Dialog Semiconductor SC14S DECT Module User Manual SC14CVMDECT SF01 V16

Dialog Semiconductor BV DECT Module SC14CVMDECT SF01 V16

user manual CVMDECT

SC14CVMDECT SF Cordless Voice Module

DATASHEET

General description

The SC14CVMDECT SF is a member of the Cordless

Module family with integrated radio transceiver and

baseband processor in a single package. It is designed

for hosted and embedded cordless voice and data

applications in the DECT frequency band. Its simple to

use API commands allow easy setup of a wireless link

between two or more nodes.

Features

nSupports EU-DECT (CAT-iq V2.0, v3.0 partly),

DECT6.0 for North America and Japan DECT

nETSI (EU-DECT) and FCC (DECT 6.0) certified

nJ-DECT pre-certified

nETSI 300 444 (DECT GAP) compliant

nUp to 6 Portable Parts or ULE devices registered per

fixed part

nUART interface to external host

nControllable via API command set

nSupports voice and data

nRF range: 1870 MHz to 1930 MHz

nReceiver sensitivity < -93 dBm

nTransmit power

• EU: 24 dBm: 1881MHz - 1897MHz

• USA: 20 dBm: 1921MH - 1928MHz

• JP: 23 dBm: 1895MHz - 1903MHz

nAntenna embedded, supports external antennas

nPower supply voltage: 2.1 V to 3.45 V

nSmall form factor (19.6 mm x 18.0 mm x 2.7 mm)

nContains both PP and FP functionality

nProgram memory available for custom software

nSupports both internal and external (hosted) applica-

tions

nOperating temperature range: -40 °C to +85 °C

Application examples

nCordless intercom

nCordless baby monitor

nWireless data applications up to 54 kbit/s

________________________________________________________________________________________________

System diagram

SC14CVMDECT

Fixed Part

Data

Host

SC14CVMDECTHost

US/EU/JP*

DECT

Portable Part 0

SC14CVMDECTHost

Portable Part 1

SC14CVMDECTHost

Portable Part 5

Voice

Voice + data: 32 kbit/s + 1.6 kbit/s

Data: 54 kbit/s

* Only end-products

can be CAT-iq certified

Voice + data

Data

Voice + data

Data

Voice + data

Data

SC14CVMDECT SF

Cordless Voice Module

JULY 1, 2014 V1.6

SC14CVMDECT SF Cordless Voice Module

Table of Contents

1.0 Connection diagram. . . . . . . . . . . . . . . . . . . . . . . . 4

1.1 PIN DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . 5

2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.2 REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 GLOSSARY AND DEFINITIONS . . . . . . . . . . . 8

3.0 Cordless Voice Module functionality . . . . . . . . . 10

3.1 MODULE HARDWARE . . . . . . . . . . . . . . . . . . 10

3.2 SOFTWARE CONTROL . . . . . . . . . . . . . . . . . 10

3.3 DECT PROTOCOL STACK . . . . . . . . . . . . . . 10

3.4 PORTABLE PART CONFIGURATION . . . . . . 11

3.5 FIXED PART CONFIGURATION . . . . . . . . . . 11

3.6 VOICE COMMUNICATION . . . . . . . . . . . . . . . 12

3.7 LIGHT DATA APPLICATION . . . . . . . . . . . . . 12

3.8 LU10 DATA APPLICATION . . . . . . . . . . . . . . 12

3.9 GENERAL FEATURES . . . . . . . . . . . . . . . . . . 14

4.0 Functional description. . . . . . . . . . . . . . . . . . . . . 15

4.1 UART INTERFACE . . . . . . . . . . . . . . . . . . . . . 15

4.2 VES (VIRTUAL EEPROM STORAGE) . . . . . . 15

4.2.1 VES layout . . . . . . . . . . . . . . . . . . . . . . . 15

4.2.2 VES access by MCU . . . . . . . . . . . . . . . 15

4.3 AUDIO CONFIGURATIONS . . . . . . . . . . . . . . 15

4.3.1 Audio connection . . . . . . . . . . . . . . . . . . 16

4.4 AUDIO ROUTING . . . . . . . . . . . . . . . . . . . . . . 17

4.4.1 FP AUDIO ROUTING . . . . . . . . . . . . . . 17

4.4.2 FP audio level adjustment . . . . . . . . . . . 17

4.4.3 PP audio routing . . . . . . . . . . . . . . . . . . 17

4.4.4 PP audio codec adjustment . . . . . . . . . . 17

4.4.5 General audio adjustment . . . . . . . . . . . 17

4.4.6 PP volume . . . . . . . . . . . . . . . . . . . . . . . 17

4.4.7 PP audio equalization . . . . . . . . . . . . . . 17

4.5 PP AUDIO MODES . . . . . . . . . . . . . . . . . . . . . 19

4.5.1 Power management. . . . . . . . . . . . . . . . 19

4.5.2 Earpiece mode. . . . . . . . . . . . . . . . . . . . 20

4.5.3 Alert mode . . . . . . . . . . . . . . . . . . . . . . . 20

4.6 CALL HANDLING . . . . . . . . . . . . . . . . . . . . . . 20

4.6.1 FP to PP call . . . . . . . . . . . . . . . . . . . . . 20

4.6.2 PP to FP call . . . . . . . . . . . . . . . . . . . . . 20

4.6.3 Intercom . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.6.4 Conference . . . . . . . . . . . . . . . . . . . . . . 20

4.6.5 Page call . . . . . . . . . . . . . . . . . . . . . . . . 20

4.7 TONE/MELODY HANDLING. . . . . . . . . . . . . . 20

4.8 DATE AND REAL-TIME CLOCK. . . . . . . . . . . 20

4.9 BATTERY MANAGEMENT . . . . . . . . . . . . . . . 21

4.10 PROTOCOL STACK . . . . . . . . . . . . . . . . . . 21

4.10.1 DECT TBR22 . . . . . . . . . . . . . . . . . . . . 21

4.10.2 Out-of-Range handling. . . . . . . . . . . . . 22

4.10.3 Preamble antenna diversity . . . . . . . . . 22

4.10.4 Broadcasting messages. . . . . . . . . . . . 22

4.10.5 IWU to IWU messaging . . . . . . . . . . . . 22

4.11 REGISTRATION . . . . . . . . . . . . . . . . . . . . . . 22

4.11.1 Handling product identities. . . . . . . . . . 22

4.11.2 Deregistration. . . . . . . . . . . . . . . . . . . . 23

4.12 PCM INTERFACE . . . . . . . . . . . . . . . . . . . . . 23

4.12.1 PCM Interface for FP . . . . . . . . . . . . . . 23

4.12.2 PCM_FSC frequency. . . . . . . . . . . . . . 23

4.12.3 Length of PCM_FSC . . . . . . . . . . . . . . 23

4.12.4 Start position of FSC . . . . . . . . . . . . . . 23

4.12.5 PCM clock frequency . . . . . . . . . . . . . . 23

4.12.6 PCM data mode . . . . . . . . . . . . . . . . . . 24

4.12.7 PCM Interface for PP. . . . . . . . . . . . . . 27

4.13 ANTENNA OPERATION . . . . . . . . . . . . . . . . 27

4.13.1 Internal antenna only . . . . . . . . . . . . . . 28

4.13.2 Internal and external antenna with FAD 28

5.0 CAT-iq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . 29

5.2 CAT-IQ PROFILE OVERVIEW . . . . . . . . . . . . 29

5.2.1 Supported main features . . . . . . . . . . . . 29

6.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.1 GENERAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . 30

6.3 OPERATING CONDITIONS . . . . . . . . . . . . . . 31

6.4 DIGITAL INPUT/OUTPUT PINS . . . . . . . . . . . 31

6.5 ANALOG FRONT END . . . . . . . . . . . . . . . . . . 32

6.6 BATTERY MANAGEMENT . . . . . . . . . . . . . . . 36

6.7 BASEBAND PART . . . . . . . . . . . . . . . . . . . . . 36

6.8 RADIO (RF) PART . . . . . . . . . . . . . . . . . . . . . 37

6.9 RF POWER SUPPLY . . . . . . . . . . . . . . . . . . . 38

6.10 RF CHANNEL FREQUENCIES. . . . . . . . . . . 39

7.0 Design guidelines. . . . . . . . . . . . . . . . . . . . . . . . . 40

7.1 APPLICATION SOFTWARE FOR PP . . . . . . 40

7.2 APPLICATION SOFTWARE FOR FP . . . . . . 40

7.3 HARDWARE DESIGN GUIDELINES . . . . . . . 40

7.3.1 Circuit design guidelines . . . . . . . . . . . . 40

7.3.2 PCB Design Guidelines . . . . . . . . . . . . . 41

7.4 MODULE PLACEMENT ON THE MAIN BOARD

SC14CVMDECT SF Cordless Voice Module

Table of Contents

7.5 PATTERN FOR PIN 79 ON THE MAIN BOARD.

7.6 PRECAUTIONS REGARDING UNINTENDED

COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

8.0 Example Application Diagram. . . . . . . . . . . . . . . 43

9.0 Notices to OEM. . . . . . . . . . . . . . . . . . . . . . . . . . . 44

9.1 FCC REQUIREMENTS REGARDING THE END

PRODUCT AND THE END USER. . . . . . . . . . 44

9.2 IC REQUIREMENTS REGARDING THE END

PRODUCT AND THE END USER . . . . . . . . . 44

9.3 PRECAUTIONS REGARDING UNINTENDED

COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.4 END APPLICATION APPROVAL . . . . . . . . . . 45

9.5 SAFETY REQUIREMENTS . . . . . . . . . . . . . . 45

10.0 Package information . . . . . . . . . . . . . . . . . . . . . 46

10.1 SOLDERING PROFILE . . . . . . . . . . . . . . . . . 46

10.2 MOISTURE SENSITIVITY LEVEL (MSL) . . . 46

10.3 COPPER PAD, SOLDER OPENING AND

STENCIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

10.4 MECHANICAL DIMENSIONS . . . . . . . . . . . . 49

11.0 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 50

SC14CVMDECT SF Cordless Voice Module

1.0 Connection diagram

Figure 1 Connection diagram (top view, leads face down)

Order numbers:

SC14CVMDECT SF01T (tray, MPQ = 600 pcs) up to 6 PPs can be registered.

GND

PARADET/P3[4]

P2[0]/ECZ1/PWM0/LED3

GND

TP1

RINGOUT/RINGING/P3[5]

GND

RFP0

GND

ADC0/P3[3]

LSRn/LINEOUT/AGND

LSRp/LINEOUT/AGND

VREFm

MICn/CIDOUT

MICp/CIDINn

VREFp

MICh/LINEIN

CIDINp/P3[2]

RINGp/P3[7]

RINGn/P3[6]

DC_I

DC_SENSE

SOCn

SOCp

ADC1/INT0/P1[0]

DC_CTRL

VDDE/RDI/INT5/P1[5]

ULP_PORT

ULP_XTAL

PON/P1[6]

CP_VOUT1

GND

DP0/PAOUTn/P3[0]

VDDPA

DP1/PAOUTp/P3[1]

CHARGE/P1[7]

CHARGE_CTRL

VBATSW

VBATIN

VDDOUT

GND

SIO/INT3/P1[3]

TDOD/INT4/P1[4]

BXTAL/INT7/P2[7]

SK/INT2/P1[2]

LE/INT1/P1[1]

P0[7]/PWM1SPI_DI

P0[6]/SPI_DO

GND

WTF_IN/P2[6]

P0[4]/SPI_EN

P0[3]/SCL2/URX2

P0[5]/SPI_CLK

P0[2]/SDA2/UTX2

P0[1]/PWM0/URX

P0[0]/UTX

GND

RSTn

JTAG

SF/P2[5]/PCM_FSC

DP3/P2[4]/SCL1/PCM_DO

DP2/P2[3]/SDA1/PCM_DI

CLK100/P2[2]/PCM_CLK

P2[1]/ECZ2/PWM1/LED4

RFP0n

P0n

RF1

GND

RF0

GND

SC14CVMDECT SF Cordless Voice Module

1.1 PIN DESCRIPTION

Table 1: Pin description

Module

Pin name

(Note 1)

In/

Out

Iout

Drive

(mA)

Reset

State

(Note 2)

Description

1GND - - -Ground

2 P0 O 8 Hi-Z Control port for FAD. See 4.13

3 RFP0 O 8 Hi-Z Control port for FAD. See 4.13

4 P0n O 8 Hi-Z Control port for FAD. See 4.13

5 RFP0n O 8 Hi-Z Control port for FAD. See 4.13

6GND - - -Ground

7 VREFp O - I Positive microphone supply voltage

8 MICp I - I Positive microphone input

9 MICn I - I Negative handset microphone input

10 MICh I - I Headset microphone input with fixed input protection

11 VREFm - - - Negative microphone reference (star point), connect to GND.

12 LSRp O - O Positive loudspeaker output

13 LSRn O - O Negative loudspeaker output

14 GND - - - Ground

15 P3[3] IO 8 I I/O Port

16 P1[0] IO 2 I-PU I/O Port

17 SOCp I - I Battery state of charge positive input.

Connect to GND if not used. See 4.9

18 SOCn I - I Battery state of charge negative input. Star point connected to the

SOC resistor. Connect to GND if not used. See 4.9

19 DC_SENSE I I Voltage sense input. Connect to GND if not used.

20 DC_I I I Current sense input of DC/DC converter. Connect to GND if not

used

21 DC_CTRL O 2 O-0 Switching clock for the DC/DC converter.

22 CHARGE_CTRL O 1 O-0 Charge control pin.

Leave unconnected if not used. See 4.9

23 CHARGE I - I-PD

(270k

fixed

pull-

down)

Charger connected indication. Switches on the device if voltage >

1.5 V. Must be connected to charger via resistor R >

(Vcharger_max-3 V)/10 mA (round to next largest value in range).

