Dialog Semiconductor SC14A DECT Cordless Voice Module User Manual SC14CVMDECTv1 2ls
Dialog Semiconductor BV DECT Cordless Voice Module SC14CVMDECTv1 2ls
Contents
- 1. user manual
- 2. user manual safety requirements
user manual
DATASHEET SC14CVMDECT Cordless Voice Module General description The SC14CVMDECT is a member of the Cordless Module family with integrated radio transceiver and baseband in a single package. It is designed for hosted and embedded cordless voice and data applications in the DECT frequency band. Its simple to use AT Commands set allows setting up of a wireless link between 2 or more nodes without detailed knowledge of the DECT protocol. Features Up-to 6 portable parts registered per fixed part UART interface to external host Controllable via AT command set (over UART) Support voice and low speed data RF range: 1870 - 1930 MHz Receiver sensitivity < -93 dBm Transmit power 23 dBm (200 mW) Antennaâs included Power supply voltage 1.9 - 3.45V Small form factor (25mm * 29mm) Contains both PP and FP functionality Program memory available for custom software. SC14CVMDECT August 19, 2011 v1.2.1 Completely ETSI-certified ETSI 300 444 (DECT GAP) compliant Application Examples FCC approved n Cordless Intercom Supports EU-DECT (CAT-iq V1 wideband audio), n Cordless baby monitor DECT6.0 for North America and Japan DECT (pendn Wireless Data applications up to 1.6 Kbit/s. ing approval) ________________________________________________________________________________________________ System Diagram US/EU/JP* DECT Voice 32kbits/s Data 1.6kbits/s Host SC14CVMDECT Voice Portable Part 0 Voice Host SC14CVMDECT Host Fixed Part SC14CVMDECT Voice Portable Part 1 Host SC14CVMDECT Voice Portable Part 5 Š 2011 SiTel Semiconductor B.V. Company Confidential Cordless Voice Module * Only end-products can be CAT-iq certified 1.0 Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . 3 8.0 Audio Level Adjustment . . . . . . . . . . . . . . . . . . . 37 1.1 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . 3 8.1 PP AUDIO LEVEL . . . . . . . . . . . . . . . . . . . . . . 37 8.2 FP AUDIO LEVEL) . . . . . . . . . . . . . . . . . . . . . 37 2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.0 Example Application Diagram. . . . . . . . . . . . . . . 38 2.2 ORDERING INFORMATION . . . . . . . . . . . . . . . 8 10.0 Mechanical Dimensions . . . . . . . . . . . . . . . . . . 39 2.3 REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . 8 SC14CVMDECT Table of Contents 11.0 Module integration . . . . . . . . . . . . . . . . . . . . . . . 40 2.4 GLOSSARY AND DEFINITIONS . . . . . . . . . . . 8 11.1 MODULE PLACEMENT ON THE MAIN BOARD 3.0 Cordless Voice Module functionality . . . . . . . . . . 9 40 3.1 MODULE HARDWARE . . . . . . . . . . . . . . . . . . . 9 3.2 SOFTWARE CONTROL . . . . . . . . . . . . . . . . . . 9 12.0 UTAM membership waiver . . . . . . . . . . . . . . . . 41 3.3 DECT PROTOCOL STACK . . . . . . . . . . . . . . . 9 13.0 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 3.4 PORTABLE PART CONFIGURATION . . . . . 10 13.1 SOLDERING PROFILE . . . . . . . . . . . . . . . . . 42 3.5 FIXED PART CONFIGURATION . . . . . . . . . . 12 13.2 COPPER PAD AND SOLDER OPENING . . . 42 3.6 LIGHT DATA APPLICATION . . . . . . . . . . . . . 14 13.3 STENCIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 3.7 FUNCTIONAL OVERVIEW . . . . . . . . . . . . . . . 15 14.0 Notices to OEM. . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.0 Functional description. . . . . . . . . . . . . . . . . . . . . 16 14.1 FCC REQUIREMENTS REGARDING THE END 4.1 UART INTERFACE . . . . . . . . . . . . . . . . . . . . . 16 PRODUCT AND THE END USER . . . . . . . . . 44 4.2 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14.2 PRECAUTIONS REGARDING UNINTENDED 4.3 PP AUDIO CONFIGURATIONS . . . . . . . . . . . 17 COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.4 CALL HANDLING . . . . . . . . . . . . . . . . . . . . . . 20 14.3 END APPLICATION APPROVAL . . . . . . . . . 44 4.5 TONE/MELODY HANDLING. . . . . . . . . . . . . . 20 14.4 SAFETY REQUIREMENTS . . . . . . . . . . . . . . . . . 44 4.6 DATE AND REAL-TIME CLOCK . . . . . . . . . . 20 4.7 PROTOCOL STACK . . . . . . . . . . . . . . . . . . . 22 4.8 REGISTRATION . . . . . . . . . . . . . . . . . . . . . . 23 4.9 PCM INTERFACE . . . . . . . . . . . . . . . . . . . . . 24 5.0 CAT-iq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . 29 5.2 CAT-IQ PROFILE OVERVIEW . . . . . . . . . . . . 29 6.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 6.1 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . 30 6.2 DIGITAL INPUT LEVELS . . . . . . . . . . . . . . . . 31 6.3 DIGITAL OUTPUT LEVELS . . . . . . . . . . . . . . 31 Cordless Voice Module 6.4 LOUDSPEAKER LOAD CIRCUITS. . . . . . . . . 31 6.5 GENERAL SPECIFICATIONS . . . . . . . . . . . . 33 6.6 BASEBAND SPECIFICATIONS . . . . . . . . . . . 33 6.7 RADIO PART (RF) SPECIFICATIONS . . . . . . 33 6.8 FP POWER SUPPLY . . . . . . . . . . . . . . . . . . . 34 7.0 Design guidelines. . . . . . . . . . . . . . . . . . . . . . . . . 35 7.1 APPLICATION SOFTWARE FOR PP . . . . . . 35 7.2 APPLICATION SOFTWARE FOR FP . . . . . . 35 7.3 HARDWARE DESIGN GUIDELINES . . . . . . . 36 Š 2011 SiTel Semiconductor B.V. Company Confidential August 19, 2011 v1.2.1 SC14CVMDECT 1.0 Connection Diagram 12 11 10 9 8 7 6 5 4 3 2 1 Figure 1 Connection Diagram (Bottom View) 1.1 PIN DESCRIPTION Table 1: Pin description In/ Out Iout Drive (mA) GND Ground GND Ground Pin Module Pin name A1 A2 Reset Description State A3 GND Ground A4 NC leave unconnected A5 VDDIO Supply voltage for internal QSPI and data flash. Must be connected to VDD (1.8V). A6 P1[2]/INT2 IO I-PU A7 GND Ground A8 GND Ground A9 VBAT Main supply voltage <5.5V. Can be directly connected to a Li-Ion battery. A10 P0[4] / SPI_EN IO I-PU A11 RSTn B1 GND Ground B2 GND Ground B3 CP_VOUT1 Charge Pump Output 1. Must be connected through a capacitor of 1uF to gnd B4 P1[5]/INT5 IO O-1 I/O port SPI_EN I-PU Active low Reset input with Schmitt-trigger input, open-drain output (200k and pull up resistor to internal VDD. Input may not exceed 2.0 V. An pull-up) internal capacitor of 100nF is mounted on this pin. Company Confidential I/O Port INT5: Interrupt Input. August 19, 2011 v1.2.1 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. I/O port. INT2: Interrupt Input. SC14CVMDECT Table 1: Pin description (Continued) In/ Out Iout Drive (mA) Pin Module Pin name B5 GND B6 P2[6]/INT6 / WTF_IN IO I-PU I/O port INT6: Interrupt Input. WTF_IN: - B7 P0[5] / SPI_CLK IO I-PU I/O Port SPI Clock B8 GND B9 P0[1] / URX IO I-PD (10k) B10 VBATT Reset Description State Ground I/O port UART Serial In Secondary supply voltage. Connect to VCCRF. B11 GND Ground B12 NC RF pad, no pad on PCB C1 GND Ground C2 PAOUTn IO 500 O-0 (5k CLASSD loudspeaker positive output fixed pulldown) C3 GND C4 P2[7]/INT7 IO I-PU I/O port INT7: Interrupt C5 P1[4]/INT4 IO 1/2 I-PD I/O port INT4: Interrupt C6 P1[1]/INT1 IO I-PU I/O Port INT1: Interrupt LE: INT6: secondary Interrupt C7 GND C8 P0[0] / UTX I-PU C9 GND C10 JTAG IO I-PU C11 VCCRF RFSUPPLY input < 3.45V. Connect to VBAT if VBAT less than 3.45V. Else this pin must be supplied from and external 3.3V LDO. Refer to Table 16 for supply requirements. D1 GND Ground D2 PAOUTp IO 500 D3 PON Ground I/O Port UART Serial Out Ground JTAG-SDI+; one wire Debug interface with open-drain. Pullup with R=1k to Vdd. O-0 (5k CLASSD loudspeaker positive outputs fixed pulldown) I (270k Power on, Switches on the device if Voltage > 1.5V. fixed May be directly connected to VBAT, also with Li-Ion batteries pulldown) Company Confidential August 19, 2011 v1.2.1 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Ground Pin Module Pin name In/ Out Iout Drive (mA) D4 CHARGE I-PD (270k fixed pulldown) D5 GND Ground D6 GND Ground D7 GND Ground D8 GND Ground D9 P2[4]/SCL1/ PCM_DO IO I-PU D10 VDD D11 P2[5]/PCM_FSC IO I-PU Reset Description State Charger connected indication. Switches on the device if voltage > 1.5v. Must be connected to charger via resistor R>(Vcharger_max3V)/10 mA (round to next largest value in range). If no charger used, Leave unconnected if not used. Charger is currently not supported. I/O port SCL1; I2C clock PCM_DO: PCM Data output Digital Core supply voltage (1.8V TYP). Output from internal regulator. I/O Port PCM_FSC: PCM Frame Sync E1 VDDPA CLASSD Audio Amplifier supply voltage up to 3.45V. E2 GND Ground E3 CHARGE_CTRL O-0 E4 SOCn Battery State Of Charge negative input. Star point connected to the SOC resistor. Charger is currently not supported: connect to GND E5 GND Ground E6 GND Ground E7 GND Ground E8 GND Ground E9 GND Ground E10 P0[7] / SPI_DI IO I-PU E11 GND Ground F1 SOCp Battery State of charge positive input. Charger is currently not supported: connect to GND F2 P1[0]/INT0/ADC1 IO I-PU F3 ADC2/NTC ADC2 NTC protection input for Li-Ion charger circuit. Charger is currently not supported: connect to GND F4 NC leave unconnected F5 ULP_PORT Ultra Low Power Port Pin Ultra low power is not supported