UserMan
COMPANY CONFIDENTIAL
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客 戶 名 稱:
Customer Name: YAMAHA
品 名 (Part Name) SMSC CX870-3OB Module
承認書版本(Approval Sheet Rev.) Preliminary version
客戶料號 (Customer Part No.)
光寶料號 (Liteon Part No.)
客 戶 簽 認
Customer Approval: _________________________________________
Prepared by Reviewed by Approved by
Frank Gung
Total Pages Date Sales
2013/10/09 Elisa Liou
4F, 90, Chien 1 Road, Chungho, New Taipei City
235, Taiwan, R.O.C.
TEL: +886-2-2222-6181
Fax: +886-2-2222-3882
光寶科技股份有限公司
台北縣中和市建一路 90 號4F
電話: 02-2222-6181 傳真: 02-2222-3882
承 認 書
(Specification Sheet)
COMPANY CONFIDENTIAL
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Index
Index.........................................................................................................................................................2
Revision History.......................................................................................................................................3
Part1. Module Spec Sheet....................................................................................................................4
1Introduction ....................................................................................................................................4
2Block Diagram ................................................................................................................................4
3Board Pictures.................................................................................................................................5
3.1Top View of CX Module........................................................................................................5
3.2Bottom View of CX Module..................................................................................................6
3.2.1CX Module Bottom View w/64-pin Low Density Connector.............................................6
3.2.2CX Module Bottom View w/120-pin Media Connector .....................................................6
3.3Production Module with Top and RF shields in place – Top View........................................7
3.4Production Module with 64-pin Connector Option – Side View...........................................7
3.5Example Production Module Showing Soldered RF Shield..................................................8
3.6Production Module with Bottom Shield (Part Numbers with a “B” after the configuration
letter) 9
3.6.1Including J3 Low Density 64-pin connector – Bottom View..............................................9
3.6.2Including J2 High Density 120-pin connector – Bottom View...........................................9
4Ordering Guide.............................................................................................................................10
4.1Part Number Syntax.............................................................................................................10
5Electrical Specifications...............................................................................................................11
5.1Absolute Maximum Ratings.................................................................................................12
5.2Operating Conditions ...........................................................................................................12
5.3WiFi Specification (CX870 only) ........................................................................................13
6Regulatory Compliance and Quality ..........................................................................................14
6.0.1 Antenna Considerations.............................................................................................................14
6.0.2 CX Power Settings Used For Modular Approval......................................................................14
6.0.3 FCC IC Warning Message.........................................................................................................15
6.1RoHS....................................................................................................................................17
6.2Environmental Test...............................................................................................................17
6.3ESD and Transient Test (Applies to LAN and USB external connections only).................17
6.4Magnetic Field Test..............................................................................................................17
6.5MTBF...................................................................................................................................17
6.6Mechanical Specifications....................................................................................................17
6.7Module Quality ....................................................................................................................17
7Board Dimensions and Weight....................................................................................................18
7.1Top & Bottom View of CX870 Module without Bottom Shield .........................................18
7.1.1Top & Bottom View of CX Module with Bottom Shield..................................................18
7.2Side View of CX870 module without Bottom Shield..........................................................19
7.2.1Side View of CX Module with Bottom Shield except CX870-3JB ..................................19
7.33D View of CX870 Module without Bottom Shield............................................................20
7.4Module Weight.....................................................................................................................20
8Connectors and Connections.......................................................................................................21
8.1WLAN UFL Antenna Connector (optional).........................................................................21
8.2Module Connectors..............................................................................................................21
8.2.1Pin Descriptions ................................................................................................................22
8.2.2Connector PIN Assignments .............................................................................................27
8.2.3GPIO Assignments............................................................................................................29
9Application Guidelines.................................................................................................................30
9.1Power Supply sequencing and Reset Timing.......................................................................30
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9.1.1Power up, Reset and Power Down Timing .......................................................................31
9.2RF Considerations................................................................................................................31
Revision History
Date Version Description
10/09/2013 Rev 00 Preliminary
This documentation describes the marketing requirements specification of the Lite-on made
CX870 Wireless module. It is a confidential document of LITEON.
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Part1. Module Spec Sheet
1 Introduction
The CX-series module is a single-board networked media player module, based on SMSC’s DM870A and DM875 media
processors, and enables fast product developments with Ethernet, USB and optional WiFi connectivity. The module connects
to standard legacy components in various audio, video/LCD and control formats.
2 Block Diagram
Ethernet
Transceiver
DM870A
or
DM875
256 Mbit
SDRAM
RJ-45
+
Transformer Mem.
Bus
USB
GPIO
24.000 MHz
NAND-Flash
2.4 GHz RF
transceiver
802.11
RMII
USB
Type-A
UART
3.3V
JukeBlox Networked Media Module – CX Series
1.2V
UART
GPIO
DAC
PCB
Antenna
RF Amp. ANT
switch
Ext.
Antenna
PWM DAC
1.9V
Flash
NOR-Flash
I2C
Apple Co-
processor
I2C
JTAG
JTAG
LCD
3x6bit RGB
Display
SSM
4/8bit MMC
SD-Card
RST
Reset In
Video Out
Audio I/O
A/D, D/A
S/PDIF
CCIR-656 AV
Ports
SPI
SPI Ctrl.
Host
Controller/
LCD setup
PCB
Antenna
Ext.
