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page 1/46
Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
NOTE D'ETUDE / TECHNICAL DOCUMENT
TITRE / TITLE :
MO300 series module Application Note
RESUME / SUMMARY
This document is the application note for the MO300 series modules.
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
NOTE D'ETUDE / TECHNICAL DOCUMENT
FICHE RECAPITULATIVE / SUMMARY SHEET
Ed Date
Date
24/08/2007
24/10/2007
13/10/2008
Observations
Comments
Création du document
/ Document creation
Mise à jour / Major
update
FCC Updates
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
MO300 M2M MODULE
APPLICATION NOTE
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
SOMMAIRE / CONTENTS
OVERVIEW ...................................................................................................................................................................6
1.1
1.2
1.3
1.4
OBJECT OF THE DOCUMENT .......................................................................................................................................6
REFERENCE DOCUMENTS ...........................................................................................................................................6
MODIFICATION OF THIS DOCUMENT ...........................................................................................................................6
FCC COMPLIANCE.....................................................................................................................................................6
BLOCK DIAGRAM.......................................................................................................................................................7
FUNCTIONAL INTEGRATION .................................................................................................................................8
3.1
HOW TO CONNECT A SIM CARD ?:.............................................................................................................................8
3.1.1
SIM on the Board to Board Connector.............................................................................................................9
3.1.1.1
3.1.1.2
3.1.2
3.1.2.1
3.1.2.2
Without SIM card detection ......................................................................................................................................... 10
With SIM card detection .............................................................................................................................................. 11
SIM holder soldered on the back of the MO300.............................................................................................12
Schematics.................................................................................................................................................................... 12
Placing.......................................................................................................................................................................... 13
3.2
HOW TO CONNECT THE AUDIOS? .........................................................................................................................14
3.2.1
Using a differential Handset mode on the main audio path ...........................................................................14
3.2.1.1
3.2.1.2
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.6.1
3.2.6.2
Notes for microphone ................................................................................................................................................... 15
Notes for speaker.......................................................................................................................................................... 15
Non differential audio handset .......................................................................................................................16
Using a mono Headset mode on the secondary audio path............................................................................17
Audio interface selection ................................................................................................................................17
Multi Channel Serial Interface .......................................................................................................................17
Characteristics of the microphone and speaker recommended by SAGEM ...................................................18
Characteristics of the microphone recommended by SAGEM ..................................................................................... 18
Characteristics of the dual mode speaker recommended by SAGEM .......................................................................... 18
3.3
NETWORK LEDS .....................................................................................................................................................18
3.3.1
Network LEDs connection. .............................................................................................................................19
3.3.2
Network LEDs behaviour. ..............................................................................................................................19
3.4
POWER SUPPLY ........................................................................................................................................................20
3.5
V24 UART .............................................................................................................................................................20
3.5.1
Complete V24 – connection MO300 - host.....................................................................................................20
3.5.2
Complete V24 interface with PC ....................................................................................................................20
3.5.3
Partial V24 ( RX-TX-RTS-CTS) – connection MO300 - host .........................................................................21
3.5.4
Partial V24 ( RX-TX) – connection MO300 - host .........................................................................................22
3.6
UART 2 ..................................................................................................................................................................22
3.7
USB 2.0 OTG .........................................................................................................................................................22
3.8
BACKUP BATTERY ...................................................................................................................................................23
3.8.1
Backup battery function feature......................................................................................................................23
3.8.2
Current consumption on the backup battery ..................................................................................................24
3.8.2.1
3.8.3
3.8.3.1
3.8.3.2
Charge by internal MO300 charging function.............................................................................................................. 24
Backup Battery technology recommended......................................................................................................25
Manganese Silicon Lithium-Ion rechargeable Battery ................................................................................................. 25
Capacitor Battery.......................................................................................................................................................... 25
3.9
GENERAL PURPOSE INPUT OUTPUT .........................................................................................................................25
3.10 TEMPERATURE SENSOR............................................................................................................................................25
3.11 ADC........................................................................................................................................................................26
3.12 MICRO-WIRE BUS ....................................................................................................................................................26
3.13 ANTENNA DETECTION..............................................................................................................................................26
3.14 HARDWARE POWER MANAGEMENT AND MULTIPLEXING INTERFACES .....................................................................27
