Wistron NeWeb UWMWBT-CWM01 MOD-SM WNC BLUETOOTH/WLAN CWM-01 User Manual WBT Manual for FCC 20111227

Download:
Mirror Download [FCC.gov]
Document ID	1610650
Application ID	WR46uw/opbjw+nwZDj7+pA==
Document Description	User Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	90.67kB (1133385 bits)
Date Submitted	2011-12-28 00:00:00
Date Available	2011-12-28 00:00:00
Creation Date	2017-11-02 14:04:51
Producing Software	GPL Ghostscript 9.18
Document Lastmod	2017-11-02 14:04:51
Document Title	Microsoft Word - WBT_Manual-for FCC_20111227.doc
Document Creator	PScript5.dll Version 5.2.2
Document Author:	VeraHsu

WLAN/BT System Integration Manual
WLAN/BT
System Integration Manual
Model Name:
UMW‐WBT,
CWM‐01
Project Code:
Base Model:
Issue Date:
2011/05/05
Rev Date:
2011/12/27
Rev:2
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
1 / 30
WLAN/BT System Integration Manual
Revision History
Rev.
History
- Initial version
Date
2011/05/05
1. Frequency range is changed to 2400‐2483.5Mhz
2. FCC channels revised to be ch1 – ch11
3. Power value is revised:
WIFI: 15+/‐1.5dBm
BT: class 1
2011/12/27
Author
Shukai Hsu
HT Liao
Hauson Chen
Chris WJ Huang
Shukai
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
2 / 30
WLAN/BT System Integration Manual
TABLE OF CONTENTS
1.
INTRODUCTION ................................................................................................................................................................4
1.1 Product Overview.............................................................................................................................................................4
1.3 Standard Bluetooth Profiles..............................................................................................................................................6
1.4 Temperature Parameter.....................................................................................................................................................6
1.5 Module Pin Out ................................................................................................................................................................7
1.6 Power management ..........................................................................................................................................................9
1.7 RF connection ................................................................................................................................................................10
2.
INTERFACES ....................................................................................................................................................................11
2.1 SDIO Interface ...............................................................................................................................................................11
2.2 UART Interface ..............................................................................................................................................................12
2.2.1 Signal Behavior ....................................................................................................................................................12
2.3 Digital Audio Interface ...................................................................................................................................................13
2.4 RESET#..........................................................................................................................................................................14
2.5 SLEEP_CLK ..................................................................................................................................................................14
2.6 Joint Test Action Group (JTAG) and Test Interface........................................................................................................14
JTAG Interface Signal Description .................................................................................................................................14
2.7 Antenna Diagnosis..........................................................................................................................................................15
Handling Requirements ................................................................................................................................................24
Moisture preconditioning.............................................................................................................................................24
4.2 Soldering Requirements .................................................................................................................................................24
4.2.1 Soldering Iron Soldering ......................................................................................................................................24
4.2.2 Reflow Profile ......................................................................................................................................................24
4.2.3 Soldering Paste ....................................................................................................................................................25
4.2.4 PCB Layout Footprint Design .............................................................................................................................26
5 PRODUCT TESTING.............................................................................................................................................................28
5.1 Production test................................................................................................................................................................28
FOR PRODUCT AVAILABLE IN THE USA/CANADA MARKET, ONLY CHANNEL 1~11 CAN BE OPERATED. SELECTION OF OTHER
CHANNELS IS NOT POSSIBLE........................................................................................................................................................29
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
3 / 30
WLAN/BT System Integration Manual
1.
Introduction
This document specifies the mechanical and electrical specifications for the 802.11b/g WiFi and
Bluetooth 3.0 module. Continuing a tradition of design ingenuity and development, Wistron NeWeb
Corporation (WNC) presents a standard modular solution for WiFi and Bluetooth technology to comply
with OEM industrial requirements in vehicles. The module provides 802.11 b/g WLAN and Bluetooth 3.0
functions by using a single chipset solution. Utilizing the module, radio manufacturers are enabled to
create feature rich ready design without the additional burden to redesign the WiFi and Bluetooth
functions.
For the remainder of the document, the host design that shall integrate the module shall be
referred to as the application. The application shall be the controlling host entity with respect to the
module.
This document also provides hardware design instruction and production setup information.
1.1 Product Overview
This document specifies the 802.11b/g + Bluetooth Module. The specification covers overall
dimensions, general module construction, connector interface footprints, and mechanical and electrical
characteristics of the WNC’s 802.11b/g + Bluetooth module. This module was built by using Marvell’s
88W8688 chipset.
