Simcom 1403022014008 WCDMA/HSDPA Module User Manual SIM5320AL

Shanghai Simcom Ltd. WCDMA/HSDPA Module SIM5320AL

Contents

SIM5320AL_User Manual

SIM5320AL_User_Manual
Smart Machine Smart Decision
Document Title SIM5320AL User Manual
Version 1.01
Date 2014-08-20
Status Release
Document Control ID SIM5320AL_User Manual_V1.01
Compliance Information
FCC Compliance Statement: This device complies with Part 15 of the FCC Rules . Operation is subject to
the following two conditions: 1. This device may not cause harmful interference, and 2. This device must
accept any interference received, including interference that may cause undesired operation. This device
must accept any interference received, including interference that may cause undesired operation. Product
that is a radio transmitter is labeled with FCC ID.
FCC Caution
(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance
with provided instructions and the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be collocated or operating in
conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna
installation instructions and transmitter operating conditions for satisfying RF exposure compliance.
(2) Any changes or modifications not expressly approved by the grantee of this device could void the
user's authority to operate the equipment.
(3) This Transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
(4) Changes or modifications to this unit not expressly approved by the party responsible for compliance
could void the user authority to operate the equipment.
(5) the modules FCC ID is not visible when installed in the host, or
(6) if the host is marketed so that end users do not have straight forward commonly used methods for
access to remove the module so that the FCC ID of the module is visible; then an additional permanent
label referring to the enclosed module: Contains Transmitter Module FCC ID: UDV-1403022014008 or
Contains FCC ID: UDV-1403022014008 must be used.
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
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Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2014
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Contents
Revision History............................................................................................................................................10
1 Introduction................................................................................................................................................11
1.1 Product Outline......................................................................................................................................11
1.2 Hardware Interface Overview............................................................................................................... 11
1.3 Hardware Diagram................................................................................................................................ 11
1.4 Functional Overview.............................................................................................................................12
2 Package Information................................................................................................................................. 13
2.1 Pin Configuration.................................................................................................................................. 13
2.2 Pin description.......................................................................................................................................17
2.3 Package Dimensions............................................................................................................................. 19
2.4 Footprint Recommendation...................................................................................................................21
3 Application Interface Specification..........................................................................................................22
3.1 Power Supply........................................................................................................................................ 22
3.1.1 Power Supply Pin........................................................................................................................... 22
3.1.2 Design Guide.................................................................................................................................. 22
3.1.3 RTC Backup....................................................................................................................................24
3.2 Power on/off Time Sequence................................................................................................................ 26
3.2.1 Power on Sequence.........................................................................................................................26
3.2.2 Power off Sequence........................................................................................................................ 28
3.3 UART Interface..................................................................................................................................... 29
3.3.1 Pin Description............................................................................................................................... 30
3.3.2 Application Guide...........................................................................................................................31
3.4 Audio Interfaces (For SIM5320AL only）...........................................................................................32
3.4.1 Pin Description............................................................................................................................... 32
3.4.2 Design Guide.................................................................................................................................. 32
3.4.3 Audio Parameter Characteristic......................................................................................................34
3.5 USIM Interface......................................................................................................................................35
3.5.1 Pin description................................................................................................................................ 35
3.5.2 Application Guide...........................................................................................................................36
3.5.3 Recommend Components...............................................................................................................36
3.6 I2C Interface..........................................................................................................................................37
3.6.1 Pin Description............................................................................................................................... 38
3.6.2 Signal Description.......................................................................................................................... 38
3.6.3 Design Guide.................................................................................................................................. 38
3.7 Keypad Interface................................................................................................................................... 38
3.7.1 Pin Description............................................................................................................................... 38
3.7.2 Application Guide...........................................................................................................................39
3.8 USB Interface........................................................................................................................................40
3.8.1 Application Guide...........................................................................................................................40
3.9 SPI Interface..........................................................................................................................................41
3.9.1 Pin Description............................................................................................................................... 41
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3.10 GPIO Interface.................................................................................................................................... 41
3.10.1 Pin Description............................................................................................................................. 41
3.10.2 Application Guide.........................................................................................................................42
3.11 PCM Interface..................................................................................................................................... 44
3.11.1 Pin Description............................................................................................................................. 44
3.11.2 Signal Description.........................................................................................................................45
3.12 Multi-functional interface................................................................................................................... 48
3.12.1 Sink Current Source......................................................................................................................48
3.12.2 Reset Function.............................................................................................................................. 49
3.12.3 ADC.............................................................................................................................................. 49
3.12.4 LDO.............................................................................................................................................. 50
4 RF Specification......................................................................................................................................... 50
4.1 RF Specification....................................................................................................................................50
4.2 Operating Specification.........................................................................................................................51
4.3 Antenna Design Guide.......................................................................................................................... 51
5 Reliability and Operating Characteristics.............................................................................................. 53
5.1 Electronic Characteristics..................................................................................................................... 53
5.2 Operating Mode.................................................................................................................................... 53
5.2.1 Operating Modes Overview........................................................................................................... 54
5.2.2 Minimize Power Consumption.......................................................................................................54
5.3 Current Consumption............................................................................................................................55
5.4 EMC and ESD Notes............................................................................................................................ 56
6 Guide for Production.................................................................................................................................57
6.1 Top and Bottom View of SIM5320AL.................................................................................................57
6.2 Typical Solder Reflow Profile.............................................................................................................. 57
6.3 Moisture Sensitivity Level (MSL)........................................................................................................58
6.4 Stencil Foil Design Recommendation.................................................................................................. 58
6.5 Recommended Pad Design................................................................................................................... 59
Appendix........................................................................................................................................................60
A. System Design........................................................................................................................................60
B. SIM5320AL GPIOs List........................................................................................................................ 61
C. Digital I/O Characteristics......................................................................................................................61
D. Related Documents................................................................................................................................ 62
E. Terms and Abbreviations........................................................................................................................63
F. Safety Caution......................................................................................................................................... 66
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Table Index
Table 1: General Feature....................................................................................................................................................10
Table 2: Pin definition....................................................................................................................................................... 14
Table 3: Pin description..................................................................................................................................................... 15
Table 4: Pin description..................................................................................................................................................... 20
Table 5: Power on timing...................................................................................................................................................25
Table 6: Power off timing.................................................................................................................................................. 26
Table 7: Pin description..................................................................................................................................................... 28
Table 8: Logic level........................................................................................................................................................... 28
Table 9: Pin description..................................................................................................................................................... 30
Table 10: MIC input characteristics...................................................................................................................................30
Table 11: Audio output characteristics...............................................................................................................................30
Table 12: Speaker output characteristics........................................................................................................................... 30
