Acer orporated N300 PDA with WLAN and Bluetooth User Manual

Acer Incorporated PDA with WLAN and Bluetooth

Contents

WLAN manual

Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 1 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. DATE OF ISSUE : 05 / 25 / 2005 DATA SHEET RF Division WLAN R&D G. WRITTEN CHECKED APPROVED Jeonho Lee Yong-Min Jung Eon Hwang CUSTOMER PRODUCT NAME Embedded Wireless LAN Module MODEL NAME SWL-2455C, SWL-2455SD Part Number ISSUED BY CHECKED BY APPROVED BY Head Office & Sales Dept. 314, Maetan-3Dong, Yeongtong-Gu Suwon, Kyunggi-Do, Korea TEL : +82 (0)31 210 6903 FAX : +82 (0)31 300 7900 Homepage : http://www.sem.samsung.com
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 2 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. Contents 0 Document...........................................................................................................................30.1 Declaration......................................................................................................................................30.2 Revision History .............................................................................................................................31 Specification for WLAN CF Embedded Module ..............................................................41.1 Identification...................................................................................................................................41.2 Hardware Specification .................................................................................................................41.2.1 Card standard............................................................................................................................ 41.2.2 RF Characteristics..................................................................................................................... 41.2.3 Mechanical Specifications......................................................................................................... 51.2.4 Recommended PCB Pad Design (Top View)............................................................................ 61.2.5 Regulation ................................................................................................................................. 71.2.6 Environmental requirements .....................................................................................................72 Software specifications ....................................................................................................82.1 OS Support & Driver.....................................................................................................................82.1.1 Available drivers........................................................................................................................ 82.2 Security............................................................................................................................................82.3 Utility...............................................................................................................................................82.4 Other Feature .................................................................................................................................83 RF Test Results .................................................................................................................94 Packing Information........................................................................................................10Appendix 1. Pin description................................................................................................ 13Appendix 2. Block Diagram ................................................................................................16Appendix 3. Reliability test conditions ..............................................................................17
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 3 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 0 Document 0.1 Declaration This specification is intended for Samsung 11Mbps embedded wireless LAN module. 0.2 Revision History 08/12/2004 Created 03/24/2005 updated Operating Voltage Page 4 updated Recommended pad design Page 6 updated S/W Drivers Page 8 updated Pin Map Page10 04/20/2005 updated Interface Standard Page 4 updated Current consumption Page 4 updated Recommended pad design Page 6 updated Packing Information Page 10~12 updated Interface mode configuration Page 14 04/20/2005 updated Current consumption, RF test results Page 4,9 05/25/2005 updated Pin description and Reliability test conditions Page 13~17
