Users Manual
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| Date Submitted | 2016-07-12 00:00:00 |
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MC2261_V2 HARDWARE DEVELOPMENT GUIDE OF MODULE PRODUCT Version: V2.1 Date: 2016-04-18 CDMA Module Series Website: www.ztewelink.com E-mail: ztewelink@zte.com.cn MC2261 Hardware Development Guide of Module Product LEGAL INFORMATION By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document. Copyright © 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or any image, table, data or other information contained in this document. is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are ZTEWelink’s trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE Corporation’s registered trademark. The other products or company names mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document. The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of products should abide by the product manual, relevant contract or the laws and regulations of relevant country. ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps the right to revise or retrieve the document any time. If you have any question about the manual, please consult the company or its distributors promptly. Copyright © ZTEWeLink Technology Co., LTD, All rights reserved. All Rights reserved, No Spreading abroad without Permission MC2261 Hardware Development Guide of Module Product REVISION HISTORY Version Date Description V1.0 2010-11-30 First published V1.1 2010-12-20 Modify Table 2-1 V1.2 2011-02-22 Update image V1.3 2011-02-25 Change Operational Temperature Range V1.4 2011-03-07 Modify Table 2-1 and power management V1.5 2011-03-29 Modify content of 3.1 power management and 5.2.5 antenna matching V1.6 2011-04-25 Modify 2.1 (add note), 3.5(add new content) V1.7 2011-06-15 Modify the email for supports. V1.8 2011-11-25 Define pin 57 MO_RI V1.9 2014-09-25 Update the format and template of module Add the name of all the Figures and Tables Update the picture of the module Update the Figure 4-1 of NMM22-5017 connector Update chapter 3.1 of power Update the pins of 35&36 V2.0 2014-09-28 Update chapter 3.1 of power Update the pins of 35 V2.1 2016-04-18 Add PID information in chapter 1.1 All Rights reserved, No Spreading abroad without Permission II MC2261 Hardware Development Guide of Module Product ABOUT THIS DOCUMENT A. Application Range R&D personnel using CDMA modules to make the second development B. Reading Note The symbols below are the reading notes you should pay attention on: : Warning or Attention : Note or Remark CONTACT INFORMATION Post 9/F, Tower A, Hans Innovation Mansion, North Ring Rd., No.9018, Hi-Tech Industrial Park, Nanshan District, Shenzhen. Web www.ztewelink.com Phone +86-755-26902600 E-Mail ztewelink@zte.com.cn Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant messaging, E-mail and on-site. All Rights reserved, No Spreading abroad without Permission III MC2261 Hardware Development Guide of Module Product SAFETY INFORMATION The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, ZTEWelink does not take on any liability for customer failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers a Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. All Rights reserved, No Spreading abroad without Permission IV MC2261 Hardware Development Guide of Module Product Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. installation. However, there is no guarantee that interference will not occur in a particular If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 4.8 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: Q78-ZTEMC2261”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. All Rights reserved, No Spreading abroad without Permission MC2261 Hardware Development Guide of Module Product Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. All Rights reserved, No Spreading abroad without Permission VI MC2261 Hardware Development Guide of Module Product CONTENTS 1. Mechanical Interface ............................................................................................................................................... 11 1.1. Physical Features ........................................................................................................................................................................ 11 1.2. Mechanical size .......................................................................................................................................................................... 11 2. Electrical Interface ................................................................................................................................................... 14 2.1. Pin Assignments ......................................................................................................................................................................... 14 2.2. Digital logic characteristics ......................................................................................................................................................... 16 3. Applications 17 3.1. Power Management ................................................................................................................................................................... 17 3.2. GPIO ................................................................................................................................................................................. 