Antenna
Note: Choice of antenna is a build option, see Ordering Guide.
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3 Board Pictures
Please note that all production modules include the RF and top shield. The below top view has the shields temporarily
removed to show the components. Also, please note that the 64-pin connector mounted on the module is the male gender.
3.1 Top View of CX Module
PCB antenna
External Antenna
Connectors SMSC processor Ethernet PHY
PCB antenna
SDRAM
802.11b/g
front-end
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LCD connector
FLASH
Media
connector
FLASH
Low density
connector
3.2 Bottom View of CX Module
3.2.1 CX Module Bottom View w/64-pin Low Density Connector
3.2.2 CX Module Bottom View w/120-pin Media Connector
LCD
connector
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3.3 Production Module with Top and RF shields in place – Top View
3.4 Production Module with 64-pin Connector Option – Side View
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3.5 Example Production Module Showing Soldered RF Shield
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3.6 Production Module with Bottom Shield (Part Numbers with a “B”
after the configuration letter)
3.6.1 Including J3 Low Density 64-pin connector – Bottom View
3.6.2 Including J2 High Density 120-pin connector – Bottom View
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4 Ordering Guide
One
Ant.
Two
Ant.
CX870-3OB DM870A+T6201 Released x X X X X X X X X CA
Part Number IC's Phase
WiFi (on-
module
PCB
diveristy)
Ext.
Diverstiy
Antennas
(UFL
Eth USB
Host
Low
Density
64-pin
conn.
Hi-
Density
120-pin
Conn.
Hi-
Density
LCD
Conn.
64MB
SDRAM
32MB
SDRAM
16MB
SDRAM
8MB
SDRAM
1Gb
NAND
32MB
NOR
8MB
NOR
Top
Module
Shield
Bottom
Module
Shield
1.9V Status
Note: Please note that the Apple Authentication Coprocessor will not be provided on the CX module. The Apple Authentication Coprocessor
should be provided on the product motherboard, connected to the SDA, SCL signals from the CX module.
Note: Shaded rows indicate Custom or Obsolete configuration - NOT TO BE USED FOR NEW/STANDARD MP DESIGNS.
Status code: C - Custom | S - Standard | O - Obsolete | A - Available
* Connector on board, but requires board modification to enable the connector.
+ The position of the X in the One Ant. column indicates that there is one external antenna connector provided. The position of the X in the
Two Ant. column indicates that there are two external antenna connectors provided. Do not use a module which has two external antenna
connectors with only one external antenna connected. Leaving one antenna socket open will degrade WiFi performance. SMSC
recommends always using modules with two external antennas for best performance.
% The CX870-3DS is the same as CX870-3D, except that the RF shield is soldered in place.
4.1 Part Number Syntax
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5 Electrical Specifications
Parameter State Model Voltage Symbol min. typ. max. Units
Power Supply Input Voltage
VIN 3.0
1.08
1.8
3.3
1.2
1.9
3.6
1.32
2.0
V
V
V
Logic Input high voltage VIH 1.7 5.5 V
Logic Input low voltage VIL -0.3 0.7 V
Logic Input threshold voltage VIT 1.29 1.39 1.5 V
Schmitt-trigger input low to high
threshold voltage VIT+ 1.58 1.65 1.71 V
Schmitt-trigger input high to low
threshold voltage VIT- 0.95 1.01 1.06 V
Logic Output high voltage VOH 2.4 V
Logic Output low voltage VOL 0.4 V
Logic Low-level output current
(VOL=0.4V) IOL -9.6 -15.6 -19.3 mA
Logic High-level output current
(VOH=2.4V) IOH 11.1 22.5 35.3 mA
3.3 I3.3 60 78 mA
1.2 I1.2 32 42 mA
Reset State
1.9 I1.9 18 23 mA
3.3 I3.3 185 241 mA
1.2 I1.2 337 438 mA
Operating in
idle state
1.9 I1.9 257 334 mA
3.3 I3.3 240 312 mA
1.2 I1.2 347 451 mA
Current Consumption
Playback over
WiFi high mips
& rate condition
CX870
1.9 I1.9 258 335 mA
Note: The maximum current values are 30% larger than the typical values. The maximum values
are intended to be used for power supply sizing calculations.
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5.1 Absolute Maximum Ratings
Parameter Component Min Max Units
3.3V Supply Voltage -0.5 4.6 V
1.2V Supply Voltage -0.5 1.8 V
1.9V Supply Voltage -0.5 2.2 V
Logic Input Voltage -0.5 6 V
Logic Output Voltage
Main
-0.5 4.6 V
5.2 Operating Conditions
Parameter Min Max Units
Operating Temperature 0 +70 °C
Operating Humidity 10 90 (non condensing) %RH
Storage Temperature -10 +75 °C
Storage Humidity 10 95 (non condensing) %RH
Storage Temperature Cycle Test 24 hrs -10 +75 °C
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5.3 WiFi Specification (CX870 only)
Feature Description
WLAN Standards IEEE 802.11b
IEEE 802.11g
Frequency Band 2.412 – 2.472 GHz (2.4GHz ISM Band, 13 Channels)
Channel 1 - Channel 13
North America FCC, Japan Telec, Europe ETSI
Modulation 802.11b mode (DS-SS: IEEE 802.11b)
802.11g mode (OFDM: IEEE 802.11g)
Transmission Speed 802.11b mode
11Mbps, 5.5Mbps, 2Mbps, 1Mbps
802.11g mode
54Mbps, 48Mbps, 36Mbps, 24Mbps, 18Mbps, 12Mbps, 9Mbps,
6Mbps
Tx Power 802.11b mode: 16.5dBm, +/-1dB
802.11g mode: 15.0dBm, +/-1dB
Using nominal production settings as follows:
Channel RF11
Rate: 11B ='3' (11Mbps), 11G = '8' (54Mbps)
MIB: 11B=9, 11G=1 (Reference for Tx Power Tuning)
Room temperature
The above TX Power specifications will apply to modules shipped from Liteon
after 9 April 2012.