Table 13: Audio parameter.................................................................................................................................................32
Table 14: Electronic characteristic.....................................................................................................................................33
Table 15: Pin description................................................................................................................................................... 33
Table 17: Pin description................................................................................................................................................... 36
Table 18: Pin description................................................................................................................................................... 36
Table 19: GPIO configuration........................................................................................................................................... 37
Table 20: Electronic characteristic.....................................................................................................................................38
Table 21: Electronic characteristic.....................................................................................................................................39
Table 22: Pin description................................................................................................................................................... 39
Table 23: Electronic characteristic.....................................................................................................................................40
Table 24: Pin description................................................................................................................................................... 40
Table 25: LED status......................................................................................................................................................... 41
Table 26: Control status..................................................................................................................................................... 42
Table 27: Electronic characteristic.....................................................................................................................................42
Table 28: Pin description................................................................................................................................................... 43
Table 29: Timing parameters............................................................................................................................................. 44
Table 30: Timing parameters............................................................................................................................................. 45
Table 31: Electronic characteristic.....................................................................................................................................46
Table 32: Electronic Characteristics.................................................................................................................................. 48
Table 33: Electronic characteristic.....................................................................................................................................48
Table 34: Conducted transmission power..........................................................................................................................49
Table 35: Operating frequencies........................................................................................................................................49
Table 36: Conducted receive sensitivity............................................................................................................................ 49
Table 37: HSDPA throughout............................................................................................................................................ 49
Table 38: Absolute maximum ratings................................................................................................................................ 51
Table 39: Recommended operating ratings....................................................................................................................... 51
Table 40: Operating temperature....................................................................................................................................... 51
Table 41: Operating Modes Overview...............................................................................................................................52
Table 42: Current consumption......................................................................................................................................... 53
Table 43: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)............................................54
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Table 43: SIM5320AL GPIOs list..................................................................................................................................... 58
Table 44: Digital I/O characteristics.................................................................................................................................. 58
Table 45: Related documents.............................................................................................................................................59
Table 46: Terms and Abbreviations................................................................................................................................... 60
Table 47: Safety caution.................................................................................................................................................... 63
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Figure Index
Figure 1: SIM5320AL functional architecture...................................................................................................................11
Figure 2: Pin view..............................................................................................................................................................14
Figure 3: Top dimensions (Unit: mm)............................................................................................................................... 19
Figure 4: Side dimensions (Unit: mm).............................................................................................................................. 19
Figure 5: Bottom dimensions (Unit: mm)......................................................................................................................... 20
Figure 6: Footprint recommendation (Unit: mm)..............................................................................................................20
Figure 8: VBAT input application circuit.......................................................................................................................... 22
Figure 9: Reference circuit of the LDO power supply...................................................................................................... 22
Figure 10: Reference circuit of the DCDC power supply................................................................................................. 23
Figure 11: RTC supply from capacitor.............................................................................................................................. 24
Figure 12: RTC supply from non-chargeable battery........................................................................................................ 24
Figure 13: RTC supply from rechargeable battery............................................................................................................ 24
Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic.................................................................................25
Figure 15: Power on Timing Sequence..............................................................................................................................26
Figure 16: Power off timing sequence...............................................................................................................................27
Figure 17: Full modem...................................................................................................................................................... 28
Figure 18: Null modem......................................................................................................................................................29
Figure 19: RI behaviour in NULL Modem........................................................................................................................30
Figure 20: RI behaviour in FULL Modem........................................................................................................................ 30
Figure 21: Speaker interface configuration....................................................................................................................... 32
Figure 22: Receiver interface configuration...................................................................................................................... 32
Figure 23: Microphone interface configuration.................................................................................................................33
Figure 24: USIM interface reference circuit......................................................................................................................35
Figure 25: Amphenol SIM card socket.............................................................................................................................. 36
Figure 26: Reference circuit.............................................................................................................................................. 38
Figure 27: USB interface................................................................................................................................................... 39
Figure 28: Application circuit............................................................................................................................................ 42
Figure 29: Flight mode switch........................................................................................................................................... 43
Figure 30: Synchrony timing............................................................................................................................................. 44
Figure 31: EXT CODEC to MODULE timing..................................................................................................................45
Figure 32: MODULE to EXT CODEC timing..................................................................................................................45
Figure 33: Synchrony timing............................................................................................................................................. 46
Figure 34: EXT CODEC to MODULE timing..................................................................................................................46
Figure 35: MODULE to EXT CODEC timing..................................................................................................................46
Figure 36: Current drive.................................................................................................................................................... 48
Figure 37: Reset circuit......................................................................................................................................................48
Figure 38: Reference circuit.............................................................................................................................................. 49
Figure 39: Antenna matching circuit................................................................................................................................. 51
Figure 40: Top and bottom view of SIM5320AL.............................................................................................................. 56
Figure 41: The ramp-soak-spike reflow profile of SIM5320AL....................................................................................... 56
Figure 42: Recommended pad........................................................................................................................................... 57
Figure 43: System design...................................................................................................................................................58
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Revision History
Data
Version
Description of change
Author
2014-08-20
1.01
Original
Libing
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1Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5320AL module. With the help of this
document and other SIM5320AL software application notes, user guides, users can quickly understand and
use SIM5320AL module to design and develop applications quickly.
1.1 Product Outline
Designed for global market, SIM5320AL is a dual-band UMTS /HSDPA that works on frequencies of
WCDMA 1900/850MHz. The SIM5320AL support HSDPA.
With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320AL can meet almost any
space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc..
There are 80 pins on SIM5320AL, which provide most application interfaces for customers’ board.
1.2 Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
●Power Supply
●USB Interface
●Serial Interface
●Analog Audio Interfaces (SIM5320AL only)
●SIM Interface
●GPIO
●ADC
●LDO Power Output
●Sink Current Source
●Keypad Interface
●SPI Interface
●RTC
●I2C Interface
1.3 Hardware Diagram
The global architecture of the SIM5320AL Embedded module is described in the figure below.
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Figure 1: SIM5320AL functional architecture
1.4 Functional Overview
Table 1: General Feature
Feature Implementation
Power supply Single supply voltage 3.3～4.2V
Transmission data
●Dual-mode UMTS/HSDPA operation
●UMTS R99 data rates-384 kbps DL/UL
●HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps
●CSD feature: 9.6, 14.4, 64 kbps UL/DL
Audio features
(SIM5320AL only)
Speech codec modes:
●Half Rate (ETS 06.20)
●Full Rate (ETS 06.10)
●Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
●AMR (WCDMA)
●A5/1, A5/2, and A5/3 ciphering
SMS
●MT, MO, CB, Text and PDU mode
●SMS storage: SIM card
●Support transmission of SMS alternatively over CSD. User can
choose preferred mode.
SIM interface Support identity card: 1.8V, 3V.
Serial interface
●Serial Port standard or null modem mode on Serial Port Interface
●Serial Port can be used to control module by sending AT command
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USB Support USB2.0 Slave mode
Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.
SIM application toolkit Support SAT class 3, GSM 11.14 Release 98
Support USAT
Real Time Clock Support RTC
Timer function Programmable by AT command
Physical characteristics Size:30*30*2.9mm
Weight:5.6g
PCM
(SIM5320AL only)
Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (-law or A-law)
and 16 bit (linear).
Firmware upgrade Firmware upgrade over USB interface
Temperature range
●Operation temperature: -30°C to +80°C
●Storage temperature -40°C to +85°C
2Package Information
2.1 Pin Configuration
All hardware interfaces which connect SIM5320AL to customers’ application platform are through 80 pins
pads (Metal half hole). Figure 2 is SIM5320AL outline diagram.
