u blox 06 BMD-SRA-1 User Manual BMD SRA 1 Datasheet
Rigado LLC BMD-SRA-1 BMD SRA 1 Datasheet
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Users manual
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| Mirror Download [FCC.gov] | |
| Document ID | 3192404 |
| Application ID | BzJQKUQOD9uv75WNBSbqTQ== |
| Document Description | Users manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 95.28kB (1191038 bits) |
| Date Submitted | 2016-11-10 00:00:00 |
| Date Available | 2016-11-10 00:00:00 |
| Creation Date | 2016-10-25 23:15:20 |
| Producing Software | Microsoft® Word 2016 |
| Document Lastmod | 2016-10-25 23:15:20 |
| Document Title | BMD-SRA-1 Datasheet |
| Document Creator | Microsoft® Word 2016 |
| Document Author: | Rigado, LLC |
BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 BMD-SRA-1 Module for Bluetooth 4.2 LE 1. Ordering Information Email modules@rigado.com for quotes. Part Number BMD-SRA-1-A-T Description BMD-SRA-1 module, nRF52832-QFAA, IS25LQ032B-JBLE, tray packaging Table 1 – Ordering Part Numbers 2. Block Diagram BMD-SRA-1 Module nRF52832 64 kB RAM SWD Debug & Programming Core LDO DC/DC Buck Regulator Bulk Capacitors Accel Address Resolver ARM Cortex-M4F @ 64MHz 2.4GHz Radio Multi-protocol AES ECB Balun 512kB Flash Matching Network AES CCM Mode Encryption Clock Management Real Time Counter x3 Watchdog Timer Timer x5 Random Number Gen Programmable Peripheral Interconnect Antenna GPIO Task Event Blocks Low Power Comparator TWI Master x2 SPI Master x3 UART I2S Quadrature Decoder General Purpose Comparator TWI Slave x2 SPI Slave X3 PWM PDM NFC Tag 8-ch 12-bit ADC Decoupling Capacitors SPI Flash GPIO x18 (Analog x3) 32 MHz Crystal Temperature Sensor Figure 1 – Block Diagram BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 1 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 Table of Contents 1. 2. 3. 4. 4.1 5. 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 6. 6.1 6.1.1 6.2 7. 7.1 8. 8.1 9. 9.1 9.2 9.3 9.4 9.5 9.6 9.7 10. 10.1 11. 12. 13. 14. ORDERING INFORMATION......................................................................................................................................................1 BLOCK DIAGRAM ....................................................................................................................................................................1 QUICK SPECIFICATIONS ..........................................................................................................................................................3 PIN DESCRIPTIONS .................................................................................................................................................................4 BMD-SRA-1 ................................................................................................................................................................................... 4 ELECTRICAL SPECIFICATIONS ..................................................................................................................................................5 ABSOLUTE MAXIMUM RATINGS............................................................................................................................................................. 5 OPERATING CONDITIONS ..................................................................................................................................................................... 5 GENERAL PURPOSE I/O ....................................................................................................................................................................... 5 MODULE RESET ............................................................................................................................................................................... 6 DEBUG & PROGRAMMING ................................................................................................................................................................... 6 CLOCKS ............................................................................................................................................................................................ 6 INTEGRATED SPI FLASH IC ................................................................................................................................................................... 6 RTC THERMISTOR .............................................................................................................................................................................. 7 FIRMWARE .............................................................................................................................................................................7 SOFTDEVICES .................................................................................................................................................................................... 7 S132 ............................................................................................................................................................................................ 