Telit Communications S p A WE865D Wi-Fi 802.11 b/g Module User Manual Gxzzz Product Description

Telit Communications S.p.A. Wi-Fi 802.11 b/g Module Gxzzz Product Description

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WE865-DUAL Hardware User Guide

1vv0300787 Rev. 1 - 03/10/08

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

This document is relating to the following products:

WE865DUA000-001

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Contents

1Overview ...........................................................................................................................6

1.1Related documents ................................................................................................................7

2Mechanical description....................................................................................................8

3Pin-out.............................................................................................................................10

3.1Pin table.................................................................................................................................10

3.2Ball grid .................................................................................................................................12

4Electrical description .....................................................................................................13

4.1Power supply ........................................................................................................................13

4.1.1Unique supply voltage for WE865-DUAL and GE863-PRO3......................................................... 13

4.1.1.1Current consumption ................................................................................................................. 15

4.1.1.2Shut-down mode........................................................................................................................ 15

4.2Power supply design guidelines.........................................................................................16

4.2.1+5V input source............................................................................................................................ 17

4.2.2+12V input source.......................................................................................................................... 18

4.2.3Battery source................................................................................................................................ 20

4.3Reset signals ........................................................................................................................20

4.3.1Reset.............................................................................................................................................. 21

4.3.2Manual reset .................................................................................................................................. 22

4.4SDIO signals .........................................................................................................................23

5Thermal design guidelines ............................................................................................24

6PCB layout design guidelines.......................................................................................25

7Antenna...........................................................................................................................26

7.1Wi-Fi antenna guidelines .....................................................................................................26

7.2Wi-Fi antenna PCB trace guidelines ...................................................................................27

7.3Wi-Fi antenna installation guidelines .................................................................................28

8Integration with the GE863-PRO3..................................................................................29

8.1Power supply ........................................................................................................................30

8.2SDIO signals .........................................................................................................................31

9WE865-DUAL - Evaluation kit........................................................................................32

9.1WE865-DUAL Interface board..............................................................................................35

9.1.1Mechanical description .................................................................................................................. 35

9.1.2Main components .......................................................................................................................... 36

9.1.3Jumpers settings............................................................................................................................ 38

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9.1.4Pin table ......................................................................................................................................... 39

10Mounting the WE865-DUAL on the application board ................................................40

10.1Stencil....................................................................................................................................40

10.2PCB pad design ....................................................................................................................40

10.3Solder paste ..........................................................................................................................43

10.4Solder reflow.........................................................................................................................43

11Moisture sensitivity........................................................................................................45

12Conformity assessment issues ....................................................................................46

13Safety recommendations...............................................................................................47

14Document change log....................................................................................................48

WE865-DUAL HW User Guide

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DISCLAIMER

The information contained in this document is proprietary information of Telit Communications S.p.A.

including its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than

the Officers, employees, agents or subcontractors of the owner or licensee of this document, without

the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the

foregoing, Telit does not make any warranty as to the information contained herein, and does not

accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the

information.

Telit disclaims any and all responsibility for the application of the devices characterized in this

document, and notes that the application of the device must comply with the safety standards of the

applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to

typographical errors, inaccurate information, or improvements to programs and/or equipment at any

time without a notice. Such changes will, nevertheless be incorporated into new editions of this

document.

WE865-DUAL HW User Guide

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1 Overview

This document is a user guide for developing a wireless application which integrates the Telit WE865-

DUAL with the GE863-PRO3 GSM/GPRS module creating a unique solution for a short and long

range.

This document cannot embrace the whole hardware solutions and products that may be designed.

The information given is a guide line and a starting point for properly developing products with the Telit

WE865-DUAL module.

For further hardware details please refer to the Telit “WE865-DUAL Product Description” document.

NOTICE

(EN) The integration of the Wi-Fi WE865-DUAL module within user application shall be done according

to the design rules described in this manual.