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Figure 2: Pin view
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Table 2: Pin definition
Pin No. Define Pin No. Define
1 GND 2 GND
3 POWER_ON 4 RESET
5 GND 6 SPI_CLK
7 SPI_MISO_DATA 8 SPI_MOSI_DATA
9 SPI_CS_N 10 GND
11 USB_VBUS 12 USB_DM
13 USB_DP 14 GND
15 RESERVED 16 RESERVED
17 USIM_DATA 18 USIM_RESET
19 USIM_CLK 20 V_USIM
21 NC 22 NC
23 NC 24 NC
25 NC 26 NC
27 KEYSENSE_N1 28 KEYSENSE_N0
29 KEYPAD_0 30 KEYPAD_2
31 KEYSENSE_N2 32 KEYSENSE_N3
33 KEYPAD_1 34 KEYPAD_4
35 KEYPAD_3 36 KEYSENSE_N4
37 GND 38 VBAT_BB
39 VBAT_BB 40 GND
41 GND 42 VRTC
43 GND 44 VREG_AUX
45 CURRENT_SINK 46 ADC2
47 ADC1 48 GPIO44
49 GPIO40 50 GPIO43
51 GPIO1 52 GPIO41
53 GPIO42 54 GPIO4
55 I2C_SCL 56 I2C_SDA
57 GND 58 GND
59 MAIN_ANT 60 GND
61 GND 62 VBAT_RF
63 VBAT_RF 64 GND
65 GND 66 UART_RTS
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67 UART_CTS 68 UART_RXD
69 UART_RI 70 UART_DCD
71 UART_TXD 72 UART_DTR
73 NC 74 NC
75 NC 76 NC
77 GND 78 GND
79 GPS_ANT 80 GND
2.2 Pin description
Table 3: Pin description
Pin name I/O Description Comment
Power Supply
VBAT_RF/VBAT_BB Power supply voltage
VRTC I/O Power supply for RTC If it is unused, keep open.
VREG_AUX O LDO power output
GND Ground
Power on/off
POWER_ON I
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
Audio interface
MIC1P
I Differential audio input
If it is unused, connect to
ground through a 100N
capacitor.
MIC1N
EAR1P O
Differential audio output If these pins are unused，
keep open.
EAR1N
SPK_P O
SPK_N
USIM interface
V_USIM O Voltage Supply for SIM card
Support 1.8V or 3V SIM card All signals of SIM
interface should be
protected against
ESD/EMC.
USIM_DATA
SIM Data Output/Input
USIM_CLK
SIM Clock
USIM_RESET
SIM Reset
SPI interface
SPI_CLK O SPI clock If it is unused, keep open.
SPI_CS_N O SPI chip-select
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SPI_MOSI_DATA O SPI (master only) master out/slave in
data
SPI_MISO_DATA I SPI (master only) master in/slave out
data
USB
USB_VBUS
USB power supply input
They are compliant with
the USB 2.0 specification.
If it is unused, keep open.
USB_DP
Plus (+) line of the differential,
bi-directional USB signal to/from the
peripheral device.
USB_DM
Minus (-) line of the differential,
bi-directional USB signal to/from the
peripheral device.
Serial interface
UART_RXD
Receive Data
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
UART_TXD
Transmit Data
UART_RTS
Request to send
UART_CTS
Clear to Send
UART_RI
Ring Indicator
UART_DTR
DTE get ready
UART_DCD
Carrier detects
I2C interface
I2C_SDA I/O I2C data Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
I2C_SCL O I2C clock output
Keypad interface
KEYPAD_0 O Bit 0 drive to the pad matrix
All Keypad pins can be
configured as GPIOs.
If it is unused, keep open.
KEYPAD_1 O Bit 1 drive to the pad matrix
KEYPAD_2 O Bit 2 drive to the pad matrix
KEYPAD_3 O Bit 3 drive to the pad matrix
KEYPAD_4 O Bit 4 drive to the pad matrix
KEYSENSE_N0 I Bit 0 for sensing key press on pad
matrix
KEYSENSE_ N1 I Bit 1 for sensing key press on pad
matrix
KEYSENSE_ N2 I Bit 2 for sensing key press on pad
matrix
KEYSENSE_ N3 I Bit 3 for sensing key press on pad
matrix
KEYSENSE_ N4 I Bit 4 for sensing key press on pad
matrix
PCM interface
PCM_DIN/GPIO0 I
General Input PIN with module
wake/interrupt. It also can be
multiplexed as the PCM_DIN pin.
If it is unused, keep open.
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PCM_SYNC/GPIO2 I General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
PCM_CLK/GPIO3 O General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
PCM_DOUT/GPIO5 O General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIOs
GPIO1 O Output PIN as LED control for
network status.
If it is unused, keep open.
GPIO4 I Input PIN as RF operating control.
GPIO40 O Output PIN as operating status
indicating of module.
GPIO41 I/O
General input/output PIN. It can be
used as wake/interrupt signal to host
from module
GPIO43 I/O
General input/output PIN. It can be
used as wake/interrupt signal to
module from host.
GPIO44 I/O General input/output PIN.
GPIO42 I/O General input/output PIN.
Other interface
RESET I System reset in, active low.
CURRENT_SINK I Current source of ground-referenced
current sink Refer to 3.13.1
ADC1 I Analog Digital Converter Input Refer to 3.13.3
ADC2 I Battery temperature ADC input pin
MAIN_ANT I/O ANT soldering pad
2.3 Package Dimensions
The following figure shows mechanical dimensions of SIM5320AL.
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Figure 3: Top dimensions (Unit: mm)
Figure 4: Side dimensions (Unit: mm)
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Figure 5: Bottom dimensions (Unit: mm)
2.4 Footprint Recommendation
Figure 6: Footprint recommendation (Unit: mm)
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3Application Interface Specification
3.1 Power Supply
The power supply pins of SIM5320AL include VBAT_RF and VBAT_BB. VBAT_RF directly supplies the
power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the current
consumption rises typically to peak of more than 2A. So the power supply must be able to provide
sufficient current up to more than 2A. The following figure is the VBAT_RF voltage ripple wave at the
maximum power transmit phase.
Please refer to Figure 8—Application circuit VBAT_RF=4.0V, VBAT maximum output current =2A,
CA=100 µF tantalum capacitor (ESR=0.7Ω) and CB=1µF.
3.1.1 Power Supply Pin
Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage.
Table 4: Pin description
Pin type Pin name Min Typ Max Unit
POWER VBAT_RF 3.3 3.8 4.2 V
VBAT_BB 3.3 3.8 4.2 V
Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF
is for RF section and VBAT_BB is for baseband system.
2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2
Note2.
3.1.2 Design Guide
Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input
voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current
consumption rises up to more than 2A. If the power voltage drops below 3.3V, the module may be shut
down automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the
voltage drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical
1000uF) to storage electric power.
For the consideration of RF performance and system stability, another large capacitor (above 100uF)
should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF)
need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put
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beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the
power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following
figure is the recommended circuit.
Figure 8: VBAT input application circuit
There are three sections about how to design and optimize users’ power systems.
Power supply circuit
We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak
current of power components can rise up to more than 2A. The following figure is the reference design of
+5V input power supply. The designed output for the power supply is 4.1V, here a linear regulator can be
used.
Figure 9: Reference circuit of the LDO power supply
If there is a big difference between the input voltage and the desired output (VBAT), a switching converter
power will be preferable because of its better efficiency, especially at the high current situation. The
following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple
current intrinsically.
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Figure 10: Reference circuit of the DCDC power supply
Voltage monitor
To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two
parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual
value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the
measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For
example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is
low: 3.3v”.
If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module
will be powered off automatically and AT commands cannot be executed any more.
Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.
Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate
value. Please refer to Document [1].
3.1.3 RTC Backup
The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at
no power supply status. The RTC power supply of module can be provided by an external capacitor or a
battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference
circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the
AT commands “AT+CTZU” and “AT +CTZR”.
External capacitor backup
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Figure 11: RTC supply from capacitor
Non-chargeable battery backup
Figure 12: RTC supply from non-chargeable battery
Rechargeable battery backup
Figure 13: RTC supply from rechargeable battery
Note: The VRTC can be disabled, jus disconnect it in application circuit.
Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.
Typical charge-discharge curves for this battery are shown in the following figure.
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Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic
3.2 Power on/off Time Sequence
3.2.1 Power on Sequence
SIM5320AL can be powered on by POWER_ON pin, which starts normal operating mode.
POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the
SIM5320AL by pulling the POWER_ON pin down for a short time. The power-on scenarios are illustrated
in the following figures.
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Figure 15: Power on Timing Sequence
Table 5: Power on timing
Parameter Description Time value Unit
Min. Typ. Max.
Ton The time to pull POWER_ON down to power on 64 180 - ms
TpD+ The time to indicate connecting with the network - - 5.5 s
Tpw+ The time to indicate the module is powered on
completely --4.5 s
Tuart The time to enable UART - - 5 s
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Tusb The time to enable USB - - 9 s
Note: Module could be automatically power on by connecting Power ON pin to Low level directly.
Before designing, please refer to Document [25] for more detail.
3.2.2 Power off Sequence
The following methods can be used to power down SIM5320AL. These procedures will make module
disconnect from the network and allow the software to enter a safe state, and then save data before
completely powering the module off.
●Method 1: Power off SIM5320AL by pulling the POWER_ON pin down
●Method 2: Power off SIM5320AL by AT command
User can power off the SIM5320AL by pulling POWER_ON down for a specific time. The power off
scenario is illustrated in the following figure.
Figure 16: Power off timing sequence
Table 6: Power off timing
Parameter Description Time value
Min. Typ. Max. Unit
Toff The time pulling POWER_ON down to power off 0.5 -5 s
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TpD- The time to indicate disconnecting from the network - - 7 s
Tpw- The time to indicate the module power off completely - - 7.5 s
Tuart_off The time to disable UART - - 6 s
Tusb_off The time to disable USB - - 7.5 s
Tona The time to power on again after Tpw- 0 - - s
User can also use the AT command “AT+CPOF”to power down the module. After that, the AT commands
cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.
For details, refer to Document [1].
3.3 UART Interface
SIM5320AL provides a UART (universal asynchronous serial transmission) port. It consists of a flexible
7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is
as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed
through UART interface.
In order to prevent the UART signals of the module damaged due to voltage spikes or ESD, some resistors
can be added on UART signals. The values of resistors are adjusted according to the actual circuit. The
resistors should be placed close to the module.
The application circuit is in the following figures.
Figure 17: Full modem
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Figure 18: Null modem
3.3.1 Pin Description
Table 7: Pin description
Pin type Pin name Pin No. I/O Active voltage Default Status
UART
UART_RXD 68 I H Pull-Down
UART_TXD 71 O H Pull-Up
UART_RTS 66 O H
UART_CTS 67 I H Pull-Up
UART_DTR 72 I H Pull-Up
UART_DCD 70 O H
UART_RI 69 O H
More pin information refers to chapter 2.2.
Table 8: Logic level
Parameter Min Max Unit
Logic low input 0 0.3*VDD_EXT V
Logic high input 0.7 *VDD_EXT VDD_EXT +0.3 V
Logic low output GND 0.2 V
Logic high output VDD_EXT -0.2 VDD_EXT V
Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.
All pins of all serial ports have 8mA driver capacity.
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3.3.2 Application Guide
If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it
will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC
reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until
the master clears the interrupt event with AT command.
Figure 19: RI behaviour in NULL Modem
If Full Modem is used to establish communication between devices, the pin “RI” is another operation
status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for
about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is
answered or hung up.
Figure 20: RI behaviour in FULL Modem
To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320AL to
the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually.
SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information
please refers to the RS-232 chip datasheet.
Note: SIM5320AL supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.
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3.4 Audio Interfaces (For SIM5320AL only）
SIM5320 provides two analog signal outputs and one analog input. MIC1P/N is used as microphone,
EAR1P/N and SPK_P/N are used as audio output. Regarding audio parameters configuration, please refer
to the ATC manual.
3.4.1 Pin Description
Table 9: Pin description
Audio channel Pin name Pin No. Function
Normal
MIC1P
23
MIC positive input
MIC1N
24
MIC negative input
EAR1P
26
Receiver positive output
EAR1N 25 Receiver negative output
Hand-free
MIC1P
23
MIC positive input
MIC1N
24
MIC negative input
SPK_P
22
Loudspeaker positive output
SPK_N 21 Loudspeaker negative output
Table 10: MIC input characteristics
Parameter Min Typ Max Unit
Working Voltage - 1.8 - V
Working Current 0.07 0.4 1 mA
External Microphone Load Resistance 1.2 2.2 k Ohms
Table 11: Audio output characteristics
Parameter Min Typ Max Unit
Normal
(EAR_P,EAR_N)
Differential
Load resistance
27
32
-
Ohm
Output power - 50 - mW
Table 12: Speaker output characteristics
Parameter Min Typ Max Unit
Quiescent Current - 2.5 4 mA
Load resistance - 8 - Ohm
Output power(1KHz) - 500 - mW
3.4.2 Design Guide
There are three audio channels in SIM5320，including speaker output , receiver output and microphone
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input.
SPEAKER circuit in SIM5320 is a Class-D amplifier, optional EMI filter is shown in the following figure;
these components (two ferrite beads and two capacitors) can reduce electromagnetic interference. If used,
they should be located beside SPK_P and SPK_N pins. Considerable current flows in the channels, so
wider PCB traces are recommended (~ 20 mils).
Figure 21: Speaker interface configuration
Figure 22: Receiver interface configuration
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Figure 23: Microphone interface configuration
Note: SIM5320 has integrated MIC bias circuit. There is no need to pull the MIC1P and MIC1N up to the external power,
just connect it to microphone. MIC1P and MIC1N must be differential lines.
3.4.3 Audio Parameter Characteristic
Main audio parameters can be changed to satisfy users’ requirement. Here primary register parameters and
related description are listed. User can adjust them through AT command. For more detail please refers to
Audio Application Document.
Table 13: Audio parameter
Parameter Influence to Range Gain range Calculation AT command
micAmp1
MICP/MICN
analogue amplifier
gain before ADC
0…1 0…24dB 2 steps AT+CMICAMP1
txVol Digital gain of input
signal after ADC
0,
1...65535
Mute,
-84...+12dB
20 * log
(txVol/
16384)
AT+CTXVOL
txGain
Digital gain of input
signal after
summation of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(txGain/
16384)
AT+CTXGAIN
txFilter
Input PCM 13-tap
filter parameters, 7
values
0...65535 --- MATLAB
calculate AT+CTXFTR
rxGain Digital gain of
output signal after
0,
1...65535
Mute,
-84...+12dB
20 * log
(rxGain/ AT+CRXGAIN
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summation of
sidetone
16384)
rxVol
Digital Volume of
output signal after
speech decoder,
before summation of
sidetone and DAC
-300…300 dbm -300…300d
bm
AT+CLVL
AT+CVLVL
AT+CRXVOL
stGain Digital attenuation
of sidetone 0, 1...65535 Mute,
-96...0dB
20 * log
(stGain/
16384) -12
AT+SIDET
rxFilter
Output PCM 13-tap
filter parameters, 7
values
0...65535 --- MATLAB
calculate AT+CRXFTR
Note: If users require better experience on audio, users should modify these parameters according to their own electronic
and mechanical design.
3.5 USIM Interface
The USIM provides the required subscription verification information to allow the mobile equipment to
attach to a UMTS network. Both 1.8V and 3.0V SIM Cards are supported.
