Dialog Semiconductor SC14A DECT Cordless Voice Module User Manual SC14CVMDECTv1 2ls

Dialog Semiconductor BV DECT Cordless Voice Module SC14CVMDECTv1 2ls

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user manual

Download: Dialog Semiconductor SC14A DECT Cordless Voice Module User Manual SC14CVMDECTv1 2ls
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Document ID1546287
Application IDJbrlmB9Jxq56rqa7bMFNkg==
Document Descriptionuser manual
Short Term ConfidentialNo
Permanent ConfidentialNo
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Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize97.36kB (1217042 bits)
Date Submitted2011-09-22 00:00:00
Date Available2011-10-06 00:00:00
Creation Date1997-02-03 11:26:52
Producing SoftwareAcrobat Elements 9.0.0 (Windows)
Document Lastmod2011-09-22 14:08:48
Document TitleSC14CVMDECTv1.2ls.fm
Document CreatorFrameMaker 9.0
Document Author: mulders

DATASHEET
SC14CVMDECT
Cordless Voice Module
General description
The SC14CVMDECT is a member of the Cordless
Module family with integrated radio transceiver and
baseband in a single package. It is designed for hosted
and embedded cordless voice and data applications in
the DECT frequency band. Its simple to use
AT Commands set allows setting up of a wireless link
between 2 or more nodes without detailed knowledge
of the DECT protocol.
Features
Up-to 6 portable parts registered per fixed part
UART interface to external host
Controllable via AT command set (over UART)
Support voice and low speed data
RF range: 1870 - 1930 MHz
Receiver sensitivity < -93 dBm
Transmit power 23 dBm (200 mW)
Antenna’s included
Power supply voltage 1.9 - 3.45V
Small form factor (25mm * 29mm)
Contains both PP and FP functionality
Program memory available for custom software.
SC14CVMDECT
August 19, 2011 v1.2.1
Completely ETSI-certified
ETSI 300 444 (DECT GAP) compliant
Application Examples
FCC approved
n Cordless Intercom
Supports EU-DECT (CAT-iq V1 wideband audio),
n Cordless baby monitor
DECT6.0 for North America and Japan DECT (pendn Wireless Data applications up to 1.6 Kbit/s.
ing approval)
________________________________________________________________________________________________
System Diagram
US/EU/JP*
DECT
Voice 32kbits/s
Data 1.6kbits/s
Host
SC14CVMDECT
Voice
Portable Part 0
Voice
Host
SC14CVMDECT
Host
Fixed Part
SC14CVMDECT
Voice
Portable Part 1
Host
SC14CVMDECT
Voice
Portable Part 5
Š 2011 SiTel Semiconductor B.V.
Company Confidential
Cordless Voice Module
* Only end-products
can be CAT-iq certified
1.0 Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . 3
8.0 Audio Level Adjustment . . . . . . . . . . . . . . . . . . . 37
1.1 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . 3
8.1 PP AUDIO LEVEL . . . . . . . . . . . . . . . . . . . . . . 37
8.2 FP AUDIO LEVEL) . . . . . . . . . . . . . . . . . . . . . 37
2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
9.0 Example Application Diagram. . . . . . . . . . . . . . . 38
2.2 ORDERING INFORMATION . . . . . . . . . . . . . . . 8
10.0 Mechanical Dimensions . . . . . . . . . . . . . . . . . . 39
2.3 REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . 8
SC14CVMDECT
Table of Contents
11.0 Module integration . . . . . . . . . . . . . . . . . . . . . . . 40
2.4 GLOSSARY AND DEFINITIONS . . . . . . . . . . . 8
11.1 MODULE PLACEMENT ON THE MAIN BOARD
3.0 Cordless Voice Module functionality . . . . . . . . . . 9
40
3.1 MODULE HARDWARE . . . . . . . . . . . . . . . . . . . 9
3.2 SOFTWARE CONTROL . . . . . . . . . . . . . . . . . . 9
12.0 UTAM membership waiver . . . . . . . . . . . . . . . . 41
3.3 DECT PROTOCOL STACK . . . . . . . . . . . . . . . 9
13.0 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.4 PORTABLE PART CONFIGURATION . . . . . 10
13.1 SOLDERING PROFILE . . . . . . . . . . . . . . . . . 42
3.5 FIXED PART CONFIGURATION . . . . . . . . . . 12
13.2 COPPER PAD AND SOLDER OPENING . . . 42
3.6 LIGHT DATA APPLICATION . . . . . . . . . . . . . 14
13.3 STENCIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
3.7 FUNCTIONAL OVERVIEW . . . . . . . . . . . . . . . 15
14.0 Notices to OEM. . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.0 Functional description. . . . . . . . . . . . . . . . . . . . . 16
14.1 FCC REQUIREMENTS REGARDING THE END
4.1 UART INTERFACE . . . . . . . . . . . . . . . . . . . . . 16
PRODUCT AND THE END USER . . . . . . . . . 44
4.2 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
14.2 PRECAUTIONS REGARDING UNINTENDED
4.3 PP AUDIO CONFIGURATIONS . . . . . . . . . . . 17
COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.4 CALL HANDLING . . . . . . . . . . . . . . . . . . . . . . 20
14.3 END APPLICATION APPROVAL . . . . . . . . . 44
4.5 TONE/MELODY HANDLING. . . . . . . . . . . . . . 20
14.4 SAFETY REQUIREMENTS . . . . . . . . . . . . . . . . . 44
4.6 DATE AND REAL-TIME CLOCK . . . . . . . . . . 20
4.7 PROTOCOL STACK . . . . . . . . . . . . . . . . . . . 22
4.8 REGISTRATION . . . . . . . . . . . . . . . . . . . . . . 23
4.9 PCM INTERFACE . . . . . . . . . . . . . . . . . . . . . 24
5.0 CAT-iq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . 29
5.2 CAT-IQ PROFILE OVERVIEW . . . . . . . . . . . . 29
6.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.1 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . 30
6.2 DIGITAL INPUT LEVELS . . . . . . . . . . . . . . . . 31
6.3 DIGITAL OUTPUT LEVELS . . . . . . . . . . . . . . 31
Cordless Voice Module
6.4 LOUDSPEAKER LOAD CIRCUITS. . . . . . . . . 31
6.5 GENERAL SPECIFICATIONS . . . . . . . . . . . . 33
6.6 BASEBAND SPECIFICATIONS . . . . . . . . . . . 33
6.7 RADIO PART (RF) SPECIFICATIONS . . . . . . 33
6.8 FP POWER SUPPLY . . . . . . . . . . . . . . . . . . . 34
7.0 Design guidelines. . . . . . . . . . . . . . . . . . . . . . . . . 35
7.1 APPLICATION SOFTWARE FOR PP . . . . . . 35
7.2 APPLICATION SOFTWARE FOR FP . . . . . . 35
7.3 HARDWARE DESIGN GUIDELINES . . . . . . . 36
Š 2011 SiTel Semiconductor B.V.
Company Confidential
August 19, 2011 v1.2.1
SC14CVMDECT
1.0
Connection Diagram
12 11 10 9 8 7 6 5 4 3 2 1
Figure 1 Connection Diagram (Bottom View)
1.1
PIN DESCRIPTION
Table 1: Pin description
In/
Out
Iout
Drive
(mA)
GND
Ground
GND
Ground
Pin
Module
Pin name
A1
A2
Reset
Description
State
A3
GND
Ground
A4
NC
leave unconnected
A5
VDDIO
Supply voltage for internal QSPI and data flash. Must be connected
to VDD (1.8V).
A6
P1[2]/INT2
IO
I-PU
A7
GND
Ground
A8
GND
Ground
A9
VBAT
Main supply voltage <5.5V. Can be directly connected to a Li-Ion
battery.
A10
P0[4] / SPI_EN
IO
I-PU
A11
RSTn
B1
GND
Ground
B2
GND
Ground
B3
CP_VOUT1
Charge Pump Output 1.