See 4.9

24 PAOUTp IO 500 O-0 (5k

fixed

pull-

down)

CLASSD loudspeaker positive outputs

25 VDDPA I - - CLASSD Audio Amplifier supply voltage up to 3.45 V.

GND or leave unconnected if CLASSD Audio Amplifier is not used.

26 CP_VOUT1 O - I Charge Pump Output 1.

A capacitor of 1 F to GND is internally connected to this pin.

27 PAOUTn IO 500 O-0 (5k

fixed

pull-

down)

CLASSD loudspeaker positive output

SC14CVMDECT SF Cordless Voice Module

28 GND - - - Ground

29 PON I - I (270k

fixed

pull-

down)

Power on, Switches on the device if Voltage > 1.5 V.

May be directly connected to VBAT, also with Li-Ion batteries.

After startup the software takes over then PON pin to keep the

device on after which the PON pin may be released.

30 ULP_XTAL I - I 32.768 kHz XTAL clock input. Connect to GND if not used. (Note 3)

31 ULP_PORT I - I Ultra Low Power Port Pin. Connect to GND if not used. (Note 3)

32 P2[7] IO 8 I-PU I/O port

33 P1[5] IO 8 O-1 I/O Port

34 P1[4] IO 1/2 I-PD I/O port

35 P1[3] IO 1/2 I-PD I/O Port

36 P1[2] IO 2 I-PD I/O Port

37 P1[1] IO 2 I-PU I/O Port

38 GND - - - Ground

39 P2[6] IO 2 I-PU I/O port

40 P0[7] / SPI_DI IO 8 I-PU I/O Port

SPI Data Input

41 P0[6] / SPI_DO IO 8 I-PU I/O Port

SPI Data Out

42 P0[5] / SPI_CLK IO 8 I-PU I/O Port

SPI Clock

43 P0[4] / SPI_EN IO 8 I-PU I/O port

SPI_EN: Active low.

44 P0[3] / SCL2 /

URX2

IO 8 I-PU I/O port

Access bus clock, UART Serial In.

45 GND - - - Ground

46 P0[2] / SDA2 /

UTX2

IO 8 I-PU I/O port

Access bus data, UART Serial Out.

47 P0[1] / URX IO 8 I-PD

(10k)

I/O port

UART Serial In

48 P0[0] / UTX O 8 I-PU I/O Port

UART Serial Out

49 GND - - - Ground

50 GND - - - Ground

51 GND - - - Ground

52 RSTn I 1 I-PU

(200k

pull-up)

Active low Reset input with Schmitt-trigger input, open-drain output

and pull up resistor to internal VDD. Input may not exceed 2.0 V. An

internal capacitor of 47 nF is mounted on this pin.

53 JTAG IO 8 I-PU JTAG-SDI+; one wire Debug interface with open-drain.

Requires external 1 k pull-up to VDD.

54 P2[5]/PCM_FSC IO 8 I-PU I/O Port

PCM_FSC: PCM Frame Sync

55 P2[4]/SCL1/

PCM_DO

IO 8 I-PU I/O port

SCL1; I2C clock

PCM_DO: PCM Data output

Table 1: Pin description (Continued)

Module

Pin name

(Note 1)

In/

Out

Iout

Drive

(mA)

Reset

State

(Note 2)

Description

SC14CVMDECT SF Cordless Voice Module

Note 1: “NC” means: leave unconnected.

“GND” means internally connected to the module ground plane. Every GND pin should be connected to the main PCB.ground plane.

Note 2: All digital inputs have Schmitt trigger inputs. After reset all I/Os are set to input and all pull-up or pull-down resistors are enabled unless oth-

erwise specified.

PU = Pull-up resistor enabled, PD = Pull-down resistor enabled, I = input,

O = output, Hi-Z = high impedance, 1 = logic HIGH level, 0 = logic LOW level

Refer also to Px_DIR_REGs for INPUT/OUTPUT and Pull-up/Pull-down configurations

Note 3: All ULP pins use snap-back devices as ESD protection, which (when triggered) have a holding voltage below the typical battery voltage.

This means that the snap-back device of a ULP pin may remain conductive, when triggered while the pin is directly connected to the battery

voltage. If any of the ULP pins are directly or indirectly electrically accessible on the outside of the application, system level ESD precau-

tions must be taken to ensure that the snap-back device is not triggered while in active mode, to prevent the chip from being damaged.

56 P2[3]/SDA1 /

PCM_DI

IO 8 I-PU I/O Port

SDA1: I2C Data

PCM_DI: PCM Data input

57 P2[2]/PCM_CLK I/O 8 I-PD I/O Port

PCM_CLK: PCM clock input/output

58 P2[1] / PWM1 /

LED4

IO 8 I I/O Port

PWM1: Pulse Width Modulation output

LED4: 2.5 mA/5 mA LED current sink

59 P2[0]/ PWM0 /

LED3

IO 8 I I/O Port

PWM0: -

LED3: 2.5 mA/5 mA LED current sink

60 GND - - - Ground

61 VDDOUT - - - Test purpose only. Must be left unconnected.

62 VBATSW Test purpose only. Must be left unconnected.

63 VBATIN I - - Main supply voltage < 3.45 V.

64 VBATIN I - - Main supply voltage < 3.45 V.

65 P3[2] IO 8 I I/O Port

66 P3[7] IO 4 I I/O Port

67 P3[6] IO 4 I I/O Port

68 P3[5] IO 4 I I/O Port

69 P3[4] IO 8 I I/O Port

70 GND - - - Ground

71 GND - - - Ground

72 GND - - - Ground

73 RF1 - - - RF signal for external antenna. See 4.13

74 GND - - - Ground

75 RF0 - - - RF signal for external antenna. See 4.13

76 GND - - - Ground

77 GND - - - Ground

78 GND - - - Ground

79 TP1 - - - Tuning point for internal antenna. Follow instructions of Section 7.5.

80 GND - - - Ground

81-88 TP2 to TP9 NC Must be left unconnected. See section 7.3.2 and Figure 36.

Table 1: Pin description (Continued)

Module

Pin name

(Note 1)

In/

Out

Iout

Drive

(mA)

Reset

State

(Note 2)

Description

SC14CVMDECT SF Cordless Voice Module

2.0 Introduction

2.1 SCOPE

The SC14CVMDECT SF is a programmable DECT

module for voice and data services. The internal soft-

ware stack receives commands and data from the

application, for instance to set up a link to other mod-

ules. The application software can be implemented on

the module itself or on an external host processor. The

internal FLASH provides user space where custom

applications can be located.

The module converts analog signals to a digital stream,

compresses/decompresses them according to the

DECT standards and transmits/receives them over the

air interface. The DECT protocol stack in each module

supports both PP and FP functionality.

The embedded software running on the internal micro-

controller (CR16) supports all protocol layers up to the

network layer. The module can be controlled by soft-

ware running on the internal controller as well as from

an external controller via the UART.

2.2 REFERENCES

1. CVM FP API Documentation package

2. CVM PP API Documentation package

3. Athena Eclipse User Manual, v1.02, Dialog

Semiconductor, Cordless Software + Tools

4. SC14CVMDECT EEPROM (VES) MAP

5. AN-D-174, SC14480 Battery Management;

using the State of Charge function, Dialog Sem-

iconductor, Application Note

6. AN-D-204, RF settings in Natalie, Dialog Semi-

conductor, Application note

7. AN-D-211, SC14CVMDECT External antenna

design guidelines, Dialog Semiconductor, Appli-

cation note

2.3 GLOSSARY AND DEFINITIONS

AFE Analog Front End

API Application Programming Interface

software between the MCU and

SC14CVMDECT SF

Baby monitor Same as intercom but optionally voice

activated

CAT-iq Cordless Advanced Technology, Internet

and Quality

Codec Coder and Decoder converts analog

signals to digital signals and vice versa.

Conference Same as intercom, but including an

external party.

CRC Cyclic Redundancy Check

CVM Cordless Voice Module

DECT Digital Enhanced Cordless Telephone

DSP Digital Signal Processor

EMC Equipment Manufacturer’s Code

ESD ElectroStatic Discharge

FAD Fast Antenna Diversity

FP Fixed Part

GAP General Access Profile (DECT)

GFSK Gaussian Frequency Shift Keying

Inband tones Tones played by the application itself

and not from external e.g. line.

Intercom Internal call between FP and one or

more PPs

IPEI International Portable Equipment Identity

(please refer to ETSI EN 300 175-6)

IWU InterWorking Unit (please refer to ETSI

EN 300 175-1)

LCD Liquid Crystal Display

LDO Low Drop Out (regulator)

LDR Low Data Rate

MCU Micro Controller Unit

MMI Man Machine Interface (keypad, LCD,

buzzer, microphone, earpiece, speaker,

headset)

NSMD Non Solder Mask Defined (pad)

NTP Normal Transmitted Power

PAEC Perceptual Acoustic Echo Canceller

PC Personal Computer, IBM compatible

PCB Printed Circuit Board without

components

PP Portable Part

PSTN Public Switched Telephone Network

POTS Plain Old Telephone System

RF Radio Frequency

RFPI Radio Fixed Part Identity (please refer to

ETSI EN 300 175-6)

RLR Receive Loudness Rating

RSSI Radio Signal Strength Indication (please

refer to ETSI EN 300 175-1)

Sidetone Feedback of microphone signal to

earpiece.

SLR Sending Loudness Rating

SPI Serial Peripheral Interface Bus

UART Universal Asynchronous Receiver and

Transmitter

ULE Ultra Low Energy

VAD Voice Activity Detection

SC14CVMDECT SF Cordless Voice Module

VES Virtual EEPROM Storage

Walkie Talkie Call between two PPs without an FP

SC14CVMDECT SF Cordless Voice Module

3.0 Cordless Voice Module function-

ality

This section describes the key functions and features

supported by the SC14CVMDECT SF as shown in Fig-

ure 2.

3.1 MODULE HARDWARE

The SC14CVMDECT SF internal hardware consists of:

• An internal microprocessor is running from FLASH

and handles the API call coming from UART or

embedded user software.

• A 4 kB VES (Virtual EEPROM Storage) used by the

protocol stack and for user variables.

• A DSP for the audio signal processing like ADPCM

voice compression towards the CODEC.

• A CODEC converts the analog signals to digital sig-

nals and vise versa.

• Input/Output ports which can be toggled high/low as

an output or a high/low digital level can be read as

an input.

• A 20.736 MHz XTAL. This crystal is automatically

tuned by the PP module software for optimal radio

performance.

• Voltage regulators convert the external supply volt-

age (VBAT) to stable supply voltages for the core

and the I/Os.

• A DECT radio transceiver with a built-in antenna cir-

cuit. The antenna itself is integrated into the module,

relieving the product designer from RF expertise.

• A full duplex UART for communication with an

optional host processor.

3.2 SOFTWARE CONTROL

The application software is written by the customer and

has to manage the call control and also the MMI func-

tions. The supported API software includes the Net-

work layer that is defined in figure 1 of the EN300 175-

3 document, which describes the DECT protocol stack.

Detailed functions and data flows, including some

example sequences, can be found in document refer-

ence [1] for FP and [2] for PP.