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 4 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 1 Specification for WLAN CF Embedded Module 1.1 Identification 1.Samsung Product name 11Mbps WLAN CF/SDIO Embedded Module 2.Samsung Model name SWL-2455C, SWL-2455SD 3.Samsung Part number TBD 1.2 Hardware Specification 1.2.1 Card standard 1. Interface Standard Compact Flash Specification electrically compliant (SWL-2455C) SDIO Specification electrically compliant (SWL-2455SD) 2. Form Factor Customized Size 3. Operating Voltage VCC : 3.0V ~ 3.3V VCCD : 1.8V ~ 3.3V VDDSHI : 1.8V ~ 3.3V ± 5% 1.2.2 RF Characteristics RF Characteristics Min Typ Max Notes 1. Specification Compliance IEEE 802.11b standard protocol (CSMA/CA) 2. Antenna External single antenna support 3. Frequency Range 2.412Ghz~2.484Ghz 4. TX output power 16dBm (40mW) 5. Current Consumption -Transmit:465mA -Receive:200mA -Standby:1mA Continuous Transmit 6. RX sensitivity - 85dBm Note : Sensitivity is based upon 1024 Bytes frame length, 11 Mbps data rate, 8% PER
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 5 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 1.2.3 Mechanical Specifications 1. Dimension 15㎜×15㎜×1.7㎜ 2. Weight 1g 3. Pin outs 52pin + 8 GND pattern SMT Type 4. Antenna Connector SMT pads (Pin No.51) 1 ↓
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 6 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 1.2.4 Recommended PCB Pad Design (Top View) ● The pattern is symmetrical. ● Refer to Appendix 1 for the pin numbering. Blue patterns are ground patterns and should be a part of main analogue ground plain. Blue patterns are excluded from pin numbering. Place thermal through holes on blue boxes to diffuse heat from the WLAN module.0.875 ●8.35 3.250.875 6.45 0.8758.075 10.475 As for the metal mask, make this hole size 30% of the PCB GND patterns to prevent the module from floating due to extra solders. 0.875 15.003.25 0.5 4.00 0.45 0.8 1.2 0.6 4.00 1.70 0.5 15.001 8 9 13 141819262731323940475248
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 7 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 1.2.5 Regulation 1. Europe Not yet submitted 2. USA,Canada Not yet submitted 3. Others Not yet submitted 1.2.6 Environmental requirements 1. Operating Temperature -10°C ~ +70°C 2. Storage Temperature -20°C ~ +80°C 3. Operating Humidity 0% ~ 90%(RH)
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 8 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 2 Software specifications 2.1 OS Support & Driver 2.1.1 Available drivers [SWL-2455C] - Windows XP(Test purpose Only) - Windows CE.NET 4.2, 5.0 - Pocket PC 2003(SE) and higher - Linux [SWL-2455SD] - Windows CE.NET 5.0 - Pocket PC 2005 and higher - Linux - 2.2 Security - WEP - TKIP,AES - 802.1x - WPA - CCX - WPA2 2.3 Utility - RF TEST TOOL - WLAN status program 2.4 Other Feature - WME
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 9 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 3 RF Test Results Specifications Measured Results General Specifications MIN TYP MAX UNITS TEMP MIN TYP MAX Notes Physical Layer Data Rate 1 Mbps FULL 2 Mbps FULL 5.5 Mbps FULL 11 Mbps FULL Frequency Range 2412 2484 MHz FULL Operating Voltage 3.0 3.3 V FULL Operating Temp Range -10 +70 C FULL Storage Temp Range -20 +80 C FULL Standby Current 1 mA 25C Receiver Sensitivity, 8% PER -85 dBm 25C -85 11Mbps, connected via cable RX Supply Current, with signal 200 mA 25C 201 3.3V, during valid packetRX Supply Current, no signal 185 mA 25C 187 3.3V, no signal applied Transmitter Average Output Power 16 dBm 25C 15.8 3.3V, connected via cableTransmit Spectral Mask -30 dBc 25C -38.1 First side-lobe, 3.3V Transmit Spectral Mask -50 dBc 25C -57.0 Second side-lobe, 3.3V Out band spurious -32 dBm 25C -55.2 TX Supply Current 465 mA 25C 470 3.3V, Continuous TX
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 10 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 4 Packing Information
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 11 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved.  Packing quantity : 1000PCS/reel  Total pocket quantity is 1100PCS including empty pockets.
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 12 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved.  Max storage condition : -40℃ ~ 80℃ ※ Recommended to be kept in room temperature.
