Users manual
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| Document ID | 3202296 |
| Application ID | sKFH7C8+ucy2c6wETyP0qw== |
| Document Description | Users manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 181.39kB (2267357 bits) |
| Date Submitted | 2016-11-21 00:00:00 |
| Date Available | 2016-11-21 00:00:00 |
| Creation Date | 2016-11-17 19:43:55 |
| Producing Software | Microsoft® Word 2016 |
| Document Lastmod | 2016-11-17 19:43:55 |
| Document Title | R41Z Data Sheet |
| Document Creator | Microsoft® Word 2016 |
| Document Author: | Nick Conroy |
Rigado LLC 3950 Fairview Industrial Dr. Salem, Oregon 97302 866-6-RIGADO modules@rigado.com www.rigado.com/modules R41Z Module for Thread and Bluetooth 4.2 LE The R41Z Module from Rigado is a highly-integrated, ultra-low power module that enables Bluetooth Low Energy and IEEE 802.15.4 connectivity based on the Kinetis KW41Z SoC from NXP Semiconductors. With and ARM® Cortex™ M0+ processor, embedded 2.4GHz transceiver supporting FSK/GFSK and O-QPSK modulations, and integrated antenna, the R41Z provides a complete RF solution with no additional RF design allowing faster time to market. Equipped with the ability to concurrently communicate over Bluetooth and Thread connections, the R41Z offers an unprecedented level of connectivity in a single module. With an internal DC-DC Converter and a wide supply voltage range of 0.9V to 4.2V, the R41Z can be directly powered by sources ranging from single alkaline cells to lithium polymer batteries. 1. Features Based on the NXP Kinetis KW41Z SoC Complete RF solution with integrated antenna Integrated DC-DC converter Arm® Cortex™-M0+ 32-bit processor Serial Wire Debug Over-the-Air (OTA) firmware updates 512kB embedded flash memory 128kb RAM 25 GPIO, 2 dedicated analog pins 16-bit/500KSPS ADC 12-bit DAC -40°C to +105°C Temperature Range Rigado Software Suite 16 Capacitive Touch Sensing Inputs Two SPI Master/Slave (12Mbps) Two I2C Master/Slave UART (w/ CTS/RTS and DMA) Low power comparator Temperature sensor Infrared communication interface Nine low power modes True Random Number Generator 128-bit AES HW encryption 32bit Real-Time Clock (RTC) Wi-Fi coexistence support Dimensions: 10.6 x 16.2 x 2.1mm FCC: 2AA9B07 IC: 12208A-07 Japan: TBD 2. Applications Home/Office/Hotel Automation Low-Power Sensor Networks Home Appliances Lighting Products Climate Control R41Z-DS-V1.0 Environmental Monitoring Home Health Care Safety and Security Access Control Smart Energy Management Page 1 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 3. Ordering Information Email module@rigado.com for quotes and ordering, or visit www.rigado.com/R41Z Part Number R41Z-TA-R R41Z-TA-EVAL Description R41Z module, Rev A, Tape & Reel, 1000 piece multiples R41Z Evaluation Kit with OpenSDA programmer Table 1 - Ordering Part Numbers 4. Block Diagram Figure 1 - Block Diagram R41Z-DS-1.0 Page 2 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Table of Contents 1. FEATURES .................................................................................................................................................. 1 2. APPLICATIONS ........................................................................................................................................... 1 3. ORDERING INFORMATION ......................................................................................................................... 2 4. BLOCK DIAGRAM ....................................................................................................................................... 2 5. QUICK SPECIFICATIONS .............................................................................................................................. 6 6. PIN DESCRIPTIONS ..................................................................................................................................... 7 6.1 R41Z PIN FUNCTIONS ........................................................................................................................................... 7 6.2 RIGDFU PIN FUNCTIONS ....................................................................................................................................... 8 7. ELECTRICAL SPECIFICATIONS ...................................................................................................................... 9 7.1 ABSOLUTE MAXIMUM RATINGS .............................................................................................................................. 9 7.2 OPERATING CONDITIONS ....................................................................................................................................... 9 7.3 DCDC CONVERTER OPERATION .............................................................................................................................. 9 7.3.1 DCDC BYPASS MODE ....................................................................................................................................... 10 7.3.2 DCDC BUCK MODE .......................................................................................................................................... 11 7.3.3 DCDC BOOST MODE ........................................................................................................................................ 12 7.4 GENERAL PURPOSE I/O AND PORTS ....................................................................................................................... 