Z Com XG182MV02 IEEE 802.11 b/g Wireless SDIO Module User Manual

Z Com Inc IEEE 802.11 b/g Wireless SDIO Module

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Download: Z Com XG182MV02 IEEE 802.11 b/g Wireless SDIO Module User Manual
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Date Submitted2012-09-21 00:00:00
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Z-Com
XG-182M
IEEE 802.11g Wireless Module
Release 0.4
Proprietary & Confidential Information
Specifications are subject to change without notice
FCC Statement
Warning: Changes or modifications to this unit not expressly approved by the
party responsible for compliance could void the user authority to operate the
equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate this equipment.
IEEE 802.11b or 802.11g operation of this product in the U.S.A. is firmware-limited to channels 1 through 11.
CAUTION:
To com ply wit h FCC RF exposure com pliance requirem ent s, a separat ion dist ance of at least 20 cm
m ust be m aint ained bet ween t he ant enna of t his device and all persons.
This Transm it t er m ust not be co- locat ed or operat ing in conj unct ion wit h any ot her ant enna or
t ransm it t er
This device is int ended only for OEM int egrat ors under t he following condit ions:
IMPORTANT
The
ant enna NOTE:
m ust be inst alled such t hat 20 cm is m aint ained bet ween t he ant enna and users. For
Federal
Communication
Statement
lapt
op inst
allat ions, t heCommission
ant enna m(FCC)
ust beRadiation
inst alledExposure
t o ensure
t hat t he proper spacing is m aint ained
This
is compliant
SARt for
population/uncontrolled
in ANSI/IEEE
in
t heEUT
event
t he userswith
places
he general
device in
t heir lap during use exposure
( i.e. positlimits
ioning
of ant ennas m ust be
C95.1-1999
and
has been
tested
thet omeasurement
methods
procedures
placed
in t he
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LCD panelwith
only
ensure 20 cm
will beand
m aint
ained if specified
t he user in
places
he
device
in
heir
lap
for
use)
and
The
ransm
it
er
odule
ay
not
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colocat
ed
wit h any
OET Bulletin 65 Supplement C.
ot her t ransm it t er or ant enna. As long as t he 2 condit ions above are m et , furt her t ransm it t er t est ing
IMPORTANT
NOTE:
will
not be required.
This module
is intended
for OEM
The OEMfor
integrator
still responsible
forfor
theany
FCC compliance
However,
t he
OEM int egrat
or isintegrator.
st ill responsible
t est ing ist heir
end- product
requirement
of the
end product,
which
addit
ional com
pliance
requirem
ent sintegrates
requiredthis
wit module.
h t his m odule inst alled ( for exam ple,
digit al device em issions, PC peripheral requirem ent s, et c.) .
Any changes or modifications not expressly approved by the manufacturer could void the user's authority to
operate this equipment.
IMPORTANT NOTE: I n t he event t hat t hese condit ions can not be m et ( for exam ple cert ain lapt op
configurat ions or co- locat ion wit h anot her t ransm it t er) , t hen t he FCC aut horizat ion is no longer
considered valid and t he FCC I D can not be used on t he final
product . I n t hese circum st ances, t he OEM int egrat or w ill be responsible for re- evaluat ing t he end
product ( including t he t ransm it t er) and obt aining a separat e FCC aut horizat ion.
The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled
environment can be satisfied. The end user has to also be informed that any changes or modifications not
expressly
approved
by the manufacturer could void the user's authority to operate this equipment. If the size
End
Product
Labeling
of
the
end
product
is
smaller
8x10cm,only
thenfor
additional
partwhere
15.19 statement
is required
be alled
This t ransm it t er m odule
is than
aut horized
use in FCC
devices
t he ant enna
m ay betoinst
available
in
the
users
manual:
This
device
complies
with
Part
15
of
FCC
rules.
Operation
is
subject
thes,
such t hat 20 cm m ay be m aint ained bet ween t he ant enna and users ( for exam ple access to
point
rout
ers, w
ireless
ASDL (1)
m odem
s, certmay
ain not
laptcause
op configurat
ions, and sim
ent )must
. Theaccept
final
following
two
conditions:
this device
harmful interference
andilar
(2)equipm
this device
end
product m ust
be labeled
in ainterference
visible areathat
witmay
h t he
following:
" Cont
ains TX FCC
any interference
received,
including
cause
undesired
operation.
