Acer orporated N300 PDA with WLAN and Bluetooth User Manual Bluetooth manual

Acer Incorporated PDA with WLAN and Bluetooth Bluetooth manual

Contents

Bluetooth manual

Specification Number : JEBMM0-0058Messrs. LITE-ON Technology Corp.Approval Sheet for Product SpecificationIssued Date : 15/Nov/2004Product Description : BlueModuleTMCustomer Part Number :Murata Part Number : LBMA477BK2-064Date :Company :Dept. :Approved bySignature :Type :The duplicate of this specification shall be returned to us with your authorised signiture. Unless itreaches us by 27/December/2004, it shall be mutually understood that this specification has been dulyapproved by you.Prepared by (signature) Keisuke Katabuchi (type)Approved by (signature) Norio Nakajima (type) Manager Product Engineering Section I Multilayer Products Department Component Division IIIMurata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058P.1/20Murata Manufacturing Co., Ltd. 1. ScopeThis specification is applied to the Bluetooth HCI module (Blue ModuleTM). 2. Part Number Production Part Number LBMA477BK2-064 3. RatingRatingsMin Max UnitOperating Temperature -20 +70 deg.CStorage Temperature -40 +85 deg.CTerminal Name Min Max UnitBTRF_REG 2.2 VBTL_REG 2.2 VSupply VoltageV_I_O 4.1 VInput Terminal Voltage Vss-0.3 VDD+0.3 V4. Weight (Nominal) 0.3g
Specification Number : JEBMM0-0058P.2/20Murata Manufacturing Co., Ltd.5. CONSTRUCTION, DIMENSIONS and Terminal ConfigurationsMark Dimension Mark Dimension Mark DimensionL7.5±0.2 W7.5±0.2 T 1.4 maxa1 0.4±0.2 a2 0.4±0.2 b1 0.75±0.2b2 1.1±0.2 c1 0.6±0.2 c2 0.6±0.2c3 4.9±0.2 c4 4.9±0.2 d1 0.75±0.2d2 0.75±0.2 p1 0.7±0.2 p2 0.7±0.2 (Unit: mm)<SIDE VIEW>T<SIDE VIEW>(18) (19) (20) (21) (22) (23) (24) (25) (26)(27)(29)(30)(31)(32)(33)(34)(1)(2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) (13) (15) (16) (17) (14) <BOTTOME VIEW>(28)c4c3c1c2b1p1b2a2p2a1(35)d2d1(17)WPin 1 index<TOP VIEW>L(1)(1) (9)(10)(18)(26)(27)(34)Lot NumberBK
Specification Number : JEBMM0-0058P.3/20Murata Manufacturing Co., Ltd.Terminal ConfigurationsTerminalNo.Terminal Name Pin Type Description(1) GROUND I -(2) NC - -(3) NC - -(4) NC - -(5) BLUE_TX I <UART_RXD> UART data input activehigh(6) REG_CTRL I Internal 1.8V regulator enable signal(7) EEPROM_CLK O Clock interface to an optional serialEEPROM(8) NC -(9) BLUE_HOST_WAKE O HOST_WAKE signal for power control(10) V_I_O I -(11) BLUE_WAKE I Active high or active low BT_WAKEsignal for powe control(12) LPO_IN I 32.768KHz digital clock input(13) BLUE_CLK_EN O -(14) GROUND I -(15) XTAL_OUT O Crystal Oscillator output(16) XTAL_IN I Crystal or frequency reference input(17) GROUND I -(18) TM0 I Test Mode 0(19) TM1_2 I Test mode 1 and 2(20) TM3 I Test mode 3(21) BTRF_REG I -(22) RESET_N I Active LOW system reset(23) TX_PU_TDD_N O Complement of TX_PU_TDD(24) GROUND I -(25) ANTENNA_MATCH I/O <Ant> RF input/output(26) GROUND I -(27) ASAP_CLK I/O <PCM_CLK> Synchronous data clock(28) ASAP_FS I/O <PCM_SYNC> Synchronous data sync(29) BLUE_CTS I <UART_CTS> UART clear to sendactive low(30) ASAP_RX O <PCM_OUT> Synchronous data output(31) BLUE_RTS O <UART_RTS> UART request to sendactive low(32) ASAP_TX I <PCM_IN> Synchronous data input(33) BLUE_RX O <UART_TXD> UART data output activehigh(34) BTL_REG I -(35) GROUND I -