by the software, connect to gnd. F6 ULP_VBAT Ultra Low Power Supply Pin Ultra low power is not supported by the software, connect to gnd. Company Confidential Charge control pin. Leave unconnected if not used. Charger is currently not supported. I/O Port SPI Data Input I/O Port INT0: Interrupt 0 ADC1; ADC input 1 August 19, 2011 v1.2.1 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. SC14CVMDECT Table 1: Pin description (Continued) Pin Module Pin name F7 ULP_MAIN_CTR F8 NC F9 In/ Out Iout Drive (mA) Reset Description State I-0 Ultra Low Power Main Control Ultra low power is not supported by the software, connect to gnd. P2[3]/SDA1 / PCM_DI IO I-PU I/O Port SDA1: I2C Data PCM_DI: PCM Data input F10 P1[3]/INT3 IO 1/2 I-PD I/O Port INT3: Interrupt F11 P0[6] / SPI_DO IO I-PU I/O Port SPI Data Out RF pad, must be left unconnected G1 GND Ground G2 LSRn Negative loudspeaker output G3 GND Ground G4 P3[3]/ADC0 IO I/O Port ADC0; ADC input 0 G5 GND Ground G6 NC leave unconnected G7 GND Ground G8 NC leave unconnected G9 GND Ground G10 GND Ground G11 GND Ground H1 VREFM H2 LSRp Positive loudspeaker output H3 P3[7]/RINGp IO I/O Port RINGp: Ringer detection input H4 NC H5 GND Ground H6 GND Ground H7 P2[2]/PCM_CLK I/O I-PD I/O Port PCM_CLK: PCM clock input/output H8 NC RF pad, must be left unconnected H9 GND Ground H10 GND Ground H11 GND Ground J1 GND Ground J2 MICh Headset microphone input with fixed input protection J3 GND Ground J4 P3[5]/RINGING / RINGOUT IO I/O Port RINGING: Ring detection Input RINGOUT: - J5 GND Ground J6 NC RF pad, must be left unconnected Negative microphone reference (star point), connect to gnd. Company Confidential August 19, 2011 v1.2.1 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. SC14CVMDECT Table 1: Pin description (Continued) SC14CVMDECT Table 1: Pin description (Continued) Pin Module Pin name J7 GND J8 P2[1] / PWM1 / LED4 J9 In/ Out Iout Drive (mA) Reset Description State Ground I/O Port PWM1: Pulse Width Modulation output LED4: 2.5/5mA LED current sink GND Ground J10 GND Ground J11 GND Ground K1 VREFp Positive microphone supply voltage K2 MICp Positive microphone input K3 P3[2]/CIDINp IO I/O Port CIDINp: Caller id opamps positive input K4 P3[6]/RINGn IO I/O Port RINGn: RING opamp negative input K5 P3[4]/PARADET IO I/O Port PARADET: Parallel set detection K6 NC leave unconnected K7 NC leave unconnected K8 P2[0]/ PWM0 / LED3 IO I/O Port PWM0: LED3: 2.5/5mA LED current sink K9 GND Ground K10 NC No ground under the pad (RF sensitive) K11 NC No ground under the pad (RF sensitive) L1 GND Ground L2 MICn Negative handset microphone input L3 GND Ground L4 GND Ground L5 NC RF pad, must be left unconnected L6 GND Ground L7 GND Ground L8 NC leave unconnected L9 GND Ground L10 NC No ground under the pad (RF sensitive) L11 GND Ground M2 NC RF pad, no pad on PCB ⢠âNCâ means: leave unconnected. ⢠O= Output ⢠GND means internally connected to Ground plane of module (51 pins in total) ⢠I-PD = Input, pulled down Cordless Voice Module IO ⢠I-PU = Input, pulled up ⢠GND means connect to Ground (not supported, functional pin) ⢠O-0 = Output, low ⢠O-1 = Output, high Reset States: ⢠I = Input Š 2011 SiTel Semiconductor B.V. Company Confidential August 19, 2011 v1.2.1 Introduction 2.1 SCOPE The SC14CVMDECT is a programmable DECT module for voice and low data rate services. The internal software-stack receives commands and data from the application, for instance to setup a link to other modules. The user interface can be implemented on the module itself or on anexternal host processor. The internal FLASH provides user space where custom applications can be located. The module converts analog signals to a digital stream, compresses/decompresses them according to the DECT standards and transmits/receives them over the air interface. The DECT protocol-stack in each module supports both PP and FP functionality. 2.2 ORDERING INFORMATION SC14CVMDECT AF01 2.3 REFERENCES 1. SC14CVMDECT AT Commands 2. SC14CVMDECT AT Commands Communication Library 3. SC14CVMDECT_PC_MMI_User_Guide 4. Athena User Manual 2.4 GLOSSARY AND DEFINITIONS API Application Programming Interface AT Command Interface The software interface between the MCU and SC14CVMDECT Cordless Advanced Technology, Internet and Quality Codec Coder and DeCoder converts analog signals to digital signals and vice versa. Conference Same as intercom, but generally including an external party. CRC Cyclic Redundancy Check CVM Cordless Voice Module DECT Digital Enhanced Cordless Telephone DSP Digital Signal Processor EC Echo Canceller EMC Equipment Manufacturerâs Code (please refer to ETSI EN 300 175-6) ESD Electro Static Discharge EQ Equalizer FP Fixed Part GFSK Gaussian Frequency Shift Keying HW Hardware Internal call between 2 or more parties. IPEI International Portable Equipment Identity (please refer to ETSI EN 300 175-6) IWU InterWorking Unit (please refer to ETSI EN 300 175-1) LCD Liquid Crystal Display LDR Low Data Rate MCU Micro Controller Unit MMI Man Machine Interface (keypad, LCD, buzzer, microphone, earpiece, speaker, headset) NTP Nominal Transmit Power PAEC Perceptual Acoustic Echo Canceller PC Personal Computer, IBM compatible PCB Printed Circuit Board without components PP Portable Part PSTN Public Switched Telephone Network POTS Plain Old Telephone System RF Radio Frequency RFPI Radio Fixed Part Identity (please refer to ETSI EN 300 175-6) RLR Receive Loudness Rating RSSI Radio Signal Strength Indication (please refer to ETSI EN 300 175-1) Sidetone Feedback of microphone signal to earpiece. SLR Sending Loudness Rating SPI Serial Periphelal Interface Bus SW Software UART Universal Asynchronous Receiver and Transmitter. VAD Voice Activity Detection Walky Talky Two PPs connected without an FP Cordless Voice Module CAT iq Intercom Inband tones Tones played by the application itself and not from external e.g. line. Š 2011 SiTel Semiconductor B.V. Company Confidential SC14CVMDECT 2.0 August 19, 2011 v1.2.1 SC14CVMDECT 3.0 Cordless Voice Module functionality This section describes the key functions and features supported by the SC14CVMDECT as shown in Figure 2. UART interface to host AT commands FLASH EEPROM User SW UART XTAL AT command interpreter Protocol Stack DSP Radio Codec DECT MIC LSR SPI Ports Headset Control Figure 2 SC14CVMDECT functional overview 3.1 MODULE HARDWARE The SC14CVMDECT internal hardware consist of: ⢠A UART for communication to a host. 3.2 SOFTWARE CONTROL The SC14CVMDECT can be controlled via an AT Command Set over the UART interface or from the internal user application. The external controller handles the user interface (MMI) and sends/receives AT commands and responses to the internal protocol stack. A detailed functional and data flow description, including an example of the start-up sequence, can be found in document reference [1]. ⢠An Internal Microprocessor (MCU) running from FLASH handling the AT command interpreter, the protocol stack and further internal control. ⢠A 4kByte EEPROM used by the protocol stack and for user EEPROM variables. ⢠A DSP for the Audio signal processing like ADPCM voice compression towards the Codecs. ⢠A codec to convert the analog signals to digital signals and vise versa. ⢠Input/Output ports which can be toggled high/low if output or a high/low digital level can be read. ⢠A 10.368 MHz XTAL clock. This crystal is automatically tuned by the module software for the best Radio Performance. The product supports up to 6 DECT GAP compliant PP units to one FP station. ⢠Voltage regulators to convert the external supply voltage to a stable supply voltages for the core and I/Oâs. ⢠A DECT Radio transceiver with two built-in antenna circuits. The antennaâs are on the module, so no RF knowledge is required. Š 2011 SiTel Semiconductor B.V. Company Confidential August 19, 2011 v1.2.1 Cordless Voice Module 3.3 DECT PROTOCOL STACK The SC14CVMDECT internal protocol stack is based on the ETSI DECT specifications and is compliant with ETSI 300 444 (GAP). Ports SC14CVMDECT 3.4 PORTABLE PART CONFIGURATION A Portable Part configuration with SC14CVMDECT requires additional external parts as shown in Figure 3. PCM Loudspeaker (optional) UART (optional) MCU SC14CVMDECT Earpiece (handset speaker) MIC2 Headset (optional) Figure 3 PP Configurations Table 2 provides the overview of the supported interfaces for a Portal Part. Table 2: PP Hardware support overview Item Supported Remark Battery connection No Non rechargeable or rechargeable 2 cells NiMH, NiCd or Li-Ion For Li-Ion an 3.3V LDO is required to supply the system. Battery charger No Use external charger. Keypad No on external MCU Display No on external MCU IO Ports Yes 4 free digital IO port pins PCM interface Yes 1x16 bits, 8,16 kHz, strobes 1,8, 16, 32 bits PCM voice coding formats Yes uLaw (64kbits/s), Alaw (64kbits/s), G.726 ADPCM (32kbits/s), G.722 ADPCM (64kbits/s), Linear (128kbits/s) UART Yes 9600-115.2kbaud, used for AT-command Headset detection Yes Yes Connected to LSRp,LSRn Headset Microphone Yes Connected to MICp Handsfree Microphone Yes Connected to MICh