Qisda GW50 MOD-SM Qisda BT/WLAN CWM-01 User Manual

Qisda Corporation MOD-SM Qisda BT/WLAN CWM-01

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Date Submitted2012-03-08 00:00:00
Date Available2012-03-08 00:00:00
Creation Date2012-02-20 09:49:45
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Document Lastmod2012-02-20 09:54:42
Document Titleuntitled

W50
WLAN / Bluetooth Wireless Module
Rev. 1.0.0
2011/10/20
Copyright © 2010 Qisda Corporation. All rights reserved.
This document contains proprietary technical information which is the property of Qisda
Corporation and is issued in strict confidential and shall not be disclosed to others parties in
whole or in parts without written permission of Qisda Corporation.
The documents contain information on a product, which is under development and is issued
for customer evaluation purposes only.
Qisda may make changes to product specifications at any time, without notice.
Wireless Data Application BD
Mobile Communications BU
Qisda Corporation
18 Jihu Road, Nei-Hu, Taipei 114, Taiwan
Tel: +886-2-2799-8800
Fax: +886-2-2656-6398
http://Qisda.com
Copyright ©2008 Qisda Corporation.
Confidential Property
Contents
1.
REVISION HISTORY ............................................................................................. 4
2.
FUNCTIONAL DESCRIPTION ............................................................................... 5
2.1.
3.
4.
OVERVIEW ....................................................................................................................................... 5
2.2.
PIN CONFIGURATION ....................................................................................................................... 6
2.2.1.
PIN ARRANGEMENT .......................................................................................................................... 6
2.2.2.
PIN FUNCTION .................................................................................................................................. 6
TECHNICAL DESCRIPTION.................................................................................. 9
3.1.
RADIO FEATURES .............................................................................................................................. 9
3.1.1.
RF PORT ........................................................................................................................................... 9
3.1.2.
RF BLUETOOTH ................................................................................................................................. 9
3.1.3.
RF WLAN ....................................................................................................................................... 9
3.1.4.
SPURIOUS EMISSIONS ........................................................................................................................ 9
3.2.
CLOCK ............................................................................................................................................ 9
3.2.1.
MAIN CLOCK ................................................................................................................................. 10
3.2.2.
SLEEP CLOCK ................................................................................................................................. 10
3.3.
START UP AND RESET ....................................................................................................................... 10
3.3.1.
POWERING..................................................................................................................................... 10
3.3.2.
RESET ............................................................................................................................................. 11
3.4.
ANTENNA DIAGNOSE CIRCUIT ........................................................................................................ 12
3.5.
POWER SUPPLY ............................................................................................................................... 13
3.5.1.
MAIN POWER ................................................................................................................................. 13
3.5.2.
SUPPLY OF I/O PINS ....................................................................................................................... 14
3.5.3.
POWER DOWN MODE ................................................................................................................... 14
ELECTRICAL SPECIFICATION............................................................................ 15
4.1.
ABSOLUTE MAXIMUM RATINGS ........................................................................................................ 15
4.2.
OPERATING CONDITIONS ............................................................................................................... 15
4.2.1.
ENVIRONMENTAL CONDITIONS ....................................................................................................... 15
4.2.2.
POWER SUPPLY ............................................................................................................................... 15
4.2.3.
DIGITAL PINS .................................................................................................................................. 16
4.2.4.
EXTERNAL SLEEP CLOCK TIMING..................................................................................................... 16
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Version: 0.0.1 – 2011/12/02
4.2.5.
5.
6.
7.
RF PERFORMANCE ........................................................................................................................ 16
MECHANICAL SPECIFICATION........................................................................ 18
5.1.
PACKAGE TYPE .............................................................................................................................. 18
5.2.
PACKAGE DIMENSIONS .................................................................................................................. 18
LABELING AND ORDERING INFORMATION .................................................... 20
6.1.
PRODUCT LABEL ............................................................................................................................. 20
6.1.1.
SHIELDING FRAME COVER LABEL ................................................................................................... 20
6.1.2.
SHIELDING CASE COVER LABEL ..................................................................................................... 20
6.2.
ORDERING INFORMATION .............................................................................................................. 21
PRODUCT HANDLING ...................................................................................... 21
7.1.
PACKAGING .................................................................................................................................. 21
7.2.
PACKING MATERIALS ..................................................................................................................... 24
7.2.1.
HUMIDITY PROTECTION MATERIALS ................................................................................................ 24
7.2.1.1.
ALUMINUM BAG ........................................................................................................................... 24
7.2.1.2.HUMIDITY INDICATOR ........................................................................................................................... 25
7.2.1.3.DESICCANT .......................................................................................................................................... 26
8.
7.2.2.
PACKING MATERIALS ..................................................................................................................... 27
7.2.2.1.
REEL ............................................................................................................................................... 27
7.2.2.2.
PIZZA BOX ...................................................................................................................................... 27
7.2.2.3.
