ZTE ME3000V2 GSM DUAL BAND GPRS WIRELESS DATA TERMINAL User Manual Q78 ME3000V2

ZTE Corporation GSM DUAL BAND GPRS WIRELESS DATA TERMINAL Q78 ME3000V2

Users Manual

Operation Description 1 ME3000V2 Operation Description Version:V1.0 ZTE CORPORTION
Operation Description 2Table of Contents 1 Mechanical Interface ...................................................................................................................... 3 1.1 Physical Features ........................................................................................................................................ 3 1.2 Mechanical size .......................................................................................................................................... 3 2 Electrical Interface ......................................................................................................................... 4 2.1 Pin Assignments ......................................................................................................................................... 4 3 Power Management ....................................................................................................................... 6 3.1 Power and Reset ......................................................................................................................................... 6 3.1.1 Power supply ..................................................................................................................................... 6 3.1.2 Power on ............................................................................................................................................ 6 3.1.3 Power off ........................................................................................................................................... 6 3.1.4 Reset .................................................................................................................................................. 6 4 Antenna Interface ........................................................................................................................... 7 4.1 Antenna Installation ................................................................................................................................... 7 4.2 Antenna Pad ............................................................................................................................................... 7 4.3 Antenna connector ..................................................................................................................................... 7 5 RF Interface ................................................................................................................................... 9 5.1 Overview .................................................................................................................................................... 9 5.2 Antenna Subsystem .................................................................................................................................... 9 5.2.1 Antenna Specifications .................................................................................................................... 10 5.2.2 Cable Loss ....................................................................................................................................... 10 5.2.3 Antenna Gain Minimum Requirements ........................................................................................... 10 5.2.4 Antenna Gain Maximum Requirements .......................................................................................... 10 5.2.5 Antenna Matching ........................................................................................................................... 10 5.2.6 PCB Design Considerations ............................................................................................................. 10 5.2.7 Other Precautions ............................................................................................................................. 10 5.2.8 Grounding .........................................................................................................................................11 6 Test Capabilities ........................................................................................................................... 12 6.1 Test Description ........................................................................................................................................ 12 6.2 GSM Test Equipment and Tools ............................................................................................................... 13 6.2.1 GSM RF Rx Specification ............................................................................................................... 14 6.2.2 GSM RF Tx Specification: .............................................................................................................. 14 6.2.3 High Temperature Operation Test .................................................................................................... 14 6.2.4 Low Temperature Operation Test .................................................................................................... 14 6.2.5 High Temperature Storage Test ....................................................................................................... 14 6.2.6 Low Temperature Storage Test ........................................................................................................ 15 6.2.7 High Temperature High Humidity Operation Test .......................................................................... 15 6.2.8 Temperature Concussion Test ......................................................................................................... 15 6.2.9 ESD Immunity Test ......................................................................................................................... 15 6.2.10 Radiated Emissions Test .................................................................................................................. 15
