ZTE ZTEMG2618 GSM Wireless Data Terminal User Manual

ZTE Corporation GSM Wireless Data Terminal Users Manual

Users Manual

Hardware Development Guide of Module
Product
ZTE MG2618
Version 1.0，2015-03-18
Welink Your Smart
Hardware Development Guide of Module Product
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ZTE MG2618
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This document is provided “as is” and “as available”. Information contained in this document is subject
to continuous update without further notice due to improvement and update of ZTE CORPORATION’s
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ZTE MG2618
Revision History
Version
Date
Description
V1.0
2015-03-18
1st released
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ZTE MG2618
Contents
1 PRODUCT OVERVIEW ............................................................................................................. 1
1.1 TECHNICAL PARAMETERS ............................................................................................ 1
1.2 APPLICATION FRAME ..................................................................................................... 2
1.3 ABBREVIATIONS.............................................................................................................. 3
2 INTERFACES ............................................................................................................................... 6
2.1 PIN DESCRIPTION ............................................................................................................ 6
2.2 ANTENNA INTERFACE ................................................................................................... 8
2.3 RF PERFORMANCE OF ANTENNA INTERFACE ......................................................... 8
3 ELECTRIC FEATURES ........................................................................................................... 10
3.1 INTERFACE POWER LEVEL ......................................................................................... 10
3.2 POWER CONSUMPTION ................................................................................................ 10
3.3 POWER-ON/OFF TIMING SEQUENCE ......................................................................... 11
3.4 RELIABILITY TEST ........................................................................................................ 11
3.5 ESD CHARACTERISTIC ................................................................................................. 12
3.6 GPS PERFORMANCE ...................................................................................................... 12
4 REFERENCE CIRCUIT OF MODULE INTERFACES ....................................................... 13
4.1 RESET AND POWER DESIGNING ................................................................................ 13
4.2 UART INTERFACE .......................................................................................................... 15
4.2.1 DUPLEX UART INTERFACE .............................................................................. 17
4.3 SIM CARD INTERFACE .................................................................................................. 18
4.4 AUDIO INTERFACE ........................................................................................................ 19
4.5 LED INDICATOR INTERFACE ...................................................................................... 22
4.6 GPS INTERFACE ............................................................................................................. 22
4.7 CONNECTION METHOD OF GPS ACTIVE ANTENNA.............................................. 23
5 MECHANIC FEATURES.......................................................................................................... 24
5.1 APPEARANCE DIAGRAM ............................................................................................. 24
5.2 ASSEMBLY DIAGRAM .................................................................................................. 25
5.3 PCB PACKAGE DIMENSIONS ....................................................................................... 26
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6 SMT PROCESS AND BAKING GUIDE .................................................................................. 28
6.1 STORAGE REQUIREMENTS.......................................................................................... 28
6.2 RECOMMENDED PAD DESIGN .................................................................................... 28
6.3 REQUIREMENTS OF MODULE’S POSITION ON MAIN BOARD ............................. 30
6.4 MODULE PLANENESS STANDARD ............................................................................ 31
6.5 PROCESS ROUTING SELECTION ................................................................................. 31
6.5.1 SOLDER PASTE SELECTION.............................................................................. 31
6.5.2 DESIGN OF MODULE PAD’S STEEL MESH OPENING ON MAIN BOARD . 31
6.5.3 MODULE BOARD’S SMT PROCESS .................................................................. 32
6.5.4 MODULE SOLDERING REFLOW CURVE ........................................................ 33
6.5.5 REFLOW METHOD .............................................................................................. 34
6.5.6 MAINTENANCE OF DEFECTS ........................................................................... 34
6.6 MODULE’S BAKING REQUIREMENTS ....................................................................... 35
6.6.1 MODULE’S BAKING ENVIRONMENT .............................................................. 35
6.6.2 BAKING DEVICE AND OPERATION PROCEDURE ........................................ 35
6.6.3 MODULE BAKING CONDITIONS ...................................................................... 35
7 SAFETY INFORMATION ........................................................................................................ 36
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ZTE MG2618
Figures
Figure 1–1 Application Frame ...................................................................................................................... 3
Figure 3–1 Power-on/off timing sequence .................................................................................................. 11
Figure 4–1 Reference Circuit of Power Supply & Reset Interface ............................................................. 14
Figure 4–2 Reference Circuit of Power Supply Interface ........................................................................... 14
Figure 4–3 Reference Circuit 1 of UART Interface ................................................................................... 16
Figure 4–4 Reference Circuit 2 of UART Interface ................................................................................... 16
Figure 4–5 UART Connection between DCE－DTE ................................................................................. 17
Figure 4–6 Reference Circuit of SIM Card Interface ................................................................................. 19
Figure 4–7 MIC reference circuit ............................................................................................................... 20
Figure 4–8 SPK reference circuit ............................................................................................................... 21
Figure 4–9 Reference Circuit of Status Indicator ....................................................................................... 22
Figure 4–10 Reference Circuit of GPS Interface ........................................................................................ 23
Figure 4–11 Active GPS antenna circuit reference design principle diagram ............................................ 23
Figure 5–1 Top & bottom & side view of module ..................................................................................... 24