Handsfree speaker Yes Connected to PAOUTP/n (No SW support) Radio Yes Integrated with two antennaâs A portable part supports following main functional features: â˘Custom Ringtones (currently not supported*) â˘Earpiece, handsfree and headset. â˘Conferencing (currently not supported*) â˘Intercom â˘Automatic headset detection (currently not supported*) â˘Battery management (currently not supported*) â˘Baby monitor (currently no VAD support*) Š 2011 SiTel Semiconductor B.V. Company Confidential 10 August 19, 2011 v1.2.1 Cordless Voice Module Headset earpiece SC14CVMDECT â˘PCM interface (one channel) â˘Walky Talky mode (currently not supported*) â˘Low Speed Data (1.6kbit) â˘LU10 data channel (54kbit/sec) (Currently not supported*) * Expected in Q2 2012 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 11 August 19, 2011 v1.2.1 SC14CVMDECT 3.5 FIXED PART CONFIGURATION A Fixed Part configuration with SC14CVMDECT requires additional external parts as shown in Figure 4. Ports PCM Loudspeaker (supported in future versions) (optional) UART MCU SC14CVMDECT Earpiece (handset speaker) MIC2 Analog frontend can be used for PSTN line interface Headset (optional) Supply Regulator Figure 4 FP Configuration Table 3 provides the overview of required and available interfaces for a basic or a feature rich cordless FP with the SC14CVMDECT. Table 3: FP Hardware support overview Supported Remark Supply Regulator No Use external 3.3V LDO. Keypad No on external MCU Display No on external MCU IO Ports Yes 4 free port pins PCM interface Yes 4x16 bits, 8,16 kHz, strobes 1,8, 16, 32 bits PCM voice coding formats Yes uLaw (64kbits/s), Alaw (64kbits/s), G.726 ADPCM (32kbits/s), G.722 ADPCM (64kbits/s), Linear (128kbits/s) UART Yes 9600-115.2kbaud, used for AT-command Headset detection Yes Headset earpiece Yes Connected to LSRp,LSRn Headset Microphone Yes Connected to MICp Handsfree Microphone Yes Connected to MICh Handsfree speaker Yes Connected to PAOUTP/n (No SW support) PSTN Line interface Yes CID, Ring detection, Line-in, Linout, Line reversal, paralle set detection (SW On request) Radio Yes Integrated with two antennaâs A fixed part supports following main functional features: â˘Custom Ringtones (currently not supported*) â˘Earpiece, handsfree and headset. â˘Conferencing (currently not supported*) â˘Automatic headset detection (currently not supported*) â˘Intercom Š 2011 SiTel Semiconductor B.V. Company Confidential 12 August 19, 2011 v1.2.1 Cordless Voice Module Item SC14CVMDECT â˘Baby Monitor (currently not supported*) â˘PCM interface (4 channels) â˘Low Speed Data (1.6kbit) â˘LU10 data channel (54kbit/sec) (Currently not supported*) â˘Base Station For Sensor applications (Currently not supported*) * Expected in Q2 2012 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 13 August 19, 2011 v1.2.1 SC14CVMDECT 3.6 LIGHT DATA APPLICATION The SC14CVMDECT supports Low Data Rate (LDR) transmission up to 1.6 kbits/s. Packets with a length of upto 30 bytes payload can be transmitted and received. One SC14CVMDECT is configured as FP and the others are configured as PPs (Figure 5). The host sends/receives AT commands (over UART) to/from PP or FP as shown in Table 4. Table 4: Low Data Services Direction Supported Host to PP to FP Yes Host to FP to PP Yes PP to PP Yes Comment Indirect via FP Up to six PPs can be registered to one FP. See document reference [1] for more information on the AT commands to support LDR. 1.6 kbits/s SC14CVMDECT PP SC14CVMDECT 1.6 kbits/s FP SC14CVMDECT PP Š 2011 SiTel Semiconductor B.V. Company Confidential 14 Cordless Voice Module Figure 5 Light Data application August 19, 2011 v1.2.1 SC14CVMDECT 3.7 FUNCTIONAL OVERVIEW Table 5: Functional overview Supported Functionality Remark Standard FP audio control feature: Call handling PP to FP, FP to PP Yes Intercom No PP to FP, FP to PP Conference call No Call forwarding No Transfer call between PPs not possible. Page call Yes FP pages all PPs (PP locator) Protocol Manual registration Yes Number of registered PPs per FP Yes 1 to 6 Low rate data transfer Yes 1.6 Kbit/s on the air-interface (30 bytes payload) Audio and tone Microphone mute Yes PP only. Mute of MIC in all audio connections are possible Tone generation Yes Melody generator with 7 polyphonic tones Audio Volume control Yes 6 steps are adjustable by EEPROM Tone Volume control Yes 6 steps are adjustable by EEPROM Headset support Yes Handsfree/Speakerphone Yes PP only Yes Accuracy depending directly on crystal General Real time clock Real time clock synchronization Yes All PP clocks are kept in synchronization with the FP SW EEPROM Storage Yes Internal on Module Battery Charge Management No PSTN line interface support No PSTN software on Request I/O port support Yes 4 pins I/O Port Interrupt support No Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 15 August 19, 2011 v1.2.1 SC14CVMDECT 4.0 Functional description 4.1 UART INTERFACE The UART isnormally used for AT commands, but can also be used for software upgrades and debugging. The UART is a full duplex UART with frame type: 1 start bit, 8 data bits (LSB first), 1 stop bit, no parity and a baud rate of 115.200 kBaud The UART hardware interface uses 3 wires (see Figure 6) Figure 6 UART hardware configuration Caution: All signals are 1.8 V. An external V.24 line driver must be provided if the UART port of the module is connected to a standard V.24 device. Connecting the module without a driver may damage the module. 4.2 ⢠normal type. The factory type is specific for the SC14CVMDECT and should only be set by production. The factory types are either parameters for adjustments used by the baseband or the radio interface, or is used to setup the SC14CVMDECT into special modes. The factory types will only be modified by changing the factory programmed default value. See document reference [2]. Only users with âdebugâ authorization can modify these EEPROM parameters EEPROM 4.2.1 EEPROM layout The SC14CVMDECT PP and FP include a 4 Kbyte EEPROM which is divided into two areas (see Table 6). The other ânormalâ EEPROM parameters can be reset to default values by running a soft default setting (default batch file). Table 6: EEPROM map EEPROM space Size Usage SC14CVMDECT 3.6 Kbyte Used for RF, audio, battery, tone setup, data base, etc. The host is able to read or modify the EEPROM parameters or limited free EEPROM areas via AT commands AT+WEExx. User 0.4 Kbyte. Can be used for MMI applications such as User information. Access to the EEPROM parameters depends on the authorization level set by the AT+WULA parameter: 4.2.2 EEPROM access by MCU 1 = Power User. Able to read from all EEPROM locations and write to locations 0x0F00..0x0FBF (user space). Password: 748357. A detailed overview of the EEPROM parameter is found in document reference [2]. Some parts of the EEPROM parameters are read into the SC14CVMDECT during the start up and other parts are used by the SC14CVMDECT software during execution. 2 = Debug User Highest Authority.Able to read from and write to EEPROM (audio and stack related parameters. Contact SiTel Semiconductor for the password. The EEPROM parameters are divided into 2 types: ⢠Factory type Š 2011 SiTel Semiconductor B.V. Company Confidential 16 August 19, 2011 v1.2.1 Cordless Voice Module 0 = Anonymous User with Lowest Authority (not able to read from and write to EEPROM) 4.3.1 Microphone supply connection For active microphones a voltage source with high supply voltage rejection ratio is provided on supply pins VREFp/VREFm. Filtering of internal and external reference voltages is provided with internal capacitor. No external capacitor shall be connected to the VREFp. To avoid audible switching noise it is important that the ground supply signals are directly âstar pointâ connected to the VREFm and not via a common ground plane. From this VREFm star point, one connection is made to the common ground plane. Audio connection The SC14CVMDECT PP audio connections are show in Figure 7. Refer to âExample Application Diagramâ on page 38 for detailed component values. SC14CVMDECT 4.3 PP AUDIO CONFIGURATIONS The SC14CVMDECT audio is supporting standard DECT audio qualities. The audio gain and volume parameters are placed in the EEPROM. The DECT gains can be adjusted to meet the TBR38 and TBR10 audio level requirements by using the SC14CVMDECT application reference design. For other line and acoustic designs it is needed to adjust and tune the audio setup. Loudspeaker connection (supported in future releases) For the handsfree operation an 4 ohm loudspeaker must be connected to the PAOUTp and PAOUTn pins as shown in Figure 8. The VDDPA is the supply pin. VREFp PAOUTp VREFm Rs_PAOUT Cs_PAOUT VDDPA MICp C_VDDPA VSS/GND PAOUTn MICn Rs_PAOUT MICh Cs_PAOUT LSRp LSRn Figure 8 Loudspeaker connection Refer to Table 12 for a detailed specification of the external components around the loudspeaker. These components are necessary to guarantee lifetime of the module. Figure 7 Audio connections Earpiece or small loudspeaker connection Cordless Voice Module The