Dialog Semiconductor SC14S DECT Module User Manual SC14CVMDECT SF01 V16
Dialog Semiconductor BV DECT Module SC14CVMDECT SF01 V16
Contents
- 1. user manual CVMDECT
- 2. user manual SPNODE
- 3. Rev_User Manual_68-2959-01_Bx_101217.pdf
user manual CVMDECT
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| Document ID | 2324864 |
| Application ID | Q9a+vM9vZzOP8gqflsnyIQ== |
| Document Description | user manual CVMDECT |
| Short Term Confidential | No |
| Permanent Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 102.07kB (1275843 bits) |
| Date Submitted | 2014-07-14 00:00:00 |
| Date Available | 2013-10-22 00:00:00 |
| Creation Date | 1997-02-03 11:26:52 |
| Producing Software | Acrobat Elements 9.0.0 (Windows) |
| Document Lastmod | 2014-07-01 13:31:37 |
| Document Title | SC14CVMDECT_SF01 V16.fm |
| Document Creator | FrameMaker 9.0 |
| Document Author: | ssato |
DATASHEET SC14CVMDECT SF Cordless Voice Module General description The SC14CVMDECT SF is a member of the Cordless Module family with integrated radio transceiver and baseband processor in a single package. It is designed for hosted and embedded cordless voice and data applications in the DECT frequency band. Its simple to use API commands allow easy setup of a wireless link between two or more nodes. RF range: 1870 MHz to 1930 MHz Receiver sensitivity < -93 dBm Transmit power • EU: 24 dBm: 1881MHz - 1897MHz SC14CVMDECT SF JULY 1, 2014 V1.6 • USA: 20 dBm: 1921MH - 1928MHz • JP: 23 dBm: 1895MHz - 1903MHz Features Antenna embedded, supports external antennas Power supply voltage: 2.1 V to 3.45 V Small form factor (19.6 mm x 18.0 mm x 2.7 mm) Contains both PP and FP functionality Program memory available for custom software Supports both internal and external (hosted) applications Operating temperature range: -40 °C to +85 °C Supports EU-DECT (CAT-iq V2.0, v3.0 partly), DECT6.0 for North America and Japan DECT n ETSI (EU-DECT) and FCC (DECT 6.0) certified n J-DECT pre-certified n ETSI 300 444 (DECT GAP) compliant n Up to 6 Portable Parts or ULE devices registered per Application examples fixed part n Cordless intercom n UART interface to external host n Cordless baby monitor n Controllable via API command set n Wireless data applications up to 54 kbit/s n Supports voice and data ________________________________________________________________________________________________ System diagram US/EU/JP* DECT Voice + data: 32 kbit/s + 1.6 kbit/s Data: 54 kbit/s Voice + data Host SC14CVMDECT Data Portable Part 0 Voice Host SC14CVMDECT Data Host Fixed Part SC14CVMDECT Voice + data Data Portable Part 1 Host SC14CVMDECT Data Portable Part 5 © 2012 Dialog Semiconductor B.V. www.dialog-semiconductor.com Cordless Voice Module Voice + data * Only end-products can be CAT-iq certified 1.0 Connection diagram. . . . . . . . . . . . . . . . . . . . . . . . 4 4.9 BATTERY MANAGEMENT . . . . . . . . . . . . . . . 21 1.1 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . 5 4.10 PROTOCOL STACK . . . . . . . . . . . . . . . . . . 21 4.10.1 DECT TBR22 . . . . . . . . . . . . . . . . . . . . 21 2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.10.2 Out-of-Range handling. . . . . . . . . . . . . 22 2.1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.10.3 Preamble antenna diversity . . . . . . . . . 22 2.2 REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.10.4 Broadcasting messages. . . . . . . . . . . . 22 2.3 GLOSSARY AND DEFINITIONS . . . . . . . . . . . 8 4.10.5 IWU to IWU messaging . . . . . . . . . . . . 22 3.0 Cordless Voice Module functionality . . . . . . . . . 10 4.11 REGISTRATION . . . . . . . . . . . . . . . . . . . . . . 22 3.1 MODULE HARDWARE . . . . . . . . . . . . . . . . . . 10 4.11.1 Handling product identities. . . . . . . . . . 22 3.2 SOFTWARE CONTROL . . . . . . . . . . . . . . . . . 10 4.11.2 Deregistration. . . . . . . . . . . . . . . . . . . . 23 3.3 DECT PROTOCOL STACK . . . . . . . . . . . . . . 10 4.12 PCM INTERFACE . . . . . . . . . . . . . . . . . . . . . 23 3.4 PORTABLE PART CONFIGURATION . . . . . . 11 4.12.1 PCM Interface for FP . . . . . . . . . . . . . . 23 3.5 FIXED PART CONFIGURATION . . . . . . . . . . 11 4.12.2 PCM_FSC frequency . . . . . . . . . . . . . . 23 3.6 VOICE COMMUNICATION . . . . . . . . . . . . . . . 12 4.12.3 Length of PCM_FSC . . . . . . . . . . . . . . 23 3.7 LIGHT DATA APPLICATION . . . . . . . . . . . . . 12 4.12.4 Start position of FSC . . . . . . . . . . . . . . 23 3.8 LU10 DATA APPLICATION . . . . . . . . . . . . . . 12 4.12.5 PCM clock frequency . . . . . . . . . . . . . . 23 3.9 GENERAL FEATURES . . . . . . . . . . . . . . . . . . 14 4.12.6 PCM data mode . . . . . . . . . . . . . . . . . . 24 4.12.7 PCM Interface for PP . . . . . . . . . . . . . . 27 4.0 Functional description. . . . . . . . . . . . . . . . . . . . . 15 4.13 ANTENNA OPERATION . . . . . . . . . . . . . . . . 27 4.1 UART INTERFACE . . . . . . . . . . . . . . . . . . . . . 15 4.13.1 Internal antenna only . . . . . . . . . . . . . . 28 4.2 VES (VIRTUAL EEPROM STORAGE) . . . . . . 15 4.13.2 Internal and external antenna with FAD 28 4.2.1 VES layout . . . . . . . . . . . . . . . . . . . . . . . 15 5.0 CAT-iq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.2.2 VES access by MCU . . . . . . . . . . . . . . . 15 5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . 29 4.3.1 Audio connection . . . . . . . . . . . . . . . . . . 16 5.2 CAT-IQ PROFILE OVERVIEW . . . . . . . . . . . . 29 4.4 AUDIO ROUTING . . . . . . . . . . . . . . . . . . . . . . 17 5.2.1 Supported main features . . . . . . . . . . . . 29 4.4.1 FP AUDIO ROUTING . . . . . . . . . . . . . . 17 6.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4.2 FP audio level adjustment . . . . . . . . . . . 17 6.1 GENERAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4.3 PP audio routing . . . . . . . . . . . . . . . . . . 17 6.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . 30 4.4.4 PP audio codec adjustment . . . . . . . . . . 17 6.3 OPERATING CONDITIONS . . . . . . . . . . . . . . 31 4.4.5 General audio adjustment . . . . . . . . . . . 17 6.4 DIGITAL INPUT/OUTPUT PINS . . . . . . . . . . . 31 4.4.6 PP volume . . . . . . . . . . . . . . . . . . . . . . . 17 6.5 ANALOG FRONT END . . . . . . . . . . . . . . . . . . 32 4.4.7 PP audio equalization . . . . . . . . . . . . . . 17 6.6 BATTERY MANAGEMENT . . . . . . . . . . . . . . . 36 4.5 PP AUDIO MODES . . . . . . . . . . . . . . . . . . . . . 19 6.7 BASEBAND PART . . . . . . . . . . . . . . . . . . . . . 36 4.5.1 Power management. . . . . . . . . . . . . . . . 19 6.8 RADIO (RF) PART . . . . . . . . . . . . . . . . . . . . . 37 4.5.2 Earpiece mode. . . . . . . . . . . . . . . . . . . . 20 6.9 RF POWER SUPPLY . . . . . . . . . . . . . . . . . . . 38 4.5.3 Alert mode . . . . . . . . . . . . . . . . . . . . . . . 20 6.10 RF CHANNEL FREQUENCIES. . . . . . . . . . . 39 4.6 CALL HANDLING . . . . . . . . . . . . . . . . . . . . . . 20 4.6.1 FP to PP call . . . . . . . . . . . . . . . . . . . . . 20 7.0 Design guidelines. . . . . . . . . . . . . . . . . . . . . . . . . 40 4.6.2 PP to FP call . . . . . . . . . . . . . . . . . . . . . 20 7.1 APPLICATION SOFTWARE FOR PP . . . . . . 40 4.6.3 Intercom . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.2 APPLICATION SOFTWARE FOR FP . . . . . . 40 4.6.4 Conference . . . . . . . . . . . . . . . . . . . . . . 20 7.3 HARDWARE DESIGN GUIDELINES . . . . . . . 40 4.6.5 Page call . . . . . . . . . . . . . . . . . . . . . . . . 20 7.3.1 Circuit design guidelines . . . . . . . . . . . . 40 4.7 TONE/MELODY HANDLING. . . . . . . . . . . . . . 20 7.3.2 PCB Design Guidelines . . . . . . . . . . . . . 41 7.4 MODULE PLACEMENT ON THE MAIN BOARD 4.8 DATE AND REAL-TIME CLOCK. . . . . . . . . . . 20 July 1, 2014 v1.6 Cordless Voice Module 4.3 AUDIO CONFIGURATIONS . . . . . . . . . . . . . . 15 © 2012 Dialog Semiconductor B.V. SC14CVMDECT SF Table of Contents SC14CVMDECT SF Table of Contents 42 7.5 PATTERN FOR PIN 79 ON THE MAIN BOARD. 42 7.6 PRECAUTIONS REGARDING UNINTENDED COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 8.0 Example Application Diagram. . . . . . . . . . . . . . . 43 9.0 Notices to OEM. . . . . . . . . . . . . . . . . . . . . . . . . . . 44 9.1 FCC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER. . . . . . . . . . 44 9.2 IC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER . . . . . . . . . 44 9.3 PRECAUTIONS REGARDING UNINTENDED COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 9.4 END APPLICATION APPROVAL . . . . . . . . . . 45 9.5 SAFETY REQUIREMENTS . . . . . . . . . . . . . . 45 10.0 Package information . . . . . . . . . . . . . . . . . . . . . 46 10.1 SOLDERING PROFILE . . . . . . . . . . . . . . . . . 46 10.2 MOISTURE SENSITIVITY LEVEL (MSL) . . . 46 10.3 COPPER PAD, SOLDER OPENING AND STENCIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 10.4 MECHANICAL DIMENSIONS . . . . . . . . . . . . 49 11.0 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 50 Cordless Voice Module © 2012 Dialog Semiconductor B.V. July 1, 2014 v1.6 SC14CVMDECT SF Connection diagram 79 TP1 GND 78 GND P0 77 GND RFP0 76 GND P0n 75 RF0 RFP0n 74 GND GND 73 RF1 VREFp 72 GND MICp/CIDINn 71 GND MICn/CIDOUT 70 GND MICh/LINEIN 10 69 PARADET/P3[4] VREFm 11 68 RINGOUT/RINGING/P3[5] LSRp/LINEOUT/AGND 12 67 RINGn/P3[6] LSRn/LINEOUT/AGND 13 66 RINGp/P3[7] GND 14 65 CIDINp/P3[2] ADC0/P3[3] 15 64 VBATIN ADC1/INT0/P1[0] 16 63 VBATIN SOCp 17 62 VBATSW SOCn 18 61 VDDOUT DC_SENSE 19 60 GND 81 82 80 GND 59 P2[0]/ECZ1/PWM0/LED3 21 58 P2[1]/ECZ2/PWM1/LED4 CHARGE_CTRL 22 57 CLK100/P2[2]/PCM_CLK CHARGE/P1[7] 23 56 DP2/P2[3]/SDA1/PCM_DI DP1/PAOUTp/P3[1] 24 55 DP3/P2[4]/SCL1/PCM_DO VDDPA 25 54 SF/P2[5]/PCM_FSC CP_VOUT1 26 53 JTAG DP0/PAOUTn/P3[0] 27 52 RSTn 88 46 47 48 49 50 51 P0[1]/PWM0/URX P0[0]/UTX GND GND GND 86 45 39 P0[2]/SDA2/UTX2 38 WTF_IN/P2[6] 44 37 GND GND 36 LE/INT1/P1[1] 43 35 SK/INT2/P1[2] P0[3]/SCL2/URX2 34 SIO/INT3/P1[3] 42 33 TDOD/INT4/P1[4] P0[4]/SPI_EN 32 VDDE/RDI/INT5/P1[5] 41 31 BXTAL/INT7/P2[7] P0[5]/SPI_CLK 30 ULP_PORT 40 29 ULP_XTAL P0[6]/SPI_DO 28 GND PON/P1[6] 84 83 87 20 85 DC_I DC_CTRL P0[7]/PWM1SPI_DI 1.0 Figure 1 Connection diagram (top view, leads face down) Cordless Voice Module Order numbers: SC14CVMDECT SF01T (tray, MPQ = 600 pcs) up to 6 PPs can be registered. © 2012 Dialog Semiconductor B.V. July 1, 2014 v1.6 SC14CVMDECT SF 1.1 PIN DESCRIPTION Table 1: Pin description Pin Module Pin name (Note 1) GND P0 Hi-Z RFP0 Hi-Z Control port for FAD. See 4.13 P0n Hi-Z Control port for FAD. See 4.13 RFP0n Hi-Z Control port for FAD. See 4.13 In/ Out Iout Reset Drive State Description (mA) (Note 2) Ground Control port for FAD. See 4.13 GND Ground VREFp Positive microphone supply voltage MICp Positive microphone input MICn Negative handset microphone input 10 MICh Headset microphone input with fixed input protection 11 VREFm Negative microphone reference (star point), connect to GND. 12 LSRp Positive loudspeaker output 13 LSRn Negative loudspeaker output 14 GND Ground 15 P3[3] IO I/O Port 16 P1[0] IO I-PU I/O Port 17 SOCp Battery state of charge positive input. Connect to GND if not used. See 4.9 18 SOCn Battery state of charge negative input. Star point connected to the SOC resistor. Connect to GND if not used. See 4.9 19 DC_SENSE Voltage sense input. Connect to GND if not used. 20 DC_I Current sense input of DC/DC converter. Connect to GND if not used 21 DC_CTRL O-0 Switching clock for the DC/DC converter. 