Laird Connectivity 60SIPT 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module User Manual CS DS SU60 SIPT PRELIMINARY

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Datasheet
60-SIPT series
Version 0.2
SU60-SIPT
Datasheet
REVISION HISTORY
Version
0.1
Date
24 Mar 2017
0.2
11 May 2017
Notes
Initial preliminary version
Updated some certifications; fixed typos in Channel table;
corrected RX sensitivity numbers on 11 AC (MCS9;HT80);
Approver
Jay White
Andrew Chen
Descript PDn and PMU_EN function
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
CONTENTS
Scope ................................................................................................................................................... 4
Introduction ......................................................................................................................................... 4
2.1 General Description...................................................................................................................... 4
3 60-SIPT Series Features Summary ....................................................................................................... 5
4 Specifications ....................................................................................................................................... 6
5 WLAN Functional Description............................................................................................................ 11
5.1 Overview .................................................................................................................................... 11
6 Bluetooth Functional Description...................................................................................................... 14
7 Block Diagram .................................................................................................................................... 15
8 Electrical Characteristics .................................................................................................................... 15
8.1 Absolute Maximum Ratings ....................................................................................................... 15
8.2 Recommended Operating Conditions ........................................................................................ 16
8.3 DC Electrical Characteristics ....................................................................................................... 16
8.4 WLAN Radio Receiver Characteristics ........................................................................................ 17
8.5 WLAN Transmitter Characteristics ............................................................................................. 18
9 Bluetooth Radio Characteristics ........................................................................................................ 19
10
Host Interface Specifications ......................................................................................................... 22
10.1 SDIO Specifications ..................................................................................................................... 22
10.2 PCI Express Specifications .......................................................................................................... 26
10.3 USB Specifications ...................................................................................................................... 30
10.4 PCM Interface Specifications ..................................................................................................... 33
11
Pin Definitions ................................................................................................................................ 34
12
Host Configuration Options ........................................................................................................... 37
13
Mechanical Specifications .............................................................................................................. 37
14
RF Layout Design Guidelines .......................................................................................................... 39
15
Recommended Storage, Handling, Baking, and Reflow Profile ..................................................... 39
15.1 Required Storage Conditions ..................................................................................................... 39
15.2 Baking Conditions ....................................................................................................................... 40
15.3 Surface Mount Conditions ......................................................................................................... 41
16
Regulatory ...................................................................................................................................... 43
16.1 Certified Antennas ..................................................................................................................... 43
17
FCC and IC Regulatory .................................................................................................................... 43
17.1 FCC .............................................................................................................................................. 44
17.2 Industry Canada ......................................................................................................................... 45
18
European Union Regulatory ........................................................................................................... 48
19
Ordering Information ..................................................................................................................... 49
19.1 General Comments .................................................................................................................... 49
19.1.1 Labeling Requirements ....................................................................................................... 50
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
SCOPE
This document describes key hardware aspects of the Laird 60-SIPT series system-in-package (SiP) modules
providing either SDIO, USB2.0, or PCIe bus interface for WLAN connection and UART/PCM, SDIO/PCM,
USB2.0/PCM for Bluetooth® connection. This document is intended to assist device manufacturers and related
parties with the integration of this radio into their host devices. Data in this document is drawn from several
sources and includes information found in the Marvell 88W8997/88PG823 data sheets issued in April 2016,
along with other documents provided from Marvell.
Note that the information in this document is subject to change. Please contact Laird to obtain the most recent
version of this document.
INTRODUCTION
2.1
General Description
The 60-SIPT series SiP modules are an integrated, small form factor 2x2 MIMO
802.11 a/b/g/n/ac WLAN plus Bluetooth 4.2 dual mode device that is
optimized for low-power mobile devices. The integration of all WLAN and
Bluetooth functionality in a single package supports low cost and simple
implementation along with flexibility for platform-specific customization.
This device is pre-calibrated and integrates the complete transmit/receive RF
paths including band pass filter, diplexer, switches, reference crystal oscillator,
and power manage units (PMU).
The 60-SIPT series device supports IEEE 802.11 ac (wave 2) 2X2 receive multiuser MIMO (MU-MIMO) spatial stream multiplexing with data rates up to MCS9 (866.7 Mbps). It also supports
Bluetooth 2.1 + EDR and Bluetooth 4.2 (Bluetooth Low Energy or BLE). Internal Wi-Fi and BT coexistence
scheme provides optimized throughput when Wi-Fi and BT working simultaneously. The device’s low power
consumption radio architecture and power manage unit (PMU) proprietary power save technologies allow for
extended battery life.
In addition, its dual 802.11 and Bluetooth radio includes full digital MAC and baseband engines that handle all
802.11 CCK/OFDM® 2.4/5GHz, and Bluetooth basic rate and EDR baseband and protocol processing.
Dual embedded low-power CPU cores minimize host loading and maximize flexibility to support customerspecific use cases.
The 60-SIPT series SiP modules include two product SKUs which is have different supported software features.
Please check Laird Sales/FAE for further information. Order information is listed in Table 1.
Table 1: Product ordering information
Order Model
SU60-SIPT
ST60-SIPT
Description
802.11ac + BT4.2 60 Series hardware combined with Summit Series Enterprise software
802.11ac + BT4.2 60 Series hardware combined with Sterling Series Professional software
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
60-SIPT SERIES FEATURES SUMMARY
The Laird 60-SIPT series device features are described in Table 2.
Table 2: 60-SIPT series features
Feature
Radio Front End
Description
Integrates the complete transmit/receive RF paths including band pass filter, diplexer,
switches, reference crystal oscillator, and power manage unit (PMU).
Supports 20/40/80MHz channel bandwidth.
WLAN/Bluetooth share one antenna.
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Any use of such
marks by Laird is under license. Other trademarks and trade names are those of their respective owners.
Coexistence
Power
Management
Coexistence arbitration for WLAN, Bluetooth, and LTE operation
Dynamic Voltage Scaling (DVS) and Adaptive Voltage Scaling (AVS) features support the
latest Marvell SoC and Processor power control scheme.
Pre-Calibration
Sleep Clock
RF system tested and calibrated in production
An external sleep clock of 32.768 KHz is required during power save mode
Host Interface
Reference
Frequency
Advanced WLAN
SDIO 3.0 (4-bit and 1-bit), SDR 12/25/50 mode (up to 100 MHz), USB2.0 or PCIe for
WLAN
SDIO 3.0, USB 2.0, HS-UART for Bluetooth HCI (compatible with any upper layer
Bluetooth stack)
PCM digital audio interface for Bluetooth audio application
Strap Value
CONFIG_HOST [2-0]
000
001
010
011
100
101
WLAN
Bluetooth/BLE
SDIO
SDIO
PCIe
PCIe
USB 2.0
USB 2.0
UART
SDIO
USB 2.0
UART
UART
USB 2.0
ROM Notes
Initial USB 2.0 PHY and COM PHY PCIe portion
Initial only COM PHY PCIe portion
Initial COM PHY USB 2.0
Initial only USB 2.0 PHY

 Incorporates a 40 MHz reference frequency source in package

 An external sleep clock is recommended for minimal current consumption. If no sleep clock
input is provided, an internal sleep clock (derived from reference clock) is used. An approximate
50 uA current increase on the 3.3V rail.

 A-MPDU RX (de-aggregation) and TX (aggregation) supports 802.11ac single-MPDU A-MPDU.

 Multi-BSS/Station

 Transmit rate adaption, transmit power control

 Modulation and coding scheme (MCS): 802.11ac—MCS0-9 Nsts=1 and 2.
802.11n—MCS0-15