3.3 DECT PROTOCOL STACK

The SC14CVMDECT SF internal protocol stack is

based on the ETSI DECT specifications and is compli-

ant with ETSI 300 444 (GAP).

The product supports up to 6 DECT GAP compliant PP

units to one FP station.

Figure 2 SC14CVMDECT SF functional overview

FLASH User SW UART XTAL

Phoenix Host API

CODEC / PCM

API commands

UART interface to host

SPI

Ports

Port PinsPCM PortHead SetDECT RF

DSP

Protocol

Stack

Radio

SC14CVMDECT SF Cordless Voice Module

3.4 PORTABLE PART CONFIGURATION

A Portable Part configuration with SC14CVMDECT SF

requires additional external parts as shown in Figure 3. .

Table 2 provides an overview of the supported inter-

faces for a portable part.

Note 4: AFE setting is configurable, refer to document [2].

3.5 FIXED PART CONFIGURATION

A Fixed Part configuration with SC14CVMDECT SF

requires additional external parts as shown in Figure 4.

Figure 3 PP configuration

SC14CVMDECT

Loudspeaker

MIC (handset)

Earpiece (handset)

MCU

Headset

UART

Ports PCM

Table 2: PP support overview

Item Supported Remark

Battery management Yes Supported by API

Keypad No On external MCU

Display No On external MCU

IO Ports Yes All digital IO port pins can be controlled by API

PCM interface Yes 1x 16 bits serial I/O, PCM_FSC 8 kHz/16 kHz

UART Yes 115.2 kbit/s, used for API-commands

Headset detection Yes Supported by API

LSR (Earpiece, headset) Yes Connected to LSRp and/or LSRn

supports single-end and differential (Note 4)

MIC (Earpiece, headset,

handsfree)

Yes Connected to MICp and/or MICn and/or MICh

supports single-ended and differential (Note 4)

Handsfree speaker Yes Connected to PAOUTp/n (Note 4)

Radio Yes Integrated single antenna and support for external antenna(s)

SC14CVMDECT SF Cordless Voice Module

Table 3 provides the overview of required and availa-

ble interfaces for a basic or a feature rich cordless FP

with the SC14CVMDECT SF. .

Note 5: AFE setting is configurable, refer to document [1].

3.6 VOICE COMMUNICATION

An FP supports up to 6 registered PPs, where 4 of

these PPs can be in a call at the same time. Multiple

simultaneous calls are supported. Supported voice

codec is G.726 (32 kbit/s ADPCM) and G.722 (64 kbit/s

ADPCM). See Figure 5.

3.7 LIGHT DATA APPLICATION

The SC14CVMDECT SF supports Low Data Rate

(LDR) transmission up to 1.6 kbit/s with IWU to IWU

messaging. The LDR can be used in combination with

voice communication. See Figure 5.

3.8 LU10 DATA APPLICATION

The SC14CVMDECT SF supports CAT-iq LU10 data

transmission up to 54 kbit/s. Since LU10 data commu-

nication uses the B-Field it cannot be used in combina-

tion with voice communication. See Figure 6.

Figure 4 FP configuration

SC14CVMDECT

Loudspeaker

MIC (handset)

Earpiece (handset)

MCU

Supply

Ports

Headset

Regulator

PCM

UART

Table 3: FP support overview

Item Supported Remark

Supply Regulator No Use external 3.3 V LDO

Keypad No On external MCU

Display No On external MCU

IO Ports Yes All digital IO port pins can be controlled via API

PCM interface Yes 4x 16 bits serial I/O, PCM_FSC 8 kHz/16 kHz

UART Yes 115.2 kbit/s, used for API-commands

Headset detection No Not supported by API

LSR (Earpiece, headset) Yes Connected to LSRp and/or LSRn

supports single-end and differential (Note 5)

MIC (Earpiece, headset,

handsfree)

Yes Connected to MICp and/or MICn and/or MICh

supports single-end and differential (Note 5)

Handsfree speaker Yes Connected to PAOUTp/n (Note 5)

PSTN Line interface No Not supported by API

Radio Yes Integrated single antenna and support for external antenna(s)

SC14CVMDECT SF Cordless Voice Module

Figure 5 Voice and LDR data communication

G.726 + 1.6 kbit/s

G.722 + 1.6 kbit/s

SC14CVMDECT

Figure 6 LU10 data application

54 kbit/s

SC14CVMDECT

SC14CVMDECT SF Cordless Voice Module

3.9 GENERAL FEATURES

Standard FP audio control feature.

Note 6: These features can be supported by combined API commands in user software.

Table 4: Supported general features

Functionality (Note 6) PP

support

support Remark

Call handling

Conferencing - Yes Call between FP and 4x PP

Intercom Yes Yes Call between FP and 4x PP

Walkie Talkie mode Yes - Call between PP and PP without FP

Baby monitor Yes - Voice Activated PP. See document reference [2]

Voice over PCM interface Yes Yes -law (64 kbit/s), A-law (64 kbit/s), G.726 ADPCM

(32 kbit/s), G.722 ADPCM (64 kbit/s), Linear (128 kbit/s)

Call transfer Yes Yes Transfer call between PPs on FP

Page call Yes Yes FP pages all PPs (PP locator)

Protocol

Manual registration Yes Yes

Number of registered PPs per FP Yes - 1 to 6

Audio and tone

Microphone mute Yes Yes

Tone generation Yes No Melody generator with 7 polyphonic tones

Audio Volume control Yes Yes

Tone Volume control Yes No

Headset support Yes Yes

Handsfree/Speakerphone Yes No

General

Real time clock Yes Yes Accuracy depending directly on crystal

Real time clock synchronization Yes Yes All PP clocks are kept in synchronization with the FP

SW EEPROM (VES) Storage Yes Yes Internal on module

Battery Charge Management Yes No

PSTN line interface support - No PSTN software on request

I/O port support Yes Yes

Port Interrupt support No No

Automatic headset detection Yes No

Low speed data Yes Yes 1.6 kbit/s

LU10 data channel Yes Yes 54 kbit/s

CAT-iq up to version 2.0, 3.0 Yes Yes

ULE applications - Yes Number of ULE subscriptions: up to 180.

SC14CVMDECT SF Cordless Voice Module

4.0 Functional description

4.1 UART INTERFACE

The UART is normally used for API commands, but

can also be used for software upgrades and debug-

ging.

The UART is a full duplex UART with frame type:

1 start bit,

8 data bits (LSB first),

1 stop bit,

no parity,

up to 115.2 kBd.

The UART hardware interface uses only TX/RX

(see Figure 7).

Caution: All signals are 1.8 V (see Table 8, Table 9

and Table 10). An external V.24 line driver must be

provided if the UART port of the module is connected

to a standard V.24 device. Connecting the module

without a driver may damage the module.

4.2 VES (VIRTUAL EEPROM Storage)

4.2.1 VES layout

The SC14CVMDECT SF PP and FP include a 4 kB

VES which is divided into two areas (see Table 5).

VES is supported as virtual EEPROM with the internal

FLASH.

A detailed overview of the VES parameters can be

found in document reference [4].

Some parts of the VES parameters are read into the

SC14CVMDECT SF during the start up and other parts

are used by the SC14CVMDECT SF software during

execution.

The VES parameters are divided into 2 types:

• Factory type

• Normal type

The factory type is specific for the SC14CVMDECT SF

and should only be set by production. The factory type

parameters are either adjustments used by the base-

band or the radio interface, or are used to set up the

SC14CVMDECT SF into special modes. The factory

type parameters will only be modified by changing the

factory programmed default value. See document ref-

erence [4].

The “normal” VES parameters can be reset to their

default values via software.

4.2.2 VES access by MCU

The host is able to read or modify the VES parameters

or limited free VES areas via API command.

4.3 AUDIO CONFIGURATIONS

The SC14CVMDECT SF audio supports standard

DECT audio qualities. The audio gain and volume

parameters are placed in the VES. The DECT gains

can be adjusted to meet the TBR38 and TBR10 audio

level requirements by using the SC14CVMDECT SF

application reference design. For other line and acous-

tic designs it is required to adjust and tune the audio

setup.

Figure 7 UART hardware configuration

SC14CVMDECT MCU

TX (serial out), module pin 48

RX (serial in), module pin 47

GND

Table 5: VES map

VES space Size Usage

SC14CVMDECT

3.6 kB Used for RF, audio,

battery, tone setup,

data base, etc.

User 0.4 kB Can be used for

MMI applications

such as User infor-

mation.

SC14CVMDECT SF Cordless Voice Module

4.3.1 Audio connection

The SC14CVMDECT SF PP audio connections are

shown in Figure 8. Refer to "Example Application Dia-

gram" on page 43 for detailed component values.

Earpiece or small loudspeaker connection

The earpiece loudspeaker can be connected either dif-

ferentially or single-ended. Dynamic loudspeakers with

an impedance of 30  can be connected, as well as

ceramic loudspeakers equivalent to 600  and 30 F.

Refer to Table 16 for a detailed specification or the ear-

piece loudspeakers.

The earpiece is connected to the LSRp and LSRn pins.

Microphone connection

The microphone can be connected either single-ended

via MICp or differentially to MICp and MICn.

Headset connection

The headset microphone must be connected to the

MICh pin. The headset earpiece is connected to the

LSRp.

Microphone supply connection

For active microphones a voltage source with high sup-

ply voltage rejection ratio is provided on supply pins

VREFp/VREFm. Filtering of internal and external refer-

ence voltages is provided by an internal capacitor. No

external capacitor shall be connected to pin VREFp. To

avoid audible switching noise it is important that the

ground supply signals are directly “star point” con-

nected to the VREFm and not via a common ground

plane. From this VREFm star point, one connection is

made to the common ground plane.

Loudspeaker connection

For the handsfree operation a 4  loudspeaker must

be connected to the PAOUTp and PAOUTn pins as

shown in Figure 9. The VDDPA is the supply pin.

Refer to Table 19 for a detailed specification of the

external components around the loudspeaker. These

components are necessary to guarantee the lifetime of

the module.

Figure 8 Audio connections

LSRn

LSRp

MICh

MICn

VREFm

MICp

VREFp

Figure 9 Loudspeaker connection

PAOUTp

PAOUTn

VDDPA

VSS/GND

C_VDDPA

Cs_PAOUT

Rs_PAOUT

Cs_PAOUT

Rs_PAOUT

SC14CVMDECT SF Cordless Voice Module

4.4 AUDIO ROUTING

4.4.1 FP AUDIO ROUTING

Figure 10 shows the audio routing for a FP. Input and

output signals are supported both for the internal codec

and the PCM, and the Air interface supports G.726

(32 kbit/s ADPCM) and G.722 (64 kbit/s ADPCM). The

internal software supports up to 4 audio channels

simultaneously. Supported sample rates are 8 kHz and

16 kHz.

FP does not support acoustic or line echo cancellation.

4.4.2 FP audio level adjustment

The internal codec audio levels can be controlled with

the parameters MicGain and LsrGain.

The MicGain range is 0 to 30 dB in steps of 2 dB and a

value of -128 will mute the input signal, default is 0 dB.

The LsrGain range is +2 dB to -12 dB in steps of 2 dB,

default is +2 dB. See document reference[1].

4.4.3 PP audio routing

Figure 11 and Figure 12 show the different audio rout-

ing modes of a PP. Figure 11 shows an overall audio

routing and Figure 12 shows the detailed audio routing

for the speakerphone of PP (FP does not support

speakerphone).

4.4.4 PP audio codec adjustment

The audio codec settings for the loudspeaker and

microphone must be pre-configured in the VES for

each mode. The VES parameter fields for

Audio.Earp.xxx

Audio.Heads.xxx

Audio.SpkPh.xxx

have a default value and maybe fine-tuned for the

application. See document reference[4].

4.4.5 General audio adjustment

For each audio mode, the receive (RLR) and transmit

(SLR) audio paths must be adjusted. RLR and SLR are

adjusted in the registers in the VES for each audio

state; see document reference [4]. Figure 13 shows

this image.

4.4.6 PP volume

The PP supports 6 volume steps, which are VES con-

figurable through parameter fields Audio.Earp.Vol.xxx,

the Audio.Heads.Vol.xxx and Audio.SpkPh.Vol.xxx.

The volume steps must be set initially in the VES dur-

ing production; see document reference [4].

4.4.7 PP audio equalization

To enable adjustments of the frequency response the

PP contains four programmable filters: 2 in RX direc-

tion and 2 in TX direction (see Figure 11).

By default these filters are loaded with bypass coeffi-

cients. These can be modified by loading new coeffi-

cients via API commands.

