Acer orporated N300 PDA with WLAN and Bluetooth User Manual Bluetooth manual

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Document ID	600225
Application ID	UUlj7n/uhcf3AdcsuP4ATg==
Document Description	Bluetooth manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	24.27kB (303327 bits)
Date Submitted	2005-11-07 00:00:00
Date Available	2005-11-07 00:00:00
Creation Date	2004-11-18 06:31:49
Producing Software	Acrobat Distiller 5.0 (Windows)
Document Lastmod	2005-10-27 11:49:15
Document Title	Bluetooth manual

Specification Number : JEBMM0-0058
Messrs. LITE-ON Technology Corp.
Approval Sheet for Product Specification
Issued Date : 15/Nov/2004
Product Description : BlueModuleTM
Customer Part Number :
Murata Part Number : LBMA477BK2-064
Date :
Company :
Dept. :
Approved by
Signature :
Type :
The duplicate of this specification shall be returned to us with your authorised signiture. Unless it
reaches us by 27/December/2004, it shall be mutually understood that this specification has been duly
approved by you.
Prepared by
Keisuke Katabuchi
(signature)
(type)
Approved by
Norio Nakajima
Manager
Product Engineering Section I
Multilayer Products Department
Component Division III
Murata Manufacturing Co., Ltd.
(signature)
(type)
Specification Number : JEBMM0-0058
P.1/20
1. Scope
This specification is applied to the Bluetooth HCI module (Blue ModuleTM).
2. Part Number
Production Part Number
LBMA477BK2-064
3. Rating
Ratings
Supply Voltage
Operating Temperature
Storage Temperature
Terminal Name
BTRF_REG
BTL_REG
V_I_O
Input Terminal Voltage
Min
-20
-40
Min
Vss-0.3
4. Weight (Nominal)
0.3g
Murata Manufacturing Co., Ltd.
Max
+70
+85
Max
2.2
2.2
4.1
VDD+0.3
Unit
deg.C
deg.C
Unit
Specification Number : JEBMM0-0058
P.2/20
5. CONSTRUCTION, DIMENSIONS and Terminal Configurations

(26)
(27)

a1

(18) (19) (20) (21) (22) (23) (24) (25) (26)
(18)
c1
(17)
a2
Lot Number
(17)
(27)
(16)
(28)
(15)
(29)
(14)
(13)
BK
Pin 1 index
(30)
c4
(35)
d1
(31)
(12)
(32)
(11)
(33)
(34)
(10)
c3
(34)
b2
(10)
(1)
(9)
c2
d2
(9)
(8)
(7)
Dimension
7.5±0.2
0.4±0.2
1.1±0.2
4.9±0.2
0.75±0.2
(6)
p2
Mark
a1
b2
c3
d2
(5)
Mark
a2
c1
c4
p1
(4)
(3) (2)
(1)
b1

Dimension
7.5±0.2
0.4±0.2
0.6±0.2
4.9±0.2
0.7±0.2
Murata Manufacturing Co., Ltd.
Mark
b1
c2
d1
p2
Dimension
1.4 max
0.75±0.2
0.6±0.2
0.75±0.2
0.7±0.2
(Unit: mm)
p1
Specification Number : JEBMM0-0058
P.3/20
Terminal Configurations
Terminal
No.