 Dynamic frequency selection (radar detection) DFS

 20/40/80 MHz channel bandwidths support

 On-chip gain selectable LNA with optimized noise figure and power consumption

 Internal PA with optimized gain distribution for linearity and noise performance

 Support wide variety of WLAN encryption: TKIP/WEP/AES
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
Feature
Advanced Bluetooth
Description
Bluetooth 4.2 (BDR/EDR/LE), Bluetooth class 1
Support data rate: 1 Mbps(GFSK), 2 Mbps ( /4-DQPSK), 3 Mbps (8-DPSK)
Digital audio interface with PCM/TDM interface for voice application
Adaptive Frequency Hopping (AFH) using Package Error Rate (PER)
Standard SDIO or UART HCI transport layer
WLAN/Bluetooth coexistence protocol support
Shared LNA with WLAN/Bluetooth
Encryption (AES) support
π
SPECIFICATIONS
Table 3: Specifications
Feature
Physical Interface
Wi-Fi Interface
Description
Bluetooth/BLE Interface
Host Controller Interface (HCI) using high speed UART, SDIO, USB 2.0
84-pin LGA package (including 16 thermal ground pad under the package)
1-bit or 4-bit Secure Digital I/O; PCIe v3.0 Gen1/Gen2 (2.5/5 Gbps); USB 2.0
Strap Value
CONFIG_HOST [2-0]
000
001
SDIO
SDIO
Bluetooth/
BLE
UART
SDIO
010
PCIe
USB 2.0
011
100
101
PCIe
USB 2.0
USB 2.0
UART
UART
USB 2.0
WLAN
ROM Notes
Initial USB 2.0 PHY and COM PHY PCIe
portion
Initial only COM PHY PCIe portion
Initial COM PHY USB 2.0
Initial only USB 2.0 PHY
Main Chip
Input Voltage Requirements
I/O Signalling Voltage
Operating Temperature
Marvell 88W8997 (WLAN/BT); Marvell 88PG823 (PMU)
Operating Humidity
Storage Temperature
Storage Humidity
Maximum Electrostatic
Discharge
Size
Weight
Wi-Fi Media
10 to 90% (non-condensing)
Bluetooth Media
Wi-Fi Media Access Protocol
Frequency Hopping Spread Spectrum (FHSS)
Network Architecture Types
Infrastructure and ad-hoc
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
DC 3.3 V ±10%
DC 3.3 V ± 10% or DC 1.8 V ± 10%
-30° to 85°C (-22° to 185°F)
-40° to 85°C (-40° to 185°F)
10 to 90% (non-condensing)
Conductive 4KV; Air coupled 8KV follow EN61000-4-2
13 mm (length) x 14 mm (width) x 1.87 mm (thickness)
TBD g
Direct Sequence-Spread Spectrum (DSSS)
Complementary Code Keying (CCK)
Orthogonal Frequency Divisional Multiplexing (OFDM)
Carrier sense multiple access with collision avoidance (CSMA/CA)
A-MPDU Rx (De-aggregation) and Tx (aggregation) (802.11ac single-MPDU AMPDU)
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
Feature
Wi-Fi Standards
Description
Bluetooth Standards
Bluetooth version 2.1 with Enhanced Data Rate
Bluetooth 4.2 (Bluetooth Low Energy or BLE)
Wi-Fi Data Rates Supported
Support 802.11 ac/a/b/g/n 2X2 MIMO.
802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps
802.11a/g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n (OFDM, HT20/HT40, MCS 0-15)
802.11ac (OFDM, HT20, MCS0-8; OFDM HT40/HT80, MCS 0-9)
IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n,
802.11r, 802.11ac, 802.11w, 802.11K, 802.11v
Modulation Table
BPSK, QPSK, CCK, 16-QAM, 64-QAM, and 256-QAM.
802.11ac
HT
VHT
802.11n
MCS
Index
MCS
Index
BPSK
1/2
QPSK
1/2
QPSK
20 MHz
Spatial
Streams
Modulation
40 MHz
80 MHz
Coding
No SGI
SGI
No SGI
SGI
No SGI
SGI
6.5
7.2
13.5
15
29.3
32.5
13
14.4
27
30
58.5
65
3/4
19.5
21.7
40.5
45
87.8
97.5
16-QAM
1/2
26
28.9
54
60
117
130
16-QAM
3/4
39
43.3
81
90
175.5
195
64-QAM
2/3
52
57.8
108
120
234
260
64-QAM
3/4
58.5
65
121.5
135
263.3
292.5
64-QAM
5/6
65
72.2
135
150
292.5
325
256-QAM
3/4
78
86.7
162
180
351
390
256-QAM
5/6
N/A
N/A
180
200
390
433.3
BPSK
1/2
13
14.4
27
30
58.5
65
QPSK
1/2
26
28.9
54
60
117
130
10
QPSK
3/4
39
43.3
81
90
175.5
195
11
16-QAM
1/2
52
57.8
108
120
234
260
12
16-QAM
3/4
78
86.7
162
180
351
390
13
64-QAM
2/3
104
115.6
216
240
468
520
14
64-QAM
3/4
117
130.3
243
270
526.5
585
15
64-QAM
5/6
130
144.4
270
300
585
650
256-QAM
3/4
156
173.3
324
360
702
180
256-QAM
5/6
N/A
N/A
360
400
780
866.7
802.11ac/n Spatial Streams
2 (2x2 MIMO)
Bluetooth Data Rates Supported
1, 2, 3 Mbps
Bluetooth Modulation
GFSK@ 1 Mbps
Pi/4-DQPSK@ 2 Mbps
8-DPSK@ 3 Mbps
Regulatory Domain Support
FCC (Americas, Parts of Asia, and Middle East)
ETSI (Europe, Middle East, Africa, and Parts of Asia)
IC (Industry Canada)
MIC (Japan) (formerly TELEC) – Option
KC (Korea) (formerly KCC) – Option
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
Feature
Description
2.4 GHz Frequency Bands
ETSI: 2.4 GHz to 2.483 GHz
FCC: 2.4 GHz to 2.473 GHz
MIC: 2.4 GHz to 2.495 GHz
KC: 2.4 GHz to 2.483 GHz
ETSI: 13 (3 non-overlapping)
FCC: 11 (3 non-overlapping)
MIC: 14 (4 non-overlapping)
KC: 13 (3 non-overlapping)
ETSI
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144)
FCC
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144
5.725 GHz to 5.85 GHz (Ch 149/153/157/161/165)
MIC (Japan)
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144)
KC
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124)
5.725 GHz to 5.825 GHz (Ch 149/153/157/161)
ETSI: 19 non-overlapping; FCC: 24 non-overlapping
MIC: (Japan): 19 non-overlapping; KC: 19 non-overlapping
2.4 GHz Operating Channels
(Wi-Fi)
5 GHz Frequency Bands
5 GHz Operating Channels (Wi-Fi)
Transmit Power
Note: Transmit power on each
channel varies per individual
country regulations. All values are
nominal with +/-2 dBm tolerance at
room temperature.
Tolerance could be up to +/-2.5
dBm across operating temperature.
Note:
HT20 – 20 MHz-wide channels
HT40 – 40 MHz-wide channels
HT80 – 80 MHz-wide channels
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
802.11a
6 Mbps
54 Mbps
802.11b
1 Mbps
11 Mbps
802.11g
6 Mbps
54 Mbps
802.11n (2.4/5 GHz)
6.5 Mbps (MCS0-5/MCS8-13; HT20)
65 Mbps (MCS6-7/MCS14-15; HT20)
13.5 Mbps (MCS0-5/MCS8-13; HT40)
135 Mbps (MCS6-7/MCS14-15; HT40)
802.11ac (5 GHz)
6.5/13 Mbps (MCS0-6; Ntst=1,2; HT20)
78/156 Mbps (MCS7-8; Ntst=1,2; HT20)
13.5/27 Mbps (MCS0-5; Ntst=1,2; HT40)
180/360 Mbps (MCS6-8; Ntst=1,2; HT40)
200/400 Mbps (MCS9; Ntst=1,2; HT40)
29.3/58.5 Mbps (MCS0-5; Ntst=1,2; HT80)
263.3/526.5 Mbps (MCS6-8; Ntst=1,2; HT80)
390/780 Mbps (MCS9; Ntst=1,2; HT80)
Bluetooth
1 Mbps (1DH5)
© Copyright 2017 Laird. All Rights Reserved
18 dBm (63 mW)
16 dBm (40 mW)
18 dBm (63 mW)
18 dBm (63 mW)
18 dBm (63 mW)
16 dBm (40 mW)
18 dBm (63 mW)
16 dBm (40 mW)
16 dBm (40 mW)
14 dBm (25 mW)
18 dBm (63 mW)
16 dBm (40 mW)
16 dBm (40 mW)
14 dBm (25 mW)
12 dBm (15.8mW)
14 dBm (25 mW)
12 dBm (15.8 mW)
10 dBm (10 mW)
10 dBm (12.5 mW)
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
Feature
Typical Receiver Sensitivity
(PER <= 10%)
Note: All values nominal, +/-3 dBm.
Sensitivity on CH13 (WLAN)/CH78
(BT) will decade up to 4-6dB.
Operating Systems Supported
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
Description
2 Mbps
7 dBm (6.3 mW)
3 Mbps
7 dBm (6.3 mW)
BLE (1 Mbps)
7 dBm (6.3 mW)
802.11a:
6 Mbps
-89 dBm
54 Mbps
-74 dBm
802.11b:
1 Mbps
-95 dBm
11 Mbps
-90 dBm (PER<8%)
802.11g:
6 Mbps
-91 dBm
54 Mbps
-75 dBm
802.11n (2.4 GHz)
6.5 Mbps (MCS0; HT20)
-91 dBm
65 Mbps (MCS7; HT20)
-73 dBm
13.5 Mbps (MCS0; HT40)
-85 dBm
135 Mbps (MCS7; HT40)
-70 dBm
802.11n (5 GHz)
6.5 Mbps (MCS0; HT20)
-89 dBm
65 Mbps (MCS7; HT20)
-70 dBm
13.5Mbps (MCS0; HT40)
-86 dBm
135Mbps (MCS7; HT40)
-69 dBm
802.11ac (5 GHz)
6.5 Mbps (MCS0; HT20)
-89 dBm
78 Mbps (MCS8; HT20)
-67 dBm
13.5 Mbps (MCS0; HT40)
-86 dBm
180 Mbps (MCS9; HT40)
-63 dBm
29.3 Mbps (MCS0; HT80)
-81 dBm
390/780 Mbps (MCS9; HT80)
-55 dBm
Bluetooth:
1 Mbps (1DH5)
-95 dBm
2Mbps (2DH5)
-94 dBm
3 Mbps (3DH5)
-88 dBm
BLE
-95 dBm
Linux 3.x to 4.9.x kernel.
Android 5.0-5.1.1 (Lollipop) Nov. 2014 supported.
Android 6.0-6.01 (Marshmallow) Oct 2015 supported
Android 7.0-7.1.1 (Nougat) Aug. 2016 supported
© Copyright 2017 Laird. All Rights Reserved
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Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
Feature
Description
Security
Standards
Wireless Equivalent Privacy (WEP)
Wi-Fi Protected Access (WPA)
IEEE 802.11i (WPA2)
Encryption
Wireless Equivalent Privacy (WEP, RC4 Algorithm)
Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)
Advanced Encryption Standard (AES, Rijndael Algorithm)
Encryption Key Provisioning
Static (40-bit and 128-bit lengths)
Pre-Shared (PSK)
Dynamic
802.1X Extensible Authentication Protocol Types
EAP-FAST
PEAP-MSCHAPv2
EAP-TLS
PEAP-TLS
EAP-TTLS
LEAP
PEAP-GTC
ETSI Regulatory Domain
EN 300 328
EN 301 489-1
EN 301 489-17
EN 301 893
EN 60950-1
2011/65/EU (RoHS)
Compliance
Note: These regulatory
certifications are pending.
FCC Regulatory Domain
FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz
FCC 15.407 UNII – 802.11a (Wi-Fi) – 5 GHz
FCC 15.247 DSS – BT 2.1
Industry Canada
RSS-247 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz
RSS-247 – BT 2.1
Certifications
Note: These regulatory
certifications are pending.
Warranty
Wi-Fi Alliance
802.11a, 802.11b, 802.11g, 802.11n, 802.11ac
WPA Enterprise
WPA2 Enterprise
Bluetooth® SIG Qualification
Three Year Warranty
All specifications are subject to change without notice
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
10
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
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SU60-SIPT
Datasheet
WLAN FUNCTIONAL DESCRIPTION
5.1
Overview
The 60-SIPT series SiP module is designed based on the Marvell 88W8997 802.11ac/a/b/g/n chipset. It is
optimized for high speed, reliable, and low-power embedded applications. It’s integrated with dual-band WLAN
(2.4/5GHz) and Bluetooth 4.2. Its functionality includes:
Improved throughput on the link due to frame aggregation, RIFS (reduced inter-frame spacing), and half
guard intervals.
Support for STBC (Space Time Block Codes) and LDPC (Low Density Parity Check) codes.
Improved 11n performance due to features such as 11n frame aggregation (A-MPDU and A-MSDU) and
low-overhead host-assisted buffering (RX A-MSDU and RX A-MPDU). These techniques can improve
performance and efficiency of applications involving large bulk data transfers such as file transfers or highresolution video streaming.
IEEE 802.11 ac (Wave 2), 2X2 receive Multi-User MIMIO (MU-MIMO) spatial stream multiplexing with data
rate up to MCS9 (866.7Mbps).
Additional functionality is listed in the following table (Table 4).
Table 4: WLAN functions
Feature
WLAN MAC
Description

 Frame Exchange at the MAC level to deliver data

 Received frame filtering and validation (Cyclic Redundancy Check (CRC))

 Generation of MAC header and trailer information (MAC protocol Data Units (MPDUs))

 Fragmentation of data frames (MAC Service Data Units (MSDUs)

 Access Mechanism support for fair access to shared wireless medium through (DCF and EDCA)

 A-MPDU Aggregation/Deaggregation (support 802.11ac single –MPDU A-MPDU)

 20/40/80 MHz channel Coexistence

 RIFS Burst Receive

 Management Information Base

 Radio Resource Measurement

 Quality of Service

 Block Acknowledgement

 802.11ac Downlink MU-MIMO (receive)

 Dynamic Frequency Selection

 Beamforming

 TIM Frame TX and RX

 Multi-BSS/Station

 Transmit Rate Adaptation.

