dresden elektronik ingenieurtechnik MEGA23M12 2.4GHz IEEE 802.15.4 compliant radio module User Manual 15 MEGA23M12 User Manual

dresden elektronik ingenieurtechnik gmbh 2.4GHz IEEE 802.15.4 compliant radio module 15 MEGA23M12 User Manual

Contents

15_MEGA23M12_User _Manual

User Manual Radio Modules deRFmega128-22M00 deRFmega256-23M00 deRFmega128-22M10 deRFmega256-23M10 deRFmega128-22M12 deRFmega256-23M12 Document Version V1.3 2013-06-10
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 2 of 69 Table of contents 1. Overview ......................................................................................................................... 6 2. Applications ..................................................................................................................... 6 3. Features .......................................................................................................................... 7 3.1. deRFmega128-22M00 ............................................................................................ 7 3.2. deRFmega128-22M10 ............................................................................................ 8 3.3. deRFmega128-22M12 ............................................................................................ 9 3.4. deRFmega256-23M00 .......................................................................................... 10 3.5. deRFmega256-23M10 .......................................................................................... 11 3.6. deRFmega256-23M12 .......................................................................................... 12 4. Technical data ............................................................................................................... 13 4.1. TX Power register settings for deRFmega128-22M00 and 22M10 ........................ 19 4.2. TX Power register settings for deRFmega128-22M12 .......................................... 20 4.3. TX Power register settings for deRFmega256-23M00 and 23M10 ........................ 21 4.4. TX Power register settings for deRFmega256-23M12 .......................................... 22 4.5. Output power and duty cycle settings for power amplified radio modules ............. 23 5. Mechanical size ............................................................................................................. 24 5.1. deRFmega128-22M00 and deRFmega256-23M00 .............................................. 24 5.2. deRFmega128-22M10 and deRFmega256-23M10 .............................................. 25 5.3. deRFmega128-22M12 and deRFmega256-23M12 .............................................. 26 6. Soldering profile............................................................................................................. 27 7. Pin assignment .............................................................................................................. 28 7.1. Signals of deRFmega128-22M00 and deRFmega256-23M00 .............................. 28 7.2. Signals of deRFmega128-22M10 and deRFmega256-23M10 .............................. 31 7.2.1. External front-end and antenna diversity control ....................................... 34 7.3. Signals of deRFmega128-22M12 and deRFmega256-23M12 .............................. 35 7.3.1. Internal front-end control ........................................................................... 38 7.4. Signal description ................................................................................................. 39 8. PCB design ................................................................................................................... 41 8.1. Technology ........................................................................................................... 41 8.2. Base board footprint ............................................................................................. 41 8.2.1. Footprint of deRFmega128-22M00 and deRFmega256-23M00 ................ 42 8.2.2. Footprint of deRFmega128-22M10 and deRfmega256-23M10 ................. 43 8.2.3. Footprint of deRFmega128-22M12 and deRFmega256-23M12 ................ 44 8.3. Ground plane........................................................................................................ 44 8.4. Layers .................................................................................................................. 45 8.5. Traces .................................................................................................................. 46 8.6. Placement on the PCB ......................................................................................... 47 8.7. Reference Design for deRFmega256-23M12 ....................................................... 48 8.7.1. Overview ................................................................................................... 48 8.7.2. PCB design ............................................................................................... 49 8.7.3. RF trace design ......................................................................................... 49 8.7.4. Chip-antenna ............................................................................................ 51 8.7.5. Coaxial connector layout ........................................................................... 52 8.7.6. Ground area and vias ................................................................................ 53
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 3 of 69 9. Clock ............................................................................................................................. 54 10. Application circuits ......................................................................................................... 55 10.1. UART ................................................................................................................... 55 10.2. ISP ....................................................................................................................... 55 10.3. JTAG .................................................................................................................... 55 10.4. TWI ...................................................................................................................... 56 10.5. External front-end and antenna diversity .............................................................. 57 11. Programming ................................................................................................................. 59 12. Pre-flashed firmware ..................................................................................................... 59 13. Adapter boards .............................................................................................................. 59 14. Radio certification .......................................................................................................... 61 14.1. United States (FCC) ............................................................................................. 61 14.2. European Union (ETSI) ........................................................................................ 62 14.3. Approved antennas .............................................................................................. 62 15. Ordering information ...................................................................................................... 64 16. Related products ........................................................................................................... 65 17. Packaging dimension .................................................................................................... 66 18. Revision notes ............................................................................................................... 66 19. References .................................................................................................................... 67
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 4 of 69 Document history Date Version Description 2012-10-15 1.0 Initial version 2012-11-30 1.1 Update technical data  TX_PWR register settings  Sensitivity Update signal description 2013-01-22 1.2 RFOUT pin description on deRFmega128-22M12 more precisely specified Update duty cycle limit Addition of deRFmega256-23M00, -23M10, -23M12 2013-06-10 1.3 Update duty cycle requirements Addition of reference design for deRFmega256-23M12 Update FCC section