3.15 RESETTING THE MODULE .........................................................................................................................................27
3.16 STARTING THE MODULE ...........................................................................................................................................27
3.16.1 Use of PWON*................................................................................................................................................27
3.16.2 Case of USB Plugged .....................................................................................................................................28
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3.17 STOPPING THE MODULE ...........................................................................................................................................28
3.17.1 Case of UART Interface..................................................................................................................................28
3.17.2 Case of USB Interface ....................................................................................................................................29
3.18 SLEEP MODE MANAGEMENT.....................................................................................................................................29
3.18.1 First mode.......................................................................................................................................................29
3.18.2 Second mode...................................................................................................................................................29
3.18.3 Third mode......................................................................................................................................................29
3.18.4 USB connectivity impact on sleep mode .........................................................................................................29
MANDATORY POINTS FOR THE FINAL TESTS AND TUNING .....................................................................30
ESD & EMC RECOMMENDATIONS ......................................................................................................................31
5.1
STANDARD REQUIREMENTS FOR ESD......................................................................................................................31
5.1.1
ESD Analysis ..................................................................................................................................................31
5.1.2
Recommendations to avoid ESD issues ..........................................................................................................31
5.2
ESD FEATURES ........................................................................................................................................................32
5.3
EMC RECOMMENDATIONS ......................................................................................................................................32
RECOMMENDED COMPONENTS .........................................................................................................................33
RADIO INTEGRATION .............................................................................................................................................34
7.1
ANTENNA CONNECTION ...........................................................................................................................................35
7.1.1
Mini Coaxial connector ..................................................................................................................................35
7.1.2
Spring contacts ...............................................................................................................................................35
7.2
GROUND LINK AREA ................................................................................................................................................35
7.3
LAYOUT ..................................................................................................................................................................36
7.4
MECHANICAL SURROUNDING ..................................................................................................................................36
7.5
OTHER RECOMMENDATIONS – TESTS FOR PRODUCTION/DESIGN ..............................................................................36
7.6
FCC RF COMPLIANCE .............................................................................................................................................36
AUDIO INTEGRATION .............................................................................................................................................37
8.1
8.2
MECHANICAL INTEGRATION AND ACOUSTICS .........................................................................................................37
ELECTRONICS AND LAYOUT.....................................................................................................................................37
RECOMMENDATIONS ON LAYOUT OF THE MAIN BOARD.........................................................................38
9.1
GENERAL RECOMMENDATIONS ON LAYOUT.............................................................................................................38
9.1.1
Ground............................................................................................................................................................38
9.1.2
Power supplies................................................................................................................................................38
9.1.3
Clocks .............................................................................................................................................................38
9.1.4
Data bus and other signals.............................................................................................................................38
9.1.5
Radio...............................................................................................................................................................38
9.1.6
Audio...............................................................................................................................................................38
9.2
EXAMPLE OF LAYOUT FOR MAIN BOARD ..................................................................................................................39
10
MECHANICAL INTEGRATION ..........................................................................................................................40
10.1 EXTERNAL CONNECTIONS PRESENTATION ...............................................................................................................40
10.2 CONNECTION CONSTRAINTS ....................................................................................................................................40
10.2.1 Board to board connection .............................................................................................................................40
10.2.2 Antenna connection ........................................................................................................................................41
10.3 WARNING RELATED TO THE USE OF METALLIC HOUSINGS ........................................................................................41
11
11.1
11.2
11.3
12
SUMMARY OF INTEGRATION ..........................................................................................................................42
ANNEXE: MOLEX BOARD TO BOARD CONNECTOR...................................................................................................42
ANNEXE: HIROSE COAXIAL CONNECTOR .................................................................................................................44
ANNEXE: SPRING CONTACT FOR ANTENNA ..............................................................................................................45
LABEL.......................................................................................................................................................................46
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Overview
1.1
Object of the document
The aim of this document is to describe some examples of hardware solutions for developing some products
around the SAGEM MO300 M2M Module. Most part of these solutions are not mandatory. Use them as
suggestions of what should be done to have a working product and what should be avoided thanks to our
experiences.