 Transmit Power Control
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
11
© Copyright 2017 Laird. All Rights Reserved
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Feature
WLAN Base Band
Description

 802.11ac 2x2 MU-MIMO (with on-chip Marvell RF radio)

 Backward compatibility with legacy 802.11 n/a/b/g technology

 WLAN/Bluetooth LNA sharing

 PHY rate up to 866.7 Mbps

 20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz packets in 40
MHz channel, 20 MHz duplicate legacy packets in 40 MHz channel operation.

 80 MHz bandwidth/channel, 4 positions of 20 MHz packets in 80 MHz channel, upper/lower 40
MHz packets in 80 MHz channel, 20 MHz quadruplicate legacy packets in 80 MHz channel
mode operation.

 Modulation and Coding Scheme (MCS): 802.11ac (MCS0-9. Nsts=1/2); 802.11n (MCS0-15)

 Dynamic Frequency Selection (DFS) (Radar detection)
– Enhanced radar detection for long and short pulse radar
– Enhanced AGC scheme for DFS channel
– Japan DFS requirements for W53 and W56

 802.11 K Radio Resource Measurement.

 802.11ac /802.11n optional MIMO features:
20/40/80 MHz Coexistence with middle-packaged detection (GI detection) for enhanced CCA
–
–
–
–
–
–
WLAN Security
One spatial stream STBC reception and transmission
LDPC transmission and reception for 802.11ac and 802.11n
256 QAM (MCS8-9) modulations supported
Short guard interval
RIFS on receive path for 802.11n packets
802.11n Greenfield TX/RX
Power Save feature
WLAN Encryption features supported include:
– Temporal Key Integrity Protocol (TKIP)/Wired Equivalent Privacy (WEP)
– Advanced Encryption Standard (AES)/Counter-Mode/CBC-MAC Protocol (CCMP)
– Advanced Encryption Standard (AES)/Cipher-Based Message Authentication Code (CMAC)
– Advanced Encryption Standard (AES)/Galois/Counter Mode Protocol (GCMP)
– WLAN Authentication and Private Infrastructure (WPAI)
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Datasheet
Feature
Description
WLAN Channel
Channel frequency supported.
Channel
10
11
12
13
20 MHz
Freq.
Channel
(MHz)
2412
36
2417
40
2422
44
2427
48
2432
52
2437
56
2422
60
2447
64
2452
100
2457
104
2462
108
2467
112
2472
116
120
124
128
132
136
140
144
149
153
157
161
165
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Freq.
(MHz)
5180
5200
5220
5240
5260
5280
5300
5320
5500
5520
5540
5560
5580
5600
5620
5640
5660
5680
5700
5720
5745
5765
5785
5805
5825
40 MHz
Freq.
Channel
(MHz)
1-5
2422
2-6
2427
3-7
2432
4-8
2437
5-9
2422
6-10
2447
7-11
2452
36-40
5190
44-48
5230
52-56
5270
60-64
5310
68-72
5350
76-80
5390
84-88
5430
92-96
5470
100-104
5510
108-112
5550
116-120
5590
124-128
5630
132-136
5670
140-144
5710
149-153
5755
157-161
5795
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80 MHz
Freq.
Channel
(MHz)
42
5210
58
5290
74
5370
90
5410
106
5530
122
5610
138
5690
155
5775
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SU60-SIPT
Datasheet
BLUETOOTH FUNCTIONAL DESCRIPTION
The 60-SIPT series includes a fully-integrated Bluetooth baseband/radio. Several features and functions are
listed in Table 5.
Table 5: Bluetooth functions
Feature
Bluetooth Interface
Bluetooth Core
functionality
Bluetooth Low Energy
(BLE) Core functionality
Description

 Voice interface:
– Hardware support for continual PCM data transmission/reception without processor
overhead.
– Standard PCM clock rates from 64 kHz to 2.048 MHz with multi-slot handshake and
synchronization.
– A-law, U-law, and linear voice PCM encoding/decoding.

 SDIO interface

 High-Speed UART interface

 USB 2.0

 Bluetooth 4.2

 Bluetooth Class 2/Bluetooth class 1

 WLAN and Bluetooth share same LNA and antenna

 Digital audio interfaces with PCM/TDM interface for voice application

 Baseband and radio BDR and EDR package type: 1 Mbps, 2 Mbps, 3 Mbps

 Fully functional Bluetooth baseband: AFH, forward error correction, header error control,
access code correction, CRC, encryption bit stream generation, and whitening.

 Adaptive Frequency Hopping (AFH) using Packet Error Rate (PER)

 Interlaced scan for faster connection setup

 Simultaneous active ACL connection setup

 Automatic ACL package type selection

 Full master and slave piconet support

 Scatter net support

 SCO/eSCO links with hardware accelerated audio signal processing and hardware supported
PPEC algorithm for speech quality improvement

 All standard SCO/eSCO voice coding

 All standard pairing, authentication, link key, and encryption operations

 Encryption (AES) support

 Advertiser, Scanner, Initiator, Master, and Slave roles support (connects to 16 links)

 WLAN/Bluetooth Coexistence (BCA) protocol support.

 Shared RF with BDR/EDR

 Encryption (AES) support.

 Intelligent Adaptive Frequency Hopping (AFH)

 LE privacy 1.2

 LE Secure Connection.

 LE Data Length Extension

 LE Advertising Length Extension.

 2Mbps LE

 Direction Finding –connectionless Angle of Departure (AoD)

