u blox VERAP174 Host-based V2X transceiver module User Manual VERA P1 series

u-blox AG Host-based V2X transceiver module VERA P1 series

Contents

User Manual

VERA-P1 series
Host-based V2X transceiver module
Data Sheet
Abstract
This technical data sheet describes the VERA-P1 series transceiver module that enables
development of electronics for Vehicle-to-Everything (V2X) communication systems. The VERA-P1
series includes an integrated MAC/LLC/Baseband processor and the required RF front-end
components. It is connected to a host processor through a USB or SPI interface.
www.u-blox.com
UBX-17004377 -
R06_draft
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft Page 2 of 30
Confidential
Document Information
Title
VERA-P1 series
Subtitle
Host-based V2X transceiver module
Document type
Data Sheet
Document number
UBX-17004377
Revision and date
R06_draft
22-Jun-2018
Disclosure Restriction
Confidential
Corresponding content status
Draft
For functional testing. Revised and supplementary data will be published later.
Objective Specification
Target values. Revised and supplementary data will be published later.
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
This document applies to the following products:
Product name
Type number
Firmware version
PCN reference
Product status
VERA-P173
VERA-P173-00A-00
N/A
N/A
Engineering Samples
VERA-P174
VERA-P174-00A-00
N/A
N/A
Engineering Samples
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
documents, visit www.u-blox.com.
Copyright © u-blox AG.
VERA-P1 series - Data Sheet
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Confidential
Contents
Document Information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Functional description ......................................................................................................................... 5
1.1 Overview ........................................................................................................................................................ 5
1.2 Product features ......................................................................................................................................... 5
1.3 Block diagram .............................................................................................................................................. 6
1.4 Product description .................................................................................................................................... 6
1.5 Supported features .................................................................................................................................... 6
2 Host interfaces ....................................................................................................................................... 7
2.1 USB interface ............................................................................................................................................... 7
2.2 SPI interface ................................................................................................................................................. 7
3 Pin Definition ........................................................................................................................................... 8
3.1 Pin description ............................................................................................................................................. 8
4 Electrical specification ...................................................................................................................... 14
4.1 Absolute maximum ratings ....................................................................................................................14
4.2 Operating conditions ................................................................................................................................14
4.3 Digital pad ratings .....................................................................................................................................15
4.4 Peak current consumption ......................................................................................................................15
4.5 Radio specifications .................................................................................................................................16
5 Mechanical specifications ................................................................................................................ 18
5.1 Physical dimensions .................................................................................................................................18
6 Qualification and approvals............................................................................................................. 20
6.1 Approvals ....................................................................................................................................................20
6.1.1 European Union regulatory compliance .......................................................................................20
6.1.2 FCC compliance ................................................................................................................................20
6.1.3 FCC IDs ................................................................................................................................................20
6.1.4 Certification in other countries ......................................................................................................20
7 Product handling & soldering ........................................................................................................... 22
7.1 Packaging ...................................................................................................................................................22
7.1.1 Reels ....................................................................................................................................................22
7.1.2 Tapes ...................................................................................................................................................22
7.2 Shipment, storage and handling ...........................................................................................................23
7.2.1 Moisture sensitivity levels ..............................................................................................................23
7.2.2 Mounting process and soldering recommendations ................................................................23
7.2.3 ESD handling precautions ..............................................................................................................24
8 Labeling and ordering information ................................................................................................25
8.1 Product labeling .........................................................................................................................................25
8.2 Explanation of codes ................................................................................................................................26
8.3 Ordering codes ...........................................................................................................................................27
Appendix ....................................................................................................................................................... 28
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Confidential
A Glossary ................................................................................................................................................. 28
Related documents ....................................................................................................................................29
Revision history ...........................................................................................................................................29
Contact .......................................................................................................................................................... 30
1 Functional description
1.1 Overview
The VERA-P1 series are compact, embedded transceiver modules that enables development of
electronics for Vehicle-to-Everything (V2X) communication systems. These automotive grade
modules are designed for applications such as traffic safety, intelligent traffic management and
entertainment. The modules can be used for both in-vehicle units (OBU - On Board Unit) and
infrastructure (RSU - Road Side Unit). They provide superior performance compared to V2X systems
based on consumer-grade Wi-Fi chipsets, especially at high vehicle speeds and in non-line-of-sight
(NLOS) conditions.
The VERA-P1 series includes an integrated MAC/LLC/Baseband processor and the required RF
front-end components. The module is connected to a host processor through USB or SPI interface.
Both interfaces can be used for data communication and firmware download.