(IT) L’integrazione del modulo Wi-Fi WE865-DUAL all’interno dell’applicazione dell’utente dovrà

rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die integration des Wi-Fi WE865-DUAL Moduls in ein Gerät muß gemäß der in diesem Dokument

beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija Wi-Fi WE865-DUAL modula v uporabniški aplikaciji bo morala upoštevati

projektna navodila, opisana v tem piročniku.

(SP) La utilización del modulo Wi-Fi WE865-DUAL debe ser conforme a los usos para los cuales ha

sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module Wi-Fi WE865-DUAL dans l’application de l’utilisateur

sera faite selon les règles de conception décri tes dans ce manuel.

ה םדומ לש היצרגטניאה ךילהתהב הז ךמסמב תוטרופמה תויחנהה תא םשייל שקבתמ רוטרגטניאה– Wi-Fi WE865-DUAL

רצומה םע

The information presented in this document is believed to be accurate and reliable. However, no responsibility is

Assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent rights of

Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to

change without notice.

WE865-DUAL HW User Guide

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1.1 Related documents

The following documents are related to this user guide:

[1] Telit WE865-DUAL Product Description 80312ST10046A

[2] Telit WE865-DUAL Software User Guide 1vv0300788

[3] Telit GE863-PRO³ Hardware User Guide 1vv0300773a

[4] Telit GE863-PRO³ Software User Guide 1vv0300788

[5] Telit GE863PRO3 EVK User Guide 1vv0300776

[6] Telit GE863PRO3 Linux SW User Guide 1vv0300781

[7] Telit GE863PRO3Linux Development Environment User Guide1vv0300780

All documentation can be downloaded from Telit’s official web site www.telit.com if not otherwise

indicated.

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2 Mechanical description

The Telit WE865-DUAL module overall dimensions are:

• Length: 22.15 mm (max)

• Width: 22.15 mm (max)

• Thickness: 3.48 mm (max)

• Weight 3.5 g

Figure 1

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Figure 2 (Bottom side)

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3 Pin-out

3.1 Pin table

Ball Signal I/O Function Internal PULL

UP/DOWN Type

SDIO

A1 SDIO[0] I/O SDIO DATA[0] (or SPI MISO) 10KOhm pull-up SDIO (or SPI)

B2 SDIO[1]

I/O SDIO DATA[1]

(or SPI INTERRUPT) 10KOhm pull-up SDIO (or SPI)

A2 SDIO[2] I/O SDIO DATA[2] 10KOhm pull-up SDIO

B3 SDIO[3]

I/O SDIO DATA[3]

(or SPI CHIP SELECT) 10KOhm pull-up SDIO (or SPI)

A3 SDIO_CLK

I/O SDIO CLOCK

(or SPI CLOCK) - SDIO (or SPI)

A4 SDIO_CMD I/O SDIO CMD (or SPI MOSI ) 10KOhm pull-up SDIO (or SPI)

Testing and Certification

C3 TEST_1 O Test line n. 1 - TEST

C4 TEST_2 I Test line n. 2 - TEST

C5 TEST_3 I Test line n. 3 - TEST

D5 TEST_4 I Test line n. 4 - TEST

Miscellaneous Functions

B1 EN_A* I Enable/shut-down 10KOhm pull-up control

C1 MR_RESET* I Manual reset

100KOhm pull-

up control

D1 EN_B* I Enable/shut-down 10KOhm pull-up control

D2 RESET I Reset for host processor

47KOhm pull-

down control

H5 RF_ANT RF RF output - antenna

Power Supply

E1 VDD PWR Power input pin - power supply

E2 VDD PWR Power input pin - power supply

F1 VCC_A PWR Power input pin - power supply

F2 VCC_A PWR Power input pin - power supply

F3 VCC_A PWR Power input pin - power supply

RESERVED1

A5 N.C.

A6 N.C.

