ZTE ZM5202 WCDMA Wireless Data Terminal User Manual

ZTE Corporation WCDMA Wireless Data Terminal Users Manual

User manual

Download: ZTE ZM5202 WCDMA Wireless Data Terminal User Manual
Mirror Download [FCC.gov]ZTE ZM5202 WCDMA Wireless Data Terminal User Manual
Document ID2034889
Application IDfUe5qSU/+BaeCVhEvJAPuQ==
Document DescriptionUser manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize135.71kB (1696432 bits)
Date Submitted2013-08-06 00:00:00
Date Available2014-02-02 00:00:00
Creation Date2017-10-26 09:30:18
Producing SoftwareGPL Ghostscript 9.18
Document Lastmod2017-10-26 09:30:18
Document TitleUsers Manual
Document CreatorAcrobat PDFMaker 10.1 Word 版
Document Author: chenying

Hardware Development Guide of Module Product
Hardware Development Guide of
Module Product
Product Model No:ZM5202
Document Version: 2.0
Release Date: 2013-05-31
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Legal Information
By accepting this certain document of Shenzhen ZTEWelink Technology CO., LTD. (hereinafter
referred to as “ZTEWelink”) you agree to the following terms. If you do not agree to the following
terms, please notice that you are not allowed to use this document.
The copyright of this document belongs to Shenzhen ZTEWelink Technology CO., LTD. Any rights
not expressly granted herein are reserved. This document contains the proprietary information of
ZTEWelink. Any reproduction, transfer, distribution, use, or disclosure of this document or any
picture, form, data or other information contained in this document, in any form by any means,
without the prior written consent of ZTEWelink is prohibited.
And
are the registered trademarks of ZTE.
is the registered
trademark of ZTEWelink. ZTEWelink is the wholly owned subsidiary of ZTE and is authorized by
the use of the registered trademark of ZTE. ZTE’s company product name, logo, and product
names referenced herein are either trademarks or registered trademarks of ZTE. Other product
and company names mentioned herein may the trademarks or registered trade names of their
respective owners. Without the prior written consent of ZTEWelink or the third party owner thereof,
anyone’s access to this document should not be construed as granting, by implication, estopped
or otherwise, any license or right to use any marks appearing in this document.
The design of this product complies with the requirements of environmental protection and
personal security. This product shall be s tored, used or discarded in accordance with product
manual, relevant contract or laws and regulations in the relevant country (countries).
Information contained in this document is subject to continuous update and modify without further
notice due to improvement and update of ZTEWelink’s products and technologies. At the same
time, ZTEWelink reserves the right to revise and recover this manual at any time.
If there are any unknown words in the user manual, please consult the company or agents,
distributor in a timely manner.
II
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Revision History
Version
1.0
Date
2010-04-15
Description
st
1 version
1. Delete the part of 3.13 and 3.14 in former version
2013-03-20
2. Change Logo of the header, footer and front cover
3. Modify the legal information
4. Modify the Reference document list in chapter 1.3
5. Add the module dimensions of top plane and thickness
6. Modify the chapter 7.7 of Recommended Product
Upgrading Plan
7. Modify the Standby current from 3.5mA to 5mA in Table
2-1
8. Modify the peak current from ≤470mA to ≤2A and
modify the Working temperature from 70 to 75°C in
Table 2-1
9. Modify the Pin 32-35,64,65,67,68 and description in
chapter 3.1.3
2.0
2013-05-13
10. Modify chapter 3.8.3 to support of 8 wire UART
11. Modify the MODULE_WAKEUP_AP interface
application
12. Modify the product test environment in Table 6-2 and
6-4
13. Modify the product test result in Table 6-6
14. Update the Figure 3-1 of PIN Configuration Diagram
Modify the Figure 7-2 of Main and AGPS Antenna
Welding Pad Interface
15. Modify the Figure 7-1 of Main Antenna RF Connector
Interface
16. Modify Figure 2-1 of Product Illustration
2013-05-31
17. Release as Version 2.0
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
III
Hardware Development Guide of Module Product
TABLE OF CONTENTS
About This Document .....................................................................................1
1.1
Application Range ............................................................................................................ 1
1.2
Purpose ............................................................................................................................ 1
1.3
Supported & Reference Document List ........................................................................... 1
1.4
Abbreviations ................................................................................................................... 2
Product Overview ............................................................................................3
2.1
Mechanic Features .......................................................................................................... 3
2.2
Technical Parameters ...................................................................................................... 5
2.3
Function Overview ........................................................................................................... 8
2.3.1 Baseband Function .......................................................................................................... 8
2.3.2 Radio Frequency Function ............................................................................................... 8
Interfaces .......................................................................................................10
3.1
Definition of PINs ........................................................................................................... 10
3.1.1 Definition of PIN I/O Parameters.................................................................................... 10
3.1.2 PIN Configuration Diagram ............................................................................................ 10
3.1.3 PIN Description .............................................................................................................. 11
3.2
Working Condition .......................................................................................................... 15
3.3
Feature of Interface Power Level ................................................................................... 16
3.3.1 Feature of Digital Power Level Signal ............................................................................ 16
3.4
Power Interface .............................................................................................................. 16
3.4.1 Description of Power PINs ............................................................................................. 16
3.4.2 Requirement of Power Supply ....................................................................................... 16
3.5
(U)SIM Card Interface .................................................................................................... 17
3.5.1 Description of PINs ........................................................................................................ 17
3.5.2 Electric Feature .............................................................................................................. 17
3.5.3 Application of (U)SIM Card Interface ............................................................................. 18
IV
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
3.6
SD Card Interface .......................................................................................................... 18
3.6.1 Description of PINs ........................................................................................................ 18
3.6.2 Electric Feature .............................................................................................................. 19
3.6.3 Application of SD Card Interface.................................................................................... 19
3.7
USB2.0 Interface ............................................................................................................ 20
3.7.1 Description of PINs ........................................................................................................ 20
3.7.2 Electric Feature .............................................................................................................. 20
3.7.3 Application of USB Interface .......................................................................................... 20
3.8
Serial Interface ............................................................................................................... 21
3.8.1 SPI (Serial Peripheral Interface) Bus Interface .............................................................. 21
3.8.2 I2C Bus .......................................................................................................................... 22
3.8.3 UART Interface .............................................................................................................. 24
3.9
JTAG (Joint Test Action Group) Interface ...................................................................... 26
3.9.1 Description of PINs ........................................................................................................ 26
3.9.2 Application of JTAG Interface ........................................................................................ 26
3.10
Power-on/Power-off & Reset Signal .............................................................................. 26
3.10.1 Description of PINs ........................................................................................................ 26
3.10.2 Interface Application ...................................................................................................... 27
3.11
Interactive Application Interface ..................................................................................... 28
3.11.1 Description of PINs ........................................................................................................ 28
3.11.2 Interface Application ...................................................................................................... 28
3.12
