Digi XBEE3 XBEE3 User Manual XBee Micro Hardware Reference Manual
Digi International Inc XBEE3 XBee Micro Hardware Reference Manual
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| Document ID | 3642957 |
| Application ID | 6FcRNH+OwMywQlLdvzgT0A== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 76.39kB (954888 bits) |
| Date Submitted | 2017-11-17 00:00:00 |
| Date Available | 2017-11-17 00:00:00 |
| Creation Date | 2017-10-17 10:21:37 |
| Producing Software | madbuild |
| Document Lastmod | 2017-10-23 09:27:41 |
| Document Title | XBee Micro Hardware Reference Manual |
| Document Author: | Digi International Inc. |
XBee3™ RF Module Hardware Reference Manual Revision history—900001543 Revision Date Description October 2017 Initial release. Trademarks and copyright Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United States and other countries worldwide. All other trademarks mentioned in this document are the property of their respective owners. © 2017 Digi International Inc. All rights reserved. Disclaimers Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time. Warranty To view product warranty information, go to the following website: www.digi.com/howtobuy/terms Send comments Documentation feedback: To provide feedback on this document, send your comments to techcomm@digi.com. Customer support Digi Technical Support: Digi offers multiple technical support plans and service packages to help our customers get the most out of their Digi product. For information on Technical Support plans and pricing, contact us at +1 952.912.3444 or visit us at www.digi.com/support. XBee3™ RF Module Hardware Reference Manual Contents XBee3™ RF Module Hardware Reference Manual General XBee3 specifications General specifications Regulatory conformity summary Serial communication specifications UART pin assignments GPIO specifications 802.15.4-specific specifications Performance specifications Power requirements Networking and security specifications Communication interface specifications 10 10 10 10 Hardware Mechanical drawings XBee3 surface-mount (U.FL/RF Pad) XBee3 surface-mount (embedded antenna) XBee3 micro (U.FL/RF Pad) XBee3 micro (chip antenna) Pin signals for the XBee3 surface-mount module Pin signals for the XBee3 micro module Design notes Power supply design Board layout Antenna performance Recommended pin connections Design notes for surface mount PCB antenna and micro footprint chip antenna devices Design notes for RF pad devices 12 12 13 14 15 15 18 21 21 21 22 22 22 24 Regulatory information United States (FCC) OEM labeling requirements FCC notices XBee3™ RF Module Hardware Reference Manual 28 28 28 FCC-approved antennas (2.4 GHz) RF exposure Europe (CE) Maximum power and frequency specifications OEM labeling requirements Declarations of conformity Antennas IC (Industry Canada) Labeling requirements For XBee3: RF Exposure 29 35 35 36 36 37 37 37 37 37 38 Manufacturing information Recommended solder reflow cycle Handling and storage Recommended footprint Flux and cleaning Reworking XBee3™ RF Module Hardware Reference Manual 40 40 41 44 44 XBee3™ RF Module Hardware Reference Manual This manual provides information for the XBee3 RF Module hardware. The XBee3 RF Module can be either the micro or the surface-mount form factor. For more information about the operation and programming functions of the device, see the XBee3® Zigbee® User Guide. XBee3™ RF Module Hardware Reference Manual General XBee3 specifications The following tables provide general specifications for the hardware. General specifications Regulatory conformity summary Serial communication specifications GPIO specifications XBee3™ RF Module Hardware Reference Manual General XBee3 specifications General specifications General specifications The following table describes the general specifications for the devices. Specification XBee3/XBee3-PRO Micro Operating frequency band ISM 2.4 – 2.4835 GHz Form factor Micro Surface-mount Dimensions Micro: 1.36 cm x 1.93 cm x 0.241 cm (0.534 in x 0.760 in x 0.095 in) Surface-mount: 2.199 x 3.4 x 0.368 cm (0.866 x 1.33 x 0.145 in) XBee3/XBee3-PRO surface-mount Operating temperature -40 to 85 °C (industrial) Antenna options RF pad, chip antenna, or U.FL connector RF pad, embedded antenna, or U.FL connector Regulatory conformity summary This table describes the agency approvals for the devices. Approval XBee3 XBee3-PRO United States (FCC Part 15.247) FCC ID: MCQ-XBEE3 FCC ID: MCQ-XBEE3 Industry Canada (IC) IC: 1846A-XBEE3 IC: 1846A-XBEE3 FCC/IC Test Transmit Power Output range -6.8 to +19.9 dBm -6.8 to +19.9 dBm Europe (CE) Yes No RoHS Compliant XBee3™ RF Module Hardware Reference Manual General XBee3 specifications Serial communication specifications Serial communication specifications The XBee3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART). UART pin assignments Specifications Device pin number UART pins XBee3 Micro XBee3 Surface-mount DOUT/DIO13 