Power-on Ramp < 2us
RF Carrier Suppression < 15dBc
TX EVM 802.11b mode: <-22dB
802.11g mode: <-25dB
Rx Sensitivity
(incl. CE2 Mother board) 802.11b mode:
<=-82dBm @ 1Mbps, <=81dBm @ 2Mbps, <=-81dBm @ 5.5Mbps,
<=-78dBm @ 11Mbps
802.11g mode:
<=-82dBm @ 9Mbps, <=-81dBm @ 18Mbps, <=-75dBm @ 36Mbps,
<=-70dBm @ 54Mbps
Throughput Rate
(measured for each
module) See factory test specification
Note: About Tx Power, different (higher/lower) RF output power settings may be used for specific
regions, antennas and/or enclosures, in which case re-certification may be required.
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6 Regulatory Compliance and Quality
Description Country Compliance Module Versions Passed
Electromagnetic Compatibility
(Prescan) USA
Europe FCC CFR47 Part15B
EN 300328
Radio Regulations (CX870
only) USA
Japan
Canada
Europe
FCC Part 15C
Telec
IC RSS-210
CE
CX870-3OB
6.0.1 Antenna Considerations
Here are the antennas used for certification:
Cfg Code Ant. Type Ant. Gain (dBi) Ant. Model Name
CX870-3OB Dipole 2.0 Cable : ACA-0200-6G0C6-A1
Antenna : EDA-8709-2G4R2-B7
Notes about antenna changes:
1) Equivalent antennas from other manufacturers may be substituted, and then marketed without
a Class II permissive change
2) Equivalent antennas must be of the same type (e.g. dipole, PIFA, etc.), must be of equal or less
gain than the antennas listed and previously authorized under the same FCC ID, and must have
similar in band and out of band characteristics (consult specification sheet for cutoff frequencies).
3) In case of new antenna types, or higher gain antennas, a Class II permissive change is required
and compliance with FCC section 15.203 must be met.
6.0.2 CX Power Settings Used For Modular Approval
SKUofModule:CX870‐3OB
FCC(2.4G)
Channel2412(1)2437(6) 2462(11)
11b
PowerSetting888
Channel2412(1)2437(6) 2462(11)
11g
PowerSetting101
SKUofModule:CX870‐3OB
CE(2.4G)
Channel2412(1)2437(6) 2472(13)
11b
PowerSetting999
Channel2412(1)2437(6) 2472(13)
11g
PowerSetting111
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6.0.3 FCC IC Warning Message
FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/ TV technician for help.
CAUTION:
Any changes or modifications not expressly approved by the grantee of this device could void the
user's authority to operate the equipment.
Labeling requirements
This device complies with Part 15 of the FCC Rules. Operation is
subject to the following two conditions: (1) this device may not cause
harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
RF exposure warning
This equipment must be installed and operated in accordance with provided instructions and
the antenna(s) used for this transmitter must be installed to provide a separation distance of at
least 20 cm from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter. End-users and installers must be provide with antenna installation
instructions and transmitter operating conditions for satisfying RF exposure compliance.
Information for the OEMs and Integrators
The following statement must be included with all versions of this document supplied to an
OEM or integrator, but should not be distributed to the end user.
This device is intended for OEM integrators only.
Please See the full Grant of Equipment document for other restrictions.
This device must be operated and used with a locally approved access point.
Information To Be Supplied to the End User by the OEM or Integrator
The following regulatory and safety notices must be published in documentation supplied to
the end user of the product or system incorporating an adapter in compliance with local regulations.
Host system must be labeled with "Contains FCC ID:A6RVX77A “, FCC ID displayed on label.
Canada, Industry Canada (IC) Notices
This Class B digital apparatus complies with Canadian ICES-003 and RSS-210.
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired operation of the
device.
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Radio Frequency (RF) Exposure Information
The radiated output power of the Wireless Device is below the Industry Canada (IC)
radio frequency exposure limits. The Wireless Device should be used in such a manner
such that the potential for human contact during normal operation is minimized.
This device has also been evaluated and shown compliant with the IC RF Exposure
limits under mobile exposure conditions. (antennas are greater than 20cm from a
person's body).
This device has been certified for use in Canada. Status of the listing in the Industry
Canada’s REL (Radio Equipment List) can be found at the following web address:
http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng
Additional Canadian information on RF exposure also can be found at the following web address:
http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html
Canada, avis d'Industry Canada (IC)
Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et
RSS-210.
Son fonctionnement est soumis aux deux conditions suivantes : (1) cet appareil ne doit pas causer
d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent
affecter son fonctionnement.
