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| Document ID | 2126697 |
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| Document Description | UserMan |
| Short Term Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 213.15kB (2664321 bits) |
| Date Submitted | 2013-11-25 00:00:00 |
| Date Available | 2013-11-26 00:00:00 |
| Creation Date | 2013-10-21 14:58:28 |
| Producing Software | Acrobat Distiller 9.0.0 (Windows) |
| Document Lastmod | 2013-10-21 14:58:28 |
| Document Title | Microsoft Word - Approval-sheet-Liteon CX870-3OB module_V00_20131009.docx |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | Administrator |
COMPANY CONFIDENTIAL 4F, 90, Chien 1 Road, Chungho, New Taipei City 235, Taiwan, R.O.C. TEL: +886-2-2222-6181 Fax: +886-2-2222-3882 光寶科技股份有限公司 台北縣中和市建一路 90 號 4F 電話: 02-2222-6181 傳真: 02-2222-3882 客 戶 名 稱: Customer Name: YAMAHA 承 認 書 (Specification Sheet) 品 名 (Part Name) 承認書版本(Approval Sheet Rev.) 客戶料號 (Customer Part No.) 光寶料號 (Liteon Part No.) SMSC CX870-3OB Module Preliminary version 客 戶 簽 認 Customer Approval: _________________________________________ Prepared by Reviewed by Approved by Frank Gung Total Pages Date Sales 2013/10/09 Elisa Liou COMPANY CONFIDENTIAL Index Index .........................................................................................................................................................2 Revision History .......................................................................................................................................3 Part1. Module Spec Sheet....................................................................................................................4 Introduction ....................................................................................................................................4 Block Diagram ................................................................................................................................4 Board Pictures.................................................................................................................................5 3.1 Top View of CX Module ........................................................................................................5 3.2 Bottom View of CX Module ..................................................................................................6 3.2.1 CX Module Bottom View w/64-pin Low Density Connector.............................................6 3.2.2 CX Module Bottom View w/120-pin Media Connector .....................................................6 3.3 Production Module with Top and RF shields in place – Top View........................................7 3.4 Production Module with 64-pin Connector Option – Side View ...........................................7 3.5 Example Production Module Showing Soldered RF Shield ..................................................8 3.6 Production Module with Bottom Shield (Part Numbers with a “B” after the configuration letter) 9 3.6.1 Including J3 Low Density 64-pin connector – Bottom View..............................................9 3.6.2 Including J2 High Density 120-pin connector – Bottom View ...........................................9 Ordering Guide.............................................................................................................................10 4.1 Part Number Syntax .............................................................................................................10 Electrical Specifications ...............................................................................................................11 5.1 Absolute Maximum Ratings.................................................................................................12 5.2 Operating Conditions ...........................................................................................................12 5.3 WiFi Specification (CX870 only) ........................................................................................13 Regulatory Compliance and Quality ..........................................................................................14 6.0.1 Antenna Considerations.............................................................................................................14 6.0.2 CX Power Settings Used For Modular Approval ......................................................................14 6.0.3 FCC IC Warning Message .........................................................................................................15 6.1 RoHS ....................................................................................................................................17 6.2 Environmental Test...............................................................................................................17 6.3 ESD and Transient Test (Applies to LAN and USB external connections only) .................17 6.4 Magnetic Field Test ..............................................................................................................17 6.5 MTBF ...................................................................................................................................17 6.6 Mechanical Specifications....................................................................................................17 6.7 Module Quality ....................................................................................................................17 Board Dimensions and Weight ....................................................................................................18 7.1 Top & Bottom View of CX870 Module without Bottom Shield .........................................18 7.1.1 Top & Bottom View of CX Module with Bottom Shield..................................................18 7.2 Side View of CX870 module without Bottom Shield ..........................................................19 7.2.1 Side View of CX Module with Bottom Shield except CX870-3JB ..................................19 7.3 3D View of CX870 Module without Bottom Shield............................................................20 7.4 Module Weight .....................................................................................................................20 Connectors and Connections .......................................................................................................21 8.1 WLAN UFL Antenna Connector (optional).........................................................................21 8.2 Module Connectors ..............................................................................................................21 8.2.1 Pin Descriptions ................................................................................................................22 8.2.2 Connector PIN Assignments .............................................................................................27 8.2.3 GPIO Assignments ............................................................................................................29 Application Guidelines .................................................................................................................30 9.1 Power Supply sequencing and Reset Timing .......................................................................30 COMPANY CONFIDENTIAL 9.1.1 9.2 Power up, Reset and Power Down Timing .......................................................................31 RF Considerations ................................................................................................................31 Revision History Date 10/09/2013 Version Rev 00 Description Preliminary This documentation describes the marketing requirements specification of the Lite-on made CX870 Wireless module. It is a confidential document of LITEON. COMPANY CONFIDENTIAL Part1. Module Spec Sheet Introduction The CX-series module is a single-board networked media player module, based on SMSC’s DM870A and DM875 media processors, and enables fast product developments with Ethernet, USB and optional WiFi connectivity. The module connects to standard legacy components in various audio, video/LCD and control formats. Block Diagram JukeBlox Networked Media Module – CX Series DM870A or DM875 3.3V 1.2V 1.9V Reset In RJ-45 Transformer RST Ethernet Transceiver USB Type-A Display SD-Card 3x6bit RGB I2C A/D, D/A S/PDIF Video Out Audio I/O UART JTAG Host Controller/ LCD setup SPI Ctrl. GPIO NAND-Flash USB Mem. Bus 256 Mbit SDRAM NOR-Flash I2C 802.11 PWM DAC CCIR-656 Flash LCD SSM 4/8bit MMC Apple Coprocessor RMII 2.4 GHz RF transceiver DAC AV Ports UART JTAG SPI GPIO Note: Choice of antenna is a build option, see Ordering Guide. RF Amp. ANT switch Ext. PCB Ext. PCB Antenna Antenna Antenna Antenna 24.000 MHz COMPANY CONFIDENTIAL Board Pictures Please note that all production modules include the RF and top shield. The below top view has the shields temporarily removed to show the components. Also, please note that the 64-pin connector mounted on the module is the male gender. 3.1 Top View of CX Module 802.11b/g front-end SDRAM PCB antenna PCB antenna External Antenna Connectors SMSC processor Ethernet PHY COMPANY CONFIDENTIAL 3.2 3.2.1 Bottom View of CX Module CX Module Bottom View w/64-pin Low Density Connector LCD connector FLASH Low density connector 3.2.2 CX Module Bottom View w/120-pin Media Connector LCD connector FLASH Media connector COMPANY CONFIDENTIAL 3.3 Production Module with Top and RF shields in place – Top View 3.4 Production Module with 64-pin Connector Option – Side View COMPANY CONFIDENTIAL 3.5 Example Production Module Showing Soldered RF Shield COMPANY CONFIDENTIAL 3.6 Production Module with Bottom Shield (Part Numbers with a “B” after the configuration letter) 3.6.1 Including J3 Low Density 64-pin connector – Bottom View 3.6.2 Including J2 High Density 120-pin connector – Bottom View COMPANY CONFIDENTIAL Ordering Guide Part Number CX870-3OB IC's