Laird Connectivity 60SIPT 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module User Manual CS DS SU60 SIPT PRELIMINARY

Laird Technologies 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module CS DS SU60 SIPT PRELIMINARY

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Users Manual_60-SIPT_SQG-60SIPT

Datasheet

60-SIPT series

Version 0.2

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

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www.lairdtech.com/wireless

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EVISION

ISTORY

Version

Date Notes Approver

0.1 24 Mar 2017 Initial preliminary version Jay White

0.2 11 May 2017

Updated some certifications; fixed typos in Channel table;

corrected RX sensitivity numbers on

11 AC (MCS9;HT80);

Descript PDn and PMU_EN function

Andrew Chen

SU60-SIPT

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ONTENTS

1 Scope ................................................................................................................................................... 4

2 Introduction ......................................................................................................................................... 4

2.1 General Description...................................................................................................................... 4

3 60-SIPT Series Features Summary ....................................................................................................... 5

4 Specifications ....................................................................................................................................... 6

5 WLAN Functional Description ............................................................................................................ 11

5.1 Overview .................................................................................................................................... 11

6 Bluetooth Functional Description ...................................................................................................... 14

7 Block Diagram .................................................................................................................................... 15

8 Electrical Characteristics .................................................................................................................... 15

8.1 Absolute Maximum Ratings ....................................................................................................... 15

8.2 Recommended Operating Conditions ........................................................................................ 16

8.3 DC Electrical Characteristics ....................................................................................................... 16

8.4 WLAN Radio Receiver Characteristics ........................................................................................ 17

8.5 WLAN Transmitter Characteristics ............................................................................................. 18

9 Bluetooth Radio Characteristics ........................................................................................................ 19

10 Host Interface Specifications ......................................................................................................... 22

10.1 SDIO Specifications ..................................................................................................................... 22

10.2 PCI Express Specifications .......................................................................................................... 26

10.3 USB Specifications ...................................................................................................................... 30

10.4 PCM Interface Specifications ..................................................................................................... 33

11 Pin Definitions ................................................................................................................................ 34

12 Host Configuration Options ........................................................................................................... 37

13 Mechanical Specifications .............................................................................................................. 37

14 RF Layout Design Guidelines .......................................................................................................... 39

15 Recommended Storage, Handling, Baking, and Reflow Profile ..................................................... 39

15.1 Required Storage Conditions ..................................................................................................... 39

15.2 Baking Conditions ....................................................................................................................... 40

15.3 Surface Mount Conditions ......................................................................................................... 41

16 Regulatory ...................................................................................................................................... 43

16.1 Certified Antennas ..................................................................................................................... 43

17 FCC and IC Regulatory .................................................................................................................... 43

17.1 FCC .............................................................................................................................................. 44

17.2 Industry Canada ......................................................................................................................... 45

18 European Union Regulatory ........................................................................................................... 48

19 Ordering Information ..................................................................................................................... 49

19.1 General Comments .................................................................................................................... 49

19.1.1 Labeling Requirements ....................................................................................................... 50

SU60-SIPT

Datasheet

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1 S

COPE

This document describes key hardware aspects of the Laird 60-SIPT series system-in-package (SiP) modules

providing either SDIO, USB2.0, or PCIe bus interface for WLAN connection and UART/PCM, SDIO/PCM,

USB2.0/PCM for Bluetooth

connection. This document is intended to assist device manufacturers and related

parties with the integration of this radio into their host devices. Data in this document is drawn from several

sources and includes information found in the Marvell 88W8997/88PG823 data sheets issued in April 2016,

along with other documents provided from Marvell.

Note that the information in this document is subject to change. Please contact Laird to obtain the most recent

version of this document.

2 I

NTRODUCTION

2.1 General Description

The 60-SIPT series SiP modules are an integrated, small form factor 2x2 MIMO

802.11 a/b/g/n/ac WLAN plus Bluetooth 4.2 dual mode device that is

optimized for low-power mobile devices. The integration of all WLAN and

Bluetooth functionality in a single package supports low cost and simple

implementation along with flexibility for platform-specific customization.

This device is pre-calibrated and integrates the complete transmit/receive RF

paths including band pass filter, diplexer, switches, reference crystal oscillator,

and power manage units (PMU).

The 60-SIPT series device supports IEEE 802.11 ac (wave 2) 2X2 receive multi-

user MIMO (MU-MIMO) spatial stream multiplexing with data rates up to MCS9 (866.7 Mbps). It also supports

Bluetooth 2.1 + EDR and Bluetooth 4.2 (Bluetooth Low Energy or BLE). Internal Wi-Fi and BT coexistence

scheme provides optimized throughput when Wi-Fi and BT working simultaneously. The device’s low power

consumption radio architecture and power manage unit (PMU) proprietary power save technologies allow for

extended battery life.

In addition, its dual 802.11 and Bluetooth radio includes full digital MAC and baseband engines that handle all

802.11 CCK/OFDM® 2.4/5GHz, and Bluetooth basic rate and EDR baseband and protocol processing.

Dual embedded low-power CPU cores minimize host loading and maximize flexibility to support customer-

specific use cases.

The 60-SIPT series SiP modules include two product SKUs which is have different supported software features.

Please check Laird Sales/FAE for further information. Order information is listed in Table 1.

Table 1: Product ordering information

Order Model Description

SU60-SIPT 802.11ac + BT4.2 60 Series hardware combined with Summit Series Enterprise software

ST60-SIPT 802.11ac + BT4.2 60 Series hardware combined with Sterling Series Professional software

SU60-SIPT

Datasheet

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3 60-SIPT

ERIES

EATURES

UMMARY

The Laird 60-SIPT series device features are described in Table 2.

Table 2: 60-SIPT series features

Feature Description

Radio Front End

Integrates the complete transmit/receive RF paths including band pass filter, diplexer,

switches, reference crystal oscillator, and power manage unit (PMU).

Supports 20/40/80MHz channel bandwidth.

WLAN/Bluetooth share one antenna.

The Bluetooth

word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Any use of such

marks by Laird is under license. Other trademarks and trade names are those of their respective owners.

Coexistence Coexistence arbitration for WLAN, Bluetooth, and LTE operation

Power

Management

Dynamic Voltage Scaling (DVS) and Adaptive Voltage Scaling (AVS) features support the

latest Marvell SoC and Processor power control scheme.

Pre-Calibration RF system tested and calibrated in production

Sleep Clock An external sleep clock of 32.768 KHz is required during power save mode

Host Interface

 SDIO 3.0 (4-bit and 1-bit), SDR 12/25/50 mode (up to 100 MHz), USB2.0 or PCIe for

WLAN

 SDIO 3.0, USB 2.0, HS-UART for Bluetooth HCI (compatible with any upper layer

Bluetooth stack)

 PCM digital audio interface for Bluetooth audio application

Strap Value

CONFIG_HOST [2-0]

WLAN Bluetooth/BLE

ROM Notes

000

SDIO

UART

001

SDIO

010 PCIe USB 2.0 Initial USB 2.0 PHY and COM PHY PCIe portion

011 PCIe UART Initial only COM PHY PCIe portion

100

USB 2.0

UART

Initial COM PHY USB 2.0

101

USB 2.0

Initial only USB

2.0 PHY

Reference

Frequency



corporates a

MHz reference frequency source in package

 An external sleep clock is recommended for minimal current consumption. If no sleep clock

input is provided, an internal sleep clock (derived from reference clock) is

used. An approximate

50 uA current increase on the 3.3V rail.

Advanced WLAN



MPDU RX (de

aggregation) and TX (aggregation) supports 802.11ac single

MPDU A

MPDU.

 Multi-BSS/Station

 Transmit rate adaption, transmit power control

 Modulation and coding scheme (MCS): 802.11ac—MCS0-9 Nsts=1 and 2.

802.11n—MCS0-15

 Dynamic frequency selection (radar detection) DFS

 20/40/80 MHz channel bandwidths support

 On-chip gain selectable LNA with optimized noise figure and power consumption

 Internal PA with optimized gain distribution for linearity and noise performance

 Support wide variety of WLAN encryption: TKIP/WEP/AES

SU60-SIPT

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Feature Description

Advanced Bluetooth



luetooth 4.2

(BDR/EDR/LE

), Bluetooth

class 1

 Support data rate: 1 Mbps(GFSK), 2 Mbps ( /4-DQPSK), 3 Mbps (8-DPSK)

 Digital audio interface with PCM/TDM interface for voice application

 Adaptive Frequency Hopping (AFH) using Package Error Rate (PER)

 Standard SDIO or UART HCI transport layer

 WLAN/Bluetooth coexistence protocol support

 Shared LNA with WLAN/Bluetooth

 Encryption (AES) support

4 S

PECIFICATIONS

Table 3: Specifications

Feature Description

Physical Interface

84-pin LGA package (including 16 thermal ground pad under the package)

Wi-Fi Interface

1-bit or 4-bit Secure Digital I/O; PCIe v3.0 Gen1/Gen2 (2.5/5 Gbps); USB 2.0

Bluetooth/BLE Interface

Host Controller Interface (HCI) using high speed UART, SDIO, USB 2.0

Strap Value

CONFIG_

HOST [

WLAN Bluetooth/

BLE

ROM Notes

000

SDIO

UART

001 SDIO SDIO -

010 PCIe USB 2.0 Initial USB 2.0 PHY and COM PHY PCIe

portion

011

PCIe

UART

Initial only COM PHY PCIe portion

100 USB 2.0

UART Initial COM PHY USB 2.0

101 USB 2.0

USB 2.0 Initial only USB 2.0 PHY

Main Chip

Marvell 88W8997 (WLAN/BT); Marvell 88PG823 (PMU)

Input Voltage Requirements

DC 3.3 V ±10%

I/O Signalling Voltage

DC 3.3 V ± 10% or DC 1.8 V ± 10%

Operating Temperature

-30° to 85°C (-22° to 185°F)

Operating Humidity

10 to 90% (non-condensing)

Storage Temperature

-40° to 85°C (-40° to 185°F)

Storage Humidity

10 to 90% (non-condensing)

Maximum Electrostatic

Discharge

Conductive 4KV; Air coupled 8KV follow EN61000-4-2

Size

13 mm (length) x 14 mm (width) x 1.87 mm (thickness)

Weight

TBD g

Wi-Fi Media

Direct Sequence-Spread Spectrum (DSSS)

Complementary Code Keying (CCK)

Orthogonal Frequency Divisional Multiplexing (OFDM)

Bluetooth Media

Frequency Hopping Spread Spectrum (FHSS)

Wi-Fi Media Access Protocol

Carrier sense multiple access with collision avoidance (CSMA/CA)

A-MPDU Rx (De-aggregation) and Tx (aggregation) (802.11ac single-MPDU A-

MPDU)

Network Architecture Types

Infrastructure and ad-hoc

SU60-SIPT

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Feature Description

Wi-Fi Standards

IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n,

802.11r, 802.11ac, 802.11w, 802.11K, 802.11v

Bluetooth Standards

Bluetooth version 2.1 with Enhanced Data Rate

Bluetooth 4.2 (Bluetooth Low Energy or BLE)

Wi-Fi Data Rates Supported

Support 802.11 ac/a/b/g/n 2X2 MIMO.