Figure 5–2 The assembly diagram of module ............................................................................................ 25
Figure 5–3 The PCB package dimensions of module (Top View) ............................................................. 26
Figure 5–4 Test point of module ................................................................................................................ 27
Figure 6–1 Module’s dimensions ............................................................................................................... 29
Figure 6–2 Recommended PAD dimensions on corresponding main board .............................................. 29
Figure 6–3 Module board’s PAD mounted on main board......................................................................... 30
Figure 6–4 Green oil and white oil at module’s position on main board .................................................... 30
Figure 6–5 Module Board’s Steel Mesh Diagram ...................................................................................... 32
Figure 6–6 Material Module Pallet ............................................................................................................. 33
Figure 6–7 Module Furnace Temperature Curve Diagram ......................................................................... 34
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ZTE MG2618
Tables
Table 1–1 The function information of module ............................................................................................ 1
Table 1–2 Major Technical Parameters ........................................................................................................ 1
Table 1–3 Abbreviation List ......................................................................................................................... 3
Table 2–1 PIN Interface Definition .............................................................................................................. 6
Table 2–2 RF Performance of antenna interface .......................................................................................... 8
Table 3–1 Power Level Range of Digital Signal ........................................................................................ 10
Table 3–2 Power Consumption of Module (Typical) ................................................................................. 10
Table 3–3 Module testing environment of temperature .............................................................................. 11
Table 3–4 ESD Endurance.......................................................................................................................... 12
Table 3–5 GPS Performance ...................................................................................................................... 12
Table 4–1 Working Condition .................................................................................................................... 13
Table 4–2 UART Interface Definition ........................................................................................................ 17
Table 4–3 Definition of SIM Card Signal .................................................................................................. 18
Table 4–4 Audio interface definition .......................................................................................................... 19
Table 4–5 Definition of LED Indicator Status ............................................................................................ 22
Table 6–1 Baking parameters ..................................................................................................................... 28
Table 6–2 Recommended PAD dimensions of main board ........................................................................ 30
Table 6–3 LCC module PAD’s steel mesh opening ................................................................................... 31
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ZTE MG2618
R&TTE Regulation:
In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE
Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3
requirements.
Hereby, ZTE CORPORATION declares that this product is in complies with the essential requirements of
Article 3 of the R&TTE 1999/5/EC Directive.
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ZTE MG2618
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
End Product Labeling
The final end product must be labeled in a visible area with the following: “Contains FCC ID:
SRQ-ZTEMG2618”. The grantee's FCC ID can be used only when all FCC compliance
requirements are met.The FCC part15.19 staement below has also be available on the
label:The device complies with part 15 of FCC rules,Operation is sugject to the following two
conditions:(1)This device may not cause harmful interference,and(2)this device must accept
any interference received,including interference that may cause undesired operation,to comply
With FCC regulations limiting both maximum RF output power and human exposure to RF
radiation.
A user maual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
Guidelines,The end product with an module may also need to pass the FCC part15
unintentional emission testing requirements and be properly authorized for FCC
part15.Note:If thie module is intended for use in a portable device,you are responsinble
For separate approval to satify the SAR requirements of FCC part2.1093
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 3 dBi.
2)The transmitter module may not be co-located with any other transmitter or antenna.
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ZTE MG2618
1 Product Overview
MG2618 is a GSM/GPRS wireless industrial module, and it contains three variants V2A, V2B and
V2C. Customer can choose the dedicated type based on the wireless network configuration. The following
table shows the entire configuration of MG2618 series.
Table 1–1 The function information of module
SN
PID
GPS
1
V2A
Not support
2
V2B
Not support
3
V2C
Support
MG2618 is a wireless Internet module with 49 pin LCC interface. It is widely applied to but not
limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric
devices, by providing data services, transceiver Email, web browsing, high speed download and so on.
In places with GSM network coverage, you can send and receive SMS, use high-speed data access
service, voice calls and other functions under the mobile environment. The module provides users with a
high degree of freedom, convenient solution to realize mobile office dreams.
This section describes the basic functions and logic diagram of the module.
1.1 Technical Parameters
Table 1–2 Major Technical Parameters
Items
Parameters
Basic Features
Bands
GSM850/EGSM900/DCS1800/PCS1900(Optional)
Dimensions
22.00mm*20.00mm*2.0mm
Weight
About 1.9g
Normal Working Temperature
-35~75°C
Extreme Working Temperature
-40~85°C
Storage Temperature
-50~90°C
Humidity
0% ~ 95%
Performance
Power Supply
The range of voltage supply is 3.4V-4.2V, typical value: 3.8V
Max. Transmitter Power
33±2dBm @ GSM850/GSM900
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ZTE MG2618
Items
Parameters
30±2dBm @ DCS1800/PCS1900
Receiving sensitivity
-108dBm @ GSM850/GSM900
-106dBm @ DCS1800/PCS1900
Interface
Encapsulation type
49 Pin LCC
Antenna interface
LCC pad
UART Interface
AT commands, data transmission
SIM card Interface
1.8V/3V
Data Service
Service
GPRS, Class A or B, Class 10 or 12
GPRS Mobile station
Class C
GPRS class
Class 12
Max. DL Data rate
85.6Kbps
Max. UL Data rate
42.8Kbps
Protocols
Embedded TCP/IP and UDP/IP protocol stack
TCP Server, UDP Server
Embedded FTP
SMS
Support TEXT/PDU mode
Point-to-point MO/MT
SMS Cell Broadcast
AT Commands
Static AT commands set
Extended AT commands set
1.2 Application Frame
The application frame of module is as follows:
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ZTE MG2618
Figure 1–1 Application Frame
Note: Only the modules which support GPS function have the function of GPS as shown in Blue
Block Diagram above.