14 7.5 ANALOG I/O AND VREF ...................................................................................................................................... 15 7.5.1 ANALOG SIGNALS AND MAPPING......................................................................................................................... 15 7.5.2 VDDA AND VREF ............................................................................................................................................ 15 7.6 MODULE RESET ................................................................................................................................................. 16 7.7 DEBUG AND PROGRAMMING ................................................................................................................................ 16 7.8 CLOCKS ............................................................................................................................................................ 16 8. FIRMWARE .............................................................................................................................................. 17 8.1 FACTORY IMAGE................................................................................................................................................. 17 8.1.1 FIRMWARE VERSION ‘00’................................................................................................................................... 17 8.2 MAC ADDRESS INFO ........................................................................................................................................... 17 9. MECHANICAL DATA ................................................................................................................................. 18 9.1 PACKAGE DIMENSIONS ........................................................................................................................................ 18 9.2 RECOMMENDED PCB FOOTPRINT.......................................................................................................................... 19 10. MODULE MARKING ................................................................................................................................. 19 11. RF DESIGN NOTES .................................................................................................................................... 20 11.1 RECOMMENDED RF LAYOUT AND GROUND PLANE .................................................................................................... 20 11.2 MECHANICAL ENCLOSURE .................................................................................................................................... 20 11.3 ANTENNA PATTERNS ........................................................................................................................................... 21 11.3.1 X-Y PLANE ...................................................................................................................................................... 21 11.3.2 Y-Z PLANE ...................................................................................................................................................... 21 11.3.3 Z-X PLANE ...................................................................................................................................................... 21 12. EVALUATION BOARDS ............................................................................................................................. 21 13. CUSTOM DEVELOPMENT ......................................................................................................................... 22 14. BLUETOOTH QUALIFICATION ................................................................................................................... 22 15. REGULATORY STATEMENTS ..................................................................................................................... 22 15.1 FCC STATEMENT ................................................................................................................................................ 22 15.2 FCC IMPORTANT NOTES: ..................................................................................................................................... 23 15.3 IC STATEMENT:.................................................................................................................................................. 24 15.4 IC IMPORTANT NOTES:........................................................................................................................................ 25 15.5 CE REGULATORY: ............................................................................................................................................... 25 15.6 JAPAN (MIC) .................................................................................................................................................... 26 15.7 AUSTRALIA / NEW ZEALAND ................................................................................................................................. 26 16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ...................................................................................... 27 16.1 MOISTURE SENSITIVITY LEVEL ............................................................................................................................... 