Informations concernant l'exposition aux fréquences radio (RF)
La puissance de sortie émise par l’appareil de sans fil Dell est inférieure à la limite
d'exposition aux fréquences radio d'Industry Canada (IC). Utilisez l’appareil de sans fil
Dell de façon à minimiser les contacts humains lors du fonctionnement normal.
Ce périphérique a également été évalué et démontré conforme aux limites d'exposition
aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se
situent à moins de 20 cm du corps d'une personne).
Ce périphérique est homologué pour l'utilisation au Canada. Pour consulter l'entrée
correspondant à l’appareil dans la liste d'équipement radio (REL - Radio Equipment List)
d'Industry Canada rendez-vous sur:
http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng
Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur :
http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html
Information To Be Supplied to the End User by the OEM or Integrator
The following regulatory and safety notices must be published in documentation supplied to the end user of the product or system
incorporating an adapter in compliance with local regulations. Host system must be labeled with "Contains IC: 740B-VX77A “,
IC ID displayed on label.
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6.1 RoHS
Uses only RoHS compliant components
6.2 Environmental Test
With stands 4 hours at 70°C, 90% RH
6.3 ESD and Transient Test (Applies to LAN and USB external
connections only)
ESD: +/- 2kV operation, +/- 4kV no destruction (part of CE test)
Fast electrical transients: +/- 500V operation, +/- 1000V no destruction (part of CE test)
6.4 Magnetic Field Test
Passes EN55022 and EN55024 (part of CE test)
6.5 MTBF
>10000 hours
6.6 Mechanical Specifications
Passes drop test according to I.E.C. 68-2-32, height 100 cm, 1 corner, 6 faces.
Passes vibration test with sine, vertical, 60 minutes, 600 to 18000 cpm, 1G
6.7 Module Quality
Defect Rate: < 1%
AQL CR=0, MA=0.4, MI=0.4
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7 Board Dimensions and Weight
7.1 Top & Bottom View of CX870 Module without Bottom Shield
7.1.1 Top & Bottom View of CX Module with Bottom Shield
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7.2 Side View of CX870 module without Bottom Shield
7.2.1 Side View of CX Module with Bottom Shield except CX870-3JB
Note:
1. All dimensions are measured in millimetres (mm).
2. PCB’s thickness: 1.00 +/- 0.10mm
3. Tolerance: +/-0.10mm
4. Outline Tolerance: +/-0.10mm
5. NPTH Hole: +/-0.05mm
6. PTH Hole: +/-0.075mm
7. Connector positions, board dimensions, mounting
hole positions and sizes are the same for all module
variants.
8. Connector position tolerance: +/- 0.38mm
9. The 64-pin connector mounted on the module along
one edge is the male gender.
10. Not all module variants have all connectors. Please
see the Ordering Guide table for details of connector
options.
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7.3 3D View of CX870 Module without Bottom Shield
Note: A 3D file of the CX module in .stp format is available from
the SMSC Customer Portal.
7.4 Module Weight
CX870: 20g
Note: Module weight applies to all versions of the module.
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8 Connectors and Connections
8.1 WLAN UFL Antenna Connector (optional)
The module includes two PCB strip antennas operated in diversity mode. Alternatively, one or two coaxial antenna
connectors are provided for connecting external (to the module) antennas. The choice between using the strip antenna or
using the coaxial sockets is a build option, determined by the position of surface mount capacitors on the module PCB. If the
PCB antennas are chosen, then diversity mode is always used. If external (to the module) antenna sockets are used, then
two external antennas should be used to provide 2X diversity operation.
If external antenna is used, please choose the proper part number indicating two external antenna sockets. Do not use a
module which has two external antenna sockets with only one external antenna connected; this will result in reduced WiFi
performance.
Please see ordering guide for build option details.
The surface-mount antenna socket used in the CX module is:
UF.L type Ultra Small Surface Mount Coaxial Connector
8.2 Module Connectors
The CX860/870 module uses 3 board-to-board connectors as interfaces to the product main board. The part numbers for the
connectors needed on the product main board, which mate with the connectors on the CX module, are shown in the table
below.
Connector
Number Connector
Purpose Connector
Type Number
of Pins Pin
Configuration Mating Connector Part Numbers
J1 LCD 30 2 x 15 x 0.5mm 14-5046-030-145-829+ (Kyocera)
J2 Media 120 2 x 60 x 0.5mm 14-5046-120-145-829+ (Kyocera)
J3 Low Density
B2B
Connector 64 2 x 32 x 2.54mm CSHA201-3202A001A1AB
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The pinout and signal names are shown on the next page. The following table provides an overview for the most important
control and interface signals.
8.2.1 Pin Descriptions
Signal(s) Type Description
POWER
VIN(+3.3V) P Power supply input ; +3.3V.
VIN (+1.2V) P Power supply input ; +1.2V.
VIN (+1.9V) P Power Supply input; +1.9V for powering RF section. Make sure this is a clean supply.
3V3RTC P The RTC function is no longer supported. This pin should be left open.
GND P Ground (GND) connection for power supply 0V, signal returns and shielding.
SPI
SPI_DOUT O SPI data from DM870A to host controller.
SPI_DIN I SPI data from host controller to DM870A.
SPI_CLK I SPI clock from host controller to DM870A. Maximum recommended frequency is 2MHz,
typical frequency is 1MHz. See Note 2 below.
