Acer orporated N300 PDA with WLAN and Bluetooth User Manual

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Document ID	600226
Application ID	UUlj7n/uhcf3AdcsuP4ATg==
Document Description	WLAN manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	50.65kB (633156 bits)
Date Submitted	2005-11-07 00:00:00
Date Available	2005-11-07 00:00:00
Creation Date	2005-05-25 19:08:43
Producing Software	Acrobat Distiller 6.0 (Windows)
Document Lastmod	2005-10-27 11:48:46
Document Title	untitled

Data Sheet
Doc no: BB-WLAN2455-01
DATE OF ISSUE : 05 / 25 / 2005
RF Division WLAN R&D G.
WRITTEN
CHECKED
APPROVED
Jeonho Lee
Yong-Min Jung
Eon Hwang
DATA SHEET
CUSTOMER
PRODUCT NAME
Embedded Wireless LAN Module
MODEL NAME
SWL-2455C, SWL-2455SD
Part Number
ISSUED BY
CHECKED BY
APPROVED BY
Head Office & Sales Dept.
314, Maetan-3Dong, Yeongtong-Gu
Suwon, Kyunggi-Do, Korea
TEL : +82 (0)31 210 6903
FAX : +82 (0)31 300 7900
Homepage : http://www.sem.samsung.com
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 1 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Contents
0 Document ........................................................................................................................... 3
0.1 Declaration......................................................................................................................................3
0.2 Revision History .............................................................................................................................3
1 Specification for WLAN CF Embedded Module .............................................................. 4
1.1 Identification...................................................................................................................................4
1.2 Hardware Specification .................................................................................................................4
1.2.1
1.2.2
1.2.3
1.2.4
1.2.5
1.2.6
Card standard............................................................................................................................ 4
RF Characteristics..................................................................................................................... 4
Mechanical Specifications ......................................................................................................... 5
Recommended PCB Pad Design (Top View)............................................................................ 6
Regulation ................................................................................................................................. 7
Environmental requirements ..................................................................................................... 7
2 Software specifications .................................................................................................... 8
2.1 OS Support & Driver.....................................................................................................................8
2.1.1
Available drivers ........................................................................................................................ 8
2.2 Security............................................................................................................................................8
2.3 Utility...............................................................................................................................................8
2.4 Other Feature .................................................................................................................................8
3 RF Test Results ................................................................................................................. 9
4 Packing Information ........................................................................................................ 10
Appendix 1. Pin description................................................................................................ 13
Appendix 2. Block Diagram ................................................................................................ 16
Appendix 3. Reliability test conditions .............................................................................. 17
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 2 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Document
0.1 Declaration
This specification is intended for Samsung 11Mbps embedded wireless LAN module.
0.2 Revision History
08/12/2004
03/24/2005
04/20/2005
04/20/2005
05/25/2005
Version 0.4
Created
updated Operating Voltage
updated Recommended pad design
updated S/W Drivers
updated Pin Map
updated Interface Standard
updated Current consumption
updated Recommended pad design
updated Packing Information
updated Interface mode configuration
updated Current consumption, RF test results
updated Pin description and Reliability test conditions
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page 4
Page 6
Page 8
Page10
Page 4
Page 4
Page 6
Page 10~12
Page 14
Page 4,9
Page 13~17
Page : 3 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Specification for WLAN CF Embedded Module
1.1 Identification
1.Samsung Product name
11Mbps WLAN CF/SDIO Embedded Module
2.Samsung Model name
SWL-2455C, SWL-2455SD
3.Samsung Part number
TBD
1.2 Hardware Specification
1.2.1
Card standard
Compact Flash Specification electrically compliant (SWL-2455C)
SDIO Specification electrically compliant (SWL-2455SD)
1. Interface Standard
2. Form Factor
Customized Size
VCC : 3.0V ~ 3.3V
VCCD : 1.8V ~ 3.3V
VDDSHI : 1.8V ~ 3.3V ± 5%
3. Operating Voltage
1.2.2
RF Characteristics
RF Characteristics
Min
Typ
1. Specification
Compliance
IEEE 802.11b standard protocol (CSMA/CA)
2. Antenna
External single antenna support
3. Frequency Range
2.412Ghz~2.484Ghz
4. TX output power
Max
Notes
16dBm (40mW)
5. Current Consumption
6. RX sensitivity
-Transmit:465mA
-Receive:200mA
-Standby:1mA
Continuous
Transmit
- 85dBm
Note : Sensitivity is based upon 1024 Bytes frame length, 11 Mbps data rate, 8% PER
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 4 / 17
Data Sheet
1.2.3
Doc no: BB-WLAN2455-01
Mechanical Specifications
1. Dimension
2. Weight
3. Pin outs
4. Antenna Connector
15㎜×15㎜×1.7㎜
1g
52pin + 8 GND pattern SMT Type
SMT pads (Pin No.51)
↓
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 5 / 17
Data Sheet
1.2.4
Doc no: BB-WLAN2455-01
Recommended PCB Pad Design (Top View)
● The pattern is symmetrical.