802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps

802.11a/g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11n (OFDM, HT20/HT40, MCS 0-15)

802.11ac (OFDM, HT20, MCS0-8; OFDM HT40/HT80, MCS 0-9)

Modulation Table

BPSK, QPSK, CCK, 16-QAM, 64-QAM, and 256-QAM.

802.11ac HT

MCS

Index

VHT

MCS

Index

Spatial

Streams

Modulation

Coding

20 MHz 40 MHz 80 MHz

802.11n No SGI

SGI No SGI

SGI

0 0 1 BPSK 1/2 6.5 7.2 13.5 15 29.3 32.5

1 1 1 QPSK 1/2 13 14.4 27 30 58.5 65

2 2 1 QPSK 3/4 19.5 21.7 40.5 45 87.8 97.5

3 3 1 16-QAM 1/2 26 28.9 54 60 117 130

4 4 1 16-QAM 3/4 39 43.3 81 90 175.5 195

5 5 1 64-QAM 2/3 52 57.8 108 120 234 260

6 6 1 64-QAM 3/4 58.5 65 121.5 135 263.3 292.5

7 7 1 64-QAM 5/6 65 72.2 135 150 292.5 325

8 1 256-QAM 3/4 78 86.7 162 180 351 390

9 1 256-QAM 5/6 N/A N/A 180 200 390 433.3

8 0 2 BPSK 1/2 13 14.4 27 30 58.5 65

9 1 2 QPSK 1/2 26 28.9 54 60 117 130

10 2 2 QPSK 3/4 39 43.3 81 90 175.5 195

11 3 2 16-QAM 1/2 52 57.8 108 120 234 260

12 4 2 16-QAM 3/4 78 86.7 162 180 351 390

13 5 2 64-QAM 2/3 104 115.6

216 240 468 520

14 6 2 64-QAM 3/4 117 130.3

243 270 526.5 585

15 7 2 64-QAM 5/6 130 144.4

270 300 585 650

8 2 256-QAM 3/4 156 173.3

324 360 702 180

9 2 256-QAM 5/6 N/A N/A 360 400 780 866.7

802.11ac/n Spatial Streams

2 (2x2 MIMO)

Bluetooth Data Rates Supported 1, 2, 3 Mbps

Bluetooth Modulation GFSK@ 1 Mbps

Pi/4-DQPSK@ 2 Mbps

8-DPSK@ 3 Mbps

Regulatory Domain Support FCC (Americas, Parts of Asia, and Middle East)

ETSI (Europe, Middle East, Africa, and Parts of Asia)

IC (Industry Canada)

MIC (Japan) (formerly TELEC) – Option

KC (Korea) (formerly KCC) – Option

SU60-SIPT

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Feature Description

2.4 GHz Frequency Bands ETSI: 2.4 GHz to 2.483 GHz

FCC: 2.4 GHz to 2.473 GHz

MIC: 2.4 GHz to 2.495 GHz

KC: 2.4 GHz to 2.483 GHz

2.4 GHz Operating Channels

(Wi-Fi)

ETSI: 13 (3 non-overlapping)

FCC: 11 (3 non-overlapping)

MIC: 14 (4 non-overlapping)

KC:

13 (3 non

overlapping)

5 GHz Frequency Bands

ETSI

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144)

FCC

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144

5.725 GHz to 5.85 GHz (Ch 149/153/157/161/165)

MIC (Japan)

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144)

5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)

5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124)

5.725 GHz to 5.825 GHz (Ch 149/153/157/161)

5 GHz Operating Channels (Wi-Fi) ETSI: 19 non-overlapping; FCC: 24 non-overlapping

MIC: (Japan): 19 non-overlapping; KC: 19 non-overlapping

Transmit Power

Note: Transmit power on each

channel varies per individual

country regulations. All values are

nominal with +/-2 dBm tolerance at

room temperature.

Tolerance could be up to +/-2.5

dBm across operating temperature.

Note:

HT20 – 20 MHz-wide channels

HT40 – 40 MHz-wide channels

HT80 – 80 MHz-wide channels

802.11a

6 Mbps

18 dBm

(63 mW)

54 Mbps

dBm

(

mW)

802.11b

1 Mbps

18 dBm

(63 mW)

11 Mbps

18 dBm

(63 mW)

802.11g

6 Mbps

18 dBm

(63 mW)

54 Mbps

dBm

(

mW)

802.11n (2.4/5 GHz)

6.5 Mbps (MCS0-5/MCS8-13; HT20)

65 Mbps (MCS6-7/MCS14-15; HT20)

13.5 Mbps (MCS0-5/MCS8-13; HT40)

135

Mbps (MCS6

7/MCS14

15;

HT40)

18 dBm (63 mW)

16 dBm (40 mW)

dBm (25 mW)

802.11ac (5 GHz)

6.5/13 Mbps (MCS0-6; Ntst=1,2; HT20)

78/156 Mbps (MCS7-8; Ntst=1,2; HT20)

13.5/27 Mbps (MCS0-5; Ntst=1,2; HT40)

180/360 Mbps (MCS6-8; Ntst=1,2; HT40)

200/400 Mbps (MCS9; Ntst=1,2; HT40)

29.3/58.5 Mbps (MCS0-5; Ntst=1,2; HT80)

263.3/526.5 Mbps (MCS6-8; Ntst=1,2; HT80)

390/780 Mbps (MCS9;

Ntst=1,2;

HT80)

18 dBm (63 mW)

16 dBm (40 mW)

14 dBm (25 mW)

12 dBm (15.8mW)

14 dBm (25 mW)

12 dBm (15.8 mW)

10 dBm (10

mW)

Bluetooth

1 Mbps

(1DH5)

dBm

(

12.5

mW)

SU60-SIPT

Datasheet

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Feature Description

2 Mbps

dBm

(

6.3

mW)

3 Mbps

BLE (1

Mbps)

7 dBm (6.3 mW)

dBm (

6.3

mW)

Typical Receiver Sensitivity

(PER <= 10%)

Note: All values nominal, +/-3 dBm.

Sensitivity on CH13 (WLAN)/CH78

(BT) will decade up to 4-6dB.

802.11a:

6 Mbps

dBm

54 Mbps

dBm

802.11b:

1 Mbps

95 dBm

11 Mbps

dBm

(

PER<8%)

802.11g:

6 Mbps -91 dBm

54 Mbps

75 dBm

802.11n (2.4 GHz)

6.5 Mbps (MCS0

;

HT20

)

dBm

65 Mbps (MCS7; HT20)

13.5 Mbps (MCS0; HT40)

135

Mbps (MCS7;

HT40)

-73 dBm

-85 dBm

70 dBm

802.11n (5 GHz)

6.5 Mbps (MCS0

;

HT20

)

dBm

65 Mbps (MCS7; HT20)

13.5Mbps (MCS0; HT40)

135Mbps (MCS7;

HT40)

-70 dBm

-86 dBm

69 dBm

802.11ac (5 GHz)

6.5 Mbps

(

MCS0

;

HT20

)

89 dBm

78 Mbps (MCS8; HT20)

13.5 Mbps (MCS0; HT40)

180 Mbps (MCS9; HT40)

29.3 Mbps (MCS0; HT80)

390/780

Mbps (

MCS

9; HT

80)

-67 dBm

-86 dBm

-63 dBm

-81 dBm

dBm

Bluetooth:

1 Mbps (1DH5)

2Mbps (2DH5)

-95 dBm

94 dBm

3 Mbps

(3DH5)

88 dBm

BLE

dBm

Operating Systems Supported

Linux 3.x to 4.9.x kernel.

Android 5.0-5.1.1 (Lollipop) Nov. 2014 supported.

Android 6.0-6.01 (Marshmallow) Oct 2015 supported

Android 7.0-7.1.1 (Nougat) Aug. 2016 supported

SU60-SIPT

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Feature Description

Security Standards

Wireless Equivalent Privacy (WEP)

Wi-Fi Protected Access (WPA)

IEEE 802.11i (WPA2)

Encryption

Wireless Equivalent Privacy (WEP, RC4 Algorithm)

Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)

Advanced Encryption Standard (AES, Rijndael Algorithm)

Encryption Key Provisioning

Static (40-bit and 128-bit lengths)

Pre-Shared (PSK)

Dynamic

802.1X Extensible Authentication Protocol Types

EAP-FAST

EAP-TLS

EAP-TTLS

PEAP

GTC

PEAP-MSCHAPv2

PEAP-TLS

LEAP

Compliance

Note: These regulatory

certifications are pending.

ETSI Regulatory Domain

EN 300 328

EN 301 489-1

EN 301 489-17

EN 301 893

EN 60950-1

2011/65/EU (RoHS)

FCC Regulatory Domain

FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz

FCC 15.407 UNII – 802.11a (Wi-Fi) – 5 GHz

FCC 15.247 DSS – BT 2.1

Industry Canada

RSS-247 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz

RSS-247 – BT 2.1

Certifications

Note: These regulatory

certifications are pending.

Wi-Fi Alliance

802.11a, 802.11b, 802.11g, 802.11n, 802.11ac

WPA Enterprise

WPA2 Enterprise

Bluetooth

SIG Qualification

Warranty Three Year Warranty

All specifications are subject to change without notice

SU60-SIPT

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5 WLAN

UNCTIONAL

ESCRIPTION

5.1 Overview

The 60-SIPT series SiP module is designed based on the Marvell 88W8997 802.11ac/a/b/g/n chipset. It is

optimized for high speed, reliable, and low-power embedded applications. It’s integrated with dual-band WLAN

(2.4/5GHz) and Bluetooth 4.2. Its functionality includes:

 Improved throughput on the link due to frame aggregation, RIFS (reduced inter-frame spacing), and half

guard intervals.

 Support for STBC (Space Time Block Codes) and LDPC (Low Density Parity Check) codes.

