Z Com XG182MV02 IEEE 802.11 b/g Wireless SDIO Module User Manual
Z Com Inc IEEE 802.11 b/g Wireless SDIO Module
Z Com >
Contents
- 1. USer Manual
- 2. user manual
user manual
Z-Com XG-182M IEEE 802.11g Wireless Module Release 0.4 Proprietary & Confidential Information Specifications are subject to change without notice FCC Statement Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. IEEE 802.11b or 802.11g operation of this product in the U.S.A. is firmware-limited to channels 1 through 11. CAUTION: To com ply wit h FCC RF exposure com pliance requirem ent s, a separat ion dist ance of at least 20 cm m ust be m aint ained bet ween t he ant enna of t his device and all persons. This Transm it t er m ust not be co- locat ed or operat ing in conj unct ion wit h any ot her ant enna or t ransm it t er This device is int ended only for OEM int egrat ors under t he following condit ions: IMPORTANT The ant enna NOTE: m ust be inst alled such t hat 20 cm is m aint ained bet ween t he ant enna and users. For Federal Communication Statement lapt op inst allat ions, t heCommission ant enna m(FCC) ust beRadiation inst alledExposure t o ensure t hat t he proper spacing is m aint ained This is compliant SARt for population/uncontrolled in ANSI/IEEE in t heEUT event t he userswith places he general device in t heir lap during use exposure ( i.e. positlimits ioning of ant ennas m ust be C95.1-1999 and has been tested thet omeasurement methods procedures placed in t he upper port ion of tinheaccordance LCD panelwith only ensure 20 cm will beand m aint ained if specified t he user in places he device in heir lap for use) and The ransm it er odule ay not be colocat ed wit h any OET Bulletin 65 Supplement C. ot her t ransm it t er or ant enna. As long as t he 2 condit ions above are m et , furt her t ransm it t er t est ing IMPORTANT NOTE: will not be required. This module is intended for OEM The OEMfor integrator still responsible forfor theany FCC compliance However, t he OEM int egrat or isintegrator. st ill responsible t est ing ist heir end- product requirement of the end product, which addit ional com pliance requirem ent sintegrates requiredthis wit module. h t his m odule inst alled ( for exam ple, digit al device em issions, PC peripheral requirem ent s, et c.) . Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. IMPORTANT NOTE: I n t he event t hat t hese condit ions can not be m et ( for exam ple cert ain lapt op configurat ions or co- locat ion wit h anot her t ransm it t er) , t hen t he FCC aut horizat ion is no longer considered valid and t he FCC I D can not be used on t he final product . I n t hese circum st ances, t he OEM int egrat or w ill be responsible for re- evaluat ing t he end product ( including t he t ransm it t er) and obt aining a separat e FCC aut horizat ion. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size End Product Labeling of the end product is smaller 8x10cm,only thenfor additional partwhere 15.19 statement is required be alled This t ransm it t er m odule is than aut horized use in FCC devices t he ant enna m ay betoinst available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject thes, such t hat 20 cm m ay be m aint ained bet ween t he ant enna and users ( for exam ple access to point rout ers, w ireless ASDL (1) m odem s, certmay ain not laptcause op configurat ions, and sim ent )must . Theaccept final following two conditions: this device harmful interference andilar (2)equipm this device end product m ust be