Operation Description 31 Mechanical Interface 1.1 Physical Features Dimensions & Weight Length: 44.5 mm Width: 28.5 mm Thickness: 8.25 mm Weight: 8 g Operational Temperature Range -20℃ to +65℃ Storage Temperature Range -40℃ to +80℃ ROHS Yes Antenna Connectors 50-Ohm ANT connectors for GSM Power Supply Two kinds of inputs: 1.external power supply (+4.75V~ +5.25V, typical value +5V) 2. battery power supply (+3.3V~ +4.2V, typical)1.2 Mechanical size Figure 1-1: ME3000V2 T-viewgraph
Operation Description 42 Electrical Interface 2.1 Pin Assignments Figure 2-1 ME3000V2 Module interface ME3000V2 map Table 2-1 ME3000V2 Module 40-pin Electrical Interface Pin Signeal Name Signal Type Input/Output Function Min Typ Max Unit Comments 6 SIM-CLK Digital O SIM clock 2.5 2.8 3.3 V 2.8VLevel 8 SIM-VCC Power O SIM power supply 2.5 2.8 3.3 V 2.8VLevel 4 SIM-DATA Digital I/O SIM data 2.5 2.8 3.3 V 2.8VLevel 2 SIM-RST Digital O SIM reset 2.5 2.8 3.3 V 2.8VLevel 30 SIG_LED Digital O LED control 2.5 2.8 3.3 V 2.8VLevel 3 RXD2 Digital O COM Port 2.5 2.8 3.3 V 2.8VLevel 11 RXD Digital O COM Port 2.5 2.8 3.3 V 2.8VLevel 1 TXD2 Digital I COM Port 2.5 2.8 3.3 V 2.8VLevel 13 TXD Digital I COM Port 2.5 2.8 3.3 V 2.8VLevel 30 SIG_LED Digital O LED control 2.5 2.8 3.3 V 2.8VLevel 28 SMS_LED Digital O LED control 2.5 2.8 3.3 V 2.8VLevel 22 V_MAIN Power P Main power 3.3 3.7 4.25 V
Operation Description 525 V_MSM Power O External power supply 2.5 2.8 3.3 V 15 RI Digital O 2.5 2.8 3.3 V LED ON as the level is high. 17 /DSR Digital O COM Port 3.3 3.8 4.2 V 14 /RTS Digital I COM Port 3.3 3.8 4.2 V 16 /DTR Digital I COM Port 4.75 5 5.25 V 5 RTS2 Digital I COM Port 3.0 3.8 4.25 V 12 /CTS Digital O COM Port 2.5 2.8 3.3 V 7 CTS2 Digital O COM Port 2.5 2.8 3.3 V 18 DCD Digital O COM Port 2.5 2.8 3.3 V 10 /RESET Digital I System reset 2.5 2.8 3.3 V 26 ON/OFF Digital I Power on/off key control 2.5 2.8 3.3 V 35 EAR_ANT_DET Analog I EARPHONE MIC KEY 36 EAR_DET Digital I EARPHONE insert detect 37 MIC_1N Analog AI Mic input- Headset MIC39 MIC_1P Analog AI Mic input+ 38 MIC_2P Analog AI Mic input+ Earphone MIC 40 MIC_2N Analog AI Mic input- 32 SPK_1N Analog AO Speaker output- Headset Receiver 34 SPK_1P Analog AO Speaker output- 33 SPK_2P Analog AO Speaker output- Earphone Receiver
Operation Description 63 Power Management 3.1 Power and Reset 3.1.1 Power supply The module could work under two power modes: 1. Charger; 2 Battery. When powered by the charger, you could perform constant current charge, constant voltage charge and trickle current charge. Normally, trickle current charge starts when the voltage is lower than 3.2V, constant current charge starts as the voltage is between 3.2V and 4.0V; and constant voltage charge starts when the voltage reaches 4.0V. As the blackout happens, the battery would be immediately used. See table 4-1 for the module’s input voltage characteristics. If the input voltage is not in the range, it must be converted to the voltage below: Table4-1 Voltage Characteristics 1. External power supply Status Max. voltage Typical voltage Min. voltage Power supply +5.25 VDC +5.0VDC +4.75 VDC 2. Battery（currently the software supports Li battery） Status Max. voltage Typical voltage Min. voltage Power supply +4.25 VDC +3.8 VDC +3.3 VDC 3.1.2 Power on The module is under power-off status after it’s normally powered on. To turn on the module, provide a 1500-2000mS low level pulse to ON/OFF pin when the module is OFF. 3.1.3 Power off To turn off the module, provide a 1500-2000mS low level pulse to ON/OFF pin when the module is ON. 3.1.4 Reset Use the above method to firstly “Power off” and then “Power on”, and by doing so the module could be reset. ME3000V2 module does not lead the reset pin.
Operation Description 74 Antenna Interface The RF interface of the ME3000V2 Module has an impedance of 50 . The module is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ME3000V2 Module PCB and should be placed in the host application. Regarding the return loss, the Module provides the following values in the active band: Table 4-1 Return Loss in the Active Band State of Module Return Loss of Module Recommended Return Loss of ApplicationReceive ≥ 8dB ≥ 12dBTransmit not applicable ≥ 12dBThe connection of the antenna or other equipment must be de coupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 4.1 Antenna Installation To suit the physical design of individual applications, the ME3000V2 offers two alternative approached to connecting the antenna: ■ Recommended approach: MM9329-2700B antenna connector manufactured by MURATA assembled on the component side of the PCB (top view on Module). See Section 4.3 for details. ■ Antenna pad and grounding plane placed on the bottom side. See Section 4.2 for details. The MM9329-2700B connector has been chosen as antenna reference point (ARP) for the ZTEMT reference equipment submitted to type approve the ME3000V2 Module. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the ZTEMT type approval you are advised to give priority to the connector, rather than using the antenna pad. Note: Both solutions can be applied alternatively. This means,if the antenna is connected to the pad, then the connector on the Module must be left empty,and when the antenna is connected to the Module connector, the pad is useless, 4.2 Antenna Pad The antenna pad of the module is soldered to the board on the customer design to connect with RF line. For proper grounding connect the RF line to the ground plane on the bottom of the MG2636 Module which must be connected to the ground plane of the application. Consider that according to GSM recommendations as 50Ω connector is mandatory for type approval measurements. It must be ensured that the RF line which is connected to antenna pad should be controlled on 50Ω. Notes on soldering ■ To prevent damage to the Module and to obtain long-term solder joint properties, you are advised to maintain the standards of good engineering practice for soldering. Material Properties ■ME3000V2 Module PCB: FR4 ■ Antenna pad: Gold plated pad 4.3 Antenna connector The ME3000V2 Module uses a microwave coaxial connector supplied by Murata Ltd. The product name is MM9329-2700B. The position of the antenna connector on the Module PCB can be seen in Figure 4-1.
