Billion Electric BIL-SIM7100C 4G/LTE PCIE module User Manual

Billion Electric Co., Ltd. 4G/LTE PCIE module Users Manual

Users Manual

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Document ID2877050
Application IDzxYQg+388s232gO5AVIt3A==
Document DescriptionUsers Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
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Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize253.61kB (3170142 bits)
Date Submitted2016-01-19 00:00:00
Date Available2016-01-19 00:00:00
Creation Date2016-01-13 18:13:16
Document Lastmod2016-01-15 13:55:11
Document TitleUsers Manual
Document CreatorWPS Office
Document Author: Libing

SIM7100C_User Manual_V1.01
Smart Machine Smart Decision
Document Title
SIM7100C_User Manual_V1.01
Version
1.01
Date
2015-09-19
Status
Draft
Document Control ID
SIM7100C_User Manual_V1.01
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
RF exposure statements:
Information to OEM integrator
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user manual of the end product.
The user manual which is provided by OEM integrators for end users must include the following
information in a prominent location.
1. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must
be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter, except in accordance with FCC
multi-transmitter product procedures.
2. Only those antennas with same type and lesser gain filed under this FCC ID number can be used with
this device.
3. The regulatory label on the final system must include the statement: “Contains FCC ID: xxxx or using
electronic labeling method as documented in KDB 784748.
4. The final system integrator must ensure there is no instruction provided in the user manual or customer
documentation indicating how to install or remove the transmitter module except such device has
implemented two ways authentication between module and the host system.
This module can't be used on radio system and operation individually. Using others antenna must be
re-testing and certification.
Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2014
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Contents
SIM7100C_User Manual_V1.01................................................................................................................... 1
Contents...........................................................................................................................................................4
Table Index...................................................................................................................................................... 7
Figure Index.................................................................................................................................................... 9
Revision History............................................................................................................................................10
Introduction............................................................................................................................................11
1.1 Product Outline................................................................................................................................. 11
1.2 Hardware Interface Overview.......................................................................................................... 11
1.3 Hardware Diagram............................................................................................................................11
1.4 Functional Overview........................................................................................................................ 12
Package Information............................................................................................................................. 13
2.1 Pin Configuration............................................................................................................................. 13
2.2 Pin description.................................................................................................................................. 16
2.3 Package Dimensions.........................................................................................................................20
2.4 Footprint Recommendation.............................................................................................................. 23
Application Interface Specification..................................................................................................... 24
3.1 Power Supply....................................................................................................................................24
3.1.1 Design Guide............................................................................................................................. 24
3.1.2 Recommended Power supply circuit.........................................................................................25
3.1.3 Voltage monitor..........................................................................................................................26
3.2 Power on/Power off/Reset Time Sequence...................................................................................... 26
3.2.1 Power on Sequence....................................................................................................................26
3.2.2 Power off Sequence................................................................................................................... 28
3.2.3 Reset Function........................................................................................................................... 29
3.3 UART Interface................................................................................................................................ 30
3.3.1 RI Behavior................................................................................................................................31
3.3.2 Design Guide............................................................................................................................. 32
3.4 USB Interface................................................................................................................................... 33
3.4.1 USB Application Guide............................................................................................................. 33
3.5 USIM Interface................................................................................................................................. 35
3.5.1 USIM Pin description................................................................................................................ 35
3.5.2 USIM Application Guide...........................................................................................................35
3.5.3 Recommend Components of USIM holder............................................................................... 36
3.6 PCM Interface...................................................................................................................................37
3.6.1 PCM Pin Description.................................................................................................................38
3.6.2 PCM Signal Description............................................................................................................38
3.6.3 Auxiliary PCM (128 KHz PCM clock).....................................................................................38
3.6.4 Primary PCM (2048 KHz PCM clock)..................................................................................... 40
3.6.5 PCM Application Guide............................................................................................................ 41
3.7 MMC/SD and SDIO Interface..........................................................................................................42
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3.7.1 MMC/SD Interface Pin Description..........................................................................................42
3.7.2 SDIO Interface Pin Description.................................................................................................44
3.7.3 SD Design guide........................................................................................................................ 44
3.8 I2C Interface..................................................................................................................................... 45
3.8.1 I2C Pin Description................................................................................................................... 45
3.8.2 I2C Signal Description.............................................................................................................. 45
3.8.3 I2C Design Guide...................................................................................................................... 45
3.9 Keypad Interface...............................................................................................................................45
3.9.1 Keypad Pin Description.............................................................................................................45
3.9.2 Keypad Application Guide........................................................................................................ 46
3.10
SPI Interface..................................................................................................................................47
3.10.1
SPI Pin Description................................................................................................................ 47
3.11
GPIO Interface.............................................................................................................................. 48
3.11.1
GPIO Pin Description............................................................................................................ 48
3.12
Network status...............................................................................................................................50
3.13
Flight mode control....................................................................................................................... 50
3.14
Multi-functional interface............................................................................................................. 51