CARTON ........................................................................................................................................ 29
7.2.3.
LABELS ........................................................................................................................................... 29
7.2.3.1.
OOB LABEL................................................................................................................................... 29
7.2.3.2.
CARTON LABEL .............................................................................................................................. 35
7.2.3.3.
CAUTION LABEL ............................................................................................................................. 35
7.2.4.
TAPES ............................................................................................................................................. 36
7.3.
SHIPMENT, STORAGE AND HANDLING ............................................................................................. 37
CERTIFICATIONS............................................................................................... 37
8.1. FCC REGULATIONS: ......................................................................................... 37
9.
CONTACT ......................................................................................................... 38
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Version: 0.0.1 – 2011/12/02
1. Revision history
Version
VER: 0.0.1
Date
2011/12/2
Notes
Preliminary version
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Version: 0.0.1 – 2011/12/02
2. Functional description
2.1. Overview
This chapter provides a short overview over the most important functions and features of the module. This data sheet is preliminary and will be changed if needed.
The module is built on the Marvell® 88W8688 low-cost highly-integrated IEEE
802.11a/g/b MAC/Baseband/RF WLAN and Bluetooth Baseband/RF system-on-chip
(SoC).
The module supports IEEE 802.11g payload data rates of 6, 9, 12, 18, 24, 36, 48, and 54
Mbps, as well as 802.11b data rates of 1, 2, 5.5 and 11 Mbps for WLAN operation.
For Bluetooth operation, the module supports Bluetooth 3.0 + High Speed (HS) (also
compliant with Bluetooth 2.1 + EDR).
For security, the 88W8688 supports the IEEE 802.11i security standard through implementation of the Advanced Encryption Standard (AES)/Counter Mode CBC-MAC
Protocol (CCMP), and Wired Equivalent Privacy (WEP) with Temporal Key Integrity
Protocol (TKIP) security mechanisms. The module also supports Internet Protocol Security (IPsec) with DES//3DES/AES encryption and MD5/SHA-1 authentication as well
as 802.11e Quality of Service (QoS).
The module supports dual SDIO host interface for connecting the WLAN and Bluetooth to the host processor. For Bluetooth application the high-speed UART (up to
4MB/s), PCM/Inter-IC Sound (I2S), are supported too.
For better throughput of WLAN/BT, the module provides different RF paths for WLAN
and Bluetooth for own antennas. By using of two antennas with enough decoupling it
enables to do without coexistence.
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Version: 0.0.1 – 2011/12/02
2.2. Pin Configuration
35
30
GND
GND
VCC_3V0
GND
VCC_3V3
VCC_3V3
VCC_1V8
GND
SD_CLK
SD_CMD
SD_DATA[1]
SD_DATA[0]
SD_DATA[3]
40
45
UART_CTS
SD_DATA[2]
GND
UART_RTS
UART_RX
UART_TX
2.2.1. Pin arrangement
28
46
27
VCC_VIO_X1
SLEEP_CLK
25
ANT_SEL_P
JTAG_TMS_CPU
POWER_DOWNn
GND
GND
VCC_3V3
50
VCC_3V3
ANT_SEL_N
GND
RSESTn
GND
VCC_BT_ANT_DIAG
54
VCC_WLAN_ANT_DIAG
19
WLAN_ANT_DIAG
GND
WLAN_RF
18
GND
JTAG_TRSTn
JTAG_TDO
JTAG_TDI
GND
JTAG_TCK
VCC_VIO_X2
GND
BT_PCM_SYNC
JTAG_TMS_SYS
15
10
BT_PCM_DOUT
GND
BT_PCM_DIN
BT_RF
GND
BT_PCM_CLK
BT_ANT_DIAG
20
Figure 2: Pin arrangement
2.2.2. Pin function
Pin#
Interface
Pin Name
Type
Supply
Description
36
SD_CLK
VIO_X1
SDIO Clock Input
37
SD_CMD
I/O
VIO_X1
SDIO Command
SD_DATA[0]
I/O
VIO_X1
SDIO Data Line Bit [0]
SD_DATA[1]
I/O
VIO_X1
SDIO Data Line Bit [1]
41
SD_DATA[2]
I/O
VIO_X1
SDIO Data Line Bit [2]
40
SD_DATA[3]
I/O
VIO_X1
SDIO Data Line Bit [3]
46
UART CTS
VIO_X1
UART Clear to send
UART RX
VIO_X1
UART Receive
UART TX
VIO_X1
UART Transmit
UART RTS
VIO_X1
UART Request to send
BT_PCM_CLK
VIO_X2