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 5 of 69 Abbreviations Abbreviation Description IEEE 802.15.4 IEEE 802.15.4 standard, applicable to low-rate Wireless Personal Area Networks (WPAN) 6LoWPAN IPv6 over Low Power Wireless Personal Area Networks ADC Analog to Digital Converter CE Consumer Electronics EMI Electromagnetic Interference ETSI European Telecommunications Standards Institute FCC Federal Communications Commission GPIO Generals Purpose Input Output JTAG Joint Test Action Group, digital interface for debugging of embedded devices, also known as IEEE 1149.1 standard interface ISA SP100 International Society of Automation, the Committee establishes standards and related technical information for implementing wireless systems. ISP In-System-Programming LGA Land Grid Array, a type of surface-mount packaging for integrated circuits LNA Low Noise Amplifier MAC Medium (Media) Access Control MCU, µC Microcontroller Unit PA Power Amplifier PCB Printed Circuit Board PWM Pulse Width Modulation RF Radio Frequency R&TTE Radio and Telecommunications Terminal Equipment (Directive of the European Union) SPI Serial Peripheral Interface TWI Two-Wire Serial Interface U[S]ART Universal [Synchronous/]Asynchronous Receiver Transmitter USB Universal Serial Bus ZigBee Low-cost, low-power wireless mesh network standard. The ZigBee Alliance is a group of companies that maintain and publish the ZigBee standard.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 6 of 69 1. Overview The tiny radio module series by dresden elektronik combines Atmel’s 8-bit AVR single chip ATmega128RFA1 and ATmega256RFR2 with a small footprint. Six different module types are available providing different features for the custom application. The deRFmega128-22M00 and deRFmega256-23M00 have an onboard chip antenna to establish a ready-to-use device. No additional and expensive RF designs are necessary. This module is full compliant to all EU and US regulatory requirements. The deRFmega128-22M10 and deRFmega256-23M10 have the smallest form factor of all module types. The customer is free to design his own antenna, coaxial output or front-end; but it is also possible to use one of the dresden elektronik’s certified and documented RF designs. The deRFmega128-22M12 and deRFmega256-23M12 have an onboard front-end feature including LNA and PA with 20 dB gain. Furthermore it supports antenna diversity by a direct connection of two antennas or coaxial connectors. All necessary RF parts and switches are integrated. This module type combined with the small form factor is the optimal solution between range extension and space for mounting on PCB. 2. Applications The main applications for the radio modules are:  2.4 GHz IEEE 802.15.4  ZigBee PRO  ZigBee RF4CE  ZigBee IP  6LoWPAN  ISA SP100  Wireless Sensor Networks  Industrial and home controlling/monitoring  Smart Metering
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 7 of 69 3. Features 3.1. deRFmega128-22M00 The radio module deRFmega128-22M00 offers the following features:  Tiny size: 23.6 x 13.2 x 3.0 mm  51 LGA pads 0.6 x 0.6 mm  Supply voltage 1.8 V to 3.6 V  RF shielding  Onboard 32.768 kHz crystal (Deep-Sleep clock) and  16 MHz crystal  Application interfaces: 2x UART, 1x TWI, 1x ADC  GPIO interface  Debug/Programming interfaces: 1x SPI, 1x JTAG, 1x ISP  Onboard 2.4 GHz chip antenna  Certification: CE, FCC Figure 1 shows the block diagram of the radio module deRFmega128-22M00. ATmega128RFA1Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC1.8V to 3.6VWatch crystal32.768kHzSPITWIADCGPIO2.4GHz antenna Figure 1: Block diagram deRFmega128-22M00
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 8 of 69 3.2. deRFmega128-22M10 The radio module deRFmega128-22M10 offers the following features:  Tiny size: 19.0 x 13.2 x 3.0 mm  55 LGA pads 0.6 x 0.6 mm  Supply voltage 1.8 V to 3.6 V  RF shielding  Onboard 32.768 kHz crystal (Deep-Sleep clock) and  16 MHz crystal  Application interfaces: 2x UART, 1x TWI, 1x ADC  GPIO interface  Debug/Programming interfaces: 1x SPI, 1x JTAG, 1x ISP  Solderable 2.4 GHz RF output pads (1x RFOUT, 3x RFGND)  Certification: CE, FCC pending Figure 2 shows the block diagram of the radio module deRFmega128-22M10. ATmega128RFA1Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC1.8V to 3.6VWatch crystal32.768kHzSPITWIADCGPIORFout Figure 2: Block diagram deRFmega128-22M10
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 9 of 69 3.3. deRFmega128-22M12 The radio module deRFmega128-22M12 offers the following features:  Tiny size: 21.5 x 13.2 x 3.0 mm  59 LGA pads 0.6 x 0.6 mm  Supply voltage 2.0 V to 3.6 V  Antenna diversity support  RF shielding  Onboard 32.768 kHz crystal (Deep-Sleep clock) and  16 MHz crystal  Application interfaces: 2x UART, 1x TWI  GPIO interface  Debug/Programming interfaces: 1x SPI, 1x JTAG, 1x ISP  2.4 GHz front-end module with internal 20 dB PA and LNA  Solderable 2.4 GHz RF output pad (2x RFOUT, 6x RFGND)  Certification: CE, FCC pending Figure 3 shows the block diagram of the radio module deRFmega128-22M12. Figure 3: Block diagram deRFmega128-22M12 ATmega128RFA1Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC2.0V to 3.6VWatch crystal32.768kHzSPITWIADCGPIO2.4GHz Front-End RFout 1RFout 2RFControl
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 10 of 69 3.4. deRFmega256-23M00 The radio module deRFmega256-23M00 offers the following features:  Tiny size: 23.6 x 13.2 x 3.0 mm  51 LGA pads 0.6 x 0.6 mm  Supply voltage 1.8 V to 3.6 V  RF shielding  Onboard 32.768 kHz crystal (Deep-Sleep clock) and  16 MHz crystal  Application interfaces: 2x UART, 1x TWI, 1x ADC  GPIO interface  Debug/Programming interfaces: 1x SPI, 1x JTAG, 1x ISP  Onboard 2.4 GHz chip antenna  Certification: CE, FCC pending Figure 4 shows the block diagram of the radio module deRFmega256-23M00. ATmega256RFR2Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC1.8V to 3.6VWatch crystal32.768kHzSPITWIADCGPIO2.4GHz antenna Figure 4: Block diagram deRFmega256-23M00
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 11 of 69 3.5. deRFmega256-23M10 The radio module deRFmega256-23M10 offers the following features:  Tiny size: 19.0 x 13.2 x 3.0 mm  55 LGA pads 0.6 x 0.6 mm  Supply voltage 1.8 V to 3.6 V  RF shielding  Onboard 32.768 kHz crystal (Deep-Sleep clock) and  16 MHz crystal  Application interfaces: 2x UART, 1x TWI, 1x ADC  GPIO interface  Debug/Programming interfaces: 1x SPI, 1x JTAG, 1x ISP  Solderable 2.4 GHz RF output pads (1x RFOUT, 3x RFGND)  Certification: CE, FCC pending Figure 5 shows the block diagram of the radio module deRFmega256-23M10. ATmega256RFR2Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC1.8V to 3.6VWatch crystal32.768kHzSPITWIADCGPIORFout Figure 5: Block diagram deRFmega256-23M10
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 12 of 69 3.6. deRFmega256-23M12 The radio module deRFmega256-23M12 offers the following features:  Tiny size: 21.5 x 13.2 x 3.0 mm  59 LGA pads 0.6 x 0.6 mm  Supply voltage 2.0 V to 3.6 V  Antenna diversity support  RF shielding  Onboard 32.768 kHz crystal (Deep-Sleep clock) and  16 MHz crystal  Application interfaces: 2x UART, 1x TWI  GPIO interface  Debug/Programming interfaces: 1x SPI, 1x JTAG, 1x ISP  2.4 GHz front-end module with internal 20 dB PA and LNA  Solderable 2.4 GHz RF output pad (2x RFOUT, 6x RFGND)  Certification: CE, FCC pending Figure 6 shows the block diagram of the radio module deRFmega256-23M12. ATmega256RFR2Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC2.0V to 3.6VWatch crystal32.768kHzSPITWIADCGPIO2.4GHz Front-End RFout 1RFout 2RFControl Figure 6: Block diagram deRFmega256-23M12
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 13 of 69 4. Technical data Table 4-1: Mechanical data Mechanical Radio modules Size (L x W x H) 23.6 x 13.2 x 3.0 mm (for 22M00 and 23M00) 19.0 x 13.2 x 3.0 mm (for 22M10 and 23M10) 21.5 x 13.2 x 3.0 mm (for 22M12 and 23M12) Pads Type LGA Pitch 1.60 mm Pad size 0.6 x 0.6 mm Table 4-2: Temperature range Temperature range Parameter Min Typ Max Unit Operating temperature range Twork -40 +85 °C Humidity 25 80 % r.H. Storage temperature range Tstorage -40 +125 °C Table 4-3: Electrical characteristics for deRFmega128 series Electrical characteristics deRFmega128-22M00 and deRFmega128-22M10 Parameter Min Typ Max Unit Supply Voltage VCC 1.8 3.3 3.6 V Current consumption ITXon (TX_PWR = +3 dBm) 17.8 18.1 18.2 mA ITxon (TX_PWR = 0 dBm) 16.2 16.4 16.5 mA ITxon (TX_PWR = -17 dBm) 12.5 12.7 12.7 mA IRXon 17.5 17.6 17.7 mA IIdle (Txoff, MCK = 8MHz) 4.7 4.8 4.8 mA ISleep (depends on Sleep Mode) <1 µA
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 14 of 69 deRFmega128-22M12 Parameter Min Typ Max Unit Supply Voltage VCC 2.0 3.3 3.6 V Current consumption ITXon (TX_PWR = +20 dBm) 119.4 197.7 205.2 mA ITXon (TX_PWR = +4 dBm) 27.0 46.1 46.7 mA IRXon 19.8 22.5 22.8 mA IIdle (Txoff, MCK = 8 MHz) 5.2 5.4 5.6 mA ISleep (depends on Sleep Mode) <1 µA Table 4-4: Electrical characteristics for deRFmega256 series Electrical deRFmega256-23M00 and deRFmega256-23M10 Parameter Min Typ Max Unit Supply Voltage VCC 1.8 3.3 3.6 V Current consumption ITXon (TX_PWR = +3.5 dBm) 18.2 18.8 19.1 mA ITXon (TX_PWR = +0.5 dBm) 16.3 16.5 16.7 mA ITXon (TX_PWR = -16.5 dBm) 11.2 11.8 12.1 mA IRXon 15.9 16.3 16.5 mA IRXon (RPC mode) 10.4 10.7 11.0 mA IIdle (Txoff, MCK = 8MHz) 4.3 4.8 5.1 mA ISleep (depends on Sleep Mode) <2 µA deRFmega256-23M12 Parameter Min Typ Max Unit Supply Voltage VCC 2.0 3.3 3.6 V Current consumption ITXon (TX_PWR = +20 dBm) 139.6 232.5 243.5 mA ITXon (TX_PWR = +4 dBm) 27.7 48.8 49.7 mA IRXon 19.0 22.4 22.3 mA IRXon (RPC mode) 13.5 16.7 18.0 mA IIdle (Txoff, MCK = 8 MHz) 4.6 5.1 5.4 mA ISleep (depends on Sleep Mode) <2 µA