3.14.1
Sink Current Source............................................................................................................... 51
3.14.2
ADC........................................................................................................................................52
3.14.3
LDO........................................................................................................................................53
RF Specification..................................................................................................................................... 54
4.1 RF Specification............................................................................................................................... 54
4.2 Antenna Design Guide......................................................................................................................56
Reliability and Operating Characteristics.......................................................................................... 59
5.1 Electronic Characteristics.................................................................................................................59
5.2 Operating Mode................................................................................................................................59
5.2.1 Operating Mode......................................................................................................................... 59
5.2.2 Minimize Power Consumption..................................................................................................60
5.2.3 Sleep mode.................................................................................................................................60
5.2.4 Minimum functionality mode....................................................................................................61
5.3 Current Consumption....................................................................................................................... 61
5.4 EMC and ESD Notes........................................................................................................................61
Guide for Production.............................................................................................................................62
6.1 Top and Bottom View of SIM7100C............................................................................................... 62
6.2 Typical Solder Reflow Profile..........................................................................................................62
6.3 Moisture Sensitivity Level (MSL)................................................................................................... 63
6.4 Stencil Foil Design Recommendation..............................................................................................64
Appendix........................................................................................................................................................65
A. Reference Design................................................................................................................................... 65
B. SIM7100C GPIOs List........................................................................................................................... 66
C. Digital I/O Characteristics......................................................................................................................66
D. Related Documents................................................................................................................................ 67
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E. Terms and Abbreviations....................................................................................................................... 68
F. Safety Caution.........................................................................................................................................70
Contact us:.....................................................................................................................................................72
Shanghai SIMCom Wireless Solutions Ltd............................................................................................... 72
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Table Index
Table 1: SIM7100C series frequency bands...................................................................................................................... 11
Table 2: General Feature....................................................................................................................................................12
Table 3: Coding schemes and maximum net data rates over air interface.........................................................................13
Table 4: Pin definition....................................................................................................................................................... 15
Table 5: IO Parameters Definition..................................................................................................................................... 16
Table 6: Pin description..................................................................................................................................................... 16
Table 7: VBAT Pin description.......................................................................................................................................... 24
Table 8: Recommended zener diode models..................................................................................................................... 25
Table 9: Power on timing...................................................................................................................................................28
Table 10: Power off timing................................................................................................................................................ 29
Table 11: RESET Pin Electronic Characteristic................................................................................................................ 30
Table 12: UART Pin description........................................................................................................................................30
Table 13: UART Pin Logic level....................................................................................................................................... 31
Table 14: USB Pin description.......................................................................................................................................... 33
Table 15: USIM Pin description........................................................................................................................................ 35
Table 16: USIM Electronic characteristic..........................................................................................................................35
Table 17: Amphenol USIM socket pin description............................................................................................................37
Table 18: PCM Pin description..........................................................................................................................................38
Table 19: PCM Electronic characteristic........................................................................................................................... 38
Table 20: Timing parameters............................................................................................................................................. 39
Table 21: Timing parameters............................................................................................................................................. 41
Table 22: MMC/SD Pin description.................................................................................................................................. 42
Table 23: MMC/SD Electronic characteristic*..................................................................................................................43
Table 24: SDIO Pin description......................................................................................................................................... 44
Table 25: SDIO Electronic characteristic.......................................................................................................................... 44
Table 26: I2C Pin description............................................................................................................................................ 45
Table 27: Keypad Pin description......................................................................................................................................45
Table 28: Keypad multiplexing function........................................................................................................................... 46
Table 29: SPI Pin description............................................................................................................................................ 47
Table 30: SPI Electronic characteristic..............................................................................................................................47
Table 31: GPIO Pin description......................................................................................................................................... 48
Table 32: GPIO Electronic characteristic.......................................................................................................................... 48
Table 23: LED status......................................................................................................................................................... 50
Table 34: Flight mode status..............................................................................................................................................51
Table 35: Sink Current Electronic characteristic............................................................................................................... 51
Table 36: Electronic Characteristics.................................................................................................................................. 52
