HARRIS TR-0017-E Sitepro Base Station User Manual RX Synth
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Maintenance Manual LBI-38641F VHF RECEIVER SYNTHESIZER MODULE 19D902781G1 & G2 TABLE OF CONTENTS Page DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Front Cover GENERAL SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CIRCUIT ANALYSIS . . . . . . . . . . . . . . . VOLTAGE CONTROLLED OSCILLATOR . BUFFER AMPLIFIERS . . . . . . . . . . . . REFERENCE OSCILLATOR AND BUFFER PRESCALER AND SYNTHESIZER . . . . . LOOP FILTER . . . . . . . . . . . . . . . . . DIGITAL CONTROL . . . . . . . . . . . . . VOLTAGE REGULATORS . . . . . . . . . . MAINTENANCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TEST AND ALIGNMENT PROCEDURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ASSEMBLY DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OUTLINE DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCHEMATIC DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 PRODUCTION CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 IC DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 DESCRIPTION The Receiver Synthesizer Module provides the local oscillator signal (LO) to the Receiver Front End Module of the MASTR III base station. The module also provides the reference oscillator signal to the transmitter synthesizer. Receiver Synthesizer Module 19D902781G1 (Group 1) generates an output injection signal in the 157 to 172 MHz range, and 19D902781G2 (Group 2) generates a signal in the 129 to 152 MHz Range. The Receiver Synthesizer Module is a phase-locked loop (PLL) design, as shown in the block diagram (Figure 1). Its output is generated directly by the VCO Q1 and buffered by Monolithic Microwave Integrated Circuits (MMIC) U1 and U3. The logic signals from controller (U10, 12, and 13) determine the synthesizer frequency. Frequency stability is maintained by either using the internal reference oscil- lator Y1 or by applying a high precision reference signal to the EXT Reference Oscillator Port J4. The internal reference oscillator is a temperature controlled crystal oscillator (TCXO) operating at 12.8 MHz. The oscillator has a stability of ±1.5 ppm over the temperature range of -30°C to +75°C. See the table containing General Specifications for the minimum external oscillator specifications. The buffered VCO output is sampled by the resistive splitter and conditioned by buffer amplifier U2. It is then fed to the divide by 64/65 dual modulus prescaler U5. The divided output from the prescaler is connected to the Fin input of the PLL U6. Within the PLL the divided VCO input signal Fin is divided again. The PLL also divides down the 12.8 MHz reference signal. Three inputs from the controller; ENABLE, CLOCK, and serial DATA program the PLL divider circuits. M/A-COM Wireless Systems 3315 Old Forest Road Lynchburg, Virginia 24501 (Outside USA, 434-385-2400) Toll Free 800-528-7711 www.macom-wireless.com Printed in U.S.A. LBI-38641F The divided reference signal and the divided VCO signal are compared in the PLL phase detector. When the reference and VCO signals are identical the PLL phase detector generates a constant DC output voltage. This voltage is buffered by U8 and filtered by the loop filter circuit. It is then applied to Q1 setting the VCO on frequency. If the compared frequencies (phases) differ, an error voltage is generated which adjusts the VCO frequency. During this out-of-lock condition, the PLL also sends a Lock Detect signal (LD) to the controller and lights the FAULT LED on the front panel of the module. TABLE 1 - GENERAL SPECIFICATIONS ITEM FREQUENCY TUNING Output Injection Signal Electrical Full Specifications Degraded Specifications Channel Spacing SPECIFICATION