SPI_NCS0 I SPI chip select from host controller to DM870A.
PDOUT1 O This signal is used as SPI_REQ, SPI request signal, from DM870A to host controller for
eDMP applications. Logic 1 indicates that there is an SPI message waiting to be read, the
host controller should start the SPI clock and read any changed registers. Logic 0
indicates that all changed register messages have been read and the message buffer is
empty. Also GPIO-06.
SPI_NCS1 I Not used. Leave open.
UART
RXD1 I UART1 input to the DM870A, used for shell access. SMSC recommends providing a
connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM
port. Such a connection can be used for product development debugging, and for module
programming control on the product manufacturing line and for module control during
certification procedures.
TXD1 O UART1 output from the DM870A, used for shell access. SMSC recommends providing a
connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM
port. Such a connection can be used for product development debugging, and for module
programming control on the product manufacturing line and for module control during
certification procedures.
RXD0 I UART0 input. Optionally used for controlling an iPod via UART.
TXD0 O UART0 output. Optionally used for controlling an iPod via UART.
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AUDIO
AV2DATA0 O I2S or left justified audio data output. Typically connected to external D/A converter input or
to external DSP for further audio processing. Used for main left and right channel audio
output data. See Note 3.
AV2CTRL0 O LRCK, audio data word clock at the audio sample rate (Fs). Maximum currently supported
frequency is 192kHz.
AV2CTRL1 O MCLK, audio master clock at 256Fs. This can be used to clock an external D/A converter
or DSP.
AV2CLK O SCLK, audio data bit clock at 64Fs. Allows for up to 32 audio data bits per sample word.
AV4DATA1 O SPDIF format output. Can support samples rates up to 192kHz, so the maximum
instantaneous frequency on this pin is 24.576MHz.
AV4DATA0 I SPDIF input. Not used at present. Leave open.
AV2DATA1 O I2S or left justified audio data output. Not used at present. Leave open.
AOUTLP/AOUTLN,
AOUTRP/AOUTRN O Differential stereo output from PWM-DAC, right and left channels. These signals require
analog low pass filtering. SMSC is not recommending using the PWM-DAC outputs
because of the potential for high out-of-band noise and uncharacterized audio quality.
SMSC recommends using an external D/A converter connected to AV2DATA0.
AV2DATA2 I I2S or left justified audio data input. Can be driven from an optional external A/D converter
used to interface to iPod analog output or other analog audio sources. If not used, leave
open.
AV2DATA3 I I2S or left justified audio data input. Not used at present. Leave open.
CONTROL
NCS3 I This signal is configured as GPIO-17 and is currently not used. DM870A-internal pull-up.
Leave this pin open.
PDOUT0 I Factory Reset. GPIO-04. Return the CnE to factory settings. High-active input,
DM870A-internal pull-down. Pull to GND with a 10kohm resistor, unless return to factory
settings from a hardware control is needed. Normally, return to factory settings is controlled
from the host controller via SPI register. This pin is only monitored during the boot up
process.
VCO0 I Infrared sensor input. GPIO-05. This is a Schmitt-Trigger input and can handle inputs with
slow slopes. Used for aDMP firmware builds for infrared remote control sensor output
connection to DM870A. For applications with a host controller, pull this pin to +3.3V via a
10kohm resistor.
AV3CLK O ETH_NRESET Low-active reset for the on-board ethernet PHY. This output is driven by the
DM870A. GPIO-12. Leave this pin open.
AV3CTRL0, AV3CTRL1 I/O I2C_SCL, I2C_SDA bus created by GPIO-13 and GPIO-14.
No internal pull-ups; Use 4.7kohm pull up resistor on each pin to +3.3V. Maximum
frequency is 400kHz.
NRESET_MOD I Low-active input to reset the module. This signal must be driven by an external reset
generator, or by a GPIO output from a host controller. See the application section of this
data sheet for the timing requirements for NRESET_MOD. Includes internal 10K pull-up
resistor to +3.3V.
NPD_RF I Active low input to shut down the power for the 802.11 RF section. Internal 10kohm pull-up
resistor to +3.3V. Leave open if powering down the RF section is not required.
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ETHERNET
ETH_RXN, ETH_RXP,
ETH_TXN, ETH_TXP M Ethernet signals between the PHY on the module and the external magnetics (transformer).
See Note 4. Maximum bit rate is 100Mbps.
ETH_LED_SPEED,
ETH_LED_ACT O
3.3V push-pull outputs (max. ±12mA) to drive the ethernet LEDs.
100Mbps speed mode and activity are indicated by the outputs being low. Connect to LEDs
through 220ohm resistors.
USB
USB_DN, USB_DP M USB data signals, normally connected to type A connector, USB switch or iPod dock
connector. Maximum bit rate is USB High Speed at 480Mbps.
USB_VBUS M Analog input for monitoring USB type A connector power. Connect to the +5V power which
is driving the USB type A connector power pins. If this pin drops below 4.6V, then the
DM870A will drive the USBVBUSDRV signal low to control an external power MOSFET to
disconnect +5V power from the USB type A connector. See Note 5.
USBVBUSDRV O Logic output to control an external MOSFET that is in series with USB type A connector
power. See USB_VBUS above and Note 5.
JTAG
TMS,TCK,TDI, TDO I/O JTAG port for DM870A. Leave open.