Table 37: Electronic characteristic.....................................................................................................................................53
Table 38: Conducted transmission power..........................................................................................................................54
Table 39: Operating frequencies........................................................................................................................................ 54
Table 40: E-UTRA operating bands.................................................................................................................................. 54
Table 41: Conducted receive sensitivity............................................................................................................................ 55
Table 42: Reference sensitivity (QPSK)............................................................................................................................57
Table 43: Absolute maximum ratings................................................................................................................................ 59
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Table 44: Recommended operating ratings....................................................................................................................... 59
Table 45: Operating temperature....................................................................................................................................... 59
Table 46: Operating mode................................................................................................................................................. 59
Table 47: Current consumption......................................................................................................................................... 61
Table 48: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)............................................61
Table 49: Moisture sensitivity level and floor life.............................................................................................................63
Table 50: SIM7100C GPIOs list........................................................................................................................................66
Table 51: Digital I/O characteristics.................................................................................................................................. 66
Table 52: Related documents.............................................................................................................................................67
Table 53: Terms and Abbreviations................................................................................................................................... 68
Table 54: Safety caution.................................................................................................................................................... 70
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Figure Index
Figure 1: SIM7100C functional architecture................................................................................................ ....................14
Figure 2: Pin view..............................................................................................................................................................14
Figure 3: Top dimensions (Unit: mm)............................................................................................................................... 20
Figure 4: Side dimensions (Unit: mm).............................................................................................................................. 21
Figure 5: Bottom dimensions (Unit: mm)......................................................................................................................... 22
Figure 6: Footprint recommendation (Unit: mm)..............................................................................................................23
Figure 7: VBAT input application circuit.......................................................................................................................... 24
Figure 8: Reference circuit of the LDO power supply...................................................................................................... 25
Figure 9: Reference circuit of the DCDC power supply................................................................................................... 26
Figure 10: Power on Timing Sequence..............................................................................................................................27
Figure 11: Power off timing sequence............................................................................................................................... 29
Figure 12: Reset circuit......................................................................................................................................................30
Figure 13: RI behaviour in NULL Modem........................................................................................................................31
Figure 14: RI behaviour in FULL Modem........................................................................................................................ 32
Figure 15: UART Full modem...........................................................................................................................................32
Figure 16: UART Null modem.......................................................................................................................................... 32
Figure 17: Reference circuit of level shift......................................................................................................................... 33
Figure 18: USB Reference Circuit with SIM7100C as USB Host Controller...................................................................34
Figure 19: USIM interface reference circuit......................................................................................................................36
Figure 20: Amphenol SIM card socket..............................................................................................................................37
Figure 21: Synchrony timing............................................................................................................................................. 39
Figure 22: EXT CODEC to MODULE timing..................................................................................................................39
Figure 23: MODULE to EXT CODEC timing..................................................................................................................39
Figure 24: Synchrony timing............................................................................................................................................. 40
Figure 25: EXT CODEC to MODULE timing..................................................................................................................41
Figure 26: MODULE to EXT CODEC timing..................................................................................................................41
Figure 27: Reference Circuit of PCM Application with Audio Codec..............................................................................42
Figure 28: SD interface circuit.......................................................................................................................................... 44
Figure 29: Reference circuit.............................................................................................................................................. 46
Figure 30: Application circuit............................................................................................................................................50
Figure 31: Flight mode switch...........................................................................................................................................51
Figure 32: Current drive.................................................................................................................................................... 52
Figure 33: Antenna matching circuit (MAIN_ANT).........................................................................................................56
Figure 34: Antenna matching circuit (AUX_ANT)...........................................................................................................57
Figure 35: Active antenna circuit.......................................................................................................................................57
Figure 36: Passive antenna circuit (Default)................................................................................................................... ..57
Figure 37: Top and bottom view of SIM7100C.................................................................................................................62
Figure 38: The ramp-soak-spike reflow profile of SIM7100C..........................................................................................63
Figure 39: Reference design.............................................................................................................................................. 65
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Revision History
Data
Version
Description of change
Author
2015-09-11
1.01
Original
Yang Hongliang
Li Ya
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1 Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM7100C module. With the help of this document
and other SIM7100C software application notes, user guides, users can quickly understand and use
SIM7100C module to design and develop applications quickly.
1.1 Product Outline
Designed for global market, SIM7100C is TD-LTE band41, User can choose the module based on the
wireless network configuration. In this document, the entire radio band configuration of SIM7100C series
is described in the following table.
Table 1: SIM7100C series frequency bands
Standard
Frequency
LTE TDD B41
(100M BW)
SIM7100C

With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM7100C can meet almost any
space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc.