22 CHARGE_CTRL O-0 Charge control pin. Leave unconnected if not used. See 4.9 23 CHARGE I-PD (270k fixed pulldown) 24 PAOUTp IO 500 25 VDDPA CLASSD Audio Amplifier supply voltage up to 3.45 V. GND or leave unconnected if CLASSD Audio Amplifier is not used. 26 CP_VOUT1 Charge Pump Output 1. A capacitor of 1 F to GND is internally connected to this pin. 27 PAOUTn IO 500 O-0 (5k CLASSD loudspeaker positive outputs fixed pulldown) O-0 (5k CLASSD loudspeaker positive output fixed pulldown) July 1, 2014 v1.6 Cordless Voice Module © 2012 Dialog Semiconductor B.V. Charger connected indication. Switches on the device if voltage > 1.5 V. Must be connected to charger via resistor R > (Vcharger_max-3 V)/10 mA (round to next largest value in range). See 4.9 Pin Module Pin name (Note 1) 28 GND 29 PON I (270k fixed pulldown) 30 ULP_XTAL 32.768 kHz XTAL clock input. Connect to GND if not used. (Note 3) 31 ULP_PORT Ultra Low Power Port Pin. Connect to GND if not used. (Note 3) 32 P2[7] IO I-PU I/O port 33 P1[5] IO O-1 I/O Port In/ Out Iout Reset Drive State Description (mA) (Note 2) Ground Power on, Switches on the device if Voltage > 1.5 V. May be directly connected to VBAT, also with Li-Ion batteries. After startup the software takes over then PON pin to keep the device on after which the PON pin may be released. 34 P1[4] IO 1/2 I-PD I/O port 35 P1[3] IO 1/2 I-PD I/O Port 36 P1[2] IO I-PD I/O Port 37 P1[1] IO I-PU I/O Port 38 GND Ground 39 P2[6] IO I-PU I/O port 40 P0[7] / SPI_DI IO I-PU I/O Port SPI Data Input 41 P0[6] / SPI_DO IO I-PU I/O Port SPI Data Out 42 P0[5] / SPI_CLK IO I-PU I/O Port SPI Clock 43 P0[4] / SPI_EN IO I-PU I/O port SPI_EN: Active low. 44 P0[3] / SCL2 / URX2 IO I-PU I/O port Access bus clock, UART Serial In. 45 GND 46 P0[2] / SDA2 / UTX2 IO I-PU I/O port Access bus data, UART Serial Out. 47 P0[1] / URX IO I-PD (10k) I/O port UART Serial In 48 P0[0] / UTX I-PU I/O Port UART Serial Out 49 GND Ground 50 GND Ground 51 GND Ground 52 RSTn 53 JTAG IO I-PU JTAG-SDI+; one wire Debug interface with open-drain. Requires external 1 k pull-up to VDD. 54 P2[5]/PCM_FSC IO I-PU I/O Port PCM_FSC: PCM Frame Sync 55 P2[4]/SCL1/ PCM_DO IO I-PU I/O port SCL1; I2C clock PCM_DO: PCM Data output Ground I-PU Active low Reset input with Schmitt-trigger input, open-drain output (200k and pull up resistor to internal VDD. Input may not exceed 2.0 V. An pull-up) internal capacitor of 47 nF is mounted on this pin. July 1, 2014 v1.6 Cordless Voice Module © 2012 Dialog Semiconductor B.V. SC14CVMDECT SF Table 1: Pin description (Continued) SC14CVMDECT SF Table 1: Pin description (Continued) Pin Module Pin name (Note 1) In/ Out Iout Reset Drive State Description (mA) (Note 2) 56 P2[3]/SDA1 / PCM_DI IO I-PU I/O Port SDA1: I2C Data PCM_DI: PCM Data input 57 P2[2]/PCM_CLK I/O I-PD I/O Port PCM_CLK: PCM clock input/output 58 P2[1] / PWM1 / LED4 IO I/O Port PWM1: Pulse Width Modulation output LED4: 2.5 mA/5 mA LED current sink 59 P2[0]/ PWM0 / LED3 IO I/O Port PWM0: LED3: 2.5 mA/5 mA LED current sink 60 GND Ground 61 VDDOUT Test purpose only. Must be left unconnected. 62 VBATSW 63 VBATIN Main supply voltage < 3.45 V. 64 VBATIN Main supply voltage < 3.45 V. 65 P3[2] IO I/O Port 66 P3[7] IO I/O Port 67 P3[6] IO I/O Port 68 P3[5] IO I/O Port 69 P3[4] IO I/O Port 70 GND Ground 71 GND Ground 72 GND Ground 73 RF1 RF signal for external antenna. See 4.13 74 GND Ground 75 RF0 RF signal for external antenna. See 4.13 76 GND Ground 77 GND Ground 78 GND Ground 79 TP1 Tuning point for internal antenna. Follow instructions of Section 7.5. 80 GND Ground 81-88 TP2 to TP9 NC Test purpose only. Must be left unconnected. Must be left unconnected. See section 7.3.2 and Figure 36. “NC” means: leave unconnected. Note 2: All digital inputs have Schmitt trigger inputs. After reset all I/Os are set to input and all pull-up or pull-down resistors are enabled unless oth- “GND” means internally connected to the module ground plane. Every GND pin should be connected to the main PCB.ground plane. erwise specified. PU = Pull-up resistor enabled, PD = Pull-down resistor enabled, I = input, O = output, Hi-Z = high impedance, 1 = logic HIGH level, 0 = logic LOW level Refer also to Px_DIR_REGs for INPUT/OUTPUT and Pull-up/Pull-down configurations Note 3: All ULP pins use snap-back devices as ESD protection, which (when triggered) have a holding voltage below the typical battery voltage. This means that the snap-back device of a ULP pin may remain conductive, when triggered while the pin is directly connected to the battery voltage. If any of the ULP pins are directly or indirectly electrically accessible on the outside of the application, system level ESD precautions must be taken to ensure that the snap-back device is not triggered while in active mode, to prevent the chip from being damaged. © 2012 Dialog Semiconductor B.V. July 1, 2014 v1.6 Cordless Voice Module Note 1: Introduction 2.1 SCOPE The SC14CVMDECT SF is a programmable DECT module for voice and data services. The internal software stack receives commands and data from the application, for instance to set up a link to other modules. The application software can be implemented on the module itself or on an external host processor. The internal FLASH provides user space where custom applications can be located. DSP Digital Signal Processor EMC Equipment Manufacturer’s Code ESD ElectroStatic Discharge FAD Fast Antenna Diversity FP Fixed Part GAP General Access Profile (DECT) GFSK Gaussian Frequency Shift Keying Inband tones Tones played by the application itself and not from external e.g. line. The module converts analog signals to a digital stream, compresses/decompresses them according to the DECT standards and transmits/receives them over the air interface. The DECT protocol stack in each module supports both PP and FP functionality. Internal call between FP and one or more PPs IPEI International Portable Equipment Identity (please refer to ETSI EN 300 175-6) IWU InterWorking Unit (please refer to ETSI EN 300 175-1) LCD Liquid Crystal Display LDO Low Drop Out (regulator) LDR Low Data Rate MCU Micro Controller Unit MMI Man Machine Interface (keypad, LCD, buzzer, microphone, earpiece, speaker, headset) 4. SC14CVMDECT EEPROM (VES) MAP NSMD Non Solder Mask Defined (pad) 5. AN-D-174, SC14480 Battery Management; using the State of Charge function, Dialog Semiconductor, Application Note NTP Normal Transmitted Power PAEC Perceptual Acoustic Echo Canceller 6. AN-D-204, RF settings in Natalie, Dialog Semiconductor, Application note PC Personal Computer, IBM compatible PCB Printed Circuit Board without components PP Portable Part PSTN Public Switched Telephone Network POTS Plain Old Telephone System RF Radio Frequency RFPI Radio Fixed Part Identity (please refer to ETSI EN 300 175-6) RLR Receive Loudness Rating RSSI Cordless Advanced Technology, Internet and Quality Radio Signal Strength Indication (please refer to ETSI EN 300 175-1) Sidetone Coder and Decoder converts analog signals to digital signals and vice versa. Feedback of microphone signal to earpiece. SLR Sending Loudness Rating SPI Serial Peripheral Interface Bus UART Universal Asynchronous Receiver and Transmitter The embedded software running on the internal microcontroller (CR16) supports all protocol layers up to the network layer. The module can be controlled by software running on the internal controller as well as from an external controller via the UART. 2.2 REFERENCES 1. CVM FP API Documentation package 2. CVM PP API Documentation package 3. Athena Eclipse User Manual, v1.02, Dialog Semiconductor, Cordless Software + Tools 7. AN-D-211, SC14CVMDECT External antenna design guidelines, Dialog Semiconductor, Application note 2.3 GLOSSARY AND DEFINITIONS AFE Analog Front End API Application Programming Interface software between the MCU and SC14CVMDECT SF Baby monitor Same as intercom but optionally voice activated CAT-iq Codec Conference Same as intercom, but including an external party. CRC Cyclic Redundancy Check CVM Cordless Voice Module ULE Ultra Low Energy DECT Digital Enhanced Cordless Telephone VAD Voice Activity Detection © 2012 Dialog Semiconductor B.V. July 1, 2014 v1.6 Cordless Voice Module Intercom SC14CVMDECT SF 2.0 SC14CVMDECT SF VES Virtual EEPROM Storage Walkie Talkie Call between two PPs without an FP Cordless Voice Module © 2012 Dialog Semiconductor B.V. July 1, 2014 v1.6 SC14CVMDECT SF 3.0 Cordless Voice Module functionality This section describes the key functions and features supported by the SC14CVMDECT SF as shown in Figure 2. UART interface to host API commands FLASH User SW UART XTAL Phoenix Host API SPI Protocol Stack DSP Radio CODEC / PCM DECT RF Head Set PCM Port Ports Port Pins Figure 2 SC14CVMDECT SF functional overview 3.1 MODULE HARDWARE The SC14CVMDECT SF internal hardware consists of: • A DECT radio transceiver with a built-in antenna circuit. The antenna itself is integrated into the module, relieving the product designer from RF expertise. • An internal microprocessor is running from FLASH and handles the API call coming from UART or embedded user software. • A full duplex UART for communication with an optional host processor. • A 4 kB VES (Virtual EEPROM Storage) used by the protocol stack and for user variables. • A DSP for the audio signal processing like ADPCM voice compression towards the CODEC. • A CODEC converts the analog signals to digital signals and vise versa. • Input/Output ports which can be toggled high/low as an output or a high/low digital level can be read as an input. 3.3 DECT PROTOCOL STACK The SC14CVMDECT SF internal protocol stack is based on the ETSI DECT specifications and is compliant with ETSI 300 444 (GAP). • A 20.736 MHz XTAL. This crystal is automatically tuned by the PP module software for optimal radio performance. • Voltage regulators convert the external supply voltage (VBAT) to stable supply voltages for the core and the I/Os. © 2012 Dialog Semiconductor B.V. The product supports up to 6 DECT GAP compliant PP units to one FP station. 10 July 1, 2014 v1.6 Cordless Voice Module 3.2 SOFTWARE CONTROL The application software is written by the customer and has to manage the call control and also the MMI functions. The supported API software includes the Network layer that is defined in figure 1 of the EN300 1753 document, which describes the DECT protocol stack. Detailed functions and data flows, including some example sequences, can be found in document reference [1] for FP and [2] for PP. Ports SC14CVMDECT SF 3.4 PORTABLE PART CONFIGURATION A Portable Part configuration with SC14CVMDECT SF requires additional external parts as shown in Figure 3. PCM Loudspeaker UART MCU SC14CVMDECT Earpiece (handset) MIC (handset) Headset Figure 3 PP configuration Table 2 provides an overview of the supported interfaces for a portable part. Table 2: PP support overview Item Supported Remark Battery management Yes Supported by API Keypad No On external MCU Display No On external MCU IO Ports Yes All digital IO port pins can be controlled by API PCM interface Yes 1x 16 bits serial I/O, PCM_FSC 8 kHz/16 kHz UART Yes 115.2 kbit/s, used for API-commands Headset detection Yes Supported by API LSR (Earpiece, headset) Yes Connected to LSRp and/or LSRn supports single-end and differential (Note 4) MIC (Earpiece, headset, handsfree) Yes Connected to MICp and/or MICn and/or MICh supports single-ended and differential (Note 4) Handsfree speaker Yes Connected to PAOUTp/n (Note 4) Radio Yes Integrated single antenna and support for external antenna(s) Cordless Voice Module Note 4: AFE setting is configurable, refer to document [2]. 