earpiece loudspeaker can be connected either differentially or single-ended. Dynamic loudspeakers with an impedance of 30 ď can be connected as well as ceramic loudspeakers equivalent to 600 ď and 30 ďF can be connected. Refer to Table 11 for a detailed specification or the earpiece loudspeakers. The earpiece is connected to the LSRp and LSRn pins. Microphone connection The microphone can be connected either single-ended via MICp or differentially to MICp and MICn Headset connection The headset microphone must be connected to the MICh pin. The headset earpiece is connected to the LSRp. Š 2011 SiTel Semiconductor B.V. Company Confidential 17 August 19, 2011 v1.2.1 Audio Modes The Alert state is for tone playing and is entered automatically when tones are played using the API calls. The Alert state can originate from idle earpiece, handsfree or headset state The PP audio handling consists of four audio states. In these states the audio subsystem is configured for a certain audio mode: 1. Idle state (not relevant for microphone configuration) 2. Earpiece Mode (Handset Speaker) SC14CVMDECT 4.3.2 3. Handsfree or Speakerphone Mode 4. Headset mode Selection between the modes is done by API calls; see document reference [1]. Cordless Voice Module Figure 9 PP Audio mode Š 2011 SiTel Semiconductor B.V. Company Confidential 18 August 19, 2011 v1.2.1 PP Audio Codec adjustment 4.3.6 The audio codec settings for the loudspeaker and Microphone must be preconfigured in the EEPROM for each mode. The EEPROM parameter fields for Audio.Earp.xxx, the Audio.Heads.xxx and Audio.SpkPh.xxx have a default value but may be modified to tune the settings. 4.3.4 In Earpiece mode (Handset Speaker) an artificial sidetone is generated. The level of the sidetone can be adjusted and setup in the EEPROM through parameter fields Audio.Earp.Vol.Elementx,SideToneGain and Audio.Heads.Elementx.SideToneGain. In Earpiece mode it is possible to adjust the volume in the Earpiece via the API calls. In Earpiece mode the PP audio is routed as shown in Figure 11. General Audio adjustment For each audio mode, the receive (RLR) and transmit (SLR) audio paths must be adjusted. RLR and SLR are adjusted in the registers in the EEPROM for each audio state; see document reference [2]. 4.3.5 Earpiece Mode 4.3.7 SC14CVMDECT 4.3.3 Alert mode The Alert mode is for generating tone and melodies in the Speakerphone loudspeaker. In Alert mode it is possible to adjust the volume in the speaker via the API calls. Power management To minimize the current consumption the PP will shutdown all codec amplifiers in Idle state. This means that all reference voltages in the front-end will be disabled. This feature can be disabled in the EEPROM if the reference voltages for some reasons are needed in Idle state. 4.3.8 PP Volume The PP supports 6 volume steps, which are EEPROM configurable through parameter fields Audio.Earp.Vol.xxx, the Audio.Heads.Vol.xxx and Audio.SpkPh.Vol.xxx. The volume steps must be set initially in the EEPROM during production. Figure 10 Handset Volume Configuration Inband tones will be affected by the volume adjustments, since the volume control is placed after tones are added to the signal..Figure 11 shows the Audio flow. Here is the list of main functions: Equalizer nc100Hz 100Hz canceller Sidetone Sidetone EC Echo Canceller Vol. Ctrl Volume Control Tonegen Tone generator Š 2011 SiTel Semiconductor B.V. Company Confidential Cordless Voice Module EQ 19 August 19, 2011 v1.2.1 Sidetone EQ EC Vol. ctrl tonegen Tx_out nc100Hz EQ Rx_in SC14CVMDECT Figure 11 PP Audio Routing 4.3.9 PP Audio equalization registered PPs. FP paging does not establish a normal audio connection and is terminated when answered by the PP. In FP Speakerphone mode a voice call can be established when the paging is answered. To enable adjustments of the frequency response the PP contains four programmable filters: 2 in RX direction and 2 in TX direction (see Figure 11). 4.4.6 By default these filters are loaded with bypass coefficients, but the API contains commands to load new coefficient for all filters. The following voice connections are supported. ⢠PP to FP Equalizer filters are part of the audio routes for all audio modes and are placed as shown in Figure 11. ⢠FP to PP. For a detailed description of the filter functionality please refer to API documentation; see document reference [1]. 4.4 4.4.1 Connection scenarios 4.5 TONE/MELODY HANDLING The tone component handles the generation of various tones in the device. Both tones/melodies in a FP and PP configuration are supported. Main features of the tone component are: CALL HANDLING FP to PP Call The main features of the tone component are: When the FP initializes a call to a PP, a radio connection is set up to all the PP applications to make it possible for the PP Application Software to indicate that there is an incoming call. ⢠Ringer tones and melodies (7 tone polyphonic) It is possible to configure the ringing indication using broadcast to make all 6 PPs ringing. When receiving the call, the PP signals the call to the MMI Software. ⢠Inband tones (dial tone, net-congestion tone, busy tone, etc.) 4.4.2 4.6 DATE AND REAL-TIME CLOCK The FP base has a real-time clock feature, which (when activated) broadcasts the date and clock to the PPs. Activation of the date and real-time clock is done by setting the date and clock via the PP. ⢠Alert tones (key sound, error tones, confirmation tones, etc.) ⢠Single tone generation When the MMI Software signals the PP to establish a call, the PP opens the radio connection to the FP. 4.4.3 Intercom and Conference The clock is with hours, minutes and date. The clock supports the leap year. Daylight saving is not supported and must be handled by the MMI application. Not supported. 4.4.4 Call Transfer Call transfers are not supported. 4.4.5 The PP clock is synchronized with the FP every time a broadcast is received. If the PP goes out-of-lock, the PP itself calculates the clock until the PP is again within the range of the FP. The updated clock can then Page Call The Page call is a FP functionality used to locate the Š 2011 SiTel Semiconductor B.V. Company Confidential 20 August 19, 2011 v1.2.1 Cordless Voice Module PP to FP Call When the SC14CVMDECT is configured as a PP, the clock has the same accuracy as the FP clock. But, when the PP synchronises with a FP, the PP crystal is synchronized with the FP crystal and the PP clock will change accordingly. To adjust the clock in the base station, a service connection can be setup which can be set by commands from the PP. The clock can also be read and set directly from an external microprocessor or through the MMI software on the FP base. The accuracy is expected to be within 1 minute for up to 6 weeks without being locked to a FP. The real-time clock accuracy depends directly on the SC14CVMDECT crystal. SC14CVMDECT be read locally from the MMI Software. Figure 12 Clock synchronization Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 21 August 19, 2011 v1.2.1 4.7.3 Pre-amble Antenna diversity The SC14CVMDECT protocol supports the DECT GAP standard. DECT TBR22 GAP type approval however is optional. To optimize the audio quality caused by rapid changing radio paths (fading), the SC14CVMDECT supports pre-amble antenna diversity. The pre-amble diversity algorithm uses RSSI measurements to judge the radio signal strength on both antennas and, as a result of it, the choice of the best performing antenna is determined. The antenna will be used for the receive slot and the next transmit slot. To pass a GAP type approval, a disable of the PP authentication and encryption during conversation is needed for some TBR22 test cases (DLC test cases). This can be done via EEPROM address 0x00F0. The pre-amble antenna diversity is supported by default. The pre-amble diversity can be disabled by EEPROM to let the SC14CVMDECT support a single antenna. See document reference [2]. 