Phase DM870A+T6201 Released WiFi (onmodule PCB diveristy) Ext. Diverstiy Antennas (UFL One Two Ant. Ant. Eth USB Host Low Density 64-pin conn. HiDensity 120-pin Conn. HiTop Bottom Density 64MB 32MB 16MB 8MB 1Gb 32MB 8MB Module Module 1.9V Status LCD SDRAM SDRAM SDRAM SDRAM NAND NOR NOR Shield Shield Conn. CA Note: Please note that the Apple Authentication Coprocessor will not be provided on the CX module. The Apple Authentication Coprocessor should be provided on the product motherboard, connected to the SDA, SCL signals from the CX module. Note: Shaded rows indicate Custom or Obsolete configuration - NOT TO BE USED FOR NEW/STANDARD MP DESIGNS. Status code: C - Custom | S - Standard | O - Obsolete | A - Available * Connector on board, but requires board modification to enable the connector. + The position of the X in the One Ant. column indicates that there is one external antenna connector provided. The position of the X in the Two Ant. column indicates that there are two external antenna connectors provided. Do not use a module which has two external antenna connectors with only one external antenna connected. Leaving one antenna socket open will degrade WiFi performance. SMSC recommends always using modules with two external antennas for best performance. % The CX870-3DS is the same as CX870-3D, except that the RF shield is soldered in place. 4.1 Part Number Syntax 10 COMPANY CONFIDENTIAL Electrical Specifications Parameter State Model Power Supply Input Voltage VIN Logic Input high voltage Logic Input low voltage Logic Input threshold voltage Schmitt-trigger input low to high threshold voltage Schmitt-trigger input high to low threshold voltage Logic Output high voltage Logic Output low voltage Logic Low-level output current (VOL=0.4V) Logic High-level output current (VOH=2.4V) VIH VIL VIT min. 3.0 1.08 1.8 1.7 -0.3 1.29 VIT+ 1.58 1.65 1.71 VIT- 0.95 1.01 1.06 VOH VOL 2.4 0.4 IOL -9.6 -15.6 -19.3 mA IOH 11.1 22.5 35.3 mA 60 32 18 185 337 257 240 347 258 78 42 23 241 438 334 312 451 335 mA mA mA mA mA mA mA mA mA Reset State Current Consumption Operating in idle state CX870 Playback over WiFi high mips & rate condition Voltage 3.3 1.2 1.9 3.3 1.2 1.9 3.3 1.2 1.9 Symbol I3.3 I1.2 I1.9 I3.3 I1.2 I1.9 I3.3 I1.2 I1.9 typ. 3.3 1.2 1.9 1.39 max. 3.6 1.32 2.0 5.5 0.7 1.5 Units Note: The maximum current values are 30% larger than the typical values. The maximum values are intended to be used for power supply sizing calculations. 11 COMPANY CONFIDENTIAL 5.1 Absolute Maximum Ratings Parameter 3.3V Supply Voltage 1.2V Supply Voltage 1.9V Supply Voltage Logic Input Voltage Logic Output Voltage 5.2 Component Main Min -0.5 -0.5 -0.5 -0.5 -0.5 Max 4.6 1.8 2.2 4.6 Units Operating Conditions Parameter Operating Temperature Operating Humidity Storage Temperature Storage Humidity Storage Temperature Cycle Test 24 hrs Min 10 -10 10 -10 12 Max +70 90 (non condensing) +75 95 (non condensing) +75 Units °C %RH °C %RH °C COMPANY CONFIDENTIAL 5.3 WiFi Specification (CX870 only) Feature WLAN Standards Frequency Band Modulation Transmission Speed Tx Power Description IEEE 802.11b IEEE 802.11g 2.412 – 2.472 GHz (2.4GHz ISM Band, 13 Channels) Channel 1 - Channel 13 North America FCC, Japan Telec, Europe ETSI 802.11b mode (DS-SS: IEEE 802.11b) 802.11g mode (OFDM: IEEE 802.11g) 802.11b mode 11Mbps, 5.5Mbps, 2Mbps, 1Mbps 802.11g mode 54Mbps, 48Mbps, 36Mbps, 24Mbps, 18Mbps, 12Mbps, 9Mbps, 6Mbps 802.11b mode: 16.5dBm, +/-1dB 802.11g mode: 15.0dBm, +/-1dB Using nominal production settings as follows: Channel RF11 Rate: 11B ='3' (11Mbps), 11G = '8' (54Mbps) MIB: 11B=9, 11G=1 (Reference for Tx Power Tuning) Room temperature Power-on Ramp RF Carrier Suppression TX EVM Rx Sensitivity (incl. CE2 Mother board) Throughput Rate (measured for each module) The above TX Power specifications will apply to modules shipped from Liteon after 9 April 2012. < 2us < 15dBc 802.11b mode: <-22dB 802.11g mode: <-25dB 802.11b mode: <=-82dBm @ 1Mbps, <=81dBm @ 2Mbps, <=-81dBm @ 5.5Mbps, <=-78dBm @ 11Mbps 802.11g mode: <=-82dBm @ 9Mbps, <=-81dBm @ 18Mbps, <=-75dBm @ 36Mbps, <=-70dBm @ 54Mbps See factory test specification Note: About Tx Power, different (higher/lower) RF output power settings may be used for specific regions, antennas and/or enclosures, in which case re-certification may be required. 13 COMPANY CONFIDENTIAL Regulatory Compliance and Quality Description Electromagnetic Compatibility (Prescan) Country USA Europe Compliance FCC CFR47 Part15B EN 300328 Module Versions Passed Radio Regulations (CX870 only) USA Japan Canada Europe FCC Part 15C Telec IC RSS-210 CE CX870-3OB 6.0.1 Antenna Considerations Here are the antennas used for certification: Cfg Code Ant. Type CX870-3OB Dipole Ant. Gain (dBi) 2.0 Ant. Model Name Cable : ACA-0200-6G0C6-A1 Antenna : EDA-8709-2G4R2-B7 Notes about antenna changes: 1) Equivalent antennas from other manufacturers may be substituted, and then marketed without a Class II permissive change 2) Equivalent antennas must be of the same type (e.g. dipole, PIFA, etc.), must be of equal or less gain than the antennas listed and previously authorized under the same FCC ID, and must have similar in band and out of band characteristics (consult specification sheet for cutoff frequencies). 