1 All the reserved pins must be kept not connected (N.C.)

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Ball Signal I/O Function Internal PULL

UP/DOWN Type

A7 N.C.

A8 N.C.

B4 N.C.

B5 N.C.

B6 N.C.

B7 N.C.

B8 N.C.

C5 N.C.

C6 N.C.

C8 N.C.

D3 N.C.

D4 N.C.

D6 N.C.

D7 N.C.

D8 N.C.

E3 N.C.

E4 N.C.

E6 N.C.

E8 N.C.

F4 N.C.

F5 N.C.

F6 N.C.

F7 N.C.

F8 N.C.

G2 N.C.

G6 N.C.

G7 N.C.

G8 N.C.

H1 N.C.

H2 N.C.

H4 N.C.

H7 N.C.

H8 N.C.

Table 1

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3.2 Ball grid

A B C D E F G H

1 SDIO[0] EN_A* MR_RESET* EN_B* VDD VCC_A GND NC

2 SDIO[2] SDIO[1] GND RESET VDD VCC_A NC NC

3 SDIO_CLK SDIO[3] TEST_1 NC NC VCC_A GND GND

4 SDIO_CMD NC TEST_2 NC NC NC GND NC

5 NC NC TEST_3 TEST_4 GND NC GND RF_ANT

6 NC NC NC NC NC NC NC GND

7 NC NC GND NC GND NC NC NC

8 NC NC NC NC NC NC NC NC

Table 2

NOTE: The drawing above is a top view.

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4 Electrical description

The power supply circuitry and board layout are a very important part in the full product design and

they strongly reflect on the product overall performances, hence read carefully the requirements and

the guidelines that will follow for a proper design.

4.1 Power supply

Powering of the module:

• wide range voltage operation from 3.4V up to 4.2V (typical voltage 3.8V) the same as

for GE863-PRO3.

The above voltage range is chosen in order to use the same voltage range for the Wi-Fi module

WE865-DUAL and the GE863-PRO3.

4.1.1 Unique supply voltage for WE865-DUAL and GE863-PRO3

In order to get the suitable voltage range valid for both WE865-DUAL and GE863-PRO3 certain balls

need to be connected as described below.

signal ball 3.8V (typ)

F1 √

F2 √

VCC_A

F3 √

E1 √

VDD E2 √

Table 3

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Figure 3

The table below shows the operating and absolute voltage ranges.

VOLTAGE RANGES @ 25 °C

Min [V] Typ [V] Max [V]

Operating range 3.4 3.8 4.2

Table 4

VCC_A

(

)

VCC

(

)

VCC

(

)

3.8 V (typ)

VDD

(

)

VDD

(

)

WE865-DUAL

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4.1.1.1 Current consumption

CURRENT CONSUMPTION @ 3.8V at 25 °C

Operating mode Typ Unit

Continuous Receive 100 mA

Continuous Transmit (maximum output power) 180 mA

Stand-by (receive beacons every 100 ms) 5 mA

Deep Sleep 3 mA

Shut-down mode <1 mA

Table 5

NOTE: continuous receive and transmit mode measures were taken at channel 6.

4.1.1.2 Shut-down mode

In order to minimize the current consumption it is possible to completely shut-down the WE865-DUAL.

That is achieved by acting on the relevant signal outside the module, which directly acts on the power

device enable/Shut-down signals.

The shut-down is achievable by driving low both the EN_B* (ball D1) and EN_A* (ball B1) signals, to

be connected together.

As EN_B* (ball D1) and EN_A* (ball B1) are internally connected to pull-up, do not drive these signals

during normal operation.