1.3 Abbreviations
Table 1–3 Abbreviation List
A
ADC
Analog-Digital Converter
模数转换
AFC
Automatic Frequency Control
自动频率控制
AGC
Automatic Gain Control
自动增益控制
ARFCN
Absolute Radio Frequency Channel Number
绝对射频信道号
ARP
Antenna Reference Point
天线参考点
ASIC
Application Specific Integrated Circuit
专用集成电路
B
BER
Bit Error Rate
比特误码率
BTS
Base Transceiver Station
基站收发信台
C
CDMA
Code Division Multiple Access
码分多址
CDG
CDMA Development Group
CDMA 发展组织
Main Chip
GPS Chip
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ZTE MG2618
CNR
Carrier Noise Ratio
载噪比
CSD
Circuit Switched Data
电路交换数据
CPU
Central Processing Unit
中央处理单元
D
DAC
Digital-to-Analog Converter
数模转换
DCE
Data Communication Equipment
数据通讯设备
DSP
Digital Signal Processor
数字信号处理
DTE
Data Terminal Equipment
数据终端设备
DTMF
Dual Tone Multi-Frequency
双音多频
DTR
Data Terminal Ready
数据终端准备好
E
EFR
Enhanced Full Rate
增强型全速率
EGSM
Enhanced GSM
增强型 GSM
EMC
Electromagnetic Compatibility
电磁兼容
EMI
Electro Magnetic Interference
电磁干扰
ESD
Electronic Static Discharge
静电放电
ETS
European Telecommunication Standard
欧洲通信标准
F
FDMA
Frequency Division Multiple Access
频分多址
FR
Full Rate
全速率
G
GPRS
General Packet Radio Service
通用分组无线业务
GSM
Global Standard for Mobile Communications
全球移动通讯系统
H
HR
Half Rate
半速率
I
IC
Integrated Circuit
集成电路
IMEI
International Mobile Equipment Identity
国际移动设备标识
ISO
International Standards Organization
国际标准化组织
ITU
International Telecommunications Union
国际电信联盟
L
LCD
Liquid Crystal Display
液晶显示器
LED
Light Emitting Diode
发光二极管
M
MCU
Machine Control Unit
机器控制单元
MMI
Man Machine Interface
人机交互接口/人机界面
MS
Mobile Station
移动台
P
PCB
Printed Circuit Board
印刷电路板
PCL
Power Control Level
功率控制等级
PCS
Personal Communication System
个人通讯系统
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PDU
Protocol Data Unit
协议数据单元
PPP
Point-to-point protocol
点到点协议
R
RAM
Random Access Memory
随机访问存储器
RF
Radio Frequency
无线频率
ROM
Read-only Memory
只读存储器
RTC
Real Time Clock
实时时钟
S
SIM
Subscriber Identification Module
用户识别卡
SMS
Short Message Service
短消息服务
SRAM
Static Random Access Memory
静态随机访问存储器
T
TA
Terminal adapter
终端适配器
TDMA
Time Division Multiple Access
时分多址
TE
Terminal Equipment also referred it as DTE
终端设备，也指 DTE
TTFF
Time To First Fix
首次定位时间
U
UART
Universal asynchronous receiver-transmitter
通用异步接收/发送器
UIM
User Identifier Management
用户身份管理
USB
Universal Serial Bus
通用串行总线
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2 Interfaces
The MG2618 module connects externally through a 49 PIN stamp-hole interface.
2.1 PIN Description
Table 2–1 PIN Interface Definition
PIN
Type
Signal Definition
I/O
Description
Remark
1
GND
GND
--
--
--
2
POWER
RSSI_LED
O
Working status
indicator
Active High
3
POWER
ON/OFF
I
Module
power-on/off
control
Valid at low level; pull-up
internally, more information please
refer to 4.1
4
GND
GND
--
--
--
5
AUDIO
HSED BIAS
O
MIC bias
Default is 1.9V
6
AUDIO
MIC1_P
I
Differential audio
input channel 1,
anode
--
7
AUDIO
MIC1_N
I
Differential audio
input channel 1,
cathode
--
8
AUDIO
MIC2_P
I
Single-end audio
input channel 2
--
9
AUDIO
SPK2_P
O
Single-end audio
output channel 2
--
10
AUDIO
SPK1_P
O
Differential audio
output channel 1,
anode
--
11
AUDIO
SPK1_N
O
Differential audio
output channel 1,
cathode
--
12
GND
GND
--
--
--
13
POWER
/RESET
I
Resetting signal
Active low
14
POWER
VREG_MSME1
O
2.8V output
Recommend to use this pin for
pull-up when level matching
15
GND
GND
--
--
--
16
ANT
RF_ANT
I/O
GSM antenna
interface
--
17
GND
GND
--
--
--
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ZTE MG2618
PIN
Type
Signal Definition
I/O
Description
Remark
18
GND
GND
--
--
--
19
POWER
VBAT
I
GSM Power supply
3.4V~4.2V
20
GND
GND
--
--
--
21
SIM
VREG_SIM
O
Power supply for
SIM card.
1.8/3V
22
SIM
SIM_DATA
I/O
Data signal of SIM
card
--
23
SIM
SIM_CLK
O
Clock signal of SIM
card.
--
24
SIM
SIM_RST
O
Reset signal of SIM
card.
--
25
UART
/RTS
O
Request to send
2.8V，active low
26
UART
/CTS
I
Clear to send
2.8V，active low
27
UART
TXD
O
Transmitting data to
serial port
2.8V，active low
28
UART
RXD
I
Receiving data from
serial port
2.8V，active low
29
NC
NC
--
--
--
30
GND
GND
--
--
--
31
UART
DCD
O
Carrier detection
2.8V，active low
32
UART
/DSR
O
Data is ready
2.8V，active low
33
UART
RI
O
Ring tone
2.8V，active low
34
UART
/DTR
I
Data terminal is
ready
2.8V，active low
35
NC
NC
--
--
--
36
GND
GND
--
--
--
37
GND
GND
--
--
--
38
ANT
GPS_ANT
I
GPS antenna
Module without GPS function, this
pin should not be connected.