3) In case of new antenna types, or higher gain antennas, a Class II permissive change is required and compliance with FCC section 15.203 must be met. 6.0.2 CX Power Settings Used For Modular Approval 11b 11g 11b 11g SKU of Module : CX870‐3OB FCC (2.4G) Channel 2412 (1) 2437 (6) Power Setting Channel 2412 (1) 2437 (6) Power Setting 2462(11) 2462(11) SKU of Module : CX870‐3OB CE (2.4G) Channel 2412 (1) 2437 (6) Power Setting Channel 2412 (1) 2437 (6) Power Setting 2472(13) 2472(13) 14 COMPANY CONFIDENTIAL 6.0.3 FCC IC Warning Message FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/ TV technician for help. CAUTION: Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment. Labeling requirements This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. RF exposure warning This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users and installers must be provide with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. Information for the OEMs and Integrators The following statement must be included with all versions of this document supplied to an OEM or integrator, but should not be distributed to the end user. This device is intended for OEM integrators only. Please See the full Grant of Equipment document for other restrictions. This device must be operated and used with a locally approved access point. Information To Be Supplied to the End User by the OEM or Integrator The following regulatory and safety notices must be published in documentation supplied to the end user of the product or system incorporating an adapter in compliance with local regulations. Host system must be labeled with "Contains FCC ID:A6RVX77A “, FCC ID displayed on label. Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 15 COMPANY CONFIDENTIAL Radio Frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Industry Canada (IC) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the IC RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a person's body). This device has been certified for use in Canada. Status of the listing in the Industry Canada’s REL (Radio Equipment List) can be found at the following web address: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional Canadian information on RF exposure also can be found at the following web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html Canada, avis d'Industry Canada (IC) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes : (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement. Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l’appareil de sans fil Dell est inférieure à la limite d'exposition aux fréquences radio d'Industry Canada (IC). Utilisez l’appareil de sans fil Dell de façon à minimiser les contacts humains lors du fonctionnement normal. Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20 cm du corps d'une personne). Ce périphérique est homologué pour l'utilisation au Canada. Pour consulter l'entrée correspondant à l’appareil dans la liste d'équipement radio (REL - Radio Equipment List) d'Industry Canada rendez-vous sur: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur : http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html Information To Be Supplied to the End User by the OEM or Integrator The following regulatory and safety notices must be published in documentation supplied to the end user of the product or system incorporating an adapter in compliance with local regulations. Host system must be labeled with "Contains IC: 740B-VX77A “, IC ID displayed on label. 16 COMPANY CONFIDENTIAL 6.1 RoHS Uses only RoHS compliant components 6.2 Environmental Test With stands 4 hours at 70°C, 90% RH 6.3 ESD and Transient Test (Applies to LAN and USB external connections only) ESD: +/- 2kV operation, +/- 4kV no destruction (part of CE test) Fast electrical transients: +/- 500V operation, +/- 1000V no destruction (part of CE test) 6.4 Magnetic Field Test Passes EN55022 and EN55024 (part of CE test) 6.5 MTBF >10000 hours 6.6 Mechanical Specifications Passes drop test according to I.E.C. 68-2-32, height 100 cm, 1 corner, 6 faces. Passes vibration test with sine, vertical, 60 minutes, 600 to 18000 cpm, 1G 6.7 Module Quality Defect Rate: < 1% AQL CR=0, MA=0.4, MI=0.4 17 COMPANY CONFIDENTIAL Board Dimensions and Weight 7.1 Top & Bottom View of CX870 Module without Bottom Shield 7.1.1 Top & Bottom View of CX Module with Bottom Shield 18 COMPANY CONFIDENTIAL 7.2 Side View of CX870 module without Bottom Shield Note: 1. 2. 3. 4. 5. 6. 7. All dimensions are measured in millimetres (mm). PCB’s thickness: 1.00 +/- 0.10mm Tolerance: +/-0.10mm Outline Tolerance: +/-0.10mm NPTH Hole: +/-0.05mm PTH Hole: +/-0.075mm Connector positions, board dimensions, mounting hole positions and sizes are the same for all module variants. 