DIN / CONFIG/DIO14 CTS / DIO7 24 25 RTS/ DIO6 27 29 GPIO specifications XBee3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available. The exact list depends on the device configuration as some GPIO pads are used for purposes such as serial communication. GPIO electrical specification Value Voltage - supply 2.1 - 3.6 V Low switching threshold 0.3 x VCC High switching threshold 0.7 x VCC Input pull-up resistor value 40 kΩ (typical) Input pull-down resistor value 40 kΩ (typical) Output voltage for logic 0 0.2 x VCC (maximum) Output voltage for logic 1 0.8 x VCC (minimum) Output source/sink current 50 mA (maximum) Total output current (for GPIO pads) 200 mA (maximum) XBee3™ RF Module Hardware Reference Manual 802.15.4-specific specifications The following tables provide specifications specific to the XBee3 RF Module when using the 802.15.4 physical layer, for example: Zigbee, DigiMesh, and so forth. Performance specifications Power requirements Networking and security specifications Communication interface specifications XBee3™ RF Module Hardware Reference Manual 10 10 10 10 802.15.4-specific specifications Performance specifications Performance specifications The following table describes the performance specifications for the devices. Specification XBee3 XBee3-PRO Indoor/urban range Up to 60 m (200 ft) Up to 90 m (300 ft) Outdoor RF line-of-sight range Up to 1200 m (4000 ft) Up to 3200 m (2 mi) Transmit power output (maximum) 6.3 mW (+8 dBm) 79 mW (+19 dBm) RF data rate 250,000 b/s Receiver sensitivity -103 dBm Power requirements The following table describes the power requirements for the XBee3 RF Module. Specification XBee3 Adjustable power Yes Supply voltage 2.1 - 3.6 V Operating current (transmit) 40 mA @ +3.3 V, +8 dBm Operating current (receive) 15 mA Power-down current 1.7 µA @ 25° C XBee3-PRO 135 mA @ +3.3 V, +19 dBm Networking and security specifications The following table describes the networking and security specifications for the devices. Specification XBee3/XBee3-PRO Supported network topologies Point-to-point, point-to-multipoint, peer-to-peer, and DigiMesh Number of channels 16 Direct sequence channels Interface immunity Direct Sequence Spread Spectrum (DSSS) Channels 11 to 26 Addressing options PAN ID and addresses, cluster IDs and endpoints (optional) Communication interface specifications The following table provides the device's communication interface specifications. Interface options UART 250 Kb/s maximum XBee3™ RF Module Hardware Reference Manual 10 Hardware Mechanical drawings Pin signals for the XBee3 surface-mount module Pin signals for the XBee3 micro module Design notes XBee3™ RF Module Hardware Reference Manual 12 15 18 21 11 Hardware Mechanical drawings Mechanical drawings The following mechanical drawings of the XBee3 RF Modules show all dimensions in inches. XBee3 surface-mount (U.FL/RF Pad) XBee3™ RF Module Hardware Reference Manual 12 Hardware Mechanical drawings XBee3 surface-mount (embedded antenna) XBee3™ RF Module Hardware Reference Manual 13 Hardware Mechanical drawings XBee3 micro (U.FL/RF Pad) XBee3™ RF Module Hardware Reference Manual 14 Hardware Pin signals for the XBee3 surface-mount module XBee3 micro (chip antenna) Pin signals for the XBee3 surface-mount module The following drawing shows the surface-mount (SMT) pin locations. XBee3™ RF Module Hardware Reference Manual 15 Hardware Pin signals for the XBee3 surface-mount module The following table shows the pin signals and their descriptions for the surface-mount device. Pin# Name Default Direction state Description GND Ground. VCC Power supply. DOUT /DIO13 Both Output UART data out /GPIO. DIN / CONFIG /DIO14 Both Input UART data in /GPIO. DIO12 Both GPIO. RESET Input Device reset. RSSI PWM/DIO10 Both Output PWM1/DIO11 Both Disabled Pulse width modulator/GPIO. [reserved] Disabled Do not connect. XBee3™ RF Module Hardware Reference Manual RX signal strength Indicator /GPIO. 16 Hardware Pin signals for the XBee3 surface-mount module Pin# Name Default Direction state 10 DTR/SLEEP_RQ /DIO8 Both Input Pin sleep control Line/GPIO. 11 GND Ground. 12 SPI_ATTN/ BOOTMODE/DIO19 Output Output 13 GND Ground. 14 SPI_CLK /DIO18 Input Input Serial peripheral interface clock/GPIO. 15 SPI_SSEL/DIO17 Input Input Serial peripheral interface not select/GPIO. 16 SPI_MOSI/DIO16 Input Input Serial peripheral interface data in/GPIO. 17 SPI_MISO/DIO15 Output Output Serial peripheral interface data out/GPIO. 18 [reserved]* Disabled Do not connect. 19 [reserved]* Disabled Do not connect. 20 [reserved]* Disabled Do not connect. 21 [reserved]* Disabled Do not connect. 22 GND 23 [reserved] Disabled Do not connect. 24 DIO4 Both Disabled GPIO. 25 CTS/DIO7 Both Output Clear to send flow control/GPIO. 26 ON/SLEEP/DIO9 Both Output Device status indicator/GPIO XBee3™ RF Module Hardware Reference Manual Description Serial peripheral interface attention . Do not tie low on reset. Ground. 