17 3.3. USB ................................................................................................................................................................................. 17 3.4. UART ................................................................................................................................................................................. 18 3.5. Powering the Module Using the MDB ........................................................................................................................................ 19 4. Antenna Interface .................................................................................................................................................... 21 4.1. Antenna Installation ................................................................................................................................................................... 21 4.2. Antenna Pad ............................................................................................................................................................................... 21 4.3. Antenna connector..................................................................................................................................................................... 22 5. RF Interface ........................................................................................................................................................ 24 5.1. Overview ................................................................................................................................................................................. 24 5.2. Antenna Subsystem .................................................................................................................................................................... 25 5.2.1. Antenna Specifications .................................................................................................................................................... 25 5.2.2. Cable Loss ........................................................................................................................................................................ 25 5.2.3. Antenna Gain Minimum Requirements ........................................................................................................................... 25 5.2.4. Antenna Gain Maximum Requirements........................................................................................................................... 25 5.2.5. Antenna Matching ........................................................................................................................................................... 25 5.2.6. PCB Design Considerations .............................................................................................................................................. 26 5.2.7. Other Precautions ............................................................................................................................................................ 26 5.2.8. Grounding ........................................................................................................................................................................ 26 6. Test Capabilities....................................................................................................................................................... 27 6.1. Test Description ......................................................................................................................................................................... 27 6.2. CDMA Test Equipment and Tools ............................................................................................................................................... 29 6.3. RF Performance Requirements .................................................................................................................................................. 30 6.3.1. CDMA2000 1X RF Rx Specification ................................................................................................................................... 30 6.3.2. CDMA2000 1X RF Tx Specification: .................................................................................................................................. 30 6.4. Environmental Reliability Requirement ..................................................................................................................................... 31 6.4.1. High Temperature Operation Test ................................................................................................................................... 31 6.4.2. Low Temperature Operation Test .................................................................................................................................... 31 6.4.3. High Temperature Storage Test ....................................................................................................................................... 32 All Rights reserved, No Spreading abroad without Permission VII MC2261 Hardware Development Guide of Module Product 6.4.4. Low Temperature Storage Test ........................................................................................................................................ 32 6.4.5. High Temperature High Humidity Operation Test ........................................................................................................... 32 6.4.6. Temperature Concussion Test ......................................................................................................................................... 