27 R41Z-DS-1.0 Page 3 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 17. 17.1 17.2 17.3 18. 19. 20. 21. PACKAGING AND LABELING ..................................................................................................................... 28 CARRIER TAPE DIMENSION ................................................................................................................................... 28 REEL PACKAGING ............................................................................................................................................... 28 PACKAGING LABEL .............................................................................................................................................. 29 CAUTIONS ................................................................................................................................................ 29 LIFE SUPPORT POLICY .............................................................................................................................. 30 DOCUMENT HISTORY ............................................................................................................................... 30 RELATED DOCUMENTS ............................................................................................................................. 30 R41Z-DS-1.0 Page 4 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Table of Figures FIGURE 1 - BLOCK DIAGRAM ............................................................................................................................... 2 FIGURE 2 - R41Z PIN OUT (TOP VIEW) ................................................................................................................. 7 FIGURE 3 - SCHEMATIC: DCDC BYPASS MODE EXAMPLE ....................................................................................... 10 FIGURE 4 - SCHEMATIC: DCDC BUCK MODE EXAMPLE .......................................................................................... 11 FIGURE 5 - SCHEMATIC: DCDC BUCK MODE PSWITCH EXAMPLE .......................................................................... 12 FIGURE 6 - SCHEMATIC: DCDC BOOST MODE EXAMPLE ........................................................................................ 13 FIGURE 7 - PCB: BOOST MODE SUGGESTED LAYOUT ............................................................................................ 14 FIGURE 8 - SCHEMATIC: LOW FREQUENCY CRYSTAL .............................................................................................. 17 FIGURE 9 - R41Z MAC ADDRESS ON LABEL ......................................................................................................... 18 FIGURE 10 - R41Z MODULE DIMENSIONS ........................................................................................................... 18 FIGURE 11 - R41Z PAD LAYOUT (TOP VIEW) ....................................................................................................... 19 FIGURE 12 - R41Z MODULE MARKING - ENG REV2 ............................................................................................. 19 FIGURE 13 - R41Z RF EXAMPLE BASED ON EVAL BOARD ...................................................................................... 20 FIGURE 14 - R41Z EVALUATION BOARD.............................................................................................................. 21 FIGURE 15 - REFLOW PROFILE FOR LEAD FREE SOLDER .......................................................................................... 27 FIGURE 16 - REEL CARTONS .............................................................................................................................. 28 FIGURE 17 - PACKAGING LABEL ......................................................................................................................... 29 Specification Tables TABLE 1 - ORDERING PART NUMBERS ................................................................................................................... 2 TABLE 2 - QUICK SPECIFICATIONS ......................................................................................................................... 6 TABLE 3 - R41Z PIN DESCRIPTIONS ...................................................................................................................... 8 TABLE 4 - RIGDFU FUNCTIONS ............................................................................................................................ 8 TABLE 5 - ABSOLUTE MAXIMUM RATINGS ............................................................................................................. 9 TABLE 6 - OPERATING CONDITIONS ...................................................................................................................... 9 TABLE 7 - DCDC MODE CONNECTIONS............................................................................................................... 10 TABLE 8 - DCDC BUCK MODE CONNECTIONS ...................................................................................................... 11 TABLE 9 - DCDC BOOST MODE CONNECTIONS .................................................................................................... 12 TABLE 10 - GPIO PROPERTIES ........................................................................................................................... 