39
GND
GND
--
--
--
40
POWER
VGPS_MAIN
I
GPS power supply
Voltage range: 2.8V~4.2V,
recommended 3.3V
Module without GPS function, this
pin should not be connected.
41
ADC
ADCIN
I
ADC voltage
detection
42
GND
GND
--
--
--
43
USB
USB_DP
--
USB differential
data (+)
Using USB and RI to download
firmware, calibration and
measurement. Not support data
transmitting yet.
44
USB
USB_DM
--
USB differential
data (-)
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PIN
Type
Signal Definition
I/O
Description
Remark
45
I2C
I2C_SCL
--
I2C serial clock
2.8V, Not supported currently
46
I2C
I2C_SDA
--
I2C serial data
2.8V, Not supported currently
47
GND
GND
--
--
--
48
BT
BT_ANT
I/O
Bluetooth antenna
interface
Not supported currently
49
GND
GND
--
--
--
2.2 Antenna Interface
Regarding the antenna of module, proper measures should be taken to reduce the access loss of
effective bands, and good shielding should be established between external antenna and RF connector.
Besides, external RF cables should be kept far away from all interference sources such as high-speed
digital signal or switch power supply.
According to mobile station standard, stationary wave ratio (SWR) of antenna should be between1.1
to 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the
antenna’s gain. Generally, the larger in-band gain and smaller out-band gain, the better performance the
antenna has. Isolation among ports must more than 30dB when multi-ports antenna is used. For example,
between two different polarized ports on dual-polarized antenna, or two different frequency ports on
dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna, the isolation
should be more than 30dB.
RF_ANT, GPS_ANT (PIN16, PIN38) are respectively used as the input pin for GSM and GPS
antenna. when using these pin pads as the antenna feed pins, customers need pay attention to the following:
(1)The feed connected to PIN38 or PIN 16 is 50ohm micro-strip or strip line. To approach the module,
put π shape or Inverted-F shape matching network for later debugging.
(2)The RF wires must be kept away from the GND, and generally the distance should be 3 times of the
width of RF wires.
(3)It’s forbidden to put some interference sources such as DC to DC, WIFI module, SIM card around RF
wires or RF port.
2.3 RF Performance of antenna interface
The RF performance of antenna interface is shown in Table 2-2:
Table 2–2 RF Performance of antenna interface
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ZTE MG2618
Band
Uplink Frequency
Band
(MS->BTS)
Downlink Frequency
Band
(BTS->MS)
Max.
Transmitter
Power(dBm)
Receiving
sensitivity(T
ypical)
GSM850
824MHz-849MHz
869MHz-894MHz
33±2 dBm
-108dBm
EGSM900
880MHz-915MHz
925MHz-960MHz
33±2 dBm
-108dBm
DCS1800
1710MHz-1785MHz
1805MHz-1880MHz
30±2 dBm
-106dBm
PCS1900
1850MHz-1910MHz
1930MHz-1990MHz
30±2 dBm
-106dBm
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3 Electric Features
This chapter mainly describes the module’s electrical characteristics, including the level, power
consumption, reliability of module’s interfaces.
3.1 Interface Power Level
Table 3–1 Power Level Range of Digital Signal
Interface
High/Low level
Min.
Typ.
Max.
Remark
UART
0
0
0
0.3* UART1
2.8V
0.7* UART1
2.8V
1.1*UART1
SIM
0
0
0
0.3*VREG_SIM
1.8V/3.0V
0.7*VREG_SIM
VREG_SIM
1.1*VREG_SIM
The high power level of UART1 is 2.8V, VREG_SIM is 1.8V/3V( automatic adaptation).
3.2 Power Consumption
Table 3–2 Power Consumption of Module (Typical)
Test Items
Test condition(Test duration
1min)
Test result
Unit
GSM
GPS
Max.
Min.
Average
Standby/sleep current
Standby
The kernel is
running, but not
working properly
47.46
30.32
31.16
mA
Standby
ON
69.19
44.45
46.35
mA
Standby
OFF
39.45
21.96
22.87
mA
Sleep
ON
75.2
23.68
27.2
mA
Sleep
OFF
28.55
0.93
2.45
mA
Working current
Turn on the module, GSP
kernel is running, not sleep or
work
123.44
54.27
72.55
mA
Network lock current
PGSM，62，PCL5
239.4
174.68
242.68
mA
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ZTE MG2618
(Instrument Network,
GPS sleep)
PGSM，62，PCL10
157.13
120.65
145.4
mA
PGSM，62，PCL19
94.41
32.71
82.01
mA
DCS，698，PCL0
195.42
147.47
180.7
mA
DCS，698，PCL5
146.32
113.48
135.2
mA
DCS，698，PCL15
87.68
70.53
79.08
mA
Note: As the GPS can’t work independently, when the module sleep in the condition of GPS working,
in fact , the module is in the state of part dormant, and the part related to GPS is still working.
3.3 Power-on/off timing sequence
The timing sequence of module shows entire process of power-on/off.
Figure 3–1 Power-on/off timing sequence
3.4 Reliability Test
The reliability test of module includes the items as follows: High/low temperature operation, high/low
temperature storage, thermal shock, alternating temperature humidity, etc. The test results must conform to
the industrial requirements. Module testing environment of temperature is shown as the Table below.