7 MAC ADDRESS INFO .......................................................................................................................................................................... 8 MECHANICAL DATA ................................................................................................................................................................9 BMD-SRA-1 DIMENSIONS .................................................................................................................................................................. 9 MODULE MARKING ................................................................................................................................................................9 BMD-SRA-1 MODULE MARKING ......................................................................................................................................................... 9 REGULATORY STATEMENTS .................................................................................................................................................. 10 FCC STATEMENT: ............................................................................................................................................................................ 10 FCC IMPORTANT NOTES: ................................................................................................................................................................... 10 IC STATEMENT: ............................................................................................................................................................................... 12 IC IMPORTANT NOTES: ...................................................................................................................................................................... 12 CE REGULATORY: ............................................................................................................................................................................. 13 JAPAN (MIC) .................................................................................................................................................................................. 13 AUSTRALIA / NEW ZEALAND ............................................................................................................................................................... 13 SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 14 MOISTURE SENSITIVITY LEVEL ............................................................................................................................................................. 14 CAUTIONS ............................................................................................................................................................................ 14 LIFE SUPPORT POLICY ........................................................................................................................................................... 15 DOCUMENT HISTORY ........................................................................................................................................................... 16 RELATED DOCUMENTS ......................................................................................................................................................... 16 BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 2 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 3. Quick Specifications Bluetooth Version 4.2 (Bluetooth Smart) Concurrent Central & Peripheral (S132) Security AES-128 LE connections Up to 8 as Central, 1 as Peripheral, Observer, Broadcaster (S132) Radio Frequency 2.360GHz to 2.500GHz Modulations GFSK at 1 Mbps, 2 Mbps data rates Transmit power +4 dBm Receiver sensitivity -96 dBm (BLE mode) Antenna Integrated Current Consumption TX only @ +4 dBm, 0 dBm RX only @ 1 Mbps CPU @ 64MHz from flash, from RAM System Off , On Additional current for RAM retention 16.6 mA, 11.6 mA 11.7 mA 7.4 mA, 6.7 mA 0.7µA, 1.2 µA 20 nA / 4K block Dimensions BMD-SRA-1 Length Width Height 37.7 mm ± 0.3mm 14.5 mm ± 0.3mm 2.5 mm ± 0.1mm Hardware Interfaces SPI Master/Slave x 3 UART Two-Wire Master/Slave (I2C) x 2 GPIO x 18 Power supply 2.3V to 3.6V Temperature Range -40 to +85°C I2S PWM PDM Certifications FCC IC CE Japan (MIC) Australia / New Zealand FCC part 15 modular certification BMD-SRA-1 FCC ID: 2AA9B06 Industry Canada RSS-210 modular certification BMD-SRA-1 IC: 12208A-06 EN 60950-1: 2011-01 3.1 (a): Health and Safety of the User (pending) EN 301 489-1 V1.9.2 & 3.1 (b): Electromagnetic Compatibility EN 301 489-17 V2.2.1 EN 300 328 V1.9.1 3.2: Effective use of spectrum allocated Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan BMD-SRA-1: TBD AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices Table 2 – Quick Specifications BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 3 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 4. Pin Descriptions 4.1 BMD-SRA-1 Figure 2 – BMD-SRA-1 Pin out Pin A-1 A-2 A-3 A-8 A-9 A-10 A-12 A-18 A-19 A-20 B-2 B-4 B-5 B-8 B-9 B-10 B-11 B-12 A-13 BMD-SRA-1-DS v1.0 Name P0.28 P0.31 P0.00 P0.01 P0.02 P0.03 P0.21 P0.30 