Equalizer filters are part of the audio routes for all

audio modes and are placed as shown in Figure 11.

For a detailed description of the filter functionality refer

to the API documentation; see document reference [2].

Figure 10 FP audio routing

Mask &

Shift

G726

Encoder

G726

Encoder

G726

Encoder

G726

Encoder

Mac

G726

Encoder

G726

Encoder

G726

Encoder

G726

Decoder

Mac

G726

Encoder

G726

Encoder

G726

Encoder

G722

Encoder

Mac

G726

Encoder

G726

Encoder

G726

Encoder

G722

Decoder

Mac

Unit

Soft Mute

(bit errors on air interface)

IoCtrl

PCMx

Codec

PCMx

Out

Codec

Out

Mask &

Shift

Mask &

Shift

Mask &

Shift G711

Decoder

G711

Decoder

G711

Decoder

G711

Decoder

CWB

Unpack

CWB

Unpack

CWB

Unpack

CWB

Unpack

IoCtrl

Mask &

Shift

Mask &

Shift

Mask &

Shift

Mask &

Shift G711

Decoder

G711

Decoder

G711

Decoder

G711

Encoder

CWB

Unpack

CWB

Unpack

CWB

Unpack

CWB

Pack

SC14CVMDECT SF Cordless Voice Module

Figure 11 PP audio routing

Earpiece/Headset Mode

Idle Mode

ToneGen

SumUnit

TonegenAu_0

summ1

Mix_Ain_Tone

ECUnit

MicLevel

AnAgc

Analog AGC

ToneGen

SumUnit

TonegenAu_0

summ1

Mix_Ain_ToneEcho Canceller

EC1

type 2

A2_OUT

B2_IN

B1_OUT A1_IN

VolSideToneUnit

Handsfree Mode

Speaker

VOLCTRL

digitaloutgain

Limiter

RMSdetector

summ2

VolSideTone

EqUnit_0

VolSideToneUnit

Earpiece Earpiece

Rx Filters

PFILT 1-3 or

IIRSOS 1-3

Rx Filters

PFILT 1-3 or

IIRSOS 1-3

NC100Hz

RFI CancellerTx Filters

PFILT 1-3 or

IIRSOS 1-3

Pass Through

CodecUnit

EqUnit_0

EqUnit_1 RfiSuppUnit

Digital

Gain &

Limiter

Plvl

summ2

VolSideTone

ECUnit

MicLevel

AnAgc

Analog AGC

ToneGen

SumUnit

TonegenAu_0

summ1

Mix_Ain_ToneEcho Canceller

AEC/PAEC/

Handsfree

A2_OUT

B2_IN

B1_OUT A1_IN

VolSideToneUnit

Rx Filters

PFILT 1-3 or

IIRSOS 1-3

NC100Hz

RFI CancellerTx Filters

PFILT 1-3 or

IIRSOS 1-3

Pass Through

CodecUnit

EqUnit_0

EqUnit_1 RfiSuppUnit

Digital

Gain &

Limiter

Plvl

summ2

VolSideTone

Noise

Gate

Noise Gate

NoiseGateUnit

Noise Gate only used together with PAEC

CNG

Comfort Noise

Generator

CngUnit Comfort Noise Generator only used together with PAEC

Figure 12 Extended speakerphone for PP

Filters

3 x biquad

Microphone Speaker

ClassD

Digital

Gain

VolSideTone

Peak

limiter

PAEC UNIT

Hfree

switch

RMS RMS

RMSRMS

PAEC

FFT

iFFT

PAEC engine

LMS

FIR

gains

Filters

3 x biquad

Post gain

Biquad

Air Interface

Rx Noise

Gate

Pre gain

Comfort

Noise

PAEC Rx Gain

SC14CVMDECT SF Cordless Voice Module

4.5 PP AUDIO MODES

The PP audio handling consists of four audio states

(see Figure 14). In these states the audio subsystem is

configured for a certain audio mode:

1. Idle mode (not relevant for microphone configu-

ration)

2. Earpiece mode (Handset speaker)

3. Handsfree or Speakerphone mode

4. Headset mode

Selection between the modes is done via API calls; see

document reference [2].

The Alert state is for tone playing and is entered auto-

matically when tones are played using the API calls.

The Alert state can originate from idle, earpiece,

handsfree or headset mode.

4.5.1 Power management

To minimize the current consumption the PP will shut

down all codec amplifiers in Idle mode. This means

that all reference voltages in the analog front-end will

be disabled. This feature can be disabled in the VES if

the reference voltages for some reasons are needed in

Idle mode.

Figure 13 Handset volume configuration

Figure 14 PP audio modes

Idle

Earpiece

Audio

Handsfree

Audio

API_PP_ AUDIO_SET_ MODE_ REQ

(API_ AUDIO_ MODE_ EARPIECE )

API_PP_ AUDIO_SET_ MODE_ REQ

(API_ AUDIO_ MODE_ EARPIECE )

API_PP_ AUDIO_SET_ MODE_ REQ

(API_ AUDIO_ MODE_ HANDSFREE )

Headset Audio

API_PP_ AUDIO_SET_ MODE_ REQ

(API_ AUDIO_ MODE_ HEADSET )

API_PP_ AUDIO_ SET_ MODE_ REQ

(API_ AUDIO_ MODE_ EARPIECE )

API_PP_ AUDIO_SET_ MODE_REQ

(API_ AUDIO_ MODE_ HEADSET)

API_PP_ AUDIO_ SET_ MODE_ REQ

( API_ AUDIO_ MODE_ EARPIECE )

SC14CVMDECT SF Cordless Voice Module

4.5.2 Earpiece mode

In Earpiece mode (Handset speaker) an artificial

sidetone is generated. The level of the sidetone can be

adjusted and setup in the VES through parameter

fields Audio.Earp.Vol.Elementx, SideToneGain and

Audio.Heads. Elementx.SideToneGain. In Earpiece

mode it is possible to adjust the volume in the Earpiece

via API calls. In Earpiece mode the PP audio is routed

as shown in Figure 11.

4.5.3 Alert mode

The Alert mode is for generating tones and melodies

on the Speakerphone loudspeaker. In Alert mode it is

possible to adjust the volume in the speaker via API

calls. Inband tones will be affected by the volume

adjustments, since the volume control takes place after

tones are added to the signal. Figure 11 shows the

Audio flow.

4.6 CALL HANDLING

4.6.1 FP to PP call

When the FP initializes a call to a PP, a radio connec-

tion is set up to all PP applications to make it possible

for the PP application software to indicate that there is

an incoming call.

It is possible to configure the ringing indication using

broadcast to make all 6 PPs ringing.

4.6.2 PP to FP call

When the MMI software signals the PP to establish a

call, the PP opens the radio connection to the FP.

4.6.3 Intercom

Figure 15 shows the audio routing of an internal call

between PP1 and PP2. In the FP no transcoding takes

place.

4.6.4 Conference

Figure 16 shows the audio routing of a 9-party confer-

ence call.

4.6.5 Page call

The Page call is a FP functionality used to locate the

registered PPs. FP paging does not establish a normal

audio connection and is terminated when answered by

the PP.

4.7 TONE/MELODY HANDLING

The tone component handles the generation of various

tones in the device. Both tones/melodies in a PP con-

figuration are supported.

The main features of the tone component are:

• Ringer tones and melodies (7-tone polyphonic)

• Alert tones (key sound, error tones, confirmation

tones, etc.)

• Inband tones (dial tone, net-congestion tone, busy

tone, etc.)

• Single tone generation

4.8 DATE AND REAL-TIME CLOCK

The FP has a real-time clock feature, which (when acti-

vated) broadcasts the date and time of day to the PPs.

Activation of the date and real-time clock is done by

setting the date and time via the PP.

The clock supports hours, minutes and date. The date

supports leap years. Daylight saving time is not sup-

ported and must be handled by the MMI application.

The PP clock is synchronized with the FP every time a

broadcast is received. If the PP goes out-of-lock, the

PP itself calculates the clock time until the PP is again

within the range of the FP. The updated clock time can

be read locally via the MMI software.

To adjust the clock in the FP, a service connection can

be set up via commands from the PP.

The clock can also be read and set directly from an

external microprocessor or through the MMI software

on the FP.

The real-time clock accuracy depends directly on the

Figure 15 Intercom connection

CVMDECT

PP2

CVMDECT

PP1

PCM

Figure 16 Conference connection

CVMDECT

PP4

CVMDECT

PP1

4CH PCM

MIX

CVMDECT FP

Analog

SC14CVMDECT SF Cordless Voice Module

SC14CVMDECT SF crystal.

When the SC14CVMDECT SF is configured as a PP,

the clock has the same accuracy as the FP clock.

When the PP synchronises with a FP, the PP crystal is

synchronized with the FP crystal and the PP clock will

change accordingly.

The accuracy is expected to be within 1 minute for up

to 6 weeks without being locked to a FP.

4.9 BATTERY MANAGEMENT

Figure 18 shows a handset application with NiMH.

SOC (State Of Charge) is used to measure the amount

of charge in the rechargeable batteries.

Figure 19 shows an FP application. The FP uses an

external LDO, so the SOC pins are not used and can

be connected to GND.

The PP API supports battery management to calculate

the battery capacity and to indicate charge status.

Refer to API document [2].

The SOC circuit is used to very accurately determine

the amount of charge in rechargeable batteries as well

as the discharge state of Alkaline batteries. This infor-

mation is essential for the battery charging algorithm

and necessary for battery status indication to the user.

Battery status information is supported by the API.

Detailed information can be found in AN-D-174 (Bat-

tery Management).

Pin CHARGE_CTRL is driven high when either the

“sensed voltage on the VBAT pin” is lower than the

voltage setting or “sensed current via SOCp” is lower

than the current setting. Pin CHARGE_CTRL can drive

up to 500 A as source current (see Table 20).

Detailed setting information can be found in document

[4] under “Battery settings”.

4.10 PROTOCOL STACK

The protocol stack handles the RF interface, the MAC-,

DLC-, NWK-layer and encryption according to the

DECT standard EN300 175 1-9.

4.10.1 DECT TBR22

The SC14CVMDECT SF supports the DECT GAP

standard according to EN300 444. For TBR22 type

approval (optional) switching off the authentication and

encryption is required, which can be done with the VES

parameter Tbr_22.

Figure 17 Clock synchronization

Figure 18 Handset (PP) application with 2x NiMH

100

CHARGE_CTRL

0.1

SOC

CHARGE

SOCp

SOCn

Vsupply VBAT IN

Figure 19 Base station (FP) application

CHARGE_CTRL

SOC

CHARGE

SOCp

SOCn

Vsupply VBAT IN

LDO

SC14CVMDECT SF Cordless Voice Module

4.10.2 Out-of-Range handling

When the PP goes in-range or out-of-range a signal is

sent from the PP to the MMI software indicating

whether the PP is in-lock or is out-of-lock with the FP.

4.10.3 Preamble antenna diversity

To optimise the audio quality caused by rapidly chang-

ing radio paths (fading), the SC14CVMDECT SF sup-

ports preamble antenna diversity. The preamble

diversity algorithm uses RSSI measurements to judge

the radio signal strength on both antennas and, as a

result, the choice of the best performing antenna is

determined. This antenna will then be used for the

receive slot and the next transmit slot.

The preamble antenna diversity is supported with two

antennas. The preamble diversity can be controlled by

VES. See document reference [4] and Section 4.13 for

more information about antenna diversity.

4.10.4 Broadcasting messages

Messages consisting of up to 19 bytes can be broad-

casted from FP to all registered PPs. Broadcasting

does not require an active connection. Broadcasting

does not use retransmission, therefore broadcasting is

not secured. If the real time clock is enabled this data is

also broadcasted to all PPs.

4.10.5 IWU to IWU messaging

The protocol in the SC14CVMDECT SF module is

made according to the DECT/GAP standard as defined

in EN 300 175 and EN 300 444.

The DECT standard defines an EMC code (see

EN 300 175-5, chapter 7.7.23.). This code is unique for

a DECT product and must be programmed by the

DECT manufacturer to the correct manufacturer code.

The EMC code must be the same for SC14CVMDECT

SF based product families when using the IWU to IWU

messaging.

If the Dialog default EMC VES value is changed the

IWU to IWU messaging may not operate correctly.

IWU data is transferred in a FA format frame; see

chapter 6.1 in EN 300 175-4. This frame has an infor-

mation field of maximum 63 bytes of which maximum

52 bytes can be used for IWU data. With the

SC14CVMDECT SF it is only possible to send

5 frames in a row without pause. The following frame

must be an acknowledge-frame to secure that the

internal buffers within the SC14CVMDECT SF are

emptied.