Table 3–3 Module testing environment of temperature
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Parameter
Working Condition
Min
Max
Remark
To
Operation temperature
-35℃
+75℃
Ta
Limited temperature
-40℃
+85℃
Ts
Storage temperature
-50℃
+90℃
3.5 ESD Characteristic
The measured ESD values of module at the normal temperature are shown as the following table.
Table 3–4 ESD Endurance
Interface
Test program
Test requirements
Antenna Interface
Air discharge
±8 kV
Contact discharge
±8 kV
SIM Interface
Air discharge
±8 kV
Contact discharge
±6 kV
3.6 GPS Performance
Table 3–5 GPS Performance
Test Items
Working mode
Typical
CNR @130dBm
--
40
Sensitivity(dBm)
Tracking
-162
Cold start
-145.5
Warm start
-159.5
TTFF @-130 dBm(Sec.)
Cold start
34.1
Warm start
32.7
Hot start
0.8
Note: The test result belongs to the modules which support GPS function.
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4 Reference Circuit of Module Interfaces
The chapter provides the precautions and reference design on the interface circuit according to the
module’s functions.
4.1 Reset and Power Designing
Power Designing
VBAT is the power supply pin of module. See the module’s required voltage characteristics in Table
4-1:
Table 4–1 Working Condition
Type
Vmin
Typical
Vmax
Input Voltage
3.4V
3.8 V
4.2 V
Input Current
< 3mA (average)
--
2A(Depending on the condition
of the network signal)
Power-on
The module is under power-off status after it’s normally connect to the power supply. To turn on the
module, provide a low level voltage more than 2.5s to the ON/OFF PIN. The power-on time of module is
related to module status, it’s usually required low level for more than 2.5S.
Power-off
To turn off the module, provide a 3s low level pulse to the ON/OFF PIN.
Reset
If the external reset function has to be used, provide a low level pulse lasting 100ms to the /RESET
PIN to reset the module. After resetting, the module will enter power-off state, and you need to provide a
low level voltage lasting 2.5s to the ON/OFF pin to power-on the module. When resetting the module, if
the power level of ON/OFF pin in the state of low level, the module will restart automatically.
Reference circuit of power supply and reset interface are shown as Figures below.
Select appropriate parameters according to the actual selected power supply since VD1 is TVS tube,
and select CJ2305 from Changjiang Electronics or DMP2305U-7 from DIODES since VT1 is MOS tube.
Refer to figure 4-2 for the design of power circuit. Select MIC29302 and adjust the output voltage through
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the adjustment of R5 and R6. Please refer to MIC29302’s specification for detailed parameters design.
Please note that the components in the figure are just for your reference. For details, please adjust
according to the actual circuit.
Power
supply
VD1
TVS
C1 C2
22uf C3
100uf
VT1
R1
15k
Power supply for module
VBAT
C4
0.1uf
Buffer start
circuit
MCU_ON/OFF
R2
4.7K
MCU_RESET
/RESETON/OFF
R3
4.7K
Figure 4–1 Reference Circuit of Power Supply & Reset Interface
R5
2.2K R6
1K
C6
0.1uF C8
100uF
C7
0.1uF
R4
10K
C5
10uF D1
MIC29302
GNDTAB
/SHUT
IN OUT
SENSE
Voltage input Power supply for module VBAT
Figure 4–2 Reference Circuit of Power Supply Interface
VREG_MSME1
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The voltage output is available only when the module is on. The normal output voltage is 2.8V, and
users should absorb the current from this pin as little as possible (less than 10mA). Generally, it is
recommended to use this pin to pull up the chipset PIN as the requirements of level matching. Therefore,
it’s not recommended to use this pin for other control purposes.
Other Advice
In order to make sure the data is saved safely, please do not cut off the power when the module is on.
It’s strongly recommended to use ON/OFF pin or AT command to turn off the module.
4.2 UART Interface
The module provides an integrated full duplex UART interface. The typical baud rate is 115.2Kbps
and the max. rate is 921.6kbps.
Note:
1)The duplex UART interface could be used as serial interface for AT commands, data service, and
the default baud rate is adaptive.
2)The module’s UART output I/O level is 2.8V, therefore it needs level conversion when connecting
with 3.3V or 5V logic circuit. Otherwise, it would be damaged or unstable by the mismatch of power level
For example, if MCU communication with module through UART interface, and the MCU UART
level is 3.3V. the most common method is to use a dynatron to realize the level conversion. Figures below
show the level conversion to 3.3V through the UART interface of module. The resistance and capacitance
in figure 4-4 are just for reference, and they need to be recalculated during the design. The diode in this
Figure is Schottky diode (forward voltage drop is 0.3V). If you select other diodes, please select one with
lower forward voltage drop to make sure RXD_2V8 is below the threshold when inputting low level.
Recommended level converter :NLSX5014MUTAG//TXB0304RUTR；
Recommended Transistor: MMBT3904LT1G//LMBT3904LT1G//PMBT3904；
Recommended Diode: LRB521S-30T1G//RB521SM-30T2R//RB521S-30//1PS79SB10//
RB521S-30U9JTE61
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Figure 4–3 Reference Circuit 1 of UART Interface
VREG_MSME1(2.8V)
TXD(2.8V)
10K 1K
VCC(3.3V)
TX(3.3V)
22pF
10K
RX(3.3V)
100pF
RXD(2.8V)
VREG_MSME1(2.8V)
Figure 4–4 Reference Circuit 2 of UART Interface
3)When the module need to enter sleep mode, pull up the pin /DTR to high level, and when you want
to wake up the module, pull down the /DRT pin to low level.