3.5.1 Pin description
Table 14: Electronic characteristic
Table 15: Pin description
Pin name 3.0V mode 1.8V mode
Min Typ Max Min Typ Max
V_USIM 2.7 3.00 3.3 1.65 1.8 2.0
USIM_RESET 0.8* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM
USIM_CLK 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM
USIM_DATA 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM
Pin name Pin Description
USIM_CLK 19 USIM Card Clock
USIM_RESET 18 USIM Card Reset
USIM_DATA 17
USIM Card data I/O, which has been pulled up with a 22kR resistor to
V_USIM in module. Do not pull up or pull down in users’ application
circuit.
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3.5.2 Application Guide
It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON
SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card
socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.
Figure 24: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM
is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to
document [1].
3.5.3 Recommend Components
For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit
http://www.amphenol.com for more information about the holder.
V_USIM 20
USIM Card Power output depends automatically on USIM mode，one
is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.
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Figure 25: Amphenol SIM card socket
Table 16: Amphenol USIM socket pin description
Pin Signal Description
C1 USIM_VDD
SIM Card Power supply, it can identify automatically the
SIM Card power mode ，one is 3.0V±10%, another is
1.8V±10%.
C2 USIM_RST SIM Card Reset.
C3 USIM_CLK SIM Card Clock.
C5 GND Connect to GND.
C6 VPP Connect to USIM_VDD
C7 USIM_DATA SIM Card data I/O.
3.6 I2C Interface
I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or
receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write
register values of related peripheral equipments connected with I2C interface.
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3.6.1 Pin Description
Table 17: Pin description
3.6.2 Signal Description
Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor
respectively. When the bus is free, both lines are high.
3.6.3 Design Guide
For SIM5320AL, the data on the I2C bus can be transferred at rates up to 400kbps. The number of
peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note
that PCB traces length and bending are in users’ control to minimize load capacitance.
Note
：
I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need
to pull them up in users’ application circuit.
3.7 Keypad Interface
SIM5320AL module provides a keypad interface that supports five sense lines, or columns, and five
keypad rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V.
3.7.1 Pin Description
Table 18: Pin description
Pin name Pin No. Function
KEYSENSE_N0 28
Sensing keys
KEYSENSE_N1 27
KEYSENSE_N2 31
KEYSENSE_N3 32
KEYSENSE_N4 36
Pin name Pin No. Function
I2C_SDA 56 Serial interface data input and output
I2C_SCL 55 Serial interface clock input
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KEYPAD_0 30
Driving pads
KEYPAD_1 29
KEYPAD_2 30
KEYPAD_3 35
KEYPAD_4 34
3.7.2 Application Guide
All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as
input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure.
Figure 26: Reference circuit
If these pins are configured for GPIOs, the sequence is listed in the following table.
Table 19: GPIO configuration
Keypad interface GPIO No.
KEYPAD_4 GPIO6
KEYPAD_3 GPIO7
KEYPAD_2 GPIO8
KEYPAD_1 GPIO9
KEYPAD_0 GPIO10
KEYSENSE_N4 GPIO11
KEYSENSE_N 3 GPIO12
KEYSENSE_N 2 GPIO13
KEYSENSE_N 1 GPIO14
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KEYSENSE_N 0 GPIO15
Note: Refer to document [21] for detailed information of Keypad Application Note.
3.8 USB Interface
SIM5320AL module contains a USB interface. This interface is compliant with the USB2.0 specification.
The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely
low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is
not supported.
Table 20: Electronic characteristic
Pin name
Pin No.
Input voltage scope( V )
Min
Typ
Max
USB_VBUS
11
4.4
5.0
5.25
USB_DP
13
They are compliant with the USB 2.0 specification.
USB_DM
12
3.8.1 Application Guide
Currently SIM5320AL supports the USB suspend and resume mechanism which can help to save power.
If no transaction is on USB bus, SIM5320AL will enter suspend mode. When some events such as voice
call or receiving SMS happen, SIM5320AL will resume normal mode automatically.
Figure 27: USB interface
Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component
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on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.
Note
：
The SIM5320AL has two kinds of interface (UART and USB) to connect to host CPU. USB interface is mapped
to five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”,
“SIMTECH Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.
3.9 SPI Interface
SPI interface of SIM5320AL is master only. It provides a duplex, synchronous, serial communication link
with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz.
3.9.1 Pin Description
Table 21: Electronic characteristic
Pin name 1.8V mode
Min Typ Max
SPI_CLK 1.65 1.8 1.95
SPI_CS_N 1.65 1.8 1.95
SPI_MOMI_DATA 1.65 1.8 1.95
SPI_MIMO_DATA 1.65 1.8 1.95
Table 22: Pin description
3.10 GPIO Interface
SIM5320AL provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs.
User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.
3.10.1 Pin Description
Table 23: Electronic characteristic
Pin name Pin No. Function
SPI_CS 9 SPI chip-select; not mandatory in a point-to-point connection
SPI_MISO_DATA 7 SPI master in/slave out data
SPI_CLK 6 SPI clock
SPI_MOSI_DATA 8 SPI master out/slave in data
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Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as KEYPAD.
Please refer to GPIO list.
Table 24: Pin description
Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.
3.10.2 Application Guide
Network status
GPIO1 is used to control Network Status LED; application circuit is shown below.
Pin name 2.6V mode
Min Typ Max
GPIO1 2.5 2.6 2.7
GPIO4 2.5 2.6 2.7
GPIO40 2.5 2.6 2.7
GPIO41 2.5 2.6 2.7
GPIO43 2.5 2.6 2.7
GPIO44 2.5 2.6 2.7
GPIO42 2.5 2.6 2.7
Pin name Pin No. I/O Function
GPIO1 51 O Output PIN as LED control for network status. If it is
unused, left open.
GPIO4 54 I
Input PIN as RF operating control.
H: Normal Mode L:Flight Mode
If it is unused, left open.
GPIO40 49 O
Output PIN as operating status indicating of module.
H: Power on L: Power off
If it is unused, left open.
GPIO41 52 I/O General input/output PIN. It can be used as wake/interrupt
signal to host from module If it is unused, left open.
GPIO42 53 I/O General Purpose Input/Output Port.
GPIO43 50 I/O
General Purpose Input/Output Port. It can be used as
wake/interrupt signal to module from host. If it is unused, left
open.
GPIO44 48 I/O General Purpose Input/Output Port
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Figure 28: Application circuit
Note: The value of resistor Rx depends on LED characteristic.
Table 25: LED status
LED Status Module Status
Always On Searching Network/Call Connect
200ms ON, 200ms OFF Data Transmit
800ms ON, 800ms OFF Registered network
Off Power off / Sleep
Flight mode control
GPIO4 controls SIM5320AL module to enter or exit the Flight mode. In Flight mode, SIM5320AL closes
RF function to prevent interference with other equipments or minimize current consumption. Bidirectional
ESD protection component is suggested to add on GPIO4.
Figure 29: Flight mode switch
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Table 26: Control status
GPIO4 Status Module operation
Low Level Flight Mode: RF is closed.
High Level Normal Mode: RF is working.
Note
：
1. When the module is powered off, make sure all digital interfaces (UART, etc) connected with peripheral devices have
no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in GPIO
pins because current leakage from above digital interfaces may occur.