Bluetooth PCM Clock (master)
BT_PCM_SYNC
VIO_X2
Bluetooth PCM Sync (master)
39
38
44
45
SDIO
UART
43
PCM
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Version: 0.0.1 – 2011/12/02
6
BT_PCM_DOUT
VIO_X2
Bluetooth PCM Data Out
BT_PCM_DIN
VIO_X2
Bluetooth PCM Data In
52
RESETn
VIO_X1
Shut down BT/WLAN IC (active
low, internal 10 kOhm pull-down)
POWER_DOWNn
Shut down internal 1V8 LDO (active
low, internal 10 kOhm pull-down)
VIO_X1
Clock Input for External Sleep Clock
CONTROL
50
47
CLOCK
SLEEP_CLK
11
JTAG_TCK
VIO_X2
JTAG Test Clock Input
12
JTAG_TDI
VIO_X2
JTAG Test Data Input
JTAG_TDO
VIO_X2
JTAG Test Data Output
JTAG_TRSTn
VIO_X2
JTAG Test Reset (active low)
15
JTAG_TMS_SYS
VIO_X2
JTAG Test Mode Select
49
JTAG_TMS_CPU
VIO_X2
JTAG Test Mode Select
13
14
17
JTAG
RF
54
BT_RF
I/O
Bluetooth RF, DC decoupled
WLAN_RF
I/O
WLAN RF, DC decoupled
BT_ANT_DIAG
VCC_BT_
ANT_DIAG
WLAN_ANT_DIAG
VCC_WLAN_
WLAN antenna diagnose
ANT_DIAG
ANT_SEL_P
BT/WLAN Antenna select when the
antenna is shared for BT and WLAN
ANT_SEL_N
BT/WLAN Antenna select when the
antenna is shared for BT and WLAN
Diagnose
19
48
51
Bluetooth /
WLAN
Antenna
Select
Bluetooth antenna diagnose
Power
23,24
VCC_3V3
Positive supply for WLAN PA
32,33
VCC_3V3
Positive supply for 1V8, 3V0 voltage
regulators
VIO_X1 supply domain. Positive supply for SDIO, UART interfaces as well
as RESET and SLEEP_CLOCK pads
26
VCC_VIO_X1
VCC_VIO_X2
VIO_X2 supply domain. Positive supply for PCM and JTAG interfaces pads
as well as internal E2PROM
29
VCC_3V0
internal 3V0 voltage regulator, for test
purpose, leave unconnected
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Version: 0.0.1 – 2011/12/02
34
VCC_1V8
internal 1V8 voltage regulator, for test
purpose, leave unconnected
53
VCC_BT_ANT_DIAG
Supply for BT antenna diagnose circuit
20
VCC_WLAN_ANT_DIAG
Supply for WLAN antenna diagnose
circuit
GND
Ground
1,3,8,
10,16,
18,21,
22,25,
27,28,
30,31,
35,42
*) The antenna diagnose functionality is supported only when antenna has a DC path with
51K Ohm resistance to ground.
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Version: 0.0.1 – 2011/12/02
3.
Technical Description
3.1. Radio Features
3.1.1. RF port
For WLAN and Bluetooth, the module provides single ended, 50 ohm matched bidirectional ports. The RX / TX switches are incorporated either in module or in 88W8688
chip.
3.1.2. RF Bluetooth
The RF part of Bluetooth has a balun for transforming the differential RF port of
88W8688 to single ended port of module. The balun is also used for powering internal
PA / LNA with 1, 8V supply.
The output power of 2 dBm with power control is fully compliant to BT Class II requirements.
The RF modem supports GFSK and DPSK modulations according to Bluetooth 2.1+EDR
standard.
3.1.3. RF WLAN
The module supports 802.11g/b operation in word harmonized 2.4 GHz ISM band. The
Power Amplifier, RX balun and TX/RX switch are integrated in to module. The output
power is 15 +/- 1 dBm in automotive temperature range.
3.1.4. Spurious emissions
Both the spurious emission of conducted and radiated had compliant with the
standards EN 300328, FCC Part 15.247.
3.2. Clock
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Version: 0.0.1 – 2011/12/02
3.2.1. Main clock
The local oscillator and digital clocks are generated from crystal. The crystal is tuned
during production process and tune values are stored in on board E2PROM.
3.2.2. Sleep clock
The sleep clock is delivered from a external 32 kHz oscillator. This clock as from external source is required for Bluetooth low power mode applications.
3.3. Start up and Reset
A low level at POWER_DOWNn pin turns off internal 1V8 LDO, but 3V0 band gap reference remain on. A low level at RESETn pin turns off IC, this pin is also used for basic
reset operation.
The both pins POWER_DOWNn and RESETn have internal 10K Ohm pull-down resistors.
It is distinguished between powering and reset.
3.3.1. Powering
While powering external voltages VCC_VIO_X1/2 VCC_3V3 are turned on. For correct functionality the start-up timing below has to follow. An additional reset isn’t
necessary. The VCC_VIO_X1 and X2 can be turned on before VCC_3V3 but latest
concurrently with it. The time between rising of VCC_VIO_X1/2 and VCC_3V3 isn’t
specified and can be unrestricted.
