u blox SARAG350 Quad band (GSM850, GSM 900, DCS 1800, PCS 1900) GSM/GPRS module User Manual SARA G3 series

u-blox AG Quad band (GSM850, GSM 900, DCS 1800, PCS 1900) GSM/GPRS module SARA G3 series

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    SARA-G3 series GSM/GPRS modules System Integration Manual                   Abstract This document describes the features and the system integration of SARA-G3 series GSM/GPRS wireless modules. These modules are complete and cost efficient solutions offering up to quad-band GSM/GPRS voice and/or data transmission technology in a compact form factor.  www.u-blox.com   26.0 x 16.0 x 3.0 mm locate, communicate, accelerate
SARA-G3 series - System Integration Manual   GSM.G2-HW-12003-1 Advance Information     Page 2 of 145  Document Information Title SARA-G3 series Subtitle GSM/GPRS modules  Document type System Integration Manual  Document number GSM.G2-HW-12003-1 Document status Advance Information  Document status information Objective Specification This document contains target values. Revised and supplementary data will be published later. Advance Information This document contains data based on early testing. Revised and supplementary data will be published later. Preliminary This document contains data from product verification. Revised and supplementary data may be published later. Released This document contains the final product specification.  This document applies to the following products: Name Type number Firmware version PCN / IN SARA-G300 SARA-G300-00S-00 TBD TBD SARA-G310 SARA-G310-00S-00 TBD TBD SARA-G350 SARA-G350-00S-00 08.45 GSM.G2-TN-13001 SARA-G350 ECALL SARA-G350-71S-00 08.45 GSM.G2-TN-13001             This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They can be downloaded from www.u-blox.com. u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice.  u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © 2013, u-blox AG. u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. Trademark Notice Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Preface      Page 3 of 145 Preface u-blox Technical Documentation As  part  of  our  commitment  to  customer  support,  u-blox  maintains  an  extensive  volume  of  technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development. AT  Commands  Manual:  This  document  provides  the  description  of  the  supported  AT  commands  by  the  SARA-G3 series modules to verify all implemented functionalities. System  Integration  Manual: This  manual  provides hardware  design instructions  and information on how to set up production and final product tests. Application  Note:  document  provides  general  design  instructions  and  information  that  applies  to  all  u-blox Wireless  modules.  See  Related  documents section  for  a  list  of  Application  Notes  related  to  your  Wireless Module.  How to use this Manual The SARA-G3 series System Integration Manual provides the necessary information to successfully design in and configure these u-blox wireless modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:  An index finger points out key information pertaining to module integration and performance.  A warning symbol indicates actions that could negatively impact or damage the module.  Questions If you have any questions about u-blox Wireless Integration:  Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com  Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com  Technical Support Worldwide Web Our  website  (www.u-blox.com)  is  a  rich  pool  of  information.  Product  information,  technical  documents  and helpful FAQ can be accessed 24h a day. By E-mail Contact the nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support, have the following information ready:  Module type (e.g. SARA-G350) and firmware version  Module configuration  Clear description of your question or the problem  A short description of the application  Your complete contact details
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Contents     Page 4 of 145 Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1 System description ....................................................................................................... 8 1.1 Overview .............................................................................................................................................. 8 1.2 Architecture ........................................................................................................................................ 10 1.2.1 Internal blocks ............................................................................................................................. 11 1.3 Pin-out ............................................................................................................................................... 12 1.4 Operating modes ................................................................................................................................ 16 1.5 Supply interfaces ................................................................................................................................ 18 1.5.1 Module supply input (VCC) ......................................................................................................... 18 1.5.2 RTC supply input/output (V_BCKP) .............................................................................................. 23 1.5.3 Interfaces supply output (V_INT) .................................................................................................. 24 1.6 System function interfaces .................................................................................................................. 25 1.6.1 Module power-on ....................................................................................................................... 25 1.6.2 Module power-off ....................................................................................................................... 26 1.6.3 Module reset ............................................................................................................................... 27 1.6.4 External 32 kHz signal input (EXT32K) ......................................................................................... 28 1.7 Antenna interface ............................................................................................................................... 29 1.7.1 Antenna RF interface (ANT) ......................................................................................................... 29 1.7.1 Antenna detection interface (ANT_DET) ...................................................................................... 30 1.8 SIM interface ...................................................................................................................................... 30 1.8.1 SIM card interface ....................................................................................................................... 30 1.8.2 SIM card detection interface (SIM_DET) ....................................................................................... 30 1.9 Serial interfaces .................................................................................................................................. 31 1.9.1 Asynchronous serial interface (UART)........................................................................................... 31 1.9.2 Auxiliary asynchronous serial interface (UART AUX) ..................................................................... 41 1.9.3 DDC (I2C) interface ...................................................................................................................... 41 1.10 Audio interface ............................................................................................................................... 43 1.10.1 Analog audio interface ................................................................................................................ 43 1.10.2 Digital audio interface ................................................................................................................. 45 1.10.3 Voice-band processing system ..................................................................................................... 46 1.11 General Purpose Input/Output (GPIO) ............................................................................................. 48 1.12 Reserved pins (RSVD) ...................................................................................................................... 50 1.13 System features............................................................................................................................... 51 1.13.1 Network indication ...................................................................................................................... 51 1.13.2 Antenna detection ...................................................................................................................... 51 1.13.3 Jamming detection ...................................................................................................................... 51 1.13.4 TCP/IP and UDP/IP ....................................................................................................................... 52 1.13.5 FTP .............................................................................................................................................. 52
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Contents     Page 5 of 145 1.13.6 HTTP ........................................................................................................................................... 52 1.13.7 SMTP ........................................................................................................................................... 52 1.13.8 Smart temperature management ................................................................................................. 53 1.13.9 AssistNow clients and GPS/GNSS integration ............................................................................... 55 1.13.10 Hybrid positioning and CellLocateTM ......................................................................................... 56 1.13.11 Firmware upgrade Over AT (FOAT) .......................................................................................... 58 1.13.12 Firmware upgrade Over The Air (FOTA) .................................................................................... 58 1.13.13 In-Band modem (eCall / ERA-GLONASS) .................................................................................. 59 1.13.14 Power saving ........................................................................................................................... 59 2 Design-in ..................................................................................................................... 60 2.1 Supply interfaces ................................................................................................................................ 61 2.1.1 Module supply (VCC) .................................................................................................................. 61 2.1.2 RTC supply (V_BCKP) ................................................................................................................... 69 2.1.3 Interface supply (V_INT) ............................................................................................................... 71 2.2 System functions interfaces ................................................................................................................ 72 2.2.1 Module power-on (PWR_ON) ...................................................................................................... 72 2.2.2 Module reset (RESET_N) .............................................................................................................. 73 2.2.3 External 32 kHz signal input (EXT32K) ......................................................................................... 74 2.3 Antenna interface ............................................................................................................................... 75 2.3.1 Antenna RF interface (ANT) ......................................................................................................... 75 2.3.2 Antenna detection interface (ANT_DET) ...................................................................................... 80 2.4 SIM interface ...................................................................................................................................... 83 2.5 Serial interfaces .................................................................................................................................. 90 2.5.1 Asynchronous serial interface (UART)........................................................................................... 90 2.5.2 Auxiliary asynchronous serial interface (UART AUX) ..................................................................... 93 2.5.3 DDC (I2C) interface ...................................................................................................................... 95 2.6 Audio Interface ................................................................................................................................... 98 2.6.1 Analog Audio interface ............................................................................................................... 98 2.6.2 Digital Audio interface ............................................................................................................... 104 2.7 General Purpose Input/Output (GPIO) ............................................................................................... 105 2.8 Reserved pins (RSVD) ........................................................................................................................ 107 2.9 Module placement............................................................................................................................ 107 2.10 Module footprint and paste mask ................................................................................................. 108 2.11 Thermal guidelines ........................................................................................................................ 109 2.12 ESD guidelines .............................................................................................................................. 111 2.12.1 ESD immunity test overview ...................................................................................................... 111 2.12.2 ESD immunity test of u-blox SARA-G3 series reference designs ................................................. 111 2.12.3 ESD application circuits .............................................................................................................. 112 2.13 Schematic for SARA-G3 series module integration ........................................................................ 114 2.14 Design-in checklist ........................................................................................................................ 116 2.14.1 Schematic checklist ................................................................................................................... 116 2.14.2 Layout checklist ......................................................................................................................... 117 2.14.3 Antenna checklist ...................................................................................................................... 117
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Contents     Page 6 of 145 3 Handling and soldering ........................................................................................... 118 3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 118 3.2 Soldering .......................................................................................................................................... 118 3.2.1 Soldering paste.......................................................................................................................... 118 3.2.2 Reflow soldering ....................................................................................................................... 118 3.2.3 Optical inspection ...................................................................................................................... 120 3.2.4 Cleaning .................................................................................................................................... 120 3.2.5 Repeated reflow soldering ......................................................................................................... 120 3.2.6 Wave soldering.......................................................................................................................... 120 3.2.7 Hand soldering .......................................................................................................................... 120 3.2.8 Rework ...................................................................................................................................... 120 3.2.9 Conformal coating .................................................................................................................... 120 3.2.10 Casting ...................................................................................................................................... 121 3.2.11 Grounding metal covers ............................................................................................................ 121 3.2.12 Use of ultrasonic processes ........................................................................................................ 121 4 Approvals .................................................................................................................. 122 4.1 Product certification approval overview ............................................................................................. 122 4.2 Federal Communications Commission and Industry Canada notice ................................................... 123 4.2.1 Safety Warnings review the structure ........................................................................................ 123 4.2.2 Declaration of Conformity – United States only ......................................................................... 123 4.2.3 Modifications ............................................................................................................................ 123 4.3 R&TTED and European Conformance CE mark ................................................................................. 125 5 Product Testing......................................................................................................... 126 5.1 u-blox in-series production test ......................................................................................................... 126 5.2 Test parameters for OEM manufacturer ............................................................................................ 126 5.2.1 “Go/No go” tests for integrated devices .................................................................................... 127 5.2.2 Functional tests providing RF operation ..................................................................................... 127 Appendix ........................................................................................................................ 130 A Migration between LISA and SARA modules ......................................................... 130 A.1 Overview .......................................................................................................................................... 130 A.2 Checklist for migration ..................................................................................................................... 131 A.3 Software migration ........................................................................................................................... 132 A.4 Hardware migration.......................................................................................................................... 132 A.4.1 Supply interfaces ....................................................................................................................... 132 A.4.2 System functions interfaces ....................................................................................................... 133 A.4.3 Antenna interface ..................................................................................................................... 134 A.4.4 SIM interface ............................................................................................................................. 135 A.4.5 Serial interfaces ......................................................................................................................... 135 A.4.6 Audio interfaces ........................................................................................................................ 136 A.4.7 GPIO pins .................................................................................................................................. 136 A.4.8 Reserved pins ............................................................................................................................ 136
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Contents     Page 7 of 145 A.4.9 Pin-out comparison between LISA and SARA ............................................................................. 137 B Glossary .................................................................................................................... 141 Related documents......................................................................................................... 143 Revision history .............................................................................................................. 144 Contact ............................................................................................................................ 145
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 8 of 145 1 System description 1.1 Overview SARA-G3 series are versatile 2.5G GSM/GPRS wireless modules in a miniature LGA (Land Grid Array) form factor. SARA-G350 is a full feature quad-band GSM/GPRS wireless module with a comprehensive feature set including an  extensive  set  of  internet  protocols.  SARA-G350  also  provides  fully  integrated  access  to  u-blox  GPS/GNSS positioning chips and modules, with embedded A-GPS (AssistNow Online and AssistNow Offline) functionality. SARA-G310  and SARA-G300 are  respectively  quad-band and dual-band  GSM/GPRS  wireless  modules targeted for high volume cost sensitive applications, providing GSM/GPRS functionalities with a reduced set of additional features to minimize the customer’s total cost of ownership. SARA-G3  wireless  modules  are  certified  and  approved  by  the  main  regulatory  bodies  and  operators,  and  RIL software for Android and Embedded Windows are available free of charge. SARA-G3 modules are manufactured in  ISO/TS  16949  certified  sites.  Each  module  is  tested  and  inspected  during  production.  The  modules  are qualified according  to  ISO  16750  –  Environmental conditions and electrical testing for  electrical and electronic equipment for road vehicles.  Table 1 describes a summary of interfaces and features provided by SARA-G3 modules.  Module Data Rate Bands Interfaces Audio Functions  GPRS multi-slot class 10 GPRS multi-slot class 2 GSM/GPRS quad-band GSM/GPRS dual-band (900/1800 MHz) UART SPI USB DDC for u-blox GPS/GNSS receivers GPIO Analog Audio Digital Audio Network indication Antenna detection Jamming detection Embedded TCP/UDP FTP, HTTP, SMTP SSL GPS/GNSS via Modem AssistNow software FW update over AT (FOAT) FW update over the air (FOTA) In-band modem CellLocateTM Low power idle-mode SARA-G300  •  • 2               •    E SARA-G310  • •  2               •    E SARA-G350 •  •  2   • 4 • • • • • • •  • • • A  • • SARA-G350 ECALL •  •  2   • 4 • • • • • • •  • • • A • • • A = available upon request E = external 32 kHz signal required for low power idle-mode Table 1: SARA-G3 series features summary
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 9 of 145 Table 2 reports a summary of GSM/GPRS characteristics of SARA-G3 series modules.  Item SARA-G300 SARA-G310 SARA-G350 GSM/GPRS Protocol Stack  3GPP Release 99 3GPP Release 99 3GPP Release 99 Mobile Station Class Class B1 Class B1 Class B1 GSM/GPRS Bands E-GSM 900 MHz DCS 1800 MHz GSM 850 MHz E-GSM 900 MHz DCS 1800 MHz PCS 1900 MHz GSM 850 MHz E-GSM 900 MHz DCS 1800 MHz PCS 1900 MHz GSM/GPRS Power Class Class 4 (33 dBm) for 900 Class 1 (30 dBm) for 1800 Class 4 (33 dBm) for 850/900 Class 1 (30 dBm) for 1800/1900 Class 4 (33 dBm) for 850/900 Class 1 (30 dBm) for 1800/1900 Packet Switched Data Rate GPRS multi-slot class 22 Coding scheme CS1-CS4 Up to 42.8 kb/s DL3 Up to 21.4 kb/s UL3 GPRS multi-slot class 22 Coding scheme CS1-CS4 Up to 42.8 kb/s DL3 Up to 21.4 kb/s UL3 GPRS multi-slot class 104  Coding scheme CS1-CS4 Up to 85.6 kb/s DL3 Up to 42.8 kb/s UL3 Circuit Switched Data Rate None None Up to 9.6 kb/s DL/UL3 Transparent mode  Non transparent mode Network Operation Modes  I to III I to III I to III Table 2: SARA-G3 series GSM/GPRS characteristics summary                                                         1 Device can be attached to both GPRS and  GSM services (i.e. Packet Switch and  Circuit Switch mode) using one  service at a  time. If  for 2 GPRS multi-slot class 2 implies a maximum of 2 slots in DL (reception) and 1 slot in UL (transmission) with 3 slots in total. 3 The maximum bit rate of the module depends on the current network settings. 4 GPRS multi-slot class 10 implies a maximum of 4 slots in DL (reception) and 2 slots in UL (transmission) with 5 slots in total.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 10 of 145 1.2 Architecture MemoryAuxiliary UARTSIM Card DetectionSIM CardUARTV_BCKP (RTC)V_INT (I/O)Power-OnReset26 MHzRF TransceiverPowerManagementBasebandANT SAWFilterSwitchPAVCC (Supply)32 kHz Figure 1: SARA-G300 and SARA-G310 modules block diagram MemoryAuxiliary UARTDDC (for GPS/GNSS)SIM Card DetectionSIM CardUARTV_BCKP (RTC)V_INT (I/O)Power-OnReset26 MHz 32.768 kHzRF TransceiverPowerManagementBasebandANT SAWFilterSwitchPADigital AudioAnalog AudioVCC (Supply)GPIOAntenna Detection Figure 2: SARA-G350 modules block diagram
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 11 of 145 1.2.1 Internal blocks SARA-G3 modules consist of the following internal sections: RF, Baseband and Power Management. RF section The RF section is composed of the following main elements:  RF  transceiver  performing  modulation,  up-conversion  of  the  baseband  I/Q  signals,  down-conversion  and demodulation of the RF received signals. The RF transceiver includes: Constant gain direct conversion receiver with integrated LNAs Highly linear RF quadrature GMSK demodulator Digital Sigma-Delta transmitter GMSK modulator Fractional-N Sigma-Delta RF synthesizer 3.8 GHz VCO Digital controlled crystal oscillator  Transmit  module,  which  amplifies  the  signals  modulated  by  the  RF  transceiver  and  connects  the  single antenna input/output pin (ANT) of the module to the suitable RX/TX path, via its integrated parts: Power amplifier Antenna switch  RX diplexer SAW (band pass) filters  26  MHz  crystal,  connected  to  the  digital  controlled  crystal  oscillator  to  perform  the  clock  reference  in active-mode or connected-mode Baseband and Power Management section The Baseband and Power Management section is composed of the following main elements:  Baseband processor, a mixed signal ASIC which integrates: Microprocessor for controller functions DSP core for GSM/GPRS Layer 1 and audio processing Dedicated peripheral blocks for parallel control of the digital interfaces Audio analog front-end  Memory system in a multi-chip package integrating two devices: NOR flash non-volatile memory PSRAM volatile memory  Voltage regulators to derive all the system supply voltages from the module supply VCC SARA-G350  modules  are  provided with  an  internal  32.768  kHz  crystal  connected to  the  oscillator  of  the  RTC (Real Time  Clock) block  that  gives the  RTC clock reference  needed to provide  the RTC functions as well  as  to reach the low power idle-mode (with power saving configuration enabled by the AT+UPSV command). SARA-G300  and  SARA-G310  modules  are  not  provided  with  internal  32.768  kHz  crystal:  an  external  32  kHz signal must be provided at the EXT32K input pin of the modules to give the RTC clock reference and to provide the RTC functions as well as to reach the low power idle-mode (with power saving configuration enabled by the AT+UPSV command).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 12 of 145 1.3 Pin-out Table 3 lists the pin-out of the SARA-G3 modules, with pins grouped by function.  Function Pin Name Module Pin No I/O Description Remarks Power VCC All 51, 52, 53 I Module supply input VCC pins are internally connected each other. VCC supply circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.5.1 for functional description and requirements for the VCC module supply. See section 2.1.1 for external circuit design-in.  GND All 1, 3, 5, 14, 20-22, 30, 32, 43, 50, 54, 55, 57-61, 63-96 N/A Ground GND pins are internally connected each other. External ground connection affects the RF and thermal performance of the device. See section 1.5.1 for functional description. See section 2.1.1 for external circuit design-in.  V_BCKP All 2 I/O Real Time Clock supply input/output V_BCKP = 2.3 V (typical) generated by internal regulator when valid VCC supply is present. See section 1.5.2 for functional description. See section 2.1.2 for external circuit design-in.  V_INT All 4 O Digital Interfaces supply output V_INT = 1.8 V (typical) generated by internal regulator when the module is switched on. See section 1.5.3 for functional description. See section 2.1.3 for external circuit design-in. System PWR_ON All 15 I Power-on input High input impedance: input voltage level has to be properly fixed, e.g. adding external pull-up. See section 1.6.1 for functional description. See section 2.2.1 for external circuit design-in.  RESET_N All 18 I External reset input A series Schottky diode is integrated in the module as protection, and then an internal 10 k pull-up resistor to V_INT is provided. See section 1.6.3 for functional description. See section 2.2.2 for external circuit design-in.  EXT32K SARA-G300 SARA-G310 31 I 32 kHz input Input for RTC reference clock, needed to enter the low power idle-mode and provide RTC functions. See section 1.6.4 for functional description. See section 2.2.3 for external circuit design-in. Antenna ANT All 56 I/O RF input/output for antenna 50  nominal characteristic impedance. Antenna circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.7 for functional description and requirements for the antenna RF interface. See section 2.3 for external circuit design-in.  ANT_DET SARA-G350 62 I Input for antenna detection ADC input for antenna detection function. See section 1.7.1 for functional description. See section 2.3.2 for external circuit design-in.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 13 of 145 Function Pin Name Module Pin No I/O Description Remarks SIM VSIM All 41 O SIM supply output VSIM = 1.80 V typ. or 2.85 V typ. automatically generated according to the connected SIM type. See section 1.8 for functional description. See section 2.4 for external circuit design-in.  SIM_IO All 39 I/O SIM data Data input/output for 1.8 V / 3 V SIM Internal 4.7 k pull-up to VSIM. See section 1.8 for functional description. See section 2.4 for external circuit design-in.  SIM_CLK All 38 O SIM clock 3.25 MHz clock output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.4 for external circuit design-in.  SIM_RST All 37 O SIM reset Reset output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.4 for external circuit design-in.  SIM_DET All 42 I SIM detection 1.8 V input for SIM presence detection function. See section 1.8.2 for functional description. See section 2.4 for external circuit design-in. UART RXD All 13 O UART data output 1.8 V output, Circuit 104 (RXD) in ITU-T V.24,  for AT command, Data communication, FOAT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  TXD All 12 I UART data input 1.8 V input, Circuit 103 (TXD) in ITU-T V.24,  for AT command, Data communication, FOAT. Internal active pull-up to V_INT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  CTS All 11 O UART clear to send output 1.8 V output, Circuit 106 (CTS) in ITU-T V.24,  for AT command, Data communication, FOAT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  RTS All 10 I UART ready to send input 1.8 V input, Circuit 105 (RTS) in ITU-T V.24,  for AT command, Data communication, FOAT. Internal active pull-up to V_INT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  DSR All 6 O UART data set ready output 1.8 V output, Circuit 107 (DSR) in ITU-T V.24,  for AT command, Data communication, FOAT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  RI All 7 O UART ring indicator output 1.8 V output, Circuit 125 (RI) in ITU-T V.24,  for AT command, Data communication, FOAT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  DTR All 9 I UART data terminal ready input 1.8 V input, Circuit 108/2 (DTR) in ITU-T V.24,  for AT command, Data communication, FOAT. Internal active pull-up to V_INT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.  DCD All 8 O UART data carrier detect output 1.8 V input, Circuit 109 (DCD) in ITU-T V.24,  for AT command, Data communication, FOAT. See section 1.9.1 for functional description. See section 2.5.1 for external circuit design-in.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 14 of 145 Function Pin Name Module Pin No I/O Description Remarks Auxiliary UART RXD_AUX All 28 O Auxiliary UART data output 1.8 V output, Circuit 104 (RXD) in ITU-T V.24,  for FW upgrade and trace log capture. Access by external test-point is recommended. See section 1.9.2 for functional description. See section 2.5.2 for external circuit design-in.  TXD_AUX All 29 I Auxiliary UART data input 1.8 V input, Circuit 103 (TXD) in ITU-T V.24,  for FW upgrade and trace log capture. Access by external test-point is recommended. Internal active pull-up to V_INT. See section 1.9.2 for functional description. See section 2.5.2 for external circuit design-in. DDC  SCL SARA-G350 27 O I2C bus clock line 1.8 V open drain, for the communication with  u-blox positioning modules and chips. External pull-up required. See section 1.9.3 for functional description. See section 2.5.3 for external circuit design-in.  SDA SARA-G350 26 I/O I2C bus data line 1.8 V open drain, for the communication with  u-blox positioning modules and chips. External pull-up required. See section 1.9.3 for functional description. See section 2.5.3 for external circuit design-in. Analog Audio  MIC_BIAS SARA-G350 46 O Microphone supply output  Supply output (2.2 V typ) for external microphone. See section 1.10.1 for functional description. See section 2.6.1 for external circuit design-in.  MIC_GND SARA-G350 47 I Microphone analog reference Local ground for the external microphone (reference for the analog audio uplink path).  See section 1.10.1 for functional description. See section 2.6.1 for external circuit design-in.  MIC_N SARA-G350 48 I Differential analog audio input (negative) Differential analog audio signal input (negative) shared for all the analog uplink path modes: handset, headset, hands-free mode.  No internal DC blocking capacitor. See section 1.10.1 for functional description. See section 2.6.1 for external circuit design-in.  MIC_P SARA-G350 49 I Differential analog audio input (positive) Differential analog audio signal input (positive) shared for all the analog uplink path modes: handset, headset, hands-free mode.  No internal DC blocking capacitor. See section 1.10.1 for functional description. See section 2.6.1 for external circuit design-in.  SPK_P SARA-G350 44 O Differential analog audio output (positive) Differential analog audio signal output (positive) shared for all the analog downlink path modes: earpiece, headset and loudspeaker mode.  See section 1.10.1 for functional description. See section 2.6.1 for external circuit design-in.  SPK_N SARA-G350 45 O Differential analog audio output (negative) Differential analog audio signal output (negative) shared for all the analog downlink path modes: earpiece, headset and loudspeaker mode.  See section 1.10.1 for functional description. See section 2.6.1 for external circuit design-in.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 15 of 145 Function Pin Name Module Pin No I/O Description Remarks Digital Audio  I2S_CLK SARA-G350 37 O I2S clock 1.8 V clock output for PCM / normal I2S modes. See section 1.10.2 for functional description. See section 2.6.2 for external circuit design-in.  I2S_RXD SARA-G350 36 I I2S receive data 1.8 V data input for PCM / normal I2S modes. Internal active pull-down to GND. See section 1.10.2 for functional description. See section 2.6.2 for external circuit design-in.  I2S_TXD SARA-G350 35 O I2S transmit data 1.8 V data output for PCM / normal I2S modes. See section 1.10.2 for functional description. See section 2.6.2 for external circuit design-in.  I2S_WA SARA-G350 34 O I2S word alignment 1.8 V word al. output for PCM / normal I2S modes See section 1.10.2 for functional description. See section 2.6.2 for external circuit design-in. GPIO GPIO1 SARA-G350 16 I/O GPIO 1.8 V GPIO by default configured as pad disabled. See section 1.11 for functional description. See section 2.7 for external circuit design-in.  GPIO2 SARA-G350 23 I/O GPIO 1.8 V GPIO by default configured to provide the custom GPS supply enable function. See section 1.11 for functional description. See section 2.7 for external circuit design-in.  GPIO3 SARA-G350 24 I/O GPIO 1.8 V GPIO by default configured to provide the custom GPS data ready function. See section 1.11 for functional description. See section 2.7 for external circuit design-in.  GPIO4 SARA-G350 25 I/O GPIO 1.8 V GPIO by default configured to provide the custom GPS RTC sharing function. See section 1.11 for functional description. See section 2.7 for external circuit design-in. Reserved RSVD All 33 N/A RESERVED pin This pin must be connected to ground. See section 2.8  RSVD All 17, 19 N/A RESERVED pin Leave unconnected. See section 2.8  RSVD SARA-G350 31 N/A RESERVED pin Internally not connected. Leave unconnected. See section 2.8  RSVD SARA-G300 SARA-G310 16, 23-27, 34-37 N/A RESERVED pin Pad disabled. Leave unconnected. See section 2.8  RSVD SARA-G300 SARA-G310 44-49, 62 N/A RESERVED pin Leave unconnected. See section 2.8 Table 3: SARA-G3 series modules pin definition, grouped by function
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 16 of 145 1.4 Operating modes SARA-G3 modules have several operating modes. The operating modes are defined in Table 4 and described in details in Table 5, providing general guidelines for operation.  General Status Operating Mode Definition Power-down Not-Powered Mode VCC supply not present or below operating range: module is switched off.  Power-Off Mode VCC supply within operating range and module is switched off. Normal Operation Idle-Mode Module processor core runs with 32 kHz reference, that is generated by:  The internal 32 kHz oscillator (SARA-G350)  The 32 kHz signal provided at the EXT32K pin (SARA-G300 and SARA-G310)  Active-Mode Module processor core runs with 26 MHz reference generated by the internal oscillator.  Connected-Mode Voice or data call enabled and processor core runs with 26 MHz reference. Table 4: Module operating modes definition  Operating Mode Description Transition between operating modes Not-Powered Mode Module is switched off. Application interfaces are not accessible. Internal RTC timer only operates if a valid voltage is applied to V_BCKP pin (necessary for all SARA-G3 modules), and if a valid 32 kHz signal is provided to EXT32K pin (necessary only for SARA-G300 and  SARA-G310 modules) When VCC supply is removed, the module enters not-powered mode. When in not-powered mode, the module cannot be switched on by a low level on PWR_ON input or by a preset RTC alarm. When in not-powered mode, the module can be switched on applying VCC supply (refer to 2.2.1) so that the module switches from not-powered to active-mode. Power-Off Mode Module is switched off: normal shutdown by an appropriate power-off event (refer to 1.6.2). Application interfaces are not accessible. Only the internal RTC timer in operation. A valid 32 kHz signal must be provided to EXT32K pin of SARA-G300 and SARA-G310 modules to let RTC timer running that otherwise is in operation (this is not needed for the other SARA-G3 series modules). When the module is switched off by an appropriate power-off event (refer to 1.6.2), the module enters power-off mode from active-mode. When in power-off mode, the module can be switched on by a low level on PWR_ON input or by a preset RTC alarm (refer to 2.2.1): module switches from power-off to active-mode. When VCC supply is removed, the module switches from power-off mode to not-powered mode. Idle-Mode The module is not ready to communicate with an external device by means of the application interfaces since configured to reduce power consumption. The module automatically enters idle-mode whenever possible if power saving is enabled by the AT+UPSV command (refer to u-blox AT Commands Manual [2]), reducing power consumption (refer to 1.5.1.3). The CTS output line indicates when the UART interface is disabled/enabled due to the module idle/active-mode according to power saving and hardware flow control settings (refer to 1.9.1.3, 1.9.1.4). Power saving configuration is not enabled by default: it can be enabled by the AT+UPSV command (see u-blox AT Commands Manual [2]). A valid 32 kHz signal must be provided to EXT32K pin of SARA-G300 and SARA-G310 modules to let  idle-mode that otherwise cannot be reached (this is not needed for the other SARA-G3 series modules). The module automatically switches from active-mode to idle-mode whenever possible if power saving is enabled (refer to sections 1.5.1.3, 1.9.1.4 and to the u-blox AT Commands Manual [2], AT+UPSV). The module wakes up from idle-mode to active-mode in the following events:  Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (refer to 1.5.1.3, 1.9.1.4)  Automatic periodic enable of the UART interface to receive and send data, if the power saving AT command is set to 1 (refer to 1.9.1.4)  RTC alarm occurs (refer to u-blox AT Commands Manual [2], AT+CALA command)  Data received on UART interface (refer to 1.9.1.4)  RTS input line set to the ON state by the DTE if hardware flow control has been disabled by AT&K3 and the power saving AT command is set to 2 (refer to 1.9.1.4)  GPS data ready: when the GPIO3 pin is informed by the connected u-blox GPS/GNSS receiver that it is ready to send data via the DDC (I2C) interface (refer to 1.11, 1.9.3)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 17 of 145 Operating Mode Description Transition between operating modes Active-Mode The module is ready to communicate with an external device by means of the application interfaces unless power saving configuration is enabled by the AT+UPSV command (refer to sections 1.5.1.3, 1.9.1.4 and to the u-blox AT Commands Manual [2]). When the module is switched on by an appropriate power-on event (refer to 2.2.1), the module enters active-mode from not-powered or power-off mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from active to idle-mode whenever possible and the module wakes up from idle to active-mode in the events listed above (refer to idle to active transition description). When a voice call or a data call is initiated, the module switches from active-mode to connected-mode. Connected-Mode A voice call or a data call is in progress. The module is ready to communicate with an external device by means of the application interfaces unless power saving configuration is enabled by the AT+UPSV command (see sections 1.5.1.3, 1.9.1.4 and the u-blox AT Commands Manual [2]). When a voice call or a data call is initiated, the module enters connected-mode from active-mode. When a voice call or a data call is terminated, the module returns to the active-mode. Table 5: Module operating modes description  Figure 3 describes the transition between the different operating modes. Switch ON:•Apply VCCIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveIncoming/outgoing call or other dedicated device network communicationCall terminated, communication droppedRemove VCCSwitch ON:•PWR_ON•RTC AlarmNot poweredPower offActiveConnected IdleSwitch OFF:•AT+CPWROFF Figure 3: Operating modes transition