1.2 Product features
Table 1: VERA-P1 series main features summary
VERA-P1 series - Data Sheet
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Page 6 of 30
1.3 Block diagram
Figure 1: Block diagram of VERA-P173 and VERA-P174
1.4 Product description
Model
Description
VERA-P173
Single channel, antenna diversity, two antennas
VERA-P174
Dual channel or single channel with antenna diversity, two antennas
Table 2: Product description
1.5 Supported features
Compliance with WAVE and ETSI ITS G5 for US and Europe operations
USB and SPI
1
host interfaces
Frequency band 5.850 – 5.925 MHz (channels 172, 174, 176, 178, 180, 182, 184)
Channel bandwidth 10 MHz
2
Data rates 3, 4.5, 6, 9, 12, 18, 24, 27 Mbps
Antenna diversity (VERA-P173, VERA-P174) – CDD for TX and MRC for RX mode
TX output power from 0 to +23 dBm (Class C), RX sensitivity -98 dBm at 3 Mbps
Power supply 3.3 V and 5.0 V, 5 W
Operation temperature -40 °C to +95 °C
Dimensions 29.6 x 24.8 x 3.5 mm
1
SPI is not recommended as the main host interface for communication due to performance limitations.
2
Support for 20 MHz mode is planned for future firmware releases subject to certain limitations, as the requirements for 20
MHz operation have not been fully specified.
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Page 7 of 30
2 Host interfaces
2.1 USB interface
The VERA-P1 series module supports a USB 2.0 high-speed interface for firmware loading (booting)
and high speed data transfer (> 200 Mbps). The USB interface of the module is powered with 3.3 V
supply voltage. The module acts as a device on the USB bus.
2.2 SPI interface
The VERA-P1 series module supports an SPI interface for firmware loading (booting) and data
communication. Firmware can be loaded by the host processor while the module operates as a slave
or from the FLASH memory while the module is in the master mode. The interface is capable of full-
duplex operation in master or slave mode. The maximum clock rate is 50 MHz in master mode, and
25 MHz in slave mode
3
.
⚠ Due to performance limitations, it is recommended not to use the SPI interface as the main host
interface for communication and operation of the module.
3
SPI host interface for data communication in slave mode is tested only with 15 MHz clock rate.
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3 Pin Definition
3.1 Pin description
Figure 2: Pin allocation (top view)
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Page 9 of 30
No.
Name
Pin
type
Power
Domain
Description
A1
GND
Ground
-
Ground
A2
GND
Ground
-
Ground
A3
RSTn
I
VIO
Module Reset, has internal pull-up 100k to VIO
A4
GND
Ground
-
Ground
A5
3V3
Power
-
Baseband/Radio supply
A6
GND
Ground
-
Ground
A7
NC
-
-
Leave unconnected
A8
VIO
Power
-
I/O voltage (1.8/2.5/3.3V), in case of 1.8V pin 8 can get supply from pin B7
A9
GND
Ground
-
Ground
A10
NC
-
-
Leave unconnected
A11
GND
Ground
-
Ground
A12
NC
-
-
Leave unconnected
A13
NC
-
-
Leave unconnected
A14
NC
-
-
Leave unconnected
A15
NC
-
-
Leave unconnected
A16
NC
-
-
Leave unconnected
A17
NC
-
-
Leave unconnected
A18
GND
Ground
-
Ground
A19
5V0_A1
Power
-
Antenna 1 radio front-end supply
A20
GND
Ground
-
Ground
A21
GPIO2_11
I/O
1V8
GPIO2_11
A22
GPIO2_12
I/O
1V8
GPIO2_12
A23
GND
Ground
-
Ground
A24
GND
Ground
-
Ground
A25
GND
Ground
-
Ground
A26
ANT1
RF I/O
-
Antenna 1
A27
GND
Ground
-
Ground
A28
GND
Ground
-
Ground
A29
NC
-
-
Leave unconnected
A30
GND
Ground
-
Ground
A31
GND
Ground
-
Ground
A32
NC
-
-
Leave unconnected
A33
GND
Ground
-
Ground
A34
GND
Ground
-
Ground
A35
NC
-
-
Leave unconnected
A36
GND
Ground
-
Ground
A37
GND
Ground
-
Ground
A38
NC
-
-
Leave unconnected
A39
GND
Ground
-
Ground
A40
GND
Ground
-
Ground
A41
ANT2
RF I/O
-
Antenna 2
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Page 10 of 30
No.