32 6.5. Electro Magnetic Compatibility .................................................................................................................................................. 33 6.5.1. ESD Immunity Test ........................................................................................................................................................... 33 6.5.2. Radiated Emissions Test................................................................................................................................................... 33 All Rights reserved, No Spreading abroad without Permission VIII MC2261 Hardware Development Guide of Module Product TABLES Table 1–1 Major Technical Parameters ................................................................................................................................................ 11 Table 2–1 MC2261 Module 68-pin Electrical Interface ........................................................................................................................ 14 Table 2–2 Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal ....................................................................................... 16 Table 2–3 Baseband digital I/O characteristics for VDD_PX = 2.85 V nominal ..................................................................................... 16 Table 3–1 Input Power Characteristics ................................................................................................................................................. 17 Table 4–1 Return Loss in the Active Band ............................................................................................................................................. 21 Table 4–2 Product specifications of NMM22-5017 connector ............................................................................................................. 22 Table 4–3 Product specifications of SSMB-50TKE-10 connector .......................................................................................................... 23 Table 5–1 The requirement of dual band antenna ............................................................................................................................... 25 Table 6–1 CDMA2000 1X RF Rx Specification ....................................................................................................................................... 30 Table 6–2 CDMA2000 1X RF Tx Specification ....................................................................................................................................... 30 Table 6–3 High Temperature Operation Test ....................................................................................................................................... 31 Table 6–4 Low Temperature Operation Test ........................................................................................................................................ 31 Table 6–5 High Temperature Storage Test ........................................................................................................................................... 32 Table 6–6 Low Temperature Storage Test ............................................................................................................................................ 32 Table 6–7 High Temperature High Humidity Operation Test ............................................................................................................... 32 Table 6–8 Temperature Concussion Test ............................................................................................................................................. 32 Table 6–9 ESD Immunity Test ............................................................................................................................................................... 33 Table 6–10 Radiated Emissions Test ..................................................................................................................................................... 33 All Rights reserved, No Spreading abroad without Permission IX MC2261 Hardware Development Guide of Module Product FIGURES Figure 1–1 MC2261 TOP SIDE ............................................................................................................................................................... 12 Figure 1–2: MC2261 BOTTOM SIDE ......................................................................................................................................................... 12 Figure 1–3 MC2261 Module Illustration ............................................................................................................................................... 13 Figure 3–1 Powered by VBAT and VPH_PWR pin ................................................................................................................................. 17 Figure 3–2 USB Typical Circuit .............................................................................................................................................................. 18 Figure 3–3 Wire serial level conversion circuit ..................................................................................................................................... 18 Figure 3–4 wire serial level conversion circuit ...................................................................................................................................... 