17 Hardware Pin signals for the XBee3 micro module Pin# Name Default Direction state Description 27 [reserved] Do not connect or connect to Disabled Ground. 28 ASSOCIATE/DIO5 Both Output Associate Indicator/GPIO. 29 RTS/DIO6 Both Input Request to send flow control /GPIO. 30 AD3/DIO3 Both Disabled Analog input/GPIO. 31 AD2/DIO2 Both Disabled Analog input/GPIO 32 AD1/DIO1 Both Disabled Analog input/GPIO. 33 AD0 /DIO0 Both Input 34 [reserved] Disabled Do not connect. 35 GND Ground. 36 RF Both RF I/O for RF pad variant. 37 [reserved] Disabled Do not connect. Analog input / GPIO / Commissioning button. Signal direction is specified with respect to the device. This is a complete list of functionalities. See the applicable software manual for available functionalities. See Design notes for details on pin connections. * Refer to Writing custom firmware for instructions on using these pins if JTAG functions are needed. Pin signals for the XBee3 micro module The following drawing shows the micro pin locations. XBee3™ RF Module Hardware Reference Manual 18 Hardware Pin signals for the XBee3 micro module The following table shows the pin signals and their descriptions for the XBee3 Micro device. Pin# Name Default Direction state Description GND Ground. VCC Power supply. DOUT /DIO13 Both Output UART data out /GPIO. DIN / CONFIG /DIO14 Both Input UART data in /GPIO. DIO12 Both GPIO. RESET Input Device reset. RSSI PWM/DIO10 Both Output PWM1/DIO11 Both Disabled Pulse width modulator/GPIO. DTR/SLEEP_RQ /DIO8 Both Input Pin sleep control Line/GPIO. 10 GND Ground. XBee3™ RF Module Hardware Reference Manual RX signal strength Indicator /GPIO. 19 Hardware Pin signals for the XBee3 micro module Pin# Name Default Direction state 11 SPI_ATTN/ BOOTMODE/DIO19 Output Output 12 GND Ground. 13 SPI_CLK /DIO18 Input Input Serial peripheral interface clock/GPIO. 14 SPI_SSEL/DIO17 Input Input Serial peripheral interface not select/GPIO. 15 SPI_MOSI/DIO16 Input Input Serial peripheral interface data in/GPIO. 16 SPI_MISO/DIO15 Output Output Serial peripheral interface data out/GPIO. 17 [reserved]* Disabled Do not connect. 18 [reserved]* Disabled Do not connect. 19 [reserved]* Disabled Do not connect. 20 [reserved]* Disabled Do not connect. 21 GND 22 [reserved] Disabled Do not connect. 23 DIO4 Both Disabled GPIO. 24 CTS/DIO7 Both Output Clear to send flow control/GPIO. 25 ON/SLEEP/DIO9 Both Output Device status indicator/GPIO. 26 ASSOCIATE/DIO5 Both Output Associate Indicator/GPIO. 27 RTS/DIO6 Both Input Request to send flow control /GPIO. XBee3™ RF Module Hardware Reference Manual Description Serial peripheral interface attention Do not tie low on reset. Ground. 20 Hardware Design notes Pin# Name Default Direction state 28 AD3/DIO3 Both Disabled Analog input/GPIO. 29 AD2/DIO2 Both Disabled Analog input/GPIO. 30 AD1/DIO1 Both Disabled Analog input/GPIO. 31 AD0 /DIO0 Both Input Analog input / GPIO / Commissioning button. 32 GND Ground. 33 RF Both RF I/O for RF pad variant. 34 GND Ground. Description Signal direction is specified with respect to the device. This is a complete list of functionalities. See the applicable software manual for available functionalities. See Design notes for details on pin connections. * Refer to Writing custom firmware for instructions on using these pins if JTAG functions are needed. Design notes XBee3 modules do not require any external circuitry or specific connections for proper operation. However, there are some general design guidelines that we recommend to build and troubleshoot a robust design. Power supply design A poor power supply can lead to poor radio performance, especially if you do not keep the supply voltage within tolerance or if it is excessively noisy. To help reduce noise, place a 1.0 µF and 8.2 pF capacitor as near as possible to XBee3 pad 2 (VCC) on the PCB. Adding a 10uF decoupling capacitor is also recommended. If you are using a switching regulator for the power supply, switch the frequencies above 500 kHz. Limit the power supply ripple to a maximum 50 mV peak to peak. For best results, place the lower capacitance capacitors closest to the XBee3 module. Board layout We design XBee3 modules to be self-sufficient and have minimal sensitivity to nearby processors, crystals or other printed circuit board (PCB) components. Keep power and ground traces thicker than signal traces and make sure that they are able to comfortably support the maximum current specifications. There are no other special PCB design considerations to integrate XBee3 modules, with the exception of antennas. XBee3™ RF Module Hardware Reference Manual 21 Hardware Design notes Antenna performance Antenna location is important for optimal performance. The following suggestions help you achieve optimal antenna performance. Point the antenna up vertically (upright). Antennas radiate and receive the best signal perpendicular to the direction they point, so a vertical antenna's omnidirectional radiation