I D: M4Y- XG182MV02 ".
LABEL OF THE END PRODUCT:
The Exposure
final end product
mustInformation
be labeled in aThat
visibleMust
area with
the following " Contains TX FCC ID: M4YRF
Manual
be Included
The
users m anual
users
ust include
t he
following
at ion
in a prom
locat ion
XG182MV02".
If the for
sizeend
of the
end m
product
is larger
than
8x10cm,inform
then the
following
FCCinent
part 15.19
"statement
I MPORTANT
NOTE:
To
com
ply
it
FCC
RF
exposure
com
pliance
requirem
ent
s,
he
ant
enna used
has to also be available on the label: This device complies with Part 15 of FCC rules. Operation
for
his
ransm
it
er
ust
be
inst
alled
provide
separat
ion
dist
ance
of
at
least
20
cm
from
is subject to the following two conditions: (1) this device may not cause harmful interference and (2)
thisall
persons and m ust not be co- locat ed or operat ing in conj unct ion wit h any ot her ant enna or
device must accept any interference received, including interference that may cause undesired operation.
t ransm it t er."
Additional Information That Must be Provided to OEM Integrators
The end user should NOT be provided any inst ruct ions on how t o rem ove or inst all t he device.
Service Center in U.S.A
Com pany Nam e : Zcom ax.
Com pany Address: 14545 Valley View Ave., Suit e S Sant a Fe Springs, CA 90670
Tel: 562- 926- 4588
依據
低功率電波輻射性電機管理辦法
第十二條
經型式認證合格之低功率射頻電機,非經許可,公司 商號或使用者均不得擅自變
更頻率 加大功率或變更原設計之特性及功能
第十四條
低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時,
應立即停用,並改善至無干擾時方得繼續使用 前項合法通信,指依電信規定作業
之無線電信 低功率射頻電機須忍受合法通信或工業 科學及醫療用電波輻射性電
機設備之干擾
1. Introduction
Designing for IEEE 802.11b/g WLAN network standard that works at 2.4 GHz Direct Sequence
Spread Spectrum (DSSS), Z-Com XG-182M, a SDIO module, can be embedded in cellular phones,
video, voice and multimedia applications. It target embedded and small form factor SDIO WLAN
devices, offering the lowest possible power consumption.
Main features are:
• MAC/Baseband/RF WLAN system-on-chip (SoC)
• IEEE 802.11g wireless LAN standard
• IEEE 802.11b wireless LAN standard
• Bluetooth coexistence interface supported
• IEEE 802.11i security standard
• WPA/WPA2/WPA-PSK/WPA2-PSK
• AES /40- and 128-bit WEP/TKIP support based on 802.11i standard
• Quality of Service (QoS) compliant to the WMM and draft IEEE 802.11e standards
• IEEE 802.1x security standard
• EAP-TLS/EAP-TTLS/EAP-PEAP
• Deep sleep mode supported, lower power consumption
• RoHs compliant
Proprietary & Confidential Information
Specifications are subject to change without notice
2. Specification
This section defines the hardware and software features, which will be required for Z-Com
XG-182M
2.1 Hardware Specification
Feature
Chip Solution
Host Interface
Connector
Antenna
EEPROM
Power Supply
Operating Requirement
Dimension
Weight
Additional Information
MAC/BB/RF : 88w8686 (QFN Package)
- SDIO/SPI
- Board to board connector
- LGA pad
- Board to board connector (NAIS AXK850145Y)
- One External Antenna
- Hirose U.FL-R-SMT compliant connector
- 8Kbit
Supply voltage
+3.3V± 7%
Max. voltage=6.5V
Peak < 700mA
Consumption current 400mA (typ.)