 Direction Finding –connectionless Angle of Arrival (AoA)
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Datasheet
BLOCK DIAGRAM
Figure 1: Block diagram
ELECTRICAL CHARACTERISTICS
8.1
Absolute Maximum Ratings
Table 6 summarizes the absolute maximum ratings and Table 7 lists the recommended operating conditions for
the 60-SIPT Series. Absolute maximum ratings are those values beyond which damage to the device can occur.
Functional operation under these conditions, or at any other condition beyond those indicated in the
operational sections of this document, is not recommended.
Note: Maximum rating for signals follows the supply domain of the signals.
Table 6: Absolute maximum ratings
Symbol
(Domain)
VIO_SD
Parameter
WLAN host SDIO interface I/O supply (for 1.8V system)
(for 3.3V system)
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Max
Rating
2.2
4.0
Unit
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SU60-SIPT
Datasheet
Symbol
(Domain)
VIO
3V3
Storage
ANT0; ANT1
ESD
8.2
Max
Rating
Parameter
I/O configuration power supply (for 1.8V system)
(for 3.3V system)
External 3.3V power supply
Storage Temperature
Maximum RF input (reference to 50-Ω input)
Electrostatic discharge tolerance
2.2
4.0
4.0
-40 to +85
+10
2000
Unit
°C
dBm
Recommended Operating Conditions
Table 7: Recommended Operating Conditions
Symbol (Domain)
VIO_SD
VIO
3V3
T-ambient
8.3
Parameter
WLAN host interface I/O supply
Min
1.62/2.97
Typ
1.8/3.3
Max
1.98/3.63
Unit
WLAN and BT GPIO I/O power supply
External 3.3V power supply
Ambient temperature
1.62/2.97
2.97
-30
1.8/3.3
3.30
25
1.98/3.63
3.63
85
°C
DC Electrical Characteristics
Table 8 and Table 9 list the general DC electrical characteristics over recommended operating conditions (unless
otherwise specified).
Table 8: General DC electrical characteristics (For 1.8V operation VIO_SD; VIO)
Symbol
VIH
VIL
Parameter
High Level Input Voltage
Low Level Input Voltage
Conditions
---
Min
1.26
-0.4
VHYS
VOH
VOL
Input Hysteresis
Output high Voltage
Output low Voltage
----
100
1.4
Typ
Max
2.2
0.54
Unit
0.4
mV
Table 9: General DC electrical characteristics (For 3.3V operation VIO_SD; VIO)
Symbol
VIH
VIL
Parameter
High Level Input Voltage
Low Level Input Voltage
Conditions
---
Min
2.4
-0.4
VHYS
VOH
VOL
Input Hysteresis
Output high Voltage
Output low Voltage
----
100
2.9
Typ
Max
3.6
0.9
Unit
0.4
mV
Max
3.6
0.8
Unit
Table 10: DC electrical characteristics for 1.8V or 3.3V operation on special pads (PCIE_WAKEn, PCIE_CLKREQn)
Symbol
VIH
VIL
Parameter
High Level Input Voltage
Low Level Input Voltage
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Conditions
---
Min
1.4
-0.4
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SU60-SIPT
Datasheet
Symbol
VHYS
VOL
8.4
Parameter
Input Hysteresis
Output low Voltage
Conditions
---
Min
150
Typ
Max
0.4
Unit
mV
WLAN Radio Receiver Characteristics
Table 11 and Table 12 summarize the WLAN 60-SIPT series receiver characteristics.
Table 11: WLAN receiver characteristics for 2.4 GHz signal chain operation
Symbol
Frx
Srf
Radj
Parameter
Receive input frequency range
Sensitivity
CCK, 1 Mbps
CCK, 11 Mbps
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Adjacent channel rejection
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Conditions
Min
2.412
Typ
Max
2.484
Unit
GHz
-95
-90
-91
-75
-91
-73
See Note1
dBm
TBD
TBD
TBD
TBD
See Note1
dB
Table 12: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation
Symbol
Frx
Parameter
Receive input frequency
range
Srf
Sensitivity
OFDM, 6 Mbps
OFDM, 54 Mbps
Radj
HT20, MCS0
HT20, MCS7
HT40, MCS0
HT40, MCS7
Adjacent channel rejection
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Conditions
Min
5.15
Typ
Max
5.825
Unit
GHz
-89
-74
-89
-70
-86
-69
See Note1
dBm
TBD
TBD
TBD
TBD
See Note1
dB
Note1: Performance data are measured under single chain operation.
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SU60-SIPT
Datasheet
8.5
WLAN Transmitter Characteristics
Table 13: WLAN transmitter characteristics for 2.4 GHz per chain operation
Symbol
Ftx
Pout
ATx
Parameter
Output power
11b mask compliant
11g mask compliant
11g EVM compliant
11n HT20 mask compliant
11n HT20 EVM compliant
11n HT40 mask compliant
11n HT40 EVM compliant
Transmit power accuracy at 25
Typ
2.412
Max
Unit
2.484
GHz
See Note
1-11Mbps
6-36Mbps
48-54Mbps
MCS0-5/MCS8-13
MCS6-7/MCS14-15
MCS0-5/MCS8-13
MCS6-7/MCS14-15
℃
-2.0
18
18
16
18
16
16
14
dBm
+2.0
dB
18dBm
16dBm
Typical Current
Consumption Single
Chain (mA)8
340
280
Max. Current
Consumption Single
Chain (mA)8
620
500
HT20 MCS7
1 Mbps
54 Mbps
HT20 MCS7
1 Mbps
54 Mbps
16dBm
18dBm
16dBm
16dBm
18dBm
16dBm
280
340
280
280
340
280
510
620
500
510
620
500
HT20 MCS7
16dBm
280
510
Mode/Rate (Mbps)
2412MHz
1 Mbps
54 Mbps
2472MHz
Min
Transmit output frequency range
Freq.
2422MHz
Conditions
Output Power Per
Chain (dBm)
Table 14: WLAN transmitter characteristics for 5 GHz per chain operation
Symbol
Ftx
Pout
Parameter
Transmit output frequency range
Output power
11a mask compliant
11a EVM compliant
11n HT20 mask compliant
11n HT20 EVM compliant
11n HT40 mask compliant
11n HT40 EVM compliant
11ac HT20 mask compliant
11ac HT20 EVM compliant
11ac HT40 mask compliant
11ac HT40 EVM compliant
11ac HT40 EVM compliant
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Conditions
Min
5.15
See Note3
6-36Mbps
48-54Mbps
MCS0-5/MCS8-13
MCS6-7/MCS14-15
MCS0-5/MCS8-13
MCS6-7/MCS14-15
MCS0-6 (Ntst=1,2)
MCS7-8(Ntst=1,2)
MCS0-5 (Ntst=1,2)
MCS6-8(Ntst=1,2)
MCS9(Ntst=1,2)
18
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Typ
18
16
18
16
16
14
18
16
16
14
12
Max
5.925
Unit
GHz
dBm
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SU60-SIPT
Datasheet
Symbol
Parameter
11ac HT80 mask compliant
11ac HT80 EVM compliant
11ac HT80 EVM compliant
Transmit power accuracy at 25
ATx
Conditions
MCS0-5 (Ntst=1,2)
MCS6-8(Ntst=1,2)
MCS9(Ntst=1,2)
℃
Min
-2.0
Typ
14
12
10
Max
+2.0
Unit
dB
Table 15: WLAN current consumption on 5 GHz
18 dBm
16 dBm
18 dBm
16 dBm
Typical Current
Consumption Single
Chain (mA)
400
330
400
360
Typical Current
Consumption Dual Chain
(mA)
710
610
720
620
HT40 MCS7
14 dBm
320
550
5500 MHz
6 Mbps
54 Mbps
HT20 MCS0
HT20 MCS7
18 dBm
16 dBm
18 dBm
16 dBm
380
330
370
320
680
600
690
600
5510 MHz
HT40 MCS7
14 dBm
300
530
5825 MHz
6 Mbps
54 Mbps
HT20 MCS0
HT20 MCS7
18 dBm
16 dBm
18 dBm
16 dBm
380
310
360
340
690
600
710
550
5795 MHz
HT40 MCS7
14 dBm
300
530
Freq.
Mode/Rate
[Mbps]
Output Power Per
Chain [dBm]
5180 MHz
6 Mbps
54 Mbps
HT20 MCS0
HT20 MCS7
5190 MHz
Note:
Final TX power values on each channel are limited by the regulatory certification test limit.
BLUETOOTH RADIO CHARACTERISTICS
Table 16 through Table 17 describe the basic rate transmitter performance, enhanced data transmitter
performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption
conditions at 25°C.
Table 16: Basic rate transmitter performance temperature at 25°C (3.3V)
Test Parameter
Maximum RF Output Power
Frequency Range
20 dB Bandwidth
Min
2.4
—
Typ
10
—
919.5
Max
11
2.4835
—
Δf1avg Maximum Modulation
140
165
175
Δf2max Minimum Modulation
Δf2avg/Δf1avg
—
—
135
0.9
—
—
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BT Spec.
0 ~ +20
2.4 ≤ f ≤ 2.4835
≤ 1000
140 < Δf1avg <
175
≥ 115
≥ 0.80
Unit
dBm
GHz
KHz
KHz
KHz
—
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SU60-SIPT
Datasheet
Initial Carrier Frequency
Drift Rate (DH1 package)
Drift (DH3 packet)
Drift (DH5 packet)
Adjacent Channel Power
—
—
—
—
—
—
—
F≥ ± 3MHz
F = ± 2MHz
F = ± 1MHz
+/-5
-50
-46
-15
—
—
—
—
—
—
—
≤±75
≤ 20
≤25
≤ 40
< -40
≤ -20
N/A
KHz
KHz/50 µs
KHz
KHz
dBm
dBm
dBm
Table 17: Enhanced data rate transmitter performance 25°C (3.3V)
Test Parameter
Relative Transmit Power
2-DH5
Max Carrier Frequency
Stability |wo|
3-DH5
Max Carrier Frequency
Stability |wi|
Max Carrier Frequency
Stability |w0+wi|
RMS DEVM
Peak DEVM
99% DEVM
Min
—
—
Typ
Max
—
—
BT Spec.
Unit
dBm
≤ ±10
KHz
2-DH5
—
—
3-DH5
—
—
≤ ±75
KHz
2-DH5
—
—
3-DH5
—
—
≤ ±75
KHz
2-DH5
—
—
≤ 20
3-DH5
—
—
≤13
2-DH5
—
—
≤ 35
3-DH5
—
—
≤ 25
2-DH5
—
12
—
≤ 30
—
—
—
—
12
99
TBD
TBD
—
—
—
—
≤ 20
≥ 99
< -40
≤ -20
dBm
dBm
3-DH5
EDR Differential Phase Encoding
F≥ ± 3MHz
Adjacent Channel Power
F = ± 2MHz
Table 18: Basic rate receiver performance at 3.3V
Test Parameter
Sensitivity (1DH5)
BER ≤ 0.1%
Min
—
Typ
-95
Max
-92
BT Spec.
≤ -70
Unit
dBm
Maximum Input
BER ≤ 0.1%
-20
-10
—
≥ -20
dBm
Co-Channel
—
10
11
11
C/I (± 1 MHz)
—
-4
dB
C/I (± 2 MHz)
—
-45
—
-30
dB
C/I (± 3 MHz)
—
-49
—
-40
dB
-39
-30
≥ -39
dBm
Carrier-to-Interferer Ratio
(C/I)
Maximum Level of Intermodulation Interferers
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Datasheet
Table 19: Enhanced data rate receiver performance 3.3V
Min
Typ
Max
Bluetooth
Specification
Unit
π/4 DQPSK
—
-94
-91
≤ -70
dBm
8 DPSK
—
-88
-85
≤ -70
dBm
π/4 DQPSK
8 DPSK
π/4 DQPSK
8 DPSK
π/4 DQPSK
8 DPSK
π/4 DQPSK
8 DPSK
π/4 DQPSK
8 DPSK
30-2000MHz
2-2.399GHz
2.484-3GHz
3-12.75GHz
-20
-20
—
—
—
—
—
—
—
—
—
—
—
—
—
—
10
16
-9
-6
-47
-42
-51
-48
-12.5
-12.4
-18
-2.6
—
—
13
20
-30
-25
-40
-33
—
—
—
—
≥ -20
≥ -20
≤ ±13
≤ ±20
≤0
≤5
≤ -30
≤ -25
≤ -40
≤ -33
—
—
—
—
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
Test Parameter
Sensitivity (BER ≤0.01%)
Maximum Input (BER ≤0.1%)
Co-Channel C/I (BER ≤0.1%)
Adjacent Channel C/I (1MHz)
Second Adjacent Channel C/I
(2MHz)
Third Adjacent Channel C/I
(3MHz)
Out-of-band blocking
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SU60-SIPT
Datasheet
10
HOST INTERFACE SPECIFICATIONS
10.1 SDIO Specifications
The 60-SIPT series SDIO host interface pins are powered from the VIO_SD voltage supply. The SDIO electrical
specifications are identical for the 1-bit SDIO and 4-bit SDIO modes.
10.1.1
Default Speed, High-speed Modes
Figure 2: SDIO protocol timing diagram--- default mode (3.3V)
Figure 3: SDIO protocol timing diagram--- High-Speed mode (3.3V)
Note:
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 20: SDIO timing requirements
Symbol
fPP
Parameter
Clock Frequency
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Condition
Default Speed
High-Speed
Min.
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Typ.
Max.
25
50
Unit
MHz
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SU60-SIPT
Datasheet
Symbol
Parameter
TODLY
Output delay time
CL 40pF (1 card)
Condition
Default Speed
High-Speed
Default Speed
High-Speed
Default Speed
High-Speed
Default Speed
High-Speed
Default Speed
High-Speed
TOH
Output hold time
High-Speed
TWL
Clock low time
TWH
Clock high time
TISU
Input Setup time
TIH
Input Hold time
10.1.2
≦
Min.
10
10
Typ.
Max.
14
14