INJECTION FREQ. 157.4 MHz - 172.2 MHz (G1) 129.4 MHz - 152.6 MHz (G2) 2 MHz 3 MHz 5 kHz FREQUENCY STABILITY ±1.5 ppm LO POWER OUTPUT 1.5 dBm ±1.5 dBm LO NOMINAL IMPEDANCE 50 Ohms PHASE NOISE @ 25 kHz Offset @ 30 kHz Offset -142 dBc/Hz -147 dBc/Hz HUM AND NOISE Companion Receiver Figure 1 - Receiver Synthesizer Block Diagram <-30 dBc SWITCHING SPEED < 50 ms CURRENT DRAIN +13.8V +12V <200 mA <50 mA EXT. REFERENCE OSCILLATOR Frequency Output Power Output Impedance CIRCUIT ANALYSIS resonant tank circuit. The circuit’s use of high-Q components minimizes phase noise. The Receiver Synthesizer Module consists of the following circuits: Frequency tuning of the VCO is done by changing the DC output voltage level from the loop filter U14. The Loop Filter Out signal from U14 is routed through L4 and R3 and applied to the two varicap diodes D4 and D5. The voltage level applied determines the diodes’ capacitance and sets the resonant frequency of the oscillator. If the VCO drifts or the frequency is changed, the DC voltage level changes causing the VCO’s resonant frequency to change. The output of the oscillator is then applied to a buffer amplifier. Course adjustment of frequency is done by adjusting trimmer capacitor C52 while applying a calibration voltage to the V_TUNE line connected to U14.4-11. -60 dB HARMONICS @ LO PORT REFERENCE OSCILLATOR Frequency Output Power Output Impedance FREQ. BAND 136 MHz - 150.8 MHz 150.8 MHz - 174 MHz 12.8 MHz ±1.5 ppm 0 dBm ±1.5 dBm 50 ohms 5.00 MHz to 17.925 MHz (must be divisible by the channel spacing) 10 dBm ±3 dBm into 50 ohms 50 ohms • • • • • • • Voltage Controlled Oscillator Buffer Amplifiers Reference Oscillator and Buffer Prescaler and Synthesizer Loop Filter Digital Control Voltage Regulators VOLTAGE CONTROLLED OSCILLATOR The free running Voltage Controlled Oscillator (VCO) is composed of a grounded-gate JFET (Q1) and associated circuitry. Inductor L10 and associated capacitors form the BUFFER AMPLIFIERS The MMIC Buffer Amplifier stage is composed of three MMICs (U1, U2, and U3) and a resistive splitter. The amplifiers serve two purposes; amplifying the local oscillator signal (LO OUTPUT) for injection into the Receiver Front End assembly and providing a feedback signal to the synthesizer Phase-Locked Loop (PLL). Copyright© 1992-2002, M/A-COM Private Radio Systems, Inc. All rights reserved. LBI-38641F Integrated circuits U1 and U3 provide amplification of the local oscillator signal. The output of U1 is fed to a resistive signal splitter composed of R13 through R18. One of the resistive signal splitter outputs drives amplifier U3. The U3 output signal is coupled by C17 to a low-pass filter network (C24 and C25, L6, L8, and L9) and a resistive pad (R25, R26 and R30) for isolation. The local oscillator signal is finally routed to J2, LO OUT, for connection to the Receiver Front End Assembly. The LO output level at BNC connector J2 is nominally 0 dBm. The other output of the resistive signal splitter drives U2. The amplified output from U2, PRESCALER BUFFER OUT, is coupled to the 50 ohm input of the prescaler U5 via capacitors C16 and C45. REFERENCE OSCILLATOR AND BUFFER The reference oscillator section provides a reference signal to the PLL section. The circuit design allows using either an external or internal oscillator. When using an external oscillator, the internal oscillator is disabled by placing a logic low on the INT OSC line from the T/R Shelf Interface Board. A high precision external oscillator may then be connected to the module through the external reference oscillator connector J4, EXT REF IN. J4 has a 50 ohm input impedance and is coupled to the base of Q12. Buffer Q12 conditions the signal and applies it to the synthesizer