Must be connected through a capacitor of 1uF to gnd
B4
P1[5]/INT5
IO
O-1
I/O port
SPI_EN
I-PU Active low Reset input with Schmitt-trigger input, open-drain output
(200k and pull up resistor to internal VDD. Input may not exceed 2.0 V. An
pull-up) internal capacitor of 100nF is mounted on this pin.
Company Confidential
I/O Port
INT5: Interrupt Input.
August 19, 2011 v1.2.1
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
I/O port.
INT2: Interrupt Input.
SC14CVMDECT
Table 1: Pin description (Continued)
In/
Out
Iout
Drive
(mA)
Pin
Module
Pin name
B5
GND
B6
P2[6]/INT6 /
WTF_IN
IO
I-PU
I/O port
INT6: Interrupt Input.
WTF_IN: -
B7
P0[5] / SPI_CLK
IO
I-PU
I/O Port
SPI Clock
B8
GND
B9
P0[1] / URX
IO
I-PD
(10k)
B10
VBATT
Reset
Description
State
Ground
I/O port
UART Serial In
Secondary supply voltage. Connect to VCCRF.
B11
GND
Ground
B12
NC
RF pad, no pad on PCB
C1
GND
Ground
C2
PAOUTn
IO
500
O-0 (5k CLASSD loudspeaker positive output
fixed
pulldown)
C3
GND
C4
P2[7]/INT7
IO
I-PU
I/O port
INT7: Interrupt
C5
P1[4]/INT4
IO
1/2
I-PD
I/O port
INT4: Interrupt
C6
P1[1]/INT1
IO
I-PU
I/O Port
INT1: Interrupt
LE: INT6: secondary Interrupt
C7
GND
C8
P0[0] / UTX
I-PU
C9
GND
C10
JTAG
IO
I-PU
C11
VCCRF
RFSUPPLY input < 3.45V. Connect to VBAT if VBAT less than
3.45V. Else this pin must be supplied from and external 3.3V LDO.
Refer to Table 16 for supply requirements.
D1
GND
Ground
D2
PAOUTp
IO
500
D3
PON
Ground
I/O Port
UART Serial Out
Ground
JTAG-SDI+; one wire Debug interface with open-drain.
Pullup with R=1k to Vdd.
O-0 (5k CLASSD loudspeaker positive outputs
fixed
pulldown)
I (270k Power on, Switches on the device if Voltage > 1.5V.
fixed May be directly connected to VBAT, also with Li-Ion batteries
pulldown)
Company Confidential
August 19, 2011 v1.2.1
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
Ground
Pin
Module
Pin name
In/
Out
Iout
Drive
(mA)
D4
CHARGE
I-PD
(270k
fixed
pulldown)
D5
GND
Ground
D6
GND
Ground
D7
GND
Ground
D8
GND
Ground
D9
P2[4]/SCL1/
PCM_DO
IO
I-PU
D10
VDD
D11
P2[5]/PCM_FSC
IO
I-PU
Reset
Description
State
Charger connected indication. Switches on the device if voltage >
1.5v. Must be connected to charger via resistor R>(Vcharger_max3V)/10 mA (round to next largest value in range).
If no charger used, Leave unconnected if not used.
Charger is currently not supported.
I/O port
SCL1; I2C clock
PCM_DO: PCM Data output
Digital Core supply voltage (1.8V TYP).
Output from internal regulator.
I/O Port
PCM_FSC: PCM Frame Sync
E1
VDDPA
CLASSD Audio Amplifier supply voltage up to 3.45V.
E2
GND
Ground
E3
CHARGE_CTRL
O-0
E4
SOCn
Battery State Of Charge negative input. Star point connected to the
SOC resistor.
Charger is currently not supported: connect to GND
E5
GND
Ground
E6
GND
Ground
E7
GND
Ground
E8
GND
Ground
E9
GND
Ground
E10
P0[7] / SPI_DI
IO
I-PU
E11
GND
Ground
F1
SOCp
Battery State of charge positive input.
Charger is currently not supported: connect to GND
F2
P1[0]/INT0/ADC1
IO
I-PU
F3
ADC2/NTC
ADC2
NTC protection input for Li-Ion charger circuit.
Charger is currently not supported: connect to GND
F4
NC
leave unconnected
F5
ULP_PORT
Ultra Low Power Port Pin
Ultra low power is not supported by the software, connect to gnd.
F6
ULP_VBAT
Ultra Low Power Supply Pin
Ultra low power is not supported by the software, connect to gnd.
Company Confidential
Charge control pin.
Leave unconnected if not used.
Charger is currently not supported.
I/O Port
SPI Data Input
I/O Port
INT0: Interrupt 0
ADC1; ADC input 1
August 19, 2011 v1.2.1
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
SC14CVMDECT
Table 1: Pin description (Continued)
Pin
Module
Pin name
F7
ULP_MAIN_CTR
F8
NC
F9
In/
Out
Iout
Drive
(mA)
Reset
Description
State
I-0
Ultra Low Power Main Control
Ultra low power is not supported by the software, connect to gnd.
P2[3]/SDA1 /
PCM_DI
IO
I-PU
I/O Port
SDA1: I2C Data
PCM_DI: PCM Data input
F10
P1[3]/INT3
IO
1/2
I-PD
I/O Port
INT3: Interrupt
F11
P0[6] / SPI_DO
IO
I-PU
I/O Port
SPI Data Out
RF pad, must be left unconnected
G1
GND
Ground
G2
LSRn
Negative loudspeaker output
G3
GND
Ground
G4
P3[3]/ADC0
IO
I/O Port
ADC0; ADC input 0
G5
GND
Ground
G6
NC
leave unconnected
G7
GND
Ground
G8
NC
leave unconnected
G9
GND
Ground
G10
GND
Ground
G11
GND
Ground
H1
VREFM
H2
LSRp
Positive loudspeaker output
H3
P3[7]/RINGp
IO
I/O Port
RINGp: Ringer detection input
H4
NC
H5
GND
Ground
H6
GND
Ground
H7
P2[2]/PCM_CLK
I/O
I-PD
I/O Port
PCM_CLK: PCM clock input/output
H8
NC
RF pad, must be left unconnected
H9
GND
Ground
H10
GND
Ground
H11
GND
Ground
J1
GND
Ground
J2
MICh
Headset microphone input with fixed input protection
J3
GND
Ground
J4
P3[5]/RINGING /
RINGOUT
IO
I/O Port
RINGING: Ring detection Input
RINGOUT: -
J5
GND
Ground
J6
NC
RF pad, must be left unconnected
Negative microphone reference (star point), connect to gnd.
Company Confidential
August 19, 2011 v1.2.1
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
SC14CVMDECT
Table 1: Pin description (Continued)
SC14CVMDECT
Table 1: Pin description (Continued)
Pin
Module
Pin name
J7
GND
J8
P2[1] / PWM1 /
LED4
J9
In/
Out
Iout
Drive
(mA)
Reset
Description
State
Ground
I/O Port
PWM1: Pulse Width Modulation output
LED4: 2.5/5mA LED current sink
GND
Ground
J10
GND
Ground
J11
GND
Ground
K1
VREFp
Positive microphone supply voltage
K2
MICp
Positive microphone input
K3
P3[2]/CIDINp
IO
I/O Port
CIDINp: Caller id opamps positive input
K4
P3[6]/RINGn
IO
I/O Port
RINGn: RING opamp negative input
K5
P3[4]/PARADET
IO
I/O Port
PARADET: Parallel set detection
K6
NC
leave unconnected
K7
NC
leave unconnected
K8
P2[0]/ PWM0 /
LED3
IO
I/O Port
PWM0: LED3: 2.5/5mA LED current sink
K9
GND
Ground
K10
NC
No ground under the pad (RF sensitive)
K11
NC
No ground under the pad (RF sensitive)
L1
GND
Ground
L2
MICn
Negative handset microphone input
L3
GND
Ground
L4
GND
Ground
L5
NC
RF pad, must be left unconnected
L6
GND
Ground
L7
GND
Ground
L8
NC
leave unconnected
L9
GND
Ground
L10
NC
No ground under the pad (RF sensitive)
L11
GND
Ground
M2
NC
RF pad, no pad on PCB
• “NC” means: leave unconnected.