● Refer to Appendix 1 for the pin numbering. Blue patterns are ground patterns and should be a part of main analogue
ground plain. Blue patterns are excluded from pin numbering. Place thermal through holes on blue boxes to diffuse
heat from the WLAN module.
0.45 0.8
8.075
1.2
0.875
0.875
●
0.6
6.45
0.875
48
52
4.00
47
40
39
1.70
3.25
0.5
4.00
8.35
3.25
32
0.5
15.00
10.475
31
As for the metal mask, make this hole size 30% of the PCB
GND patterns to prevent the module from floating due to extra solders.
13
0.875
14
27
18
19
26
15.00
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 6 / 17
Data Sheet
1.2.5
Regulation
1. Europe
Not yet submitted
2. USA,Canada
Not yet submitted
3. Others
Not yet submitted
1.2.6
Doc no: BB-WLAN2455-01
Environmental requirements
1. Operating Temperature
-10°C ~ +70°C
2. Storage Temperature
-20°C ~ +80°C
3. Operating Humidity
0% ~ 90%(RH)
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 7 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Software specifications
2.1 OS Support & Driver
2.1.1
Available drivers
[SWL-2455C]
- Windows XP(Test purpose Only)
- Windows CE.NET 4.2, 5.0
- Pocket PC 2003(SE) and higher
- Linux
[SWL-2455SD]
- Windows CE.NET 5.0
- Pocket PC 2005 and higher
- Linux
2.2 Security
- WEP
- TKIP,AES
- 802.1x
- WPA
- CCX
- WPA2
2.3 Utility
- RF TEST TOOL
- WLAN status program
2.4 Other Feature
- WME
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 8 / 17
Data Sheet
Doc no: BB-WLAN2455-01
RF Test Results
Specifications
General Specifications
MIN
Physical Layer Data Rate
Frequency Range
Operating Voltage
Operating Temp Range
Storage Temp Range
Standby Current
Receiver
Sensitivity, 8% PER
RX Supply Current,
with signal
RX Supply Current,
no signal
TYP
Measured Results
UNITS
TEMP
2484
3.3
+70
+80
Mbps
Mbps
Mbps
Mbps
MHz
mA
FULL
FULL
FULL
FULL
FULL
FULL
FULL
FULL
25C
-85
dBm
25C
-85
11Mbps, connected via cable
200
mA
25C
201
3.3V, during valid packet
185
mA
25C
187
3.3V, no signal applied
16
dBm
dBc
dBc
dBm
mA
25C
25C
25C
25C
25C
15.8
-38.1
-57.0
-55.2
470
3.3V, connected via cable
First side-lobe, 3.3V
Second side-lobe, 3.3V
5.5
11
2412
3.0
-10
-20
MIN
TYP
Notes
MAX
MAX
Transmitter
Average Output Power
Transmit Spectral Mask
Transmit Spectral Mask
Out band spurious
TX Supply Current
Version 0.4
-30
-50
-32
465
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
3.3V, Continuous TX
Page : 9 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Packing Information
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 10 / 17
Data Sheet
Doc no: BB-WLAN2455-01
„ Packing quantity : 1000PCS/reel
„ Total pocket quantity is 1100PCS including empty pockets.
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 11 / 17
Data Sheet
Doc no: BB-WLAN2455-01
‹ Max storage condition : -40℃ ~ 80℃
※ Recommended to be kept in room temperature.
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 12 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Appendix 1. Pin description.
* I/O : Digital Input/Output, I : Digital Input, O : Digital Output, A : Analog, PU : Pull up
No. Compact Flash
SDIO
Type Internal
Description
Resister
GND
GND
Ground
Ground
D03
NC
I/O
100K PU CF : Data line 3
D04
NC
I/O
100K PU CF : Data line 4
D05
NC
I/O
100K PU CF : Data line 5
D06
NC
I/O
100K PU CF : Data line 6
D07
NC
I/O
CE1#
NC
MOD1
MOD1
I/O
OE#
SD_CMD
100K PU CF : Data line 7
CF Card Enable 1,
100K PU This enables even-numbered address bytes.