Specification Number : JEBMM0-0058P.4/20Murata Manufacturing Co., Ltd.6. Electrical Characteristics6-1 Operating ConditionsMin Typ Max UnitOperating Temperature -20 +25 +70 deg.CSupply Voltage BTRF_REG, BTL_REG V_I_O1.711.711.82.81.983.63VV6-2-1 Characteristics　+25degC,BTRF_REG/BTL_REG=1.8V, VIO=2.75VItems ContentsBluetooth specification Ver 1.2Channel spacing 1MHzNumber of RF channel 79Power class 2Operation mode(Rx/Tx) Time division multiplex either transmit or receiveFrequency hopping after one Rx/Tx cycleItems Min Typ Max Unit1.Current Consumption RF Register x57=xC6 1.1 BTRF_REG_IDC_max DH5; 100% slot utilization;50% Rx/Tx slot duty cycle75 mA1.3 V_I_O_REG_IDC_max DH5; 100% slot utilization;50% Rx/Tx slot duty cycle10 mA-TX characteristics- Min Typ Max Unit2.Output Power -4 4 dBm3.Frequency range（Rx/Tx）2400.5～2483.5MHz4.-20dB bandwidth 1MHz5.Adjacent Channel Power *1 5.1 [M-N]＝2-21 dBm 5.2 [M-N]≧3-41 dBm6.Modulation characteristics 6.1 Modulation δf1avg 145 173 kHz 6.2 Modulation δf2max 125 kHz 6.3 Modulationδf2avg/δf1avg 0.857.Initial Carrier Frequency Tolerance -45 45 kHz8.Carrier Frequency Drift 8.1 1slot -25 25 kHz 8.2 3slot -40 40 kHz 8.3 5slot -40 40 kHz 8.4 Maximum drift rate -20 20 kHz/50μs9.Out-of-Band Spurious Emissions 9.1 30-1000MHz (Operation Mode) -36 dBm 9.2 1000-12750MHz (Operation Mode) -30 dBm 9.3 1800-1900MHz(Operation Mode) -47 dBm 9.4 2110-2170MHz (Operation Mode) -75 dBm 9.5 5150-5300MHz (Operation Mode) -47 dBm
Specification Number : JEBMM0-0058P.5/20Murata Manufacturing Co., Ltd.-RX characteristics- min typ max unit10.Sensitivity (BER≦0.1%) 10.1 2402MHz -79 dBm 10.2 2441MHz -79 dBm 10.3 2480MHz -79 dBm11.C/I Performance (BER≦0.1%) *2 11.1 co-channel ratio (-60dBm input) 11 dBm 11.2 1MHz ratio (-60dBm input) 0dBm 11.3 2MHz ratio (-60dBm input) -30 dBm 11.4 3MHz ratio (-67dBm input) -40 dBm 11.5 image ratio (-67dBm input) -9 dBm 11.6 image +/- 1MHz ratio (-67dBm input) -20 dBm12.Blocking performance(BER<0.1%) *3 12.1 30MHz-2000MHz -10 dBm 12.2 2000MHz-2400MHz -27 dBm 12.3 2500MHz-3000MHz -27 dBm 12.4 3000MHz-12750MHz -10 dBm13.Intermodulation performance (BER≦0.1%, -64dBm input) -35 dBm14.Maximum Input Level -20 dBm*1 Up to three sprious responses within Bluetooth limits are allowed.*2 Up to five sprious responses within Bluetooth limits are allowed.*3 Up to twenty-four sprious responses within Bluetooth limits are allowed.
Specification Number : JEBMM0-0058P.6/20Murata Manufacturing Co., Ltd.6-2-2. Extreme condition : -20 to +70degC, BTRF_REG/BTL_REG=1.71-1.98V, VIO=1.71-3.63VItems Min Typ Max Unit1.Current Consumption RF Register x57=xC6 1.1 BTRF_REG_IDC_max DH5; 100% slot utilization;50% Rx/Tx slot duty cycle80 mA1.3 V_I_O_REG_IDC_max DH5; 100% slot utilization;50% Rx/Tx slot duty cycle12 mA-TX characteristics- Min Typ Max Unit2.Output Power -6 +6 dBm3.Frequency range（Rx/Tx）2400.5～2483.5MHz4.-20dB bandwidth 1MHz5.Adjacent Channel Power *1 5.1 [M-N]＝2-20 dBm 5.2 [M-N]≧3-40 dBm6.Modulation characteristics 6.1 Modulation δf1avg 145 175 kHz 6.2 Modulation δf2max 115 kHz 6.3 Modulationδf2avg/δf1avg 0.87.Initial Carrier Frequency Tolerance -75 75 kHz8.Carrier Frequency Drift 8.1 1slot -25 25 kHz 8.2 3slot -40 40 kHz 8.3 5slot -40 40 kHz 8.4 Maximum drift rate -20 20 kHz/50μs9.Out-of-Band Spurious Emissions 9.1 30-1000MHz (Operation Mode) -36 dBm 9.2 1000-12750MHz (Operation Mode) -30 dBm 9.3 1800-1900MHz(Operation Mode) -47 dBm 9.4 2110-2170MHz (Operation Mode) -65 dBm 9.5 5150-5300MHz (Operation Mode) -47 dBm-RX characteristics- min typ max unit10.Sensitivity (BER≦0.1%) 10.1 2402MHz -77 dBm 10.2 2441MHz -77 dBm 10.3 2480MHz -77 dBm*1 Up to three spurious responses within Bluetooth limits are allowed.NoteThe above mentioned values have been obtained according to our own measuring methods (testing jigFig.1) and may very depend on the circuit, in which the component is actually incorporated. Therefore,you are kindly requested to test the performance of the component actually in your set.