 Improved 11n performance due to features such as 11n frame aggregation (A-MPDU and A-MSDU) and

low-overhead host-assisted buffering (RX A-MSDU and RX A-MPDU). These techniques can improve

performance and efficiency of applications involving large bulk data transfers such as file transfers or high-

resolution video streaming.

 IEEE 802.11 ac (Wave 2), 2X2 receive Multi-User MIMIO (MU-MIMO) spatial stream multiplexing with data

rate up to MCS9 (866.7Mbps).

Additional functionality is listed in the following table (Table 4).

Table 4: WLAN functions

Feature Description

WLAN MAC



Frame Exchange at the MAC level to deliver data

 Received frame filtering and validation (Cyclic Redundancy Check (CRC))

 Generation of MAC header and trailer information (MAC protocol Data Units (MPDUs))

 Fragmentation of data frames (MAC Service Data Units (MSDUs)

 Access Mechanism support for fair access to shared wireless medium through (DCF and EDCA)

 A-MPDU Aggregation/Deaggregation (support 802.11ac single –MPDU A-MPDU)

 20/40/80 MHz channel Coexistence

 RIFS Burst Receive

 Management Information Base

 Radio Resource Measurement

 Quality of Service

 Block Acknowledgement

 802.11ac Downlink MU-MIMO (receive)

 Dynamic Frequency Selection

 Beamforming

 TIM Frame TX and RX

 Multi-BSS/Station

 Transmit Rate Adaptation.

 Transmit Power Control

SU60-SIPT

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Feature Description

WLAN Base Band 

802.11ac 2x2 MU

MIMO (with on

chip Marvell RF radio)

 Backward compatibility with legacy 802.11 n/a/b/g technology

 WLAN/Bluetooth LNA sharing

 PHY rate up to 866.7 Mbps

 20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz packets in 40

MHz channel, 20 MHz duplicate legacy packets in 40 MHz channel operation.

 80 MHz bandwidth/channel, 4 positions of 20 MHz packets in 80 MHz channel, upper/lower 40

MHz packets in 80 MHz channel, 20 MHz quadruplicate legacy packets in 80 MHz channel

mode operation.

 Modulation and Coding Scheme (MCS): 802.11ac (MCS0-9. Nsts=1/2); 802.11n (MCS0-15)

 Dynamic Frequency Selection (DFS) (Radar detection)

– Enhanced radar detection for long and short pulse radar

– Enhanced AGC scheme for DFS channel

– Japan DFS requirements for W53 and W56

 802.11 K Radio Resource Measurement.

 802.11ac /802.11n optional MIMO features:

20/40/80 MHz Coexistence with middle-packaged detection (GI detection) for enhanced CCA

– One spatial stream STBC reception and transmission

–

LDPC transmission and reception for 802.11ac and 802.11n

–

256 QAM (MCS8-9) modulations supported

–

Short guard interval

–

RIFS on receive path for 802.11n packets

–

802.11n Greenfield TX/RX

 Power Save feature

WLAN Security 

WLAN Encryption features supported include:

– Temporal Key Integrity Protocol (TKIP)/Wired Equivalent Privacy (WEP)

– Advanced Encryption Standard (AES)/Counter-Mode/CBC-MAC Protocol (CCMP)

– Advanced Encryption Standard (AES)/Cipher-Based Message Authentication Code (CMAC)

– Advanced Encryption Standard (AES)/Galois/Counter Mode Protocol (GCMP)

– WLAN Authentication and Private Infrastructure (WPAI)

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Feature Description

WLAN Channel

Channel frequency supported.

20 MHz 40 MHz 80 MHz

Channel

Freq.

(MHz)

Channel

Freq.

(MHz)

Channel

Freq.

(MHz)

Channel

Freq.

(MHz)

1 2412 36 5180 1-5 2422

42 5210

2 2417 40 5200 2-6 2427

58 5290

2422

5220

2432

5370

2427

5240

2437

5410

5 2432 52 5260 5-9 2422

106 5530

6 2437 56 5280 6-10 2447

122 5610

2422

5300

2452

138

5690

2447

5320

5190

155

5775

2452

100

5500

5230

10 2457 104 5520 52-56 5270

11 2462 108 5540 60-64 5310

2467

112

5560

5350

2472

116

5580

5390

120 5600 84-88 5430

124 5620 92-96 5470

128

5640

100

104

5510

132

5660

108

112

5550

136 5680 116-120

5590

140 5700 124-128

5630

144 5720 132-136

5670

149

5745

140

144

5710

153

5765

149

153

5755

157 5785 157-161

5795

161 5805

165

5825

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6 B

LUETOOTH

UNCTIONAL

ESCRIPTION

The 60-SIPT series includes a fully-integrated Bluetooth baseband/radio. Several features and functions are

listed in Table 5.

Table 5: Bluetooth functions

Feature Description

Bluetooth Interface



Voice interface:

– Hardware support for continual PCM data transmission/reception without processor

overhead.

– Standard PCM clock rates from 64 kHz to 2.048 MHz with multi-slot handshake and

synchronization.

– A-law, U-law, and linear voice PCM encoding/decoding.

 SDIO interface

 High-Speed UART interface



USB 2.0

Bluetooth Core

functionality



Bluetooth 4.2

 Bluetooth Class 2/Bluetooth class 1

 WLAN and Bluetooth share same LNA and antenna

 Digital audio interfaces with PCM/TDM interface for voice application

 Baseband and radio BDR and EDR package type: 1 Mbps, 2 Mbps, 3 Mbps

 Fully functional Bluetooth baseband: AFH, forward error correction, header error control,

access code correction, CRC, encryption bit stream generation, and whitening.

 Adaptive Frequency Hopping (AFH) using Packet Error Rate (PER)

 Interlaced scan for faster connection setup

 Simultaneous active ACL connection setup

 Automatic ACL package type selection

 Full master and slave piconet support

 Scatter net support



SCO/eSCO links with hardware accelerated audio signal processing and hardware supported

PPEC algorithm for speech quality improvement

 All standard SCO/eSCO voice coding

 All standard pairing, authentication, link key, and encryption operations

 Encryption (AES) support

Bluetooth Low Energy

(BLE) Core functionality



Advertiser, Scanner, Initiator, Master, and Slave roles support (

connects

to 16 links)

 WLAN/Bluetooth Coexistence (BCA) protocol support.

 Shared RF with BDR/EDR

 Encryption (AES) support.

 Intelligent Adaptive Frequency Hopping (AFH)

 LE privacy 1.2

 LE Secure Connection.

 LE Data Length Extension

 LE Advertising Length Extension.

 2Mbps LE

 Direction Finding –connectionless Angle of Departure (AoD)

 Direction Finding –connectionless Angle of Arrival (AoA)

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7 B

LOCK

IAGRAM

Figure 1: Block diagram

8 E

LECTRICAL

HARACTERISTICS

8.1 Absolute Maximum Ratings

Table 6 summarizes the absolute maximum ratings and Table 7 lists the recommended operating conditions for

the 60-SIPT Series. Absolute maximum ratings are those values beyond which damage to the device can occur.

Functional operation under these conditions, or at any other condition beyond those indicated in the

operational sections of this document, is not recommended.

Note: Maximum rating for signals follows the supply domain of the signals.

Table 6: Absolute maximum ratings

Symbol

(Domain) Parameter Max

Rating Unit

VIO_SD WLAN host SDIO interface I/O supply (for 1.8V system)

(for 3.3V system)

2.2

4.0

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Symbol

(Domain) Parameter Max

Rating Unit

VIO I/O configuration power supply (for 1.8V system)

(for 3.3V system)

2.2

4.0

3V3 External 3.3V power supply 4.0 V

Storage Storage Temperature -40 to +85

°C

ANT0; ANT1 Maximum RF input (reference to 50-Ω input) +10 dBm

ESD Electrostatic discharge tolerance 2000 V

8.2 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

Symbol (Domain) Parameter Min Typ Max Unit

VIO_SD WLAN host interface I/O supply 1.62/2.97 1.8/3.3 1.98/3.63

VIO WLAN and BT GPIO I/O power supply 1.62/2.97 1.8/3.3 1.98/3.63

3V3 External 3.3V power supply 2.97 3.30 3.63 V

T-ambient Ambient temperature -30 25 85 °C

8.3 DC Electrical Characteristics

Table 8 and Table 9 list the general DC electrical characteristics over recommended operating conditions (unless

otherwise specified).

Table 8: General DC electrical characteristics (For 1.8V operation VIO_SD; VIO)

Symbol Parameter Conditions Min Typ Max Unit

VIH High Level Input Voltage -- 1.26 2.2 V

VIL Low Level Input Voltage -- -0.4 0.54 V

VHYS Input Hysteresis -- 100 mV

VOH Output high Voltage -- 1.4 V

VOL Output low Voltage -- 0.4 V

Table 9: General DC electrical characteristics (For 3.3V operation VIO_SD; VIO)

Symbol

Parameter Conditions Min Typ

Max Unit

VIH High Level Input Voltage -- 2.4 3.6 V

VIL Low Level Input Voltage -- -0.4 0.9 V

VHYS Input Hysteresis -- 100 mV

VOH Output high Voltage -- 2.9 V

VOL Output low Voltage -- 0.4 V

Table 10: DC electrical characteristics for 1.8V or 3.3V operation on special pads (PCIE_WAKEn, PCIE_CLKREQn)

Symbol Parameter Conditions Min Typ Max Unit

VIH High Level Input Voltage -- 1.4 3.6 V

VIL Low Level Input Voltage -- -0.4 0.8 V

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Symbol Parameter Conditions Min Typ Max Unit

VHYS Input Hysteresis -- 150 mV

VOL Output low Voltage -- 0.4 V

8.4 WLAN Radio Receiver Characteristics

Table 11 and Table 12 summarize the WLAN 60-SIPT series receiver characteristics.