The FA frame is segmented in 5 byte fragments and

transferred over the air-interface in the A-field. The 2-

bytes CRC is used to determine if the data is received

correctly. If the data is not received correctly this is sig-

nalled back to the transmitter by the Q2 bit, and the

data is retransmitted.

The FA frame has a 2 bytes checksum, used to deter-

mine if the complete packet is received correctly. If A

checksum error is signalled back to the transmitter and

the complete packet is retransmitted. The packet will

be retransmitted until it is received correctly, or until the

link is closed.

More transmitted packets will be received in the same

order as they were transmitted. The application must

handle flow control, if needed.

4.11 REGISTRATION

The PP and the FP must be paired using a procedure

called Registration. Without Registration, the PP will be

out-of-lock and will not be able to establish a link to a

FP and therefore not be able to make a call. The regis-

tration uses the unique product identities and secures

the PP and FP to allow no cross-communication.

The PP can be de-registered from a FP either via the

FP or PP MMI Software using the command interface.

It is also possible to deregister a PP from another reg-

istered PP.

It is possible to pair a PP and FP during the production.

4.11.1 Handling product identities

To secure that the FP and PPs do not make cross-

communications a unique ID must be entered into the

VES of an FP or PP. For the DECT version the ID for

the FP is named RFPI and for the PP the ID is named

IPEI. These numbers are factory settings.

After a successful registration, the IPEI is stored in the

FP and the RFPI is stored in the PP. In this way the two

parts are known to each other and are allowed to make

connections. The registration data are automatically

stored in VES of the FP and PP while making the regis-

tration.

It is possible to register the same PP to 2 FPs, but it

can only be used in one FP at the same time.

SC14CVMDECT SF Cordless Voice Module

4.11.2 Deregistration

There are two ways of deregistering a PP from an FP:

• Remote FP and PP deregistration

The correct way to deregister a PP from an FP is to

deregister it remotely in the FP. If this is done over a

service connection from the PP to the FP, the FP

actually performs the deregistration and then it is

automatically signalled to the PP which in turn will

drop out-of-lock. Using this method it is also possible

to deregister other PPs registered to the FP from

one PP.

• Removing all registrations at once from the FP (e.g.

in case the original PPs are lost).

4.12 PCM INTERFACE

The PCM supports the following modes:

• SLAVE mode clock sync. In this mode the clock of

the module will be adjusted to follow the PCM pro-

vided by the external PCM master clock. All audio

samples are kept if the provided PCM clock accu-

racy is +/- 5 ppm, which is a DECT radio require-

ment.

• SLAVE no clock sync. In this mode the clock of the

module is not synchronized. This means audio sam-

ple will be discarded in case the master PCM clock

is faster than the clock of the module or samples will

be repeated in case the master PCM clock is slower.

• MASTER mode. The FP is master on PCM interface

and therefore provides PCM clock and PCM_FSC to

an external device.

4.12.1 PCM Interface for FP

The SC14CVMDECT SF supports PCM interface func-

tionality to connect to an external audio source/destina-

tion.

The different PCM interface modes and timings are

shown in Figure 21 to 26. Refer to document [1] for

detailed information.

4.12.2 PCM_FSC frequency

The PCM interface supports the following options:

• 8 kHz

• 16 kHz

4.12.3 Length of PCM_FSC

The PCM interface supports the following options:

• 1: The length of PCM_FSC pulse is equal to

1 data bit.

• 8: The length of PCM_FSC pulse is equal to

8 data bits.

• 16: The length of PCM_FSC pulse is equal to

16 data bits.

• 32: The length of PCM_FSC pulse is equal to

32 data bits.

4.12.4 Start position of FSC

The PCM interface supports the following options:

• The FSC pulse starts 1 data bit before

the MSB bit of the PCM channel 0 data.

• The FSC pulse starts at the same time as

the MSB bit of the PCM channel 0 data.

4.12.5 PCM clock frequency

The PCM interface supports the following options in

master mode:

• 1.152 MHz

• 2.304 MHz

Figure 20 Handling product identities

SC14CVMDECT SF Cordless Voice Module

• 4.608 MHz

• 1.536 MHz

4.12.6 PCM data mode

The PCM interface supports the following PCM data

formats:

• Linear PCM, 8 kHz sample rate.

Used for narrowband calls (G.726).

• Linear PCM, 16 kHz sample rate.

Used for wideband calls (G.722).

• G.711 – A-law, 8 kHz sample rate.

Used for narrowband calls (G.726).

• G.711 – -law, 8 kHz sample rate.

Used for narrowband calls (G.726).

• Compressed wideband using A-law, 16 kHz sample

rate. The 16 bit PCM data is encoded as two 8 bit

audio samples if 8 kHz frame sync is used. Used for

wideband calls (G.722).

• Compressed wideband using -law, 16 kHz sample

rate. The 16 bit PCM data is encoded as two 8 bit

audio samples if 8 kHz frame sync is used. Used for

wideband calls (G.722).

Figure 21 PCM interface formats

Channel 3Channel 3Channel 2Channel 2Channel 1Channel 1Channel 0Channel 0

DSP_PCM_CTRL_REG[5,4,3] = 000

DSP_PCM_CTRL_REG[5,4,3] = 010

DSP_PCM_CTRL_REG[5,4,3] = 100

DSP_PCM_CTRL_REG[5,4,3] = 101

DSP_PCM_CTRL_REG[5,4,3] = 111

DSP_PCM_CTRL_REG[5]=0

DSP_PCM_CTRL_REG[5]=1

PCM Slave mode

D15 D8 D7 D0

PCM Master

DSP_PCM_CTRL_REG[5,4,3] = 001

DSP_PCM_CTRL_REG[5,4,3] = 011

DSP_PCM_CTRL_REG[5,4,3] = 110

PCM_CLK

PCM_DI PCM_DO

PCM_FSC (input)

PCM_FSC

SC14CVMDECT SF Cordless Voice Module

Figure 22 PCM bus with linear PCM, 8 kHz sample rate

PCM CLK

8 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

AP_DATA_FORM AT_LINEAR_8kHz with 8 kHz frame sync:

1st fram e 2nd fram e1st

fram e

1st fram e 1st

fram e

2nd fram e

2nd fram e 2 nd fram e

PCM CLK

16 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 1 Channel 0 Channel 1

1st fram e 1st fram e

AP_DATA_FORM AT_LINEAR_8kHz with 16 kHz frame sync:

1st fram e 1st fra m e

Channel 0 Channel 1

1st fram e 1st fram e

Figure 23 PCM bus with linear PCM, 16 kHz sample rate

PCM CLK

16 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

1st frame 2nd frame1st frame

1st frame 1st frame

2nd frame

2nd frame 2nd frame

AP_DATA_FORMAT_LINEAR_16kHz with 16 kHz frame sync:

SC14CVMDECT SF Cordless Voice Module

Figure 24 PCM bus with G.711 – A-law/-law, 8 kHz sample rate

PCM CLK

8 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 8 kHz frame sync:

1st frame

2nd frame

1st frame

2nd frame

PCM CLK

16 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 1 Channel 0 Channel 1

AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 16 kHz frame sync:

1st frame

1st frame 1st frame 1st frame

Channel 0 Channel 1

1st frame 1st frame

Figure 25 PCM bus with compressed wideband using A-law/ -law, G722 used on air interface

PCM CLK

16 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.722 used on air):

1st frame

2nd frame

PCM CLK

8 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

Channel 0

Channel 1

Channel 0

Channel 1

AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.722 used on air):

1st frame

2nd frame

1st frame

2nd frame

3rd frame4th frame 3rd frame4th frame

4th frame 3rd frame4th frame3rd frame

SC14CVMDECT SF Cordless Voice Module

4.12.7 PCM Interface for PP

The SC14CVMDECT SF supports PCM interface func-

tionality to connect to an external audio source/destina-

tion. Refer to document [2] for detailed information.

• PCM interface mode

supports only master mode.

• PCM_FSC frequency

supports 8 kHz and 16 kHz.

• LENGTH of PCM_FSC

The PCM interface supports the following options:

• 1: The length of PCM_FSC pulse is equal to 1

data bit.

• 8: The length of PCM_FSC pulse is equal to 8

data bits.

• 16: The length of PCM_FSC pulse is equal to 16

data bits.

• 32: The length of PCM_FSC pulse is equal to 32

data bits.

• Start position of FSC

The PCM interface supports the following options:

• The FSC pulse starts 1 data bit before MSB bit of

the PCM channel 0 data.

• The FSC pulse starts at the same time as the

MSB bit of the PCM channel 0 data.

• PCM clock

PCM clock is delivered to an external slave PCM

device from SC14CVMDECT SF.

• PCM Data mode

Supports only linear 16 bit PCM.

4.13 ANTENNA OPERATION

Figure 27 shows the internal circuit of the

SC14CVMDECT SF. Pin RF0 is used for two external

antennas and can also be used for RF test purposes,

so it is recommended to add a 10 pF capacitor as

reserve pattern even when the two external antennas

are not used.

Figure 26 PCM bus with compressed wideband using A-law/ -law, G726 used on air interface

PCM CLK

16 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.726 on air):

1st frame

PCM CLK

8 KHz FSC

PCM in

PCM out

Channel 0

Channel 1

Channel 0

Channel 1

Channel 0

Channel 1

Channel 0

Channel 1

AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.726 on air):

1st frame

2nd frame

1st frame

2nd frame

1st frame

Figure 27 Internal circuit of the SC14CVMDECT SF

RF1

TP1

Internal antenna

RF0

P0n

RFP0n

RFP0

SC14CVMDECT SF Cordless Voice Module

Re-certification of the SC14CVMDECT SF is required if

at least one external antenna is added. On request,

Dialog Semiconductor can provide a pre-certified PCB

layout for an external antenna circuit.

RF1 is also recommended to use and can be con-

nected to the RF cable to be able to do the JPN DECT

type approval test.

4.13.1 Internal antenna only

The FAD function is not enabled if only the internal

antenna is used. In this case pins RFP0, RFP0n, P0

and P0n must be left unconnected.

4.13.2 Internal and external antenna with FAD

Figure 28 shows one external antenna that is con-

nected to RF1 of the SC14CVMDECT SF. This config-

uration supports the FAD function. In this case pins

RFP0, RFP0n, P0 and P0n must be left unconnected.

The software patch code is not needed if the

SC14CVMDECT SF is operated as FP.

Figure 28 One external antenna

External

Antenna

RF1

SC14CVMDECT SF Cordless Voice Module

5.0 CAT-iq

5.1 INTRODUCTION

CAT-iq stands for Cordless Advanced Technology,

Internet and Quality. It is the new global technology ini-

tiative from the DECT Forum, designed for IP-voice

services in the next generation networks. CAT-iq is

based on the regulatory framework of the mature and

reliable DECT technology. It is fully backward compati-

ble to DECT GAP and, as the new cordless phone

standard, focuses on high definition VoIP (HD voice)

as well as data applications as the next generation

Cordless Phone standard.

5.2 CAT-IQ PROFILE OVERVIEW

The CAT-iq profiles are split between voice and data

services, with CAT-iq 1.0 and CAT-iq 2.0 providing fea-

tures to support key voice enhancements, and CAT-iq

3.0 and CAT-iq 4.0 providing features to support data.

5.2.1 Supported main features

• Narrowband (G.726) and wideband (G.722) audio

and switching between these two codecs is sup-

ported.

• CLIP, CNIP, CLIR: Calling Line Identification Pres-

entation, Calling Name Identification, Calling Line

Identity Restriction for internal and external calls.

• Synchronization of call lists and telephone books,

missed calls list, incoming accepted calls list, inter-

nal names list (unique identifier of each handset),

base telephone book

• Synchronization of system settings: PPs are enabled

to change partly the configuration of the system con-

sisting of FP and PPs, these system settings are

handled using the list access method. Using this

method, the FP and the PPs support:

• Synchronization of time and date for FP and PPs,

that FP is enabled to transmit time and date to the

PPs.

• Reset to factory settings, means that PP is ena-

bled to reset the FP configuration to its factory

setting.

• Obtaining FP versions, means that a PP can

obtain the software release of the FP.

• Multiple lines handling: The behaviour of DECT sys-

tems connected to multiple network lines. These

lines may be of different types (VoIP and PSTN for

example). This feature details how calls are placed

in a multiple lines context. This feature also impacts

the behaviour of other services in order to ensure

attachment of PPs to a line, line settings and several

lists properly.