P0.29 P0.27 P0.12 P0.18 P0.20 P0.19 P0.17 P0.16 P0.11 P0.05 SWCLK Pin description Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In CONFIDENTIAL Description GPIO/AIN4 GPIO/AIN7 GPIO/XTAL1 (32.768kHz) GPIO/XTAL2 (32.768kHz) GPIO/AIN0 GPIO/AIN1 ̅̅̅̅̅̅̅̅ GPIO/RESET GPIO/AIN6 GPIO/AIN5 GPIO GPIO GPIO/TRACEDATA[0]/SWO GPIO/TRACECLK GPIO GPIO/TRACEDATA[3] GPIO/TRACEDATA[1] GPIO GPIO/AIN3 SWD Clock Page 4 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 Pin A-11 A-17, B-6 A-4, B-1, B-3, B-7 A-5, A-6, A-7, A-14, A-15, A-16 Name SWDIO VCC GND Direction In/Out Power Power Description SWD IO +2.3V to +3.6V Electrical Ground NC N/A No Connect Table 3 – BMD-SRA-1/301 Pin Descriptions 5. Electrical Specifications 5.1 Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC_MAX Voltage on supply pin -0.3 3.9 VIO_MAX Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 VIO_MAX Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3V Storage Temperature Range -40 125 °C TS Table 4 – Absolute Maximum Ratings 5.2 Operating Conditions Symbol VCC TR_VCC TA Parameter Operating supply voltage Supply rise time (0V to 2.3V) Operating Ambient Temperature Range Min. Typ. Max. Unit 2.3 3.0 3.6 60 ms -40 25 85 °C Table 5 – Operating Conditions 5.3 General Purpose I/O The general purpose I/O is organized as one port enabling access and control of the 18 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features: Input/output direction Output drive strength Internal pull-up and pull-down resistors Wake-up from high or low level triggers on all pins Trigger interrupt on all pins All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels All pins can be individually configured to carry serial interface or quadrature demodulator signals Symbol Parameter Min. Typ. Max. Unit VIH Input High Voltage 0.7 x VCC VCC VIL Input Low Voltage VSS 0.3 x VCC VOH Output High Voltage VCC − 0.4 VCC VOL Output Low Voltage VSS VSS + 0.4 BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 5 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 RPU Pull-up Resistance 11 13 16 kΩ RPD Pull-down Resistance 11 13 16 kΩ Table 6 – GPIO 5.4 Module RESET GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers PSELRESET[0] and ̅̅̅̅̅̅̅̅, the internal pull-up is automatically PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as RESET ̅̅̅̅̅̅̅̅. enabled. Rigado and Nordic example applications and development kits program P0.21 as RESET 5.5 Debug & Programming The BMD-SRA-1 supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. The BMD-SRA-1 also supports ETM and ITM trace. Trace data from the ETM and the ITM is sent to an external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports serial trace via the Serial Wire Output (SWO) trace protocol. 5.6 Clocks The BMD-SRA-1 utilizes two internal clock sources that are required for BLE operation. The high frequency clock is provided on-module by a high-accuracy 32-MHz crystal as required by the nRF52832 for radio operation. The low frequency clock is be provided internally by an RC oscillator or synthesized from the fast clock. Using the internal RC oscillator with calibration provides acceptable performance for BLE. Note: the ANT protocol requires the use of an external crystal. 32.768 kHz Oscillator Comparison Symbol Parameter Min. Typ. Max. Unit ILFXO Current for 32.768kHz Crystal Oscillator 0.25 µA ILFRC Current for 32.768kHz RC Oscillator 0.6 µA ILFSYNT Current for 32.768kHz Synthesized Oscillator Frequency Tolerance, 32.768kHz Crystal Oscillator (BLE Stack)1 Frequency Tolerance, 32.768kHz Crystal Oscillator (ANT Stack)1 Frequency Tolerance, 32.768kHz RC Oscillator 100 µA ±250 ppm ±50 ppm ±2 Frequency tolerance, 32.768kHz RC after calibration Frequency Tolerance, 32.768kHz Synthesized Oscillator ±250 ppm ±48 ppm fTOL_LFXO_BLE fTOL_LFXO_ANT f TOL_LFRC fTOL_CAL_LFRC fTOL_LFSYNT Note 1: fTOL_LFXO_BLE and fTOL_LFXO_ANT are the max allowed for BLE and ANT applications. Actual tolerance depends on the crystal used. Table 7 – 32.768 kHz Oscillator 5.7 Integrated SPI Flash IC All modules are shipped with blank from the factory, except the Rigado MAC address is programmed into the UICR. BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 6 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 Figure 3 – SPI Flash Circuit 5.8 RTC Thermistor The module includes a NTC thermistor circuit for measuring on board temperature. The circuit can be found in Figure 4. The RTC thermistor is the Murata NCP15WM474J03RC and is connected to AIN4 (P0.04) on the nRF52832. Figure 4 – RTC Thermistor Circuit 6. Firmware All modules are shipped with blank from the factory, except the Rigado MAC address is programmed into the UICR. 6.1 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable from the Nordic website. The BMD-SRA-1 with the nRF52832 SoC supports the S132 (BLE Central & Peripheral) SoftDevice. 