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Version: 0.0.1 – 2011/12/02
3.1 powering
3.3.2. Reset
After powering the IC correctly, it can be anytime reset by pulling down of signal
RESETn for at least 5 ms (Pic 3.1). The reset by POWER_DOWNn-RESETn sequence is
also possible. In this case the duration of POWER_DOWNn should be at least 700 ms.
3.2 Reset by RESETn
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Version: 0.0.1 – 2011/12/02
3.3 Reset by RESETn and POWER_DOWNn
3.4. Antenna diagnose circuit
The picture below shows the principle of antenna diagnose circuit.
Requirement for functionality of circuit is that the external antenna has a internal DC
path to ground with real impedance value of 51K Ohm.
This impedance builds with in module built-in resistor of 51K Ohm a voltage divider. By
measuring and evaluation of voltage in divider midpoint it is possible to detected 3
states of antenna connection:
open, measured voltage is equal supply voltage of antenna diagnose circuit
antenna is connected correctly, measured voltage is equal the half of supply
voltage antenna diagnose circuit
Antenna is shorted to GND, measured voltage is equal 0V
Those three states are detected if supply voltage of antenna diagnose circuit (pins
VCC_BT_ANT_DIAG or VCC_WLAN_ANT_DIAG) is equal reference voltage of ADC.
In case that supply voltage is lower than ADC reference voltage it is possible to detect one more state:
Antenna has bypass to higher voltage source (for example to UBAT), the
measured voltage is higher than supply voltage of antenna diagnose circuit.
On system side can be used a low pass filter for filtering. Good results can be
achieved when C1=220nF and R1=51K Ohm, in this case the resistor R1 limits the
current into ADC if antenna connector is shorted to battery voltage too.
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Version: 0.0.1 – 2011/12/02
3.5. Power supply
3.5.1. Main power
All for functionality necessary power supplies are generated by into module integrated 1.8 V LDO, 1V and 3.0 V band gap reference. The digital core supply of 1,2V is
generated by in 88W8688 integrated LDO powering external voltages VCC_VIO_X1/2
VCC_3V3 are turned on.
For correct functionality the start-up timing below has to follow. An additional reset
isn’t necessary. The VCC_VIO_X1 and X2 can be turned on before VCC_3V3 but latest concurrently with it. The time between rising of VCC_VIO_X1/2 and VCC_3V3 isn’t
specified and can be unrestricted.
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Version: 0.0.1 – 2011/12/02
3.4 Power supply structure
3.5.2. Supply of I/O pins
The I/O pins are grouped in two supply domains: VCC_VIO_X1 and VCC_VIO_X2. Basically each domain can be powered either from 1,8V or 3,3V, but in circuits used
E2PROM can’t be powered by dual voltage. So supply of the VCC_VIO_X2 domain is
specified by E2PROM chip. The supply for VCC_VIO_X2 can be chosen at ordering.
The supply for VCC_VIO_X1 can be free chosen.
3.5.3. Power Down Mode
The module can be put into power down mode by signal POWER_DOWNn (Pin 50,
active level low).
Please note that 3V0 bang gap reference always remains on and consumes about
10 mA even if the IC and 1V8 LDO are powered down. From Power Down Mode the
module can be wacked up by powering sequence (pic. 3.1).
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Version: 0.0.1 – 2011/12/02
4. Electrical specification
4.1. Absolute maximum ratings
Symbol
Parameter
Min.
Max.
Units
VIO_X1
Power supply voltage
with respect to VSS
2.3
4.2
VIO_X2
Power supply voltage
with respect to VSS
2.3
4.2
3V3
Power supply voltage
with respect to VSS
3.45
-40
+85
℃
Typ.
Max.
Units
+85
℃
Storage temperature
Tstg
4.2. Operating conditions
4.2.1. Environmental conditions
Symbol
Parameter
Min.
Ta
Ambient temperature range
-40
4.2.2. Power supply
Symbol
Parameter
Min.
Typ.
Max.
Units
VIO_X1
Host Interface digital I/O
power supply
16.2
1.8
1.98
2.97
3.3
3.63
VIO_X2
Digital I/O power supply
16.2
1.8
1.98
2.97
3.3
3.63
3.15
3.3
3.45
3V3
I_VIO_X1
Current Supply VIO_X1
tbd
205
mA
I_VIO_X2
Current Supply VIO_X2
tbd
125
mA
I_3V3
Current Supply 3V3
285
400
mA
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Version: 0.0.1 – 2011/12/02
4.2.3. Digital pins
Symbol
Parameter
VCC_VIO
Min.
Typ.
Max.
Units
POWER_
DOWNn
Power Down input, High
1.4
5.5
Power Down input, Low
-0.3
0.5
Vin
Input high voltage
1.8
1.2
V18+0.3
3.3
2.3
V33+0.3
Vin
Input low voltage
1.8
-0.3
0.6
3.3
-0.3
1.1
Vout
Output high voltage
1.8
1.22
3.3
2.57
Vout
Output low voltage
1.8
0.4
3.3
0.4
4.2.4. External Sleep Clock Timing
Symbol
Parameter
Min.