SSM
SSMD4, SSMD5,
SSMD6, SSMD7 I/O Can be used to drive external shift registers to make extended GPIO signals (see Note 6),
or as individual GPIO signals, or to make an SD card interface. SD card firmware is not
supported at present in JB2. Can be mapped to GPIO #s 08,09,10,11. Leave open if not
used.
SSMD0, SSMD1,
SSMD2, SSMD3,
SSMCLK, SSMCP,
SSMCMD, SSMWP
I/O Used to make an SD card interface. SD card firmware is not supported at present in JB2.
Leave open.
VIDEO
AV0CLK, AV0CTRL0,
AV0CTRL1,
AV0CTRL2,
AV0DATA0, AV0DATA1,
AV0DATA2, AV0DATA3,
AV1DATA0, AV1DATA1,
AV1DATA2, AV1DATA3
O ITU-R BT.656 digital video output signals. Optionally used to make a TVout menu display, o
r
to display decoded album art. Can be connected to video D/A converter (see Note 7), or
connected to a video DSP.
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GPIO (not already
mentioned elsewhere
in this table)
A22 O GPIO18 Reserved for NOR flash address A22. Leave open.
A23 O GPIO-16 Reserved for NOR flash address A23. Leave open.
NWAIT I/O GPIO-15 Not currently assigned. Leave open.
NCS2 I GPIO-19 Assigned to iPod dock connector iPod NDETECT. See Note 8.
VCO1 I/O GPIO-07 Not currently assigned. Leave open.
MIICRS I/O GPIO-00 Not currently assigned. Leave open.
MIICOL I/O GPIO-01 Not currently assigned. Leave open.
MIITXER I/O GPIO-02 Not currently assigned. Leave open.
MIITXCLK I/O GPIO-03 iPod dock connector Accessory Power signal. See Note 8.
MII
MIITXD0, MIITXD1,
MIIRXD0, MIIRXD1 I/O Can be used, with GPIO signals above, to drive an external ethernet PHY. This is not
supported by JB2 firmware. Leave open.
LCD
LCDD0, LCDD1,
LCDD2, LCDD3,
LCDD4, LCDD5,
LCDD6, LCDD7,
LCDD8, LCDD9,
LCDD10, LCDD11,
LCDD12, LCDD13,
LCDD14, LCDD15,
LCD16, LCDD17,
LCDCLK, LCDCTRL0,
LCDCTRL1,
LCDCTRL2,
LCDCTRL3
O Uses optional J1 LCD connector. Connect to local LCD display. See Note 9. Leave open if
not used.
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Notes:
1. Signal type codes:
I – 3.3V level Digital Logic Input into the DM870A
O – 3.3V level Digital Logic Output from the DM870A
IO – 3.3V level Digital Logic Input and Output (bi-directional) signal
M – Miscellaneous, see text for description
P – Power Supply
2. For SPI timing diagram for eDMP applications, please see:
BridgeCo_JB2x - DeviceControlProtocol_Registers_v_2_1.pdf, or later version.
For detailed setup and hold timing details, see DM870A IC data sheet:
DM870A DS rev. 1.3_12-15-11.pdf, or later version.
3. For audio port timing diagrams, and for detailed setup and hold timing, please see DM870A IC data sheet:
DM870A DS rev. 1.3_12-15-11.pdf, or later version.
4. For example ethernet external schematic, see:
CX Module Ethernet (RJ45 + Ext.Magnetics)_V1.2.pdf, or later version.
This schematic is typically compressed into a zip file, for example:
CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar
5. For example USB schematics, see:
CX Module USB_V1.2.pdf, or later version.
This schematic is typically compressed into a zip file, for example:
CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar
6. For example use of extended GPIO shift registers, see CE2 schematic:
A EVMCE2-4_schematic.pdf, or later version.
7. For example connection to a video D/A converter, see CE2 schematic:
A EVMCE2-4_schematic.pdf, or later version.
8. iPod dock connector pin and GPIO assignments are under discussion. Please contact SMSC for
recommendations for iPod dock connections to CX870 module.
9. For example connection to an LCD display, see CE2 schematic:
A EVMCE2-4_schematic.pdf, or later version.
10. All the above signals are brought out to J2 pins. Not all the above signals are brought out to J3, the 64-pin
low density connector. The J3 pin assignments table shows which signals are brought out to the J3 pins.
11. SMSC has a set of example motherboard schematics that shows example external circuitry that is typically
connected to the module. Please check the SMSC/BridgeCo customer portal at https://portal.bridgeco.net/
for a copy of these example schematics. These schematics are typically compressed into a zip file, for
example:
CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar
12. Please check the SMSC/BridgeCo Customer Portal Download area for the latest version of the SMSC
documents. Go to https://portal.bridgeco.net/. If you do not have an account, please contact SMSC.