8. Connector position tolerance: +/- 0.38mm 9. The 64-pin connector mounted on the module along one edge is the male gender. 10. Not all module variants have all connectors. Please see the Ordering Guide table for details of connector options. 7.2.1 Side View of CX Module with Bottom Shield except CX870-3JB 19 COMPANY CONFIDENTIAL 7.3 3D View of CX870 Module without Bottom Shield Note: A 3D file of the CX module in .stp format is available from the SMSC Customer Portal. 7.4 Module Weight CX870: 20g Note: Module weight applies to all versions of the module. 20 COMPANY CONFIDENTIAL Connectors and Connections 8.1 WLAN UFL Antenna Connector (optional) The module includes two PCB strip antennas operated in diversity mode. Alternatively, one or two coaxial antenna connectors are provided for connecting external (to the module) antennas. The choice between using the strip antenna or using the coaxial sockets is a build option, determined by the position of surface mount capacitors on the module PCB. If the PCB antennas are chosen, then diversity mode is always used. If external (to the module) antenna sockets are used, then two external antennas should be used to provide 2X diversity operation. If external antenna is used, please choose the proper part number indicating two external antenna sockets. Do not use a module which has two external antenna sockets with only one external antenna connected; this will result in reduced WiFi performance. Please see ordering guide for build option details. The surface-mount antenna socket used in the CX module is: UF.L type Ultra Small Surface Mount Coaxial Connector 8.2 Module Connectors The CX860/870 module uses 3 board-to-board connectors as interfaces to the product main board. The part numbers for the connectors needed on the product main board, which mate with the connectors on the CX module, are shown in the table below. Connector Number J1 J2 J3 Connector Purpose LCD Media Low Density Connector Type B2B Connector Number of Pins 30 120 64 Pin Configuration 2 x 15 x 0.5mm 2 x 60 x 0.5mm 2 x 32 x 2.54mm 21 Mating Connector Part Numbers 14-5046-030-145-829+ (Kyocera) 14-5046-120-145-829+ (Kyocera) CSHA201-3202A001A1AB COMPANY CONFIDENTIAL The pinout and signal names are shown on the next page. The following table provides an overview for the most important control and interface signals. 8.2.1 Pin Descriptions Signal(s) Type Description POWER VIN(+3.3V) VIN (+1.2V) VIN (+1.9V) 3V3RTC GND Power supply input ; +3.3V. Power supply input ; +1.2V. Power Supply input; +1.9V for powering RF section. Make sure this is a clean supply. The RTC function is no longer supported. This pin should be left open. Ground (GND) connection for power supply 0V, signal returns and shielding. SPI SPI_DOUT SPI_DIN SPI_CLK SPI_NCS0 PDOUT1 SPI_NCS1 SPI data from DM870A to host controller. SPI data from host controller to DM870A. SPI clock from host controller to DM870A. Maximum recommended frequency is 2MHz, typical frequency is 1MHz. See Note 2 below. SPI chip select from host controller to DM870A. This signal is used as SPI_REQ, SPI request signal, from DM870A to host controller for eDMP applications. Logic 1 indicates that there is an SPI message waiting to be read, the host controller should start the SPI clock and read any changed registers. Logic 0 indicates that all changed register messages have been read and the message buffer is empty. Also GPIO-06. Not used. Leave open. UART RXD1 TXD1 RXD0 TXD0 UART1 input to the DM870A, used for shell access. SMSC recommends providing a connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM port. Such a connection can be used for product development debugging, and for module programming control on the product manufacturing line and for module control during certification procedures. UART1 output from the DM870A, used for shell access. SMSC recommends providing a connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM port. Such a connection can be used for product development debugging, and for module programming control on the product manufacturing line and for module control during certification procedures. UART0 input. Optionally used for controlling an iPod via UART. UART0 output. Optionally used for controlling an iPod via UART. 22 COMPANY CONFIDENTIAL AUDIO AV2DATA0 AV2CTRL0 AV2CTRL1 AV2CLK AV4DATA1 AV4DATA0 AV2DATA1 AOUTLP/AOUTLN, AOUTRP/AOUTRN AV2DATA2 AV2DATA3 CONTROL NCS3 PDOUT0 VCO0 AV3CLK AV3CTRL0, AV3CTRL1 I/O NRESET_MOD NPD_RF I2S or left justified audio data output. Typically connected to external D/A converter input or to external DSP for further audio processing. Used for main left and right channel audio output data. See Note 3. LRCK, audio data word clock at the audio sample rate (Fs). Maximum currently supported frequency is 192kHz. MCLK, audio master clock at 256Fs. This can be used to clock an external D/A converter or DSP. SCLK, audio data bit clock at 64Fs. Allows for up to 32 