Host Interface:
WLAN: SDIO
Bluetooth: SDIO/high speed UART
802.11b/g :
Frequency band:
 B Mode: 2.400~2.4835 GHz
 G Mode: 2.400~2.4835 GHz
Channel Spacing:
B / G Mode: 5MHz
Modulation:
 B Mode: DSSS with DBPSK, DQPSK, and CCK
 G Mode: OFDM with BPSK, QPSK, QAM, and 16/64QAM
Channels Support:
 B Mode:
CH1 – CH13 (ETSI)/CH1‐CH11 (FCC)/CH1‐CH14 (Japan)
 G Mode:
CH1 – CH13 (ETSI)/CH1‐CH11 (FCC)/CH1‐CH14 (Japan)
RF output Power:
 B Mode: 16.30 dBm @ 1,2, 5.5, and 11Mbps
 G Mode: 23.55 dBm @ 6, 9, 12, 18, 24, 36,48 and 54Mbps
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
4 / 30
WLAN/BT System Integration Manual
Sensitivity:
 B Mode: –88dBm at 1Mbps
–87dBm at 2Mbps
–84dBm at 5.5Mbps
–80dBm at 11Mbps
 G Mode: –82dBm at 6Mbps
–81dBm at 9Mbps
–79dBm at 12Mbps
–77dBm at 18Mbps
–74dBm at 24Mbps
–70dBm at 36Mbps
–66dBm at 48Mbps
–65dBm at 54Mbps
Media Access Protocol: CSMA/CA
802.11b data rates of 1, 2, 5.5 and 11 Mbps
802.11g data rates of 6, 9, 12, 18, 24, 36, 48, and 54 Mbps for multimedia content transmission
802.11e Quality of service (QoS)
802.11h transmit power control
802.11j channels (Japan)
802.11s mesh networking
Encryption:
 AEC‐CCMP
 WPA encryption
 WEP 64‐ and 128‐bit encryption with hardware TKIP processing
 IPSEC security acceleration in hardware
Bluetooth
Fully compliant with Bluetooth 2.1+EDR, 3.0
Carrier frequency: 2400MHz to 2483.5MHz (79 channels)
RF Output Power: 6.35dBm Class 1
Rx Sensitivity
‐82.4 dBm (typ.) for GFSK @ BER = 0.1%,1Mpbs
‐89.8 dBm (typ.) for π/4‐DQPSK @ BER = 0.1%,2Mpbs
‐89.8 dBm (typ.) for 8‐DPSK @ BER = 0.1%,3Mpbs
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
5 / 30
WLAN/BT System Integration Manual
1.3 Standard Bluetooth Profiles
The standard Bluetooth profile is as Table 1‐2. Additional profiles other than lists are supported by 3’rd
party.
Operating System
Bluetooth Profile
GAP
SDP
GOEP
A2DP
Linux‐BlueZ
HID
HSP
PAN
OPP
SPP
SDP
Windows Mobile
A2DP
HID
HSP
Table 1‐1 Standard Bluetooth Profiles
1.4 Temperature Parameter
Operating temperature range:
 Low ambient temperature: ‐40ºC
 High case temperature: +85ºC
Storage temperature range:
 Low temperature: ‐40ºC
 High temperature: +85ºC
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
6 / 30
WLAN/BT System Integration Manual
1.5 Module Pin Out
45
UART_CTS
40
35
30
GND
VCC_3V0
GND
GND
VCC_3V3
VCC_3V3
VCC_1V8
GND
SD_CLK
SD_CMD
SD_DATA[1]
SD_DATA[0]
SD_DATA[3]
SD_DATA[2]
GND
UART_RTS
UART_RX
UART_TX
The module is designed as 54 pin solder joint module for SMT process. The pin‐out is illustrated in the
figure 1‐2.
28
46
27
VCC_VIO_X1
SLEEP_CLK
ANT_SEL _P
25
JTAG_TMS_CPU
NC
GND
VCC_3V3
50
VCC_3V3
ANT_SEL_N
GND
RESETn
GND
VCC_BT _ANT_DIAG
54
VCC_WLAN_ANT_DIAG
19
WLAN_ANT_DIAG
GND
WLAN_RF
GND
JTAG_TMS_SYS
JTAG_TRSTn
JTAG_TDO
JTAG_TDI
20
18
15
JTAG_TCK
GND
VCC_VIO_X2
GND
BT_PCM_SYNC
10
BT_PCM_DO UT
BT_PCM_DIN
GND
BT_RF
GND
BT_PCM_CLK
BT _ANT_DIAG
GND
Figure 1‐2 Pin out of 802.11b/g + Bluetooth module
The pin definition is shown in the following table 1‐2.
Pin #
Signal Name
36
37
39
38
41
40
SD_CLK
SD_CMD
SD_DAT_0
SD_DAT_1
SD_DAT_2
SD_DAT_3
45
44
46
43
TXD
RXD
CTS
RTS
I/O
Signal Description
SDIO Interface
I/O SDIO clock
I/O SDIO command line
I/O SDIO data line bit 0
I/O SDIO data line bit 1
I/O SDIO data line bit 2
I/O SDIO data line bit 3
UART Interface
O UART serial data output
UART serial data input
UART Clear to send signal
O UART Ready to send signal
WLAN and Bluetooth RF Interface
Signal Characteristics
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
7 / 30
WLAN/BT System Integration Manual
17
WLAN_RF
BT_RF
BT_PCM_CLK/I2S_BCLK
BT_PCM_SYNC/I2S_LRCL
BT_PCM_DIN/I2S_DIN
I/O WLAN antenna in/out
I/O Bluetooth antenna in/out
Audio Interface – PCM/I2S
I/O PCM clock / I2S audio bit
clock
I/O PCM sync pulse / I2S
left/right clock
PCM data input / I2S data
input (for recording)
O PCM data output / I2S
data output (for playback)
Control & Power Interface
Reset signal
Active low
Sleep clock
Coexistence
O Differential Antenna Select
Positive output
JTAG Test Mode Select
(Selects the internal CPU
JTAG controller)
BT_PCM_DOUT/I2S_DO
UT
52
47
RESET#
SLEEP_CLK
48
ANT_SEL_P
49
JTAG_TMS_CPU
50
51
NC
ANT_SEL_P
VCC_3V0
PO
53
54
20
19
11
12
13
14
15
23,
24,
32,
33,
29
Differential Antenna Select
Negative output
Antenna Diagnosis
VCC_BT_ANT_DIAG
External power for BT
antenna
diagnosis
BT_ANT_DIAG
BT antenna diagnosis
output
VCC_WLAN_ANT_DIAG
External power for WLAN
antenna diagnosis
WLAN_ANT_DIAG
WLAN antenna diagnosis
output
Joint Test Action Group (JTAG) and Test Interface
JTAG_TCK
JTAG Tset Clock
JTAG_TDI
JTAG Tset Data Input
JTAG_TDO
O JTAG Test Data Output
JTAG_TRSTn
JTAG Test Reset
Active low
JTAG_TMS_SYS
JTAG Test Mode Select
(Selects the System JTAG
controller)
Power & Ground
VCC_3V3
PI 3.3V power input
3.3V +/‐ 1.5V is required.