This document suggests how to integrate the MO300 M2M module in wireless communicating devices such as
GSM Gateway, POS, EDGE/GPS Tracking system, Wireless modem : connection with external devices, layout
advises, external components (decoupling capacitors…).
1.2
Reference documents
[ 1 ] URD1 – 5625.1 – 004 69772 - MO300 series modules specification
[ 2 ] URD1 - 5625.1 - 014 69979 - AT Command Set for SAGEM Modules
1.3
Modification of this document
The information presented in this document is supposed to be accurate and reliable.
SAGEM assumes no responsibility for its use, nor any infringement of patents or other rights of third parties
which may result from its use.
This document is subject to change without notice.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment.
1.4
FCC Compliance
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. this device may not cause harmful interference, and
2. this device must accept any interference received; including interference that may cause undesired
operation.
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Block diagram
MO300
EDGE QUAD-BANDS
GSM850 / GSM900 / DCS1800 / PCS1900
VBAT_CNT
PWON* signal
PWON*
Power ON & Reset
Hardware
Power
Management
Mod_on_state
Mod_uart_state
Mod_flow_state
Mod_reset_state
Dte_uart_state*
H.P.M.
HOST
U.S.B. 2.0 O.T.G.
USB_ID
USB_DM
USB_DP
VBUS
Full U.S.B. 2.0
O.T.G. BUS
DEVICE
External Analog Input
ADC
1.8/2.8V Power
Supply
RXD2*
TXD2 *
VBAT
U.A.R.T.2
TXD*, RXD*,
CTS*, RTS*,
DCD*, DSR*,
DTR*, RI*
U.A.R.T
MicroWire BUS
MWDSI
MWSDO
MWSCLK
MWCS0*
MCSI_SYNC
MCSI_BCLK
MCSI_DIN
MCSI_DOUT
Main battery
Backup
battery
Debug UART
V24 Full UART
Interface with
Transceiver
(if necessary)
µ Wire Devices: LCD,
EEPROM, CENSORS …
VBAT
VREXTH
Analog
Digital Audio
Backup
Power supplies
47µF - 10V
LED1
VBAT
LED2
L.P.G.
(P.W.M. out)
M.S.C.I. BUS
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6 G.P.I.O.s
GPIO7
GPIO8
GPIO9
GPIO10
10
available
G.P.I.O.s
SIM plus interface 3V & 1.8V
SIM Plus BUS
SIMCLK
SIMRST
SIMVCC
SIMIO
SIMPLUS_CMD
SIMPLUS_DATA
SIMPLUS_CLK
SIMCD*
GND
SDA_I²C
SCL_I²C
I²C BUS
Devices: LCD,
EEPROM, CENSORS…
MICP
MICN
MICBIAS_OUT
HSMICBIAS_OUT
Accessory
Microphone
2V or 2.5V power
supply for
Microphones
SPKP
SPKN
HSOR
HSOL
Analog Audio
BUSES
HSMICP
HSMICN
Receiver
Accessory
earphone
Accessory Microphone
GND ANA
Figure 1
MO300 bloc diagram
* Low level active signal.
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Functional integration
The MO300 series modules target the M2M applications market.
Following the improvement of Silicon technologies includes functionality improvement, less power consumption,
low voltage and higher working frequencies clock, the MO300 module meets all these requirement and uses
last high end technology. All digital I/Os at the 80 pins connector are on 1.8V domain and 1.4 V for its core.