LED Indicator Interface .................................................................................................. 29
3.12.1 Description of PINs ........................................................................................................ 29
3.12.2 Interface Application ...................................................................................................... 30
Electric Feature .............................................................................................31
4.1
Power Feature................................................................................................................ 31
4.1.1 Power Supply ................................................................................................................. 31
4.1.2 Working Current ............................................................................................................. 31
4.2
Power-on/Power-off Flow............................................................................................... 32
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
4.3
Resetting Flow ............................................................................................................... 34
Technical Index of Radio Frequency ...........................................................35
5.1
Technical Index of Radio Frequency under UMTS Mode .............................................. 35
5.1.1 UMTS (WCDMA)............................................................................................................ 35
5.2
Technical Index of Radio Frequency under GPRS/GSM/EDGE Mode ......................... 35
5.3
Technical Parameters of Antenna Testing Console ...................................................... 35
5.3.1 Sourceless Index............................................................................................................ 36
5.3.2 Sourced Index ................................................................................................................ 36
Related Test & Testing Standard .................................................................37
6.1
Testing Reference .......................................................................................................... 37
6.2
Description of Testing Environment ............................................................................... 38
6.3
Reliability Testing Environment...................................................................................... 39
6.4
Reliability Testing Result ................................................................................................ 40
Design Guide .................................................................................................41
7.1
General Design Rule & Requirement ............................................................................ 41
7.2
Power Supply Circuit Design ......................................................................................... 41
7.3
RF Circuit Design ........................................................................................................... 42
7.3.1 RF Antenna Circuit Design ............................................................................................ 42
7.3.2 Precautions During the Initial Design of Antenna .......................................................... 45
7.4
Suggestions for EMC & ESD Design ............................................................................. 47
7.5
Suggestions for PCB Wielding Panel Design ................................................................ 48
7.6
Suggestions for Heat-dissipation Design ....................................................................... 48
7.7
Recommended Product Upgrading Plan ....................................................................... 49
VI
Manufacturing Guide ....................................................................................50
8.1
Design of Steel Mesh ..................................................................................................... 50
8.2
Furnace Temperature Curve.......................................................................................... 50
FCC Regulations ...........................................................................................51
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Figures
Figure 2-1 Product Illustration .......................................................................................3
Figure 2-2 Module Dimensions .....................................................................................4
Figure 2-3 System Connection Structure ...................................................................... 8
Figure 3-1 PIN Configuration Diagram ........................................................................ 11
Figure 3-2 (U)SIM Card Signal Connection Circuit ...................................................... 18
Figure 3-3 SD Typical Application Circuit .................................................................... 19
Figure 3-4 USB Typical Circuit Application ................................................................. 21
Figure 3-5 SPI Bus Sequence Chart ........................................................................... 22
Figure 3-6 I2C Reference Circuit Diagram .................................................................. 23
Figure 3-7 Module Serial Port & AP Application Processor ......................................... 25
Figure 3-8 The connection of ZM5202 UART and Standard RS-232-C interface ........ 25
Figure 3-9 Module Power-on Plan .............................................................................. 27
Figure 3-10 Recommended Circuit for Power-on/Power-off & Reset........................... 27
Figure 3-11 The output of MODULE_WAKEUP_AP ................................................... 29
Figure 3-12 Reference Circuit of Status Indicator ....................................................... 30
Figure 4-1 Power-on Sequence Chart of ZM5202 Module .......................................... 33
Figure 4-2 Power-off Sequence Chart of ZM5202 Module .......................................... 33
Figure 4-3 Module Resetting Flow .............................................................................. 34
Figure 7-1 Main Antenna RF Connector Interface ....................................................... 42
Figure 7-2 Interface of Main Antenna and AGPS Antenna Welding Pad ..................... 44
Figure 7-3 RF Interface Testing Console (W.FL-R-SMT-1 from HRS)......................... 44
Figure 7-4 T esting Cable ............................................................................................ 45
Figure 8-1 Recommended Pattern of Steel Mesh on Wielding panel .......................... 50
Figure 8-2 Furnace Temperature Curve Reference Diagram ...................................... 53
Figure 8-3 T esting Result............................................................................................ 53
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
VII
Hardware Development Guide of Module Product
Tables
Table 1-1 Supported Document List ............................................................................. 1
Table 1-2 A bbreviation List ...........................................................................................2
Table 2-1 M ajor Technical Parameters ......................................................................... 6
Table 2-2 Working Frequency Band ............................................................................. 9
Table 3-1 P IN Parameters .......................................................................................... 10
Table 3-2 PIN Interface Definition ............................................................................... 11
Table 3-3 Working Condition ...................................................................................... 15
Table 3-4 Power Level Range of Digital Signal ........................................................... 16
Table 3-5 Definition & Description of (U)SIM Card Signal Group ................................ 17
Table 3-6 Definition of SD Card Signal Interface......................................................... 18
Table 3-7 Definition of SPI Signal ............................................................................... 21
Table 3-8 Definition of UART Signal ........................................................................... 24
Table 3-9 Definition of JTAG Signal ............................................................................ 26
Table 3-10 Interactive Application Interface ................................................................ 28
Table 3-11 Definition of LED PIN Signal ..................................................................... 29
Table 3-12 Definition of Indicator Status ..................................................................... 30
Table 4-1 Input Voltage .............................................................................................. 31
Table 4-2 Working Current.......................................................................................... 31
Table 4-3 P ower-on/Power-off Time ........................................................................... 33
Table 5-1 Sourceless Index of Main Antenna (Recommended) .................................. 36
Table 6-1 Testing Standard ........................................................................................ 37
Table 6-2 Testing Environment ................................................................................... 38
Table 6-3 Testing Instrument & Device ....................................................................... 38
Table 6-4 R eliability Features ..................................................................................... 39
Table 6-5 Temperature Testing Result Under Windless Environment ......................... 40
Table 6-6 H igh/Low-temperature Running & Storage Testing Result .......................... 40
Table 8-1 Curve Temperature Curve Parameter Setting ............................................. 52
VIII
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
About This Document
1.1
Application Range
This document is applicable as the hardware development guide of ZM5202
WCDMA module products. The user can design ZM5202 according to the
requirement and guidance in this document. It is only applicable for the hardware
application and development of ZM5202 WCDMA module products.