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 15 of 69 Table 4-5: Quartz crystal properties Quartz crystal Parameter Min Typ Max Unit Watch crystal Frequency 32.768 kHz Frequency tolerance +/-20 ppm Transceiver crystal Frequency 16.000 MHz Frequency tolerance +/-10 ppm Table 4-6: Radio data of deRFmega128-22M00 and deRFmega128-22M10 Radio 2.4 GHz (Supply voltage VCC = 3.3V) Parameter / feature Min Typ Max Unit Antenna Type Chip ceramic Gain -0.7 dBi Diversity No RF Pad Impedance 50 Ω Range Line of sight TBD m Frequency range1 PHY_CC_CCA = 0x0B...0x1A 2405 2480 MHz Channels PHY_CC_CCA = 0x0B...0x1A 16 Transmitting power conducted TX_PWR = 0x00 VCC = 3.3V 2.3 2.9 dBm Receiver sensitivity Data Rate = 250 kBit/s Data Rate = 500 kBit/s Data Rate = 1000 kBit/s Data Rate = 2000 kBit/s -98 -94 -91 >-80 dBm dBm dBm dBm Data rate (gross) TRX_CTRL_2 = 0x00 TRX_CTRL_2 = 0x01 TRX_CTRL_2 = 0x02 TRX_CTRL_2 = 0x03 250 500 1000 2000 kBit/s kBit/s kBit/s kBit/s EVM conducted 6.5 7.5 10.5 % 1 Operating the transmitter at channel 11 to 25 requires a duty cycle ≤35% and channel 26 requires a duty cycle ≤15% to fulfil all requirements according to FCC Part 15 Subpart C § 15.209.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 16 of 69 Table 4-7: Radio data of deRFmega128-22M12 Radio (Supply voltage VCC = 3.3V) Parameter / feature Min Typ Max Unit RF pad Impedance 50 Ω Diversity Yes Range TBD m Frequency range 2405 2480 MHz Channels 16 Transmitting power conducted2,3 TX_PWR = 0x00 VCC = 3.3V 21.4 21.9 22.4 dBm Receiver sensitivity Data Rate = 250 kBit/s Data Rate = 500 kBit/s Data Rate = 1000 kBit/s Data Rate = 2000 kBit/s -105 -100 -98 -91 dBm dBm dBm dBm Data rate (gross) TRX_CTRL_2 = 0x00 TRX_CTRL_2 = 0x01 TRX_CTRL_2 = 0x02 TRX_CTRL_2 = 0x03 250 500 1000 2000 kBit/s kBit/s kBit/s kBit/s EVM conducted 6.5 7.5 9.5 % Table 4-8: Radio data of deRFmega256-23M00 and deRFmega256-23M10 Radio 2.4 GHz (Supply voltage VCC = 3.3V)4 Parameter / feature Min Typ Max Unit Antenna Type Chip ceramic Gain -0.7 dBi Diversity No RF Pad Impedance 50 Ω Range Line of sight TBD m Frequency range5 PHY_CC_CCA = 0x0B...0x1A 2405 2480 MHz 2 Only applicable for EU: The maximum allowed TX_PWR register setting of deRFmega128-22M12 is TX_PWR = 0x0E. According to EN 300 328 clause 4.3.1 the maximum transmit power is restricted to a limit of +10dBm. 3 Only applicable for US: Operating the transmitter at channel 11, 12, 13, 23, 24, 25 and 26 requires to ensure a reduced output power and/or duty cycle limit to fulfil all requirements according to FCC Part 15 Subpart C § 15.209. See chapter 4.3. 4 Values are not validated.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 17 of 69 Parameter / feature Min Typ Max Unit Channels PHY_CC_CCA = 0x0B...0x1A 16 Transmitting power conducted TX_PWR = 0x00 VCC = 3.3V 3.6 3.7 3.8 dBm Receiver sensitivity Data Rate = 250 kBit/s Data Rate = 500 kBit/s Data Rate = 1000 kBit/s Data Rate = 2000 kBit/s -99 -95 -93 -87 dBm dBm dBm dBm Data rate (gross) TRX_CTRL_2 = 0x00 TRX_CTRL_2 = 0x01 TRX_CTRL_2 = 0x02 TRX_CTRL_2 = 0x03 250 500 1000 2000 kBit/s kBit/s kBit/s kBit/s EVM conducted ~8 % Table 4-9: Radio data of deRFmega256-23M12 Radio (Supply voltage VCC = 3.3V)6 Parameter / feature Min Typ Max Unit RF pad Impedance 50 Ω Diversity Yes Range TBD m Frequency range 2405 2480 MHz Channels 16 Transmitting power conducted7,8 TX_PWR = 0x00 VCC = 3.3V 22.2 22.5 22.8 dBm Receiver sensitivity Data Rate = 250 kBit/s Data Rate = 500 kBit/s Data Rate = 1000 kBit/s Data Rate = 2000 kBit/s -105 -101 -99 -94 dBm dBm dBm dBm 5 Operating the transmitter at channel 26 requires a duty cycle ≤25% to fulfil all requirements according to FCC Part 15 Subpart C § 15.209. 6 Values are not validated. 7 Only applicable for EU: The maximum allowed TX_PWR register setting of deRFmega128-22M12 is TX_PWR = 0x0E. According to EN 300 328 clause 4.3.1 the maximum transmit power is restricted to a limit of +10dBm. 8 Only applicable for US: Operating the transmitter at channel 11, 12, 13, 23, 24, 25 and 26 requires to ensure a reduced output power and/or duty cycle limit to fulfil all requirements according to FCC Part 15 Subpart C § 15.209. See chapter 4.3.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 18 of 69 Data rate (gross) TRX_CTRL_2 = 0x00 TRX_CTRL_2 = 0x01 TRX_CTRL_2 = 0x02 TRX_CTRL_2 = 0x03 250 500 1000 2000 kBit/s kBit/s kBit/s kBit/s EVM conducted ~7 %
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 19 of 69 4.1. TX Power register settings for deRFmega128-22M00 and 22M10 The diagrams in Figure 7 and Figure 8 are showing the current consumption and conducted output power during transmission depending on the TX_PWR register setting. The values are valid for deRFmega128-22M00 and 22M10. Figure 7: TX Idd vs. TX_PWR for deRFmega128-22M00 / 22M10 Figure 8: TX Pout vs. TX_PWR for deRFmega128-22M00 / 22M10
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 20 of 69 4.2. TX Power register settings for deRFmega128-22M12 The diagrams in Figure 9 and Figure 10 showing the current consumption and conducted output power during transmission depending on the TX_PWR register setting. The values are valid for deRFmega128-22M12. Figure 9: TX Idd vs. TX_PWR for deRFmega128-22M12 Figure 10: TX Pout vs. TX_PWR for deRFmega128-22M12
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 21 of 69 4.3. TX Power register settings for deRFmega256-23M00 and 23M10 The diagrams in Figure 11 and Figure 12 are showing the current consumption and conducted output power during transmission depending on the TX_PWR register setting. The values are valid for deRFmega256-23M00 and 23M10. Figure 11: TX Idd vs. TX_PWR for deRFmega256-23M00 / 23M10 Figure 12: TX Pout vs. TX_PWR for deRFmega256-23M00 / 23M10
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 22 of 69 4.4. TX Power register settings for deRFmega256-23M12 The diagrams in Figure 13 and Figure 14 showing the current consumption and conducted output power during transmission depending on the TX_PWR register setting. The values are valid for deRFmega256-23M12. Figure 13: TX Idd vs. TX_PWR for deRFmega256-23M12 Figure 14: TX Pout vs. TX_PWR for deRFmega256-23M12
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 23 of 69 4.5. Output power and duty cycle settings for power amplified radio modules The radio modules deRFmega128-22M12 and deRFmega256-23M12 are able to provide an output power greater than 20dBm. Table 4-10 defines the necessary power settings of the TX_PWR register [1] and [2], which must be set to fulfill all national requirements of Europe (EN 300 328) and USA (CFR 47 Ch. I FCC Part 15). The duty cycle defines the relationship between the radio-on time and the period of 100ms. Table 4-10: power table for deRFmega128-22M12 Device deRFmega128-22M12 deRFmega256-23M12 Channel ETSI FCC ETSI FCC TX_PWR [hex] Duty Cycle [%] TX_PWR [hex] Duty Cycle [%] TX_PWR [hex] Duty Cycle [%] TX_PWR [hex] Duty Cycle [%] 11 0xE 100 0xB 100 0xF 100 0xD 100 12 0xE 100 0x2 100 0xF 100 0x8 100 13 0xE 100 0x1 100 0xF 100 0x4 100 14 0xE 100 0x0 100 0xF 100 0x4 100 15 0xE 100 0x0 100 0xF 100 0x4 100 16 0xE 100 0x0 100 0xF 100 0x4 100 17 0xE 100 0x0 100 0xF 100 0x4 100 18 0xE 100 0x0 100 0xF 100 0x4 100 19 0xE 100 0x0 100 0xF 100 0x4 100 20 0xE 100 0x0 100 0xF 100 0x4 100 21 0xE 100 0x0 100 0xF 100 0x4 100 22 0xE 100 0x0 100 0xF 100 0x4 100 23 0xE 100 0x6 100 0xF 100 0xA 100 24 0xE 100 0xD 100 0xF 100 0xD 100 25 0xE 100 0xF 100 0xF 100 0xF 100 26 0xE 100 0xF 25 0xF 100 0xF 25
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 24 of 69 5. Mechanical size The following section show the mechanical dimensions of the different radio modules. All distances are given in millimeters. 5.1. deRFmega128-22M00 and deRFmega256-23M00 The module has a size of 23.6 x 13.2 mm and a height of 3.0 mm. The LGA pads are arranged in a double row design. Figure 15 shows the details from top view. Figure 15: Module dimension and signal pads geometry (top view)
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 25 of 69 5.2. deRFmega128-22M10 and deRFmega256-23M10 The module has a size of 19.0 x 13.2 mm and a height of 3.0 mm. The LGA pads are arranged in a double row design. The RF pads consist of three ground pads and one signal pad. Figure 16 and Figure 17 shows the details from top view. Figure 16: Module dimension and signal pad geometry (top view) Figure 17: RF pad geometry (top view)
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 26 of 69 5.3. deRFmega128-22M12 and deRFmega256-23M12 The module has a size of 21.5 x 13.2 mm and a height of 3.0 mm. The LGA pads are designed in a zigzag structure. The RF pads consist of six ground pads and two signal pads. Figure 18 and Figure 19 show the details from top view. Figure 18: Module dimension and signal pad geometry (top view) Figure 19: RF pad geometry de (top view)