Internal voltage
+3.3V, +1.8V, +1.2V
Operating Temperature: 00C to 550 C
Operating Humidity: 5 ~ 90%
Storage Temperature: -200C to 800 C
Storage Humidity: 5 ~ 90%
20mm(L)*23mm(W)*3.85mm(H)
TBD
2.2 Firmware Specification
Feature
Standard
Operating Mode
Power Management
Security
Supported OS
Additional Information
IEEE 802.11i security standard
IEEE 802.1x security standard
IEEE 802.11e standard
Infrastructure mode
Ad-hoc mode
Power save mode
Deep sleep mode
WPA/WPA2/WPA-PSK/WPA2-PSK
40- and 128-bit WEP
EAP-TLS/EAP-TTLS/EAP-PEAP
WinCE 5.0
Linux 2.6
Proprietary & Confidential Information
Specifications are subject to change without notice
2.3 Wireless RF Specification
Standard
IEEE 802.11g standard
IEEE 802.11b standard
11g: 54M/48M/36M/24M/18M/12M/9/6Mbps
11b: 11Mbps/5.5Mbps/2Mbps/1Mbps
Direct Sequence Spread Spectrum (DSSS)
AES/40- and 128-bit WEP/TKIP
USA (FCC): 2.412GHz ~ 2.462GHz (Ch1-11)
Europe (CE): 2.412GHz ~ 2.472GHz (Ch1-13)
Japan (TELEC): 2.412GHz ~ 2.472GHz (Ch1-13)
OFDM/QAM-64/QAM-16/QPSK/BPSK
DSSS/CCK/DQPSK/DBPSK
11g : 20.09dBm @ 54Mbps
11b : 18.06dBm @ 11/5.5/2/1Mbps
11g: 54M : -68dBm
11b: 11M : -82dBm
Data Rate
Transmission/Emission Type
Security
RF Frequency Range
Data modulation type
Output Power +-2dB
Sensitivity
2.4 Pin definition
XG-182M Pin Definition of CON1 (NAIS AXK850145Y) and LGA
CON1 LGA
Pin #
Pin#
Pin Name
I/O
Connection
Description
Bluetooth State
0 = normal priority, Rx
17
BT_STATE
88W8686
Pin.56
1 = high priority, Tx
Priority is signaled after BT_PRIORITY has been
asserted. After priority signaling, BT_STATE
BT_FREQ
BT_TX_CON
88W8686
Pin.57
88W8686
indicates the Tx/Rx mode of Bluetooth radio.
4-Wire BCA Mode:
Bluetooth Frequency
Asserted (logic high) when the Bluetooth
transceiver hops into the restricted channels
defined by the coexistence mechanism.
2-Wire, 3-Wire BCA Mode:
Tie to ground (VSS)
Bluetooth WLAN Active
Proprietary & Confidential Information
Specifications are subject to change without notice
FIRM
49
BT_PRIORIT
SDIO_SPI_S
EL
Pin.58
88W8686
Pin.59
2-Wire BCA Mode:
When high, WLAN is transmitting or receiving
packets.
3-Wire BCA Mode:
0 = Bluetooth device allowed to transmit
1 = Bluetooth device not allowed to transmit
This pin drives low when PDn is asserted.
In WLAN Sleep mode, all I/O pads are powered
down. This pad must stay at a low state even in
power down mode.
Bluetooth Priority
2-Wire BCA Mode:
When high, Bluetooth is transmitting or receiving
high priority packets.
3-Wire BCA Mode:
When high, Bluetooth is transmitting or receiving
packets.