Typ.
Max.
Units
CLK
Clock Frequency
Range
32 or 32.768 - 50
ppm
32 or
32.768
32 or 32.768 + 50
ppm
kHZ
THIGH
Clock high time
40
--
--
ns
TLOW
Clock low time
40
--
--
ns
TRISE
Clock rise time
--
--
ns
TFALL
Clock fall time
--
--
ns
4.2.5. RF Performance
4.2.5.1 BT Radio Characteristics
Parameter Items
Class1.5:
Transmit Power Level
Specifications
7.8 ± 0.8 dBm (2441Mhz),
7.8 ± 1.5 dBm (2402~2480Mhz),
Class2.0:
2.5 ± 0.8 dBm (2441Mhz),
2.5 ± 1.5 dBm (2402~2480Mhz),
Receive Sensitivity
Operating Frequency
-80dBm (GFSK),
-77dBm (π/4-DQPSK),
-77dBm (8DPSK)
2402 MHz to 2480 MHz
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Version: 0.0.1 – 2011/12/02
Parameter Items
Channel
Specifications
79
Carrier Spacing
1 MHz separation
Duplexing
Time Division Duplex
Hopping Rate
1600 hops/per second
Symbol Rate
1 Mbps (GFSK)
2 Mbps (π/4-DQPSK)
3 Mbps (8DPSK)
Modulation
GFSK BT =0.5
π/4-DQPSK
8DPSK
4.2.5.2 WLAN Radio Characteristics
Parameter Items
Specifications
Frequency Band
2.4000~2.4835Ghz (2.4G ISM Band)
Selectable Sub Channel
13 Channels
Modulation
Supported Rates
OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK,
DQPSK, CCK , 16QAM, 64QAM
1, 2, 5.5, 11 Mbps (802.11b)
6, 9, 12, 18, 24, 36, 48, 54 Mbps (802.11g)
Maximum Receiver Level
-10dBm with PER < 8% (802.11b)
-10dBm with PER < 10% (802.11g)
Output Power
15 dBm ± 1.5 dBm for 1, 2, 5.5, 11Mbps (802.11b)
15 dBm ± 1.5 dBm for 6 ,9 and >12Mhz (802.11g)
Carrier Frequency Accuracy
+/- 25ppm
(+/-2ppm in 25℃)
(F=2412+n*5Mhz,n=0~12)
1.0 Mbps (BPSK) : <35%
802.11b Mode EVM
2.0 Mbps (BPSK) : <35%
5.5 Mbps (QPSK) : <35%
11.0 Mbps (QPSK) : <35%
802.11g Mode EVM
6.0 Mbps (BPSK) : <-5.0dB
9.0 Mbps (BPSK) : <-8.0dB
12.0 Mbps (QPSK) : <-10.0dB
18.0 Mbps (QPSK) : <-13.0dB
24.0 Mbps (16-QAM) : <-16.0dB
36.0 Mbps (16-QAM) : <-19.0dB
48.0 Mbps (64-QAM) : <-22.0dB
54.0 Mbps (64-QAM) : <-25.0dB
802.11b Mode Sensitivity
PER <8%, Rx Sensitivity @ 1.0 Mbps : -90dBm
PER <8%, Rx Sensitivity @ 11.0 Mbps: -86dBm
- 17 -
Version: 0.0.1 – 2011/12/02
Parameter Items
Specifications
PER <10%, Rx Sensitivity @ 6.0 Mbps: -88dBm
PER <10%, Rx Sensitivity @ 54.0 Mbps: -72dBm
802.11g Mode Sensitivity
5. Mechanical specification
5.1. Package Type
54pin LGA, 1,6mm pitch
5.2. Package dimensions
Figure 3 : Package dimensions
Parameter
Description
Min.
Typ.
Max.
Units
Height
0.15
21
0.15
mm
Width
0.15
30
0.3
mm
Thickness
0.2
0.15
mm
Pin to Pin Pitch
tbd
1.6
tbd
mm
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Version: 0.0.1 – 2011/12/02
E
Edge to Pin
tbd
0.9
tbd
mm
Edge to Pin
tbd
3.6
tbd
mm
Pin Width
tbd
tbd
mm
Weight
- 19 -
Version: 0.0.1 – 2011/12/02
6. Labeling and ordering information
6.1. Product label
2 Product Labels of W50 have been placed on Shielding Frame and
Shielding Case. For more information about the W50 Product Labels, please
refer to the below 6.1.1 and 6.1.2.
6.1.1. Shielding Frame Cover Label
The Label type of W50 Shielding Frame cover label is a 2D-Code Label
with 9 * 9 mm dimensions. The P/N has been defined as 4E.1HR02.001. The
2D-Code digits have been defined as below:
1st digit: Present the 2D-Code type.
2nd digits: Present the Main board type.