pattern is strongest across the horizon. Position the antennas away from metal objects whenever possible. Metal objects between the transmitter and receiver can block the radiation path or reduce the transmission distance. Objects that are often overlooked include: n Metal poles Metal studs Structure beams Concrete, which is usually reinforced with metal rods If you place the device inside a metal enclosure, use an external antenna. Common objects that have metal enclosures include: n Vehicles Elevators Ventilation ducts Refrigerators Microwave ovens Batteries Tall electrolytic capacitors Use the following additional guidelines for optimal antenna performance: n Do not place XBee3 modules with the chip antenna or the embedded antenna inside a metal enclosure. Do not place any ground planes or metal objects above or below the antenna. For the best results, mount the device at the edge of the host PCB. Ensure that the ground, power, and signal planes are vacant immediately below the antenna section. Recommended pin connections The only required pin connections for two-way communication are VCC, GND, DOUT and DIN. To support serial firmware updates, you must connect VCC, GND, DOUT, DIN, RTS, and DTR. For applications that need to ensure the lowest sleep current, never leave unconnected inputs floating. Use internal or external pull-up or pull-down resistors, or set the unused I/O lines to outputs. Design notes for surface mount PCB antenna and micro footprint chip antenna devices Position PCB/chip antenna devices so there are no ground planes or metal objects above or below the antenna. For best results, do not place the device in a metal enclosure, as this may greatly reduce the range. Place the device at the edge of the PCB on which it is mounted. Make sure the ground, power and signal planes are vacant immediately below the antenna section. XBee3™ RF Module Hardware Reference Manual 22 Hardware Design notes The following drawings illustrate important recommendations when you are designing with PCB/chip antenna devices. For optimal performance, do not mount the device on the RF pad footprint described in the next section, because the footprint requires a ground plane within the PCB antenna keep out area. Surface-mount embedded antenna keepout area Notes 1. We recommend non-metal enclosures. For metal enclosures, use an external antenna. 2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the antenna. 3. Maximize the distance between the antenna and metal objects that might be mounted in the keepout area. 4. These keepout area guidelines do not apply for chip antennas or external RF connectors. XBee3™ RF Module Hardware Reference Manual 23 Hardware Design notes XBee3 Micro keepout area Notes 1. We recommend non-metal enclosures. For metal enclosures, use an external antenna. 2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the antenna. 3. Maximize the distance between the antenna and metal objects that might be mounted in the keepout area. 4. These keepout area guidelines do not apply for surface-mount embedded antennas or external RF connectors. Design notes for RF pad devices The RF pad is a soldered antenna connection. The RF signal travels from the RF pad connection (pad 33 on micro modules and pad 36 on surface-mount modules) on the device to the antenna through an RF trace transmission line on the PCB. Any additional components between the device and antenna violates modular certification. The controlled impedance for the RF trace is 50 Ω. We recommend using a microstrip trace, although you can also use a coplanar waveguide if you need more isolation. A microstrip generally requires less area on the PCB than a coplanar waveguide. We do not recommend using a stripline because sending the signal to different PCB layers can introduce matching and performance problems. Following good design practices is essential when implementing the RF trace on a PCB. Consider the following points: n Minimize the length of the trace by placing the RPSMA jack close to the device. Connect all of the grounds on the jack and the device to the ground planes directly or through closely placed vias. XBee3™ RF Module Hardware Reference Manual 24 Hardware Design notes Space any ground fill on the top layer at least twice the distance d, for Micro modules at least 0.028" and for surface mount modules at least 0.050". Additional considerations: n The top two layers of the PCB have a controlled thickness dielectric material in between. The second layer has a ground plane which runs underneath the entire RF pad area. This ground plane is a distance d, the thickness of the dielectric, below the top layer. The RF trace width determines the impedance of the transmission line with relation to the ground plane. Many online tools can estimate this value, although you should consult the PCB manufacturer for the exact width. Implementing these design suggestions helps ensure that the RF pad device