labeled in ainterference visible areathat witmay h t he following: " Cont ains TX FCC any interference received, including cause undesired operation. I D: M4Y- XG182MV02 ". LABEL OF THE END PRODUCT: The Exposure final end product mustInformation be labeled in aThat visibleMust area with the following " Contains TX FCC ID: M4YRF Manual be Included The users m anual users ust include t he following at ion in a prom locat ion XG182MV02". If the for sizeend of the end m product is larger than 8x10cm,inform then the following FCCinent part 15.19 "statement I MPORTANT NOTE: To com ply it FCC RF exposure com pliance requirem ent s, he ant enna used has to also be available on the label: This device complies with Part 15 of FCC rules. Operation for his ransm it er ust be inst alled provide separat ion dist ance of at least 20 cm from is subject to the following two conditions: (1) this device may not cause harmful interference and (2) thisall persons and m ust not be co- locat ed or operat ing in conj unct ion wit h any ot her ant enna or device must accept any interference received, including interference that may cause undesired operation. t ransm it t er." Additional Information That Must be Provided to OEM Integrators The end user should NOT be provided any inst ruct ions on how t o rem ove or inst all t he device. Service Center in U.S.A Com pany Nam e : Zcom ax. Com pany Address: 14545 Valley View Ave., Suit e S Sant a Fe Springs, CA 90670 Tel: 562- 926- 4588 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機,非經許可,公司 商號或使用者均不得擅自變 更頻率 加大功率或變更原設計之特性及功能 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時, 應立即停用,並改善至無干擾時方得繼續使用 前項合法通信,指依電信規定作業 之無線電信 低功率射頻電機須忍受合法通信或工業 科學及醫療用電波輻射性電 機設備之干擾 1. Introduction Designing for IEEE 802.11b/g WLAN network standard that works at 2.4 GHz Direct Sequence Spread Spectrum (DSSS), Z-Com XG-182M, a SDIO module, can be embedded in cellular phones, video, voice and multimedia applications. It target embedded and small form factor SDIO WLAN devices, offering the lowest possible power consumption. Main features are: • MAC/Baseband/RF WLAN system-on-chip (SoC) • IEEE 802.11g wireless LAN standard • IEEE 802.11b wireless LAN standard • Bluetooth coexistence interface supported • IEEE 802.11i security standard • WPA/WPA2/WPA-PSK/WPA2-PSK • AES /40- and 128-bit WEP/TKIP support based on 802.11i standard • Quality of Service (QoS) compliant to the WMM and draft IEEE 802.11e standards • IEEE 802.1x security standard • EAP-TLS/EAP-TTLS/EAP-PEAP • Deep sleep mode supported, lower power consumption • RoHs compliant Proprietary & Confidential Information Specifications are subject to change without notice 2. Specification This section defines the hardware and software features, which will be required for Z-Com XG-182M 2.1 Hardware Specification Feature Chip Solution Host Interface Connector Antenna EEPROM Power Supply Operating Requirement Dimension Weight Additional Information MAC/BB/RF : 88w8686 (QFN Package) - SDIO/SPI - Board to board connector - LGA pad - Board to board connector (NAIS AXK850145Y) - One External Antenna - Hirose U.FL-R-SMT compliant connector - 8Kbit Supply voltage +3.3V± 7% Max. voltage=6.5V Peak < 700mA Consumption current 400mA (typ.) Internal voltage +3.3V, +1.8V, +1.2V Operating Temperature: 00C to 550 C Operating Humidity: 5 ~ 90% Storage Temperature: -200C to 800 C Storage Humidity: 5 ~ 90% 20mm(L)*23mm(W)*3.85mm(H) TBD 2.2 Firmware Specification Feature Standard Operating Mode Power Management Security