Acer orporated N300 PDA with WLAN and Bluetooth User Manual

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 1 / 17

DATE OF ISSUE : 05 / 25 / 2005

DATA SHEET

RF Division WLAN R&D G.

WRITTEN CHECKED APPROVED

Jeonho Lee Yong-Min Jung Eon Hwang

CUSTOMER

PRODUCT NAME Embedded Wireless LAN Module

MODEL NAME SWL-2455C, SWL-2455SD

Part Number

ISSUED BY CHECKED BY APPROVED BY

Head Office & Sales Dept.

314, Maetan-3Dong, Yeongtong-Gu

Suwon, Kyunggi-Do, Korea

TEL : +82 (0)31 210 6903

FAX : +82 (0)31 300 7900

Homepage : http://www.sem.samsung.com

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 2 / 17

Contents

0 Document...........................................................................................................................3

0.1 Declaration......................................................................................................................................3

0.2 Revision History .............................................................................................................................3

1 Specification for WLAN CF Embedded Module ..............................................................4

1.1 Identification...................................................................................................................................4

1.2 Hardware Specification .................................................................................................................4

1.2.1 Card standard............................................................................................................................ 4

1.2.2 RF Characteristics..................................................................................................................... 4

1.2.3 Mechanical Specifications......................................................................................................... 5

1.2.4 Recommended PCB Pad Design (Top View)............................................................................ 6

1.2.5 Regulation ................................................................................................................................. 7

1.2.6 Environmental requirements .....................................................................................................7

2 Software specifications ....................................................................................................8

2.1 OS Support & Driver.....................................................................................................................8

2.1.1 Available drivers........................................................................................................................ 8

2.2 Security............................................................................................................................................8

2.3 Utility...............................................................................................................................................8

2.4 Other Feature .................................................................................................................................8

3 RF Test Results .................................................................................................................9

4 Packing Information........................................................................................................10

Appendix 1. Pin description................................................................................................ 13

Appendix 2. Block Diagram ................................................................................................16

Appendix 3. Reliability test conditions ..............................................................................17

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 3 / 17

0 Document

0.1 Declaration

This specification is intended for Samsung 11Mbps embedded wireless LAN module.

0.2 Revision History

08/12/2004 Created

03/24/2005 updated Operating Voltage Page 4

updated Recommended pad design Page 6

updated S/W Drivers Page 8

updated Pin Map Page10

04/20/2005 updated Interface Standard Page 4

updated Current consumption Page 4

updated Recommended pad design Page 6

updated Packing Information Page 10~12

updated Interface mode configuration Page 14

04/20/2005 updated Current consumption, RF test results Page 4,9

05/25/2005 updated Pin description and Reliability test conditions Page 13~17

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 4 / 17

1 Specification for WLAN CF Embedded Module

1.1 Identification

1.Samsung Product name 11Mbps WLAN CF/SDIO Embedded Module

2.Samsung Model name SWL-2455C, SWL-2455SD

3.Samsung Part number TBD

1.2 Hardware Specification

1.2.1 Card standard

1. Interface Standard Compact Flash Specification electrically compliant (SWL-2455C)

SDIO Specification electrically compliant (SWL-2455SD)

2. Form Factor Customized Size

3. Operating Voltage

VCC : 3.0V ~ 3.3V

VCCD : 1.8V ~ 3.3V

VDDSHI : 1.8V ~ 3.3V ± 5%

1.2.2 RF Characteristics

RF Characteristics Min Typ Max Notes

1. Specification

Compliance IEEE 802.11b standard protocol (CSMA/CA)

2. Antenna External single antenna support

3. Frequency Range 2.412Ghz~2.484Ghz

4. TX output power 16dBm (40mW)

5. Current Consumption

-Transmit:465mA

-Receive:200mA

-Standby:1mA

Continuous

Transmit

6. RX sensitivity - 85dBm

Note : Sensitivity is based upon 1024 Bytes frame length, 11 Mbps data rate, 8% PER

Data Sheet Doc no: BB-WLAN2455-01

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1.2.3 Mechanical Specifications

1. Dimension 15㎜×15㎜×1.7㎜

2. Weight 1g

3. Pin outs 52pin + 8 GND pattern SMT Type

4. Antenna Connector SMT pads (Pin No.51)

1

↓

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 6 / 17

1.2.4 Recommended PCB Pad Design (Top View)

● The pattern is symmetrical.