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 18 of 145 1.5 Supply interfaces 1.5.1 Module supply input (VCC) SARA-G3 modules must be supplied via the three VCC pins that represent the module power supply input. The VCC pins are internally connected to the RF power amplifier and to the integrated Power Management Unit: all supply voltages needed by the module are generated from the  VCC supply by integrated voltage regulators, including V_BCKP Real Time Clock supply, V_INT digital interfaces supply and VSIM SIM card supply. During operation, the current drawn by the SARA-G3 series modules through the VCC pins can vary by several orders of magnitude. This ranges from the high peak of current consumption during GSM transmitting bursts at maximum power level in connected-mode (as described in the chapter 1.5.1.2), to the low current consumption during low power idle-mode with power saving enabled (as described in the chapter 1.5.1.3).  1.5.1.1 VCC supply requirements Table 6 summarizes the requirements for the VCC module supply. Refer to chapter 2.1.1 for all the suggestions to properly design a VCC supply circuit compliant to the requirements listed in Table 6.   The  VCC  supply  circuit  affects  the  RF  compliance  of  the  device  integrating  SARA-G3  series module  with  applicable  required  certification  schemes  as  well  as  antenna  circuit  design. Compliance is guaranteed if the VCC requirements summarized in the Table 6 are fulfilled.  Item Requirement Remark VCC nominal voltage Within VCC normal operating range: 3.35 V min. / 4.50 V max. The module cannot be switched on if  VCC voltage value is below the normal operating range minimum limit. Ensure  that  the  input  voltage  at  VCC  pins  is  above  the minimum limit of the normal operating range for at least more than 3 s after the module switch-on. VCC voltage during normal operation Within VCC extended operating range: 3.00 V min. / 4.50 V max. The  module  may  switch  off  when  VCC  voltage  drops below the extended operating range minimum limit. Operation  above  extended  operating  range  maximum limit  is  not  recommended  and  exposure  beyond  it  may affect device reliability. VCC average current Considerably  withstand  maximum  average  current consumption  value  in  connected-mode  conditions specified in SARA-G3 series Data Sheet [1]. The  maximum  average  current  consumption  can  be greater  than  the  specified value  according  to  the  actual antenna mismatching, temperature and VCC voltage. Chapter 1.5.1.2 describes connected-mode current. VCC peak current Withstand  the  maximum  peak  current  consumption specified in the SARA-G3 series Data Sheet [1]. The  specified  maximum  peak  of  current  consumption occurs  during GSM  single  transmit slot  in  850/900  MHz connected-mode, in case of mismatched antenna. Chapter 1.5.1.2 describes connected-mode current. VCC voltage drop during Tx slots Lower than 400 mV VCC  voltage  drop  values  greater  than  recommended during 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes VCC voltage drop during Tx slots. VCC voltage ripple during Tx slots  Lower than 30 mVpp if fripple ≤ 200 kHz Lower than 10 mVpp if 200 kHz < fripple ≤ 400 kHz Lower than 2 mVpp if fripple > 400 kHz VCC  voltage  ripple  values  higher  than  recommended during  2G/3G  transmission  directly  affect  the  RF compliance with applicable certification schemes. Figure 5 describes VCC voltage ripple during Tx slots.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 19 of 145 Item Requirement Remark VCC under/over-shoot at start/end of Tx slots Absent or at least minimized VCC  under/over-shoot higher  than  recommended at  the start/end  of  2G  TDMA  transmission  slots  directly  affect the RF compliance with applicable certification schemes Figure  5  describes  VCC  voltage  under/over-shoot  at  the start/end of Tx slots Table 6: Summary of VCC supply requirements     1.5.1.2 VCC current consumption in connected-mode When a GSM call is established, the VCC consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The current consumption peak during a transmission slot is strictly dependent on the transmitted power, which is regulated by the network. If the module is transmitting in GSM talk mode in  the 850 or 900 MHz bands, at the  maximum  RF  power  control  level  (approximately  2  W  or  33  dBm  in  the  allocated  transmit  slot/burst)  the current consumption can reach up to  1900 mA (with a highly unmatched antenna) for 576.9 µs (width of the transmit slot/burst)  with  a periodicity  of  4.615 ms (width of 1 frame  =  8 slots/burst),  so  with a 1/8  duty cycle according to GSM TDMA (Time Division Multiple Access). If the module is in GSM connected-mode in the 1800 or 1900 MHz bands, the current consumption figures are lower than the one in the 850 or 900 MHz bands, due to 3GPP transmitter output power specifications (refer to SARA-G3 series Data Sheet [1]). During a GSM call, current consumption is in the order of 60-130 mA  in receiving or in monitor bursts and  is about 10-40 mA in the inactive unused bursts (low current period). The more relevant contribution to determine the average current consumption is set by the transmitted power in the transmit slot.  Figure 4 shows an example of the module current consumption profile versus time in GSM talk mode.  Time [ms]RX   slotunused slotunused slotTX  slotunused slotunused slotMON       slotunused slotRX   slotunused slotunused slotTX   slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200 mA60-120 mA1900 mAPeak current depends on TX powerGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.060-120 mA10-40 mA Figure 4: VCC current consumption profile versus time during a GSM call (1 TX slot, 1 RX slot)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 20 of 145 Figure  5  illustrates  VCC  voltage  profile  versus  time  during  a  GSM  call,  according  to  the  relative  VCC  current consumption profile described in the Figure 4.  TimeundershootovershootrippledropVoltage3.8 V (typ)RX     slotunused slotunused slotTX     slotunused slotunused slotMON       slotunused slotRX     slotunused slotunused slotTX     slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)GSM frame             4.615 ms                                       (1 frame = 8 slots) Figure 5: Description of the VCC voltage profile versus time during a GSM call  When a GPRS connection is established, more than one slot can be used to transmit and/or more than one slot can  be  used  to  receive.  The  transmitted  power  depends  on  network  conditions,  which  set  the  peak  current consumption, but following the GPRS specifications the maximum transmitted RF power is reduced if more than one slot is used to transmit, so the maximum peak of current is not as high as can be in case of a GSM call. If  the  module  transmits  in  GPRS  multi-slot  class  10,  in  the  850  or  900  MHz  bands,  at  the  maximum  power control  level, the consumption  can  reach  up  to  1600  mA  (with  highly  unmatched  antenna).  This  happens  for 1.154 ms (width of the 2 Tx slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/4 duty cycle, according to GSM TDMA. If the module is in GPRS connected-mode in 1800 or 1900 MHz bands, consumption figures are lower than in the 850 or 900 MHz band, due to 3GPP Tx power specifications. Figure 6 reports the current consumption profiles in GPRS connected-mode, in the 850 or 900 MHz bands, with 2 slots used to transmit and 1 slot used to receive.  Time [ms]RX   slotunused slotunused slotTX   slotTX                  slotunused slotMON       slotunused slotRX  slotunused slotunused slotTX   slotTX                                   slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]60-120mAGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.060-120mA 10-40mA200mAPeak current depends on TX power1600 mA Figure 6: VCC current consumption profile versus time during a GPRS connection (2 TX slots, 1 RX slot)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 21 of 145 1.5.1.3 VCC current consumption in cyclic idle/active-mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the appropriate AT command (refer  to  u-blox AT  Commands Manual  [2],  AT+UPSV  command).  When  power  saving  is  enabled, the  module automatically enters idle-mode whenever possible, reducing current consumption. During idle-mode, the module processor runs with 32 kHz reference clock frequency. For SARA-G350 modules, the  internal  oscillator  automatically  generates  the  32  kHz  clock.  For  SARA-G300  and  SARA-G310  modules,  a valid 32 kHz signal must be provided to the  EXT32K  input pin of the module to let idle-mode, that otherwise cannot be reached (this is not needed for the other SARA-G3 series modules). When power saving is enabled, the module is registered or attached to a network and a voice or data call is not enabled,  the  module  automatically  enters  idle-mode  whenever  possible,  but  it  must  periodically  monitor  the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. When the module monitors the paging channel, it wakes up to active-mode, to enable the reception of paging block. In between, the module switches to idle-mode. This is known as GSM discontinuous reception (DRX). The  module  processor  core  is  activated  during  the  paging  block  reception,  and  automatically  switches  its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The  time  period  between  two  paging  block  receptions  is  defined  by  the  network.  This  is  the  paging  period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell. The time interval between two paging block receptions can be from 470.76 ms (DRX = 2, i.e. width of 2 GSM multiframes  =  2  x  51  GSM  frames  =  2  x  51  x  4.615  ms)  up  to  2118.42  ms  (DRX  =  9,  i.e.  width  of  9  GSM multiframes = 9 x 51 frames = 9 x 51 x 4.615 ms). Figure 7 shows an example of a module current consumption profile: the module is registered with the network, automatically  enters  idle-mode  and  periodically  wakes  up  to  active-mode  to  monitor  the  paging  channel  for paging block reception.  ~30 msIDLE MODE ACTIVE MODE IDLE MODE400-700 µAActive Mode EnabledIdle Mode Enabled400-700 µA60-120 mA0.44-2.09 sIDLE MODE~30 msACTIVE MODETime [s]Current [mA]100500Time [ms]Current [mA]1005003-6 mA 7-18 mA60-120 mAPLL EnabledRX Enabled20-40 mADSP Enabled Figure 7: Description of VCC current consumption profile versus time when the module is registered the network: the module is in idle-mode and periodically wakes up to active-mode to monitor the paging channel for paging block reception
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 22 of 145 1.5.1.4 VCC current consumption in fixed active-mode (power saving disabled) Power saving configuration is by default disabled, or it can be disabled using the appropriate AT command (refer to u-blox AT Commands Manual [2], AT+UPSV command). When power saving is disabled, the module does not automatically enter idle-mode whenever possible: the module remains in active-mode. The module processor core is activated during active-mode, and the 26 MHz reference clock frequency is used. Figure  8  shows  an  example  of  the  module  current  consumption  profile  when  power  saving  is  disabled:  the module is registered with the network, active-mode is maintained, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception.  ACTIVE MODE7-18 mA60-120 mA0.47-2.12 sPaging periodTime [s]Current [mA]100500Time [ms]Current [mA]1005007-18 mA60-120 mARX Enabled20-40 mADSP Enabled7-18 mA Figure  8:  Description  of  the VCC  current  consumption profile versus  time when power saving  is  disabled: the  active-mode is always held, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 23 of 145 1.5.2 RTC supply input/output (V_BCKP) The V_BCKP pin of SARA-G3 modules connects the supply for the Real Time Clock (RTC) and Power-On internal logic. This supply domain is internally generated by a linear LDO regulator integrated in the Power Management Unit, as described in Figure 9. The output of this linear regulator is always enabled when the main voltage supply provided to the module through the VCC pins is within the valid operating range, with the module switched off or switched on.  Baseband Processor51VCC52VCC53VCC2V_BCKPLinear LDO RTCPower ManagementSARA-G35032 kHzBaseband Processor51VCC52VCC53VCC2V_BCKPLinear LDO RTCPower ManagementSARA-G300 / SARA-G31032 kHz31EXT32K Figure 9: SARA-G3 series RTC supply input/output (V_BCKP) and 32 kHz RTC timing reference clock simplified block diagram  The  RTC  provides  the  module  time  reference  (date  and  time),  also  in  power-off  mode,  when  the  V_BCKP voltage is within its valid range (specified in the  “Input characteristics of Supply/Power pins” table in SARA-G3 series Data  Sheet [1]).  The  RTC  timing  is  normally  used  to  set  the  wake-up  interval  during  idle-mode  periods between  network  paging, but  is  able  to  provide  programmable  alarm  functions  by  means  of  the  32.768  kHz clock provided  by the internal oscillator  on SARA-G350 modules or  provided by a valid  32 kHz external signal present at the EXT32K input pin of SARA-G300 and SARA-G310 modules. The RTC can be supplied from an external back-up battery through the V_BCKP, when the main voltage supply is not provided to the module through VCC. This lets the time reference (date and time) run until the  V_BCKP voltage is within its valid range, even when the main supply is not provided to the module. The  RTC  oscillator  does  not  necessarily  stop  operation (i.e.  the  RTC  counting  does  not  necessarily stop)  when V_BCKP voltage  value drops below the specified operating range  minimum limit  (1.00 V): the  RTC value read after a system restart could be not reliable as explained in the following Table 7.  V_BCKP voltage value RTC value reliability Notes 1.00 V < V_BCKP < 2.40 V RTC oscillator does not stop operation RTC value read after a restart of the system is reliable V_BCKP within operating range 0.05 V < V_BCKP < 1.00 V RTC oscillator does not necessarily stop operation RTC value read after a restart of the system is not reliable V_BCKP below operating range 0.00 V < V_BCKP < 0.05 V RTC oscillator stops operation RTC value read after a restart of the system is reliable V_BCKP below operating range Table 7: RTC value reliability as function of V_BCKP voltage value   Consider  that  the  module  cannot  switch  on  if  a  valid  voltage  is  not  present  on  VCC  even  when  the  RTC  is supplied through V_BCKP (meaning that VCC is mandatory to switch on the module). The RTC has very low power consumption, but is highly temperature dependent. For example at 25 °C, with the V_BCKP voltage equal to the typical output value, the power consumption is approximately 2 µA (refer to the
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 24 of 145 “Input  characteristics  of  Supply/Power  pins”  table  in  the  SARA-G3  series Data  Sheet [1]  for  the  detailed specification), whereas at 70 °C and an equal voltage the power consumption increases to 5-10 µA. If V_BCKP is left unconnected and the module main voltage supply is removed from VCC, the RTC is supplied from  the  bypass  capacitor  mounted  inside  the  module.  However,  this  capacitor  is  not  able  to  provide  a  long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range (1 V min). This has no impact on wireless connectivity, as all the module functionalities do not rely on date and time setting.  1.5.3 Interfaces supply output (V_INT) The  same  1.8  V  voltage  domain  used  internally  to  supply  the  digital  interfaces  of  SARA-G3  modules  is  also available on the V_INT supply output pin, as described in Figure 10.  Baseband Processor51VCC52VCC53VCC4V_INTSwitchingStep-DownDigital I/O InterfacesPower ManagementSARA-G3 series Figure 10: SARA-G3 series interfaces supply output (V_INT) simplified block diagram The  internal  regulator  that  generates  the  V_INT  supply  is  a  switching  step-down  converter  that  is  directly supplied from VCC. The voltage regulator output is set to 1.8 V (typical) when the module is switched on and it is disabled when the module is switched off. The switching regulator operates in Pulse Width Modulation (PWM)  for greater efficiency at high output loads when  the  module  is  in  active-mode  or  in  connected-mode.  When  the  module  is  in  low  power  idle-mode between  paging  periods  and  with  power  saving  configuration  enabled  by  the  appropriate  AT  command,  it automatically switches to Pulse Frequency Modulation (PFM) for greater efficiency at low output loads. Refer to the u-blox AT Commands Manual [2], +UPSV command.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 25 of 145 1.6 System function interfaces 1.6.1 Module power-on The power-on sequence of SARA-G3 series modules is initiated in one of these ways:  Rising edge on the VCC pin to a valid voltage as module supply (i.e. applying module supply)  Low level on the PWR_ON pin (normally high with external pull-up) for an appropriate time period  RTC alarm (i.e. pre-programmed scheduled time by AT+CALA command)  1.6.1.1 Rising edge on VCC When a SARA-G3 module is in the not-powered mode, it can be switched on by applying the VCC supply. The module is switched on when the voltage rises up to the VCC normal operating range minimum limit (3.35 V) starting from a voltage value lower than 2.25 V,  and with a proper voltage slope: the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 4 ms to switch on the module. When the VCC voltage is stabilized at its nominal value within the normal operating range, the module can be switched on by a low level on  PWR_ON pin (see section 1.6.1.2) or by RTC alarm (see section 1.6.1.3). If  the  PWR_ON  input  pin  is  held  low  during  the  VCC  apply  phase,  the  SARA-G3  module  switches  on  when voltage rises up to the VCC normal operating range minimum limit (3.35 V). 1.6.1.2 Low level on PWR_ON When a  SARA-G3 module is  in  the  power-off  mode  (i.e.  switched  off  with valid  VCC  supply maintained),  the module can be switched on by forcing a low level on the PWR_ON input pin at least for 5 ms. The  electrical  characteristics  of  the  PWR_ON  input  pin  are  different  from  the  other  digital  I/O  interfaces.  The input  voltage  thresholds  are  slightly  different  since  the  PWR_ON  input  pin  is  tolerant  of  voltages  up  to  the module supply level. The detailed electrical characteristics are described in SARA-G3 series Data Sheet [1]. There is no internal pull-up resistor on the PWR_ON pin: the pin has high input impedance and is weakly pulled to the high level by the internal circuit.  Therefore the external circuit must be able to hold the high logic level stable, e.g. providing an external pull-up resistor (for further design-in guidelines refer to chapter 2.2.1). 1.6.1.3 RTC alarm When a SARA-G3 module is in the power-off mode (i.e. switched off with valid VCC supply maintained) and the RTC  timing  (32  kHz  reference  clock)  is  available,  the  module  can  be  switched  on  by  an  RTC  alarm  previously programmed  by  AT  command  at  a  scheduled  time  (refer  to  the  u-blox  AT  Commands  Manual  [2],  AT+CALA command). The internal RTC block system will then initiate the module boot sequence by instructing the Power Management  Unit  to  turn  on  power.  Also  included  in  this  setup  is  an  interrupt  signal  from  the  RTC  block  to indicate to the baseband processor that an RTC event has occurred. The RTC timing is  generated  by the 32 kHz reference  clock  provided  by the  internal oscillator  on SARA-G350 modules.  A  valid  32 kHz  external  signal  must  be  provided  at  the  EXT32K  input  pin  of  the  SARA-G300  and SARA-G310 modules to enable RTC timing, otherwise the switch-on of SARA-G300 and SARA-G310 modules by means of a pre-programmed RTC alarm is not possible (refer to the chapter 1.6.4). 1.6.1.4 Additional considerations The  module  is  switched  on  when  the  VCC  voltage  rises  to  the  normal  operating  range  (i.e.  applying  module supply): the first time that the module is used, it is switched on in this way. SARA-G3 modules can be switched off by means of the  AT+CPWROFF command, entering power-off mode.  In this state, the digital input-output pads  of  the  baseband  chipset  (i.e.  all  the  digital  pins  of  the  module)  are  locked  in  tri-state  (i.e.  floating).  The power down tri-state function isolates the module pins from the environment, when no proper operation of the outputs can be guaranteed.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 26 of 145 The module can be switched on from power-off mode by forcing a proper start-up event (e.g. PWR_ON low). After the detection of a start-up event, all the module digital pins are held in tri-state until all the internal LDO voltage regulators are turned on in a defined power-on sequence. Then, as described in Figure 11, the baseband core is still held in reset state for a time interval: the internal reset signal (which is not available on a module pin) is still low and all the digital pins of the module are held in reset state. The reset state of all the digital pins is reported in the pin description table of SARA-G3 Series Data Sheet [1]. When the internal signal is released, the configuration of the module interfaces starts: during this phase any digital pin is set in a proper sequence from the  reset  state  to  the  default  operational configuration.  Finally, the  module  is  fully  ready  to  operate  when  all interfaces are configured. VCCV_BCKPPWR_ONV_INTInternal ResetSystem StateBB Pads StateInternal Reset → Operational OperationalTristate / Floating Internal ResetOFFONStart-up eventPWR_ON can be set highStart of interface configurationAll interfaces are configured0 ms5 ms~35 ms~3 s8 ms Figure 11: SARA-G3 series power-on sequence description  The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the start of the SARA-G3 series power-on sequence.  1.6.2 Module power-off The correct way to switch off SARA-G3 modules is by means of +CPWROFF AT command (more details in u-blox AT Commands Manual [2]):  in  this  way the  current  parameter  settings are  saved  in  the  module’s  non-volatile memory and a proper network detach is performed. An under-voltage shutdown occurs on SARA-G3 modules when the VCC supply is removed, but in this case the current  parameter  settings  are  not  saved  in  the  module’s  non-volatile  memory  and  a  proper  network  detach cannot be performed. An  over-temperature  or  an  under-temperature  shutdown  occurs  when  the  temperature  measured  within  the wireless module reaches the dangerous area, if the optional Smart Temperature Supervisor feature is activated and configured by the dedicated AT+USTS command. Refer to chapter 1.13.8 and to the u-blox AT Commands Manual [2] for more details. Figure 12 describes the power-off sequence by means of +CPWROFF AT command. When the +CPWROFF AT command is sent, the module starts the switch-off routine replying OK on the AT interface. At the end of the switch-off routine, all digital pins are locked in tri-state by the module and all the internal LDO voltage regulators except  the  RTC  supply  (V_BCKP)  are  turned  off  in  a  defined  power-off  sequence.  The  module  remains  in power-off mode as long as a switch on event does not occur (i.e. applying a low level on the PWR_ON pin, or by a pre-programmed RTC alarm), and enters not-powered mode if the supply is removed from the VCC pin. Current parameter settings are stored to the module’s non-volatile memory and a network detach is performed before the OK reply from AT+CPWROFF command.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 27 of 145 The duration of the switch-off routine phases can largely differ from the values reported in Figure 12, depending on the network settings and the concurrent activities of the module performing a network detach.  VCCV_BCKPPWR_ONV_INTInternal ResetSystem StateBB Pads State OperationalOFFTristate / Floating ONOperational → Tristate / FloatingAT+CPWROFFsent to the module0 s~2.5 s~5 sOKreplied by the module Figure 12: SARA-G3 series power-off sequence description   The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the end of the SARA-G3 series power-off sequence.  1.6.3 Module reset A SARA-G3 module reset can be performed in one of two ways. RESET_N input pin: Forces a low level on the RESET_N input pin, causing an “external” or “hardware” reset. This must be for at least 50 ms on SARA-G350 modules or 3000 ms on SARA-G300 and SARA-G310 modules. This  causes  an  asynchronous  reset  of  the  module  baseband  processor,  excluding  the  integrated  Power Management Unit and the RTC internal block: the V_INT interfaces supply is enabled and each digital pin is set in its reset state, the V_BCKP supply and the RTC block are enabled. Forcing an “external” or “hardware” reset, the current parameter settings are not saved in the module’s non-volatile memory and a proper network detach is not performed. AT+CFUN command (refer to the u-blox AT Commands Manual [2] for more details): This command causes an “internal” or “software” reset, which is an asynchronous reset of the module baseband processor. The electrical behavior is the same as that of the “external” or “hardware” reset, but in an “internal” or “software” reset the current  parameter  settings  are  saved  in  the  module’s  non-volatile  memory  and  a  proper  network  detach  is performed. After either reset, when RESET_N is released from the low level, the module automatically starts its power-on sequence from the reset state.   The reset state of all digital pins is reported in the pin description table in SARA-G3 series Data Sheet [1].  The electrical characteristics of RESET_N are different from the other digital I/O interfaces: the RESET_N input pin is tolerant  of  voltages up to the  module supply level due to the  series  Schottky diode  mounted inside  the module on the RESET_N pin. As described in Figure 13, the module has an internal pull-up resistor which pulls the line to the high  logic level  when the  RESET_N  pin  is  not forced low  from the  external. Detailed  electrical characteristics are described in SARA-G3 series Data Sheet [1].
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 28 of 145  Baseband Processor18RESET_N Reset InputSARA-G3 series10k1.8 V Figure 13: SARA-G3 series reset input (RESET_N) description  1.6.4 External 32 kHz signal input (EXT32K) The external 32 kHz signal input pin (EXT32K) is available on SARA-G300 and SARA-G310 modules to provide the 32 kHz reference clock for the Real Time Clock (RTC) timing, used by the module processor when in the low power idle-mode. Only if a valid 32 kHz external signal is provided at the EXT32K input pin, SARA-G300 and SARA-G310 modules can enter the low power idle-mode (with power saving configuration enabled by the AT+UPSV command) and can provide the RTC functions (as RTC timing by AT+CCLK command and RTC alarm by AT+CALA command). The detailed electrical characteristics are described in SARA-G3 series Data Sheet [1]. The 32 kHz reference clock for the RTC timing is automatically generated by the internal oscillator  provided on the SARA-G350 modules: the same pin (31) is a reserved (RSVD) pin internally not connected, since an external 32 kHz signal is not needed to enter the low power idle-mode and to provide the RTC functions.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 29 of 145 1.7 Antenna interface 1.7.1 Antenna RF interface (ANT) The  ANT  pin  of  SARA-G3  modules  represents  the  RF  input/output  for  transmission  and  reception  of  the GSM/GPRS RF signal. The ANT pin has a nominal characteristic impedance of 50   and must be connected to the antenna through a 50  transmission line to allow proper RF transmission and reception in operating bands.  1.7.1.1 Antenna RF interface requirements Table 8 summarizes the requirements for the antenna RF interface (ANT). Refer to section 2.3.1 for suggestions to properly design an antenna circuit compliant to these requirements.   The antenna circuit affects the RF compliance of the device integrating SARA-G3 series module with  applicable  required  certification  schemes.  Compliance  is  guaranteed  if  the  antenna  RF interface (ANT) requirements summarized in Table 8 are fulfilled.  Item Requirements Remarks Impedance 50  nominal characteristic impedance The impedance of the antenna RF connection must match the 50  impedance of the ANT pin. Frequency Range SARA-G350, SARA-G310:  824..960 MHz (GSM 850, GSM 900)  1710..1990 MHz (GSM 1800, GSM 1900) SARA-G300:  880..960 MHz (GSM 900)  1710..1880 MHz (GSM 1800) The required frequency range of the antenna depends on the operating bands of the used SARA-G3 module and the used Mobile Network. V.S.W.R Return Loss < 2:1 recommended, < 3:1 acceptable S11 < -10 dB recommended, S11 < -6 dB acceptable The impedance of the antenna termination must match as much as possible the 50  impedance of the ANT pin over the operating frequency range. Input Power > 2 W peak The antenna termination must withstand the maximum peak of power transmitted by SARA-G3 modules during a GSM single-slot call. Gain Below the levels reported in the chapter 4.2.2 The antenna gain must not exceed the herein specified value to comply with FCC radiation exposure limits. Detection Application board with antenna detection circuit If antenna detection is required by the custom application, proper antenna detection circuit must be implemented on the application board as described in section 2.3.2.  Antenna assembly with built-in diagnostic circuit If antenna detection is required by the custom application, the external antenna assembly must be provided with proper diagnostic circuit as described in section 2.3.2. Table 8: Summary of antenna RF interface (ANT) requirements
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 30 of 145 1.7.1 Antenna detection interface (ANT_DET)   SARA-G300 and SARA-G310 modules do not support antenna detection interface (ANT_DET).  The  antenna  detection  is  based  on  ADC  measurement.  The  ANT_DET  pin  is  an  Analog  to  Digital  Converter (ADC) provided to sense the antenna presence. The antenna detection function provided by ANT_DET pin is an optional feature that can be implemented if the application requires  it.  The  antenna  detection is  forced  by  the  +UANTR  AT command.  Refer  to  the  u-blox  AT Commands Manual [2] for more details on this feature. The  ANT_DET  pin  generates  a  DC  current  (20  µA  for  5.4  ms)  and  measures  the  resulting  DC  voltage,  thus determining  the  resistance  from  the  antenna  connector  provided  on  the  application  board  to  GND.  So,  the requirements to achieve antenna detection functionality are the following:  an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used  an antenna detection circuit must be implemented on the application board Refer to the section 2.3.2 for antenna detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines.  1.8 SIM interface 1.8.1 SIM card interface SARA-G3 modules provide high-speed SIM/ME interface including automatic detection and configuration of the voltage required by the connected SIM card or chip. Both 1.8  V  and  3  V  SIM types are  supported:  activation  and  deactivation with  automatic voltage  switch from 1.8 V to 3 V is implemented, according to ISO-IEC 7816-3 specifications. The VSIM supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. The SIM driver supports the PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM Card. SIM Application Toolkit (R99) is supported only by SARA-G350 modules.  1.8.2 SIM card detection interface (SIM_DET) The SIM_DET pin is configured as an external interrupt to detect the SIM card mechanical / physical presence. The pin is configured as input with an internal active pull-down enabled, and it can sense SIM card presence only if properly connected to the mechanical switch of a SIM card holder as described in the chapter 2.4:  Low logic level at SIM_DET input pin is recognized as SIM card not present  High logic level at SIM_DET input pin is recognized as SIM card present The SIM card detection function provided by SIM_DET pin is an optional feature that can be implemented / used or not according to the application requirements. For more details on SIM detection function refer to the u-blox AT Commands Manual [2], “simind” value of the <descr> parameter of the +CIND and +CMER commands.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 31 of 145 1.9 Serial interfaces SARA-G3 series modules provide the following serial communication interfaces:  UART interface: 9-wire unbalanced 1.8 V asynchronous serial interface available for AT commands interface, Packet-Switched / Circuit-Switched Data communication, FW upgrades by means of the FOAT feature  Auxiliary  UART  interface:  3-wire  unbalanced  1.8  V  asynchronous  serial  interface  available only  for  the FW upgrade by means of the u-blox EasyFlash tool and for the Trace log capture (debug purpose)  DDC interface: I2C compatible 1.8 V interface available only for the communication with u-blox positioning chips and modules  1.9.1 Asynchronous serial interface (UART) 1.9.1.1 UART features The UART interface is a 9-wire 1.8 V unbalanced asynchronous serial interface, and it is the only serial interface of  the  SARA-G3  modules  available  for  an  AT  command  interface  and  for  Packet-Switched  /  Circuit-Switched Data communication. The  module  firmware  can  be  upgraded  over  the  UART  interface  by  means  of  the  Firmware  upgrade  over  AT (FOAT) feature only: for more details refer to section 1.13 and Firmware update application note [22]. UART  interface  provides  RS-232  functionality  conforming  to  the  ITU-T  V.24  Recommendation  (more  details available in ITU Recommendation [9]), with CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8 V for high data bit or OFF state. For detailed electrical characteristics refer to SARA-G3 series Data Sheet [1]. SARA-G3  modules  are  designed  to  operate  as  a  GSM/GPRS  wireless  modem,  which  represents  the  data circuit-terminating equipment (DCE) as described by the ITU-T V.24 Recommendation [9]. A customer application processor connected to the module through the UART interface represents the data terminal equipment (DTE).   The  signal  names  of  the  UART  interface  of  the  SARA-G3  modules  conform  to  the  ITU-T  V.24 Recommendation [9]: e.g. TXD line represents the data transmitted by the DTE (application processor data output) and received by the DCE (module input).  The UART interface is controlled and operated with:  AT commands according to 3GPP TS 27.007 [10]  AT commands according to 3GPP TS 27.005 [11]  AT commands according to 3GPP TS 27.010 [12]  u-blox AT commands   For  the  complete  list  of  supported  AT  commands  and  their  syntax  refer  to  the  u-blox  AT  Commands Manual [2].  All flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [2], &K, +IFC, \Q AT commands): hardware flow control (RTS/CTS), software flow control (XON/XOFF), or none flow control.   Hardware flow control is enabled by default.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 32 of 145 The following baud rates can be configured by AT command:  2400 b/s  4800 b/s  9600 b/s  19200 b/s  38400 b/s  57600 b/s  115200 b/s, default value when the autobauding is disabled The following baud rates are available with autobauding only:  1200 b/s  230400 b/s   Autobauding is enabled by default.  The following frame formats can be configured by AT command:  8N1 (8 data bits, No parity, 1 stop bit), default frame configuration with fixed baud rate  8E1 (8 data bits, even parity, 1 stop bit)  8O1 (8 data bits, odd parity, 1 stop bit)  8N2 (8 data bits, No parity, 2 stop bits)  7E1 (7 data bits, even parity, 1 stop bit)  7O1 (7 data bits, odd parity, 1 stop bit)   Automatic frame recognition is supported and enabled by default in conjunction with the auto-bauding. When auto-bauding is active, the auto-framing is enabled overruling the frame format setting.  Figure 14 describes the 8N1 frame format, which is the default configuration with fixed baud rate. D0 D1 D2 D3 D4 D5 D6 D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer, 8N1 Figure 14: Description of UART default frame format (8N1) with fixed baud rate
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 33 of 145 1.9.1.2 UART AT interface configuration The  UART  interface  is  the  only  AT  command  interface  on  SARA-G3  series  modules.  UART  is  configured  as described in Table 9 (for information about further settings, refer to the u-blox AT Commands Manual [2]).  Interface AT Settings Comments UART interface AT interface: enabled AT command interface is enabled by default on the UART physical interface AT+IPR=0 Automatic baud rate detection enabled by default AT+ICF=0 Automatic frame format recognition enabled by default AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode5 and set OFF in command mode5 AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command mode5 and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise MUX protocol: disabled Multiplexing mode is disabled by default and it can be enabled by AT+CMUX command. The following virtual channels are defined for SARA-G350 modules:  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GPS tunneling The following virtual channels are defined for SARA-G300 and SARA-G310 modules:  Channel 0: control channel  Channel 1 – 2: AT commands / data connection Table 9: Default UART AT interface configuration  1.9.1.3 UART signal behavior (AT commands interface case) At  the  module  switch-on,  before  the  UART  interface  initialization  (as  described  in  the  power-on  sequence reported in Figure 11), each pin is first tri-stated and then is set to its relative internal reset state.6 At the end of the  boot  sequence,  the  UART  interface  is  initialized,  the  module  is  by  default  in  active-mode,  and  the  UART interface is enabled. The  configuration  and  the  behavior  of  the  UART  signals  after  the  boot  sequence  are  described  below.  See section 1.4 for definition and description of module operating modes referred to in this section.  RXD signal behavior The module data output line (RXD) is set by default to OFF state (high level) at UART initialization. The module holds RXD in OFF state until the module does not transmit some data.  TXD signal behavior The module data input line (TXD) is set by default to OFF state (high level) at UART initialization. The TXD line is then  held  by  the  module  in  the  OFF state if  the  line  is  not activated  by the  DTE:  an  active  pull-up  is  enabled inside the module on the TXD input.                                                        5 Refer to the u-blox AT Commands Manual [2] for the definition of the interface data mode, command mode and online command mode. 6 See the pin description table in the SARA-G3 series Data Sheet [1].
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 34 of 145 CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the hardware flow control is enabled (for more details, refer to u-blox AT Commands Manual [2], AT&K, AT\Q, AT+IFC  AT  command)  the  CTS  line  indicates  when  the  UART  interface  is  enabled  (data  can  be  sent  and received): the module drives the CTS line to the ON state or to the OFF state when it is either able or not able to accept data from the DTE (refer to chapter 1.9.1.4 for the complete description). If the hardware flow control is not enabled, the CTS line is always held in the ON state after UART initialization.  If hardware flow control is enabled, then when the CTS line is ON the UART is enabled and the module is in active-mode. If the CTS  line  is OFF  it does  not necessarily mean that the module is in idle-mode, but only that the UART is not enabled (the module could be forced to stay in active-mode for other activities, e.g. network related).  When the power saving configuration is enabled and the hardware flow-control is not implemented in the DTE/DCE connection, data sent by the DTE can be lost: the first character sent when the module is in idle-mode will not be a valid communication character (see chapter 1.9.1.4 for complete description).  When the multiplexer protocol is active, the CTS line state is mapped to FCon / FCoff MUX command for flow control  issues  outside  the  power saving  configuration while the  physical  CTS  line  is still used  as  a power state indicator. For more details, refer to Mux Implementation Application Note [20].  RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The module then holds the RTS line in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If  the  HW  flow  control  is  enabled  (for  more  details,  refer  to  u-blox  AT  Commands  Manual  [2]  AT&K,  AT\Q, AT+IFC  command  descriptions)  the  module  monitors  the  RTS  line  to  detect  permission from  the  DTE  to send data  to the  DTE  itself.  If  the  RTS  line  is  set  to  OFF  state,  any  on-going  data  transmission from the  module  is immediately interrupted or any subsequent transmission forbidden until the RTS line changes to ON state.   The DTE must still be able to accept a certain number of characters after the RTS line is set to OFF state: the module guarantees the transmission interruption within two characters from RTS state change.  If AT+UPSV=2 is set and HW flow control is disabled, the module monitors the RTS line to manage the power saving configuration:  When an OFF-to-ON transition occurs on the RTS input line, the UART is enabled and the module is forced to active-mode; after ~20 ms from the transition the switch is completed and data can be received without loss. The module cannot enter idle-mode and the UART is keep enabled as long as the RTS input line is held in the ON state  If the RTS input line is set to OFF state by the DTE, the UART is disabled (held in low power mode) and the module automatically enters idle-mode whenever possible For more details, refer to chapter 1.9.1.4 and u-blox AT Commands Manual [2], AT+UPSV command.  DSR signal behavior If AT&S0 is set, the DSR module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&S1 is set, the DSR module output line is set by default to OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode or in online command mode and is set  to  the  ON state  when  the module  is  in  data  mode  (refer  to  the  u-blox  AT Commands  Manual  [2]  for the definition of the interface data mode, command mode and online command mode).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 35 of 145 DTR signal behavior The  DTR  module  input  line  is  set  by  default  to  OFF  state  (high  level)  at  UART  initialization.  The  module  then holds the DTR line in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module  on  the  DTR  input.  Module  behavior  according  to  DTR  status  depends  on  the  AT  command configuration (see u-blox AT Commands Manual [2], &D AT command).  DCD signal behavior If AT&C0 is set, the DCD module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&C1 is set, the DCD module output line is set by default to OFF state (high level) at UART initialization. The module then sets the DCD line in accordance  with the carrier  detect status: ON  if the carrier is detected, OFF otherwise. For voice calls, DCD is set to the ON state when the call is established. For a data call there are the following scenarios (refer to the u-blox AT Commands Manual [2] for the definition of the interface data mode, command mode and online command mode):   Packet  Switched  Data  call:  Before  activating  the  PPP  protocol  (data  mode)  a  dial-up  application  must provide the ATD*99***<context_number># to the module: with this command the module switches from command mode to data mode and can accept PPP packets. The module sets the DCD line to the ON state, then answers with a CONNECT to confirm the ATD*99 command. The DCD ON is not related to the context activation but with the data mode  Circuit Switched Data call: To establish a data call, the DTE can send the ATD<number> command to the module  which  sets  an  outgoing  data  call  to  a  remote  modem  (or  another  data  module).  Data  can  be transparent (non reliable) or non transparent (with the reliable RLP protocol). When the remote DCE accepts the  data  call,  the  module  DCD  line  is  set  to  ON  and  the  CONNECT  <communication  baudrate>  string  is returned  by  the  module.  At  this  stage  the  DTE  can  send  characters  through  the  serial  line  to  the  data module which sends them through the network to the remote DCE attached to a remote DTE   DCD  is  set  to  ON  during  the  execution  of  the  +CMGS,  +CMGW,  +USOWR,  +USODL  AT  commands requiring input data from the DTE: the DCD  line  is set to ON state as soon as the switch to binary/text input mode is completed and the prompt is issued; DCD line is set to OFF as soon as the input mode is interrupted or completed (for more details refer to the u-blox AT Commands Manual [2]).   DCD line is kept to ON state even during the online command mode to indicate that the data call is still established even if suspended, while if the module enters command mode DSR line is set to OFF state. For more details refer to DSR signal behavior description.   For scenarios when the DCD line setting is requested for different reasons (e.g. SMS texting during online command  mode),  the  DCD  line  changes  to  guarantee  the  correct  behavior  for  all  the  scenarios.  For instance, in case of SMS texting in online command mode, if the data call is released, the DCD line is kept to ON till the SMS command execution is completed (even if the data call release would request the DCD setting to OFF).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 36 of 145 RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization. Then, during an incoming call, the RI line is switched from OFF state to ON state with a 4:1 duty cycle and a 5 s period (ON for 1 s,  OFF  for  4  s,  see  Figure  15),  until  the  DTE  attached  to  the  module  sends  the  ATA  string  and  the  module accepts  the  incoming  data  call. The  RING  string  sent  by the  module  (DCE) to  the  serial  port  at  constant  time intervals is not correlated with the switch of the RI line to the ON state.  Figure 15: RI behavior during an incoming call The RI line can notify an SMS arrival. When the SMS arrives, the  RI line switches from OFF to ON for 1 s (see Figure 16), if the feature is enabled by the proper AT command (refer to the u-blox AT Commands Manual [2], AT+CNMI command).  Figure 16: RI behavior at SMS arrival This behavior allows the DTE to stay in power saving mode until the DCE related event requests service. For SMS arrival, if several events coincidently occur or in quick succession each event independently triggers the RI line, although the line will not be deactivated between each event. As a result, the RI line may stay to ON for more than 1 s. If an incoming call is answered within less than 1 s (with ATA or if auto-answering is set to ATS0=1) than the RI line is set to OFF earlier. As a result:  RI line monitoring cannot be used by the DTE to determine the number of received SMSes.  For multiple events (incoming call plus SMS received), the RI line cannot be used to discriminate the two events,  but  the  DTE  must  rely  on  the  subsequent  URCs  and  interrogate  the  DCE  with  the  proper commands.  SMS arrives time [s] 0 RI ON RI OFF 1s SMS  time [s] 0 RI ON RI OFF 1s 1stime [s]151050RI ONRI OFFCall incomes1stime [s]151050RI ONRI OFFCall incomes