15 TABLE 11 - ANALOG SIGNALS ............................................................................................................................ 15 TABLE 12 - ANALOG PROPERTIES ....................................................................................................................... 16 TABLE 13 – LOW FREQUENCY CRYSTAL RECOMMENDED SPECIFICATIONS ................................................................. 16 R41Z-DS-1.0 Page 5 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 5. Quick Specifications Bluetooth Version 4.2 Security AES-128 LE Connections Thread (IEEE 802.15.4) Security AES-128 Node Types Router Eligible, End Device, REED Radio Frequency 2.360GHz to 2.483GHz Modulations GFSK @ 1Mbps, OQPSK @ 250kbps Transmit power +3.5dbm Receiver sensitivity -95dBm (BLE), -100dBm (IEEE 802.15.4) Antenna Integrated Current Consumptions TX only @ 0dBm, bypass mode 14.7 mA TX only @ 0dBm, DCDC enabled, 3.6V Vin 6.1mA RX only, bypass mode 16.2mA RX only, DCDC enabled, 3.6V Vin 6.7mA Normal Run CPU @ 48MHz @ 3.0V, DCDC enabled 4.8mA Very-Low-Power Run CPU @ 4MHz @ 3.0V, DCDC enabled 137µA Very-Low-Leakage Stop 3 (RAM retained) @ 3.0V @ 25°C, DCDC enabled 1.8 µA Very-Low-Leakage Stop 0 @ 3.0V @25°C, bypass mode 182 nA Dimensions Length 16.2 mm ± 0.3mm Width 10.6 mm ± 0.3mm Height 2.1 mm ± 0.1mm Hardware SPI Master/Slave x2 Two-Wire Mast/Slave (I2C) x2 Interfaces UART x1 GPIO x25 Touch Sense Interface x16 Analog input x6 Boost mode: 0.9V to 1.8V, 1.1V required at startup Power Supply Bypass mode: 1.71V to 3.6V Buck mode: 1.8V to 4.2V, 2.1V required at startup Temperature Range -40 to +105 °C Certifications FCC FCC part 15 modular certification ID: 2AA9B07 IC Industry Canada RSS-210 modular certification IC: 12208A-07 EN 60950-1: 2011-01 3.1 (a): Health and Safety of the User EN 301 489-1 V1.9.2 & 3.1 (b): Electromagnetic Compatibility CE EN 301 489-17 V2.2.1 EN 300 328 V1.9.1 3.2: Effective use of spectrum allocated Japan (MIC) Australia / New Zealand Bluetooth Thread R41Z-DS-1.0 Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices Pending Pending Table 2 - Quick Specifications Page 6 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 6. Pin Descriptions 6.1 R41Z Pin Functions Figure 2 - R41Z Pin out (Top View) Pin 10 11 12 13 14 15 17 18 19 20 21 R41Z-DS-1.0 Name PTC1 PTC2 PTC3 PTC4 PTC5 PTC6 PTC7 PTC16 PTC17 PTC18 PTC19 PTA0 PTA1 PTA2 PTA16 PTA17 PTA18 PTA19 Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out GPIO/Analog Description GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO Default State at POR Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled SWDIO, Pullup EN SWCLK, Pulldown EN ̅̅̅̅̅̅̅, Pullup EN Reset Disabled Disabled Disabled Disabled Page 7 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Pin 30 31 32 33 34 36 37 38 39 Name PTB0 PTB1 PTB2 PTB3 PTB16 PTB17 PTB18 ADC0_P ADC0_N Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In In Pin 40 41 42 Name XTAL_OUT VREF VDDA Direction Out In/Out Power Description Default State at POR GPIO Disabled GPIO Disabled GPIO Disabled GPIO Disabled GPIO EXTAL32K GPIO XTAL23K ̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅̅ GPIO Non Maskable Interrupt Req. ADC/Comparator input N/A ADC/Comparator input N/A Reference Signals Description 32MHz Clock output Analog reference voltage. Internally or externally sourced Analog supply. Internally sourced1 Power Description DCDC start signal2 DCDC mode2 DCDC input2 DCDC signal2 DCDC IO and peripheral voltage2 DCDC RF supply2 Pin Name Direction 22 PSWITCH Input 23 DCDC_CFG Input 25 VCC Power 26 DCDC_LP Power 27 V1P8 Power 29 V1P5 Power 1, 9, 16, 24, 28, GND Power Electrical Ground 35, 43, 44, 45 Note 1: VDDA is tied to V1P8 through a power filtering circuit on the R41Z module Note 2: See the DCDC Converter Operation section for details on signal usage and DCDC modes Table 3 - R41Z Pin Descriptions 6.2 RigDFU Pin Functions When loaded with RigDFU, two GPIO pins are configured as UART pins for transferring new firmware images to the R41Z. Pins are configured only when the bootloader is running and are fully available to the application firmware. RigDFU can be removed from the R41Z by performing a full-chip erase. Pin Name PTC6 Direction In PTC7 Out RigDFU Functions UART-RX for bootloader. Internal pulldown enabled. UART-TX for bootloader. Hi-Z until bootloader activation message received on UART RX Table 4 - RigDFU Functions R41Z-DS-1.0 Page 8 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 7. Electrical Specifications 7.1 Absolute Maximum Ratings Symbol Parameter Vcc_MAX Voltage on Supply Pin V1P8_MAX VRF_MAX TS Voltage on V1P8 and GPIO Voltage on V1P5 Storage Temperature Condition Min. Max. Unit DCDC Boost Mode DCDC Bypass Mode DCDC Buck Mode All DCDC modes All DCDC modes -0.3 -0.3 -0.3 -0.3 -0.3 -40 1.8 3.6 4.2 3.6 3.6 125 °C Table 5 - Absolute Maximum Ratings 7.2 Operating Conditions Symbol Parameter Condition Vcc Voltage on Supply Pin V1P8 VRF Voltage on V1P8 and GPIO Voltage on V1P5 I1P8 DCDC Boost Mode DCDC Bypass Mode DCDC Buck Mode All DCDC modes All DCDC modes DCDC Buck Mode, 1.8Vout DCDC Buck Mode, 3.0Vout DCDC Boost Mode, 1.7Vin, 1.8 Vout DCDC Boost Mode, 0.9Vin, 3.0Vout V1P8 output current Min. Max. Unit 0.9 1.71 1.82 1.45 1.8 Typ. 1.5 3.3 3.3 3.3 3.3 1.8 3.6 4.2 3.6 3.6 45 mA 27 mA 45 mA 10 mA 25 TA Ambient Temperature -40 85 Note 1: In Boost mode a minimum of 1.1V is required