U6 via coupling capacitor C10. The internal reference oscillator, Y1, provides a 12.8 MHz signal with a stability of ±1.5 ppm. It is enabled by applying a logic high signal on the INT OSC line. This signal turns on Q2, allowing it to conduct and apply +5 volts to pin 1 of the oscillator Y1. The 12.8 MHz output signal (Y1 pin 2) is then sent to the synthesizer via coupling capacitor C9. The reference oscillator signal, either external or internal, is also routed to Q13 via coupling capacitor C54. The output taken from the emitter of Q13 is applied through C11 to the input of Buffer Amplifier U4. The buffered signal is coupled through C12 to a low pass filter network (C32,C33,C34, and L7) and a resistive pad (R27, R28, and R31) for isolation. The output from the resistive pad is then connected to J3, REF OUT, making the reference oscillator signal available for external use. PRESCALER AND SYNTHESIZER IC The integrated circuit U6 is the heart of the synthesizer. It contains the necessary frequency dividers and control circuitry to synthesize output frequencies by the technique of dual modulus prescaling. U6 also contains an analog sample and hold phase detector and a lock detector circuit. Within the U6 are three programmable dividers which are serially loaded using the CLOCK, DATA, and ENABLE inputs (pins 11, 12, and 13 respectively). A serial data stream (DATA) on pin 12 is shifted into the internal shift registers by low to high transitions on the clock input (CLOCK) at pin 11. A logic high (ENABLE) on pin 13 then transfers the program information from the shift registers to the divider latches. The serial data determines the VCO frequency by setting the internal R, A, and N dividers. The 12.8 MHz reference oscillator signal OSCIN is internally routed to the "R" divider. The "R" divider divides down the 12.8 MHz reference signal to a lower frequency, Fr, as directed by the input data and applies the signal to the internal analog phase and lock detectors. The "A" and "N" dividers process the loop feedback signal from the VCO (by way of the dual modulus prescaler U5). The output of the "N" divider, Fv, is a divided down version of the VCO output frequency. This signal is also applied to the internal phase detector. The ramp and hold constants are determined by C26, R37, C31, and R36. The analog phase detector output voltage (PD OUT) is proportional to the phase difference between Fv and Fr. This output serves as the loop error signal. When operating on the correct frequency, the inputs to the phase detector are identical and the output voltage of the analog phase detector is constant. If the compared frequencies (phases) differ, the analog phase detector increases or decreases the DC output voltage (PD OUT). This error signal voltage tunes the VCO to whatever frequency is required to keep Fv and Fr locked (in phase). The lock detector furnishes the Fault circuit in U13 with the lock detect (LD) signal. When Fv and Fr are in phase, the lock detector output sends a logic high on the LD line to the fault circuit U13. If the VCO is not locked onto the correct frequency, the resulting out-of-phase condition causes the output from the lock detector to be a logic low. LOOP FILTER The error signal, ANOUT, is applied to the loop filter at U8.2-5 and U8.1-3. U8.2 acts as a buffer amplifier with gain. The output signal from the amplifier is applied to a loop filter consisting of R42, R43, R44, C35 and C36 via the bilateral switch U14. The filter removes noise and sampling frequencies from the error voltage. The switch, U14, selects the proper filter configuration for operation in the narrow band, w i d e b a n d o r tu n i n g m o d e . T h e c o n t r o l si g n a ls (OPEN_LOOP, ENABLE_NOT, and