• O= Output
• GND means internally connected to Ground plane of
module (51 pins in total)
• I-PD = Input, pulled down
Cordless Voice Module
IO
• I-PU = Input, pulled up
• GND means connect to Ground (not supported,
functional pin)
• O-0 = Output, low
• O-1 = Output, high
Reset States:
• I = Input
Š 2011 SiTel Semiconductor B.V.
Company Confidential
August 19, 2011 v1.2.1
Introduction
2.1 SCOPE
The SC14CVMDECT is a programmable DECT
module for voice and low data rate services. The
internal software-stack receives commands and data
from the application, for instance to setup a link to
other modules. The user interface can be implemented
on the module itself or on anexternal host processor.
The internal FLASH provides user space where
custom applications can be located. The module
converts analog signals to a digital stream,
compresses/decompresses them according to the
DECT standards and transmits/receives them over the
air interface. The DECT protocol-stack in each module
supports both PP and FP functionality.
2.2 ORDERING INFORMATION
SC14CVMDECT AF01
2.3
REFERENCES
1. SC14CVMDECT AT Commands
2. SC14CVMDECT AT Commands
Communication Library
3. SC14CVMDECT_PC_MMI_User_Guide
4. Athena User Manual
2.4 GLOSSARY AND DEFINITIONS
API
Application Programming Interface
AT Command Interface
The software interface between the
MCU and SC14CVMDECT
Cordless Advanced Technology, Internet
and Quality
Codec
Coder and DeCoder converts analog
signals to digital signals and vice versa.
Conference
Same as intercom, but generally
including an external party.
CRC
Cyclic Redundancy Check
CVM
Cordless Voice Module
DECT
Digital Enhanced Cordless Telephone
DSP
Digital Signal Processor
EC
Echo Canceller
EMC
Equipment Manufacturer’s Code (please
refer to ETSI EN 300 175-6)
ESD
Electro Static Discharge
EQ
Equalizer
FP
Fixed Part
GFSK
Gaussian Frequency Shift Keying
HW
Hardware
Internal call between 2 or more parties.
IPEI
International Portable Equipment Identity
(please refer to ETSI EN 300 175-6)
IWU
InterWorking Unit (please refer to ETSI
EN 300 175-1)
LCD
Liquid Crystal Display
LDR
Low Data Rate
MCU
Micro Controller Unit
MMI
Man Machine Interface (keypad, LCD,
buzzer, microphone, earpiece, speaker,
headset)
NTP
Nominal Transmit Power
PAEC
Perceptual Acoustic Echo Canceller
PC
Personal Computer, IBM compatible
PCB
Printed Circuit Board without
components
PP
Portable Part
PSTN
Public Switched Telephone Network
POTS
Plain Old Telephone System
RF
Radio Frequency
RFPI
Radio Fixed Part Identity (please refer to
ETSI EN 300 175-6)
RLR
Receive Loudness Rating
RSSI
Radio Signal Strength Indication (please
refer to ETSI EN 300 175-1)
Sidetone
Feedback of microphone signal to
earpiece.
SLR
Sending Loudness Rating
SPI
Serial Periphelal Interface Bus
SW
Software
UART
Universal Asynchronous Receiver and
Transmitter.
VAD
Voice Activity Detection
Walky Talky Two PPs connected without an FP
Cordless Voice Module
CAT iq
Intercom
Inband tones Tones played by the application itself
and not from external e.g. line.
Š 2011 SiTel Semiconductor B.V.
Company Confidential
SC14CVMDECT
2.0
August 19, 2011 v1.2.1
SC14CVMDECT
3.0
Cordless Voice Module
functionality
This section describes the key functions and features
supported by the SC14CVMDECT as shown in Figure
2.
UART interface
to host
AT commands
FLASH
EEPROM
User
SW
UART
XTAL
AT command
interpreter
Protocol
Stack
DSP
Radio
Codec
DECT
MIC
LSR
SPI
Ports
Headset
Control
Figure 2 SC14CVMDECT functional overview
3.1 MODULE HARDWARE
The SC14CVMDECT internal hardware consist of:
• A UART for communication to a host.
3.2 SOFTWARE CONTROL
The SC14CVMDECT can be controlled via an AT
Command Set over the UART interface or from the
internal user application. The external controller
handles the user interface (MMI) and sends/receives
AT commands and responses to the internal protocol
stack. A detailed functional and data flow description,
including an example of the start-up sequence, can be
found in document reference [1].
• An Internal Microprocessor (MCU) running from
FLASH handling the AT command interpreter, the
protocol stack and further internal control.
• A 4kByte EEPROM used by the protocol stack and
for user EEPROM variables.
• A DSP for the Audio signal processing like ADPCM
voice compression towards the Codecs.
• A codec to convert the analog signals to digital
signals and vise versa.
• Input/Output ports which can be toggled high/low if
output or a high/low digital level can be read.
• A 10.368 MHz XTAL clock. This crystal is
automatically tuned by the module software for the
best Radio Performance.
The product supports up to 6 DECT GAP compliant PP
units to one FP station.
• Voltage regulators to convert the external supply
voltage to a stable supply voltages for the core and
I/O’s.
• A DECT Radio transceiver with two built-in antenna
circuits. The antenna’s are on the module, so no RF
knowledge is required.
Š 2011 SiTel Semiconductor B.V.
Company Confidential
August 19, 2011 v1.2.1
Cordless Voice Module
3.3 DECT PROTOCOL STACK
The SC14CVMDECT internal protocol stack is based
on the ETSI DECT specifications and is compliant with
ETSI 300 444 (GAP).
Ports
SC14CVMDECT
3.4 PORTABLE PART CONFIGURATION
A Portable Part configuration with SC14CVMDECT
requires additional external parts as shown in Figure 3.
PCM
Loudspeaker
(optional)
UART
(optional)
MCU
SC14CVMDECT
Earpiece
(handset speaker)
MIC2
Headset
(optional)
Figure 3 PP Configurations
Table 2 provides the overview of the supported
interfaces for a Portal Part.
Table 2: PP Hardware support overview
Item
Supported
Remark
Battery connection
No
Non rechargeable or rechargeable 2 cells NiMH, NiCd or Li-Ion
For Li-Ion an 3.3V LDO is required to supply the system.
Battery charger
No
Use external charger.
Keypad
No
on external MCU
Display
No
on external MCU
IO Ports
Yes
4 free digital IO port pins
PCM interface
Yes
1x16 bits, 8,16 kHz, strobes 1,8, 16, 32 bits
PCM voice coding
formats
Yes
uLaw (64kbits/s), Alaw (64kbits/s), G.726 ADPCM (32kbits/s), G.722
ADPCM (64kbits/s), Linear (128kbits/s)
UART
Yes
9600-115.2kbaud, used for AT-command
Headset detection
Yes
Yes
Connected to LSRp,LSRn
Headset Microphone
Yes
Connected to MICp
Handsfree Microphone
Yes
Connected to MICh
Handsfree speaker
Yes
Connected to PAOUTP/n (No SW support)
Radio
Yes
Integrated with two antenna’s
A portable part supports following main functional
features:
•Custom Ringtones (currently not supported*)
•Earpiece, handsfree and headset.
•Conferencing (currently not supported*)
•Intercom
•Automatic headset detection (currently not
supported*)
•Battery management (currently not supported*)
•Baby monitor (currently no VAD support*)
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Cordless Voice Module
Headset earpiece
SC14CVMDECT
•PCM interface (one channel)
•Walky Talky mode (currently not supported*)
•Low Speed Data (1.6kbit)
•LU10 data channel (54kbit/sec) (Currently not
supported*)
* Expected in Q2 2012
Cordless Voice Module
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SC14CVMDECT
3.5 FIXED PART CONFIGURATION
A Fixed Part configuration with SC14CVMDECT
requires additional external parts as shown in Figure 4.