performs to its specifications. The following figures show a layout example of a host PCB that connects an RF pad device to a right angle, through-hole RPSMA jack. Number Description Maintain a distance of at least 2 d between microstrip and ground fill. XBee3™ RF Module Hardware Reference Manual 25 Hardware Design notes Number Description RF pad pin. 50 Ω microstrip trace. RF connection of RPSMA jack. This example is on a surface-mount device. The width in this example is approximately 0.045" for a 50 Ω trace, assuming d=0.025”, and that the dielectric has a relative permittivity of 4.4. This trace width is a good fit with the device footprint's 0.060" pad width. Note We do not recommend using a trace wider than the pad width, and using a very narrow trace (under 0.010") can cause unwanted RF loss. The following illustration shows PCB layer 2 of an example RF layout. Number Description Use multiple vias to help eliminate ground variations. Put a solid ground plane under RF trace to achieve the desired impedance. XBee3™ RF Module Hardware Reference Manual 26 Regulatory information United States (FCC) Europe (CE) IC (Industry Canada) XBee3™ RF Module Hardware Reference Manual 28 35 37 27 Regulatory information United States (FCC) United States (FCC) XBee3 RF Modules comply with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the OEM must comply with the following regulations: 1. The system integrator must ensure that the text on the external label provided with this device is placed on the outside of the final product. 2. RF Modules may only be used with antennas that have been tested and approved for use with the modules. OEM labeling requirements WARNING! As an Original Equipment Manufacturer (OEM) you must ensure that FCC labeling requirements are met. You must include a clearly visible label on the outside of the final product enclosure that displays the following content: Required FCC Label for OEM products containing the XBee3 RF Module Contains FCC ID: MCQ-XBEE3 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1.) this device may not cause harmful interference and (2.) this device must accept any interference received, including interference that may cause undesired operation. FCC notices IMPORTANT: XBee3 RF Modules have been certified by the FCC for use with other products without any further certification (as per FCC section 2.1091). Modifications not expressly approved by Digi could void the user's authority to operate the equipment. IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section 15.107 & 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules. IMPORTANT: The RF module has been certified for remote and base radio applications. If the module will be used for portable applications, the device must undergo SAR testing. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Re-orient or relocate the receiving antenna, Increase the separation between the equipment and receiver, Connect equipment and receiver to outlets on different circuits, or Consult the dealer or an experienced radio/TV technician for help. XBee3™ RF Module Hardware Reference Manual 28 Regulatory information United States (FCC) FCC-approved antennas (2.4 GHz) The XBee3 RF Module can be installed using antennas and cables constructed with non-standard connectors (RPSMA, RPTNC, etc.) An adapter cable may be necessary to attach the XBee connector to the antenna connector. The modules are FCC approved for fixed base station and mobile applications for the channels indicated in the tables below. If the antenna is mounted at least 20 cm (7.87 in) from nearby persons, the application is considered a mobile application. Antennas not listed in the table must be tested to comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions). The antennas in the tables below have been approved for use with this module. Cable loss is required when using gain antennas as shown in the tables. Digi does not carry all of these antenna variants. Contact Digi Sales for available antennas. XBee3™ RF Module Hardware Reference Manual 29 The following table shows the antennas approved for use with the XBee3 RF module. All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. Required antenna cable loss (dB) Part number Type (description) Gain (dBi) Application* Min. separation 802.15.4 Based Protocols (Ex: ZigBee) BLE (when available) Regulatory information XBee3™ RF Module Hardware Reference Manual XBee3 RF module Integral antennas 29000313 Integral PCB antenna (surface-mount only) 0.0 Fixed/Mobile 20 cm N/A N/A 29000710 Chip antenna (micro only) 0.0 Fixed/Mobile 20 cm N/A N/A Dipole antennas A24-HASM450 Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed 20 cm N/A N/A A24-HABSM* Dipole (Articulated RPSMA) 2.1 Fixed 20 cm N/A N/A 29000095 Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed/Mobile 20 cm N/A N/A A24-HABUFP5I Dipole (Half-wave articulated bulkhead mount 2.1 U.FL. w/ 