18 Figure 3–5 wire serial level conversion circuit .................................................................................................................................... 19 Figure 3–6 Module Development Board Illustration ............................................................................................................................ 19 Figure 3–7 First method to connect the module to RF test equipment ............................................................................................... 20 Figure 3–8 Second method to connect the module to RF test equipment ........................................................................................... 20 Figure 4–1 Specification of NMM22-5017 connector ........................................................................................................................... 22 Figure 4–2 Specification of SSMB-50TKE-10 ......................................................................................................................................... 23 Figure 5–1 CDMA Connector ................................................................................................................................................................ 24 Figure 5–2 CDMA Connector on daughter board ................................................................................................................................. 24 Figure 5–3 Antenna Matching Circuit ................................................................................................................................................... 26 Figure 6–1 CDMA Connector ................................................................................................................................................................ 27 Figure 6–2 Module Development Board Illustration ............................................................................................................................ 27 Figure 6–3 First method to connect the module to RF test equipment ............................................................................................... 28 Figure 6–4 Second method to connect the module to RF test equipment ........................................................................................... 28 Figure 6–5 First method to connect the module to RF antenna ........................................................................................................... 29 Figure 6–6 Second method to connect the module to RF antenna ...................................................................................................... 29 All Rights reserved, No Spreading abroad without Permission MC2261 Hardware Development Guide of Module Product 1. MECHANICAL I NTERFACE 1.1. P HYSICAL F EATURES Table 1–1 Major Technical Parameters Item Specifications Dimensions & Weight Length: 34.4 mm Width: 30 mm Thickness: 3.3 mm Weight: 8g Operational Temperature Range -30℃ to +75℃ Storage Temperature Range -40℃ to +80℃ ROHS Yes Antenna Connectors 50-Ohm ANT connectors for CDMA Power Supply Powered by the VPH_PWR pin (+3.3V~ +4.2V, typical value：3.8V) Current Idle current: 5mA @-75dBm, Powered by the VPH_PWR call current: 156mA @-75dBm, Powered by the VPH_PWR max current: 535mA @-104dBm, Powered by the VPH_PWR CELL BAND PID V1CP: 800M/1.9G PID V2CP: 800M/1.9G 1.2. M ECHANICAL SIZE NOTE: 1. All dimensions shown in the drawing below are in the unit of mm. 2. Default dimension’s tolerance is +/-0.1mm. All Rights reserved, No Spreading abroad without Permission 11 MC2261 Hardware Development Guide of Module Product Figure 1–1 MC2261 TOP SIDE Figure 1–2: MC2261 BOTTOM SIDE All Rights reserved, No Spreading abroad without Permission 12 MC2261 Hardware Development Guide of Module Product Figure 1–3 MC2261 Module Illustration NOTE: The picture above is just for reference, please take the actual product as the referece. All Rights reserved, No Spreading abroad without Permission 13 MC2261 Hardware Development Guide of Module Product 2. E LECTRICAL I NTERFACE 2.1. P IN A SSIGNMENTS Table 2–1 MC2261 Module 68-pin Electrical Interface No. Signal Signal Type Input/output Description Name GND_RF RF_ANT Typical Default (Internal Value PU/PD) Comments Ground Analog I/O Connect 50ohm Connect 50ohm antenna or feed antenna or feed GND_RF Ground GPIO0 Digital I/O GPIO 1.8V 0（Output PD） 1.8V Level， GPIO1 Digital I/O GPIO 1.8V 0（Output PD） 1.8V Level GPIO2 Digital I/O GPIO 1.8V 0（Output PD） 1.8V Level GPIO3 Digital I/O GPIO 1.8V 0（Output PD） 1.8V Level GPIO4 Digital I/O GPIO 1.8V 0（Output PD） 1.8V Level GPIO9 Digital I/O GPIO 1.8V 1.8V（Input PU） 1.8V Level 10 GPIO8 Digital I/O GPIO 1.8V 1.8V（Input PU） 1.8V Level 11 GPIO7 Digital I/O GPIO 1.8V 1.8V（Input PU） 1.8V Level 12 GPIO6 Digital I/O GPIO 1.8V 1.8V（Input PU） 1.8V Level 13 GPIO5 Digital I/O GPIO 1.8V 1.8V（Input PU） 1.8V Level 14 GND 15 MSM_CTS Ground Clear to send UART Port 1.8V Level 16 MSM_RTS Ready to send UART Port 1.8V Level 17 18 MSM_RXD MSM_TXD Transmitting UART Port data 1.8V Level Receiving data UART Port 1.8V Level 19 GND 20 NA Reserved 21 NA Reserved 22 NA Reserved 23 NA Reserved 24 GND 25 NA Reserved 26 NA Reserved 27 GND 28 NA Reserved 29 NA Reserved All Rights reserved, No Spreading abroad without Ground Ground Ground Permission 14 MC2261 Hardware Development Guide of Module Product 30 NA Reserved 31 NA Reserved 32 GND 33 VPH_PWR Ground P (input) Main power 3.8 Power range: 3.3V-4.2V 34 VPH_PWR P (input) Main power 3.8 Power range: 3.3V-4.2V 35 NC 36 VBAT Not connected P (input) Used for 3.8 Power range: module’s power 3.3V-4.2V supply 37 NA