• Parallel calls: initiating a second call in parallel to the

first call, toggling between calls, putting a call on

hold, resuming calls from on hold, call transfer, 3-

party conference with established external and/or

internal calls

• DTMF and tones

• Headset support

• Easy PIN code registration

• Easy pairing

• handset location

• Supports SUOTA (Software Update Over The Air)

and LU10 (max 54 kbit/s).

SC14CVMDECT SF Cordless Voice Module

6.0 Specifications

All MIN/MAX specification limits are guaranteed by design, or production test, or statistical methods unless

note 7 is added to the parameter description. Typical values are informative.

Note 7: This parameter will not be tested in production. The MIN/MAX values are guaranteed by design and verified by characterization.

6.1 GENERAL

Note 8: The resulting range is very dependent of the mechanical design. Dialog Semiconductor is not responsible for this design and as such Dialog

Semiconductor is not responsible for the resulting performance range of the final product.

6.2 ABSOLUTE MAXIMUM RATINGS

Note 9: Absolute maximum ratings are those values that may be applied for maximum 50 hours.

Beyond these values, damage to the device may occur.

Table 6: SC14CVMDECT SF module

ITEM CONDITIONS VALUE UNIT

Dimensions l x w x h 18.0 x 19.6 x 2.7 mm

Weight 1.5 g

Temperature range -40 to +85 °C

Frequency range According to DECT standard 1870 to 1930 MHz

Antenna range According to DECT standard; (Note 8)

- typical outdoor 350 m

- typical indoor 75 m

Standards compliancy ETS 300 444 (DECT GAP), former TBR2214

FCC part 15

Power supply 2 cell NiCd/NiMH

Note: for 1 Li-Ion battery an external LDO is required.

2.10 to 3.45 V

Maximum PCB warpage For entire reflow range 0.1 mm

Table 7: Absolute Maximum Ratings (Note 9)

PARAMETER DESCRIPTION CONDITIONS MIN MAX UNIT

Vbat_max Max voltage on pin VBATIN, VDDPA 3.45 V

Vpon_max Max voltage on pin PON 5.5 V

Vled_max Max voltage on pin LED4, LED3 3.6 V

Vdig_bp_max Max voltage on digital pins with back drive

protection; ports P0 and P2 (except P2.6)

3.6 V

Vdig_max Max voltage on other digital pins 2.0 V

Vana_max Max voltage on analog pins 2.2 V

Vesd_hbm ESD voltage according to human body

model; all pins

2000 V

Vesd_mm ESD voltage according to machine model;

all pins

150 V

SC14CVMDECT SF Cordless Voice Module

6.3 OPERATING CONDITIONS

Note 10: Within the specified limits, a life time of 10 years is guaranteed.

Note 11: A life time of 10 years of the CLASS-D amplifier is guaranteed if switched on for 10% of the time.

Note 12: Within this temperature range full operation is guaranteed.

6.4 DIGITAL INPUT/OUTPUT PINS

Note 13: For output drive capability, see section "Pin Description" on page 5.

Table 8: Operating Conditions (Note 10)

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vbat Supply voltage on pin VBATIN 2.1 3.45 V

Vdd_pa CLASSD supply voltage on pin VDDPA 2.1 3.45 V

Vpon Voltage on pin PON 5.5 V

Vdig_bp Voltage on digital pins with back drive

protection; ports P0 and P2 (except P2.6)

3.45 V

Vdig Voltage on other digital pins VDD = 1.8 V 1.98 V

Vana Voltage on analog pins AVD = 1.8 V 2.1 V

Icharge Current through pin CHARGE Rseries >

(Vcharge-3 V)/

10 mA

Ipa Current through pin PAOUTp, PAOUTn (Note 11) 500 mA

Iout_vrefp Output current through pin VREFp 1mA

TA Ambient temperature (Note 12) -40 +85 °C

Table 9: Digital input levels

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vil_dig Logic 0 input level; all digital

input pins except PON,

CHARGE and RSTn

VDD = 1.8 V 0.3*VDD V

Vil_pon Logic 0 input level; pin PON 0.9 V

Vil_charge Logic 0 input level; pin

CHARGE

0.9 V

Vil_rst Logic 0 input level; pin RSTn VDD = 1.8 V 0.2*VDD V

Vih_dig Logic 1 input level; all digital

input pins except PON,

CHARGE and RSTn

VDD = 1.8 V 0.7*VDD V

Vih_pon Logic 1 input level; pin PON 1.5 V

Vih_charge Logic 1 input level; pin

CHARGE

1.5 V

Vih_rst Logic 1 input level; pin RSTn VDD = 1.8 V 0.8*VDD V

Table 10: Digital output levels

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vol_dig Logic 0 output level VDD = 1.8 V; Iout =

2, 4, 8 mA (Note 13)

0.2*VDD V

Voh_dig Logic 1 output level VDD = 1.8 V; Iout =

2, 4, 8 mA (Note 13)

0.8*VDD V

SC14CVMDECT SF Cordless Voice Module

6.5 ANALOG FRONT END

Note 14: BANDGAP_REG will be tuned at the factory.

Note 15: 0 dBm0 on COUT = -3.14 dB of max PCM value. COUT is CODEC output in test mode

Note 16: Trimming possibility is foreseen. At system production the bandgap reference voltage can be controlled within 2% accuracy and data can

be stored in Flash. Either AVD or VREF can be trimmed within 2% accuracy. If AVD is trimmed VREF will be within 2% accuracy related to

either AVD. Or vice versa VREF can be trimmed. For Vref trimming measure VREFp, VREFm) and update BANDGAP_REG[3..0].

Note 17: Vrefm is a clean ground input and is the 0 V reference.

Table 11: Microphone amplifier

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vmic_0dB_unt Untrimmed differen-

tial RMS input volt-

age between MICp

and MICn (0 dBm0

reference level)

(Note 7)

0 dBm0 on COUT

(Note 15)

MIC_GAIN[3:0] = 0,

@ 1020 Hz;

Tolerance:

• 13% when untrimmed

(BANDGAP_REG=8)

(Note 14)

• 6% when trimmed

(Note 16)

114 131 149 mV

Rin_mic Resistance of acti-

vated microphone

amplifier inputs

(MICp, MICn and

MICh) to internal GND

(Note 7)

75 150 k

Vmic_offset Input referred DC-off-

set (Note 7)

MIC_GAIN[3..0] = 1111

3 sigma deviation limits

-2.6 +2.6 mV

Table 12: Microphone amplifier (Operating Condition)

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vmic_cm_level MICp and MICn com-

mon mode voltage

MICp and MICn are set to

GND with internal resistors

(Rin_mic). If DC coupled

the input voltage must be

equal to this voltage.

(0.9 V/1.5)*

VREFp V

Table 13: Microphone supply voltages

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vref_unt VREFp-VREFm

untrimmed

(Note 17)

ILOAD = 0 mA

BANDGAP_REG = 8

(Note 16)

1.41 1.5 1.59 V

Rout_vrefp VREFp output

resistance

Figure 29 1

Nvrefp_idle Peak noise on

VREFp-VREFm

(Note 7)

CCITT weighted -120 dBV

PSRRvrefp Power supply rejec-

tion Vref output

(Note 7)

See Figure 29, AVD to

VREFp/m, f = 100 Hz to 4 kHz

BANDGAP_REG[5:4] = 3

40 dB

SC14CVMDECT SF Cordless Voice Module

Note 18: 0 dBm0 on CIN = -3.14 dB of max PCM value.

Table 14: VREFp load circuit

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Cload_vrefp VREFp (parasitic) load

capacitance

20 pF

Iout_vrefp VREFp output current 1mA

Figure 29 VREFp load circuit

Cload_vrefp

VREFp

VREFm

Iout_vrefp

Rout_vrefp

Table 15: LSRp/LSRn outputs

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vlsr_0dB_unt Untrimmed differen-

tial RMS output volt-

age between LSRp

and LSRn in audio

mode (0 dBm0 refer-

ence level)

0 dBm0 on CIN (Note 18),

LSRATT[2:0] = 001,

@ 1020 Hz Load circuit A (see

Figure 30, Table 16) with

RL1=  , Cp1 or load circuit

B (see Figure 31) with RL2,

Cp2 and Cs2

Tolerance:

• 13% when untrimmed

(BANDGAP_REG=8)

• 6% when trimmed

(Note 16)

621 714 807 mV

Rout_lsr Resistance of acti-

vated loudspeaker

amplifier outputs

LSRp and LSRn

1

Vlsr_dc DC offset between

LSRp and LSRn

(Note 7)

LSRATT[2:0] = 3

RL1 = 28 

3 sigma deviation limits

-20 20 mV

SC14CVMDECT SF Cordless Voice Module

Note 19: Clipping of the outputs occurs when the VDDPA drops and the following conditions becomes true. If CLASSD_CTRL_REG[CLASSD_CLIP]

is not equal to zero then upon a programmable number of clipping occurrences a CLASSD_INT is generated:

The software can stop clipping by reducing the gain via the GENDSP:

Clipping occurs if

Table 16: LSRp/LSRn load circuits

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Cp1_Rl1_inf Load capacitance see Figure 30, RL1 = 30 pF

Cp1_Rl1_1k Load capacitance see Figure 30, RL1 1 k100 pF

Rl1 Load resistance 28 

Cp2 Parallel load

capacitance

see Figure 31 30 pF

Cs2 Serial load capacitance 30 F

Rl2 Load resistance 600 

Figure 30 Load circuit A: Dynamic loudspeaker

RL1 Cp1

LSRp

LSRn

Figure 31 Load circuit B: Piezo loudspeaker

Cs2

LSRp

LSRn

RL2

Cp2

Table 17: PAOUTp, PAOUTn outputs

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vpa_4v Differential rms output

voltage between

PAOUTp and PAOUTn

Trimmed bandgap

input = 0 dBm0, 1 kHz

(Note 15)

Output low-pass filtered

CLASSD_VOUT = 0

0.985 Vrms

Vpa_6v As above

CLASSD_VOUT = 1

1.478 Vrms

Zload_pa_4v Speaker impedance,

connected between

PAOUTp and PAOUTn

With these values, the peak cur-

rents stays within the operating

range.

4

Zload_pa_6v 6

Table 18: PAOUTp, PAOUTn outputs (Note 19)

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Rout_pa Differential output

resistance between

PAOUTp and PAOUTn

See (Note 19) 1

peak LowPassFiltered PAOUTp PAOUTm–

VDDPA VSSPA–

-----------------------------------------------------------------------------------------------------------------------Zload

Zload Rout_pa+

-------------------------------------------



SC14CVMDECT SF Cordless Voice Module

Efficiency 75% at 300 mW@2 V, 500 mW@2.5 V into a 4  transducer.

Table 19: PAOUTp, PAOUTn external components

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

C_VDDPA Decoupling capacitor on

VDDPA

Required when Class-D is used

and guaranteed life time.

(see Figure 32)

1F

Cs_PAOUT Snubber capacitor (to

reduce ringing at

PAOUTp/n)

Required when Class-D is used

to prevent EMI and guaranteed

life time. (see Figure 32)

1nF

Rs_PAOUT Snubber resistor (to

reduce ringing at

PAOUTp/n)

Required when Class-D is used

to prevent EMI and guaranteed

life time. (see Figure 32)

1

Figure 32 Class-D external components

PAOUTp

PAOUTn

VDDPA

VSS/GND

C_VDDPA

Cs_PAOUT

Rs_PAOUT

Figure 33 CLASS-D amplifier measurement setup

in out

AP-system2, settings:

15 H

15H

4 

PAOUTp

PAOUTn

VDDPA

GND (2x)

dummy load

1 F ceramic

2.5 V (= VBAT)

DUT 100 

100 

(models typical speaker)

bw = <10 Hz until 30 kHz

filter = A-weighting

detection = 4/s RMS

input = high-ohmic

AP AUX-0025

passive switching ampli-

fier measurement filter

resistors reduce

influence from

measurement on

DUT

SC14CVMDECT SF Cordless Voice Module

6.6 BATTERY MANAGEMENT

6.7 BASEBAND PART

Table 20: CHARGE_CTRL pin

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Voh_charge_ctrl Drive capability of pin

CHARGE_CTRL

sourcing 500 A1.6 V

Vol_charge_ctrl sinking 100 A0.2 V

Table 21: State of charge circuit (SoC) (Operating condition)

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Vsocp_socn Input voltage

between SOCp and

SOCn

With the prescribed 0.1  sense

resistor this results in the usable cur-

rent range

-100 +100 mV

Figure 34 State of charge (SOC) counter accuracy

SoC_asym_err

input current

Counter ticks/s

1000 mA

100 mA

-100 mA

-1000 mA

100 mA extrapolation

BSoC_sym_err: A - |B|

Table 22: Baseband specifications

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

Fbit_uart Serial interface bit rate UART; Interface for external

microprocessor or PC

115.2 kbit/s

Fbit_flash Flash download bit rate Via UART 115.2 kbit/s

Ibat_stdby_fp Standby supply current FP application (3.3 V) 55 60 mA

Ibat_act_fp Active supply current FP application (3.3 V) 65 70 mA

Ibat_stdby_pp Standby supply current PP application (3.3 V) 4.5 6mA

Ibat_act_pp Active supply current PP application (3.3 V) 30 40 mA

SC14CVMDECT SF Cordless Voice Module

6.8 RADIO (RF) PART

Standards compliancy: ETS 301 406 (former TBR6).