Ports
PCM
Loudspeaker
(supported in future versions)
(optional)
UART
MCU
SC14CVMDECT
Earpiece
(handset speaker)
MIC2
Analog frontend
can be used for
PSTN line interface
Headset
(optional)
Supply
Regulator
Figure 4 FP Configuration
Table 3 provides the overview of required and
available interfaces for a basic or a feature rich
cordless FP with the SC14CVMDECT.
Table 3: FP Hardware support overview
Supported
Remark
Supply Regulator
No
Use external 3.3V LDO.
Keypad
No
on external MCU
Display
No
on external MCU
IO Ports
Yes
4 free port pins
PCM interface
Yes
4x16 bits, 8,16 kHz, strobes 1,8, 16, 32 bits
PCM voice coding
formats
Yes
uLaw (64kbits/s), Alaw (64kbits/s), G.726 ADPCM (32kbits/s), G.722
ADPCM (64kbits/s), Linear (128kbits/s)
UART
Yes
9600-115.2kbaud, used for AT-command
Headset detection
Yes
Headset earpiece
Yes
Connected to LSRp,LSRn
Headset Microphone
Yes
Connected to MICp
Handsfree Microphone
Yes
Connected to MICh
Handsfree speaker
Yes
Connected to PAOUTP/n (No SW support)
PSTN Line interface
Yes
CID, Ring detection, Line-in, Linout, Line reversal, paralle set detection
(SW On request)
Radio
Yes
Integrated with two antenna’s
A fixed part supports following main functional
features:
•Custom Ringtones (currently not supported*)
•Earpiece, handsfree and headset.
•Conferencing (currently not supported*)
•Automatic headset detection (currently not
supported*)
•Intercom
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Cordless Voice Module
Item
SC14CVMDECT
•Baby Monitor (currently not supported*)
•PCM interface (4 channels)
•Low Speed Data (1.6kbit)
•LU10 data channel (54kbit/sec) (Currently not
supported*)
•Base Station For Sensor applications (Currently not
supported*)
* Expected in Q2 2012
Cordless Voice Module
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SC14CVMDECT
3.6 LIGHT DATA APPLICATION
The SC14CVMDECT supports Low Data Rate (LDR)
transmission up to 1.6 kbits/s. Packets with a length of
upto 30 bytes payload can be transmitted and
received.
One SC14CVMDECT is configured as FP and the
others are configured as PPs (Figure 5). The host
sends/receives AT commands (over UART) to/from PP
or FP as shown in Table 4.
Table 4: Low Data Services
Direction
Supported
Host to PP to FP
Yes
Host to FP to PP
Yes
PP to PP
Yes
Comment
Indirect via FP
Up to six PPs can be registered to one FP.
See document reference [1] for more information on
the AT commands to support LDR.
1.6 kbits/s
SC14CVMDECT
PP
SC14CVMDECT
1.6 kbits/s
FP
SC14CVMDECT
PP
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Figure 5 Light Data application
August 19, 2011 v1.2.1
SC14CVMDECT
3.7
FUNCTIONAL OVERVIEW
Table 5: Functional overview
Supported
Functionality
Remark
Standard FP audio control feature: Call handling
PP to FP, FP to PP
Yes
Intercom
No
PP to FP, FP to PP
Conference call
No
Call forwarding
No
Transfer call between PPs not possible.
Page call
Yes
FP pages all PPs (PP locator)
Protocol
Manual registration
Yes
Number of registered PPs per FP
Yes
1 to 6
Low rate data transfer
Yes
1.6 Kbit/s on the air-interface (30 bytes payload)
Audio and tone
Microphone mute
Yes
PP only. Mute of MIC in all audio connections are possible
Tone generation
Yes
Melody generator with 7 polyphonic tones
Audio Volume control
Yes
6 steps are adjustable by EEPROM
Tone Volume control
Yes
6 steps are adjustable by EEPROM
Headset support
Yes
Handsfree/Speakerphone
Yes
PP only
Yes
Accuracy depending directly on crystal
General
Real time clock
Real time clock synchronization
Yes
All PP clocks are kept in synchronization with the FP
SW EEPROM Storage
Yes
Internal on Module
Battery Charge Management
No
PSTN line interface support
No
PSTN software on Request
I/O port support
Yes
4 pins I/O
Port Interrupt support
No
Cordless Voice Module
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SC14CVMDECT
4.0
Functional description
4.1 UART INTERFACE
The UART isnormally used for AT commands, but can
also be used for software upgrades and debugging.
The UART is a full duplex UART with frame type: 1
start bit, 8 data bits (LSB first), 1 stop bit, no parity and
a baud rate of 115.200 kBaud
The UART hardware interface uses 3 wires
(see Figure 6)
Figure 6 UART hardware configuration
Caution: All signals are 1.8 V. An external V.24 line
driver must be provided if the UART port of the module
is connected to a standard V.24 device. Connecting
the module without a driver may damage the module.
4.2
• normal type.
The factory type is specific for the SC14CVMDECT
and should only be set by production. The factory types
are either parameters for adjustments used by the
baseband or the radio interface, or is used to setup the
SC14CVMDECT into special modes. The factory types
will only be modified by changing the factory
programmed default value. See document reference
[2]. Only users with “debug” authorization can modify
these EEPROM parameters
EEPROM
4.2.1
EEPROM layout
The SC14CVMDECT PP and FP include a 4 Kbyte
EEPROM which is divided into two areas (see Table
6).
The other “normal” EEPROM parameters can be reset
to default values by running a soft default setting
(default batch file).
Table 6: EEPROM map
EEPROM space
Size
Usage
SC14CVMDECT
3.6 Kbyte
Used for RF, audio,
battery, tone setup,
data base, etc.
The host is able to read or modify the EEPROM
parameters or limited free EEPROM areas via AT
commands AT+WEExx.
User
0.4 Kbyte.
Can be used for
MMI applications
such as User
information.
Access to the EEPROM parameters depends on the
authorization level set by the AT+WULA parameter:
4.2.2
EEPROM access by MCU
1 = Power User. Able to read from all EEPROM
locations and write to locations 0x0F00..0x0FBF (user
space). Password: 748357.
A detailed overview of the EEPROM parameter is
found in document reference [2].
Some parts of the EEPROM parameters are read into
the SC14CVMDECT during the start up and other parts
are used by the SC14CVMDECT software during
execution.
2 = Debug User Highest Authority.Able to read from
and write to EEPROM (audio and stack related
parameters. Contact SiTel Semiconductor for the
password.
The EEPROM parameters are divided into 2 types:
• Factory type
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Cordless Voice Module
0 = Anonymous User with Lowest Authority (not able to
read from and write to EEPROM)
4.3.1
Microphone supply connection
For active microphones a voltage source with high
supply voltage rejection ratio is provided on supply pins
VREFp/VREFm. Filtering of internal and external
reference voltages is provided with internal capacitor.
No external capacitor shall be connected to the
VREFp. To avoid audible switching noise it is important
that the ground supply signals are directly “star point”
connected to the VREFm and not via a common
ground plane. From this VREFm star point, one
connection is made to the common ground plane.
Audio connection
The SC14CVMDECT PP audio connections are show
in Figure 7. Refer to “Example Application Diagram” on
page 38 for detailed component values.
SC14CVMDECT
4.3 PP AUDIO CONFIGURATIONS
The SC14CVMDECT audio is supporting standard
DECT audio qualities. The audio gain and volume
parameters are placed in the EEPROM. The DECT
gains can be adjusted to meet the TBR38 and TBR10
audio level requirements by using the SC14CVMDECT
application reference design. For other line and
acoustic designs it is needed to adjust and tune the
audio setup.
Loudspeaker connection (supported in future
releases)
For the handsfree operation an 4 ohm loudspeaker
must be connected to the PAOUTp and PAOUTn pins
as shown in Figure 8. The VDDPA is the supply pin.