Reserved 38 GND 39 NA Reserved 40 NA Reserved 41 ON 42 NA Reserved 43 NA Reserved 44 NA Reserved 45 NA Reserved 46 VREG_MS Ground Power button Power button Digital power 2.85V Digital power 1.8V ME2 47 VREG_MS ME1 48 NA Reserved 49 GND 50 USB_VBUS 51 USB_DP 52 USB_DM 53 GND 54 NA Reserved 55 NA Reserved 56 NA Reserved 57 MO_RI Ground USB power 5V Digital Send D+ to USB USB_D+ signal Digital Send D- to USB USB_D- signal Ground Digital MSG arrival Output PU indication 2.85V，normal 300ms high-level impulse when MSG arrival 58 DCD Carrier detect 2.85V 2.85V, low active 59 DTR Data Terminal 2.85V UART Port, All Rights reserved, No Spreading abroad without Permission 15 MC2261 Hardware Development Guide of Module Product Ready Connect to DCD, 2.85V Level 60 DSR Data Set Ready 2.85V UART Port, Connect to DTR, 2.85V Level 61 NA 62 GND 63 USE_LED Reserved Ground In-use LED LED ON as the level is high. 2.85V Level 64 NA Reserved 65 NA Reserved 66 GPIO42 Digital I/O GPIO 1.8V 0（Iutput PD） 1.8V Level 67 GPIO43 Digital I/O GPIO 1.8V 0（Iutput PD） 1.8V Level 68 GND Ground NOTE: 1 All the pin can be left open ,when they are not used. 2 I/O stands for Inupt/Output, P stands for Power, B stands for Bi-Directional. PU/PD stands for Pull-up/Pull-down. The unit of Min, Typ, Max is V. 2.2. D IGITAL LOGIC CHARACTERISTICS Specifications for the digital I/Os of the baseband functions depend upon the pad voltage being used. The MC2261 I/O uses two pad voltages: 1.8 and 2.85 V. Digital I/O specifications under both pad voltage conditions are presented in Table 2-2 and Table 2-3 Table 2–2 Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal Parameter Min Typ Max Unit VIH High-level input voltage 0.65·VDD_PX VDD_PX+0.3 VIL Low-level input voltage -0.3 0.35·VDD_PX VOH High-level output voltage4 VDD_PX-0.45 VDD_PX VOL Low-level output voltage 4 0.45 Table 2–3 Baseband digital I/O characteristics for VDD_PX = 2.85 V nominal Parameter Min Typ Max Unit VIH High-level input voltage 0.65·VDD_PX VDD_PX+0.3 VIL Low-level input voltage -0.3 0.35·VDD_PX VOH High-level output voltage4 VDD_PX-0.45 VDD_PX VOL Low-level output voltage 4 0.45 All Rights reserved, No Spreading abroad without Permission 16 MC2261 Hardware Development Guide of Module Product 3. A PPLICATIONS 3.1. P OWER M ANAGEMENT The module could work under the conditions as follows: Connect VPH_PWR and VBAT pins together, and then connect to the power as shown in Figure 3-1. Figure 3–1 Powered by VBAT and VPH_PWR pin Refer to Table 3-1 for the module’s input power characteristics. If the input voltage is not in the range, it must be converted to the voltage below: Table 3–1 Input Power Characteristics Status Max. Value Typical Volute Min. Value Power voltage +4.2V DC +3.8V DC +3.3V DC Power current < 3mA (Average -- 800mA (Depending on the network supply value) supply signal condition) When powered, the module will be automatically powered on. 3.2. GPIO The Module have 12 GPIO,,The GPIO level is 1.8V, the logic-level voltage refer to the Table 2-2. The GPIO input and output functions can be set by software. When the GPIO is set to output, the output drive current are 2~16mA. in the range of 2~16mA current value can be set by software. When the GPIO is set to input, it can be set to pull-up or pull-down by software. NOTE: The AT commands now do not support setting the GPIO functions. If you want AT commands to support the functions, the software must be revised. 3.3. USB The module provides a USB2.0 full-speed interface. The ESD protector and RC circuit are required to restrain EMI for USB port. Please see Figure 3-2 for USB port. The USB port could be used for AT command、software upgrade, RF calibration and mobile station test. All Rights reserved, No Spreading abroad without Permission 17 MC2261 Hardware Development Guide of Module Product Figure 3–2 USB Typical Circuit 3.4. UART Pins of MSM_CTS, MSM_RTS, MSM_RXD and MSM_TXD are 1.8V level respectively for the external interface, when connecting with level circuit which is not 1.8V will need the level switch connection. Pins of MO_RI, DCD, DTR and DSR are the level of 2.85V respectively for the external interface, when connecting with level circuit which is not 2.85V will need the level switch connection. Otherwise, UART will be unstable or module will be damaged because of the unmatched level. Figure 3-3, 3-4 and 3-5 are the references: NOTES: 1）UART must be led out[only requires the connection with RXD or TXD] for upgrading when use the module to do whole device design, USB for software upgrading is the first choice. 2）IO level is 1.8V or 2.85V. Level switch connection must be needed when 1.8V level is connected with the logic circuit which is not 1.8V[such as MCU, RS232 or driver IC MAX3238], or when 2.85V level is connected with the logic circuit which is not 2.85V[for example, RS232 or driver IC MAX3238]. Otherwise, level will be unstable or module will be damaged because of the unmatched level 3）Only RXD and TXD are needed to be connected under the condition of no flow control. RXD, TXD, /CTS and /RTS are needed to be used when selecting hardware flow control to connect other processors. All IO signal should be connected when the module is used as Modem to connect with PC. 4）Module won’t be hibernated if RxD is high level. Figure 3–3 Wire serial level conversion circuit Figure 3–4 wire serial level conversion circuit All Rights reserved, No Spreading abroad without Permission 18 MC2261 Hardware Development Guide of Module Product Figure 3–5 wire serial level conversion circuit 3.5. P OWERING THE M ODULE U SING