TUNE_CTRL) for U14 are derived from the digital control circuits U10, U12, and U13. U8.1 provides a buffered output for testing at the DIN connector on the rear of the module. DIGITAL CONTROL The discrete +8V OSC regulator circuit is a linear regulator consisting of U9A, Q7, Q8, and associated circuitry. The error amplifier U9A controls Q7 and pass element Q8. The +8V OSC is used as the power source for the VCO circuit, where additional filtering is provided to keep noise to a minimum MAINTENANCE Logic control circuits (other than those inside the synthesizer IC - U6) consist of the following: • • • RECOMMENDED TEST EQUIPMENT Digital Control Circuit (U10, U12, & U13) Level Shifters Fault Circuit The Digital Control Circuits U10, U12, & U13 serve as an interface between the controller and the synthesizer IC. As an address decoder, U10 enables the input gates when the A0, A1, and A2 input lines (pins 4, 3, and 2) receive the correct address code from the controller. For the Receiver synthesizer the enable address is 010 on A0, A1, and A2 respectively. After receiving the proper logic code, the input gate U12 is enabled. This allows the ENABLE, CLOCK, and serial DATA information to pass on to the synthesizer via the level shifters. The Level Shifters Q3, Q4, and Q5 convert the five (5) volt logic level to the eight (8) volt logic level required by the synthesizer. The Fault circuit, U13, monitors the lock detect signal from the PLL synthesizer. Under normal (locked) condition, the PLL sends a logic high signal to U13. U13 processes the signal and providing a logic high output which saturates Q6. With Q6 saturated, the FAULT LED (CR1) turns off. U13 also sends a logic high signal, FLAG 2, (U13.3-8) to the controller indicating the VCO’s frequency is correct. When the VCO is not on the correct frequency, the synthesizer sends a logic low signal to U13. This causes U13 to cutoff Q6 which turns on the FAULT LED. U13 also sends a logic low signal to the controller indicating the VCO’s frequency is incorrect. VOLTAGE REGULATORS Voltage regulators U15 and U16 reduce the +13.8 VF line to +5 Vdc and +8 Vdc respectively. The output from U15 (+5V_SYN) is used by both the synthesizer and logic circuitry while the 8 Vdc output from U16 is used for the op-amps, level shifters, and the discrete +8V OSC regulator circuit. The following test equipment is required to test the Synthesizer Module: 1. Modulation Analyzer; HP 8901A, or equivalent 2. Power Supply; 12.0 Vdc @ 500 mA 3. Frequency Counter; 10 MHz - 250 MHz 4. Power Meter; -20 dBm to +10 dBm 5. Spectrum Analyzer; 0 - 1 GHz TEST AND ALIGNMENT Initialization Apply +12 Vdc to the test fixture. Current consumption Measure the current through pins 15A,15B, 15C, 16A, 16B, and 16C. Verify the current is less than 250 mA. Total current is the +13.8 VF current and +12 Vdc current combined. Reference Oscillator Adjust Y1 for an output frequency of 12.8 MHz ±5 Hz. Measure the output power of the reference oscillator output (J3). Verify the output power is 0 dBm ±1.5 dBm. Oscillator Alignment Ground the ENABLE TEST line (pin 22A). Apply +5 Vdc to the V_TUNE line (pin 26A). Measure the frequency of the free running oscillator at the LO OUT port (J2). LBI-38641F Synthesizer Loading SERVICE NOTES The following service information applies when aligning, testing, or troubleshooting the RX Synthesizer: • Unground the ENABLE TEST line (pin 22A). Load the synthesizer IC Group 1 - 170 MHz. Group 2 - 150 MHz. Logic Levels: Logic 1 = high Logic 0 = Low • • TROUBLESHOOTING CHART SYMPTOM I. Loop Fails To Lock Verify the lock indicator (CR1) is off or the FLAG 2 line is high. 4.5 to 5.5 Vdc 0 to 0.5 Vdc Receiver Synthesizer Address = A0 A1 A2 = 010 Synthesizer data