(1)
(2)
(3)
(4)
(5)
Terminal Name
Pin Type
Description
GROUND
NC
NC
NC
BLUE_TX
(6)
(7)
REG_CTRL
EEPROM_CLK
 UART data input active
high
Internal 1.8V regulator enable signal
Clock interface to an optional serial
EEPROM
(8)
(9)
(10)
(11)
NC
BLUE_HOST_WAKE
V_I_O
BLUE_WAKE
(12)
(13)
(14)
(15)
(16)
(17)
(18)
(19)
(20)
(21)
(22)
(23)
(24)
(25)
(26)
(27)
(28)
(29)
LPO_IN
BLUE_CLK_EN
GROUND
XTAL_OUT
XTAL_IN
GROUND
TM0
TM1_2
TM3
BTRF_REG
RESET_N
TX_PU_TDD_N
GROUND
ANTENNA_MATCH
GROUND
ASAP_CLK
ASAP_FS
BLUE_CTS
I/O
I/O
I/O
(30)
(31)
ASAP_RX
BLUE_RTS
(32)
(33)
ASAP_TX
BLUE_RX
(34)
(35)
BTL_REG
GROUND
Murata Manufacturing Co., Ltd.
HOST_WAKE signal for power control
Active high or active low BT_WAKE
signal for powe control
32.768KHz digital clock input
Crystal Oscillator output
Crystal or frequency reference input
Test Mode 0
Test mode 1 and 2
Test mode 3
Active LOW system reset
Complement of TX_PU_TDD
 RF input/output
 Synchronous data clock
 Synchronous data sync
 UART clear to send
active low
 Synchronous data output
 UART request to send
active low
 Synchronous data input
 UART data output active
high
Specification Number : JEBMM0-0058
P.4/20
6. Electrical Characteristics
6-1 Operating Conditions
Operating Temperature
Supply Voltage
BTRF_REG, BTL_REG
V_I_O
Min
-20
Typ
+25
Max
+70
Unit
deg.C
1.71
1.71
1.8
2.8
1.98
3.63
6-2-1 Characteristics
+25degC,BTRF_REG/BTL_REG=1.8V, VIO=2.75V
Items
Contents
Bluetooth specification
Ver 1.2
Channel spacing
1MHz
Number of RF channel
79
Power class
Operation mode(Rx/Tx)
Time division multiplex either transmit or receive
Frequency hopping after one Rx/Tx cycle
Items
Min
Typ
Max
Unit
1.Current Consumption
RF Register x57=xC6
1.1 BTRF_REG_IDC_max
mA
DH5; 100% slot utilization;
75
50% Rx/Tx slot duty cycle
1.3 V_I_O_REG_IDC_max
DH5; 100% slot utilization;
10
mA
50% Rx/Tx slot duty cycle
-TX characteristicsMin
Typ
Max
Unit
2.Output Power
-4
dBm
3.Frequency range（Rx/Tx）
2400.5～2483.5MHz
4.-20dB bandwidth
MHz
5.Adjacent Channel Power *1
-21
dBm
5.1 [M-N]＝2
-41
dBm
5.2 [M-N]≧3
6.Modulation characteristics
145
173
kHz
6.1 Modulation δf1avg
125
kHz
6.2 Modulation δf2max
0.85
6.3 Modulationδf2avg/δf1avg
7.Initial Carrier Frequency Tolerance
-45
45
kHz
8.Carrier Frequency Drift
8.1 1slot
-25
25
kHz
8.2 3slot
-40
40
kHz
8.3 5slot
-40
40
kHz
8.4 Maximum drift rate
-20
20
kHz/50μs
9.Out-of-Band Spurious Emissions
9.1
30-1000MHz (Operation Mode)
-36
dBm
9.2
1000-12750MHz (Operation Mode)
-30
dBm
-47
9.3
1800-1900MHz(Operation Mode)
dBm
9.4
2110-2170MHz (Operation Mode)
-75
dBm
-47
9.5
5150-5300MHz (Operation Mode)
dBm
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.5/20
-RX characteristicsmin
10.Sensitivity (BER≦0.1%)
10.1 2402MHz
10.2 2441MHz
10.3 2480MHz
11.C/I Performance (BER≦0.1%) *2
11.1 co-channel ratio (-60dBm input)
11.2 1MHz ratio (-60dBm input)
11.3 2MHz ratio (-60dBm input)
11.4 3MHz ratio (-67dBm input)
11.5 image ratio (-67dBm input)
11.6 image +/- 1MHz ratio (-67dBm input)
12.Blocking performance(BER<0.1%) *3
-10
12.1 30MHz-2000MHz
12.2 2000MHz-2400MHz
-27
-27
12.3 2500MHz-3000MHz
12.4 3000MHz-12750MHz
-10
13.Intermodulation performance
-35
(BER≦0.1%, -64dBm input)
14.Maximum Input Level
-20
*1
Up to three sprious responses within Bluetooth limits are allowed.
