumption Note 1 Measurement taken without Test Board Note 2 Measurement taken without Accelerometer Note 3 Value calculated from measured IUSB_AVG subtacted from ITOTAL_GPS_AVG, I-GPS = I-Total_GPS_AVG – IUSB_AVG 17 Product specification 6. APPLICATION DESIGN NOTES 6.1 Layout Notes 6.2 RF Pin Input Impedance Matching Applications utilizing the module must ensure that a 50Ω controlled impedance trace is used. Shown in the accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the Description column in the table below. Layer Material Type Conductive 27 2.1 50 Microstrip Dielectric Conductive Dielectric Conductive Dielectric Conductive 16 20 16 1.4 4.3 27 1.4 2.1 - Prepreg - Plane - Prepreg - Plane - Prepreg 50 Microstrip Dielectric Trace Thickness Width Copper Thickness Dielectric Constant Char. Description Impedance 4.3 4.3 Table 6-1-1-1 Application Board Characteristic Impedance Figure 6-1-1-1 Application Board Layer Stack Up 6.3 Handling Requirements DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING. 6.4 Soldering Requirements Soldering Iron Soldering Solder Temperature: 350oC Immersion Duration: 2 ~ 3 seconds 18 Product specification 6.1.3 Reflow Profile 19 Product specification 7. MECHANICAL REQUIREMENTS 7.1 Module Dimension and Footprint The dimension of this module: Figure 7-1-1 Dimension of SFF Module 20 Product specification Figure 7-1-2 Recommended Footprint of SFF Module 21 Product specification 8 Certification Requirements 8.1 Carrier Certification Requirements The SFF Development Kit will be used to demonstrate Safe for Network (SFN) compliance for the SFF module on selected cellular carriers. 8.2 Regulatory Compliance 8.3 FCC warning statement FCC Regulations: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 22 Product specification Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the antenna type and gain allowed for use with this device is type: fixed external; max. gain: 2dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: NKRUMC-6055Q”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 23
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : Yes Encryption : Standard V2.3 (128-bit) User Access : Print, Extract, Print high-res Tagged PDF : Yes XMP Toolkit : Adobe XMP Core 4.0-c316 44.253921, Sun Oct 01 2006 17:14:39 Create Date : 2014:07:17 14:58:14+08:00 Creator Tool : Microsoft® Office Word 2007 Modify Date : 2014:07:24 18:19:03+08:00 Metadata Date : 2014:07:24 18:19:03+08:00 Format : application/pdf Description : HiLo3G technical specification Creator : AMMARI Mohamed Title : HiLo3G technical specification Keywords : HiLo3G technical specification Producer : Microsoft® Office Word 2007 Document ID : uuid:fb3359cb-73fc-4fdf-b40c-246796d75fca Instance ID : uuid:54216e17-7fe1-4392-a4b0-ff4b929896f3 Page Count : 23 Language : zh-TW Subject : HiLo3G technical specification Author : AMMARI MohamedEXIF Metadata provided by EXIF.tools