3.5 FIXED PART CONFIGURATION A Fixed Part configuration with SC14CVMDECT SF requires additional external parts as shown in Figure 4. © 2012 Dialog Semiconductor B.V. 11 July 1, 2014 v1.6 SC14CVMDECT SF Ports PCM Loudspeaker UART MCU SC14CVMDECT Earpiece (handset) MIC (handset) Headset Supply Regulator Figure 4 FP configuration Table 3 provides the overview of required and available interfaces for a basic or a feature rich cordless FP with the SC14CVMDECT SF. Table 3: FP support overview Item Supported Remark Supply Regulator No Use external 3.3 V LDO Keypad No On external MCU No On external MCU IO Ports Yes All digital IO port pins can be controlled via API PCM interface Yes 4x 16 bits serial I/O, PCM_FSC 8 kHz/16 kHz UART Yes 115.2 kbit/s, used for API-commands Headset detection No Not supported by API LSR (Earpiece, headset) Yes Connected to LSRp and/or LSRn supports single-end and differential (Note 5) MIC (Earpiece, headset, handsfree) Yes Connected to MICp and/or MICn and/or MICh supports single-end and differential (Note 5) Handsfree speaker Yes Connected to PAOUTp/n (Note 5) PSTN Line interface No Not supported by API Radio Yes Integrated single antenna and support for external antenna(s) Note 5: AFE setting is configurable, refer to document [1]. 3.6 VOICE COMMUNICATION An FP supports up to 6 registered PPs, where 4 of these PPs can be in a call at the same time. Multiple simultaneous calls are supported. Supported voice codec is G.726 (32 kbit/s ADPCM) and G.722 (64 kbit/s ADPCM). See Figure 5. (LDR) transmission up to 1.6 kbit/s with IWU to IWU messaging. The LDR can be used in combination with voice communication. See Figure 5. 3.8 LU10 DATA APPLICATION The SC14CVMDECT SF supports CAT-iq LU10 data transmission up to 54 kbit/s. Since LU10 data communication uses the B-Field it cannot be used in combination with voice communication. See Figure 6. 3.7 LIGHT DATA APPLICATION The SC14CVMDECT SF supports Low Data Rate © 2012 Dialog Semiconductor B.V. 12 July 1, 2014 v1.6 Cordless Voice Module Display SC14CVMDECT SF G.726 + 1.6 kbit/s SC14CVMDECT PP SC14CVMDECT FP G.722 + 1.6 kbit/s SC14CVMDECT PP Figure 5 Voice and LDR data communication 54 kbit/s SC14CVMDECT PP SC14CVMDECT FP 54 kbit/s SC14CVMDECT PP © 2012 Dialog Semiconductor B.V. 13 Cordless Voice Module Figure 6 LU10 data application July 1, 2014 v1.6 SC14CVMDECT SF 3.9 GENERAL FEATURES Standard FP audio control feature. Table 4: Supported general features PP support FP support Remark Conferencing Yes Call between FP and 4x PP Intercom Yes Yes Call between FP and 4x PP Walkie Talkie mode Yes Call between PP and PP without FP Baby monitor Yes Voice Activated PP. See document reference [2] Voice over PCM interface Yes Yes -law (64 kbit/s), A-law (64 kbit/s), G.726 ADPCM (32 kbit/s), G.722 ADPCM (64 kbit/s), Linear (128 kbit/s) Call transfer Yes Yes Transfer call between PPs on FP Page call Yes Yes FP pages all PPs (PP locator) Manual registration Yes Yes Number of registered PPs per FP Yes Microphone mute Yes Yes Tone generation Yes No Audio Volume control Yes Yes Tone Volume control Yes No Headset support Yes Yes Handsfree/Speakerphone Yes No Real time clock Yes Yes Accuracy depending directly on crystal Real time clock synchronization Yes Yes All PP clocks are kept in synchronization with the FP SW EEPROM (VES) Storage Yes Yes Internal on module Battery Charge Management Yes No PSTN line interface support No I/O port support Yes Yes Port Interrupt support No No Functionality (Note 6) Call handling Protocol 1 to 6 Audio and tone Melody generator with 7 polyphonic tones General PSTN software on request Automatic headset detection Yes No Low speed data Yes Yes 1.6 kbit/s LU10 data channel Yes Yes 54 kbit/s Yes Yes ULE applications Yes Note 6: Cordless Voice Module CAT-iq up to version 2.0, 3.0 Number of ULE subscriptions: up to 180. These features can be supported by combined API commands in user software. © 2012 Dialog Semiconductor B.V. 14 July 1, 2014 v1.6 Functional description The UART hardware interface uses only TX/RX (see Figure 7). 4.1 UART INTERFACE The UART is normally used for API commands, but can also be used for software upgrades and debugging. The UART is a full duplex UART with frame type: 1 start bit, 8 data bits (LSB first), 1 stop bit, no parity, up to 115.2 kBd. SC14CVMDECT SF 4.0 TX (serial out), module pin 48 RX (serial in), module pin 47 SC14CVMDECT MCU GND Figure 7 UART hardware configuration Caution: All signals are 1.8 V (see Table 8, Table 9 and Table 10). An external V.24 line driver must be provided if the UART port of the module is connected to a standard V.24 device. Connecting the module without a driver may damage the module. execution. 4.2 VES (VIRTUAL EEPROM Storage) The factory type is specific for the SC14CVMDECT SF and should only be set by production. The factory type parameters are either adjustments used by the baseband or the radio interface, or are used to set up the SC14CVMDECT SF into special modes. The factory type parameters will only be modified by changing the factory programmed default value. See document reference [4]. The VES parameters are divided into 2 types: • Factory type • Normal type 4.2.1 VES layout The SC14CVMDECT SF PP and FP include a 4 kB VES which is divided into two areas (see Table 5). Table 5: VES map Size Usage SC14CVMDECT SF 3.6 kB Used for RF, audio, battery, tone setup, data base, etc. User 0.4 kB The “normal” VES parameters can be reset to their default values via software. 4.2.2 VES access by MCU Can be used for MMI applications such as User information. The host is able to read or modify the VES parameters or limited free VES areas via API command. 4.3 AUDIO CONFIGURATIONS The SC14CVMDECT SF audio supports standard DECT audio qualities. The audio gain and volume parameters are placed in the VES. The DECT gains can be adjusted to meet the TBR38 and TBR10 audio level requirements by using the SC14CVMDECT SF application reference design. For other line and acoustic designs it is required to adjust and tune the audio setup. VES is supported as virtual EEPROM with the internal FLASH. A detailed overview of the VES parameters can be found in document reference [4]. Some parts of the VES parameters are read into the SC14CVMDECT SF during the start up and other parts are used by the SC14CVMDECT SF software during © 2012 Dialog Semiconductor B.V. 15 July 1, 2014 v1.6 Cordless Voice Module VES space plane. From this VREFm star point, one connection is made to the common ground plane. The SC14CVMDECT SF PP audio connections are shown in Figure 8. Refer to "Example Application Diagram" on page 43 for detailed component values. Loudspeaker connection For the handsfree operation a 4 loudspeaker must be connected to the PAOUTp and PAOUTn pins as shown in Figure 9. The VDDPA is the supply pin. VREFp SC14CVMDECT SF 4.3.1 Audio connection PAOUTp VREFm Rs_PAOUT Cs_PAOUT MICp VDDPA C_VDDPA VSS/GND MICn PAOUTn Rs_PAOUT MICh Cs_PAOUT LSRp LSRn Figure 9 Loudspeaker connection Refer to Table 19 for a detailed specification of the external components around the loudspeaker. These components are necessary to guarantee the lifetime of the module. Figure 8 Audio connections Earpiece or small loudspeaker connection The earpiece loudspeaker can be connected either differentially or single-ended. Dynamic loudspeakers with an impedance of 30 can be connected, as well as ceramic loudspeakers equivalent to 600 and 30 F. Refer to Table 16 for a detailed specification or the earpiece loudspeakers. The earpiece is connected to the LSRp and LSRn pins. Microphone connection The microphone can be connected either single-ended via MICp or differentially to MICp and MICn. Headset connection Cordless Voice Module The headset microphone must be connected to the MICh pin. The headset earpiece is connected to the LSRp. Microphone supply connection For active microphones a voltage source with high supply voltage rejection ratio is provided on supply pins VREFp/VREFm. Filtering of internal and external reference voltages is provided by an internal capacitor. No external capacitor shall be connected to pin VREFp. To avoid audible switching noise it is important that the ground supply signals are directly “star point” connected to the VREFm and not via a common ground © 2012 Dialog Semiconductor B.V. 16 July 1, 2014 v1.6 PCMx In Codec In IoCtrl IoCtrl IoCtrl IoCtrl Mask && Mask Mask Shift Mask&& Shift Shift Shift CWB CWB CWB Unpack CWB Unpack Unpack Unpack G711 G711 G711 Decoder G711 Decoder Decoder Decoder PCMx Out Codec Out CWB CWB CWB Pack CWB Unpack Unpack Unpack Mac Rx G726 G726 G726 G726 Decoder Encoder Encoder Encoder Mac Tx G722 G726 G726 G726 Encoder Encoder Encoder Encoder Mac Rx G722 G726 G726 G726 Decoder Encoder Encoder Encoder Mac Tx Mac Unit IoCtrl IoCtrl IoCtrl IoCtrl Mask && Mask Mask Shift Mask&& Shift Shift Shift G726 G726 G726 G726 Encoder Encoder Encoder Encoder SC14CVMDECT SF 4.4 AUDIO ROUTING G711 G711 G711 Encoder G711 Decoder Decoder Decoder Soft Mute (bit errors on air interface) Figure 10 FP audio routing 4.4.1 FP AUDIO ROUTING Audio.Heads.xxx Audio.SpkPh.xxx Figure 10 shows the audio routing for a FP. Input and output signals are supported both for the internal codec and the PCM, and the Air interface supports G.726 (32 kbit/s ADPCM) and G.722 (64 kbit/s ADPCM). The internal software supports up to 4 audio channels simultaneously. Supported sample rates are 8 kHz and 16 kHz. have a default value and maybe fine-tuned for the application. See document reference[4]. 4.4.5 General audio adjustment For each audio mode, the receive (RLR) and transmit (SLR) audio paths must be adjusted. RLR and SLR are adjusted in the registers in the VES for each audio state; see document reference [4]. Figure 13 shows this image. FP does not support acoustic or line echo cancellation. 4.4.2 FP audio level adjustment The internal codec audio levels can be controlled with the parameters MicGain and LsrGain. 4.4.6 PP volume 4.4.3 PP audio routing 4.4.7 PP audio equalization Figure 11 and Figure 12 show the different audio routing modes of a PP. Figure 11 shows an overall audio routing and Figure 12 shows the detailed audio routing for the speakerphone of PP (FP does not support speakerphone). To enable adjustments of the frequency response the PP contains four programmable filters: 2 in RX direction and 2 in TX direction (see Figure 11). By default these filters are loaded with bypass coefficients. These can be modified by loading new coefficients via API commands. 