Specification Number : JEBMM0-0058P.7/20Murata Manufacturing Co., Ltd.7. Other Specification and MethodsNo. Items Specifications Test MethodsAppearance No severe damages1VibrationResistanceElectricalSpecificationsSatisfy specifications listed inparagraph 6.Solder specimens on the testing jig shown inappended Fig.3 by an solder. The soldering shallbe done either by iron or reflow and beconducted with care so that the soldering isuniform and free of defect such as by heatshock. Frequency : 10 to 2000 by 10 Hz Acceleration : 196 m/s2 Direction : X,Y,Z 3axes Period : 2 h on each direction(Total 6 h.)Appearance No severe damages2 ShockElectricalSpecificationsSatisfy specifications listed inparagraph 6.Solder specimens on the testing jig shown inappended Fig.3 by an solder. The soldering shallbe done either by iron or reflow and beconducted with care so that the soldering isuniform and free of defect such as by heatshock. Pulse Wave : Sine Half Wave Acceleration : 30000 m/s2 (Peak) Period : 0.3 ms. Cycle : 10 times3 Deflection No damage with 1mm deflection Solder specimens on the testing jig shown inappended Fig.3 by an solder. The soldering shallbe done either by iron or reflow and beconducted with care so that the soldering isuniform and free of defect such as by heatshock.4 Soldering strength(Push Strength)9.8 N Minimum Solder specimens on the testing jig shown inappended Fig.3 by an solder. As shown below,apply pushing force at 0.5 mm/s until electrodepads are pealed off or ceramics are broken.Pushing force is applied as show below.5 Solderability of Termination 75% of the terminations is to besoldered evenly and continuously.Immerse specimens first a ethanol solution ofrosin (25% rosin in weight proportion), then in ansolder solution for 2+/-0.5 s at 230+/-5 deg.C. Preheat : 100 to 120 deg.C, 60 s Solder Paste : Eutectic Solder Flux : Solution of ethanol and rosin(25% rosin in weight proportion)Appearance No severe damages6 Resistanceto SolderingHeat(Reflow)ElectricalspecificationsSatisfy specifications listed inparagraph 6. Preheat Temperature : 150 +/-10 deg.C Preheat Period : 60s Peak Temperature : 230+/-5 deg.C Peak Temp. Period : 10 sSpecimens are soldered once with the abovecondition, then kept in room condition for 24 hbefore measurements.No. Items Specifications Test MethodsSpecimenJigPushing Direction
Specification Number : JEBMM0-0058P.8/20Murata Manufacturing Co., Ltd.Appearance No severe damages7 TemperatureCycleElectricalspecificationsSatisfy specifications listed inparagraph 6.Set the specimens to the supporting jig in thesame manner and under the same condition asFig.1 and conduct the 100 cycles according tothe temperatures and time shown in thefollowing table.Appearance No severe damages8 HumidityLoad LifeElectricalspecificationsSatisfy specifications listed inparagraph 6. Temperature : 85+/-2 deg.C Humidity : 80 to 85%RH Period : 500+24/-0 h Room Condition : 2 to 24 h Supply Voltage : 3.63V D.C. to V_I_O,1.93V D.C to BTRF_REG and BTL_REGAppearance No severe damages9 High Temp.Load LifeElectricalspecificationsSatisfy specifications listed inparagraph 6. Temperature : 85+/-2 deg.C Period : 500+24/-0 h Room Condition : 2 to 24 hSupply Voltage : 3.63V D.C. to V_I_O1.93V D.C to BTRF_REG and BTL_REGExcessive mechanical force or thermal stress may damage the products. Appropriate handling isrequired.8. Interface UART9. IC/Firmware BROADCOM’s BCM2035 B3 Version10. Production Site FUKUI MURATA MFG.CO.,LTD.Step 1 2Temp.(deg.C) Min operatingTemp . + 0/-3Max operatingTemp . + 3/-0Time (min) 30+/-3 30+/-3
Specification Number : JEBMM0-0058P.9/20Murata Manufacturing Co., Ltd.Fig.1 Measurement Board
Specification Number : JEBMM0-0058P.10/20Murata Manufacturing Co., Ltd.Fig.2 Land Patterns (Unit:mm)0.70.40.750.74.94.90.40.757.57.5Land
Specification Number : JEBMM0-0058P.11/20Murata Manufacturing Co., Ltd.Fig.2 Testing Board Unit:mmGlass epoxy board t=0.8mmCopper thickness 35um min 0.7 0.40.75 0.7 49 49 0.4 0.75 75 75 Land 40100
Specification Number : JEBMM0-0058P.12/20Murata Manufacturing Co., Ltd.Mounted SituationTesting Method100Unit : mm45 45ModuleR2305020DeflectionUnit : mm