*2
Up to five sprious responses within Bluetooth limits are allowed.
*3
Up to twenty-four sprious responses within Bluetooth limits are allowed.
Murata Manufacturing Co., Ltd.
typ
max
unit
-79
-79
-79
dBm
dBm
dBm
11
-30
-40
-9
-20
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Specification Number : JEBMM0-0058
P.6/20
6-2-2. Extreme condition : -20 to +70degC, BTRF_REG/BTL_REG=1.71-1.98V, VIO=1.71-3.63V
Items
Min
Typ
Max
Unit
1.Current Consumption
RF Register x57=xC6
1.1 BTRF_REG_IDC_max
mA
DH5; 100% slot utilization;
80
50% Rx/Tx slot duty cycle
1.3 V_I_O_REG_IDC_max
DH5; 100% slot utilization;
12
mA
50% Rx/Tx slot duty cycle
-TX characteristicsMin
Typ
Max
Unit
2.Output Power
-6
+6
dBm
3.Frequency range（Rx/Tx）
2400.5～2483.5MHz
4.-20dB bandwidth
MHz
5.Adjacent Channel Power *1
-20
dBm
5.1 [M-N]＝2
-40
dBm
5.2 [M-N]≧3
6.Modulation characteristics
145
175
kHz
6.1 Modulation δf1avg
115
kHz
6.2 Modulation δf2max
0.8
6.3 Modulationδf2avg/δf1avg
7.Initial Carrier Frequency Tolerance
-75
75
kHz
8.Carrier Frequency Drift
8.1 1slot
-25
25
kHz
8.2 3slot
-40
40
kHz
8.3 5slot
-40
40
kHz
8.4 Maximum drift rate
-20
20
kHz/50μs
9.Out-of-Band Spurious Emissions
9.1
30-1000MHz (Operation Mode)
-36
dBm
9.2
1000-12750MHz (Operation Mode)
-30
dBm
9.3
1800-1900MHz(Operation Mode)
-47
dBm
9.4
2110-2170MHz (Operation Mode)
-65
dBm
9.5
5150-5300MHz (Operation Mode)
-47
dBm
-RX characteristics10.Sensitivity (BER≦0.1%)
10.1 2402MHz
10.2 2441MHz
10.3 2480MHz
min
typ
max
unit
-77
-77
-77
dBm
dBm
dBm
*1 Up to three spurious responses within Bluetooth limits are allowed.
Note
The above mentioned values have been obtained according to our own measuring methods (testing jig
Fig.1) and may very depend on the circuit, in which the component is actually incorporated. Therefore,
you are kindly requested to test the performance of the component actually in your set.
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.7/20
7. Other Specification and Methods
No.
Vibration
Resistance
Items
Appearance
Shock
Specifications
No severe damages
Electrical
Specification
Satisfy specifications listed in
paragraph 6.
Appearance
No severe damages
Electrical
Specification
Satisfy specifications listed in
paragraph 6.
Test Methods
Solder specimens on the testing jig shown in
appended Fig.3 by an solder. The soldering shall
be done either by iron or reflow and be
conducted with care so that the soldering is
uniform and free of defect such as by heat
shock.
Frequency : 10 to 2000 by 10 Hz
Acceleration : 196 m/s2
Direction
: X,Y,Z 3axes
Period
: 2 h on each direction
(Total 6 h.)