Name
Pin
type
Power
Domain
Description
A42
GND
Ground
-
Ground
A43
GND
Ground
-
Ground
A44
GND
Ground
-
Ground
A45
5V0_A2
Power
-
Antenna 2 radio front-end supply
A46
GND
Ground
-
Ground
A47
SPI_MOSI
I/O
VIO
SPI Bus
A48
SPI_MISO
I/O
VIO
SPI Bus
A49
MOD_IO_SPARE
I/O
VIO
Optional SPI CS, GPIO1_10
A50
GND
Ground
-
Ground
A51
NC
-
-
Leave unconnected
A52
NC
-
-
Leave unconnected
A53
NC
-
-
Leave unconnected
A54
NC
-
-
Leave unconnected
A55
NC
-
-
Leave unconnected
A56
NC
-
-
Leave unconnected
A57
GND
Ground
-
Ground
A58
NC
-
-
Leave unconnected
A59
NC
-
-
Leave unconnected
A60
NC
-
-
Leave unconnected
A61
GND
Ground
-
Ground
A62
USB_DN
I/O
-
USB Bus
A63
USB_DP
I/O
-
USB Bus
A64
USB_VBUS
I
-
USB VBUS detect input
A65
GND
Ground
-
Ground
A66
GND
Ground
-
Ground
A67
GND
Ground
-
Ground
A68
GPIO1_12
I/O
VIO
UART1_RX
A69
GND
Ground
-
Ground
A70
1PPS
I
1V8
One pulse per second input
A71
GND
Ground
-
Ground
A72
NC
-
-
Leave unconnected
A73
NC
-
-
Leave unconnected
A74
NC
-
-
Leave unconnected
A75
NC
-
-
Leave unconnected
A76
NC
-
-
Leave unconnected
A77
GND
Ground
-
Ground
A78
GPIO1_14
I/O
VIO
UART2_RX
A79
BOOT_0
I
VIO
Boot mode configuration
A80
NC
-
-
Leave unconnected
A81
GND
Ground
-
Ground
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No.
Name
Pin
type
Power
Domain
Description
A82
NC
-
-
Leave unconnected
A83
NC
-
-
Leave unconnected
A84
GND
Ground
-
Ground
B1
NC
-
-
Leave unconnected
B2
NC
-
-
Leave unconnected
B3
GND
Ground
-
Ground
B4
3V3
Power
-
Baseband/Radio supply
B5
GND
Ground
-
Ground
B6
NC
-
-
Leave unconnected
B7
1V8
O
-
1.8 V supply output, can be connected to pin 8 only as a VIO voltage source
B8
GND
Ground
-
Ground
B9
NC
-
-
Leave unconnected
B10
GND
Ground
-
Ground
B11
NC
-
-
Leave unconnected
B12
NC
-
-
Leave unconnected
B13
NC
-
-
Leave unconnected
B14
NC
-
-
Leave unconnected
B15
NC
-
-
Leave unconnected
B16
NC
-
-
Leave unconnected
B17
GND
Ground
-
Ground
B18
5V0_A1
Power
-
Antenna 1 radio front-end supply
B19
GND
Ground
-
Ground
B20
GPIO2_13
I/O
1V8
GPIO2_13
B21
GPIO2_14
I/O
1V8
GPIO2_14
B22
GND
Ground
-
Ground
B23
GND
Ground
-
Ground
B24
GND
Ground
-
Ground
B25
PA1_EN
I/O
VIO
PA enable for ANT1
B26
NC
-
-
Leave unconnected
B27
LAN1_EN
I/O
VIO
LNA enable for ANT1
B28
GND
Ground
-
Ground
B29
GND
Ground
-
Ground
B30
GND
Ground
-
Ground
B31
GND
Ground
-
Ground
B32
GND
Ground
-
Ground
B33
GND
Ground
-
Ground
B34
LNA2_EN
I/O
VIO
LNA enable for ANT2
B35
NC
-
-
Leave unconnected
B36
PA2_EN
I/O
VIO
PA enable for ANT2
B37
GND
Ground
-
Ground
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Page 12 of 30
No.