Supported OS Additional Information IEEE 802.11i security standard IEEE 802.1x security standard IEEE 802.11e standard Infrastructure mode Ad-hoc mode Power save mode Deep sleep mode WPA/WPA2/WPA-PSK/WPA2-PSK 40- and 128-bit WEP EAP-TLS/EAP-TTLS/EAP-PEAP WinCE 5.0 Linux 2.6 Proprietary & Confidential Information Specifications are subject to change without notice 2.3 Wireless RF Specification Standard IEEE 802.11g standard IEEE 802.11b standard 11g: 54M/48M/36M/24M/18M/12M/9/6Mbps 11b: 11Mbps/5.5Mbps/2Mbps/1Mbps Direct Sequence Spread Spectrum (DSSS) AES/40- and 128-bit WEP/TKIP USA (FCC): 2.412GHz ~ 2.462GHz (Ch1-11) Europe (CE): 2.412GHz ~ 2.472GHz (Ch1-13) Japan (TELEC): 2.412GHz ~ 2.472GHz (Ch1-13) OFDM/QAM-64/QAM-16/QPSK/BPSK DSSS/CCK/DQPSK/DBPSK 11g : 20.09dBm @ 54Mbps 11b : 18.06dBm @ 11/5.5/2/1Mbps 11g: 54M : -68dBm 11b: 11M : -82dBm Data Rate Transmission/Emission Type Security RF Frequency Range Data modulation type Output Power +-2dB Sensitivity 2.4 Pin definition XG-182M Pin Definition of CON1 (NAIS AXK850145Y) and LGA CON1 LGA Pin # Pin# Pin Name I/O Connection Description Bluetooth State 0 = normal priority, Rx 17 BT_STATE 88W8686 Pin.56 1 = high priority, Tx Priority is signaled after BT_PRIORITY has been asserted. After priority signaling, BT_STATE BT_FREQ BT_TX_CON 88W8686 Pin.57 88W8686 indicates the Tx/Rx mode of Bluetooth radio. 4-Wire BCA Mode: Bluetooth Frequency Asserted (logic high) when the Bluetooth transceiver hops into the restricted channels defined by the coexistence mechanism. 2-Wire, 3-Wire BCA Mode: Tie to ground (VSS) Bluetooth WLAN Active Proprietary & Confidential Information Specifications are subject to change without notice FIRM 49 BT_PRIORIT SDIO_SPI_S EL Pin.58 88W8686 Pin.59 2-Wire BCA Mode: When high, WLAN is transmitting or receiving packets. 3-Wire BCA Mode: 0 = Bluetooth device allowed to transmit 1 = Bluetooth device not allowed to transmit This pin drives low when PDn is asserted. In WLAN Sleep mode, all I/O pads are powered down. This pad must stay at a low state even in power down mode. Bluetooth Priority 2-Wire BCA Mode: When high, Bluetooth is transmitting or receiving high priority packets. 3-Wire BCA Mode: When high, Bluetooth is transmitting or receiving packets. 88W8686 Pin.22 or High or NC for SDIO, low for SPI interface Pin.24 13 10 12 25 11 SPI_SDI/SD_ CMD I/O SPI_SINTn/ SD_D2 I/O SPI_SCSn/S D_D0 88W8686 Pin.43 88W8686 Pin.46 88W8686 Pin.44 G-SPI Mode: SPI_SDI G-SPIData Input SDIO 4-bit Mode: SD_CMD Command/Response SDIO 1-bit Mode: SD_CMD Command Line SDIO SPI Mode: SD_CMD Data Input G-SPI Mode: SPI_SINTn G-SPI Interrupt Output (active low) SDIO 4-bit Mode: SD_D2 Data Line Bit[2] or Read Wait (optional) SDIO 1-bit Mode: SD_D2 Read Wait (optional) SDIO SPI Mode: SD_D2 Reserved G-SPI Mode: SPI_SCSn G-SPI Chip Select Input (active low) SDIO 4-bit Mode: SD_D0 Data Line Bit [0] SDIO 1-bit Mode: SD_D0 Data Line SDIO SPI Mode: SD_D0 Data Output Proprietary & Confidential Information Specifications are subject to change without notice 32 16 34 15 35 14 39 46 13,38 2,3 1,18,1 1, 50 SPI_CLK/SD _CLK I/O SPI_SDO/SD _D1 I/O SD_D3 I/O GPIO0 GPIO1 I/O I/O 88W8686 Pin.42 88W8686 Pin.45 88W8686 Pin.47 88W8686 Pin.11 88W8686 Pin.40 G-SPI Mode: SPI_CLK G-SPI Clock Input SDIO 4-bit Mode: SD_CLK Clock Input SDIO 1-bit Mode: SD_CLK Clock Input SDIO SPI Mode: SD_CLK Clock Input G-SPI Mode: SPI_SDO G-SPI Data Output SDIO 4-bit Mode: SD_D1 Data Line Bit [1] SDIO 1-bit Mode: SD_D1 Interrupt SDIO SPI Mode: SD_D1 Reserved SDIO 