4)When there is a call, a low level is output from PIN RI, and lasting until the end of conversation.
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4.2.1 Duplex UART Interface
RXD
TXD
/CTS
/RTS
/DTR
/DSR
DCD
RI
TXD
RXD
RTS
CTS
DTR
DSR
DCD
RING
Module Application
DCE DTE
Figure 4–5 UART Connection between DCE－DTE
The UART interface definition is shown in Table below:
Table 4–2 UART Interface Definition
Function
PIN
Definition
I/O
Description
Remark
UART
25
/RTS
O
Ready to send
DTE informs DCE to send
26
/CTS
I
Clear to send
DCE has switched to Rx. mode
27
TXD
O
Transmitting data
DTE receives serial data
28
RXD
I
Receiving data
DTE transmits serial data
31
DCD
O
Carrier detection
Data link connected
32
/DSR
O
Data set ready
DCE is ready
33
RI
O
Ringtone indication
Inform DTE upon a remote call
34
/DTR
I
Data terminal ready
DTE is ready
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4.3 SIM Card Interface
Module supports two kinds of SIM card of 1.8V and 3V. The following Figure shows the reference
design of the SIM card. On the line close to the SIM card console, be sure to add the ESD circuit protection
during the design.
Table 4–3 Definition of SIM Card Signal
PIN
Function
Definition
I/O
Description
Remark
21
SIM
VREG_SIM
O
SIM card power, output
from the module
1.8/3V
22
SIM
SIM_DATA
I/O
SIM card DATA signal
--
23
SIM
SIM_CLK
O
SIM card clock signal
--
24
SIM
SIM_RST
O
SIM card reset signal
--
The typical rate of SIM card interface is about 3.25MHz. It is recommended to place SIM card
console close to the SIM card interface to prevent the wiring from being too long(less than 100mm), which
might seriously distort the waveform and thus affect the signal integrity
The distance between the module and headset/handset should be as short as possible and it’s
enveloped by the ground wires to avoid strong interference sources.
It is recommended to make the grounding protection for SIM_CLK and SIM_DATA signal wiring.
Cascade one 1uF capacitor between VREG_SIM and GND, another 0.1uF and 33pF capacitor can be
added between VREG_UIM and GND. In order to filter out the antenna’s interference signal, add three
33pF capacitors between SIM_CLK, SIM_DATA, SIM_RST and GND.
It is recommended to take electrostatic discharge (ESD) protection measures near the SIM card socket.
The TVS diode junction capacitance less than 10 pF must be placed as close as possible to the SIM socket,
and the Ground pin of the ESD protection component is well connected to the Ground. The recommended
model is: CESDLC3V0L4//NZQA5V6AXV5T1G//PESD3V3V4UW. The reference circuit of SIM card
interface is as shown in Figure below.
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Figure 4–6 Reference Circuit of SIM Card Interface
Note:
The distance between the module and SIM card console should be as short as possible, and it is
recommended to place SIM card console and ESD circuit close to the SIM card interface.
4.4 Audio Interface
The module provides 2 Speaker interfaces and 2 Microphone interfaces. Only one pair I/O works at
the same time.
Table 4–4 Audio interface definition
Function
PIN
Definition
I/O
Description
Remark
AUDIO
7
MIC1_N
I
Differential audio input
channel 1, cathode
Differential input
6
MIC1_P
I
Differential audio input
channel 1, anode
11
SPK1_N
O
Differential audio output
channel 1, cathode
Differential output
10
SPK1_P
O
Differential audio output
channel 1, anode
8
MIC2_P
I
Single-end audio input
channel 2
Single-end input
9
SPK2_P
O
Single-end audio output
channel 2
Single-end output
5
HSED BIAS
O
MIC bias
Default: 1.8V
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See the audio reference circuit in Figure below.
Figure 4–7 MIC reference circuit
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Figure 4–8 SPK reference circuit
Microphone
The MIC1_N & MIC1_P are both differential interfaces, and they can also be used for single-ended
input. It’s recommended to use differential method to reduce the noises. The MIC2_P interface is used for
single-ended input. Directly connect to the microphone since these two inputs are internally provide 1.9V
bias voltage.
Speaker
The SPK1_P & SPK1_N are both differential interfaces with 32 ohm impedance, while the SPK2_P is
single-ended interface with 32 ohm impedance. There is no coupling capacitor internally, you need to add
it in the designing process.
Design of audio interface on the receiver
The output power of SPK1 is 35mW. Select the microphone with the sensitivity lower than -51.5dB
since and the max. gain inside MIC1 can reach 51.5dB. The voltage level of MIC1_P is about 1.9V.
NOTE:
If other kind of audio input method is adopted, the input signal should be within 0.5V. If the signal
voltage is lower than this value, then the pre-amplifier should be added. If the signal voltage is higher than
this value, then attenuation network should be added
Design of audio interface on the earpiece
The output power of SPK2 is 10.8 mW.Select the microphone with the sensitivity lower than -51.5dB
since and the max. gain inside MIC2 reaches 51.5dB. The voltage level of MIC2_P is about 1.9V.
Note: In order to achieve well audio effects, it’s recommended that:
1) During the process of using module, it’s advised to use 100pf & 33pf capacitance on its external
audio path, and serially connect with the beads to improve the audio quality.
2) Connect TVS tube or pressure sensitive resistance on the audio path (approaching the module’s
interface) to prevent the ESD from damaging the module.
3) Make sure the use environment and module are well grounded and there is no mutual influence.