Operation Description 8Figure 4-1 Specification of MM9329-2700B connector Table 4-2 Product specifications of MM9329-2700B connector Part Number Rated Voltage (V) Contact Resistance (ohm) Withstanding Voltage (rms) Insulation Resistance (M ohm)Durability (cycles) Frequency Rating (GHz) Temperature Range (degree C)VSWR Center Contact Outer Contact InsulatorMM9329-2700B 250 0.015 max. 300 (AC) 500 min. 100 DC - 6.0 -40~+90 1.2 max. (DC~3GHz) Copper Alloy Gold plated Copper Alloy Silver plated Engineering plasticImpedance : 50 ohm
Operation Description 95 RF Interface 5.1 Overview A 50 ohm coaxial RF connector is provided for Module testing. However, we advise customers lead from the antenna pad at the RF line to the antenna. Figure 5-1 GSM Connector The module must provide a suitable antenna that works in the desired frequency band of operation. The Antenna connected to the GSM connector should be a dual band antenna supporting the GSM900 and DCS1800 bands. Band TX Frequency RX Frequency GSM 880~915 MHz 925~960 MHz DCS 1710~1785 MHz 1805~1880 MHz Note: TX refers to the transmit from the module into the antenna (Reverse Link of the GSM system), and RX refers to the receive from the antenna into the module (Forward Link of the GSM system). 5.2 Antenna Subsystem The antenna sub-system and its design is a major part of the final product integration. Special attention and care should be taken in adhering to the following guidelines.
Operation Description 105.2.1 Antenna Specifications Choice of the antenna cable (type, length, performance, RF loss, etc) and antenna connector (type + losses) can have a major impact on the success of the design. 5.2.2 Cable Loss All cables have RF losses. Minimizing the length of the cable between the antenna and the RF connectors on the module will help obtain superior performance. High Quality/Low loss co-axial cables should be used to connect the antenna to the RF connectors. Contact the antenna vendor for the specific type of cable that interfaces with their antenna and ask them to detail the RF losses of the cables supplied along with the antenna. Typically, the cable length should be such that they have no more than 1-2dB of loss. Though the system will work with longer (loss) cables, this will degrade GSM system performance. Care should also be taken to ensure that the cable end connectors/terminations are well assembled to minimize losses and to offer a reliable, sturdy connection to the Module sub-system. This is particularly important for applications where the module is mounted on a mobile or portable environment where it is subject to shock and vibration. 5.2.3 Antenna Gain Minimum Requirements It is recommended that the antenna chosen have at least 2 dBi gain in the GSM900 band and 4 dBi in the PCS band. The Antenna subsystem shall also have at least 8 dB of return loss at the input with respect to a 50-ohm system. 5.2.4 Antenna Gain Maximum Requirements Our FCC Grant imposes a maximum gain for the antenna subsystem: 7 dBi for the GSM900 band and 13dBi for the DCS band. Warning: Excessive gain could damage sensitive RF circuits and void the warranty. 5.2.5 Antenna Matching The module’s RF connectors are designed to work with a 50-ohm subsystem. It is assumed that the antenna chosen has matching internal to it to match between the 50-ohm RF connectors and the antenna impedance. 5.2.6 PCB Design Considerations • The antenna subsystem should be treated like any other RF system or component. It should be isolated as much as possible from any noise generating circuitry including the interface signals via filtering and shielding. • As a general recommendation all components or chips operating at high frequencies such as micro controllers, memory, DC/DC converts and other RF components should not be placed too close to the module. When such cases exist, correct supply and ground de-coupling areas should be designed and validated. • Avoid placing the components around the RF connection and close to the RF line between the RF antenna and the module. • RF lines and cables should be as short as possible. • If using coaxial cable it should not be placed close to devices operating at low frequencies. Signals like charger circuits may require some EMI/RFI decoupling such as filter capacitors or ferrite beads. • Adding external impedance matching to improve the match to your cable and antenna assemblies is optional. Please contact the antenna vendor for matching requirements. • For better ESD protection one can implement a shock coil to ground and place it close to the RF connector. 5.2.7 Other Precautions It is essential to keep the voltage ripple to a minimum at this connection in order to avoid phase error. Insufficient power supply voltage can dramatically affect some RF performance such as TX power, modulation spectrum EMC performance, and spurious emissions and frequency error. The RF connections are 50-ohm impedance systems and are a DC short to ground. Best effort should be made to provide low insertion loss and shielding between the external antenna and RF connections over the frequency band of interest.