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 27 of 69 6. Soldering profile Table 6-1 shows the recommended soldering profile for the radio modules. Table 6-1: Soldering Profile Profile Feature Values Average-Ramp-up Rate (217°C to Peak) 3°C/s max Preheat Temperature 175°C ±25°C 180 s max Temperature Maintained Above 217°C 60 s to 150 s Time within 5°C of Actual Peak Temperature 20 s to 40 s Peak Temperature Range 260°C Ramp-down Rate 6°C/s max Time 25°C to Peak Temperature 8 min max Figure 20 shows a recorded soldering profile for a radio module. The blue colored line illustrates a temperature sensor placed next to the soldering contacts of the radio module. The pink line shows the set temperatures depending on the zone within the reflow soldering machine. 406080100120140160180200220240260280020406080100120140160180200220240260280300320340360t [s]T [°C]Measured Temp. Zone Temp.Figure 20: Recorded soldering profile A solder process without supply of nitrogen causes a discoloration of the metal RF-shielding. It is possible that the placed label shrinks due the reflow process.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 28 of 69 7. Pin assignment The LGA pads provide all signals to the customer: power supply, peripheral, programming, debugging, tracing, analog measurement, external front-end control, antenna diversity control and free programmable ports. All provided signals except VCC, DGND, RSTN, RSTON, AREF, AVDDOUT and CLKI are free programmable port pins (GPIO). 7.1. Signals of deRFmega128-22M00 and deRFmega256-23M00 The radio modules deRFmega128-22M00 and deRFmega256-23M00 have 51 LGA pads. The ‘1’ marking is shown in Figure 22. Consider that the pin numbering in Figure 23 is shown from top view. All available LGA pads are listed in Table 7-1. Figure 21: deRFmega128-22M00 (top view) Figure 22: deRFmega128-22M00 (bottom view) Figure 23: Pad numbering and signal names (top view) pad 1 Antenna
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 29 of 69 Table 7-1: I/O port pin to LGA pad mapping for deRFmega128-22M00 and deRFmega256-23M00 I/O port pin mapping LGA Pad MCU Pin Primary function Alternate functions Comments GND 2 - VCC 1.8 V to 3.6 V 3 11 TST Must be connected to GND! 4 12 RSTN Reset 5 13 RSTON Reset output 6 14 PG0 DIG3 7 15 PG1 DIG1 8 16 PG2 AMR 9 19 PG5 OC0B 10 53 PE7 ICP3 INT7 CLKO 11 52 PE6 T3 INT6 Timer3 12 28 PD3 TXD1 INT3 UART1 13 27 PD2 RXD1 INT2 UART1 14 33 CLKI External clock input 15 32 PD7 T0 16 25 PD0 SCL INT0 TWI 17 26 PD1 SDA INT1 TWI 18 30 PD5 XCK1 19 31 PD6 T1 Timer1 20 36 PB0 SS PCINT0 SPI 21 38 PB2 MOSI PDI PCINT2 SPI, ISP 22 37 PB1 SCK PCINT1 SPI 23 39 PB3 MISO PDO PCINT3 SPI, ISP 24 40 PB4 OC2A PCINT4 25 41 PB5 OC1A PCINT5 26 42 PB6 OC1B PCINT6 27 43 PB7 OC0A OC1C PCINT7 28 46 PE0 RXD0 PCINT8 UART0 29 47 PE1 TXD0 UART0 30 48 PE2 XCK0 AIN0 UART0 31 - GND
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 30 of 69 32 49 PE3 OC3A AIN1 33 5 PE4 OC3B INT4 34 51 PE5 OC3C INT5 35 - NC Leave unconnected 36 - NC Leave unconnected 37 29 PD4 ICP1 38 60 AVDDOUT Leave unconnected if unused (1.8V TRX Voltage Output) Internal 1uF capacitor 39 62 AREF No internal capacitor assambled 40 63 PF0 ADC0 ADC 41 64 PF1 ADC1 ADC 42 1 PF2 ADC2 DIG2 ADC 43 2 PF3 ADC3 DIG4 44 - GND 45 6 PF7 ADC7 TDI JTAG 46 5 PF6 ADC6 TDO JTAG 47 4 PF5 ADC5 TMS JTAG 48 3 PF4 ADC4 TCK JTAG 49 - GND 50 - VCC 1.8 V to 3.6 V 51 - GND Note: PG4/TOSC1 and PG3/TOSC2 are connected to a 32.768 kHz crystal internally.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 31 of 69 7.2. Signals of deRFmega128-22M10 and deRFmega256-23M10 The radio modules deRFmega128-22M10 and deRFmega256-23M10 have 55 LGA pads. The ‘1’ marking is shown in Figure 25. Consider that the pin numbering in Figure 26 is shown from top view. All LGA pads are listed in Table 7-2. Figure 24: deRFmega128-22M10 (top view) Figure 25: deRFmega128-22M10 (bottom view) Figure 26: Pad numbering and signal names (top view) pad 1 RFOUT
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 32 of 69 Table 7-2: I/O port pin to LGA pad mapping for deRFmega128-22M10 and deRFmega256-23M10 I/O port pin mapping LGA Pad MCU Pin Primary function Alternate functions Comments 1 - GND 2 - VCC 1.8 V to 3.6 V 3 11 TST Must be connected to GND! 4 12 RSTN Reset 5 13 RSTON Reset output 6 14 PG0 DIG3 External Front-End control 7 15 PG1 DIG1 External diversity control 8 16 PG2 AMR 9 19 PG5 OC0B 10 53 PE7 ICP3 INT7 CLKO 11 52 PE6 T3 INT6 Timer3 12 28 PD3 TXD1 INT3 UART1 13 27 PD2 RXD1 INT2 UART1 14 33 CLKI External clock input 15 32 PD7 T0 16 25 PD0 SCL INT0 TWI 17 26 PD1 SDA INT1 TWI 18 30 PD5 XCK1 19 31 PD6 T1 Timer1 20 36 PB0 SS PCINT0 SPI 21 38 PB2 MOSI PDI PCINT2 SPI, ISP 22 37 PB1 SCK PCINT1 SPI 23 39 PB3 MISO PDO PCINT3 SPI, ISP 24 40 PB4 OC2A PCINT4 25 41 PB5 OC1A PCINT5 26 42 PB6 OC1B PCINT6 27 43 PB7 OC0A OC1C PCINT7 28 46 PE0 RXD0 PCINT8 UART0 29 47 PE1 TXD0 UART0 30 48 PE2 XCK0 AIN0 UART0 31 - GND
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 33 of 69 32 49 PE3 OC3A AIN1 33 5 PE4 OC3B INT4 34 51 PE5 OC3C INT5 35 - NC Leave unconnected 36 - NC Leave unconnected 37 29 PD4 ICP1 38 60 AVDDOUT Leave unconnected if unused (1.8V TRX Voltage Output) Internal 1uF capacitor 39 62 AREF No internal capacitor assambled 40 63 PF0 ADC0 ADC 41 64 PF1 ADC1 ADC 42 1 PF2 ADC2 DIG2 ADC 43 2 PF3 ADC3 DIG4 External Front-End control 44 - GND 45 6 PF7 ADC7 TDI JTAG 46 5 PF6 ADC6 TDO JTAG 47 4 PF5 ADC5 TMS JTAG 48 3 PF4 ADC4 TCK JTAG 49 - GND 50 - VCC 1.8 V to 3.6 V 51 - GND 52 - RFGND 53 - RFOUT 50 Ω impedance 54 - RFGND 55 - RFGND Note: PG4/TOSC1 and PG3/TOSC2 are internally connected to a 32.768 kHz crystal.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 34 of 69 7.2.1. External front-end and antenna diversity control The radio modules deRFmega128-22M10 and deRFmega256-23M10 offer the possibility to control external front-end components and to support antenna diversity. Table 7-3 and Table 7-4 show the logic values of the control signals. A logic ‘0’ is specified with a voltage level of 0 V to 0.3 V. A logic ‘1’ is specified with a value of VCC - 0.3 V to 3.6 V. An application circuit is shown in Section 10.5. Antenna Diversity The antenna diversity algorithm is enabled with setting bit ANT_DIV_EN=1 in the ANT_DIV register. The external control of RF switches must be enabled by bit ANT_EXT_SW_EN of the same register. This action will configure the pins DIG1 and DIG2 as outputs. Both pins are used to feed the RF switch signal and its inverse to the differential inputs of the RF switch. Please refer to ATmega128RFA1 [1] and ATmega256RFR2 [2] datasheet to get information to all register settings. Table 7-3: Antenna diversity control Mode description PG1/DIG1 PF2/DIG2 TRX off Sleep mode Disable register bit ANT_EXT_SW_EN and set port pins DIG1 and DIG2 to output low via I/O port control registers. This action could reduce the power consumption of an external RF switch. ANT0 1 0 ANT1 0 1 Front-End The control of front-end components can be realized with the signals DIG3 and DIG4. The function will be enabled with bit PA_EXT_EN of register TRX_CTRL_1 which configures both pins as outputs. While transmission is turned off DIG3 is set to ‘0’ and DIG4 is set to ‘1’. When the transceiver starts transmission the polarity will be changed. Both pins can be used to control PA, LNA and RF switches. Please refer to ATmega128RFA1 [1] and ATmega256RFR2 [2] datasheet to get information to all register settings. Table 7-4: Front-end control PG0/DIG3 PF3/DIG4 TRX off Sleep mode Disable register bit PA_EXT_EN and set port pins DIG3 and DIG4 to output low via I/O port control registers. This action may reduce the power consumption of external front-end devices. TRX off 0 1 TRX on 1 0 Sleep mode To optimize the power consumption of external front-end components, it is possible to use a dedicated GPIO to set the PA into sleep mode, if applicable or to switch an additionally MOSFET, which supplies the PA.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 35 of 69 7.3. Signals of deRFmega128-22M12 and deRFmega256-23M12 The radio modules deRFmega128-22M12 and deRFmega256-23M12 have 59 LGA pads. The ‘1’ marking is shown in Figure 28. Consider that the pin numbering in Figure 29 is shown from top view. All LGA pads are listed in Table 7-5. Figure 27: deRFmega128-22M12 (top view) Figure 28: deRFmega128-22M12 (bottom view) Figure 29: Pad numbering and signal names (top view) pad 1 RFOUT10 RFOUT2
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 36 of 69 Table 7-5: I/O port pin to LGA pad mapping for deRFmega128-22M12 and deRFmega256-23M12 I/O port pin mapping LGA Pad MCU Pin Primary function Alternate functions Comments 1 - GND 2 - VCC 2.0 V to 3.6 V 3 11 TST Must be connected to GND! 4 12 RSTN Reset 5 13 RSTON Reset output 6 14 PG0 DIG3 Leave unconnected Internal connected to PA-CTX9 7 15 PG1 DIG1 Leave unconnected Internal connected to PA-ANTSEL9 8 16 PG2 AMR 9 19 PG5 OC0B 10 53 PE7 ICP3 INT7 CLKO 11 52 PE6 T3 INT6 Timer3 12 28 PD3 TXD1 INT3 UART1 13 27 PD2 RXD1 INT2 UART1 14 33 CLKI External clock input 15 32 PD7 T0 16 25 PD0 SCL INT0 TWI 17 26 PD1 SDA INT1 TWI 18 30 PD5 XCK1 19 31 PD6 T1 Leave unconnected Internal connected to PA-CSD9 20 36 PB0 SS PCINT0 SPI 21 38 PB2 MOSI PDI PCINT2 SPI, ISP 22 37 PB1 SCK PCINT1 SPI 23 39 PB3 MISO PDO PCINT3 SPI, ISP 24 40 PB4 OC2A PCINT4 25 41 PB5 OC1A PCINT5 26 42 PB6 OC1B PCINT6 27 43 PB7 OC0A OC1C PCINT7 28 46 PE0 RXD0 PCINT8 UART0 9 See Section 7.3.1