4) The power ripple supplied to the module is less than 50mV.
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4.5 LED indicator interface
RSSI_LED is pull-down internally, it need to add transistor to drive.
Table 4–5 Definition of LED Indicator Status
Module status
LED status
Frequency
Power on state
the LED is off
Network searching state
the LED blinks at 3Hz
3Hz
Idle/sleep state
the LED blinks at 1Hz
1Hz
Traffic state (call, data):
the LED blinks at 5Hz
5Hz
The output status of RSSI_LED pin is decided by the software of module, and it’s the GPIO pin, the
driver ability is limit. It can’t drive the LED directly, and it need to work with transistor. The figure below
is the reference of circuit.
Figure 4–9 Reference Circuit of Status Indicator
4.6 GPS Interface
(This chapter can be only applied by the modules support GPS function)
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Figure 4–10 Reference Circuit of GPS Interface
It’s recommended to connect with GPS RF socket through a 50Ω RF cable. The good matching
between antenna and module enables GPS to obtain better receiving sensitivity. V_GPS works as the PIN
to supply 2.8-4.3V power to GPS(recommended: 3.3V);
LDO can be the power supply of GPS, and the GPIO of MCU can be used as the external
enable/disable control for the LDO. In the figure above, name the MCU control signal of LDO as GPS_EN,
which connected with MCU to control the power supply for GPS. The GPS chip can’t work independently,
and it need to work with the GSM module together to output the valid location information. The GPS data
output from UART interface.
4.7 Connection Method of GPS Active Antenna
(This chapter can be only applied by the modules support GPS function)
In the figure below, V_G_ANT works as the power supply of GPS active antenna. Set V_G_ANT
voltage according to the requirements of selected GPS active antenna, connect M_GPS_RF to GPS_ANT,
and connect GPS_RFIN to GPS active antenna. The resistance of RF cable in the figure is 50Ω.
Figure 4–11 Active GPS antenna circuit reference design principle diagram
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5 Mechanic Features
5.1 Appearance diagram
Figure 5–1 Top & bottom & side view of module
(Note: The figure above is just for reference, please take the actual products as the reference)
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5.2 Assembly Diagram
See the assembly diagram of module in Figure below (Unit: mm):
Figure 5–2 The assembly diagram of module
Dimensions(Length×Width×Thickness): 22.00mm×20.00mm×2.0mm
Weight: About 1.9g
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5.3 PCB Package Dimensions
The PCB package dimensions of module are shown in Figure below (Unit: mm):
Figure 5–3 The PCB package dimensions of module (Top View)
←PIN1
←PIN49
PIN18→
PIN19→
←PIN36
←PIN37
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Figure 5–4 Test point of module
Precaution during PCB designing:
1） Copper-clad and wiring are forbidden in the nearby areas of the RF stamp-hole.
2） For the convenience of testing and maintenance, it is recommended to drill holes on the PCB to
expose JTAG test points.
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6 SMT Process and Baking Guide
This chapter describes module’s storage, PAD design, SMT process parameters, baking requirements,
etc., and it is applicable for the process guide to second-level assembly of LCC encapsulation module.
6.1 Storage Requirements
Storage conditions: temperature<40℃, relative humidity<90% (RH), 12 months weldability
guaranteed under this circumstances of excellent sealing package.
The Moisture sensitivity level for all modules is level 3 (Conforming to IPC/JEDEC J-STD-020).
After opening the package, mount within 168 hours under the environment conditions of temperature<30℃,
relative humidity<60% (RH); if it doesn’t meet the above requirements, perform the baking process. See
the baking parameters in Table below:
Table 6–1 Baking parameters
Temperature
Baking conditions
Baking time
Remarks
125±5℃
Moisture≤60%RH
8 hours
The accumulated baking time must be
less than 96 hours
45±5℃
Moisture≤5%RH
192 hours
The product’s transportation, storage and processing must conform to IPC/JEDEC J-STD-033
When in the process of PAD designing of module, refer to IPC-SM-782A and the chapter 6.2 below.
6.2 Recommended PAD Design
When designing the pad of main board, the following dimensions marked in the Figure below should
be taken into consideration.
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Figure 6–1 Module’s dimensions
Figure 6–2 Recommended PAD dimensions on corresponding main board
t2=Main board’s PAD
extend inward
t1=Main board’s PAD
extend outward
LCC module
PAD
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Figure 6–3 Module board’s PAD mounted on main board
Refer to the recommended PAD dimensions of main board at client end in the table below:
Table 6–2 Recommended PAD dimensions of main board
Limited
conditions of
module board’s
dimensions
Main board’s recommended PAD dimensions
Y1=T1+t1+t2
X
Z
G
e
/
t1
t2
When H<1mm,
P-W<0.5mm
T1
H/2
0.05mm
W
L+2*t1
S-2*t2
P
When H<1mm
P-W≥0.5mm
H/2
0.05mm
W(min)
(W+0.2mm)(max)
L+2*t1
S-2*t2
P
When
H≥1mm,and
P-W<0.5mm
0.5mm
0.05mm(min)
0.1mm(max)
W
L+2*t1
S-2*t2
P
When
H≥1mm,and
P-W≥0.5mm
0.5mm
0.05mm(min)
0.1mm(max)
W(min)
(W+0.2mm)(max)
L+2*t1
S-2*t2
P
6.3 Requirements of Module’s Position on Main board
It is recommended that the thickness of green oil at the module’s position on main board should be
less than 0.02mm. Do not cover with white oil or cover white oil on the green oil layer to avoid excessive
thickness. As the excessive thickness may cause the module cannot be effective contact with the solder
paste thus affecting the quality of welding.