Table 11: WLAN receiver characteristics for 2.4 GHz signal chain operation

Symbol Parameter Conditions Min Typ Max Unit

Frx Receive input frequency range

2.412

2.484 GHz

Srf

Sensitivity

CCK, 1 Mbps

See Note

-95

dBm

CCK, 11 Mbps -90

OFDM, 6 Mbps -91

OFDM, 54 Mbps -75

HT20, MCS0 -91

HT20, MCS7 -73

Radj Adjacent channel rejection

OFDM, 6 Mbps

See Note

TBD

OFDM, 54 Mbps TBD

HT20, MCS0 TBD

HT20, MCS7 TBD

Table 12: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation

Symbol Parameter Conditions Min

Typ Max Unit

Frx Receive input frequency

range

5.15

5.825 GHz

Srf

Sensitivity

OFDM, 6 Mbps

See Note

-89

dBm

OFDM, 54 Mbps -74

HT20, MCS0 -89

HT20, MCS7 -70

HT40, MCS0 -86

HT40, MCS7 -69

Radj Adjacent channel rejection

OFDM, 6 Mbps

See Note

TBD

OFDM, 54 Mbps TBD

HT20, MCS0 TBD

HT20, MCS7 TBD

Note

: Performance data are measured under single chain operation.

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8.5 WLAN Transmitter Characteristics

Table 13: WLAN transmitter characteristics for 2.4 GHz per chain operation

Symbol Parameter Conditions Min Typ Max Unit

Ftx Transmit output frequency range 2.412 2.484 GHz

Pout Output power See Note

11b mask compliant 1-11Mbps 18

dBm

11g mask compliant 6-36Mbps 18

11g EVM compliant 48-54Mbps 16

11n HT20 mask compliant MCS0-5/MCS8-13 18

11n HT20 EVM compliant MCS6-7/MCS14-15

11n HT40 mask compliant MCS0-5/MCS8-13 16

11n HT40 EVM compliant MCS6-7/MCS14-15

ATx Transmit power accuracy at 25 - -2.0 - +2.0 dB

Freq. Mode/Rate (Mbps)

Output Power Per

Chain (dBm)

Typical Current

Consumption Single

Chain (mA)

Max. Current

Consumption Single

Chain (mA)

2412MHz

1 Mbps 18dBm 340 620

54 Mbps 16dBm 280 500

HT20 MCS7 16dBm 280 510

2422MHz

1 Mbps 18dBm 340 620

54 Mbps 16dBm 280 500

HT20 MCS7 16dBm 280 510

2472MHz

1 Mbps 18dBm 340 620

54 Mbps 16dBm 280 500

HT20 MCS7 16dBm 280 510

Table 14: WLAN transmitter characteristics for 5 GHz per chain operation

Symbol Parameter Conditions Min Typ Max Unit

Ftx Transmit output frequency range 5.15 5.925

GHz

Pout Output power See Note

11a mask compliant 6-36Mbps 18

dBm

11a EVM compliant 48-54Mbps 16

11n HT20 mask compliant MCS0-5/MCS8-13 18

11n HT20 EVM compliant MCS6-7/MCS14-15

11n HT40 mask compliant MCS0-5/MCS8-13 16

11n HT40 EVM compliant MCS6-7/MCS14-15

11ac HT20 mask compliant MCS0-6 (

Ntst=1,2)

11ac HT20 EVM compliant MCS7-8(

Ntst=1,2)

11ac HT40 mask compliant MCS0-5 (

Ntst=1,2)

11ac HT40 EVM compliant MCS6-8(

Ntst=1,2)

11ac HT40 EVM compliant MCS9(

Ntst=1,2)

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Symbol Parameter Conditions Min Typ Max Unit

11ac HT80 mask compliant MCS0-5 (

Ntst=1,2)

11ac HT80 EVM compliant MCS6-8(

Ntst=1,2)

11ac HT80 EVM compliant MCS9(

Ntst=1,2)

ATx Transmit power accuracy at 25 - -2.0 - +2.0 dB

Table 15: WLAN current consumption on 5 GHz

Freq. Mode/Rate

[Mbps]

Output Power Per

Chain [dBm]

Typical Current

Consumption Single

Chain (mA)

Typical Current

Consumption Dual Chain

(mA)

5180 MHz

5190 MHz

6 Mbps 18 dBm 400 710

54 Mbps 16 dBm 330 610

HT20 MCS0 18 dBm 400 720

HT20 MCS7 16 dBm 360 620

HT40 MCS7 14 dBm 320 550

5500 MHz

5510 MHz

6 Mbps 18 dBm 380 680

54 Mbps 16 dBm 330 600

HT20 MCS0 18 dBm 370 690

HT20 MCS7 16 dBm 320 600

HT40 MCS7 14 dBm 300 530

5825 MHz

5795 MHz

6 Mbps 18 dBm 380 690

54 Mbps 16 dBm 310 600

HT20 MCS0 18 dBm 360 710

HT20 MCS7 16 dBm 340 550

HT40 MCS7 14 dBm 300 530

Note: Final TX power values on each channel are limited by the regulatory certification test limit.

9 B

LUETOOTH

ADIO

HARACTERISTICS

Table 16 through Table 17 describe the basic rate transmitter performance, enhanced data transmitter

performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption

conditions at 25°C.

Table 16: Basic rate transmitter performance temperature at 25°C (3.3V)

Test Parameter Min Typ Max BT Spec. Unit

Maximum RF Output Power 8 10 11 0 ~ +20 dBm

Frequency Range 2.4 — 2.4835

2.4 ≤ f ≤ 2.4835 GHz

20 dB Bandwidth — 919.5 — ≤ 1000 KHz

Δf1avg Maximum Modulation 140 165 175 140 < Δf1avg <

175 KHz

Δf2max Minimum Modulation — 135 — ≥ 115 KHz

Δf2avg/Δf1avg — 0.9 — ≥ 0.80 —

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Initial Carrier Frequency — +/-5 — ≤±75 KHz

Drift Rate (DH1 package) — 4 — ≤ 20 KHz/50 µs

Drift (DH3 packet) — 8 — ≤25 KHz

Drift (DH5 packet) — 7 — ≤ 40 KHz

Adjacent Channel Power

F≥ ± 3MHz — -50 — < -40 dBm

F = ± 2MHz — -46 — ≤ -20 dBm

F = ± 1MHz — -15 — N/A dBm

Table 17: Enhanced data rate transmitter performance 25°C (3.3V)

Test Parameter Min Typ Max BT Spec. Unit

Relative Transmit Power 5 7 9 dBm

Max Carrier Frequency

Stability |wo|

2-DH5 — 1 — ≤ ±10 KHz

3-DH5 — 1 —

Max Carrier Frequency

Stability |wi|

2-DH5 — 4 — ≤ ±75 KHz

3-DH5 — 4 —

Max Carrier Frequency

Stability |w0+wi|

2-DH5 — 5 — ≤ ±75 KHz

3-DH5 — 5 —

RMS DEVM 2-DH5 — 4 — ≤ 20 %

3-DH5 — 4 — ≤13 %

Peak DEVM 2-DH5 — 9 — ≤ 35 %

3-DH5 — 9 — ≤ 25 %

99% DEVM 2-DH5 — 12 — ≤ 30 %

3-DH5 — 12 — ≤ 20 %

EDR Differential Phase Encoding — 99 — ≥ 99 %

Adjacent Channel Power F≥ ± 3MHz — TBD — < -40 dBm

F = ± 2MHz — TBD — ≤ -20 dBm

Table 18: Basic rate receiver performance at 3.3V

Test Parameter Min Typ Max BT Spec. Unit

Sensitivity (1DH5) BER ≤ 0.1% — -95 -92 ≤ -70 dBm

Maximum Input BER ≤ 0.1% -20 -10 — ≥ -20 dBm

Carrier-to-Interferer Ratio

(C/I)

Co-Channel — 10 11 11

C/I (± 1 MHz) — -4 0 0 dB

C/I (± 2 MHz) — -45 — -30 dB

C/I (± 3 MHz) — -49 — -40 dB

Maximum Level of Intermodulation Interferers

-39 -30 - ≥ -39 dBm

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Table 19: Enhanced data rate receiver performance 3.3V

Test Parameter Min Typ Max Bluetooth

Specification Unit

Sensitivity (BER ≤0.01%)

π/4 DQPSK — -94 -91 ≤ -70 dBm

8 DPSK — -88 -85 ≤ -70 dBm

Maximum Input (BER ≤0.1%) π/4 DQPSK -20 — — ≥ -20 dBm

8 DPSK -20 — — ≥ -20 dBm

Co-Channel C/I (BER ≤0.1%) π/4 DQPSK — 10 13 ≤ ±13 dB

8 DPSK — 16 20 ≤ ±20 dB

Adjacent Channel C/I (1MHz) π/4 DQPSK — -9 0 ≤ 0 dB

8 DPSK — -6 5 ≤5 dB

Second Adjacent Channel C/I

(2MHz)

π/4 DQPSK — -47 -30 ≤ -30 dB

8 DPSK — -42 -25 ≤ -25 dB

Third Adjacent Channel C/I

(3MHz)

π/4 DQPSK — -51 -40 ≤ -40 dB

8 DPSK — -48 -33 ≤ -33 dB

Out-of-band blocking

30-2000MHz

— -12.5 — — dBm

2-2.399GHz

— -12.4 — — dBm

2.484-3GHz

— -18 — — dBm

3-12.75GHz

— -2.6 — — dBm

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10 H

OST

NTERFACE

PECIFICATIONS

10.1 SDIO Specifications

The 60-SIPT series SDIO host interface pins are powered from the VIO_SD voltage supply. The SDIO electrical

specifications are identical for the 1-bit SDIO and 4-bit SDIO modes.