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 37 of 145 1.9.1.4 UART and power-saving  The power saving configuration is controlled by the AT+UPSV command (for the complete description, refer to u-blox AT Commands Manual [2]). When power saving is enabled, the module automatically enters low power idle-mode whenever possible, and otherwise the active-mode is maintained by the module (see section  1.4 for definition and description of module operating modes referred to in this section). The AT+UPSV command configures both the module power saving and also the UART behavior in relation to the power  saving.  The  conditions  for  the  module  entering  idle-mode  also  depend  on  the  UART  power  saving configuration.  Three different power saving configurations can be set by the AT+UPSV command:  AT+UPSV=0, power saving disabled: module forced on active-mode and UART interface enabled (default)  AT+UPSV=1, power saving enabled: module cyclic active / idle-mode and UART enabled / disabled  AT+UPSV=2, power saving enabled and controlled by the UART RTS input line  The different power saving configurations that can be set by the +UPSV AT command are described in details in the  following  subchapters.  Table  10  summarizes  the  UART  interface  communication  process  in  the  different power  saving  configurations,  in  relation  with  HW  flow  control  settings  and  RTS  input  line  status.  For  more details on the +UPSV AT command description, refer to u-blox AT commands Manual [2].  AT+UPSV HW flow control RTS line Communication during idle-mode and wake up  0 Enabled (AT&K3) ON Data sent by the DTE is correctly received by the module. 0 Enabled (AT&K3) OFF Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line is ON). 0 Disabled (AT&K0) ON Data sent by the DTE is correctly received by the module. 0 Disabled (AT&K0) OFF Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 1 Enabled (AT&K3) ON Data sent by the DTE is buffered by the DTE and will be correctly received by the module when active-mode is entered. 1 Enabled (AT&K3) OFF Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 1 Disabled (AT&K0) ON The first character sent by the DTE is lost, but it wakes up the UART (if disabled) and the module (if in idle-mode) after ~20 ms. Recognition of subsequent characters is guaranteed only after the complete wake-up of the UART and the module (i.e. after ~20 ms). 1 Disabled (AT&K0) OFF Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 2 Enabled (AT&K3) ON Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Enabled (AT&K3) OFF Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Disabled (AT&K0) ON Data sent by the DTE is correctly received by the module. 2 Disabled (AT&K0) OFF The first character sent by the DTE is lost, but it wakes up the UART (if disabled) and the module (if in idle-mode) after ~20 ms. Recognition of subsequent characters is guaranteed only after the complete wake-up of the UART and the module (i.e. after ~20 ms). Table 10: UART and power-saving summary  AT+UPSV=0: power saving disabled, fixed active-mode The module does not enter idle-mode and the UART interface is enabled (data can be sent and received): the CTS line is always held in the ON state after UART initialization. This is the default configuration.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 38 of 145 AT+UPSV=1: power saving enabled, cyclic idle/active-mode The module automatically enters idle-mode whenever possible and, if the module is registered with network, it periodically wakes up from idle-mode to active-mode for at least ~11 ms to monitor the paging channel of the current base station (paging block reception), according to the GSM discontinuous reception (DRX) specification. The idle-mode period depends on the time period between two paging receptions defined by the current base station  (i.e.  by  the  network):  the  paging  reception  period  can  vary  from  ~0.47  s  (DRX = 2,  i.e.  2  x  51  GSM frames) up to ~2.12 s (DRX = 9, i.e. 9 x 51 GSM frames) When the module wakes up to active-mode for the paging block receptions, the UART interface is enabled for at least ~11 ms  concurrently to each paging reception and then, as data has not  been received or  sent  over the UART, the interface is disabled until the next paging reception. During a call, the UART interface is kept enabled, regardless of the AT+UPSV setting.  If the module is not registered with a network, the cyclic idle/active-mode configuration is present as well: the module automatically enters idle-mode whenever possible and  periodically wakes up to active-mode to enable the UART for at least ~11 ms and then, as data has not been received or sent over the UART, the interface is disabled for a defined period (according to the latest DRX setting) and afterwards the UART is enabled again. When  UART  interface  is  disabled,  data  transmitted  by  the  DTE  is  lost  if  hardware  flow  control  is  disabled.  If hardware  flow  control is  enabled, data is  buffered  by  the DTE and will be correctly received  by  the  module when UART interface is enabled again. When UART interface is enabled, data can be received. When a character is received, it forces the UART interface to stay enabled for a longer time and it forces the module to stay in the active-mode for a longer time.  The module active-mode duration depends on:  The time period for the paging block reception, which is set by the current base station: ~11 ms minimum  The time period where the UART interface is enabled, when the module is not registered with a network: ~11 ms minimum of in absence of data reception by serial interface  The time period from the last data received at the serial port during the active-mode: the module does not enter idle-mode until a timeout expires. The second parameter of the +UPSV AT command configures this timeout, from 40 GSM TDMA frames (i.e. 40 x 4.615 ms = ~184 ms) up to 65000 GSM TDMA frames (i.e. 65000 x 4.615 ms = 300 s). Default value is 2000 GSM frames (i.e. 2000 x 4.615 ms = ~9.2 s) The active-mode duration can be extended indefinitely since every subsequent character received during the active-mode, resets and restarts the timer.  If HW flow control is enabled, the hardware flow-control output (CTS line) indicates when the UART interface is enabled (data can be sent and received) as illustrated in Figure 17.  time [s]CTS ONCTS OFFUART disabled~10 ms (min)UART enabled~9.2 s (default)UART enabledData input0.47- 2.10 s Figure 17: CTS behavior with power saving enabled (AT+UPSV=1) and HW flow control enabled: the CTS output line indicates when the UART interface of the module is enabled (CTS = ON = low level) or disabled (CTS = OFF = high level)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 39 of 145 AT+UPSV=2: power saving enabled and controlled by the RTS line This configuration can only be enabled with the module HW flow control disabled (AT&K0). The UART interface is immediately disabled after the DTE sets the RTS line to OFF. Then, if a voice or data call is not enabled, the module automatically enters idle-mode whenever possible according to any other activity, and periodically wakes up from idle-mode to active-mode to monitor the paging channel of the current base station (paging block reception). Instead, the UART is disabled as long as the RTS line is set to OFF, also when the module is in active-mode, to reduce power consumption. The UART is enabled in the following cases:  During a call, the UART interface is kept enabled, regardless of the RTS line setting  If the module must transmit some data over the UART (e.g. URC), the interface is temporarily enabled even if the RTS line is set to OFF by the DTE  If the module receives a  data over the UART, it causes the  system wake-up: this is the “wake up via data reception” feature described in the following subsection When the DTE sets the RTS line to OFF, the timeout to enter idle-mode from the last data received at the serial port  during  the  active-mode  is  the  one  previously  set  with  the  AT+UPSV=1  configuration  or  it  is  the  default value.  If  the  RTS  line  is  set  to  ON  by  the  DTE  the  module  is  not  allowed  to  enter  idle-mode  and  the  UART  is  kept enabled until the RTS line is set to OFF. When an OFF-to-ON transition occurs on the RTS input line, the UART is re-enabled and the module, if it was in idle-mode, switches from idle to active-mode after ~20 ms: this is the UART and module “wake up time”.   Even  if  HW  flow  control  is  disabled,  if  the  DTE  sets  the  RTS  line  to  OFF,  the  module  sets the CTS  line accordingly to its power saving configuration as illustrated in Figure 17, like for the AT+UPSV=1 case with HW flow control enabled.  Wake up via data reception If the DTE transmits data when the UART is disabled (when power saving is configured), it is lost (not correctly received by the module) in the following cases:  +UPSV=1 with hardware flow control disabled  +UPSV=2 with hardware flow control disabled and RTS line set to OFF When the module is in idle-mode, the TXD input line of the module is always configured to wake up the UART and the module  via data reception: when a low-to-high transition occurs on the  TXD input line, it causes  the system wake-up. The UART is enabled and the module switches from idle-mode to active-mode within ~20 ms from the first data reception: this is the system “wake up time”. As a consequence, the first character sent by the DTE when UART is disabled (i.e. the wake up character)  is not a valid communication character because it cannot be recognized, and the recognition of the subsequent characters is guaranteed only after the complete system wake-up (i.e. after ~20 ms).  Figure 18 and Figure 19 show an example of common scenarios and timing constraints:  AT+UPSV=2 power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames due to the timeout previously set by AT+UPSV=1,2000 as the default case  Hardware flow control disabled on the DCE (as required to enable the AT+UPSV=2 configuration) and RTS line set to  OFF  by the  DTE:  in  this case  the CTS  line  is set  by the  module  accordingly to  its power saving configuration as illustrated in Figure 17, like for the AT+UPSV=1 case with HW flow control enabled
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 40 of 145 Figure 18 shows the case where the DCE UART is disabled and only a wake-up is forced. In this scenario the only character  sent  by  the  DTE  is  the  wake-up  character;  as  a  consequence,  the  DCE  UART  is  disabled  when  the timeout from last data received expires (2000 frames without data reception, as the default case). CTS OFFCTS ONDCE UART is enabled for 2000 GSM frames (~9.2 s)time Wake up time: ~20 mstime TxD module inputWake up character        Not recognized by DCE Figure 18: Wake-up via data reception without further communication Figure  19  shows  the  case  where  in  addition  to  the  wake-up  character  further  (valid)  characters  are  sent.  The wake  up character wakes-up the  DCE  UART.  The other  characters must  be  sent  after  the  “wake  up time”  of ~20 ms. If this condition is satisfied, the DCE recognizes characters. The DCE is allowed to disable the UART and re-enters idle-mode after 2000 GSM frames from the latest data reception. CTS OFFCTS ONDCE UART is enabled for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: ~20 mstime TxD module inputWake up character        Not recognized by DCEValid characters          Recognized by DCE Figure 19: Wake-up via data reception with further communication  The “wake-up via data reception” feature cannot be disabled.  In command mode7, if autobauding is enabled and the DTE does not implement HW flow control, the DTE must  always  send  a  character  to  the  module  before  the  “AT”  prefix  set  at  the  beginning  of  each command line: the first character is ignored if the module is in active-mode, or it represents the wake-up character if the module is in idle-mode.                                                       7 Refer to the u-blox AT Commands Manual [2] for the definition of the interface data mode, command mode and online command mode.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 41 of 145  In command mode7,  if autobauding  is disabled, the  DTE must always send a dummy  “AT”  before  each command line: the first character  is not ignored if the module is in active-mode (i.e. the module  replies “OK”),  or  it  represents  the  wake  up  character  if  the  module  is  in  idle-mode  (i.e.  the  module  does  not reply).  No  wake-up  character  or  dummy  “AT”  is  required  from  the  DTE  during  a  voice  or  data  call  since  the module UART interface continues to be enabled and does not need to be woken-up. Furthermore in data mode7 a dummy “AT” would affect the data communication.  1.9.1.5 Multiplexer protocol (3GPP 27.010) SARA-G3  modules  have  a  software  layer  with  MUX  functionality,  3GPP  TS  27.010  Multiplexer  Protocol  [12], available on the  UART  physical  link.  The auxiliary  UART  and the DDC (I2C) serial interfaces do not support  the multiplexer protocol. This  is  a  data  link  protocol  (layer  2  of  OSI  model)  which  uses  HDLC-like  framing  and  operates  between  the module (DCE) and the application processor (DTE) and allows a number of simultaneous sessions over the used physical  link  (UART  or  SPI):  the  user  can  concurrently  use  AT  command  interface  on  one  MUX  channel  and Packet-Switched / Circuit-Switched Data communication on another multiplexer channel. Each session consists of a stream of bytes transferring various kinds of data such as SMS, CBS, PSD, GPS, AT commands in general. This permits, for example, SMS to be transferred to the DTE when a data connection is in progress. The following virtual channels are defined for SARA-G350 modules:  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GPS tunneling The following virtual channels are defined for SARA-G300 and SARA-G310 modules:  Channel 0: control channel  Channel 1 – 2: AT commands / data connection For more details, refer to Mux implementation Application Note [20].  1.9.2 Auxiliary asynchronous serial interface (UART AUX) The auxiliary UART interface is a 3-wire unbalanced 1.8 V asynchronous serial interface (only the RXD_AUX data output and TXD_AUX  data input are provided), available for  SARA-G3 modules FW upgrade by means of the u-blox EasyFlash tool and for Trace log capture (debug purpose). The AT commands interface is not available on the auxiliary UART interface.  1.9.3 DDC (I2C) interface   SARA-G300 and SARA-G310 modules do not support DDC (I2C) interface.  An I2C bus compatible Display Data Channel (DDC) interface for communication with u-blox GPS/GNSS receivers is  available  on  SDA  and  SCL  pins  of  SARA-G350  modules.  Only  this  interface  provides  the  communication between the u-blox wireless module and u-blox positioning chips and modules. The AT commands interface is not available on the DDC (I2C) interface. DDC (I2C) slave-mode operation is not supported: the SARA-G350 wireless module can act as master only, and the connected u-blox GPS/GNSS receiver automatically acts as slave in the DDC (I2C) communication.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 42 of 145 Two lines, serial data (SDA) and serial clock (SCL), carry information on the bus. SCL is used to synchronize data transfers, and SDA is the data line. To be compliant to the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors must be used conforming to the I2C bus specifications [13].  u-blox has implemented special features in SARA-G350 wireless modules to ease the design effort required for the integration of a u-blox wireless module with a u blox GPS/GNSS receiver. Combining a u-blox wireless module with a u-blox GPS/GNSS receiver allows designers to have full access to the positioning receiver directly via  the  wireless module: it relays  control messages to the  GPS/GNSS  receiver  via  a dedicated  DDC  (I2C)  interface.  A  2nd  interface  connected  to  the  positioning  receiver  is  not  necessary:  AT commands via the UART serial interface of the wireless module allows a fully control of the  GPS/GNSS receiver from any host processor. SARA-G350  modules  feature  embedded  GPS  aiding  that  is  a  set  of  specific  features  developed  by  u-blox  to enhance GPS/GNSS performance, decreasing Time To First Fix (TTFF), thus allowing to calculate the position in a shorter time with higher accuracy.  SARA-G350 modules support these GPS aiding types:  Local aiding  AssistNow Online  AssistNow Offline  AssistNow Autonomous The  embedded  GPS  aiding  features  can  be  used  only  if  the  DDC  (I2C)  interface  of  the  wireless  module  is connected to the u-blox GPS/GNSS receivers.  SARA-G350  wireless  modules  provide  additional  custom  functions  over  GPIO  pins  to  improve  the  integration with u-blox positioning chips and modules. GPIO pins can handle:  GPS/GNSS  receiver  power-on/off:  “GPS  supply  enable”  function  provided  by  GPIO2  improves  the positioning receiver power consumption. When the GPS/GNSS functionality is not required, the positioning receiver  can  be  completely  switched  off  by  the  wireless  module  that  is  controlled  by  the  application processor with AT commands  The wake up from idle-mode when the GPS/GNSS receiver is ready to send data: “GPS data ready” function provided by GPIO3 improves the wireless module power consumption. When power saving is enabled in the wireless module by the AT+UPSV command and the GPS/GNSS receiver does not send data by the DDC (I2C) interface,  the  module  automatically  enters  idle-mode whenever  possible.  With  the  “GPS  data  ready” function the GPS/GNSS receiver can indicate to the wireless module that it is ready to send data by the DDC (I2C) interface: the positioning receiver can wake up the wireless module if it is in idle-mode, so the wireless module does not lose the data sent by the GPS/GNSS receiver even if power saving is enabled  The RTC synchronization signal to the GPS/GNSS receiver: “GPS RTC sharing” function provided by GPIO4 improves  GPS/GNSS  receiver  performance,  decreasing  the  Time  To  First  Fix  (TTFF),  and  thus  allowing  to calculate the position in a shorter time with higher accuracy. When GPS local aiding is enabled, the wireless module  automatically  uploads  data  such  as  position,  time,  ephemeris,  almanac,  health  and  ionospheric parameter from the positioning receiver into its local memory, and restores this to the GPS/GNSS receiver at the next power up of the positioning receiver   For more details regarding the handling of the DDC (I2C) interface, the GPS aiding features and the GPS related  functions  over  GPIOs,  refer  to  the  chapter  1.11,  to  the  u-blox  AT  Commands  Manual  [2] (AT+UGPS, AT+UGPRF, AT+UGPIOC AT commands) and the GPS Implementation Application Note [21].  “GPS data ready” and “GPS RTC sharing” functions are not supported by all u-blox GPS/GNSS receivers HW  or  ROM/FW  versions.  Refer  to  the  GPS  Implementation  Application  Note  [21]  or  to  the  Hardware Integration Manual of the u-blox GPS/GNSS receivers for the supported features.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 43 of 145 As additional improvement for the  GPS/GNSS receiver performance, the V_BCKP supply output of SARA-G350 modules can be connected to the V_BCKP backup supply input pin of u-blox positioning chips and modules to provide  the  supply  for  the  GPS/GNSS  real  time  clock  and  backup  RAM  when  the  VCC  supply  of  the  wireless module is within its operating range and the VCC supply of the GPS/GNSS receiver is disabled. This  enables  the  u-blox  positioning  receiver  to  recover  from  a  power  breakdown  with  either  a  hot  start  or  a warm start (depending on the duration of the GPS/GNSS receiver VCC outage) and to maintain the configuration settings saved in the backup RAM.  1.10 Audio interface   SARA-G300 and SARA-G310 modules do not support audio interface.  SARA-G350  modules provide  one  analog  audio  interface  and  one  digital  audio  interface  that  can  be  selected and set by the dedicated AT command +USPM (refer to u-blox AT Commands Manual [2]): this command allows setting the audio path mode, composed by the uplink audio path and the downlink audio path. Each  uplink  path  mode  defines  the  physical  input  (i.e.  the  analog  or  the  digital  audio  input)  and  the  set  of parameters to process the uplink audio signal (uplink gains, uplink digital filters, echo canceller parameters). For example  the  “Headset  microphone”  uplink  path  uses  the  differential  analog  audio  input  with  the  default parameters for the headset profile. Each downlink path mode defines the physical output (i.e. the analog or the digital audio output) and the set of parameters  to  process  the  downlink  audio  signal  (downlink  gains,  downlink  digital  filters  and  sidetone).  For example  the  “Mono  headset”  downlink  path  uses  the  differential  analog  audio  output  with  the  default parameters for the headset profile. The  set of  parameters to  process the  uplink  or  the  downlink  audio  signal  can  be  changed with dedicated  AT commands for each uplink or downlink path and then stored in two profiles in the non volatile memory (refer to u-blox AT Commands Manual [2] for Audio parameters tuning commands).  1.10.1 Analog audio interface 1.10.1.1 Uplink path SARA-G350 pins related to the analog audio uplink path are:  MIC_P  /  MIC_N:  Differential  analog  audio  signal  inputs  (positive/negative).  These  two  pins  are  internally directly connected to the differential input of an integrated Low Noise Amplifier, without any internal series capacitor  for  DC  blocking.  The  LNA  output  is  internally  connected  to  the  digital  processing  system  by  an integrated sigma-delta analog-to-digital converter  MIC_BIAS: Supply output for an external microphone. The pin is internally connected to the output of a low noise LDO linear regulator provided with proper internal bypass capacitor to guarantee stable operation of the linear regulator  MIC_GND: Local ground for the external microphone. The pin is internally connected to ground as a sense line as the reference for the analog audio input The  analog  audio  input  is  selected  when  the  parameter  <main_uplink>  in  AT+USPM  command  is  set  to “Headset  microphone”,  “Handset  microphone”  or  “Hands-free  microphone”:  the  uplink  analog  path  profiles use  the  same  physical  input  but  have  different  sets  of  audio  parameters  (for  more  details,  refer  to  u-blox  AT Commands Manual [2], AT+USPM, AT+UMGC, AT+UUBF, AT+UHFP commands). SARA-G3 series Data Sheet [1] provides the detailed electrical characteristics of the analog audio uplink path.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 44 of 145 1.10.1.2 Downlink path SARA-G350 pins related to the analog audio downlink path are:  SPK_P  /  SPK_N:  Differential  analog  audio  signal  output  (positive/negative).  These  two  pins  are  directly connected  internally  to  the  differential  output  of  a  low  power  audio  amplifier,  for  which  the  input  is connected internally to the digital processing system by to an integrated digital-to-analog converter. The  analog  audio  output  is  selected  when  the  parameter  <main_downlink>  in  AT+USPM  command  is  set  to “Normal  earpiece”,  “Mono  headset”  or  “Loudspeaker”:  the  downlink  analog  path  profiles  use  the  same physical output but have different sets of audio parameters (for more details, refer to the u-blox AT Commands Manual [2], AT+USPM, AT+USGC, AT+UDBF, AT+USTN commands). The differential analog audio output of SARA-G350 modules (SPK_P / SPK_N) is able to directly drive loads with resistance rating greater than 14 : it can be directly connected to a headset earpiece or handset earpiece but cannot directly drive a 8  or 4  loudspeaker for the hands-free mode. SARA-G3 series Data Sheet [1] provides the detailed electrical characteristics of the analog audio downlink path.   Warning: excessive sound pressure from headphones can cause hearing loss.  1.10.1.3 Headset mode Headset mode is the default audio operating mode of the modules. The headset profile is configured when the uplink audio path is set to “Headset microphone” and the downlink audio path is set to “Mono headset” (refer to u-blox AT Commands Manual [2]: AT+USPM command: <main_uplink>, <main_downlink> parameters). 1.10.1.4 Handset mode The handset profile is configured when the uplink audio path is set to “Handset microphone” and the downlink audio  path  is  set  to  “Normal  earpiece”  (refer  to  u-blox AT  commands  manual [2]:  AT+USPM  command: <main_uplink>, <main_downlink> parameters). 1.10.1.5 Hands-free mode The  hands-free  profile  is  configured  when  the  uplink  audio  path  is  set  to  “Hands-free  microphone”  and  the downlink audio path is set to “Loudspeaker” (refer to  u-blox AT commands manual [2]: AT+USPM command: <main_uplink>, <main_downlink> parameters). Hands-free  functionality  is  implemented  using  appropriate  digital  signal  processing  algorithms  for  voice-band handling  (echo  canceller  and  automatic  gain  control),  managed  via  software  (refer  to  u-blox AT  commands manual [2], AT+UHFP command).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 45 of 145 1.10.2 Digital audio interface  SARA-G350 modules provide one 4-wire I2S digital audio interface (1.8 V) that acts as an I2S master and can be used for digital audio communication with external digital audio devices that acts as I2S slave. Related pins are:  I2S_TXD data output  I2S_RXD data input  I2S_CLK clock output  I2S_WA world alignment output  The I2S interface can be set to two modes, by the <I2S_mode> parameter of the AT+UI2S command:  PCM mode  Normal I2S mode   SARA-G350 modules do not support I2S slave mode: module acts as master only.  The sample rate is fixed at 8 kHz only: it is not possible to configure the  sample rate of transmitted and received words of SARA-G350 modules.  The <main_uplink> and <main_downlink> parameters of the AT+USPM command must be properly configured to select the I2S digital audio interfaces paths (for more details, refer to u-blox AT Commands Manual [2]):  <main_uplink> must be properly set to select: o the I2S interface (using I2S_RXD module input)  <main_downlink> must be properly set to select: o the I2S interface (using I2S_TXD module output) Parameters  of  digital  path  can  be  configured  and  saved  as  the  normal  analog  paths,  using  appropriate  path parameter as described in the u-blox AT Commands Manual [2], +USGC, +UMGC, +USTN AT command. Analog gain parameters of microphone and speakers are not used when digital path is selected. The I2S receive data input and the I2S transmit data output signals are respectively connected in parallel to the analog microphone input and speaker output signals, so resources available for analog path can be shared:  Digital filters and digital gains are available in both uplink and downlink direction. The AT commands allow to properly configure them  Ringer tone and service tone are mixed on the TX path when active (downlink)  The HF algorithm acts on I2S path   Refer to the u-blox AT Commands Manual [2]: AT+UI2S command for possible settings of I2S interface.  1.10.2.1 I2S interface – PCM mode Main features of the I2S interface in PCM mode:  I2S runs in PCM – short alignment mode (configurable by AT commands)  I2S word alignment signal is configured to 8 kHz: this is the <sample_rate> parameter  I2S word alignment toggles high for 1 or 2 CLK cycles of synchronization (configurable), then toggles low for 16 CLK cycles of sample width. Frame length can be 1 + 16 = 17 bits or 2 + 16 = 18 bits  I2S clock frequency depends on frame length and the 8 kHz sample rate. Can be 17 x 8 kHz or 18 x 8 kHz  I2S transmit and I2S receive data are 16 bit words long with the same sampling rate as  I2S word alignment, mono. Data is in 2’s complement notation. MSB is transmitted first
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 46 of 145  When I2S word alignment toggles high, the first synchronization bit is always low.  Second synchronization bit (present only in case of 2 bit long I2S word alignment configuration) is MSB of the transmitted word (MSB is transmitted twice in this case)  I2S transmit data changes on I2S clock rising edge, I2S receive data changes on I2S clock falling edge  1.10.2.2 I2S interface – Normal I2S mode Normal I2S supports:  16 bits word  Mono interface  Sample rate: 8 kHz Main features of I2S interface in normal I2S mode:  I2S runs in normal I2S – long alignment mode (configurable by AT commands)  I2S word alignment signal always runs at 8 kHz sample rate and synchronizes 2 channels (timeslots on word alignment high, word alignment low)  I2S transmit data  is composed of 16 bit words, dual mono (the words are written on both channels). Data are in 2’s complement notation. MSB  is transmitted  first. The  bits are  written on I2S  clock  rising  or  falling edge (configurable)  I2S receive data is read as 16 bit words, mono (words are read only on the timeslot with WA high). Data is read in 2’s complement notation. MSB is read first. The bits are read on the I2S clock edge opposite to I2S transmit data writing edge (configurable)  I2S clock frequency is 16 bits x 2 channels x 8 kHz The  modes  are  configurable  through  a  specific  AT  command  (refer  to  the  related  chapter  in  the  u-blox  AT Commands Manual [2], +UI2S AT command) and the following parameters can be set:  MSB can be 1 bit delayed or non-delayed on I2S word alignment edge  I2S transmit data can change on rising or falling edge of I2S clock signal  I2S receive data are read on the opposite front of I2S clock signal  1.10.3 Voice-band processing system  1.10.3.1 Audio processing system overview The  voice-band  processing  on  the  SARA-G350  modules  is  implemented  in  the  DSP  core  inside  the  baseband chipset.  The  analog  audio  front-end  of  the  chipset  is  connected  to  the  digital  system  through  16  bit  ADC converters in the uplink path, and through  16  bit DAC converters in the downlink path. External digital audio devices  can  directly  be  interfaced  to  the  DSP  digital  processing  part  via  the  I2S  digital  interface.  The  analog amplifiers are skipped in this case. The voice-band processing system can be split up into three different blocks:  Sample-based Voice-band Processing (single sample processed at 8 kHz, every 125 µs)  Frame-based Voice-band Processing (frames of 160 samples are processed every 20 ms)  MIDI synthesizer running at 47.6 kHz These three blocks are connected by buffers and sample rate converters (for 8 to 47.6 kHz conversion)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 47 of 145 I2S_RXDSwitchMIC Uplink Analog GainUplink Filter 2Uplink Filter 1To    Radio TXUplinkDigital GainDownlink Filter 1Downlink Filter 2MIDI PlayerSPK SwitchI2Sx TXI2S_TXDScal_Rec Digital GainSPK         Analog GainGain_Out Digital GainFrom Radio RXSpeech LevelI2Sx RXSample Based Processing Frame Based ProcessingCircular BufferSidetone Digital GainDACADCTone GeneratorAMR PlayerHands-FreeVoiceband Sample Buffer Figure 20: SARA-G350 modules voice-band processing system block diagram The  sample-based  voice-band  processing  main  task  is  to  transfer  the  voice-band  samples  from  either  analog audio front-end uplink path or I2Sx RX path to the Voice-band Sample Buffer and from the Voice-band Sample Buffer to the analog audio front-end downlink path and/or I2Sx TX path. While doing this the samples are scaled by  digital  gains  and  processed  by  digital  filters  both  in  the  uplink  and  downlink  direction  and  the  sidetone  is generated mixing scaled uplink samples to the downlink samples (refer to the u-blox AT Commands Manual [2], +UUBF, +UDBF, +UMGC, +USGC, +USTN commands). The  frame-based  voice-band  processing  implements  the  Hands-Free  algorithm.  This  consists  of  the  Echo Canceller, the Automatic Gain Control and the Noise Suppressor. Hands-Free algorithm acts on the uplink signal only.  Algorithms  are  configurable  with  AT  commands  (refer  to  the  u-blox  AT  Commands  Manual [2],  +UHFP command).  The  frame-based  voice-band  processing  also  implements  an  AMR  player.  The  speech  uplink  path final block before radio transmission is the speech encoder. Symmetrically, on downlink path, the starting block is the speech decoder which extracts speech signal from the radio receiver. The circular  buffer is a 3000 word buffer to store and  mix the voice-band samples from Midi  synthesizer. The buffer has a circular structure, so that when the write pointer reaches the end of the buffer, it is wrapped to the begin address of the buffer. Two  different  sample-based  sample  rate  converters  are  used:  an  interpolator,  required  to  convert  the sample-based  voice-band  processing  sampling  rate  of  8  kHz  to  the  analog  audio  front-end  output  rate  of 47.6 kHz; a decimator, required to convert the circular buffer sampling rate of 47.6 kHz to the I2Sx TX or the uplink path sample rate of 8 kHz. 1.10.3.2 Audio codecs The following speech codecs are supported by firmware on the DSP :  GSM Half Rate (TCH/HS)  GSM Full Rate (TCH/FS)  GSM Enhanced Full Rate (TCH/EFR)  3GPP Adaptive Multi Rate (AMR) (TCH/AFS+TCH/AHS) o In AMR Full Rate (AFS) the Active CODEC Set is selected from an overall set of 8 data rates:  12.2 – 10.2 – 7.95 – 7.40 – 6.70 – 5.90 – 5.15 – 4.75 kb/s o In AMR Half Rate (AHS) the overall set comprises 6 different data rates:     7.95 – 7.40 – 6.70 – 5.90 – 5.15 – 4.75 kb/s
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 48 of 145 1.11 General Purpose Input/Output (GPIO)   SARA-G300 and SARA-G310 modules do not support GPIOs.  SARA-G350  modules  provide  4  pins  (GPIO1-GPIO4)  which  can  be  configured  as  general  purpose  input  or output, or can be configured to provide special functions via u-blox AT commands (for further details refer to the u-blox AT Commands Manual [2], +UGPIOC, +UGPIOR, +UGPIOW, +UGPS, +UGPRF).  The following functions are available in the SARA-G350 modules:   Network status indication: The GPIO1, or the GPIO2, GPIO3 and GPIO4 alternatively from their default settings, can be configured to indicate network status (i.e. no service, registered home network, registered visitor network, voice or data call enabled), setting the parameter <gpio_mode> of AT+UGPIOC command to 2. No GPIO pin is by default configured to provide the “Network status indication” function. The  “Network  status  indication”  mode  can  be  provided  only  on  one  pin  per  time:  it  is  not  possible  to simultaneously set the same mode on another pin. The pin configured to provide the “Network status indication” function is set as o Continuous Output / Low, if no service (no network coverage or not registered) o Cyclic Output / High for 100 ms, Output / Low for 2 s, if registered with the home network o Cyclic Output / High for 100 ms, Output / Low for 100 ms, Output / High for 100 ms, Output / Low for 2 s, if registered with the visitor network (roaming) o Continuous Output / High, if voice or data call enabled   GSM Tx burst indication: GPIO1  pin  can  be  configured  by  AT+UGPIOC  to  indicate  when  a  GSM  Tx  burst/slot  occurs,  setting  the parameter <gpio_mode> of AT+UGPIOC command to 9. No GPIO pin is by default configured to provide the “GSM Tx burst indication” function. The pin configured to provide the “GSM Tx burst indication” function is set as o Output / High, since ~10 µs before the start of first Tx slot, until ~5 µs after the end of last Tx slot o Output / Low, otherwise   GPS supply enable: The GPIO2 is by default configured by AT+UGPIOC command to enable or disable the supply of the u-blox GPS/GNSS receiver connected to the wireless module. The  GPIO1,  GPIO3 or GPIO4  pins  can  be  configured  to  provide  the  “GPS  supply  enable”  function, alternatively to the default GPIO2 pin, setting the parameter <gpio_mode> of AT+UGPIOC command to 3. The  “GPS  supply  enable”  mode  can  be  provided  only  on  one  pin  per  time:  it  is  not  possible  to simultaneously set the same mode on another pin. The pin configured to provide the “GPS supply enable” function is set as o Output / High, to switch on the u-blox GPS/GNSS receiver, if the parameter <mode> of AT+UGPS command is set to 1 o Output / Low, to switch off the u-blox GPS/GNSS receiver, if the parameter <mode> of AT+UGPS command is set to 0 (default setting)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 49 of 145  GPS data ready: Only  the  GPIO3 pin  provides  the  “GPS  data  ready”  function,  to  sense  when  a  u-blox  GPS/GNSS  receiver connected to the wireless  module  is ready to send data via the  DDC (I2C) interface, setting the  parameter <gpio_mode> of AT+UGPIOC command to 4. The pin configured to provide the “GPS data ready” function is set as o Input,  to  sense  the  line  status,  waking  up  the  wireless  module  from  idle-mode  when  the  u-blox GPS/GNSS  receiver  is  ready  to  send  data  via  the  DDC  (I2C)  interface;  the  parameter  <mode>  of AT+UGPS  command  must  be  set  to  1  and  the  parameter  <GPS_IO_configuration>  of  AT+UGPRF command to 16 o Tri-state with an internal active pull-down enabled, otherwise (default setting)   GPS RTC sharing: Only  the  GPIO4 pin  provides  the  “GPS  RTC  sharing”  function,  to  provide  an  RTC  (Real  Time  Clock) synchronization  signal  to  the  u-blox  GPS/GNSS  receiver  connected  to  the  wireless  module,  setting  the parameter <gpio_mode> of AT+UGPIOC command to 5. The pin configured to provide the “GPS RTC sharing” function is set as o Output,  to  provide  an  RTC  (Real  Time  Clock)  synchronization  signal  to  the  u-blox  GPS/GNSS receiver  if  the  parameter  <mode>  of  AT+UGPS  command  is  set  to  1  and  parameter <GPS_IO_configuration> of AT+UGPRF command is set to 32 o Output / Low, otherwise (default setting)   General purpose input: All the GPIOs can be configured as input to sense high or low digital level through AT+UGPIOR command, setting the parameter <gpio_mode> of AT+UGPIOC command to 1. The  “General  purpose  input”  mode  can  be  provided  on  more  than  one  pin  at  a  time:  it  is  possible  to simultaneously set the same mode on another pin (also on all the GPIOs). No GPIO pin is by default configured as “General purpose input”. The pin configured to provide the “General purpose input” function is set as o Input, to sense high or low digital level by AT+UGPIOR command.   General purpose output: All  the  GPIOs  can  be  configured  as  output  to  set  the  high  or  the  low  digital  level  through  AT+UGPIOW command, setting the parameter <gpio_mode> of +UGPIOC AT command to 0. The  “General  purpose  output”  mode  can  be  provided  on  more  than  one  pin  per  time:  it  is  possible  to simultaneously set the same mode on another pin (also on all the GPIOs). No GPIO pin is by default configured as “General purpose output”. The pin configured to provide the “General purpose output” function is set as o Output / Low, if the parameter <gpio_out_val> of AT+UGPIOW command is set to 0 o Output / High, if the parameter <gpio_out_val> of AT+UGPIOW command is set to 1   Pad disabled: All the  GPIOs  can be  configured  in  tri-state  with  an  internal active pull-down  enabled,  as  a  not  used  pin, setting the parameter <gpio_mode> of +UGPIOC AT command to 255. The “Pad disabled” mode can be provided on more than one pin per time: it is possible to simultaneously set the same mode on another pin (also on all the GPIOs). The pin configured to provide the “Pad disabled” function is set as o Tri-state with an internal active pull-down enabled
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 50 of 145 Table 11 describes the configurations of all SARA-G350 GPIO pins.  Pin Module Name Description Remarks 16 SARA-G350 GPIO1 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the AT+UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  GSM Tx Burst Indication 23 SARA-G350 GPIO2 GPIO By default, the pin is configured to provide GPS Supply Enable function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  Pad disabled 24 SARA-G350 GPIO3 GPIO By default, the pin is configured to provide GPS Data Ready function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  Pad disabled 25 SARA-G350 GPIO4 GPIO By default, the pin is configured to provide GPS RTC sharing function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  Pad disabled Table 11: GPIO pins configurations  1.12 Reserved pins (RSVD) SARA-G3 modules have pins reserved for future use: they can all be left unconnected on the application board, except the RSVD pin number 33 that must be externally connected to ground.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 51 of 145 1.13 System features 1.13.1 Network indication  Not supported by SARA-G300 and SARA-G310 modules.  The  GPIO1,  or  the  GPIO2,  GPIO3  and  GPIO4  alternatively  from  their  default  settings,  can  be  configured  to indicate network status (i.e. no  service, registered home network, registered visitor network, voice or  data call enabled), by means of the AT+UGPIOC command. For the detailed description, refer to chapter 1.11 and to u-blox AT Commands Manual [2], GPIO commands.  1.13.2 Antenna detection  Not supported by SARA-G300 and SARA-G310 modules.  ANT_DET pin of SARA-G350 modules is an Analog to Digital Converter (ADC) provided to sense the presence of an external antenna when optionally set by the +UANTR AT command. The external antenna assembly must be provided with a built-in resistor (diagnostic circuit) to be detected, and an  antenna  detection  circuit  must be  implemented  on  the application  board  properly  connecting the  antenna detection input (ANT_DET) to the antenna RF interface (ANT). For more details regarding feature description and detection / diagnostic circuit design-in refer to chapters 1.7.1 and 2.3.2, and to the u-blox AT Commands Manual [2].  1.13.3 Jamming detection  Not supported by SARA-G300 and SARA-G310 modules.  In  real  network  situations  modules  can  experience  various  kind  of  out-of-coverage  conditions:  limited  service conditions  when  roaming  to  networks  not  supporting  the  specific  SIM,  limited  service  in  cells  which  are  not suitable or barred due to operators’ choices, no cell condition when moving to poorly served or highly interfered areas. In the latter case, interference can be artificially injected in the environment by a noise generator covering a given spectrum, thus obscuring the operator’s carriers entitled to give access to the GSM service. The  Jamming  Detection  Feature  detects  such  “artificial”  interference  and  reports  the  start  and  stop  of  such conditions  to  the  client,  which  can  react  appropriately  by  e.g.  switching  off  the  radio  transceiver  to  reduce power consumption and monitoring the environment at constant periods. The feature detects, at radio resource level, an anomalous source of interference and signals it to the client with an unsolicited indication when the detection is entered or released. The jamming condition occurs when:  The module has lost synchronization with the serving cell and cannot select any other cell  The band scan reveals at least n carriers with power level equal or higher than threshold  On all such carriers, no synchronization is possible The number of  minimum disturbing  carriers and the power level threshold can  be configured by the client  by using the AT+UCD command [2]. The client can configure the number of minimum disturbing carriers and the power level threshold by using the AT+UCD command [2]. The jamming condition is cleared when any of the above mentioned statements does not hold. The congestion (i.e. jamming) detection feature can be enabled and configured by the +UCD AT command (for more details refer to the u-blox AT Commands Manual [2]).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 52 of 145 1.13.4 TCP/IP and UDP/IP   Not supported by SARA-G300 and SARA-G310 modules.  Via the AT commands it is possible to access the TCP/IP and UDP/IP functionalities over the Packet Switched data connection. For more details about AT commands see the u-blox AT Commands Manual [2]. Using the embedded TCP/IP or UDP/IP stack, only 1 IP instance (address) is supported. The IP instance supports up to 7 sockets. Using an external TCP/IP stack (on the application processor), it is possible to have 3 IP instances (addresses). Direct Link mode for TCP and UDP sockets is supported. Sockets can be set in Direct Link mode to establish a transparent  end-to-end  communication  with  an  already  connected  TCP  or  UDP  socket  via  serial  interface.  In Direct  Link mode,  data  sent  to the  serial  interface  from  an  external  application  processor  is forwarded  to  the network and vice-versa. To avoid data loss while using Direct Link, enable HW flow control on the serial interface.  1.13.5 FTP   Not supported by SARA-G300 and SARA-G310 modules.  SARA-G350  modules  support  the  File  Transfer  Protocol  functionalities  via  AT  commands.  Files  are  read  and stored in the local file system of the module. For more details about AT commands see the u-blox AT Commands Manual [2].  1.13.6 HTTP   Not supported by SARA-G300 and SARA-G310 modules.  HTTP client is implemented in SARA-G350 modules: HEAD, GET, POST, DELETE and PUT operations are available. The file size to be uploaded / downloaded depends on the free space available in the local file system (FFS) at the moment of the operation. Up to 4 HTTP client contexts can simultaneously be used. For more details about AT commands see the u-blox AT Commands Manual [2].  1.13.7 SMTP   Not supported by SARA-G300 and SARA-G310 modules.  SARA-G350 modules support SMTP client functionalities. It is possible to specify the common parameters (e.g. server data, authentication method, etc. can be specified), to send an email to a SMTP server. Emails can be sent with or without attachment. Attachments are store in the local file system of SARA-G350 modules. For more details about AT commands see the u-blox AT Commands Manual [2].