Host interface mode configuration 1
This pin is used as configuration to set parameters a
following a reset. To set a configuration bit to 0, attach a
100Kohm resister from this pin to ground. No external
circuitry is required to set a configuration bit to 1
After reset is completed, this pin is used for AGC output
in module
CF : Output Enable. It is used to read data from the Card
in Memory mode and to read the CIS and configuration
100K PU registers.
SD 1-bit/4-bit mode : Command/Response
10
A09
SD_DAT[2]
100K PU
11
12
13
14
15
16
17
18
19
20
21
22
23
A08
A07
VCCD
A06
A05
A04
A03
A02
A01
A00
D00
D01
D02
NC
NC
VCCD
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Power
I/O
I/O
I/O
100K PU
100K PU
24
IOIS16#
NC
100K PU
25 BT_PRIORITY BT_PRIORITY
26
BT_STATE
Version 0.4
BT_STATE
100K PU
100K PU
100K PU
100K PU
100K PU
100K PU
100K PU
100K PU
100K PU
100K PU
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
CF : Address line 9
SD 4-bit mode : Data line bit 2 or Read wait(optional)
SD 1-bit mode : Read Wait(optional)
SPI mode : Reserved
CF : Address line 8
CF : Address line 7
Digital core power
CF : Address line 6
CF : Address line 5
CF : Address line 4
CF : Address line 3
CF : Address line 2
CF : Address line 1
CF : Address line 0
CF : Data line 0
CF : Data line 1
CF : Data line 2
CF : I/O mode
A low signal indicates that a 16bit or odd byte only
operation can be performed at the addressed port
Bluetooth Priority
Asserted 1 during local BT RX and TX slots.
Bluetooth State
0 = normal priority, Rx
1 = high priority, Tx
Page : 13 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Priority is signaled after BT-PRIORITY has beed
asserted. After priority signaling. BT_STATE indicates
the Tx/Rx mode of BT radio
27
28
29
30
31
D11
D12
D13
D14
D15
NC
NC
NC
NC
NC
I/O
I/O
I/O
I/O
I/O
100K PU
100K PU
100K PU
100K PU
100K PU
32
CE2#
SD_CLK,
50K PU
33 WL_ACTIVE
WL_ACTIVE
50K PU
34
IORD#
SD_DAT[1]
100K PU
35
IOWR#
SD_DAT[3]
50K PU
36
37
38
39
WE#
IREQ#
VCC
PD#
NC
NC
VCC
PD#
40
MOD2
MOD2
I/O
41
RESET
RESET
100K PU
42
WAIT#
NC
100K PU
43
INPACK#
NC
100K PU
44
REG#
NC
100K PU
45
LED_OUT#
LED_OUT#
I/O
200K PU
46
VDDSHI
VDDSHI
Power
Version 0.4
100K PU
100K PU
Power
200K PU
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
CF Data line 11
CF Data line 12
CF Data line 13
CF Data line 14
CF Data line 15
CF : Card Enable 2,
This enables odd-numbered address bytes.
SDIO 1-bit/4-bit mode : Clock
SPI mode : Clock
WL_ACTIVE
Transmission Confirmation to BT, active low signal. 0
= BT can transmit. Once asserted, it stays asserted until
the BT device completes the transmission. Once allowed
to transmit, BT device cannot stop in the middle of a
packet. If asserted during BT transmission slot so that the
Tx has not been started, the BT module shall not active
the transmitter during the rest of the Tx period.
Note : In WLAN Sleep mode, all I/O PADs are powered
down. This PAD must stay at a low state even in power
down mode.
CF : I/O Read strobe
SDIO 4-bit mode : Data line bit 1
SDIO 1-bit mode : Interrupt
SPI mode : Reserved
CF : I/O Write strobe
SDIO 4-bit mode : Data line bit 3
SDIO 1-bit mode : Reserved
SPI mode : Card Select
CF : Write enable
CF : Interrupt Request
Power
Full power down
Host interface mode configuration.