There are 87 pins on SIM7100C, which provide most application interfaces for customers’ board.
1.2 Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
● Power Supply
● USB Interface
● UART Interface
● MMC/SD and SDIO Interfaces
● USIM Interface
● GPIO
● ADC
● LDO Power Output
● Current Sink Source
● PCM Interface
● Keypad Interface
● SPI Interface
● I2C Interface
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1.3 Functional Overview
Table 2: General Feature
Feature
Implementation
Power supply
Power Save mode
Frequency bands
Single supply voltage 3.4~4.2V
TBD
Please refer to table 1.
UMTS:
 Class 3 (0.25W): LTE
Transmitting power
Connectivity Speed
Rx-diversity
GNSS
SMS
USIM interface
USIM application toolkit
Phonebook management
Audio features
UART interface


LTE Category 3 - 100 Mbps (DL)
LTE Category 3 - 50 Mbps (UL)
Support UMTS/LTE Rx-diversity.
● GNSS engine (GPS and GLONASS)
● Protocol: NMEA
● Mobile-assisted mode
● Mobile-based mode
● Standalone mode
● MT, MO, CB, Text and PDU mode
● SMS storage: USIM card or ME(default)
● Support transmission of SMS alternatively over CSD or GPRS.
User can choose preferred mode.
Support identity card: 1.8V, 3V.
Support SAT class 3, GSM 11.14 Release 98
Support USAT
Support phonebook types: SM, FD, LD, RC, ON, MC.
Support digital audio interface: PCM interface.
● Used for analog audio function with external codec.
● Support long frame sync and short frame sync.
● Support 8-bit A-law, μ-law and 16-bit linear data formats.
● Support master and slave mode, but must be the master in long
frame sync.







Default one Full modem serial port
1200bps to 460800bps.
Can be used for AT commands or data stream.
Support RTS/CTS hardware handshake and software ON/OFF
flow control.
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
Autobauding supports baud rate from 1200 bps to 115200bps.
upgrading firmware
MMC/SD/SDIO
Two secure digital controller (SDC) ports up to 52MHz:
● support MMC and SD cards with 1.8 V or 2.95 V on SD1
● support SDIO with1.8 V only on SD2
USB
USB 2.0 specification-compliant as a peripheral or embedded host
Firmware upgrade
Firmware upgrade over USB interface
●
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Physical characteristics
Size:30*30*2.9mm
Weight:5.7 g
Normal operation temperature: -30°C to +80°C
● Extended operation temperature: -40°C to +85°C
● Storage temperature -45°C to +90°C
●
Temperature range
Table 3: Coding schemes and maximum net data rates over air interface
LTE-FDD device category
(Downlink)
Max data rate(peak)
Category 1
10Mbps
Category 2
50Mbps
Category 3
100Mbps
Category 4
150Mbps
LTE-TDD device category
Modulation type
QPSK/16QAM/64QA
QPSK/16QAM/64QA
QPSK/16QAM/64QA
QPSK/16QAM/64QA
Max data rate(peak)
Modulation type
Category 1
5Mbps
QPSK/16QAM
Category 2
25Mbps
QPSK/16QAM
Category 3
50Mbps
QPSK/16QAM
Category 4
50Mbps
QPSK/16QAM
(Uplink)
2 Package Information
2.1
Pin Configuration
All hardware interfaces which connect SIM7100C to customers’ application platform are through 87 pins
pads (Metal half hole). Figure 2 is SIM7100C outline diagram.
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Figure 1: Pin view
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Table 4: Pin definition
Pin No.
Define
Pin No.