Unit
ns
ns
ns
ns
ns
ns
SDR12, SDR25, SDR50 Mode (up to 100MHz) (1.8V)
Figure 4: SDIO protocol timing Diagram--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)
Note:
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 21: SDIO timing requirements--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)
Symbol
fPP
TISU
TIH
TCLK
TCR, TCF
Parameter
Clock Frequency
Condition
SDR12/25/50
Min.
25
Typ.
Max.
100
Unit
MHz
Input setup time
Input Hold time
Clock Time
Raise time, Fall time
TCR, TCF <2ns (max) at 100MHz
CCARD=10pF
SDR12/25/50
SDR12/25/50
SDR12/25/50
0.8
10
--
40
ns
ns
ns
SDR12/25/50
0.2*TCLK
ns
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SU60-SIPT
Datasheet
Symbol
TODLY
TOH
10.1.3
Parameter
Output delay time
CL 30pF
Output hold time
CL=15pF
Condition
≦
Min.
Typ.
Max.
Unit
SDR12/25/50
7.5
ns
SDR12/25/50
1.5
ns
SDR104 Mode (208MHz) (1.8V)
Figure 5: SDIO protocol timing Diagram--- SDR104 modes (up to 208 MHz) (1.8V)
Note:
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 22: SDIO timing requirements--- SDR104 modes (up to 208MHz) (1.8V)
Symbol
fPP
TISU
TIH
TCLK
TCR, TCF
TOP
TODW
Parameter
Clock Frequency
Condition
SDR104
Input setup time
Input Hold time
Clock Time
Raise time, Fall time
TCR, TCF <0.96ns (max) at 208MHz
CCARD=10pF
Card Output phase
Output timing pf variable data
window
SDR104
SDR104
SDR104
SDR104
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SDR104
SDR12/25/50
Min.
Typ.
Max.
208
Unit
MHz
1.4
0.8
4.8
--
ns
ns
ns
0.2*TCLK
ns
10
ns
2.88
ns
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Datasheet
10.1.4
DDR50 Mode (50MHz) (1.8V)
Figure 6: SDIO CMD timing diagram--- DDR50 modes (50 MHz) (1.8V)
Figure 7: SDIO DAT[3:0] timing Diagram--- DDR50 modes (50 MHz) (1.8V)
Note:
In DDR50 mode, DAT[3:0] lines are samples on both edges pf the clock (not applicable for CMD line)
Table 23: SDIO timing requirements – DDR50 modes (50 MHz)
Symbol
Clock
TCLK
TCR, TCF
Clock Duty
Parameter
Clock time
50MHz (max) between rising edge
Rise time, fall time
TCR, TCF <4.00ns (max) at 50MHz.
CCARD=10pF
--
CMD Input (referenced to clock rising edge)
Input setup time
TIS
CCARD
≦10pF (1 card)
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Condition
Min.
Typ.
Max.
Unit
DDR50
20
--
--
ns
DDR50
--
--
0.2*TCLK
ns
DDR50
45
--
55
DDR50
--
--
ns
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SU60-SIPT
Datasheet
Symbol
Parameter
Condition
Input hold time
TIH
DDR50
CCARD
CMD Output (referenced to clock rising and failing edge)
Output delay time during data transfer
mode
TODLY
DDR50
CL 30pF (1 card)
≦10pF (1 card)
≦
Output hold time
DDR50
CL≥15pF (1 card)
DAT[3:0] Input (referenced to clock rising and failing edges)
Input setup time
TIS2X
DDR50
CCARD
Input hold time
TIH2X
DDR50
CCARD
TOHLD
≦10pF (1 card)
≦10pF (1 card)
DAT[3:0] Output (referenced to clock rising and failing edges)
Output delay time during data transfer
DDR50
TODLY2X (max) mode
CL 25pF (1 card)
≦
TODLY2X (min)
Output hold time
CL≥15pF (1 card))
DDR50
Min.
Typ.
Max.
Unit
0.8
--
--
ns
--
--
13.7
ns
1.5
--
--
ns
--
--
ns
0.8
--
--
ns
--
--
7.0
ns
1.5
--
--
ns
10.2 PCI Express Specifications
The PCI Express host interface pins are powered from the 1.8V generated by the PMU inside the 60-SIPT series.
10.2.1
Differential TX Output Electricals
Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 24: PCI Express TX Output Specifications – 2.5GT/s
Symbol
UI
VTX-DIFF-PP
VTX-DIFF-PP-LOW
VTX-DE-RATIO-3.5dB
TTX-EYE
Parameter
Unit interval (UI)
The specified UI is equivalent to a tolerance of +/300ppm for each Refclk source. Period does not
account for SSC induced variations.
Differential peak-to-peak TX voltage swing
VTX-DIFF-PP=2* VTXD+ – VTXD-│
│
Low power differential peak-to-peak TX voltage
swing
VTX-DIFF-PP=2* VTXD+ – VTXD-│
Tx de-emphasis level ratio (3.5dB)
Tx eye including all jitter sources
│
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Min.
Typ.
Max.
399.88
400.12
0.8
1.2
0.4
1.2
3.0
0.75
4.0
UI
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Datasheet
Symbol
TTX-EYE-MEDIAN-toMAX-JITTER
TTX-RISE-FALL
RLTX-DIFF
RLTX-CM
VTX-CM-AC-P
ITX-SHORT
VTX-DC-CM
VTX-CM-DC-ACTIVEIDLE-DELTA
VTX-IDLE-DIFF-AC-p
TTX-IDLE-MIN
TTX-IDLE-SET-TO-IDLE
TTX-IDLE-TO-DIFF-DATA
TCROSLINK
CTX
Note:
Parameter
Maximum time between jitter median and
maximum deviation from median
Tx rise/fall time
Measured differentially from 20% to 80%
Tx package plus Si differential return loss
Tx package plus Si common mode return loss
Tx AC common mode voltage
Tx short circuit current limit
Min.
Typ.
Max.
Unit
0.125
UI
0.125
UI
10
20
90
dB
dB
mV
mA
3.6
100
mV
Electrical idle differential peak output voltage
Minimum time spent in electrical idle
Maximum time to transition to a valid electrical
idle after sending an electrical idle ordered set
Maximum time to transition to valid diff signalling
after leaving electrical idle
20
20
mV
ns
ns
ns
Crosslink random timeout
AC coupling capacitor
75
1.0
200
ms
nF
Tx DC common mode voltage
Absolute delta of DC common mode voltage
during L0 and electrical idle.
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 25: PCI Express TX Output Specifications - 5GT/s
Symbol
UI
VTX-DIFF-PP
VTX-DIFF-PP-LOW
VTX-DE-RATIO-3.5dB
VTX-DE-RATIO-6dB
TMIN-PULSE
TTX-EYE
TTX-HF-DJ-DD
Parameter
Unit interval (UI)
The specified UI is equivalent to a tolerance of +/300ppm for each Refclk source. Period does not
account for SSC induced variations.
Differential peak-to-peak TX voltage swing
VTX-DIFF-PP=2* VTXD+ – VTXD-│
│
Low power differential peak-to-peak TX voltage
swing
VTX-DIFF-PP=2* VTXD+ – VTXD-│
Tx de-emphasis level ratio (3.5dB)
Tx de-emphasis level ratio (6dB)
Instantaneous lone pulse width
Measured relative to rising/failing pulse
Tx eye including all jitter sources
Tx deterministic jitter > 1.5MHz
Deterministic jitter only
│
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Min.
Typ.
Max.
199.94
200.06
0.8
1.2
0.4
1.2
3.0
5.5
4.0
6.5
0.9
UI
0.75
UI
0.15
UI
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Datasheet
Symbol
TTX-LF-RMS
TTX-RISE-FALL
RLTX-DIFF
RLTX-CM
VTX-CM-AC-PP
ITX-SHORT
VTX-DC-CM
VTX-CM-DC-ACTIVEIDLE-DELTA
VTX-IDLE-DIFF-AC-p
VTX-IDLE-DIFF-DC
VTX-RCVDETECT
TTX-IDLE-MIN
TTX-IDLE-SET-TO-IDLE
TTX-IDLE-TO-DIFF-DATA
TCROSLINK
CTX
10.2.2
Parameter
Tx RMS jitter<1.5MHz
Total energy measured over a 10KHz-1.5MHz
range
Tx rise/fall time
Measured differentially from 20% to 80%
Tx package plus Si differential return loss
(0.05-1.25GHz)
(1.25-2.5GHz)
Tx package plus Si common mode return loss
Min.
Typ.
Max.
Unit
3.0
Ps RMS
0.15
UI
10
dB
dB
100
90
3.6
mV
mA
100
mV
20
mV
mV
Voltage change allowed during receiver detection
Minimum time spent in electrical idle
Maximum time to transition to a valid electrical
idle after sending an electrical idle ordered set
Maximum time to transition to valid diff signalling
after leaving electrical idle
20
600
mV
ns
ns
ns
Crosslink random timeout
AC coupling capacitor
75
1.0
200
ms
nF
Tx AC common mode voltage
Tx short circuit current limit
Tx DC common mode voltage
Absolute delta of DC common mode voltage
during L0 and electrical idle.
Electrical idle differential peak output voltage
VTX-IDLE-DIFF-DC= VTX-IDLE-D+ VTX-IDLE-D20mV
│
–
│≦
DC Electrical idle differential output voltage
=│V
–V
│≦5mV
TX-IDLE-DIFF-DC
TX-IDLE-D+
TX-IDLE-D-
Differential RX input Electricals
Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 26: PCI Express RX Output Specifications – 2.5GT/s
Symbol
UI
VRX-DIFF-PP-CC
VRX-DIFF-PP-DC
Parameter
Unit interval (UI)
The specified UI is equivalent to a tolerance of +/300ppm for each Refclk source. Period does not
account for SSC induced variations.
Differential RX peak-to-peak voltage for common
Refclk RX architecture
Differential RX peak-to-peak voltage for data
clocked Refclk RX architecture
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Min.
Typ.
Max.
399.88
400.12
0.175
1.2
0.175
1.2
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SU60-SIPT
Datasheet
Symbol
TRX-EYE
TRX-EYE-MEDIAN-toMAX-JITTER
VRX-CM-ACp
RLRX-DIFF
RLRX-CM
ZRX-DIFF-DC
ZRX-DC
ZRX-HIGH-IMP-DC
VRX-IDLE-DET-DIFF-p-p
TRX-IDLE-DIFFENTERTIME
LRX-SKEW
Parameter
Rx eye time opening
Minimum eye time at Rx pins to yield a 10-12 BER
Maximum time delta between median and
deviation from median
AC peak common mode input voltage
Differential return loss
Common mode return loss
DC differential input impedance
Min.
Typ.
Max.
Unit
0.4
UI
0.3
UI
15
80
100
150
3.6
120
mV
dB
dB
Ω
DC input impedance
Powered down DC input impedance
Electrical idle detect threshold
Unexpected electrical idle enter detect threshold
integration time
Total Skew
40
200
65
50
60
175
Ω
KΩ
mV
10
ms
20
ns
Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Table 27: PCI Express RX Output Specifications – 5GT/s
Symbol
UI
VRX-DIFF-PP-CC
VRX-DIFF-PP-DC
Parameter
Unit interval (UI)
The specified UI is equivalent to a tolerance of +/300ppm for each Refclk source. Period does not
account for SSC induced variations.
Differential RX peak-to-peak voltage for common
Refclk RX architecture
Differential RX peak-to-peak voltage for data
clocked Refclk RX architecture
Min.
Typ.
Max.
Unit
199.94
200.06
0.12
1.2
0.1
1.2
0.4
UI
0.34
UI
0.3
UI
ps
0.24
UI
TRX-MIN-PULSE
VRX-CM-ACp
RLRX-DIFF
RLRX-CM
Maximum Rx inherent total timing error for
common Refclk RX architecture
Maximum Rx inherent total timing error for data
clocked RX architecture
Maximum Rx inherent deterministic timing error
for common Refclk RX architecture
Maximum Rx inherent deterministic timing error
for data clocked RX architecture
Minimum width pulse at Rx
AC peak common mode input voltage
Differential return loss
Common mode return loss
0.6
15
1-
150
3.6
UI
mV
dB
dB
ZRX-DIFF-DC
ZRX-DC
DC differential input impedance
DC input impedance
80
40
100
50
120
60
Ω
Ω
TRX-TJ-CC
TRX-TJ-DC
TRX-DJ-DD-CC
TRX-DJ-DD-DC
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SU60-SIPT
Datasheet
Symbol
Parameter
Powered down DC input impedance
ZRX-HIGH-IMP-DC
VRX-IDLE-DET-DIFF-p-p
TRX-IDLE-DIFFENTERTIME
Electrical idle detect threshold
Unexpected electrical idle enter detect threshold
integration time
LRX-SKEW
Total Skew
Min.
200
Typ.
Max.
Unit
KΩ
65
175
mV
10
ms
20
ns
10.3 USB Specifications
10.3.1
USB LS Driver and Receiver Parameters
Notes:
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
The load is 100Ω differential for these parameters, unless other specified.
Table 28: USB LS Driver and Receiver Specifications
Symbol
Parameter
BR
Baud rate
BRPPM
Baud rate tolerance
Driver Specifications
VOH
VOL
VCRS