This pin is used as configuration to set parameters a
following a reset. To set a configuration bit to 0, attach a
100Kohm resister from this pin to ground. No external
circuitry is required to set a configuration bit to 1
After reset is completed, this pin is used for AGC output
in module
RESET, active high
CF : Wait signal
This is driven low by CF module to signal the host to
delay completion of a momory or I/O cycle that is in
progress
CF : Input Acknowledge signal
CF : REG
This signal is used during Attribute memory accesses or
I/O accesses.
GPIO for LED
Blinking : AP scanning
ON (Low): Link
This power supplies power to the IO cells.
Page : 14 / 17
Data Sheet
47
48
49
50
51
D08
D09
D10
GND
RF_INOUT
NC
NC
NC
GND
RF_INOUT
52
NC
SD_DAT[0]
Doc no: BB-WLAN2455-01
I/O
100K PU CF Data line 8
I/O
100K PU CF Data line 9
I/O
100K PU CF Data line 10
Ground
Ground
RF Input/Output
SDIO 4-bit mode : Data line bit 0
I/O
100K PU SDIO 1-bit mode : Data line
SPI mode : Data output
* ‘#’ means that the signal is low active.
* VCCD power voltage range is from 1.8V to 3.3V. Its current consumption has no relation with its voltage. It
means that the lower the input voltage is the smaller power it consumes. It may be tied to the VCC, if you want
to use the same voltage for both power inputs.
* VDDSHI : Digital I/O Power Supply. When using CF interface, this pin must be connected to same supply as
VCC. When using SDIO, this pin can be between 1.8 and 3.3V depending on the host interface I/O supply
* PD# signal in CF interface is not matched with CF standard pin outs. This signal replaced the CSEL# signal in
CF specification, and is used to set the full power down state. When this signal is connected to 0V, the module
will be set to the full power down state. If you don’t use this function, just connect this pin to the main power.
* LED_OUT# signal in CF interface is not matched with CF standard pin outs. This signal replaced the SPKR
signal in CF specification, and is used to control the external LED. This signal is low active.
* Pin No.25,26,33 are for the Bluetooth co-existence interface. If you connect these to the Bluetooth correctly,
WLAN and Bluetooth will not conflict each other.
* NC pins are used for test procedure or reserved for future use. These signal replaced the unused signals in CF
specification. Just leave them unconnected. Connect CD1, CD2, VS1 from CF host to GND and leave VS2,
SPKR, CSEL, STSCHG, A10 from CF host unconnected.
* Host Interface mode configuration
2455
MOD1
MOD2
CF
No connect
Connect 100K ohm Pull down
SDIO
Connect 100K ohm Pull down
No connect
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 15 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Appendix 2. Block Diagram
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 16 / 17
Data Sheet
Doc no: BB-WLAN2455-01
Appendix 3. Reliability test conditions
Test Item
Condition
●Environmental Test
Normal Temperature
Stability Test
24℃, 4Hr (FTP Server Get/Put 30Mbyte)
High Temperature
Operating Test
80℃, 48Hr (FTP Server Get/Put 30Mbyte)
Low Temperature
Operating
-20℃, 48Hr (FTP Server Get/Put 30Mbyte)
High Temperature
Storage Test
110℃, 120Hr, Recovery Time 2Hr
Low Temperature
Storage Test
-40℃, 120Hr, Recovery Time 2Hr
High Temp./Humidity
Storage Test
Thermal Shock
Storage Test
Pressure Cooker Test
85℃, 85%RH, 120Hr, Recovery Time 4Hr
-40℃/30min↔110℃/30min, 50Cycle, Recovery Time 4Hr
121℃, 100%RH, 2Kf/㎠, 24Hr, Recovery Time 24Hr
●Mechanical Test
Vibration Test
Random:20~2000Hz, PSD 0.053g²/Hz, X,Y,Z 15min/direction
Module:152Cm, Steel floor, 12times, Free Drop
Drop Test
Jig:120Cm(12times), 152Cm(19times) Total 31times Free Drop
●Electrical Test
ESD Test
HBM Class 1A :100pF, 1500Ω, ±500V,Contact/Air 3times
●Packing Distribution Test
Packing Vibration
Packing Drop
5~55Hz, Amplitude:1m(p-p) X,Y,Z Each Axis/1Hr
150Cm, 1Corner, 3edges, 6faces 1times Drop
Total 15 Items TEST
Version 0.4
Date: 05.25.2005
© Copyright Samsung Electro-Mechanics. All rights reserved.
Page : 17 / 17

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