Name
Pin
type
Power
Domain
Description
B38
GND
Ground
-
Ground
B39
GND
Ground
-
Ground
B40
5V0_A2
Power
-
Antenna 2 radio front-end supply
B41
GND
Ground
-
Ground
B42
SPI_SCK
I/O
VIO
SPI Bus
B43
SPI_CSn
I/O
VIO
SPI Bus
B44
NC
-
-
Leave unconnected
B45
GND
Ground
-
Ground
B46
NC
-
-
Leave unconnected
B47
NC
-
-
Leave unconnected
B48
NC
-
-
Leave unconnected
B49
NC
-
-
Leave unconnected
B50
NC
-
-
Leave unconnected
B51
NC
-
-
Leave unconnected
B52
GND
Ground
-
Ground
B53
NC
-
-
Leave unconnected
B54
NC
-
-
Leave unconnected
B55
NC
-
-
Leave unconnected
B56
GND
Ground
-
Ground
B57
NC
-
-
Leave unconnected
B58
NC
-
-
Leave unconnected
B59
NC
-
-
Leave unconnected
B60
NC
-
-
Leave unconnected
B61
GPIO1_11
I/O
VIO
UART1_TX
B62
NC
-
-
Leave unconnected
B63
GND
Ground
-
Ground
B64
NC
-
-
Leave unconnected
B65
NC
-
-
Leave unconnected
B66
NC
-
-
Leave unconnected
B67
NC
-
-
Leave unconnected
B68
NC
-
-
Leave unconnected
B69
NC
-
-
Leave unconnected
B70
GND
Ground
-
Ground
B71
BOOT_2
I
VIO
Boot mode configuration, UART2_TX
B72
BOOT_1
I
VIO
Boot mode configuration
B73
NC
-
-
Leave unconnected
B74
GND
Ground
-
Ground
B75
NC
-
-
Leave unconnected
B76
NC
-
-
Leave unconnected
EP
GND
Ground
-
20 Ground/Thermal exposed pads, connect to the ground
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Table 3: VERA-P1 series pin description
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4 Electrical specification
⚠ Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating conditions section of this
document should be avoided. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
☞ Operating condition ranges define those limits within which the functionality of the device is
guaranteed. Where application information is given, it is advisory only and does not form part of
the specification.
4.1 Absolute maximum ratings
Symbol
Description
Min.
Max.
Units
5V0_A1,
5V0_A2
Power supply voltage 5.0 V
-0.3
6.0
V
3V3
Power supply voltage 3.3 V
-0.3
3.9
V
VIO
I/O supply voltage 1.8 V/2.5 V/3.3 V
-0.3
3.9
V
TSTORAGE
Storage temperature
-40
+95
ºC
Table 4: Absolute maximum ratings
⚠ The product is not protected against overvoltage or reversed voltages. If necessary, voltage
spikes exceeding the power supply voltage specification, given in table above, must be limited to
values within the specified boundaries by using appropriate protection devices.
4.2 Operating conditions
Symbol
Parameter
Min.
Typ
Max.
Units
5V0_A1,
5V0_A2
Power supply voltage 5.0 V
4.5
5.0
5.5
V
3V3
Power supply voltage 3.3 V
3.0
3.3
3.6
V
VIO
I/O supply voltage 1.8 V/2.5 V/3.3 V
1.65
1.8
1.95
V
2.3
2.5
2.8
3.0
3.3
3.6
V
TA
Ambient operating temperature
-40
-
+95
ºC
Ripple Noise
Peak-to-peak voltage ripple on 5V0 and 3V3
supply lines.
-
-
10
mV
Table 5: Operating conditions
4
4
Min and Max limits apply for TA = +25 °C.
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4.3 Digital pad ratings
Symbol
Parameter
Conditions
Min.
Max.
Units
VIH
Input high voltage
0.7*VIO5
VIO1
V
VIL
Input low voltage
-0.3
0.66
V
VHYS
Input hysteresis
0.18
-
V
VOH
Output high voltage
IOmax = 5 mA
VIO-0.4
-
V
VOH
Output low voltage
IOmax = -5 mA
-
0.4
V
Table 6: Digital pad ratings
4.4 Peak current consumption
Operation Mode
Peak current typ. (mA)
3V3
VIO
5V0_A1, 5V0_A2
Idle
372
0.55
1.7
RX single antenna
382
0.45
30
RX dual antenna
(5V0 peak current applies to each RX
chain)
461
0.55
30
TX single antenna
+0 dBm
432
0.45
186
+10 dBm
434
0.45
197
+20 dBm
437
0.45
273
TX dual antenna
(output power and 5V0 peak current
apply to each TX chain)
+0 dBm
563
0.55
186
+10 dBm
565
0.55
197
+20 dBm
570
0.55
273
Table 7: Peak current consumption (typical values are referenced to TA = +25 °C, 3V3 = 3.3 V, VIO = 1.8 V, 5V0_A1 = 5V0_A2
= 5.0 V)
☞ The average current consumption for full operation mode strongly depends on the RX/TX time
ratio and remains within the range between the peak values of RX and TX.
5
1PPS pad always use 1.8 V internally generated IO supply regardless of the VIO pad voltage.
6
RSTn pad internally pulled high to VIO voltage by 100k. During reset it should be below 0.2 V.
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4.5 Radio specifications
Parameter
Operation Mode
Specification
RF Frequency Range
802.11p
5.85 – 5.925 GHz
Modulation
802.11p
OFDM
Supported Data Rates
802.11p
3, 4.5, 6, 9, 12, 18, 24, 27 Mbps
Supported Bandwidth
802.11p
10 MHz
Maximum Transmit Power
(combined on 2 antennas)
802.11p
23 dBm7
Minimum Transmit Power
802.11p
0 dBm
Receiver sensitivity
802.11p
10 MHz,
no multipath
3 Mbps
-98 dBm typ.