4.7.1 4.7.2 DECT TBR22 SC14CVMDECT 4.7 PROTOCOL STACK The protocol stack handles the RF interface. For the SC14CVMDECT the DECT TDMA is used. The protocol features encryption. In general an FP uses diversity and a PP does not. Out-of-Range handling 4.7.4 When the PP goes in-range or out-of-range a signal is sent from the PP to the MMI Software indicating whether the PP is in-lock or is out-of-lock with the FP. Low Speed Data During a voice call or using a service call, data can be transferred at a rate of about 1.6 Kbit/s using IWU to IWU messaging. PP FP PP Figure 13 Low Speed Data Scenario Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 22 August 19, 2011 v1.2.1 chapter 6.1 in EN 300 175-4. This frame has an information field of maximum 63 bytes of which maximum 52 bytes can be used for IWU data. With the SC14CVMDECT it is only possible to send 5 frames in a row without pause. The following frame must be an acknowledge-frame to secure that the internal buffers within the SC14CVMDECT are emptied. ⢠PP to PP (point to point) ⢠FP to PP, PP to FP ⢠PP to all PPs (broadcast) ⢠FP to all PPs (broadcast) All communication is routed via the FP. The FP has number #6. See Figure 14. PP #3 PP #2 FP #6 PP #1 The FA frame is segmented in 5 bytes fragments and transferred over the air-interface in the A-field. The 2bytes CRC is used to determine if the data is received correct. If the data is not received correct this is signalled back to the transmitter by the Q2 bit, and the data is retransmitted. The FA frame has a 2 bytes checksum, used to determine if the complete packet is received correct. If A checksum error is signalled back to the transmitter and the complete packet is retransmitted. The packet will re-transmit until it is received correctly, or the link is closed. PP #4 More transmitted packets will be received in the same order as they were transmitted. The application must handle flow control, if needed. PP #5 PP #0 4.8 REGISTRATION The PP and the FP must be paired using a procedure called Registration. Without Registration, the PP will be out-of-lock and will not be able to establish a link to a FP and therefore not be able to make a call. The registration uses the unique product identities and secures the PP and FP to allow no crosscommunication. To avoid cross-communication it is very important that all the PPs and the FP use an unique numbering scheme. Figure 14 Data connection PP0 to PP1 or all 4.7.5 Broadcasting messages The broadcast message is 19 bytes at a time and can real-time clock from the FP to the PP when the realtime clock is activated. The PP can be deregistered from a FP either via the FP or PP MMI Software using the command interface. It is also possible to deregister a PP from another registered PP. When broadcasting data no active connections are established. The data is transmitted from the FP and received by any registered PP. The communication is only one way. Therefore, the broadcast data is not secured because there is no retransmission. It is possible to pair a PP and FP during the production. 4.8.1 Handling product identities To secure that the FP and PPs do not make crosscommunications a unique ID must be entered into the EEPROM of an FP or PP. For the DECT version the ID for the FP is named RFPI and for the PP the ID is named IPEI. These numbers are factory settings. If the PP does not receive it right the first time, the broadcast data is lost. 4.7.6 IWU to IWU messaging After a successful registration, the IPEI is stored in the FP and the RFPI is stored in the PP. In this way the two parts are known to each other and are allowed to make connections. The registration data are automatically stored in EEPROM of the FP and PP while making the registration. The DECT standard defines an EMC code (see EN 300 175-5, chapter 7.7.23.). This code is unique for a DECT product and must be programmed by the DECT manufacturer to the correct manufacturer code. It is possible to register the same PP to 2 FPs, but it can only be used in one FP at the same time. The EMC code must be the same for SC14CVMDECT based product families when using the IWU to IWU messaging. If the SiTel default EMC EEPROM value is changed the IWU to IWU messaging may not operate correctly. IWU data is transferred in a FA format frame; see Company Confidential 23 August 19, 2011 v1.2.1 Cordless Voice Module The protocol in the SC14CVMDECT module is made according to the DECT/GAP standard as defined in EN 300 175 and EN 300 444. Š 2011 SiTel Semiconductor B.V. SC14CVMDECT The following data connections are supported: SC14CVMDECT Figure 15 Handling Product Identities 4.8.2 Deregistration narrowband calls (G.726). There are two ways of deregistering a PP from an FP: G.711 â u-law, 8 kHz sample rate.Used for narrowband calls (G.726). ⢠Remote FP and PP deregistration The correct way to deregister a PP from an FP is to deregister it remotely in the FP. If this is done over a service connection from the PP to the FP, the FP actually performs the deregistration and then it is automatically signalled to the PP which in turn will drop out- of-lock. Using this method it is also possible to deregister other PPs registered to the FP from one PP. ⢠Compressed wideband using A-law, 16 kHz sample rate. The 16 bit PCM data is encoded as two 8 bit audio samples if 8 kHz frame sync is used. Used for wideband calls (G.722). ⢠Compressed wideband using u-law, 16 kHz sample rate. Removing all registration at once from the FP (e.g. in case the original PPs are lost). The 16 bit PCM data is encoded as two 8 bit audio samples if 8 kHz frame sync is used. Used for wideband calls (G.722). 4.9 PCM INTERFACE The audio is routed between the MCU and the CVM via the PCM bus. The MCU is responsible for selection and enabling of the audio path between the PCM bus and the CVM when calls to the external line are established. This is done with AT commands. Synchronization modes In slave mode the PCM interface can be configured for the following synchronization modes: The CVM is responsible for connecting the right PCM channel to the right handset for external calls when the audio path between the CVM and the handset is opened. ⢠Synchronous system clock: In this mode the clock of the module will be adjusted to follow the PCM clock provided by the master. In this case all audio samples will be kept if the provided PCM clock has an accuracy of +/- 5ppm which is a DECT radio requirement. The physical PCM interface formats are illustrated in the figures in this section. The CVM supports the following PCM data formats Linear PCM, 8 kHz sample rate.Used for narrowband calls (G.726). Linear PCM, 16 kHz sample rate.Used for wideband calls (G.722). G.711 â A-law, 8 kHz sample rate.Used for Š 2011 SiTel Semiconductor B.V. Company Confidential 24 August 19, 2011 v1.2.1 Cordless Voice Module ⢠Asynchronous system clock: In this mode the clock of the module is not synchronized to the PCM clock. This means that audio samples will be either discarded in case the master PCM clock is faster than the clock of the module or samples will be repeated in case the master PCM clock is slower. SC14CVMDECT Figure 16 PCM Interface Formats Š 2011 SiTel Semiconductor B.V. Company Confidential Cordless Voice Module The MCU must make sure that the PCM data format matches the CODEC selected for the call. Modifying the CODEC requires the PCM data format to be changed too. The following figures illustrate the PCM bus with different PCM data formats (PCM CODECâs). 25 August 19, 2011 v1.2.1 SC14CVMDECT A P _ D A T A _ F O R M A T _ L IN E A R _ 8 k H z w ith 8 k H z fr a m e s y n c : PCM CLK 8 KHz FSC P C M in 1 s t fra m e C hannel 0 PCM out 1 s t fra m e C hannel 0 1 s t fr a m e C hannel 1 1 s t fr a m e C hannel 1 2 n d fra m e C hannel 0 2 n d fra m e C hannel 1 2 n d fra m e C hannel 0 2 n d fra m e C hannel 1 1 s t fra m e C hannel 0 1 s t fra m e C hannel 1 1 s t fra m e C hannel 0 1 s t fra m e C hannel 1 A P _ D A T A _ F O R M A T _ L IN E A R _ 8 k H z w ith 1 6 k H z f r a m e s yn c : PCM CLK 16 K Hz FS C P C M in 1 s t fra m e C hannel 0 PCM out 1 s t fra m e C hannel 0 1 s t fra m e C hannel 1 1 s t fra m e C hannel 1 Figure 17 PCM bus with linear PCM, 8kHz sample rate AP_DATA_FORMAT_LINEAR_16kHz with 16 kHz frame sync: PCM CLK 16 KHz FSC PCM in 1st frame Channel 0 PCM out 1st frame Channel 0 1st frame Channel 1 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 Figure 18 PCM bus with linear PCM, 16kHz sample rate Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 26 August 19, 2011 v1.2.1 SC14CVMDECT AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 8 kHz frame sync: PCM CLK 8 KHz FSC 2nd frame PCM in 1st frame Channel 0 1st frame Channel 1 Channel 0 PCM out 1st frame Channel 0 1st frame Channel 1 Channel 0 2nd frame 2nd frame Channel 1 2nd frame Channel 1 AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 16 kHz frame sync: PCM CLK 16 KHz FSC PCM in 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 Figure 19 PCM bus with G.711 â A-law/u-law, 8 kHz sample rate AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.722 used on air): PCM CLK 8 KHz FSC PCM in 2nd frame 1st frame 2nd frame 1st frame Channel 0 Channel 0 Channel 1 Channel 1 4th frame 3rd frame 4th frame 3rd frame Channel 0 Channel 0 Channel 1 Channel 1 PCM out 2nd frame 1st frame 2nd frame 1st frame Channel 0 Channel 0 Channel 1 Channel 1 4th frame 3rd frame 4th frame 3rd frame Channel 0 Channel 0 Channel 1 Channel 1 AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.722 used on air): PCM CLK PCM in 1st frame Channel 0 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 1 Figure 20 PCM bus with compressed wideband using A-law/ u-law, G722 used on air interface. Š 2011 SiTel Semiconductor B.V. Company Confidential 27 August 19, 2011 v1.2.1 Cordless Voice Module 16 KHz FSC SC14CVMDECT AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.726 on air): PCM CLK 8 KHz FSC PCM in 1st frame Channel 0 1st frame Channel 0 1st frame Channel 1 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 0 2nd frame Channel 1 2nd frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 0 1st frame Channel 1 1st frame Channel 1 2nd frame Channel 0 2nd frame Channel 0 2nd frame Channel 1 2nd frame Channel 1 AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.726 on air): PCM CLK 16 KHz FSC PCM in 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 PCM out 1st frame Channel 0 1st frame Channel 1 1st frame Channel 0 1st frame Channel 1 Figure 21 PCM bus with compressed wideband using A-law/ ?