Except VREXTH (1.8V or 2.8V) and VCCSIM (and the SIM I/Os at 1.8V or 2.8V) and obviously VBAT.
Thus, all chip used to communicate with the MO300 must be compatible with this voltage requirement.
Otherwise you will be simply required to use level shifters to adapt the voltage of the signals to meet the
requirement of MO300 Module.
As example here is the validated chip on our design to shift I/Os voltage from 2.8V to 1.8V:
Figure 2
Example of Level Shifter
3.1
How to connect a SIM card ?:
Figure 3
Sim plus card
Preliminary notes:
Regarding the Sim cards:
Some improvements and new features are supported by new generation of Sim cards.
The main features are the support for 1.8 power supply for USIM used in EDGE, HSDPA and UMTS
applications.
The second one is the add-on, the flash memory included in Simplus card to mix and simplify the design of two
Card holder in some applications. If necessary, with only one mechanical card holder it is possible to have
access to Sim card features and at the same time to also have access to an external Flash memory module like
MMC.
Regarding the card holders:
The Sim card holder can have 6 or 8 pins depending if it feature a mechanical card presence detector or not.
The Simplus card holder can have 8 or 10 pins depending if it feature a card presence detector or not.
There are two ways to connect a Sim card holder to the MO300 module.
• External Sim card holder uses 10 pins if Simplus compliant or 8 pins if normal Sim compliant from Pin 5 to
pin 12 of the board to board (BtB)connector.
• Internal Sim card holder by soldering the card holder( and it's protective components) on the back side of
the MO300 module.
Note: These two ways are exclusives, never use both solutions at the same time. This is mandatory.
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3.1.1
SIM on the Board to Board Connector.
The SIM card connection could be done in two ways:
• Connector with 6 pins without SIM card detection.
• Connector with 8 pins with SIM card detection.
In both cases, decoupling capacitors of 10pF have to be added on SIMCLK, SIMRST, SIMVCC and SIMIO
signals as close as possible to the SIM card connector to avoid EMC issues. Moreover, use ESD protection
components to protect Sim card and module I/Os against Electro Static Discharges. The following schematic
show how to protect the Sim access for 8 pins connector. Apply the same method for a 6 pins connector.
Figure 4
Protections : EMC and ESD components close to the Sim
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3.1.1.1
Without SIM card detection
Normal SIM card case: 6 pins are used.
GND
MO300
SIM connector
SIMVCC
SIMRST
VCC
GND
RST
VPP
CLK
I/O
SIMCLK
SIMIO
SIMCD*
Figure 5
6 pins SIM card connection without presence detection
SIM Plus card case: 8 pins are used.
GND
MO300
SIMVCC
SIMRST
SIMCLK
SIMPLUS_DATA
SIMPLUS_CMD
SIMIO
SIMPLUS_CLK
VCC
GND
RST
SP CLK
I/O
SP DATA SP CMD
SIMCD*
Figure 6
8 pins SIM plus card connection without presence detection
In these configurations, the SIMCD* signal is always Low.
There is no hardware SIM card detection, so the SIM card is considered as always present. (A software
detection is always performed). For filtering, EMC and ESD values refer to schematics figure 4.
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3.1.1.2
With SIM card detection
Normal SIM card case: 6 pins are used.
GND
SIM connector
MO300
SIMVCC
SIMRST
SIMCLK
VCC
GND
RST
VPP
CLK
I/O
CNT1 CNT2
SIMIO
SIMCD*
Figure 7
SIM card connection with presence detection
SIM Plus card case: 8 pins are used.