3.0V monitoring output
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
8 / 30
WLAN/BT System Integration Manual
34
26
VCC_1V8
VCC_VIO_X1
PO
PI
VCC_VIO_X2
PI
GND
1, 3,
8,
10,
16,
18,
21,
22,
25,
27,
28,
30,
31,
35,
42
1.8V monitoring output
1.8/3.3V Host Interface
Supply
3.3V Digital Interface
supply
Ground
For SDIO, UART interface
For PCM interface
Table 1‐2 Pin Out Definition
1.6 Power management
Module supply (VCC_3V3)
802.11b/g + Bluetooth modules must be supplied through VCC_3V3 pin by a DC power supply. Voltages
must be stable, due to the surging consumption profile of the WiFi/BT system.
Name
VCC_3V3
Description
Module Supply
VCC_IO_X1,
VCC_IO_X2
I/O Supply
GND
Ground
Remarks
Clean and stable supply is required: low ripple and low
voltage drop must be guaranteed. Voltage provided has to
be always above the minimum limit of the operating range.
Consider that there are large current spike in WIFI or BT
connected mode.
Clean and stable supply is required: low ripple and low
voltage drop must be guaranteed. Voltage provided has to
be always above the minimum limit of the operating range.
GND pins are internally connected but good (low
impedance) external ground can improve RF
performances. All GND pins must be externally connected
to ground.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
9 / 30
WLAN/BT System Integration Manual
Operating condition
Symbol
Parameter
VCC_3V3
Module power supply
VIO_X1
Host interface digital I/O
power supply
VIO_X2
Digital I/O power supply
VCC_3V0
1.8V internal voltage supply
VCC_1V8
1.8V internal voltage supply
TA
Ambient operating temperature
TJ
Maximum junction temperature
Condition
Min
2.97
1.62
2.97
2.97
2.9
1.7
‐40
Typ
3.3
1.8
3.3
3.3
3.0
1.8
Max
3.63
1.98
3.63
3.63
3.1
1.9
85
125
Units
℃
℃
1.7 RF connection
The RF pin has 50 Ω nominal impedance and must be connected to the antenna through a 50 Ω
transmission line to allow transmission and reception of radio frequency (RF) signals in the WIFI and BT
operating bands.
Name
WLAN_RF
BT_RF
Description
WLAN antenna in/out
Bluetooth antenna in/out
Remarks
50 nominal impedance.
50 nominal impedance.
RF port ESD rating is +/‐8kV (contact discharge). A higher protection level could be required if the line is
externally accessible on the application board. Note that antenna detection functionality will be not
provided implementing for ESD protection on the ANT port.
Choose an antenna with optimal radiating characteristics for the best electrical performance and overall
module functionality. An internal antenna, integrated on the application board, or an external antenna,
connected to the application board through a proper 50 Ω connector, can be used.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
10 / 30
WLAN/BT System Integration Manual
2.
Interfaces
This chapter describes the interfaces on the WLAN/BT modules: SDIO, UART, PCM, JTAG, Antenna
diagnosis.
2.1 SDIO Interface
The module supports a SDIO device interface that conforms to the industry standard SDIO full speed
card specification and allows a host controller using the SDIO bus protocol to access the WLAN
and/or Bluetooth device. This device also supports high speed mode as defined in SDIO 1.2
specification.
The SDIO interface supports dual function operations, for WLAN and Bluetooth. Dual functionality
allows the use of independent client drivers for WALN and/or Bluetooth on the host platform. Since
these functions share the same physical interface, an arbitration scheme is required in the SDIO bus
driver on the host platform.
The SDIO interface supports SPI, 1‐bit SDIO, 4‐bit SDIO transfer modes at the full clock range of 0 to
50MHz.
2.1.1 SDIO Interface Signal Description
Pin Name
SD_CLK
Signal Name
CLK
Type
I/O
Description
SDIO 4‐bit mode: Clock
SDIO 1‐bit mode: Clock
SDIO SPI mode: Clock
SD_CMD
CMD
I/O
SDIO 4‐bit mode: Command/Response
SDIO 1‐bit mode: Command line
SDIO SPI mode: Data in
SD_DAT_0
DAT0
I/O
SDIO 4‐bit mode: Data line bit [0]
SDIO 1‐bit mode: Data line
SDIO SPI mode: Data out
SD_DAT_1
DAT1
I/O
SDIO 4‐bit mode: Data line bit [1]
SDIO 1‐bit mode: Interrupt
SDIO SPI mode: Interrupt
SD_DAT_2
DAT2
I/O
SDIO 4‐bit mode: Data line bit [2]
SDIO 1‐bit mode: Read Wait (optional)
SDIO SPI mode: Reserved
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
11 / 30
WLAN/BT System Integration Manual
SD_DAT_3
DAT3
I/O
SDIO 4‐bit mode: Data line bit [3]
SDIO 1‐bit mode: Not used
SDIO SPI mode: Chip select (Negative true)
2.1.2 SDIO Connection/Function
Figure 1.1 SDIO Physical Connection – 4 bit mode
Note: In 4‐bit SDIO mode, data is transferred on all 4 data pins (DAT [3:0]), and the interrupt pin is not
available for exclusive use as it is utilized as a data transfer line. Thus, if the interrupt function is required,
a special timing is required to provide interrupts. The 4‐bit SDIO mode provides the highest data transfer
possible, up to 100 Mbps.