THE MDB Place the module on the MDB (Module Development Board), then plugging one end of USB cable in PC and another in MDB, if the power supplied by the USB port, the X3 doesn’t supplied the power. If not use the USB port, the X3 can supplied the power (DC5V), when the users power the module’s development board, the module will be automatically powered on. The users could power the module’s development board in the following two methods: i. Supplied by USB_VBUS_5V. ii. Supplied by X3 (DC5V). Operating instructions Figure 3–6 Module Development Board Illustration All Rights reserved, No Spreading abroad without Permission 19 MC2261 Hardware Development Guide of Module Product Connect the sector to access terminal antenna connectors as shown in the following Figure 3-8 or Figure 3-9. Figure 3–7 First method to connect the module to RF test equipment Figure 3–8 Second method to connect the module to RF test equipment All Rights reserved, No Spreading abroad without Permission 20 MC2261 Hardware Development Guide of Module Product 4. A NTENNA INTERFACE The RF interface of the MC2261 Module has an impedance of 50 ohm. The module is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the MC2261 Module PCB and should be placed in the host application. Regarding the return loss, the Module provides the following values in the active band: Table 4–1 Return Loss in the Active Band State of Module Return Loss of Module Recommended Return Loss of Application Receive ≥ 8dB ≥ 12dB Transmit not applicable ≥ 12dB The connection of the antenna or other equipment must be de coupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 4.1. A NTENNA I NSTALLATION To suit the physical design of individual applications, the MC2261 offers two alternatives approached to connecting the antenna: ■ Recommended approach: CS-G2-SS1S-1.6S antenna connector manufactured by Percsson assembled on the daughter board. See Section 4.3 for details. CS-G2-SS1S-1.6D antenna connector manufactured by Percsson assembled on the component side of the PCB (top view on Module). See Section 4.3 for details. ■ Antenna pad and grounding plane placed on the bottom side. See Section 4.2 for details. The SSMB-50TKE-10 and NMM22-5017 connectors have been chosen as antenna reference point (ARP) for the ZTE reference equipment submitted to type approve the MC2261 Module. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the ZTE type approval you are advised to give priority to the connector, rather than using the antenna pad. NOTE: Both solutions can be applied alternatively. This means, if the antenna is connected to the pad, then the connector on the Module must be left empty. If the antenna is connected to daughter board, the connector on the Module must be left empty too. And when the antenna is connected to the Module connector, the pad is useless. 4.2. A NTENNA P AD The antenna pad of the module is soldered to the board on the customer design to connect with RF line. For proper grounding connect the RF line to the ground plane on the bottom of the MC2261 Module which must be connected to the ground plane of the application. Consider that according to CDMA recommendations as 50Ω connector is mandatory for type approval measurements. It must be ensured that the RF line which is connected to antenna pad should be controlled on 50Ω. Notes on soldering ■ To prevent damage to the Module and to obtain long-term solder joint properties, you are advised to maintain the standards of good engineering practice for soldering. All Rights reserved, No Spreading abroad without Permission 21 MC2261 Hardware Development Guide of Module Product Material Properties ■ MC2261 Module PCB: FR4 ■ Antenna pad: Gold plated pad 4.3. A NTENNA CONNECTOR The MC2261 Module uses a microwave coaxial connector supplied by Murata Ltd. The product name is NMM22-5017. The position of the antenna connector on the Module PCB can be seen in Figure 5-1. Figure 4–1 Specification of NMM22-5017 connector Table 4–2 Product specifications of NMM22-5017 connector Rated Contact With Insulation Durability Voltage Resistance standing Resistance (cycles) (V) (ohm) Voltage (M ohm) Frequency TEMP Rating Range (GHz) (degree C) DC - 6.0 -40~+90 VSWR Center Outer Insulator Contact Contact 1.2 Copper Copper Engineeri max. Alloy Alloy ng plastic (DC~3 Gold Silver GHz) plated plated (rms) 250 0.05 300 (AC) 500 min. 500 max. Impedance: 50 ohm All Rights reserved, No Spreading abroad without Permission 22 MC2261 Hardware Development Guide of Module Product The daughter board of MC2261 Module uses a microwave coaxial connector supplied by CNT Ltd. The product name is SSMB-50TKE-10. The position of the antenna connector on the daughter PCB can be seen in Figure 5-2. Figure 4–2 Specification of SSMB-50TKE-10 Table 4–3 Product specifications of SSMB-50TKE-10 connector Rated Contact Withstanding Insulation Durability Frequency Temperature Voltage Resistance Voltage Resistance (cycles) Rating Range (V) (ohm) (rms) (M ohm) (GHz) (degree C) 250 0.05 max. 300 (AC) 1000 min. DC - 3.0 -55~+155 5000 VSWR Center Outer Contact Contact 1.35 Copper Copper max. Alloy Alloy (DC~3 Gold Silver GHz) plated plated Insulator Engineerin g plastic Impedance: 50 ohm All Rights reserved, No Spreading abroad without Permission 23 MC2261 Hardware Development Guide of Module Product 5. RF I NTERFACE 5.1. O VERVIEW A 50 ohm coaxial RF connector is provided for Module testing. However, we advise customers lead from the antenna pad at the RF line to the antenna. Figure 5–1 CDMA Connector Another 50 ohm coaxial RF connector on daughter board is provided for Module testing and customer showing. Figure 5–2 CDMA Connector on daughter board The integrator must provide a suitable antenna that works in the desired frequency band of operation. The Antenna connected to the CDMA connector should be a dual band antenna supporting the US PCS and Cellular bands. All Rights reserved, No Spreading abroad without Permission 24 MC2261 Hardware Development Guide of Module Product Table 5–1 The requirement of dual band antenna Band TX Frequency RX Frequency PCS 1850-1910 MHz 1930-1990 MHz Cellular 824-849 MHz 869-894 MHz NOTE: TX refers to the transmit from the module into the antenna (Reverse Link of the CDMA system), and RX refers to the receive from the antenna into the module (Forward Link of the CDMA system). 