● Refer to Appendix 1 for the pin numbering. Blue patterns are ground patterns and should be a part of main analogue

ground plain. Blue patterns are excluded from pin numbering. Place thermal through holes on blue boxes to diffuse

heat from the WLAN module.

0.875

●

8.35 3.25

0.875 6.45 0.875

8.075

10.475

As for the metal mask, make this hole size 30% of the PCB

GND patterns to prevent the module from floating due to extra solders.

0.875

15.00

3.25 0.5

4.00

0.45 0.8

1.2 0.6

4.00 1.70

0.5 15.00

1

8

9

13

14

18

19

26

27

31

32

39

40

47

52

48

Data Sheet Doc no: BB-WLAN2455-01

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1.2.5 Regulation

1. Europe Not yet submitted

2. USA,Canada Not yet submitted

3. Others Not yet submitted

1.2.6 Environmental requirements

1. Operating Temperature -10°C ~ +70°C

2. Storage Temperature -20°C ~ +80°C

3. Operating Humidity 0% ~ 90%(RH)

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 8 / 17

2 Software specifications

2.1 OS Support & Driver

2.1.1 Available drivers

[SWL-2455C]

- Windows XP(Test purpose Only)

- Windows CE.NET 4.2, 5.0

- Pocket PC 2003(SE) and higher

- Linux

[SWL-2455SD]

- Windows CE.NET 5.0

- Pocket PC 2005 and higher

- Linux

-

2.2 Security

- WEP

- TKIP,AES

- 802.1x

- WPA

- CCX

- WPA2

2.3 Utility

- RF TEST TOOL

- WLAN status program

2.4 Other Feature

- WME

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 9 / 17

3 RF Test Results

Specifications Measured Results

General Specifications

MIN TYP MAX UNITS TEMP MIN TYP MAX

Notes

Physical Layer Data Rate 1 Mbps FULL

2 Mbps FULL

5.5 Mbps FULL

11 Mbps FULL

Frequency Range 2412 2484 MHz FULL

Operating Voltage 3.0 3.3 V FULL

Operating Temp Range -10 +70 C FULL

Storage Temp Range -20 +80 C FULL

Standby Current 1 mA 25C

Receiver

Sensitivity, 8% PER -85 dBm 25C -85 11Mbps, connected via cable

RX Supply Current,

with signal 200 mA 25C 201 3.3V, during valid packet

RX Supply Current,

no signal 185 mA 25C 187 3.3V, no signal applied

Transmitter

Average Output Power 16 dBm 25C 15.8 3.3V, connected via cable

Transmit Spectral Mask -30 dBc 25C -38.1 First side-lobe, 3.3V

Transmit Spectral Mask -50 dBc 25C -57.0 Second side-lobe, 3.3V

Out band spurious -32 dBm 25C -55.2

TX Supply Current 465 mA 25C 470 3.3V, Continuous TX

Data Sheet Doc no: BB-WLAN2455-01

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4 Packing Information

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 11 / 17

 Packing quantity : 1000PCS/reel

 Total pocket quantity is 1100PCS including empty pockets.

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 12 / 17

 Max storage condition : -40℃ ~ 80℃

※ Recommended to be kept in room temperature.

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 13 / 17

Appendix 1. Pin description.

* I/O : Digital Input/Output, I : Digital Input, O : Digital Output, A : Analog, PU : Pull up

No. Compact Flash SDIO Type Internal

Resister Description

1 GND GND Ground Ground

2 D03 NC I/O 100K PU CF : Data line 3

3 D04 NC I/O 100K PU CF : Data line 4

4 D05 NC I/O 100K PU CF : Data line 5

5 D06 NC I/O 100K PU CF : Data line 6

6 D07 NC I/O 100K PU CF : Data line 7

7 CE1# NC I 100K PU

CF Card Enable 1,

This enables even-numbered address bytes.