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 53 of 145 1.13.8 Smart temperature management  Wireless  modules  –  independent  of  the  specific  model  –  always  have  a  well-defined  operating  temperature range. This range should be respected to guarantee full device functionality and long life span. Nevertheless  there  are  environmental  conditions  that  can  affect  operating  temperature,  e.g.  if  the  device  is located near a heating/cooling source, if there is/is not air circulating, etc. The module itself can also influence the environmental conditions; such as when it is transmitting at full power. In this case its temperature increases very quickly and can raise the temperature nearby. The best solution is always to properly design the system where the module is integrated. Nevertheless an extra check/security  mechanism  embedded  into  the  module  is  a  good  solution  to  prevent  operation  of  the  device outside of the specified range.  1.13.8.1 Smart Temperature Supervisor (STS) The  Smart  Temperature  Supervisor  is  activated  and  configured  by  a  dedicated  AT+USTS  command.  Refer  to u-blox AT Commands Manual [2] for more details. The wireless module measures the internal temperature (Ti) and its value is compared with predefined thresholds to identify the actual working temperature range.   Temperature  measurement  is  done  inside  the  module:  the  measured  value  could  be  different  from  the environmental temperature (Ta). Warningareat-1 t+1 t+2t-2Valid temperature rangeSafeareaDangerousarea Dangerousarea Warningarea Figure 21: Temperature range and limits The entire temperature range is divided into sub-regions by limits (see Figure 21) named t-2, t-1, t+1 and t+2.  Within the first limit, (t-1 < Ti < t+1), the wireless module is in the normal working range, the Safe Area  In the Warning Area, (t-2 < Ti < t.1) or (t+1 < Ti < t+2), the wireless module is still inside the valid temperature range, but the measured temperature approaches the limit (upper or lower). The module sends a warning to the user (through the active AT communication interface), which can take, if possible, the necessary actions to return to a safer temperature range or simply ignore the indication. The module is still in a valid and good working condition  Outside the valid temperature range, (Ti < t-2) or (Ti > t+2), the device is working outside the specified range and  represents  a  dangerous  working  condition.  This  condition  is  indicated  and  the  device  shuts  down  to avoid damage   For security  reasons  the  shutdown  is  suspended  in  case  an emergency  call  in  progress.  In  this  case  the device switches off at call termination.  The user can decide at anytime to enable/disable the Smart Temperature Supervisor feature. If the feature is disabled there is no embedded protection against disallowed temperature conditions.  Figure  22  shows  the  flow  diagram  implemented  in  SARA-G3  series  modules  for  the  Smart  Temperature Supervisor.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 54 of 145  IF STS enabledRead temperatureIF(t-1<Ti<t+1)IF(t-2<Ti<t+2)Send notification (warning)Send notification(dangerous)Wait emergencycall terminationIFemerg. call in progressShut the device downYesNoYesYesNoNoNoYesSend shutdownnotificationFeature enabled (full logic or indication only)IF Full Logic EnabledFeature disabled: no actionTemperature is  within normal operating rangeYesTempetature  is within warning areaTempetature is outside valid temperature rangeNoFeatuere enabled in full logic modeFeature enabled in  indication only mode:no  further actionsSend notification (safe)Previously outside of Safe AreaTempetature  is back to safe areaNoNo furtheractionsYes Figure 22: Smart Temperature Supervisor (STS) flow diagram
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 55 of 145 1.13.8.2 Threshold definitions When  the  module  application  operates  at  extreme  temperatures  with  Smart  Temperature  Supervisor  enabled, the user should note that outside the valid temperature range the device automatically shuts down as described above. The input for the  algorithm  is  always the temperature measured  within the  wireless module (Ti, internal). This value  can  be  higher  than  the  working  ambient  temperature  (Ta,  ambient),  since  (for  example)  during transmission at maximum power a significant fraction of DC input power is dissipated as heat. This behavior is partially  compensated  by  the  definition  of  the  upper  shutdown  threshold  (t+2)  that  is  slightly  higher  than  the declared environmental temperature limit. Table 12 defines the temperature thresholds.  Symbol Parameter Temperature Remarks t-2 Low temperature shutdown –40 °C Equal to the absolute minimum temperature rating for the wireless module (the lower limit of the extended temperature range) t-1 Low temperature warning –30 °C 10 °C above t-2 t+1 High temperature warning +85 °C 10 °C below t+2. The higher warning area for upper range ensures that any countermeasures used to limit the thermal heating will become effective, even considering some thermal inertia of the complete assembly. t+2 High temperature shutdown +95 °C Equal to the internal temperature Ti measured in the worst case operating condition at typical supply voltage when the ambient temperature Ta in the reference setup (*) equals the absolute maximum temperature rating (upper limit of the extended temperature range) (*) SARA-G3 series module mounted on a 79 mm x 62 mm x 1.41 mm 4-Layers PCB with a high coverage of copper in still air conditions Table 12: Thresholds definition for Smart Temperature Supervisor on the SARA-G3 series modules   The sensor measures board temperature inside the shields, which can differ from ambient temperature.  1.13.9 AssistNow clients and GPS/GNSS integration  Not supported by SARA-G300 and SARA-G310 modules.  For  customers  using  u-blox  GPS/GNSS  receivers,  SARA-G350  modules  feature  embedded  AssistNow  clients. AssistNow A-GPS provides better GPS/GNSS performance and faster Time-To-First-Fix. The clients can be enabled and disabled with an AT command (see the u-blox AT Commands Manual [2]). SARA-G350  modules  act  as  a  stand-alone  AssistNow  client,  making  AssistNow  available  with  no  additional requirements  for  resources  or  software  integration  on  an  external  host  micro  controller.  Full  access  to  u-blox positioning receivers is available via the SARA-G350 modules, through a dedicated DDC (I2C) interface, while the available GPIOs can handle the positioning chipset / module power-on/off. This means that the wireless module and the positioning chips and modules can be controlled through a single serial port from any host processor.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 56 of 145 1.13.10 Hybrid positioning and CellLocateTM   Not supported by SARA-G300 and SARA-G310 versions.  Although GPS/GNSS is a widespread technology, reliance on the visibility of extremely weak  GPS/GNSS satellite signals means that positioning is not always possible, particularly in shielded environments such as indoors and enclosed  park  houses,  or  when  a  GPS/GNSS  jamming  signal  is  present.  The  situation  can  be  improved  by augmenting  GPS/GNSS  receiver  data  with  network  cell  information  to  provide  a  level  of  redundancy  that  can benefit numerous applications.  1.13.10.1 Positioning through cellular information: CellLocateTM u-blox CellLocateTM enables the device position estimation based on the parameters of the mobile network cells visible to the specific device. To estimate its position the module sends the CellLocateTM server the parameters of network cells visible to it using a UDP connection. In return the server provides the estimated position based on the CellLocateTM database. The SARA-G350 module can either send the parameters of the visible home network cells only (normal scan) or the parameters of all surrounding cells of all mobile operators (deep scan).  The CellLocateTM database is compiled from the position of devices which observed, in the past, a specific cell or set of cells (historical observations) as follows:  1. Several devices reported their position to the CellLocate server when observing a specific cell (the As in the picture represent the position of the devices which observed the same cell A)    2. CellLocateTM server defines the area of Cell A visibility
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 57 of 145 3. If a new device reports the observation of Cell A CellLocateTM is able to provide the estimated position from the area of visibility    4. The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility.    CellLocateTM is implemented using a set of two AT commands that allow configuration of the CellLocateTM service (AT+ULOCCELL) and requesting position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy.   The  accuracy  of  the  position  estimated  by  CellLocateTM  depends  on  the  availability  of  historical observations in the specific area.  1.13.10.2 Hybrid positioning With  u-blox  hybrid  positioning  technology,  u-blox  wireless  modules  can  be  triggered  to  provide  their  current position using either a u-blox GPS/GNSS receiver or the position estimated from CellLocate. The choice depends on  which  positioning  method  provides  the  best  and  fastest  solution  according  to  the  user  configuration, exploiting the benefit of having multiple and complementary positioning methods. Hybrid  positioning  is  implemented  through  a  set  of  three  AT  commands  that  allow  GPS/GNSS  receiver configuration (AT+ULOCGNSS), CellLocateTM service configuration (AT+ULOCCELL), and requesting the position according  to  the  user  configuration  (AT+ULOC).  The  answer  is  provided  in  the  form  of  an  unsolicited  AT command  including  latitude,  longitude  and  estimated  accuracy  (if  the  position  has  been  estimated  by CellLocateTM), and additional parameters if the position has been computed by the GPS/GNSS receiver. The  configuration  of  mobile  network  cells  does  not  remain  static  (e.g.  new  cells  are  continuously  added  or existing cells are reconfigured by the network operators). For this reason, when a hybrid positioning method has been triggered and the GPS/GNSS receiver calculates the position, a database self-learning mechanism has been implemented so that these positions are sent to the server to update the database and maintain its accuracy.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 58 of 145 The  use  of  hybrid  positioning  requires  a  connection  via  the  DDC  (I2C)  bus  between  the  SARA-G350  wireless module and the u-blox GPS/GNSS receiver (Refer to chapter 2.5.3). Refer to GPS Implementation Application Note [21] for the complete description of the feature.   u-blox  is  extremely  mindful  of  user  privacy.  When  a  position  is  sent  to  the  CellLocate  server  u-blox  is unable to track the SIM used or the specific device.  1.13.11 Firmware upgrade Over AT (FOAT)  1.13.11.1 Overview This feature allows upgrading the module Firmware over the UART interface, using AT Commands.  AT Command AT+UFWUPD triggers a reboot followed by the upgrade procedure at specified a baud rate (refer to u-blox AT Commands Manual [2] for more details)  Both Xmodem-1k protocol (1024 bytes packets) and Xmodem protocol (128 bytes packets) can be used for downloading the new firmware image via a terminal application   A special boot loader on the module performs firmware installation, security verifications and module reboot  Firmware authenticity verification is performed via a security signature during the download. The firmware is then  installed,  overwriting  the  current  version.  In  case  of  power  loss  during  this  phase,  the  boot  loader detects a fault at the next wake-up, and restarts the firmware download from the Xmodem-1k handshake. After completing the upgrade, the module is reset again and wakes-up in normal boot 1.13.11.2 FOAT procedure The application processor must proceed in the following way:  Send the AT+UFWUPD command through UART interface, specifying the file type and the desired baud rate  Reconfigure serial communication at selected baud rate, without flow control with the used protocol  Send the new FW image via the used protocol For more details, refer to the Firmware Update Application Note [22].  1.13.12 Firmware upgrade Over The Air (FOTA)   Not supported by SARA-G300 and SARA-G310 modules.   Supported upon request on SARA-G350 modules.   This feature allows upgrading the module Firmware over the air, i.e. over the GSM network. The main idea with updating Firmware over the air is to reduce the amount of data required for transmission to the module. This is achieved by downloading only a “delta file” instead of the full firmware. The delta contains only the differences between the two firmware versions (old and new), and is compressed. For more details, refer to the Firmware Update Application Note [22].
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  System description     Page 59 of 145 1.13.13 In-Band modem (eCall / ERA-GLONASS)  Supported only by SARA-G350 ECALL module version.  SARA-G350  ECALL  module  version  supports  an In-Band  modem  solution  for  eCall  and  ERA-GLONASS emergency  call  applications  over  cellular  networks,  implemented  according  to  3GPP  TS  26.267  [19],  BS  EN 16062:2011 [26] and ETSI TS 122 101 [27] specifications. eCall and ERA-GLONASS are respectively a European and Russian initiatives to combine mobile communications and  satellite  positioning  to  provide  rapid  assistance  to  motorists  in  the  event  of  a  collision,  implementing automated emergency response system based the first on GPS the latter on GLONASS positioning system.  When activated, the in-vehicle systems (IVS) automatically initiate an emergency call carrying both voice and data (including  location  data)  directly  to  the  nearest  Public  Safety  Answering  Point  (PSAP)  to  determine  whether rescue services should be dispatched to the known position.  Figure 23: eCall and ERA-GLONASS automated emergency response systems diagram flow  1.13.14 Power saving  The  power  saving  configuration  is  by  default  disabled,  but  it  can  be  enabled  using  the  AT+UPSV  command. When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption. During low power idle-mode, the module is not ready to communicate with an external device by means of the application interfaces, since it is configured to reduce power consumption. It can be woken up from idle-mode to  active-mode  by  the  connected  application  processor,  by  the  connected  u-blox  positioning  receiver  or  by network activities, as described in the Table 5. During idle-mode, the module processor core runs with the RTC 32 kHz reference clock, which is generated by:  The internal 32 kHz oscillator, in case of SARA-G350 modules  The 32 kHz signal provided at the EXT32K input pin, in case of SARA-G300 and SARA-G310 modules   SARA-G300 and SARA-G310 need a 32 kHz signal at EXT32K input to reach the low power idle-mode.  For the complete description of the AT+UPSV command, refer to the u-blox AT Commands Manual [2]. For the definition and the description of SARA-G3 series modules operating modes, including the events forcing transitions between the different operating modes, refer to the chapter 1.4. For the description of current consumption in idle and active operating modes, refer to chapters 1.5.1.2, 1.5.1.4. For the description of the UART settings related to module power saving configuration, refer to chapter 1.9.1.4. For the description of the EXT32K input and relative application circuit design-in, refer to chapters 1.6.4, 2.2.3.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 60 of 145 2 Design-in For an optimal integration of SARA-G3 modules in the final application board follow the design guidelines stated in this chapter. Every  application  circuit  must  be  properly  designed  to  guarantee  the  correct  functionality  of  the  relative interface, however a number of points require high attention during the design of the application device.  The following list provides a ranking of importance in the application design, starting from the highest relevance:  1. Module antenna connection: ANT and ANT_DET pins. Antenna circuit directly affects the RF compliance of the  device  integrating  SARA-G3  module  with  applicable  certification  schemes.  Very  carefully  follow  the suggestions provided in the relative chapter 2.3 for schematic and layout design. 2. Module supply: VCC and GND pins. The supply circuit  affects the RF compliance  of the device integrating SARA-G3  module  with  applicable  required  certification  schemes  as  well  as  antenna  circuit  design.  Very carefully follow the suggestions provided in the relative chapter 2.1.1 for schematic and layout design.  3. SIM  card  interface:  VSIM,  SIM_CLK,  SIM_IO,  SIM_RST,  SIM_DET  pins.  Accurate  design  is  required  to guarantee SIM card functionality reducing the risk of RF coupling. Carefully follow the suggestions provided in the relative chapter 2.4 for schematic and layout design. 4. System functions: RESET_N, PWR_ON pins. Accurate design is required to guarantee that the voltage level is well defined during  operation.  Carefully  follow  the  suggestions  provided  in  the  relative  chapter  2.2 for schematic and layout design. 5. Analog  audio  interface:  MIC_BIAS,  MIC_GND,  MIC_P,  MIC_N  uplink  and  SPK_P,  SPK_N  downlink  pins. Accurate design is required to obtain clear and high quality audio reducing the risk of noise from audio lines due to both supply burst noise coupling and RF detection. Carefully follow the suggestions provided in the relative chapter 2.6.1 for schematic and layout design. 6. External  32  kHz  input:  the  EXT32K  input  pin  of  SARA-G300  and  SARA-G310  modules  requires  accurate layout  design  as  it  may  affect  the  stability  of  the  RTC  timing  reference.  Carefully  follow  the  suggestions provided in the relative chapter 2.2.3 for schematic and layout design.  7. Other  digital  interfaces:  UART  and  auxiliary  UART  interfaces,  DDC  I2C-compatible  interface,  digital  audio interface and GPIOs. Accurate design is required to guarantee proper functionality.  Follow the suggestions provided in the relative chapters 2.5.1, 2.5.2, 2.5.3, 2.6.2 and 2.7 for schematic and layout design. 8. Other  supplies:  the  V_BCKP  RTC  supply  input/output  and  the  V_INT  digital  interfaces  supply  output. Accurate design is required to guarantee proper functionality. Follow the suggestions provided in the relative chapters 2.1.2 and 2.1.3 for schematic and layout design.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 61 of 145 2.1 Supply interfaces 2.1.1 Module supply (VCC) 2.1.1.1 General guidelines for VCC supply circuit selection and design VCC  pins  are  internally  connected,  but  connect  all  the  available  pads  to  the  external  supply  to  minimize  the power loss due to series resistance. GND pins are internally connected but connect all the available pads to solid ground on the application board, since  a  good  (low  impedance)  connection  to  external  ground  can  minimize  power  loss  and  improve  RF  and thermal performance.  SARA-G3 modules must be supplied through the VCC pins by a proper DC power supply that should meet the following prerequisites to comply with the module VCC requirements summarized in Table 6. The proper DC power supply can be selected according to the application requirements (see Figure 24) between the different possible supply sources types, which most common ones are the following:  Switching regulator  Low Drop-Out (LDO) linear regulator  Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery  Primary (disposable) battery  Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage >5 V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available  Figure 24: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much  higher (e.g.  greater  than 5  V)  than the  SARA-G3 modules  operating supply voltage.  The use  of switching step-down provides the best power efficiency for the overall application and minimizes current drawn from the main supply source. The use of an LDO linear regulator becomes convenient for  a primary supply with a relatively low voltage (e.g. less than 5 V). In this case the typical 90% efficiency of the switching regulator diminishes the benefit of voltage step-down and no true advantage is gained in input current savings. On the opposite side, linear regulators are not  recommended  for  high  voltage  step-down  as  they  dissipate  a  considerable  amount  of  energy  in  thermal power. If SARA-G3 modules are deployed in a mobile unit where no permanent primary supply source is available, then a battery will be required to  provide  VCC.  A standard  3-cell Li-Ion or Li-Pol  battery pack  directly connected to VCC is the usual choice for battery-powered devices. During charging, batteries with Ni-MH chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 62 of 145 The use of primary (not rechargeable) battery is uncommon, since the most cells available are seldom capable of delivering the burst peak current for a GSM call due to high internal resistance. Keep in mind that the use of batteries requires the implementation of a suitable charger circuit (not included in SARA-G3 modules). The charger circuit should be designed in order to prevent over-voltage on VCC beyond the upper limit of the absolute maximum rating. The usage of more than one DC supply at the same time should be carefully evaluated: depending on the supply source characteristics, different DC supply systems can result as mutually exclusive.  The usage of a regulator or a battery not able to withstand the maximum peak current consumption specified in the SARA-G3 series Data Sheet [1] is generally not recommended. However, if the selected regulator or battery is not able to withstand the maximum peak current of the module, it must be able to considerably withstand at least the maximum average current consumption value specified in the SARA-G3 series Data Sheet [1], and the additional energy required by the module during a GSM/GPRS Tx slot (when the current consumption can rise up to 1.9 A in the worst case, as described in section 1.5.1.2) could be provided by a proper bypass tank capacitor with very large  capacitance and very  low ESR  (depending  on  the actual capability  of the selected regulator  or battery, the required capacitance can be considerably larger than 1 mF) placed close to the module  VCC pins. Carefully evaluate the implementation of this solution since the aging and temperature conditions highly affects the actual capacitors characteristics.  The following sections highlight some design aspects for each of the supplies listed above providing application circuit design-in compliant with the module VCC requirements summarized in Table 6.  2.1.1.2 Guidelines for VCC supply circuit design using a switching regulator The use of a switching regulator is suggested when the difference from the available supply rail to the VCC value is high: switching regulators provide good efficiency transforming a 12 V or greater voltage supply to the typical 3.8 V value of the VCC supply. The characteristics of the switching regulator connected to VCC pins should meet the following prerequisites to comply with the module VCC requirements summarized in Table 6:  Power  capability:  the  switching  regulator  with  its  output  circuit  must  be  capable of  providing  a  voltage value to the VCC pins within the specified operating range and must be capable of delivering 1.9 A current pulses with 1/8 duty cycle to the VCC pins  Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC voltage profile  High switching frequency: for best performance and for smaller applications select a switching frequency ≥ 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a  variable switching frequency  or with  a switching  frequency  lower than  600 kHz must  be carefully evaluated since this can produce noise in the VCC voltage profile and therefore negatively impact GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output  to  VCC  supply  pins  can  mitigate  the  ripple  on  VCC,  but  adds  extra  voltage  drop  due  to  resistive losses on series inductors  PWM  mode  operation:  it  is  preferable  to  select  regulators  with  Pulse  Width  Modulation  (PWM)  mode. While in connected-mode Pulse Frequency Modulation (PFM) mode and PFM/PWM mode, transitions must be  avoided  to  reduce  the  noise  on  the  VCC  voltage  profile.  Switching  regulators  that  are  able  to  switch between  low ripple  PWM  mode and  high  efficiency  burst  or  PFM  mode  can  be  used,  provided  the  mode transition occurs when the module changes status from idle/active-mode to connected-mode (where current consumption  increases  to a  value  greater  than 100  mA):  it  is  permissible  to use  a  regulator  that  switches from the PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA)  Output  voltage  slope: the use of the  soft start  function provided  by some voltage regulators  should be carefully evaluated, since the VCC pins voltage must ramp from 2.5 V to 3.2 V within 4 ms to switch on the module that otherwise can be switched on by a low level on PWR_ON pin
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 63 of 145 Figure  25  and  the  components  listed  in  Table  13  show  an  example  of  a  high  reliability  power  supply  circuit, where the module VCC is supplied by a step-down switching regulator capable of delivering 1.9 A current pulses with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz. SARA-G3 series12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7 C8D1 R4R5L1C3U152 VCC53 VCC51 VCCGND Figure 25: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 10 µF Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata C4 22 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H220JZ01 - Murata C5 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C6 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata C7 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C8 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET D1 Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor L1 10 µH Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics R1 470 kΩ Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo R2 15 kΩ Resistor 0402 5% 0.1 W 2322-705-87153-L - Yageo R3 22 kΩ Resistor 0402 5% 0.1 W 2322-705-87223-L - Yageo R4 390 kΩ Resistor 0402 1% 0.063 W RC0402FR-07390KL - Yageo R5 100 kΩ Resistor 0402 5% 0.1 W 2322-705-70104-L - Yageo U1 Step-Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 13: Suggested components for the VCC voltage supply application circuit using a step-down regulator
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 64 of 145 Figure 26 and the components listed in Table 14 show an example of a low cost power supply circuit, where the VCC module supply is provided by a step-down switching regulator capable of delivering 1.9 A current pulses, transforming a 12 V supply input.  SARA-G3 series12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1 R1R2L1U1GNDFBCOMP54R3C4R4C552 VCC53 VCC51 VCC Figure 26: Suggested low cost solution for the VCC voltage supply application circuit using step-down regulator Reference Description Part Number - Manufacturer C1 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 – Murata C2 100 µF Capacitor Tantalum B_SIZE 20% 6.3V 15m T520B107M006ATE015 – Kemet C3 5.6 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H562KA88 – Murata C4  6.8 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H682KA88 – Murata C5 56 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H560JA01 – Murata C6 220 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E224KA88 – Murata D1 Schottky Diode 25V 2 A STPS2L25 – STMicroelectronics L1 5.2 µH Inductor 30% 5.28A 22 m MSS1038-522NL – Coilcraft R1 4.7 k Resistor 0402 1% 0.063 W RC0402FR-074K7L – Yageo R2 910  Resistor 0402 1% 0.063 W RC0402FR-07910RL – Yageo R3 82  Resistor 0402 5% 0.063 W RC0402JR-0782RL – Yageo R4 8.2 k Resistor 0402 5% 0.063 W RC0402JR-078K2L – Yageo R5 39 k Resistor 0402 5% 0.063 W RC0402JR-0739KL – Yageo U1 Step-Down Regulator 8-VFQFPN 3 A 1 MHz L5987TR – ST Microelectronics Table 14: Suggested components for low cost solution VCC voltage supply application circuit using a step-down regulator  2.1.1.3 Guidelines for VCC supply circuit design using a Low Drop-Out (LDO) linear regulator The use of a linear regulator is suggested when the difference from the available supply rail and the VCC value is low:  linear  regulators  provide  high  efficiency  when  transforming  a  5  V  supply  to  a  voltage  value  within  the module VCC normal operating range. The  characteristics  of  the  LDO  linear  regulator  connected  to  the  VCC  pins  should  meet  the  following prerequisites to comply with the module VCC requirements summarized in Table 6:  Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a proper voltage value to the VCC pins and of delivering 1.9 A current pulses with 1/8 duty cycle  Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the min output voltage to evaluate the power dissipation of the regulator)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulator  should  be carefully evaluated, since the VCC pins voltage must ramp from 2.5 V to 3.2 V within 4 ms to switch-on the module that otherwise can be switched on by a low level on PWR_ON pin
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 65 of 145 Figure 27 and  the components listed  in Table 15  show an  example of a power  supply circuit, where  the VCC module  supply  is  provided  by  an  LDO  linear  regulator  capable  of  delivering  1.9  A  current  pulses, with  proper power handling capability. It is recommended to configure the LDO linear regulator  to generate a voltage supply value slightly below the maximum limit of the module VCC normal operating range (e.g. ~4.1 V as in the circuit described in  Figure 27 and Table  15). This reduces the  power on the  linear regulator  and  improves  the thermal design of  the supply circuit. 5VC1 R1IN OUTADJGND12453C2R2R3U1SHDNSARA-G3 series52 VCC53 VCC51 VCCGNDC3 Figure 27: Suggested schematic design for the VCC voltage supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET R1 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL - Yageo Phycomp R2 9.1 kΩ Resistor 0402 5% 0.1 W RC0402JR-079K1L - Yageo Phycomp R3 3.9 kΩ Resistor 0402 5% 0.1 W RC0402JR-073K9L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LT1764AEQ#PBF - Linear Technology Table 15: Suggested components for VCC voltage supply application circuit using an LDO linear regulator  2.1.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery Rechargeable  Li-Ion  or  Li-Pol  batteries  connected  to  the  VCC  pins  should  meet  the  following  prerequisites  to comply with the module VCC requirements summarized in Table 6:  Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its output circuit must be capable  of  delivering  1.9  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption to  VCC pins. The maximum  pulse  discharge  current  and  the  maximum  DC  discharge  current  are  not  always  reported  in battery data sheets, but the maximum DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour  DC series resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop greater than 400 mV during transmit bursts  2.1.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery The  characteristics  of  a  primary  (non-rechargeable)  battery  connected  to  VCC  pins  should  meet  the  following prerequisites to comply with the module VCC requirements summarized in Table 6:  Maximum pulse and DC discharge current: the non-rechargeable battery with its output circuit must be capable  of  delivering  1.9  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption at the  VCC pins. The maximum pulse and the maximum DC discharge current is not always reported in battery data sheets,
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 66 of 145 but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery  capacity  in  Amp-hours divided by 1 hour  DC  series  resistance: the non-rechargeable  battery with  its  output circuit must be capable of avoiding a VCC voltage drop greater than 400 mV during transmit bursts  2.1.1.6 Additional guidelines for VCC supply circuit design To  reduce  voltage  drops,  use  a  low  impedance  power  source.  The  resistance  of  the  power  supply  lines (connected to the VCC and GND pins of the module) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible to minimize power losses. Three pins are allocated for VCC supply. Another twenty pins are designated for GND connection. Even if all the VCC  pins  and  all  the  GND  pins  are  internally  connected  within  the  module,  it  is  recommended  to  properly connect all of them to supply the module to minimize series resistance losses. To  avoid  voltage  drop  undershoot  and  overshoot  at  the  start  and  end  of  a  transmit  burst  during  a  GSM  call (when current consumption on the VCC supply can rise up to as much as 1.9 A in the worst case), place a bypass capacitor with large capacitance (more than 100 µF) and low ESR near the VCC pins, for example:  330 µF capacitance, 45 m ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor) The use of very large capacitors (i.e. greater then 1000 µF) on the VCC line should be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 4 ms to switch on the module that otherwise can be switched on by a low level on PWR_ON pin. To reduce voltage ripple and noise, especially if the application device integrates an internal antenna, place the following bypass capacitors near the VCC pins:  100 nF capacitor (e.g Murata GRM155R61C104K) to filter digital logic noise from clocks and data sources  10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources  56 pF  capacitor  with  Self-Resonant  Frequency in  800/900  MHz  range  (e.g.  Murata  GRM1555C1E560J)  to filter transmission EMI in the GSM/EGSM bands  15 pF capacitor with Self-Resonant Frequency in 1800/1900 MHz range (e.g. Murata GRM1555C1E150J) to filter transmission EMI in the DCS/PCS bands   Figure 28 shows the complete configuration but the mounting of each single component depends on the application design: it is recommended to provide all the VCC bypass capacitors as described in Figure 28 and Table 16 if the application device integrates an internal antenna.  C4GNDC3 C2SARA-G3 series52VCC53VCC51VCC3V8C1+C5 Figure 28: Suggested schematic and layout design for the VCC bypass capacitors to reduce ripple / noise on VCC voltage profile and to avoid undershoot / overshoot on VCC voltage drops
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 67 of 145 Reference Description Part Number - Manufacturer C1 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C4 56 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E560JA01 - Murata C5  15 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1E150JA01 - Murata Table 16: Suggested components to reduce ripple / noise on VCC and to avoid undershoot/ overshoot on VCC voltage drops   ESD  sensitivity  rating  of  the  VCC  supply  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if accessible battery connector is directly connected to VCC pins. Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible point.  2.1.1.7 Guidelines for external battery charging circuit SARA-G3 modules do not have an on-board charging circuit. Figure 29 provides an example of a battery charger design, suitable for applications that are battery powered with a Li-Ion (or Li-Polymer) cell. In  the  application  circuit,  a  rechargeable  Li-Ion  (or  Li-Polymer)  battery  cell,  that  features  proper  pulse  and  DC discharge current capabilities and proper DC series resistance, is directly connected to the  VCC supply input of SARA-G3 module. Battery charging is completely managed by the STMicroelectronics L6924U Battery Charger IC that, from a USB power source (5.0 V typ.), charges as a linear charger the battery, in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant  current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for USB power source (~500 mA)  Constant  voltage:  when  the  battery  voltage  reaches  the  regulated  output  voltage  (4.2  V),  the  L6924U starts  to  reduce  the  current  until  the  charge  termination  is  done.  The  charging  process  ends  when  the charging current reaches the value configured by an external resistor to ~15 mA or when the charging timer reaches the value configured by an external capacitor to ~9800 s Using a battery pack with an internal NTC resistor, the L6924U can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Alternatively the L6924U, providing input voltage range up to 12 V, can charge from an AC wall adapter. When a current-limited adapter is used, it can operate in quasi-pulse mode, reducing power dissipation.  C5 C8GNDC7C6 C9SARA-G3 series52 VCC53 VCC51 VCC+USB SupplyC3 R4θU1IUSBIACIENDTPRGSDVINVINSNSMODEISELC2C15V0THGNDVOUTVOSNSVREFR1R2R3Li-Ion/Li-Pol Battery PackD1B1C4Li-Ion/Li-Polymer    Battery Charger IC Figure 29: Li-Ion (or Li-Polymer) battery charging application circuit
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 68 of 145 Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 470  NTC Various manufacturer C1, C4 1 µF Capacitor Ceramic X7R 0603 10% 16 V GRM188R71C105KA12 - Murata C2, C6 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 1 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H102KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C7 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C8 56 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E560JA01 - Murata C9 15 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1E150JA01 - Murata D1 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX R1, R2 24 k Resistor 0402 5% 0.1 W RC0402JR-0724KL - Yageo Phycomp R3 3.3 k Resistor 0402 5% 0.1 W RC0402JR-073K3L - Yageo Phycomp R4 1.0 k Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp U1 Single Cell Li-Ion (or Li-Polymer) Battery Charger IC for USB port and AC Adapter L6924U - STMicroelectronics Table 17: Suggested components for Li-Ion (or Li-Polymer) battery charging application circuit  2.1.1.8 Guidelines for VCC supply layout design Good  connection  of  the  module  VCC  pins  with  DC  supply  source  is  required  for  correct  RF  performance. Guidelines are summarized in the following list:  All the available VCC pins must be connected to the DC source  VCC connection must be as wide as possible and as short as possible  Any series component with Equivalent Series Resistance (ESR) greater than few milliohms must be avoided  VCC connection must be routed through a PCB area separated from sensitive analog signals and sensitive functional units: it is good practice to interpose at least one layer of PCB ground between  VCC track and other signal routing  Coupling between VCC and audio lines (especially microphone inputs) must be avoided, because the typical GSM burst has a periodic nature of approx. 217 Hz, which lies in the audible audio range  The tank bypass capacitor with low ESR for current spikes smoothing described in Figure 28 and Table 16 should be  placed close  to  the VCC  pins.  If the  main DC source is a switching  DC-DC converter,  place  the large  capacitor  close  to  the  DC-DC  output  and  minimize  the  VCC  track  length.  Otherwise  consider  using separate capacitors for DC-DC converter and SARA-G3 module tank capacitor  The  bypass  capacitors  in  the  pF  range  described  in  Figure  28  and  Table  16  should  be  placed  as  close  as possible to the VCC pins. This is highly recommended if the application device integrates an internal antenna  Since  VCC  is  directly  connected  to  RF  Power  Amplifiers,  voltage  ripple  at  high  frequency  may  result  in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which case  it  is better to select the highest operating frequency  for the switcher and add a large L-C filter before connecting to the SARA-G3 series modules in the worst case  If  VCC  is  protected  by  transient  voltage  suppressor  to  ensure  that  the  voltage  maximum  ratings  are  not exceeded,  place  the  protecting  device  along  the  path  from  the  DC  source  toward  the  SARA-G3  module, preferably closer to the DC source (otherwise protection functionality may be compromised)  2.1.1.9 Guidelines for grounding layout design Good connection of the module GND pins with application board solid ground layer is required for correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.  Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 69 of 145  The VCC supply current flows back to main DC source through GND as ground current: provide adequate return path with suitable uninterrupted ground plane to main DC source  If  the  application  board  is  a  multilayer  PCB,  then  it  is  required  to  connect  together  each  GND  area  with complete via stack down to main board ground layer  It is recommended to implement one layer of the application board as ground plane as wide as possible  Good grounding of GND pads also ensures thermal heat sink. This is critical during call connection, when the real  network commands the module  to transmit at maximum power: proper grounding  helps prevent module overheating  2.1.2 RTC supply (V_BCKP) 2.1.2.1 Guidelines for V_BCKP circuit design If  RTC  timing  is  required  to  run  for  a  time  interval  of  T  [s]  at  25  °C  when  VCC  supply  is  removed,  place  a capacitor  with a  nominal  capacitance  of  C  [µF]  at  the  V_BCKP pin. Choose  the  capacitor  using the  following formula: C [µF] = (Current_Consumption [µA] x T [s]) / Voltage_Drop [V] = 1.5 x T [s]  For example, a 100 µF capacitor (such as the Murata GRM43SR60J107M) can be placed at V_BCKP to provide a long buffering time. This capacitor holds V_BCKP voltage within its valid range for around 50 s at 25 °C, after the  VCC  supply  is  removed.  If  a  very  long  buffering  time  is  required,  a  70  mF  super-capacitor  (e.g.  Seiko Instruments XH414H-IV01E) can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 10 hours at 25 °C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. These capacitors allow the time reference to run during battery disconnection.  SARA-G3 seriesC1(a)2V_BCKPR2SARA-G3 seriesC2(superCap)(b)2V_BCKPD3SARA-G3 seriesB3(c)2V_BCKP Figure 30: Real time clock supply (V_BCKP) application circuits: (a) using a 100 µF capacitor to let the RTC run for ~50 s after VCC removal; (b) using a 70 mF capacitor to let RTC run for ~10 hours after VCC removal; (c) using a non-rechargeable battery Reference Description Part Number - Manufacturer C1 100 µF Tantalum Capacitor GRM43SR60J107M - Murata R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2 70 mF Capacitor  XH414H-IV01E - Seiko Instruments Table 18: Example of components for V_BCKP buffering  If longer buffering time is required to allow the  RTC time reference to run during a disconnection of the  VCC supply,  then  an  external  battery  can  be  connected  to  V_BCKP  pin.  The  battery  should  be  able  to  provide  a proper  nominal  voltage and must  never  exceed the  maximum operating  voltage  for  V_BCKP  (specified  in  the Input characteristics of Supply/Power pins table in SARA-G3 series Data Sheet [1]). The connection of the battery