4.5 Mbps
-96 dBm typ.
6 Mbps
-95 dBm typ.
9 Mbps
-93 dBm typ.
12 Mbps
-90 dBm typ.
18 Mbps
-86 dBm typ.
24 Mbps
-82 dBm typ.
27 Mbps
-80 dBm typ.
10 MHz,
NLoS (Non-line-of-
sight)
3 Mbps
-95 dBm typ.
4.5 Mbps
-92 dBm typ.
6 Mbps
-88 dBm typ.
9 Mbps
-86 dBm typ.
12 Mbps
-85 dBm typ.
18 Mbps
-82 dBm typ.
24 Mbps
Na
27 Mbps
Na
Receiver maximum operating input level
802.11p
-20 dBm
RSSI accuracy
802.11p
Over temperature range
+/-3 dB
Center frequency and symbol clock
tolerance
802.11p
+/-10 ppm
Transmitter spectral flatness
802.11p
All modulation modes
< +/-2 dB
Transmitter center frequency
leakage
802.11p
< -15 dB
Transmit power control step size
802.11p
0.5 dB
Transmit power control accuracy
802.11p
Over temperature range
+/-2 dB
Table 8: Radio specifications (values are referenced to TA = -40 to +95 °C, 3V3 = VIO = 3.3 V, 5V0_A1 = 5V0_A2 = 5.0 V)
Table 9 shows the Highway NLoS (Non-line-of-sight) channel parameters that are used to obtain the
receiver sensitivity values in Table 8. This channel was used in RF testing at the third ETSI Plug test
(CMS3).
Each tap is faded using Pure Doppler, but the second antenna has a Doppler increased by 11 Hz,
which prevents phase synchronization of channels. The RX Power listed in Table 8 refers to the power
of Tap 0.
7
To protect the module against permanent damage caused by overheating, the transmit power is derated at high
temperature. The derating depends on the RX/TX time ratio.
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The values presented are typical values, measured at +25 °C.
Tap#
Relative Power (dB)
Delay (ns)
Doppler Frequency (Hz)
0
0
0
0
1
-2
200
689
2
-5
433
-492
3
-7
700
886
Table 9: Highway NLoS channel parameters
The adjacent and non-adjacent channel rejection measurements are provided in Table 10 and
Table 11 respectively.
Bit rate
Target ACR (dB)
Target opt. enc. ACR (dB)
VERA-P1 typical ACR (dB)
3 Mbps (1/2BPSK)
16
28
37
4.5 Mbps (3/4BPSK)
15
27
33
6 Mbps (1/2QPSK)
13
25
35
9 Mbps (3/4QPSK)
11
23
29
12 Mbps (1/2QAM16)
8
20
29
18 Mbps (3/4QAM16)
4
16
25
24 Mbps (2/3QAM64)
0
12
22
27 Mbps (3/4QAM64)
-1
11
20
Table 10: Adjacent channel rejection
Bit rate
Target ACR (dB)
Target opt. enc. ACR (dB)
VERA-P1 typical ACR (dB)
3 Mbps (1/2BPSK)
32
42
51
4.5 Mbps (3/4BPSK)
31
41
48
6 Mbps (1/2QPSK)
29
39
48
9 Mbps (3/4QPSK)
27
37
45
12 Mbps (1/2QAM16)
24
34
42
18 Mbps (3/4QAM16)
20
30
38
24 Mbps (2/3QAM64)
16
26
34
27 Mbps (3/4QAM64)
15
25
32
Table 11: Non-adjacent channel rejection
Channel
Frequency, GHz
172
5.860
174
5.870
176
5.880
178
5.890
180
5.900
182
5.910
184
5.920
Table 12: Supported channels
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft Mechanical specifications Page 18 of 30
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5 Mechanical specifications
5.1 Physical dimensions
Figure 3: Physical dimensions
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Symbol
Description
Millimeters
Min.
Nom.
Max.
A
Module Thickness
3.3
3.5
3.7
A1
Vertical distance from the solder mask to the pad surface
0.010
0.020
0.035
b
Width of the peripheral pads
0.70
0.75
0.80
D
Module horizontal dimension
24.8 BSC
D2
Horizontal dimension of the exposed thermal pads pattern
17.7
17.8
17.9
D3
Horizontal dimension of the individual exposed thermal pad
3.9
4.0
4.1
E
Module vertical dimension
29.6 BSC
E2
Vertical dimension of the exposed thermal pads pattern
22.3
22.4
22.5
E3
Vertical dimension of the individual exposed thermal pad
3.9
4.0
4.1
e
Pitch of the peripheral pads
1.2 BSC
E1
Pitch of the individual exposed thermal pads
4.6 BSC
aaa
Bilateral profile tolerance of the module body
0.2
ddd
Co-planarity of the module bottom surface (unilateral tolerance)
0.1
eee
Tolerance of the peripheral pads pattern position
0.2
fff
Tolerance of the peripheral pads position with respect to each other
0.04
ggg
Tolerance of the exposed thermal pads pattern position
0.08
Table 13: VERA-P1 series dimensional references
☞ The “aaa” tolerances +/- 0.2 mm may be exceeded in the corners of the PCB due to the cutting
process. In worst case, the outer dimension “D” could reach 25.3 mm.