3rd~4th digits: Present the Model type.
5th~6th digits: Present the Date. Refer to the below figure for the Date
code rules.
7th digit: Present the Factory code.
8th~12th digits: Present the serial number.
6.1.2. Shielding Case Cover Label
The W50 Shielding Case cover label with 13 * 13 mm dimensions, defined
as 4E.1HR01.001, included below information:
A. 2D-Barode: The digital definition refer to the below 2D Barcode Definition chart.
- 20 -
Version: 0.0.1 – 2011/12/02
B. P/N: Present the Harman PCBA Part Number.
C. S/N: Present the Harman Serial Number.
D. EC: Present the Engineering Changer Number.
2D Barcode Definition (1/3)
xxx
1xxxxxxxx
Qisda
Harman
Supplier
Serial
EC
Harman
PCBA
Fixed
Desc.
Code
No.
Level
Module No.
Part. No.
Key
Digits
3 digits
9 digits
2 digits
2 digits
8 digits+1
7 digits
xx
xxxxxxxx,
01
LICHRG#
Harman
Specified
2D Barcode Definition (2/3)
YYYYMMDD, KD_PC#
GW50,
KD_SN#
9J1HR01001
S0x,
Supplier
Fixed
Qisda
Qisda
In-
Qisda
Production
Specified
ternal Pro-
Fixed Speci-
ternal
Part
Date,
Key
ject No.
fied Key
No.
sion No.
8 digits+1
6 digits
4 digits+1
6 digits
10 digits
3 digits+1
In-
MAC-ADR#
In-
ternal Ver-
Fixed
cified Key
8 digits
2D Barcode Definition (3/3)
xxxxxxxxxxxx,
BLUE-TOOTH#
xxxxxxxxxxxx,
WiFi MAC,
Fixed Specified Key
BT MAC,
12 digits+1
11 digits
12 digits+1
6.2. Ordering information
Ordering No.
Product
CWM-01-3V3
Bluetooth/WLAN Module 3,3V supply
7. Product handling
7.1. Packaging
Below Table 1 displays the W50 Packaging list, including Humidity Protec-
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Spe-
Version: 0.0.1 – 2011/12/02
tion Materials, Packing Materials, Labels, and Taps. For more information
about the illustration of W50 packaging materials, please refer to the Figure 1
and Figure 2.
Table 1 W50 Packaging table
Type
1. Humidity Protection
Materials
2. Packing
Materials
3. Labels
4. Taps
Qisda P/N
Packaging
Figure No.
Aluminum
Bag
L460 * W410 * T0.15
mm
ALUMINUM BAG
GW50
4G.1HR01.00
Humidity Indicator
CARD HUMIDITY INDICATOR GP
4J.G3501.002
DESICCANT
BAG
DESICCANT BAG
68*89
3H.09005.001
12
Taping Reel
PLATE TAPING REEL
13IN. GW50
4B.1HR02.001
Pizza Box
L356 * W344 * T61
mm
4D.1HR01.001
10
Carton
L355 * W340 * T386
mm (Pizza Box * 5)
4D.1HR02.001
OOB Label
100*50mm
4E.1HR03.001
Carton Label
50*15mm (Print on
Carton )
Caution
label
LABEL ATTENTION
56M31
55 mm * 55 mm
4E.G3503.001
11
Cover Tap
COVER TAPE GW50
4B.1HR01.001
Carrier Tap
CARRIER TAPE GW50
4B.1HR03.001
Item
Spec.
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Version: 0.0.1 – 2011/12/02
Figure 1 W50 Packaging 1/2
Figure 2 W50 Packaging 2/2
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Version: 0.0.1 – 2011/12/02
7.2. Packing Materials
7.2.1. Humidity Protection Materials
7.2.1.1. Aluminum Bag: The L460*W410*T0.15 mm dimensions Aluminum bag is
prepared for the W50 module vacuum packing on the Humidity protection purpose. The P/N has been defined as 4G.1HR01.001. Please
see the below illustration and picture for the W50 Aluminum bag:
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Version: 0.0.1 – 2011/12/02
7.2.1.2. Humidity Indicator: The L102*W38 mm dimensions Humidity Indicator is
prepared for including in the W50 Aluminum Bag on the Humidity Inspection purpose. The P/N has been defined as 4J.G3501.002. Please
see the below illustration and picture for the W50 Humidity Indicator:
湿度卡图.jpg
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Version: 0.0.1 – 2011/12/02
7.2.1.3. Desiccant: The L89*W68 mm dimensions and Mineral Bentonite inside
Desiccant is prepared for the W50 module packaging on the Humidity
prevention purpose. The P/N has been defined as 3H.09005.001. Please
see the below illustration and picture for the W50 Desiccant:
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Version: 0.0.1 – 2011/12/02
7.2.2. Packing Materials
7.2.2.1. Reel: The 13” dimension and PS Black Reel is prepared for the W50
module packaging, met to ESD standard Ohm: 10^7Ω~10^11Ω and
EIA-471-D. The P/N has been defined as 4B.1HR02.002. Please see the
below illustrations and pictures for the W50 Reel:
7.2.2.2. Pizza Box: The L356*W344*T61mm dimensions and B Flute Pizza Box is
prepared for the W50 Reel(with Aluminum Bag) inside. The P/N has
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Version: 0.0.1 – 2011/12/02
been defined as 4D.1HR01.001. Please see the below illustration and
pictures for the W50 Pizza Box:
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Version: 0.0.1 – 2011/12/02
7.2.2.3. Carton: The L355*W340*T384mm dimensions and AB/F Carton is prepared for the 5 Pizza Boxes inside. The P/N has been defined as
4D.1HR02.001. Please see the below illustration and picture for the W50
Carton:
7.2.3. Labels
7.2.3.1. OOB Label: 4 OOB Labels on Reel, Aluminum Bag, Pizza Box and Car-
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Version: 0.0.1 – 2011/12/02
ton are placed for the W50. For more information about the W50 OOB
Labels, please refer to the below description.