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 37 of 69 29 47 PE1 TXD0 UART0 30 48 PE2 XCK0 AIN0 UART0 31 - GND 32 49 PE3 OC3A AIN1 33 5 PE4 OC3B INT4 34 51 PE5 OC3C INT5 35 - NC Leave unconnected 36 - NC Leave unconnected 37 29 PD4 ICP1 38 60 AVDDOUT Leave unconnected if unused (1.8V TRX Voltage Output) Internal 1uF capacitor 39 62 AREF No internal capacitor assambled 40 63 PF0 ADC0 ADC 41 64 PF1 ADC1 ADC 42 1 PF2 ADC2 DIG2 Leave unconnected 43 2 PF3 ADC3 DIG4 Leave unconnected 44 - GND 45 6 PF7 ADC7 TDI JTAG 46 5 PF6 ADC6 TDO JTAG 47 4 PF5 ADC5 TMS JTAG 48 3 PF4 ADC4 TCK JTAG 49 - GND 50 - VCC 2.0 V to 3.6 V 51 - GND 52 - RFGND 53 - RFOUT2 50 Ω impedance* 54 - RFGND 55 - RFGND 56 - RFGND 57 - RFOUT1 50 Ω impedance* 58 - RFGND 59 - RFGND Note: PG4/TOSC1 and PG3/TOSC2 are internally connected to a 32.768 kHz crystal. *) If one of both RFOUT pads of the radio modules deRFmega128-22M12 / 23M12 is unused, it must be terminated with 50 ohms to ground. This action ensures the proper function of the internal power amplifier and will reduce the power consumption.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 38 of 69 7.3.1. Internal front-end control The front-end of deRFmega128-22M12 and deRFmega256-23M12 have an internal PA for transmit and a LNA for receive mode. An additionally antenna diversity feature is usable to select the antenna with the best link budget. The front-end control includes three MCU port pins (Figure 30). They are used to choose the TX/RX antenna, de-/activate transmit and receive mode and de-/activate the sleep mode. Table 7-6 and Table 7-7 show the logic values. A logic ‘0’ is specified with a voltage level of 0 V to 0.3 V. A logic ‘1’ is specified with a value of VCC - 0.3 V to 3.6 V. The control signals DIG1, DIG3 and PD6 are available on the LGA pins. Table 7-6: Front-end control of TX/RX and sleep mode Mode description PG1/DIG1 PD6/T1 PG0/DIG3 PA_ANT SEL PA_CSD PA_CTX All off (sleep mode) X 0 0 RX LNA mode X 1 0 TX mode X 1 1 Table 7-7: Front-end control of TX/RX antenna Mode description PG1/DIG1 PD6/T1 PG0/DIG3 PA_ANT SEL PA_CSD PA_CTX RFOUT1 port enabled 0 X X RFOUT2 port enabled 1 X X ATmega128RFA1Transceiver crystal16MHz [+/-10ppm]JTAGUARTVCC2.0V to 3.6VWatch crystal32.768kHzSPITWIADCGPIO RFout 1RFout 2RFDIG1PD6DIG3ANT SELPALNATX/RXSleep Figure 30: Block diagram of front-end functionality and control Note: Do not leave any unused RFOUT pad unterminated! Leave pins DIG1, DIG2, DIG3, DIG4 and PD6 unconnected to ensure the proper front-end functionality!
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 39 of 69 7.4. Signal description The available signals are described in Table 7-8. Please refer to ATmega128RFA1 [1] and ATmega256RFR2 [2] datasheet for more information of all dedicated signals. Table 7-8: Signal description list Signal name Function Type Active Level Comments Power VCC Voltage Regulator Power Supply Input Power GND Ground Clocks and Oscillators CLKI External Clock Input Input CLKO Divided System Clock Output Output JTAG TCK Test Clock Input No pull-up resistor on module TDI Test Data In Input No pull-up resistor on module TDO Test Data Out Output TDM Test Mode Select Input No pull-up resistor on module Serial Programming PDI Data Input Input PDO Data Output Output SCK Serial Clock Input Reset RSTN Microcontroller Reset I/O Low Pull-Up resistor10 USART TXD0 – TXD1 Transmit Data RXD0 – RXD1 Receive Data XCK0 – XCK1 Serial Clock Timer/Counter and PWM Controller OC0A-OC3A Output Compare and PWM Output A for Timer/Counter 0 to 3 OC0B-OC3B Output Compare and PWM Output B for Timer/Counter 0 to 3 10 Internal MCU Pull-up resistor
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 40 of 69 OC0C-OC3C Output Compare and PWM Output C for Timer/Counter 0 to 3 T0, T1, T3 Timer/Counter 0,1,3 Clock Input Input ICP1 ICP3 Timer/Counter Input Capture Trigger 1 and 3 Input Interrupt PCINT0 - PCINT7 Pin Change Interrupt Source 0 to 7 Output INT0 – INT7 External Interrupt Input 0 to7 Input SPI MISO SPI Master In/Slave Out I/O MOSI SPI Master Out/Slave In I/O SCK SPI Bus Serial Clock I/O SSN SPI Slave Port Select I/O Two-Wire-Interface SDA Two-Wire Serial Interface Data I/O No pull-up resistor11 SCL Two-Wire Serial Interface Clock I/O No pull-up resistor11 Analog-to-Digital Converter ADC0 – ADC7 Analog to Digital Converter Channel 0 to 7 Analog AREF Analog Reference Analog AVDDOUT 1.8V Regulated Analog Supply Voltage Output from Transceiver Analog Analog Comparator AIN0 Analog Comparator Positive Input Analog AIN1 Analog Comparator Negative Input Analog Radio Transceiver DIG1/DIG2 Antenna Diversity Control Output Output Set to output by register command DIG3/DIG4 External Front-End control Output 11 External 4k7 pull-up resistors necessary for proper Two-Wire-Interface functionality
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 41 of 69 8. PCB design The PCB design of a radio module base board is important for a proper performance of peripherals and the radio. The next subsections give design hints to create a custom base board. 8.1. Technology The described design has the main goal to use standard PCB technology to reduce the costs and cover a wider application range. Design parameters  150 µm manufacturing process  4 layer PCB with FR4 Prepreg  No via plugging  Via hole size: 0.2 mm  Via diameter: 0.6 mm 8.2. Base board footprint The footprint for a custom base board depends on the radio module used. The mechanical dimensions are shown in Section 5. The following part describes an example to design a base board. Properties of stencil and solder paste  Stencil = 130 µm thickness  Lead free solder paste (particle size from 20 to 38 µm) Properties of signal pads  Signal pad dimension = 0.6 x 0.6 mm (rectangular, red)  Signal pad cut-out on stencil = 0.6 x 0.6 mm (rectangular, grey)  Clearance to solder stop = 0.1 mm (purple) Figure 31: Signal pad footprint design Properties of RF pads  RF ground pad dimension = 1.6 x 0.5 mm (round, red)  RF ground pad cut-out on stencil = 1.3 x 0.2 mm (round, grey)  RF signal-out pad dimension = 0.6 x 0.6 mm (round, red)  RF signal-out pad cut-out on stencil = 0.6 x 0.6 mm (round, grey)  Clearance to solder stop = 0.1 mm (purple)
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 42 of 69 Figure 32: RF pad footprint design (top view) 8.2.1. Footprint of deRFmega128-22M00 and deRFmega256-23M00 Figure 33 shows an exemplary base board footprint for deRFmega128-22M00 and deRFmega256-23M00. Only the top layer (red) is visible. The mid and bottom layers are hidden. The rectangular signal pad copper area (red, not visible) and the paste dimension (grey) have the same size of 0.6 x 0.6 mm. The solder stop clearance (purple) has a value of 0.1 mm. Do not place copper on any other area among the entire module. Solder stop could be used everywhere. Figure 33: Exemplary base board footprint for 22M00 / 23M00 (top view)
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 43 of 69 8.2.2. Footprint of deRFmega128-22M10 and deRfmega256-23M10 The exemplary base board footprint for deRFmega128-22M10 and deRFmega256-23M10 is shown in Figure 34. The top layer (red) is visible, the mid and bottom layers are hidden. The rectangular signal pad copper area (red, not visible) and the paste dimension (grey) have the same size of 0.6 x 0.6 mm. The solder stop clearance (purple) has a value of 0.1 mm. The RF ground pads are connected to each other and to the board ground to ensure a proper ground area. For the most applications it is not necessary to separate the RF ground from system ground. The RF ground area in Figure 34 has a vertical dimension of 3.8 mm. The ground vias are not plugged. In this area are no other radio module signals. An unintentional short-circuit is therefore accepted. Do not place copper on any other area among the entire module. Solder stop could be used everywhere. The RF trace design depends on the used base board and is described detailed in Section 8.5. Figure 34: Exemplary base board footprint for 22M10 /23M10 (top view)
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 44 of 69 8.2.3. Footprint of deRFmega128-22M12 and deRFmega256-23M12 Figure 35 shows an exemplary base board footprint for deRFmega128-22M12 and deRFmega256-23M12. Only the top layer (red) is visible. The mid and bottom layers are hidden. The pad copper area (red, not visible) and the paste dimension (grey) have the same size of 0.6 x 0.6 mm. The solder stop clearance (purple) has a value of 0.1 mm. The RF ground pads are connected to each other and to the board ground to ensure a proper ground area. For the most applications it is not necessary to separate the RF ground from system ground. The RF ground area in Figure 35 has a vertical dimension of 9.4 mm. The ground vias are not plugged. In this area are no other radio module signals. An unintentional short-circuit is therefore accepted. Do not place copper on any other area among the entire module. Solder stop could be used everywhere. The RF trace design depends on the used base board and is described detailed Section 8.5. Figure 35: Exemplary base board footprint for 22M12 / 23M12 (top view) 8.3. Ground plane The performance of RF applications mainly depends on the ground plane design. The often used chip ceramic antennas are very tiny, but they need a proper ground plane to establish a good radiation pattern. Every board design is different and cannot easily be compared to each other. Some practical notes for the ground plane design are described below:  Regard to the design guideline of the antenna manufacturer  Use closed ground planes on the PCB edges on top and bottom layer  Connect the ground planes with lots of vias. Place it inside the PCB like a chessboard and on the edges very closely.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 45 of 69 8.4. Layers The use of 2 or 4 layer boards have advantages and disadvantages for the design of a custom base board. Table 8-1: 2 and 4 layer board properties in comparison 2 Layer board 4 Layer board (-) only 2 layers available for routing the traces and design a proper ground area (+) 4 layers available for routing the traces and design a proper ground area (-) only 1 layer available for routing the traces under the module (+) 3 layers available for routing the traces under the module (-) no separate VCC plane usable (+) separate VCC plane usable (+) cheaper than 4 layers (-) more expensive than 2 layers TopBottomMid 1Mid 22 Layer 4 LayerModule4 Layer Traces under module:Not allowedallowedallowedallowedTraces under module:Not allowedallowed Figure 36: Layer design of 2 and 4 layer boards