Solder specimens on the testing jig shown in
appended Fig.3 by an solder. The soldering shall
be done either by iron or reflow and be
conducted with care so that the soldering is
uniform and free of defect such as by heat
shock.
Pulse Wave : Sine Half Wave
Acceleration : 30000 m/s2 (Peak)
Period
: 0.3 ms.
Cycle
: 10 times
Deflection
No damage with 1mm deflection
Solder specimens on the testing jig shown in
appended Fig.3 by an solder. The soldering shall
be done either by iron or reflow and be
conducted with care so that the soldering is
uniform and free of defect such as by heat
shock.
Soldering strength
(Push Strength)
9.8 N Minimum
Solder specimens on the testing jig shown in
appended Fig.3 by an solder. As shown below,
apply pushing force at 0.5 mm/s until electrode
pads are pealed off or ceramics are broken.
Pushing force is applied as show below.
Specimen
Pushing Direction
Jig
Solderability of Termination
75% of the terminations is to be
soldered evenly and continuously.
Immerse specimens first a ethanol solution of
rosin (25% rosin in weight proportion), then in an
solder solution for 2+/-0.5 s at 230+/-5 deg.C.
Preheat
: 100 to 120 deg.C, 60 s
Solder Paste : Eutectic Solder
Flux
: Solution of ethanol and rosin
(25% rosin in weight proportion)
Resistance
to Soldering
Heat
(Reflow)
Appearance
No severe damages
Electrical
specifications
Satisfy specifications listed in
paragraph 6.
Preheat Temperature : 150 +/-10 deg.C
Preheat Period
: 60s
Peak Temperature
: 230+/-5 deg.C
Peak Temp. Period
: 10 s
Specimens are soldered once with the above
condition, then kept in room condition for 24 h
before measurements.
Specifications
Test Methods
No.
Items
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.8/20
Temperature
Cycle
Appearance
No severe damages
Electrical
specifications
Satisfy specifications listed in
paragraph 6.
Step
Temp.(deg.C)
Time (min)
Humidity
Load Life
High Temp.
Load Life
Min operating
Temp. +0/-3
30+/-3
Set the specimens to the supporting jig in the
same manner and under the same condition as
Fig.1 and conduct the 100 cycles according to
the temperatures and time shown in the
following table.
Max operating
Temp. +3/-0
30+/-3
Appearance
No severe damages
Electrical
specifications
Satisfy specifications listed in
paragraph 6.
Appearance
No severe damages
Electrical
specifications
Satisfy specifications listed in
paragraph 6.
Temperature : 85+/-2 deg.C
Humidity
: 80 to 85%RH
Period
: 500+24/-0 h
Room Condition : 2 to 24 h
Supply Voltage : 3.63V D.C. to V_I_O,
1.93V D.C to BTRF_REG and BTL_REG
Temperature
: 85+/-2 deg.C
Period
: 500+24/-0 h
Room Condition : 2 to 24 h
Supply Voltage : 3.63V D.C. to V_I_O
1.93V D.C to BTRF_REG and BTL_REG
Excessive mechanical force or thermal stress may damage the products. Appropriate handling is
required.
8. Interface
UART
9. IC/Firmware
BROADCOM’s BCM2035 B3 Version
10. Production Site
FUKUI MURATA MFG.CO.,LTD.
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.9/20
Fig.1 Measurement Board
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.10/20
Land Patterns
Land
0.7
4.9
0.7
0.4
0.75
0.4
7.5
Fig.2
4.9
0.75
7.5
(Unit:mm)
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.11/20
Testing Board
100
40
Land
0.7
49
0.7
0.4
0.75
0.4
75
Fig.2
49
0.75
75
Unit:mm
Glass epoxy board t=0.8mm
Copper thickness 35um min
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.12/20
100
Mounted Situation
Module
45
Testing Method
Unit : mm
45
20
50
Unit : mm
R230
Deflection
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.13/20
11.Tape and Reel Packing
(1) Dimensions of Tape ( Plastic tape )
1.Cumulative tolerance of max. ± 0.3 every 10 pitches
2.Reference value
4.0 ±
0.1
1.6 ± 0.1
1.5+0.1
Max=0.6
2.0 ±
0.1
7.5 ±
Pad 1
0.1
16.0± 0.3
7.8 ± 0.1
Min=14.25
Min= 1.5
12.0 ±
0.1
Feeding Direction
Max 5.0°
7.8 ± 0.1
(2) Dimensions of Reel
17.0±0.6
25.5±0.6
φ 13±0.2
(φ 330)
(φ 100)
2.0±0.5
20.4 max.