-law, G726 used on air interface. Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 28 August 19, 2011 v1.2.1 5.1 CAT-iq also impacts the behaviour of other services in order to ensure attachment of PPs to a line, line settings and several lists properly. INTRODUCTION CAT-iq stands for Cordless Advanced Technology, Internet and Quality. It is the new global technology initiative from the DECT Forum, designed for IP-voice services in the next generation networks. CAT-iq is based on the regulatory framework of the mature and reliable ⢠Parallel calls: initiating a second call in parallel to the first call, toggling between calls, putting a call on hold, resuming calls from on hold, call transfer, 3party conference with established external and/or internal calls ⢠DTMF and tones DECT technology. It is fully backward compatible to DECT GAP and, as the new cordless phone standard, focuses on high quality Audio VoIP (wideband) as well as low bit-rate data applications as the next generation Cordless Phone standard. ⢠Headset support ⢠Easy PIN code registration ⢠Easy pairing ⢠handset location 5.2 CAT-IQ PROFILE OVERVIEW The CAT-iq profiles are split between voice and data services, with CAT-iq 1.0 and CAT-iq 2.0 providing features to support key voice enhancements, and CATiq 3.0 and CAT-iq 4.0 providing features to support data. Each profile has a corresponding ETSI specification, the organization where the technical experts have realized the requirements as defined for each profile by the DECT Forum. 5.2.1 SC14CVMDECT 5.0 CAT-iq 1.0 ⢠Narrowband (G.726) and wideband (G.722) audio and switching between these two codecs is supported. ⢠CLIP, CNIP, CLIR: Calling Line Identification Presentation, Calling Name Identification, Calling Line Identity Restriction for internal and external calls. 5.2.2 CAT-iq 2.0 (Supported in future releases) ⢠Synchronization of call lists and telephone books, missed calls list, incoming accepted calls list, internal names list (unique identifier of each handset), base telephone book ⢠Synchronization of system settings: PPs are enabled to change partly the configuration of the system consisting of FP and PPs, these system settings are handled using the list access method. Using this method, the FP and the PPs support: Cordless Voice Module ⢠Synchronization of time and date for FP and PPs, that FP is enabled to transmit time and date to the PPs. ⢠Reset to factory settings, means that PP is enabled to reset the FP configuration to itâs factory setting. ⢠Obtaining FP versions, means that a PP can obtain the software release of the FP. ⢠Multiple lines handling: The behavior of DECT systems connected to more than one network lines. These lines may be of different types (VoIP and PSTN for example). This feature details how calls are placed in a multiple lines context. This feature Š 2011 SiTel Semiconductor B.V. Company Confidential 29 August 19, 2011 v1.2.1 6.1 Specifications ABSOLUTE MAXIMUM RATINGS Table 7: Absolute Maximum Ratings (Note 1) Description Condition Min Max Unit VBAT 5.5 VBATT, VCCRF, VDDPA 3.6 VDDIO PON 5.5 Port pins LED4, LED3 3.6 human body model 2000 machine model 100 Maximum supply voltages: SC14CVMDECT 6.0 Maximum voltage on pins: ESD voltage all pins Note 1: Absolute maximum ratings are those values that may be applied for maximum 50 hours. Beyond these values, damage to the device may occur. Table 8: Operating Conditions Description Condition Min TYP Max Unit 5.5 3.45 Supply voltage: VBAT 2.1 VBATT, VCCRF, VDDPA VDD 2.1 The module provides an output voltage in this range VDDIO 1.8 1.65 1.65 1.98 5.5 P2[0]/LED4, P2[1]/LED3 3.45 All other pins 10 mA CLASSD pins 500 mA VREFp mA Voltage on pins: PON pin 2.1 Maximum Currents through pins CHARGE pin Company Confidential 30 August 19, 2011 v1.2.1 Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Series resistor R>(Vcharger-3)/10mA DIGITAL INPUT LEVELS Table 9: DIGITAL INPUT LEVELS Description Condition Min Max Units Logic 0 input level all digital pads, except PON, CHARGE 0.3 x VDD PON VDD=1.8V 0.9 CHARGE 0.9 RSTn 0.2 x VDD SC14CVMDECT 6.2 Logic 1 input level all digital pads, except PON, CHARGE 0.7 x VDD PON 1.5 CHARGE 1.5 RSTn 0.8xVDD 6.3 VDD = 1.8 V DIGITAL OUTPUT LEVELS Table 10: Digital Output Levels Descriptions Conditions Logic 0 output level (For drive capability see pin description) Iout = 2,4,8 mA VDD = 1.8 V Logic 1 output level Iout = 2,4,8 mA VDD = 1.8 V 6.4 Min Max Units 0.2 x VDD 0.8 x VDD LOUDSPEAKER LOAD CIRCUITS Table 11: LSRp/LSRn load circuits PARAMETER DESCRIPTION CONDITIONS Cp1_Rl1_inf Load capacitance Cp1_Rl1_1k Load capacitance Rl1 Load resistance Cp2 Parallel load capacitance Cs2 Serial load capacitance Rl2 Load resistance MIN TYP MAX UNITS see Figure 22, RL1 = ďĽ 30 pF see Figure 22, RL1 ďŁď ďąď kď 100 pF 30 pF 30 ďF ď 28 see Figure 23 ď 600 LSRp RL2 RL1 Cp2 Cp1 Cs2 LSRn LSRn Figure 23 Load circuit B Piezo loudspeaker Figure 22 Load circuit A Dynamic loudspeaker Š 2011 SiTel Semiconductor B.V. Company Confidential 31 August 19, 2011 v1.2.1 Cordless Voice Module LSRp PARAMETER DESCRIPTION CONDITIONS C_VDDPA Decoupling capacitor on VDDPA Required when Class-D is used and guaranteed life time. (see Figure 24) MIN TYP MAX UNITS ďF Cs_PAOUT Snubber capacitor (to reduce ringing at PAOUTp/n) Required when Class-D is used to prevent EMI and guaranteed life time. (see Figure 24) nF Rs_PAOUT Snubber resistor (to reduce ringing at PAOUTp/n) Required when Class-D is used to prevent EMI and guaranteed life time. (see Figure 24) ď SC14CVMDECT Table 12: PAOUTp, PAOUTn external components PAOUTp Rs_PAOUT Cs_PAOUT VDDPA C_VDDPA VSS/GND PAOUTn Rs_PAOUT Cs_PAOUT May 10, 2010 Figure 24 Class-D external components Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 32 August 19, 2011 v1.2.1 GENERAL SPECIFICATIONS Table 13: SC14CVMDECT module Item Condition Value Unit Dimension lxwxh 25.0 x 29.0 x 2.9 mm 4.5 -20 to +60 °C 1870 to 1930 MHz - typical outdoor 350 - typical indoor 75 Weight Temperature Range Frequency range According to DECT standard Antenna Range According to DECT standard; (Note 2) Standard Compliancy ETS 300 444 (DECT GAP), former TBR2214 FCC part 15 Power supply 2 or 3 cell NiCd/NiMH Note for 1 Li-Ion battery an external LDO is required. 2.10 to 3.45V Maximum PCB warpage For entire reflow range 0.1 mm Note 2: SC14CVMDECT 6.5 The resulting range is very dependent of the mechanical design. SiTel is not responsible for this design and as such SiTel is not responsible for the resulting range performance of the final product. 6.6 BASEBAND SPECIFICATIONS Table 14: Baseband specifications Item Specification Serial Interface baud rate Min Typ Max Unit UART; Interface for external microprocessor or PC 115.2 kBits Flash Download baud rate Via UART 115.2 kBits Flash data space Module Flash kByte EEPROM data space Module EEPROM 0.4 kByte Analog front-end/Audio PP/FP Application: Interface for Microphone, Earpiece, Headset Power consumption (charge) FP Application (3.3V): - stand by mode 55 60 mA - talk mode 65 70 mA - stand by mode 4,5 mA - talk mode 30 40 mA PP Application (3.3V): RADIO PART (RF) SPECIFICATIONS Table 15: Radio part (RF) Item Conditions Min Typ Max Unit Receive sensitivity @ BER = 0.001 -93 -92 -89 dBm Receive IIP3 Š 2011 SiTel Semiconductor B.V. -20 Company Confidential 33 dBm August 19, 2011 v1.2.1 Cordless Voice Module 6.7 Item Conditions Min Typ Max Unit Transmit Power (NTP) DECT: 200 mW 20 23 25.5 dBm DECT6.0: 115 mW (max peak) 18.5 21 24 dBm TDMA (time division multiple access) 6xRx + 6xTx time slots per carrier Data rate Modulation depth DECT GFSK bandwidth = 20 dB < Antenna diversity Two built-in antennaâs Standard Compliancy ETS 301 406 (former TBR6) 6.8 1.152 Mbits/s 1,728 MHz SC14CVMDECT Table 15: Radio part (RF) FP POWER SUPPLY Table 16: Requirements for linear supply regulator Parameter Description Condition Min Typ Max Unit VCCRF Voltage at VCCRF Unloaded VB Loaded VB-V1-V2-V3 2.1 3V 3.45 V1 Settling time I = 50 mA 20 mV V2 Receive period I = 130 mA 100 mV V2 Transmit period I = 400 mA 200 mV V3 Drop during transmit 25 mV none mV Additional ripple (DC/DC) none none Cordless Voice Module Figure 25 FP power supply Š 2011 SiTel Semiconductor B.V. Company Confidential 34 August 19, 2011 v1.2.1 Design guidelines Headset detection boundaries can be adjusted in EEPROM. When headset indication is received from the PP Headset detection logic (future release), the Application Software can decide if audio should be switched to the headset and sends a request to the SC14CVMDECT. This section describes the software and hardware considerations taken into account when designing the target application. The PP audio handling basically consists of 4 audio states (see Figure 9): The SC14CVMDECT can be used standalone or next to an MCU that controls the module. In case the module is used standalone the application will be stored in its on-board Flash. In total 324kBytes of Flash are available for this. 1. Idle (Alert) State 2. Earpiece State 3. Handsfree State (Speakerphone) Applications can be written with the Athena software development environment (see [4]). 