input stream is as follows: 14-bit "R" divider most significant bit (MSB) = R13 through "R" divider least significant bit (LSB) = R0 Hum and Noise Initialize the HP 8901A for 300 Hz - 3 kHz, 750 us deemphasis, average FM deviation, and 0.44 dB reference for the deviation. Verify the hum and noise (J2) is less than -55 dB. 10-bit "N" divider MSB = N9 through "N" divider LSB = N0 Output Power and Harmonic Content 7-bit "A" divider MSB = A6 through "A" divider LSB = A0 is: Single high Control bit (last bit) Verify the output power (J2) at the fundamental frequency 0 dBm ±2.0 dB AREAS TO CHECK INDICATIONS 1. Check for: +8 Vdc at U16-3, +5 Vdc at U15-3 +8 Vdc at Q8-C. B ad Regu lation circuitry. Tro ub leshoot using standard procedures. 2. Check for 12.8 MHz reference at U6-2, and U6-3. Typical Levels: 500 mVpp @ U6-2 2.5 Vpp @ U6-3 Reference Osc. Module defective or supply not present or low. Proceed to reference oscillator section II. 3. Check for LO output @ J2. FLO ±5 MHz,0dBm nominal. LO tuning incorrect, or buffer amplifier bad. Proceed to LO tuning and power section III. 4. Check Prescaler output @ U5-4. Typically: 2-4 MHz square wave @ 1.25 Vpp. If LO power is good, Check for 3.2 Vdc @ U2-3. Replace U2, then U5 if necessary. 5. Check for CLOCK, DATA, and ENABLE signals are reaching U6 pins 11,12, and 13 respectively. (0, 8V logic levels) B ad digital control circuitry. Tro ub leshoot using standard procedures. Ensure all programming sig nals are present at J1. (CLOCK,DATA,ENABLE,A0,A1 and A2) 6. Check Ramp Signal @ U6-15. It should be 5 kHz nominal. I f r ef er ence oscillator and programming signals are present for proper programming information. Last resort - replace Synthesizer IC U6. 1. Check for 4.3 Vdc supply at junction of R5 and C41. Bad supply switch Q2 or wrong C on tro l Signal Internal Osc. Tro ub leshoot using standard procedures. Replace Y1 as last resort 2. Check 12.8 MHz signal @ Q13-E. Should be approx. 350 mVpp. B ad b uf fe r am plifier Q13. Tro ub leshoot using standard procedures. Latched When Control Bit = 1 Verify the harmonic content is less than -30dBc. DATA ENTRY FORMAT Latched When Control Bit = 1 Data→ Last bit A0 --LSB A6 N0 --MSB LSB N9 R0 --MSB LSB R13 MSB Shift →Register Out Control Bit • • Synthesizer lock is indicated by the extinguishing of the front panel LED indicator and a logic high on the fault FLAG 2 line (J1 pin 12C). Always verify synthesizer lock after each new data loading. Adjust the trimmer capacitor C52 to the correct frequency: II. Reference OSC. not present or low power. Group 1 - 170 MHz ±100 kHz. Group 2 - 150 MHz ±100 kHz. Continued LBI-38641F ASSEMBLY DIAGRAM TROUBLESHOOTING CHART (Continued) SYMPTOM III. LO power low or tuned out of band. IV. LO signal not present. (i.e. Q1 does not oscillate) AREAS TO CHECK INDICATIONS 1. Check tuning with 6 Vdc applied using test procedure. FLO±5 MHz LO tuning incorrect. Retune following test procedure. 2. Check DC bias at Buffer Amplifiers U1, U2, & U3 pin 3 Typ. 3.2 Vdc. Bad Buffer Amplifier. Replace bad part. 1. Check DC bias at Q1 drain. (Typ. +8Vdc) Replace Q1. 2. Check DC bias at Q1 source. (Typ. +0.9 Vdc) RECEIVER SYNTHESIZER MODULE 19D902781G1 & G2 (19D902781, Sh1, Rev. 7) OUTLINE DIAGRAM LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G1 & G2 (19D902664, Sh. 1, Rev. 10) LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G1 (19D903621, Sh. 1, Rev. 4) SCHEMATIC DIAGRAM SCHEMATIC DIAGRAM LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G1 (19D903621, Sh. 2, Rev. 4) LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G1 (19D903621, Sh. 3, Rev. 4) SCHEMATIC DIAGRAM SCHEMATIC DIAGRAM LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G2 (19D903769, Sh. 1, Rev. 3) LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G2 (19D903769, Sh. 2, Rev. 3) 10 SCHEMATIC DIAGRAM SCHEMATIC DIAGRAM LBI-38641F RECEIVER SYNTHESIZER BOARD 19D902664G2 (19D903769, Sh. 3, Rev. 3) 11 PARTS LIST LBI-38641F RECEIVER SYNTHESIZER MODULE 19D902781G1-G2 ISSUE 4 SYMBOL PART N0. DESCRIPTION ——— MISCELLANEOUS — — PART NO. DESCRIPTION 19B802690P1 RF Shielding Grommet. C36 19A703902P3 Metal: 0.047 µF ±10%, 50 VDCW. RF Casting. C37 19A702052P14 Ceramic: 0.01 µF ±10%, 50 VDCW. 11 19A702381P508 Screw, thd. form: No. 3.5-0.6 x 8. (Used in G1, G2, G1 and G2). C38 19A702052P26 Ceramic: 0.1 µF ±10%, 50 VDCW. 17 19D902664G2 C39 and C40 19A702052P3 Ceramic: 470 pF ±10%, 50 VDCW. C41 and C42 19A705205P6 C43 19A705205P2 C3 19A702236P38 Ceramic: 33 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM/°C. (Used in G2). C3 19A702236P36 Ceramic: 27 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM/°C. (Used in G1). C4 19A702236P9 Ceramic: 1.8 pF ±0.25 pF, 50 VDCW, temp coef 0 ±30 PPM. C5 19A702236P30 Ceramic: 15 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM/°C. (Used in G2). C5 19A702236P28 Ceramic: 12 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM. (Used in G1). C6 19A702236P36 Ceramic: 27 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM/°C. (Used in G2). C6 19A702236P34 Ceramic: 22 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM. (Used in G1). C7 19A702052P14 Ceramic: 0.01 µF ±10%, 50 VDCW. C8 19A702052P26 Ceramic: 0.1 µF ±10%, 50 VDCW. C9 thru C12 19A702052P14 Ceramic: 0.01 µF ±10%, 50 VDCW. C13 and C14 19A702052P26 Ceramic: 0.1 µF ±10%, 50 VDCW. C15 19A702052P5 Ceramic: 1000 pF ±10%, 50 VDCW. C16 thru C22 19A702061P99 Ceramic: 1000 pF ±5%, 50 VDCW, temp coef. 0 ±30 PPM/ºC. C23 19A702052P5 Ceramic: 1000 pF ±10%, 50 VDCW. *COMPONENTS, ADDED, DELETED OR CHANGED BY PRODUCTION CHANGES 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. 19A705470P13 Coil: 0.10 µH ±20%. (Used in G2). R30 19B800607P270 Metal film: 27 ohms ±5%, 1/8 w. (Used in G2). L6 19A705470P12 Coil, fixed. (Used in G1). R30 L7 19A705470P24 Coil, fixed: 1.5 µH ±10%. 19B800607P390 Metal film: 39 ohms ±5%, 1/8 w. (Used in G1). L8 19A705470P10 Coil, fixed: 56 nH ±20%. (Used in G2). R31 19B800607P270 Metal film: 27 ohms ±5%, 1/8 w. Coil, Fixed: 47 nH; sim to Toko 380NB-47nM. (Used in G1). R32 and R33 19B800607P472 Metal film: 4.7K ohms ±5%, 1/8 w. R34 and R35 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. R36 and R37 19B800607P104 Metal film: 100K ohms ±5%, 1/8 w. R38 19B800607P682 Metal film: 6.8K ohms ±5%, 1/8 w. R42 19B800607P104 Metal film: 100K ohms ±5%, 1/8 w. (Used in G2). R42 19B800607P333 Metal film: 33K ohms ±5%, 1/8 w. (Used in G1). R43 19B800607P333 Metal film: 33K ohms ±5%, 1/8 w. R44 19B800607P105 Metal film: 1M ohms ±5%, 1/8 w. Metallized polyester: 2.2 µF ±10%, 50 VDCW. 19A703684P3 19D902824P1 Ceramic: 1.5 pF ±.25 pF, 50 VDCW. (Used in G1). R29 L6 10 19A702236P8 Coil, RF: 1.5 µH ±10%. 19A700024P15 C2 19B800607P181 Metal film: 180 ohms ±5%, 1/8 w. L5 C35 Ceramic: 2.2 pF ±2.5 pF, 50 VDCW, temp coef 0 ±30 PPM/°C. (Used in G2). R27 and R28 Ceramic: 51 pF ±5, 50 VDCW, ±30 PPM/°C. 19A702381P513 Screw, thread forming: TORX, No. M3.5 - 0.6 X 13. 19A702236P10 Coil, RF: 1.0 µH ±10%. 19A702236P43 C34 C2 19B800607P151 Metal film: 150 ohms ±5%, 1/8 w. (Used in G1). 