GND
SIM connector
SIMVCC
SIMRST
SIMCLK
SIMPLUS_DATA
SIMPLUS_CMD
SIMIO
SIMPLUS_CLK
VCC
GND
RST
SP_CLK
CLK
I/O
SP_DATA SP_CMD
CNT2
SIMCD*
Figure 8
8 pins SIM plus card connection with presence detection
These configurations allows the module to detect if a SIM card is present in the connector or not. When present,
the SIMCD signal is connected to GND signal through a mechanical switch integrated in the SIM connector (the
type of switch depends of the SIM connector) thus a hardware interruption is generated. When the switch is
opened, the internal MO300 pull up raise the signal to high level (1.8V)
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3.1.2
SIM holder soldered on the back of the MO300.
The MO300 module feature a soldering area on its back to mount a Sim card holder with all necessary
components to protect it from EMC and ESD.
For your design, if the Sim connection through the BtB connector is not required, use the following
recommended schematic.
As already warned: Never use both SIM card connection solutions at the same time. This is mandatory.
Figure 9 SIM holder
The behaviour is as described in the previous chapter.
3.1.2.1
Schematics
Figure 10
Components for backside Sim holder
Note: SIM card presence detector cannot be used with the SIM holder on the back of the MO300. The
SIMCD signal is therefore not used in that case.
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3.1.2.2
Placing
All these components should be soldered at the following positions.
Figure 11
Components for backside SIM holder
Close view of the components area:
Figure 12
Zoom on components area
SAGEM can provide a suppliers component codes list on request
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3.2
HOW to connect the AUDIOS?
The MO300 module feature 2 differential audio paths. A main audio path to connect a microphone and a
speaker, and a second one to connect an auxiliary audio through a Jack (for example). In this following chapter
examples of design will be given including protections against EMC and ESD and some notes about the routing
rules to follow to avoid the TDMA noise usually present in this sensitive area of design. It will also give the way
to use the hook function and the audio-jack presence detector.
3.2.1
Using a differential Handset mode on the main audio path
The MO300 can manage an external microphone (MICP/MICN) and external speaker (32 ohms SPKP/SPKN) in
differential mode.
Thus, one receiver and one microphone can be connected to the module with the following characteristics (see
SAGEM references):
- Receiver 32 ohms up to 120 ohms
- Microphone accepting the polarisation described below (FET Buffer + Open Drain).
- The microphone can be supplied using the internal MO300 bias supply (recommended but not mandatory)
or any other external bias system compliant with selected microphone within the MO300 inputs limits.
Protective components
MO300
SPKP
SPKN
MICP
MICN
2.0V / 2.5V
MICBIAS
22pF
47nH
15pF
speaker
22pF
47nH
15pF
See
Application
schematic
Figure 13
Differential audio handset mode
Figure 14
Microphone on board components
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Microphone
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3.2.1.1
•
•
•
•
•
Notes for microphone
Pay attention to the microphone device, It must not be sensitive to RF disturbances.
Some microphone includes two spatial microphones inside the same shell and allow to make an
electrical difference between the environment noise (received by one of the two mic.) and the
active signal (received by the other mic. + noise) resulting in a very high SNR.
Some resistors and capacitors should be connected as near as possible to the module as shown
in the figure.
If you Need to have deported microphone out of the board with long wires, you should pay
attention to the EMC and ESD effect. It also the case when your design is ESD sensitive. In
those cases, add the following protections to improve your design.
To ensure proper operation of such sensitive signals, they have to be isolated from the others by
analogue ground on mother board layout. (Refer to Layout design chapter)
Figure 15
EMC& ESD protections for microphone in case of need
3.2.1.2
Notes for speaker
•
•
•
•
For the speaker external π filters have to be added as near as possible to the speaker to
suppress external disruption.
Moreover, as explained for the microphone, if the speaker is deported out of the board or is
sensitive to ESD, use the schematic here after to improve the audio.
SPKP ,SPKN, and tracks must be larger than other tracks: 0.3mm .
As described in the layout chapter, differential signals have to be routed in parallel: it is the case
for SPKP, SPKN, MICP and MICN.