max
30.5
(Unit :mm)
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.14/20
(3) Taping Diagrams
[1] Feeding Hole
[2] Hole for chip
As specified in (1)
[3] Cover tape
62 μm in thickness
[4] Base tape
As specified in (1)
[3]
As specified in (1)
[1]
[2]
[3]
[4]
穴
り
送
Feeding Hole
Feeding Direction
Module
穴
り
送
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.15/20
(4) Leader and Tail tape
Tail tape
(No components)
Components
No components
Leader tape
(Cover tape alone)
40 to 200 mm
150 mm min.
250 mm min.
Feeding direction
(5)
The tape for chips are wound clockwise, the feeding holes to the right side as the ta
pe is pulled toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250 mm min.
(7) Tear off strength against pulling of cover tape : 5 N min.
(8)
Packaging unit : 1000 pcs./ reel
(9)
material : Base tape : Plastic
Reel
: Plastic
Cover tape , cavity tape and reel are made the anti-static processing.
(10)
Peeling of force : 0.7 N max. in the direction of peeling as shown below.
0.7 N max.
165 to 180 °
Cover tape
Base tape
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.16/20
NOTICE
1. Storage Conditions:
The product shall be stored under the following conditions in order not to damage the solderbility of the
external electrodes.
- The product shall be stored without opening the packing and at the ambient temperature between 5
and 30 deg.C and humidity between 20 and 70 %RH. And the product shall be used within 6 months
after reception. (Packing materials, in particular, may be deformed at the temperature over 45 deg.C.)
- After opening the packing, the product shall be stored at 5 to 30 deg.C / < 60 %RH and the product
shall be used within 48 hours. If the product is not used within 48 hours after opening the packing, the
product shall be baked under the following conditions.
Baking condition : 125 +/-5 deg.C, 24 hours, 1 time
The products shall be baked on the heat-resistant tray because the material (Base
Tape, Reel Tape and Cover Tape) are not heat-resistant.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Solderbility shall be confirmed before use if the product is stored for more than 3 months.
- When the indicator in the packing has changed its color, the product shall be baked before soldering.
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
2. Handling Conditions:
- Be careful in handling or transporting products because excessive stress or mechanical
shock may break products due to the nature of ceramics structure.
- Handle with care because the characteristics of products may change if products may have cracks or
damages on their terminals. Do not touch products with bear hands that may result in poor
solderability.
3. Standard PCB Design (Land Patterns and Dimensions) :
- All the ground terminals should be connected to the ground patterns. Please refer to
Fig.2 for the standard land dimensions.
- The recommended land patterns and dimensions are as Murata's standard. The characteristics of
products may vary depending on the pattern drawing method, grounding method, land dimensions,
land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to
verify the characteristics in the actual set. When using non-standard lands, contact Murata
beforehand.
4. Notice for Chip Placer :
- When placing products on the PCB, products may be stressed and broken by uneven
forces from a worn-out chucking locating claw or a suction nozzle. To prevent products
from damages, be sure to follow the specifications for the maintenance of the chip placer
being used. For the positioning of products on the PCB, be aware that mechanical
chucking may damage products.