Define
GND
GND
PWRKEY
RESET
GND
SPI_CLK
SPI_MISO
SPI_MOSI
SPI_CS
10
GND
11
USB_VBUS
12
USB_DN
13
USB_DP
14
GND
15
VDD_1V8
16
USB_ID
17
USIM_DATA
18
USIM_RST
19
USIM_CLK
20
USIM_VDD
21
SD_CMD
22
SD_DATA0
23
SD_DATA1
24
SD_DATA2
25
SD_DATA3
26
SD_CLK
27
KBC1
28
KBC0
29
KBR0
30
KBR2
31
KBC2
32
KBC3
33
KBR1
34
KBR4
35
KBR3
36
KBC4
37
GND
38
VBAT
39
VBAT
40
GND
41
GND
42
NC
43
GND
44
VDD_EXT
45
ISINK
46
ADC2
47
ADC1
48
GPIO44
49
GPIO40
50
GPIO43
51
GPIO1
52
GPIO41
53
GPIO42
54
GPIO4
55
SCL
56
SDA
57
GND
58
GND
59
AUX_ANT
60
GND
61
GND
62
VBAT
63
VBAT
64
GND
65
GND
66
RTS
67
CTS
68
RXD
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69
RI
70
DCD
71
TXD
72
DTR
73
PCM_OUT
74
PCM_IN
75
PCM_SYNC
76
PCM_CLK
77
GND
78
GND
79
GNSS_ANT
80
GND
81
GND
82
MAIN_ANT
83
RF_CFG1
84
RF_CFG2
85
BOOT_CFG0
86
RF_CFG3
87
BOOT_CFG1
2.2 Pin description
Table 5: IO Parameters Definition
Pin Type
Description
PI
Power input
PO
Power output
IO
Bidirectional input / output
DI
Digital input
DO
Digital output
AI
Analog input
Table 6: Pin description
Pin name
Pin No.
I/O
Description
Comment
VBAT
38,39,
62,63
PI
Power supply voltage
NC
42
No connection
Please keep open
44
PO
LDO power output for SD card
circuit or other external circuit
with MAX. 150mA output. This
LDO output voltage can be
changed by the AT command
“AT+CVAUXV”.
If unused, please keep
open.
PO
Recommend placing a
10uF and 100nF
1.8V SMPS output for external capacitors to improve
circuit, such as level shift circuit. the stability of the
internal 1.8V SMPS
circuit.
Power Supply
VDD_EXT
VDD_1V8
15
GND
1,2,5,10
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,14,37,4
0,41,43,
57,58,6
0,61,64,
65,77,7
8,80,81
Power on/off
DI
PWRKEY should be pulled low PWRKEY has been
at least 180ms to power on or pulled up to 1.8V in
500ms to power off the module.
the module.
SD_CMD
21
I/O
SDIO command
SD_DATA0
22
I/O
SDIO data
SD_DATA1
23
I/O
SDIO data
SD_DATA2
24
I/O
SDIO data
SD_DATA3
25
I/O
SDIO data
SD_CLK
26
DO
SDIO clock
USIM_DATA
17
I/O
SIM Data Output/Input
USIM_RST
USIM_CLK
18
19
DO
DO
SIM Reset
SIM Clock
USIM_VDD
20
PO
Voltage Supply for SIM card
Support 1.8V or 3V SIM card
SPI_CLK
DO
SPI clock
SPI_MISO
DI
SPI_MOSI
DO
SPI_CS
DO
SPI chip-select
USB_VBUS
11
DI
Valid USB detection input
USB_DN
12
I/O
Negative line of the differential,
bi-directional USB signal to/from
the peripheral device.
13
I/O
Positive line of the differential,
bi-directional USB signal to/from
the peripheral device.
PWRKEY
SD interface
If unused, please keep
open.
USIM interface
All signals of SIM
interface should be
protected against
ESD/EMC.
SPI interface
SPI (master only) master in/slave
out data
If unused, please keep
SPI(master only) master out/slave open.
in data
USB
USB_DP
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16
DI
High-speed USB ID
RTS
66
DO
Request to send
CTS
67
DI
Clear to Send
RXD
68
DI
Receive Data
RI
69
DO
Ring Indicator
DCD
70
DO
Carrier detects
TXD
DTR
71
72
DO
DI
Transmit Data
DTE get ready
SCL
55
DO
I2C clock output
SDA
56
I/O
I2C data
KBR0
29
DO
Bit 0 drive to the pad matrix
KBR1
33
DO
Bit 1 drive to the pad matrix
KBR2
30
DO
Bit 2 drive to the pad matrix
KBR3
35
DO
Bit 3 drive to the pad matrix
KBR4
34
DO
Bit 4 drive to the pad matrix
KBC0
28
DI
Bit 0 for sensing key press on pad
matrix
KBC1
27
DI
Bit 1 for sensing key press on pad
matrix
KBC2
31
DI
Bit 2 for sensing key press on pad
matrix
KBC3
32
DI
Bit 3 for sensing key press on pad
matrix
KBC4
36
DI
Bit 4 for sensing key press on pad
matrix
PCM_OUT
73
DO
PCM_IN
74
DI
PCM_SYNC
75
DO
USB_ID
If SIM7100C is
peripheral (USB
device), please keep it
open. If SIM7100C is
USB host, please
connect to GND
directly.
UART interface
I2C interface
Please place 2
external Pull-up 2.2kR
resistors to VDD_1V8
for using I2C bus.