4.4.4 PP audio codec adjustment Equalizer filters are part of the audio routes for all audio modes and are placed as shown in Figure 11. The audio codec settings for the loudspeaker and microphone must be pre-configured in the VES for each mode. The VES parameter fields for For a detailed description of the filter functionality refer to the API documentation; see document reference [2]. Audio.Earp.xxx © 2012 Dialog Semiconductor B.V. 17 July 1, 2014 v1.6 Cordless Voice Module The LsrGain range is +2 dB to -12 dB in steps of 2 dB, default is +2 dB. See document reference[1]. The PP supports 6 volume steps, which are VES configurable through parameter fields Audio.Earp.Vol.xxx, the Audio.Heads.Vol.xxx and Audio.SpkPh.Vol.xxx. The volume steps must be set initially in the VES during production; see document reference [4]. The MicGain range is 0 to 30 dB in steps of 2 dB and a value of -128 will mute the input signal, default is 0 dB. VolSideToneUnit SumUnit VolSideTone Mix_Ain_Tone digitaloutgain PFILT 1-3 or IIRSOS 1-3 Limiter VOLCTRL summ2 TonegenAu_0 Earpiece Rx Filters SC14CVMDECT SF Idle Mode summ1 RMSdetector ToneGen EqUnit_0 Earpiece/Headset Mode Earpiece Pass Through EqUnit_0 ECUnit Rx Filters VolSideToneUnit Echo Canceller PFILT 1-3 or IIRSOS 1-3 B1_OUT SumUnit VolSideTone Mix_Ain_Tone Digital Gain & Limiter A1_IN summ2 summ1 ToneGen Analog AGC Tx Filters RFI Canceller TonegenAu_0 Plvl EC1 type 2 MicLevel PFILT 1-3 or IIRSOS 1-3 NC100Hz EqUnit_1 RfiSuppUnit A2_OUT B2_IN AnAgc CodecUnit Noise Gate only used together with PAEC Handsfree Mode Speaker Pass Through EqUnit_0 ECUnit Rx Filters VolSideToneUnit Echo Canceller PFILT 1-3 or IIRSOS 1-3 B1_OUT NoiseGateUnit VolSideTone Noise Gate Digital Gain & Limiter A1_IN summ2 SumUnit Mix_Ain_Tone Noise Gate summ1 ToneGen Analog AGC Tx Filters RFI Canceller Comfort Noise Generator TonegenAu_0 Plvl AEC/PAEC/ Handsfree MicLevel PFILT 1-3 or IIRSOS 1-3 NC100Hz EqUnit_1 RfiSuppUnit A2_OUT B2_IN CNG AnAgc CodecUnit CngUnit Comfort Noise Generator only used together with PAEC Figure 11 PP audio routing Speaker ClassD PAEC UNIT VolSideTone Filters 3 x biquad Digital Gain RMS RMS Peak limiter Rx Noise Gate 2x Biquad PAEC LMS Hfree switch PAEC engine FIR RMS EC gains Microphone FFT iFFT RMS Comfort Noise Post gain Filters 3 x biquad FFT Pre gain Figure 12 Extended speakerphone for PP © 2012 Dialog Semiconductor B.V. 18 July 1, 2014 v1.6 Cordless Voice Module Air Interface PAEC Rx Gain SC14CVMDECT SF Figure 13 Handset volume configuration 4.5 PP AUDIO MODES The PP audio handling consists of four audio states (see Figure 14). In these states the audio subsystem is configured for a certain audio mode: 4. Headset mode Selection between the modes is done via API calls; see document reference [2]. The Alert state is for tone playing and is entered automatically when tones are played using the API calls. The Alert state can originate from idle, earpiece, handsfree or headset mode. 1. Idle mode (not relevant for microphone configuration) 2. Earpiece mode (Handset speaker) 3. Handsfree or Speakerphone mode Idle API_PP_ AUDIO_ SET_ MODE_ REQ (API_ AUDIO_ MODE_ EARPIECE) API_PP_ AUDIO_ SET_ MODE_ REQ (API_ AUDIO_ MODE_ HANDSFREE ) Earpiece Audio API_PP_ AUDIO_ SET_ MODE_ REQ (API_ AUDIO_ MODE_ EARPIECE ) API_PP_ AUDIO_ SET_ MODE_ REQ (API_ AUDIO_ MODE_ EARPIECE ) API_PP_ AUDIO_SET_ MODE_ REQ (API_ AUDIO_ MODE_ EARPIECE ) Headset Audio API_PP_ AUDIO_ SET_ MODE_ REQ (API_ AUDIO_ MODE_ HEADSET) Figure 14 PP audio modes 4.5.1 Power management be disabled. This feature can be disabled in the VES if the reference voltages for some reasons are needed in Idle mode. To minimize the current consumption the PP will shut down all codec amplifiers in Idle mode. This means that all reference voltages in the analog front-end will © 2012 Dialog Semiconductor B.V. 19 July 1, 2014 v1.6 Cordless Voice Module API_PP_ AUDIO_ SET_ MODE_ REQ (API_ AUDIO_ MODE_ HEADSET ) Handsfree Audio In Earpiece mode (Handset speaker) an artificial sidetone is generated. The level of the sidetone can be adjusted and setup in the VES through parameter fields Audio.Earp.Vol.Elementx, SideToneGain and Audio.Heads. Elementx.SideToneGain. In Earpiece mode it is possible to adjust the volume in the Earpiece via API calls. In Earpiece mode the PP audio is routed as shown in Figure 11. CVMDECT PP1 CVMDECT FP MIX 4CH PCM 4.5.3 Alert mode The Alert mode is for generating tones and melodies on the Speakerphone loudspeaker. In Alert mode it is possible to adjust the volume in the speaker via API calls. Inband tones will be affected by the volume adjustments, since the volume control takes place after tones are added to the signal. Figure 11 shows the Audio flow. CVMDECT PP4 Analog Figure 16 Conference connection 4.6 CALL HANDLING 4.6.5 Page call 4.6.1 FP to PP call The Page call is a FP functionality used to locate the registered PPs. FP paging does not establish a normal audio connection and is terminated when answered by the PP. When the FP initializes a call to a PP, a radio connection is set up to all PP applications to make it possible for the PP application software to indicate that there is an incoming call. It is possible to configure the ringing indication using broadcast to make all 6 PPs ringing. 4.7 TONE/MELODY HANDLING The tone component handles the generation of various tones in the device. Both tones/melodies in a PP configuration are supported. 4.6.2 PP to FP call The main features of the tone component are: When the MMI software signals the PP to establish a call, the PP opens the radio connection to the FP. • Ringer tones and melodies (7-tone polyphonic) • Alert tones (key sound, error tones, confirmation tones, etc.) 4.6.3 Intercom • Inband tones (dial tone, net-congestion tone, busy tone, etc.) Figure 15 shows the audio routing of an internal call between PP1 and PP2. In the FP no transcoding takes place. • Single tone generation 4.8 DATE AND REAL-TIME CLOCK The FP has a real-time clock feature, which (when activated) broadcasts the date and time of day to the PPs. Activation of the date and real-time clock is done by setting the date and time via the PP. CVMDECT PP1 CVMDECT FP The PP clock is synchronized with the FP every time a broadcast is received. If the PP goes out-of-lock, the PP itself calculates the clock time until the PP is again within the range of the FP. The updated clock time can be read locally via the MMI software. To adjust the clock in the FP, a service connection can be set up via commands from the PP. Figure 15 Intercom connection The clock can also be read and set directly from an external microprocessor or through the MMI software on the FP. 4.6.4 Conference Figure 16 shows the audio routing of a 9-party conference call. The real-time clock accuracy depends directly on the 20 July 1, 2014 v1.6 Cordless Voice Module The clock supports hours, minutes and date. The date supports leap years. Daylight saving time is not supported and must be handled by the MMI application. PCM CVMDECT PP2 © 2012 Dialog Semiconductor B.V. SC14CVMDECT SF 4.5.2 Earpiece mode change accordingly. When the SC14CVMDECT SF is configured as a PP, the clock has the same accuracy as the FP clock. When the PP synchronises with a FP, the PP crystal is synchronized with the FP crystal and the PP clock will The accuracy is expected to be within 1 minute for up to 6 weeks without being locked to a FP. SC14CVMDECT SF SC14CVMDECT SF crystal. Figure 17 Clock synchronization 4.9 BATTERY MANAGEMENT V supply V B A T IN LD O V B A T IN V supply SOCp SOCn 100 SOCn CHARGE 0.1 SOCp CHARGE CHARGE_CTRL 1k 1k CHARGE_CTRL 1k SO C SOC Figure 19 Base station (FP) application Figure 18 Handset (PP) application with 2x NiMH Pin CHARGE_CTRL is driven high when either the “sensed voltage on the VBAT pin” is lower than the voltage setting or “sensed current via SOCp” is lower than the current setting. Pin CHARGE_CTRL can drive up to 500 A as source current (see Table 20). Detailed setting information can be found in document [4] under “Battery settings”. Figure 18 shows a handset application with NiMH. SOC (State Of Charge) is used to measure the amount of charge in the rechargeable batteries. Figure 19 shows an FP application. The FP uses an external LDO, so the SOC pins are not used and can be connected to GND. The SOC circuit is used to very accurately determine the amount of charge in rechargeable batteries as well as the discharge state of Alkaline batteries. This information is essential for the battery charging algorithm and necessary for battery status indication to the user. Battery status information is supported by the API. Detailed information can be found in AN-D-174 (Battery Management). © 2012 Dialog Semiconductor B.V. 4.10.1 DECT TBR22 The SC14CVMDECT SF supports the DECT GAP standard according to EN300 444. For TBR22 type approval (optional) switching off the authentication and encryption is required, which can be done with the VES parameter Tbr_22. 21 July 1, 2014 v1.6 Cordless Voice Module 4.10 PROTOCOL STACK The protocol stack handles the RF interface, the MAC-, DLC-, NWK-layer and encryption according to the DECT standard EN300 175 1-9. The PP API supports battery management to calculate the battery capacity and to indicate charge status. Refer to API document [2]. checksum error is signalled back to the transmitter and the complete packet is retransmitted. The packet will be retransmitted until it is received correctly, or until the link is closed. When the PP goes in-range or out-of-range a signal is sent from the PP to the MMI software indicating whether the PP is in-lock or is out-of-lock with the FP. More transmitted packets will be received in the same order as they were transmitted. The application must handle flow control, if needed. 4.10.3 Preamble antenna diversity To optimise the audio quality caused by rapidly changing radio paths (fading), the SC14CVMDECT SF supports preamble antenna diversity. The preamble diversity algorithm uses RSSI measurements to judge the radio signal strength on both antennas and, as a result, the choice of the best performing antenna is determined. This antenna will then be used for the receive slot and the next transmit slot. 4.11 REGISTRATION The PP and the FP must be paired using a procedure called Registration. Without Registration, the PP will be out-of-lock and will not be able to establish a link to a FP and therefore not be able to make a call. The registration uses the unique product identities and secures the PP and FP to allow no cross-communication. The preamble antenna diversity is supported with two antennas. The preamble diversity can be controlled by VES. See document reference [4] and Section 4.13 for more information about antenna diversity. SC14CVMDECT SF 4.10.2 Out-of-Range handling The PP can be de-registered from a FP either via the FP or PP MMI Software using the command interface. It is also possible to deregister a PP from another registered PP. 4.10.4 Broadcasting messages It is possible to pair a PP and FP during the production. Messages consisting of up to 19 bytes can be broadcasted from FP to all registered PPs. Broadcasting does not require an active connection. Broadcasting does not use retransmission, therefore broadcasting is not secured. If the real time clock is enabled this data is also broadcasted to all PPs. 4.11.1 Handling product identities To secure that the FP and PPs do not make crosscommunications a unique ID must be entered into the VES of an FP or PP. For the DECT version the ID for the FP is named RFPI and for the PP the ID is named IPEI. These numbers are factory settings. 