Specification Number : JEBMM0-0058P.13/20Murata Manufacturing Co., Ltd.11.Tape and Reel Packing(1) Dimensions of Tape ( Plastic tape )1.Cumulative tolerance of max. ± 0.3 every 10 pitches2.Reference value (2) Dimensions of Reel30.5 max.(Unit :mm)φ 13±0.22.0±0.525.5±0.6 100) (φ 330) (φ4.0 ± 0.1Min=14.252.0 ± 0.17.5 ± 0.116.0± 0.3Max=0.61.6 ± 0.17.8 ± 0.112.0 ± 0.17.8 ± 0.1Max 5.0°Min=1.51.5+0.1Feeding DirectionPad 117.0±0.620.4　max
Specification Number : JEBMM0-0058P.14/20Murata Manufacturing Co., Ltd.(3) Taping Diagrams[1] Feeding Hole : As specified in (1)[2] Hole for chip : As specified in (1)[3] Cover tape : 62 μm in thickness[4] Base tape : As specified in (1) 送り穴[2][3][4][3][1]送り穴ModuleFeeding DirectionFeeding Hole
Specification Number : JEBMM0-0058P.15/20Murata Manufacturing Co., Ltd.(4) Leader and Tail tape(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (6) The cover tape and base tape are not adhered at no components area for 250 mm min.(7) Tear off strength against pulling of cover tape : 5 N min.(8) Packaging unit : 1000 pcs./ reel(9) material : Base tape : PlasticReel : PlasticCover tape , cavity tape and reel are made the anti-static processing.(10) Peeling of force : 0.7 N max. in the direction of peeling as shown below. 165 to 180 °0.7 N max.Base tape Cover tape 40 to 200 mm Tail tape(No components) Components No componentsFeeding direction Leader tape(Cover tape alone)150 mm min. 250 mm min.
Specification Number : JEBMM0-0058P.16/20Murata Manufacturing Co., Ltd.NOTICE1. Storage Conditions:The product shall be stored under the following conditions in order not to damage the solderbility of theexternal electrodes.- The product shall be stored without opening the packing and at the ambient temperature between 5and 30 deg.C and humidity between 20 and 70 %RH. And the product shall be used within 6 monthsafter reception. (Packing materials, in particular, may be deformed at the temperature over 45 deg.C.)- After opening the packing, the product shall be stored at 5 to 30 deg.C / < 60 %RH and the productshall be used within 48 hours. If the product is not used within 48 hours after opening the packing, theproduct shall be baked under the following conditions.Baking condition : 125 +/-5 deg.C, 24 hours, 1 time The products shall be baked on the heat-resistant tray because the material (BaseTape, Reel Tape and Cover Tape) are not heat-resistant.- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).- Solderbility shall be confirmed before use if the product is stored for more than 3 months.- When the indicator in the packing has changed its color, the product shall be baked before soldering.- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharpobject and dropping the product, shall not be applied in order not to damage the packing materials.2. Handling Conditions:- Be careful in handling or transporting products because excessive stress or mechanicalshock may break products due to the nature of ceramics structure.- Handle with care because the characteristics of products may change if products may have cracks ordamages on their terminals. Do not touch products with bear hands that may result in poorsolderability.3. Standard PCB Design (Land Patterns and Dimensions) :- All the ground terminals should be connected to the ground patterns. Please refer toFig.2 for the standard land dimensions.- The recommended land patterns and dimensions are as Murata's standard. The characteristics ofproducts may vary depending on the pattern drawing method, grounding method, land dimensions,land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure toverify the characteristics in the actual set. When using non-standard lands, contact Muratabeforehand.4. Notice for Chip Placer :- When placing products on the PCB, products may be stressed and broken by unevenforces from a worn-out chucking locating claw or a suction nozzle. To prevent productsfrom damages, be sure to follow the specifications for the maintenance of the chip placerbeing used. For the positioning of products on the PCB, be aware that mechanicalchucking may damage products.