The W50 OOB Label on Reel with 100 * 50 mm dimensions defined
as 4E.1HR01.001. Please see the below picture illustration and detail
information.
Item
Content
Remark
Reel ID
R+Year+Month+SN
SN is from 0001~9999
PIO No
Defined by Harman, will be
Ex. R2011040001
changed for each shipment
Lot No
L+Year+month+SN
(a) 5 Pizza boxes are in 1 Lot.
(b) SN is from
0001~9999
Ex. L2011040001
Model No
GW50
Qisda Model No.
Harman Part
Defined by Harman, will be
C1b sample:2318091
No
changed for each ship-
C3/D1 sample:2321122
ment
D2 sample : 2357720
9J.1HR01.001
Qisda Part No.
Part No.
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Version: 0.0.1 – 2011/12/02
Item
Content
Remark
General
MOD-SM Qisda
Add sample build status,
Desc.
BT/WLANCWM-01.C1A
Ex.C1a.EVT3-2/C1b.EVT3-3/C3.EVT3-4
Q’ty
400
400 pcs for each Reel
EC
Started at 03 and be up-
EVT 3-2(C1a): EC05/ 3-3 (C1b): EC06/ 3-4(C3):
dated by every pilot run
EC07
DVT (D1a/b): EC08/ (D2): EC09
FCC ID
VRSGW50
The W50 OOB Label on Aluminum Bag with 100 * 50 mm dimensions
defined as 4E.1HR01.001. Please see the below picture illustration and
detail information.
Item
Content
Remark
Bag ID
A+Year+Month+SN
SN is from 0001~9999 Ex. A2011040001
PIO No
Defined by Harman, will be
changed for each shipment
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Version: 0.0.1 – 2011/12/02
Item
Lot No
Content
Remark
L+Year+month+SN
(a) 5 Pizza boxes are in 1 Lot. (b) SN is from
0001~9999
Ex. L2011040001
Model No
GW50
Qisda Model No.
Harman Part
Defined by Harman, will be
C1b sample:2318091
No
changed for each shipment
C3/D1 sample:2321122
D2 sample :2357720
Part No.
9J.1HR01.001
Qisda Part No.
General
MOD-SM Qisda
Add sample build status,
Desc.
BT/WLANCWM-01.C1A
Ex.C1a.EVT3-2/C1b.EVT3-3/C3.EVT3-4
Q’ty
400
400 pcs for each Aluminum Bag
EC
Started at 03 and be up-
EVT 3-2(C1a): EC05/ 3-3 (C1b): EC06/ 3-4(C3): EC07
dated by every pilot run
DVT (D1a/b): EC08/ (D2): EC09
FCC ID
VRSGW50
The W50 OOB Label on Pizza Box with 100 * 50 mm dimensions defined as 4E.1HR01.001. Please see the below picture illustration and
detail information.
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Version: 0.0.1 – 2011/12/02
Item
Content
Remark
Box ID
B+Year+Month+SN
SN is from 0001~9999 Ex. B2011040001
PIO No
Defined by Harman, will be
changed for each shipment
Lot No
L+Year+month+SN
(a) 5 Pizza boxes are in 1 Lot.
(b) SN is from
0001~9999
Ex. L2011040001
Model No
GW50
Qisda Model No.
Harman
Defined by Harman, will be
C1b sample:2318091
Part No
changed for each shipment
C3/D1 sample:2321122
D2 sample : 2357720
Part No.
9J.1HR01.001
Qisda Part No.
General
MOD-SM Qisda
Add sample build status,
Desc.