4.10.5 IWU to IWU messaging After a successful registration, the IPEI is stored in the FP and the RFPI is stored in the PP. In this way the two parts are known to each other and are allowed to make connections. The registration data are automatically stored in VES of the FP and PP while making the registration. The protocol in the SC14CVMDECT SF module is made according to the DECT/GAP standard as defined in EN 300 175 and EN 300 444. The DECT standard defines an EMC code (see EN 300 175-5, chapter 7.7.23.). This code is unique for a DECT product and must be programmed by the DECT manufacturer to the correct manufacturer code. It is possible to register the same PP to 2 FPs, but it can only be used in one FP at the same time. The EMC code must be the same for SC14CVMDECT SF based product families when using the IWU to IWU messaging. If the Dialog default EMC VES value is changed the IWU to IWU messaging may not operate correctly. Cordless Voice Module IWU data is transferred in a FA format frame; see chapter 6.1 in EN 300 175-4. This frame has an information field of maximum 63 bytes of which maximum 52 bytes can be used for IWU data. With the SC14CVMDECT SF it is only possible to send 5 frames in a row without pause. The following frame must be an acknowledge-frame to secure that the internal buffers within the SC14CVMDECT SF are emptied. The FA frame is segmented in 5 byte fragments and transferred over the air-interface in the A-field. The 2bytes CRC is used to determine if the data is received correctly. If the data is not received correctly this is signalled back to the transmitter by the Q2 bit, and the data is retransmitted. The FA frame has a 2 bytes checksum, used to determine if the complete packet is received correctly. If A © 2012 Dialog Semiconductor B.V. 22 July 1, 2014 v1.6 SC14CVMDECT SF Figure 20 Handling product identities 4.11.2 Deregistration The different PCM interface modes and timings are shown in Figure 21 to 26. Refer to document [1] for detailed information. There are two ways of deregistering a PP from an FP: • Remote FP and PP deregistration The correct way to deregister a PP from an FP is to deregister it remotely in the FP. If this is done over a service connection from the PP to the FP, the FP actually performs the deregistration and then it is automatically signalled to the PP which in turn will drop out-of-lock. Using this method it is also possible to deregister other PPs registered to the FP from one PP. 4.12.2 PCM_FSC frequency The PCM interface supports the following options: • 8 kHz • 16 kHz 4.12.3 Length of PCM_FSC The PCM interface supports the following options: • Removing all registrations at once from the FP (e.g. in case the original PPs are lost). • 1: The length of PCM_FSC pulse is equal to 1 data bit. 4.12 PCM INTERFACE The PCM supports the following modes: • 8: The length of PCM_FSC pulse is equal to 8 data bits. • SLAVE mode clock sync. In this mode the clock of the module will be adjusted to follow the PCM provided by the external PCM master clock. All audio samples are kept if the provided PCM clock accuracy is +/- 5 ppm, which is a DECT radio requirement. • 16: The length of PCM_FSC pulse is equal to 16 data bits. • 32: The length of PCM_FSC pulse is equal to 32 data bits. 4.12.4 Start position of FSC The PCM interface supports the following options: • The FSC pulse starts 1 data bit before the MSB bit of the PCM channel 0 data. • The FSC pulse starts at the same time as the MSB bit of the PCM channel 0 data. • MASTER mode. The FP is master on PCM interface and therefore provides PCM clock and PCM_FSC to an external device. 4.12.5 PCM clock frequency The PCM interface supports the following options in master mode: 4.12.1 PCM Interface for FP The SC14CVMDECT SF supports PCM interface functionality to connect to an external audio source/destination. © 2012 Dialog Semiconductor B.V. • 1.152 MHz • 2.304 MHz 23 July 1, 2014 v1.6 Cordless Voice Module • SLAVE no clock sync. In this mode the clock of the module is not synchronized. This means audio sample will be discarded in case the master PCM clock is faster than the clock of the module or samples will be repeated in case the master PCM clock is slower. • 1.536 MHz • Compressed wideband using A-law, 16 kHz sample rate. The 16 bit PCM data is encoded as two 8 bit audio samples if 8 kHz frame sync is used. Used for wideband calls (G.722). 4.12.6 PCM data mode The PCM interface supports the following PCM data formats: • Compressed wideband using -law, 16 kHz sample rate. The 16 bit PCM data is encoded as two 8 bit audio samples if 8 kHz frame sync is used. Used for wideband calls (G.722). • Linear PCM, 8 kHz sample rate. Used for narrowband calls (G.726). • Linear PCM, 16 kHz sample rate. Used for wideband calls (G.722). SC14CVMDECT SF • G.711 – -law, 8 kHz sample rate. Used for narrowband calls (G.726). • 4.608 MHz • G.711 – A-law, 8 kHz sample rate. Used for narrowband calls (G.726). PCM_CLK PCM_CLK Channel 0 PCM_DI PCM_DO D15 D8 Channel 1 D7 Channel 2 Channel 3 D0 PCM_FSC (input) DSP_PCM_CTRL_REG[5]=0 PCM_FSC (input) DSP_PCM_CTRL_REG[5]=1 PCM Slave mode PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 000 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 001 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 010 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 011 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 100 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 101 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 110 PCM_FSC DSP_PCM_CTRL_REG[5,4,3] = 111 PCM Master Cordless Voice Module Figure 21 PCM interface formats © 2012 Dialog Semiconductor B.V. 24 July 1, 2014 v1.6 SC14CVMDECT SF A P _ D A T A _ F O R M A T _ L IN E A R _ 8 k H z w ith 8 k H z fr a m e s y n c : PCM CLK 8 KHz FSC P C M in 1 s t fra m e C hannel 0 PCM out 1 s t fra m e C hannel 0 1 s t fr a m e C hannel 1 1 s t fr a m e C hannel 1 2 n d fra m e C hannel 0 2 n d fra m e C hannel 1 2 n d fra m e C hannel 0 2 n d fra m e C hannel 1 1 s t fra m e C hannel 0 1 s t fra m e C hannel 1 1 s t fra m e C hannel 0 1 s t fra m e C hannel 1 A P _ D A T A _ F O R M A T _ L IN E A R _ 8 k H z w ith 1 6 k H z f r a m e s yn c : PCM CLK 16 K Hz FS C P C M in 1 s t fra m e C hannel 0 PCM out 1 s t fra m e C hannel 0 1 s t fra m e C hannel 1 1 s t fra m e C hannel 1 Figure 22 PCM bus with linear PCM, 8 kHz sample rate AP_DATA_FORMAT_LINEAR_16kHz with 16 kHz frame sync: PCM CLK 16 KHz FSC PCM in 1st frame Channel 0 PCM out 1st frame Channel 0 1st frame Channel 1 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 Figure 23 PCM bus with linear PCM, 16 kHz sample rate Cordless Voice Module © 2012 Dialog Semiconductor B.V. 25 July 1, 2014 v1.6 SC14CVMDECT SF AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 8 kHz frame sync: PCM CLK 8 KHz FSC 2nd frame PCM in 1st frame Channel 0 1st frame Channel 1 Channel 0 PCM out 1st frame Channel 0 1st frame Channel 1 Channel 0 2nd frame 2nd frame Channel 1 2nd frame Channel 1 AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 16 kHz frame sync: PCM CLK 16 KHz FSC PCM in 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 Figure 24 PCM bus with G.711 – A-law/-law, 8 kHz sample rate AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.722 used on air): PCM CLK 8 KHz FSC PCM in 2nd frame 1st frame 2nd frame 1st frame Channel 0 Channel 0 Channel 1 Channel 1 4th frame 3rd frame 4th frame 3rd frame Channel 0 Channel 0 Channel 1 Channel 1 PCM out 2nd frame 1st frame 2nd frame 1st frame Channel 0 Channel 0 Channel 1 Channel 1 4th frame 3rd frame 4th frame 3rd frame Channel 0 Channel 0 Channel 1 Channel 1 AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.722 used on air): PCM CLK 16 KHz FSC 1st frame Channel 0 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 Figure 25 PCM bus with compressed wideband using A-law/ -law, G722 used on air interface © 2012 Dialog Semiconductor B.V. 26 July 1, 2014 v1.6 Cordless Voice Module PCM in SC14CVMDECT SF AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.726 on air): PCM CLK 8 KHz FSC PCM in 1st frame Channel 0 1st frame Channel 0 1st frame Channel 1 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 0 2nd frame Channel 1 2nd frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 0 1st frame Channel 1 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 0 2nd frame Channel 1 2nd frame Channel 1 AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.726 on air): PCM CLK 16 KHz FSC PCM in 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 Figure 26 PCM bus with compressed wideband using A-law/ -law, G726 used on air interface 4.12.7 PCM Interface for PP device from SC14CVMDECT SF. The SC14CVMDECT SF supports PCM interface functionality to connect to an external audio source/destination. Refer to document [2] for detailed information. • PCM Data mode • PCM interface mode 4.13 ANTENNA OPERATION Supports only linear 16 bit PCM. supports only master mode. • PCM_FSC frequency supports 8 kHz and 16 kHz. RF1 P0n • LENGTH of PCM_FSC RFP0n TP1 Internal antenna The PCM interface supports the following options: TX • 1: The length of PCM_FSC pulse is equal to 1 data bit. RX • 8: The length of PCM_FSC pulse is equal to 8 data bits. RFP0 P0 • 16: The length of PCM_FSC pulse is equal to 16 data bits. RF0 • Start position of FSC The PCM interface supports the following options: Figure 27 Internal circuit of the SC14CVMDECT SF • The FSC pulse starts 1 data bit before MSB bit of the PCM channel 0 data. Figure 27 shows the internal circuit of the SC14CVMDECT SF. Pin RF0 is used for two external antennas and can also be used for RF test purposes, so it is recommended to add a 10 pF capacitor as reserve pattern even when the two external antennas are not used. • The FSC pulse starts at the same time as the MSB bit of the PCM channel 0 data. • PCM clock PCM clock is delivered to an external slave PCM © 2012 Dialog Semiconductor B.V. 27 July 1, 2014 v1.6 Cordless Voice Module • 32: The length of PCM_FSC pulse is equal to 32 data bits. SC14CVMDECT SF Re-certification of the SC14CVMDECT SF is required if at least one external antenna is added. On request, Dialog Semiconductor can provide a pre-certified PCB layout for an external antenna circuit. RF1 is also recommended to use and can be connected to the RF cable to be able to do the JPN DECT type approval test. 4.13.1 Internal antenna only The FAD function is not enabled if only the internal antenna is used. In this case pins RFP0, RFP0n, P0 and P0n must be left unconnected. 