4. Headset State 7.1 APPLICATION SOFTWARE FOR PP In a PP application the following software tasks must be handled by the MCU or within the module itself: Shifting between states is done through the API. ⢠UART communication (external microprocessor only) Tone handling Please refer to the PP application layout for pin connections. The Application Software state machine must control when to play tones and the volume setting. Custom melodies can be defined in the EEPROM. ⢠PP MMI ⢠Display interface (optional) ⢠Keyboard interface (optional) 7.2 APPLICATION SOFTWARE FOR FP In an FP application the following software tasks must be handled by the MCU or within the module itself: ⢠Battery Charge interface (optional) ⢠Audio handling ⢠UART communication (external microprocessor only) ⢠Tone / Melodies handling For control commands see document reference [1]. ⢠FP MMI UART communication ⢠Display interface (optional) The UART communication is the main control interface of the SC14CVMDECT. ⢠Keyboard interface (optional) ⢠Audio handling PP MMI ⢠Tone / Melodies handling The MMI state machine must handle the call setup and call termination on the PP. For control commands see document reference [1]. Display Interface UART Communication The MCU / PP handles the display interface including the display driver. The UART communication forms the basic of the FP operation because via this interface the SC14CVMDECT is controlled. Keyboard Interface PP MMI The MCU/ PP handles the keyboard interface including the keyboard driver. The MMI state machine must handle the call setup and call termination on the FP. Battery Charge handling The MCU/ FP handles the display interface including the display driver. Keyboard Interface The MCU/ FP handles the keyboard interface including the keyboard driver. Audio handling Audio Handling The Application Software state machine must control when to open and close the audio. The headset plug-in detection must handled by the host, and a status is send to the PP MMI from the PP. The PP MMI must handle the volume control. Company Confidential The Application Software state machine must control when to open and close the audio. The headset plug-in detection is handled by the FP, and a status is send to the FP MMI from the FP. The FP MMI must handle the 35 August 19, 2011 v1.2.1 Cordless Voice Module Display Interface SC14CVMDECT V3 supports no battery management. This must be done by and external charge circuit on combination with the external MCU. The Application Software must handle the MMI part such as battery status for the user and the PP battery current consumption states. Š 2011 SiTel Semiconductor B.V. SC14CVMDECT 7.0 ⢠Make angle breaks on long supply lines to avoid resonance frequencies in respect to DECT frequencies. Maximum 8 cm before an angle break is recommended. ⢠Supply lines should be placed as far as possible away from sensitive audio circuits. If it is necessary to cross supply lines and audio lines, it should be done with right angles between supply and audio lines/circuits (microphone, ear-speaker, speakerphone, etc.) Tone Handling The Application Software state machine must control when to play tones and the volume setting. Custom melodies can be defined in EEPROM. ⢠Ground plane considerations In order to achieve the best audio performance and to avoid the influence of power supply noise, RF radiation, TDD noise and other noise sources, it is important that the audio circuits on both FP and PP applications boards are connected to the GND_ANA pins (analog ground) on the SC14CVMDECT with separate nets in the layout. It is advised to provide the following audio circuits with separate ground nets connected to the GND_ANA pins: 7.3 HARDWARE DESIGN GUIDELINES Within this section general design guidelines for SC14CVMDECT FP and PP applications are given. 7.3.1 Circuit design Guidelines For a reference schematic refer to the SC14CVMDECT reference kit. With the reference kit package a noncost optimized reference design is presented. ⢠Microphone(s) For a FP hardware design the following hardware parts will be needed besides the SC14CVMDECT: ⢠Headset microphone and speaker ⢠Supply voltage ⢠Speakerphone (signal grounds) ⢠Battery charge Depending on the layout it may also be necessary to bypass a number of the audio signals listed above to avoid humming, noise from RF radiation and TDD noise with. It is also important to choose a microphone of appropriate quality with a high RF immunity (with built-in capacitor). ⢠LED and buttons ⢠Speakerphone For a PP hardware design the following hardware parts will be needed besides the SC14CVMDECT: ⢠ESD performance Besides TDD noise, the ESD performance is important for the end-application. In order to achieve a high ESD performance supply lines should be placed with a large distance from charging terminals, display, headset connector and other electrical terminals with direct contact to the ESD source. On a two-layer PCB application it is important to keep a simulated one layer ground. With a stable ground ESD and TDD noise performance will always improve. ⢠Power ⢠Battery Charger ⢠Audio: ⢠Microphone ⢠Earpiece ⢠Speaker ⢠Headset 7.3.2 PCB Design Guidelines Cordless Voice Module ⢠Because of the presence of the digital radio frequency burst with 100 Hz time division periods (TDD noise), supply ripple and RF radiation, special attention is needed for the power supply and ground PCB layout. ⢠Power supply considerations Both high and low frequency bypassing of the supply line connections should be provided and placed as close as possible to the SC14CVMDECT. In order to get the best overall performance for both FP and PP applications, a number of considerations for the PCB has to be taken into account. ⢠The width of the power amplifier supply line is recommended to be between 0.8 and 1.2 mm due to high current peaks during RF bursts. Š 2011 SiTel Semiconductor B.V. SC14CVMDECT volume control. Headset detection boundaries can be adjusted in EEPROM. When headset indication is received from the FP headset detection logic (future release), the Application Software can decide if audio should be switched to headset and sends a request to the FP. Company Confidential 36 August 19, 2011 v1.2.1 SC14CVMDECT 8.0 Audio Level Adjustment 8.1 PP AUDIO LEVEL For adjusting the audio levels in the PP (SLR/TOLR) and (RLR/OLR) the related eeprom parameters can be adjusted during production. 8.2 FP AUDIO LEVEL) For adjusting the audio level in the FP (SLR/TOLR) and (RLR/ROLR) he related eeprom parameters can be adjusted during production. Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 37 August 19, 2011 v1.2.1 SC14CVMDECT 9.0 Example Application Diagram 9%$7 9%$7 - $ 9'' %DWWHU\ &RQQHFWRU *1' & X) 9 *1' ' & % & S) *1' & X) 9 & S) & S) $ *1' ( ) *1' *1' ( & ( *1' + *1' ) ) ) 5 + '1$ 5 + * '1$ ) / *1' - + - (DUSLHFH & & '1$ '1$ ) 5 . 5 / . % 5 $ *1' . 5 & . / '1$ + * *1' - 5 & 5 5 0LFURSKRQH 5 - 0,&+ . 5 X) 9 / & '1$ '1$ + $ $*1' 5 $*1' & X) 9 5 3:063,B', 9'',2 ) & & -7$* 0 % 5 *1' *1' 5 * &+$5*(B&75/ 21(B&(// 8/3B0$,1 8/3B9%$7 8/3B3257 ,17,17/( ,17,176. ,17,176,2 ,177'2' ,179''(5', 321 &+$5*( 1& 5 '&B&75/ '&B&75/1 5)3 5)3 5)3 5)321 5) (&=3:0/(' (&=3:0/(' &/.3&0B&/. '36'$3&0B', '36&/3&0B'2 6)3&0B)6& ,17:7)B,1 . $ $ $ $*1' $ % 9'' % % % % -7$* & 85; & 87; & & ' %0%65667% 3URJUDPPLQJ3LQV ' *1' ' ' ' *1' 3B ) 3B ( 3B ) 3B & 3B $ 3B ) 3B & 3B % 3B ' 321 ' 3B . 3B - 3B + 3B ) 3B ' 3B ,17%;7$/ ' 3B % 3B & 3B & 3B ' 3B . 3B * 3B . 3B - 3B . 3B + 3B 5) &3B9287 '33$2871 &3B9287 '33$2873 :/(' 3>@&,',13 $'& :/(' 3$5$'(7 :/(' /653 5,1*2875,1*,1* /651 5,1*1 0,&+ 5,1*3 0,&3 0,&1 95()3 *1' 95()0 *1' *1' 5671 $'& *1' -7$* *1' *1' 73 *1' 73 *1' *1' 1& *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' *1' 6&&90'(&7 ( ( ( ( ( ( ( * * * * * * * + + + - - - - - Cordless Voice Module - 3B % 5) *1' $ *1' 85; $ 1& '1$ 87; % 62&1 *1' 9 & 62&3 X) 5 63,B'2 *1' 63,B&/. 9&&5) *1' . & 9''3$ 95()3 . 63,B(1 9'' ,17$'& S) 3:085; 9%$77 & S) 87; 9%$7 - - . / / / / / / / *1' Figure 26 Referencediagram Š 2011 SiTel Semiconductor B.V. Company Confidential 38 August 19, 2011 v1.2.1 SC14CVMDECT 10.0 Mechanical Dimensions Cordless Voice Module Figure 27 Package Outline Drawing Š 2011 SiTel Semiconductor B.V. Company Confidential 39 August 19, 2011 v1.2.1 partly surrounding the antennas, will normally cause a significant degradation of the coverage. 