88W8686
Pin.22 or
High or NC for SDIO, low for SPI interface
Pin.24
13
10
12
25
11
SPI_SDI/SD_
CMD
I/O
SPI_SINTn/
SD_D2
I/O
SPI_SCSn/S
D_D0
88W8686
Pin.43
88W8686
Pin.46
88W8686
Pin.44
G-SPI Mode: SPI_SDI
G-SPIData Input
SDIO 4-bit Mode: SD_CMD
Command/Response
SDIO 1-bit Mode: SD_CMD
Command Line
SDIO SPI Mode: SD_CMD
Data Input
G-SPI Mode: SPI_SINTn
G-SPI Interrupt Output (active low)
SDIO 4-bit Mode: SD_D2
Data Line Bit[2] or Read Wait (optional)
SDIO 1-bit Mode: SD_D2
Read Wait (optional)
SDIO SPI Mode: SD_D2
Reserved
G-SPI Mode: SPI_SCSn
G-SPI Chip Select Input (active low)
SDIO 4-bit Mode: SD_D0
Data Line Bit [0]
SDIO 1-bit Mode: SD_D0
Data Line
SDIO SPI Mode: SD_D0
Data Output
Proprietary & Confidential Information
Specifications are subject to change without notice
32
16
34
15
35
14
39
46
13,38
2,3
1,18,1
1, 50
SPI_CLK/SD
_CLK
I/O
SPI_SDO/SD
_D1
I/O
SD_D3
I/O
GPIO0
GPIO1
I/O
I/O
88W8686
Pin.42
88W8686
Pin.45
88W8686
Pin.47
88W8686
Pin.11
88W8686
Pin.40
G-SPI Mode: SPI_CLK
G-SPI Clock Input
SDIO 4-bit Mode: SD_CLK
Clock Input
SDIO 1-bit Mode: SD_CLK
Clock Input
SDIO SPI Mode: SD_CLK
Clock Input
G-SPI Mode: SPI_SDO
G-SPI Data Output
SDIO 4-bit Mode: SD_D1
Data Line Bit [1]
SDIO 1-bit Mode: SD_D1
Interrupt
SDIO SPI Mode: SD_D1
Reserved
SDIO 4-bit Mode: SD_D3
Data Line Bit [3]
SDIO 1-bit Mode: SD_D3
Reserved
SDIO SPI Mode: SD_D3
Card Select (active low)
Internal pull-up
General Purpose Input/Output
These pins are asynchronous to internal clocks.
Several of these pins can be selected to perform
alternate functions such as an LED controller.
When not used, these pins should be left floating.
GPIO1 – LED output (strap pin) (Tx power or Rx
ready LED)
GPIO0 – external oscillator control/SLEEPn;
Wake up control
During power down sleep mode, the external
crystal oscillator is disabled, and, if implemented,
also powered down by GPIO0
3.3V
Power
―
Power supply from host
GND
Ground
―
Ground
NC
NC
NC
NC
6,7,8,1
1,12,1
4,15,1
NC
6,17,1
8,19,2
Proprietary & Confidential Information
Specifications are subject to change without notice
0,21,2
2,23,2
4,26,2
7,28,2
9,30,3
1,33,3
6,37,4
0,4142
,43,44,
45,47,
48
Proprietary & Confidential Information
Specifications are subject to change without notice
3. Physical Specification
3.1
Mechanical Drawing
Proprietary & Confidential Information
Specifications are subject to change without notice
3.2 Connector Drawing
(NAIS AXK850 145Y)
Proprietary & Confidential Information
Specifications are subject to change without notice
3.3 LGA Drawing
Fig 5.3.1 XG-182M See-Through Drawing
Fig 5.3.2 XG-182M Top View Drawing
Proprietary & Confidential Information
Specifications are subject to change without notice
Fig 5.3.3 XG-182M Bottom View Drawing
Proprietary & Confidential Information
Specifications are subject to change without notice
4. Necessary Approval
(base on customer’s requirement)
4.1 Country Approval
Safety
EMI
European Union (CE mark)
North America
European Union (CE mark)
Telec
EMS
European Union (CE mark)
EN60950
FCC Part 15 Class B
EN55022 Class B
EN300 328
STD-33
STD-66
VCCI
EN301 489-1
EN301 489-17
Proprietary & Confidential Information
Specifications are subject to change without notice
5. Packaging Specification
The following items will be required for the complete packaging of the Z-Com XG-182M:
Item
Comments
EPE Tray
Suitable size and material to protect product
Inner Box
Suitable size and material to protect product
Carton
XG-182M
Suitable size and material to protect product
WLAN module
5.1 Package drawing (Reference only)
Proprietary & Confidential Information
Specifications are subject to change without notice
6. Documents:
8.1 Reliability Test Plan: TBD
7. Warranty
One year warranty on the product.
Proprietary & Confidential Information
Specifications are subject to change without notice
7. Test program
DutApiSD83xxp TX Mode command:
12 1
Chose Antenna
22 1 13
Set target power
25 1 13
Enable Duty Cycle Mode
25 0
Disable
17 1 13
Enable Continuous Mode
17 0
Disable
DutApiSD83xxp Read/Write EEPROM command:
53 Read EEPROM
54 Write EEPROM

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