VREFp
PAOUTp
VREFm
Rs_PAOUT
Cs_PAOUT
VDDPA
MICp
C_VDDPA
VSS/GND
PAOUTn
MICn
Rs_PAOUT
MICh
Cs_PAOUT
LSRp
LSRn
Figure 8 Loudspeaker connection
Refer to Table 12 for a detailed specification of the
external components around the loudspeaker. These
components are necessary to guarantee lifetime of the
module.
Figure 7 Audio connections
Earpiece or small loudspeaker connection
Cordless Voice Module
The earpiece loudspeaker can be connected either
differentially or single-ended. Dynamic loudspeakers
with an impedance of 30  can be connected as well
as ceramic loudspeakers equivalent to 600  and
30 F can be connected. Refer to Table 11 for a
detailed specification or the earpiece loudspeakers.
The earpiece is connected to the LSRp and LSRn pins.
Microphone connection
The microphone can be connected either single-ended
via MICp or differentially to MICp and MICn
Headset connection
The headset microphone must be connected to the
MICh pin. The headset earpiece is connected to the
LSRp.
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Audio Modes
The Alert state is for tone playing and is entered
automatically when tones are played using the API
calls. The Alert state can originate from idle earpiece,
handsfree or headset state
The PP audio handling consists of four audio states. In
these states the audio subsystem is configured for a
certain audio mode:
1. Idle state (not relevant for microphone
configuration)
2. Earpiece Mode (Handset Speaker)
SC14CVMDECT
4.3.2
3. Handsfree or Speakerphone Mode
4. Headset mode
Selection between the modes is done by API calls; see
document reference [1].
Cordless Voice Module
Figure 9 PP Audio mode
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PP Audio Codec adjustment
4.3.6
The audio codec settings for the loudspeaker and
Microphone must be preconfigured in the EEPROM for
each mode. The EEPROM parameter fields for
Audio.Earp.xxx, the Audio.Heads.xxx and
Audio.SpkPh.xxx have a default value but may be
modified to tune the settings.
4.3.4
In Earpiece mode (Handset Speaker) an artificial
sidetone is generated. The level of the sidetone can be
adjusted and setup in the EEPROM through parameter
fields Audio.Earp.Vol.Elementx,SideToneGain and
Audio.Heads.Elementx.SideToneGain. In Earpiece
mode it is possible to adjust the volume in the Earpiece
via the API calls. In Earpiece mode the PP audio is
routed as shown in Figure 11.
General Audio adjustment
For each audio mode, the receive (RLR) and transmit
(SLR) audio paths must be adjusted. RLR and SLR are
adjusted in the registers in the EEPROM for each
audio state; see document reference [2].
4.3.5
Earpiece Mode
4.3.7
SC14CVMDECT
4.3.3
Alert mode
The Alert mode is for generating tone and melodies in
the Speakerphone loudspeaker. In Alert mode it is
possible to adjust the volume in the speaker via the
API calls.
Power management
To minimize the current consumption the PP will
shutdown all codec amplifiers in Idle state. This means
that all reference voltages in the front-end will be
disabled. This feature can be disabled in the EEPROM
if the reference voltages for some reasons are needed
in Idle state.
4.3.8
PP Volume
The PP supports 6 volume steps, which are EEPROM
configurable through parameter fields
Audio.Earp.Vol.xxx, the Audio.Heads.Vol.xxx and
Audio.SpkPh.Vol.xxx. The volume steps must be set
initially in the EEPROM during production.
Figure 10 Handset Volume Configuration
Inband tones will be affected by the volume
adjustments, since the volume control is placed after
tones are added to the signal..Figure 11 shows the
Audio flow. Here is the list of main functions:
Equalizer
nc100Hz
100Hz canceller
Sidetone
Sidetone
EC
Echo Canceller
Vol. Ctrl
Volume Control
Tonegen
Tone generator
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EQ
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Sidetone
EQ
EC
Vol.
ctrl
tonegen
Tx_out
nc100Hz
EQ
Rx_in
SC14CVMDECT
Figure 11 PP Audio Routing
4.3.9
PP Audio equalization
registered PPs. FP paging does not establish a normal
audio connection and is terminated when answered by
the PP. In FP Speakerphone mode a voice call can be
established when the paging is answered.
To enable adjustments of the frequency response the
PP contains four programmable filters: 2 in RX
direction and 2 in TX direction (see Figure 11).
4.4.6
By default these filters are loaded with bypass
coefficients, but the API contains commands to load
new coefficient for all filters.
The following voice connections are supported.
• PP to FP
Equalizer filters are part of the audio routes for all
audio modes and are placed as shown in Figure 11.
• FP to PP.
For a detailed description of the filter functionality
please refer to API documentation; see document
reference [1].
4.4
4.4.1
Connection scenarios
4.5 TONE/MELODY HANDLING
The tone component handles the generation of various
tones in the device. Both tones/melodies in a FP and
PP configuration are supported. Main features of the
tone component are:
CALL HANDLING
FP to PP Call
The main features of the tone component are:
When the FP initializes a call to a PP, a radio
connection is set up to all the PP applications to make
it possible for the PP Application Software to indicate
that there is an incoming call.
• Ringer tones and melodies (7 tone polyphonic)
It is possible to configure the ringing indication using
broadcast to make all 6 PPs ringing. When receiving
the call, the PP signals the call to the MMI Software.
• Inband tones (dial tone, net-congestion tone, busy
tone, etc.)
4.4.2
4.6 DATE AND REAL-TIME CLOCK
The FP base has a real-time clock feature, which
(when activated) broadcasts the date and clock to the
PPs. Activation of the date and real-time clock is done
by setting the date and clock via the PP.
• Alert tones (key sound, error tones, confirmation
tones, etc.)
• Single tone generation
When the MMI Software signals the PP to establish a
call, the PP opens the radio connection to the FP.
4.4.3
Intercom and Conference
The clock is with hours, minutes and date. The clock
supports the leap year. Daylight saving is not
supported and must be handled by the MMI
application.
Not supported.
4.4.4
Call Transfer
Call transfers are not supported.
4.4.5
The PP clock is synchronized with the FP every time a
broadcast is received. If the PP goes out-of-lock, the
PP itself calculates the clock until the PP is again
within the range of the FP. The updated clock can then
Page Call
The Page call is a FP functionality used to locate the
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PP to FP Call
When the SC14CVMDECT is configured as a PP, the
clock has the same accuracy as the FP clock. But,
when the PP synchronises with a FP, the PP crystal is
synchronized with the FP crystal and the PP clock will
change accordingly.
To adjust the clock in the base station, a service
connection can be setup which can be set by
commands from the PP.
The clock can also be read and set directly from an
external microprocessor or through the MMI software
on the FP base.
The accuracy is expected to be within 1 minute for up
to 6 weeks without being locked to a FP.
The real-time clock accuracy depends directly on the
SC14CVMDECT crystal.
SC14CVMDECT
be read locally from the MMI Software.
Figure 12 Clock synchronization
Cordless Voice Module
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4.7.3
Pre-amble Antenna diversity
The SC14CVMDECT protocol supports the DECT GAP
standard. DECT TBR22 GAP type approval however is
optional.
To optimize the audio quality caused by rapid changing
radio paths (fading), the SC14CVMDECT supports
pre-amble antenna diversity. The pre-amble diversity
algorithm uses RSSI measurements to judge the radio
signal strength on both antennas and, as a result of it,
the choice of the best performing antenna is
determined. The antenna will be used for the receive
slot and the next transmit slot.
To pass a GAP type approval, a disable of the PP
authentication and encryption during conversation is
needed for some TBR22 test cases (DLC test cases).
This can be done via EEPROM address 0x00F0.
The pre-amble antenna diversity is supported by
default. The pre-amble diversity can be disabled by
EEPROM to let the SC14CVMDECT support a single
antenna. See document reference [2].