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 70 of 145 to  V_BCKP  should  be  done  with  a  suitable  series  resistor  for  a  rechargeable  battery,  or  with  an  appropriate series  diode  for  a  non-rechargeable  battery.  The  purpose of  the  series  resistor  is  to  limit  the  battery  charging current due to the battery specifications, and also to allow a fast rise time of the voltage value at the V_BCKP pin after the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery.   If  the  RTC  timing  is  not  required  when  the  VCC  supply  is  removed,  it  is  not  needed  to  connect  the V_BCKP pin to an external capacitor or battery. In this case the date and time are not updated when VCC is disconnected. If  VCC is  always supplied, then the internal  regulator is  supplied from the  main  supply and there is no need for an external component on V_BCKP.  Combining  a  SARA-G3  wireless  module  with  a  u-blox  GPS/GNSS  positioning  receiver,  the  positioning  receiver VCC supply is controlled by the wireless module by means of the “GPS supply enable” function provided by the GPIO2 of the wireless module. In this case the V_BCKP supply output of the SARA-G3 wireless module can be connected  to  the  V_BCKP  backup  supply  input  pin  of  the  GPS/GNSS  receiver  to  provide  the  supply  for  the positioning real time clock and backup RAM when the VCC supply of the wireless module is within its operating range and the  VCC supply of the GPS/GNSS receiver is disabled.  This enables the  u-blox GPS/GNSS receiver to recover  from  a  power  breakdown  with  either  a  hot  start  or  a  warm  start  (depending  on  the  duration  of  the positioning VCC outage) and to maintain the configuration settings saved in the backup RAM. Refer to section 2.5.3 for more details regarding the application circuit with a u-blox GPS/GNSS receiver. On SARA-G300 and SARA-G310 modules, the V_BCKP supply output can be used to supply an external 32 kHz oscillator which provides a 32 kHz signal to the EXT32K input pin as reference clock for the RTC timing, so that the modules can enter the low power idle-mode and can make available the RTC functions.   The internal regulator for V_BCKP is optimized for low leakage current and very light loads. Do not apply loads which might exceed the limit for maximum available current from V_BCKP supply, as this can cause malfunctions in the module. SARA-G3 series Data Sheet [1] describes the detailed electrical characteristics.  V_BCKP  supply  output  pin  provides  internal  short  circuit  protection  to  limit  start-up  current  and  protect  the device in short circuit situations. No additional external short circuit protection is required.   ESD sensitivity rating of the V_BCKP supply pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if an accessible back-up battery connector is directly connected to V_BCKP pin. Higher protection level can be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  close  to  the accessible point.  2.1.2.2 Guidelines for V_BCKP layout design RTC supply (V_BCKP) requires careful layout: avoid injecting noise on this voltage  domain as it may affect the stability of the 32 kHz oscillator.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 71 of 145 2.1.3 Interface supply (V_INT) 2.1.3.1 Guidelines for V_INT circuit design The V_INT digital interfaces 1.8 V supply output can be mainly used to:  Pull-up DDC (I2C) interface signals (see section 2.5.3 for more details)  Pull-up SIM detection signal (see section 2.4 for more details)  Supply voltage translators to connect digital interfaces of the module to a 3.0 V device (see section 2.5.1)  Supply a 1.8 V u-blox 6 or subsequent GPS/GNSS receiver (see section 2.5.3 for more details)  Indicate when the module is switched on   Do not  apply  loads which  might  exceed the  limit for  maximum available  current from  V_INT  supply, as this  can  cause  malfunctions  in  internal  circuitry  supplies  to  the  same  domain.  SARA-G3  series Data Sheet [1] describes the detailed electrical characteristics.  V_INT can only be used as an output; do not connect any external regulator on V_INT.  Since the V_INT supply is generated by an internal switching step-down regulator, the V_INT voltage ripple can range from 15 mVpp during active-mode or connected-mode (when the switching regulator operates in PWM mode), to 90 mVpp in idle-mode (when the switching regulator operates in PFM mode).   It is not recommended to supply sensitive analog circuitry without adequate filtering for digital noise.  V_INT supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required.   ESD sensitivity rating of the V_INT  supply  pin  is 1 kV  (Human  Body Model according to  JESD22-A114). Higher  protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board. Higher  protection  level  can  be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) close to accessible point.   If the V_INT supply output is not required by the customer application, since DDC (I2C) interface and SIM detection functions are not used and voltage translation of digital interfaces are not needed, the  V_INT pin can be left  unconnected to external components,  but  it  is  recommended  providing direct access on the application board by means of accessible testpoint directly connected to the V_INT pin.  2.1.3.2 Guidelines for V_INT layout design V_INT  digital  interfaces  supply  output  is  generated  by  an  integrated  switching  step-down  converter,  used internally  to  supply  the  digital  interfaces.  Because  of  this,  it  can  be  a  source  of  noise:  avoid  coupling  with sensitive signals.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 72 of 145 2.2 System functions interfaces 2.2.1 Module power-on (PWR_ON) 2.2.1.1 Guidelines for PWR_ON circuit design Connecting the PWR_ON input to a push button that shorts the PWR_ON pin to ground, provide an external pull-up resistor (e.g. 100  kΩ)  biased  by  the  V_BCKP  supply pin of  the module, as  described  in  Figure 31 and Table  19.  Connecting  the  PWR_ON  input  to  a  push  button,  the  pin  will  be  externally  accessible  on  the application device: according to EMC/ESD requirements of the application, provide an additional ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point.   The PWR_ON pin has high input impedance and is weakly pulled to the high level on the module. Avoid keeping it floating in a noisy environment. To hold the high logic level stable, the PWR_ON pin must be connected to a pull-up resistor (e.g. 100 kΩ) biased by the V_BCKP supply pin of the module.  ESD sensitivity rating of the PWR_ON pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board,  e.g.  if  an accessible push button is directly connected to PWR_ON pin. Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible point.  Connecting the PWR_ON input to an external device (e.g. application processor), use an open drain output on the  external  device  with  an  external  pull-up  resistor  (e.g.  100  kΩ)  biased  by  the  V_BCKP  supply  pin  of  the module, as described in Figure 31 and Table 19. A  compatible  push-pull  output  of  an  application  processor  can  also  be  used:  in  this  case  the  pull-up  can  be provided to pull the PWR_ON level high when the application processor is switched off. If the high-level voltage of the push-pull output  pin  of the application processor is greater than  the maximum  input  voltage operating range of the V_BCKP pin (refer to SARA-G3 series Data Sheet [1]), the V_BCKP supply cannot be used to bias the pull-up resistor: the supply rail of the application processor or the module VCC supply could be used, but this increases the V_BCKP (RTC supply) current consumption when the module is in not-powered mode (VCC supply not present). Using a push-pull output of the external device, take care to fix the proper level in all the possible scenarios to avoid an inappropriate module switch-on.  SARA-G3 seriesRext2V_BCKP15 PWR_ONPower-on push buttonESDOpen Drain OutputApplication ProcessorSARA-G3 seriesRext2V_BCKP15 PWR_ONTP TP Figure 31: PWR_ON application circuits using a push button and an open drain output of an application processor Reference Description Remarks Rext 100 kΩ Resistor 0402 5% 0.1 W External pull-up resistor ESD CT0402S14AHSG - EPCOS Varistor array for ESD protection Table 19: Example of pull-up resistor and ESD protection for the PWR_ON application circuit  It  is recommended  to  provide  direct access to  the  PWR_ON  pin  on  the  application  board  by  means  of accessible testpoint directly connected to the PWR_ON pin.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 73 of 145 2.2.1.2 Guidelines for PWR_ON layout design The power-on circuit (PWR_ON) requires careful layout since it is the sensitive input available to switch on the SARA-G3 modules until a valid VCC supply is provided after that the module has been switched off by means of the  AT+CPWROFF  command:  ensure  that  the  voltage  level  is  well  defined  during  operation  and  no  transient noise is coupled on this line, otherwise the module might detect a spurious power-on request.  2.2.2 Module reset (RESET_N) 2.2.2.1 Guidelines for RESET_N circuit design As described in Figure 13, the module has an internal pull-up resistor on the reset input line: an external pull-up is not required on the application board. Connecting  the  RESET_N  input  to  a  push  button  that  shorts  the  RESET_N  pin  to  ground,  the  pin  will  be externally accessible on the application device: according to EMC/ESD requirements of the application, provide an additional ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point, as described in Figure 32 and Table 20.   ESD sensitivity rating of the RESET_N pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board,  e.g.  if  an accessible push button is directly connected to RESET_N pin. Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible point.  Connecting the RESET_N input to an external device (e.g. application processor), an open drain output can be directly  connected  without  any  external  pull-up,  as  described  in  Figure  32  and  Table  20:  the  internal  pull-up resistor provided by the module pulls the line to the high logic level when the RESET_N pin is not forced low by the application processor. A compatible push-pull output of an application processor can be used too.  SARA-G3 series18 RESET_NReset      push buttonESDOpen Drain OutputApplication ProcessorSARA-G3 series18 RESET_NTP TP Figure 32: RESET_N application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection CT0402S14AHSG - EPCOS Table 20: Example of ESD protection component for the RESET_N application circuit  If the external reset function is not required by the customer application, the  RESET_N input pin can be left  unconnected  to  external  components,  but  it  is  recommended  providing  direct  access  on  the application board by means of accessible testpoint directly connected to the RESET_N pin.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 74 of 145 2.2.2.2 Guidelines for RESET_N layout design The reset circuit (RESET_N) requires careful layout due to the pin function: ensure that the voltage level is well defined during  operation and no  transient noise  is coupled on  this line,  otherwise  the  module might  detect a spurious reset request. It is recommended to keep the connection line to RESET_N as short as possible.  2.2.3 External 32 kHz signal input (EXT32K) 2.2.3.1 Guidelines for EXT32K circuit design The application circuit of  Figure 33 and Table 21 describe how to provide a 32.768 kHz square wave from an external oscillator to the EXT32K input pin of SARA-G300 and SARA-G310 modules, as reference clock for the Real Time Clock timing, so that the modules can enter the low power idle-mode and can provide RTC functions. As alternative solution, a reference signal with proper frequency and voltage levels can be provided by the used application processor, if capable, instead of using a dedicated stand-alone oscillator. SARA-G350 modules do not provide EXT32K input pin since the 32 kHz reference clock for the Real Time Clock (RTC) timing is generated by the available internal oscillator.  2V_BCKPGNDSARA-G300 SARA-G31031 EXT32K32 kHz OscillatorGNDCLKOUTOEVCCC1U1 Figure 33: EXT32K application circuit using an external 32 kHz oscillator Reference Description Remarks C1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Low Power Clock Oscillator 32.768 kHz OV-7604-C7 - Micro Crystal or SG-3040LC - EPSON TOYOCOM Table 21: Example of components for the EXT32K application circuit   ESD sensitivity rating of the EXT32K input pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board. Higher protection  level can  be achieved  by  mounting  an ESD  protection (e.g.  EPCOS  CA05P4S14THSG  varistor array) close to accessible point.   If  the  low  power  idle-mode  and  the  RTC  functions  are  not  required  by  the  customer  application,  the EXT32K input pin can be left not connected.  2.2.3.2 Guidelines for EXT32K layout design The external 32 kHz (EXT32K) input pin requires accurate layout design: avoid injecting noise on this pin as it may affect the stability of the RTC timing reference.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 75 of 145 2.3 Antenna interface The  ANT  pin,  provided  by  all  SARA-G3  modules,  represents  the  main  RF  input/output  used  to  transmit  and receive the GSM/GPRS RF signal: the main antenna must be connected to this pad. The ANT pin has a nominal characteristic impedance of  50  and must  be connected to the antenna through a 50   transmission line to allow transmission and reception of radio frequency (RF) signals in the 2G and 3G operating bands.  2.3.1 Antenna RF interface (ANT) 2.3.1.1 General guidelines for antenna selection and design The GSM antenna is the most critical component to be evaluated: care must be taken about it at the start of the design development, when  the  physical dimensions  of  the application  board are  under analysis/decision,  since the  RF  compliance  of  the  device  integrating  SARA-G3  module  with  all  the  applicable  required  certification schemes depends from antenna radiating performance.  GSM antennas are typically available as:  Linear monopole / External antenna: o External antenna usage basically does not imply physical restriction to the design of the PCB where the SARA-G3 series module is mounted o The  radiation  performance  mainly  depends  on  the  antenna:  select  the  antenna  with  optimal radiating performance in the operating bands o If antenna detection functionality is  required, select  an  antenna assembly  provided  with a proper built-in diagnostic circuit with a resistor connected to ground: refer to guidelines in section 2.3.2 o Select an RF cable with minimum insertion loss: additional insertion loss due to low quality or long cable reduces radiation performance o Select a suitable 50  connector providing proper PCB-to-RF-cable transition: it is recommended to strictly follow the layout guidelines provided by the connector manufacturer  Patch-like antenna / Integrated antenna: o Internal integrated antenna implies physical restriction to the design of the PCB: the ground plane can be reduced down to a minimum size that must be similar to the quarter of the wavelength of the minimum frequency that has to be radiated. As numerical example:   Frequency = 1 GHz  Wavelength = 30 cm  Minimum GND plane size = 7.5 cm o The  radiation  performance  depends  on  the  whole  PCB  and  antenna  system  design,  including product  mechanical  design  and  usage:  select  the  antenna  with  optimal  radiating  performance  in the operating bands according to the mechanical specifications of the PCB and the whole product o Select  a  complete custom  antenna  designed  by an  antenna manufacturer  if  the  required  ground plane dimensions  are  very small (e.g.  less than  6.5  cm long and  4 cm wide): the antenna  design process should begin at the start of the whole product design process o Select an integrated antenna solution provided by an antenna manufacturer if the required ground plane  dimensions  are  enough  large  according  to  the  relative  integrated  antenna  solution specifications:  the  antenna  selection  and  the  definition  of  its  placement  in  the  product  layout should begin at the start of the product design process o It  is  highly  recommended  to  strictly  follow  the  detailed  and  specific  guidelines  provided  by  the antenna  manufacturer  regarding  correct  installation  and  deployment  of  the  antenna  system, including PCB layout and matching circuitry o Further to the custom PCB  and product restrictions, the antenna may require a tuning to comply with  all  the  applicable  required  certification  schemes:  it  is  recommended  to  consult  the  antenna manufacturer for the design-in guidelines for antenna matching relative to the custom application
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 76 of 145 In both cases, selecting an external or an internal antenna, observe these recommendations:  Select an antenna providing optimal return loss (or V.S.W.R.) figure over all the operating frequencies  Select an antenna providing optimal efficiency figure over all the operating frequencies  Select an antenna providing appropriate gain figure (i.e. combined antenna directivity and efficiency figure) so  that  the  electromagnetic  field  radiation  intensity  do  not  exceed  the  regulatory  limits  specified  in  some countries (e.g. by FCC in the United States, as reported in the chapter 4.2.2)  2.3.1.2 Guidelines for antenna RF interface design Guidelines for ANT pin RF connection design Proper  transition  between  the  ANT  pad  and  the  application  board  PCB  must  be  provided,  implementing  the following design-in guidelines for the layout of the application PCB close to the ANT pad:  On a multi layer board, the whole layer stack below the RF connection should be free of digital lines  Increase GND keep-out (i.e. clearance, a void area) around the ANT pad, on the top layer of the application PCB,  to  at  least  250 µm  up  to  adjacent  pads  metal  definition  and  up  to  400 µm  on  the  area  below  the module, to reduce parasitic capacitance to ground, as described in the left picture in Figure 34  Add GND keep-out (i.e. clearance, a void area) on the buried metal layer below the ANT pad if the top-layer to buried layer dielectric thickness is below 200 µm, to reduce parasitic capacitance to ground, as described in the right picture in Figure 34  GND clearance on buried layer          below ANT padGNDMin. 250 µmMin. 400 µmGND clearance on top layer around ANT pad Figure 34: GND keep-out area on the top layer around ANT pad and on the very close buried layer below ANT pad  Guidelines for RF transmission line design The transmission  line  from the  ANT pad up to antenna  connector or  up  to  the internal antenna  pad  must  be designed so that the characteristic impedance is as close as possible to 50 . The transmission line can be designed as a micro strip (consists of a conducting strip separated from a ground plane by a dielectric material) or a strip line (consists of a flat strip of metal which is sandwiched between two parallel ground planes within a dielectric material). The micro strip, implemented as a coplanar waveguide, is the most common configuration for printed circuit board.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 77 of 145 Figure 35 and Figure 36 provide two examples of proper 50  coplanar waveguide designs: the first transmission line can be implemented in case of 4-layer PCB stack-up herein described, the second transmission line can be implemented in case of 2-layer PCB stack-up herein described. 35 um35 um35 um35 um270 um270 um760 umL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric380 um 500 um500 um Figure 35: Example of 50  coplanar waveguide transmission line design for the described 4-layer board layup 35 um35 um1510 umL2 CopperL1 CopperFR-4 dielectric1200 um 400 um400 um Figure 36: Example of 50  coplanar waveguide transmission line design for the described 2-layer board layup  If the two examples do not match the application PCB layup, the 50  characteristic impedance calculation can be  made  using  the  HFSS  commercial  finite  element  method  solver  for  electromagnetic  structures  from  Ansys Corporation, or using freeware tools like AppCAD from Agilent or TXLine from Applied Wave Research, taking care of the approximation formulas used by the tools for the impedance computation. To achieve a 50  characteristic impedance, the width of the transmission line must be chosen depending on:  the thickness of the transmission line itself (e.g. 35 µm in the example of Figure 35 and Figure 36)  the thickness of the dielectric material between the top layer (where the transmission line is routed) and the inner closer layer implementing the ground plane (e.g. 270 µm in Figure 35, 1510 µm in Figure 36)  the  dielectric  constant  of  the  dielectric  material  (e.g.  dielectric  constant  of  the  FR-4  dielectric  material  in Figure 35 and Figure 36)  the gap from the transmission line to the adjacent ground plane on the same layer of the transmission line (e.g. 500 µm in Figure 35, 400 µm in Figure 36)  If the distance between the transmission line and the adjacent GND area (on the same layer) does not exceed 5 times the track width of the micro strip, use the “Coplanar Waveguide” model for the 50  calculation.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 78 of 145 Additionally to the 50  impedance, the following guidelines are recommended for the transmission line design:  Minimize  the  transmission  line  length: the  insertion  loss  should  be minimized  as  much  as  possible,  in  the order of a few tenths of a dB  Add GND keep-out (i.e. clearance, a void area) on buried metal layers below any pad of component present on  the  RF  transmission  line,  if  top-layer  to  buried  layer  dielectric  thickness  is  below  200 µm,  to  reduce parasitic capacitance to ground  The transmission line width and spacing to GND must be uniform and routed as smoothly as possible: avoid abrupt changes of width and spacing to GND  Add GND vias around transmission line, as described in Figure 37  Ensure  solid  metal  connection  of  the  adjacent  metal  layer  on  the  PCB  stack-up  to  main  ground  layer, providing enough on the adjacent metal layer, as described in Figure 37  Route RF transmission line far from any noise source (as switching supplies and digital lines) and from any sensitive circuit (as analog audio lines)  Avoid stubs on the transmission line  Avoid signal routing in parallel to transmission line or crossing the transmission line on buried metal layer  Do not route microstrip line below discrete component or other mechanics placed on top layer  An example of proper RF circuit design is reported in the Figure 37. In this case, the antenna detection circuit is not  implemented:  the  ANT  pin  is  directly  connected  to  an  SMA  connector  by  means  of  a  proper  50  transmission line, designed with proper layout. If  the  antenna  detection  function  is  required  by  the  application,  follow  the  guidelines  for  circuit  and  layout implementation reported in section 2.3.2.  SARA-G3 seriesSMAconnector Figure 37: Suggested circuit and layout for antenna RF circuit on application board, if antenna detection is not required
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 79 of 145 Guidelines for RF termination design The RF termination must provide a characteristic impedance of 50  as well as the RF transmission line up to the RF termination itself, to match the characteristic impedance of the ANT pin of SARA-G3 modules. However, real antennas have no perfect 50  load on all the supported frequency bands. Therefore, to reduce as  much  as  possible  performance  degradation  due  to  antenna  mismatch,  the  RF  termination  must  provide optimal return loss (or V.S.W.R.) figure over all the operating frequency bands, as summarized in Table 8.  If an external antenna is used, the antenna connector represents the RF termination on the PCB:  Use a suitable 50  connector providing proper PCB-to-RF-cable transition  Strictly follow the connector manufacturer’s recommended layout, for example:  o SMA  Pin-Through-Hole  connectors  require  GND  keep-out  (i.e.  clearance,  a  void  area)  on  all  the layers around the central pin up to annular pads of the four GND posts, as shown in Figure 37 o U.FL surface mounted  connectors require no  conductive traces  (i.e.  clearance, a void  area)  in  the area below the connector between the GND land pads  Cut out the GND layer under RF connectors and close to buried vias, to remove stray capacitance and thus keep the RF line 50 : e.g. the active pad of U.FL connectors needs to have a GND keep-out (i.e. clearance, a void area) at least on first inner layer to reduce parasitic capacitance to ground  If an integrated antenna is used, the RF termination is represented by the integrated antenna itself:  Use an antenna designed by an antenna manufacturer, providing the best possible return loss (or V.S.W.R.)  Provide a ground plane enough large according to the relative integrated antenna requirements: the ground plane of the application PCB can be reduced down to a minimum size that must be similar to one quarter of wavelength of the minimum frequency that has to be radiated. As numerical example   Frequency = 1 GHz  Wavelength = 30 cm  Minimum GND plane size = 7.5 cm  It  is  highly  recommended  to  strictly  follow  the  detailed  and  specific  guidelines  provided  by  the  antenna manufacturer  regarding  correct  installation  and  deployment  of  the  antenna  system,  including  PCB  layout and matching circuitry  Further to the custom PCB and product restrictions, the antenna may require a tuning to comply with all the applicable  required certification schemes:  it is  recommended to  consult  the  antenna  manufacturer  for  the design-in guidelines for the antenna matching relative to the custom application  Additionally, these recommendations regarding the antenna system placement must be followed:  Do not include antenna within closed metal case  Do not place the antenna in close vicinity to end user since the emitted radiation in human tissue is limited by regulatory requirements  Place the antenna far from sensitive analog systems or employ countermeasures to reduce electromagnetic compatibility issues  Take care of interaction between co-located RF systems since the GSM transmitted power may interact or disturb the performance of companion systems
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 80 of 145 2.3.2 Antenna detection interface (ANT_DET) 2.3.2.1 Guidelines for ANT_DET circuit design Figure 38 and Table 22 describe the recommended schematic and components for the antenna detection circuit to  be  provided  on  the  application  board  for  the  diagnostic  circuit  that  must  be  provided  on  the  antenna assembly to achieve antenna detection functionality.  Application BoardAntenna CableSARA-G35056ANT62ANT_DET R1C1 D1L1C2 J1Z0= 50 ohm Z0= 50 ohm Z0= 50 ohmAntenna AssemblyR2C3L2Radiating ElementDiagnostic Circuit Figure 38: Suggested schematic for antenna detection circuit on application board and diagnostic circuit on antenna assembly Reference Description Part Number - Manufacturer C1 27 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H270J - Murata C2 33 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H330J - Murata D1 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics L1 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata R1 10 k Resistor 0402 1% 0.063 W RK73H1ETTP1002F - KOA Speer J1 SMA Connector 50  Through Hole Jack SMA6251A1-3GT50G-50 - Amphenol C3 22 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1H220J - Murata L2 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata R2 15 k Resistor for Diagnostic Various Manufacturers Table 22: Suggested components for antenna detection circuit on application board and diagnostic circuit on antenna assembly  The antenna detection circuit and diagnostic circuit suggested in Figure 38 and Table 22 are here explained:  When antenna detection is forced by the +UANTR AT command, the ANT_DET pin generates a DC current measuring the resistance (R2) from the antenna connector (J1) provided on the application board to GND  DC  blocking  capacitors  are  needed  at  the  ANT  pin  (C2)  and  at  the  antenna  radiating  element  (C3)  to decouple the DC current generated by the ANT_DET pin  Choke inductors with a Self Resonance Frequency (SRF) in the range of 1 GHz are needed  in series at the ANT_DET pin (L1) and in series at the diagnostic resistor (L2), to avoid a reduction of the RF performance of the system, improving the RF isolation of the load resistor.   Additional components (R1, C1 and D1 in Figure 38) are needed at the ANT_DET pin as ESD protection  The ANT pin must  be connected to the  antenna connector  by  means of  a transmission line with  nominal characteristics impedance as close as possible to 50 
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 81 of 145 The DC impedance at  RF port  for  some antennas may  be a  DC open  (e.g. linear  monopole) or a DC  short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of Figure 38, the measured DC resistance is always at the limits of the measurement range (respectively open or short), and there is no mean to  distinguish  between  a  defect  on  antenna  path  with  similar  characteristics  (respectively:  removal  of  linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other DC signal injected to the RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection.   It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 k to 30 k to  assure  good  antenna  detection  functionality  and  avoid  a  reduction  of  module  RF  performance.  The choke inductor should exhibit a parallel Self Resonance Frequency (SRF) in the range of 1 GHz to improve the RF isolation of load resistor.  For example: Consider a GSM antenna with built-in DC load resistor of 15 k. Using the +UANTR AT command, the module reports the resistance value evaluated from the antenna connector provided on the application board to GND:  Reported  values close  to  the  used  diagnostic  resistor  nominal  value  (i.e.  values from  13  k  to  17  k  if  a 15 k diagnostic resistor is used) indicate that the antenna is properly connected  Values  close  to  the  measurement  range  maximum  limit  (approximately  50  k)  or  an  open-circuit “over range” report (see u-blox AT Commands Manual [2]) means that that the antenna is not connected or the RF cable is broken  Reported values below the measurement range minimum limit (1 k) highlights a short to GND at antenna or along the RF cable  Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic  Reported  value  could  differ  from  the  real  resistance  value  of  the  diagnostic  resistor  mounted  inside  the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method   If the antenna detection function is not required by the customer application, the  ANT_DET pin can be left not connected and the ANT pin can be directly connected to the antenna connector by means of a 50  transmission line as described in Figure 37.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 82 of 145 2.3.2.1 Guidelines for ANT_DET layout design Figure 39 describes the recommended layout for the antenna detection circuit to be provided on the application board to achieve antenna detection functionality, implementing the recommended schematic described in Figure 38 and Table 22.  SARA-G350C2R1D1C1L1J1 Figure 39: Suggested layout for antenna detection circuit on application board  The antenna detection circuit layout suggested in Figure 39 is here explained:  The ANT pin is connected to the antenna connector by means of a 50  transmission line, implementing the design guidelines described in section 2.3.1 and the recommendations of the SMA connector manufacturer  DC blocking capacitor at the ANT pin (C2) is placed in series to the 50  transmission line  The ANT_DET pin is connected to the 50  transmission line by means of a sense line  Choke inductor in series at the ANT_DET pin (L1) is placed so that one pad is on the 50  transmission line and the other pad represents the start of the sense line to the ANT_DET pin  The additional components (R1, C1 and D1) on the ANT_DET line are placed as ESD protection
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 83 of 145 2.4 SIM interface 2.4.1.1 Guidelines for SIM circuit design Guidelines for SIM cards, SIM connectors and SIM chips selection The ISO/IEC 7816, the ETSI TS 102 221 and the ETSI TS 102 671 specifications define the physical, electrical and functional characteristics of Universal Integrated Circuit Cards (UICC) which contains the Subscriber Identification Module  (SIM)  integrated  circuit  that  securely  stores  all  the  information  needed  to  identify  and  authenticate subscribers over the GSM network.  Removable UICC / SIM card contacts mapping is defined by ISO/IEC 7816 and ETSI TS 102 221as follows:  Contact C1 = VCC (Supply)              It must be connected to VSIM  Contact C2 = RST (Reset)              It must be connected to SIM_RST  Contact C3 = CLK (Clock)              It must be connected to SIM_CLK  Contact C4 = AUX1 (Auxiliary contact)         It must be left not connected  Contact C5 = GND (Ground)            It must be connected to GND  Contact C6 = VPP (Programming supply)         It must be connected to VSIM  Contact C7 = I/O (Data input/output)          It must be connected to SIM_IO  Contact C8 = AUX2 (Auxiliary contact)         It must be left not connected A removable SIM card can have 6 contacts (C1 = VCC, C2 = RST, C3 = CLK, C5 = GND, C6 = VPP, C7 = I/O) or 8 contacts, providing also the auxiliary contacts C4 = AUX1 and C8 = AUX2 for USB interfaces and other uses. Only 6 contacts are required and must be connected to the module SIM card interface as described above, since SARA-G3 modules do not support the additional auxiliary features (contacts C4 = AUX1 and C8 = AUX2). Removable SIM card are suitable for applications where the SIM changing is required during the product lifetime.  A SIM card holder  can have  6  or  8 positions  if  a mechanical  card presence  detector is not  provided, or  it  can have 6+2 or 8+2 positions if two additional pins  relative to the normally-open mechanical switch integrated in the SIM  connector  for  the mechanical card  presence  detection are provided:  select a  SIM  connector  providing 6+2 or  8+2  positions  if  the  optional  SIM  detection  feature  is required  by  the  custom  application,  otherwise  a connector without integrated mechanical presence switch can be selected.  Solderable UICC / SIM chip contacts mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671 as follows:  Package Pin 8 = UICC Contact C1 = VCC (Supply)        It must be connected to VSIM  Package Pin 7 = UICC Contact C2 = RST (Reset)        It must be connected to SIM_RST  Package Pin 6 = UICC Contact C3 = CLK (Clock)        It must be connected to SIM_CLK  Package Pin 5 = UICC Contact C4 = AUX1 (Auxiliary contact)      It must be left not connected  Package Pin 1 = UICC Contact C5 = GND (Ground)       It must be connected to GND  Package Pin 2 = UICC Contact C6 = VPP (Programming supply)   It must be connected to VSIM  Package Pin 3 = UICC Contact C7 = I/O (Data input/output)      It must be connected to SIM_IO  Package Pin 4 = UICC Contact C8 = AUX2 (Auxiliary contact)      It must be left not connected A solderable SIM chip has 8 contacts and can provide also the auxiliary contacts C4 = AUX1 and C8 = AUX2 for USB interfaces and other uses, but only 6 contacts are required and must be connected to the module SIM card interface as described above, since SARA-G3 modules do not support the additional auxiliary features (contacts C4 = AUX1 and C8 = AUX2). Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once installed.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 84 of 145 Guidelines for single SIM card connection without detection A  removable  SIM  card  placed  in  a  SIM  card  holder  must  be  connected  the  SIM  card  interface  of  SARA-G3 modules as described in Figure 40, where the optional SIM detection feature is not implemented (refer to the circuit described in Figure 42 if the SIM detection feature is not required). Follow these guidelines connecting the module to a SIM connector without SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module  Connect the UICC / SIM contact C5 (GND) to ground  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the relative pad of the SIM connector, to prevent digital noise  Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H470J)  on  each  SIM  line (VSIM, SIM_CLK, SIM_IO,  SIM_RST), very close to each relative pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each relative pad of the SIM connector: ESD sensitivity rating of the  SIM interface pins is 1  kV  (Human Body  Model  according  to  JESD22-A114),  so  that,  according to  the EMC/ESD  requirements  of  the  custom  application,  higher  protection  level  can  be  required  if  the  lines  are externally accessible on the application device  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  SARA-G3 series41VSIM39SIM_IO38SIM_CLK40SIM_RST4V_INT42SIM_DETSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4C8C4TP Figure 40: Application circuit for the connection to a single removable SIM card, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3, D4 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  J1 SIM Card Holder 6 positions, without card presence switch Various Manufacturers, C707 10M006 136 2 - Amphenol Table 23: Example of components for the connection to a single removable SIM card, with SIM detection not implemented
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 85 of 145 Guidelines for single SIM chip connection A solderable SIM chip (M2M UICC Form Factor) must be connected the SIM card interface of SARA-G3 modules as  described  in  Figure  41,  where  the  optional  SIM  detection  feature  is  not  implemented  (refer  to  the  circuit described in Figure 42 if the SIM detection feature is not required). Follow these guidelines connecting the module to a solderable SIM chip without SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module  Connect the UICC / SIM contact C5 (GND) to ground  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM) close to the relative pad of the SIM chip, to prevent digital noise   Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H470J)  on  each  SIM  line (VSIM, SIM_CLK,  SIM_IO,  SIM_RST),  to  prevent  RF  coupling  especially  in  case  the  RF  antenna  is  placed closer than 10 - 30 cm from the SIM card holder  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  SARA-G3 series41VSIM39SIM_IO38SIM_CLK40SIM_RST4V_INT42SIM_DET SIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5U1C4283671C1 C5C2 C6C3 C7C4 C887651234TP Figure 41: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata U1 SIM chip (M2M UICC Form Factor) Various Manufacturers Table 24: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented  Guidelines for single SIM card connection with detection A removable  SIM  card  placed  in  a  SIM  card  holder  must  be  connected  to the  SIM  card interface of  SARA-G3 modules as described in Figure 42, where the optional SIM card detection feature is implemented. Follow these guidelines connecting the module to a SIM connector implementing SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 86 of 145  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module  Connect the UICC / SIM contact C5 (GND) to ground  Connect one pin of the mechanical switch integrated in the SIM connector (e.g. the SW2 pin as described in Figure 42) to the SIM_DET input pin of the module  Connect  the  other  pin  of  the  mechanical  switch  integrated  in  the  SIM  connector  (e.g.  the  SW1  pin  as described in Figure 42) to the V_INT 1.8 V supply output of the module by means of a strong (e.g. 1 k) pull-up resistor, as the R1 resistor in Figure 42  Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in Figure 42  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the relative pad of the SIM connector, to prevent digital noise   Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H470J)  on  each  SIM  line (VSIM, SIM_CLK, SIM_IO,  SIM_RST), very close to each relative pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each relative pad of the SIM connector: ESD sensitivity rating of the  SIM interface pins is 1  kV  (Human Body  Model  according  to  JESD22-A114),  so  that,  according to  the EMC/ESD  requirements  of  the  custom  application,  higher  protection  level  can  be  required  if  the  lines  are externally accessible on the application device  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  SARA-G3 series41VSIM39SIM_IO38SIM_CLK40SIM_RST4V_INT42SIM_DETSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4SW1SW2D1 D2 D3 D4 D5 D6R2R1C8C4TP Figure 42: Application circuit for the connection to a single removable SIM card, with SIM detection implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3,  D4, D5, D6 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 1 k Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2 470 k Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp J1 SIM Card Holder 6 + 2 positions, with card presence switch Various Manufacturers, CCM03-3013LFT R102 - C&K Components Table 25: Example of components for the connection to a single removable SIM card, with SIM detection implemented
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 87 of 145 Guidelines for dual SIM card connection with detection Two removable SIM card placed in two different SIM card holders must be connected to the SIM card interface of SARA-G3 modules as described in Figure 43, providing also the SIM card detection feature. SARA-G3 modules do not support the usage of two SIM at the same time, but two SIM can be populated on the application board providing a proper switch to connect only the first or only the second SIM per time to the SIM card interface of the SARA-G3 modules as described in Figure 43. SARA-G3 modules do not support SIM hot insertion / removal: the module is able to properly use a SIM only if the SIM / module physical connection is provided before the module boot and then held for normal operation. Switching from one SIM to another one can only be properly done within one of these two time periods:  after module switch-off by the AT+CPWROFF and before module switch-on by PWR_ON  after network deregistration by AT+COPS=2 and before module reset by AT+CFUN=16 or RESET_N In the application circuit represented in Figure 43, the application processor must drive the SIM switch using its own GPIO before the module boot, to properly select the SIM that is used after the module boot. If the SIM detection feature is not required by the custom application, the relative detection circuit described in Figure 43 can be not implemented in the dual SIM connection circuit, leaving SIM_DET pin not connected. The  dual  SIM  connection  circuit  described  in  Figure  43  can  be  implemented  for  SIM  chips  as  well,  providing proper connection between SIM switch and SIM chip as described in Figure 41. If it is required to switch between more than two SIM, a circuit similar to the one described in Figure 43 can be implemented: for example, in case of four SIM circuit, using proper four-throw switches instead of the suggested double-throw switches.  Follow these guidelines connecting the module to two SIM connectors implementing SIM presence detection:  Connect  the  contacts  C1  (VCC)  and  C6  (VPP)  of  the  two  UICC  /  SIM  to  the  VSIM  pin  of  the  module  by means  of  a  proper  low  on  resistance  (i.e.  few  ohms)  and  low  on  capacitance  (i.e.  few  pF)  double-throw analog switch (e.g. Fairchild FSA2567) to ensure high-speed data transfer according to SIM requirements  Connect the contact C7 (I/O) of the two UICC / SIM to the SIM_IO pin of the module by means of a proper low  on  resistance  (i.e.  few  ohms)  and  low  on  capacitance  (i.e.  few  pF)  double-throw  analog  switch  (e.g. Fairchild FSA2567) to ensure high-speed data transfer according to SIM requirements  Connect  the contact C3  (CLK)  of  the  two  UICC /  SIM  to the  SIM_CLK  pin  of  the  module  by  means  of  a proper low on resistance (i.e. few ohms) and low on capacitance (i.e. few pF) double-throw analog switch (e.g. Fairchild FSA2567) to ensure high-speed data transfer according to SIM requirements  Connect  the  contact  C2  (RST)  of  the  two  UICC /  SIM  to  the  SIM_RST  pin  of  the  module  by  means  of  a proper low on resistance (i.e. few ohms) and low on capacitance (i.e. few pF) double-throw analog switch (e.g. Fairchild FSA2567) to ensure high-speed data transfer according to SIM requirements  Connect the contact C5 (GND) of the two UICC / SIM to ground  Connect  one  pin  of  the  mechanical  switch  integrated  in  the  two  SIM  connectors  (e.g.  the  SW2  pins  as described in Figure 43) to the SIM_DET input pin of the module by means of a proper double-throw digital switch (e.g. NXP 74LVC1G157)  Connect the other pin of the mechanical switch integrated in the two SIM connectors (e.g. the SW1 pins as described in Figure 43) to the V_INT 1.8 V supply output of the module by means of a strong (e.g. 1 k) pull-up resistor, as the R1 and R3 resistors in Figure 43  Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, between the double-throw digital switch and the relative SIM connector as the R2 and R4 resistors in Figure 43  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the relative pad of the two SIM connectors, to prevent digital noise   Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H470J)  on  each  SIM  line (VSIM, SIM_CLK, SIM_IO, SIM_RST), very close to each relative pad of the two SIM connectors, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holders