LOGIC CONFIGURATION

signal ball Shut-down mode Operating mode

EN_A* B1 to be driven low internally pulled-up 2

EN_B* D1 to be driven low internally pulled-up 1

Table 6

2 If the shut-down mode is not used, no external connection is needed.

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VOLTAGE LEVELS @ 25 °C

VIL

SIGNAL Min [V] Max [V]

EN_A*, EN_B* 0 0.20

Table 7

Figure 4

4.2 Power supply design guidelines

The power supply circuitry is a very important part in the full product design and it strongly affects the

product overall performances, hence read carefully the requirements and the guidelines that will follow

for a proper design.

The table below shows the WE865-DUAL operating voltage range:

VOLTAGE RANGE

Nominal Supply Voltage 3.8V

Minimum Supply Voltage 3.4V

Max Supply Voltage 4.2V

Table 8

The electrical design of the power supply strongly depends on the power source the current is drained

from. Please refer to electrical design guidelines in the GE863-PRO3 Hardware User Guide for further

information.

WE865-DUAL

EN_B*

EN_A*

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4.2.1 +5V input source

A linear regulator can be used to generate the 3.8V output voltage. When using a linear regulator, a

proper heat sink shall be provided in order to dissipate the generated power. A protection diode should

be inserted close to the power input, in order to save the WE865-DUAL from power polarity inversion.

This can be the same diode as for spike protection.

The figure below shows a possible solution for the switching power supply. It must be taken into

account that the power supply performance strongly depends on the layout design.

Figure 5

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4.2.2 +12V input source

Due to the big difference between the input source and the desired output voltage, a linear voltage

regulator is not suited and not recommended. A switching power supply will be preferable because of

its better efficiency especially in presence of peak current load.

When using a switching regulator, 500 kHz switching frequency (or more) is preferable because of its

smaller inductor size and its faster transient response. This allows the regulator to respond quickly to

any current peak absorption.

A protection diode should be inserted close to the power input, in order to save the WE865-DUAL from

power polarity inversion. This can be the same diode as for spike protection.

The figure below shows a possible solution for the switching power supply. It must be taken into

consideration that the switching power supply performances strongly depend on the layout design.

WE865-DUAL HW User Guide

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Figure 6

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4.2.3 Battery source

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V,

thus a single 3.7V Li-Ion cell battery type is suited for supplying the power to the WE865-DUAL

module.

Please refer to GE863-PRO3 electrical design guidelines for further information regarding type

and battery usage.

A protection diode should be inserted close to the power input, in order to save the WE865-DUAL from

power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity

inversions when connecting the battery.

When integrating the GE863-PRO3 with the WE865-DUAL modules together in the user application,

take into account that battery charger control circuitry is embedded inside the GE863-PRO3 (please

refer to GE863-PRO3 Hardware User Guide for more details) and can be used with Li-ION batteries

only. Using other type of batteries, an external charger will be needed.

The battery capacity should be suitable chosen dependently on the customer’s application current

consumption and the battery life requirements. When integrating the GE863-PRO3 with the WE865-

DUAL modules together in the user application, the battery capacity must be at least 800mAh in order

to withstand any current peak (please refer to GE863-PRO3 Hardware User Guide for more details).

4.3 Reset signals

The WE865-DUAL has a power-on-reset (POR) circuit inside, so no specific reset is required in the

initialization phase.

Two signals are available to reset the module:

• an active high host reset (RESET)

• an active low manual reset (MR_RESET*)

In addition to the active high RESET signal issued by the host system (GE863-PRO3), a reset button

can be integrated in the customer application.

Even if it is not mandatory to drive the available reset lines in the module, it is recommended to

employ those signals to prevent critical situations.

When resetting during normal operation, after the release of the reset the module is unconditionally

shut down, without doing any detach operation from the network where it is associated.

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4.3.1 Reset

An active high host reset (RESET, ball D2), allowing the WE865-DUAL to be reset by an external

device (host).

This pin is internally pulled-down, do not drive the signal during normal operation.

The signal must be asserted for a period greater than 1ms.