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6 Qualification and approvals
6.1 Approvals
8
Products marked with this lead-free symbol on the product label comply with
the "Directive 2002/95/EC of the European Parliament and the Council on the
Restriction of Use of certain Hazardous Substances in Electrical and Electronic
Equipment" (RoHS).
VERA-P1 series V2X modules are RoHS compliant.
6.1.1 European Union regulatory compliance
TBD
6.1.2 FCC compliance
The VERA-P1 series modules comply with Part 95, Subpart L and Part 90, Subpart M of the FCC Rules.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause
undesired operation.
⚠ Non authorized modification could void authority to use this equipment. The internal / external
antenna(s) used for this module must provide a separation distance of at least 20 cm from all
persons and must not be co-located or operating in conjunction with any other antenna or
transmitter.
These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and,
if not installed and used in accordance with the manufacturer’s instructions, may cause harmful
interference to radio communications.
☞ The outside of final product that contains the VERA-P173 or VERA-P174 module must display in
a user accessible area a label referring to the enclosed module. This exterior label can use wording
such as the following: “Contains Transmitter Module FCC ID: XPYVERAP174” or “Contains FCC ID:
XPYVERAP174”.
6.1.3 FCC IDs
Model
FCC ID
VERA-P173
XPYVERAP174
VERA-P174
XPYVERAP174
Table 14: FCC IDs for different models of VERA-P1 series
6.1.4 Certification in other countries
TBD
6.2 Approved antennas
Please refer to the
VERA-P1 series antenna reference design [2]
for the essential specifications to be
fulfilled in the end-product design to make use of the module’s radio type approval. It provides PCB
layout details and electrical specifications as well as information about approved antennas.
8
These approvals are pending.
VERA-P1 series - Data Sheet
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VERA-P1 series - Data Sheet
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7 Product handling & soldering
7.1 Packaging
The VERA-P1 series modules are delivered as hermetically sealed, reeled tapes to enable efficient
production, production lot set-up and tear-down. For more information about packaging, see the
u-
blox Package Information Guide [1]
.
7.1.1 Reels
The VERA-P1 series modules are deliverable in quantities of 250 pieces on a reel. The VERA-P1 series
modules are shipped on reel Type A as specified in the
u-blox Package Information Guide [1]
.
7.1.2 Tapes
Figure 4 shows the position and orientation of the VERA-P1 modules as they are delivered on tape.
The dimensions of the tapes are specified in Figure 5.
Figure 4: Orientation of VERA-P1 module on tape
Figure 5: VERA-P1 tape dimensions
Feed direction
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7.2 Shipment, storage and handling
For more information regarding shipment, storage and handling see the u-blox Package Information
Guide
[1].
7.2.1 Moisture sensitivity levels
The VERA-P1 series modules are rated at moisture sensitivity level 3. See moisture sensitive warning
label on each shipping bag for detailed information. After opening the dry pack, modules must be
mounted within 168 hours in factory conditions of maximum 30 °C/60%RH or must be stored at less
than 10%RH. Modules require baking if the humidity indicator card shows more than 10% when read
at 23±5°C or if the conditions mentioned above are not met. Please refer to J-STD-033B standard for
bake procedure.
7.2.2 Mounting process and soldering recommendations
The VERA-P1 series module is a surface mount module supplied on an 8-layer FR4-type PCB with gold
plated connection pins and produced in a lead-free process with a lead-free soldering paste. The wrap
page of the PCB is max. 0.75% according to IPC-A-610E. The thickness of solder resist on the host
PCB top side and the JODY-W1 bottom side must be considered for the soldering process.
This module is compatible with industrial reflow profile for RoHS/Pb-free solders, Sn96.5/Ag3.0/Cu0.5
solder is a right choice. Use of "No Clean" soldering paste is strongly recommended, cleaning the
populated modules is strongly discouraged - residuals under the module cannot be easily removed
with any cleaning process. Cleaning with water can lead to capillary effects where water is absorbed
into the gap between the host board and module. The combination of soldering flux residuals and
encapsulated water could lead to short circuits between neighboring pins.