5” pigtail) Fixed/Mobile 20 cm N/A N/A A24-HASM525 Dipole (Half-wave articulated RPSMA - 5.25") 2.1 Fixed 20 cm N/A N/A Omni-directional antennas Omni-directional (Fiberglass base station) 2.1 Fixed/Mobile 20 cm N/A N/A A24-F3NF Omni-directional (Fiberglass base station) 3.0 Fixed/Mobile 20 cm N/A N/A A24-F5NF Omni-directional (Fiberglass base station) 5.0 Fixed 20 cm N/A N/A A24-F8NF Omni-directional (Fiberglass base station) 8.0 Fixed 2m N/A N/A 30 United States (FCC) A24-F2NF Part number Type (description) Gain (dBi) Application* Min. separation 802.15.4 Based Protocols (Ex: ZigBee) BLE (when available) A24-F9NF Omni-directional (Fiberglass base station) 9.5 Fixed 2m N/A N/A A24-F10NF Omni-directional (Fiberglass base station) 10.0 Fixed 2m N/A N/A A24-F12NF Omni-directional (Fiberglass base station) 12.0 Fixed 2m N/A N/A A24-W7NF Omni-directional (Fiberglass base station) 7.2 Fixed 2m N/A N/A A24-M7NF Omni-directional (Mag-mount base station) 7.2 Fixed 2m N/A N/A A24-F15NF Omni-directional (Fiberglass base station) 15.0 Fixed 2m N/A N/A Regulatory information XBee3™ RF Module Hardware Reference Manual Required antenna cable loss (dB) Panel antennas A24-P8SF Flat Panel 8.5 Fixed 2m N/A N/A A24-P8NF Flat Panel 8.5 Fixed 2m N/A N/A A24-P13NF Flat Panel 13.0 Fixed 2m N/A N/A A24-P14NF Flat Panel 14.0 Fixed 2m N/A N/A A24-P15NF Flat Panel 15.0 Fixed 2m N/A N/A A24-P16NF Flat Panel 16.0 Fixed 2m N/A N/A A24-P19NF Flat Panel 19.0 Fixed 2m N/A N/A A24-Y6NF Yagi (6-element) 8.8 Fixed 2m N/A N/A A24-Y7NF Yagi (7-element) 9.0 Fixed 2m N/A N/A A24-Y9NF Yagi (9-element) 10.0 Fixed 2m N/A N/A A24-Y10NF Yagi (10-element) 11.0 Fixed 2m N/A N/A Yagi antennas United States (FCC) 31 Part number Type (description) Gain (dBi) Application* Min. separation 802.15.4 Based Protocols (Ex: ZigBee) BLE (when available) A24-Y12NF Yagi (12-element) 12.0 Fixed 2m N/A N/A A24-Y13NF Yagi (13-element) 12.0 Fixed 2m N/A N/A A24-Y15NF Yagi (15-element) 12.5 Fixed 2m N/A N/A A24-Y16NF Yagi (16-element) 13.5 Fixed 2m N/A N/A A24-Y16RM Yagi (16-element, RPSMA connector) 13.5 Fixed 2m N/A N/A A24-Y18NF Yagi (18-element) 15.0 Fixed 2m N/A N/A Regulatory information XBee3™ RF Module Hardware Reference Manual Required antenna cable loss (dB) United States (FCC) 32 The following table shows the antennas approved for use with the XBee3-PRO RF Module. All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. Required antenna cable loss (dB) Part number Type (description) Gain (dBi) Min 802.15.4 Based Protocols Application* separation (Ex: ZigBee) BLE (when available) Regulatory information XBee3™ RF Module Hardware Reference Manual XBee3-PRO RF module Internal antennas 29000313 Integral PCB antenna (surface mount only) 0.0 Fixed/Mobile 20 cm N/A N/A 29000710 Chip antenna (micro only) 0.0 Fixed/Mobile 20 cm N/A N/A Dipole antennas A24-HASM450 Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed 20 cm N/A N/A A24-HABSM* Dipole (Articulated RPSMA) 2.1 Fixed 20 cm N/A N/A 29000095 Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed/Mobile 20 cm N/A N/A A24-HABUFP5I Dipole (Half-wave articulated bulkhead mount U.FL. w/ 5” pigtail) 2.1 Fixed/Mobile 20 cm N/A N/A A24-HASM525 Dipole (Half-wave articulated RPSMA - 5.25") 2.1 Fixed 20 cm N/A N/A Omni-directional antennas Omni-directional (Fiberglass base station) 2.1 Fixed/Mobile 20 cm N/A N/A A24-F3NF Omni-directional (Fiberglass base station) 3.0 Fixed/Mobile 20 cm N/A N/A A24-F5NF Omni-directional (Fiberglass base station) 5.0 Fixed 20 cm N/A N/A A24-F8NF Omni-directional (Fiberglass base station) 8.0 Fixed 2m N/A N/A 33 United States (FCC) A24-F2NF Part number Type (description) Gain (dBi) Min 802.15.4 Based Protocols Application* separation (Ex: ZigBee) BLE (when available) A24-F9NF Omni-directional (Fiberglass base station) 9.5 Fixed 2m N/A N/A A24-F10NF Omni-directional (Fiberglass base station) 10 Fixed 2m N/A N/A A24-F12NF Omni-directional (Fiberglass base station) 12 Fixed 2m N/A N/A A24-W7NF Omni-directional (Fiberglass base station) 7.2 Fixed 2m N/A N/A A24-M7NF Omni-directional (Mag-mount base station) 7.2 Fixed 2m N/A N/A A24-F15NF Omni-directional (Fiberglass base station) 15.0 Fixed 2m N/A 2.0 Regulatory information XBee3™ RF Module Hardware Reference Manual Required antenna cable loss (dB) Panel antennas A24-P8SF Flat Panel 8.5 Fixed 2m N/A N/A A24-P8NF Flat Panel 8.5 Fixed 2m N/A N/A A24-P13NF Flat Panel 13.0 Fixed 2m N/A N/A A24-P14NF Flat Panel 14.0 Fixed 2m N/A 1.0 A24-P15NF Flat Panel 15.0 Fixed 2m N/A 2.0 A24-P16NF Flat Panel 16.0 Fixed 2m N/A 3.0 A24-P19NF Flat Panel 19.0 Fixed 2m 3.0 6.0 A24-Y6NF Yagi (6-element) 8.8 Fixed 2m N/A N/A A24-Y7NF Yagi (7-element) 9.0 Fixed 2m N/A N/A A24-Y9NF Yagi (9-element) 10.0 Fixed 2m N/A N/A A24-Y10NF Yagi (10-element) 11.0 Fixed 2m N/A N/A Yagi antennas United States (FCC) 34 Part number Type (description) Gain (dBi) Min 802.15.4 Based Protocols Application* separation (Ex: ZigBee) BLE (when available) A24-Y12NF