4.7.1
4.7.2
DECT TBR22
SC14CVMDECT
4.7 PROTOCOL STACK
The protocol stack handles the RF interface. For the
SC14CVMDECT the DECT TDMA is used. The
protocol features encryption.
In general an FP uses diversity and a PP does not.
Out-of-Range handling
4.7.4
When the PP goes in-range or out-of-range a signal is
sent from the PP to the MMI Software indicating
whether the PP is in-lock or is out-of-lock with the FP.
Low Speed Data
During a voice call or using a service call, data can be
transferred at a rate of about 1.6 Kbit/s using IWU to
IWU messaging.
PP
FP
PP
Figure 13 Low Speed Data Scenario
Cordless Voice Module
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chapter 6.1 in EN 300 175-4. This frame has an
information field of maximum 63 bytes of which
maximum 52 bytes can be used for IWU data. With the
SC14CVMDECT it is only possible to send 5 frames in
a row without pause. The following frame must be an
acknowledge-frame to secure that the internal buffers
within the SC14CVMDECT are emptied.
• PP to PP (point to point)
• FP to PP, PP to FP
• PP to all PPs (broadcast)
• FP to all PPs (broadcast)
All communication is routed via the FP. The FP has
number #6. See Figure 14.
PP
#3
PP
#2
FP
#6
PP
#1
The FA frame is segmented in 5 bytes fragments and
transferred over the air-interface in the A-field. The 2bytes CRC is used to determine if the data is received
correct. If the data is not received correct this is
signalled back to the transmitter by the Q2 bit, and the
data is retransmitted.
The FA frame has a 2 bytes checksum, used to
determine if the complete packet is received correct. If
A checksum error is signalled back to the transmitter
and the complete packet is retransmitted. The packet
will re-transmit until it is received correctly, or the link is
closed.
PP
#4
More transmitted packets will be received in the same
order as they were transmitted. The application must
handle flow control, if needed.
PP
#5
PP
#0
4.8 REGISTRATION
The PP and the FP must be paired using a procedure
called Registration. Without Registration, the PP will be
out-of-lock and will not be able to establish a link to a
FP and therefore not be able to make a call. The
registration uses the unique product identities and
secures the PP and FP to allow no crosscommunication. To avoid cross-communication it is
very important that all the PPs and the FP use an
unique numbering scheme.
Figure 14 Data connection PP0 to PP1 or all
4.7.5
Broadcasting messages
The broadcast message is 19 bytes at a time and can
real-time clock from the FP to the PP when the realtime clock is activated.
The PP can be deregistered from a FP either via the
FP or PP MMI Software using the command interface.
It is also possible to deregister a PP from another
registered PP.
When broadcasting data no active connections are
established.
The data is transmitted from the FP and received by
any registered PP. The communication is only one
way. Therefore, the broadcast data is not secured
because there is no retransmission.
It is possible to pair a PP and FP during the production.
4.8.1
Handling product identities
To secure that the FP and PPs do not make crosscommunications a unique ID must be entered into the
EEPROM of an FP or PP. For the DECT version the ID
for the FP is named RFPI and for the PP the ID is
named IPEI. These numbers are factory settings.
If the PP does not receive it right the first time, the
broadcast data is lost.
4.7.6
IWU to IWU messaging
After a successful registration, the IPEI is stored in the
FP and the RFPI is stored in the PP. In this way the two
parts are known to each other and are allowed to make
connections. The registration data are automatically
stored in EEPROM of the FP and PP while making the
registration.
The DECT standard defines an EMC code (see
EN 300 175-5, chapter 7.7.23.). This code is unique for
a DECT product and must be programmed by the
DECT manufacturer to the correct manufacturer code.
It is possible to register the same PP to 2 FPs, but it
can only be used in one FP at the same time.
The EMC code must be the same for SC14CVMDECT
based product families when using the IWU to IWU
messaging.
If the SiTel default EMC EEPROM value is changed
the IWU to IWU messaging may not operate correctly.
IWU data is transferred in a FA format frame; see
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The protocol in the SC14CVMDECT module is made
according to the DECT/GAP standard as defined in
EN 300 175 and EN 300 444.
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SC14CVMDECT
The following data connections are supported:
SC14CVMDECT
Figure 15 Handling Product Identities
4.8.2
Deregistration
narrowband calls (G.726).
There are two ways of deregistering a PP from an FP:
G.711 – u-law, 8 kHz sample rate.Used for narrowband
calls (G.726).
• Remote FP and PP deregistration
The correct way to deregister a PP from an FP is to
deregister it remotely in the FP. If this is done over a
service connection from the PP to the FP, the FP
actually performs the deregistration and then it is
automatically signalled to the PP which in turn will
drop out- of-lock. Using this method it is also
possible to deregister other PPs registered to the FP
from one PP.
• Compressed wideband using A-law, 16 kHz sample
rate.
The 16 bit PCM data is encoded as two 8 bit audio
samples if 8 kHz frame sync is used. Used for
wideband calls (G.722).
• Compressed wideband using u-law, 16 kHz sample
rate.
Removing all registration at once from the FP (e.g. in
case the original PPs are lost).
The 16 bit PCM data is encoded as two 8 bit audio
samples if 8 kHz frame sync is used. Used for
wideband calls (G.722).
4.9 PCM INTERFACE
The audio is routed between the MCU and the CVM via
the PCM bus. The MCU is responsible for selection
and enabling of the audio path between the PCM bus
and the CVM when calls to the external line are
established. This is done with AT commands.
Synchronization modes
In slave mode the PCM interface can be configured for
the following synchronization modes:
The CVM is responsible for connecting the right PCM
channel to the right handset for external calls when the
audio path between the CVM and the handset is
opened.
• Synchronous system clock: In this mode the clock of
the module will be adjusted to follow the PCM clock
provided by the master. In this case all audio
samples will be kept if the provided PCM clock has
an accuracy of +/- 5ppm which is a DECT radio
requirement.
The physical PCM interface formats are illustrated in
the figures in this section.
The CVM supports the following PCM data formats
Linear PCM, 8 kHz sample rate.Used for narrowband
calls (G.726).
Linear PCM, 16 kHz sample rate.Used for wideband
calls (G.722).
G.711 – A-law, 8 kHz sample rate.Used for
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Cordless Voice Module
• Asynchronous system clock: In this mode the clock
of the module is not synchronized to the PCM clock.
This means that audio samples will be either
discarded in case the master PCM clock is faster
than the clock of the module or samples will be
repeated in case the master PCM clock is slower.
SC14CVMDECT
Figure 16 PCM Interface Formats
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Cordless Voice Module
The MCU must make sure that the PCM data format
matches the CODEC selected for the call. Modifying
the CODEC requires the PCM data format to be
changed too. The following figures illustrate the PCM
bus with different PCM data formats (PCM CODEC’s).