TLR
TLF
TLRFM
TUDJ1
TUDJ2
Output signal ended high
Defined with 1.425KΩ pull-up resistor to 3.6V
Output signal ended low
Defined with 1.425KΩ pull-up resistor to ground
Output signal crossover voltage
Data fall time
Defined from 10% to 90% for raise time and 90% to 10%
for fall time
Data rise time
Defined from 10% to 90% for raise time and 90% to 10%
for fall time
Rise and fall time matching
Source jitter total: to next transition
*Including frequency tolerance. Timing difference
between the differential data signals.
*Defined at crossover point of differential signals
Source jitter total: for paired transitions
*Including frequency tolerance. Timing difference
between the differential data signals.
*Defined at crossover point of differential signals
Min.
-15000
Typ.
1.5
Max.
15000
Unit
Mbps
ppm
2.8
3.6
0.0
0.3
2.0
1.3
75.0
300.0
ns
75.0
300.0
ns
80.0
125.0
-95
95
ns
-150
150
ns
Receiver Specifications
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Datasheet
VIH
VIL
Input signal ended high
Input signal ended low
2.0
0.8
VDI
Differential input sensitivity
0.2
10.3.2
USB FS Driver and Receiver Parameters
Notes: Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
The load is 100Ω differential for these parameters, unless other specified.
Table 29: USB FS Driver and Receiver Specifications
Symbol
BR
BRPPM
Parameter
Baud rate
Baud rate tolerance
Driver Specifications
Output signal ended high
VOH
Defined with 1.425KΩ pull-up resistor to 3.6V
Output signal ended low
VOL
Defined with 1.425KΩ pull-up resistor to ground
VCRS
TFR
TFL
TDJ1
TDJ2
TFDEOP
Output signal crossover voltage
Output raise time
Defined from 10% to 90% for raise time and 90% to
10% for fall time
Output fall time
Defined from 10% to 90% for raise time and 90% to
10% for fall time
Source jitter total: to next transition
*Including frequency tolerance. Timing difference
between the differential data signals.
*Defined at crossover point of differential signals
Source jitter total: for paired transitions
*Including frequency tolerance. Timing difference
between the differential data signals.
*Defined at crossover point of differential signals
Source jitter for differential transition to SE0
transition. Defined at crossover point of differential
signals
Receiver Specifications
VIH
Input signal ended high
VIL
Input signal ended low
VDI
Differential input sensitivity
TJR1
Receiver jitter: to next transition
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Min.
-2500
Typ.
12.0
Max.
2500
Unit
Mbps
ppm
2.8
3.6
0.0
0.3
2.0
1.3
-4.0
20.0
ns
-4.0
20.0
ns
-3.5
3.5
ns
-4.0
4.0
ns
-2.0
5.0
ns
2.0
0.2
-18.5
0.8
18.5
ns
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SU60-SIPT
Datasheet
Symbol
Parameter
Defined at crossover point of differential data
signals
Receiver jitter: for paired transitions
Defined at crossover point of differential data
signals
TJR2
10.3.3
Min.
Typ.
Max.
Unit
-9.0
9.0
ns
USB HS Driver and Receiver Parameters
Notes: Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
The load is 100Ω differential for these parameters, unless other specified.
Table 30: USB HS Driver and Receiver Specifications
Symbol
BR
BRPPM
Parameter
Baud rate
Baud rate tolerance
Driver Specifications
VHSOH
Data signal high
VHSOL
Data signal low
Data rise time
THSR
Defined from 10% to 90% for raise time and 90% to 10%
for fall time
Data fall time
THSF
Defined from 10% to 90% for raise time and 90% to 10%
for fall time
Receiver Specifications
VHSCM
Input signal ended low
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Min.
-500
Typ.
480
Max.
500
Unit
Mbps
ppm
360
-10
440
10
mV
mV
500
ns
-500
ns
-50
500
mV
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Datasheet
10.4 PCM Interface Specifications
Figure 8: PCM Timing Specification – Master Mode
Table 31: PCM Timing Specification – Master Mode
Symbol
Parameter
FBCLK
Min.
Typ.
2/2.048
Max.
Unit
MHz
Duty CycleBCLK
TBCLK rise/fall
TDO
TDISU
TDIHO
TBF
0.4
20
15
0.5
0.6
15
15
ns
ns
ns
ns
ns
Min.
0.4
Typ.
2/2.048
0.5
Max.
0.6
Unit
MHz
ns
Figure 9: PCM Timing Specification – Slave Mode
Table 32: PCM Timing Specification – Slave Mode
Symbol
FBCLK
Duty CycleBCLK
TBCLK rise/fall
Parameter
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SU60-SIPT
Datasheet
Symbol
TDO
Min.
TDISU
TDIHO
TBFSU
TBFHO
15
10
15
10
11
Parameter
Typ.
Max.
30
Unit
ns
ns
ns
ns
ns
PIN DEFINITIONS
Note: AVDD18 is generated by PMU internally. No need to power from outside the SIP.
Table 33: Pin definitions of 60-SIPT series
Pin
Name
Type
PDn
GND
GND
ANT0 (Wi-Fi/BT)
A,I/O
10
11
GND
GND
GND
GND
GND
GND
GND
12
ANT1 (Wi-Fi only)
A,I/O
13
14
GND
GND
15
CONFIG_HOST2
I, PU
16
CONFIG_HOST1
I, PU
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Voltage
Ref.
If Not
Used
Description
Full Power-Down (input) (Active low)
0=full power-down mode; 1=normal mode
PDn can accept an input range from 1.8V to 3.6V
PDn must be high for normal operation. Please
connect to pin-32 (1.8V_OUT) through 49.9KΩ.
Ground
Ground
RF Transmit/Receive
Wi-Fi and BT share the same path.
Ground
Ground
Ground
Ground
Ground
Ground
Ground
RF Transmit/Receive
Wi-Fi only
Ground
Ground
Host interface configuration setting.
Detail configuration table are shown in Table 32
AVDD18 To set a configuration bit to “0”, attach a 100kΩ
resistor from the pin to ground.
No external circuitry is required to set a
configuration bit to “1”.
Host interface configuration setting.
Detail configuration table are shown in Table 32
AVDD18
To set a configuration bit to “0”, attach a 100kΩ
resistor from the pin to ground.
34
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GND
GND
50Ω
Load
GND
GND
GND
GND
GND
GND
GND
50Ω
Load
GND
GND
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SU60-SIPT
Datasheet
Pin
Name
Type
17
CONFIG_HOST0
I, PU
18
GND
19
PCM_CLK
I/O
20
PCM_DOUT
21
PCM_SYNC
I/O
22
23
24
25
26
PCM_DIN
GPIO0
GND
PCIE_WAKEn
PCIE_CLKREQn
I/O
I/O
I/O
27
PCIE_PERSTn
I, PD
28
PCIE_W_DISABLEn
I, PU
31
LTE_SOUT/
JTAG_TDO
LTE_SIN/
JTAG_TDI
VIO
O, PD
O, PD
I, PD
I, PD
Power
32
1.8V_OUT
Power
33
GND
34
32KHz
I, PU
35
36
37
38
GND
PCIE_RCLK_N
PCIE_RCLK_P
GND
29
30
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Voltage
Ref.
If Not
Used
Description
No external circuitry is required to set a
configuration bit to “1”.
Host interface configuration setting.
Detail configuration table are shown in Table 32
AVDD18 To set a configuration bit to “0”, attach a 100kΩ
resistor from the pin to ground.
No external circuitry is required to set a
configuration bit to “1”.
Ground
PCM Clock Signal (Optimal)
VIO
Optimal clock used for some codecs.
Output if Master mode; Input if Slave mode.
VIO
PCM Data
PCM Sync Pulse Signal
VIO
Output if Master mode; Input if Slave mode.
VIO
PCM Data
VIO
General purpose I/O pin.
Ground
VIO
PCIe wake signal (input/output) (active low)
VIO
PCIe clock request (input/output) (active low)
PCIe host indication to reset the device (input)
VIO
(active low)
PCIe host indication to disable the WLAN function
VIO
of the device (input) (active low)
Serial data to external LTE device/
VIO
JTAG Test Data Out (TDO)
Serial data from external LTE device/
VIO
JTAG Test Data Input (TDI)
1.8V/2.5V/3.3V Digital I/O Power Supply
1.8V output from 60-SIPT series.
Used to pull-up the PDn pin for POR.
Note:
Do NOT used as power source for other circuits.
Ground
Sleep Clock Input
An external sleep clock of 32.768KHz with
VIO
minimum +/-250ppm is required for power saving
mode
Ground
AVDD18 PCIe Differential Clock Input-Negative
AVDD18 PCIe Differential Clock Input-Positive
Ground
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GND
N/C
N/C
N/C
N/C
N/C
GND
N/C
GND
N/C
N/C
N/C
N/C
N/C
GND
GND
N/C
N/C
GND
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SU60-SIPT
Datasheet
Name
Type
PCIE_TX_P
PCIE_TX_N
GND
PCIE_RX_N
PCIE_RX_P
GND
USB_DN
USB_DP
GND
I/O
I/O
Voltage
Ref.
AVDD18
AVDD18
AVDD18
AVDD18
3V3
3V3
48
3V3
Power
49
3V3
Power
50
GND
51
PMU_EN
52
53
54
55
56
57
58
59
VIO_SD
SDIO_DATA0
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
SDIO_CMD
SDIO_CLK
GND
60
UART_TXD
61
62
UART_RXD
UART_CTSn
63
UART_RTSn
64
65
66
GND
JTAG_TCK
JTAG_TMS
Power
I/O, PU
I/O, PU
I/O, PU
I/O, PU
I/O, PU
I, PU
O,
WPU
I, WPU
I, PU
O,
WPU
I, PU
I, PU
Pin
39
40
41
42
43
44
45
46
47
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Description
If Not
Used
N/C
N/C
GND
N/C
N/C
GND
N/C
N/C
GND
VIO_SD
VIO_SD
VIO_SD
VIO_SD
VIO_SD
VIO_SD
PCIe Transmit Data-Positive
PCIe Transmit Data-Negative
Ground
PCIe Receive Data-Negative
PCIe Receive Data-Positive
Ground
USB Differential Data-Negative
USB Differential Data-Positive
Ground
3.3V module power supply
Note: A 10u MLCC is needed for this pin. Place the
capacitor close to this pin as possible.
Ref. parts: GRM188R60J106ME47D (MURATA)
or CC0805KKX7R6BB106 (YAGO)
3.3V module power supply
Note: A 10u MLCC is needed for this pin. Place the
capacitor close to this pin as possible.
Ref. parts: GRM188R60J106ME47D (MURATA)
or CC0805KKX7R6BB106 (YAGO)
Ground
Enable input for all Regulators inside the 60-SIPT
series when it is “H” state. The 60-SIPT will be off
when it is “L” state.
Note: DO NOT float this pin. Pull-up to 3.3V with
100K for normal operation.
1.8V/3.3V Digital I/O SDIO Power Supply
SDIO 4-bit Mode DATA line Bit[0]
SDIO 4-bit Mode DATA line Bit[1]
SDIO 4-bit Mode DATA line Bit[2]
SDIO 4-bit Mode DATA line Bit[3]
SDIO 4-bit Mode Command/Response
SDIO 4-bit Mode Clock Input
Ground
N/C
N/C
N/C
N/C
N/C
N/C
GND
VIO
UART Serial Data Output
N/C
VIO
VIO
UART Serial Data Input
UART Clear to Send (Active low)
N/C
N/C
VIO
UART Request to Send (Active low)
N/C
VIO
VIO
Ground
JTAG Test Clock (input)
JTAG Test Controller Select (input)
GND
N/C
N/C
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GND
100K,
PU
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SU60-SIPT
Datasheet
Pin
67
68
6984
12
Name
Type
LED_OUT_BT
LED_OUT_WLAN
O, PU
O, PU
Voltage
Ref.
VIO
VIO
GND
Description
LED indicator for BT with 10mA drive capability.
LED indicator for WLAN with 10mA drive capability
Thermal Ground Pad
(Important for RF performance and thermal
dissipation; please flow the reference design)
If Not
Used
N/C
N/C
GND
HOST CONFIGURATION OPTIONS
60-SIPT series support various host configurations for WLAN and BT. Its detail configurations are shown in
following table (Error! Reference source not found.).
Table 34: Wi-Fi host interface configuration table
CONFIG_HOST [2-0]
WLAN
BT/BLE
Note
000
001
010
SDIO
SDIO
PCIe
UART
SDIO
USB 2.0
Initial USB 2.0 PHY and COM PHY PCIe portion
011
100
101
PCIe