audio data bits per sample word. SPDIF format output. Can support samples rates up to 192kHz, so the maximum instantaneous frequency on this pin is 24.576MHz. SPDIF input. Not used at present. Leave open. I2S or left justified audio data output. Not used at present. Leave open. Differential stereo output from PWM-DAC, right and left channels. These signals require analog low pass filtering. SMSC is not recommending using the PWM-DAC outputs because of the potential for high out-of-band noise and uncharacterized audio quality. SMSC recommends using an external D/A converter connected to AV2DATA0. I2S or left justified audio data input. Can be driven from an optional external A/D converter used to interface to iPod analog output or other analog audio sources. If not used, leave open. I2S or left justified audio data input. Not used at present. Leave open. This signal is configured as GPIO-17 and is currently not used. DM870A-internal pull-up. Leave this pin open. Factory Reset. GPIO-04. Return the CnE to factory settings. High-active input, DM870A-internal pull-down. Pull to GND with a 10kohm resistor, unless return to factory settings from a hardware control is needed. Normally, return to factory settings is controlled from the host controller via SPI register. This pin is only monitored during the boot up process. Infrared sensor input. GPIO-05. This is a Schmitt-Trigger input and can handle inputs with slow slopes. Used for aDMP firmware builds for infrared remote control sensor output connection to DM870A. For applications with a host controller, pull this pin to +3.3V via a 10kohm resistor. ETH_NRESET Low-active reset for the on-board ethernet PHY. This output is driven by the DM870A. GPIO-12. Leave this pin open. I2C_SCL, I2C_SDA bus created by GPIO-13 and GPIO-14. No internal pull-ups; Use 4.7kohm pull up resistor on each pin to +3.3V. Maximum frequency is 400kHz. Low-active input to reset the module. This signal must be driven by an external reset generator, or by a GPIO output from a host controller. See the application section of this data sheet for the timing requirements for NRESET_MOD. Includes internal 10K pull-up resistor to +3.3V. Active low input to shut down the power for the 802.11 RF section. Internal 10kohm pull-up resistor to +3.3V. Leave open if powering down the RF section is not required. 23 COMPANY CONFIDENTIAL ETHERNET ETH_RXN, ETH_RXP, ETH_TXN, ETH_TXP ETH_LED_SPEED, ETH_LED_ACT Ethernet signals between the PHY on the module and the external magnetics (transformer). See Note 4. Maximum bit rate is 100Mbps. 3.3V push-pull outputs (max. ±12mA) to drive the ethernet LEDs. 100Mbps speed mode and activity are indicated by the outputs being low. Connect to LEDs through 220ohm resistors. USB USB_DN, USB_DP USB_VBUS USBVBUSDRV JTAG TMS,TCK,TDI, TDO I/O JTAG port for DM870A. Leave open. I/O Can be used to drive external shift registers to make extended GPIO signals (see Note 6), or as individual GPIO signals, or to make an SD card interface. SD card firmware is not supported at present in JB2. Can be mapped to GPIO #s 08,09,10,11. Leave open if not used. Used to make an SD card interface. SD card firmware is not supported at present in JB2. Leave open. SSM SSMD4, SSMD5, SSMD6, SSMD7 SSMD0, SSMD1, SSMD2, SSMD3, SSMCLK, SSMCP, SSMCMD, SSMWP VIDEO AV0CLK, AV0CTRL0, AV0CTRL1, AV0CTRL2, AV0DATA0, AV0DATA1, AV0DATA2, AV0DATA3, AV1DATA0, AV1DATA1, AV1DATA2, AV1DATA3 I/O USB data signals, normally connected to type A connector, USB switch or iPod dock connector. Maximum bit rate is USB High Speed at 480Mbps. Analog input for monitoring USB type A connector power. Connect to the +5V power which is driving the USB type A connector power pins. If this pin drops below 4.6V, then the DM870A will drive the USBVBUSDRV signal low to control an external power MOSFET to disconnect +5V power from the USB type A connector. See Note 5. Logic output to control an external MOSFET that is in series with USB type A connector power. See USB_VBUS above and Note 5. ITU-R BT.656 digital video output signals. Optionally used to make a TVout menu display, or to display decoded album art. Can be connected to video D/A converter (see Note 7), or connected to a video DSP. 24 COMPANY CONFIDENTIAL GPIO (not already mentioned elsewhere in this table) A22 A23 NWAIT NCS2 VCO1 MIICRS MIICOL MIITXER MIITXCLK MII MIITXD0, MIITXD1, MIIRXD0, MIIRXD1 LCD LCDD0, LCDD1, LCDD2, LCDD3, LCDD4, LCDD5, LCDD6, LCDD7, LCDD8, LCDD9, LCDD10, LCDD11, LCDD12, LCDD13, LCDD14, LCDD15, LCD16, LCDD17, LCDCLK, LCDCTRL0, LCDCTRL1, LCDCTRL2, LCDCTRL3 I/O I/O I/O I/O I/O I/O GPIO18 Reserved for NOR flash address A22. Leave open. GPIO-16 Reserved for NOR flash address A23. Leave open. GPIO-15 Not currently assigned. Leave open. GPIO-19 Assigned to iPod dock connector iPod NDETECT. See Note 8. GPIO-07 Not currently assigned. Leave open. GPIO-00 Not currently assigned. Leave open. GPIO-01 Not currently assigned. Leave open. GPIO-02 Not currently assigned. Leave