19A700024P13 19A702381P506 Screw, thread forming: TORX, No. M3.5 - 0.6 X 6. Ceramic: 8.2 pF ±.25 pF, 50 VDCW, temp coef 0 ±30 PPM. (Used in G1). R26 L2 thru L4 19A702236P23 19B800607P181 Metal film: 180 ohms ±5%, 1/8 w. (Used in G2). Ceramic: 220 pF ±10%, 50 VDCW. Receiver Synthesizer Board, (Used in G1). C1 R26 19A702052P1 19D902664G1 Ceramic: 12 pF ±5%, 50 VDCW, temp coef 0±30 PPM. (Used in G2). Connector, receptacle. C31 thru C33 19A702236P28 19A115938P24 Tantalum: 1 µF, 16 VDCW; sim to Sprague 293D. Handle. C1 J2 thru J4 19A705205P2 19D902555P1 — — — — CAPACITORS — — — 19B800607P151 Metal film: 150 ohms ±5%, 1/8 w. (Used in G1). C27 thru C30 L9 19A705470P10 Coil, fixed: 56 nH ±20%. (Used in G2). L9 19A705470P9 Coil, Fixed: 47 nH; sim to Toko 380NB-47nM. (Used in G1). L10 19C851001P3 Coil, RF: sim to Paul Smith SK-901-1. (Used in G2). Tantalum: 1 µF, 16 VDCW; sim to Sprague 293D. L10 19C851001P1 Coil, RF: sim to Paul Smith SK901-1. (Used in G1). L18 19A705470P13 Coil: 0.10 µH ±20% 19A702052P26 Ceramic: 0.1 µF ±10%, 50 VDCW. C45 thru C47 19A702052P3 Ceramic: 470 pF ±10%, 50 VDCW. C48 and C49 19A705205P6 19A702052P26 Tantalum: 10 µF, 16 VDCW; sim to Sprague 293D. Ceramic: 0.1 µF ±10%, 50 VDCW. C51 19A701225P3 Electrolytic: 220 µF, -10+50%, 25 VDCW. C52 19A134227P5 Variable: 1.5 to 14 pF, 100 VDCW. C53 19A702052P26 Ceramic: 0.1 µF ±10%, 50 VDCW. C54 19A702052P14 Ceramic: 0.01 µF ±10%, 50 VDCW. C55 and C56 19A702052P26 Ceramic: 0.1 µF ±10%, 50 VDCW. C57 and C58 19A702061P99 C59 and C60 19A702052P14 C61 thru C69 19A702061P99 C70 thru C81 19A702061P61 C102 19A702236P25 Ceramic: 1000 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM/°C. Ceramic: 0.01 µF ±10%, 50 VDCW. Ceramic: 1000 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM/°C. Ceramic: 100 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM. Ceramic: 10 pF ±25pF, 50 VDCW, temp coef. 0 ±30 PPM/ºC. ———— CR1 19A703595P10 ——— 19A705470P9 C44 C50 — — — — INDUCTORS L8 Tantalum: 10 µF, 16 VDCW; sim to Sprague 293D. DIODES — — — — — Diode, Optoelectric: Red; sim to HP HLMP-1301-010. D3 19A705377P1 Silicon, Hot Carrier: sim to MMB0201. D4 and D5 19A149674P1 Silicon, capacitive: sim to Toko KV1410. DESCRIPTION R25 Ceramic: 3300 pF ±10%, 50 VDCW. Chassis. PART NO. Connector, DIN: 96 male contacts, right angle mounting; sim to AMP 650887-1. 19A702052P8 Cover. SYMBOL 19B801587P7 C26 19D902509P3 DESCRIPTION J1 Ceramic: 18 pF ±5%, 50 VDCW, temp coef 0 ±30 PPM 19D902508P3 RECEIVER SYNTHESIZER BOARD 19D902664G1 - G2 PART NO. 19A702236P32 Receiver Synthesizer Board. (Used in G2). SYMBOL C24 and C25 12 SYMBOL ——— TRANSISTORS — — — Q1 19A702524P2 N-Type, field effect; sim to MMBFU310. Q2 thru Q7 19A700076P2 Silicon, NPN: sim to MMBT3904, low profile. Q8 19A700059P2 Q9 thru Q13 19A700076P2 R45 19B800607P472 Metal film: 4.7K ohms ±5%, 1/8 w. Silicon, PNP: sim to MMBT3906, low profile. R46 19B800607P201 Metal film: 200 ohms ±5%, 1/8 w. (Used in G2). Silicon, NPN: sim to MMBT3904, low profile. R46 19B800607P181 Metal film: 180 ohms ±5%, 1/8 w. (Used in G1). R47 19B800607P271 Metal film: 270 ohms ±5%, 1/8 w. R48 19B800607P181 Metal film: 180 ohms ±5%, 1/8 w. — — — — RESISTORS— — — — R1 19B800607P680 Metal film: 68 ohms ±5%, 1/8 w. 19B800607P100 Metal film: 10 ohms ±5%, 1/8 w. R49 thru R51 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. R2 thru R9 R52 thru R54 19B800607P473 Metal film: 47K ohms ±5%, 1/8 w. 19B800607P1 *R10 Metal film: 0 ohms. R11 19B800607P183 Metal film: 18K ohms ±5%, 1/8 w. R12 19B800607P330 Metal film: 33 ohms ±5%, 1/8 w. R55 19B800607P222 Metal film: 2.2K ohms ±5%, 1/8 w. 19B800607P270 Metal film: 27 ohms ±5%, 1/8 w. R56 19B800607P510 Metal film: 51 ohms ±5%, 1/8 w. R14 and R15 19B800607P470 Metal film: 47 ohms ±5%, 1/8 w. R57 19B800607P473 Metal film: 47K ohms ±5%, 1/8 w. R58 19B800607P681 Metal film: 680 ohms ±5%, 1/8 w. 19B800607P330 Metal film: 33 ohms ±5%, 1/8 w. R59 19B800607P222 Metal film: 2.2K ohms ±5%, 1/8 w. R16 19B800607P270 Metal film: 27 ohms ±5%, 1/8 w. 19B800607P102 Metal film: 1K ohms ±5%, 1/8 w. R17 R18 19B800607P180 Metal film: 18 ohms ±5%, 1/8 w. R60 thru R63 R19 19B800607P100 Metal film: 10 ohms ±5%, 1/8 w. R64 19B800607P510 Metal film: 51 ohms ±5%, 1/8 w. 