USB 2.0
USB 2.0
UART
UART
USB 2.0
Initial only COM PHY PCIe portion
Initial USB 2.0 PHY
Initial only USB 2.0 PHY
13
MECHANICAL SPECIFICATIONS
Module dimensions of 60-SIPT series is 13 x 14 x 1.87 mm. Detail drawings are shown in Figure 10.
Figure 10: Mechanical drawing - 60-SIPT
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SU60-SIPT
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Figure 11: Module dimension of 60-SIPT series
Note:
The Wi-Fi MAC address is located on the product label. The BT MAC address always immediately
follows the Wi-Fi MAC address. Therefore, the BT MAC address is the Wi-Fi MAC address plus one.
TOP VIEW
Figure 12: Recommended ground via
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Recommend minimal via size and placement for grounding and thermal dissipation. Please double the ground
via number when using laser via on HID process. More ground via and the use of 1-oz copper is recommended in
our design to get better thermal dissipation.
Note: When soldering, the stencil thickness should be ≥ 0.1 mm.
14
RF LAYOUT DESIGN GUIDELINES
The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your
device.
Do not run antenna cables directly above or directly below the radio.
Do not place any parts or run any high speed digital lines below the radio.
If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the
devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between
these two antennas.
Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird radio
from the antenna. In addition, do not place antennas directly above or directly below the radio.
Laird recommends the use of a double-shielded cable for the connection between the radio and the
antenna elements.
Be sure to put a 10uF capacitor on EACH 3.3V power pin. Also, place that capacitor to the pin as close as
possible to make sure the internal PMU working correctly.
Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.
To get maximum throughput when operate at MIMO 2x2, two antennas with at least 25 dB isolation is
recommended.
To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic
objects or components.
15
RECOMMENDED STORAGE, HANDLING, BAKING, AND REFLOW PROFILE
15.1 Required Storage Conditions
15.1.1
Prior to Opening the Dry Packing
The following are required storage conditions prior to opening the dry packing:
Normal temperature: 5~40℃
Normal humidity: 80% (Relative humidity) or less
Storage period: One year or less
Note: Humidity means Relative Humidity.
15.1.2
After Opening the Dry Packing
The following are required storage conditions after opening the dry packing (to prevent moisture absorption):
Storage conditions for one-time soldering:
– Temperature: 5~25℃
– Humidity: 60% or less
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– Period: 48 hours or less after opening
Storage conditions for two-time soldering
Storage conditions following opening and prior to performing the 1st reflow:
–
–
–
Temperature: 5~25℃
Humidity: 60% or less
Period: 48 hours or less after opening
Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow
–
–
–
15.1.3
Temperature: 5~25℃
Humidity: 60% or less
Period: 48 hours or less after completion of the 1st reflow
Temporary Storage Requirements after Opening
The following are temporary storage requirements after opening:
Only re-store the devices once prior to soldering.
Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing
again using heat-sealing.
The following indicate the required storage period, temperature, and humidity for this temporary storage:
1. Storage temperature and humidity
Temperature: 5-25°C
Temperature: 5-40°C
Humidity: 60% or less
Humidity: 80% or less
***
Temperature: 5-40°C
Temperature: 5-25°C
Humidity: 80% or less
Humidity: 60% or less
***
*** - External atmosphere temperature and humidity of the dry packing
2. Storage period
– X1+X2 – Refer to After Opening the Dry Packing storage requirements.
– Y – Two weeks or less.
15.2 Baking Conditions
Baking conditions and processes for the SSD50NBT follow the J-STD-033 standard which includes the following:
The calculated shelf life in a sealed bag is 12 months at <40℃ and <90% relative humidity.
Once the packaging is opened, the SiP must be mounted (per MSL3/Moisture Sensitivity Level 3) within 168
hours at <30℃ and <60% relative humidity.
If the SiP is not mounted within 168 hours or if, when the packaging is opened, the humidity indicator card
displays >10% humidity, then the product must be baked for 48 hours at 125℃ (±5℃).
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SU60-SIPT
Datasheet
15.3 Surface Mount Conditions
The following soldering conditions are recommended to ensure device quality.
15.3.1
Soldering
Note: When soldering, the stencil thickness should be ≥ 0.1 mm.
Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen
environment)
Measuring point – IC package surface
Temperature profile:
Figure 13 Temperature profile
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Datasheet
15.3.2
Cautions When Removing the SIP from the Platform for RMA
Bake the platform before removing the SIP from the platform. Reference baking conditions.
Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.
Suggestion conditions:
One-side component platform:
– Set the hot plate at 280°C.
– Put the platform on the hot plate for 8~10 seconds.
– Remove the SIP from platform.
Two-side components platform:
– Use two hot air guns
– On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable
distance from the platform PCB.
– On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be
removed from platform PCB.
Remove Nozzle
Platform
SIP
Pre-heat
Remove the residue solder under the bottom side of SIP.
(Not accepted for RMA)
(Accepted for RMA analysis)
SIP with residue solder on the bottom
SIP without residue solder on the bottom
Remove and clean the residue flux is needed.
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Datasheet
15.3.3
Precautions for Use
Opening/handing/removing must be done on an anti-ESD treated workbench.
All workers must also have undergone anti-ESD treatment.
The devices should be mounted within one year of the date of delivery.
16
REGULATORY
16.1 Certified Antennas
Type
Connector
2400~2483.5MHz
5150~5250MHz 5250~5350MHz
5470~5725MHz 5725~5850MHz
Laird/NanoBlade-IP04
PCB Dipole
IPEX U.FL
2 dBi (2.4-2.5 GHz), 3.9 dBi (5.15-5.35 GHz), 4 dBi
(5.6 GHz)
Laird/MAF95310 Mini NanoBlade
Flex
PCB Dipole
IPEX U.FL
2.79 dBi @ 2.4 GHz, 3.38 dBi @ 5 GHz
Magnetic
Dipole
IPEX U.FL
2.5dBi (2.390-2.490),3.5 dBi (4.900-5.100),3.5 dBi
(5.150-5.350),3.5 dBi (5.70-5.900)
PIFA
IPEX U.FL
2.5dBi@2.4GHz, 3dBi@5GHz
Dipole
IPEX U.FL
2dBi@2.4GHz, 2dBi@5GHz
Model
Ethertronics/WLAN_1000146
LSR/FlexPIFA 001-0016
LSR/001-0009
17
FCC AND IC REGULATORY
Model
60-SIPT series
US/FCC
SQG-SU60SIPT
CANADA/IC
3147A-SU60SIPT
The SSD50NBT has been designed to pass certification with the antenna listed below. The required antenna
impedance is 50 ohms.
Peak gain (dBi)
Model
Type
Connector 2400~2483.5 5150~5250 5250~5350 5470~5725 5725~5850M
MHz
MHz
MHz
MHz
Hz
Laird/NanoBlade-IP04
PCB Dipole
IPEX U.FL
2.0 dBi
Laird/MAF95310 Mini
NanoBlade Flex
PCB Dipole
IPEX U.FL
2.79 dB
Magnetic
Dipole
IPEX U.FL
2.5 dBi
3.5 dBi
PIFA
IPEX U.FL
2.5dBi
3.0dBi
Dipole
IPEX U.FL
2.0dBi
2.0 dBi
Ethertronics/WLAN_1000146
LSR/FlexPIFA 001-0016
LSR/001-0009
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3.9 dBi
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3.9 dBi
4.0dBi
3.38dBi
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SU60-SIPT
Datasheet
17.1 FCC
17.1.1
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in an installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
Important Note
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Country Code selection feature to be disabled for products marketed to the US/Canada.
This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna,
3. For all products market in US, OEM must limit the operation channels in CH1 to CH11 for 2.4G band by
supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to
Regulatory Domain change.
If the three conditions above are met, further transmitter testing is not required. However, the OEM integrator
is still responsible for testing their end-product for any additional compliance requirements required with this
module installed.
Important Note
If these conditions cannot be met (for example certain laptop configurations or co-location with another
transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final
product. In these circumstances, the OEM integrator is responsible for re-evaluating the end product (including
the transmitter) and obtaining a separate FCC authorization.
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SU60-SIPT
Datasheet
17.1.2
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm
may be maintained between the antenna and users. The end product must be labeled in a visible area with the
following: Contains FCC ID: SQG-SSD50NBT.
17.1.3
Manual Information to the End User
The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
17.2 Industry Canada
17.2.1
Industry Canada Statement
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two
conditions:
This device may not cause interference; and
This device must accept any interference, including interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes:
l’appareil ne doit pas produire de brouillage;
l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
This radio transmitter (IC: 3147A-SSD50NBT) has been approved by Industry Canada to operate with the
antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list,
having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this
device.
Le présent émetteur radio (IC: 3147A-MSD50NBT) a été approuvé par Industrie Canada pour fonctionner avec
les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus
dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour
l'exploitation de l'émetteur.
17.2.2
Antenna Information
Peak gain (dBi)
Model
Type
Connector
Laird/NanoBlade-IP04
PCB Dipole
IPEX U.FL
2.0 dBi
Laird/MAF95310 Mini
PCB Dipole
NanoBlade Flex
IPEX U.FL
2.79 dB
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2400~2483.5 5150~5250
MHz
MHz
3.9 dBi
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5250~5350 5470~5725 5725~5850MH
MHz
MHz
3.9 dBi
4.0 dBi
3.38 dBi
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SU60-SIPT
Datasheet
Model
Type
Peak gain (dBi)
Connector
Ethertronics/WLAN_10 Magnetic
00146
Dipole
IPEX U.FL
2.5 dBi