VOLTAGE LEVELS @ 25 °C

Min [V] Max [V] Remark

VIH 2,0 3,0 -

Table 9

Figure 7

WE865-DUAL

RESET

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4.3.2 Manual reset

An active low manual reset (MR_RESET*, ball C1), see the table below for the allowed voltage levels.

As the pin is internally pulled-up, do not drive the signal during normal operation.

The signal must be asserted for a period greater than 1ms.

VOLTAGE LEVELS @ 25 °C

Min [V] Max [V] Remark

VIL -0,3 0,825

Table 10

Figure 8

WE865-DUAL

MR_RESET*

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4.4 SDIO signals

A 4-data bit SDIO interface is available on the WE865-DUAL that must be connected to the host

processor (Telit GE863-PRO3).

WE865-DUAL SDIO voltage levels are fully compatible with the GE863-PRO3 I/O voltage levels.

47 Ohm series resistor on each SDIO line and 12pF capacitor on clock line must be inserted in order

to avoid noise (see Electrical design guidelines chapter). Refer to §8.2.

Voltage levels for all the SDIO pins are reported in the table:

VOLTAGE LEVELS @ 25 °C

Min [V] Max [V] Remark

VIL -0,3 0,825

VIH 2,0625 3,6

VOL 0 0,125 I = 4mA

VOH 2,475 3,3 I = 4mA

Table 11

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5 Thermal design guidelines

The thermal design for the power supply heat sink should be done taking into account the current

consumption involved in the appropriate power supply configuration. Please refer to §4.1.1.1 for

detailed information on the current consumption.

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6 PCB layout design guidelines

In case of implementing the input power supply circuitry as described in the previous §4.2.2, the PCB

traces connecting the switching output to the inductor and the switching diode must be as short as

possible. It is recommended to place the inductor and the diode very close to the power switching IC.

This is done in order to reduce the radiated field (noise) of the switching frequency (100-500 kHz

usually).

The use of a good common ground plane is generally suggested.

The placement of the power supply on the board should be done in such a way to guarantee that the

high current return paths in the ground plane are not overlapped to any noise sensitive lines.

The power supply input cables should be kept separate from noise sensitive lines.

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7 Antenna

The antenna connection and board layout design are the most important part in the full product design

and they strongly reflect on the product overall performances, hence read carefully and follow the

requirements and the guidelines for a proper design.

7.1 Wi-Fi antenna guidelines

General guidelines for an antenna and antenna line on PCB for a Telit WE865-DUAL device

ANTENNA REQUIREMENTS

Frequency range [MHz] 2400-2500

Gain [dBi] ≤ 2

Impedance [Ohm] 50

Maximum Input Power [mW] >100

VSWR recommended ≤2

Table 12

Frequency range indicated in order to support 14 Wi-Fi channels. Smaller ranges are allowed or

requested for application over 11 or 13 channels.

Please refer to IEEE specifications and to the proper regulatory body directives about 802.11

channels and antenna specifications in different countries.

When using the Telit WE865-DUAL, since there's no antenna connector on the module, the antenna

must be connected to the WE865-DUAL through the PCB with the antenna pad.

Please consider that antenna design and choice is dependent on the specific application.

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This transmission line shall fulfill the following requirements:

ANTENNA LINE ON PCB REQUIREMENTS

Impedance [Ohm] 50

Maximum Attenuation [dB] 0.3

Coupling with other signals is not allowed

Table 13

7.2 Wi-Fi antenna PCB trace guidelines

• Ensure that the antenna line impedance is 50 ohm.

• Keep the antenna line on the PCB as short as possible in order to limit losses.

• Antenna line must have uniform characteristics, constant cross section, avoid meanders

and abrupt curves.

• Keep, if possible, one layer of the PCB used only for the Ground plane.

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid

having other signal tracks facing directly the antenna line track.

• The ground around the antenna line on PCB has to be strictly connected to the Ground

Plane by placing vias once per 2mm at least.

• Place EM noisy devices as far as possible from WE865-DUAL antenna line.