Table 23: Radio specifications

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

P_Rx Receiver sensitivity BER = 0.001; TA = 25 °C -93 -92 -89 dBm

P_Rx_T Receiver sensitivity, full

temperature range

BER = 0.001;

-40 °C TA 85 °C

-87 dBm

IPL Intermodulation perform-

ance level (EN 301 406

section 4.5.7.6)

TA = 25 °C;

Pw = -80 dBm;

f = 2 channels

-35 dBm

NTP Normal transmitted power DECT: 250 mW 24 26 dBm

J-DECT: 10 mW average per

frame for each slot

23 24.5 dBm

DECT6.0: 100 mW (max

peak)

20.0 dBm

dPrfpa_T RFPA power variation, full

temperature range

-40 °C TA +85 °C 2.5 4dB

Fbit Bit rate GFSK modulation 1.152 Mbit/s

BW_Tx Transmitter bandwidth DECT GFSK;

NTP = 20 dB

1.728 MHz

Table 24: RFPA preferred settings for various power modes (PP application)

Address

(VES) Register / Parameter HPM/U

(USA)

HPM

(Europe)

HPM/J

(Japan)

0x3D RF_BBADC_CTRL_REG 0x0380 0x03A0 0x0398

0x39 RF_PA_CTRL1_REG 0x09A0 0x0CF0 0x2CE0

0x3B RF_TEST_MODE2_REG 0x0056 0x0062 0x0068

0x05 RF_PLL_CTRL2_REG[MODINDEX] 0x25 0x25 0x23

0x23 Upper RSSI threshold 0x2C N/A 0x28

0x24 Lower RSSI threshold 0x22 N/A 0x1E

SC14CVMDECT SF Cordless Voice Module

6.9 RF POWER SUPPLY

Table 25: Requirements for linear supply regulator

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

VBAT IN Voltage at VBAT SW Unloaded VB

Loaded VB-V1-V2-V3

2.1 33.45 V

V1Settling time I = 50 mA 20 mV

V2Receive period I = 130 mA 100 mV

V2Transmit period I = 550 mA 200 mV

V3Drop during transmit 25 mV

Figure 35 RF power supply

SC14CVMDECT SF Cordless Voice Module

6.10 RF CHANNEL FREQUENCIES

RF setting values must be followed according to

AN-D-204 when DECT country mode was changed.

Table 26: RF frequencies and channel numbers

Frequency

(MHz)

DECT

J-DECT

DECT6.0

1881.792 9

1883.520 8

1885.248 7

1886.976 6

1888.704 5

1890.432 4

1892.160 3

1893.888 2

1895.616 1 1

1897.344 0 0

1899.072 10

1900.800 11

1902.528 12

1921.536 4

1923.264 3

1924.992 2

1926.720 1

1928.448 0

SC14CVMDECT SF Cordless Voice Module

7.0 Design guidelines

This section describes the software and hardware con-

siderations to be taken into account when designing

the target application.

The SC14CVMDECT SF can be used standalone or

next to an MCU that controls the module. In case the

module is used standalone the application will be

stored in its on-board Flash. In total 324 kB of Flash is

available for this purpose.

Applications can be developed with the Athena soft-

ware development environment (see reference [3]).

7.1 APPLICATION SOFTWARE FOR PP

In a PP application the following software tasks must

be handled by the MCU or within the module itself:

• UART communication (external microprocessor

only)

• PP MMI

• Display interface (optional)

• Keyboard interface (optional)

• Battery Charge interface (optional)

• Audio handling

• Tone / Melodies handling

For control commands see document reference [2].

UART communication

The UART communication is the main control interface

of the SC14CVMDECT SF.

PP MMI

The MMI state machine must handle the call setup and

call termination on the PP.

Display Interface

The MCU / PP handles the display interface including

the display driver.

Keyboard Interface

The MCU/ PP handles the keyboard interface including

the keyboard driver.

Audio handling

The Application Software state machine must control

when to open and close the audio. The headset plug-in

detection must handled by the host, and a status is

send to the PP MMI from the PP stack software. The

PP MMI must handle the volume control.

Headset detection boundaries can be adjusted in VES.

When headset indication is received from the PP

Headset detection logic, the Application Software can

decide if audio should be switched to the headset and

sends a request to the PP stack software.

The PP audio handling basically consists of 4 audio

modes (see Figure 14):

1. Idle (Alert) mode

2. Earpiece mode

3. Handsfree mode (Speakerphone)

4. Headset mode

Shifting between modes is done through the API.

Tone handling

The Application Software state machine must control

when to play tones and the volume setting. Custom

melodies can be defined in the VES.

7.2 APPLICATION SOFTWARE FOR FP

In an FP application the following software tasks must

be handled by the MCU or within the module itself:

• UART communication (external microprocessor

only)

•FP MMI

• Display interface (optional)

• Keyboard interface (optional)

• Audio handling

• Tone / Melodies handling

For control commands see document reference [1].

UART communication

The UART communication forms the basic of the FP

operation because via this interface the

SC14CVMDECT SF is controlled.

FP MMI

The MMI state machine must handle the call setup and

call termination on the FP.

Display interface

The MCU/ FP handles the display interface including

the display driver.

Keyboard interface

The MCU/ FP handles the keyboard interface including

the keyboard driver.

Audio handling

The Application Software state machine must control

when to open and close the audio. The FP MMI must

handle the volume control.

Tone handling

The Application Software state machine must control

when to play tones and the volume setting. Custom

melodies can be defined in VES.

7.3 HARDWARE DESIGN GUIDELINES

Within this section general design guidelines for

SC14CVMDECT SF FP and PP applications are given.

7.3.1 Circuit design guidelines

For a reference schematic refer to the SC14CVMDECT

SF reference kit. With the reference kit package a non-

cost optimised reference design is presented.

SC14CVMDECT SF Cordless Voice Module

For a FP hardware design the following hardware parts

will be needed besides the SC14CVMDECT SF:

• Supply voltage

• Battery charge

• LED and buttons

• Audio:

• Headset

• External PCM device.

For a PP hardware design the following hardware parts

will be needed besides the SC14CVMDECT SF:

• Power

• Battery Charger

• Audio:

• Microphone

• Earpiece

• Speaker

• Headset

7.3.2 PCB Design Guidelines

• Because of the presence of the digital radio fre-

quency burst with 100 Hz time division periods (TDD

noise), supply ripple and RF radiation, special atten-

tion is needed for the power supply and ground PCB

layout.

• Power supply considerations

Both high and low frequency bypassing of the supply

line connections should be provided and placed as

close as possible to the SC14CVMDECT SF. In

order to get the best overall performance for both FP

and PP applications, a number of considerations for

the PCB has to be taken into account.

• Make angle breaks on long supply lines to avoid

resonance frequencies in respect to DECT fre-

quencies. Maximum 8 cm before an angle break

is recommended.

• Supply lines should be placed as far as possible

away from sensitive audio circuits. If it is neces-

sary to cross supply lines and audio lines, it

should be done with right angles between supply

and audio lines/circuits (microphone, ear-speaker,

speakerphone, etc.)

• Ground plane considerations

In order to achieve the best audio performance

and to avoid the influence of power supply noise,

RF radiation, TDD noise and other noise sources,

it is important that the audio circuits on both FP

and PP applications boards are connected to the

VREFM pin (analog ground: AGND, see Figure

38) on the SC14CVMDECT SF with separate nets

in the layout.

It is advised to provide the following audio circuits

with separate ground nets connected to the

VREFM pin:

• Microphone(s)

• Headset microphone and speaker

• Speakerphone (signal grounds)

Depending on the layout it may also be necessary to

bypass a number of the audio signals listed above to

avoid humming, noise from RF radiation and TDD

noise with. It is also important to choose a microphone

of appropriate quality with a high RF immunity (with

built-in capacitor).

• ESD performance

Besides TDD noise, the ESD performance is impor-

tant for the end-application. In order to achieve a

high ESD performance supply lines should be

placed with a large distance from charging terminals,

display, headset connector and other electrical ter-

minals with direct contact to the ESD source.

On a two-layer PCB application it is important to

keep a simulated one layer ground. With a stable

ground ESD and TDD noise performance will always

improve.

• Clearance around test patterns

Pin number 81 to 88 are used for production test

purposes. In order to avoid any interference or dis-

turbance the area around these signal pins must be

kept clear of any signal and/or GND. The recom-

mended clearance is at least 1 mm as shown in Fig-

ure 36.

Figure 36 Clearance around test patterns

Test

pattern

0.9mm

0.6mm1.0mm

1.0mm

GND Pattern

SC14CVMDECT SF Cordless Voice Module

7.4 MODULE PLACEMENT ON THE MAIN BOARD

In order to ensure FCC compliance, proper coverage

and to avoid detuning of the antennas, it is required to

place the module free on the main board in relation to

other surrounding materials.

Keep a distance of at least 10 mm from the antenna

elements to conducting objects and at least 5 mm to

non-conducting objects.

Keep in mind that electrical shielding objects, even

partly surrounding the antennas, will normally cause a

significant degradation of the coverage.

Place the module at the edge of the main-board as

shown in Figure 37.

If the module has to be placed away from the edge of

the main board, then avoid conducting areas in front of

the antennas and make a cut-out in the main board

underneath the antennas as shown in the figure.

Keep solid ground on layer 2 out to the edges of the

main board as shown in the figure.

7.5 PATTERN FOR PIN 79 ON THE MAIN BOARD

The copper pattern for pin 79 on the main board is very

important because it is part of the internal antenna of

the module. It is used to extend the internal antenna for

optimum RF performance.

The PCB pattern shown in Figure 41 under “pads C”

for pin 79 on the main board was used during module

certification.

7.6 PRECAUTIONS REGARDING UNINTENDED

COUPLING

The SC14CVMDECT SF includes the internal antenna,

so by integration on the main board precautions shall

be taken in order to avoid any kind of coupling from the

main board to the RF part of the module.

If there is any doubt about this, a brief radio test should

be performed.

Figure 37 Module placement on the main board (top view)

178

No PCB area

376

GND

GND GND

79 Main boardModule

antenna extension

> 10 mm

SC14CVMDECT SF Cordless Voice Module

8.0 Example Application Diagram

Figure 38 Reference diagram example

D D

C C

B B

A A

AGND

UTX

URX

P0[2]

P0[3]

P0[4]

P0[5]

P0[6]

P0[7]

P1[0

P1[1]

P1[2]

P1[3]

P1[4]

P1[5]

PON

CHARGE

P2[0]

P2[1]

P2[2]

P2[3]

P2[4]

P2[5]

P2[6]

P2[7]

MICh

PAOUTn

PAOUTp

P3[2]

P3[3]

P3[4]

P3[5]

P3[6]

P3[7]

JTAG

Title :

Doc. Nr. Rev:

Date: Sheet: of

Dialog Semiconductor .

Het Zuiderkruis 53

5215 MV 's-Hertogenbosch

tel. (+31) 73 6408822

fax. (+31) 73 6408823

Designer: 0.1

SC14CVMDECT_SF01_RD

11Wednesday, November 28, 2012

F v D

Title :

Doc. Nr. Rev:

Date: Sheet: of

Dialog Semiconductor .

Het Zuiderkruis 53

5215 MV 's-Hertogenbosch

tel. (+31) 73 6408822

fax. (+31) 73 6408823

Designer: 0.1

SC14CVMDECT_SF01_RD

11Wednesday, November 28, 2012

F v D

Title :

Doc. Nr. Rev:

Date: Sheet: of

Dialog Semiconductor .

