Haier US Appliance Solutions BLEA003 Bluetooth 4.0 Module User Manual Product Specification
GE Appliance & Lighting Bluetooth 4.0 Module Product Specification
15_BB1737-25 UserMan
Bluetooth 4.0 BLE Product Specification Prouct: Module Number: Doc Version: Data: Bluetooth 4.0 BLE Module BB1737-25 V1.1 October 17,2015 Module Bluetooth 4.0 BLE Module Section 1:Overview The BB1737-25 is a Bluetooth 4.0 module based on the Broadcom BCM20737 specification basic rate-compliant stand alone baseband processor with an integrated 2.4GHz transceiver. The module includes Flash , crystal and PCB antenna. 1.1 Applications The following profiles are supported in ROM: • Battery status • Blood pressure monitor • Find me • Heart rate monitor • Proximity • Thermometer • Weight scale • Time Additional profiles that can be supported from RAM include: • Blood glucose monitor • Temperature alarm • Location 1.2 Features • Support for RSA encryption/decryption and key exchange mechanisms (up to 4 kbit) • Support for X.509 certificate exchange • Support for NFC tag-based "tap-to-pair" • Support for Bluetooth Smart Based Audio • • • • • Bluetooth low energy (BLE)-compliant Supports Adaptive Frequency Hopping Excellent receiver sensitivity 10-bit auxiliary ADC with nine analog channels On-chip support for serial peripheral interface(SPI,UART) (master and slave modes) Programmable output power control Integrated ARM Cortex™-M3 based microprocessor core Automation Profile Support for secure OTA On-chip power-on reset (POR) Integrated low-dropout regulator (LDO) On-chip software controlled power management unitq Package type:20.5*12.5*2mm FR4 PCB with 25 pads located around the perimeter. • • • • • • • • Bluetooth 4.0 BLE Module 1.3 Functional Description The primary component on the module is the Broadcom BCM20737, which is a Bluetooth 4.0 compliant basic rate single-chip. The baseband and radio have been integrated into a single chip implemented in standard digital CMOS. The block diagram of the module is shown in Figure 1. Figure 1: Block Diagram The BB1737-25 employs an integrated ARM CortexTM-M3 microprocessor core that runs software from the Link Control layer up to the Host Controller Interface (HCI).The baseband portion of the BB1737-25 performs all the time-critical functions required for high-performance Bluetooth operations. The radio incorporates the complete receive and transmit paths, including PLL, VCO, LNA, PA, upconverter,downconverter, modulator, demodulator, and channel select filtering. The module has a SPI interface. The interface has a 16-byte transmit buffer and a 16-byte receive buffer .To support more flexibility for user applications. The module acts as an SPI master device that supports 1.8V or 3.3V SPI slaves. Bluetooth 4.0 BLE Module 1.4 Physical Description The BB1737-25 is a 20.5*12.5*2mm FR4 PCB with 25 pads located around the perimeter 2 shows the pinout diagram of the module. Fingle 2 Pin Location Figure 3 : Module PCB Layout Mechanical Specification Fingle Bluetooth 4.0 BLE Figure 4 : Module PCB To p vi e w Figure 5 : Module PCB B o t t o m vi e w Table 1 shows the pin-out diagram of the module. Table 1: Pin Description(Cont.) Pin Number 1,2,8,9,25 24 Pin Name GND UP_RX UP_TX SDA SCL P32 VDDIO Default State 10 RST I/ O 11 12 13 14 15 16 17 18 19 20 21 22 23 P0 P1 P3 P2 P4 P8/P33 P25 P24 P13/P28 P14/P38 P15 P11/P27 P12/P26 Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input floating Input output I/ O I/ O I/ O VDDO Module Function Description Connect to ground UART input serial data for the HCI UART interface UART output serial data for the HCI UART interface Internal flash memory use Internal flash memory use Internal flash memory use Power supply Active-low system reset with open-drain output & internal pull-up resistor GPIO:P0 SPI_2:MOSI (master) A/D input GPIO:P1 SPI_2:MISO (master) A/D input GPIO:P3 SPI_2:CLK (master) GPIO:P2 SPI_2:CS (master) GPIO:P4 Internal flash memory use GPIO:P25 GPIO:P24 GPIO:P13,P28 A/D input PWM3 GPIO:P14,P38 A/D input PWM2 GPIO:P15 A/D input(Battery moniter) GPIO:P11,P27 PWM1 GPIO:P12,P26 PWM0 Bluetooth 4.0 BLE Module Section 2: Specifications 2.1 Electrical Characteristics Table 2 shows the maximum electrical rating for voltages referenced to VDD pin. Table 2: c Rating Symbol Value Unit DC supply voltage for VDDIO domain Voltage on input or output pin Operating ambient temperature range Storage temperature range – – Topr Tstg 3.8 VSS – 0.3 to VDD + 0.3 -30°C to +85°C –40 to +125 °C °C Table 3 shows the power supply characteristics for the range TJ = 0 to 85°C. Table 3: Power Supply Minimum a Parameter DC supply voltage for VDDM (UART/I2C) DC supply voltage for VDDIO Typical 1.62 1.8 Maximuma Unit – – 3.63 3.63 a. Overall performance degrades