4.13.2 Internal and external antenna with FAD Figure 28 shows one external antenna that is connected to RF1 of the SC14CVMDECT SF. This configuration supports the FAD function. In this case pins RFP0, RFP0n, P0 and P0n must be left unconnected. The software patch code is not needed if the SC14CVMDECT SF is operated as FP. External Antenna RF1 Figure 28 One external antenna Cordless Voice Module © 2012 Dialog Semiconductor B.V. 28 July 1, 2014 v1.6 CAT-iq • DTMF and tones • Headset support 5.1 INTRODUCTION • Easy PIN code registration CAT-iq stands for Cordless Advanced Technology, Internet and Quality. It is the new global technology initiative from the DECT Forum, designed for IP-voice services in the next generation networks. CAT-iq is based on the regulatory framework of the mature and reliable DECT technology. It is fully backward compatible to DECT GAP and, as the new cordless phone standard, focuses on high definition VoIP (HD voice) as well as data applications as the next generation Cordless Phone standard. • Easy pairing • handset location • Supports SUOTA (Software Update Over The Air) and LU10 (max 54 kbit/s). SC14CVMDECT SF 5.0 5.2 CAT-IQ PROFILE OVERVIEW The CAT-iq profiles are split between voice and data services, with CAT-iq 1.0 and CAT-iq 2.0 providing features to support key voice enhancements, and CAT-iq 3.0 and CAT-iq 4.0 providing features to support data. 5.2.1 Supported main features • Narrowband (G.726) and wideband (G.722) audio and switching between these two codecs is supported. • CLIP, CNIP, CLIR: Calling Line Identification Presentation, Calling Name Identification, Calling Line Identity Restriction for internal and external calls. • Synchronization of call lists and telephone books, missed calls list, incoming accepted calls list, internal names list (unique identifier of each handset), base telephone book • Synchronization of system settings: PPs are enabled to change partly the configuration of the system consisting of FP and PPs, these system settings are handled using the list access method. Using this method, the FP and the PPs support: • Synchronization of time and date for FP and PPs, that FP is enabled to transmit time and date to the PPs. • Reset to factory settings, means that PP is enabled to reset the FP configuration to its factory setting. • Obtaining FP versions, means that a PP can obtain the software release of the FP. Cordless Voice Module • Multiple lines handling: The behaviour of DECT systems connected to multiple network lines. These lines may be of different types (VoIP and PSTN for example). This feature details how calls are placed in a multiple lines context. This feature also impacts the behaviour of other services in order to ensure attachment of PPs to a line, line settings and several lists properly. • Parallel calls: initiating a second call in parallel to the first call, toggling between calls, putting a call on hold, resuming calls from on hold, call transfer, 3party conference with established external and/or internal calls © 2012 Dialog Semiconductor B.V. 29 July 1, 2014 v1.6 Specifications All MIN/MAX specification limits are guaranteed by design, or production test, or statistical methods unless note 7 is added to the parameter description. Typical values are informative. Note 7: This parameter will not be tested in production. The MIN/MAX values are guaranteed by design and verified by characterization. 6.1 GENERAL Table 6: SC14CVMDECT SF module ITEM CONDITIONS Dimensions lxwxh Weight UNIT 18.0 x 19.6 x 2.7 mm 1.5 -40 to +85 °C 1870 to 1930 MHz - typical outdoor 350 - typical indoor 75 2.10 to 3.45 0.1 mm Temperature range Frequency range According to DECT standard Antenna range According to DECT standard; (Note 8) Standards compliancy ETS 300 444 (DECT GAP), former TBR2214 FCC part 15 Power supply 2 cell NiCd/NiMH Note: for 1 Li-Ion battery an external LDO is required. Maximum PCB warpage For entire reflow range Note 8: VALUE SC14CVMDECT SF 6.0 The resulting range is very dependent of the mechanical design. Dialog Semiconductor is not responsible for this design and as such Dialog Semiconductor is not responsible for the resulting performance range of the final product. 6.2 ABSOLUTE MAXIMUM RATINGS Table 7: Absolute Maximum Ratings (Note 9) PARAMETER DESCRIPTION Vbat_max Vpon_max MIN UNIT Max voltage on pin VBATIN, VDDPA 3.45 Max voltage on pin PON 5.5 Vled_max Max voltage on pin LED4, LED3 3.6 Vdig_bp_max Max voltage on digital pins with back drive protection; ports P0 and P2 (except P2.6) 3.6 Vdig_max Max voltage on other digital pins 2.0 Vana_max Max voltage on analog pins 2.2 Vesd_hbm ESD voltage according to human body model; all pins 2000 Vesd_mm ESD voltage according to machine model; all pins 150 Absolute maximum ratings are those values that may be applied for maximum 50 hours. Beyond these values, damage to the device may occur. © 2012 Dialog Semiconductor B.V. 30 July 1, 2014 v1.6 Cordless Voice Module MAX Note 9: CONDITIONS Table 8: Operating Conditions (Note 10) PARAMETER DESCRIPTION CONDITIONS Vbat Supply voltage on pin VBATIN Vdd_pa CLASSD supply voltage on pin VDDPA Vpon Vdig_bp Vdig Voltage on other digital pins Vana Voltage on analog pins Icharge Current through pin CHARGE Ipa Current through pin PAOUTp, PAOUTn Iout_vrefp Output current through pin VREFp TA Ambient temperature MIN MAX UNIT 2.1 3.45 2.1 3.45 Voltage on pin PON 5.5 Voltage on digital pins with back drive protection; ports P0 and P2 (except P2.6) 3.45 VDD = 1.8 V 1.98 AVD = 1.8 V 2.1 Rseries > (Vcharge-3 V)/ 10 mA 10 mA 500 mA mA +85 °C (Note 11) (Note 12) -40 TYP SC14CVMDECT SF 6.3 OPERATING CONDITIONS Note 10: Within the specified limits, a life time of 10 years is guaranteed. Note 11: A life time of 10 years of the CLASS-D amplifier is guaranteed if switched on for 10% of the time. Note 12: Within this temperature range full operation is guaranteed. 6.4 DIGITAL INPUT/OUTPUT PINS Table 9: Digital input levels PARAMETER DESCRIPTION CONDITIONS Vil_dig Logic 0 input level; all digital input pins except PON, CHARGE and RSTn VDD = 1.8 V Vil_pon Vil_charge Vil_rst Logic 0 input level; pin RSTn VDD = 1.8 V Vih_dig Logic 1 input level; all digital input pins except PON, CHARGE and RSTn VDD = 1.8 V Vih_pon Vih_charge Vih_rst Logic 1 input level; pin RSTn VDD = 1.8 V MIN TYP MAX UNIT 0.3*VDD Logic 0 input level; pin PON 0.9 Logic 0 input level; pin CHARGE 0.9 0.2*VDD 0.7*VDD Logic 1 input level; pin PON 1.5 Logic 1 input level; pin CHARGE 1.5 0.8*VDD PARAMETER DESCRIPTION CONDITIONS Vol_dig Logic 0 output level VDD = 1.8 V; Iout = 2, 4, 8 mA (Note 13) Voh_dig Logic 1 output level VDD = 1.8 V; Iout = 2, 4, 8 mA (Note 13) MIN 0.8*VDD TYP MAX UNIT 0.2*VDD Note 13: For output drive capability, see section "Pin Description" on page 5. © 2012 Dialog Semiconductor B.V. 31 July 1, 2014 v1.6 Cordless Voice Module Table 10: Digital output levels Table 11: Microphone amplifier PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT Vmic_0dB_unt Untrimmed differential RMS input voltage between MICp and MICn (0 dBm0 reference level) (Note 7) 0 dBm0 on COUT (Note 15) MIC_GAIN[3:0] = 0, @ 1020 Hz; Tolerance: • 13% when untrimmed (BANDGAP_REG=8) (Note 14) 114 131 149 mV 75 150 SC14CVMDECT SF 6.5 ANALOG FRONT END • 6% when trimmed (Note 16) Rin_mic Resistance of activated microphone amplifier inputs (MICp, MICn and MICh) to internal GND (Note 7) Vmic_offset Input referred DC-offset (Note 7) MIC_GAIN[3..0] = 1111 3 sigma deviation limits -2.6 k +2.6 mV Note 14: BANDGAP_REG will be tuned at the factory. Note 15: 0 dBm0 on COUT = -3.14 dB of max PCM value. COUT is CODEC output in test mode Note 16: Trimming possibility is foreseen. At system production the bandgap reference voltage can be controlled within 2% accuracy and data can be stored in Flash. Either AVD or VREF can be trimmed within 2% accuracy. If AVD is trimmed VREF will be within 2% accuracy related to either AVD. Or vice versa VREF can be trimmed. For Vref trimming measure VREFp, VREFm) and update BANDGAP_REG[3..0]. Table 12: Microphone amplifier (Operating Condition) PARAMETER DESCRIPTION CONDITIONS Vmic_cm_level MICp and MICn common mode voltage MICp and MICn are set to GND with internal resistors (Rin_mic). If DC coupled the input voltage must be equal to this voltage. MIN TYP MAX UNIT (0.9 V/1.5)* VREFp Table 13: Microphone supply voltages DESCRIPTION CONDITIONS MIN TYP MAX UNIT Vref_unt VREFp-VREFm untrimmed (Note 17) ILOAD = 0 mA BANDGAP_REG = 8 (Note 16) 1.41 1.5 1.59 Rout_vrefp VREFp output resistance Figure 29 Nvrefp_idle Peak noise on VREFp-VREFm (Note 7) CCITT weighted PSRRvrefp Power supply rejection Vref output (Note 7) See Figure 29, AVD to VREFp/m, f = 100 Hz to 4 kHz BANDGAP_REG[5:4] = 3 -120 40 dBV dB Note 17: Vrefm is a clean ground input and is the 0 V reference. © 2012 Dialog Semiconductor B.V. 32 July 1, 2014 v1.6 Cordless Voice Module PARAMETER PARAMETER DESCRIPTION Cload_vrefp Iout_vrefp Rout_vrefp MAX UNIT VREFp (parasitic) load capacitance 20 pF VREFp output current mA VREFp CONDITIONS MIN TYP SC14CVMDECT SF Table 14: VREFp load circuit Iout_vrefp Cload_vrefp VREFm Figure 29 VREFp load circuit Table 15: LSRp/LSRn outputs PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT Vlsr_0dB_unt Untrimmed differential RMS output voltage between LSRp and LSRn in audio mode (0 dBm0 reference level) 0 dBm0 on CIN (Note 18), LSRATT[2:0] = 001, @ 1020 Hz Load circuit A (see Figure 30, Table 16) with RL1= , Cp1 or load circuit B (see Figure 31) with RL2, Cp2 and Cs2 621 714 807 mV Tolerance: • 13% when untrimmed (BANDGAP_REG=8) • 6% when trimmed (Note 16) Resistance of activated loudspeaker amplifier outputs LSRp and LSRn Vlsr_dc DC offset between LSRp and LSRn (Note 7) LSRATT[2:0] = 3 RL1 = 28 3 sigma deviation limits -20 20 mV Cordless Voice Module Rout_lsr Note 18: 0 dBm0 on CIN = -3.14 dB of max PCM value. © 2012 Dialog Semiconductor B.V. 33 July 1, 2014 v1.6 PARAMETER DESCRIPTION CONDITIONS Cp1_Rl1_inf Load capacitance Cp1_Rl1_1k Load capacitance Rl1 Load resistance Cp2 Parallel load capacitance Cs2 Serial load capacitance Rl2 Load resistance MIN TYP MAX UNIT see Figure 30, RL1 = 30 pF see Figure 30, RL1 1 k 100 pF 30 pF 30 F 28 see Figure 31 600 LSRp SC14CVMDECT SF Table 16: LSRp/LSRn load circuits LSRp RL2 RL1 Cp2 Cp1 Cs2 LSRn LSRn Figure 31 Load circuit B: Piezo loudspeaker Figure 30 Load circuit A: Dynamic loudspeaker Table 17: PAOUTp, PAOUTn outputs PARAMETER DESCRIPTION CONDITIONS Vpa_4v Differential rms output voltage between PAOUTp and PAOUTn Trimmed bandgap input = 0 dBm0, 1 kHz (Note 15) Output low-pass filtered CLASSD_VOUT = 0 0.985 Vrms As above CLASSD_VOUT = 1 1.478 Vrms Vpa_6v Zload_pa_4v Zload_pa_6v Speaker impedance, connected between PAOUTp and PAOUTn MIN With these values, the peak currents stays within the operating range. TYP MAX UNIT Table 18: PAOUTp, PAOUTn outputs (Note 19) DESCRIPTION CONDITIONS Rout_pa Differential output resistance between PAOUTp and PAOUTn See (Note 19) MIN TYP MAX UNIT Note 19: Clipping of the outputs occurs when the VDDPA drops and the following conditions becomes true. If CLASSD_CTRL_REG[CLASSD_CLIP] is not equal to zero then upon a programmable number of clipping occurrences a CLASSD_INT is generated: The software can stop clipping by reducing the gain via the GENDSP: Clipping occurs if © 2012 Dialog Semiconductor B.V. peak LowPassFiltered PAOUTp – PAOUTm - ------------------------------------------Zload --------------------------------------------------------------------------------------------------------------------- VDDPA – VSSPA Zload + Rout_pa 34 July 1, 2014 v1.6 Cordless Voice Module PARAMETER PARAMETER DESCRIPTION CONDITIONS C_VDDPA Decoupling capacitor on VDDPA Required when Class-D is used and guaranteed life time. (see Figure 32) MIN TYP MAX UNIT F Cs_PAOUT Snubber capacitor (to reduce ringing at PAOUTp/n) Required when Class-D is used to prevent EMI and guaranteed life time. (see Figure 32) nF Rs_PAOUT Snubber resistor (to reduce ringing at PAOUTp/n) Required when Class-D is used to prevent EMI and guaranteed life time. (see Figure 32) SC14CVMDECT SF Table 19: PAOUTp, PAOUTn external components PAOUTp Rs_PAOUT Cs_PAOUT VDDPA C_VDDPA VSS/GND PAOUTn Rs_PAOUT Figure 32 Class-D external components Efficiency 75% at 300 mW@2 V, 500 mW@2.5 V into a 4 transducer. 