1.2
Purpose
This document provides the design and development fundamentals for the users of
ZM5202. By reading this document, the user can have an overall knowledge of
ZM5202 and a clear understanding of the technical parameters. With this document,
the user can successfully fulfill the application and development of wireless 3G
Internet product or equipment.
Besides the product features and technical parameters, this document also
provides the product reliability tests and related testing standards, service function
implementation flow, RF performance indexes and a guide on the design of user
circuits, to provide the user with a complete design reference.
1.3
Supported & Reference Document List
Besides the hardware development document, ZTEWelink also provides the board
operation guide, software development guide and upgrading plan guide of ZM5202.
Table 1-1 is the list of supported documents.
Table 1-1
NO.
Supported Document List
Document Name
ZTEWelink ZM5202 Module Specification.pdf
ZTEWelink LGA Type Ⅱ Module Dev Board User Guide.pdf
ZM5202 Software Development Guide of Module Product.pdf
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
1.4
Abbreviations
Table 1-2 is a list of abbreviations involved in this document, as well as the English
full names.
Table 1-2
Abbreviations
Abbreviation List
Full Name
ESD
Electro-Static discharge
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile
Communications
I/O
Input/output
LED
Light Emitting Diode
SPI
Serial Peripheral Interface
WCDMA
Wideband Code Division Multi Access
UMTS
Universal Mobile Telecommunication
System
BER
Bit Error Rate
DL
Downlink
DPCH
Dedicated Physical Channel
DPCH_Ec
Average energy per PN chip for DPCH.
DPCH
SIM
Subscriber Identification Module
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Product Overview
ZM5202 is one WCDMA wireless Internet module with LGA interface. It is widely
applied to but not limited to the various products and equipment such as laptops,
vehicle-mounted terminals, and e lectric devices, by providing data services. The
features of ZM5202 module are described as below.
1. It
can
support
UMTS
850(900)/1900/2100MHz
frequency
band,
and
GSM/GPRS/EDGE 850/900/1800/ 1900MHz frequency band.
2.
It can provide high-speed data access service under the mobile environment.
3.
It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V),
USB2.0 interface, UART interface, SD2.0 interface, power-on/power-off, and
resetting.
Figure 2-1
2.1
Product Illustration
Mechanic Features
ZM5202 is a 108-pin LGA encapsulation module. Except for the signal PIN, there
are many dedicated heat-dissipation ground wielding panel to improve the
grounding performance, mechanical strength and heat-dissipation performance.
There are altogether 30 heat-dissipation ground wielding panels, evenly distributed
at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm,
and the height is 2.5+/-0.2mm. The location of PIN 1 is identified by the ground
wielding panel with an inclination at the bottom, and its angle orientates to the top
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
welding panel of the corresponding module. Figure 2-2 is a figure about the
dimensions of ZM5202 module.
Figure 2-2
(a)Dimensions on Top plane
Module Dimensions
(b) Thickness
(c) Bottom
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
2.2
Technical Parameters
The major features of ZM5202 can be described from the aspects of mechanic
feature, base band, radio frequency, technical standard and e nvironment feature.
Table 2-1 is a l ist of the major technical parameters and f eatures supported by
ZM5202.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Table 2-1
Name
Major Technical Parameters
Parameter
Specifications
Item
Mechanical
Dimensions
36mm * 26mm * (2.5+/-0.2)mm
Feature
Weight
About 5.2g
Encapsulation
type
Processor
ARM 9 architecture
architecture
Standard 6 PIN SIM card interface
(U)SIM/SIM
Baseband
LGA package(108 Pin)
3V SIM card and 1.8V SIM card
Memory
32MByte/128MByte
USB interface
USB 2.0 HIGH SPEED
Maximum
power
2.2W
consumption
Voltage
Working
current
DC 3. 4V-4.2V, typical: 3.8V
Peak current
≤2A (3.8V) note1
Average normal working current
≤150mA (3.8V) note2
Average normal working current
(without services)
Standby current
≤75mA
≤5mA (3.8V) note3
GSM band
EDGE/GPRS/GSM: 1900/1800/900/850MHz
UMTS band
/WCDMA: 2100/1900/850(900)MHz;
RxDiv Band
NAnote
UMTS2100/1900/850(900): Power Class 3 (+24dB +1/-3dBm)
GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm
RF
Max.
transmitter
power
±2dBm)
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm
±2dBm)
EDGE 850MHz/900MHz: Power Class E2 (+27dBm ±3dBm)
EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm
-4/+3dBm)
Receiving
sensitivity
WCDMA2100 : ≤-106.7dBm
WCDMA1900/850 : ≤-104.7dBm
WCDMA900 : ≤-103.7dBm
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Name
Parameter
Specifications
Item
GSM850/900/1800/1900 : ≤-102dBm
Equalization
Main antenna
interface
Receive
diversity
(GPS)
antenna
interface
Support
Support
Support the GPS wielding panel interface, support the diversity
antenna interface; but they are not supported simultaneously.
ZTEWelink does not provide the antenna, and the antenna is
provided by the third party.
GSM CS: UL 9.6kbps/DL 9.6kbps
GPRS: Multi-slot Class 10
Data rate
EDGE: Multi-slot Class 12
WCDMA CS: UL 64kbps/DL 64kbps
WCDMA PS: UL 384kbps/DL 384kbps
GPRS type
Technical
Standard
3GPP
protocol
Class B
R99/R5
Windows XP (SP2 and later)
Operating
system
Windows Vista
Windows 7
Linux
Android
Working
Environment
Feature
Application
temperature
Storage
temperature
-20 to 75° C
-40 to 85° C
Humidity
5%~ 95%
RAS dialup
Support
SMS
Support
Network
Optionally support
locking
SIM READER
Not support
Upgrading
Support
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Note: 1. Test condition: The value is measured in Max. transmit power.
Note 2: Testing condition: The value is measured in transmit power of 0dBm and band of WCDMA 2100MHz.
Note 3: Testing condition: The value is measured in cell power of -75dBm and DRX=640.
Note 4: NA means unrelated.
2.3
Function Overview
2.3.1
Baseband Function
The baseband part of ZM5202 mainly includes the following signal groups: USB
signal, (U)SIM card signal, wakeup signal, working status indicator signal, UART
signal, SD interface signal, I2C interface signal, module power-on/resetting signal,
SPI, main antenna interface, AGPS antenna interface and power-supply interface.
Figure 2-3 is a diagram of the system connection structure.