5.2. A NTENNA S UBSYSTEM The antenna sub-system and its design is a major part of the final product integration. Special attention and care should be taken in adhering to the following guidelines. 5.2.1. ANTENNA SPECIFICATIONS Choice of the antenna cable (type, length, performance, RF loss, etc) and antenna connector (type + losses) can have a major impact on the success of the design. 5.2.2. CABLE LOSS All cables have RF losses. Minimizing the length of the cable between the antenna and the RF connectors on the module will help obtain superior performance. High Quality/Low loss co-axial cables should be used to connect the antenna to the RF connectors. Contact the antenna vendor for the specific type of cable that interfaces with their antenna and ask them to detail the RF losses of the cables supplied along with the antenna. Typically, the cable length should be such that they have no more than 1-2dB of loss. Though the system will work with longer (lossy) cables, this will degrade CDMA system performance. Care should also be taken to ensure that the cable end connectors/terminations are well assembled to minimize losses and to offer a reliable, sturdy connection to the Module sub-system. This is particularly important for applications where the module is mounted on a mobile or portable environment where it is subject to shock and vibration. 5.2.3. ANTENNA GAIN MINIMUM REQUIREMENTS It is recommended that the antenna chosen have at least 2 dBi gain in the cellular band and 4 dBi in the PCS band. The Antenna subsystem shall also have at least 8 dB of return loss at the input with respect to a 50-ohm system. 5.2.4. ANTENNA GAIN MAXIMUM REQUIREMENTS Our FCC Grant imposes a maximum gain for the antenna subsystem: 7 dBi for the Cellular band and 13dBi for the PCS band. Warning: Excessive gain could damage sensitive RF circuits and void the warranty. 5.2.5. ANTENNA MATCHING The module’s RF connectors are designed to work with a 50-ohm subsystem. It is assumed that the antenna chosen has matching internal to it to match between the 50-ohm RF connectors and the antenna impedance. All Rights reserved, No Spreading abroad without Permission 25 MC2261 Hardware Development Guide of Module Product Figure 5–3 Antenna Matching Circuit 5.2.6. PCB DESIGN CONSIDERATIONS • The antenna subsystem should be treated like any other RF system or component. It should be isolated as much as possible from any noise generating circuitry including the interface signals via filtering and shielding. • As a general recommendation all components or chips operating at high frequencies such as micro controllers, memory, DC/DC converts and other RF components should not be placed too close to the module. When such cases exist, correct supply and ground de-coupling areas should be designed and validated. • Avoid placing the components around the RF connection and close to the RF line between the RF antenna and the module. • RF lines and cables should be as short as possible. • If using coaxial cable it should not be placed close to devices operating at low frequencies. Signals like charger circuits may require some EMI/RFI decoupling such as filter capacitors or ferrite beads. • Adding external impedance matching to improve the match to your cable and antenna assemblies is optional. Please contact the antenna vendor for matching requirements. • For better ESD protection one can implement a shock coil to ground and place it close to the RF connector. 5.2.7. OTHER PRECAUTIONS V_MAIN_3V7 are used to supply the module. The module internally regulates these to obtain regulated voltages to supply both the baseband and RF parts of the Module. V_MAIN_3V7 directly supplies the RDF components with 3.7V. It is essential to keep the voltage ripple to a minimum at this connection in order to avoid phase error. Insufficient power supply voltage can dramatically affect some RF performance such as TX power, modulation spectrum EMC performance, and spurious emissions and frequency error. The RF connections are 50-ohm impedance systems and are a DC short to ground. Best effort should be made to provide low insertion loss and shielding between the external antenna and RF connections over the frequency band of interest. 