Only a single reflow soldering process is permitted for host boards with the VERA-P1 series
modules.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. Since the profile used is process and
layout dependent, the optimum profile should be studied case by case. Recommendations below
should be taken as a starting point guide. In case of basic information necessity, refer to J-STD-020C
standard.
Profile feature
Sn-Pb eutectic
(Sn63/Pb37)
RoHS/Pb-free
(Sn96.5/Ag3.0/Cu0.5)
Ramp up rate (TSMAX to TP)
3 °C/sec max
3 °C/sec max
Minimum soak temperature (TSMIN)
100 °C
150 °C
Maximum soak temperature (TSMAX)
150 °C
200 °C
Soak time (ts)
60 - 120 sec
60 - 180 sec
Liquidus temperature (TL)
183 °C
217 °C
Time above TL (tL)
60 - 150 sec
60 - 150 sec
Peak temperature (TP)
215 – 225 °C
235 – 245 °C
Time within +0 / -5°C of actual TP (tp)
10 - 30 sec
20 - 40 sec
Ramp down rate
6 °C/sec max
6 °C/sec max
Time from 25°C to TP
6 min max
8 min max
Table 15: Recommended reflow profile
☞ The lowest value of TP and slower ramp down rate (2 – 3 °C/sec) is preferred.
VERA-P1 series - Data Sheet
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Figure 6: Reflow profile
7.2.3 ESD handling precautions
⚠ VERA-P1 series modules are Electrostatic Sensitive Devices (ESD). Observe precautions for
handling! Failure to observe these precautions can result in severe damage to the Wi-Fi receiver!
Wi-Fi transceivers are Electrostatic Sensitive Devices (ESD) and require special precautions when
handling. Particular care must be exercised when handling patch antennas, due to the risk of
electrostatic charges. In addition to standard ESD safety practices, the following measures should be
taken into account whenever handling the receiver:
Unless there is a galvanic coupling between
the local GND (i.e. the work table) and the
PCB GND, then the first point of contact
when handling the PCB must always be
between the local GND and PCB GND.
Before mounting an antenna patch, connect
ground of the device
When handling the RF pin, do not come into
contact with any charged capacitors and be
careful when contacting materials that can
develop charges (e.g. patch antenna ~10 pF,
coax cable ~50-80 pF/m, soldering iron, …)
To prevent electrostatic discharge through
the RF input, do not touch any exposed
antenna area. If there is any risk that such
exposed antenna area is touched in non ESD
protected work area, implement proper ESD
protection measures in the design.
When soldering RF connectors and patch
antennas to the receiver’s RF pin, make
sure to use an ESD safe soldering iron (tip).
VERA-P1 series - Data Sheet
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8 Labeling and ordering information
8.1 Product labeling
The labels of VERA-P1 series include important product information as described in this section.
Figure 7 illustrates the sample label of the VERA-P1 series. A detailed description of the label
components are listed in Table 16.
Figure 7: VERA-P1 series - Sample label
8
1
4
5
6
7
3
2
11
9
10
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft Labeling and ordering information Page 26 of 30
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Reference
Description
1
Company logo and trademark
2
Panel position number
3
Production date YY/WW (year/week)
4
Pb-Free, Platin Spec IPC-1066/JESD97
5
Type number (format PPPP-TGVV-TTQ-XX), e.g. VERA-P173-00A-00
“Model:” PPPP-TGVV
TTQ-XX
6
Datacode
7
Serial number “S/N:” MAC address
(Format of MAC address: D4-CA-6E-01-02-03)
8
DataMatrix (product identifier, serial number, datacode)
Product identifier: 3 digits
Serial number: MAC address
Datacode: 4 digits
9
Text box containing approval IDs
10
FCC ID: XPYVERA173 (example)
11
Pin 1 marker
Table 16: VERA-P1 series label description
8.2 Explanation of codes
Three different product code formats are used. The Product Name is used in documentation such as
this data sheet and identifies all u-blox products, independent of packaging and quality grade. The
Ordering Code includes options and quality, while the Type Number includes the hardware and
firmware versions. Table 17 below details these three different formats:
Format
Structure
Product Name
PPPP-TGVV
Ordering Code
PPPP-TGVV-TTQ
Type Number
PPPP-TGVV-TTQ-XX
Table 17: Product Code Formats
Code
Meaning
Example
PPPP
Form factor
VERA
TG
Platform
T – Dominant technology, For example, W: Wi-Fi, B: Bluetooth
G – Generation
P1
VV
Variant based on the same platform; range [00…99]
73
TT
Major Product Version
00
Q
Quality grade
A: Automotive
B: Professional
C: Standard
A
XX
Minor product version (not relevant for certification)
00
Table 18: Part identification code
VERA-P1 series - Data Sheet
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8.3 Ordering codes
Ordering Code
Product name
Product
VERA-P173-00A-00
VERA-P173
VERA-P173 automotive grade module
VERA-P174-00A-00
VERA-P174
VERA-P174 automotive grade module
EVK-VERA-P174-00A
EVK-VERA-P174
Evaluation kit for VERA-P173 and VERA-P174
Table 19: Product ordering codes
☞ Product changes affecting form, fit or function are documented by u-blox. For a list of Product
Change Notifications (PCNs) see our website.