Yagi (12-element) 12.0 Fixed 2m N/A N/A A24-Y13NF Yagi (13-element) 12.0 Fixed 2m N/A N/A A24-Y15NF Yagi (15-element) 12.5 Fixed 2m N/A N/A A24-Y16NF Yagi (16-element) 13.5 Fixed 2m N/A 0.5 A24-Y16RM Yagi (16-element, RPSMA connector) 13.5 Fixed 2m N/A 0.5 A24-Y18NF Yagi (18-element) 15.0 Fixed 2m N/A 2.0 Regulatory information XBee3™ RF Module Hardware Reference Manual Required antenna cable loss (dB) RF exposure If you are an integrating the XBee3 into another product, you must include the following Caution statement in OEM product manuals to alert users of FCC RF exposure compliance: CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during device operation. To ensure compliance, operations at closer than this distance are not recommended. The antenna used for this transmitter must not be co-located in conjunction with any other antenna or transmitter. Europe (CE) The XBee3 RF Module has been tested for use in several European countries. For a complete list, refer to www.digi.com/resources/certifications. If XBee3 RF Modules are incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the Radio Equipment Directive. A Declaration of Conformity must be issued for each of these standards and kept on file as described in the Radio Equipment Directive. Furthermore, the manufacturer must maintain a copy of the XBee3 RF Module user guide documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user guide. Europe (CE) 35 For the XBee3 device: When using 802.15.4 RF physical layer: n Maximum power: 8.61mW (9.35 dBm) Equivalent Isotropically Radiated Power (EIRP). Frequencies: 5 MHz channel spacing, beginning at 2405 MHz and ending at 2480 MHz. When using BLE RF physical layer: n Maximum power: 9.02mW (9.55 dBm) Equivalent Isotropically Radiated Power (EIRP). Regulatory information XBee3™ RF Module Hardware Reference Manual Maximum power and frequency specifications Frequencies: 2 MHz channel spacing, beginning at 2402 MHz and ending at 2480 MHz. OEM labeling requirements The “CE” marking must be affixed to a visible location on the OEM product. The following figure shows CE labeling requirements. 36 Europe (CE) The CE mark shall consist of the initials “CE” taking the following form: If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be respected. The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly. Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio regulatory agency in the desired countries of operation for more information. Declarations of conformity Regulatory information XBee3™ RF Module Hardware Reference Manual Digi has issued Declarations of Conformity for the XBee3 RF Modules concerning emissions, EMC, and safety. For more information, see www.digi.com/resources/certifications. Antennas The following antennas have been tested and approved for use with the XBee3 RF Module: All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. n Dipole (2.1 dBi, Omni-directional, Articulated RPSMA, Digi part number A24-HABSM) PCB antenna (surface mount boards only) (0.0 dBi) Chip antenna (micro form factor only) (0.0 dBi) IC (Industry Canada) Labeling requirements Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label on the outside of the final product enclosure must display the following text. Contains Model XBEE3, IC: 1846A-XBEE3 The integrator is responsible for its product to comply with IC ICES-003 & FCC Part 15, Sub. B -Unintentional Radiators. ICES-003 is the same as FCC Part 15 Sub. B and Industry Canada accepts FCC test report or CISPR 22 test report for compliance with ICES-003. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 37 IC (Industry Canada) For XBee3: RF Exposure CAUTION! This equipment is approved for mobile and base station transmitting devices only. Antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Regulatory information XBee3™ RF Module Hardware Reference Manual Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. ATTENTION! Cet équipement est approuvé pour la mobile et la station base dispositifs d'émission seulement. Antenne(s) utilisé pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm à partir de toutes les personnes et ne doit pas être situé ou fonctionner en conjonction avec tout autre antenne ou émetteur. Transmitters with Detachable Antennas This radio transmitter (IC: 1846A-XBEE3) has been approved by Industry Canada to operate with the antenna types listed in FCC-approved antennas (2.4 GHz) with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le présent émetteur radio (IC: 1846A-XBEE3) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Detachable Antenna Under Industry Canada regulations, this radio transmitter may operate using only an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than that necessary for successful communication. 