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 46 of 69 8.5. Traces Common signal traces should be designed with these guidelines:  Traces on top layer are not allowed under the module (see Figure 36)  Traces on mid layers and bottom layers are allowed (see Figure 36)  Route traces straight away from module (see Figure 33)  Do not use heat traps of components directly on the RF trace  Do not use 90 degree corners. Better is 45 degree or rounded corners. The trace design for RF signals has a lot of more important points to regard. It defines the trace impedance and therefore the signal reflection and transmission. The most commonly used RF trace designs are Microstrip and Grounded Coplanar Wave Guide (GCPW). The dimension of the trace is depending on the used PCB material, the height of the material to the next ground plane, a PCB with or without a ground plane, the trace width and for GCPW the gap to the top ground plane. The calculation is not trivial, therefore specific literature and web content is available (see [3]) The reference plane to the GCPW should always be a ground area, that means the bottom layer for a 2 layer design and mid layer 1 for a 4 layer design (see Figure 37). Furthermore, it is important to use a PCB material with a known layer stack and relative permittivity. Small differences in the material thickness have a great influence on the trace impedance, especially on 4 layer designs. TopBottomMid 1Mid 22 Layer 4 Layerhg gwg gwhFR4 ≈ 4.3 FR4 ≈ 4.3 Figure 37: GCPW trace design
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 47 of 69 8.6. Placement on the PCB The PCB design of the radio module base board and placement affects the radio characteristic. The radio module with chip antenna should be placed at the edge or side of a base board. The chip antenna should be directed to PCB side. Figure 38: Placing at the edge Figure 39: Placing at the center edge Do not place the chip antenna radio module within the base board. This will effect a very poor radio performance. Instead radio modules with RF pads could be placed everywhere on the PCB. But it should be enough space for routing a RF trace to a coaxial connector or to an onboard antenna. Figure 40: Placing in the center with antenna Figure 41: Placing in the center with RF pad Do not place ground areas below the radio module (see Section 8.4) and near the chip antenna. Figure 42: No ground plane under the module
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 48 of 69 8.7. Reference Design for deRFmega256-23M12 8.7.1. Overview A reference design allows for a fast design-in of radio modules. Following its recommendations the most RF issues become subsidiary. Even with less or no RF experience it will be possible to get an optimal RF performance of a custom design. This reference design description must be respected for the use of deRFmega256-23M12 in the United States and to fulfil the requirements of FCC regulations according to the ‘Transmitter Module Equipment Authorization Guide’ [10]. See chapter 14.1 for further notes of FCC compliance. If the reference design will be integrated into a custom design, it will fulfil the FCC requirements too. The radio module deRFmega256-23M12 was measured and certified on the reference design board named RaspBee (see Figure 43). Further information on this device can be found in chapter 16. All following design descriptions are based on RaspBee. Figure 43: Reference design board (RaspBee) The design guide allows it to create a base board according to the reference board PCB properties. To fulfil the above-mentioned FCC requirements, the RF area of a custom PCB must have the same (design) properties. Any deviation from the reference design will result in a loss of FCC certification of the radio module and the custom design, unless the individual design will be certified again. However re-certification is possible and may be performed as Permissive Change Class II [11]. A partial re-measurement of RF properties is necessary. Note: Please get in contact with us to advise you for a custom FCC certified design. If necessary we will also provide RF part design data.. This may require signing a Non-Disclosure Agreement. The important area of the reference design is the RF part shown in Figure 44. One RF-OUT pad of the radio module is connected to the chip-antenna and the other RF-OUT pad is connected to a coaxial connector or an optional wire-antenna. It is also permitted to use only one of the both RF outputs, if needed. In this case terminate the unused port with 50ohms to ground.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 49 of 69 Figure 44: RF design 8.7.2. PCB design The used standard technology PCB has the following properties:  two-layer board  board material FR4 TG 135  dielectric constant 4.4 to 4.8 at 1 MHz  board thickness of 1.55mm  copper layer thickness of 35µm  top and bottom solder  no silk screen used If the custom board is a multi-layer board, it is possible to leave blank all inner layers within the RF part to get a two-layer board in this area. Figure 45 shows the layer stack as presented by the PCB design tool. Figure 45: PCB Layer stack 8.7.3. RF trace design The RF trace is designed as GCPW (see chapter 8.5) with the following properties:  GCPW width is 0.7mm  GCPW gap is 0.2mm
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 50 of 69 Figure 46 shows the RF traces including their length. The middle traces and matching parts are routed in a 45 degree pitch. The PCB design tool defines a traces as a line with a specified width. However the traces have a round edge unlike the measurement start and end point. If one of the RF traces will not be used, it is necessary to terminate it with 50 ohms to ground. A 49.9 ohms 0402 resistor is applicable. Figure 46: RF trace length All matching parts are shown in Figure 44 and have a 0402 footprint with these dimensions:  Pad width is 0.5mm  Pad length is 0.6mm  Pad center to center distance is 1.1mm Figure 47: Pad design 0402
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 51 of 69 8.7.4. Chip-antenna The used chip-antenna is optimized for being placed at the PCB edge. Its footprint dimensions are shown in Figure 48. Further details of the used antenna can be found in the manufacturer’s datasheets [12]. The used antenna and all matching parts are listed in Table 8-2. Table 8-2: BOM chip antenna BOM – Chip antenna and matching parts ID Value Order code Vendor Comment ANT1 - 2450AT43B100 Johanson Technology C1 - - - Not assembled C13 22pF GRM1555C1H220JZ01D Murata L2 1.5nH HK10051N5S-T Taiyo Yuden Figure 48: Chip antenna footprint
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 52 of 69 8.7.5. Coaxial connector layout The coaxial connector allows the connection of an external antenna. It is only allowed to use the approved antennas as listed in chapter 14.3. Figure 49 shows the connector footprint dimensions. Both coaxial connector and matching parts are listed in Table 8-3. Table 8-3: BOM coaxial connector BOM – Coaxial connector and matching parts ID Value Order code Vendor Comment X2 - U.FL-R-SMT-1(10) Hirose R1 49R9 RC1005F49R9CS Samsung termination resistor if coax not used, otherwise not assembled R2 10k RC10005F1002CS Samsung C2 22pF GRM1555C1H220JZ01D Murata C3 - - - Not assembled Figure 49: Coaxial connector and wire antenna footprint
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 53 of 69 8.7.6. Ground area and vias The ground area is important to ensure a proper RF radiation and antenna characteristic. Both ground planes on top and bottom layer (highlighted in Figure 50 and Figure 51) must be connected together with sufficient vias. The ground planes should not be separated by other signal traces. Figure 50: Top ground Figure 51: Bottom ground