2.2 UART Interface
The module supports a high speed UART interface, compliant to the industry standard 16550
specification. High speed baud rates are supported to provide the physical transport between the
device and the host for exchanging Bluetooth data.
2.2.1 Signal Behavior
TXD
Serial data output to the peripheral device.
RXD
Serial data input from to peripheral device.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
12 / 30
WLAN/BT System Integration Manual
CTS
Clear‐to‐Send input from the peripheral device.
RTS
Request‐to‐Send output to the peripheral device.
2.3 Digital Audio Interface
Digital audio interfaces include PCM for voice application and I2S for digital stereo applications. PCM
and I2S interface share the same pins.
Voice interface supports.
Hardware support for continual transmission and reception of PCM data without processor
overhead.
Standard PCM clock rates from 64KHz to 2.048MHz with multi‐slot handshake and synchronization.
PCM encoding/decoding support of A‐law, μ‐law, and linear voice.
Stereo audio interface supports.
Standard record and playback for I2S, left‐justified, and right‐justified serial interfaces.
Playback in IEC60958 Compatible Audio Codec Interface.
Master and slave mode for I2S, MSB, and LSB audio interfaces.
Slave mode with option to use asynchronous internal CLK.
Slave mode with optional slower synchronous CLK input from host to save power.
2.3.1 BT_PCM_SYNC/I2S_LRCLK
PCM mode: BT_PCM_SYNC, input/output (output if PCM initiator, input if PCM target)
Stereo audio mode: I2S_LRCLK
Master mode: output
Slave mode: input
2.3.2 BT_PCM_CLK/I2S_BCLK
PCM mode: BT_PCM_CLK, input/output (output if PCM initiator, input if PCM target)
Stereo audio mode: I2S_BCLK
Master mode: output
Slave mode: input
2.3.3 BT_PCM_DOUT/I2S_DOUT
PCM mode: BT_PCM_DOUT, output
Stereo audio mode: I2S _DOUT, output
2.3.4 BT_PCM_DIN/I2S_DIN
PCM mode: BT_PCM_DIN, input
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
13 / 30
WLAN/BT System Integration Manual
Stereo audio mode: I2S_DIN, input
2.4 RESET#
Reset signal, active low. The module is reset and the module begins the boot sequence when RESET#
input pin transitions from low to high.
2.5 SLEEP_CLK
SLEEP_CLK, clock input for external sleep clock. The sleep clock is used by the PMU during power
save modes.
2.6 Joint Test Action Group (JTAG) and Test Interface
JTAG is reserved for SW debug and failure analysis.
JTAG Interface Signal Description
Pin Name
TCK
Type
Description
JTAG Test Clock Input
TDI
JTAG Test Data Input
TDO
JTAG Test Data Output
TRSTn
I/O
JTAG Test Reset (active low)
TMS_CPU
JTAG Test Mode Select
Selects the internal CPU JTAG controller
TMS_SYS
JTAG Test Mode Select
Selects the System JTAG controller
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
14 / 30
WLAN/BT System Integration Manual
2.7 Antenna Diagnosis
If an external antenna equipped a 50Kohm from its RF cable core to GND, then this antenna
diagnosis can check whether the antenna is plugged well or not.
2.7.1 VCC_BT_ANT_DIAG and BT_ANT_DIAG
If an external antenna equipped a 50Kohm from its RF cable core to GND and a voltage V1 is applied
to VCC_BT_ANT_DIAG, then BT_ANT_DIAG can be read as V1/2 if the connection of antenna and module
is good.
2.7.2 VCC_WLAN_ANT_DIAG and WLAN_ANT_DIAG
If an external antenna equipped a 50Kohm from its RF cable core to GND and a voltage V2 is applied
to VCC_WLAN_ANT_DIAG, then WLAN_ANT_DIAG can be read as V2/2 if the connection of antenna and
module is good.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
15 / 30
WLAN/BT System Integration Manual
3. Design‐In
3.1 Design‐in checklist
This section provides a design‐in checklist.
3.1.1 Schematic checklist
The following are the most important points for a simple schematic check:
□ DC supply must provide a nominal voltage (3.3V) at VCC_3V3 pins above the minimum normal
operating range limit.
□ DC supply must provide a nominal voltage (3.3V) at VCC_VIO_X2 pins above the minimum normal
operating range limit.
□ DC supply must provide a nominal voltage (3.3V or 1.8V) at VCC_VIO_X1 pins above the minimum
normal operating range limit.
□ DC supply must be capable to provide 0.5A current bursts with maximum 200 mV voltage drop at
VCC_3V3 pins.
□ DC supply must be capable to provide 0.1A current bursts with maximum 200 mV voltage drop at
VCC_VIO_X2 pins.
□ DC supply must be capable to provide 0.1A current bursts with maximum 100 mV voltage drop at
VCC_VIO_X1 pins.
□ VCC_3V3 supply should be clean, with very low ripple/noise (less than 200mVpp): suggested passive
filtering parts can be inserted.