3.11 PCM Interface
SIM5320 provides hardware PCM interface for external codec. The PCM interface enables
communication with an external codec to support hands-free applications. SIM5320 PCM interface can be
used in two modes: the default mode is auxiliary PCM (8 KHz long sync mode at 128 KHz PCM CLK);
the other mode is primary PCM (8 KHz short sync mode at 2048 KHz PCM CLK). In short-sync
(primary PCM) mode, SIM5320 can be a master or a slave. In long-sync (auxiliary PCM) mode, SIM5320
is always a master. SIM5320 also supports 3 kinds of coding formats: 8 bits (-law or A-law) and 16 bits
(linear).
Note: PCM interface is multiplexed from GPIO (default setting). The AT command “AT+CPCM” is used to switch
between PCM and GPIO functions. Please refer to document [22] and document [1] for details.
3.11.1 Pin Description
Table 27: Electronic characteristic
Pin name DC Characteristics
Min Typ Max
PCM_CLK -0.3 2.6 2.9
PCM_SYNC -0.3 2.6 2.9
PCM_DOUT -0.3 2.6 2.9
PCM_DIN -0.3 2.6 2.9
Table 28: Pin description
Pins Pin No. AUX_PCM
functionality
Primary PCM
functionality Description
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PCM_DIN/GPIO0 74 AUX_PCM_DIN PCM_DIN PCM data input
PCM_SYNC/GPIO2 75 AUX_PCM_SYNC PCM_SYNC PCM data synchrony
PCM_DOUT/GPIO5 73 AUX_PCM_DOUT PCM_DOUT PCM data output
PCM_CLK/GPIO3 76 AUX_PCM_CLK PCM_CLK PCM data clock
3.11.2 Signal Description
The default PCM interface in SIM5320 is the auxiliary PCM interface. The data changes on the high level
of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is disabled
after every power-on or every reset event. So user must use AT command to enable the primary PCM
mode after powering on or resetting the module every time if user wants to use Primary PCM.SIM5320
PCM Interface can be operated in Master or Slave mode if it is configured to primary PCM. In Master
Mode, the Module drives the clock and sync signals that are sent to the external codec. When it is in Slave
Mode, the external codec drives the clock and sync signals which are sent to the module. Both PCM
modes are discussed in this section followed by additional PCM topics.
Auxiliary PCM (128 KHz PCM clock)
-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard
long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.
Most -law codec support the 128 KHz clock.
Figure 30: Synchrony timing
Figure 31: EXT CODEC to MODULE timing
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Figure 32: MODULE to EXT CODEC timing
Table 29: Timing parameters
Parameter Description Min Typ Max Unit
T(auxsync) AUX_PCM_SYNC cycle time – 125 - μs
T(auxsynch) AUX_PCM_SYNC high time 62.4 62.5 - μs
T(auxsyncl) AUX_PCM_SYNC low time 62.4 62.5 - μs
T(auxclk)* AUX_PCM_CLK cycle time - 7.8 – μs
T(auxclkh) AUX_PCM_CLK high time 3.8 3.9 – μs
T(auxclkl) AUX_PCM_CLK low time 3.8 3.9 – μs
T(suauxsync) AUX_PCM_SYNC setup time high before
falling edge of PCM_CLK 1.95 – – μs
T(hauxsync) AUX_PCM SYNC hold time after falling edge
of PCM_CLK 1.95 – – μs
T(suauxdin) AUX_PCM_DIN setup time before falling
edge of AUX_PCM_CLK 70 – – ns
T(hauxdin) AUX_PCM_DIN hold time after falling edge
of AUX_PCM_CLK 20 – – ns
T(pauxdout) Delay from AUX_PCM_CLK rising to
AUX_PCM_DOUT valid – – 50 ns
*Note: T(auxclk) = 1/(128 KHz).
Primary PCM (2048 KHz PCM clock)
SIM5320 also supports 2.048 MHz PCM data and sync timing for -law codec. This is called the primary
PCM interface. User can use AT command to take the mode you want as discussed above.
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Figure 33: Synchrony timing
Figure 34: EXT CODEC to MODULE timing
Figure 35: MODULE to EXT CODEC timing
Table 30: Timing parameters
Parameter Description Min Typ Max Unit
T(sync) PCM_SYNC cycle time – 125 – μs
T(synch) PCM_SYNC high time 400 500 – ns
T(syncl) PCM_SYNC low time – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high time – 244 – ns
T(clkl) PCM_CLK low time – 244 – ns
T(susync) PCM_SYNC setup time high before falling edge of
PCM_CLK 60 – – ns
T(hsync) PCM_SYNC hold time after falling edge of
PCM_CLK 60 – – ns
T(sudin) PCM_DIN setup time before falling edge of
PCM_CLK 50 – – ns
T(hdin) PCM_DIN hold time after falling edge of
PCM_CLK 10 – – ns
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T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid – – 350 ns
T(zdout) Delay from PCM_CLK falling to PCM_DOUT
HIGH-Z – 160 – ns
Note: SIM5320 can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more
information of PCM Application Note.
3.12 Multi-functional interface
SIM5320AL merges functions for various applications. It can enrich users’ design and lower the cost of
users’ hardware.
3.12.1 Sink Current Source
The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this
implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain
a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.
Table 31: Electronic characteristic
Symbol Description Min Typ Max Unit
CURRENT_SINK Input voltage 0.5 VDD 5 V
IOInput current - - 150 mA
Since the driver is ground-referenced current sink, the operating device it drives must form a current path
between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference.
Figure 36: Current drive
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Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>,
<value>”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA.
3.12.2 Reset Function
SIM5320AL also have a RESET pin (PIN4) to reset the module. This function is used as an emergency
reset only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the
RESET pin to ground, then the module will reset.
This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor
close to the RESET pin is strongly recommended. A reference circuit is recommended in the following
figure.
Figure 37: Reset circuit
Note
：
50ms<t<200ms. ESD components are suggested to be used on Reset pin.
3.12.3 ADC
SIM5320AL has a dedicated ADC that is available for digitizing analog signals such as battery voltage and
so on; it is on PIN 47 and PIN 46 , namely ADC1 and ADC2 . This ADC is 12 bit
successive-approximation circuit, and electronic specification is shown in the following table.
Table 32: Electronic Characteristics
Specification Min Typ Max Unit Comments/Conditions
Resolution 12 Bits
Differential nonlinearity -4 +4 LSB
Analog Vdd = ADC reference
2.4MHz sample rate
Integral nonlinearity -8 +8 LSB
Gain Error -2.5 +2.5 %
Offset Error -4 +40 LSB
Input Range GND 2.2V V
Input serial resistance 2 kΩ Sample and hold switch resistance
Input capacitance 53 pF
Power-down to wakeup 9.6 19.2 μs
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User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw
data which is between 0 and 4095. The data can be transformed to any type such as voltage, temperature
etc. Please refer to document [1].
Figure 38: Reference circuit
Note: The input signal voltage value in ADC must not be higher than 2.2V.
3.12.4 LDO
SIM5320AL has a LDO power output, namely VREG_AUX. The LDO is available and output voltage is
2.85v by default, rated for 250mA. User can switch the LDO on or off by the AT command
“AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.
Table 33: Electronic characteristic
Symbol Description Min Typ Max Unit
VREG_AUX Output voltage 1.5 2.85 3.05 V
IOOutput current - - 250 mA
4 RF Specification
4.1 RF Specification
Table 34: Conducted transmission power
Frequency Max Min
WCDMA 1900 24dBm +1/-3dB -56dBm ±5dB
WCDMA 850 24dBm +1/-3dB -56dBm ±5dB
Table 35: Operating frequencies
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Frequency Receiving Transmission
WCDMA1900 1930～1990 MHz 1850～1910 MHz
WCDMA 850 869 ～894 MHz 824 ～849 MHz
Table 36: Conducted receive sensitivity
Frequency Receive sensitivity
WCDMA 1900 < -108dBm
WCDMA 850 < -106dBm
4.2 Operating Specification
SIM5320AL can support high rate data by WCDMA wireless network. In the different network
environment, data transmission rate shifts depending on modulation and encoding.