open. GPIO-03 iPod dock connector Accessory Power signal. See Note 8. I/O Can be used, with GPIO signals above, to drive an external ethernet PHY. This is not supported by JB2 firmware. Leave open. Uses optional J1 LCD connector. Connect to local LCD display. See Note 9. Leave open if not used. 25 COMPANY CONFIDENTIAL Notes: 1. Signal type codes: I – 3.3V level Digital Logic Input into the DM870A O – 3.3V level Digital Logic Output from the DM870A IO – 3.3V level Digital Logic Input and Output (bi-directional) signal M – Miscellaneous, see text for description P – Power Supply 2. For SPI timing diagram for eDMP applications, please see: BridgeCo_JB2x - DeviceControlProtocol_Registers_v_2_1.pdf, or later version. For detailed setup and hold timing details, see DM870A IC data sheet: DM870A DS rev. 1.3_12-15-11.pdf, or later version. 3. For audio port timing diagrams, and for detailed setup and hold timing, please see DM870A IC data sheet: DM870A DS rev. 1.3_12-15-11.pdf, or later version. 4. For example ethernet external schematic, see: CX Module Ethernet (RJ45 + Ext.Magnetics)_V1.2.pdf, or later version. This schematic is typically compressed into a zip file, for example: CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar 5. For example USB schematics, see: CX Module USB_V1.2.pdf, or later version. This schematic is typically compressed into a zip file, for example: CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar 6. For example use of extended GPIO shift registers, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version. 7. For example connection to a video D/A converter, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version. 8. iPod dock connector pin and GPIO assignments are under discussion. Please contact SMSC for recommendations for iPod dock connections to CX870 module. 9. For example connection to an LCD display, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version. 10. All the above signals are brought out to J2 pins. Not all the above signals are brought out to J3, the 64-pin low density connector. The J3 pin assignments table shows which signals are brought out to the J3 pins. 11. SMSC has a set of example motherboard schematics that shows example external circuitry that is typically connected to the module. Please check the SMSC/BridgeCo customer portal at https://portal.bridgeco.net/ for a copy of these example schematics. These schematics are typically compressed into a zip file, for example: CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar 12. Please check the SMSC/BridgeCo Customer Portal Download area for the latest version of the SMSC documents. Go to https://portal.bridgeco.net/. If you do not have an account, please contact SMSC. 26 COMPANY CONFIDENTIAL 8.2.2 Connector PIN Assignments J2 – Media Connector Function GPIO IC PIN Signal D15 D14 B16 C13 B14 A14 B13 SPI Debug UART SPI_E_NCS SPI_E_SDI GPIO-11 GPIO-09 D12 B12 D11 A11 C10 D10 A1 B1 E3 USB K4 L2 GPIO-16 GPIO-18 GPIO-14 GPIO-13 I2C SDA I2C SCL Video Output LRCK A/D data 1 A/D data 0 D/A data 1 D/A data 0 H17 H16 T3 U2 M3 M2 L1 M4 N1 N2 N3 T1 P4 R3 T2 U1 GND VIN (+3.3V) VIN (+3.3V) GND VIN (+1.2V) VIN (+1.2V) GND VIN (+1.9V) GND 3V3RTC GND GND SPI_DOUT SPI_DIN SPI_CLK TXD0 RXD0 RXD1 TXD1 GND SSMD7 SSMD5 SSMD3 SSMD0 SSMCLK SSMCP GND USB_DN USB_DP USBVBUSDRV GND AOUTLP AOUTLN GND A23 A22 AV3CTRL1 AV3CTRL0 AV0CTRL2 AV0CTRL1 AV0CLK AV0DATA3 AV0DATA2 AV0DATA1 AV0DATA0 GND AV2CTRL0 AV2DATA3 AV2DATA2 AV2DATA1 AV2DATA0 GND ETH_RXN ETH_RXP Ethernet GPIO-15 K18 ETH_TXN ETH_TXP GND NWAIT NPD_RF PIN Number Signal 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 GND VIN (+3.3V) VIN (+3.3V) GND VIN (+1.2V) VIN (+1.2V) GND VIN (+1.9V) GND GND TMS TCK TDI TDO SPI_NCS0 SPI_NCS1 NRESET_MOD SSMD6 SSMD4 SSMD2 SSMD1 SSMCMD SSMWP NCS3 NCS2 GND USB_VBUS GND AOUTRN AOUTRP GND PDOUT1 VCO1 PDOUT0 VCO0 AV3CLK AV0CTRL0 AV1DATA3 AV1DATA2 AV1DATA1 AV1DATA0 GND AV2CTRL1 GND AV2CLK GND AV4DATA1 AV4DATA0 GND ETH_LED_ACT ETH_LED_SPEED MIICRS MIICOL MIITXER MIITXCLK MIITXD0 MIITXD1 MIIRXD0 MIIRXD1 GND 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 IC PIN GPIO Function B15 C14 A16 A15 C15 B17 C12 A12 C11 B11 A13 D9 H18 J17 JTAG SPI Module reset input GPIO-10 SPI_E_CLK GPIO-08 SPI_E_SDO GPIO-17 BIST activate GPIO-19 iPod NDETECT USB D2 L3 L4 J1 J2 K1 K2 R4 M1 N4 P1 P2 P3 GPIO-06 GPIO-07 GPIO-04 GPIO-05 GPIO-12 SPI_REQ Factory reset IR input ETH NRESET Video Output T1 MCLK R1 SCLK U3 V2 SPDIF output SPDIF input Ethernet R14 T13 T11 R12 U10 V10 U12 V12 GPIO-00 GPIO-01 GPIO-02 GPIO-03 iPod Access Power Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This allows for easy cross-reference to the DM860A or DM870A data sheet information. 