38 IC (Industry Canada) Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peutfonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvépour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne etson gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépassepas l'intensité nécessaire àl'établissement d'une communication satisfaisante. Manufacturing information Manufacturing information The XBee3 RF Module (both surface-mount and micro) is designed for surface-mounting on the OEM PCB. It has castellated pads to allow for easy solder attaching and inspection. The pads are all located on the edge of the device so there are no hidden solder joints on these devices. Recommended solder reflow cycle Handling and storage Recommended footprint Flux and cleaning Reworking XBee3™ RF Module Hardware Reference Manual 40 40 41 44 44 39 Manufacturing information Recommended solder reflow cycle Recommended solder reflow cycle The following diagram shows the recommended solder reflow cycle. The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the device while the solder is molten, as parts inside the device can be removed from their required locations. Hand soldering is possible and should be done in accordance with approved standards. Handling and storage The XBee3 RF Modules are level 3 Moisture Sensitive Devices. When using this kind of device, consider the relative requirements in accordance with standard IPC/JEDEC J-STD-020. In addition, note the following conditions: a. Calculated shelf life in sealed bag: 12 months at <40 °C and <90% relative humidity (RH). b. Environmental condition during the production: 30 °C /60% RH according to IPC/JEDEC J-STD 033C, paragraphs 5 through 7. c. The time between the opening of the sealed bag and the start of the reflow process cannot exceed 168 hours if condition b) is met. d. Baking is required if conditions b) or c) are not met. e. Baking is required if the humidity indicator inside the bag indicates a RH of 10% more. f. If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at 125 °C. XBee3™ RF Module Hardware Reference Manual 40 Manufacturing information Recommended footprint Recommended footprint We recommend that you use the following PCB footprints for surface-mounting. The dimensions without brackets are in inches, and those in brackets are in millimeters. XBee3 surface-mount recommended footprint XBee3™ RF Module Hardware Reference Manual 41 Manufacturing information Recommended footprint XBee3 Micro recommended footprint Match the solder footprint to the copper pads, but may need to be adjusted depending on the specific needs of assembly and product standards. Recommended stencil thickness is 0.15 mm/0.005”. Place the component last and set the placement speed to the slowest setting. While the underside of the device is mostly coated with solder resist, we recommended the copper layer directly below the device be left open to avoid unintended contacts. Copper or vias must not interfere with the three exposed RF test points on the bottom of the device as shown in the following diagrams. These devices have a ground plane in the middle on the back side for shielding purposes, which can be affected by copper traces directly below the device. XBee3™ RF Module Hardware Reference Manual 42 Manufacturing information Recommended footprint Copper keepout for the XBee3 surface-mount XBee3™ RF Module Hardware Reference Manual 43 Manufacturing information Flux and cleaning Copper keepout for the XBee3 Micro Flux and cleaning Digi recommends that a “no clean” solder paste be used in assembling these devices. This eliminates the clean step and ensures unwanted residual flux is not left under the device where it is difficult to remove. In addition the following issues can occur: n Cleaning with liquids can result in liquid remaining under the shield or in the gap between the device and the OEM PCB. This can lead to unintended connections between pads on the device. The residual moisture and flux residue under the device are not easily seen during an inspection process. Factory recommended best practice is to use a “no clean” solder paste to avoid these issues and ensure proper device operation. Reworking Never perform rework on the device itself. The device has been optimized to give the best possible performance, and reworking the device itself will void warranty coverage and certifications. We recognize that some customers choose to rework and void the warranty. The following information serves as a guideline in such cases to increase the chances of success during rework, though the warranty is still voided. The device may be removed from the OEM PCB by the use of a hot air rework station, or hot plate. Be careful not to overheat the device. During rework, the device temperature may rise above its internal XBee3™ RF Module Hardware Reference Manual 44 Manufacturing information Reworking solder melting point and care should be taken not to dislodge internal components from their intended positions. XBee3™ RF Module Hardware Reference Manual 45
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