BT/WLANCWM-01.C1A
Ex.C1a.EVT3-2/C1b.EVT3-3/C3.EVT3-4
Q’ty
400
400 pcs for each Pizza Box
EC
Started at 03 and be updated by
EVT 3-2(C1a): EC05/ 3-3 (C1b): EC06/ 3-4(C3):
every pilot run
EC07
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Version: 0.0.1 – 2011/12/02
Item
Content
Remark
DVT (D1a/b): EC08/ (D2): EC09
FCC ID
VRSGW50
The W50 OOB Label on Carton with 100 * 50 mm dimensions defined as 4E.1HR01.001. Please see the below picture illustration and
detail information.
Item
Content
Remark
Carton ID
C+Year+Month+SN
SN is from 0001~9999 Ex. C2011040001
PIO No
Defined by Harman, will be
changed for each shipment
Lot No
L+Year+month+SN
(a) 5 Pizza boxes are in 1 Lot. (b) SN is from
0001~9999
Model No
GW50
Qisda Model Number
Harman
Defined by Harman, will be
(a) EVT3-3(C1b sample): 02318091
Part No
changed for each ship-
(b) EVT3-4(C3 /D1 sample): 02321122
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Version: 0.0.1 – 2011/12/02
Item
Content
Remark
ment
(c ) D2 sample : 02357720
Part No.
9J.1HR01.001
Qisda Part Number
General
MOD-SM Qisda BT/WLAN
Add sample build status as “XX”
Desc.
CWM-01.CXX
Ex.C1A=EVT3-2/C1B=EVT3-3/ C3=EVT3-4
Q’ty
Depend on shipment Q’ty
400 pcs for 1 Reel, Max Q’ty is 2000 pcs for each
Carton
EC
FCC ID
Start from 03 and be up-
EVT 3-2(C1a): EC05/ 3-3 (C1b): EC06/ 3-4(C3): EC07
dated by every pilot run
DVT (D1a/b): EC08/ (D2): EC09
VRSGW50
7.2.3.2. Carton Label: The L50*W15 mm dimensions’ Carton Label, printed on
Carton, is prepared for the W50 moving caution language. Please see
the below picture on the W50 Carton:
7.2.3.3. Caution Label: The L55*W55 mm dimensions’ Caution Label is pre- 35 -
Version: 0.0.1 – 2011/12/02
pared for the ESD Indicator purpose. The P/N has been defined as
4E.G3503.00. Please see the below illustration and picture for the W50
Caution Label:
7.2.4. Tapes: The 400 pcs W50 of per Reel with PS Black Cover and Carrier
Tapes are prepared for the W50 Module packaging, met to ESD standard Ohm: 10^4Ω~10^6Ω and EIA-481-D. The P/N has been defined as
Cover Tap-4B.1HR01.001 and Carrier Tap-4B.1HR03.001. Please see the
below illustration and pictures for the W50 Carrier and Cover Tapes:
- 36 -
Version: 0.0.1 – 2011/12/02
7.3. Shipment, storage and handling
The W50 Shipment, Storage and Handling are based and acting on per Carton
with 5 Pizza Box packages and 2,000 pcs W50 inside.
8. Certifications
8.1. FCC Regulations:
This device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiated radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
- 37 -
Version: 0.0.1 – 2011/12/02
Changes or modifications not expressly approved by the party responsible for compliance
could void the user‘s authority to operate the equipment.
RF Exposure Information
This Modular Approval is limited to OEM installation for mobile and fixed applications
only. The antenna installation and operating configurations of this transmitter, including any
applicable source-based time-averaging duty factor, antenna gain and cable loss must satisfy
MPE categorical Exclusion Requirements of §2.1091.
The antenna(s) used for this transmitter must be installed to provide a separation distance of
at least 20 cm from all persons, must not be collocated or operating in conjunction with any
other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures.
The end user has no manual instructions to remove or install the device and a separate approval is required for all other operating configurations, including portable configurations
with respect to 2.1093 and different antenna configurations.
Maximum antenna gain allowed for use with this device is 2 dBi.
When the module is installed in the host device, the FCC ID label must be visible through a
window on the final device or it must be visible when an access panel, door or cover is easily
re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: VRSGW50”.
9. Contact
Qisda Corporation
18 Jihu Road, Neihu,
Taipei 114, Taiwan
Tel: +886 2 2799-8800
Fax: +886 2 2799-9688
Website: Qisda.com
- 38 -
Version: 0.0.1 – 2011/12/02
Source Exif Data: 
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File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 38
XMP Toolkit                     : XMP toolkit 2.9.1-13, framework 1.6
About                           : uuid:f6dc8530-577c-4859-bbe3-88aa5b55d1c8
Producer                        : Acrobat Distiller 6.0 (Windows)
Create Date                     : 2012:02:20 09:49:45+08:00
Modify Date                     : 2012:02:20 09:54:42+08:00
Metadata Date                   : 2012:02:20 09:54:42+08:00
Document ID                     : uuid:ac9cbaef-a5e4-4be7-84f9-4a069294a03b
Format                          : application/pdf
Title                           : untitled
EXIF Metadata provided by EXIF.tools
FCC ID Filing: VRSGW50

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