27 COMPANY CONFIDENTIAL J1 – LCD Connector Function GPIO IC PIN Signal LCD Interface V8 T8 V7 T7 V6 T6 V5 T5 U4 LCD Interface T10 T9 V9 GND LCDD0 LCDD2 LCDD4 LCDD6 LCDD8 LCDD10 LCDD12 LCDD14 LCDD16 GND LCDCLK LCDCTRL1 LCDCTRL3 GND PIN Number 11 13 15 17 19 21 23 25 27 29 10 12 14 16 18 20 22 24 26 28 30 Signal GND LCDD1 LCDD3 LCDD5 LCDD7 LCDD9 LCDD11 LCDD13 LCDD15 LCDD17 GND LCDCTRL0 LCDCTRL2 GND GND IC PIN GPIO Function U8 R8 U7 R7 U6 R6 U5 V4 V3 LCD Interface R9 U9 LCD Interface Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This allows for easy cross-reference to the DM860A or DM870A data sheet information. J3 – Low Density Connector Function GPIO IC PIN Signal Free iPod NDETECT GPIO-15 GPIO-19 K18 J17 D13 Free GPIO-17 D14 D15 B16 C15 H18 E-GPIO_NCS/TBA I2C SDA I2C SCL GPIO-11 GPIO-14 GPIO-13 D12 T3 U2 SPI_REQ Factory Reset IR input GPIO-06 GPIO-04 GPIO-05 J1 K1 K2 SPI Ethernet iPod Access Power GPIO-03 R12 Ethernet Free GPIO-00 R14 GND VIN (+3.3) VIN (+3.3) GND VIN (+1.9) VIN (+1.9) GND NWAIT NCS2 NRESET 3V3RTC GND SPI_DIN SPI_DOUT SPI_CLK SPI_NCS0 NCS3 GND SSMD7 AV3CTRL1 AV3CTRL0 GND PDOUT1 PDOUT0 VCO0 GND ETH_LED_SPEED MIITXCLK ETH_RXN ETH_TXN MIICRS GND PIN Number 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 Signal GND RXD0 TXD0 GND VIN (+1.2) VIN (+1.2) GND RXD1 TXD1 GND AV2CTRL1 AV2CTRL0 AV2CLK AV2DATA2 AV2DATA0 AV4DATA1 AV4DATA0 GND USB_DN USB_DP USBVBUSDRV USB_VBUS GND SSMD5 SSMD4 GND ETH_LED_ACT SSMD6 ETH_RXP ETH_TXP MIICOL GND IC PIN GPIO Function B14 C13 A14 B13 R2 T1 R1 R3 U1 T2 V2 A1 B1 E3 D2 Debug UART MCLK LRCK SCLK A/D data 0 D/A data 0 SPDIF output SPDIF input USB B12 A12 GPIO-09 E-GPIO_SDI/TBA GPIO-08 E-GPIO_SDO/TBA C12 Ethernet GPIO-10 E-GPIO_CLK/TBA T13 GPIO-01 Free Ethernet Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This allows for easy cross-reference to the DM860A or DM870A data sheet information. 28 COMPANY CONFIDENTIAL 8.2.3 GPIO Assignments GPIO Assignments for J3 64-pin Low Density Connector GPIO 00 01 03 04 05 06 08 09 10 11 13 14 15 17 19 PIN Name MIICRS MIICOL MIITXCLK PDOUT0 VCO0 PDOUT1 SSMD4 SSMD5 SSMD6 SSMD7 AV3CTRL0 AV3CTRL1 NWAIT NCS3 NCS2 PIN Number 61 62 55 47 49 45 50 48 56 37 41 39 15 33 17 Function Free Free iPOD Access Power Factory Reset IR Input Host NIREQ E_GPIO_SDO/TBA E_GPIO_SDI/TBA E_GPIO_CLK/TBA E_GPIO_NCS/TBA I2C_SCL I2C_SDA Free Free IPOD NDETECT Note: Not all 20 GPIO signals are brought out to J3 64-pin low density connector. For the CX870-3K, GPIOs 00, 01 and 03 are not brought out to J3 64-pin low density connector. J3 pin numbers 61, 62 and 55 are not connected to any signal in the CX870-3K module. 29 COMPANY CONFIDENTIAL Application Guidelines 9.1 Power Supply sequencing and Reset Timing There are strict power sequencing and reset timing requirements. Power up the I/O voltage (3.3V) first and hold NRESET_MOD low. The core voltage (1.2V) must never be higher than (I/O voltage +0.5 V). The core voltage (1.2V) must be within the specified core voltage limits less than 300ms after the I/O voltage (3.3V) reaches the specified I/O voltage limits. Throughout the power down process, the 3.3V supply must maintain a higher voltage than the 1.2V supply, until both have reached ground potential. To assure a proper IC reset, the power supplies must be present for a minimum time of 2ms before NRESET_MOD is de-asserted. Please see the power and reset timing figure in Section 9.1.1 below. About 1.9V, the arrival of 1.9V supply should lag behind the arrival of the 3.3V. The delay between the 1.9V and the 3.3V is not critical. Typical delay is approximately 10ms, for example using 10kohm resistor and 0.1uF capacitor on the enable pin of a 1.9V dc-to-dc converter. 30 COMPANY CONFIDENTIAL 9.1.1 Power up, Reset and Power Down Timing Voltage Power Up Power Down +3.3V +1.2V 0V < 300ms NRESET_MOD >= 2ms Time 9.2 RF Considerations Note that overall system, RF and WiFi performance is significantly affected by the product design, environment and the application. It is the responsibility of the product designer to ensure proper system level shielding (if required) and to verify performance and fitness for the given product features and applications. The WiFi performance will be affected by the RF environment surrounding the CX module. Please ensure that the CX module is positioned in a “quiet” RF environment, as far away as possible from high frequency clock signals and any other sources of RF energy. Also, make sure the antenna is not shielded by any metal objects, for example loudspeakers or other metal parts. Please make sure that the power supplies, in particular the +1.9V supply, are quiet and free from noise. SMSC recommends that systems implementing AirPlay should use a module configuration that includes on-module shielding, as well as paying particular attention to system configuration and shielding. In particular, SMSC is recommending the use of the Bottom Shield versions of the modules, which allows greater freedom in antenna positioning. Also, please see the SMSC Application Note: SMSCAppNote - CX870_Antenna_Placement_V1_4.pdf regarding antenna positioning guidelines. Please see below picture for the recommended keep out area and cable routing for the antennas. 31
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