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.17/20
5. Soldering Conditions :
- Carefully perform preheating so that the temperature difference (delta T) between the solder and
products surface should be in the following range. When products are immersed in solvent after
mounting, pay special attention to maintain the temperature difference within 100 deg.C. Soldering
must be carried out by the above mentioned conditions to prevent products from damage. Contact
Murata before use if concerning other soldering conditions.
Soldering methods
Soldering iron method
Reflow method
Temperature
delta T < 130 deg.C
- Soldering iron method conditions are indicated below.
Kind of iron
Items
Soldering iron wattage
Temperature of iron-tip
Iron contact time
Ceramic heater
< 18 W
<350 °C
within 3 s
- Diameter of iron-tip : φ3.0 mm max.
- Do not touch the module itself directly by the iron-tip.
Reflow soldering standard conditions(Example)
250 to 260 °C
within 3 s.
Cooling down
slowly
Temperature (°C)
∆Τ
220 °C
Pre-heating
within 120 s
within 60 s.
Murata Manufacturing Co., Ltd.
Time (s.)
Specification Number : JEBMM0-0058
P.18/20
- Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt% or less. Be careful so as
not to remain the flux residue around products. Because there are possibilities to become worse the
characteristics.
- Amount of Solder Paste:
Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of
the external electrodes. If too much or little solder is applied, there is high possibility that the
mechanical strength will be insufficient, creating the variation of characteristics.
Amount of solder paste
Chip
Hight

Chassis
Solder (Grounding solder)
Lead wire of leaded
component
Lead wire of componen
mounted later
Soldering iron
Chip
Land
PCB

Solder resist
Solder resist
Chip
Murata Manufacturing Co., Ltd.
Solder resist
Specification Number : JEBMM0-0058
P.19/20
6. Operational Environment Conditions :
- Products are designed to work for electronic products under normal environmental conditions
(ambient temperature, humidity and pressure). Therefore, products have no problems to be used
under the similar conditions to the above-mentioned. However, if products are used under the
following circumstances, it may damage products and electric shock and abnormal temperature may
occur.
- In an atmosphere containing corrosive gas (CL2, NH3, SOx, NOx, etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
- If there are possibilities for products to be used under the preceding clause, consult
with Murata before actual use.
- As it might be a cause of degradation or destruction to apply static electricity to
products, do not apply static electricity or excessive voltage while assembling and
measuring.
7. Limitation of Applications :
Please contact Murata before using products for the applications listed below which
require especially high reliability for the prevention of defects which might directly cause
damage to the third party's life, body or property.
- Aircraft equipment.
- Aerospace equipment.
- Undersea equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-processing equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the
above.
Murata Manufacturing Co., Ltd.
Specification Number : JEBMM0-0058
P.20/20
Note :
- Please make sure that your product has been evaluated and confirmed against your specifications
when our product is mounted to your product.
- All the items and parameters in this product specification have been prescribed on the premise that
our product is used for the purpose, under the condition and in the environment agreed upon between
you and us. You are requested not to use our product deviating from such agreement.
- We consider it not appropriate to include other terms and conditions for transaction warranty in
product specifications, drawings or other technical documents. Therefore, even if your original part of
this product specification includes such terms and conditions as warranty clause, product liability
clause, or intellectual property infringement liability clause, we are not able to accept such terms and
conditions in this product specification unless they are based on the governmental regulation or what
we have agreed otherwise in a separate contact. We would like to suggest that you propose to discuss
them under negotiation of contract.
Murata Manufacturing Co., Ltd.

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File Type                       : PDF
File Type Extension             : pdf
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Create Date                     : 2004:11:18 06:31:49Z
Modify Date                     : 2005:10:27 11:49:15+08:00
Page Count                      : 21
Creation Date                   : 2004:11:18 06:31:49Z
Mod Date                        : 2005:10:27 11:49:15+08:00
Producer                        : Acrobat Distiller 5.0 (Windows)
Metadata Date                   : 2005:10:27 11:49:15+08:00

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