• Keep the antenna line far away from the WE865-DUAL power supply lines.

• If you have EM noisy devices around the PCB hosting the WE865-DUAL, such as fast

switching ICs, take care of the shielding of the antenna line by burying it inside the layers

of PCB and surround it with Ground planes, or shield it with a metal frame cover.

• If you don't have EM noisy devices around the PCB of WE865-DUAL, by using a strip-line

on the superficial copper layer for the antenna line, the line attenuation will be lower than

a buried one.

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7.3 Wi-Fi antenna installation guidelines

• Install the antenna in a place covered by the Wi-Fi signal.

• The antenna must be installed to provide a separation distance of at least 20 cm

from all persons and must not be co-located or operating in conjunction with any

other antenna or transmitter.

• Antenna shall not be installed inside metal cases.

• Antenna shall be installed also according Antenna manufacturer instructions.

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8 Integration with the GE863-PRO3

Figure 9 (Block diagram)

NOTE: It is mandatory to leave available the TEST lines in the customer design:

• TEST_1

• TEST_2

• TEST_3

• TEST_4

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8.1 Power supply

When integrating the WE865-DUAL with the Telit GE863-PRO3 module, as described in previous

chapters a 3.8V (typ) voltage must be provided to the WE865-DUAL.

The WE865-DUAL power enable signals (EN_A* and EN_B*) must be connected together and be

driven by the GE863-PRO3 GPIO PC29 (ball F5) through a N-channel MOSFET.

In the GE863-PRO3 the power supply inputs of the GSM engine and the ARM processor part have

been kept separate, VBATT is the input for the GSM part, VBATT2 is the input for ARM.

It is possible to connect together the two power inputs since they have compatible ranges, but if it is

desired the two power supplies can be kept separate.

If keeping separated VBATT and VBATT2 is the chosen solution, the WE865-DUAL 3.8V power balls

(VCC_A) should be connected to the same voltage source feeding VBATT2.

Figure 10

WE865-DUAL

EN_B*

EN_A*

GE863-PRO3

PC29

3V8 (typ) 3V8 (typ)

VBATT VBATT2

3V8 (typ) 3V8 (typ)

GND GND

VCC_A VDD

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8.2 SDIO signals

A 4-data bit SDIO interface is available on the WE865-DUAL that must be connected to the host

processor (Telit GE863-PRO3).

The WE865-DUAL SDIO voltage levels are fully compatible with the GE863-PRO3 I/O voltage levels.

47 Ohm series resistor on each SDIO line and 12pF capacitor on clock line must be inserted in order

to avoid noise (see Electrical design guidelines chapter). Refer to block diagram in Figure 7.

Figure 11

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9 WE865-DUAL - Evaluation kit

The WE865-DUAL can be provided with an evaluation/testing kit.

The kit consists of:

• EVK-PRO3 evaluation kit for GE863-PRO3 module

(EVK-PRO3 main board + GE863-PRO3 interface board)

• WE865-DUAL interface board

In such a case, the WE865-DUAL module is directly soldered on its interface board. The figure below

shows how the boards must be assembled in order to allow the system working.

Figure 12

All the boards are connected each other via 40-pins connectors.

The core of the evaluation system is the EVK-PRO3 EVALUATION KIT, which can be split into several

functional blocks depending on the implemented function. Refer to the “EVK-PRO3 User Guide” for

additional information on the EVK-PRO3 description and usage.