Figure 2-3
System Connection Structure
USB
Main Antenna
SIM card
SPI
UART
LGA HSDPA
I2C
Wireless module
AGPS Antenna
POWER
GND
SD
Wakeup and
Status
Indication
2.3.2
Radio Frequency Function
The radio frequency function of ZM5202 can be viewed from the aspect of
over-the-air wireless bearer network, frequency band, whether the receive diversity
feature is supported, and the GPS function.
1.
Support WCDMA 850(900)/1900/2100MHz;
2.
Support GSM/EDGE/GPRS 850/900/1800/1900 MHz;
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
3.
Support GPS/AGPS;
The working frequency band of ZM5202 transceiver transmitter is as shown in Table
2-2.
Table 2-2 Working Frequency Band
Working
Frequency
Uplink Frequency Band
Downlink Frequency
Band
Band
UMTS850
824 MHz — 849 MHz
869 MHz — 894 MHz
UMTS900
880 MHz — 915 MHz
925 MHz — 960 MHz
UMTS1900
1850 MHz — 1910 MHz
1930 MHz — 1990 MHz
UMTS2100
1920 MHz — 1980 MHz
2110 MHz — 2170 MHz
GSM850
824 MHz — 849MHz
869 MHz — 894 MHz
GSM900
890 MHz — 915MHz
935 MHz — 960MHz
GSM1800
1710 MHz — 1785MHz
1805 MHz — 1880MHz
GSM1900
1850 MHz — 1910MHz
1930 MHz — 1990MHz
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Interfaces
3.1
Definition of PINs
3.1.1
Definition of PIN I/O Parameters
The definition of ZM5202 I/O parameter is as shown in Table 3-1.
Table 3-1
PIN Attribute
PIN Parameters
Description
Input PIN
Output PIN
Two-way digital port, CMOS
input
High-resistance output
P1
PIN group 1, the power supply
voltage is VDD_P1
P2
PIN group 2, the power supply
voltage is VDD_P2
3.1.2
PU
PIN internal pull-up
PD
PIN internal pull-down
A, AI, AO, AIO
Analog circuit
PIN Configuration Diagram
The PIN sequence of interfaces on ZM5202 is defined as shown in Figure 3-1.
10
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Figure 3-1
3.1.3
PIN Configuration Diagram
PIN Description
Table 3-2
PIN Interface Definition
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
11
Hardware Development Guide of Module Product
PIN
Signal Definition
ANT_MAIN
Pin
Voltage
--
I/O
PIN Attribute
AI,
Main
antenna
AO
feedback point
PU/PD
Remark
Status
--
Mandatory
GND
--
--
Ground
--
Mandatory
JTAG_RESOUT_N
P1
DI
JTAG reset LGA
--
If it is not used, NC
PON_RST_N
P1
DI
Module reset
--
If it is not used, NC
POWER_ON
P1
DI
Power-on/Power-off
PU
Mandatory
--
If it is not used, NC
PIN
AP_READY
P1
DI
Module queries AP
sleep status
I2C_SCL
P1
I2C clock
--
If it is not used, NC
I2C_SDA
P1
I2C data
--
If it is not used, NC
MODULE_READY
P1
DO
AP queries Module
--
If it is not used, NC
--
Low-power
sleep status
10
AP_WAKEUP_MO
P1
DI
AP wakes up Module
DULE
level
wakeup. To make the
module
standby,
the
primary server needs to
raise up this low signal.
If it is not used, NC
11
MODULE
P1
DO
Module wakes up AP
--
If it is not used, NC
_WAKEUP_AP
12
GND
--
--
--
--
Mandatory
13
NC
--
--
--
--
--
14
GND
--
--
--
--
Mandatory
15
NC
--
--
--
--
--
16
NC
--
--
--
--
--
17
NC
--
--
--
--
--
18
NC
--
--
--
--
--
19
MODULE_POWER
P1
DO
MODULE
--
If it is not used, NC
indicator
--
If it is not used, NC
indicator
--
If it is not used, NC
ON
20
LED_GREEN
power-on
status indicator
P1
AI
Signal
interface
21
LED_RED
P1
AI
Signal
interface
12
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
PIN
22
Signal Definition
LED_BLUE
Pin
Voltage
P1
I/O
AI
PIN Attribute
Signal
PU/PD
Remark
Status
indicator
--
If it is not used, NC
indicator
--
System power supply,
--
mandatory
interface
23
VPH_PWR
24
VPH_PWR
25
VPH_PWR
--
26
VPH_PWR
--
27
UART_CTS
28
UART_RFR
3.8V
AI
Signal
interface
P1
P1
DI(
UART interface CTS
HV)
signal
DO
UART Interface RFR
--
If it is not used, NC
--
If it is not used, NC
--
If it is not used, NC
--
If it is not used, NC
signal
29
UART_TXD
P1
DO
UART interface TXD
signal
30
UART_RXD
P1
DI
UART interface RXD
signal
31
GND
--
--
Ground
--
--
32
Preserved
--
--
--
--
--
33
Preserved
--
--
--
--
--
34
Preserved
--
--
--
--
--
35
Preserved
--
--
--
--
--
36
GND
--
--
Ground
--
Mandatory
37
ADC
--
AI
Analog signal input
--
If it is not used, NC
38
GND
--
--
Ground
--
Mandatory
39
SPI_CS_N
P1
DO
SPI interface channel
--
If it is not used, NC
signal
40
SPI_CLK
P1
DO
SPI clock signal
--
If it is not used, NC
41
SPI_DATA_MI_SO
P1
SPI data IO signal
--
If it is not used, NC
42
SPI_DATA_MO_SI
P1
SPI data IO signal
--
If it is not used, NC
43
USB_VBUS
--
AI
USB _VBUS power
--
Pay
attention
the
power-on sequence of
VPH_PWR, mandatory.