□ VCC_VIO_X1 supply should be clean, with very low ripple/noise (less than 100mVpp): suggested
passive filtering parts can be inserted.
□ VCC_VIO_X2 supply should be clean, with very low ripple/noise (less than 200mVpp): suggested
passive filtering parts can be inserted.
□ Connect only one DC supply to VCC_3V3: different DC supply systems are mutually exclusive.
□ Check that voltage level of any connected pin does not exceed the relative operating range.
□ Check UART signals direction.
□ Check the digital audio interface specifications to connect a proper device.
□ To avoid an increase of module current consumption in power down mode, any external signals
connected to the module digital pins (UART, PCM, SDIO interface) must be set low or tri‐stated when
the module is in power down mode.
□ Any external signal connected to the digital audio interface must be tri‐stated when the module is in
power down mode and must be tri‐stated during the module power‐on sequence (at least for 1500
ms after the start‐up event).
□ Provide proper precautions for ESD immunity as required on the application board.
□ All the not used pins can be left floating on the application board.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
16 / 30
WLAN/BT System Integration Manual
3.1.2 Layout checklist
The following are the most important points for a simple layout check:
□ Check 50 Ω impedance of ANT line (WLAN_RF, BT_RF).
□ Follow the recommendations of the antenna producer for correct antenna installation and
deployment.
□ Ensure no coupling occurs with other noisy or sensitive signals.
□ VCC line (VCC_3V3, VCC_VIO_X1, VCC_VIO_X2)should be wide and short.
□ Route VCC supply line away from sensitive analog signals.
□ Ensure proper grounding.
□ Optimize placement for minimum length of RF line and closer path from DC source for VCC.
3.2 Design Guidelines for Layout
The following design guidelines must be met for optimal integration of WLAN+BT modules on the final
application board.
45
UART_CTS
40
35
30
Legend :
Very Important
Careful Layout
Common Practice
GND
VCC_3V0
GND
GND
VCC_3V3
VCC_3V3
VCC_1V8
GND
SD_CLK
SD_CMD
SD_DATA[1]
SD_DATA[0]
SD_DATA[3]
SD_DATA[2]
GND
UART_RTS
UART_RX
UART_TX
3.2.1 Layout guidelines per pin function
This section groups the module pins by signal function and provides a ranking of importance in
layout design.
28
46
27
SLEEP_CLK
VCC_VIO_X1
25
ANT_SEL _P
JTAG_TMS_CPU
NC
GND
VCC_3V3
50
VCC_3V3
GND
ANT_SEL_N
RESETn
GND
VCC_BT _ANT_DIAG
54
20
VCC_WLAN_ANT_DIAG
19
WLAN_ANT_DIAG
GND
WLAN_RF
18
GND
JTAG _TMS_SYS
JTAG_TRSTn
JTAG_TDO
JTAG_TDI
15
JTAG_TCK
GND
VCC_VIO_X2
GND
BT_PCM_SYNC
BT_PCM_DIN
GND
BT_RF
GND
10
BT_PCM_DOUT
BT_PCM_CLK
BT _ANT_DIAG
GND
Figure 3‐1: Module pin‐out with highlighted functions
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
17 / 30
WLAN/BT System Integration Manual
Rank
1st
Function
RF in/out
2nd DC Supply
3rd
Ground
Pin(s)
BT_RF
WLAN_RF
VCC_3V3
VCC_VIO_X1
VCC_VIO_X2
GND
Layout
Very
Important
Very
Important
Remarks
Design for 50 ohm characteristic
impedance
VCC lines should be short and wide.
Route away from sensitive analog
signals.
Careful
Layout
provide proper grounding.
Common
Practice
Follow common practice rules for
digital pin routing.
Digital Pins:
SDIO
SD_CLK, SD_CMD,
interface
SD_DAT_0, SD_DAT_1,
SD_DAT_2, SD_DAT_3
4th
UART
TXD, RXD, CTS, RTS
Digital
Audio
BT_PCM_DIN,
BT_PCM_SYNC,
BT_PCM_CLK,
BT_PCM_DOUT
RESET
RESET#
Sleep Clock SLEEP_CLK
Antenna
Detection
VCC_BT_ANT_DIAG,
BT_ANT_DIAG,
VCC_WLAN_ANT_DIAG,
WLAN_ANT_DIAG
Antenna
Select
JTAG
ANT_SEL_P, ANT_SEL_N
JTAG_TCK, JTAG_TDI,
JTAG_TDO,
JTAG_TRSTn,
JTAG_TMS_SYS,
JTAG_TMS_CPU
Table 3‐1: Pin list in order of decreasing importance for layout design
3.2.1.1 RF I/O connection
The RF antenna connection pin BT_RF & WLAN_RF are very critical in layout design. The PCB line
must be designed to provide 50 Ω characteristic impedance and minimum loss up to radiating element.
 Provide proper transition between the BT_RF & WLAN_RF pads to application board PCB.
 Increase GND keep‐out (i.e. clearance) for BT_RF & WLAN_RF pins to at least 250 μm up to
adjacent pads metal definition and up to 250 μm on the area below the Data Module, as described
in Figure XXX.
 The transmission line up to antenna connector or pad may be a micro strip or a stripline. In any
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
18 / 30
WLAN/BT System Integration Manual













case must be designed to achieve 50 Ω characteristic impedance.
Microstrip lines are usually easier to implement and the reduced number of layer transitions up to
antenna connector simplifies the design and diminishes reflection losses. However, the
electromagnetic field extends to the free air interface above the stripline and may interact with
other circuitry.