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SC14CVMDECT
A P _ D A T A _ F O R M A T _ L IN E A R _ 8 k H z w ith 8 k H z fr a m e s y n c :
PCM CLK
8 KHz FSC
P C M in
1 s t fra m e
C hannel 0
PCM out
1 s t fra m e
C hannel 0
1 s t fr a m e
C hannel 1
1 s t fr a m e
C hannel 1
2 n d fra m e
C hannel 0
2 n d fra m e
C hannel 1
2 n d fra m e
C hannel 0
2 n d fra m e
C hannel 1
1 s t fra m e
C hannel 0
1 s t fra m e
C hannel 1
1 s t fra m e
C hannel 0
1 s t fra m e
C hannel 1
A P _ D A T A _ F O R M A T _ L IN E A R _ 8 k H z w ith 1 6 k H z f r a m e s yn c :
PCM CLK
16 K Hz FS C
P C M in
1 s t fra m e
C hannel 0
PCM out
1 s t fra m e
C hannel 0
1 s t fra m e
C hannel 1
1 s t fra m e
C hannel 1
Figure 17 PCM bus with linear PCM, 8kHz sample rate
AP_DATA_FORMAT_LINEAR_16kHz with 16 kHz frame sync:
PCM CLK
16 KHz FSC
PCM in
1st frame
Channel 0
PCM out
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 1
2nd frame
Channel 0
2nd frame
Channel 1
2nd frame
Channel 0
2nd frame
Channel 1
Figure 18 PCM bus with linear PCM, 16kHz sample rate
Cordless Voice Module
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SC14CVMDECT
AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 8 kHz frame sync:
PCM CLK
8 KHz FSC
2nd frame
PCM in
1st frame
Channel 0
1st frame
Channel 1
Channel 0
PCM out
1st frame
Channel 0
1st frame
Channel 1
Channel 0
2nd frame
2nd frame
Channel 1
2nd frame
Channel 1
AP_DATA_FORMAT_G711A / AP_DATA_FORMAT_G711U with 16 kHz frame sync:
PCM CLK
16 KHz FSC
PCM in
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 0
1st frame
Channel 1
PCM out
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 0
1st frame
Channel 1
Figure 19 PCM bus with G.711 – A-law/u-law, 8 kHz sample rate
AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.722 used on air):
PCM CLK
8 KHz FSC
PCM in
2nd frame 1st frame 2nd frame 1st frame
Channel 0 Channel 0 Channel 1 Channel 1
4th frame 3rd frame 4th frame 3rd frame
Channel 0 Channel 0 Channel 1 Channel 1
PCM out
2nd frame 1st frame 2nd frame 1st frame
Channel 0 Channel 0 Channel 1 Channel 1
4th frame 3rd frame 4th frame 3rd frame
Channel 0 Channel 0 Channel 1 Channel 1
AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.722 used on air):
PCM CLK
PCM in
1st frame
Channel 0
1st frame
Channel 1
2nd frame
Channel 0
2nd frame
Channel 1
PCM out
1st frame
Channel 0
1st frame
Channel 1
2nd frame
Channel 0
2nd frame
Channel 1
Figure 20 PCM bus with compressed wideband using A-law/ u-law, G722 used on air interface.
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August 19, 2011 v1.2.1
Cordless Voice Module
16 KHz FSC
SC14CVMDECT
AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 8 kHz frame sync (G.726 on air):
PCM CLK
8 KHz FSC
PCM in
1st frame
Channel 0
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 1
2nd frame
Channel 0
2nd frame
Channel 0
2nd frame
Channel 1
2nd frame
Channel 1
PCM out
1st frame
Channel 0
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 1
2nd frame
Channel 0
2nd frame
Channel 0
2nd frame
Channel 1
2nd frame
Channel 1
AP_DATA_FORMAT_CWB_ALAW / AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync (G.726 on air):
PCM CLK
16 KHz FSC
PCM in
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 0
1st frame
Channel 1
PCM out
1st frame
Channel 0
1st frame
Channel 1
1st frame
Channel 0
1st frame
Channel 1
Figure 21 PCM bus with compressed wideband using A-law/ ?-law, G726 used on air interface.
Cordless Voice Module
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August 19, 2011 v1.2.1
5.1
CAT-iq
also impacts the behaviour of other services in order
to ensure attachment of PPs to a line, line settings
and several lists properly.
INTRODUCTION
CAT-iq stands for Cordless Advanced Technology,
Internet and Quality. It is the new global technology
initiative from the DECT Forum, designed for IP-voice
services in the next generation networks. CAT-iq is
based on the regulatory framework of the mature and
reliable
• Parallel calls: initiating a second call in parallel to the
first call, toggling between calls, putting a call on
hold, resuming calls from on hold, call transfer, 3party conference with established external and/or
internal calls
• DTMF and tones
DECT technology. It is fully backward compatible to
DECT GAP and, as the new cordless phone standard,
focuses on high quality Audio VoIP (wideband) as
well as low bit-rate data applications as the next
generation Cordless Phone standard.
• Headset support
• Easy PIN code registration
• Easy pairing
• handset location
5.2 CAT-IQ PROFILE OVERVIEW
The CAT-iq profiles are split between voice and data
services, with CAT-iq 1.0 and CAT-iq 2.0 providing
features to support key voice enhancements, and CATiq 3.0 and CAT-iq 4.0 providing features to support
data. Each profile has a corresponding ETSI
specification, the organization where the technical
experts have realized the requirements as defined for
each profile by the DECT Forum.
5.2.1
SC14CVMDECT
5.0
CAT-iq 1.0
• Narrowband (G.726) and wideband (G.722) audio
and switching between these two codecs is
supported.
• CLIP, CNIP, CLIR: Calling Line Identification
Presentation, Calling Name Identification, Calling
Line Identity Restriction for internal and external
calls.
5.2.2
CAT-iq 2.0 (Supported in future releases)
• Synchronization of call lists and telephone books,
missed calls list, incoming accepted calls list,
internal names list (unique identifier of each
handset), base telephone book
• Synchronization of system settings: PPs are enabled
to change partly the configuration of the system
consisting of FP and PPs, these system settings are
handled using the list access method. Using this
method, the FP and the PPs support:
Cordless Voice Module
• Synchronization of time and date for FP and PPs,
that FP is enabled to transmit time and date to the
PPs.
• Reset to factory settings, means that PP is enabled to reset the FP configuration to it’s factory
setting.
• Obtaining FP versions, means that a PP can
obtain the software release of the FP.
• Multiple lines handling: The behavior of DECT
systems connected to more than one network lines.
These lines may be of different types (VoIP and
PSTN for example). This feature details how calls
are placed in a multiple lines context. This feature
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August 19, 2011 v1.2.1
6.1
Specifications
ABSOLUTE MAXIMUM RATINGS
Table 7: Absolute Maximum Ratings (Note 1)
Description
Condition
Min
Max
Unit
VBAT
5.5
VBATT, VCCRF, VDDPA
3.6
VDDIO
PON
5.5
Port pins
LED4, LED3
3.6
human body model
2000
machine model
100
Maximum supply voltages:
SC14CVMDECT
6.0
Maximum voltage on pins:
ESD voltage
all pins
Note 1:
Absolute maximum ratings are those values that may be applied for maximum 50 hours.
Beyond these values, damage to the device may occur.
Table 8: Operating Conditions
Description
Condition
Min
TYP
Max
Unit
5.5
3.45
Supply voltage:
VBAT
2.1
VBATT, VCCRF, VDDPA
VDD
2.1
The module provides an
output voltage in this range
VDDIO
1.8
1.65
1.65
1.98
5.5
P2[0]/LED4, P2[1]/LED3
3.45
All other pins
10
mA
CLASSD pins
500
mA
VREFp
mA
Voltage on pins:
PON pin
2.1
Maximum Currents through pins
CHARGE pin
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August 19, 2011 v1.2.1
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
Series resistor
R>(Vcharger-3)/10mA
DIGITAL INPUT LEVELS
Table 9: DIGITAL INPUT LEVELS
Description
Condition
Min
Max
Units
Logic 0 input level
all digital pads, except PON, CHARGE
0.3 x VDD
PON
VDD=1.8V
0.9
CHARGE
0.9
RSTn
0.2 x VDD
SC14CVMDECT
6.2
Logic 1 input level
all digital pads, except PON, CHARGE
0.7 x VDD
PON
1.5
CHARGE
1.5
RSTn
0.8xVDD
6.3
VDD = 1.8 V
DIGITAL OUTPUT LEVELS
Table 10: Digital Output Levels
Descriptions
Conditions
Logic 0 output level
(For drive capability see pin description)
Iout = 2,4,8 mA
VDD = 1.8 V
Logic 1 output level
Iout = 2,4,8 mA
VDD = 1.8 V
6.4
Min
Max
Units
0.2 x VDD
0.8 x VDD
LOUDSPEAKER LOAD CIRCUITS
Table 11: LSRp/LSRn load circuits
PARAMETER
DESCRIPTION
CONDITIONS
Cp1_Rl1_inf
Load capacitance
Cp1_Rl1_1k
Load capacitance
Rl1
Load resistance
Cp2
Parallel load
capacitance
Cs2
Serial load capacitance
Rl2
Load resistance
MIN
TYP
MAX
UNITS
see Figure 22, RL1 = 
30
pF
see Figure 22, RL1 k
100
pF
30
pF
30
F

28
see Figure 23

600
LSRp
RL2
RL1
Cp2
Cp1
Cs2
LSRn
LSRn
Figure 23 Load circuit B Piezo loudspeaker
Figure 22 Load circuit A Dynamic loudspeaker
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August 19, 2011 v1.2.1
Cordless Voice Module
LSRp
PARAMETER
DESCRIPTION
CONDITIONS
C_VDDPA
Decoupling capacitor on
VDDPA
Required when Class-D is used
and guaranteed life time.