Table 37: HSDPA throughout
Category Supported Max supported
HS-DSCH codes
Theoretical max
peak rate(Mbps) Modulation
Category1 5 1.2 16QAM,QPSK
Category2 5 1.2 16QAM,QPSK
Category3 5 1.8 16QAM,QPSK
Category4 5 1.8 16QAM,QPSK
Category5 5 3.6 16QAM,QPSK
Category6 5 3.6 16QAM,QPSK
Category7 10 7.2 16QAM,QPSK
Category8 10 7.2 16QAM,QPSK
Category9 15 10.0 16QAM,QPSK
Category10 15 14.0 16QAM,QPSK
Category11 5 0.9 QPSK
Category12 5 1.8 QPSK
Note: Actual throughout rates depend on network configuration, network loading, signal condition and so on.
4.3 Antenna Design Guide
SIM5320AL provides RF antenna interface. Customer’s antenna should be located in the host board and
connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace
impedance must be controlled in 50Ω.The maximum gain of the Main antenna gain should not exceed
1dBi considering the SAR radio. No antenna gain may be used that would exceed the 2W EIRP power
limit in 1900MHz band.The input impendence of the antenna should be 50Ω, and the VSWR should be
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less than 2.
SIMCom recommends that the total insertion loss between the antenna pad and antenna should meet the
following requirements:
●WCDMA 1900<0.9dB
●WCDMA 850<0.5dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit
should be added. The following figure is the recommended circuit.
Figure 39: Antenna matching circuit
In this figure, the components R1,C1,C2 and R2 is used for antenna matching, the value of components
can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R1,
R2 are 0 ohm resistors, and the C1, C2 are reserved for tuning.
The RF test connector in the figure is used for the conducted RF performance test, and should be placed as
close as to the module’s antenna pin. The traces impedance between components must be controlled in
50ohm.
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5Reliability and Operating Characteristics
5.1 Electronic Characteristics
Absolute maximum rating for digital and analog pins of SIM5320AL are listed in the following table:
Table 38: Absolute maximum ratings
Parameter Min Max Unit
Voltage at digital pins (1.8v mode) -0.3 1.8+0.3 V
Voltage at digital pins (2.6v mode) -0.3 2.6+0.3 V
Voltage at VBAT -0.5 6.0 V
Voltage at VRTC 1.5 3.2 V
Voltage at USB_VBUS -0.5 6.0 V
Table 39: Recommended operating ratings
Parameter Min Typ Max Unit
Voltage at digital pins (1.8v mode) 1.65 1.8 1.95 V
Voltage at digital pins (2.6v mode) 2.5 2.6 2.7 V
Voltage at VBAT 3.3 3.8 4.2 V
Voltage at VRTC 1.5 - 3.0 V
Voltage at USB_VBUS 4.75 5 5.25 V
The operating temperature and power specification is listed in the following table.
Table 40: Operating temperature
Parameter Min Typ Max Unit
Ambient temperature -30 25 80 ℃
Storage temperature -40 25 +85 ℃
Note: SIMCom recommends user to install a heat sink on the module shielding case if SIM5320AL operates in WCDMA
band.
5.2 Operating Mode
The following table summarizes the various operating modes, each operating modes will be referred to in
the following chapters.
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5.2.1 Operating Modes Overview
Table 41: Operating Modes Overview
Mode Function
Sleep mode WCDMA
SLEEP
Module will automatically enter SLEEP mode if DTR is set to high
level and there is no on air or hardware interrupt (such as GPIO
interrupt or data on serial port).
In this case, the current consumption of module will be reduced to the
minimal level.
In SLEEP mode, the module can still receive paging message，voice
call and SMS.
WCDMA
WCDMA
IDLE
Module has registered to the WCDMA network, and the module is
ready to communicate.
WCDMA
TALK
Module is active in WCDMA mode. The power consumption depends
on network settings.
HSDPA
HSDPA IDLE
Module is ready for data transmission, but no data is currently sent or
received. Power consumption depends on network settings and
HSDPA configuration
HSDPA
DATA
There is HSDPA data transfer (PPP or TCP or UDP) in progress. In
this case, power consumption is related with network settings (e.g.
power control level), uplink/downlink data rates and HSDPA
configuration
Power down
Module can be powered down by the AT command “AT+CPOF” or the POWER_ON
pin. The power management unit shuts down the power supply of the module, only the
power supply of RTC is remained. The serial interface is not accessible. Operating
voltage (connected to VBAT) remains applied.
Minimum
functionality
mode
The AT command “AT+CFUN” can be used to set the module to a minimum
functionality mode without removing the power supply. In this mode, the RF part of
the module will not work or the SIM card will not be accessible, or both will be closed,
and the serial port is still accessible. The power consumption in this mode is very low.
5.2.2 Minimize Power Consumption
There are two modes that SIM5320AL achieves low power consumption.
Sleep mode
If peripheral equipments stops working, and there is no on air or hardware interrupts (such as GPIO
interrupts or data on UART), SIM5320AL will enter sleep mode automatically. In this mode, SIM5320AL
can still receive paging，voice call or SMS from network. If USB interface of SIM5320AL is connected to
host CPU, but host CPU does not support USB suspending, then SIM5320AL will not enter sleep mode.
After USB is disconnected, SIM5320AL will enter sleep mode.
Note: When UART interface is connected with host CPU, SIM5320AL can not enter sleep mode until RXD is pulled
down by the host CPU. If the module is in the idle mode, make sure to pull the RXD to low level by host CPU. SIMCom
recommends using GPIO43 or UART_DTR to wake up the module from host CPU and to use GPIO41 or UART_RI to
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wake up the host CPU. Before designing, pay attention to how to realize waking function and refer to Document[24] and
Document[25] for more detail.
Minimum functionality mode
Minimum functionality mode ceases a majority function of module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.
●AT+CFUN=0: Minimum functionality
●AT+CFUN=1: Full functionality (Default)
●AT+CFUN=4: Disable RF function of the module (Flight mode)
If SIM5320AL has been set to minimum functionality mode, the module will firstly enter sleep mode, then
the RF function and SIM card function will be closed. In this case, the serial port is still accessible, but RF
function or SIM card will be unavailable. When SIM5320AL is in minimum functionality or flight mode,
it can return to full functionality by the AT command “AT+CFUN=1”.
Note: For flight mode, please refer to Chapter3.9.2.
5.3 Current Consumption
The current consumption in suspended mode and without USB connection is listed in the table below.
Here, “suspended mode” means that SIM5320AL is connected to USB bus, but it does not transfer data.