Het Zuiderkruis 53

5215 MV 's-Hertogenbosch

tel. (+31) 73 6408822

fax. (+31) 73 6408823

Designer: 0.1

SC14CVMDECT_SF01_RD

11Wednesday, November 28, 2012

F v D

DNA

LSR1

SC14CVMDECT SF01

SC14WSMDATA_SF01

P1[2]/INT2/SK

VBATSW 62

P0[4]/SPI_EN

RSTn

CP_VOUT1

P1[5]/INT5/RDI/VDDE

P2[6]WTF_IN

P0[1]/URX

VBATIN 63

P3[0]/PAOUTn/DP0

P2[7]/BXTAL

P1[4]/INT4/TDOD

P1[1]/INT1/LE

P0[0]/UTX

JTAG

P3[1]/PAOUTp/DP1

P1[6] / PON

P1[7] / CHARGE

P2[4]/SCL1/PCM_DO/DP3

VDDOUT 61

P2[5]/PCM_FSC/SF

VDDPA 25

CHARGE_CTRL 22

P0[7]/SPI_DI/PWM1

SOCp 17

P1[0]/INT0/ADC1

ULP_PORT

ULP_XTAL

P0n 4

P2[3]/SDA1/PCM_DI/DP2

P1[3]/INT3/SIO

P0[6]/SPI_DO

LSRn 13

P3[3]/ADC0

DC_CTRL 21

VREFm 11

LSRp 12

P3[7]/RINGp

DC_SENSE 19

DC_I 20

P2[2]/PCM_CLK/CLK100

RFP0n 5

MICh 10

P3[5]/RINGING/RINGOUT

RFP0 3

P2[1]/ECZ2/PWM1/LED4

VREFp 7

MICp/CIDINn 8

P3[2]/CIDINp

P3[6]RINGn

P3[4]/PARADET

P2[0]/ECZ1/PWM0/LED3

RF0 75

MICn/CIDOUT 9

P0 2

RF1 73

P0[5]/SPI_CLK

VBATIN 64

P0[3]/URX2/SCL2

44 P0[2]/UTX2/SDA2

GND

SOCn/GND 18

GND

C13

1uF

MIC1

DNA

C12

10pF

C11

22uF

10R

0,.1uF

DNA

C15

10pF

1uF

DNA

C10

DNA

0,.1uF

internal

SC14CVMDECT SF Cordless Voice Module

9.0 Notices to OEM

The end product has to be certified again if it has

been programmed with other software than Dialog

standard software stack for portable part and/or

uses one or two external antenna(s).

9.1 FCC REQUIREMENTS REGARDING THE END

PRODUCT AND THE END USER.

The end product that the module is integrated into must

be marked as follows:

“Contains Transmitter Module FCC ID: Y82-SC14S /

IC: 9576A-SC14S”

The literature provided to the end user must include the

following wording:

FCC compliance statement

This device complies with Part 15 of the FCC Rules for

only portable part.

Operation is subject to the following two conditions: (1)

this device may not cause harmful interference, and (2)

this device must accept any interference received,

including interference that may cause undesired opera-

tion of the device.

Module transmetteur ID IC: 9576A-SC14S.

Son fonctionnement est soumis aux deux conditions

suivantes: (1) cet appareil ne doit pas causer d’interfé-

rences nuisibles et (2) appareil doit accepter toute

interférence reçue, y compris les interférences qui peu-

vent perturber le fonctionnement.

Changes or modifications to the equipment not

expressly approved by the Party responsible for com-

pliance could void the user's authority to operate the

equipment.

NOTE: This equipment has been tested and found to

comply with the limits for a Class B digital device, pur-

suant to Part 15 of the FCC Rules. These limits are

designed to provide reasonable protection against

harmful interference in a residential installation.

This equipment generate, uses and can radiate radio

frequency energy and, if not installed and used in

accordance with the instructions, may cause harmful

interference to radio communications. However, there

is no guarantee that interference will not occur in a par-

ticular installation.

If this equipment does cause harmful interference to

radio or television reception, which can be determined

by turning the equipment off and on, the user is

encouraged to try to correct the interference by one or

more of the following measures:

• Reorient or relocate the receiving antenna

• Increase the separation between the equipment and

receiver

• Connect the equipment into an outlet on a circuit dif-

ferent from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV tech-

nician for help.

Privacy of communications may not be ensured when

using this phone.

9.2 INDUSTRY CANADA REQUIREMENTS

REGARDING THE END PRODUCT AND THE END

USER

The host device shall be properly labelled to identify

the modules within the host device. The Industry Can-

ada certification label of a module shall be clearly visi-

ble at all times when installed in the host device,

otherwise the host device must be labelled to display

the Industry Canada certification number of the mod-

ule, preceded by the words "Contains transmitter mod-

ule", or the word "Contains", or similar wording

expressing the same meaning, as follows:

Contains transmitter module IC: 9576A-SC14S

L'appareil hôte doit être étiqueté comme il faut pour

permettre l'identification des modules qui s'y trouvent.

L'étiquette de certification d'Industrie Canada d'un

module donné doit être posée sur l'appareil hôte à un

endroit bien en vue en tout temps. En l'absence d'éti-

quette, l'appareil hôte doit porter une etiquette donnant

le numéro de certification du module d'Industrie Can-

ada, précédé des mots " Contient un module d'émis-

sion ", du mot " Contient " ou d'une formulation

similaire exprimant le même sens, comme suit :

Contient le module d'émission IC: 9576A-SC14S

This device complies with Industry Canada licence-

exempt RSS standard(s). Operation is subject to the

following two conditions: (1) this device may not cause

interference, and (2) this device must accept any inter-

ference, including interference that may cause unde-

sired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie

Canada applicables aux appareils radio exempts de

licence. L'exploitation est autorisée aux deux condi-

tions suivantes : (1) l'appareil ne doit pas produire de

brouillage, et (2) l'utilisateur de l'appareil doit accepter

tout brouillage radioélectrique subi, même si le brouil-

lage est susceptible d'en compromettre le fonctionne-

ment.

CAN ICES-3 (B)/NMB-3(B)

SC14CVMDECT SF Cordless Voice Module

9.3 PRECAUTIONS REGARDING UNINTENDED

COUPLING

Integration on the main board precautions shall be

taken in order to avoid any kind of

coupling from the main board to the RF part of the

module. If there is any doubt about this, a radio short

test should be performed.

9.4 END APPLICATION APPROVAL

The module is intended to be used in an end applica-

tion. Type approval concerning the end product, except

for the module, should off cause be done. Please con-

tact a test-house in order to clarify what is needed.

9.5 SAFETY REQUIREMENTS

This section provides of an overview of the safety

requirements you must adhere to when working with

the Cordless Voice Module SC14CVMDECT SF.

• The specific external power supply for the Cordless

Voice Module SC14CVMDECT SF has to fulfil the

requirements according to clause 2.5 (Limited power

source) of this standard EN 60950-1:2006.

• Interconnection circuits shall be selected to provide

continued conformance to the requirements of

clause 2.2 for SELV (Safety Extra Low Voltage) cir-

cuits according to EN 60950-1:2006 after making

connections.

• Interface type not subjected to over voltages (i.e.

does not leave the building).

• Requirements additional to those specified in this

standard may be necessary for:

• Equipment intended for operation in special envi-

ronments (for example, extremes of temperature,

excessive dust, moisture or vibration, flammable

gases and corrosive or explosive atmospheres).

• Equipment intended to be used in vehicles, on

Board ships or aircraft, in tropical countries or at

altitudes greater than 2000 m.

• Equipment intended for use where ingress of

water is possible.

• Installation by qualified personnel only!

• The product is a component intended for installation

and use in complete equipment. The final accept-

ance of the component is dependent upon its instal-

lation and use in complete equipment.

SC14CVMDECT SF Cordless Voice Module

10.0 Package information

10.1 SOLDERING PROFILE

The SC14CVMDECT SF should be soldered using a

standard reflow soldering profile and lead free solder

paste as shown below. Adjustments to the profile may

be necessary depending on process requirements.

10.2 MOISTURE SENSITIVITY LEVEL (MSL)

The MSL is an indicator for the maximum allowable

time period (floor life time) in which a moisture sensi-

tive plastic device, once removed from the dry bag, can

be exposed to an environment with a maximum tem-

perature of 30°C and a maximum relative humidity of

60% RH. before the solder reflow process.

The SC14CVMDECT SF is qualified to MSL 3.

Figure 39 Reflow profile

MSL Level Floor Life Time

MSL 4 72 hours

MSL 3 168 hours

MSL 2A 4 weeks

MSL 2 1 year

MSL 1 Unlimited at 30°C/85%RH

SC14CVMDECT SF Cordless Voice Module

10.3 COPPER PAD, SOLDER OPENING AND STEN-

CIL

For the stencil a thickness of 0.122 mm is recom-

mended. Recommended copper pad, solder mask

opening and stencil are shown below.

Figure 40 Pad dimensions

SC14CVMDECT SF Cordless Voice Module

Figure 41 Copper pad, Solder mask opening and Stencil

Figure 42 Solder stencil

SC14CVMDECT SF Cordless Voice Module

10.4 MECHANICAL DIMENSIONS

Figure 43 Package outline drawing

SC14CVMDECT SF Cordless Voice Module

11.0 Revision history

Jul1, 2014 v1.6:

• Changed maximum RF output power for DECT 6.0

Apr16, 2014 v1.5

• Added an explanation for RF1 on 4.13

Feb 11, 2014 v1.4

• Correct 10.3Copper pad, solder openinG and

STENCIL47

Jan 31, 2014 v1.3

• Update 10.3Copper pad, solder openinG and

STENCIL47

Nov 8, 2013 v1.2:

• Added section “9.2 INDUSTRY CANADA

REQUIREMENTS REGARDING THE END PROD-

UCT AND THE END USER”

Sept 12, 2013 v1.1:

• Ordering code for tray version corrected.

• Ordering code for tape-on-reel version removed.

July 9, 2013 v1.0: Initial version

SC14CVMDECT SF Cordless Voice Module

Product Status Definitions

Dialog Semiconductor reserves the right to make changes without notice to any products herein to improve reliabil-

ity, function or design. Dialog Semiconductor does not assume any liability arising out of the application or use of

any product or circuit described herein; neither does it convey any license under its patent rights, nor the right of oth-

ers.

Datasheet Status Product Status Definition

Advance Information Formative or in Design This data sheet contains the design specifications for prod-

uct development. Specifications may change in any manner

without notice.

Preliminary First Production This data sheet contains preliminary data. Supplementary

data will be published at a later date. Dialog Semiconductor

reserves the right to make changes at any time without

notice in order to improve design and supply the best possi-

ble product.

No Identification Noted Full production This data sheet contains final specifications. Dialog Semi-

conductor reserves the right to make changes at any time

without notice in order to improve design and supply the best

possible product.

Obsolete Not in Production This data sheet contains specifications on a product that has

been discontinued by Dialog Semiconductor. The data-sheet

is printed for reference information only.

Life Support Policy

DIALOG’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL

COUNCIL OF DIALOG SEMICONDUCTOR. As used herein:

1. Life support devices or systems are devices or

systems which,

(a) are intended for surgical implant into the

body, or (b) support or sustain life, and whose

failure to perform, when properly used in accord-

ance with instructions for use provided in the

labelling, can be reasonably expected to result

in a significant injury to the user.

2. A critical component is any component of a life

support device or system whose failure to per-

form can be reasonably expected to cause the

failure of the life support device or system, or to

affect its safety or effectiveness.

Germany Headquarters

Dialog Semiconductor GmbH

Phone: +49 7021 805-0

United Kingdom

Dialog Semiconductor (UK) Ltd

Phone: +44 1793 757700

The Netherlands

Dialog Semiconductor B.V.

Phone: +31 73 640 88 22

Dialog Semiconductor does not assume any responsibility for use of any circuit described, no circuit patent licenses are implied, and Dialog

reserves the right, at any time without notice, to change said circuitry or specifications.

Contacting Dialog Semiconductor

RoHS Compliance

Dialog Semiconductor complies to European Directive 2001/95/EC and from 2 January 2013 onwards to European

Directive 2011/65/EU concerning Restriction of Hazardous Substances (RoHS/RoHS2).

Dialog Semiconductor’s statement on RoHS can be found on the customer portal http:/portal.dialog-semiconduc-

tor.com. RoHS certificates from our suppliers are available on request.

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Phone: +1 408 727 3200

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Dialog Semiconductor SC14S DECT Module User Manual SC14CVMDECT SF01 V16

Dialog Semiconductor BV DECT Module SC14CVMDECT SF01 V16

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