6.1.1 S132 The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution supporting up to three Central and one Peripheral simultaneous connections and concurrent Observer and Broadcaster roles. It integrates a low energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy System on Chip (SoC) solutions. Key Features Bluetooth 4.2 compliant low energy single-mode protocol stack suitable for Bluetooth Smart products One connection as a peripheral Observer Concurrent Central, Observer, Peripheral, and Broadcaster roles with up to: Broadcaster Link layer Three connections as a central BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 7 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 L2CAP, ATT, and SM protocols GATT and GAP APIs GATT Client and Server Complementary nRF52 SDK including Bluetooth profiles and example applications Master Boot Record for over-the-air device firmware update Memory isolation between application and protocol stack for robustness and security Thread-safe supervisor-call based API Asynchronous, event-driven behavior No RTOS dependency No link-time dependencies Standard ARM® CortexTMM4F project configuration for application development Support for concurrent and non-concurrent multiprotocol operation Any RTOS can be used Concurrent with the Bluetooth stack using concurrent multiprotocol timeslot API Alternate protocol stack in application space 6.2 MAC Address Info The BMD-SRA-1 modules comes preprogrammed with a unique MAC address from the factory. The MAC address is also printed on a 2D barcode on the top of the module. The 6-byte BLE Radio MAC address is stored in the nRF52832 UICR at NRF_UICR_BASE+0x80 LSB first. Please read the MAC Address Provisioning application note to avoid erasing/overwriting the MAC address during programming. UICR Register: NRF_UICR + 0x80 (0x10001080): MAC_Addr [0] (0xZZ) NRF_UICR + 0x81 (0x10001081): MAC_Addr [1] (0xYY) NRF_UICR + 0x82 (0x10001082): MAC_Addr [2] (0xXX) NRF_UICR + 0x83 (0x10001083): MAC_Addr [3] (0x93) NRF_UICR + 0x84 (0x10001084): MAC_Addr [4] (0x54) NRF_UICR + 0x85 (0x10001085): MAC_Addr [5] (0x94) BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 8 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 7. Mechanical Data 7.1 BMD-SRA-1 Dimensions Figure 5 – BMD-SRA-1 Module Dimensions (All dimensions are in mm) 8. Module Marking 8.1 BMD-SRA-1 Module Marking Figure 6 – BMD-SRA-1 Module Marking – Rev A BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 9 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 9. Regulatory Statements 9.1 FCC Statement: This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modification to this product will void the user’s authority to operate this equipment. Note: Modification to this product will void the users’ authority to operate this equipment. 9.2 FCC Important Notes: (1) FCC Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in this document. Caution! The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modification could void the user authority to operate the equipment. (2) Co-location Warning: This device and its antenna(s) must not be co-located or operating in conjunction with any other transmitter antenna. (3) OEM integration instructions： This device is intended only for OEM integrators under the following conditions: The antenna and transmitter must not be co-located with any other transmitter or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 10 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.) In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. Caution! The OEM is still responsible for verifying compliance with FCC Part 15, subpart B limits for unintentional radiators through an accredited test facility. (4) End product labeling： The final end product must be labeled in a visible area with the following: BMD-SRA-1: “Contains FCC ID: 2AA9B06” Any similar wording that expresses the same meaning may be used. The FCC Statement below should also be included on the label. When not possible, the FCC Statement should be included in the User Manual of the host device. “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.” (5) Information regarding the end user manual： The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual (Section 15.2(4)). BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 11 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 9.3 IC Statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou onctionner en conjonction avec toute autre antenne ou transmetteur . 9.4 IC Important Notes: 1. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC multi‐transmitter product procedures. 3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two‐ways authentication between module and the host system. 