2.5 V (= VBAT) VDDPA GND (2x) DUT PAOUTp 15 H 4 PAOUTn AP-system2, settings: bw = <10 Hz until 30 kHz filter = A-weighting detection = 4/s RMS input = high-ohmic in in out 15H 100 AP AUX-0025 passive switching amplifier measurement filter Figure 33 CLASS-D amplifier measurement setup © 2012 Dialog Semiconductor B.V. 35 July 1, 2014 v1.6 Cordless Voice Module 1 F ceramic dummy load (models typical speaker) resistors reduce influence from measurement on DUT 100 Table 20: CHARGE_CTRL pin PARAMETER DESCRIPTION CONDITIONS MIN Voh_charge_ctrl Drive capability of pin CHARGE_CTRL sourcing 500 A 1.6 Vol_charge_ctrl TYP MAX UNIT sinking 100 A 0.2 MAX UNIT +100 mV Table 21: State of charge circuit (SoC) (Operating condition) DESCRIPTION CONDITIONS MIN Vsocp_socn Input voltage between SOCp and SOCn With the prescribed 0.1 sense resistor this results in the usable current range -100 -1000 mA TYP SoC_asym_err ex tra po la io 10 Counter ticks/s PARAMETER SC14CVMDECT SF 6.6 BATTERY MANAGEMENT -100 mA 100 mA 1000 mA input current SoC_sym_err: A - |B| Figure 34 State of charge (SOC) counter accuracy 6.7 BASEBAND PART Table 22: Baseband specifications DESCRIPTION CONDITIONS Fbit_uart Serial interface bit rate Fbit_flash MAX UNIT UART; Interface for external microprocessor or PC 115.2 kbit/s Flash download bit rate Via UART 115.2 kbit/s Ibat_stdby_fp Standby supply current FP application (3.3 V) 55 60 mA Ibat_act_fp Active supply current FP application (3.3 V) 65 70 mA Ibat_stdby_pp Standby supply current PP application (3.3 V) 4.5 mA Ibat_act_pp Active supply current PP application (3.3 V) 30 40 mA © 2012 Dialog Semiconductor B.V. 36 MIN TYP July 1, 2014 v1.6 Cordless Voice Module PARAMETER Table 23: Radio specifications PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT P_Rx Receiver sensitivity BER = 0.001; TA = 25 °C -93 -92 -89 dBm P_Rx_T Receiver sensitivity, full temperature range BER = 0.001; -40 °C TA 85 °C -87 dBm IPL Intermodulation performance level (EN 301 406 section 4.5.7.6) TA = 25 °C; Pw = -80 dBm; f = 2 channels NTP Normal transmitted power DECT: 250 mW 24 26 dBm J-DECT: 10 mW average per frame for each slot 23 24.5 dBm 20.0 dBm dB -35 dBm DECT6.0: 100 mW (max peak) dPrfpa_T RFPA power variation, full temperature range -40 °C TA +85 °C Fbit Bit rate GFSK modulation BW_Tx Transmitter bandwidth DECT GFSK; NTP = 20 dB SC14CVMDECT SF 6.8 RADIO (RF) PART Standards compliancy: ETS 301 406 (former TBR6). 2.5 1.152 Mbit/s 1.728 MHz Table 24: RFPA preferred settings for various power modes (PP application) Address (VES) Register / Parameter HPM/U (USA) HPM (Europe) HPM/J (Japan) 0x3D RF_BBADC_CTRL_REG 0x0380 0x03A0 0x0398 0x39 RF_PA_CTRL1_REG 0x09A0 0x0CF0 0x2CE0 0x3B RF_TEST_MODE2_REG 0x0056 0x0062 0x0068 0x05 RF_PLL_CTRL2_REG[MODINDEX] 0x25 0x25 0x23 0x23 Upper RSSI threshold 0x2C N/A 0x28 0x24 Lower RSSI threshold 0x22 N/A 0x1E Cordless Voice Module © 2012 Dialog Semiconductor B.V. 37 July 1, 2014 v1.6 Table 25: Requirements for linear supply regulator PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT VBAT IN Voltage at VBAT SW Unloaded VB Loaded VB-V1-V2-V3 2.1 3.45 V1 Settling time I = 50 mA 20 mV V2 Receive period I = 130 mA 100 mV V2 Transmit period I = 550 mA 200 mV V3 Drop during transmit 25 mV SC14CVMDECT SF 6.9 RF POWER SUPPLY Figure 35 RF power supply Cordless Voice Module © 2012 Dialog Semiconductor B.V. 38 July 1, 2014 v1.6 SC14CVMDECT SF 6.10 RF CHANNEL FREQUENCIES Table 26: RF frequencies and channel numbers Frequency (MHz) DECT CH 1881.792 1883.520 1885.248 1886.976 1888.704 1890.432 1892.160 1893.888 1895.616 1897.344 J-DECT CH DECT6.0 CH 1899.072 10 1900.800 11 1902.528 12 1921.536 1923.264 1924.992 1926.720 1928.448 RF setting values must be followed according to AN-D-204 when DECT country mode was changed. Cordless Voice Module © 2012 Dialog Semiconductor B.V. 39 July 1, 2014 v1.6 Design guidelines 2. Earpiece mode 3. Handsfree mode (Speakerphone) This section describes the software and hardware considerations to be taken into account when designing the target application. 4. Headset mode Shifting between modes is done through the API. The SC14CVMDECT SF can be used standalone or next to an MCU that controls the module. In case the module is used standalone the application will be stored in its on-board Flash. In total 324 kB of Flash is available for this purpose. Tone handling The Application Software state machine must control when to play tones and the volume setting. Custom melodies can be defined in the VES. Applications can be developed with the Athena software development environment (see reference [3]). 7.2 APPLICATION SOFTWARE FOR FP In an FP application the following software tasks must be handled by the MCU or within the module itself: 7.1 APPLICATION SOFTWARE FOR PP In a PP application the following software tasks must be handled by the MCU or within the module itself: • UART communication (external microprocessor only) • UART communication (external microprocessor only) • FP MMI • Display interface (optional) • PP MMI • Keyboard interface (optional) • Display interface (optional) • Audio handling • Keyboard interface (optional) • Tone / Melodies handling • Battery Charge interface (optional) For control commands see document reference [1]. • Audio handling UART communication • Tone / Melodies handling The UART communication forms the basic of the FP operation because via this interface the SC14CVMDECT SF is controlled. For control commands see document reference [2]. UART communication FP MMI The UART communication is the main control interface of the SC14CVMDECT SF. The MMI state machine must handle the call setup and call termination on the FP. PP MMI Display interface The MMI state machine must handle the call setup and call termination on the PP. The MCU/ FP handles the display interface including the display driver. Display Interface Keyboard interface The MCU / PP handles the display interface including the display driver. The MCU/ FP handles the keyboard interface including the keyboard driver. Keyboard Interface Audio handling The MCU/ PP handles the keyboard interface including the keyboard driver. The Application Software state machine must control when to open and close the audio. The FP MMI must handle the volume control. Audio handling Tone handling The Application Software state machine must control when to play tones and the volume setting. Custom melodies can be defined in VES. Headset detection boundaries can be adjusted in VES. When headset indication is received from the PP Headset detection logic, the Application Software can decide if audio should be switched to the headset and sends a request to the PP stack software. 7.3 HARDWARE DESIGN GUIDELINES Within this section general design guidelines for SC14CVMDECT SF FP and PP applications are given. 7.3.1 Circuit design guidelines The PP audio handling basically consists of 4 audio modes (see Figure 14): For a reference schematic refer to the SC14CVMDECT SF reference kit. With the reference kit package a noncost optimised reference design is presented. 1. Idle (Alert) mode 40 July 1, 2014 v1.6 Cordless Voice Module The Application Software state machine must control when to open and close the audio. The headset plug-in detection must handled by the host, and a status is send to the PP MMI from the PP stack software. The PP MMI must handle the volume control. © 2012 Dialog Semiconductor B.V. SC14CVMDECT SF 7.0 • Microphone(s) • Headset microphone and speaker • Supply voltage • Speakerphone (signal grounds) • Battery charge Depending on the layout it may also be necessary to bypass a number of the audio signals listed above to avoid humming, noise from RF radiation and TDD noise with. It is also important to choose a microphone of appropriate quality with a high RF immunity (with built-in capacitor). • LED and buttons • Audio: • Headset • External PCM device. • ESD performance Besides TDD noise, the ESD performance is important for the end-application. In order to achieve a high ESD performance supply lines should be placed with a large distance from charging terminals, display, headset connector and other electrical terminals with direct contact to the ESD source. On a two-layer PCB application it is important to keep a simulated one layer ground. With a stable ground ESD and TDD noise performance will always improve. For a PP hardware design the following hardware parts will be needed besides the SC14CVMDECT SF: • Power • Battery Charger • Audio: • Microphone • Earpiece • Speaker • Clearance around test patterns Pin number 81 to 88 are used for production test purposes. In order to avoid any interference or disturbance the area around these signal pins must be kept clear of any signal and/or GND. The recommended clearance is at least 1 mm as shown in Figure 36. • Headset 7.3.2 PCB Design Guidelines • Because of the presence of the digital radio frequency burst with 100 Hz time division periods (TDD noise), supply ripple and RF radiation, special attention is needed for the power supply and ground PCB layout. • Power supply considerations Both high and low frequency bypassing of the supply line connections should be provided and placed as close as possible to the SC14CVMDECT SF. In order to get the best overall performance for both FP and PP applications, a number of considerations for the PCB has to be taken into account. 1.0mm GND Pattern • Ground plane considerations In order to achieve the best audio performance and to avoid the influence of power supply noise, RF radiation, TDD noise and other noise sources, it is important that the audio circuits on both FP and PP applications boards are connected to the VREFM pin (analog ground: AGND, see Figure 38) on the SC14CVMDECT SF with separate nets in the layout. It is advised to provide the following audio circuits with separate ground nets connected to the VREFM pin: Figure 36 Clearance around test patterns 41 July 1, 2014 v1.6 Cordless Voice Module • Supply lines should be placed as far as possible away from sensitive audio circuits. If it is necessary to cross supply lines and audio lines, it should be done with right angles between supply and audio lines/circuits (microphone, ear-speaker, speakerphone, etc.) 1.0mm Test pattern 0.6mm 0.9mm • Make angle breaks on long supply lines to avoid resonance frequencies in respect to DECT frequencies. Maximum 8 cm before an angle break is recommended. © 2012 Dialog Semiconductor B.V. SC14CVMDECT SF For a FP hardware design the following hardware parts will be needed besides the SC14CVMDECT SF: Place the module at the edge of the main-board as shown in Figure 37. If the module has to be placed away from the edge of the main board, then avoid conducting areas in front of the antennas and make a cut-out in the main board underneath the antennas as shown in the figure. Keep a distance of at least 10 mm from the antenna elements to conducting objects and at least 5 mm to non-conducting objects. Keep solid ground on layer 2 out to the edges of the main board as shown in the figure. Keep in mind that electrical shielding objects, even partly surrounding the antennas, will normally cause a significant degradation of the coverage. N o P C B a re a SC14CVMDECT SF 7.4 MODULE PLACEMENT ON THE MAIN BOARD In order to ensure FCC compliance, proper coverage and to avoid detuning of the antennas, it is required to place