10.1.1 Default Speed, High-speed Modes

Figure 2: SDIO protocol timing diagram--- default mode (3.3V)

Figure 3: SDIO protocol timing diagram--- High-Speed mode (3.3V)

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 20: SDIO timing requirements

Symbol Parameter Condition Min. Typ. Max. Unit

Clock Frequency Default Speed

High-Speed

50 MHz

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Symbol Parameter Condition Min. Typ. Max. Unit

Clock low time Default Speed

High-Speed

- ns

Clock high time Default Speed

High-Speed

- ns

ISU

Input Setup time Default Speed

High-Speed

- ns

Input Hold time Default Speed

High-Speed

- ns

ODLY

Output delay time

CL 40pF (1 card)

Default Speed

High-Speed

14 ns

Output hold time High-Speed 0 - - ns

10.1.2 SDR12, SDR25, SDR50 Mode (up to 100MHz) (1.8V)

Figure 4: SDIO protocol timing Diagram--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 21: SDIO timing requirements--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)

Symbol Parameter Condition Min. Typ. Max. Unit

Clock Frequency SDR12/25/50 25 - 100 MHz

ISU

Input setup time SDR12/25/50 3 -- - ns

Input Hold time SDR12/25/50 0.8 - - ns

CLK

Clock Time SDR12/25/50 10 - 40 ns

, T

Raise time, Fall time

, T

<2ns (max) at 100MHz

CARD

=10pF

SDR12/25/50 - - 0.2*T

CLK

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Symbol Parameter Condition Min. Typ. Max. Unit

ODLY

Output delay time

30pF SDR12/25/50 - - 7.5 ns

Output hold time

=15pF SDR12/25/50 1.5 - - ns

10.1.3 SDR104 Mode (208MHz) (1.8V)

Figure 5: SDIO protocol timing Diagram--- SDR104 modes (up to 208 MHz) (1.8V)

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 22: SDIO timing requirements--- SDR104 modes (up to 208MHz) (1.8V)

Symbol Parameter Condition Min. Typ. Max. Unit

Clock Frequency SDR104 0 - 208 MHz

ISU

Input setup time SDR104 1.4 -- - ns

Input Hold time SDR104 0.8 - - ns

CLK

Clock Time SDR104 4.8 - - ns

, TCF

Raise time, Fall time

, TCF <0.96ns (max) at 208MHz

CARD

=10pF

SDR104

- - 0.2*T

CLK

Card Output phase SDR104 0 - 10 ns

ODW

Output timing pf variable data

window SDR12/25/50

2.88 - - ns

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10.1.4 DDR50 Mode (50MHz) (1.8V)

Figure 6: SDIO CMD timing diagram--- DDR50 modes (50 MHz) (1.8V)

Figure 7: SDIO DAT[3:0] timing Diagram--- DDR50 modes (50 MHz) (1.8V)

Note: In DDR50 mode, DAT[3:0] lines are samples on both edges pf the clock (not applicable for CMD line)

Table 23: SDIO timing requirements – DDR50 modes (50 MHz)

Symbol Parameter Condition Min. Typ. Max. Unit

Clock

CLK

Clock time

50MHz (max) between rising edge DDR50 20 -- -- ns

, T

Rise time, fall time

, T

<4.00ns (max) at 50MHz.

CARD

=10pF

DDR50 -- -- 0.2*T

CLK

Clock Duty -- DDR50 45 -- 55 %

CMD Input (referenced to clock rising edge)

Input setup time

CARD

DDR50 6 -- -- ns

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Symbol Parameter Condition Min. Typ. Max. Unit

Input hold time

CARD

DDR50 0.8 -- -- ns

CMD Output (referenced to clock rising and failing edge)

ODLY

Output delay time during data transfer

mode

30pF (1 card)

DDR50 -- -- 13.7 ns

OHLD

Output hold time

≥15pF (1 card) DDR50 1.5 -- -- ns

DAT[3:0] Input (referenced to clock rising and failing edges)

IS2X

Input setup time

CARD

DDR50 3 -- -- ns

IH2X

Input hold time

CARD

DDR50 0.8 -- -- ns

DAT[3:0] Output (referenced to clock rising and failing edges)

ODLY2X (max)

Output delay time during data transfer

mode

25pF (1 card)

DDR50 -- -- 7.0 ns

ODLY2X (min)

Output hold time

≥15pF (1 card)) DDR50 1.5 -- -- ns

10.2 PCI Express Specifications

The PCI Express host interface pins are powered from the 1.8V generated by the PMU inside the 60-SIPT series.

10.2.1 Differential TX Output Electricals

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 24: PCI Express TX Output Specifications – 2.5GT/s

Symbol Parameter Min. Typ.

Max. Unit

Unit interval (UI)

The specified UI is equivalent to a tolerance of +/-

300ppm for each Refclk source. Period does not

account for SSC induced variations.

399.88 - 400.12

TX-DIFF-PP

Differential peak-to-peak TX voltage swing

TX-DIFF-PP

=2* V

TXD+

– V

TXD-

│ 0.8 - 1.2 V

TX-DIFF-PP-LOW

Low power differential peak-to-peak TX voltage

swing

TX-DIFF-PP

=2* V

TXD+

– V

TXD-

│

0.4 - 1.2 V

TX-DE-RATIO-3.5dB

Tx de-emphasis level ratio (3.5dB) 3.0 - 4.0 V

TX-EYE

Tx eye including all jitter sources 0.75 - - UI

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Symbol Parameter Min. Typ.

Max. Unit

TX-EYE-MEDIAN-to-

MAX-JITTER

Maximum time between jitter median and

maximum deviation from median - - 0.125

TX-RISE-FALL

Tx rise/fall time

Measured differentially from 20% to 80% 0.125 - - UI

TX-DIFF

Tx package plus Si differential return loss 10 - - dB

TX-CM

Tx package plus Si common mode return loss 6 - - dB

TX-CM-AC-P

Tx AC common mode voltage - 20 - mV

TX-SHORT

Tx short circuit current limit - - 90 mA

TX-DC-CM

Tx DC common mode voltage - - 3.6 V

TX-CM-DC-ACTIVE-

IDLE-DELTA

Absolute delta of DC common mode voltage

during L0 and electrical idle. 0 - 100 mV

TX-IDLE-DIFF-AC-p

Electrical idle differential peak output voltage 0 - 20 mV

TX-IDLE-MIN

Minimum time spent in electrical idle 20 - - ns

TX-IDLE-SET-TO-IDLE

Maximum time to transition to a valid electrical

idle after sending an electrical idle ordered set - - 8 ns

TX-IDLE-TO-DIFF-DATA

Maximum time to transition to valid diff signalling

after leaving electrical idle - - 8 ns

CROSLINK

Crosslink random timeout - - 1.0 ms

AC coupling capacitor 75 - 200 nF

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 25: PCI Express TX Output Specifications - 5GT/s

Symbol Parameter Min. Typ.

Max. Unit

Unit interval (UI)

The specified UI is equivalent to a tolerance of +/-

300ppm for each Refclk source. Period does not

account for SSC induced variations.

199.94 - 200.06

TX-DIFF-PP

Differential peak-to-peak TX voltage swing

TX-DIFF-PP

=2* V

TXD+

– V

TXD-

│ 0.8 - 1.2 V

TX-DIFF-PP-LOW

Low power differential peak-to-peak TX voltage

swing

TX-DIFF-PP

=2* V

TXD+

– V

TXD-

│

0.4 - 1.2 V

TX-DE-RATIO-3.5dB

Tx de-emphasis level ratio (3.5dB) 3.0 - 4.0 V

TX-DE-RATIO-6dB

Tx de-emphasis level ratio (6dB) 5.5 - 6.5 V

MIN-PULSE

Instantaneous lone pulse width

Measured relative to rising/failing pulse 0.9 - - UI

TX-EYE

Tx eye including all jitter sources 0.75 - - UI

TX-HF-DJ-DD

Tx deterministic jitter > 1.5MHz

Deterministic jitter only - - 0.15 UI

SU60-SIPT

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Symbol Parameter Min. Typ.

Max. Unit

TX-LF-RMS

Tx RMS jitter<1.5MHz

Total energy measured over a 10KHz-1.5MHz

range

- 3.0 - Ps RMS

TX-RISE-FALL

Tx rise/fall time

Measured differentially from 20% to 80% 0.15 - - UI

TX-DIFF

Tx package plus Si differential return loss

(0.05-1.25GHz)

(1.25-2.5GHz)

8 - - dB

TX-CM

Tx package plus Si common mode return loss

6 - - dB

TX-CM-AC-PP

Tx AC common mode voltage - - 100 mV

TX-SHORT

Tx short circuit current limit - - 90 mA

TX-DC-CM

Tx DC common mode voltage - - 3.6 V

TX-CM-DC-ACTIVE-

IDLE-DELTA

Absolute delta of DC common mode voltage

during L0 and electrical idle. 0 - 100 mV

TX-IDLE-DIFF-AC-p

Electrical idle differential peak output voltage

TX-IDLE-DIFF-DC

= V

TX-IDLE-D+

TX-IDLE-D-

20mV

0 - 20 mV

TX-IDLE-DIFF-DC

DC Electrical idle differential output voltage

TX-IDLE-DIFF-DC

= V

TX-IDLE-D+

TX-IDLE-D-

5mV 0 - 5 mV

TX-RCVDETECT

Voltage change allowed during receiver detection

0 - 600 mV

TX-IDLE-MIN

Minimum time spent in electrical idle 20 - - ns

TX-IDLE-SET-TO-IDLE

Maximum time to transition to a valid electrical

idle after sending an electrical idle ordered set - - 8 ns

TX-IDLE-TO-DIFF-DATA

Maximum time to transition to valid diff signalling

after leaving electrical idle - - 8 ns

CROSLINK

Crosslink random timeout - - 1.0 ms

AC coupling capacitor 75 - 200 nF

10.2.2 Differential RX input Electricals

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 26: PCI Express RX Output Specifications – 2.5GT/s

Symbol Parameter Min. Typ.

Max. Unit

Unit interval (UI)

The specified UI is equivalent to a tolerance of +/-

300ppm for each Refclk source. Period does not

account for SSC induced variations.

399.88 - 400.12

RX-DIFF-PP-CC

Differential RX peak-to-peak voltage for common

Refclk RX architecture 0.175 - 1.2 V

RX-DIFF-PP-DC

Differential RX peak-to-peak voltage for data

clocked Refclk RX architecture 0.175 - 1.2 V

SU60-SIPT

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Symbol Parameter Min. Typ.

Max. Unit

RX-EYE

Rx eye time opening

Minimum eye time at Rx pins to yield a 10

-12

BER 0.4 - - UI

RX-EYE-MEDIAN-to-

MAX-JITTER

Maximum time delta between median and

deviation from median - - 0.3 UI

RX-CM-ACp

AC peak common mode input voltage - - 150 mV

RX-DIFF

Differential return loss 15 - - dB

RX-CM

Common mode return loss 0 - 3.6 dB

RX-DIFF-DC

DC differential input impedance 80 100 120 Ω

RX-DC

DC input impedance 40 50 60 Ω

RX-HIGH-IMP-DC

Powered down DC input impedance 200 - - KΩ

RX-IDLE-DET-DIFF-p-p

Electrical idle detect threshold 65 - 175 mV

RX-IDLE-DIFF-

ENTERTIME

Unexpected electrical idle enter detect threshold

integration time - - 10 ms

RX-SKEW

Total Skew - - 20 ns

Note: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

Table 27: PCI Express RX Output Specifications – 5GT/s

Symbol Parameter Min. Typ.

Max. Unit

Unit interval (UI)

The specified UI is equivalent to a tolerance of +/-

300ppm for each Refclk source. Period does not

account for SSC induced variations.