5.2.8. GROUNDING On terminals including the antenna, poor shielding can dramatically affect the sensitivity of the terminal. Moreover the power emitted through the antenna can affect the application. All Rights reserved, No Spreading abroad without Permission 26 MC2261 Hardware Development Guide of Module Product 6. T EST C APABILITIES 6.1. T EST D ESCRIPTION 1) MC2261 RF Connectors are shown in Figure 5-1： Figure 6–1 CDMA Connector 2) Operating instructions Figure 6–2 Module Development Board Illustration Connect the sector to access terminal antenna connectors as shown in the following Figure 6-3 or Figure 6-4: All Rights reserved, No Spreading abroad without Permission 27 MC2261 Hardware Development Guide of Module Product Figure 6–3 First method to connect the module to RF test equipment Figure 6–4 Second method to connect the module to RF test equipment Connect the RF antenna to terminal antenna connectors as shown in the following Figure 6-5 or Figure 6-6: All Rights reserved, No Spreading abroad without Permission 28 MC2261 Hardware Development Guide of Module Product Figure 6–5 First method to connect the module to RF antenna Figure 6–6 Second method to connect the module to RF antenna 6.2. CDMA T EST E QUIPMENT AND T OOLS Lease or purchase of test equipment is available from vendors who provide this equipment for CDMA over the-air simulation. Some suggested products include: • Agilent 8960 Series 10 E5515C CDMA Mobile Station Tester • Agilent E4440A Spectrum analyzer • Agilent E4438C Signal Generator • Agilent E4438C Signal Generator • Programmable Temperature-Humidity Testor • Programmable Temperature Concussion Testor All Rights reserved, No Spreading abroad without Permission 29 MC2261 Hardware Development Guide of Module Product 6.3. RF P ERFORMANCE R EQUIREMENTS 6.3.1. CDMA2000 1X RF RX SPECIFICATION Table 6–1 CDMA2000 1X RF Rx Specification Frequency range 869~894MHz/1930~1990MHZ Rx. Sensitivity -104 dBm(FER≤0.5％) Rx. Signal Range -25 dBm~ -104dBm(FER≤0.5％) Immunity FER≤1.0％(-101dBm/BW , 30dBm@±900KHz) (800MHz) FER≤1.0％(-101dBm/BW ,-40dBm@±1250KHz) (1900MHz) Inter-modulation spurious emissions FER≤1.0％(Test1: -101dBm/BW ,+900/+1700KHz, -43dBm) FER≤1.0％(Test1: -101dBm/BW ,+1250/+2050KHz, -43dBm) FER≤1.0％(Test 2: -101dBm/BW ,-900/-1700KHz, -43dBm) FER≤1.0％(Test 2: -101dBm/BW,-1250/-2050KHz, -43dBm) Conductive spurious emissions <-76dBm/1MHz(1930~1990MHz ; 869~894MHz) < - 61dBm/1MHz(1850~1910MHz ; 824~849MHz) < - 47dBm/30KHz(other frequency) Demodulation of forward traffic channel in AWGN FER≤3.0％(Test 1: Rate Group 1(9600bps) FER≤1.0％(Test 2: Rate Group 1(9600bps) FER≤0.5％(Test 3: Rate Group 1(9600bps) FER≤1.0％(Test 4: Rate Group 1(4800bps) FER≤1.0％(Test 5: Rate Group 1(2400bps) FER≤1.0％(Test 6: Rate Group 1(1200bps) FER≤3.0％(Test 7: Rate Group 2(14400bps) FER≤1.0％(Test 8: Rate Group 2(14400bps) FER≤0.5％(Test 9: Rate Group 2(14400bps) FER≤1.0％(Test 10: Rate Group 2(7200bps) FER≤1.0％(Test 11: Rate Group 2(3600bps) FER≤1.0％(Test 12: Rate Group 2(1800bps) 6.3.2. CDMA2000 1X RF TX SPECIFICATION: Table 6–2 CDMA2000 1X RF Tx Specification Max. frequency tolerance 824~849MHz/1850~1910MHz Max. Tx. Power ±300Hz/±150Hz Min. output power 800MHz: 23dBm ~ 30dBm@-105.5 dBm 1900MHz: 18dBm ~ 27dBm@-105.5 dBm Standby output power < -50dBm@-25 dBm All Rights reserved, No Spreading abroad without Permission 30 MC2261 Hardware Development Guide of Module Product Code domain power <-61dBm Transmitter time error ±1.0μs Waveform quality factor >0.944 Open loop power control (Test 1: -25dBm/1.23MHz)-48dBm/1.23MHz±9.5dBm (Test 2: 1: -65dBm/1.23MHz)-8dBm/1.23MHz±9.5dBm -25dBm/1.23MHz)-51dBm/1.23MHz±9.5dBm 2: -93.5dBm/1.23MHz)+20dBm/1.23MHz±9.5dBm -65dBm/1.23MHz)-11dBm/1.23MHz±9.5dBm (Test 3: Close loop power control (Test 3: -91.3dBm/1.23MHz)+15dBm/1.23MHz±9.5dBm ±24dB(9600bps data rate) ±24dB(4800bps data rate) ±24dB(2400bps data rate) ±24dB(1200bps data rate) Conductive spurious emissions -42dBc/30KHz or -54dBm/1.23MHz(|Δf|: 1.25MHz~1.98MHz) -54dBc/30KHz or -54dBm/1.23MHz(|Δf|: 1.98MHz~4.00MHz) < -13dBm/1KHz(f> 4MHz, 9KHz < f < 150KHz,) < -13dBm/10KHz(f > 4MHz, 150KHz4MHz, 30MHz < f < 1GHz) < -13dBm/1MHz(f> 4MHz, 1GHz < f < 10GHz) Remarks: RF technical specification conforms to the following standards: 3GPP2 C.S0011-C V2.0 Recommended Minimum Performance Standards for cdma2000 Spread Spectrum Mobile Stations 3GPP2 C.S0033-0 V2.0 Recommended Minimum Performance Standards for cmda2000 High Rate Packet Data Access Terminal 6.4. E NVIRONMENTAL R ELIABILITY R EQUIREMENT 6.4.1. HIGH TEMPERATURE OPERATION TEST Table 6–3 High Temperature Operation Test EUT Status Power-on Temperature 70℃ Duration 16h 6.4.2. LOW TEMPERATURE OPERATION TEST Table 6–4 Low Temperature Operation Test EUT Status Power-on Temperature -25℃ Duration 16h All Rights reserved, No Spreading abroad without Permission 31 MC2261 Hardware Development Guide of Module Product 6.4.3. HIGH TEMPERATURE STORAGE TEST Table 6–5 High Temperature Storage Test EUT Status Power-off Temperature 85℃ Duration 24h 6.4.4. LOW TEMPERATURE STORAGE TEST Table 6–6 Low Temperature Storage Test EUT Status Power-off Temperature -45℃ Duration 24h 6.4.5. HIGH TEMPERATURE HIGH HUMIDITY OPERATION TEST Table 6–7 High Temperature High Humidity Operation Test EUT Status Power-on Temperature 55℃ Humidity 93% Duration 48h 6.4.6. TEMPERATURE CONCUSSION TEST Table 6–8 Temperature Concussion Test EUT Status Power-off High Temperature 85℃ High Temperature Duration 1h Low Temperature -45℃ Low Temperature Duration 1h Cycle Times 10 All Rights reserved, No Spreading abroad without Permission 32 MC2261 Hardware Development Guide of Module Product 6.5. E LECTRO M AGNETIC C OMPATIBILITY 6.5.1. ESD IMMUNITY TEST Table 6–9 ESD Immunity Test EUT Status Idle mode and traffic mode Test Voltage Air ±8KV; Contact ±6KV Reference Standard IEC 61000-4-2 : 2001 6.5.2. RADIATED EMISSIONS TEST Table 6–10 Radiated Emissions Test EUT Status Idle mode and traffic mode Limits for radiated disturbance Class B ITE Reference Standard FCC Part15 All Rights reserved, No Spreading abroad without Permission 33
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