8 MOD1 MOD1 I/O

Host interface mode configuration 1

This pin is used as configuration to set parameters a

following a reset. To set a configuration bit to 0, attach a

100Kohm resister from this pin to ground. No external

circuitry is required to set a configuration bit to 1

After reset is completed, this pin is used for AGC output

in module

9 OE# SD_CMD I 100K PU

CF : Output Enable. It is used to read data from the Card

in Memory mode and to read the CIS and configuration

registers.

SD 1-bit/4-bit mode : Command/Response

10 A09 SD_DAT[2] I 100K PU

CF : Address line 9

SD 4-bit mode : Data line bit 2 or Read wait(optional)

SD 1-bit mode : Read Wait(optional)

SPI mode : Reserved

11 A08 NC I 100K PU CF : Address line 8

12 A07 NC I 100K PU CF : Address line 7

13 VCCD VCCD Power Digital core power

14 A06 NC I 100K PU CF : Address line 6

15 A05 NC I 100K PU CF : Address line 5

16 A04 NC I 100K PU CF : Address line 4

17 A03 NC I 100K PU CF : Address line 3

18 A02 NC I 100K PU CF : Address line 2

19 A01 NC I 100K PU CF : Address line 1

20 A00 NC I 100K PU CF : Address line 0

21 D00 NC I/O 100K PU CF : Data line 0

22 D01 NC I/O 100K PU CF : Data line 1

23 D02 NC I/O 100K PU CF : Data line 2

24 IOIS16# NC O 100K PU

CF : I/O mode

A low signal indicates that a 16bit or odd byte only

operation can be performed at the addressed port

25 BT_PRIORITY BT_PRIORITY I

Bluetooth Priority

Asserted 1 during local BT RX and TX slots.

26 BT_STATE BT_STATE I

Bluetooth State

0 = normal priority, Rx

1 = high priority, Tx

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 14 / 17

Priority is signaled after BT-PRIORITY has beed

asserted. After priority signaling. BT_STATE indicates

the Tx/Rx mode of BT radio

27 D11 NC I/O 100K PU CF Data line 11

28 D12 NC I/O 100K PU CF Data line 12

29 D13 NC I/O 100K PU CF Data line 13

30 D14 NC I/O 100K PU CF Data line 14

31 D15 NC I/O 100K PU CF Data line 15

32 CE2# SD_CLK, I 50K PU

CF : Card Enable 2,

This enables odd-numbered address bytes.

SDIO 1-bit/4-bit mode : Clock

SPI mode : Clock

33 WL_ACTIVE WL_ACTIVE O 50K PU

WL_ACTIVE

Transmission Confirmation to BT, active low signal. 0

= BT can transmit. Once asserted, it stays asserted until

the BT device completes the transmission. Once allowed

to transmit, BT device cannot stop in the middle of a

packet. If asserted during BT transmission slot so that the

Tx has not been started, the BT module shall not active

the transmitter during the rest of the Tx period.

Note : In WLAN Sleep mode, all I/O PADs are powered

down. This PAD must stay at a low state even in power

down mode.

34 IORD# SD_DAT[1] I 100K PU

CF : I/O Read strobe

SDIO 4-bit mode : Data line bit 1

SDIO 1-bit mode : Interrupt

SPI mode : Reserved

35 IOWR# SD_DAT[3] I 50K PU

CF : I/O Write strobe

SDIO 4-bit mode : Data line bit 3

SDIO 1-bit mode : Reserved

SPI mode : Card Select

36 WE# NC I 100K PU CF : Write enable

37 IREQ# NC O 100K PU CF : Interrupt Request

38 VCC VCC Power Power

39 PD# PD# I 200K PU Full power down

40 MOD2 MOD2 I/O

Host interface mode configuration.

This pin is used as configuration to set parameters a

following a reset. To set a configuration bit to 0, attach a

100Kohm resister from this pin to ground. No external

circuitry is required to set a configuration bit to 1

After reset is completed, this pin is used for AGC output

in module

41 RESET RESET I 100K PU RESET, active high

42 WAIT# NC O 100K PU

CF : Wait signal

This is driven low by CF module to signal the host to

delay completion of a momory or I/O cycle that is in

progress

43 INPACK# NC O 100K PU CF : Input Acknowledge signal

44 REG# NC I 100K PU

CF : REG

This signal is used during Attribute memory accesses or

I/O accesses.