Figure 16
EMC& ESD protections for speaker in case of need
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3.2.2
Non differential audio handset
For a better rejection of the common mode it is recommend to use differential audio lines.
In case, customer wants to implement a non differential solution, the figure below shows an example.
The microphone can be supplied using the internal MO300 bias supply (recommended but not mandatory) or
any other external bias system compliant with selected microphone within the MO300 inputs limits.
Note:
SPKN and MICN must not be grounded
SPKN must not be connected to SPKP
MICN must not be connected to MICP
MO300
22pF
SPKP
68µF
22pF
Power amplifier
or Speaker
SPKN
22pF
1µF
2.0V / 2.5V MICBIAS
1KΩ
MICP
MICN
100nF
22pF
22pF
22pF
Micro
1KΩ
1µF
Figure 17
Non differential audio connections
Note:
If this design is ESD or EMC sensitive do not hesitate to improve it using the advises given in those chapters :
• Notes for microphone
• Notes for speaker
The weakness can either come from your PCB routing and placement or from the chosen components (or
both).
• This design is an example of single audio connection for both microphone and speaker. Only a part of it
can be chosen depending on your project request (i.e. single microphone and differential speaker or viceversa).
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3.2.3
Using a mono Headset mode on the secondary audio path
MO300 features a secondary audio path dedicated to be used with a Hands free kit accessory.
This audio path can also be used instead of the main depending on the required audio power.
An external microphone and earphone (32 ohms) can be connected to the MO300
Since the input unlink path is differential only mono headsets are supported, the speaker is connected between
HSOR and HSOL.
The microphone can be supplied using the internal MO300 bias supply (recommended but not mandatory) or
any other external bias system compliant with selected microphone within the MO300 inputs limits.
MO300
2.0V / 2.5V
MICBIAS
1KΩ
HSMICIP
100nF
22pF
22pF
1KΩ
HSMICIN
22pF
1µF
HSOR
22pF
22pF
HSOL
22pF
Figure 18
Mono audio headset
Note: The capacitors have to be close to the external connector.
3.2.4
Audio interface selection
In order to switch from one selection to the other, AT commands shall be used to configure the audio paths in
case "SGV" file is used by default.
Refer to relevant paragraph of document [ 2 ] to implement AT commands.
3.2.5
Multi Channel Serial Interface
A MCSI bus is provided on the module MO300 for a digital interface application ( i.e. Bluetooth).
Characteristics are the following :
- Voice samples : 16bits, 8kHz
- MCSI Clock : 520 kHz
- Voltage : 1.8V
More details can be given on request.
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3.2.6
Characteristics of the microphone and speaker recommended by SAGEM
3.2.6.1
Characteristics of the microphone recommended by SAGEM
Item to be inspected
Acceptance criterion
Sensitivity
-32 dB SPL +/- 3 dB (0 dB = 1 V/Pa @ 1kHz) or
-40 dB SPL +/- 3 dB (0 dB = 1 V/Pa @ 1kHz)
Frequency response
Limits (relatives values)
Current consumption
Operating voltage
S / N ratio
Directivity
Maximum input sound pressure level
Radio frequency protection
Freq. (Hz)
Lower limit
Upper limit
100
-1
+1
200
-1
+1
300
-1
+1
1000
2000
-1
+1
3000
-1.5
+1.5
3400
-2
+2
4000
-2
+2
1 mA (maximum)
DC 1 to 3 V (minimum)
55 dB minimum (A-Curve at 1 kHz, 1 Pa)
Omni-directional
100 dB SPL (1 kHz)
Maximum distortion 1%
Over 800 - 1200 MHz and 1700 - 2000 MHz, S/N ratio 50
dB minimum (signal 1 kHz, 1 Pa)
3.2.6.2
Characteristics of the dual mode speaker recommended by SAGEM
Inspection non operating
Item to be inspected
Acceptance criterion
Input power: rated / max
0.5 W / 1 W
DC Impedance
6 Ω +/- 10 %
Resonance frequency (Fo)
480 Hz +/- 10%
Magnetic field
< 50 Gauss at 5 mm on the back side of the speaker
Weight
< 3.0 g
Inspection operating
Test condition: Receiver is measured with IEC 318 coupler in sealed condition
Item to be inspected
Frequency response
Input Voltage: 60mVrms
S / N ratio
3.3
Acceptance criterion
Freq
Lower limit
(Hz)
(dBSPL)
Nom. value
(dBSPL)
200
119
121
400
122
124
700
125
127
800
125
127
1000
120
122
1500
111
113
2000
108
110
3000
103
105
4000
98
100
50 dB minimum (A-Curve at 1 kHz, 1 Pa)
Upper Limit
(dBSPL)
123
126
129
129
124
115
112
107
102
Network LEDs
The MO300 module can manage two PWM outputs, for example to drive two network LED.