COMPANY CONFIDENTIAL
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8.2.2 Connector PIN Assignments
J2 – Media Connector
Function GPIO IC PIN Signal Signal IC PIN GPIO Function
GND 1 2 GND
VIN (+3.3V) 3 4 VIN (+3.3V)
VIN (+3.3V) 5 6 VIN (+3.3V)
GND 7 8 GND
VIN (+1.2V) 9 10 VIN (+1.2V)
VIN (+1.2V) 11 12 VIN (+1.2V)
GND 13 14 GND
VIN (+1.9V) 15 16 VIN (+1.9V)
GND 17 18 GND
3V3RTC 19 20 GND
GND 21 22 TMS B15
GND 23 24 TCK C14
D15 SPI_DOUT 25 26 TDI A16
D14 SPI_DIN 27 28 TDO A15
B16 SPI_CLK 29 30 SPI_NCS0 C15
C13 TXD0 31 32 SPI_NCS1 B17
B14 RXD0 33 34 NRESET_MOD Module reset input
A14 RXD1 35 36 SSMD6 C12 GPIO-10 SPI_E_CLK
B13 TXD1 37 38 SSMD4 A12 GPIO-08 SPI_E_SDO
GND 39 40 SSMD2 C11
SPI_E_NCS GPIO-11 D12 SSMD7 41 42 SSMD1 B11
SPI_E_SDI GPIO-09 B12 SSMD5 43 44 SSMCMD A13
D11 SSMD3 45 46 SSMWP D9
A11 SSMD0 47 48 NCS3 H18 GPIO-17 BIST activate
C10 SSMCLK 49 50 NCS2 J17 GPIO-19 iPod NDETECT
D10 SSMCP 51 52 GND
GND 53 54 USB_VBUS D2
A1 USB_DN 55 56 GND
B1 USB_DP 57 58 AOUTRN L3
E3 USBVBUSDRV 59 60 AOUTRP L4
GND 61 62 GND
K4 AOUTLP 63 64 PDOUT1 J1 GPIO-06 SPI_REQ
L2 AOUTLN 65 66 VCO1 J2 GPIO-07
GND 67 68 PDOUT0 K1 GPIO-04 Factory reset
GPIO-16 H17 A23 69 70
V
CO0 K2 GPIO-05 IR input
GPIO-18 H16 A22 71 72
A
V3CLK R4 GPIO-12 ETH NRESET
I2C SDA GPIO-14 T3 AV3CTRL1 73 74 AV0CTRL0 M1
I2C SCL GPIO-13 U2 AV3CTRL0 75 76 AV1DATA3 N4
M3 AV0CTRL2 77 78 AV1DATA2 P1
M2 AV0CTRL1 79 80 AV1DATA1 P2
L1 AV0CLK 81 82 AV1DATA0 P3
M4 AV0DATA3 83 84 GND
N1 AV0DATA2 85 86 AV2CTRL1 T1 MCLK
N2 AV0DATA1 87 88 GND
N3 AV0DATA0 89 90 AV2CLK R1 SCLK
GND 91 92 GND
LRCK T1 AV2CTRL0 93 94 AV4DATA1 U3 SPDIF output
A/D data 1 P4 AV2DATA3 95 96 AV4DATA0 V2 SPDIF input
A/D data 0 R3 AV2DATA2 97 98 GND
D/A data 1 T2 AV2DATA1 99 100 ETH_LED_ACT
D/A data 0 U1 AV2DATA0 101 102 ETH_LED_SPEED
GND 103 104 MIICRS R14 GPIO-00
ETH_RXN 105 106 MIICOL T13 GPIO-01
ETH_RXP 107 108 MIITXER T11 GPIO-02
109 110 MIITXCLK R12 GPIO-03 iPod Access Power
ETH_TXN 111 112 MIITXD0 U10
ETH_TXP 113 114 MIITXD1 V10
GND 115 116 MIIRXD0 U12
GPIO-15 K18 NWAIT 117 118 MIIRXD1 V12
NPD_RF 119 120 GND
USB
Video Output
Ethernet
USB
Video Output
Ethernet
PIN Number
SPI
Debug UART
JTAG
SPI
Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This
allows for easy cross-reference to the DM860A or DM870A data sheet information.
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J1 – LCD Connector
Function GPIO IC PIN Signal Signal IC PIN GPIO Function
GND 12
GND
V8 LCDD0 34
LCDD1 U8
T8 LCDD2 56
LCDD3 R8
V7 LCDD4 78
LCDD5 U7
T7 LCDD6 910
LCDD7 R7
V6 LCDD8 11 12 LCDD9 U6
T6 LCDD10 13 14 LCDD11 R6
V5 LCDD12 15 16 LCDD13 U5
T5 LCDD14 17 18 LCDD15 V4
U4 LCDD16 19 20 LCDD17 V3
GND 21 22 GND
T10 LCDCLK 23 24 LCDCTRL0 R9
T9 LCDCTRL1 25 26 LCDCTRL2 U9
V9 LCDCTRL3 27 28 GND
GND 29 30 GND
PIN Number
LCD Interface
LCD Interface
LCD Interface
LCD Interface
Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This
allows for easy cross-reference to the DM860A or DM870A data sheet information.