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. R65 and R66 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. R67 and R68 19B800607P473 Metal film: 47K ohms ±5%, 1/8 w. R13 R20 R21 19B800607P472 Metal film: 4.7K ohms ±5%, 1/8 w. R22 19B800607P271 Metal film: 270 ohms ±5%, 1/8 w. R23 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. R24 19B800607P201 Metal film: 200 ohms ±5%, 1/8 w. PARTS LIST & PRODUCTION CHANGES SYMBOL PART NO. DESCRIPTION R70 thru R72 19B800607P102 Metal film: 1K ohms ±5%, 1/8 w. R73 thru R76 19B800607P103 Metal film: 10K ohms ±5%, 1/8 w. R77 and R78 19B800607P101 Metal film: 100 ohms ±5%, 1/8 w. R79 thru R88 19B800607P102 Metal film: 1K ohms ±5%, 1/8 w. IC DATA LBI-38641F U1 thru U4 19A705927P1 Silicon Bipolar IC PRODUCTION CHANGES Changes in the equipment to improve or to simplify circuits are identified by a "Revision Letter", which is stamped after the model number of the unit. The revision stamped on the unit includes all previous revisions. Refer to the Parts List for descriptions of parts affected by these revisions. REV. A - RECEIVER SYNTHESIZER BOARD 19D902664G1 & G2 To improve regulator operation at low supply voltage. Changed resistor R10. Resistor R10 was 10 ohms (19B800607P100). REV. B - RECEIVER SYNTHESIZER BOARD 19D902664G1 & G2 —— INTEGRATED CIRCUITS — U1 thru U4 19A705927P1 Silicon, bipolar: sim to Avantek MSA-0611. U5 19A149944P201 Dual Modulus Prescaler: sim to MC12022A. U6 19B800902P5 Synthesizer, custom: CMOS, serial input. U8 and U9 19A702293P3 Linear: Dual Op Amp; sim to LM358D. U10 19A703471P320 Digital: 3-Line To 8-Line Decoder; sim to 74HC138. U12 and U13 19A703483P302 Digital: Quad 2-Input NAND Gate; sim to 74HC00. U14 19A702705P4 Digital: Quad Analog Switch/ Multiplexer; sim to 4066BM. U15 19A704971P8 Voltage Regulator, Positive: sim to Motorola MC78M05CDT. U16 19A704971P10 Voltage Regulator, Positive: sim to Motorola MC78M08CDT. Y1 19B801351P12 Crystal Oscillator; 14.850 MHz, temperature compensated. ———— CRYSTALS To accommodate SOG synthesizer IC package U6 (PLCC package discontinued) and make provision for RC compensation network (R89, C82) in 10-Volt regulator circuit. Resistor R89 and capacitor C82 are not installed. Modified printed wire board layout (Printed wire board changed from 19D902665P1R1 to 19D902665P1R2). Changed U6. Synthesizer U6 was 19B800902P5. REV. A - RECEIVER SYNTHESIZER MODULE 19D902781G1 & G2 To install RF shielding grommets. Installed item 9 RF shielding grommets (19B705470P1) on three BNC connectors of input/output RF ports. REV. C - RECEIVER SYNTHESIZER BOARD 19D902664G1 & G2 To add filtering in the output circuit of the pre-scaler buffer amplifier. Changed capacitor C16. Capacitor C16 was 19A702052P3 (470 pF). Added capacitor C102 and inductor L18. Changed resistor R24. Resistor R24 was 19B800607P510 (51 Ohms). U5 19A149944P201 Modulus Prescaler ——— U6 19B800902P7 Synthesizer 20 19 18 17 16 15 14 13 12 10 11 13 LBI-38641F U8 & U9 19A702293P2 Dual Operational Amplifier IC DATA U14 19A702705P4 Quad Analog Switch U10 19A703471P120 Decoder/Demux U15 19A704971P8 +5 Regulator U12 & U13 19A703483P302 Logic Gate/Inverter 14 Y1 19B801351P12 Crystal Oscillator U16 19A70497P10 +8V Regulator LBI-38641F This page intentionally left blank 15
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.3 Linearized : No Create Date : 2002:03:06 13:39:31 Producer : Acrobat Distiller 4.05 for Windows Modify Date : 2003:03:03 18:11:02-07:00 Subject : Maintenance Manual Title : LBI-38641F, VHF RECEIVER SYNTHESIZER MODULE, 19D902781G1 & G2 Author : M/A-COM Private Radio Systems, Inc. Page Count : 16 Page Mode : UseThumbsEXIF Metadata provided by EXIF.tools