These LED could be used to interact with the network activity and the MO300 states.
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If more than two LED are required, any GPIO can be used to drive a LED. A maximum of 10 GPIO are available
on the MO300 Module.
3.3.1
Network LEDs connection.
Green LED shall be connected to LED1, Red LED shall be connected to LED2, serial resistor shall be
connected to each LED.
These transistors can be found a in a single package referenced as UMDXX or PUMDXX Family.
Value of resistor depends on characteristic of chosen LED, it is used to limit the current through the diode,
Consider this formula to compute the resistor value in worst case: R max =
Vbat min - (Vd min + Vcesat max )
Id min
VBAT
VBAT
LED1
MO300
LED2
Figure 19
Network LED connection
3.3.2
Network LEDs behaviour.
As LEDs are driven through PWM outputs of the MO300, they can be configured with appropriate AT
command.
User application can set for each output :
- Period between : 125ms and 3000ms
- Time on between : 3,889 and 93,59 ms
More details can be found in AT document referenced [ 2 ].
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3.4
Power supply
The MO300 module can be supplied by battery or any DC/DC converter compliant with the module supply
range 3.3Vmin and up to 5.5Vmax 2A.
The PCB tracks must be well dimensioned to support 2A maximum current.
Maximum serial resistance on VBAT = 170mΩ internal resistance of the battery plus tracks and contact
resistance of the connectors for a new battery, or tracks & contact resistance of the connectors for a DC/DC
converter.
Case of old batteries: If this value is overran, this can cause erratic reset of the module when the
battery begins to be discharged.
The VBAT_CNT signal disturbs the other signal; it has to be isolated with ground from the other signals,
especially radio and audio signals.
In case of batteries, it is mandatory to use Li-Ion or Li-Polymer batteries.
NOTE: The MO300 M2M module does not manage the charge of any kind of batteries.
3.5
V24 UART
The MO300 module feature a V24 UART interface plus a USB2 OTG interface to communicate with the Host
through AT commands or for easy firmware upgrading purpose.
3.5.1
Complete V24 – connection MO300 - host
A V24 UART interface is provided on the main connector of the MO300 module with the following signals:
RTS/CTS, RXD/TXD, DSR, DTR, DCD, RI.
It is recommended to manage an external access to the V24 interface, in order to allow easy software upgrade,
especially when USB is not planed to be used.
RXD
RXD
TXD
TXD
RTS
CTS
RTS
CTS
DCD
DCD
DTR
DTR
DSR
DSR
MO300
RI
GND
Host
RI
GND
Figure 20
Complete V24 UART connection between MO300 and host
3.5.2
Complete V24 interface with PC
It supports speeds up to 115.2 KBPS and may be used in auto bauding mode as well.
To use the V24 interface, some adaptation components are necessary to convert the +1.8V signals from
the MO300 to +5V signals compatible with a PC.
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An example of connection between MO300 and a PC is given below.