to start the DCDC converter. Once started, the converter can operate at 0.9V Note 2: In Buck mode a minimum of 2.1V is required to start the DCDC converter. °C Table 6 - Operating Conditions 7.3 DCDC Converter Operation The R41Z module contains an integrated DCDC converter which allows for three modes of operation without additional components. When operating in DCDC Buck mode, power consumption from using the radio can be reduced compared to DCDC Bypass mode. DCDC Boost mode allows the use of a single alkaline or other low voltage source. While it is possible to switch between these modes in a single design, for example the R41Z Evaluation Board, it is not recommended to switch between modes while power is applied. R41Z-DS-1.0 Page 9 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 7.3.1 DCDC Bypass Mode Mode Pin Bypass 22 23 25 26 27 29 Name PSWITCH DCDC_CFG VCC DCDC_LP V1P8 V1P5 Net Connection Ground 1.71V - 3.6V Source IN 1.71V - 3.6V Source IN No Connection 1.71V - 3.6V Source IN 1.45V - 3.6V Source IN Table 7 - DCDC Mode Connections Figure 3 - Schematic: DCDC Bypass Mode Example R41Z-DS-1.0 Page 10 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 7.3.2 DCDC Buck Mode Name Net Connection PSWITCH 22 1.8V - 4.2V Source IN DCDC_CFG 23 1.8V - 4.2V Source IN VCC 25 1.8V - 4.2V Source IN Buck DCDC_LP 26 No Connection V1P8 27 No Connection or 1.8V – 3.0V OUT2 V1P5 29 No Connection Note 1: In Buck mode PSWITCH can inhibit the DCDC converter from starting when the source voltage is applied. When PSWITCH is connected to the source voltage, the DCDC converter will start. Once started, PSWITCH can be reconnected to GND without disrupting the DCDC converter’s operation. Note 2: V1P8 is the R41Z’s IO voltage when the DCDC converter is running in either Buck or Boost mode. V1P8 can source a limited number or additional peripheral devices (sensors, LEDs, etc.) that connect directly to the R41Z’s IO. In Buck mode, V1P8 cannot output a voltage greater than the source voltage Mode Pin Table 8 - DCDC Buck Mode Connections Figure 4 - Schematic: DCDC Buck Mode Example R41Z-DS-1.0 Page 11 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Figure 5 - Schematic: DCDC Buck Mode PSWITCH Example 7.3.3 DCDC Boost Mode Name Net Connection PSWITCH 22 0.9V – 1.8V Source IN DCDC_CFG 23 Ground VCC 25 0.9V – 1.8V Source IN Boost DCDC_LP 26 0.9V – 1.8V Source IN V1P8 27 No Connection or 1.8V – 3.0V OUT1 V1P5 29 No Connection Note 1: V1P8 is the R41Z’s IO voltage when the DCDC converter is running in either Buck or Boost mode. V1P8 can source a limited number or additional peripheral devices (sensors, LEDs, etc.) that connect directly to the R41Z’s IO. Mode Pin Table 9 - DCDC Boost Mode Connections R41Z-DS-1.0 Page 12 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Figure 6 - Schematic: DCDC Boost Mode Example When using Boost Mode care should be taken to ensure that DCDC_LP (Pin 26) is connected to VCC (Pin 25) with a trace wide enough to carry the full current expected to be drawn from the R41Z module and any peripherals sourced by the module. The connection should also be as short as possible. R41Z-DS-1.0 Page 13 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 V1P8 → DCDC_LP → VCC → DCDC_CFG → PSWITCH → Figure 7 - PCB: Boost Mode Suggested Layout 7.4 General Purpose I/O and ports The general purpose I/O is organized as three ports (A, B, and C) that enable access and control to each of the 25 available GPIO pins. Each GPIO can be configured individually through a Pin Control Register (PCR) and Port Data Direction Register (PDDR) with the following available features: Input/Output direction Output drive strength Internal pull-up and pull-down resistors Trigger interrupts and/or DMA from input Read and clear interrupt flags Enable passive input filter Fast/slow slew rate selection Control pin muxing to internal modules To use a pin as GPIO set the Pin Mux Control field of the pin to ALT1 in the PCR. Ports must have their clock source enabled in the System Clock Gating Control Register 5 (SIM_SCGC5) before accessing any port registers. Attempting to access port registers without the port clock enabled will cause program execution to immediately vector to the default exception handler. Disabling the clock to ports that are not being used will reduce power consumption. Ports should be disabled before turning off the clock. Symbol VIH VIL R41Z-DS-1.0 Parameter Input High Voltage, 2.7V ≤ VIO ≤ 3.6V Input High Voltage, 1.7V ≤ VIO ≤ 2.7V Input Low Voltage, 2.7V ≤ VIO ≤ 3.6V Input Low Voltage, 1.7V ≤ VIO ≤ 2.7V Min 0.7 × VIO 0.75 × VIO Max. 0.35 × VIO 0.3 × VIO Unit Page 14 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Symbol VHYS VOH VOL RP Parameter Min VIO – 0.5 20 Input Hysteresis Output High Voltage Output Low Voltage Pull resistance Max. 0.06 × VIO 0.5 50 Unit kΩ Table 10 - GPIO Properties 7.5 Analog I/O and VREF 7.5.1 Analog Signals and Mapping Analog ADC, DAC, and comparator signals can be routed to a select set of port or dedicated analog pins. Generally, on port pins the analog function can be used by setting the Pin Mux Control field in the PCR of the pin to ALT0. Signal CMP0_OUT CMP0_IN0 CMP0_IN1 CMP0_IN2 CMP0_IN3 CMP0_IN4 CMP0_IN5 ADC0_SE0 ADC0_SE1 ADC0_SE2 ADC0_SE3 ADC0_SE4 ADC0_DP0 ADC0_DN0 DAC0_OUT Direction Out In In In In In In In In In In In In In In Description Comparator 0 Output Comparator 0 Single-ended input 0 Comparator 0 Single-ended