11.1 MODULE PLACEMENT ON THE MAIN BOARD In order to ensure FCC compliance, proper coverage and to avoid detuning of the antennas, it required to place the module free on the main board in relation to other surrounding materials. Place the module at the corner of the main-board as shown in Figure 28. If the module has to be placed away from the edge of the main-board, then avoid conducting areas in front of the antennas and make a cut-out in the main board underneath the antennas as shown in the figure. Keep a distance of at least 10 mm from the antenna elements to conducting objects and at least 5 mm to non-conducting objects. SC14CVMDECT 11.0 Module integration Keep solid ground on layer 2 out to the edges of the main board as shown. Keep in mind that electrical shielding objects, even Figure 28 Module placement on the main board (top view) Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 40 August 19, 2011 v1.2.1 SC14CVMDECT 12.0 UTAM membership waiver Payment of the Up Front Membership Fee and Per Radiating Device Fees is not required from a manufacturer or distributor that uses an FCC-certified module for which such fees have been paid. Such an âFCC certified moduleâ is defined as a device that contains the complete UPCS-compliant radio modem functionality from a supplier that has a valid UTAM Affidavit. The hardware and firmware implementation of the FCC certified module must not be modified by the manufacturer or distributor in a way that would invalidate its original FCC certification unless the manufacturer of the device that will contain the module secures its own FCC approval. Any applicant for FCC approval seeking to use an FCC certified module must give the FCC ID number of the certified module that it will employ and attest that it is using a module for which UTAM fees have been paid. See also www.utam.org Cordless Voice Module Š 2011 SiTel Semiconductor B.V. Company Confidential 41 August 19, 2011 v1.2.1 SC14CVMDECT 13.0 Soldering 13.1 SOLDERING PROFILE The SC14CVMDECT should be soldered using a standard reflow soldering profile and lead free solder paste as shown below. Adjustments to the profile may be necessary depending on process requirements. Reflow profile â leadfree Sn96.5-Ag3.0-Cu0.5 Temp. C° t3 250° T3 t4 220°C Meltingpoint 217°C 200° T2 190°C T1 150°C 150° 100° 50° t1 t2 0° Time t1: Max. Change in temperature t2: Time in preheat (150°C < temp. < 190°C) t3: Time in reflow zone (temp. > 220°C) t4: Peak temperature 3°C/sec. 60 - 120 sec. 30 - 60 sec. 237°CÂą5°C T1 Preheat zone bottom T2 Preheat zone top T3 Reflow zone 150°C 190°C 220°C Figure 29 Reflow profile Cordless Voice Module 13.2 COPPER PAD AND SOLDER OPENING Recommended Copper Pad and Solder Mask Opening (NSMD). Š 2011 SiTel Semiconductor B.V. Company Confidential 42 August 19, 2011 v1.2.1 ma sk pen ing 1.08 0xx1 ..0800 . pa Cu 8000 xx01.. .800 d 01 SC14CVMDECT So lde mm Copper pads Solder Mask Substrate Figure 30 Copper pad and Solder mask opening 13.3 STENCIL For the stencil a thickness of 0.122 mm is recommended. Recommended opening is as shown below. Stencil 0.80x0.80 Opening in stencil 1.40 x 1,40mm Cordless Voice Module Figure 31 Stencil Š 2011 SiTel Semiconductor B.V. Company Confidential 43 August 19, 2011 v1.2.1 ⢠Consult the dealer or an experienced radio/TV technician for help. 14.1 FCC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER. This module is for use only in DECT / UPCS handsets and base stations. Privacy of communications may not be ensured when using this phone. A separation distance of at least 20 cm must be maintained between the base station and all persons (excluding extremities of hands, wrist and feet). The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other transmitter 14.2 PRECAUTIONS REGARDING UNINTENDED COUPLING The SC14CVMDECT does not have any electrical Shielding, so by integration on the main board precautions shall be taken in order to avoid any kind of coupling from the main board to the RF part of the module. If there is any doubt about this, a radio short test should be performed. The end product that the module is integrated into must be marked as follows: "Contains Transmitter Module FCC ID: Y82-SC14A / IC: 9576A-SC14A" The literature provided to the end user must include the following wording: FCC compliance statement 14.3 END APPLICATION APPROVAL The module is intended to be used in an end application. When the requirements in 14.2 are fulfilled, no further test concerning the module is needed. Type approval concerning the end product, except for the module, should off cause be done. Please contact a test-house in order to clarify what is needed. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation of the device. Module transmetteur ID IC: 9576A-SC14A 14.4 SAFETY REQUIREMENTS This section provides of an overview of the safety requirements you must adhere to when working with the Cordless Voice Module SC14CVMDECT. Son fonctionnement est soumis aux deux conditions Suivantes: (1) cet appareil ne doit pas causer D'interfĂŠrences nuisibles et (2) appareil doit accepter Toute interference recue, y compris les interferences Qui peuvent pertuber le fonctionnement. ⢠The specific external power supply for the Cordless Voice Module SC14CVMDECT has to fulfill the requirements according to clause 2.5 (Limited power source) of this standard EN 60950-1:2006. Changes or modifications to the equipment not expressly approved by the Party responsible for compliance could void the user's authority to Operate the equipment. ⢠Interconnection circuits shall be selected to provide continued conformance to the requirements of clause 2.2 for SELV (Safety Extra Low Voltage) circuits according to EN 60950-1:2006 after making connections. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. ⢠Interface type not subjected to over voltages (i.e. does not leave the building). This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. ⢠Requirements additional to those specified in this standard may be necessary for: ⢠Equipment intended to be used in vehicles, on Board ships or aircraft, in tropical countries or at altitudes greater than 2000 m. ⢠Equipment intended for use where ingress of water is possible. ⢠Reorient or relocate the receiving antenna ⢠Increase the separation between the equipment and receiver ⢠Installation by qualified personnel only! ⢠The product is a component intended for installation and use in complete equipment. The final acceptance of the component is dependent upon its installation and use in complete equipment. ⢠Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Company Confidential 44 August 19, 2011 v1.2.1 Cordless Voice Module ⢠Equipment intended for operation in special environments (for example, extremes of temperature, excessive dust, moisture or vibration, flammable gases and corrosive or explosive atmospheres). If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Š 2011 SiTel Semiconductor B.V. SC14CVMDECT 14.0 Notices to OEM Datasheet Status Product Status Definition Advance Information Formative or in Design This data sheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This data sheet contains preliminary data. Supplementary data will be published at a later date. SiTel Semiconductor reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. No Identification Noted Full production This data sheet contains final specifications. SiTel Semiconductor reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Obsolete Not in Production This data sheet contains specifications on a product that has been discontinued by SiTel Semiconductor. The data-sheet is printed for reference information only. SC14CVMDECT Product Status Definitions SiTel Semiconductor reserves the right to make changes without notice to any products herein to improve reliability, function or design. SiTel Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the right of others. Life Support Policy SiTelâS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CIRTICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSIL OF SiTel SEMICONDUCTOR. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labelling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. SiTel Semiconductor does not assume any responsibility for use of any circuit described, no circuit patent licenses are implied, and SiTel reserves the right, at any time without notice, to change said circuitry or specifications. RoHS Compliance SiTel Semiconductor complies to DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 concerning Restriction of Hazardous Substances (RoHS). Contacting SiTel Semiconductor The Netherlands SiTel Semiconductor B.V. Phone: +31 73 640 88 22 North America SiTel North America Phone: +1 408 727 3200 Singapore SiTel Semiconductor Singapore Phone: +65 64845419 Japan SiTel Semiconductor K. K. Phone: +81 3 3769 8123 SiTel Semiconductor Japan Short Range wireless & VoIP Phone: +81 3 5408 4330 Š 2011 SiTel Semiconductor B.V. Company Confidential 45 August 19, 2011 v1.2.1 Cordless Voice Module SiTel Semiconductor statement on RoHS can be found on the customer portal http:/portal.SiTel-semiconductor.com. RoHS certificates from our suppliers are available on request.
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