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 13 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. Appendix 1. Pin description. * I/O : Digital Input/Output, I : Digital Input, O : Digital Output, A : Analog, PU : Pull up No. Compact Flash SDIO Type Internal Resister Description 1 GND GND Ground Ground 2 D03 NC I/O 100K PU CF : Data line 3 3 D04 NC I/O 100K PU CF : Data line 4 4 D05 NC I/O 100K PU CF : Data line 5 5 D06 NC I/O 100K PU CF : Data line 6 6 D07 NC I/O 100K PU CF : Data line 7 7 CE1# NC I 100K PUCF Card Enable 1, This enables even-numbered address bytes. 8 MOD1 MOD1 I/O Host interface mode configuration 1 This pin is used as configuration to set parameters a following a reset. To set a configuration bit to 0, attach a 100Kohm resister from this pin to ground. No external circuitry is required to set a configuration bit to 1 After reset is completed, this pin is used for AGC output in module 9 OE# SD_CMD I 100K PUCF : Output Enable. It is used to read data from the Card in Memory mode and to read the CIS and configuration registers. SD 1-bit/4-bit mode : Command/Response 10 A09 SD_DAT[2] I 100K PUCF : Address line 9 SD 4-bit mode : Data line bit 2 or Read wait(optional) SD 1-bit mode : Read Wait(optional) SPI mode : Reserved 11 A08 NC I 100K PU CF : Address line 8 12 A07 NC I 100K PU CF : Address line 7 13 VCCD VCCD Power Digital core power 14 A06 NC I 100K PU CF : Address line 6 15 A05 NC I 100K PU CF : Address line 5 16 A04 NC I 100K PU CF : Address line 4 17 A03 NC I 100K PU CF : Address line 3 18 A02 NC I 100K PU CF : Address line 2 19 A01 NC I 100K PU CF : Address line 1 20 A00 NC I 100K PU CF : Address line 0 21 D00 NC I/O 100K PU CF : Data line 0 22 D01 NC I/O 100K PU CF : Data line 1 23 D02 NC I/O 100K PU CF : Data line 2 24 IOIS16# NC O 100K PUCF : I/O mode A low signal indicates that a 16bit or odd byte only operation can be performed at the addressed port 25 BT_PRIORITY BT_PRIORITY I Bluetooth Priority Asserted 1 during local BT RX and TX slots. 26 BT_STATE BT_STATE I Bluetooth State 0 = normal priority, Rx 1 = high priority, Tx
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 14 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. Priority is signaled after BT-PRIORITY has beed asserted. After priority signaling. BT_STATE indicates the Tx/Rx mode of BT radio 27 D11 NC I/O 100K PU CF Data line 11 28 D12 NC I/O 100K PU CF Data line 12 29 D13 NC I/O 100K PU CF Data line 13 30 D14 NC I/O 100K PU CF Data line 14 31 D15 NC I/O 100K PU CF Data line 15 32 CE2# SD_CLK, I 50K PU CF : Card Enable 2, This enables odd-numbered address bytes. SDIO 1-bit/4-bit mode : Clock SPI mode : Clock 33 WL_ACTIVE WL_ACTIVE O 50K PUWL_ACTIVE Transmission Confirmation to BT, active low signal. 0 = BT can transmit. Once asserted, it stays asserted until the BT device completes the transmission. Once allowed to transmit, BT device cannot stop in the middle of a packet. If asserted during BT transmission slot so that the Tx has not been started, the BT module shall not active the transmitter during the rest of the Tx period. Note : In WLAN Sleep mode, all I/O PADs are powered down. This PAD must stay at a low state even in power down mode. 34 IORD# SD_DAT[1] I 100K PUCF : I/O Read strobe SDIO 4-bit mode : Data line bit 1 SDIO 1-bit mode : Interrupt SPI mode : Reserved 35 IOWR# SD_DAT[3] I 50K PUCF : I/O Write strobe SDIO 4-bit mode : Data line bit 3 SDIO 1-bit mode : Reserved SPI mode : Card Select 36 WE# NC I 100K PU CF : Write enable 37 IREQ# NC O 100K PU CF : Interrupt Request 38 VCC VCC Power Power 39 PD# PD# I 200K PU Full power down 40 MOD2 MOD2 I/O Host interface mode configuration. This pin is used as configuration to set parameters a following a reset. To set a configuration bit to 0, attach a 100Kohm resister from this pin to ground. No external circuitry is required to set a configuration bit to 1 After reset is completed, this pin is used for AGC output in module 41 RESET RESET I 100K PU RESET, active high 42 WAIT# NC O 100K PUCF : Wait signal This is driven low by CF module to signal the host to delay completion of a momory or I/O cycle that is in progress 43 INPACK# NC O 100K PU CF : Input Acknowledge signal 44 REG# NC I 100K PUCF : REG This signal is used during Attribute memory accesses or I/O accesses. 45 LED_OUT# LED_OUT# I/O 200K PUGPIO for LED Blinking : AP scanning ON (Low): Link 46 VDDSHI VDDSHI Power This power supplies power to the IO cells.