44
GND
--
--
ground
--
Mandatory
45
USB_DP
--
AI/
USB data cable
--
Mandatory
USB data cable
--
Mandatory
AO
46
USB_DM
--
AI/
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
13
Hardware Development Guide of Module Product
PIN
Signal Definition
Pin
Voltage
I/O
PIN Attribute
PU/PD
Remark
Status
AO
47
GND
--
--
Ground
48
VREG_RUIM
P1/ P2
AO
UIM
card
power
--
Mandatory
--
Mandatory
signal
49
UIM_DATA
P1/ P2
UIM card data signal
--
Mandatory
50
UIM_CLK
P1/ P2
DO
UIM card clock signal
--
Mandatory
51
UIM_RST
P1/ P2
DO
UIM card reset signal
--
Mandatory
52
UIM_DP
P1/ P2
AI,
Data signal
--
If it is not used, NC
Data signal
--
If it is not used, NC
AO
53
UIM_DM
P1/ P2
AI,
AO
54
GND
--
--
Ground
--
Mandatory
55
VREG_SDCC
P2
AO
SD card power
--
If it is not used, NC
56
SDCC_CMD
P2
SD
--
If it is not used, NC
card
control
signal
57
SDCC_CLK
P2
DO
SD card clock signal
--
If it is not used, NC
58
SDCC_DATA3
P2
SD card data signal
--
If it is not used, NC
59
SDCC_DATA2
P2
SD card data signal
--
If it is not used, NC
60
SDCC_DATA1
P2
SD card data signal
--
If it is not used, NC
61
SDCC_DATA0
P2
SD card data signal
--
If it is not used, NC
62
SD_DET_N
--
--
NC
--
Reserved
63
GND
--
--
Ground
--
Mandatory
64
Preserved
--
--
--
--
--
65
Preserved
--
--
--
--
--
66
GND
--
--
Ground
--
Mandatory
67
Preserved
--
--
--
--
--
68
Preserved
--
--
--
--
--
69
GND
--
--
Ground
--
Mandatory
70
GPS_ANT
--
--
GPS antenna
--
If it is not used, NC
71
GND
--
--
Ground
--
If it is not used, NC
72
JTAG_TRST_N
P1
--
NC
--
If it is not used, NC
73
JTAG_RTCK
P1
--
NC
--
If it is not used, NC
74
JTAG_TCK
P1
--
NC
--
If it is not used, NC
14
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
PIN
Signal Definition
Pin
Voltage
I/O
PIN Attribute
PU/PD
Remark
Status
75
JTAG_TDO
P1
--
NC
--
If it is not used, NC
76
JTAG_TDI
P1
--
NC
--
If it is not used, NC
77
JTAG_TMS
P1
--
NC
--
If it is not used, NC
78
GND
--
--
Ground
--
Mandatory
79.-
GND
--
--
Heat-dissipation
--
Mandatory
108.
welder
Note: “NC” indicates Not Connected. That is, there is no connection inside the module. P1 and P2 refer to the
power-supply signal level group 1 and 2.
3.2
Working Condition
Table 3-3 Working Condition
Signal
Description
VPH_PWR
Main power supply of
Min
Typical
Max
Unit
3.4
3.8
4.2
3.3
5.25
the module
USB_VBUS
Power supply PIN of
USB PHY
ADC
Analog input
--
2.2
VDD_P1
Voltage of PIN group
1.65
1.8
1.95
2.7
2.85
P1
VDD_P2
Voltage of PIN group
P2
Note: The typical voltage refers to the default I/O voltage of P1 and P2 PIN group. It is required that the external input PIN
provides this voltage. 2. The voltage design of external circuit interfaces should match that of the ZM5202 PINs. 3. When
VPH_PWR works within the voltage range, it can reach good whole-set performance. If it is lower than the minimum value,
the whole-set performance will be affected, or the module cannot work normally. If it is higher than the maximum value, the
module might be damaged.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
15
Hardware Development Guide of Module Product
3.3
Feature of Interface Power Level
3.3.1
Feature of Digital Power Level Signal
Table 3-4
Signal
VIH
Power Level Range of Digital Signal
Description
High level of
Min
Max
Units
0.65*VDD_PX
VDD_PX+0.3
-0.3
0.35* VDD_PX
VDD_PX-0.45
VDD_PX
0.45
input voltage
VIL
Low level of
input voltage
VOH
High level of
output voltage
VOL
Low level of
output voltage
3.4
Power Interface
3.4.1
Description of Power PINs
Power VPH_PWR signal (PIN No: 23-26). This is the positive signal of 3.8V power
supply.
GND signal (PIN No: 2/12/14/31/36/38/44/47/54/63/66/69/71/78). This is the power
ground and signal ground of ZM5202, which needs to be connected to the ground
on the system board. If the GND signal is not connected completely, the
performance of ZM5202 will be affected. Besides, there are altogether 30
heat-dissipation wielding panel with PIN No. 79-108.
3.4.2
Requirement of Power Supply
The power supply is recommended to be within the range of 3.4~4.2V. If the
network is in poor situation, the antenna will transmit at the maximum power, and
the transient maximum peak current under 2G mode can reach as high as 2A. So
the power supply capacity for peak current needs to be ab ove 2.5A, and the
average peak current needs to be above 0.9A.
16
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
3.5
(U)SIM Card Interface
3.5.1
Description of PINs
ZM5202 WCDMA module baseband processor integrates the (U)SIM card interface
in compliance with ISO 7816-3 standards, and supports to automatically detect
3.0V/1.8V (U)SIM cards. The signals on SIM card interface is as shown in Table
3-5.
Table 3-5
PIN
Definition & Description of (U)SIM Card Signal Group
Protocol
Signal
Signal
Definition
48
VREG_RSIM
SIM card power
49
UIM_RST
50
UIM_DATA
51
UIM_CLK
SIM card reset
PIN
SIM card data
PIN
SIM card clock
PIN
Signal Description
Output range: 1.5-3.0V
---USIM card data signal,
52
UIM_DP
Data cable
applied on a large-capacity
SIM card
USIM card data signal,
53
UIM_DM
Data cable
applied on a large-capacity
SIM card
3.5.2
Electric Feature
On the line close to the (U)SIM card console, be sure to add the ESD circuit
protection during the design.
To comply with the requirements of 3GPP TS 51.010-1 and EMC authentication, it
is recommended to place (U)SIM card console close to the (U)SIM card interface, to
prevent the wiring from being too long, which might seriously distort the waveform
and thus affect the signal integrity. It is recommended to make the grounding
protection for UIM_CLK and UIM_DATA signal wiring. Cascade one 0.1uF and
33pF capacitor between VREG_RSIM and GND, and cascade a 33pF capacitor
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
17
Hardware Development Guide of Module Product
between UIM_CLK, UIM_RST and GND, to filter out the interference by RF signals.
It is recommended to cascade a 20ohm resistance on UIM_DATA cable.
3.5.3
Application of (U)SIM Card Interface
Figure 3-2
(U)SIM Card Signal Connection Circuit
3.6
SD Card Interface
3.6.1
Description of PINs
The SD card interface of ZM5202 module is the storage card based on FLASH,
embedded with 4-bit and 1-bit SD controller, supporting SD and Mini SD cards. Its
PIN signals are as shown in Table 3-6.