J3 – Low Density Connector
Function GPIO IC PIN Signal Signal IC PIN GPIO Function
GND 12GND
VIN (+3.3) 34RXD0 B14
VIN (+3.3) 56TXD0 C13
GND 78GND
VIN (+1.9) 910VIN (+1.2)
VIN (+1.9) 11 12 VIN (+1.2)
GND 13 14 GND
Free GPIO-15 K18 NWAIT 15 16 RXD1 A14
iPod NDETECT GPIO-19 J17 NCS2 17 18 TXD1 B13
D13 NRESET 19 20 GND
3V3RTC 21 22 AV2CTRL1 R2 MCLK
GND 23 24 AV2CTRL0 T1 LRCK
D14 SPI_DIN 25 26 AV2CLK R1 SCLK
D15 SPI_DOUT 27 28 AV2DATA2 R3 A/D data 0
B16 SPI_CLK 29 30 AV2DATA0 U1 D/A data 0
C15 SPI_NCS0 31 32 AV4DATA1 T2 SPDIF output
Free GPIO-17 H18 NCS3 33 34 AV4DATA0 V2 SPDIF input
GND 35 36 GND
E-GPIO_NCS/TBA GPIO-11 D12 SSMD7 37 38 USB_DN A1
I2C SDA GPIO-14 T3 AV3CTRL1 39 40 USB_DP B1
I2C SCL GPIO-13 U2 AV3CTRL0 41 42 USBVBUSDRV E3
GND 43 44 USB_VBUS D2
SPI_REQ GPIO-06 J1 PDOUT1 45 46 GND
Factory Reset GPIO-04 K1 PDOUT0 47 48 SSMD5 B12 GPIO-09 E-GPIO_SDI/TBA
IR input GPIO-05 K2 VCO0 49 50 SSMD4 A12 GPIO-08 E-GPIO_SDO/TBA
GND 51 52 GND
ETH_LED_SPEED 53 54 ETH_LED_ACT
iPod Access Power GPIO-03 R12 MIITXCLK 55 56 SSMD6 C12 GPIO-10 E-GPIO_CLK/TBA
ETH_RXN 57 58 ETH_RXP
ETH_TXN 59 60 ETH_TXP
Free GPIO-00 R14 MIICRS 61 62 MIICOL T13 GPIO-01 Free
GND 63 64 GND
PIN Number
Debug UART
USB
SPI
Ethernet
EthernetEthernet
Ethernet
Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This
allows for easy cross-reference to the DM860A or DM870A data sheet information.
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8.2.3 GPIO Assignments
GPIO Assignments for J3 64-pin Low Density Connector
GPIO PIN Name PIN Number Function
00 MIICRS 61 Free
01 MIICOL 62 Free
03 MIITXCLK 55 iPOD Access Power
04 PDOUT0 47 Factory Reset
05 VCO0 49 IR Input
06 PDOUT1 45 Host NIREQ
08 SSMD4 50 E_GPIO_SDO/TBA
09 SSMD5 48 E_GPIO_SDI/TBA
10 SSMD6 56 E_GPIO_CLK/TBA
11 SSMD7 37 E_GPIO_NCS/TBA
13 AV3CTRL0 41 I2C_SCL
14 AV3CTRL1 39 I2C_SDA
15 NWAIT 15 Free
17 NCS3 33 Free
19 NCS2 17 IPOD NDETECT
Note: Not all 20 GPIO signals are brought out to J3 64-pin low density connector. For the CX870-3K, GPIOs 00,
01 and 03 are not brought out to J3 64-pin low density connector. J3 pin numbers 61, 62 and 55 are not connected
to any signal in the CX870-3K module.
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9 Application Guidelines
9.1 Power Supply sequencing and Reset Timing
There are strict power sequencing and reset timing requirements.
Power up the I/O voltage (3.3V) first and hold NRESET_MOD low.
The core voltage (1.2V) must never be higher than (I/O voltage +0.5 V).
The core voltage (1.2V) must be within the specified core voltage limits less than 300ms after the I/O voltage (3.3V)
reaches the specified I/O voltage limits.
Throughout the power down process, the 3.3V supply must maintain a higher voltage than the 1.2V supply, until both
have reached ground potential.
To assure a proper IC reset, the power supplies must be present for a minimum time of 2ms before NRESET_MOD is
de-asserted.
Please see the power and reset timing figure in Section 9.1.1 below.
About 1.9V, the arrival of 1.9V supply should lag behind the arrival of the 3.3V. The delay between the 1.9V and the 3.3V is
not critical. Typical delay is approximately 10ms, for example using 10kohm resistor and 0.1uF capacitor on the enable pin of
a 1.9V dc-to-dc converter.
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9.1.1 Power up, Reset and Power Down Timing
Time
Voltage
NRESET_MOD
0V
+1.2V
+3.3V
< 300ms
>= 2ms
Power Up Power Down
9.2 RF Considerations
Note that overall system, RF and WiFi performance is significantly affected by the product design, environment and the
application. It is the responsibility of the product designer to ensure proper system level shielding (if required) and to verify
performance and fitness for the given product features and applications.
The WiFi performance will be affected by the RF environment surrounding the CX module. Please ensure that the CX module
is positioned in a “quiet” RF environment, as far away as possible from high frequency clock signals and any other sources of
RF energy. Also, make sure the antenna is not shielded by any metal objects, for example loudspeakers or other metal parts.
Please make sure that the power supplies, in particular the +1.9V supply, are quiet and free from noise.
SMSC recommends that systems implementing AirPlay should use a module configuration that includes on-module
shielding, as well as paying particular attention to system configuration and shielding. In particular, SMSC is recommending
the use of the Bottom Shield versions of the modules, which allows greater freedom in antenna positioning.
Also, please see the SMSC Application Note:
SMSCAppNote - CX870_Antenna_Placement_V1_4.pdf
regarding antenna positioning guidelines.
Please see below picture for the recommended keep out area and cable routing for the antennas.