Figure 21
Signal adaptation using Level Shifters and RS232 Transceiver.
3.5.3
Partial V24 ( RX-TX-RTS-CTS) – connection MO300 - host
When using only RX/TX/RTS/CTS instead of the complete V24 link, we recommend following schematic:
As we need DTR active (low electrical level), a loop DSR on DTR is sufficient because DSR is active (low
electrical level) once the XS200 is switched on.
DCD and RI can stay not connected and floating.
RXD
RXD
TXD
TXD
RTS
CTS
RTS
CTS
DCD
DCD
DTR
DSR
DTR
DSR
RI
RI
GND
GND
MO300
Host
Figure 22
Partial V24 connection (4 wires) between MO300 and host
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3.5.4
Partial V24 ( RX-TX) – connection MO300 - host
When using only RX/TX instead of the complete V24 link, we recommend following schematic :
We need DTR active (low electrical level), a loop DSR on DTR is sufficient because DSR is active (low
electrical level) once the MO300 is switched on.
We also need RTS active (low electrical level), a loop RTS on CTS is sufficient because CTS is active (low
electrical level) once the MO300 is switched on.
DCD and RI can stay not connected and floating.
RXD
TXD
TXD
RXD
RTS
CTS
RTS
CTS
DCD
DCD
DTR
DSR
DTR
DSR
RI
RI
GND
GND
MO300
Host
Figure 23
Partial V24 connection (2 wires) between MO300 and host
3.6
UART 2
It is strongly recommended to let this interface externally accessible for Debug (e.g. access by 2 tests pads).
TXD2 and RXD2 can be used to get the software traces.
3.7
USB 2.0 OTG
The USB 2.0 interface is Full speed, then has a maximum rate of 12Mbit/s. It is On The Go capable then can be
in slave or Master mode depending on the connected equipment and the MO300 Version.
MO300 can only be in slave mode. Master mode and capability to switch between the two modes is only
available with the MO300E module.
In slave mode, the MO300 is answering to the customer application which is the Master of the communication.
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USB ID
USB ID
VBUS
VBUS
CMD
MO300 (device)
Host
D+
D+
D-
DFigure 24
USB Connection between MO300 and host
To use USB link between Host and MO300, specific SAGEM USB drivers are needed and available on SAGEM
www site and on request.
As soon as USB link is detected by the MO300 module, the AT command responses are sent on USB link and
RS232 - UART1 interface is de-activated.
RS232 - UART2 interface for traces is still operational.
USB and RS232 - UART1 are then exclusive and priority is given to the USB interface.
CMD I/O command can be used if required, see "Stopping the module" chapter.
3.8
Backup battery
3.8.1
Backup battery function feature
A backup battery can be connected to the module in the aim to supply internal RTC (Real Time Clock) when the
main battery is removed. Thus, when the main battery is removed, the RTC is still supplied. Otherwise, user will
have to set the date and time after the next start.
With external BACKUP:
- if VBAT < VBACKUP, internal RTC is supplied by VBACKUP.
- if VBAT > VBACKUP, internal RTC is supplied by VBAT.
If there is no backup battery, VBACKUP input of the module has to be connected to VBAT signal.
Without external VBACKUP (VBACKUP input connected to VBAT)
- if VBAT > 2.2V, internal RTC is supplied by VBAT.
- if VBAT < 2.2V, internal RTC is not supplied.
Signal
Min
Max
VBACKUP
+1.8V
+3.2V
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3.8.2
Current consumption on the backup battery
When the Main battery is removed, the current consumption which is supplied by the backup battery changes,
depending on its voltage level.
The following table sum up the three different states:
VBACKUP (V)
2.4 < VBACKUP
2.15 < VBACKUP < 2.4
Typical value of current Consumption (µA)
50
Linear decrease from 250 (at 2.15V) to 50 (at
2.4V)
Linear growth from 50 (at 1 V ) to 250 (at 2.15V)
1
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