EVK-PRO3 main board

GE863-PRO3 interface board

WE865-DUAL interface board

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Figure 13

WE865-DUAL

interface board

WE865-DUAL

EVK-PRO3

GE863-PRO3

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Figure 14

EVK-PRO3

WE865-DUAL

interface board

WE865-DUAL

GE863-PRO3

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

9.1 WE865-DUAL Interface board

9.1.1 Mechanical description

Figure 15

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

9.1.2 Main components

Main components TOP side list:

WE865-DUAL module

PL101: 2 pin jumper

PL102: 2 pin jumper

SW101: Reset button – Push to drive MR_RESET* low)

SO104: RF connector (alternative to AT101)

PL103: 5 pin header - SPI for test

Figure 16

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Main components BOTTOM side list:

SO101: Interface connector

SO102: Interface connector

SO103: Interface connector

Figure 17

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

9.1.3 Jumpers settings

The figure below shows the PL101 and PL102 jumpers on the TOP side in the interface board

Figure 18

PL101 - Short the jumper to drive EN_A* low

PL102 - Short the jumper to drive EN_B* low

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

9.1.4 Pin table

SO101 SO102 SO103 PL103

Pin n. Signal name Signal name Signal name Signal name

1 RESERVED RESERVED RESERVED TEST_1

2 RESERVED RESERVED RESERVED TEST_2

3 RESERVED RESERVED RESERVED TEST_3

4 RESERVED RESERVED RESERVED TEST_4

5 RESERVED RESERVED RESERVED GND

6 RESERVED RESERVED RESERVED -

7 SDIO[0] RESERVED RESERVED -

8 SDIO_CMD RESERVED RESERVED -

9 SDIO_CLK RESERVED RESERVED -

10 SDIO[1] RESERVED RESERVED -

11 SDIO[2] RESERVED RESERVED -

12 SDIO[3] RESERVED RESERVED -

13 RESERVED RESERVED RESERVED -

14 RESERVED RESERVED RESERVED -

15 RESERVED RESERVED RESERVED -

16 RESERVED RESERVED RESERVED -

17 RESERVED RESERVED RESERVED -

18 RESERVED RESERVED RESERVED -

19 RESERVED RESERVED RESERVED -

20 RESERVED RESERVED RESERVED -

21 RESERVED RESERVED RESERVED -

22 RESERVED RESERVED RESERVED -

23 RESERVED RESERVED RESERVED -

24 RESERVED RESERVED RESERVED -

25 RESERVED RESERVED RESERVED -

26 RESERVED RESERVED RESERVED -

27 RESERVED RESERVED RESERVED -

28 RESERVED RESERVED RESERVED -

29 RESERVED RESERVED RESET -

30 RESERVED RESERVED RESERVED -

31 RESERVED RESERVED RESERVED -

32 RESERVED RESERVED RESERVED -

33 RESERVED RESERVED RESERVED -

34 RESERVED RESERVED RESERVED -

35 RESERVED RESERVED RESERVED -

36 VBATT RESERVED RESERVED -

37 RESERVED RESERVED GND -

38 RESERVED RESERVED RESERVED -

39 GND GND GND -

40 GND GND RESERVED -

Table 14

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

10 Mounting the WE865-DUAL on the

application board

The Telit WE865-DUAL module has been designed in order to be compliant with a standard lead-free

SMT process.

10.1 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a

thickness of stencil foil ≥ 120μm.

10.2 PCB pad design

"Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

Figure 19

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Figure 20

Recommendations for PCB pad dimensions

Dimension Value [mm]

Ball pitch 2

Solder resist opening diameter A 1,150

Metal PAD diameter B 1 +/- 0,05

Table 15

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist

Opening”,unless the microvia carry the same signal of the pad itself.

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Figure 21

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish Layer tickness [um] Properties

Electro-less Ni /

Immersion Au

3-7 /

0,05-0,15

good solder ability protection,

high shear force values

Table 16

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.

This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder

paste on the described surface plating is better compared to lead-free solder paste.