the module free on the main board in relation to other surrounding materials. > 10 m m > 10 m m > 10 m m 79 a n te n n a e x te n s io n GND M o d u le M a in b o a rd 78 GND 77 76 GND Figure 37 Module placement on the main board (top view) 7.5 PATTERN FOR PIN 79 ON THE MAIN BOARD The copper pattern for pin 79 on the main board is very important because it is part of the internal antenna of the module. It is used to extend the internal antenna for optimum RF performance. The PCB pattern shown in Figure 41 under “pads C” for pin 79 on the main board was used during module certification. Cordless Voice Module 7.6 PRECAUTIONS REGARDING UNINTENDED COUPLING The SC14CVMDECT SF includes the internal antenna, so by integration on the main board precautions shall be taken in order to avoid any kind of coupling from the main board to the RF part of the module. If there is any doubt about this, a brief radio test should be performed. © 2012 Dialog Semiconductor B.V. 42 July 1, 2014 v1.6 D J1 J2 JTAG UTX URX P0[2] P0[3] P0[4] P0[5] P0[6] P0[7] P1[0 P1[1] P1[2] P1[3] P1[4] P1[5] PON CHARGE P2[0] P2[1] P2[2] P2[3] P2[4] P2[5] P2[6] P2[7] PAOUTn PAOUTp P3[2] P3[3] P3[4] P3[5] P3[6] P3[7] internal 22uF C11 10pF C12 R9 1K C3 1uF CP_VOUT1 ULP_PORT ULP_XTAL P3[0]/PAOUTn/DP0 P3[1]/PAOUTp/DP1 P3[2]/CIDINp P3[3]/ADC0 P3[4]/PARADET P3[5]/RINGING/RINGOUT P3[6]RINGn P3[7]/RINGp P2[0]/ECZ1/PWM0/LED3 P2[1]/ECZ2/PWM1/LED4 P2[2]/PCM_CLK/CLK100 P2[3]/SDA1/PCM_DI/DP2 P2[4]/SCL1/PCM_DO/DP3 P2[5]/PCM_FSC/SF P2[6]WTF_IN P2[7]/BXTAL P1[0]/INT0/ADC1 P1[1]/INT1/LE P1[2]/INT2/SK P1[3]/INT3/SIO P1[4]/INT4/TDOD P1[5]/INT5/RDI/VDDE P1[6] / PON P1[7] / CHARGE P0[0]/UTX P0[1]/URX P0[2]/UTX2/SDA2 P0[3]/URX2/SCL2 P0[4]/SPI_EN P0[5]/SPI_CLK P0[6]/SPI_DO P0[7]/SPI_DI/PWM1 JTAG RSTn U1 SC14WSMDATA_SF01 53 52 48 47 46 44 43 42 41 40 16 37 36 35 34 33 29 23 59 58 57 56 55 54 39 32 27 24 65 15 69 68 67 66 31 30 26 SC14CVMDECT SF01 10pF C15 1uF C13 RF0 RF1 P0 P0n RFP0 RFP0n LSRn LSRp VREFp MICn/CIDOUT MICh MICp/CIDINn VREFm 75 73 13 R2 R1 12 R3 R5 R4 10 11 MICh R7 0R 0R 0R 1K 0R 0R C7 C8 AGND 0,.1uF 0,.1uF C5 C4 DNA R6 DNA C9 DNA 10R C10 DNA Title : C6 DNA R8 1K of Rev: 0.1 Dialog Semiconductor Het Zuiderkruis 53 5215 MV 's-Hertogenbosch tel. (+31) 73 6408822 fax. (+31) 73 6408823Sheet: Figure 38 Reference diagram example Cordless Voice Module LSR1 MIC1 SC14CVMDECT_SF01_RD Designer: F v D Doc. Nr. Date: Wednesday, November 28, 2012 July 1, 2014 v1.6 43 © 2012 Dialog Semiconductor B.V. 61 VDDOUT 25 VDDPA 62 VBATSW GND 80 GND 78 GND 76 GND 74 GND 72 GND 77 64 63 VBATIN VBATIN 19 DC_SENSE 21 DC_CTRL 20 DC_I GND 71 GND 70 GND 60 GND 51 GND 50 GND 49 18 SOCn/GND 22 CHARGE_CTRL 17 SOCp GND 45 GND 38 GND 28 GND GND 14 GND SC14CVMDECT SF Example Application Diagram 8.0 Notices to OEM • Increase the separation between the equipment and receiver The end product has to be certified again if it has been programmed with other software than Dialog standard software stack for portable part and/or uses one or two external antenna(s). • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 9.1 FCC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER. The end product that the module is integrated into must be marked as follows: Privacy of communications may not be ensured when using this phone. 9.2 INDUSTRY CANADA REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: “Contains Transmitter Module FCC ID: Y82-SC14S / IC: 9576A-SC14S” The literature provided to the end user must include the following wording: FCC compliance statement This device complies with Part 15 of the FCC Rules for only portable part. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation of the device. Contains transmitter module IC: 9576A-SC14S L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification d'Industrie Canada d'un module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une etiquette donnant le numéro de certification du module d'Industrie Canada, précédé des mots " Contient un module d'émission ", du mot " Contient " ou d'une formulation similaire exprimant le même sens, comme suit : Module transmetteur ID IC: 9576A-SC14S. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d’interférences nuisibles et (2) appareil doit accepter toute interférence reçue, y compris les interférences qui peuvent perturber le fonctionnement. Changes or modifications to the equipment not expressly approved by the Party responsible for compliance could void the user's authority to operate the equipment. Contient le module d'émission IC: 9576A-SC14S This device complies with Industry Canada licenceexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: CAN ICES-3 (B)/NMB-3(B) • Reorient or relocate the receiving antenna 44 July 1, 2014 v1.6 Cordless Voice Module This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. © 2012 Dialog Semiconductor B.V. SC14CVMDECT SF 9.0 SC14CVMDECT SF 9.3 PRECAUTIONS REGARDING UNINTENDED COUPLING Integration on the main board precautions shall be taken in order to avoid any kind of coupling from the main board to the RF part of the module. If there is any doubt about this, a radio short test should be performed. 9.4 END APPLICATION APPROVAL The module is intended to be used in an end application. Type approval concerning the end product, except for the module, should off cause be done. Please contact a test-house in order to clarify what is needed. 9.5 SAFETY REQUIREMENTS This section provides of an overview of the safety requirements you must adhere to when working with the Cordless Voice Module SC14CVMDECT SF. • The specific external power supply for the Cordless Voice Module SC14CVMDECT SF has to fulfil the requirements according to clause 2.5 (Limited power source) of this standard EN 60950-1:2006. • Interconnection circuits shall be selected to provide continued conformance to the requirements of clause 2.2 for SELV (Safety Extra Low Voltage) circuits according to EN 60950-1:2006 after making connections. • Interface type not subjected to over voltages (i.e. does not leave the building). • Requirements additional to those specified in this standard may be necessary for: • Equipment intended for operation in special environments (for example, extremes of temperature, excessive dust, moisture or vibration, flammable gases and corrosive or explosive atmospheres). • Equipment intended to be used in vehicles, on Board ships or aircraft, in tropical countries or at altitudes greater than 2000 m. • Equipment intended for use where ingress of water is possible. • Installation by qualified personnel only! © 2012 Dialog Semiconductor B.V. Cordless Voice Module • The product is a component intended for installation and use in complete equipment. The final acceptance of the component is dependent upon its installation and use in complete equipment. 45 July 1, 2014 v1.6 SC14CVMDECT SF 10.0 Package information 10.1 SOLDERING PROFILE The SC14CVMDECT SF should be soldered using a standard reflow soldering profile and lead free solder paste as shown below. Adjustments to the profile may be necessary depending on process requirements. Figure 39 Reflow profile 10.2 MOISTURE SENSITIVITY LEVEL (MSL) The MSL is an indicator for the maximum allowable time period (floor life time) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a maximum temperature of 30°C and a maximum relative humidity of 60% RH. before the solder reflow process. MSL Level Cordless Voice Module The SC14CVMDECT SF is qualified to MSL 3. Floor Life Time MSL 4 72 hours MSL 3 168 hours MSL 2A 4 weeks MSL 2 1 year MSL 1 Unlimited at 30°C/85%RH © 2012 Dialog Semiconductor B.V. 46 July 1, 2014 v1.6 SC14CVMDECT SF 10.3 COPPER PAD, SOLDER OPENING AND STENCIL For the stencil a thickness of 0.122 mm is recommended. Recommended copper pad, solder mask opening and stencil are shown below. Cordless Voice Module Figure 40 Pad dimensions © 2012 Dialog Semiconductor B.V. 47 July 1, 2014 v1.6 SC14CVMDECT SF Figure 41 Copper pad, Solder mask opening and Stencil Cordless Voice Module Figure 42 Solder stencil © 2012 Dialog Semiconductor B.V. 48 July 1, 2014 v1.6 SC14CVMDECT SF 10.4 MECHANICAL DIMENSIONS Cordless Voice Module Figure 43 Package outline drawing © 2012 Dialog Semiconductor B.V. 49 July 1, 2014 v1.6 SC14CVMDECT SF 11.0 Revision history Jul1, 2014 v1.6: • Changed maximum RF output power for DECT 6.0 Apr16, 2014 v1.5 • Added an explanation for RF1 on 4.13 Feb 11, 2014 v1.4 • Correct 10.3Copper pad, solder openinG and STENCIL47 Jan 31, 2014 v1.3 • Update 10.3Copper pad, solder openinG and STENCIL47 Nov 8, 2013 v1.2: • Added section “9.2 INDUSTRY CANADA REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER” Sept 12, 2013 v1.1: • Ordering code for tray version corrected. • Ordering code for tape-on-reel version removed. July 9, 2013 v1.0: Initial version Cordless Voice Module © 2012 Dialog Semiconductor B.V. 50 July 1, 2014 v1.6 Datasheet Status Product Status Definition Advance Information Formative or in Design This data sheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This data sheet contains preliminary data. Supplementary data will be published at a later date. Dialog Semiconductor reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. No Identification Noted Full production This data sheet contains final specifications. Dialog Semiconductor reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Obsolete Not in Production This data sheet contains specifications on a product that has been discontinued by Dialog Semiconductor. The data-sheet is printed for reference information only. SC14CVMDECT SF Product Status Definitions Dialog Semiconductor reserves the right to make changes without notice to any products herein to improve reliability, function or design. Dialog Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the right of others. Life Support Policy DIALOG’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNCIL OF DIALOG SEMICONDUCTOR. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labelling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Dialog Semiconductor does not assume any responsibility for use of any circuit described, no circuit patent licenses are implied, and Dialog reserves the right, at any time without notice, to change said circuitry or specifications. RoHS Compliance Dialog Semiconductor complies to European Directive 2001/95/EC and from 2 January 2013 onwards to European Directive 2011/65/EU concerning Restriction of Hazardous Substances (RoHS/RoHS2). Contacting Dialog Semiconductor Germany Headquarters Dialog Semiconductor GmbH Phone: +49 7021 805-0 North America Dialog Semiconductor Inc. Phone: +1 408 727 3200 Singapore Dialog Semiconductor Singapore Phone: +65 64845419 United Kingdom Dialog Semiconductor (UK) Ltd Phone: +44 1793 757700 Japan Dialog Semiconductor K. K. Phone: +81 3 5425 4567 China Dialog Semiconductor China Phone: +852 2607 4271 The Netherlands Dialog Semiconductor B.V. Phone: +31 73 640 88 22 Taiwan Dialog Semiconductor Taiwan Phone: +886 226 580 388 Korea Dialog Semiconductor Korea Phone: +82 2 569 2301 © 2012 Dialog Semiconductor B.V. 51 July 1, 2014 v1.6 Cordless Voice Module Dialog Semiconductor’s statement on RoHS can be found on the customer portal http:/portal.dialog-semiconductor.com. RoHS certificates from our suppliers are available on request.
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