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 88 of 145  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each relative pad of the two SIM connectors, according to the EMC/ESD requirements of the custom application  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  SARA-G3 seriesC1FIRST             SIM CARD HOLDERVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4SW1SW2D1 D2 D3 D4 D5 D6GNDU141VSIM VSIM 1VSIM2VSIMVCCC114PDT Analog Switch3V839SIM_IO DAT 1DAT2DAT38SIM_CLK CLK 1CLK2CLK40SIM_RST RST 1RST2RSTSELYGNDU2I0I1VCCSPDT Digital SwitchS42SIM_DET4V_INTC12R4R3SECOND   SIM CARD HOLDERVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2SW1SW2C6 C7 C8 C10C9 D7 D8 D9 D10 D11 D12R2R1Application ProcessorGPIOR5TP Figure 43: Application circuit for the connection to two removable SIM cards, with SIM detection implemented Reference Description Part Number - Manufacturer C1 – C4, C6 – C9 33 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5, C10 – C12 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1 – D12 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1, R3 1 kΩ Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2, R4 470 kΩ Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp R5 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL- Yageo Phycomp J1, J2 SIM Card Holder, 6 + 2 p., with card presence switch CCM03-3013LFT R102 - C&K Components U1 4PDT Analog Switch,  with Low On-Capacitance and Low On-Resistance FSA2567 - Fairchild Semiconductor U2 Single 2-Input Digital Multiplexer  74LVC1G157 - NXP Semiconductors Table 26: Example of components for the connection to two removable SIM cards, with SIM detection implemented
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 89 of 145 2.4.1.2 Guidelines for SIM layout design The layout of the SIM card interface lines (VSIM, SIM_CLK, SIM_IO, SIM_RST) may be critical if the SIM card is placed  far  away  from  the  SARA-G3  series  modules  or  in  close  proximity  to  the  RF  antenna:  these  two  cases should be avoided or at least mitigated as described below.  In the first case, the long connection can cause the radiation of some harmonics of the digital data frequency as any other digital interface: keep the traces short and avoid coupling with RF line or sensitive analog inputs. In  the  second  case,  the  same  harmonics  can  be  picked  up  and  create  self-interference  that  can  reduce  the sensitivity of GSM receiver channels whose carrier frequency is coincidental with harmonic frequencies: placing the RF bypass capacitors suggested in Figure 42 near the SIM connector will mitigate the problem. In addition, since the SIM card is typically accessed by the end user, it can be subjected to ESD discharges: add adequate ESD protection as suggested in Figure 42 to protect module SIM pins near the SIM connector. Limit  capacitance  and  series  resistance  on  each  SIM  signal  to  match  the  SIM  specifications:  the  connections should always be kept as short as possible. Avoid coupling with any sensitive analog circuit, since the SIM signals can cause the radiation of some harmonics of the digital data frequency
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 90 of 145 2.5 Serial interfaces 2.5.1 Asynchronous serial interface (UART) 2.5.1.1 Guidelines for UART circuit design Providing the full RS-232 functionality (using the complete V.24 link) If RS-232 compatible signal levels are needed, two different external voltage translators (e.g. Maxim MAX3237E and Texas Instruments SN74AVC8T245PW) can be used to provide full RS-232 (9 lines) functionality. The Texas Instruments  chip  provides  the  translation  from  1.8  V  to  3.3  V,  while  the  Maxim  chip  provides  the  translation from 3.3 V to RS-232 compatible signal level. If a 1.8V application processor is used, for complete RS-232 functionality conforming to ITU Recommendation [9] in DTE/DCE  serial communication, the  complete UART  interface of the module (DCE) must  be connected to  a 1.8 V application processor (DTE) as described in Figure 44. TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDSARA-G3 series (1.8V DCE)12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND Figure 44: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 45. 4V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDSARA-G3 series (1.8V DCE)12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2B3A3VCCBVCCAUnidirectionalVoltage TranslatorC3 C43V0DIR1DIR3 OEB2 A2B4A4DIR4DIR2TP Figure 45: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1, U2 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 27: Component for UART application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 91 of 145 Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link) If the functionality of the DSR, DCD, RI and DTR lines is not required in, or the lines are not available:  Connect the module DTR input line to GND, since the module requires DTR active (low electrical level)  Leave DSR, DCD and RI lines of the module unconnected and floating If RS-232 compatible signal levels are needed, the Maxim 13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard. If a 1.8 V Application Processor is used, the circuit should be implemented as described in Figure 46. TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDSARA-G3 series (1.8V DCE)12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND Figure 46: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 47. 4V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDSARA-G3 series (1.8V DCE)12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR4TP Figure 47: UART interface application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 28: Component for UART application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE)  If only TXD, RXD, RTS and CTS lines are provided, as implemented in Figure 46 and in Figure 47, the procedure to enable power saving depends on the HW flow-control status. If HW flow-control is enabled (AT&K3, that is the default setting) power saving will be activated by AT+UPSV=1. Through this configuration, when the module is in idle-mode, data transmitted by the DTE is buffered by the DTE and is correctly received by the module when active-mode is entered.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 92 of 145 If  the  HW  flow-control  is  disabled  (AT&K0),  AT+UPSV=2  can  enable  the  power  saving.  The  module  is  in  idle-mode until a high-to-low (i.e. OFF-to-ON) transition on the RTS input line switches the module from idle-mode to active-mode in 20 ms. The module is forced into active-mode if the RTS input line is held in the ON state.  Providing the TXD and RXD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, the circuit with a 1.8 V Application Processor should be implemented as described in Figure 48:  Connect  the  module  RTS  input  line  to  GND  or  to  the  CTS  output  line  of  the  module:  since  the  module requires RTS active (low electrical level) if HW flow-control is enabled (AT&K3, that is the default setting), the pin can be connected using a 0  series resistor to GND or to the active-module CTS (low electrical level) when the module is in active-mode, the UART interface is enabled and the HW flow-control is enabled  Connect the module DTR input line to GND, since the module requires DTR active (low electrical level)  Leave DSR, DCD and RI lines of the module unconnected and floating  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDSARA-G3 series (1.8V DCE)12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND Figure 48: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 49. 4V_INTTxDApplication Processor(3.0V DTE)RxDDTRDSRRIDCDGNDSARA-G3 series (1.8V DCE)12 TXD9DTR13 RXD6DSR7RI8DCDGND1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR1DIR2 OEVCCB2 A2RTSCTS11 RTS12 CTSTP Figure 49: UART interface application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 29: Component for UART application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE)
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 93 of 145 If  only  TXD  and  RXD  lines  are  provided,  as  described  in  Figure  48  or  in  Figure  49,  and  HW  flow-control  is disabled (AT&K0), the power saving must be enabled by AT+UPSV=1. In this way, the UART of the module is re-enabled  20  ms  after  a  low-to-high  transition  on  the  TXD  input  line,  and  the  recognition  of  the  subsequent characters is guaranteed until the module is in active-mode.  Data delivered by the DTE can be lost using this configuration and the following settings: o HW flow-control enabled in the module (AT&K3, that is the default setting) o Module power saving enabled by AT+UPSV=1 o HW flow-control disabled in the DTE  In this case the first character sent when the module is in idle-mode will be a wake-up character and will not be a valid communication character (refer to chapter 1.9.1.4 for the complete description).  If power saving is enabled the application circuit with the TXD and RXD lines only is not recommended. During command mode the DTE must send to the module a wake-up character or a dummy “AT” before each  command  line  (refer  to  chapter  1.9.1.4  for  the  complete  description),  but  during  data  mode  the wake-up character or the dummy “AT” would affect the data communication.  Additional considerations   Any external signal connected to the UART interface must be tri-stated or set low when the module is in power-down mode and during the module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated or set low, insert a multi channel digital  switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit connections and set to high impedance during module power down mode and during the module power-on sequence.  ESD  sensitivity  rating  of  UART  interface  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher  protection  level could be  required  if  the lines  are externally accessible on  the  application  board. Higher  protection  level  can  be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) close to accessible points.  2.5.1.2 Guidelines for UART layout design The UART serial interface requires the same consideration regarding electro-magnetic interference as any other digital  interface.  Keep  the  traces  short  and  avoid  coupling  with  RF  line  or  sensitive  analog  inputs,  since  the signals can cause the radiation of some harmonics of the digital data frequency.  2.5.2 Auxiliary asynchronous serial interface (UART AUX) 2.5.2.1 Guidelines for UART AUX circuit design The auxiliary UART interface can be connected to an application processor if it can be set in pass-through mode so that the auxiliary UART interface can be accessed for SARA-G3 modules’ firmware upgrade by means of the u-blox EasyFlash tool and for Trace log capture (debug purpose).  To  directly  enable  PC  (or  similar)  connection  to  the  module  for  firmware  upgrade  using  the  u-blox EasyFlash  tool  and  for  debugging  purposes,  it  is  highly  recommended  to  provide  direct  access  on  the application  board  to  the  TXD_AUX  and  RXD_AUX  pins,  by  means  of  accessible  testpoints  directly connected to the pins of the module. Also provide access to the V_INT pin to make possible the voltage translation to the auxiliary UART interface voltage level, and to the PWR_ON or RESET_N pins, or enable the DC supply connected to the VCC pin to start the firmware upgrade using the u-blox EasyFlash tool.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 94 of 145 The circuit with a 1.8 V Application Processor should be implemented as described in Figure 48. TxDApplication Processor(1.8V DTE)RxDSARA-G3 series (1.8V DCE)29 TXD_AUX28 RXD_AUXGND GND0 ohm0 ohmTestPointTestPoint Figure 50: UART AUX interface application circuit connecting a 1.8 V application processor  If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 49. 4V_INTTxDApplication Processor(3.0V DTE)RxDGNDSARA-G3 series (1.8V DCE)29 TXD_AUX28 RXD_AUXGND1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR1DIR2OEVCCB2 A20 ohm0 ohmTPTPTP Figure 51: UART AUX interface application circuit connecting a 3.0 V application processor Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 30: Component for UART AUX interface application circuit connecting a 3.0 V application processor  Refer to Firmware Update Application Note [22] for additional guidelines regarding the procedure for SARA-G3 modules’ firmware upgrade over the auxiliary UART interface using the u-blox EasyFlash tool.   Any  external  signal  connected  to  the  auxiliary  UART  interface  must  be  tri-stated  or  set  low  when  the module is in power-down mode and during the module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated or set low, insert a multi  channel  digital  switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157) between the two-circuit connections and set to high impedance during module power down mode and during the module power-on sequence.  ESD  sensitivity  rating  of  auxiliary  UART  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher  protection  level could be  required  if  the lines  are externally accessible on  the  application  board. Higher  protection  level  can  be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) close to accessible points.  2.5.2.2 Guidelines for UART AUX layout design The auxiliary UART serial interface is not critical for the layout design since it is not used during normal operation of  SARA-G3  modules.  Ensure  accessibility  to  the  TXD_AUX  and  RXD_AUX  pins  providing  test  points  on  the application board.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 95 of 145 2.5.3 DDC (I2C) interface 2.5.3.1 Guidelines for DDC (I2C) circuit design The SDA and SCL lines must be connected to the DDC (I2C) interface pins of the u-blox GPS/GNSS receiver (i.e. the SDA2 and SCL2 pins of the u-blox positioning receiver) on the application board to allow the communication between the wireless module and the u-blox GPS/GNSS receiver, enabled by the AT+UGPS command (for more details refer to u-blox AT Commands Manual [2]). To be compliant to the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors must be used conforming to the I2C bus specifications [13]. Since the pull-up resistors are not mounted on the module, they must be mounted externally.   Provide external pull-ups resistors (e.g. 4.7 k) on SDA and SCL lines and connect them to the V_INT 1.8 V supply source, or another 1.8 V supply source enabled after V_INT (e.g., as the 1.8 V supply present in the application circuit of Figure 52, controlled by the wireless module).  The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus increase the capacitance. If the bus capacitance is increased, use pull-up resistors with nominal resistance value lower than 4.7 k, to match the I2C bus specifications [13] regarding rise and fall times of the signals.   Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 µs is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible.  If the pins are not used as DDC bus interface, they can be left unconnected.  The following special features over GPIOs can be optionally implemented on the application board to improve the integration of SARA-G350 wireless modules with a u blox GPS/GNSS receiver:  The GPIO2, by default configured to provide the “GPS supply enable” function, must be connected to the active-high  enable  pin  (or  the  active-low  shutdown  pin)  of  the  voltage  regulator  that  supplies  the  u-blox positioning receiver on the application board to enable or disable the supply of the u-blox GPS/GNSS receiver connected to the wireless module by the AT+UGPS command  The GPIO3, by default configured to provide the “GPS data ready” function, must be connected to the data ready output of the u-blox positioning receiver (i.e. the pin TXD1 of the u-blox GPS/GNSS receiver) on the application board, to sense when the u-blox positioning receiver connected to the wireless module is ready to send data by the DDC (I2C) interface  The GPIO4, by default configured to  provide the  “GPS RTC  sharing” function,  must be connected  to  the RTC synchronization signal of the u-blox positioning receiver (i.e. the pin EXTINT0 of the u-blox GPS/GNSS receiver) on the application board, to provide an RTC (Real Time Clock) synchronization signal at the power up of the u-blox positioning receiver connected to the wireless module   “GPS data ready” and “GPS RTC sharing” functions are not supported by all u-blox GPS/GNSS receivers HW  or  ROM/FW  versions.  Refer  to  the  GPS  Implementation  Application  Note  [21]  or  to  the  Hardware Integration Manual of the u-blox GPS/GNSS receivers for the supported features.  Figure 52 illustrates an application circuit for SARA-G350 connection to a u-blox 1.8 V GPS/GNSS receiver:  The SDA and SCL pins of the SARA-G350 module are directly connected to the relative pins of the u-blox 1.8 V GPS/GNSS receiver, with appropriate pull-up resistors.  The  GPIO3  and  GPIO4  pins  are  directly  connected  respectively  to  TXD1  and  EXTINT0  pins  of  the  u-blox 1.8 V GPS/GNSS receiver providing “GPS data ready” and “GPS RTC sharing” functions.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 96 of 145  The GPIO2 pin is connected to the active-high enable pin of the voltage regulator that supplies the u-blox 1.8 V GPS/GNSS  receiver  providing the  “GPS supply  enable”  function.  A pull-down resistor  is  provided to avoid a switch on of the positioning receiver when the  SARA-G350 module is switched off or in the reset state.  The V_BCKP supply output of the SARA-G350 wireless module is connected to the V_BCKP backup supply input pin of the GPS/GNSS receiver to provide the supply for the GPS/GNSS real time clock and backup RAM when  the  VCC  supply  of  the  wireless  module  is  within  its  operating  range  and  the  VCC  supply  of  the GPS/GNSS  receiver  is  disabled.  This  enables  the  u-blox  GPS/GNSS  receiver  to  recover  from  a  power breakdown with either a Hot-start or a Warm-start (depending on the actual duration of the GPS/GNSS VCC outage) and to maintain the configuration settings saved in the backup RAM.  SARA-G350R1INOUTGNDGPS LDORegulatorSHDNu-blox GPS/GNSS1.8 V receiverSDA2SCL2R21V8 1V8VMAIN1V8U123 GPIO2SDASCLC1TxD1EXTINT0GPIO3GPIO426272425VCCR3V_BCKP V_BCKP2 Figure 52: DDC (I2C) application circuit for u-blox 1.8 V GPS/GNSS receiver Reference Description Part Number - Manufacturer R1, R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp U1 Voltage Regulator for GPS/GNSS Receiver See GPS/GNSS Receiver Hardware Integration Manual Table 31: Components for DDC (I2C) application circuit for u-blox 1.8 V GPS/GNSS receiver  As an  alternative  to  using  an  external  voltage  regulator,  the  V_INT  supply  output  of  SARA-G350  wireless modules can be used to supply a u-blox 1.8 V GPS/GNSS receiver of the u-blox 6 family (or later u-blox family). The V_INT supply is able to withstand the maximum current consumption of these positioning receivers. The V_INT supply output provides low voltage ripple (up to 15 mVpp) when the module is in active-mode or in connected-mode, but it provides higher voltage ripple (up to 90 mVpp) when the module is in the low power idle-mode with power saving configuration enabled by AT+UPSV (refer to u-blox AT Commands Manual [2]). According to the voltage ripple characteristic of the V_INT supply output:  The power saving configuration cannot be enabled to properly supply by V_INT output any 1.8 V GPS/GNSS receiver of the u-blox 6 family and any 1.8 V GPS/GNSS receiver of the u-blox 7 family with TCXO  The power saving configuration can  be enabled to properly supply  by  V_INT  output  any  1.8 V  GPS/GNSS receiver of the u-blox 7 family without TCXO  Additional filtering may be needed to properly supply an external LNA, depending on the characteristics of the used LNA, adding a series ferrite bead and a bypass capacitor (e.g. the Murata BLM15HD182SN1 ferrite bead and the Murata GRM1555C1H220J 22 pF capacitor) at the input of the external LNA supply line. Refer to the GPS Implementation Application Note [21] for additional guidelines using the V_INT supply output of SARA-G350 wireless modules to supply a u-blox 1.8 V GPS/GNSS receiver.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 97 of 145 Figure 53 illustrates the application circuit for SARA-G350 connection to a u-blox 3.0 V GPS/GNSS receiver:  SDA and SCL pins of SARA-G350 are directly connected to the relative pins of the u-blox 3.0 V GPS/GNSS receiver, with appropriate pull-up resistors: an I2C-bus Voltage Translator is not needed because SARA-G350 DDC (I2C) pins are capable up to 3.3 V.  GPIO3 and GPIO4 pins of SARA-G350 are connected to the u-blox 3.0 V GPS/GNSS receiver by means of a general purpose Voltage Translator, needed for SARA-G350 generic digital pins because only 1.8 V capable.  GPIO2 is connected to the active-high enable pin of the external voltage regulator that supplies the u-blox 3.0 V GPS/GNSS receiver to enable or disable the 3.0 V GPS/GNSS supply.  The V_BCKP supply output of SARA-G350 is directly connected to the V_BCKP backup supply input pin of the u-blox 3.0 V GPS/GNSS receiver as in the application circuit for a u-blox 1.8 V GPS/GNSS receiver.  SARA-G350R1INOUTGNDGPS LDORegulatorSHDNu-blox GPS/GNSS3.0 V receiverSDA2SCL2R23V0 3V0VMAIN3V0U123 GPIO2SDASCLC12627VCCR3V_BCKP V_BCKP224 GPIO325 GPIO41V8B1 A1GNDU2B2A2VCCBVCCAUnidirectionalVoltage TranslatorC2 C33V0TxD1EXTINT04V_INTDIR1DIR2 OEGPS data readyGPS RTC sharingTP Figure 53: DDC (I2C) application circuit for u-blox 3.0 V GPS/GNSS receiver Reference Description Part Number – Manufacturer R1, R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp C2, C3 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1 Voltage Regulator for GPS/GNSS Receiver See GPS/GNSS Receiver Hardware Integration Manual U2 Generic Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 32: Components for DDC (I2C) application circuit for u-blox 3.0 V GPS/GNSS receiver   ESD  sensitivity  rating  of  the  DDC  (I2C)  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher  protection  level could be  required  if  the lines  are externally accessible on  the  application  board. Higher  protection  level  can  be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) close to accessible points.  2.5.3.2 Guidelines for DDC (I2C) layout design The  DDC  (I2C)  serial  interface  requires  the  same  consideration  regarding  electro-magnetic  interference  as  any other digital interface. Keep the traces short and avoid coupling with RF line or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 98 of 145 2.6 Audio Interface 2.6.1 Analog Audio interface 2.6.1.1 Guidelines for microphone and speaker connection circuit design (headset / handset modes) SARA-G350 modules provide one analog audio input path and one analog audio output path: the same paths are used for both headset and handset modes, so that basically the same application circuit can be implemented for both headset and handset modes.  Figure 54 shows an application circuit for the analog audio interface in headset and handset modes, connecting a 2.2 k electret microphone and a 16  receiver / speaker:  External microphone can be connected to the uplink path of the module as described in Figure 54, since the module provides supply and reference as well as differential signal input for the external microphone  16   receiver  /  speaker  can  be  directly  connected  to  the  balanced  output  of  the  module  as  described  in Figure  54,  since  the  differential  analog  audio  output  of  the  module  is  able  to  directly  drive  loads  with resistance rating greater than 14   The general guidelines for the design of the analog audio circuit for both headset and handset modes, fulfilled implementing the circuit of Figure 54, are the following:  Provide proper supply to the used electret microphone, providing a proper connection from the MIC_BIAS supply output to the microphone. It’s suggested to implement a bridge structure as described in Figure 54: o the electret microphone, with its  nominal intrinsic  resistance value,  represents one  resistor of the bridge o to achieve good supply noise rejection, the ratio of the two resistance in one leg (R2/R3) should be equal to the ratio of the two resistance in the other leg (R4/MIC), i.e. R2 has to be equal to R4 (e.g. 2.2 k) and R3 has to be equal to the microphone nominal intrinsic resistance value (e.g. 2.2 k)  Provide  a  proper  series  resistor  at  the  MIC_BIAS  supply  output  and  then  mount  a  proper  large  bypass capacitor  to provide  additional  supply noise filtering,  as  the R1  series resistor  (2.2  k)  and  the  C1  bypass capacitor (10 µF) in the circuit implemented in Figure 54  Do  not  place  a  bypass  capacitor  directly  at  the  MIC_BIAS  supply  output,  since  proper  internal  bypass capacitor is already provided to guarantee stable operation of the internal regulator  Connect  the  reference  of  the  microphone  circuit  to  the  MIC_GND  pin  of  the  module  as  a  sense  line: implement the connection described in Figure 54  Provide a proper series capacitor at both MIC_P and MIC_N analog uplink inputs for DC blocking (as the C2 an  C3  100  nF  Murata  GRM155R71C104K  capacitors  in  Figure  54)  to  provide  an  high-pass  filter  for  the microphone DC bias with proper cut-off frequency according to the value of the resistors of the microphone supply circuit, and then connect the signal lines to the microphone as described in Figure 54  Provide proper parts on each line connected to the external microphone as noise and EMI improvements, to minimize  RF  coupling  and  TDMA  noise,  according  to  the  custom  application  requirements.  Following  the circuit described in Figure 54: o mount  an  82  nH  series  inductor  with  self  resonance  frequency  ~1  GHz  (e.g.  Murata LQG15HS82NJ02) on each microphone line, as L1 and L2 inductors in Figure 54 o mount and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) from each microphone line to solid ground plane, as C4 and C5 capacitors in Figure 54  Use a micropone designed for GSM applications which typically have internal built-in bypass capacitor  Connect the SPK_P and SPK_N analog downlink outputs directly to the receiver / speaker (which resistance rating has to be greater than 14 ) as in the circuit described in Figure 54
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 99 of 145  Provide  proper  parts  on  each  line  connected  to  the  receiver  /  speaker  as  noise  and  EMI  improvments,  to minimize  RF  coupling,  according  to  EMC  requirements  of  the  custom  application.  Following  the  circuit described in Figure 54: o mount and  a 27 pF  bypass  capacitor (e.g.  Murata GRM1555C1H270J) from each  speaker  line to solid ground plane, as C6 and C7 capacitors in Figure 54  Provide an additional ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) if the analog audio lines will be  externally  accessible  on the  application  device,  according  to  EMC/ESD  requirements  of  the  custom application. The protection should be mounted close to accessible point of the line, as the D1 and D2 parts in the circuit described in Figure 54  SARA-G35049MIC_PR1R2 R444SPK_P48MIC_N45SPK_NR3C146MIC_BIAS47MIC_GNDC2C3D2D1C6 C7L2L1C5C4SPKSpeaker ConnectorJ2Microphone Connector MICJ1 Figure 54: Analog audio interface headset and handset mode application circuit Reference Description Part Number – Manufacturer C1 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C2, C3 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA88 – Murata C4, C5, C6, C7 27 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1H270JA01 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX J1 Microphone Connector Various Manufacturers  J2 Speaker Connector Various Manufacturers  L1, L2 82 nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 – Murata MIC 2.2 kΩ Electret Microphone Various Manufacturers R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp SPK 16 Ω Speaker  Various Manufacturers Table 33: Example of components for analog audio interface headset and handset mode application circuit  If the analog audio interface is not used, the analog audio pins (MIC_BIAS, MIC_GND, MIC_P, MIC_N, SPK_P, SPK_N) can be left unconnected on the application board.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 100 of 145 2.6.1.2 Guidelines for microphone and loudspeaker connection circuit design (hands-free mode) Figure 55 shows an application circuit for the analog audio interface in hands-free mode, connecting a 2.2 k electret microphone and an 8  or 4  loudspeaker:  External microphone can be connected to the uplink path of the module as described in Figure 55, since the module provides supply and reference as well as differential signal input for the external microphone  Using a 8  or 4  loudspeaker for the hands-free mode, an external audio amplifier must be provided on the application board to amplify the low power audio signal provided by the downlink path of the module, so that  the  external  audio  amplifier will  drive  the  8   or  4   loudspeaker,  since  differential  analog  audio output of the module is able to directly drive loads with resistance rating greater than 14   The general guidelines for the design of the analog audio circuit for hands-free mode, fulfilled implementing the circuit of Figure 55, are the following:  Provide proper supply to the used electret microphone, providing a proper connection from the MIC_BIAS supply output to the microphone. It’s suggested to implement a bridge structure as described in Figure 55: o the electret microphone, with  its  nominal intrinsic resistance  value, represents  one  resistor of the bridge o to achieve good supply noise rejection, the ratio of the two resistance in one leg (R2/R3) should be equal to the ratio of the two resistance in the other leg (R4/MIC), i.e. R2 has to be equal to R4 (e.g. 2.2 k) and R3 must be equal to the microphone nominal intrinsic resistance value (e.g. 2.2 k)  Provide a series resistor at the MIC_BIAS supply output and then mount a good bypass capacitor to provide additional supply noise filtering, as the R1 series resistor (2.2 k) and the C1 bypass capacitor (10 µF) in the circuit implemented in Figure 55  Do  not  place  a  bypass  capacitor  directly  at  the  MIC_BIAS  supply  output,  since  proper  internal  bypass capacitor is already provided to guarantee stable operation of the internal regulator  Connect  the  reference  of  the  microphone  circuit  to  the  MIC_GND  pin  of  the  module  as  a  sense  line: implement the connection described in Figure 55  Provide a proper series capacitor at both MIC_P and MIC_N analog uplink inputs for DC blocking (as the C2 an  C3  100  nF  Murata  GRM155R71C104K  capacitors  in  Figure  55)  to  provide  an  high-pass  filter  for  the microphone DC bias with proper cut-off frequency according to the value of the resistors of the microphone supply circuit, and then connect the signal lines to the microphone as described in Figure 55  Provide proper parts on each line connected to the external microphone as noise and EMI improvements, to minimize  RF  coupling  and  TDMA  noise,  according  to  the  custom  application  requirements.  Following  the circuit described in Figure 55: o mount  an  82  nH  series  inductor  with  self  resonance  frequency  ~1  GHz  (e.g.  Murata LQG15HS82NJ02) on each microphone line, as L1 and L2 inductors in Figure 55 o mount and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) from each microphone line to solid ground plane, as C4 and C5 capacitors in Figure 55  Use a microphone designed for GSM applications which typically have internal built-in bypass capacitor  Provide a 47 nF series capacitor at both SPK_P and SPK_N analog downlink outputs for DC blocking (as the C8 an C9 Murata GRM155R71C473K capacitors in Figure 55) and then connect the lines to the differential input  of  a  proper  external  audio  amplifier  which  differential  output  has  to  be  connected  the  8   or  4  loudspeaker as for the Analog Devices SSM2305CPZ filter-less mono 2.8  W class-D Audio Amplifier in the circuit described in Figure 55  Provide proper parts on each line connected to the external loudspeaker as noise and EMI improvments, to minimize  RF  coupling,  according  to  EMC  requirements  of  the  custom  application.  Following  the  circuit described in Figure 55: o mount and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) from each  loudspeaker line to solid ground plane, as C6 and C7 capacitors in Figure 55
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 101 of 145  Provide an additional ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) if the analog audio lines will be  externally  accessible  on the  application  device,  according to  EMC/ESD  requirements  of  the custom application. The protection should be mounted close to accessible point of the line, as the D1 and D2 parts in the circuit described in Figure 55  SARA-G35049MIC_PR1R2 R444SPK_P48MIC_N45SPK_NR3C146MIC_BIAS47MIC_GNDC2C3D2D1C6 C7L2L1C5C4LSPKLoud-Speaker ConnectorJ2Microphone Connector MICJ1OUT+IN+GNDU1OUT-IN-C8C9R5R6VDDC11C10Audio AmplifierVCC Figure 55: Analog audio interface hands-free mode application circuit Reference Description Part Number – Manufacturer C1, C10 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C2, C3, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA88 – Murata C4, C5, C6, C7 27 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1H270JA01 – Murata C8, C9 47 nF Capacitor Ceramic X7R 0402 10% 16V GRM155R71C473KA01 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX J1 Microphone Connector Various Manufacturers  J2 Speaker Connector Various Manufacturers  L1, L2 82 nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 – Murata LSPK 8  Loud-Speaker Various Manufacturers MIC 2.2 kΩ Electret Microphone Various Manufacturers R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp R5, R6 0 Ω Resistor 0402 5% 0.1 W  RC0402JR-070RL – Yageo Phycomp U1 Filter-less Mono 2.8 W Class-D Audio Amplifier SSM2305CPZ – Analog Devices Table 34: Example of components for analog audio interface hands-free mode application circuit  If the analog audio interface is not used, the analog audio pins (MIC_BIAS, MIC_GND, MIC_P, MIC_N, SPK_P, SPK_N) can be left unconnected on the application board.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 102 of 145 2.6.1.3 Guidelines for external analog audio device connection circuit design The  differential  analog  audio  input  /  output  can  be  used  to  connect  the  module  to  an  external  analog  audio device.  Audio  devices  with  a  differential  analog  input  /  output  are  preferable,  as  they  are  more  immune  to external disturbances. Figure 56 and Table 35 describe the application circuits, following the suggested circuit design-in.  Guidelines for the connection to a differential analog audio input:  The  SPK_P /  SPK_N  balanced  output  of  the  module  must  be  connected  to  the  differential  input  of  the external audio device by means of series capacitors for DC blocking (e.g. 10 µF Murata GRM188R60J106M) to decouple the bias present at the module output, as described in the left side of Figure 56  Guidelines for the connection to a single ended analog audio input:  A proper differential to single ended circuit must be inserted from the SPK_P / SPK_N balanced output of the module to the single ended input of  the external audio device, as described in the right side of Figure 56: 10 µF  series capacitors  (e.g.  Murata GRM188R60J106M) are provided to  decouple the bias present  at the  module  output,  and  a  voltage  divider  is  provided  to  properly  adapt  the  signal  level  from  the  module output to the external audio device input  Guidelines for the connection to a differential analog audio output:  The MIC_P /  MIC_N  balanced  input  of  the  module  must  be  connected  to  the  differential  output  of  the external audio device by means of series capacitors for DC blocking (e.g. 10 µF Murata GRM188R60J106M) to decouple the bias present at the module input, as described in the left side of Figure 56  Guidelines for the connection to a single ended analog audio output:  A proper single ended to differential circuit has to be inserted from the single ended output of the external audio device to the MIC_P / MIC_N balanced input of the module, as described in the right side of Figure 56: 10 µF  series capacitors  (e.g. Murata GRM188R60J106M) are provided to decouple the bias present  at the module input, and a voltage divider is provided to properly adapt the signal level from the external audio device output to the module input  Additional guidelines for any connection:  The DC-block series capacitor acts as high-pass filter for audio signals, with cut-off frequency depending on both the values of capacitor and on the input impedance of the device. For example: in case of differential input impedance of 600  , the two 10 µF capacitors will set the -3 dB cut-off frequency to 53 Hz, while for single ended connection to 600  external device, the cut-off frequency with just the single 10 µF capacitor will be 103 Hz. In both cases the high-pass filter has a low enough cut-off to not impact the audio signal frequency response  Use a suitable power-on  sequence to avoid audio bump due to charging of the  capacitor:  the  final audio stage should be always enabled as last one  The  signal  levels  can  be  adapted  by  setting  gain  using  AT  commands  (refer  to  the  u-blox  AT  Commands Manual [2], +USGC, +UMGC), but additional circuitry must be inserted if the SPK_P / SPK_N output level of the module is too high for the input of the audio device or if the output level of the audio device is too high for MIC_P / MIC_N, as the voltage dividers present in the circuits described in the right side of Figure 56 to properly adapt the signal level
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 103 of 145 SARA-G350C1C245SPK_N44SPK_PGND49MIC_PGNDAnalog IN (-)Analog IN (+)Analog OUT (-)Analog OUT (+)Audio DeviceGNDGND48MIC_NC3C4SARA-G35045SPK_N44SPK_PGND49MIC_PGNDAnalog INAudio DeviceGNDReference48MIC_NAnalog OUTC5C6 R2R1R4R3C7C846MIC_BIAS47MIC_GND46MIC_BIAS47MIC_GND Figure 56: Application circuits to connect the module to audio devices with proper differential or single-ended input/output Reference Description Part Number – Manufacturer C1, C2, C3, C4,  C5, C6, C7, C8 10 µF Capacitor X5R 0603 5% 6.3 V  GRM188R60J106M – Murata R1, R3 0 Ω Resistor 0402 5% 0.1 W  RC0402JR-070RL – Yageo Phycomp R2, R4 Not populated  Table 35: Connection to an analog audio device  2.6.1.4 Guidelines for analog audio layout design Accurate analog audio design is very important to obtain clear and high quality audio. The GSM signal burst has a repetition rate of 217 Hz that lies in the audible range. A careful layout is required to reduce the risk of noise from audio lines due to both VCC burst noise coupling and RF detection. Guidelines for the uplink path, which is the most sensitive since the analog input signals are in the  microVolts range, are the following:  Avoid  coupling  of  any  noisy  signal  to  microphone  lines:  it’s  strongly  recommended  to  route  microphone lines away from module VCC supply line, any switching regulator line, RF antenna lines, digital lines and any other possible noise source  Keep ground separation from microphone lines to other noisy signals. Use an intermediate ground layer or vias wall for coplanar signals  Route microphone signal lines as a differential pair embedded in ground to reduce differential noise pick-up. The balanced configuration will help reject the common mode noise  Route microphone reference as a signal line since the MIC_GND pin is internally connected to ground as a sense line as the reference for the analog audio input  Cross other signals lines on adjacent layers with 90° crossing  Place bypass capacitor for RF very close to active microphone. The preferred microphone should be designed for GSM applications which typically have internal built-in bypass capacitor for RF very close to active device. If  the  integrated  FET  detects  the  RF  burst,  the  resulting  DC  level  will  be  in  the  pass-band  of  the  audio circuitry and cannot be filtered by any other device Guidelines for the downlink path are the following:  The  physical  width  of  the  audio  output  lines  on  the  application board must  be wide enough  to  minimize series resistance since the lines are connected to low impedance speaker transducer  Avoid  coupling  of  any  noisy  signal  to  speaker  lines:  it’s  recommended  to  route  speaker  lines  away  from module VCC supply line, any switching regulator line, RF antenna lines, digital lines and any other possible noise source