Buried stripline exhibits better shielding to incoming and generated interferences. Therefore are
preferred for sensitive application. In case a stripline is implemented, carefully check that the via
pad‐stack does not couple with other signals on the crossed and adjacent layers.
Minimize the transmission line length; the insertion loss should be minimized as much as possible,
in the order of a few tenths of a dB.
The transmission line should not have abrupt change to thickness and spacing to GND, but must be
uniform and routed as smoothly as possible.
The transmission line must be routed in a section of the PCB where minimal interference from
noise sources can be expected.
Route ANT line far from other sensitive circuits as it is a source of electromagnetic interference.
Avoid coupling with VCC routing and analog audio lines.
Ensure solid metal connection of the adjacent metal layer on the PCB stack‐up to main ground
layer.
Add GND vias around transmission line.
Ensure no other signals are routed parallel to transmission line, or that other signals cross on
adjacent metal layer If the distance between the transmission line and the adjacent GND area (on
the same layer) does not exceed 5 times the trace width of the micro strip, use the “Coplanar
Waveguide” model for 50 Ω characteristic impedance calculation.
Don’t route microstrip line below discrete component or other mechanics placed on top layer.
When terminating transmission line on antenna connector (or antenna pad) it is very important to
strictly follow the connector manufacturer’s recommended layout.
GND layer under RF connectors and close to buried vias should be cut out in order to remove stray
capacitance and thus keep the RF line 50 Ω. In most cases the large active pad of the integrated
antenna or antenna connector needs to have a GND keep‐out (i.e. clearance) at least on first inner
layer to reduce parasitic capacitance to ground. Note that the layout recommendation is not
always available from connector manufacturer: e.g. the classical SMA Pin‐Through‐Hole needs to
have GND cleared on all the layers around the central pin up to annular pads of the four GND posts.
Check 50 Ω impedance of ANT line.
3.2.1.2 Main DC supply connection
The DC supply of WLAN/BT modules is very important for the overall performance and functionality
of the integrated product.
 VCC connection may carry a maximum burst current in the order of 0.5 A. Therefore, it is typically
implemented as a wide PCB line with short routing from DC supply (DC‐DC regulator, battery pack,
etc)
 Each voltage drop in the DC supply track will restrict the operating margin at the main DC source
output. Therefore, the PCB connection has to exhibit a minimum or zero voltage drop. Avoid any
series component with Equivalent Series Resistance (ESR) greater than a few mΩ.
 Given the large burst current, VCC line is a source of disturbance for other signals. Therefore route
VCC through a PCB area separated from sensitive analog signals. Typically it is good practice to
interpose at least one layer of PCB ground between VCC track and other signal routing.
 The VCC supply current supply flows back to main DC source through GND as ground current:
provide adequate return path with suitable uninterrupted ground plane to main DC source.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
19 / 30
WLAN/BT System Integration Manual
 A tank capacitor with low ESR is often used to smooth current spikes. This is most effective when
placed as close as possible to VCC. From main DC source, first connect the capacitor and then VCC.
If the main DC source is a switching DC‐DC converter, place the large capacitor close to the DC‐DC
output and minimize the VCC track length. Otherwise consider using separate capacitors for DC‐DC
converter and WLAN/BT module tank capacitor.
 VCC_3V3 is directly connected to the RF power amplifier. Add capacitor in the pF range from VCC
to GND along the supply path.
 Since VCC_3V3 is directly connected to RF Power Amplifier, voltage ripple at high frequency may
result in unwanted spurious modulation of transmitter RF signal. This is especially seen with
switching DC‐DC converters, in which case it is better to select the highest operating frequency for
the switcher and add a large L‐C filter before connecting to WLAN/BT module in the worst case.
 The large current generates a magnetic field that is not well isolated by PCB ground layers and
which may interact with other analog modules (e.g. VCO) even if placed on opposite side of PCB. In
this case route VCC away from other sensitive functional units.
 If VCC is protected by transient voltage suppressor / reverse polarity protection diode to ensure
that the voltage maximum ratings are not exceeded, place the protecting device along the path
from the DC source toward WLAN/BT module, preferably closer to the DC source (otherwise
functionality may be compromised).
3.2.1.3 Module grounding
Good connection of the module with application board solid ground layer is required for correct RF
performance. It significantly reduces EMC issues.
 Connect each GND pin with application board solid GND layer. It is strongly recommended that
each GND pad surrounding VCC and ANT pins have one or more dedicated via down to application
board solid ground layer.
 If the application board is a multilayer PCB, then it is required to tight together each GND area with
complete via stack down to main board ground layer.
 It is recommended to implement one layer of the application board as ground plane.
 Good grounding of GND pads will also ensure thermal heat sink.
3.2.1.4 Digital pins
 External Reset (RESET#): input for external reset, a logic low voltage will reset the module. RESET#
have to be asserted before VCC is powered ON, and the de‐assertion of RESET# needs at least 1ms
delay after VCC is powered and stable.
 SDIO (SD_CLK, SD_CMD, SD_DAT_0, SD_DAT_1, SD_DAT_2, SD_DAT_3): the SDIO layout may be
critical if the application processor is placed far away from WLAN/BT module or in close vicinity of
RF antenna. In the first case the long connection may radiate higher harmonic of digital data. In the
second case the same harmonics may be picked up and create self‐interference that can reduce the
sensitivity of WLAN/BT Receiver channels whose carrier frequency is coincident with harmonic
frequencies. In the later case using RF bypass capacitors on the digital line will mitigate the
problem.