beyond minimum and maximum supply voltages. Table 4: Current Consumption a Operational Mode Conditions Receive Transmit Max Unit Receiver and baseband are both operating, 100% 26 ON. Transmitter and baseband are both operating, 20 100% ON. – mA – mA 4.3 5.9 40 – – – mA mA uA Standby Broadcast Sleep a. Current consumption measurements are taken at VBAT 3V. Typ Bluetooth 4.0 BLE Module 2.2 RF Specifications Table 5: Receiver RF Specifications Parameter Mode and Conditions Min Typ Max Unit – 0.1%BER, 1 Mbps – – 2402 – – –16 – 2480 – – – MHz dBm dBm dBm – –10 – – dBm 0.1%BER 0.1%BER 0.1%BER 0.1%BER 0.1%BER 0.1%BER – – – – – – – – – – – – 21 15 –17 –27 –9.0 –15 dB dB dB dB dB dB – – – – –30.0 –35 –35 –30.0 – – – – dBm dBm dBm dBm – – – – –57.0 –55.0 dBm dBm Receiver Section Frequency range RX sensitivity (standard) RX sensitivity (low current) Input IP3 Maximum input Interference Performancea,b C/I cochannel C/I 1 MHz adjacent channel C/I 2 MHz adjacent channel C/I ≥ 3 MHz adjacent channel C/I image channel C/I 1 MHz adjacent to image channel Out-of-Band Blocking Performance (CW)a,b 30 MHz to 2000 MHz 0.1%BERc 2003 MHz to 2399 MHz 0.1%BERd 2484 MHz to 2997 MHz 0.1%BERd 3000 MHz to 12.75 GHz 0.1%BERe Spurious Emissions 30 MHz to 1 GHz – 1 GHz to 12.75 GHz – a. b. c. d. e. 30.8% PER. Desired signal is 3 dB above the reference sensitivity level (defined as –70 dBm). Measurement resolution is 10 MHz. Measurement resolution is 3 MHz. Measurement resolution is 25 MHz. -85 -85 Bluetooth 4.0 BLE Module Table 6: Transmitter RF Specifications Parameter Transmitter Section Frequency range Output power adjustment range Default output power Output power variation Adjacent Channel Power |M – N| = 2 |M – N| ≥ 3 Out-of-Band Spurious Emission 30 MHz to 1 GHz 1 GHz to 12.75 GHz 1.8 GHz to 1.9 GHz 5.15 GHz to 5.3 GHz LO Performance Initial carrier frequency tolerance Frequency Drift Frequency drift Drift rate Frequency Deviation Average deviation in payload (sequence used is 00001111) Maximum deviation in payload (sequence used is 10101010) Channel spacing Min Typ Max Unit 2402 – – – – 4.0 2.0 2480 – – – MHz dBm dBm dB – – – – –20 –30 dBm dBm – – – – – – – – –36.0 –30.0 –47.0 –47.0 dBm dBm dBm dBm – – ±150 kHz – – – – ±50 20 kHz kHz/50 µs 225 – 275 kHz 185 – – kHz – – MHz Bluetooth 4.0 BLE Module 2.3 Timing and AC Charactristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 7: UART Timing Specifications Reference Characteristics Min Max Unit Delay time, UART_CTS_N low to UART_TXD valid – 24 Setup time, UART_CTS_N high before midpoint of stop – bit Delay time, midpoint of stop bit to UART_RTS_N high – 10 Baud out cycles ns F A Figure 6: UART Timing Baud out cycles Bluetooth 4.0 BLE Module SPI Timing The SPI interface supports clock speeds up to 12 MHz with VDDIO ≥ 2.5V. The supported clock speed is 6 MHz when 2.5V > VDDIO ≥ 2.35V. Figure 7 and Figure 8 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively. Table 8: SPI Interface Timing Specifications Reference Characteristics Min Typ Max Time from CSN asserted to first clock edge Master setup time Master hold time Slave setup time Slave hold time Time from last clock edge to CSN deasserted 1 SCK – ½ SCK – ½ SCK 1 SCK 100 ½ SCK – ½ SCK – 10 SCK ∞ – – – – 100 SPI_CSN SPI_CLK (Mode 0) SPI_CLK (Mode 2) SPI_MOSI SPI_MISO Not Driven First Bit First Bit Second Bit Second Bit Figure 7: SPI Timing – Mode 0 and 2 Figure 8: SPI Timing – Mode 1 and 3 Last bit Last bit Not Driven Bluetooth 4.0 BLE Module Section3: Reference Design The most recent schematic and design example , bill of material ,and layout file are available from the ITON Technology Limit. Contact your ITON representative for details. Figure 9: Module Reference Schematic Figure 10: SPI/UART Reference Interface REVISION HISTORY Data 17-April-2015 17-October-2015 Revision 1.0 Changes Initial Version 1.1 Update Working Voltage NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (OEM) Integrator has to assure compliance of the entire end‐product incl. the integrated RF Module. Additional measurements (15B) and/or equipment authorizations (e.g Verification) may need to be addressed depending on co‐location or simultaenous transmission issues if applicable. Integrator is reminded to assure that these installation instructions will not be made available to the end‐user of the final host device. With the low output power, this RF Module meets the FCC SAR exemption and can be therefore integrated into any (portable, mobile, fixed) host device that powered by battery. The final host device, into which this RF Module is integrated" has to be labelled with an auxilliary lable stating the FCC ID of the RF Module, such as "Contains FCC ID: ZKJ-BLEA003 ".
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