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 104 of 145  Route speaker signal lines as a differential pair embedded in ground up to reduce differential noise pick-up. The balanced configuration will help reject the common mode noise  Cross other signals lines on adjacent layers with 90° crossing  Place bypass capacitor for RF close to the speaker  2.6.2 Digital Audio interface  2.6.2.1 Guidelines for digital audio circuit design SARA-G3  series  I2S  digital  audio  interface  can  be  connected  to  an  external  digital  audio  device  for  voice applications. The external digital audio device must act as an I2S slave (since the SARA-G3 modules act as an I2S master  only),  with  compatible  I2S  mode  (i.e.  PCM  mode  or  Normal  I2S  mode),  I2S  sample  rate  and  I2S  clock frequency. The external device must provide compatible voltage levels (1.80 V typ.), otherwise the lines must be connected  by  means  of  a  proper  unidirectional  voltage  translator  (e.g.  Texas  Instruments  SN74AVC4T774  or SN74AVC2T245). Figure 57 shows an application circuit with a generic digital audio device.  36I2S_CLK34I2S_WAI2S ClockI2S Word AlignmentSARA-G35035I2S_TXD37I2S_RXDI2S Data InputI2S Data OutputGND GND1.8 V Digital Audio Device Figure 57: I2S interface application circuit with a generic digital audio device  Any external signal connected to the digital audio interface must be tri-stated or set low when the module is in  power-down  mode and during  the  module power-on sequence (at  least  until the  activation of  the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module. If  the  external  signals  connected  to  the  wireless  module  cannot  be  tri-stated  or  set  low,  insert  a  multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit  connections  and  set  to  high  impedance  during  module  power  down  mode  and  during  the module power-on sequence.  ESD sensitivity rating of I2S interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection  level could be  required  if  the  lines  are  externally  accessible  on the  application  board.  Higher protection  level  can  be  achieved  by  mounting  a  general  purpose  ESD  protection  (e.g.  EPCOS CA05P4S14THSG varistor array) close to accessible points.  If the I2S digital audio pins are not used, they can be left unconnected on the application board.  2.6.2.2 Guidelines for digital audio layout design The  I2S  interfaces  lines  (I2S_CLK,  I2S_RX,  I2S_TX,  I2S_WA)  require  the  same  consideration  regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 105 of 145 2.7 General Purpose Input/Output (GPIO) 2.7.1.1 Guidelines for GPIO circuit design The  following  application  circuits  are  suggested  as  general  guideline  for  the  usage  of  the  GPIO  pins  available with the SARA-G350 modules, according to the relative custom function.   Network status indication: The pin configured to provide the “Network status indication” function, e.g. the GPIO1, can be connected on the application board to an input pin of an application processor or can drive a LED by a transistor with integrated resistors to indicate network status.  GSM Tx burst indication: The GPIO1 pin, as configured to provide the “GSM Tx burst indication” function, can be connected on the application board to an input pin of an application processor to indicate when a GSM Tx burst/slot occurs.  GPS supply enable: The pin configured to provide the “GPS supply enable” function (GPIO2 by default) has to be connected to the active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS/GNSS receiver.  GPS data ready: The GPIO3 pin, by default configured to provide the “GPS data ready” function, has to be connected to the data ready output of the u-blox GPS/GNSS receiver (i.e. the pin TXD1).  GPS RTC sharing: The GPIO4 pin, by default configured to provide the “GPS RTC sharing” function, has to be connected to the RTC synchronization input of the u-blox GPS/GNSS receiver (i.e. the pin EXTINT0).  Figure 58 describes an application circuit for a typical usage of the GPIOs of SARA-G350 modules:  Network indication function provided by the GPIO1 pin  GPS supply enable function provided by the GPIO2 pin  GPS data ready function provided by the GPIO3 pin  GPS RTC sharing function provided by the GPIO4 pin   Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 kΩ resistor on the board in series to the GPIO.  ESD  sensitivity  rating  of  the  GPIO  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114).  Higher  protection  level could be  required  if  the lines  are externally accessible on  the  application  board. Higher  protection  level  can  be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) close to accessible points.  Any external signal connected to the GPIOs must be tri-stated or set low when the module is in power-down mode and during the module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals  connected  to  the  wireless  module  cannot  be  tri-stated  or  set  low,  insert  a  multi  channel  digital switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit connections and set to high impedance during module power down mode and during the module power-on sequence.  If the GPIO pins are not used, they can be left unconnected on the application board.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 106 of 145 OUTINGNDLDO RegulatorSHDN3V8 1V8GPIO3GPIO4TxD1EXTINT02425R1VCCGPIO2 23SARA-G350 u-blox GPS/GNSS 1.8 V receiverU1C1R2R43V8Network IndicatorR3GPS Supply EnableGPS Data ReadyGPS RTC Sharing16GPIO1DL1T1 Figure 58: GPIO application circuit Reference Description Part Number - Manufacturer R1 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers U1 Voltage Regulator for GPS/GNSS Receiver See GPS/GNSS Module Hardware Integration Manual R2 10 kΩ Resistor 0402 5% 0.1 W Various manufacturers R3 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers R4 820 Ω Resistor 0402 5% 0.1 W Various manufacturers DL1 LED Red SMT 0603 LTST-C190KRKT - Lite-on Technology Corporation T1 NPN BJT Transistor BC847 - Infineon Table 36: Components for GPIO application circuit  2.7.1.1 Guidelines for GPIO layout design The general purpose input/output pins are generally not critical for layout.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 107 of 145 2.8 Reserved pins (RSVD) SARA-G3 series modules have pins reserved for future use. All the RSVD pins, except pin number 33, can be left unconnected on the application board. Figure 59 illustrates the application circuit.   Pin 33 (RSVD) must be connected to GND.  SARA-G3 series33RSVDRSVD Figure 59: Application circuit for the reserved pins (RSVD)   2.9 Module placement Optimize placement for minimum length of RF line and closer path from DC source for VCC. Make sure that RF and analog circuits are clearly separated from any other digital circuits on the system board. Provide enough clearance between the module and any external part.   The  heat  dissipation  during  continuous  transmission  at  maximum  power  can  significantly  raise  the temperature  of  the  application  base-board  below  the  SARA-G3  modules:  avoid  placing  temperature sensitive devices close to the module.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 108 of 145 2.10 Module footprint and paste mask Figure 60 and Table 37 describe the suggested footprint (i.e. copper mask) and paste mask layout for SARA-G3 modules:  the  proposed  land  pattern  layout  reflects  the  modules’  pads  layout,  while  the  proposed  stencil apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’, H’, I’, J’, O’ ones). The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type, implementing the solder mask opening 50 µm larger per side than the corresponding copper pad. The recommended solder paste thickness is 150 µm, according to application production process requirements.  KM1M1M2E G H’ J’ EANT pinBPin 1KGH’J’ADDO’O’L N LI’F’F’KM1M1M2E G H’’ J’’ EANT pinBPin 1KGH’’J’’ADDO’’O’’L N LI’’F’’F’’Stencil: 150 µm Figure 60: SARA-G3 series modules suggested footprint and paste mask (application board top view) Parameter Value  Parameter Value  Parameter Value A 26.0 mm  G 1.10 mm  K 2.75 mm B 16.0 mm  H’ 0.80 mm  L 2.75 mm C 3.00 mm  H’’ 0.75 mm  M1 1.80 mm D 2.00 mm  I’ 1.50 mm  M2 3.60 mm E 2.50 mm  I’’ 1.55 mm  N 2.10 mm F’ 1.05 mm  J’ 0.30 mm  O’ 1.10 mm F’’ 1.00 mm  J’’ 0.35 mm  O’’ 1.05 mm Table 37: SARA-G3 series modules suggested footprint and paste mask dimensions   These  are  recommendations  only  and  not  specifications.  The  exact  copper,  solder  and  paste  mask geometries,  distances,  stencil  thicknesses  and  solder  paste  volumes  must  be  adapted  to  the  specific production processes (e.g. soldering etc.) of the customer.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 109 of 145 2.11 Thermal guidelines  SARA-G3 series module operating temperature range and module thermal resistance are specified in the SARA-G3 series Data Sheet [1].  The  most  critical  condition  concerning  module  thermal  performance  is  the  uplink  transmission  at  maximum power  (data  upload  or  voice  call  in  connected-mode),  when  the  baseband  processor  runs  at  full  speed,  radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks; however the application should be correctly designed to cope with it. During  transmission  at  maximum  RF  power  the  SARA-G3  series  modules  generate  thermal  power  that  can exceed 1 W: this is an indicative value since the exact generated power strictly depends on operating condition such as the number of allocated TX slot, transmitting frequency band, etc. The generated thermal power must be adequately dissipated through the thermal and mechanical design of the application. The  spreading  of  the  Module-to-Ambient  thermal  resistance  (Rth,M-A)  depends  on  the  module  operating condition  (e.g.  GSM  or  GPRS  mode,  transmit  band):  the  overall  temperature  distribution  is  influenced  by  the configuration  of  the  active  components  during  the  specific  mode  of  operation  and  their  different  thermal resistance toward the case interface.  Mounting a  SARA-G3 series  module on a 79 mm x 62  mm  x  1.41 mm 4-Layers PCB with a  high coverage of copper in still air conditions8, the increase of the module temperature9 in different modes of operation, referred to idle state initial condition10, can be summarized as following:  ~8 °C during a GSM voice call (1 TX slot, 1 RX slot) at max TX power  ~12 °C during a GPRS data transfer (2 TX slots, 3 RX slots) at max TX power   The Module-to-Ambient thermal resistance value and the relative increase of module temperature will be different  for  other  mechanical  deployments  of  the  module,  e.g.  PCB  with  different  dimensions  and characteristics, mechanical shells enclosure, or forced air flow.  The increase of thermal dissipation, i.e. the Module-to-Ambient thermal resistance reduction, will decrease the temperature for internal circuitry of  SARA-G3  series modules for a  given  operating ambient  temperature. This improves the device long-term reliability for applications operating at high ambient temperature.  A few hardware techniques may be used to reduce the Module-to-Ambient thermal resistance in the application:  Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete via stack down to main ground layer  Provide a ground plane as wide as possible on the application board  Optimize antenna return loss, to optimize overall electrical performance of the module including a decrease of module thermal power  Optimize the thermal design of any high-power component included in the application, as linear regulators and amplifiers, to optimize overall temperature distribution in the application device  Select the material, the thickness and the surface of the box (i.e. the mechanical enclosure of the application device that integrates the module) so that it provides good thermal dissipation  Force ventilation air-flow within mechanical enclosure                                                       8 Refer to SARA-G3 series Data Sheet [1] for the Rth,M-A value in this application condition 9 Temperature is measured by internal sensor of wireless module 10 Steady state thermal equilibrium is assumed. The module’s temperature in idle state can be considered equal to ambient temperature
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 110 of 145  Provide a heat  sink  component attached  to the module top side,  with electrically  insulated / high thermal conductivity adhesive, or on the backside of the application board, below the wireless module  For example, after the installation of a robust aluminum heat-sink with forced air ventilation on the back of the same application board described above, the Module-to-Ambient  thermal resistance (Rth,M-A)  is  reduced up to the  Module-to-Case  thermal  resistance  (Rth,M-C)  defined  in  the  SARA-G3  series Data  Sheet [1].  The  effect  of lower Rth,M-A can be seen from the module temperature increase, which now can be summarized as following:  ~1 °C during a GSM voice call (1 TX slot, 1 RX slot) at the maximum TX power  ~2 °C during a GPRS data transfer (2 TX slots, 3 RX slots) at the maximum TX power  Beside the reduction of the Module-to-Ambient thermal resistance implemented by the hardware design of the application device integrating a SARA-G3 series module, the increase of module temperature can be moderated by the software implementation of the application. Since  the  most  critical  condition  concerning  module  thermal  power  occurs  when  module  connected-mode  is enabled, the actual module thermal power depends, as module current consumption, on the radio access mode (GSM / GPRS), the operating band and the average TX power.  A few software techniques may be implemented to reduce the module temperature increase in the application:  Select by means of AT command (refer to the u-blox AT Commands Manual [2], +UCLASS command) the module’s  GPRS  multi-slot  class  which  provides  lower  current  consumption  (refer  to  current  consumption values reported in the SARA-G3 series Data Sheet [1])   Select by means of AT command (refer to the u-blox AT Commands Manual [2], +UBANDSEL command) the operating band which provides lower current consumption (refer to current consumption values reported in the SARA-G3 series Data Sheet [1])   Enable module connected-mode for a given time period and then disable it for a time period enough long to properly mitigate temperature increase
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 111 of 145 2.12 ESD guidelines  2.12.1 ESD immunity test overview The  immunity  of  devices  integrating  SARA-G3  series  modules  to  Electro-Static  Discharge  (ESD)  is  part  of  the Electro-Magnetic  Compatibility  (EMC)  conformity  which  is  required  for  products  bearing  the  CE  marking, compliant  with  the  R&TTE Directive  (99/5/EC),  the  EMC  Directive  (89/336/EEC)  and  the  Low  Voltage  Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 [15] and the radio equipment standards ETSI EN 301 489-1 [16], ETSI EN 301 489-7 [17], ETSI EN 301 489-24 [18], which requirements are summarized in Table 38. The ESD  immunity test is performed at  the enclosure  port,  defined by  ETSI EN  301 489-1 [16]  as the physical boundary through  which  the electromagnetic field  radiates.  If  the  device  implements  an integral antenna,  the enclosure port is seen as all insulating and conductive surfaces housing the  device. If the device  implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1 [16]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting cables  to  auxiliary  equipments,  depends  on  device  accessible  interfaces  and  manufacturer  requirements,  as defined by ETSI EN 301 489-1 [16]. Contact  discharges  are  performed  at  conductive  surfaces,  while  air  discharges  are  performed  at  insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2 [15].   For the definition of integral antenna, removable antenna, antenna port, device classification refer to ETSI EN 301 489-1 [16].  CENELEC EN 61000-4-2 [15] defines the contact and air discharges.  Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge 4 kV Air Discharge 8 kV Table 38: Electro-Magnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24   2.12.2 ESD immunity test of u-blox SARA-G3 series reference designs Although  Electro-Magnetic  Compatibility  (EMC)  certification  is  required  for  customized  devices  integrating  SARA-G3  series  modules  for  R&TTED  and  European  Conformance  CE  mark,  EMC  certification  (including  ESD immunity) has been successfully performed on SARA-G3 series modules reference design according to CENELEC EN 61000-4-2 [15], ETSI EN 301 489-1 [16], ETSI EN 301 489-7 [17], ETSI EN 301 489-24 [18] European Norms. The  EMC  /  ESD  approved  u-blox  reference  designs  consist  of  a  SARA-G3  series  module  soldered  onto  a motherboard which provides supply interface, SIM card, headset and communication port. An external antenna is connected to an SMA connector provided on the motherboard for the GSM antenna. Since an external antenna  is used,  the antenna  port can  be  separated from the  enclosure  port.  The  reference design is not  enclosed  in a  box so  that the enclosure  port is  not  indentified with  physical surfaces. Therefore, some test cases cannot be applied. Only the antenna port is identified as accessible for direct ESD exposure.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 112 of 145  u-blox SARA-G3 series reference design implement all the ESD precautions described in section 2.12.3.  Table  39  reports  the  u-blox  SARA-G3  series  reference  designs  ESD  immunity  test  results,  according  to  test requirements stated in the  CENELEC EN 61000-4-2 [15], ETSI EN 301 489-1 [16], ETSI EN 301 489-7 [17] and ETSI EN 301 489-24 [18].  Category Application Immunity Level Remarks Contact Discharge  to coupling planes  (indirect contact discharge) Enclosure +4 kV / -4 kV  Contact Discharges  to conducted surfaces  (direct contact discharge) Enclosure port Not Applicable Test not applicable to u-blox reference design because it does not provide enclosure surface. The  test  is  applicable  only  to  equipments  providing conductive enclosure surface. Antenna port +4 kV / -4 kV Test  applicable  to  u-blox  reference  design  because  it provides antenna with conductive & insulating surfaces. The  test  is  applicable  only  to  equipments  providing antenna with conductive surface. Air Discharge  at insulating surfaces Enclosure port Not Applicable Test  not  applicable  to  the  u-blox  reference  design because it does not provide an enclosure surface. The  test  is  applicable  only  to  equipments  providing insulating enclosure surface. Antenna port +8 kV / -8 kV Test  applicable  to  u-blox  reference  design  because  it provides antenna with conductive & insulating surfaces. The  test  is  applicable  only  to  equipments  providing antenna with insulating surface. Table 39: Enclosure ESD immunity level of u-blox SARA-G3 series modules reference designs  2.12.3 ESD application circuits The  application  circuits  described  in  this  section  are  recommended  and  should  be  implemented  in  the  device integrating  SARA-G3  series  modules,  according  to  the  application  board  classification  (see  ETSI EN 301 489-1 [16]), to satisfy the requirements for ESD immunity test summarized in Table 38.  Antenna interface  The ANT pin of SARA-G3 series modules provides ESD immunity up to ±4 kV for direct Contact Discharge and up to  ±8  kV  for  Air  Discharge:  no  further  precaution  to  ESD  immunity  test  is  needed, as  implemented  in  the EMC / ESD approved reference design of SARA-G3 series modules. The antenna interface application circuit implemented in the EMC / ESD approved reference designs of SARA-G3 series modules is described in Figure 37 in case of antenna detection circuit not implemented, and is described in Figure 38 and Table 22 in case of antenna detection circuit implemented (section 2.3).  RESET_N pin The following precautions are suggested for the  RESET_N line of SARA-G3 series modules, depending on the application board handling, to satisfy ESD immunity test requirements:  It is recommended to keep the connection line to RESET_N as short as possible
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 113 of 145 Maximum ESD  sensitivity rating of the  RESET_N  pin is  1  kV  (Human Body Model  according  to  JESD22-A114). Higher protection level could be required if the  RESET_N pin is externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A  general  purpose  ESD  protection  device  (e.g.  EPCOS  CA05P4S14THSG  varistor  array  or  EPCOS CT0402S14AHSG varistor) should be mounted on the RESET_N line, close to accessible point The RESET_N application circuit implemented in the EMC / ESD approved reference designs of  SARA-G3 series modules is described in Figure 32 and Table 20 (section 2.2.2).  SIM interface The following precautions are suggested for  SARA-G3 series modules SIM interface (VSIM, SIM_RST, SIM_IO, SIM_CLK pins), depending on the application board handling, to satisfy ESD immunity test requirements:  A  47  pF  bypass  capacitor  (e.g.  Murata  GRM1555C1H470J)  must  be  mounted  on  the  lines  connected  to VSIM,  SIM_RST,  SIM_IO  and  SIM_CLK  pins  to  assure  SIM  interface  functionality  when  an  electrostatic discharge is applied to the application board enclosure  It is suggested to use as short as possible connection lines at SIM pins Maximum ESD sensitivity rating of SIM interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if SIM interface pins are externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A low capacitance (i.e. less than 10 pF) ESD protection device (e.g. Tyco Electronics PESD0402-140) should be mounted on each SIM interface line, close to accessible points (i.e. close to the SIM card holder) The  SIM  interface  application  circuit  implemented  in  the  EMC  /  ESD  approved  reference  designs  of  SARA-G3 series modules is described in Figure 42 and Table 25 (section 2.4).  Other pins and interfaces All the module  pins that  are externally accessible on the device integrating  SARA-G3 series  module  should be included in the ESD immunity test since they are considered to be a port as defined in  ETSI EN 301 489-1 [16]. Depending on  applicability,  to  satisfy  ESD immunity  test  requirements  according to  ESD  category  level,  all  the module pins that are externally accessible should be protected up to ±4 kV for direct Contact Discharge and up to ±8 kV for Air Discharge applied to the enclosure surface. The maximum ESD sensitivity rating of all the other pins of the module is 1 kV (Human Body Model according to JESD22-A114).  Higher  protection  level  could  be  required  if  the  relative  pin  is  externally  accessible  on  the application board. The following precautions are suggested to achieve higher protection level:  A general purpose ESD protection device (e.g. EPCOS CA05P4S14THSG or EPCOS CT0402S14AHSG varistor) should be mounted on the relative line, close to accessible point
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 114 of 145 2.13 Schematic for SARA-G3 series module integration Figure 61 is an example of a schematic diagram where a SARA-G350 module is integrated into an application board, using all the available interfaces and functions of the module. TXDRXDRTSCTSDTRDSRRIDCDGND12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND3V8GND330µF 10nF100nF 56pFSARA-G35052 VCC53 VCC51 VCC+100µF2V_BCKPGND GNDGNDRTC back-up1.8V DTE1.8V DTE16 GPIO13V8Network Indicator18 RESET_NApplication ProcessorOpen Drain Output15 PWR_ON100kΩOpen Drain OutputTXDRXD29 TXD_AUX28 RXD_AUX0Ω0ΩTPTPu-blox  1.8 V GPS/GNSS Receiver4.7kOUTINGNDLDO RegulatorSHDNSDASCL4.7k3V8 1V8_GPSSDA2SCL2GPIO3GPIO4TxD1EXTINT02627242547kVCCGPIO2 231.8V Digital Audio DeviceI2S_RXDI2S_CLKI2S Data OutputI2S ClockI2S_TXDI2S_WAI2S Data InputI2S Word Alligment3736353449MIC_P2.2k2.2k 2.2k48MIC_N2.2k10uF46MIC_BIAS47MIC_GND100nF100nF44SPK_P45SPK_N82nH82nH27pF27pFConnectorMicrophoneESDESD27pF 27pFSpeakerConnectorESD ESD15pF33 RSVD31 RSVD17 RSVD19 RSVD47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF41VSIM39SIM_IO38SIM_CLK40SIM_RST47pFSW1 SW24V_INT42SIM_DET470k ESD ESD ESD ESD ESD ESD56ANT62ANT_DET10k 82nH33pF Connector27pF ESDExternal AntennaV_BCKP1kTPTPTP Figure 61: Example of schematic diagram to integrate SARA-G350 module in an application board, using all the interfaces
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 115 of 145 Figure 62 is an example of a schematic diagram where a SARA-G300 / SARA-G310 module is integrated into an application board, using all the available interfaces and functions of the module. TXDRXDRTSCTSDTRDSRRIDCDGND12 TXD9DTR13 RXD10 RTS11 CTS6DSR7RI8DCDGND3V8GND330µF 10nF100nF 56pFSARA-G300/G31052 VCC53 VCC51 VCC+GND GND1.8V DTE1.8V DTE16 RSVD18 RESET_NApplication ProcessorOpen Drain Output15 PWR_ON100kΩOpen Drain OutputTXDRXD29 TXD_AUX28 RXD_AUX0Ω0ΩTPTPRSVDRSVDRSVDRSVD26272425RSVD 23RSVDRSVDRSVDRSVD3736353449RSVD48RSVD46RSVD47RSVD44RSVD45RSVD15pF33 RSVD31 EXT32K17 RSVD19 RSVD47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF41VSIM39SIM_IO38SIM_CLK40SIM_RST47pFSW1 SW24V_INT42SIM_DET470k1kESD ESD ESD ESD ESD ESD56ANT62RSVDConnector External Antenna100µF2V_BCKPGNDRTC back-upV_BCKP32kHz OscillatorGNDCLKOUTOEVCCV_BCKP100nFTPTPTP Figure 62: Example of schematic diagram to integrate SARA-G300/G310 modules in an application board, using all the interfaces
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 116 of 145 2.14 Design-in checklist This section provides a design-in checklist. 2.14.1 Schematic checklist The following are the most important points for a simple schematic check:  DC supply must provide a nominal voltage at VCC pin above the minimum operating range limit.  DC supply must be capable of providing 1.9 A current pulses, providing a voltage at VCC pin above the minimum operating range limit and with a maximum 400 mV voltage drop from the nominal value.  VCC  supply  should  be  clean,  with  very  low  ripple/noise:  provide  the  suggested  bypass  capacitors,  in particular if the application device integrates an internal antenna.  VCC voltage must ramp from 2.5 V to 3.2 V within 4 ms to allow a proper switch-on of the module.  Do not leave PWR_ON floating: fix properly the level, e.g. adding a proper pull-up resistor to V_BCKP.  Do not apply loads which might exceed the limit for maximum available current from V_INT supply.  Check that voltage level of any connected pin does not exceed the relative operating range.  Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications.  Insert the suggested capacitors on each SIM signal and low capacitance ESD protections if accessible.  Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation [9].  Provide accessible  testpoints  directly connected  to  the following  pins:  TXD_AUX  and RXD_AUX pins, V_INT  pin,  PWR_ON  and/or  RESET_N  pins,  to  allow  the  module  firmware  upgrade  using  the  u-blox EasyFlash tool and to allow the trace log capture (debug purpose).  Add a proper pull-up resistor (e.g. 4.7 k) to V_INT or another proper 1.8 V supply on each DDC (I2C) interface line, if the interface is used.  Capacitance and series resistance must be limited on each line of the DDC (I2C) interface.  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 k resistor on the board in series to the GPIO when those are used to drive LEDs.  Connect the pin number 33 (RSVD) to ground.  Insert the suggested passive filtering parts on each used analog audio line.  Check the digital audio interface specifications to connect a proper device.  Provide proper precautions for ESD immunity as required on the application board.  Any external signal connected to the UART interface, auxiliary UART interface, I2S interfaces and GPIOs must be tri-stated or set low when the module is in power-down mode and during the module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and let a proper boot of the module.  All unused pins can be left unconnected except the PWR_ON pin (its level must be properly fixed, e.g. adding a 100 k pull-up to V_BCKP) and the RSVD pin number 33 (it must be connected to GND).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Design-in     Page 117 of 145 2.14.2 Layout checklist The following are the most important points for a simple layout check:  Check  50    nominal  characteristic  impedance  of  the  RF  transmission  line  connected  to  the  ANT pad (antenna RF input/output interface).  Follow the recommendations of the antenna producer  for correct antenna installation and deployment (PCB layout and matching circuitry).  Ensure no coupling occurs between the RF interface and noisy or sensitive signals (primarily analog audio input/output signals, SIM signals, high-speed digital lines).  VCC line should be wide and short.  Route VCC supply line away from sensitive analog signals.  Ensure proper grounding.  Optimize placement for minimum length of RF line and closer path from DC source for VCC.  Route analog audio signals away from noisy sources (primarily RF interface, VCC, switching supplies).  The audio outputs lines on the application board must be wide enough to minimize series resistance.  Keep routing short and minimize parasitic capacitance on the SIM lines to preserve signal integrity.  2.14.3 Antenna checklist  Antenna termination should provide 50  characteristic impedance with V.S.W.R at least less than 3:1 (recommended 2:1) on operating bands in deployment geographical area.  Follow the recommendations of the antenna producer for correct antenna  installation and deployment (PCB layout and matching circuitry).  Follow the additional guidelines for products marked with the FCC logo (United States only) reported in chapter 2.3.1.2 and 4.2.2  Follow the guidelines in chapter 2.3.2 to get proper antenna detection functionality, if required.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Handling and soldering     Page 118 of 145 3 Handling and soldering   No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.  3.1 Packaging, shipping, storage and moisture preconditioning For  information  pertaining  to  reels  and  tapes,  Moisture  Sensitivity  levels  (MSD),  shipment  and  storage information, as well as drying for preconditioning see the SARA-G3 series Data Sheet [1] and the u-blox Package Information Guide [25]. The SARA-G3 series modules are Electro-Static Discharge (ESD) sensitive devices.  Ensure ESD precautions are implemented during handling of the module.  3.2 Soldering 3.2.1 Soldering paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:    OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:  95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)       95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature:   217 °C Stencil Thickness:  150 µm for base boards The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.10  The  quality  of  the  solder  joints  on  the  connectors  (’half  vias’)  should  meet  the  appropriate  IPC specification.  3.2.2 Reflow soldering A  convection  type-soldering  oven  is  strongly  recommended  over  the  infrared  type  radiation  oven. Convection  heated  ovens  allow  precise  control  of  the  temperature  and  all  parts  will  be  heated  up  evenly, regardless of material properties, thickness of components and surface color. Consider  the  "IPC-7530  Guidelines  for  temperature  profiling  for  mass  soldering  (reflow  and  wave)  processes, published 2001". Reflow profiles are to be selected according to the following recommendations.  Failure to observe these recommendations can result in severe damage to the device!
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Handling and soldering     Page 119 of 145 Preheat phase Initial heating of component leads and balls. Residual humidity will be dried out.  Note that this preheat phase will not replace prior baking procedures.  Temperature rise rate: max 3 °C/s  If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.  Time: 60 – 120 s  If  the  preheat  is  insufficient,  rather  large  solder  balls  tend  to  be generated.  Conversely,  if  performed excessively, fine  balls and  large balls will be generated in clusters.  End Temperature: 150 - 200 °C  If  the  temperature  is  too  low,  non-melting  tends  to  be  caused  in areas containing large heat capacity. Heating/ reflow phase The  temperature  rises  above  the  liquidus  temperature  of  217  °C.  Avoid  a  sudden  rise  in  temperature  as  the slump of the paste could become worse.  Limit time above 217 °C liquidus temperature: 40 - 60 s  Peak reflow temperature: 245 °C Cooling phase A  controlled  cooling  avoids  negative  metallurgical  effects  (solder  becomes  more  brittle)  of  the  solder  and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.  Temperature fall rate: max 4 °C/s   To avoid falling off, modules should be placed on the topside of the motherboard during soldering.  The  soldering  temperature  profile  chosen  at  the  factory  depends  on  additional  external  factors  like  choice  of soldering paste, size, thickness and properties of the base board, etc.   Exceeding  the  maximum  soldering  temperature  and  the  maximum  liquidus  time  limit  in  the recommended soldering profile may permanently damage the module. Preheat Heating Cooling[°C] Peak Temp. 245°C [°C]250 250Liquidus Temperature217 217200 20040 - 60 sEnd Temp.max 4°C/s150 - 200°C150 150max 3°C/s60 - 120 s100 Typical Leadfree 100Soldering Profile50 50Elapsed time [s] Figure 63: Recommended soldering profile  SARA-G3 series modules must not be soldered with a damp heat process.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Handling and soldering     Page 120 of 145 3.2.3 Optical inspection After soldering the SARA-G3 series modules, inspect the modules optically to verify that the module is properly aligned and centered. 3.2.4 Cleaning Cleaning  the  soldered  modules  is  not  recommended.  Residues  underneath  the  modules  cannot  be  easily removed with a washing process.  Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.  Cleaning with alcohol or other organic solvents can result  in  soldering flux  residues flooding  into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.  Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering. 3.2.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a SARA-G3 series module populated on it. The reason for this is the risk of the module falling off due to high weight in relation to the adhesive properties of the solder. 3.2.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with SARA-G3 series modules. 3.2.7 Hand soldering Hand soldering is not recommended. 3.2.8 Rework Rework is not recommended.  Never  attempt  a  rework  on  the  module  itself,  e.g.  replacing  individual  components.  Such  actions immediately terminate the warranty. 3.2.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These materials affect the HF properties of the SARA-G3 series modules and it is important to prevent them from flowing into the module.  The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating.  Conformal Coating of the module will void the warranty.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Handling and soldering     Page 121 of 145 3.2.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the SARA-G3 series modules before implementing this in the production.  Casting will void the warranty. 3.2.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI  covers  is  done  at  the  customer's  own  risk.  The  numerous  ground  pins  should  be  sufficient  to  provide optimum immunity to interferences and noise.  u-blox gives no warranty for damages to the SARA-G3 series modules caused by soldering metal cables or any other forms of metal strips directly onto the EMI covers. 3.2.12 Use of ultrasonic processes SARA-G3  series  modules  contain  components  which  are  sensitive  to  Ultrasonic  Waves.  Use  of  any  Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.  u-blox  gives  no  warranty  against  damages  to  the  SARA-G3  series  modules  caused  by  any  Ultrasonic Processes.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Approvals     Page 122 of 145 4 Approvals   For  the  complete  list  of  all  the  certification  schemes  approvals  of  SARA-G3  series  modules  and  the corresponding declarations of conformity, refer to the u-blox web-site (http://www.u-blox.com).  4.1 Product certification approval overview Product certification approval is the process of certifying that a product has passed all tests and criteria required by specifications, typically called “certification schemes” that can be divided into three distinct categories:  Regulatory certification o Country specific approval required by local government in most regions and countries, as:  CE (Conformité Européenne) marking for European Union  FCC (Federal Communications Commission) approval for United States  Industry certification o Telecom industry specific approval verifying the interoperability between devices and networks:  GCF  (Global  Certification  Forum),  partnership  between  European  device  manufacturers  and network operators to ensure and verify global interoperability between devices and networks  PTCRB  (PCS  Type  Certification  Review  Board),  created  by  United  States  network  operators  to ensure and verify interoperability between devices and North America networks  Operator certification o Operator specific approval required by some mobile network operator, as:  AT&T network operator in United States  Even  if  SARA-G3  modules  are  approved  under  all  major  certification  schemes,  the  application  device  that integrates  SARA-G3  modules  must  be  approved  under  all  the  certification  schemes  required  by  the  specific application device to be deployed in the market. The required certification scheme approvals and relative testing specifications differ depending on the country or the region where the device that integrates SARA-G3 series modules must be deployed, on the relative vertical market of the device, on type, features and functionalities of the whole application device, and on the network operators where the device must operate.   The certification of the application device that integrates a  SARA-G3 module and the compliance of the application  device  with  all  the  applicable  certification  schemes,  directives  and  standards  are  the  sole responsibility of the application device manufacturer.  SARA-G3 modules  are certified according to all capabilities and options stated in the Protocol  Implementation Conformance  Statement  document  (PICS)  of  the  module. The  PICS,  according  to  3GPP  TS  51.010-2  [14],  is  a statement of the implemented and supported capabilities and options of a device.   The PICS document of the application device integrating a  SARA-G3 module must be updated from the module  PICS  statement  if  any  feature  stated  as  supported  by  the  module  in  its  PICS  document  is  not implemented or disabled in the application device, as for the following cases: o if any RF band is disabled by AT+UBANDSEL command  o if the automatic network attach is disabled by AT+COPS command o if the module’s GPRS multi-slot class is changed by AT+UCLASS command
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Approvals     Page 123 of 145 4.2 Federal Communications Commission and Industry Canada notice  Federal Communications Commission (FCC) ID:  XPYSARAG350 Industry Canada (IC) Certification Number:  8595A-SARAG350 4.2.1 Safety Warnings review the structure  Equipment for building-in. The requirements for fire enclosure must be evaluated in the end product  The  clearance  and  creepage  current  distances  required  by  the  end  product  must  be  withheld  when  the module is installed  The cooling of the end product shall not negatively be influenced by the installation of the module  Excessive sound pressure from earphones and headphones can cause hearing loss  No natural rubbers, no hygroscopic materials nor materials containing asbestos are employed 4.2.2 Declaration of Conformity – United States only This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:  this device may not cause harmful interference  this device must accept any interference received, including interference that may cause undesired operation  Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  FCC  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment  should be  installed and  operated with  a  minimum distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The  gain  of  the  system  antenna(s)  used  for  the  SARA-G3  series  modules  (i.e.  the  combined transmission line, connector, cable losses and radiating element gain) must not exceed 8.39 dBi (850 MHz) and 3.11 dBi (1900 MHz) for mobile and fixed or mobile operating configurations. 4.2.3 Modifications The  FCC  requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device  that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.  Manufacturers  of  mobile  or  fixed  devices  incorporating  the  SARA-G3  series  modules  are authorized  to  use  the  FCC  Grants  and  Industry  Canada  Certificates  of  the  SARA-G3  series modules for their own final products according to the conditions referenced in the certificates.  The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: "Contains FCC ID: XPYSARAG350" resp.  The IC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: "Contains IC: 8595A-SARAG350" resp.  Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: o this device may not cause interference
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Approvals     Page 124 of 145 o this device must accept any interference, including interference that may cause undesired operation of the device Radio Frequency (RF) Exposure Information The radiated  output power of the  u-blox  Wireless Module is below the Industry Canada  (IC) radio frequency exposure limits. The u-blox Wireless Module should be used in such a manner such that the potential for human contact during normal operation is minimized. This  device  has  been  evaluated  and  shown  compliant  with  the  IC  RF  Exposure  limits  under mobile exposure conditions (antennas are greater than 20cm from a person's body). This device has been certified for use in Canada. Status of the listing in the Industry Canada’s REL  (Radio  Equipment  List)  can  be  found  at  the  following  web  address: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional  Canadian  information  on  RF  exposure  also  can  be  found  at  the  following  web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT: Manufacturers of portable applications incorporating the SARA-G3 series modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada  Certificate  related  to  the  specific  portable  device.  This  is  mandatory  to  meet  the  SAR requirements for portable devices. Changes  or  modifications  not  expressly  approved  by  the  party  responsible  for  compliance could void the user's authority to operate the equipment.  Canada, avis d'Industrie Canada (IC) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: o cet appareil ne doit pas causer d'interférence o cet  appareil  doit  accepter  toute  interférence,  notamment  les  interférences  qui  peuvent affecter son fonctionnement Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l’appareil de sans fil u-blox Wireless Module est inférieure à la limite d'exposition aux fréquences radio d'Industrie Canada (IC). Utilisez l’appareil de sans fil u-blox Wireless Module de façon à minimiser les contacts humains lors du fonctionnement normal. Ce périphérique  a été évalué  et démontré conforme  aux  limites d'exposition aux fréquences radio (RF) d'IC lorsqu'il est installé dans des produits hôtes particuliers qui fonctionnent dans des  conditions  d'exposition  à  des  appareils  mobiles  (les  antennes  se  situent  à  plus  de  20 centimètres du corps d'une personne). Ce  périphérique  est  homologué  pour  l'utilisation  au  Canada.  Pour  consulter  l'entrée correspondant  à  l’appareil  dans  la  liste  d'équipement  radio  (REL  -  Radio  Equipment  List) d'Industrie Canada rendez-vous sur:  http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=fra Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT:  les  fabricants  d'applications  portables  contenant  les  modules  SARA-G3  series doivent  faire  certifier  leur  produit  final  et  déposer  directement  leur  candidature  pour  une certification FCC ainsi que pour un certificat Industrie Canada délivré par l'organisme chargé de ce  type  d'appareil  portable.  Ceci  est  obligatoire  afin  d'être  en  accord  avec  les  exigences  SAR pour les appareils portables. Tout changement ou modification non expressément approuvé par la partie responsable de la certification peut annuler le droit d'utiliser l'équipement.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Approvals     Page 125 of 145 4.3 R&TTED and European Conformance CE mark  This device has been evaluated against the essential requirements of the 1999/5/EC Directive. In order to satisfy the essential requirements of 1999/5/EC Directive, the module is compliant with the following standards:  Radio Frequency spectrum use (R&TTE art. 3.2): o EN 301 511 V9.0.2  Electromagnetic Compatibility (R&TTE art. 3.1b): o EN 301 489-1 V1.9.2 o EN 301 489-7 V1.4.1  Health and Safety (R&TTE art. 3.1a) o EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + AC:2011 o EN 62311:2008 The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body No: 1909 Thus, the following marking is included in the product:  There is no restriction for the commercialisation of this device in all the countries of the European Union.   1909
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Product Testing     Page 126 of 145 5 Product Testing 5.1 u-blox in-series production test u-blox focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The following measurements are done:  Digital self-test (firmware download, Flash firmware verification, IMEI programming)  Measurement of voltages and currents  Adjustment of ADC measurement interfaces  Functional tests (Serial interface communication, analog audio interface, real time clock, temperature sensor, antenna detection, SIM card communication)  Digital tests (GPIOs, digital interfaces)  Measurement and calibration of RF characteristics in all supported bands (Receiver S/N verification, frequency tuning of reference clock, calibration of transmitter and receiver power levels)  Verification  of  RF  characteristics  after  calibration  (modulation  accuracy,  power  levels  and  spectrum performance are checked to be within tolerances when calibration parameters are applied)   Figure 64: Automatic test equipment for module tests  5.2 Test parameters for OEM manufacturer Because of the testing  done by u-blox (with 100% coverage), an OEM manufacturer does not need to repeat firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their production test. An OEM manufacturer should focus on:  Module assembly on the device; it should be verified that: o Soldering and handling process did not damaged the module components o All module pins are well soldered on device board o There are no short circuits between pins