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 54 of 69 9. Clock The radio module contains an onboard 32.768 kHz 20 ppm quartz crystal for the MCU and a 16.000 MHz 10 ppm quartz crystal for the internal transceiver. For optimum RF timing characteristics it is necessary to use a low tolerance crystal. The watch crystal clocks a timer, not the processor. The timer is intended to wake-up the processor periodically.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 55 of 69 10. Application circuits 10.1. UART Two U(S)ART interfaces are available on the radio modules. For communication to a host with a different supply voltage domain it is necessary to use a level-shifter. We recommend the USB level shifter by dresden elektronik. The level-shifter can be connected to the custom base board via 100 mil 2 x 3 pin header. The pin assignment should be designed as below in Figure 52. For an UART connection it is sufficient to use only TXD, RXD and GROUND signals. 1. PE1/TXD0 2. VCC 3. Not connected 4. PE0/RXD0 5. Not connected 6. GND Figure 52: 100 mil 2 x 3 pin header for UART0 10.2. ISP The AVR based radio modules can be programmed via JTAG and ISP interface. For ISP connections a 100 mil 2 x 3 pin header should be used. The pin assignment is given in Figure 53. The MCU ATmega128RFA1 uses the ISP signals PDO and PDI on the same pins like the SPI with MISO and MOSI. We recommend the use of an ‘AVR ISP programmer’. 1. PB3/MISO/PDO 2. VCC 3. PB1/SCK 4. PB2/MOSI/PDI 5. RSTN 6. GND Figure 53: 100 mil 2x3 pin header for ISP 10.3. JTAG The AVR based radio modules can be programmed via JTAG and ISP interface. For JTAG connections a 100 mil 2 x 5 pin header should be used. The pin assignment is given in Figure 54. We recommend the use of ‘Atmel AVR Dragon’ or ‘Atmel JTAG ICE mkII’ programmer. 1. PF4/TCK 2. GND 3. PF6/TDO 4. VCC 5. PF5/TMS 6. RSTN 7. VCC 8. Not connected 9. PF7/TDI 10. GND Figure 54: 100 mil 2x5 pin header for JTAG
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 56 of 69 10.4. TWI The connection of external peripherals or sensors via Two-Wire-Interface is possible by using the TWI clock signal PD0/SCL and TWI data signal PD1/SCA. The necessary pull-up resistors must be placed externally on the base board. We recommend the use of 4.7 kΩ resistors as shown in Figure 55. Figure 55: Two-Wire-Interface
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 57 of 69 10.5. External front-end and antenna diversity The radio module deRFmega128-22M10 and deRFmega256-23M10 can be connected with an external front-end including power amplifier (PA) for transmission and low noise block (LNA) for receiving. Figure 56 shows a possible design as block diagram. A custom design can contain a single PA or single LNA or a complete integrated front-end chip. It depends mainly on the application. Furthermore, it is possible to include a RF switch for driving the antenna diversity feature. deRFmega12822M10VCC1.8V to 3.6VGPIOfor PA on/off PALNARF switch RF switchBPFRFoutANT1ANT2DIG3DIG4DIG1 Figure 56: block diagram for external PA/LNA and antenna diversity control Unbalanced RF output The radio module 22M10 has a 50 Ω unbalanced RF output. For designs with external RF power amplifier a RF switch is required to separate the TX and RX path. RF switches to PA, LNA and antenna The switch must have 50 Ω inputs and outputs for the RF signal. The switch control could be realized with the DIG3 and DIG4 signal of the radio module. Refer to Section 7.2.1 for detailed information. PA The PA has to be placed on the TX path after the RF switch. It is important to regard the PA’s manufacturer datasheet and application notes, especially for designing the power supply and ground areas. A poor design could cause a very poor RF performance. For energy efficiency it is useful to activate the PA only during TX signal transmission. In this case the DIG3 signal can be used as switch for (de-)activating the PA. Some PAs have the possibility to set them into sleep state. This application can be realized via a dedicated GPIO pin. Refer to Section 7.2.1 for more information. BPF The use of a band-pass filter is optional. It depends on the PA properties. Some PAs have an internal BPF and other do not have. The BPF is necessary to suppress spurious emissions of the harmonics and to be compliant with national EMI limits. It is possible to use an integrated BPF part or discrete parts. The advantage of the first variant is that the BPF characteristic is known and published in the manufacturer’s datasheet.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 58 of 69 LNA The LNA could be used to amplify the received signal. Please regard the manufacturer’s datasheet for a proper design. The control could be done by DIG4 signal. Refer to Section 7.2.1 for more information. RF switch for antenna diversity The switch must have 50 Ω inputs and outputs for the RF signal. It is possible to use a separate switch with 2 inputs and 2 outputs or use another (third) switch following the switch required for the PA/LNA. Antenna diversity switching could be controlled via DIG1. Refer to Section 7.2.1 for more information. Certification The customer has to ensure, that custom front-end and antenna diversity designs based on the radio module deRFmega128-22M10 or deRFmega256-23M10 will meet all national regulatory requirements of the assignment location and to have all necessary certifications, device registration or identification numbers. For long range applications we recommend the use of the deRF-mega128-22M12 radio module which already includes PA, LNA, BPF, RF switches and antenna diversity. This module will be provided by dresden elektronik with certified reference designs for EU and US applications that meet all regulatory requirements and reduce custom design costs.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 59 of 69 11. Programming The programming procedures are described in the documentation Fehler! Verweisquelle konnte nicht gefunden werden., which is online available on dresden elektronik webpage. It describes the update process of the radio module, the required software and hardware for programming via JTAG and the driver installation on different operating systems. The firmware programming of deRFmega256 radio modules is supported by Atmel Studio 6. 12. Pre-flashed firmware Actually, the radio modules will be delivered without pre-flashed firmware. 13. Adapter boards dresden elektronik offers these radio modules already soldered on suitable adapter boards. These boards can be plugged into dresden elektronik's development hardware platforms deRFbreakout Board, deRFnode or deRFgateway. For detailed information please refer to the datasheet [5], [6], [7] and [8] of the respective adapter board. Figure 57: deRFmega128-22T00 adapter board with radio module deRFmega128-22M00 / deRFmega256-23M00 Figure 58: deRFmega128-22T02 adapter board with radio module deRFmega128-22M10 / deRFmega256-23M10
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 60 of 69 Figure 59: deRFmega128-22T13 adapter board with radio module deRFmega128-22M12 / deRFmega256-23M12
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 61 of 69 14. Radio certification 14.1. United States (FCC) The deRFmega128-22M00, deRFmega128-22M10, deRFmega128-22M12, deRFmega256-23M00, deRFmega256-23M10 and deRFmega256-23M12 comply with the requirements of FCC part 15. The certification process for deRFmega128-22M10, deRFmega128-22M12, deRFmega256-23M00, deRFmega256-23M10 and deRFmega256-23M12 is pending. To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations: The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following. Any similar wording that expresses the same meaning may be used. Sample label for radio module deRFmega128-22M00: FCC-ID: XVV-MEGA22M00 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Sample label for radio module deRFmega256-23M12: FCC-ID: XVV-MEGA23M12 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment. This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment authorization.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 62 of 69 Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21). This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at their own expense (FCC section 15.105). According to KDB 996369 the radio module deRFmega256-23M12 can only be used with a host antenna circuit trace layout design in strict compliance with the OEM instructions provided in this user manual. 14.2. European Union (ETSI) The deRFmega128-22M00, deRFmega128-22M10, deRFmega128-22M12, deRFmega256-23M00, deRFmega256-23M10 and deRFmega256-23M12 are conform for use in European Union countries. If the deRFmega128-22M00, deRFmega128-22M10, deRFmega128-22M12, deRFmega256-23M00, deRFmega256-23M10 and deRFmega256-23M12 modules are incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and low-voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain a copy of the deRFmega128-22M00, deRFmega128-22M10, deRFmega128-22M12, deRFmega256-23M00, deRFmega256-23M10 and deRFmega256-23M12 modules documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. The CE marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials "CE" taking the following form:  If the CE marking is reduced or enlarged, the proportions must be respected.  The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus.  The CE marking must be affixed visibly, legibly, and indelibly. More detailed information about CE marking requirements can be found in [9]. 14.3. Approved antennas The deRFmega128-22M00 and deRFmega256-23M00 has an integrated chip antenna. The design is fully compliant with all regulations. The certification process is pending for deRFmega256-23M00.