Table 3-6
PIN
18
Signal Name
Definition of SD Card Signal Interface
Description
Function
61
SDCC_DATA0
SD card data cable PIN
60
SDCC_DATA1
SD card data cable PIN
59
SDCC_DATA2
SD card data cable PIN
58
SDCC_DATA3
SD card data cable PIN
57
SDCC_CLK
SD card clock cable PIN
56
SDCC_CMD
SD card control PIN
--
55
VREG_MMC
SD card power
3V
SD card data cable
SD control clock output
can reach up to 20MHz
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
3.6.2
Electric Feature
SDCC_CLK: Clock signal, host2device, default is 0~25MHz.
SDCC_CMD: Command/response, two-way: the command can sent from the host
to a single card/all cards, the response is sent from a single card/all cards to the
host.
SDCC_DATA[3..0]: Data cable, two-way, default is 0~12.5MB/sec.
3.6.3
Application of SD Card Interface
Figure 3-3 is the reference design diagram for the SD interface. The detection of SD
card adopts the polling mode of DATA3 signal cable to judge whether T card is
inserted or not.
Figure 3-3
SD Typical Application Circuit
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
19
Hardware Development Guide of Module Product
3.7
USB2.0 Interface
3.7.1
Description of PINs
ZM5202 has the high-speed USB2.0 interface, which supports both the full-speed
mode and the high-speed mode. The main processor (AP) is connected with the
module via the USB interface to transmit data.
3.7.2
Electric Feature
The USB interface complies with the USB2.0 specifications and the electric features.
USB_DP, USB_DA are wired strictly according to the differential mode, and the
length difference between the two cables should be restricted within 1mm.
Note: The differential impedance should be controlled within 90ohm.
It is recommended to connect to a high-speed common-mode echo filter on the USB
differential signal wire. If the cable is exposed to the external environment, it is
suggested to add a n ESB protection device. The power capacity of the ESD
protection device should be kept within 1.5pF.
3.7.3
Application of USB Interface
The USB bus is mainly used in data transmission, software upgrading and modular
program detection. Figure 3-4 shows a reference circuit design.
20
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Figure 3-4
USB Typical Circuit Application
3.8
Serial Interface
3.8.1
SPI (Serial Peripheral Interface) Bus Interface
3.8.1.1
Description of PINs
The definition of SPI interface signaling is defined as shown in Table 3-7.
Table 3-7
PIN
3.8.1.2
Signal Name
Definition of SPI Signal
I/O Type
Function
39
SPI_ CS_N
SPI segment
40
SPI_ CLK
SPI clock
41
SPI_MISO_DATA
Main input, slave output
42
SPI_MOSI_DATA
Main input, slave output
Electric Feature
The SPI bus of ZM5202 is configured as the master equipment, and there are three
modes for SPI:
Running mode: Basic running mode.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
21
Hardware Development Guide of Module Product
Waiting mode: The waiting mode of SPI is a configurable low-power mode, enabled
by the byte of the control registered. In the waiting mode, if the waiting byte is
cleared, SPI works under the similar running mode. However, if SPI waits for the
position byte, SPI clock stops and enters the low-power status.
Stop mode: Under the stop mode, SPI is not available, so the power consumption is
reduced. If SPI is configured as the master equipment, any transmission process
will be s topped, but it can enter the running mode when the waiting mode stops.
Figure 3-5 is the SPI bus sequence chart.
Figure 3-5
3.8.2
I2C Bus
3.8.2.1
Description of PINs
SPI Bus Sequence Chart
I2C is the two-wire bus for the communication between ICs, which supports any IC
process (NMOS, CMOS, dual-polarity). The two signal wires, serial data (SDA) and
serial clock (SCL), can transmit information between the connected equipment.
Each equipment is identified by the unique address (such as the micro controller,
storage, LCD driver, audio DAC or keyboard interface). Due to the different
functions of the equipment, it can be used as both the sender and the receiver.
22
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
3.8.2.2
Electric Feature
The I2C interface has the following features:
1.
The two-wire bus is used for the communication between ICs.
2.
It supports any external equipment of any manufacturing technology (1.8V).
3.
It supports the external functions, such as the image sensor, micro controller,
FM radio chip, LCD chip, audio DAC and keyboard interface.
The I2C interface has two working modes with different transmission ratios:
standard mode with a speed as high as 100kbps; high-speed mode with a speed as
high as 400kbps. Figure 3-6 is the I2C reference circuit design diagram.
Figure 3-6
I2C Reference Circuit Diagram
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
23
Hardware Development Guide of Module Product
3.8.3
UART Interface
3.8.3.1
Description of PINs
ZM5202 module provides a circuit of serial communication interface UART, which
complies with the RS-232 interface protocol, and supports the 8-byte serial bus
interface or 2-byte serial interface is Via the UART interface. But the 8-byte serial
bus UART interface and the SPI bus interface are not supported simultaneously.
The module can perform the serial communication and AT instruction interaction
with external.
This UART port supports the programmable data width, programmable data stop
digit and programmable odd/even checksum, and has an independent TX and RX
FIFOs (512 bytes for each). For the normal UART application (non-Bluetooth), the
maximum baud r ate is 230400bps, the 4Mbps high baud rate is only used on
Bluetooth 2.0 application, and the default baud rate is 115200bps. The PINs are
defined as shown in Table 3-8.
Table 3-8
PIN
3.8.3.2
Definition of UART Signal
Signal
Description
Name
Function
UART port CTS clearing
27
UART1_CTS
28
UART1_RFR
29
UART1_TXD
UART port TXT sending data
30
UART1_RXD
UART port RXD data receiving
40
UART_DTR
DTE is ready
--
41
UART_RI
Ring indicator
--
42
UART_DSR
Data is ready
--
39
UART_DCD
Carrier detect
--
sending
UART port RFR preparing to
UART power level
receive
is 1.8V.
Electric Feature
During the software interconnection process, there is a method of capturing logs,
and it is recommended that this interface be kept during the design and the testing
point be reserved. If the module is used together with the application processor, and
the PWL matches with 1.8V, the connection mode is as shown in Figure 3-7. The
24
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
4-wire or 2-wire mode can be us ed for connection. The module interface PWL is
1.8V. If it does not match the PWL of AP interface, it is recommended to add the
PWL conversion circuit.