 Digital Audio (BT_PCM_CLK, BT_PCM_SYNC, BT_PCM_DIN, BT_PCM_DOUT): the PCM interface
requires the same consideration regarding electro‐magnetic interference as the SDIO. Keep the
traces short and avoid coupling with RF line or sensitive analog inputs.
 UART (TXD, RXD, CTS, RTS): the serial interface require the same consideration regarding
electro‐magnetic interference as for SDIO. Keep the traces short and avoid coupling with RF line or
sensitive analog inputs.
 JTAG (JTAG_TCK, JTAG_TDI, JTAG_TDO, JTAG_TRSTn, JTAG_TMS_SYS, JTAG_TMS_CPU): the debug
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
20 / 30
WLAN/BT System Integration Manual
interface require the same consideration regarding electro‐magnetic interference as for SDIO. Keep
the traces short and avoid coupling with RF line or sensitive analog inputs.
3.2.2 Footprint and paste mask
Figure 3‐2 and Figure 3‐3 describe the footprint and provide recommendations for the stencil for
WLAN/BT modules. These are recommendations only and not specifications.
Figure 3‐2: WLAN/BT modules pad design
Figure 3‐3: WLAN/BT modules stencil design
 The paste mask outline needs to be considered when defining the minimal distance to the next
component.
 The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to
the specific production processes (e.g. soldering etc.) of the customer.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
21 / 30
WLAN/BT System Integration Manual
3.2.3 Placement
Optimize placement for minimum length of RF line and closer path from DC source for VCC.
3.3 Module thermal consideration
The temperature increase of the main chip 88w8688, PA LX5511 and LDO MAX4835 on a WLAN/BT
module mounted on a 168 x 46.45 x 1.3 mm FR4 PCB with a high coverage of copper (e.g. the EVK‐G25H
evaluation kit) in still air conditions are less than 28℃, 25℃, 25℃ respectively. This is based on a worse
case with full continuous WLAN TX mode.
This temperature increase will be different than the one provided if the module is mounted on a
PCB with different size and characteristics.
3.4 Antenna guidelines
Antenna characteristics are essential for good functionality of the module. The radiating
performance of antennas has direct impact on the reliability of connection over the Air Interface. Bad
termination of ANT can result in poor performance of the module.
The following parameters should be checked: Item Recommendations
Item
Recommendations
Impedance 50 Ω nominal characteristic impedance
Frequency WIFI: 2400MHz ~ 2483.5 MHz
BT: 2400MHz ~ 2483.5MHz
V.S.W.R
<2:1 recommended
Return Loss S11<‐10 dB recommended, S11<‐8 dB acceptable
Gain
<3dBi
Table 3‐2: General recommendation for antenna
Antennas are typically available as:
 Linear monopole: typical for fixed application. The antenna extends mostly as a linear element with
a dimension comparable to lambda/4 of the lowest frequency of the operating band. Magnetic
base may be available. Cable or direct RF connectors are common options. The integration
normally requires the fulfillment of some minimum guidelines suggested by antenna manufacturer.
 Patch‐like antenna: better suited for integration in compact designs. They are mostly custom
designs where the exact definition of the PCB and product mechanical design is fundamental for
tuning of antenna characteristics.
For integration observe these recommendations:
 Ensure 50 Ω antenna termination, minimize the V.S.W.R. or return loss, as this will optimize the
electrical performance of the module.
 Select antenna with best radiating performance.
 If a cable is used to connect the antenna radiating element to application board, select a short
cable with minimum insertion loss. The higher the additional insertion loss due to low quality or
long cable, the lower the connectivity.
 Follow the recommendations of the antenna manufacturer for correct installation and deployment.
 Do not include antenna within closed metal case.
 Do not place antenna in close vicinity to end user since the emitted radiation in human tissue is
limited by S.A.R. regulatory requirements.
 Do not use directivity antenna since the electromagnetic field radiation intensity is limited in some
countries.
 Take care of interaction between co‐located RF systems since the WIFI/BT transmitted power may
interact or disturb the performance of companion systems.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
22 / 30
WLAN/BT System Integration Manual
 Place antenna far from sensitive analog systems or employ countermeasures to reduce
electromagnetic compatibility issues that may arise.
3.4.1 Antenna termination
WLAN/BT modules are designed to work on a 50 Ω load. However, real antennas have no perfect
50 Ω load on all the supported frequency bands. To reduce as much as possible performance
degradation due to antenna mismatch, the following requirements should be met:
 Measure the antenna termination with a network analyzer: connect the antenna through a coaxial
cable to the measurement device, the |S11| indicates which portion of the power is delivered to
antenna and which portion is reflected by the antenna back to the module output.
 A good antenna should have a |S11| below ‐10 dB over the entire frequency band. Due to
miniaturization, mechanical constraints and other design issues, this value will not be achieved. A
value of |S11| of about ‐8 dB is acceptable.
3.4.2 Antenna diagnosis functionality
The internal antenna diagnosis circuit is based on ADC measurement at ANT_DIAG pin: the RF port
is DC coupled to the ADC unit in the application processor which injects a DC voltage (3.3V) on
VCC_ANT_DIAG and measures the resulting DC voltage to evaluate the resistance from ANT pad to GND.
The antenna detection is performed by the measurement of the resistance from ANT pad to GND.
To achieve good antenna detection functionality, use an RF antenna with built‐in resistor from ANT
signal to GND, or implement an equivalent solution with a circuit between the antenna cable connection
and the radiating element.