If unused, keep open.
Keypad interface
All Keypad pins can
be configured as
GPIOs.
KBC0, KBC1, KBC2,
KBC3, KBR0 and
KBR2 can be
configured as SD2,
please refer to SDIO
description for more
details.
If unused, please keep
open.
PCM interface
SIM7100C_User Manual_V1.01
PCM data output. It also can be
multiplexed as GPIO5.
PCM data input. It also can be If unused, please keep
multiplexed as GPIO0 with open.
module wake/interrupt.
PCM data frame sync signal. It
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PCM_CLK
also can be multiplexed as
GPIO2.
PCM data bit clock. It also can be
multiplexed as GPIO3.
76
DO
GPIO1
51
DO
Output as LED control for
network status.
GPIO4
54
DI
Input as RF operating control.
GPIOs
GPIO40
49
DO
GPIO41
52
DO
GPIO43
50
DI
GPIO44
48
I/O
GPIO42
53
I/O
Output as operating status
indicating of module.
It also can output a clock signal
for PCM clock source.
General input/output. It can be
used as wake/interrupt signal to
If unused, keep open.
host from module
General input/output. It can be
used as wake/interrupt signal to
module from host.
General input/output.
It can be configured as SD
detecting.
General input/output.
It can be configured as USIM
card detecting.
RF interface
MAIN _ANT
82
MAIN antenna soldering pad
GNSS_ANT
79
AI
GNSS antenna soldering pad
AUX_ANT
59
AI
Diversity antenna soldering pad
RESET
DI
System reset input, active low.
ISINK
45
DI
Current source of
ground-referenced current sink
ADC1
47
AI
Analog Digital Converter Input
ADC2
46
AI
Analog Digital Converter Input
RF_CFG1
83
I/O
RF_CFG2
84
I/O
RF_CFG3
86
I/O
BOO_CFG0
85
DI
BOO_CFG1
87
DI
Other interface
SIM7100C_User Manual_V1.01
RF control
Boot configure
19
If unused, please keep
open.
They are used to
control RF when
SDIO function is
used.
If unused, keep open.
Recommend placing 2
test points for
debugging. Module
will be forced to go
into USB download
mode by connect 85
and 87 pins to
VDD_1V8 during
power up.
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2.3 Package Dimensions
The following figure shows mechanical dimensions of SIM7100C.
Figure 2: Top dimensions (Unit: mm)
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Figure 3: Side dimensions (Unit: mm)
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Figure 4: Bottom dimensions (Unit: mm)
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2.4 Footprint Recommendation
Figure 5: Footprint recommendation (Unit: mm)
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3 Application Interface Specification
3.1 Power Supply
The power supply pins of SIM7100C include four VBAT pins (pin 62&63, pin 38&39). VBAT directly
supplies the power to RF and baseband circuit. VBAT directly supplies the power to RF PA and baseband
system. Power Supply Pin
4 VBAT pins are dedicated to connect the supply voltage.
Table 7: VBAT Pin description
Pin type
Pin name
Min
Typ
Max
Unit
POWER
VBAT
3.15
3.8
4.2
3.1.1
Design Guide
Make sure that the input voltage at the VBAT pin will never drop below 3.15V even during a transmit
when the current consumption up to more than 700mA. If the power voltage drops below 3.15V, the
module may be shut down automatically. Using large tantalum capacitors (above 300uF) will be the best
way to reduce the voltage drops.
For the consideration of RF performance and system stability, some multi-layer ceramic chip (MLCC)
capacitors (0.1/1uF) need to be used for EMC because of their low ESR in high frequencies. Note that
capacitors should be put beside VBAT pins as close as possible. Also User should minimize the PCB trace
impedance from the power supply to the VBAT pins through widening the trace to 80 mil or more on the
board. The following figure is the recommended circuit.
Figure 6: VBAT input application circuit
Note: The Cd, Ce, Cb, Cc and Cf must be mounted for SIM7100C.
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In addition, in order to get a stable power source, it is suggested to use a zener diode of which reverse
zener voltage is 5.1V and dissipation power is more than 500mW.
Table 8: Recommended zener diode models
No.
Manufacturer
Part Number
Power
Package
On semi
MMSZ5231BT1G
500mW
SOD123
Prisemi
PZ3D4V2H
500mW
SOD323
Vishay
MMSZ4689-V
500mW
SOD123
Crownpo
CDZ55C5V1SM
500mW
0805
3.1.2
Recommended Power supply circuit
We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak
current of power components can rise up to more than 2A. The following figure is the reference design of
+5V input power supply. The designed output for the power supply is 3.8V, here a linear regulator can be
used.