199.94 - 200.06

RX-DIFF-PP-CC

Differential RX peak-to-peak voltage for common

Refclk RX architecture 0.12 - 1.2 V

RX-DIFF-PP-DC

Differential RX peak-to-peak voltage for data

clocked Refclk RX architecture 0.1 - 1.2 V

RX-TJ-CC

Maximum Rx inherent total timing error for

common Refclk RX architecture - - 0.4 UI

RX-TJ-DC

Maximum Rx inherent total timing error for data

clocked RX architecture - - 0.34 UI

RX-DJ-DD-CC

Maximum Rx inherent deterministic timing error

for common Refclk RX architecture - - 0.3 UI

RX-DJ-DD-DC

Maximum Rx inherent deterministic timing error

for data clocked RX architecture - - 0.24 UI

RX-MIN-PULSE

Minimum width pulse at Rx 0.6 - - UI

RX-CM-ACp

AC peak common mode input voltage - - 150 mV

RX-DIFF

Differential return loss 15 - - dB

RX-CM

Common mode return loss 1- - 3.6 dB

RX-DIFF-DC

DC differential input impedance 80 100 120 Ω

RX-DC

DC input impedance 40 50 60 Ω

SU60-SIPT

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Symbol Parameter Min. Typ.

Max. Unit

RX-HIGH-IMP-DC

Powered down DC input impedance 200 - - KΩ

RX-IDLE-DET-DIFF-p-p

Electrical idle detect threshold 65 - 175 mV

RX-IDLE-DIFF-

ENTERTIME

Unexpected electrical idle enter detect threshold

integration time - - 10 ms

RX-SKEW

Total Skew - - 20 ns

10.3 USB Specifications

10.3.1 USB LS Driver and Receiver Parameters

Notes: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

The load is 100Ω differential for these parameters, unless other specified.

Table 28: USB LS Driver and Receiver Specifications

Symbol Parameter Min. Typ.

Max. Unit

BR Baud rate - 1.5 - Mbps

PPM

Baud rate tolerance -15000

- 15000

ppm

Driver Specifications

Output signal ended high

Defined with 1.425KΩ pull-up resistor to 3.6V 2.8 - 3.6 V

Output signal ended low

Defined with 1.425KΩ pull-up resistor to ground 0.0 - 0.3 V

CRS

Output signal crossover voltage 1.3 2.0 V

Data fall time

Defined from 10% to 90% for raise time and 90% to 10%

for fall time

75.0 - 300.0

Data rise time

Defined from 10% to 90% for raise time and 90% to 10%

for fall time

75.0 - 300.0

LRFM

Rise and fall time matching 80.0 - 125.0

UDJ1

Source jitter total: to next transition

*Including frequency tolerance. Timing difference

between the differential data signals.

*Defined at crossover point of differential signals

-95

UDJ2

Source jitter total: for paired transitions

*Including frequency tolerance. Timing difference

between the differential data signals.

*Defined at crossover point of differential signals

-150

150

Receiver Specifications

SU60-SIPT

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10.3.2 USB FS Driver and Receiver Parameters

Notes: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

The load is 100Ω differential for these parameters, unless other specified.

Table 29: USB FS Driver and Receiver Specifications

Symbol Parameter Min. Typ.

Max. Unit

BR Baud rate - 12.0

- Mbps

PPM

Baud rate tolerance -2500 - 2500 ppm

Driver Specifications

Output signal ended high

Defined with 1.425KΩ pull-up resistor to 3.6V 2.8 - 3.6 V

Output signal ended low

Defined with 1.425KΩ pull-up resistor to ground 0.0 - 0.3 V

CRS

Output signal crossover voltage 1.3 2.0 V

Output raise time

Defined from 10% to 90% for raise time and 90% to

10% for fall time

-4.0 - 20.0 ns

Output fall time

Defined from 10% to 90% for raise time and 90% to

10% for fall time

-4.0 - 20.0 ns

DJ1

Source jitter total: to next transition

*Including frequency tolerance. Timing difference

between the differential data signals.

*Defined at crossover point of differential signals

-3.5

3.5

DJ2

Source jitter total: for paired transitions

*Including frequency tolerance. Timing difference

between the differential data signals.

*Defined at crossover point of differential signals

-4.0

4.0

FDEOP

Source jitter for differential transition to SE0

transition. Defined at crossover point of differential

signals

-2.0

5.0

Receiver Specifications

Input signal ended high 2.0 - - V

Input signal ended low - - 0.8 V

Differential input sensitivity 0.2 - - V

JR1

Receiver jitter: to next transition -18.5 - 18.5 ns

Input signal ended high 2.0 - - V

Input signal ended low - - 0.8 V

Differential input sensitivity 0.2 - - V

SU60-SIPT

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Symbol Parameter Min. Typ.

Max. Unit

Defined at crossover point of

differential data

signals

JR2

Receiver jitter: for paired transitions

Defined at crossover point of differential data

signals

-9.0 - 9.0 ns

10.3.3 USB HS Driver and Receiver Parameters

Notes: Over full range of values specified in the Recommended Operating Conditions unless otherwise

specified.

The load is 100Ω differential for these parameters, unless other specified.

Table 30: USB HS Driver and Receiver Specifications

Symbol Parameter Min. Typ.

Max. Unit

BR Baud rate - 480 - Mbps

PPM

Baud rate tolerance -500 - 500 ppm

Driver Specifications

HSOH

Data signal high 360 - 440 mV

HSOL

Data signal low -10 - 10 mV

HSR

Data rise time

Defined from 10% to 90% for raise time and 90% to 10%

for fall time

500 - - ns

HSF

Data fall time

Defined from 10% to 90% for raise time and 90% to 10%

for fall time

-500 - - ns

Receiver Specifications

HSCM

Input signal ended low -50 - 500 mV

SU60-SIPT

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10.4 PCM Interface Specifications

Figure 8: PCM Timing Specification – Master Mode

Table 31: PCM Timing Specification – Master Mode

Symbol Parameter Min. Typ. Max. Unit

BCLK

- - 2/2.048 - MHz

Duty Cycle

BCLK

- 0.4 0.5 0.6 -

BCLK rise/fall

- - 3 - ns

- - - 15 ns

DISU

- 20 - - ns

DIHO

- 15 - - ns

- - - 15 ns

Figure 9: PCM Timing Specification – Slave Mode

Table 32: PCM Timing Specification – Slave Mode

Symbol Parameter Min. Typ. Max. Unit

BCLK

- - 2/2.048 - MHz

Duty Cycle

BCLK

- 0.4 0.5 0.6 -

BCLK rise/fall

- - 3 - ns

SU60-SIPT

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Symbol Parameter Min. Typ. Max. Unit

- - - 30 ns

DISU

- 15 - - ns

DIHO

- 10 - - ns

BFSU

- 15 - - ns

BFHO

- 10 - - ns

11 P

EFINITIONS

Note: AVDD18 is generated by PMU internally. No need to power from outside the SIP.

Table 33: Pin definitions of 60-SIPT series

# Name Type Voltage

Ref. Description If Not

Used

1 PDn I -

Full Power-Down (input) (Active low)

0=full power-down mode; 1=normal mode

PDn can accept an input range from 1.8V to 3.6V

PDn must be high for normal operation. Please

connect to pin-32 (1.8V_OUT) through 49.9KΩ.

2 GND - - Ground GND

3 GND - - Ground GND

4 ANT0 (Wi-Fi/BT) A,I/O - RF Transmit/Receive

Wi-Fi and BT share the same path.

50Ω

Load

5 GND - - Ground GND

6 GND - - Ground GND

7 GND - - Ground GND

8 GND - - Ground GND

9 GND - - Ground GND

GND - - Ground GND

ANT1 (Wi-Fi only) A,I/O - RF Transmit/Receive

Wi-Fi only

50Ω

Load

GND - - Ground GND

CONFIG_HOST2 I, PU AVDD18

Host interface configuration setting.

Detail configuration table are shown in Table 32

To set a configuration bit to “0”, attach a 100kΩ

resistor from the pin to ground.

No external circuitry is required to set a

configuration bit to “1”.

CONFIG_HOST1 I, PU AVDD18

Host interface configuration setting.

Detail configuration table are shown in Table 32

To set a configuration bit to “0”, attach a 100kΩ

resistor from the pin to ground.

SU60-SIPT

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# Name Type Voltage

Ref. Description If Not

Used

No external circuitry is required to set a

configuration bit to “1”.

CONFIG_HOST0 I, PU AVDD18

Host interface configuration setting.

Detail configuration table are shown in Table 32

To set a configuration bit to “0”, attach a 100kΩ

resistor from the pin to ground.

No external circuitry is required to set a

configuration bit to “1”.

GND - - Ground GND

PCM_CLK I/O VIO

PCM Clock Signal (Optimal)

Optimal clock used for some codecs.

Output if Master mode; Input if Slave mode.

N/C

PCM_DOUT O VIO PCM Data N/C

PCM_SYNC I/O VIO PCM Sync Pulse Signal

Output if Master mode; Input if Slave mode. N/C

PCM_DIN I VIO PCM Data N/C

GPIO0 I/O VIO General purpose I/O pin. N/C

GND - - Ground GND

PCIE_WAKEn I/O VIO PCIe wake signal (input/output) (active low) N/C

PCIE_CLKREQn I/O VIO PCIe clock request (input/output) (active low) GND

PCIE_PERSTn I, PD VIO PCIe host indication to reset the device (input)

(active low) N/C

PCIE_W_DISABLEn I, PU VIO PCIe host indication to disable the WLAN function

of the device (input) (active low) N/C

LTE_SOUT/

JTAG_TDO

O, PD

O, PD VIO Serial data to external LTE device/

JTAG Test Data Out (TDO) N/C

LTE_SIN/

JTAG_TDI

I, PD

I, PD VIO Serial data from external LTE device/

JTAG Test Data Input (TDI) N/C

VIO Power - 1.8V/2.5V/3.3V Digital I/O Power Supply -

1.8V_OUT Power -

1.8V output from 60-SIPT series.

Used to pull-up the PDn pin for POR.

Note:

Do NOT used as power source for other circuits.