Figure 6–4 Green oil and white oil at module’s position on main board
(The figure is just for reference; it doesn’t represent the actual module encapsulation)
In addition, do not lay out other components within 2mm around the module’s position on main board
to ensure the maintenance of the module.
The white
oil need be
removed
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6.4 Module Planeness Standard
The module’s planeness is required to be 0.15mm. Measurement method: put the module on the
marble plane, use the feeler gage to measure the gap width at the position of maximum warp, and do not
exert force on the module during the measurement.
6.5 Process Routing Selection
The modules are manufactured with the lead-free process and meet the ROHS requirements, therefore
it’s recommended to follow the lead-free manufacturing process upon the selection of process routing for
module board and main board.
6.5.1 Solder Paste Selection
The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements. It is
accordingly recommended to use the no-clean solder paste. If the solder paste which needs cleaning is used,
we cannot guarantee the components on the module board could withstand the washing of the cleaning
solvents. This might cause the functional problems of such components and affect the appearance of the
module. During the printing process, make sure the solder paste’s thickness at the position of module’s
PAD is within 0.18mm -0.20mm.
6.5.2 Design of module PAD’s steel mesh opening on main board
The thickness of the steel mesh on main board is selected according to the encapsulation type of
components on the main board. Pay attention to the following requirements:
1） Make sure to design the module PAD on main board according to section 2.1.
2） The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad
can be increased to 0.18~0.20mm or the thickness of steel mesh is directly 0.18mm~0.20mm on
main board.
3） Requirements on the thickness of solder paste: control the thickness between 0.18mm and
0.20mm.
4） See the LCC module PAD’s steel mesh opening in the following table:
Table 6–3 LCC module PAD’s steel mesh opening
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Module PAD GAP (G)=Center Distance (e)
－PAD width (X)
Steel mesh opening
G≥0.5mm
Drill holes at 100%
scale in the direction of
width;
extend 0.3mm outward
in the direction of
length
G＜0.5mm
Contract 0.05~0.1mm
in the direction of
width;
Contract 0.05~0.1mm
inward in the direction
of length, extend
0.5mm outward in the
direction of length.
Figure 6–5 Module Board’s Steel Mesh Diagram
6.5.3 Module Board’s SMT process
1) SMT Pallets:
The pallets, which are suitable for SMT, have been made for most ZTE modules. If the module has
provided the pallets itself and meets the SMT requirements, customers can directly use it for module SMT.
0.1mm
0.1mm
0.5mm
0.1mm
Steel
mesh
opening
Module PAD on
PCB
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Figure 6–6 Material Module Pallet
(The figure is just for reference; it doesn’t represent the actual Material Module Pallet)
Otherwise, customers need make a loading tool similar to the pallet. Customers can take out the
module from the packaging box, put them into the pallet according to the sequence and direction, and then
start SMT.
2） Mounting Pressure:
In order to ensure a good contact between the module and the solder paste on main board, the pressure
of placing the module board on main board should be 2-5N according to our experiences. Different
modules have different numbers of pads, therefore the pressure selected are different. Customers can select
proper pressure based on their own situations to suppress the module paste as little as possible, in order to
avoid the surface tension of the solder paste melts too much to drag the module during reflow.
6.5.4 Module Soldering Reflow Curve
Module soldering furnace temperature curve is:
Peak value: 245+0/-5℃
≥217℃: 30～～60S
150～200℃: 60～～120S
Temperature rise slope: <3℃/S
Temperature drop rate: －2～－4℃/S
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Figure 6–7 Module Furnace Temperature Curve Diagram
Note: The test board of furnace temperature must be the main board with the module board mounted
on, and there must be testing points at the position of module board.
6.5.5 Reflow method
If the main board used by customers is a double-sided board, it is recommended to mount the module
board at the second time. In addition, it is preferable for the main board to reflow on the mesh belt when
mounting at the first time and the second time. If such failure is caused by any special reason, the fixture
should be also used to make such main board reflow on the track so as to avoid the deformation of PCB
during the reflow process.
6.5.6 Maintenance of defects
If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module
board and main board, the welder can directly use the soldering iron to repair welding according to the
factory’s normal welding parameters.
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6.6 Module’s Baking Requirements
The module must be baked prior to the second reflow.
6.6.1 Module’s Baking Environment
The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and good
static-resistant environment. Refer to the following environment requirements:
The product’s transportation, storage and processing must conform to IPC/JEDEC J-STD-033.
6.6.2 Baking device and operation procedure
Baking device: any oven where the temperature can rise up to 125°C or above.
Precautions regarding baking: during the baking process, the modules should be put in the
high-temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the
modules. During the baking process, do not overlay the modules directly because it might cause damage to
the module’s chipset.
6.6.3 Module Baking Conditions
See the baking parameters in Table 6-1.
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7 Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal incorporating ZM5330 module. Manufacturers of the cellular
terminal should send the following safety information to users, operating personnel and to incorporate
these guidelines into all manuals supplied with the product.
The use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as hospitals, aircrafts,
airports, etc, switch off before boarding an aircraft. Make sure the cellular terminal is switched off
in these areas. The operation of wireless appliances in the hospitals, aircrafts and airports are
forbidden to prevent interference with communication systems.
Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel
or chemical transfer or storage facilities, areas where the air contains chemicals or particles such
as gasoline stations, oil refineries, etc make sure that wireless devices are turned off.
It’s the responsibility of users to enforce other country regulations and the specific environment
regulations. And our company does not take on any liability for customer failure to comply with these
precautions.

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