4-bit Mode: SD_D3 Data Line Bit [3] SDIO 1-bit Mode: SD_D3 Reserved SDIO SPI Mode: SD_D3 Card Select (active low) Internal pull-up General Purpose Input/Output These pins are asynchronous to internal clocks. Several of these pins can be selected to perform alternate functions such as an LED controller. When not used, these pins should be left floating. GPIO1 – LED output (strap pin) (Tx power or Rx ready LED) GPIO0 – external oscillator control/SLEEPn; Wake up control During power down sleep mode, the external crystal oscillator is disabled, and, if implemented, also powered down by GPIO0 3.3V Power ― Power supply from host GND Ground ― Ground NC NC NC NC 6,7,8,1 1,12,1 4,15,1 NC 6,17,1 8,19,2 Proprietary & Confidential Information Specifications are subject to change without notice 0,21,2 2,23,2 4,26,2 7,28,2 9,30,3 1,33,3 6,37,4 0,4142 ,43,44, 45,47, 48 Proprietary & Confidential Information Specifications are subject to change without notice 3. Physical Specification 3.1 Mechanical Drawing Proprietary & Confidential Information Specifications are subject to change without notice 3.2 Connector Drawing (NAIS AXK850 145Y) Proprietary & Confidential Information Specifications are subject to change without notice 3.3 LGA Drawing Fig 5.3.1 XG-182M See-Through Drawing Fig 5.3.2 XG-182M Top View Drawing Proprietary & Confidential Information Specifications are subject to change without notice Fig 5.3.3 XG-182M Bottom View Drawing Proprietary & Confidential Information Specifications are subject to change without notice 4. Necessary Approval (base on customer’s requirement) 4.1 Country Approval Safety EMI European Union (CE mark) North America European Union (CE mark) Telec EMS European Union (CE mark) EN60950 FCC Part 15 Class B EN55022 Class B EN300 328 STD-33 STD-66 VCCI EN301 489-1 EN301 489-17 Proprietary & Confidential Information Specifications are subject to change without notice 5. Packaging Specification The following items will be required for the complete packaging of the Z-Com XG-182M: Item Comments EPE Tray Suitable size and material to protect product Inner Box Suitable size and material to protect product Carton XG-182M Suitable size and material to protect product WLAN module 5.1 Package drawing (Reference only) Proprietary & Confidential Information Specifications are subject to change without notice 6. Documents: 8.1 Reliability Test Plan: TBD 7. Warranty One year warranty on the product. Proprietary & Confidential Information Specifications are subject to change without notice 7. Test program DutApiSD83xxp TX Mode command: 12 1 Chose Antenna 22 1 13 Set target power 25 1 13 Enable Duty Cycle Mode 25 0 Disable 17 1 13 Enable Continuous Mode 17 0 Disable DutApiSD83xxp Read/Write EEPROM command: 53 Read EEPROM 54 Write EEPROM
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Encryption : Standard V4.4 (128-bit) User Access : Print, Extract, Print high-res Author : annsu Create Date : 2007:07:09 13:48:35+08:00 Modify Date : 2012:09:18 15:52:34+08:00 Has XFA : No XMP Toolkit : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04 Producer : Acrobat Distiller 7.0 (Windows) Creator Tool : PScript5.dll Version 5.2.2 Metadata Date : 2012:09:18 15:52:34+08:00 Format : application/pdf Title : Microsoft Word - C_ZCOM_XG-624_User Maunal_070709.doc Creator : annsu Document ID : uuid:547e3178-b553-410d-872c-e0aa38df5fcd Instance ID : uuid:11206744-1f6b-4080-b12e-38cd68af974f State : 1 Version : 1.1 Page Count : 19EXIF Metadata provided by EXIF.tools