N/C

GND - - Ground GND

32KHz I, PU VIO

Sleep Clock Input

An external sleep clock of 32.768KHz with

minimum +/-250ppm is required for power saving

mode

GND - - Ground GND

PCIE_RCLK_N I AVDD18

PCIe Differential Clock Input-Negative N/C

PCIE_RCLK_P I AVDD18

PCIe Differential Clock Input-Positive N/C

GND - - Ground GND

SU60-SIPT

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# Name Type Voltage

Ref. Description If Not

Used

PCIE_TX_P O AVDD18

PCIe Transmit Data-Positive N/C

PCIE_TX_N O AVDD18

PCIe Transmit Data-Negative N/C

GND - - Ground GND

PCIE_RX_N I AVDD18

PCIe Receive Data-Negative N/C

PCIE_RX_P I AVDD18

PCIe Receive Data-Positive N/C

GND - - Ground GND

USB_DN I/O 3V3 USB Differential Data-Negative N/C

USB_DP I/O 3V3 USB Differential Data-Positive N/C

GND - - Ground GND

3V3 Power -

3.3V module power supply

Note: A 10u MLCC is needed for this pin. Place the

capacitor close to this pin as possible.

Ref. parts: GRM188R60J106ME47D (MURATA)

or CC0805KKX7R6BB106 (YAGO)

3V3 Power -

3.3V module power supply

Note: A 10u MLCC is needed for this pin. Place the

capacitor close to this pin as possible.

Ref. parts: GRM188R60J106ME47D (MURATA)

or CC0805KKX7R6BB106 (YAGO)

GND - - Ground GND

PMU_EN I

Enable input for all Regulators inside the 60-SIPT

series when it is “H” state. The 60-SIPT will be off

when it is “L” state.

Note: DO NOT float this pin. Pull-up to 3.3V with

100K for normal operation.

100K,

VIO_SD Power - 1.8V/3.3V Digital I/O SDIO Power Supply -

SDIO_DATA0 I/O, PU

VIO_SD SDIO 4-bit Mode DATA line Bit[0] N/C

SDIO_DATA1 I/O, PU

VIO_SD SDIO 4-bit Mode DATA line Bit[1] N/C

SDIO_DATA2 I/O, PU

VIO_SD SDIO 4-bit Mode DATA line Bit[2] N/C

SDIO_DATA3 I/O, PU

VIO_SD SDIO 4-bit Mode DATA line Bit[3] N/C

SDIO_CMD I/O, PU

VIO_SD SDIO 4-bit Mode Command/Response N/C

SDIO_CLK I, PU VIO_SD SDIO 4-bit Mode Clock Input N/C

GND - - Ground GND

UART_TXD O,

WPU VIO UART Serial Data Output N/C

UART_RXD I, WPU

VIO UART Serial Data Input N/C

UART_CTSn I, PU VIO UART Clear to Send (Active low) N/C

UART_RTSn O,

WPU VIO UART Request to Send (Active low) N/C

GND - - Ground GND

JTAG_TCK I, PU VIO JTAG Test Clock (input) N/C

JTAG_TMS I, PU VIO JTAG Test Controller Select (input) N/C

SU60-SIPT

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# Name Type Voltage

Ref. Description If Not

Used

LED_OUT_BT O, PU VIO LED indicator for BT with 10mA drive capability. N/C

LED_OUT_WLAN O, PU VIO LED indicator for WLAN with 10mA drive capability

N/C

69-

GND - -

Thermal Ground Pad

(Important for RF performance and thermal

dissipation; please flow the reference design)

GND

12 H

OST

ONFIGURATION

PTIONS

60-SIPT series support various host configurations for WLAN and BT. Its detail configurations are shown in

following table (Error! Reference source not found.).

Table 34: Wi-Fi host interface configuration table

CONFIG_HOST [2-0]

WLAN BT/BLE Note

000 SDIO UART -

001 SDIO SDIO -

010 PCIe USB 2.0

Initial USB 2.0 PHY and COM PHY PCIe portion

011 PCIe UART Initial only COM PHY PCIe portion

100 USB 2.0 UART Initial USB 2.0 PHY

101 USB 2.0 USB 2.0

Initial only USB 2.0 PHY

13 M

ECHANICAL

PECIFICATIONS

Module dimensions of 60-SIPT series is 13 x 14 x 1.87 mm. Detail drawings are shown in Figure 10.

Figure 10: Mechanical drawing - 60-SIPT

SU60-SIPT

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Figure 11: Module dimension of 60-SIPT series

Note: The Wi-Fi MAC address is located on the product label. The BT MAC address always immediately

follows the Wi-Fi MAC address. Therefore, the BT MAC address is the Wi-Fi MAC address plus one.

Figure 12: Recommended ground via

IEW

SU60-SIPT

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Recommend minimal via size and placement for grounding and thermal dissipation. Please double the ground

via number when using laser via on HID process. More ground via and the use of 1-oz copper is recommended in

our design to get better thermal dissipation.

Note: When soldering, the stencil thickness should be ≥ 0.1 mm.

14 RF

AYOUT

ESIGN

UIDELINES

The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your

device.

 Do not run antenna cables directly above or directly below the radio.

 Do not place any parts or run any high speed digital lines below the radio.

 If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the

devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between

these two antennas.

 Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird radio

from the antenna. In addition, do not place antennas directly above or directly below the radio.

 Laird recommends the use of a double-shielded cable for the connection between the radio and the

antenna elements.

 Be sure to put a 10uF capacitor on EACH 3.3V power pin. Also, place that capacitor to the pin as close as

possible to make sure the internal PMU working correctly.

 Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.

 To get maximum throughput when operate at MIMO 2x2, two antennas with at least 25 dB isolation is

recommended.

 To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic

objects or components.

15 R

ECOMMENDED

TORAGE

ANDLING

AKING

AND

EFLOW

ROFILE

15.1 Required Storage Conditions

15.1.1 Prior to Opening the Dry Packing

The following are required storage conditions prior to opening the dry packing:

 Normal temperature: 5~40℃

 Normal humidity: 80% (Relative humidity) or less

 Storage period: One year or less

Note: Humidity means Relative Humidity.

15.1.2 After Opening the Dry Packing

The following are required storage conditions after opening the dry packing (to prevent moisture absorption):

 Storage conditions for one-time soldering:

– Temperature: 5~25℃

– Humidity: 60% or less

SU60-SIPT

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– Period: 48 hours or less after opening

 Storage conditions for two-time soldering

Storage conditions following opening and prior to performing the 1

reflow:

– Temperature: 5~25℃

– Humidity: 60% or less

– Period: 48 hours or less after opening

Storage conditions following completion of the 1

reflow and prior to performing the 2

reflow

– Temperature: 5~25℃

– Humidity: 60% or less

– Period: 48 hours or less after completion of the 1

reflow

15.1.3 Temporary Storage Requirements after Opening

The following are temporary storage requirements after opening:

 Only re-store the devices once prior to soldering.

 Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing

again using heat-sealing.

The following indicate the required storage period, temperature, and humidity for this temporary storage:

1. Storage temperature and humidity

*** - External atmosphere temperature and humidity of the dry packing

2. Storage period

– X1+X2 – Refer to After Opening the Dry Packing storage requirements.

– Y – Two weeks or less.

15.2 Baking Conditions

Baking conditions and processes for the SSD50NBT follow the J-STD-033 standard which includes the following:

 The calculated shelf life in a sealed bag is 12 months at <40℃ and <90% relative humidity.

 Once the packaging is opened, the SiP must be mounted (per MSL3/Moisture Sensitivity Level 3) within 168

hours at <30℃ and <60% relative humidity.

 If the SiP is not mounted within 168 hours or if, when the packaging is opened, the humidity indicator card

displays >10% humidity, then the product must be baked for 48 hours at 125℃ (±5℃).

Temperature: 5-40°C

Humidity: 80% or less

Temperature: 5-25°C

Humidity: 60% or less

Temperature: 5-40°C

Humidity: 80% or less

Temperature: 5-25°C

Humidity: 60% or less

*** ***

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

15.3 Surface Mount Conditions

The following soldering conditions are recommended to ensure device quality.

15.3.1 Soldering

Note: When soldering, the stencil thickness should be ≥ 0.1 mm.

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen

environment)

 Measuring point – IC package surface

 Temperature profile:

Figure 13 Temperature profile

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

15.3.2 Cautions When Removing the SIP from the Platform for RMA

 Bake the platform before removing the SIP from the platform. Reference baking conditions.

 Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician.

Suggestion conditions:

 One-side component platform:

– Set the hot plate at 280°C.

– Put the platform on the hot plate for 8~10 seconds.

– Remove the SIP from platform.

 Two-side components platform:

– Use two hot air guns

– On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable

distance from the platform PCB.

– On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be

removed from platform PCB.

 Remove the residue solder under the bottom side of SIP.

(Not accepted for RMA) (Accepted for RMA analysis)

SIP with residue solder on the bottom SIP without residue solder on the bottom

 Remove and clean the residue flux is needed.

Platform

SIP

Remove Nozzle

Pre

heat

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

15.3.3 Precautions for Use

 Opening/handing/removing must be done on an anti-ESD treated workbench.

All workers must also have undergone anti-ESD treatment.

 The devices should be mounted within one year of the date of delivery.

16 R

EGULATORY

16.1 Certified Antennas

Model Type Connector

2400~2483.5MHz

5150~5250MHz 5250~5350MHz

5470~5725MHz 5725~5850MHz

Laird/NanoBlade-IP04

PCB Dipole

IPEX U.FL

2 dBi (2.4-2.5 GHz), 3.9 dBi (5.15-5.35 GHz), 4 dBi

(5.6 GHz)

Laird/MAF95310 Mini NanoBlade

Flex

PCB Dipole

IPEX U.FL

2.79 dBi @ 2.4 GHz, 3.38 dBi @ 5 GHz

Ethertronics/WLAN_1000146

Magnetic

Dipole

IPEX U.FL

2.5dBi (2.390-2.490),3.5 dBi (4.900-5.100),3.5 dBi

(5.150-5.350),3.5 dBi (5.70-5.900)

LSR/FlexPIFA 001-0016

PIFA

IPEX U.FL

2.5dBi@2.4GHz, 3dBi@5GHz

LSR/001-0009

Dipole

IPEX U.FL

2dBi@2.4GHz, 2dBi@5GHz

17 FCC

AND

EGULATORY

Model

US/FCC

CANADA/IC

SIPT series

SQG

U60

SIPT

3147A

U60

SIPT

The SSD50NBT has been designed to pass certification with the antenna listed below. The required antenna

impedance is 50 ohms.