input 1 Comparator 0 Single-ended input 2 Comparator 0 Single-ended input 3 Comparator 0 Single-ended input 4 Comparator 0 Single-ended input 5 ADC Channel 0 Single-ended input 0 ADC Channel 0 Single-ended input 1 ADC Channel 0 Single-ended input 2 ADC Channel 0 Single-ended input 3 ADC Channel 0 Single-ended input 4 ADC Channel 0 Differential input positive ADC Channel 0 Differential input negative DAC Channel 0 Single-ended output Pin 30 38 39 37 32 33 31 31 33 32 37 21 38 39 37 Port PTB0 PTB18 PTB2 PTB3 PTB1 PTB1 PTB3 PTB2 PTB18 PTA19 PTB18 Mux Alt ALT4 ALT0 ALT0 ALT0 ALT0 ALT0 ALT0 ALT0 ALT0 ALT0 ALT0 Table 11 - Analog Signals 7.5.2 VDDA and VREF The source voltage for the analog sub-system, VDDA, is supplied by V1P8 through a filtering circuit onboard the R41Z module. The voltage reference pin, VREF, has two sourcing options: internal and external. When externally supplied, VREF should be referenced to VDDA. Internal sourcing is provided by a resistor trimmed circuit. For details on using the analog modules, see the MKW41Z512 data sheet. Symbol VDDA VREF_OUT VREFH VADIN VACIN VACIO ICMP R41Z-DS-1.0 Parameter Analog supply voltage VREF internally sourced, factory trim VREF externally sourced 16-bit, differential mode 16-bit, All other modes CMP/6-bit ADC analog input voltage CMP/6-bit ADC analog input voltage offset CMP current, High-speed mode Min 1.71 1.190 1.13 GND GND GND – 0.3 Typ. V1P8 1.1950 VDDA Max. V1P8 1.200 VDDA 31/32 × VREFH VREFH V1P8 20 200 Page 15 of 30 Unit mV µA R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Symbol VCMPH VCMPL Parameter CMP current, Low-speed mode Comparator output high Comparator output low Min V1P8 – 0.5 Typ. Max. 20 0.5 Unit µA Table 12 - Analog Properties 7.6 Module Reset Pin 17, PTA2, is used as an external reset source by default. This pin can be used for other functions, such as GPIO, by setting the RESET_PIN_CFG option bit of the FTFA_FPORT register to 0. The setting of this bit is retained through system resets and low power modes. 7.7 Debug and Programming The R41Z module supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanisms for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. The R41Z also supports Micro Trace Buffer (MTB) which provides a lightweight program trace capabilities using system RAM. SWD pins can be repurposed as additional GPIO by the application. 7.8 Clocks The R41Z requires two clocks: a high frequency clock and a low frequency clock. The high frequency clock is provided on-module by a high accuracy 32-MHz crystal which is required for Real Time Clock (RTC) and radio DeepSleep Mode (DSM) operation. In most applications, an external crystal oscillator is required to provide the low frequency clock. For normal run modes, an internal oscillator can provide the low frequency clock. However, to maintain radio functionality in reduced power modes an external crystal must be used. For most applications using the low frequency clock, external capacitors are not required. Internal, programmable capacitors are provided on the R41Z module. In applications that use Rigado provided firmware, use the typical specifications listed below. An external clock source can be used in place of a crystal. In this case, the clock source should be connected to the EXTAL32K pin (PTB16). XTAL23K (PTB17) should be left unconnected. Low Frequency Crystal Symbol FNOM_LFXO FTOL_LFXO_BLE CL_LFXO Parameter Crystal frequency Frequency tolerance, BLE applications Load Capacitance Typ. 32.768 ±20 Max. ±250 12.5 Unit kHz ppm pF Table 13 – Low Frequency Crystal Recommended Specifications R41Z-DS-1.0 Page 16 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Figure 8 - Schematic: Low Frequency Crystal 8. Firmware 8.1 Factory Image All modules are shipped with factory programmed firmware. The factory programmed firmware version is indicated on the label. 8.1.1 Firmware Version ‘00’ R41Z modules marked with firmware version ‘00’ are not loaded with a firmware image at the factory. Note: when the R41Z does not have a firmware image loaded that can be executed out of POR, the R41Z module will re-assert POR. 8.2 Mac Address Info On R41Z modules, the MAC address is typically located in flash as part of the firmware image and is typically accessed as a global constant. Rigado provides a unique MAC address which may be used in an end application. The MAC address is printed on a 2D barcode and human readable text on the top of the module. R41Z-DS-1.0 Page 17 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Figure 9 - R41Z MAC Address on Label When loading custom firmware to the module, the MAC address must be inserted into the image. This can be done manually using the human readable text or automated using a barcode scanner and suitable factory programmer tools. When loading a new application to the module care should be taken to ensure the Rigado bootloader (if used) and MAC address are not overwritten. 