4. The host device shall be properly labelled to identify the module within the host device. The final end product must be labeled in a visible area with the following: BMD-SRA-1: “Contains IC: 12208A-06“ Any similar wording that expresses the same meaning may be used. The IC Statement below should also be included on the label. When not possible, the IC Statement should be included in the User Manual of the host device. “This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le onctionnement.” BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 12 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 9.5 CE Regulatory: The BMD-SRA-1 modules are tested and compliant against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device. From Directive 2006/95/EC: EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 From R&TTE Directive 1999/5/EC: ETSI EN 300 328 V 1.9.1 From Directive 2004/108/EC: ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1 Declarations of Conformity and supporting test reports are available at www.rigado.com. 9.6 Japan (MIC) The BMD-SRA-1 modules have received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final end product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. • There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html Note: Japan Certifications for the BMD-SRA-1 are pending. The label on the final end product which contains a BMD-SRA-1 module must follow the MIC marking requirements. Labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website: http://www.tele.soumu.go.jp/e/index.htm. The BMD-SRA-1 module is labeled with its assigned technical conformity mark and certification number. The final end product in which this module is being used must have an external label referring to the type certified module inside: Contains transmitter module with certificate number: TBD 9.7 Australia / New Zealand The BMD-SRA-1 modules have been tested to comply with the AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices – Limits and methods of measurement. The report may be downloaded from www.rigado.com, and may be used as evidence in obtaining permission to use the RCM. Information on registration as a Responsible Party, license and labeling requirements may be found at the following websites: Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-2004 New Zealand: http://www.rsm.govt.nz/compliance The A-Tick and C-Tick marks are being migrated to the Regulatory Compliance Mark (RCM). Only Australianbased and New Zealand-based companies who are registered may be granted permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also register as a Responsible Party to use the RCM on behalf of a company not in Australia or New Zealand. BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 13 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 10. Solder Reflow Temperature-Time Profile Figure 7 – Reflow Profile for Lead Free Solder 10.1 Moisture Sensitivity Level The BMD-SRA-1 is rated for MSL 3, 168-hour floor life after opening. 11. Cautions 1) The guidelines of this document should be followed in order to assure proper performance of the module. 2) This product is for use in office, business, and residential applications, but not medical devices. 3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe precautions should be used. This could be accomplished by redundant systems and protection circuits. 4) Supply voltage to the module should not be higher than the specified inputs or reversed. Additionally, it should not contain noise, spikes, or AC ripple voltage. 5) Avoid use with other high frequency circuits. 6) Use methods to eliminate static electricity when working with the module as it can damage the components. 7) Contact with wires, the enclosure, or any other objects should be avoided. 8) If hand soldering is used, be sure to use the precautions outlined in this document. 9) This module should be kept away from heat, both during storage and after installation. 10) Do not drop or physically shock the module. 11) Do not damage the interface surfaces of the module. 12) The module should not be mechanically stressed at any time (storage, handling, installation). 13) Do not store or expose this module to: Humid or salty air conditions High concentrations of corrosive gasses. Long durations of direct sunlight. Temperatures lower than -40°C or higher than 125°C. BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 14 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 12. Life Support Policy This product is not designed to be used in a life support device or system, or in applications where there is potential for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in an application that poses these risks, such as described above, the customer is agreeing to indemnify Rigado for any damages that result. BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 15 of 16 BMD-SRA-1 Module Datasheet Bluetooth 4.2 LE October 25, 2016 13. Document History Revision Date Changes / Notes 0.8 0.9 1.0 9/22/2016 9/29/2016 10/25/2016 Initial preliminary release Updated mechanical drawing Updated certification status 14. Related Documents Nordic Documents: Visit infocenter.nordicsemi.com for a comprehensive library of Nordic technical documentation. nRF52832 – nRF52832 Product Specification S132-SDS – nRF52832 S132 Soft Device Specification BMD-SRA-1-DS v1.0 CONFIDENTIAL Page 16 of 16
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : No Page Count : 16 Language : en-US Tagged PDF : Yes XMP Toolkit : 3.1-701 Producer : Microsoft® Word 2016 Title : BMD-SRA-1 Datasheet Creator : Rigado, LLC Description : BMD-SRA-1-DS Creator Tool : Microsoft® Word 2016 Create Date : 2016:10:25 23:15:20-07:00 Modify Date : 2016:10:25 23:15:20-07:00 Document ID : uuid:9AF67CDF-82B2-484F-9D11-D2FE4457D7C0 Instance ID : uuid:9AF67CDF-82B2-484F-9D11-D2FE4457D7C0 Author : Rigado, LLC Subject : BMD-SRA-1-DSEXIF Metadata provided by EXIF.tools