The connection of ZM5202 UART port and standard RS-232-C interface can be
through the chip like class 232. The design involves the transformation of TTL level
and EIA level. We recommend to use the chip of NLSX5014MUTAG. If using the
2-byte serial bus interface, MAX3232 is recommended, and if using the 8-byte serial
bus interface, SP3238 or MAX3238 is recommended. The connection mode is as
shown in Figure 3-7
Figure 3-7
Module Serial Port & AP Application Processor
RXD
TXD
TXD
RXD
CTS
RFR
ZM5202 DTR
RFR
CTS
DTR
DSR
DSR
DCD
DCD
RI
RI
GND
Figure 3-8
AP
GND
The connection of ZM5202 UART and Standard RS-232-C interface
User Board
UART_DCD
RS232_DCD
UART_DSR
RS232_DSR
UART_TXD
UART_CTS
ZM5202
module
Female DB9
UART_RXD
UART_RFR
1.8V
-TTL
level
translator
UART_DTR
TTLRS232
level
translator
RS232_TXD
RS232_CTS
RS232_RXD
RS232_RTS
SP3238
RS232_DTR
NLSX5014MUTAG
UART_RI
MAX3238
GND
RS232_RI
GND
Note:UART_RFR is equal to UART_RTS.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
25
Hardware Development Guide of Module Product
3.9
JTAG (Joint Test Action Group) Interface
3.9.1
Description of PINs
The JTAG interface complies with the ANSI/ICEEE Std. 1149.1-1990 standard, and
the interface is defined as shown in Table 3-9.
Table 3-9
PIN
Signal Name
Definition of JTAG Signal
I/O Type
Function
JTAG_RESOUT_N
DI
LGA reset
72
JTAG_TRST_N
DI-PD
JTAG reset
73
JTAG_RTCK
DO
JTAG return clock
74
JTAG_TCK
DI-PU
JTAG clock input
75
JTAG_TDO
JTAG test data output
76
JTAG_TDI
DI-PU
JTAG test data input
77
JTAG_TMS
DI-PU
JTAG test mode
select
78
3.9.2
GND
--
Grounding
Application of JTAG Interface
On the system board, you need to reserve the testing point or interface of the
related JTAG signal, so as to solve the un-repairable fault of LGA module due to
emergencies such as downloading interruption.
3.10
Power-on/Power-off & Reset Signal
3.10.1
Description of PINs
The power-on process of ZM5202 module is: Push the POWER_ON PIN for more
than 50ms, pull this PIN upward and then power on. Under the power-on status,
push POWER_ON PIN for more than 5s, then pull this PIN higher, and then power
off. Within the module, POWER_ON PIN is pulled via a 200 K resistance to 1.8V
power. To power on, if it does not need to be powered down, process POWER_ON
according to the figure below.
26
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Figure 3-9
Module Power-on Plan
PON_RST_N PIN is used to reset the module. After pushing PON_RST_N PIN for
50ms, pull it higher again and then reset the module.
3.10.2
Interface Application
The POWER_ON and PON_RST_N circuits can refer to the design circuit as shown
in Table 3-9. In this figure, the two input signals on t he left are the input control
signals for reset and power-on respectively.
Figure 3-10
Recommended Circuit for Power-on/Power-off & Reset
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
27
Hardware Development Guide of Module Product
3.11
Interactive Application Interface
3.11.1
Description of PINs
Table 3-10 mainly describes the interfaces interacting with the application processor,
including the following three types of interfaces: querying, wakeup and status
indication.
Table 3-10
PIN
Signal Name
I/O Type
Function
Module querying AP
AP_READY
DI
MODULE_READY
DO
10
AP_WAKEUP_MODULE
DI
AP wakeup Module
DO
Module wakeup AP
11
19
3.11.2
Interactive Application Interface
MODULE
_WAKEUP_AP
MODULE_POWERON
DO
sleep status
AP querying Module
sleep status
MODULE power-on
status indication
Interface Application
The ZM5202 module provides 5 handshake signals for the communication with the
application processor (AP). By MODULE_POWERON, AP can query whether LGA
is powered on and is working normally. By MODULE_READY, AP queries whether
the LGA module has entered the sleep status, wakes up the module under the sleep
status by AP_WAKEUP _MODULE. In the same way, when AP is in the sleep
status, the LGA module can query the AP status by AP_READY, and wakes up AP
by MODULE _WAKEUP_AP.
AP_READY: Indicates that the AP server is sleep: the high PWL indicates the sleep
status, and the low PWL indicates the wakeup status.
MODULE_READY: Indicates that the module is sleep: the high PWL indicates the
sleep status, and the low PWL indicates the wakeup status.
AP_WAKEUP_MODULE: After the module has entered the sleep status, the AP
server can wake up the module by the low PWL control; if it’s always on the low
28
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
PWL, the module cannot enter the sleep status. After the AP server enters the high
PWL, the module enters the sleep status.
MODULE_WAKEUP_AP: Make sure that the function of remote wake up is enabled
in the config file. When a S MS or call is receiving, the output level of this pin is
shown in the following figure: low for 2s—high for 15s—low for 2s—high for
15s—low for 2s before return its default high level to wakeup the AP side.
Figure 3-11
The output of MODULE_WAKEUP_AP
MODULE_POWERON: After the module is powered on, this signal is set to high,
and kept until the system is restarted or powered down. Low signal indicates that
the server is not powered on, during the power-on process or is being restarted.
3.12
LED Indicator Interface
3.12.1
Description of PINs
Table 3-11
PIN
20.
21.
22.
Signal Name
Definition of LED PIN Signal
I/O Type
LED_GREEN
AI
LED_RED
AI
LED_BLUE
AI
Function
Module signal indicator
interface
Module signal indicator
interface
Module signal indicator
interface
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
29
Hardware Development Guide of Module Product
3.12.2
Interface Application
The LGA module has three PINs to control the LED indicator, used to indicate the
network connection status. The different modes of status indicator flashing indicate
different network statuses. All the three PINs use the current sink type of current
source for control, which connects to the negative end of LED and connects to
VPH_PWR externally, to directly drive LED. Figure 3-12 is the reference circuit
design diagram. The flashing of indicator is controlled by the switch of RF, and the
LED PIN transmits the control signal to the external. The indicator status is as
defined in Table 3-12. If the RF control is not needed, the AP server can design the
status of control indicator by itself.
Figure 3-12
Reference Circuit of Status Indicator
Table 3-12
Indicator Status
RED indicator
always on
Module Working Status
Not registered to the network
GREEN indicator
Have been registered to 2G
always on
network
GREEN indicator
flashing
Have been registered to 2G
network, and there is data service
as well.
BLUE indicator
Have been registered to 3G
always on
network
BLUE indicator
flashing
30
Definition of Indicator Status
Have been registered to 3G
network, and there is data service
as well.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Electric Feature
4.1
Power Feature
4.1.1
Power Supply
The input voltage range of ZM5202 is DC 3.4V~4.2V, and the typical value is 3.8V,
as shown in Table 4-1.