Specification Number : JEBMM0-0058P.17/20Murata Manufacturing Co., Ltd.5. Soldering Conditions :- Carefully perform preheating so that the temperature difference (delta T) between the solder andproducts surface should be in the following range. When products are immersed in solvent aftermounting, pay special attention to maintain the temperature difference within 100 deg.C. Solderingmust be carried out by the above mentioned conditions to prevent products from damage. ContactMurata before use if concerning other soldering conditions.Soldering methods TemperatureSoldering iron methodReflow method delta T < 130 deg.C- Soldering iron method conditions are indicated below.Kind of ironItems Ceramic heaterSoldering iron wattage < 18 WTemperature of iron-tip <350 °CIron contact time within 3 s- Diameter of iron-tip : φ3.0 mm max.- Do not touch the module itself directly by the iron-tip. within 3 s. within 120 s∆ΤTemperature (°C)Pre-heatingTime (s.)Reflow soldering standard conditions(Example)220 °Cwithin 60 s.Cooling down slowly250 to 260 °C
Specification Number : JEBMM0-0058P.18/20Murata Manufacturing Co., Ltd.- Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt% or less. Be careful so asnot to remain the flux residue around products. Because there are possibilities to become worse thecharacteristics.- Amount of Solder Paste: Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface ofthe external electrodes. If too much or little solder is applied, there is high possibility that themechanical strength will be insufficient, creating the variation of characteristics. Amount of solder paste Chip Hight <Unacceptable> <Improvements by land division> Lead wire of leaded component Soldering iron Lead wire of componenmounted later Solder resist Solder resist Solder resist Chip Chassis Solder (Grounding solder) Chip Land PCB
Specification Number : JEBMM0-0058P.19/20Murata Manufacturing Co., Ltd.6. Operational Environment Conditions :- Products are designed to work for electronic products under normal environmental conditions(ambient temperature, humidity and pressure). Therefore, products have no problems to be usedunder the similar conditions to the above-mentioned. However, if products are used under thefollowing circumstances, it may damage products and electric shock and abnormal temperature mayoccur.- In an atmosphere containing corrosive gas (CL2, NH3, SOx, NOx, etc.).- In an atmosphere containing combustible and volatile gases.- Dusty place.- Direct sunlight place.- Water splashing place.- Humid place where water condenses.- Freezing place.- If there are possibilities for products to be used under the preceding clause, consultwith Murata before actual use.- As it might be a cause of degradation or destruction to apply static electricity toproducts, do not apply static electricity or excessive voltage while assembling andmeasuring.7. Limitation of Applications :Please contact Murata before using products for the applications listed below whichrequire especially high reliability for the prevention of defects which might directly causedamage to the third party's life, body or property.- Aircraft equipment.- Aerospace equipment.- Undersea equipment.- Medical equipment.- Transportation equipment (vehicles, trains, ships, etc.).- Traffic signal equipment.- Disaster prevention / crime prevention equipment.- Data-processing equipment- Application of similar complexity and/ or reliability requirements to the applications listed in theabove.
Specification Number : JEBMM0-0058P.20/20Murata Manufacturing Co., Ltd. Note :- Please make sure that your product has been evaluated and confirmed against your specificationswhen our product is mounted to your product.- All the items and parameters in this product specification have been prescribed on the premise thatour product is used for the purpose, under the condition and in the environment agreed upon betweenyou and us. You are requested not to use our product deviating from such agreement.- We consider it not appropriate to include other terms and conditions for transaction warranty inproduct specifications, drawings or other technical documents. Therefore, even if your original part ofthis product specification includes such terms and conditions as warranty clause, product liabilityclause, or intellectual property infringement liability clause, we are not able to accept such terms andconditions in this product specification unless they are based on the governmental regulation or whatwe have agreed otherwise in a separate contact. We would like to suggest that you propose to discussthem under negotiation of contract.

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