3.5 dBi
LSR/FlexPIFA 001-0016 PIFA
IPEX U.FL
2.5 dBi
3.0 dBi
LSR/001-0009
IPEX U.FL
2.0 dBi
2.0 dBi
Dipole
Caution:
(i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co-channel mobile satellite systems;
(ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 52505350 MHz and 5470-5725 MHz shall be such that the equipment still complies with EIRP limit;
(iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 57255850 MHz shall be such that the equipment still complies with the EIRP limits specified for point-to-point and
non-point-to-point operation as appropriate; and
Operations in the 5.25-5.35GHz band are restricted to indoor usage only.
Avertissement:
(i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation
à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les
mêmes canaux;
(ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs
utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e;
(iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs
utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation
point à point et l'exploitation non point à point, selon le cas;
Les opérations dans la bande de 5.25-5.35GHz sont limités à un usage intérieur seulement.
17.2.3
Radiation Exposure Statement
This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator and your body.
17.2.4
Déclaration d'exposition aux radiations
Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.
Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.
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Datasheet
This device is intended only for OEM integrators under the following condition:
The transmitter module may not be co-located with any other transmitter or antenna.
If the condition above is met, further transmitter test is not required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module
installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.
Important Note:
If these conditions cannot be met (for example certain laptop configurations or co-location with another
transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate Canada authorization.
Note Importante:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.
17.2.5
End Product Labeling
The end product must be labeled in a visible area with the following: Contains IC: 3147A-SSD50NBT.
17.2.6
Plaque signalétique du produit final
Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: Contient des IC: 3147ASSD50NBT.
17.2.7
Manual Information to the End User
The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
17.2.8
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon
d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements
comme indiqué dans ce manuel.
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SU60-SIPT
Datasheet
18
EUROPEAN UNION REGULATORY
The SSD50NBT has been tested for compliance with relevant standards for the EU market. SSD50NBT module
was tested with antennas listed below.
Type
Connector
2400~2483.5MHz
5150~5250MHz 5250~5350MHz
5470~5725MHz 5725~5850MHz
Laird/NanoBlade-IP04
PCB Dipole
IPEX U.FL
2 dBi (2.4-2.5 GHz), 3.9 dBi (5.15-5.35 GHz), 4 dBi
(5.6 GHz)
Laird/MAF95310 Mini NanoBlade Flex
PCB Dipole
IPEX U.FL
2.79 dBi @ 2.4 GHz, 3.38 dBi @ 5 GHz
Magnetic
Dipole
IPEX U.FL
2.5dBi (2.390-2.490),3.5 dBi (4.900-5.100),3.5 dBi
(5.150-5.350),3.5 dBi (5.70-5.900)
PIFA
IPEX U.FL
2.5dBi@2.4GHz, 3dBi@5GHz
Dipole
IPEX U.FL
2dBi@2.4GHz, 2dBi@5GHz
Model
Ethertronics/WLAN_1000146
LSR/FlexPIFA 001-0016
LSR/001-0009
The OEM should consult with a qualified test house before entering their device into an EU member country to
make sure all regulatory requirements have been met for their complete device.
Reference the Declaration of Conformities listed below for a full list of the standards that the modules were
tested to. Test reports are available upon request.
18.1 EU Declarations of Conformity
This device complies with the essential requirements of the Radio Equipment directive: 2014/53/EU. The
following test methods have been applied to prove presumption of conformity with the essential requirements
of the Radio Equipment directive 2014/53/EU:
Manufacturer:
Laird
Products:
60-SIPT series
EU Directives:
2014/53/EU – Radio Equipment Directive (RED)
Reference standards used for presumption of conformity:
Article Number Requirement
Low voltage equipment safety
3.1a
RF Exposure
3.1b
3.2
Protection requirements with respect
to electromagnetic compatibility
Means of the efficient use of the
radio frequency spectrum
Reference standard(s)
EN 60950-1:2006+A11+A1:2010+A12:2011+A2 2013
EN 62311:2008
EN 50385:2002
EN 301 489-1 v2.2.0 (Draft)
EN 301 489-17 v3.2.0 (Draft)
EN 300 328 v2.1.1 (2015-02)
EN 301 893 v2.1.0 (Final Draft)
Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and
that the above product to which this declaration relates is in conformity with all the applicable essential
requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.
Place of Issue:
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
Laird
W66N220 Commerce Court, Cedarburg, WI 53012 USA
48
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
tel: +1-262-375-4400 fax: +1-262-364-2649
May 2017
Thomas T Smith, Director of EMC Compliance
Date of Issue:
Name of Authorized Person:
Signature of Authorized Person:
Maximum Output Power for Each Frequency
TBD
Software Version for Testing
SW version: P95
20.5 dBm, 5.15-5.25 GHz
20.5 dBm, 5.25-5.35 GHz
20.5 dBm, 5.47-5.725 GHz
The minimum distance between the user and/or any bystander and the radiating structure of the transmitter
is 20 cm.
5150 ~ 5350 MHz is limited to indoor used in the following countries:
19
BE
DK
IE
FR
CY
LU
NL
PT
SK
UK
NO
BG
DE
EL
HR
LV
HU
AT
RO
FI
LI
TR
CZ
EE
ES
IT
LT
MT
PL
SI
SE
IS
CH
ORDERING INFORMATION
Part Number
60-SIPT series
Description
2X2 802.11 a/b/g/n/ac with BT4.2 dual mode module.
19.1 General Comments
This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If
in doubt, ask.
Česky
[Czech]
[Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími
příslušnými ustanoveními směrnice 1999/5/ES.
Dansk
[Danish]
Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets typebetegnelse]
overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.
Deutsch
[German]
Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den
grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG
befindet.
Eesti
[Estonian]
Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of equipment]
vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele
sätetele.
English
Español
[Spanish]
Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the
essential requirements and other relevant provisions of Directive 1999/5/EC.
Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los
requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
49
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
Ελληνική
[Greek]
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ∆ΗΛΩΝΕΙ ΟΤΙ [type of equipment]
ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ
∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ.
Français
[French]
Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences
essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.
Italiano
[Italian]
Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti
essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.
Latviski
[Latvian]
Aršo[name of manufacturer /izgatavotājanosaukums] deklarē, ka[type of equipment / iekārtas
tips]atbilstDirektīvas 1999/5/EK būtiskajāmprasībām un citiemar to saistītajiemnoteikumiem.
Lietuvių
[Lithuanian]
Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas
1999/5/EB Direktyvos nuostatas.
Nederlands
[Dutch]
Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de
essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.
Malti
[Maltese]
Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet
essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.
Magyar
[Hungarian]
Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus]megfelel a vonatkozó alapvetõ követelményeknek
és az 1999/5/EC irányelv egyéb elõírásainak.
Polski
[Polish]
Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami
oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC.
Português
[Portuguese]
[Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais
e outras disposições da Directiva 1999/5/CE.
Slovensko
[Slovenian]
[Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi
relevantnimi določili direktive 1999/5/ES.
Slovensky
[Slovak]
[Menovýrobcu]týmtovyhlasuje, že[typzariadenia]spĺňazákladnépožiadavky a
všetkypríslušnéustanoveniaSmernice 1999/5/ES.
Suomi
[Finnish]
[Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä]
tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden
ehtojen mukainen.
Svenska
[Swedish]
Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga
egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.
19.1.1
Labeling Requirements
The end product must be labeled in a visible area with the following notice:
© Copyright 2017 Laird. All Rights Reserved. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are
subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents
cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird
materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or
consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
50
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
SU60-SIPT
Datasheet
which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird
Technologies™, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties.
Nothing herein provides a license under any Laird or any third party intellectual property right.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
51
© Copyright 2017 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.7
Linearized                      : No
Author                          : Connie.Lin
Create Date                     : 2017:05:24 11:08:12+08:00
Modify Date                     : 2017:07:17 13:19:31+08:00
Has XFA                         : No
XMP Toolkit                     : XMP toolkit 2.9.1-13, framework 1.6
About                           : b8858630-4289-11e7-0000-213e216a669a
Producer                        : GPL Ghostscript 8.63
Creator Tool                    : PScript5.dll Version 5.2.2
Document ID                     : b8858630-4289-11e7-0000-213e216a669a
Format                          : application/pdf
Title                           : Microsoft Word - CS-DS-SU60-SIPT-PRELIMINARY
Creator                         : Connie.Lin
Page Count                      : 51

EXIF Metadata provided by EXIF.tools