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft Appendix Page 28 of 30
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Appendix
A Glossary
Abbreviation
Definition
COTS
Commercial off-the-shelf
CS
Chip select
ESD
Electrostatic Sensitive Devices
ETSI
European Telecommunications Standards Institute
FCC
Federal Communications Commission
GND
Ground
GPIO
General-purpose input/output
IC
Industry Canada
LLC
Logical Link Control
MAC
Media Access Control
nACR
Non-adjacent channel rejection
NLoS
Non-Line-of-Sight
OBU
On Board Unit
OFDM
Orthogonal frequency-division multiplexing
PCB
Printed Circuit Board
RF
Radio Frequency
RSU
Road Side Unit
RoHS
Restriction of Hazardous Substances
SPI
Serial Peripheral Interface
USB
Universal Serial Bus
V2X
Vehicle-to-Everything
Table 20: Explanation of the abbreviations and terms used
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft Related documents Page 29 of 30
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Related documents
[1] u-blox Package Information Guide, document number UBX-14001652
[2] VERA-P1 series antenna reference design, document number UBX-18022092
☞ For regular updates to u-blox documentation and to receive product change notifications, register
on our homepage (www.u-blox.com).
Revision history
Revision
Date
Name
Comments
R01
23-Feb-2017
ishe, kgom
Initial release.
R02
5-May-2017
ddie, kgom
Added VERA-P174 product variant and included block diagram, FCC/IC ID, and
ordering code for this variant.
R03
11-Sep-2017
mzes, kgom,
ddie
Updated Table 1. Included footnotes in section 1.5. Updated the ordering
codes (section 8.3). Added reel size (section 7.1) and tape dimensions (Figure
5).
R04
17-Oct-2017
ddie, kgom
Removed references to VERA-P175 variant. Updated Table 1.
R05
4-June-2018
smay, kgom
Updated total power consumption in section 1.5. Added SPI limitation in
section 2.2. Added peak current consumption in Table 7. Extended worst case
dimension D in section 5.1. Added position and orientation in section 7.1.2.
Added product labeling in section 8.1. Update lowest TX power level. Removed
all references to VERA-P171 variant.
R06
22-June-2018
ddie
Added clarification that 23 dBm max output power is the combined output
power of two antennas. Added FCC approvals section (6.1.2).
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft Contact Page 30 of 30
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Contact
For complete contact information, visit us at www.u-blox.com.
u-blox Offices
North, Central and South America
u-blox America, Inc.
Phone: +1 703 483 3180
E-mail: info_us@u-blox.com
Regional Office West Coast:
Phone: +1 408 573 3640
E-mail: info_us@u-blox.com
Technical Support:
Phone: +1 703 483 3185
E-mail: support@u-blox.com
Headquarters
Europe, Middle East, Africa
u-blox AG
Phone: +41 44 722 74 44
E-mail: info@u-blox.com
Support: support@u-blox.com
Asia, Australia, Pacific
u-blox Singapore Pte. Ltd.
Phone: +65 6734 3811
E-mail: info_ap@u-blox.com
Support: support_ap@u-blox.com
Regional Office Australia:
Phone: +61 2 8448 2016
E-mail: info_anz@u-blox.com
Support: support_ap@u-blox.com
Regional Office China (Beijing):
Phone: +86 10 68 133 545
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office China (Chongqing):
Phone: +86 23 6815 1588
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office China (Shanghai):
Phone: +86 21 6090 4832
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office China (Shenzhen):
Phone: +86 755 8627 1083
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office India:
Phone: +91 80 405 092 00
E-mail: info_in@u-blox.com
Support: support_in@u-blox.com
Regional Office Japan (Osaka):
Phone: +81 6 6941 3660
E-mail: info_jp@u-blox.com
Support: support_jp@u-blox.com
Regional Office Japan (Tokyo):
Phone: +81 3 5775 3850
E-mail: info_jp@u-blox.com
Support: support_jp@u-blox.com
Regional Office Korea:
Phone: +82 2 542 0861
E-mail: info_kr@u-blox.com
Support: support_kr@u-blox.com
Regional Office Taiwan:
Phone: +886 2 2657 1090
E-mail: info_tw@u-blox.com
Support: support_tw@u-blox.com

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