Please note that the DC impedance at RF port for some antennas may be a DC open (e.g. linear
monopole) or a DC short to reference GND (e.g. PIFA antenna). For those antennas, without the
diagnostic circuit Figure 53, the measured DC resistance will be always on the extreme of measurement
range (respectively open or short), and there will be no mean to distinguish from defect on antenna
path with similar characteristic (respectively: removal of linear antenna or RF cable shorted to GND for
PIFA antenna).
Furthermore, any other DC signal injected to the RF connection from ANT connector to radiating
element will alter the measurement and produce invalid results for antenna detection.
It is recommended to use an antenna with a built‐in diagnostic resistor of 51kΩ to assure good
antenna detection functionality and to avoid a reduction of module RF performances.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
23 / 30
WLAN/BT System Integration Manual
4. Handling and Soldering
4.1 Packaging, shipping, storage and moisture preconditioning
Handling Requirements
DO NOT TOUCH ANY PIN OF WIFI MODULE WHILE ASSEMBLYING.
Moisture preconditioning
This WLAN/BT module meets MSL3. Please follow J‐STD‐033B to handle this module.
4.2 Soldering Requirements
4.2.1 Soldering Iron Soldering
Solder Temperature: 350oC
Immersion Duration: 2 ~ 3 seconds
4.2.2 Reflow Profile
A convection type‐soldering oven is strongly recommended over the infrared type radiation oven.
Convection heated ovens allow precise control of the temperature and all parts will be heated up evenly,
regardless of material properties, thickness of components and surface color.
Consider the "IPC‐7530 Guidelines for temperature profiling for mass soldering (reflow and wave)
processes.”
Preheat Phase
Initial heating of component leads and balls. Residual humidity will be dried out. Please note that this
preheat phase will not replace prior baking procedures.
Temperature rise rate: max 3°C/s If the temperature rise is too rapid in the preheat phase it may cause
excessive slumping.
Preheat Time: 60 ~ 120 sec If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will be generated in clusters.
End Temperature: 140 ~ 190°C If the temperature is too low, non‐melting tends to be caused in areas
containing large heat capacity.
Heating/ Reflow Phase
The temperature rises above the liquids temperature of 227°C. Avoid a sudden rise in temperature as the
slump of the paste could become worse.
Limit time above 227°C liquids temperature: 30 ~ 70 sec
Peak reflow temperature: 235 ~ 250°C
Cooling Phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and
possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets
with a good shape and low contact angle.
Temperature fall rate: max 4°C / s
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
24 / 30
WLAN/BT System Integration Manual
4.2.3 Soldering Paste
Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the
soldering process has taken place. The paste listed in the example below meets these criteria.
Soldering Paste: ACS‐SN100C‐MA1
Alloy specification: Sn‐0.7Cu‐0.05Ni+Ge (99.2% Tin / 0.7 % Copper / 0.05% Nickel / Germanium)
Melting Temperature: 227°C
Stencil Thickness: 120 μm for base boards
The final choice of the soldering paste depends on the approved manufacturing procedures.
The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
25 / 30
WLAN/BT System Integration Manual
4.2.4 PCB Layout Footprint Design
4.2.4.1 Module Dimensions
4.2.4.2 PCB Layout Pad Design
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
26 / 30
WLAN/BT System Integration Manual
4.2.4.3 Stencil Design
Stencil thickness : 0.10mm ~ 0.15mm.
Solder paste thickness : 0.12mm ~ 0.18mm
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
27 / 30
WLAN/BT System Integration Manual
5 Product Testing
5.1 Production test
WNC focuses on high quality for its products. All units produced are fully tested. Defective units are
analyzed in detail to improve the production quality.
This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The
following measurements are done:
 Measurement of voltages and currents
 Measurement of RF characteristics
 Test at temperature 75℃ for 30 minutes
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
28 / 30
WLAN/BT System Integration Manual
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
● Reorient or relocate the receiving antenna.
● Increase the separation between the equipment and receiver.
● Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
● Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
For product available in the USA/Canada market, only channel 1~11 can be operated. Selection of other
channels is not possible.
This device and its antenna(s) must not be co‐located or operation in conjunction with any other
antenna or transmitter.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
your body.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance
requirement of the end product, which integrates this module.
20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module
is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled
environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate
this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the
antenna while this end product is installed and operated. The end user has to be informed that the FCC
radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be
informed that any changes or modifications not expressly approved by the manufacturer could void the user's
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
29 / 30
WLAN/BT System Integration Manual
authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part
15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this
device must accept any interference received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
NKRUWMWBT-CWM01". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19
statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is
subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must
accept any interference received, including interference that may cause undesired operation.
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.
30 / 30

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
Encryption                      : Standard V4.4 (128-bit)
User Access                     : Print, Extract, Print high-res
Author                          : VeraHsu
Create Date                     : 2011:12:27 17:33:00+08:00
Modify Date                     : 2011:12:27 17:35:05+08:00
XMP Toolkit                     : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04
Creator Tool                    : PScript5.dll Version 5.2.2
Metadata Date                   : 2011:12:27 17:35:05+08:00
Format                          : application/pdf
Title                           : Microsoft Word - WBT_Manual-for FCC_20111227.doc
Creator                         : VeraHsu
Producer                        : Acrobat Distiller 9.2.0 (Windows)
Document ID                     : uuid:39ee25d4-73e7-4c30-95fc-804ee47ecbb3
Instance ID                     : uuid:92ba1b4e-9ea3-4f5c-b59d-6eb8f7cfdff8
Page Count                      : 30

EXIF Metadata provided by EXIF.tools