45 LED_OUT# LED_OUT# I/O 200K PU

GPIO for LED

Blinking : AP scanning

ON (Low): Link

46 VDDSHI VDDSHI Power This power supplies power to the IO cells.

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 15 / 17

47 D08 NC I/O 100K PU CF Data line 8

48 D09 NC I/O 100K PU CF Data line 9

49 D10 NC I/O 100K PU CF Data line 10

50 GND GND Ground Ground

51 RF_INOUT RF_INOUT A RF Input/Output

52 NC SD_DAT[0] I/O 100K PU

SDIO 4-bit mode : Data line bit 0

SDIO 1-bit mode : Data line

SPI mode : Data output

* ‘#’ means that the signal is low active.

* VCCD power voltage range is from 1.8V to 3.3V. Its current consumption has no relation with its voltage. It

means that the lower the input voltage is the smaller power it consumes. It may be tied to the VCC, if you want

to use the same voltage for both power inputs.

* VDDSHI : Digital I/O Power Supply. When using CF interface, this pin must be connected to same supply as

VCC. When using SDIO, this pin can be between 1.8 and 3.3V depending on the host interface I/O supply

* PD# signal in CF interface is not matched with CF standard pin outs. This signal replaced the CSEL# signal in

CF specification, and is used to set the full power down state. When this signal is connected to 0V, the module

will be set to the full power down state. If you don’t use this function, just connect this pin to the main power.

* LED_OUT# signal in CF interface is not matched with CF standard pin outs. This signal replaced the SPKR

signal in CF specification, and is used to control the external LED. This signal is low active.

* Pin No.25,26,33 are for the Bluetooth co-existence interface. If you connect these to the Bluetooth correctly,

WLAN and Bluetooth will not conflict each other.

* NC pins are used for test procedure or reserved for future use. These signal replaced the unused signals in CF

specification. Just leave them unconnected. Connect CD1, CD2, VS1 from CF host to GND and leave VS2,

SPKR, CSEL, STSCHG, A10 from CF host unconnected.

* Host Interface mode configuration

2455 MOD1 MOD2

CF No connect Connect 100K ohm Pull down

SDIO Connect 100K ohm Pull down No connect

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 16 / 17

Appendix 2. Block Diagram

Data Sheet Doc no: BB-WLAN2455-01

Version 0.4 Date: 05.25.2005 Page : 17 / 17

Appendix 3. Reliability test conditions

Test Item Condition

●Environmental Test

Normal Temperature

Stability Test 24℃, 4Hr (FTP Server Get/Put 30Mbyte)

High Temperature

Operating Test 80℃, 48Hr (FTP Server Get/Put 30Mbyte)

Low Temperature

Operating -20℃, 48Hr (FTP Server Get/Put 30Mbyte)

High Temperature

Storage Test 110℃, 120Hr, Recovery Time 2Hr

Low Temperature

Storage Test -40℃, 120Hr, Recovery Time 2Hr

High Temp./Humidity

Storage Test 85℃, 85%RH, 120Hr, Recovery Time 4Hr

Thermal Shock

Storage Test -40℃/30min↔110℃/30min, 50Cycle, Recovery Time 4Hr

Pressure Cooker Test 121℃, 100%RH, 2Kf/㎠, 24Hr, Recovery Time 24Hr

●Mechanical Test

Vibration Test Random:20~2000Hz, PSD 0.053g²/Hz, X,Y,Z 15min/direction

Module:152Cm, Steel floor, 12times, Free Drop

Drop Test

Jig:120Cm(12times), 152Cm(19times) Total 31times Free Drop

●Electrical Test

ESD Test HBM Class 1A :100pF, 1500Ω, ±500V,Contact/Air 3times

●Packing Distribution Test

Packing Vibration 5~55Hz, Amplitude:1m(p-p) X,Y,Z Each Axis/1Hr

Packing Drop 150Cm, 1Corner, 3edges, 6faces 1times Drop

Total 15 Items TEST

Acer orporated N300 PDA with WLAN and Bluetooth User Manual

Acer Incorporated PDA with WLAN and Bluetooth

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