Table 4-1
Parameter
Input
Min
3.4V
Input Voltage
Typical
3.8V
Max
4.2V
voltage
4.1.2
Working Current
The working current range of ZM5202 is as shown in Table 4-2. The IDLE mode
indicates the power consumption of the module when there is no service. The table
also provides the working current range under GSM and WCMA mode when there
is data service.
Table 4-2 Working Current
Mode
GSM
Status
Average
With no service
≤75mA
IDLE mode
With data
≤380mA
GPRS/EDGE
transmission
WCDMA
Remark
mode
With no service
≤75mA
IDLE mode
With data
≤470mA
HSPA mode
transmission
Note: The above average current is acquired under the maximum transmission power. Under different
environments, the testing results might be slightly different. Take the actual situation as the reference.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
31
Hardware Development Guide of Module Product
4.2
Power-on/Power-off Flow
To guarantee the user can power on and power off stably, you can refer to the
power-on sequence chart as shown in Figure 4-1 and the power-off sequence chart
as shown in Figure 4-2. Table 4-3 shows the power-on and resetting time, which
needs to be paid attention to during the module power-on process.
1.
Once VPH_PWR is powered on, the POWER_ON signal will be synchronized
and be established as the high PWL.
2.
After VPH_PWR is established normally, the interval between it to the
POWER_ON signal cannot be too short. Refer to T2 parameter. ZTEWelink
recommends that VPH_PWR adopt the power-off plan that does not
disconnect the power supply.
3.
The power-on startup time takes the lower level of POWER_ON as the starting
point, and POWER_ON needs to be released after being kept on the low PWL
for a period.
4.
SUB_VBUS is the USB PHY power supply. It is not recommended to be
established before VPH_PWR.
During the process of establishing the module PINs, pay attention to the following
items:
1.
To power off by the POWER_ON signal, the T4 period needs to be designed
as required.
2.
After VPH_PWR and USB_VBUS are powered off, it is recommended not to
disconnect the power supply.
32
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Figure 4-1
Power-on Sequence Chart of ZM5202 Module
T1
VPH_PWR
T3
USB_VBUS
POWER_ON
T2
Figure 4-2
Power-off Sequence Chart of ZM5202 Module
T5
VPH_PWR
USB_VBUS
T4
POWER_ON
Table 4-3
Parameter
T1
Power-on/Power-off Time
Description
From powering on VPH_PWR to
Min
Typical
Max
Unit
0.5
second
1.5
--
second
0.05
0.1
--
second
--
second
--
second
establishing USB_VBUS
T2
From powering on VPH_PWR to
Power-on taking effect
T3
The period that the Power-on signal
for power on operation is kept on
the low PWL
T4
The period that the Power-on signal
for power off operation is kept on
the low PWL
T5
From the releasing the Power-on
button for power off operation to the
power off of VPH_PWR and
USB_VBUS
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
33
Hardware Development Guide of Module Product
4.3
Resetting Flow
The PON_RST_N reset signal of ZM5202 module is the increasing resetting, so it is
reset after decreasing this PIN by 100ms. Figure 4-3 is the module resetting flow.
Figure 4-3
PON_RST_N
Module Resetting Flow
100ms
34
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Hardware Development Guide of Module Product
Technical Index of Radio Frequency
5.1
Technical Index of Radio Frequency under
UMTS Mode
5.1.1
UMTS (WCDMA)
The RF index should be tested strictly in accordance with the related testing
specifications of 3GPP. The RF indexes of UMTS2100/1900/850 should satisfy the
requirements of 3GPP TS 34.121 protocol.
5.2
Technical Index of Radio Frequency under
GPRS/GSM/EDGE Mode
The RF indexes of GSM/GPRS/EDGE850/900/1800/1900 should satisfy the
requirements of 3GPP TS 05.05 protocol.
5.3
Technical Parameters of Antenna Testing
Console
ZM5202 supports the AGPS function, so the system equipment needs to add the
AGPS antennal. The design of AGPS antenna is consistent with that of the main
antenna, and its efficiency index can be 3dB lower. The separation degree between
the main antenna and the diversity antenna is required to be greater than 12dB. The
antenna index is divided into the sourceless index and s ourced index. The
sourceless index includes S11, efficiency, gains, orientation diagram and polarity,
which can be used as the parameter measuring the performance of the antenna
itself. The sourced index is also called the OTA index, including TRP (all-round
radiation power), TIS (all-round receiving sensitivity), radiation orientation diagram,
which is an important index measuring the radiation performance of the whole set
(including the antenna, module, circuit main board).
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
35
Hardware Development Guide of Module Product
5.3.1
Sourceless Index
The sourceless indexes of antenna are different according to the different
requirements of wireless Internet products. Here, taking the 3G Internet notepad as
an example, the sourceless index of the antenna is recommended to reach the
standards as described below.
Table 5-1
Sourceless Index of Main Antenna (Recommended)
Frequency Band
1710-2170MHz
VSWR in Free Space
<3:1
<3:1
Peak Gain in Free Space
>0dBi
>0dBi
-3dBi
-3dBi
>50%
>50%
3-D Average Gain in Free
Space
Antenna Efficiency
5.3.2
824-960MHz
Sourced Index
The sourced indexes of antenna are different according to the different
requirements of the product type. Here, taking the 3G Internet notepad as an
example, the sourced index of the antenna is recommended as below.
TRP: 18dBm;
GSM850>27dBm, GSM900>27dBm;
DCS1800>24dBm, PCS1900>24dBm>;
TIS: 
Source Exif Data: 
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
Encryption                      : Standard V4.4 (128-bit)
User Access                     : Print, Extract, Print high-res
Author                          : chenying
Create Date                     : 2013:08:01 10:56:32+08:00
Modify Date                     : 2013:08:02 16:59:22+08:00
Subject                         : 
Tagged PDF                      : Yes
XMP Toolkit                     : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04
Metadata Date                   : 2013:08:02 16:59:22+08:00
Creator Tool                    : Acrobat PDFMaker 10.1 Word 版
Document ID                     : uuid:8773c73f-e1d1-4a6c-9689-352900784d13
Instance ID                     : uuid:0d73ce6e-ea46-4ed2-b140-e46d2ec941b6
Format                          : application/pdf
Title                           : 【模块产品名称】用户开发手册
Description                     : 
Creator                         : chenying
Producer                        : Adobe PDF Library 10.0
Keywords                        : 
Source Modified                 : D:20130801025512
Company                         : 中兴手机事业部
Page Layout                     : OneColumn
Page Count                      : 61


EXIF Metadata provided by EXIF.tools
FCC ID Filing: SRQ-ZM5202

Navigation menu