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 15 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. 47 D08 NC I/O 100K PU CF Data line 8 48 D09 NC I/O 100K PU CF Data line 9 49 D10 NC I/O 100K PU CF Data line 10 50 GND GND Ground Ground 51 RF_INOUT RF_INOUT A RF Input/Output 52 NC SD_DAT[0] I/O 100K PUSDIO 4-bit mode : Data line bit 0 SDIO 1-bit mode : Data line SPI mode : Data output * ‘#’ means that the signal is low active. * VCCD power voltage range is from 1.8V to 3.3V. Its current consumption has no relation with its voltage. It means that the lower the input voltage is the smaller power it consumes. It may be tied to the VCC, if you want to use the same voltage for both power inputs. * VDDSHI : Digital I/O Power Supply. When using CF interface, this pin must be connected to same supply as VCC. When using SDIO, this pin can be between 1.8 and 3.3V depending on the host interface I/O supply * PD# signal in CF interface is not matched with CF standard pin outs. This signal replaced the CSEL# signal in CF specification, and is used to set the full power down state. When this signal is connected to 0V, the module will be set to the full power down state. If you don’t use this function, just connect this pin to the main power. * LED_OUT# signal in CF interface is not matched with CF standard pin outs. This signal replaced the SPKR signal in CF specification, and is used to control the external LED. This signal is low active. * Pin No.25,26,33 are for the Bluetooth co-existence interface. If you connect these to the Bluetooth correctly, WLAN and Bluetooth will not conflict each other. * NC pins are used for test procedure or reserved for future use. These signal replaced the unused signals in CF specification. Just leave them unconnected. Connect CD1, CD2, VS1 from CF host to GND and leave VS2, SPKR, CSEL, STSCHG, A10 from CF host unconnected. * Host Interface mode configuration 2455 MOD1 MOD2 CF No connect Connect 100K ohm Pull down SDIO Connect 100K ohm Pull down No connect
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 16 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. Appendix 2. Block Diagram
Data Sheet Doc no: BB-WLAN2455-01 Version 0.4 Date: 05.25.2005 Page : 17 / 17 © Copyright Samsung Electro-Mechanics. All rights reserved. Appendix 3. Reliability test conditions Test Item Condition ●Environmental Test Normal Temperature Stability Test 24℃, 4Hr (FTP Server Get/Put 30Mbyte) High Temperature Operating Test 80℃, 48Hr (FTP Server Get/Put 30Mbyte) Low Temperature Operating -20℃, 48Hr (FTP Server Get/Put 30Mbyte) High Temperature Storage Test 110℃, 120Hr, Recovery Time 2Hr Low Temperature Storage Test -40℃, 120Hr, Recovery Time 2Hr High Temp./Humidity Storage Test 85℃, 85%RH, 120Hr, Recovery Time 4Hr Thermal Shock Storage Test -40℃/30min↔110℃/30min, 50Cycle, Recovery Time 4Hr Pressure Cooker Test 121℃, 100%RH, 2Kf/㎠, 24Hr, Recovery Time 24Hr ●Mechanical Test Vibration Test Random:20~2000Hz, PSD 0.053g²/Hz, X,Y,Z 15min/direction Module:152Cm, Steel floor, 12times, Free Drop Drop Test Jig:120Cm(12times), 152Cm(19times) Total 31times Free Drop ●Electrical Test ESD Test HBM Class 1A :100pF, 1500Ω, ±500V,Contact/Air 3times ●Packing Distribution Test Packing Vibration 5~55Hz, Amplitude:1m(p-p) X,Y,Z Each Axis/1Hr Packing Drop 150Cm, 1Corner, 3edges, 6faces 1times Drop Total 15 Items TEST

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