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

10.3 Solder paste

Lead free

Solder paste Sn / Ag / Cu

Table 17

10.4 Solder reflow

The following is the recommended solder reflow profile

Figure 22

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

Profile Feature Pb-Free

Assembly

Average ramp-up rate (TL to TP)

3 °C / second

max

Preheat:

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

150 °C

200 °C

60-180

seconds

Tsmax to TL:

- Ramp-up rate

3 °C / second

max

Time maintaned above:

- Temperature (TL)

- Time (tL)

217 °C

60-150

seconds

Peak Temperature (Tp): 245 + 0/-5 °C

Time within 5 °C of actual Peak

Temperature (tp) 10-30 seconds

Ramp-down rate

6 °C/second

max

Time 25 °C to Peak Temperature 8 minutes max

Table 18

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

IMPORTANT: WE865-DUAL module can accept only one reflow process

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

11 Moisture sensitivity

The level of moisture sensibility of Telit WE865-DUAL modules is “3”, according with standard

IPC/JEDEC J-STD-020, take care of all the relative requirements for using this kind of components.

Moreover, the customer has to take care of the following conditions:

• The shelf life of WE865 inside of the dry bag shall be 12 month from the bag seal date, when

stored in a non-condensing atmospheric environment of <40°C / 90% RH

• Environmental condition during the production: ≤ 30°C / 60% RH according to IPC/JEDEC J-

STD-033A paragraph 5

• The maximum time between the opening of the sealed bag and the reflow process shall be 168

• Hours if the condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected

• A baking is required if conditions b) or c) are not respected

• A baking is required if the humidity indicator inside the bag indicates 10% RH or more

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

12 Conformity assessment issues

Assessment of the final product must be made against the Essential requirements of the R&TTE

Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3

requirements.

The WE865-DUAL module is conform with the following European Union Directives:

• R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)

• Low Voltage Directive 73/23/EEC and product safety

• Directive 89/336/EEC for conformity for EMC

In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the WE865-DUAL module is

compliant with the following standards:

• Use of RF Spectrum. Standard: EN 300 328 v1.7.1 (2006-10)

• EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-17

• LVD (Low Voltage Directive) Standards: EN 60 950

The WE865-DUAL module is conform with the following US Directives:

• Use of RF Spectrum. Standards: FCC 47 Part 15

• EMC (Electromagnetic Compatibility). Standards: FCC 47 Part 15

To meet the FCC's RF exposure rules and regulations:

- The system antenna(s) used for this transmitter must be installed to provide a separation

distance of at least 20 cm from all the persons and must not be co-located or operating in

conjunction with any other antenna or transmitter.

- The system antenna(s) used for this module must not exceed 2 dBi for all operating

configurations.

- Users and installers must be provided with antenna installation instructions and transmitter

operating conditions for satisfying RF exposure compliance.

Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify

any regulatory questions and to have their complete product tested and approved for FCC

compliance.

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

13 Safety recommendations

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of

this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc

It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for a correct wiring of the

product. The product has to be supplied with a stabilized voltage source and the wiring has to be

conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic

discharges may damage the product itself.

The system integrator is responsible of the functioning of the final product; therefore, care has to be

taken to the external components of the module, as well as of any project or installation issue,

because the risk of disturbing the external networks or devices or having impact on the security.

Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has

to be installed with care in order to avoid any interference with other electronic devices and has to

guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied,

the system integrator has to assess the final product against the SAR regulation EN 50360.

The European Community provides some Directives for the electronic equipments introduced on the

market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the

applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

WE865-DUAL HW User Guide

1vv0300787 Rev. 1 - 03/10/08

14 Document change log

ISSUE#0 20/08/08 Preliminary Release

ISSUE#1 03/10/08 Updated mechanical dimensions

Updated pin-out and ball grid

Updated power configuration section

Added current consumption

Updated reset section

Updated antenna section

Updated integration section with GE863-PRO3

Updated evaluation kit section

Added conformity assessment issues section

Added safety recommendations section

Telit Communications S p A WE865D Wi-Fi 802.11 b/g Module User Manual Gxzzz Product Description

Telit Communications S.p.A. Wi-Fi 802.11 b/g Module Gxzzz Product Description

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