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 63 of 69 The deRFmega128-22M10, deRFmega128-22M12 and deRFmega256-23M10 will be tested with external antennas. The approved antenna list will be updated after certification process has finished. The deRFmega128-22M10 is compliant with the listed approved antennas in Table 14-2. Table 14-1: Approved antenna list Approved antenna(s) for deRFmega128-22M10 Type Gain Mount Order code Vendor 2400 to 2500 MHz Chip ceramic antenna +1.3dBi (peak) SMT 2450AT43B100 Johanson Technology The deRFmega256-23M12 is compliant with the listed approved antennas in Table 14-2. Table 14-2: Approved antenna list Approved antenna(s) for deRFmega256-23M12 Type Gain Mount Order code Vendor 2400 to 2500 MHz Chip ceramic antenna +1.3dBi (peak) SMT 2450AT43B100 Johanson Technology 2400 to 2483.5 MHz Rubber antenna +5dBi (peak) RP-SMA 17013.RSMA WiMo According to KDB 178919 it is allowed to substitute approved antennas through equivalent antennas of the same type: ‘Equivalent antennas must be of the same type (e.g., yagi, dish, etc.), must be of equal or less gain than an antenna previously authorized under the same FCC ID, and must have similar in band and out-of-band characteristics (consult specification sheet for cutoff frequencies).’
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 64 of 69 15. Ordering information The product name includes the following information: deRF xxxx - x x x xxFeaturesForm FactorFlash MemoryFrequency RangeProduct / Chipset Table 15-1: Product name code Product name code Information Code Explanation Comments Product / Chipset mega128 ATmega128RFA1 MCU Mega256 ATmega256RFR2 MCU Frequency Range 2 2.4 GHz Flash memory 2 128 kByte 3 256 kByte Size M OEM module solderable Features 00 chip antenna onboard 10 RFOUT pad 12 Internal front-end, Antenna diversity, 2x RFOUT pads
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 65 of 69 Table 15-2: Ordering information Ordering information Part number Product name Comments BN-034491 deRFmega128-22M00 solderable radio module with onboard chip antenna, no pre-flashed firmware BN-034492 deRFmega128-22M10 solderable radio module with RFOUT pad, no pre-flashed firmware BN-034368 deRFmega128-22M12 solderable radio module with onboard front-end, antenna diversity RFOUT pads, no pre-flashed firmware BN-600011 deRFmega256-23M00 solderable radio module with onboard chip antenna, no pre-flashed firmware BN-600012 deRFmega256-23M10 solderable radio module with RFOUT pad, no pre-flashed firmware BN-600013 deRFmega256-23M12 solderable radio module with onboard front-end, antenna diversity RFOUT pads, no pre-flashed firmware 16. Related products RaspBee The RaspBee is a ZigBee Light Link Addon Board for Raspberry Pi (RPi). This will enhance the application range of RPi with monitoring and controlling ZigBee networks, especially with ZigBee Light Link (ZLL) profile and ZigBee Home Automation (ZHA). ZigBee compatible end-devices and routers from a lot of manufacturers can be added into the network. Find more information about all related products on our webpage www.dresen-elektronik.de
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 66 of 69 17. Packaging dimension Currently the radio modules are delivered as singular pieces with an appropriate ESD packaging. The delivery as Tape & Reel will be possible for larger amounts but is not yet available. Further information will be described in this section as Tape & Reel delivery becomes available. 18. Revision notes Actually, no design issues of the radio modules are known. All errata of the AVR MCU ATmega128RFA1 are described in the datasheet [1]. All errata of the AVR MCU ATmega256RFR2 are described in the datasheet [2].
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 67 of 69 19. References [1] ATmega128RFA1: 8-bit AVR Microcontroller with Low Power 2.4 GHz Transceiver for ZigBee and IEEE802.15.4; Datasheet, URL: http://www.atmel.com [2] ATmega256RFR2: 8-bit AVR Microcontroller with Low Power 2.4 GHz Transceiver for ZigBee and IEEE802.15.4; Datasheet, URL: http://www.atmel.com [3] AppCAD Version 3.0.2, RF & Microwave design software, Agilent Technologies; URL: http://www.hp.woodshot.com [4] User Manual Firmware Update; URL: http://www.dresden-elektronik.de/funktechnik/products/radio-modules/oem-derfmega/description/?L=0&eID=dam_frontend_push&docID=1917 [5] Datasheet adapter board 22T00 | 22T02, URL: http://www.dresden-elektronik.de/funktechnik/products/radio-modules/adapter-boards-oem-modules/description/?L=1%252Fproducts%252Fusb-radio-sticks%252Fderfusb-analyzer%252F%253FL%253D1&eID=dam_frontend_push&docID=1816 [6] Datasheet adapter board 22T13, URL: http://www.dresden-elektronik.de/funktechnik/products/radio-modules/adapter-boards-oem-modules/description/?L=1%252Fproducts%252Fusb-radio-sticks%252Fderfusb-analyzer%252F%253FL%253D1&eID=dam_frontend_push&docID=1818 [7] Datasheet adapter board 23T00 | 23T02, URL: http://www.dresden-elektronik.de/funktechnik/products/radio-modules/adapter-boards-oem-modules/description/?L=1&eID=dam_frontend_push&docID=1859 [8] Datasheet adapter board 23T13, URL: http://www.dresden-elektronik.de/funktechnik/products/radio-modules/adapter-boards-oem-modules/description/?L=1&eID=dam_frontend_push&docID=1861 [9] Directive 1999/5/EC, European Parliament and the Council, 9 March 1999, section 12 [10] Transmitter Module Equipment Authorization Guide; 996369 D01 Module Certification Guide; FCC OET; URL: https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?id=44637&switch=P [11] Permissive Change Policy; 178919 D01 Permissive Change Policy); FCC OET; URL: https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?id=33013&switch=P [12] 2.4GHz Chip-Antenna 2450AT43B100 by JOHANSON TECHNOLOGY; Datasheet; URL: http://www.johansontechnology.com/datasheets/antennas/2450AT43B100.pdf
User Manual Version 1.3 2013-06-10 OEM radio modules deRFmega www.dresden-elektronik.de Page 68 of 69 dresden elektronik ingenieurtechnik gmbh Enno-Heidebroek-Straße 12 01237 Dresden GERMANY Phone +49 351 - 31850 0 Fax +49 351 - 31850 10 Email wireless@dresden-elektronik.de Trademarks and acknowledgements  IEEE 802.15.4™ is a trademark of the Institute of Electrical and Electronics Engineers (IEEE).  ZigBee® is a registered trademark of the ZigBee Alliance.  RaspBee is a registered trademark of dresden elektronik ingenieurtechnik gmbh All trademarks are registered by their respective owners in certain countries only. Other brands and their products are trademarks or registered trademarks of their respective holders and should be noted as such. Disclaimer This note is provided as-is and is subject to change without notice. Except to the extent prohibited by law, dresden elektronik ingenieurtechnik gmbh makes no express or implied warranty of any kind with regard to this guide, and specifically disclaims the implied warranties and conditions of merchantability and fitness for a particular purpose. dresden elektronik ingenieurtechnik gmbh shall not be liable for any errors or incidental or consequential damage in connection with the furnishing, performance or use of this guide. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or any means electronic or mechanical, including photocopying and recording, for any purpose other than the purchaser’s personal use, without the written permission of dresden elektronik ingenieurtechnik gmbh.
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