Figure 7: Reference circuit of the LDO power supply
If there is a big difference between the input voltage and the desired output (VBAT), a switching converter
power will be preferable because of its better efficiency, especially at the high current situation. The
following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple
current intrinsically.
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Figure 8: Reference circuit of the DCDC power supply
3.1.3
Voltage monitor
To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two
parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual
value of battery (at the VBAT pin). The voltage is continuously measured at intervals, whenever the
measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For
example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is
low: 3.3v”.
If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module
will be powered off automatically and AT commands cannot be executed any more.
Note: Under-voltage warning function and under-voltage power-off function are disabled by default.
For more information about these AT command, please refer to Document [1].
3.2 Power on/Power off/Reset Time Sequence
3.2.1
Power on Sequence
SIM7100C can be powered on by PWRKEY pin, which starts normal operating mode.
PWRKEY pin is pulled up with a 200k ohm resistor to 1.8V in module. User can power on the SIM7100C
by pulling the PWRKEY pin down for a short time. The power-on scenarios are illustrated in the following
figures.
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Figure 9: Power on Timing Sequence
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Table 9: Power on timing
Symbol
Time value
Parameter
Unit
Min.
Typ.
Max.
180
500
ms
0.5
Ton
The time to pull PWRKEY down to power on
TpD+
The time to indicate connecting with the network
Tpw+
The time to indicate the module is powered on
completely
Tuart
The time to enable UART
Tusb
The time to enable USB
10
Note: Module could be automatically power on by connecting PWRKEY pin to Low level directly.
Before designing, please refer to Document [27] for more detail.
3.2.2
Power off Sequence
The following methods can be used to power down SIM7100C. These procedures will make module
disconnect from the network and allow the software to enter a safe state, and then save data before
completely powering the module off.
Method 1: Power off SIM7100C by pulling the PWRKEY pin down
● Method 2: Power off SIM7100C by AT command
●
User can power off the SIM7100C by pulling PWRKEY down for a specific time. The power off scenario
is illustrated in the following figure.
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Figure 10: Power off timing sequence
Table 10: Power off timing
Symbol
Parameter
Time value
Min.
Typ.
Max.
Unit
0.5
Toff
The time pulling PWRKEY down to power off
TpD-
The time to indicate disconnecting from the network
Tpw-
The time to indicate the module power off completely
Tuart
The time to disable UART
Tusb
The time to disable USB
Trestart
The time to power on again after Tpw-
User can also use the AT command “AT+CPOF” to power down the module. After that, the AT
commands cannot be executed any longer. The module enters the POWER DOWN mode.
VDD_EXT pin can be used to detect whether module is powered on or not. When module is powered
on and firmware goes ready, VDD_EXT will be high level.
Note: For details about “AT+CPOF”, please refer to Document [1].
3.2.3
Reset Function
SIM7100C also have a RESET pin (PIN4) to reset the module. This function is used as an emergency reset
only when AT command “AT+CPOF” and the PWRKEY pin has no effect. User can pull the RESET pin
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to ground, then the module will reset.
This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor
close to the RESET pin is strongly recommended. A reference circuit is recommended in the following
figure.
Figure 11: Reset circuit
Note:50ms, ”.The “value” ranges from 0 to 15,on behalf of the current changes from
0mA to 150mA in steps of 10mA.
3.14.2 ADC
SIM7100C has a dedicated ADC that is available for digitizing analog signals such as battery voltage and
so on; it is on PIN 47 and PIN 46 , namely ADC1 and ADC2 . This ADC is 15 bit
successive-approximation circuit, and electronic specification is shown in the following table.
Table 36: Electronic Characteristics
Specification
Resolution
Analog input bandwidth
Gain Error
Offset Error
Input Range
Min
Typ
Max
15
–
100
-2.5
-3.5
GND
–
+2.5
+3.5
2.2V
Unit
Bits
kHz
LSB
Analog Vdd = ADC reference
2.4MHz sample rate
Sample and hold switch resistance
Input serial resistance
kΩ
Power supply current
Normal operation
1.5
mA
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Comments/Conditions
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Power
Off
supply
current
50
200
nA
User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw
data which is between 0 and 32768. The data can be transformed to any type such as voltage, temperature
etc. Please refer to document [1].
Note: The input signal voltage value in ADC must not be higher than 2.2V.
3.14.3 LDO
SIM7100C has a LDO power output, namely VDD_EXT. The LDO is available and output voltage is
2.85v by default, rated for 150mA. User can switch the LDO on or off by the AT command
“AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.