Table 42: Current consumption
UMTS Sleep Mode (without USB connection)
WCDMA 1900
Sleep @DRX=9 2.2mA
Sleep @DRX=8 2.7 mA
Sleep @DRX=6 4.7mA
WCDMA 850
Sleep @DRX=9 2.2mA
Sleep @DRX=8 2.7 mA
Sleep @DRX=6 4.7mA
UMTS Sleep Mode (with USB suspended)
WCDMA 1900
Sleep @DRX=9 2.4mA
Sleep @DRX=8 2.8 mA
Sleep @DRX=6 4.8mA
WCDMA 850
Sleep @DRX=9 2.4mA
Sleep @DRX=8 2.8 mA
Sleep @DRX=6 4.8mA
HSDPA Data
WCDMA 1900 @Power 23dBm CQI=22 Typical 610mA
@Power 21dBm CQI=5 Typical 540mA
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@Power -5dBm CQI=22 Typical 270mA
WCDMA 850
@Power 23dBm CQI=22 Typical 550mA
@Power 21dBm CQI=5 Typical 490mA
@Power -5dBm CQI=22 Typical 220mA
5.4 EMC and ESD Notes
EMC tests should be performed to detect any potential problems. Possible harmful emissions radiate by
the application to the RF receiver in the receiver band. It is recommended to shield the sensitive
components and trace with common ground and user can add beads where necessary.
Normally SIM5320AL is mounted on customer host board. Although some ESD components have been
added in SIM5320AL, to prevent ESD, user should put some ESD components on customers’ board. The
ESD components should be placed beside the connectors which human body might touch, such as SIM
card holder, switches, keys, etc. The following table is the SIM5320AL ESD measurement performance;
the results are from SIMCom EVB test.
Table 43: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
Part Contact discharge Air discharge
VBAT,GND ±4KV ±6KV
UART,USB ±2KV ±6KV
Antenna port ±4KV ±6KV
Other ports ±2KV ±2KV
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6Guide for Production
6.1 Top and Bottom View of SIM5320AL
Figure 40: Top and bottom view of SIM5320AL
These test points are only used for module manufacturing and testing. They are not for customer’s
application.
6.2 Typical Solder Reflow Profile
For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In
final board assembly, the typical solder reflow profile will be determined by the largest component on the
board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown
below is only a generic recommendation and should be adjusted to the specific application and
manufacturing constraints.
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Figure 41: The ramp-soak-spike reflow profile of SIM5320AL
For details about secondary SMT, please refer to document [24].
6.3 Moisture Sensitivity Level (MSL)
SIM5320AL is qualified to Moisture Sensitivity Level (MSL) 5 in accordance with JEDEC J-STD-020.
After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment
(<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not
heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.
6.4 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.15mm.
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6.5 Recommended Pad Design
Figure 42: Recommended pad
Note: More designing details refer to Figure 6.
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Appendix
A. System Design
Figure 43: System design
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B. SIM5320AL GPIOs List
Table 43: SIM5320AL GPIOs list
Name GPIO Index Default Function Alternate Function
STATUS_LED 1 Status led GPIO
RF_SWITCH 4 RF Switch Enable/Disable RF subsystem
KEYPAD_4 6 Keypad GPIO
KEYPAD_3 7 Keypad GPIO
KEYPAD_2 8 Keypad GPIO
KEYPAD_1 9 Keypad GPIO
KEYPAD_0 10 Keypad GPIO
KEYSENSE_N4 11 Keypad GPIO
KEYSENSE_N3 12 Keypad GPIO
KEYSENSE_N2 13 Keypad GPIO
KEYSENSE_N1 14 Keypad GPIO
KEYSENSE_N0 15 Keypad GPIO
UART1_CTS 33 CTS GPIO
UART1_ RTS 34 RTS GPIO
UART1_DTR 35 DTR wake up module GPIO
UART_DCD 36 DCD GPIO
UART_RI 37 RI wake up host GPIO
GPIO40 40 Module power up status GPIO
GPIO41 41 Wake up host GPIO
GPIO42 42 GPIO GPIO
GPIO43 43 Wake up module GPIO
GPIO44 44 GPIO GPIO
C. Digital I/O Characteristics
Table 44: Digital I/O characteristics
Parameter Description 2.6V Mode 1.8V Mode Unit
Min Typ Max Min Typ Max
VIH High-level
input voltage 1.69 2.6 2.9 1.17 1.8 2.1 V
VIL Low-level
input voltage -0.3 0 0.91 -0.3 0 0.63 V
VOH High-level
output voltage 1.17 2.6 2.6 0.81 1.8 1.8 V
VOL Low-level
output voltage 0 0 0.45 0 0 0.45 V
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IIH
Input high
leakage
current
- - 1 - - 1 uA
IIL
Input low
leakage
current
-1 - - -1 - - uA
CIN
Input
capacitance - - 7 - - 7 pF
Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, SPI and DEBUG. The
SIM5320AL includes two kinds of voltages: 1.8v and 2.6v. Digital I/O specifications under both conditions are presented
in the above tables.
D. Related Documents
Table 45: Related documents
SN Document name Remark
[1] SIM5320AL_ATC_V1.0
0SIM5320AL_ATC_V1.00
[2] ITU-T Draft new
recommendationV.25ter Serial asynchronous automatic dialing and control
[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set
for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
[5] GSM 07.05
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment (DTE –
DCE) interface for Short Message Service (SMS) and Cell
Broadcast Service (CBS)
[6] GSM 11.14
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
[7] GSM 11.11
Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
[8] GSM 03.38 Digital cellular telecommunications system (Phase 2+); Alphabets
and language-specific information
[9] GSM 11.10
Digital cellular telecommunications system (Phase 2) ；Mobile
Station (MS) conformance specification ；Part 1: Conformance
specification
[10] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[11] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.
[12] 3GPP TS 34.121 Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.
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[13] 3GPP TS 34.123-1
Technical Specification Group Radio Access Network; Terminal
conformance specification; Radio transmission and reception
(FDD)
[14] 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract
Test Suites.
[15] EN 301 908-02 V2.2.1
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
[16] EN 301 489-24 V1.2.1
Electromagnetic compatibility and Radio Spectrum Matters (ERM);
Electromagnetic Compatibility (EMC) standard for radio
equipment and services; Part 24: Specific conditions for IMT-2000
CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio
and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
[20] 2002/95/EC
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain hazardous
substances in electrical and electronic equipment (RoHS)
[21] Keypad Application
Note V1.01 Keypad Application Note V1.01
[22] Sleep_Application_Note Sleep_Application_Note
[23] Waking_up_Applicatio
n_Note
Waking_up_Application_Note
[24] Module
secondary-SMT-UGD
SMT Note
[25] SIM5xxx_Automatic_powe
r_on_Application_Note
SIM5xxx_Automatic_power_on_Application_Note
E. Terms and Abbreviations
Table 46: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
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DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HR Half Rate
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
Inorm Normal Current
Imax Maximum Load Current
kbps Kilo bits per second
Li-Ion Lithium-Ion
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
Rx Receive Direction
SIM Subscriber Identification Module
SMS Short Message Service
SPI serial peripheral interface
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
Vmax Maximum Voltage Value
Vnorm Normal Voltage Value
Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
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VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output High Level Voltage Value
VOHmin Minimum Output High Level Voltage Value
VOLmax Maximum Output Low Level Voltage Value
VOLmin Minimum Output Low Level Voltage Value
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
USIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter
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F. Safety Caution
Table 47: Safety caution
Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use of
mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive
to not operate normally for RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forget to think much of these instructions
may lead to the flight safety or offend against local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical
equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios, computers
or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, for example no mobile
fee or a invalid SIM card. While you are in this condition and need emergent help,
please remember using emergency calls. In order to make or receive calls, the cellular
terminal or mobile must be switched on and in a service area with adequate cellular
signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R.
China 200335
Tel: +86 21 3235 3300
Fax: +86 21 3235 3301
URL: www.sim.com/wm

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