Operation Description 115.2.8 Grounding On terminals including the antenna, poor shielding can dramatically affect the sensitivity of the terminal.Moreover the power emitted through the antenna can affect the application.
Operation Description 126 Test Capabilities 6.1 Test Description 1) ME3000V2 RF Connectors： 2) Operating instructions
Operation Description 13Connect the sector to access terminal antenna connectors as shown in the following figure 6-1 figure 6-1  Connect the sector to access terminal antenna connectors as shown in the following figure 6-2: figure 6-2 6.2 GSM Test Equipment and Tools Lease or purchase of test equipment is available from vendors who provide this equipment for GSM over the-air simulation. Some suggested products include: • Agilent 8960 Series 10 E5515C CDMA Mobile Station Tester • Agilent E4440A Spectrum analyzer • Agilent E4438C Signal Generator • Agilent E4438C Signal Generator • Programmable Temperature-Humidity Testor • Programmable Temperature Concussion Testor RF Performance Requirements
Operation Description 146.2.1 GSM RF Rx Specification Frequency range 925~960 MHz/1805~1880 MHz Rx. Sensitivity -109 dBm for GSM, -108dBm for DCS (BER≤2.4％) Rx. Signal Range -25 dBm~ -109dBm(BER≤2.4％) 6.2.2 GSM RF Tx Specification: Max. frequency tolerance 880~915 MHz/1710~1785 MHz Max. Tx. Power GSM900: 32.2±1 dBm DCS1800:29.2±1 dBm Peak Phase Error -20°< PPE < 20° RMS Phase Error -5°< RMS < 5° Frequency Error GSM900: -90Hz< FE <90 Hz DCS1800: -180Hz< FE <180 Hz Modulation Spectrum Mod +400kHz: <-60dBm Mod -400kHz: <-60dBm Mod+1800kHz:<-63dBm Mod-1800kHz:<-63dBm Switching Spectrum Switching +400kHz:<-22dBm Switching -400kHz:<-22dBm Switching +1800kHz:<-27dBm Switching -1800kHz:<-27dBm Remarks: RF technical specification conforms to the following standards: 3GPP2 Recommended Minimum Performance Standards for GSM Spread Spectrum Mobile Stations 3GPP2 Recommended Minimum Performance Standards for GSM High Rate Packet Data Access Terminal Environmental Reliability Requirement 6.2.3 High Temperature Operation Test EUT Status Power-on Temperature 70℃ Duration 24h 6.2.4 Low Temperature Operation Test EUT Status Power-on Temperature -30℃ Duration 24h 6.2.5 High Temperature Storage Test EUT Status Power-off Temperature 85℃
Operation Description 15Duration 24h 6.2.6 Low Temperature Storage Test EUT Status Power-off Temperature -40℃ Duration 24h 6.2.7 High Temperature High Humidity Operation Test EUT Status Power-on Temperature 55℃ Humidity 93% Duration 48h 6.2.8 Temperature Concussion Test EUT Status Power-off High Temperature 85℃ High Temperature Duration 1h Low Temperature -45℃ Low Temperature Duration 1h Cycle Times 10 ElectroMagnetic Compatibility 6.2.9 ESD Immunity Test EUT Status Idle mode and traffic mode Test Voltage Air ±8KV; Contact ±6KV Reference Standard IEC 61000-4-2 : 2001 6.2.10 Radiated Emissions Test EUT Status Idle mode and traffic mode Limits for radiated disturbance Class B ITE Reference Standard FCC Part 22H&24E

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