Table 37: Electronic characteristic
Symbol
Description
Min
Typ
Max
Unit
VDD_EXT
Output voltage
1.7
2.85
3.05
IO
Output current
50
mA
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4 RF Specification
4.1 RF Specification
Table 38: Conducted transmission power
Frequency
LTE-TDD B41
Max
23dBm +2.7dB
Min
-50dBm ±5dB
Table 39: Operating frequencies
Frequency
Receiving
Transmission
LTE Operating frequencies are shown in following table 34.
Note: Operating frequencies of LTE TDD B41 for SIM7100C is 100MHz BW, 2555 ~ 2655
MHz
Table 40: E-UTRA operating bands
(DL)
operating
Uplink (UL) operating band
Downlink
band
BS receive / UE transmit(UL)
BS transmit / UE receive(DL)
1920 MHz~1980 MHz
2110 MHz~2170 MHz
FDD
1850 MHz~1910 MHz
1930 MHz~1990 MHz
FDD
1710 MHz~1785 MHz
1805 MHz~1880 MHz
FDD
1710 MHz~1755 MHz
2110 MHz~2155 MHz
FDD
824 MHz~849 MHz
869 MHz~894MHz
FDD
61
830 MHz~840 MHz
875 MHz~885 MHz
FDD
2500 MHz~2570 MHz
2620 MHz~2690 MHz
FDD
880 MHz~915 MHz
925 MHz~960 MHz
FDD
1749.9 MHz~1784.9 MHz
1844.9 MHz~1879.9 MHz
FDD
10
1710 MHz~1770 MHz
2110 MHz~2170 MHz
FDD
11
1427.9 MHz~1447.9 MHz
1475.9 MHz~1495.9 MHz
FDD
12
699 MHz~716 MHz
729 MHz~746 MHz
FDD
13
777 MHz~787 MHz
746 MHz~756 MHz
FDD
14
788 MHz~798 MHz
758 MHz~768 MHz
FDD
17
704 MHz~716 MHz
734 MHz~746 MHz
FDD
18
815 MHz~830 MHz
860 MHz~875 MHz
FDD
19
830 MHz~845 MHz
875 MHz~890 MHz
FDD
20
832 MHz~862 MHz
791 MHz~821 MHz
FDD
E-UTRA
Operating
Band
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Duplex
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21
1447.9 MHz~1462.9 MHz
1495.9 MHz~1510.9 MHz
FDD
22
3410 MHz~3490 MHz
3510 MHz~3590 MHz
FDD
23
2000 MHz~2020 MHz
2180 MHz~2200 MHz
FDD
24
1626.5 MHz~1660.5 MHz
1525 MHz~1559 MHz
FDD
25
1850 MHz~1915 MHz
1930 MHz~1995 MHz
FDD
26
814 MHz~849 MHz
859 MHz~894 MHz
FDD
27
807 MHz~824 MHz
852 MHz~869 MHz
FDD
28
703 MHz~748 MHz
758 MHz~803 MHz
FDD
31
452.5 MHz~457.5 MHz
462.5 MHz~467.5 MHz
FDD
33
1900 MHz~1920 MHz
1900 MHz~1920 MHz
TDD
34
2010
2010 MHz~2025 MHz
TDD
35
1850 MHz~1910 MHz
1850 MHz~1910 MHz
TDD
36
1930 MHz~1990 MHz
1930 MHz~1990 MHz
TDD
37
1910 MHz~1930 MHz
1910 MHz~1930 MHz
TDD
38
2570 MHz~2620 MHz
2570 MHz~2620 MHz
TDD
39
1880 MHz~1920 MHz
1880 MHz~1920 MHz
TDD
40
2300 MHz~2400 MHz
2300 MHz~2400 MHz
TDD
41
2496 MHz~2690 MHz
2496 MHz~2690 MHz
TDD
42
3400 MHz~3600 MHz
3400 MHz~3600 MHz
TDD
43
3600 MHz~3800 MHz
3600 MHz~3800 MHz
TDD
44
703 MHz~803 MHz
703 MHz~803 MHz
TDD
MHz~2025 MHz
Table 41: Conducted receive sensitivity
Frequency
LTE TDD
Receive sensitivity
See table 36.
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4.2 Antenna Design Guide
SIM7100C provides RF antenna interface. Customer’s antenna should be located in the host board and
connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace
impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the
antenna pad and antenna should meet the following requirements:
LTE (F<1GHz) <0.5dB
● LTE (1GHz
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