9. Mechanical Data 9.1 Package Dimensions Figure 10 - R41Z Module Dimensions (All dimensions are in mm) R41Z-DS-1.0 Page 18 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 9.2 Recommended PCB Footprint PAD DIMENSIONS: 0.60MM X 0.60MM Figure 11 - R41Z Pad Layout (Top View) (All dimensions are in mm) 10. Module Marking RIGADO 320-00065 v2 Figure 12 - R41Z Module Marking - ENG Rev2 R41Z-DS-1.0 Page 19 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 11. RF Design Notes 11.1 Recommended RF layout and Ground Plane The integrated antenna on the R41Z module requires a suitable ground plane to radiate effectively. The module antenna has been tuned for having a PCB directly below with no copper or any other metal present. The module should be placed at the edge of the PCB with the antenna edge facing out. For best performance, the ground plane should be on the same layer as the module or as close as possible. If this is not possible in a design, ground planes on multiple layers generously connected with vias may also be used. Reduced ground plane size will result in reduced radio performance. Figure 13 - R41Z RF Example Based on EVAL Board 11.2 Mechanical Enclosure Care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can decrease RF performance. The module is designed and tuned to be in free air. Any potting, epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by the customer. If potting must be used, the compound should have a low dielectric constant and should be designed for use with 2.4GHz RF electronics. R41Z-DS-1.0 Page 20 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 11.3 Antenna Patterns 11.3.1 X-Y Plane TBD 11.3.2 Y-Z Plane TBD 11.3.3 Z-X Plane TBD 12. Evaluation Boards Rigado has developed a full featured evaluation board that provides on-board programming and debug, power and virtual COM port over USB, 32.768kHz crystal, Arduino style IO headers 2 mechanical user buttons, 2 capacitive touch buttons, 3-axis accelerometer/magnetometer (I2C), and a 4Mbit flash chip (SPI). The evaluation board also allows for easy use of all of the R41Z’s DCDC power modes and can be powered from an adjustable LDO regulator, CR2032 coin cell battery, or through an external power header. Power consumption can be measured through onboard current sensing resistors and headers. Figure 14 - R41Z Evaluation Board R41Z-DS-1.0 Page 21 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 13. Custom Development Rigado is a full-service design house offering end-to-end product development from concept to manufacturing. We can provide custom modules, perform electrical and mechanical design, end product manufacturing, firmware and mobile development, and DevOps management tools. 14. Bluetooth Qualification The R41Z module is being qualified as a Bluetooth Component (tested) for RF-PHY. This allows for customers to use qualified NXP Bluetooth stacks without the need to complete additional RF-PHY testing. R41Z: Declaration ID TBD / QDID TBD 15. Regulatory Statements 15.1 FCC Statement This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. R41Z-DS-1.0 Page 22 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modification to this product will void the user’s authority to operate this equipment. Note: Modification to this product will void the users’ authority to operate this equipment. 15.2 FCC Important Notes: (1) FCC Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in this document. Caution! The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modification could void the user authority to operate the equipment. (2) Co-location Warning: This device and its antenna(s) must not be co-located or operating in conjunction with any other transmitter antenna. (3) OEM integration instructions: This device is intended only for OEM integrators under the following conditions: The antenna and transmitter must not be co-located with any other transmitter or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.) In the event that these conditions cannot be met (for example certain laptop configuration or colocation with another transmitter), then the FCC authorization for this module in combination with the R41Z-DS-1.0 Page 23 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. Caution! The OEM is still responsible for verifying compliance with FCC Part 15, subpart B limits for unintentional radiators through an accredited test facility. (4) End product labeling: The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2AA9B07” Any similar wording that expresses the same meaning may be used. The FCC Statement below should also be included on the label. When not possible, the FCC Statement should be included in the User Manual of the host device. “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.” (5) Information regarding the end user manual： The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual (Section 15.2(4)). 15.3 IC Statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. R41Z-DS-1.0 Page 24 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou onctionner en conjonction avec toute autre antenne ou transmetteur . 15.4 IC Important Notes: 1. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC multi‐transmitter product procedures. 3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two‐ways authentication between module and the host system. 4. The host device shall be properly labelled to identify the module within the host device. The final end product must be labeled in a visible area with the following: “Contains IC: 12208A-07“ Any similar wording that expresses the same meaning may be used. The IC Statement below should also be included on the label. When not possible, the IC Statement should be included in the User Manual of the host device. “This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le onctionnement.” 