Model

Type

Connector

Peak gain (dBi)

2400~2483.5

MHz

5150~5250

MHz

5250~5350

MHz

5470~5725

MHz

5725~5850M

Laird/NanoBlade-IP04

PCB Dipole

IPEX U.FL

2.0 dBi 3.9 dBi

3.9 dBi 4.0dBi

Laird/MAF95310 Mini

NanoBlade Flex

PCB Dipole

IPEX U.FL

2.79 dB 3.38dBi

Ethertronics/WLAN_1000146

Magnetic

Dipole

IPEX U.FL

2.5 dBi 3.5 dBi

LSR/FlexPIFA 001-0016

PIFA

IPEX U.FL

2.5dBi 3.0dBi

LSR/001-0009

Dipole

IPEX U.FL

2.0dBi 2.0 dBi

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

17.1 FCC

17.1.1 Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in an installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined by turning the equipment off

and on, the user is encouraged to try to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution:

Any changes or modifications not expressly approved by the party responsible for compliance could void the

user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

Important Note

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Country Code selection feature to be disabled for products marketed to the US/Canada.

This device is intended only for OEM integrators under the following conditions:

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2. The transmitter module may not be co-located with any other transmitter or antenna,

3. For all products market in US, OEM must limit the operation channels in CH1 to CH11 for 2.4G band by

supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to

Regulatory Domain change.

If the three conditions above are met, further transmitter testing is not required. However, the OEM integrator

is still responsible for testing their end-product for any additional compliance requirements required with this

module installed.

Important Note

If these conditions cannot be met (for example certain laptop configurations or co-location with another

transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final

product. In these circumstances, the OEM integrator is responsible for re-evaluating the end product (including

the transmitter) and obtaining a separate FCC authorization.

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

17.1.2 End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm

may be maintained between the antenna and users. The end product must be labeled in a visible area with the

following: Contains FCC ID: SQG-SSD50NBT.

17.1.3 Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

17.2 Industry Canada

17.2.1 Industry Canada Statement

This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two

conditions:

 This device may not cause interference; and

 This device must accept any interference, including interference that may cause undesired operation of

the device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.

L’exploitation est autorisée aux deux conditions suivantes:

 l’appareil ne doit pas produire de brouillage;

 l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d’en compromettre le fonctionnement.

This radio transmitter (IC: 3147A-SSD50NBT) has been approved by Industry Canada to operate with the

antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list,

having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this

device.

Le présent émetteur radio (IC: 3147A-MSD50NBT) a été approuvé par Industrie Canada pour fonctionner avec

les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus

dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour

l'exploitation de l'émetteur.

17.2.2 Antenna Information

Model

Type

Connector

Peak gain (dBi)

2400~2483.5

MHz

5150~5250

MHz

5250~5350

MHz

5470~5725

MHz

5725~5850MH

Laird/NanoBlade-IP04

PCB Dipole

IPEX U.FL

2.0 dBi 3.9 dBi 3.9 dBi 4.0 dBi

Laird/MAF95310 Mini

NanoBlade Flex

PCB Dipole

IPEX U.FL

2.79 dB 3.38 dBi

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Model

Type

Connector

Peak gain (dBi)

Ethertronics/WLAN_10

00146

Magnetic

Dipole

IPEX U.FL

2.5 dBi 3.5 dBi

LSR/FlexPIFA 001-

0016

PIFA

IPEX U.FL

2.5 dBi 3.0 dBi

LSR/001-0009

Dipole

IPEX U.FL

2.0 dBi 2.0 dBi

Caution:

(i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for

harmful interference to co-channel mobile satellite systems;

(ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-

5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with EIRP limit;

(iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-

5850 MHz shall be such that the equipment still complies with the EIRP limits specified for point-to-point and

non-point-to-point operation as appropriate; and

Operations in the 5.25-5.35GHz band are restricted to indoor usage only.

Avertissement:

(i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation

à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les

mêmes canaux;

(ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs

utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e;

(iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs

utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation

point à point et l'exploitation non point à point, selon le cas;

Les opérations dans la bande de 5.25-5.35GHz sont limités à un usage intérieur seulement.

17.2.3 Radiation Exposure Statement

This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

17.2.4 Déclaration d'exposition aux radiations

Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.

Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

This device is intended only for OEM integrators under the following condition:

 The transmitter module may not be co-located with any other transmitter or antenna.

If the condition above is met, further transmitter test is not required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module

installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

 Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas

nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes

exigences de conformité supplémentaires requis pour ce module installé.

Important Note:

If these conditions cannot be met (for example certain laptop configurations or co-location with another

transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the

final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate Canada authorization.

Note Importante:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est

plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,

l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une

autorisation distincte au Canada.

17.2.5 End Product Labeling

The end product must be labeled in a visible area with the following: Contains IC: 3147A-SSD50NBT.

17.2.6 Plaque signalétique du produit final

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: Contient des IC: 3147A-

SSD50NBT.

17.2.7 Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

17.2.8 Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon

d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements

comme indiqué dans ce manuel.

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

18 E

UROPEAN

NION

EGULATORY

The SSD50NBT has been tested for compliance with relevant standards for the EU market. SSD50NBT module

was tested with antennas listed below.

Model Type Connector

2400~2483.5MHz

5150~5250MHz 5250~5350MHz

5470~5725MHz 5725~5850MHz

Laird/NanoBlade-IP04

PCB Dipole

IPEX U.FL

2 dBi (2.4-2.5 GHz), 3.9 dBi (5.15-5.35 GHz), 4 dBi

(5.6 GHz)

Laird/MAF95310 Mini NanoBlade Flex

PCB Dipole

IPEX U.FL

2.79 dBi @ 2.4 GHz, 3.38 dBi @ 5 GHz

Ethertronics/WLAN_1000146

Magnetic

Dipole

IPEX U.FL

2.5dBi (2.390-2.490),3.5 dBi (4.900-5.100),3.5 dBi

(5.150-5.350),3.5 dBi (5.70-5.900)

LSR/FlexPIFA 001-0016

PIFA

IPEX U.FL

2.5dBi@2.4GHz, 3dBi@5GHz

LSR/001-0009

Dipole

IPEX U.FL

2dBi@2.4GHz, 2dBi@5GHz

The OEM should consult with a qualified test house before entering their device into an EU member country to

make sure all regulatory requirements have been met for their complete device.

Reference the Declaration of Conformities listed below for a full list of the standards that the modules were

tested to. Test reports are available upon request.

18.1 EU Declarations of Conformity

This device complies with the essential requirements of the Radio Equipment directive: 2014/53/EU. The

following test methods have been applied to prove presumption of conformity with the essential requirements

of the Radio Equipment directive 2014/53/EU:

Manufacturer:

Laird

Products:

SIPT series

EU Directives:

2014/53/EU

–

Radio Equipment Directive (RED)

Reference standards used for presumption of conformity:

Article Number

Requirement Reference standard(s)

3.1a

Low voltage equipment safety

EN 60950-1:2006+A11+A1:2010+A12:2011+A2 2013

RF Exposure EN 62311:2008

EN 50385:2002

3.1b Protection requirements with respect

to electromagnetic compatibility

EN 301 489-1 v2.2.0 (Draft)

EN 301 489-17 v3.2.0 (Draft)

3.2 Means of the efficient use of the

radio frequency spectrum

EN 300 328 v2.1.1 (2015-02)

EN 301 893 v2.1.0 (Final Draft)

Declaration:

We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and

that the above product to which this declaration relates is in conformity with all the applicable essential

requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.

Place of Issue: Laird

W66N220 Commerce Court, Cedarburg, WI 53012 USA

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

tel: +1

262

375

4400

fax: +1

262

364

2649

Date of Issue: May 2017

Name of Authorized Person: Thomas T Smith, Director of EMC Compliance

Signature of Authorized Person:

Maximum Output Power for Each Frequency

TBD

20.5 dBm, 5.15-5.25 GHz

20.5 dBm, 5.25-5.35 GHz

20.5 dBm, 5.47-5.725 GHz

Software Version for Testing

SW version: P95

The minimum distance between the user and/or any bystander and the radiating structure of the transmitter

is 20 cm.

5150 ~ 5350 MHz is limited to indoor used in

the following countries:

BE DK

LU NL

LI TR

CZ EE

IT LT

19 O

RDERING

NFORMATION

art

umber

Description

SIPT series

2X2 802.11 a/b/g/n

/ac

with BT4.

dual mode module.

19.1 General Comments

This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If

in doubt, ask.

Česky

[Czech]

[Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími

příslušnými ustanoveními směrnice 1999/5/ES.

Dansk

[Danish]

Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets typebetegnelse]

overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.

Deutsch

[German]

Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den

grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG

befindet.

Eesti

[Estonian]

Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of equipment]

vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele

sätetele.

English Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the

essential requirements and other relevant provisions of Directive 1999/5/EC.

Español

[Spanish]

Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los

requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Ελληνική

[Greek]

ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ∆ΗΛΩΝΕΙ ΟΤΙ [type of equipment]

ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ

∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ.

Français

[French]

Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences

essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.

Italiano

[Italian]

Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti

essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.

Latviski

[Latvian]

Aršo[name of manufacturer /izgatavotājanosaukums] deklarē, ka[type of equipment / iekārtas

tips]atbilstDirektīvas 1999/5/EK būtiskajāmprasībām un citiemar to saistītajiemnoteikumiem.

Lietuvių

[Lithuanian]

Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas

1999/5/EB Direktyvos nuostatas.

Nederlands

[Dutch]

Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de

essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.

Malti

[Maltese]

Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet

essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.

Magyar

[Hungarian]

Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus]megfelel a vonatkozó alapvetõ követelményeknek

és az 1999/5/EC irányelv egyéb elõírásainak.

Polski

[Polish]

Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami

oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC.

Português

[Portuguese]

[Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais

e outras disposições da Directiva 1999/5/CE.

Slovensko

[Slovenian]

[Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi

relevantnimi določili direktive 1999/5/ES.

Slovensky

[Slovak]

[Menovýrobcu]týmtovyhlasuje, že[typzariadenia]spĺňazákladnépožiadavky a

všetkypríslušnéustanoveniaSmernice 1999/5/ES.

Suomi

[Finnish]

[Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä]

tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden

ehtojen mukainen.

Svenska

[Swedish]

Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga

egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.

19.1.1 Labeling Requirements

The end product must be labeled in a visible area with the following notice:

subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents

cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird

materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or

consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of

SU60-SIPT

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

Americas: +1-800-492-2320

Europe: +44-1628-858-940

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which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird

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Laird Connectivity 60SIPT 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module User Manual CS DS SU60 SIPT PRELIMINARY

Laird Technologies 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module CS DS SU60 SIPT PRELIMINARY

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Users Manual_60-SIPT_SQG-60SIPT

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