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Product Testing     Page 127 of 145  Component assembly on the device; it should be verified that: o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna  Dedicated  tests  can  be  implemented  to  check  the  device.  For  example,  the  measurement  of  module  current consumption when set in a specified status can detect a short circuit if compared with a “Golden Device” result. Module AT commands are used to perform functional tests (communication with host controller, check SIM card interface, check communication between module and  GPS/GNSS, GPIOs, etc.) and to perform RF performance tests.  5.2.1 “Go/No go” tests for integrated devices A ‘Go/No go’ test is to compare the signal quality with a “Golden Device” in a position with excellent network coverage and after having dialed a call (refer to  u-blox AT Commands Manual [2], AT+CSQ command: <rssi>, <ber> parameters).   These kinds of test may be useful as a ‘go/no go’ test but not for RF performance measurements.  This test is suitable to check the communication with host controller and SIM card, the audio and power supply functionality and verify if components at antenna interface are well soldered.  5.2.2 Functional tests providing RF operation Overall RF performance test of the device including antenna can be performed with basic instruments such as a spectrum analyzer (or an RF power meter) and a signal generator using AT+UTEST command over AT interface. The AT+UTEST command gives a simple interface to set the module to Rx and Tx test modes ignoring GSM/GPRS signaling protocol. The command can set the module:  In transmitting mode in a specified channel and power level in all supported modulation schemes (single slot GMSK) and bands  In receiving mode in a specified channel to returns the measured power level in all supported bands    Refer to the u-blox AT Commands Manual [2], for AT+UTEST command syntax description.  Refer  to  the  End  user  test  Application  Note  [24],  for  AT+UTEST  command  user  guide,  limitations  and examples of use.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Product Testing     Page 128 of 145 Application BoardSARA-G3 seriesANTApplication Processor AT   CommandsWireless AntennaSpectrum  AnalyzerINWideband AntennaTXApplication BoardSARA-G3 seriesANTApplication Processor AT   CommandsWireless AntennaSignalGeneretorOUTWideband AntennaRX Figure 65: Setup with spectrum analyzer and signal generator for radiated measurement   This feature allows the measurement of the transmitter and receiver power levels to check component assembly related  to  the  module  antenna  interface  and  to  check  other  device  interfaces  from  which  depends  the  RF performance.   To  avoid  module  damage  during  transmitter  test,  a  proper  antenna  according  to  module specifications or a 50  termination must be connected to ANT pin.  To  avoid  module  damage  during  receiver  test  the  maximum  power  level  received  at  ANT  pin must meet module specifications.   The AT+UTEST command sets the module to emit RF power ignoring GSM/GPRS signalling protocol. This emission  can  generate  interference  that  can  be  prohibited  by  law  in  some  countries.  The  use  of  this feature is intended for testing purpose in controlled environments by qualified user and must not be used during  the  normal  module  operation.  Follow  instructions  suggested  in  u-blox  documentation.  u-blox assumes no responsibilities for the inappropriate use of this feature.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Product Testing     Page 129 of 145 Example of production tests for OEM manufacturer:  1. Trigger TX GMSK burst at low Power Control Level (lower than 15) or a RX measure reporting to check: o If ANT pin is soldered o If ANT pin is in short circuit o If the module was damaged during soldering process or during handling (ESD, mechanical shock…) o If antenna matching components on application board are soldered o If integrated antenna is correctly connected   To  avoid  module  damage  during  transmitter  test  when  good  antenna  termination  is  not guaranteed, use a  low  Power  Control Level  (i.e. PCL  lower or equal  to  15). u-blox assumes no responsibilities for module damaging caused by an inappropriate use of this feature.  2. Trigger TX GMSK burst at maximum PCL: o To check if the power supply is correctly assembled and is able to deliver the required current  3. Trigger TX GMSK burst: o To measure current consumption o To check if module components were damaged during soldering process or during handling (ESD, mechanical shock…)  4. Trigger RX measurement: o To test receiver signal level. Assuming that there are no losses between ANT pin and input power source,  be  aware  that  the  power  level  estimated  by  the  module  can  vary  approximately  within 3GPP tolerances for the average value o To  check  if  module  was  damaged  during  soldering  process  or  during  handling  (ESD,  mechanical shock…)  5. Trigger TX GMSK burst and RX measurement to check: o Overall RF performance of the device including antenna measuring TX and RX power levels
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 130 of 145 Appendix A Migration between LISA and SARA modules A.1 Overview Migrating  between  LISA-U1,  LISA-U2,  LISA-C2  series  and  SARA-G3  series  wireless  modules  designs  is  a  fairly procedure that allows customers to take maximum advantage of their hardware and software investments. SARA-G3  wireless  modules  (26.0  x  16.0  mm  LGA)  have  a  different  form  factor  than  LISA  wireless  modules  (33.2 x 22.4  mm LCC),  but  the footprint for each  SARA and LISA  module  has been developed so that  all the pads on the same lateral edge of the antenna pin can be shared on the application board, due to the same pitch and nearly the same functions provided, as described in Figure 66. 64 63 61 60 58 57 55 5422 23 25 26 28 29 31 3211108754212119181615131243444647495052533335363839414265 66 67 68 69 7071 72 73 74 75 7677 7879 8081 8283 8485 86 87 88 89 9091 92 93 94 95 96CTSRTSDCDRIV_INTV_BCKPGNDRSVDRESET_NRSVD/ GPIO1PWR_ONRXDTXD32017149624 27 305148454037345962 56GNDGNDDSRDTRGNDRSVDGNDGNDRXD_AUXTXD_AUXEXT32 / RSVDGNDRSVD/ GPIO2RSVD/ GPIO3RSVD/ SDARSVD/SCLRSVD/ GPIO4GNDGNDGNDRSVD/ SPK_PRSVD/ MIC_BIASRSVD/ MIC_GNDRSVD/ MIC_PGNDVCCVCCRSVDRSVD/ I2S_TXDRSVD/ I2S_CLKSIM_CLKSIM_IOVSIMSIM_DETVCCRSVD/ MIC_NRSVD/ SPK_NSIM_RSTRSVD/ I2S_RXDRSVD/ I2S_WAGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVD/ ANT_DETANTSARA-G3 seriesTop ViewPin 65-96: GND65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDSPI_MRDYSPI_SRDYSPI_MISOSPI_MOSISPI_SCLKRSVD / SPK_NGNDRSVD / SPK_PRSVDGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WA12345678910111213141516171819202122232425V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039RSVD / MIC_PRSVD / MIC_N28 29 30 31 32 33 34 35 36 37 3876 75 74 73 72 71 70 69 68 67 66LISA-U1 seriesTop ViewGNDRSVDGNDGNDGNDGNDGNDANTGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDSPI_MRDY / GPIO14SPI_SRDY / GPIO13SPI_MISO / GPIO12SPI_MOSI / GPIO11SPI_SCLK / GPIO10GPIO9 / I2S1_WAGNDGPIO8 / I2S1_CLKRSVD / CODEC_CLKGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WA12345678910111213141516171819202122232425V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039GPIO7 / I2S1_TXDGPIO6 / I2S1_RXD28 29 30 31 32 33 34 35 36 37 3876 75 74 73 72 71 70 69 68 67 66LISA-U2 seriesTop ViewGNDRSVD/ ANT_DIVGNDGNDGNDGNDGNDANTGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDRSVDRSVDRSVDRSVDRSVDSPK_NGNDSPK_PRSVDGPIO5VSIMSIM_RSTSIM_IOSIM_CLKRSVDRSVDPCM_DIPCM_CLKPCM_DOPCM_SYNC12345678910111213141516171819202122232425RSVDGNDV_INTRSVDGNDGNDGNDRSVDRIRSVDRSVDGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039MIC_PMIC_N28 29 30 31 32 33 34 35 36 37 3876 75 74 73 72 71 70 69 68 67 66LISA-C2 seriesTop ViewGNDRSVDGNDGNDGNDGNDGNDANTGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND Figure 66: LISA series vs. SARA-G3 series modules pin assignment: highlighted pads that can be shared on the application board This is the basis of the Nested  Design  concept:  any SARA-G3, any  LISA-U1, any LISA-U2, any  LISA-C2 module can  be  alternatively  mounted  on  the  same  nested  board  as  shown  in  Figure  67,  enabling  straightforward development of products supporting either GSM/GPRS, W-CDMA or CDMA wireless technology with the same application board.  LISANESTED APPLICATION BOARDTop Layer and Solder MaskLISA mounting optionwith LISA Paste MaskSARASARA mounting optionwith SARA Paste MaskANT pad Figure 67: Nested Design concept description: LISA and SARA modules alternatively mounted on the same application board
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 131 of 145 The  voltage  level  of  all  the  digital  interfaces  of  SARA-G3  and  LISA  modules  is  1.8  V:  this  allows  the  direct connection from a 1.8 V external device (e.g. application processor) to all the modules. The following chapters explains in details all the points to consider during the migration between LISA and SARA designs, implementing or not a nested design For  further  details  regarding  SARA-G3  and  LISA  modules  characteristics,  usage,  settings  refer  to  the  relative module datasheet [1], [3], [4], [5], System Integration Manual [6], [7], and AT commands manual [2], [8].  A.2 Checklist for migration Have you chosen the optimal SARA-G3 series module?  For quad-band GSM/GPRS class 12, full feature set, select the SARA-G350 module.  For quad-band GSM/GPRS class 2, reduced feature set, select the SARA-G310 module.  For dual-band GSM/GPRS class 2, reduced feature set, select the SARA-G300 module.  Check SARA-G3 series modules hardware requirements  Check power capabilities of the external supply circuit: SARA-G3 modules require large current pulses in connected-mode as well as LISA-U series modules when a 2G call is enabled. LISA-C2 series modules do not require large current pulses due to the CDMA channel access technology.  Check  supported  bands  for  proper  antenna  circuit  development:  SARA-G3  modules  frequency  ranges are within LISA-U modules ranges, but LISA-C2 modules range is quite different.  Check  antenna  detection  requirements:  SARA-G350  modules  provide  the  antenna  detection  function implementing an external application circuit between ANT_DET and ANT pins.  Check  the  module  power-on  requirements:  Table  40  and  relative  section  summarize  differences between SARA-G3 series and LISA modules.  Check the module requirements to enter low power idle-mode: SARA-G300 and SARA-G310 modules require an external 32 kHz signal at EXT32K input pin.  Check serial interfaces requirements: SARA-G3 modules provide UART interface for AT command, data communication, multiplexer functionality, FW upgrade over AT and provide auxiliary UART interface for FW upgrade using the u-blox EasyFlash tool and for Trace log capture (debug purpose).  Check analog audio requirements: SARA-G350 modules do not provide DC blocking capacitors at the MIC_P / MIC_N input pins and provide supply output and local ground for an external microphone at the MIC_BIAS / MIC_GND pins.  Check  digital  audio  requirements:  SARA-G350  modules  provide  a  4-wire  1.8  V  interface  supporting PCM and Normal I2S modes, master role and fixed sample rate.  Check internal active pull-up / down values at digital interface input pins and the current capability of digital interface output pins, since they are slightly different between SARA-G3 and LISA modules.  Check SARA-G3 series modules software requirements  Not  all  of  the  functionalities  available  with  LISA  modules  are  supported  by  all  the  SARA-G3  modules versions. SARA-G300 and SARA-G310 modules do not support: o Audio interfaces, DDC (I2C) interface, Antenna detection interface, GPIOs o Low power idle-mode, if an external 32 kHz signal at EXT32K input pin is not provided o TCP/IP, UDP/IP, FTP, HTTP o GPS/GNSS via Modem, AssistNow clients, Hybrid positioning and CellLocateTM functionalities o Jamming detection
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 132 of 145 A.3 Software migration Software migration between SARA-G3 and LISA wireless modules is a straightforward procedure. Nevertheless there  are  some  differences  to  be  considered  with  firmware  version.  Each  wireless  module  supports  AT commands  according  to  3GPP  standards:  TS  27.007  [10],  TS 27.005  [11],  TS 27.010 [12]  and  the  u-blox  AT command extension. Backward compatibility has been maintained as far as possible.   For  the  complete  list  of  supported  AT  commands  and  their  syntax  refer  to  the  relative  AT  commands manual of the module [2], [8].  A.4 Hardware migration SARA-G3 series  modules have been designed with  backward  compatibility  to LISA  series modules  in mind but some minor differences were unavoidable. These minor differences are however not relevant for the majority of the designs. The following subchapters describe the hardware differences between the interfaces of SARA-G3 series modules and LISA series modules while Table 41 summarizes the detailed differences between the pins.  A.4.1 Supply interfaces Module supply input (VCC) The  same  compatible  external  circuit  can  be  implemented  for  SARA-G3  and  LISA  even  if  there  are  minor differences in the VCC input voltage ranges and some differences in the current consumption figures. The voltage provided must be within the normal operating range limits to allow module switch-on and must be above  the  minimum  limit  of  the  extended  operating  range  to  avoid  module  switch-off.  For  the  detailed  VCC input voltage ranges values refer to Table 41 or to the relative datasheet of the module [1], [3], [4], [5]. The SARA-G3 maximum average current consumption is lower than the LISA one due to the lower data rate or the different channel access technology.  SARA-G3 modules require large current pulses in connected-mode as well as LISA-U  series when a 2G call is enabled.  LISA-C2 series do not  require large current  pulses due  to  the CDMA channel access technology. For the detailed current consumption values refer to the relative datasheet of the module [1], [3], [4], [5]. Detailed supply circuit  design-in guidelines are  reported in section  2.1.1  and in the relative  System Integration Manual of the module [6], [7]. RTC supply input/output (V_BCKP) The same compatible external circuit can be implemented for SARA-G3 series and LISA-U series even if there are minor differences in the V_BCKP typical output voltage and input voltage range as reported in Table 41 or in the relative datasheet of the module [1], [3], [4], [5]. LISA-C2 series do not provide V_BCKP RTC supply input/output as well as the whole RTC functionality. Interfaces supply output (V_INT) The  same  compatible  external  circuit  can  be  implemented  for  SARA-G3  series  and  LISA  series:  there  are  no differences in the V_INT output characteristics.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 133 of 145 A.4.2 System functions interfaces Module power-on SARA-G3 and LISA series power-on sequence is initiated in one of the ways summarized in Table 40. For more details refer to section 1.6.1 or to the relative System Integration Manual of the module [6], [7].  SARA-G3 series LISA-C2 series LISA-U1 series LISA-U2 series Rising edge on the VCC pins to a valid voltage as module supply Rising edge on the VCC pins to a valid voltage as module supply with PWR_ON pin permanently low when VCC is applied Rising edge on the VCC pins to a valid voltage as module supply Rising edge on the VCC pins to a valid voltage as module supply Low level on the PWR_ON pin for appropriate time period Low pulse on the PWR_ON pin for appropriate time period Low pulse on the PWR_ON pin for appropriate time period Low pulse on the PWR_ON pin for appropriate time period Pre-programmed RTC alarm (32 kHz signal at EXT32K input needed for SARA-G300/G310)  Pre-programmed RTC alarm Pre-programmed RTC alarm   RESET_N input pin released from the low level RESET_N input pin released from the low level Table 40: Summary of power on events among modules The same compatible external power-on circuit can be implemented for SARA-G3 series and LISA series even if there are minor differences in the PWR_ON input voltage levels ranges and in the low level time or low pulse time to switch-on the module, as reported in Table 41 or in the relative datasheet of the module [1], [3], [4], [5]. PWR_ON  falling  edge  (i.e.  low  pulse)  is  required  for  LISA  series,  but  it  is  not  required  for  SARA-G3  series. External pull-up is not needed for LISA-C2 series since internal pull-up is provided. Module power-off SARA-G3 and LISA modules can be all properly switched off by means of the AT+CPWROFF command. All LISA-U2 modules except LISA-U200-00S modules can be additionally properly switched off by low pulse on PWR_ON pin, as reported in Table 41 or in the relative datasheet of the module [5]. Module reset SARA-G3 series and LISA series modules reset can be performed in one of the following ways:  Forcing a low level on the RESET_N pin, causing an “external” or “hardware” reset  By means of the AT+CFUN command, causing an “internal” or “software” reset The same compatible external reset circuit can be implemented for SARA-G3 series and LISA series even if there are minor differences in the RESET_N input voltage levels ranges and in the low level time, as reported in Table 41 or in the relative datasheet of the module [1], [3], [4], [5]. Additional  precautions  are  suggested  for  the  RESET_N  line  of  LISA-U  series  modules,  depending  on  the application board handling, to satisfy ESD immunity test requirements as described in the LISA-U Series System Integration Manual [7]. External 32 kHz input The external 32 kHz signal input pin (EXT32K) is available only on the SARA-G300 and SARA-G310 modules to provide the 32 kHz reference clock for the Real Time Clock (RTC) timing, used by the module processor to reach the low power idle-mode and provide the RTC functions. SARA-G350 and LISA-U modules are equipped with internal 32 kHz oscillator to provide the same functions. LISA-C2 series do not provide RTC and the relative functions.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 134 of 145 A.4.3 Antenna interface RF interface for Tx/Rx antenna The same compatible external circuit can be implemented for  SARA-G3 series and LISA  series  ANT pin even if there are some differences in the operating bands frequency ranges as summarized in Figure 68.  VV II II850900850800 850 900 950900 18001900 190018001700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200824 960 1710 1990LISA-U100 LISA-U120 LISA-U260LISA-U200 LISA-U230VV II II850900850800 850 900 950900 18001900 190018001700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200IIVIVIVIIIVIII IV IV824 960 1710 2170850900850800 850 900 950900 18001900 190018001700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200IIVIIIVIII824 960 1710 2170LISA-U110 LISA-U130 LISA-U270850900850800 850 900 950900 18001900 190018001700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200824 960 1710 1990SARA-G310 SARA-G350900800 850 900 950900 1800 18001700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200880 960 1710 1880SARA-G300800800800 850 900 9501900 19001700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200824 894 1850 1990LISA-C200 Figure 68: Summary of operating bands frequency ranges among modules An external application circuit can be implemented on the application device integrating LISA-U2 series modules to  satisfy  ESD  immunity  test  requirements  at  the  antenna  port,  as  described  in  the  LISA-U  Series  System Integration  Manual [7].  The  same  application  circuit  is  not  applicable  for  SARA-G3  series,  LISA-U1  series  and LISA-C2 series. RF interface for Rx diversity antenna Only the LISA-U230 modules provide the RF input for Rx diversity antenna (ANT_DIV). SARA-G3, LISA-C2, LISA-U1 and the other LISA-U2 series modules do not support Rx diversity. Antenna detection interface An external application circuit can be implemented on the application device integrating SARA-G350 modules to provide antenna detection functionality, with a proper connection between the ANT_DET pin and the ANT pin, as described in section 2.3.2. LISA-U modules are equipped with internal circuit for antenna detection support. SARA-G300, SARA-G310 and LISA-C2 series modules do not support antenna detection.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 135 of 145 A.4.4 SIM interface SIM interface The same compatible external circuit can be implemented for SARA-G3 and LISA modules: 1.8 V and 3.0 V SIM card / IC are supported. LISA-C2 modules do not need an external SIM for Sprint and Verizon mobile operators. LISA-C2 series SIM interface is hardware ready but the support of external SIM card / IC will be provided by the upcoming firmware releases. SIM detection interface The  same  compatible  external  circuit  can  be  implemented  for  SARA-G3  and  LISA  modules:  SIM  detection function is provided by the SIM_DET pin on SARA-G3 modules and by the GPIO5 pin on LISA-U modules. SIM card hot insertion/removal is additionally supported by all LISA-U2 series except LISA-U200-00S. LISA-C2 modules do not support SIM detection. A.4.5 Serial interfaces UART interface The  same  compatible  external  circuit  can  be  implemented  for  SARA-G3  and  LISA  modules:  1.8  V  unbalanced asynchronous  serial  port  with  RS-232  functionality  is  provided  on  SARA-G3  modules  (for  AT  command,  data communication,  MUX  functionality,  FW  upgrade  over  AT),  LISA-C2  modules  (for  AT  command,  data communication, MUX functionality), LISA-U modules (for AT command, data communication, MUX functionality, FW upgrade over AT or using the u-blox EasyFlash tool). LISA-C2 modules do not support DSR, DCD and DTR functions. Table 41 and in relative datasheet of the module [1], [3], [4], [5] report minor differences in the internal pull-ups and drivers strengths. These are the default settings of the UART interfaces:  SARA-G3 modules: automatic baud rate and frame format detection  LISA-U2 except LISA-U200-00S modules: one-shot automatic baud rate and frame format detection  LISA-C2, LISA-U1 and LISA-U200-00S modules: 115200 b/s baud rate and 8N1 frame format For further details regarding UART interface settings refer to the relative datasheet of the module [1], [3], [4], [5] and to the relative AT commands manual of the module [2], [8]. UART AUX interface Only the SARA-G3 modules provide auxiliary UART interface for FW upgrade using the u-blox EasyFlash tool and for Trace log capture (debug purpose). LISA modules do not provide auxiliary UART interface. USB interface SARA-G3 modules do not provide USB interface that is available on LISA-U modules (High-Speed USB 2.0 for AT command,  data  communication,  FW  upgrade  over  AT  or  using  the  u-blox  EasyFlash  tool,  and  for  Trace  log capture) and on LISA-C2 modules (Full-Speed USB 2.0 for AT command, Data communication, FW upgrade). SPI interface SARA-G3  and  LISA-C2  modules  do  not  provide  SPI  interface  that  is  available  on  LISA-U  modules  (5-wire  IPC interface for AT command, data communication, MUX functionality, FW upgrade over AT). DDC (I2C) interface The same compatible external circuit can be implemented for  SARA-G350 and LISA series: 1.8 V DDC  (I2C bus compatible) interface is provided to communicate with u-blox GPS/GNSS receivers.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 136 of 145 SARA-G300, SARA-G310 and LISA-U200-00S modules do not support DDC (I2C) interface. LISA-C2 modules will support DDC (I2C) interface by the upcoming firmware releases. All LISA-U2  except LISA-U200-00S modules  additionally support  the communication  with  I2C slaves other then u-blox positioning receivers over the same DDC (I2C) interface, by means of dedicated AT commands. A.4.6 Audio interfaces Analog audio interfaces Differential analog audio input is provided on the MIC_P / MIC_N pins of SARA-G350 modules (without internal DC blocking capacitor) and LISA-C2 series, LISA-U120, LISA-U130 modules (with internal DC blocking capacitor). Supply output and local ground for an external microphone is  provided on the  MIC_BIAS / MIC_GND pins of SARA-G350 modules only: the supply for an external microphone has to be  provided by an external LDO linear regulator with the other modules. Differential analog audio output is provided on the SPK_P / SPK_N pins of SARA-G350, LISA-U120, LISA-U130 modules (16 ohm load capable) and LISA-C2 series modules (32 ohm load capable). SARA-G300/G310, LISA-U100/U110, LISA-U200-00S modules do not provide analog audio interfaces. LISA-U2 series modules do not provide analog audio interfaces but analog audio can be provided with external audio codec connected to a digital audio interface of all LISA-U2 series except LISA-U200-00S modules (e.g. the 4-wire I2S digital audio interface provided instead of the 4 analog audio pins).  The modules provide control of the external codec by means of the I2C interface and clock reference by means of the CODEC_CLK pin. For further details regarding analog audio interfaces characteristics, usage, settings refer to the relative module datasheet [1], [3], [4], [5], System Integration Manual 1.10.1, 2.6.1, [6], [7], and AT commands manual [2], [8]. Digital audio interfaces Digital audio interface is provided  on the  I2S_TXD, I2S_RXD,  I2S_CLK,  I2S_WA  pins of SARA-G350 modules (1.8 V, PCM & Normal I2S modes, master, fixed sample rate) and LISA-U120/U130 and all LISA-U2 series except LISA-U200-00S modules (1.8 V, PCM & Normal I2S modes, master & slave, configurable sample rate), and it  is provided on the PCM_DO, PCM_DI, PCM_CLK, PCM_SYNC pins of LISA-C2 series modules (1.8 V, PCM): the same compatible external circuit can be implemented according to external digital audio device capabilities. Additional digital audio interface is provided on I2S1_TXD, I2S1_RXD, I2S1_CLK, I2S1_WA pins of all LISA-U2 series except LISA-U200-00S (1.8 V, PCM & Normal I2S modes, master & slave, configurable sample rate). SARA-G300/G310, LISA-U100/U110, LISA-U200-00S modules do not provide digital audio interfaces. For further details regarding digital audio interfaces characteristics, usage, settings refer to the relative module datasheet [1], [3], [4], [5], System Integration Manual 1.10.2, 2.6.2, [6], [7], and AT commands manual [2], [8]. A.4.7 GPIO pins The same compatible external circuit can be implemented for SARA-G350 and LISA series: four 1.8 V GPIOs are provided  by  SARA-G350  modules,  providing  the  same  functionalities  as  LISA  series  modules  except  Module Status  and  Operating  Mode  Indications.  SIM detection  function  is  provided by  the  SIM_DET  pin on  SARA-G3 series modules instead of the GPIO5 pin on LISA-U series modules. SARA-G300 and SARA-G310 modules do not provide GPIOs. A.4.8 Reserved pins SARA-G3 series modules RSVD pin 33 must be connected to ground as LISA series modules RSVD pin 5.
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 137 of 145 A.4.9 Pin-out comparison between LISA and SARA Table 41 summarizes the pin electrical differences between LISA and SARA wireless modules. Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series Power        VCC 51-53 Normal op. range:  3.35 V – 4.5 V  Extended op. range:  3.00 V – 4.5 V  High pulse current  due to GSM TDMA 61-63 Normal op. range:  3.3 V – 4.4 V  Extended op. range:  Not applicable No high pulse current  due to CDMA Normal op. range:  3.4 V – 4.2 V  Extended op. range:  3.1 V – 4.2 V  High pulse current  due to GSM TDMA Normal op. range:  3.3 V – 4.4 V  Extended op. range:  3.1 V – 4.5 V  High pulse current  due to GSM TDMA V_BCKP 2 Output characteristics:  2.3 V typ, 2 mA max Input op. range:  1.0 V – 2.4 V  2 Not Available Output characteristics:  2.3 V typ, 3 mA max Input op. range:  1.0 V – 2.5 V  Output characteristics:  1.8 V typ, 3 mA max Input op. range:  1.0 V – 1.9 V  V_INT 4 Output characteristics:  1.8 V typ, 50 mA max 4 Output characteristics:  1.8 V typ, 50 mA max Output characteristics:  1.8 V typ, 50 mA max Output characteristics:  1.8 V typ, 50 mA max Antenna       ANT 56 RF input/output for Tx/Rx antenna  68 RF input/output for Tx/Rx antenna  RF input/output for Tx/Rx antenna  RF input/output for main Tx/Rx antenna  ANT_DIV  Not Available 74 Not Available Not Available LISA-U230 only:   RF input for   Rx diversity antenna ANT_DET 62 SARA-G350 only:   Input for antenna   detection circuit  Not Available Internal antenna detection circuit Internal antenna detection circuit System       PWR_ON 15 No internal pull-up L-level: -0.10 V – 0.65 V  H-level: 2.00 V – 4.50 V  ON L-level time:  5 ms min OFF L-level pulse time:  Not Available 19 180 k internal pull-up L-level: -0.30 V – 0.30 V  H-level: 2.00 V – 4.70 V  ON L-level pulse time:  150 ms min OFF L-level pulse time:  Not Available No internal pull-up L-level: -0.30 V –0.65 V  H-level: 2.00 V – 4.50 V  ON L-level pulse time:  5 ms min OFF L-level pulse time:  Not Available No internal pull-up L-level: -0.30 V – 0.65 V  H-level: 1.50 V – 4.40 V  ON L-level pulse time:  50 µs min / 80 µs max OFF L-level pulse time:  Not Available RESET_N 18 Internal diode & pull-up L-level: -0.30 V – 0.30 V  H-level: 2.00 V – 4.70 V  Reset L-level pulse time:  50 ms min (SARA-G350)  3 s min (SARA-G300/G310) 22 550  internal pull-up L-level: -0.30 V – 0.63 V  H-level: 1.32 V – 2.10 V  Reset L-level pulse time:  300 ms min 10 k internal pull-up L-level: -0.30 V – 0.65 V  H-level: 1.69 V – 2.48 V  Reset L-level pulse time:  50 ms min 10 k internal pull-up L-level: -0.30 V – 0.51 V  H-level: 1.32 V – 2.01 V  Reset L-level pulse time:  50 ms min EXT32K 31 SARA-G300/G310:  32 kHz input for RTC   & low power idle mode SARA-G350:  Internal 32 kHz for RTC   & low power idle mode  Not Available Internal 32 kHz for RTC  & low power idle mode Internal 32 kHz for RTC  & low power idle mode SIM       SIM_CLK 38 1.8V / 3V SIM clock 47 1.8V / 3V SIM clock (upcoming FW releases) 1.8V / 3V SIM clock 1.8V / 3V SIM clock SIM_IO 39 1.8V / 3V SIM data  Internal 4.7k pull-up 48 1.8V / 3V SIM data (upcoming FW releases) Internal 10k pull-up 1.8V / 3V SIM data  Internal 4.7k pull-up 1.8V / 3V SIM data Internal 4.7k pull-up SIM_RST 40 1.8V / 3V SIM reset 49 1.8V / 3V SIM reset (upcoming FW releases) 1.8V / 3V SIM reset 1.8V / 3V SIM reset VSIM 41 1.8V / 3V SIM supply 50 1.8V / 3V SIM supply (upcoming FW releases) 1.8V / 3V SIM supply 1.8V / 3V SIM supply SIM_DET 42 1.8 V, SIM detect input Inner pull-down: 103 µA  Not Available Provided by GPIO5:  1.8 V, SIM detect input  Inner pull-down: 55 µA Provided by GPIO5:  1.8 V, SIM detect input  Inner pull-down: 200 µA
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 138 of 145 Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series UART       DSR 6 1.8 V, DSR output Driver strength: 6 mA 9 Not Available 1.8 V, DSR output Driver strength: 4 mA 1.8 V, DSR output Driver strength: 1 mA RI 7 1.8 V, RI output Driver strength: 6 mA 10 1.8 V, RI output Driver strength: 6 mA 1.8 V, RI output Driver strength: 4 mA 1.8 V, RI output Driver strength: 2 mA DCD 8 1.8 V, DCD output Driver strength: 6 mA 11 Not Available 1.8 V, DCD output Driver strength: 4 mA 1.8 V, DCD output Driver strength: 2 mA DTR 9 1.8 V, DTR input Internal pull-up: -55 µA 12 Not Available 1.8 V, DTR input Internal pull-up: -110 µA 1.8 V, DTR input Internal pull-up: -125 µA RTS 10 1.8 V, Flow ctrl input Internal pull-up: -31 µA 13 1.8 V, Flow ctrl input Internal pull-up: -30 µA 1.8 V, Flow ctrl input Internal pull-up: -60 µA 1.8 V, Flow ctrl input Internal pull-up: -240 µA CTS 11 1.8 V, Flow ctrl output Driver strength: 6 mA 14 1.8 V, Flow ctrl output Driver strength: 4 mA 1.8 V, Flow ctrl output Driver strength: 4 mA 1.8 V, Flow ctrl output Driver strength: 6 mA TXD 12 1.8 V, Data input Internal pull-up: -102 µA 15 1.8 V, Data input Internal pull-up: -30 µA 1.8 V, Data input Internal pull-up: -60 µA 1.8 V, Data input Internal pull-up: -240 µA RXD 13 1.8 V, Data output Driver strength: 5 mA 16 1.8 V, Data output Driver strength: 4 mA 1.8 V, Data output Driver strength: 4 mA 1.8 V, Data output Driver strength: 6 mA UART AUX       TXD_AUX 29 1.8 V, Data input Internal pull-up: -102 µA  Not Available Not Available Not Available RXD_AUX 28 1.8 V, Data output Driver strength: 5 mA  Not Available Not Available Not Available USB       VUSB_DET  Not Available 18 5 V, Supply detection 5 V, Supply detection 5 V, Supply detection USB_D-  Not Available 26 Full-Speed USB 2.0 High-Speed USB 2.0 High-Speed USB 2.0 USB_D+  Not Available 27 Full-Speed USB 2.0 High-Speed USB 2.0 High-Speed USB 2.0 SPI       SPI_SCLK  Not Available 55 Not Available 1.8 V, Clock input Inner pull-down: 100 µA 1.8 V, Clock input Inner pull-down: 200 µA SPI_MOSI  Not Available 56 Not Available 1.8 V, Data input Internal pull-up: -220 µA 1.8 V, Data input Internal pull-up: -240 µA SPI_MISO  Not Available 57 Not Available 1.8 V, Data output Driver strength: 2.5 mA 1.8 V, Data output Driver strength: 6 mA SPI_SRDY  Not Available 58 Not Available 1.8 V, Flow ctrl output Driver strength: 4 mA 1.8 V, Flow ctrl output Driver strength: 6 mA SPI_MRDY  Not Available 59 Not Available 1.8 V, Flow ctrl input Inner pull-down: 55 µA 1.8 V, Flow ctrl input Inner pull-down: 200 µA DDC (I2C)       SCL 27 SARA-G350 only:   1.8 V, open drain  Driver strength: 3 mA 45 1.8 V, open drain (upcoming FW releases) 1.8 V, open drain Driver strength: 1 mA 1.8 V, open drain Driver strength: 1 mA LISA-U200-00S: N.A. SDA 26 SARA-G350 only:   1.8 V, open drain  Driver strength: 3 mA 46 1.8 V, open drain (upcoming FW releases) 1.8 V, open drain Driver strength: 1 mA 1.8 V, open drain Driver strength: 1 mA LISA-U200-00S: N.A. Audio       Analog        MIC_BIAS 46 SARA-G350 only:   2.2 V supply output for  external microphone  Not Available Not Available Not Available MIC_GND 47 SARA-G350 only:   Local ground sense for  external microphone  Not Available Not Available Not Available MIC_P 49 SARA-G350 only:   Differential input (+)  No internal capacitor  for DC blocking  40 Differential input (+) 100 nF internal capacitor for DC blocking  LISA-U120/U130 only:   Differential input (+)  100 nF internal capacitor  for DC blocking  Not Available
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 139 of 145 Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series MIC_N 48 SARA-G350 only:   Differential input (-)  No internal capacitor  for DC blocking  39 Differential input (-) 100 nF internal capacitor for DC blocking  LISA-U120/U130 only:   Differential input (-)  100 nF internal capacitor  for DC blocking  Not Available SPK_P 44 SARA-G350 only: Differential output (+) 16 ohm load capable 53 Differential output (+) 32 ohm load capable LISA-U120/U130 only: Differential output (+) 16 ohm load capable Not Available SPK_N 45 SARA-G350 only: Differential output (-) 16 ohm load capable 54 Differential output (-) 32 ohm load capable LISA-U120/U130 only: Differential output (-) 16 ohm load capable Not Available Digital        I2S_TXD 35 SARA-G350 only:   1.8 V, Data Out  PCM / Normal I2S mode  Driver strength: 5 mA 42 PCM_DO:  1.8 V, PCM Data Out LISA-U120/U130 only:  1.8 V, Data Out  PCM / Normal I2S mode  Driver strength: 2.5 mA 1.8 V, Data Out PCM / Normal I2S mode Driver strength: 2 mA LISA-U200-00S: N.A. I2S_RXD 37 SARA-G350 only:   1.8 V, Data In  PCM / Normal I2S mode  Inner pull-down: 103 µA 44 PCM_DI:  1.8 V, PCM Data In LISA-U120/U130 only:  1.8 V, Data In  PCM / Normal I2S mode  Inner pull-down: 100 µA 1.8 V, Data In PCM / Normal I2S mode Inner pull-down: 200 µA LISA-U200-00S: N.A. I2S_WA 34 SARA-G350 only:   1.8 V, Word align. Out  Fixed frequency  Driver strength: 6 mA 41 PCM_SYNC:  1.8 V, PCM Sync Out LISA-U120/U130 only:  1.8 V, Word align. In/Out  Configurable frequency  Inner pull-down: 100 µA  Driver strength: 2.5 mA 1.8 V, Word align. In/Out Configurable frequency Inner pull-down: 200 µA Driver strength: 2 mA LISA-U200-00S: N.A. I2S_CLK 36 SARA-G350 only:   1.8 V, Clock Out  Fixed frequency  Driver strength: 5 mA 43 PCM_CLK:  1.8 V, PCM Clock Out LISA-U120/U130 only: 1.8 V, Clock In/Out  Configurable frequency  Inner pull-down: 100 µA  Driver strength: 2.5 mA 1.8 V, Clock In/Out Configurable frequency Inner pull-down: 200 µA Driver strength: 2 mA LISA-U200-00S: N.A. I2S1_WA  Not Available 54 Not Available Not Available 1.8 V, Data Out PCM / Normal I2S mode Driver strength: 1 mA LISA-U200-00S: N.A. I2S1_TXD  Not Available 40 Not Available Not Available 1.8 V, Data In PCM / Normal I2S mode Inner pull-down: 150 µA LISA-U200-00S: N.A. I2S1_CLK  Not Available 53 Not Available Not Available 1.8 V, Word align. In/Out Configurable frequency Inner pull-down: 150 µA Driver strength: 1 mA LISA-U200-00S: N.A. I2S1_RXD  Not Available 39 Not Available Not Available 1.8 V, Clock In/Out Configurable frequency Inner pull-down: 150 µA Driver strength: 1 mA LISA-U200-00S: N.A. Other        CODEC_CLK  Not Available 52 Not Available Not Available 1.8 V, 13/26 MHz Out Driver strength: 4 mA LISA-U200-00S: N.A. GPIO       GPIO1 16 SARA-G350 only:   1.8 V, configurable GPIO  Default: Pad disabled  Driver strength: 6 mA  Inner pull-down: 51 µA 20 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 4 mA Inner pull-down: 30 µA 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 1 mA Inner pull-down: 100 µA 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 6 mA Inner pull-down: 200 µA
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 140 of 145 Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series GPIO2 23 SARA-G350 only:   1.8 V, configurable GPIO  Default: GPS supply ena.  Driver strength: 6 mA   Inner pull-down: 51 µA 21 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 4 mA Inner pull-down: 30 µA 1.8 V, configurable GPIO Default: GPS supply en. Driver strength: 1 mA  Inner pull-down: 85 µA 1.8 V, configurable GPIO Default: GPS supply en. Driver strength: 1 mA  Inner pull-down: 150 µA GPIO3 24 SARA-G350 only:   1.8 V, configurable GPIO  Default: GPS data ready  Driver strength: 5 mA   Inner pull-down: 27 µA 23 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 4 mA Inner pull-down: 30 µA 1.8 V, configurable GPIO Default: GPS data ready Driver strength: 4 mA  Inner pull-down: 55 µA 1.8 V, configurable GPIO Default: GPS data ready Driver strength: 6 mA  Inner pull-down: 200 µA GPIO4 25 SARA-G350 only:   1.8 V, configurable GPIO  Default: GPS RTC shar.  Driver strength: 6 mA   Inner pull-down: 51 µA 24 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 4 mA Inner pull-down: 30 µA 1.8 V, configurable GPIO Default: GPS RTC sharing (4.7 k external pull-down required for RTC sharing) Driver strength: 4 mA  Inner pull-down: 55 µA 1.8 V, configurable GPIO Default: GPS RTC sharing Driver strength: 6 mA  Inner pull-down: 200 µA GPIO5  Not Available 51 1.8 V, configurable GPIO Default: Pad disabled Driver strength: 4 mA Inner pull-down: 30 µA 1.8 V, configurable GPIO Default: SIM detection Driver strength: 2.5 mA  Inner pull-down: 55 µA 1.8 V, configurable GPIO Default: SIM detection Driver strength: 6 mA  Inner pull-down: 200 µA GPIO6  Not Available 39 Not Available Not Available 1.8 V, configurable GPIO Default: I2S1_RXD Driver strength: 1 mA  Inner pull-down: 150 µA GPIO7  Not Available 40 Not Available Not Available 1.8 V, configurable GPIO Default: I2S1_TXD Driver strength: 1 mA  Inner pull-down: 150 µA GPIO8  Not Available 53 Not Available Not Available 1.8 V, configurable GPIO Default: I2S1_CLK Driver strength: 1 mA  Inner pull-down: 150 µA GPIO9  Not Available 54 Not Available Not Available 1.8 V, configurable GPIO Default: I2S1_WA Driver strength: 1 mA  Inner pull-down: 150 µA GPIO10  Not Available 55 Not Available Not Available 1.8 V, configurable GPIO Default: SPI_SCLK Driver strength: 6 mA  Inner pull-down: 200 µA GPIO11  Not Available 56 Not Available Not Available 1.8 V, configurable GPIO Default: SPI_MOSI Driver strength: 6 mA  Inner pull-down: 200 µA GPIO12  Not Available 57 Not Available Not Available 1.8 V, configurable GPIO Default: SPI_MISO Driver strength: 6 mA   Inner pull-down: 200 µA GPIO13  Not Available 58 Not Available Not Available 1.8 V, configurable GPIO Default: SPI_SRDY Driver strength: 6 mA   Inner pull-down: 200 µA GPIO14  Not Available 59 Not Available Not Available 1.8 V, configurable GPIO Default: SPI_MRDY Driver strength: 6 mA  Inner pull-down: 200 µA Table 41: Summary of pin differences and compatibility level among modules
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 141 of 145 B Glossary  3GPP 3rd Generation Partnership Project ADC Analog to Digital Converter AP Application Processor AT AT Command Interpreter Software Subsystem, or attention CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC Direct Current  DCD Data Carrier Detect DCE Data Communication Equipment DCS Digital Cellular System DDC Display Data Channel interface DL Down-link (Reception) DRX Discontinuous Reception DSP Digital Signal Processing DSR Data Set Ready DTE Data Terminal Equipment DTM Dual Transfer Mode DTR Data Terminal Ready  EMC Electro-magnetic Compatibility EMI Electro-magnetic Interference ESD Electro-static Discharge ESR Equivalent Series Resistance FEM Front End Module FOAT Firmware Over AT commands FTP File Transfer Protocol FTPS FTP Secure FW Firmware GMSK Gaussian Minimum Shift Keying modulation GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication HF Hands-free HTTP HyperText Transfer Protocol  HTTPS Hypertext Transfer Protocol over Secure Socket Layer HW Hardware I/Q In phase and Quadrature
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Appendix      Page 142 of 145 I2C Inter-Integrated Circuit interface I2S Inter IC Sound interface IP Internet Protocol LCC Leadless Chip Carrier LDO Low-Dropout LGA Land Grid Array LNA Low Noise Amplifier M2M Machine-to-Machine MCS Modulation Coding Scheme  N/A Not Applicable N.A. Not Available PA Power Amplifier PCM Pulse Code Modulation PCN / IN Product Change Notification / Information Note PCS Personal Communications Service PFM Pulse Frequency Modulation PMU Power Management Unit PSRAM Pseudo-Static RAM PWM Pulse Width Modulation RF Radio Frequency RI Ring Indicator RTC Real Time Clock RTS Request To Send SAW Surface Acoustic Wave SIM Subscriber Identification Module SMS Short Message Service SMTP Simple Mail Transfer Protocol SPI Serial Peripheral Interface SRF Self Resonant Frequency TBD To Be Defined TCP Transmission Control Protocol TDMA Time Division Multiple Access  TP Test-Point UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol  UICC Universal Integrated Circuit Card UL Up-link (Transmission) UMTS Universal Mobile Telecommunications System USB Universal Serial Bus UTRA UMTS Terrestrial Radio Access  VCO Voltage Controlled Oscillator VSWR Voltage Standing Wave Ratio
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Related documents      Page 143 of 145 Related documents [1] u-blox SARA-G3 series Data Sheet, Docu No GSM.G2-HW-12001 [2] u-blox AT Commands Manual, Docu No WLS-SW-11000 [3] u-blox LISA-C200 series Data Sheet, Docu No CDMA-2X-11001 [4] u-blox LISA-U1 series Data Sheet, Docu No 3G.G2-HW-10001 [5] u-blox LISA-U2 series Data Sheet, Docu No 3G.G3-HW-11004 [6] u-blox LISA-C200 & FW75-C200 System Integration Manual, Docu No CDMA-2X-11004 [7] u-blox LISA-U series System Integration Manual, Docu No 3G.G2-HW-10002 [8] u-blox C200 AT Commands Manual, Docu No CDMA-2X-11002 [9] ITU-T Recommendation V.24, 02-2000. List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE).  http://www.itu.int/rec/T-REC-V.24-200002-I/en [10] 3GPP TS 27.007 – AT command set for User Equipment (UE) (Release 1999) [11] 3GPP TS 27.005 – Use of Data Terminal Equipment – Data Circuit terminating; Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) (Release 1999) [12] 3GPP TS 27.010 – Terminal Equipment to User Equipment (TE-UE) multiplexer protocol (Release 1999) [13] I2C-Bus Specification Version 2.1 Philips Semiconductors (January 2000), http://www.nxp.com/acrobat_download/literature/9398/39340011_21.pdf [14] 3GPP TS 51.010-2 – Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS)  [15] CENELEC  EN  61000-4-2  (2001):  "Electromagnetic  compatibility  (EMC)  –  Part  4-2:  Testing  and measurement techniques – Electrostatic discharge immunity test". [16] ETSI  EN  301  489-1  V1.8.1:  “Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  1:  Common technical requirements” [17] ETSI  EN  301  489-7  V1.3.1  “Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  7:  Specific conditions  for  mobile  and  portable  radio  and  ancillary  equipment  of  digital  cellular  radio telecommunications systems (GSM and DCS)“ [18] ETSI  EN  301  489-24  V1.4.1  "Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  24:  Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment" [19] 3GPP TS 26.267 V10.0.0 – eCall Data Transfer; In-band modem solution; General description (Rel. 10) [20] Multiplexer Implementation Application Note, Docu No WLS-CS-11002 [21] GPS Implementation Application Note, Docu No GSM.G1-CS-09007 [22] Firmware Update Application Note, Docu No WLS-CS-11001 [23] 3GPP  TS 23.060  –  Technical Specification Group  Services and System Aspects; General Packet  Radio Service (GPRS); Service description [24] End user test Application Note, Docu No WLS-CS-12002 [25] u-blox Package Information Guide, Docu No GPS-X-11004 [26] BS EN 16062:2011 – Intelligent transport systems – eSafety – eCall high level application requirements [27] ETSI TS 122 101 V8.7.0 – Service aspects; Service principles (3GPP TS 22.101 v.8.7.0 Rel. 8)  Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com).
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Revision history      Page 144 of 145 Revision history Revision Date Name Status / Comments - Oct. 30, 2012 sses Initial Release 1 Mar. 28, 2013 sses Updated suggested paste mask  Updated current consumption description Updated voice-band processing system block diagram Updated DDC (I2C) application circuit for 3V u-blox GPS/GNSS receivers
SARA-G3 series - System Integration Manual GSM.G2-HW-12003-1  Advance Information  Contact      Page 145 of 145 Contact For complete contact information visit us at www.u-blox.com  u-blox Offices     North, Central and South America u-blox America, Inc. Phone:  +1 703 483 3180 E-mail:  info_us@u-blox.com Regional Office West Coast: Phone:  +1 408 573 3640 E-mail:  info_us@u-blox.com Technical Support: Phone:  +1 703 483 3185 E-mail:  support_us@u-blox.com  Headquarters Europe, Middle East, Africa u-blox AG  Phone:  +41 44 722 74 44 E-mail:  info@u-blox.com Support:  support@u-blox.com  Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:  +65 6734 3811 E-mail:  info_ap@u-blox.com Support:  support_ap@u-blox.com Regional Office China (Beijing): Phone:  +86 10 68 133 545 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office China (Shenzhen): Phone:  +86 755 8627 1083 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office India: Phone:  +91 959 1302 450 E-mail:  info_in@u-blox.com Support:  support_in@u-blox.com Regional Office Japan: Phone:  +81 3 5775 3850 E-mail:  info_jp@u-blox.com Support:  support_jp@u-blox.com Regional Office Korea: Phone:  +82 2 542 0861 E-mail:  info_kr@u-blox.com  Support:  support_kr@u-blox.com Regional Office Taiwan: Phone:  +886 2 2657 1090 E-mail:  info_tw@u-blox.com  Support:  support_tw@u-blox.com

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