15.5 CE Regulatory: The R41Z modules are being tested and expected to be compliant against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device. From Directive 2006/95/EC: EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 From R&TTE Directive 1999/5/EC: ETSI EN 300 328 V 1.9.1 R41Z-DS-1.0 Page 25 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 From Directive 2004/108/EC: ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1 Declarations of Conformity and supporting test reports are available at www.rigado.com. 15.6 Japan (MIC) The R41Z Series modules are pending type certification and are to be labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final end product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html The label on the final end product which contains a R41Z Series module must follow the MIC marking requirements. Labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website: http://www.tele.soumu.go.jp/e/index.htm. The R41Z module is to be labeled with its assigned technical conformity mark and certification number. The final end product in which this module is being used must have an external label referring to the type certified module inside: Contains transmitter module with certificate number: TBD 15.7 Australia / New Zealand The R41Z module have been tested to comply with the AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices – Limits and methods of measurement. The report (Pending) may be downloaded from www.rigado.com, and may be used as evidence in obtaining permission to use the RCM. Information on registration as a Responsible Party, license and labeling requirements may be found at the following websites: R41Z-DS-1.0 Page 26 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard2004 New Zealand: http://www.rsm.govt.nz/compliance The A-Tick and C-Tick marks are being migrated to the Regulatory Compliance Mark (RCM). Only Australian-based and New Zealand-based companies who are registered may be granted permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also register as a Responsible Party to use the RCM on behalf of a company not in Australia or New Zealand. 16. Solder Reflow Temperature-Time Profile Figure 15 - Reflow Profile for Lead Free Solder 16.1 Moisture Sensitivity Level The R41Z module is rated for MSL 3, 168-hour floor life after opening. R41Z-DS-1.0 Page 27 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 17. Packaging and Labeling 17.1 Carrier Tape Dimension TBD 17.2 Reel Packaging Modules come on 330mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and humidity card and placed in a 340x350x65mm box. On the outside of the bag an antistatic warning and reel label are adhered. Figure 16 - Reel Cartons R41Z-DS-1.0 Page 28 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 17.3 Packaging Label Figure 17 - Packaging Label 18. Cautions 1) The guidelines of this document should be followed in order to assure proper performance of the module. 2) This product is for use in office, business, and residential applications, but not medical devices. 3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe precautions should be used. This could be accomplished by redundant systems and protection circuits. 4) Supply voltage to the module should not be higher than the specified inputs or reversed. Additionally, it should not contain noise, spikes, or AC ripple voltage. 5) Avoid use with other high frequency circuits. 6) Use methods to eliminate static electricity when working with the module as it can damage the components. 7) Contact with wires, the enclosure, or any other objects should be avoided. 8) Refer to the recommended pattern when designing for this module. 9) If hand soldering is used, be sure to use the precautions outlined in this document. 10) This module should be kept away from heat, both during storage and after installation. 11) Do not drop or physically shock the module. 12) Do not damage the interface surfaces of the module. 13) The module should not be mechanically stressed at any time (storage, handling, installation). 14) Do not store or expose this module to: Humid or salty air conditions High concentrations of corrosive gasses. Long durations of direct sunlight. Temperatures lower than -40°C or higher than 125°C. R41Z-DS-1.0 Page 29 of 30 R41Z Module Data Sheet Thread + Bluetooth 4.2 LE November 17, 2016 19. Life Support Policy This product is not designed to be used in a life support device or system, or in applications where there is potential for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in an application that poses these risks, such as described above, the customer is agreeing to indemnify Rigado for any damages that result. 20. Document History Revision Date Changes / Notes 0.9 1.0 10/20/2016 11/17/2016 Release draft. Images and specifications updated. Certifications added 21. Related Documents Rigado Documents: R41Z Module Product Brief NXP Documents: KW41Z Fact Sheet NXP BLE Mobile Toolbox KW41Z Data Sheet KW41Z Reference Manual R41Z-DS-1.0 Page 30 of 30
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : No Page Count : 30 Language : en-US Tagged PDF : Yes XMP Toolkit : 3.1-701 Producer : Microsoft® Word 2016 Title : R41Z Data Sheet Creator : Nick Conroy Creator Tool : Microsoft® Word 2016 Create Date : 2016:11:17 19:43:55-08:00 Modify Date : 2016:11:17 19:43:55-08:00 Document ID : uuid:25F73FA6-15CF-41D1-9ACC-CE9EC3542E4E Instance ID : uuid:25F73FA6-15CF-41D1-9ACC-CE9EC3542E4E Author : Nick ConroyEXIF Metadata provided by EXIF.tools