(see Figure 24)
MIN
TYP
MAX
UNITS
F
Cs_PAOUT
Snubber capacitor (to
reduce ringing at
PAOUTp/n)
Required when Class-D is used
to prevent EMI and guaranteed
life time. (see Figure 24)
nF
Rs_PAOUT
Snubber resistor (to
reduce ringing at
PAOUTp/n)
Required when Class-D is used
to prevent EMI and guaranteed
life time. (see Figure 24)

SC14CVMDECT
Table 12: PAOUTp, PAOUTn external components
PAOUTp
Rs_PAOUT
Cs_PAOUT
VDDPA
C_VDDPA
VSS/GND
PAOUTn
Rs_PAOUT
Cs_PAOUT
May 10, 2010
Figure 24 Class-D external components
Cordless Voice Module
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August 19, 2011 v1.2.1
GENERAL SPECIFICATIONS
Table 13: SC14CVMDECT module
Item
Condition
Value
Unit
Dimension
lxwxh
25.0 x 29.0 x 2.9
mm
4.5
-20 to +60
°C
1870 to 1930
MHz
- typical outdoor
350
- typical indoor
75
Weight
Temperature Range
Frequency range
According to DECT standard
Antenna Range
According to DECT standard; (Note 2)
Standard Compliancy
ETS 300 444 (DECT GAP), former TBR2214
FCC part 15
Power supply
2 or 3 cell NiCd/NiMH
Note for 1 Li-Ion battery an external LDO is required.
2.10 to 3.45V
Maximum PCB warpage
For entire reflow range
0.1
mm
Note 2:
SC14CVMDECT
6.5
The resulting range is very dependent of the mechanical design. SiTel is not responsible for this design and as such SiTel is not responsible
for the resulting range performance of the final product.
6.6
BASEBAND SPECIFICATIONS
Table 14: Baseband specifications
Item
Specification
Serial Interface baud rate
Min
Typ
Max
Unit
UART; Interface for external
microprocessor or PC
115.2
kBits
Flash Download baud rate
Via UART
115.2
kBits
Flash data space
Module Flash
kByte
EEPROM data space
Module EEPROM
0.4
kByte
Analog front-end/Audio
PP/FP Application: Interface for
Microphone, Earpiece, Headset
Power consumption
(charge)
FP Application (3.3V):
- stand by mode
55
60
mA
- talk mode
65
70
mA
- stand by mode
4,5
mA
- talk mode
30
40
mA
PP Application (3.3V):
RADIO PART (RF) SPECIFICATIONS
Table 15: Radio part (RF)
Item
Conditions
Min
Typ
Max
Unit
Receive sensitivity
@ BER = 0.001
-93
-92
-89
dBm
Receive IIP3
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-20
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33
dBm
August 19, 2011 v1.2.1
Cordless Voice Module
6.7
Item
Conditions
Min
Typ
Max
Unit
Transmit Power (NTP)
DECT: 200 mW
20
23
25.5
dBm
DECT6.0: 115 mW (max peak)
18.5
21
24
dBm
TDMA (time division
multiple access)
6xRx + 6xTx time slots per carrier
Data rate
Modulation depth
DECT GFSK bandwidth = 20 dB <
Antenna diversity
Two built-in antenna’s
Standard Compliancy
ETS 301 406 (former TBR6)
6.8
1.152
Mbits/s
1,728
MHz
SC14CVMDECT
Table 15: Radio part (RF)
FP POWER SUPPLY
Table 16: Requirements for linear supply regulator
Parameter
Description
Condition
Min
Typ
Max
Unit
VCCRF
Voltage at VCCRF
Unloaded VB
Loaded VB-V1-V2-V3
2.1
3V
3.45
V1
Settling time
I = 50 mA
20
mV
V2
Receive period
I = 130 mA
100
mV
V2
Transmit period
I = 400 mA
200
mV
V3
Drop during transmit
25
mV
none
mV
Additional ripple (DC/DC)
none
none
Cordless Voice Module
Figure 25 FP power supply
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August 19, 2011 v1.2.1
Design guidelines
Headset detection boundaries can be adjusted in
EEPROM. When headset indication is received from
the PP Headset detection logic (future release), the
Application Software can decide if audio should be
switched to the headset and sends a request to the
SC14CVMDECT.
This section describes the software and hardware
considerations taken into account when designing the
target application.
The PP audio handling basically consists of 4 audio
states (see Figure 9):
The SC14CVMDECT can be used standalone or next
to an MCU that controls the module. In case the
module is used standalone the application will be
stored in its on-board Flash. In total 324kBytes of Flash
are available for this.
1. Idle (Alert) State
2. Earpiece State
3. Handsfree State (Speakerphone)
Applications can be written with the Athena software
development environment (see [4]).
4. Headset State
7.1 APPLICATION SOFTWARE FOR PP
In a PP application the following software tasks must
be handled by the MCU or within the module itself:
Shifting between states is done through the API.
• UART communication (external microprocessor
only)
Tone handling
Please refer to the PP application layout for pin
connections.
The Application Software state machine must control
when to play tones and the volume setting. Custom
melodies can be defined in the EEPROM.
• PP MMI
• Display interface (optional)
• Keyboard interface (optional)
7.2 APPLICATION SOFTWARE FOR FP
In an FP application the following software tasks must
be handled by the MCU or within the module itself:
• Battery Charge interface (optional)
• Audio handling
• UART communication (external microprocessor
only)
• Tone / Melodies handling
For control commands see document reference [1].
• FP MMI
UART communication
• Display interface (optional)
The UART communication is the main control interface
of the SC14CVMDECT.
• Keyboard interface (optional)
• Audio handling
PP MMI
• Tone / Melodies handling
The MMI state machine must handle the call setup and
call termination on the PP.
For control commands see document reference [1].
Display Interface
UART Communication
The MCU / PP handles the display interface including
the display driver.
The UART communication forms the basic of the FP
operation because via this interface the
SC14CVMDECT is controlled.
Keyboard Interface
PP MMI
The MCU/ PP handles the keyboard interface including
the keyboard driver.
The MMI state machine must handle the call setup and
call termination on the FP.
Battery Charge handling
The MCU/ FP handles the display interface including
the display driver.
Keyboard Interface
The MCU/ FP handles the keyboard interface including
the keyboard driver.
Audio handling
Audio Handling
The Application Software state machine must control
when to open and close the audio. The headset plug-in
detection must handled by the host, and a status is
send to the PP MMI from the PP. The PP MMI must
handle the volume control.
Company Confidential
The Application Software state machine must control
when to open and close the audio. The headset plug-in
detection is handled by the FP, and a status is send to
the FP MMI from the FP. The FP MMI must handle the
35
August 19, 2011 v1.2.1
Cordless Voice Module
Display Interface
SC14CVMDECT V3 supports no battery management.
This must be done by and external charge circuit on
combination with the external MCU. The Application
Software must handle the MMI part such as battery
status for the user and the PP battery current
consumption states.
Š 2011 SiTel Semiconductor B.V.
SC14CVMDECT
7.0
• Make angle breaks on long supply lines to avoid
resonance frequencies in respect to DECT frequencies. Maximum 8 cm before an angle break
is recommended.
• Supply lines should be placed as far as possible
away from sensitive audio circuits. If it is necessary to cross supply lines and audio lines, it
should be done with right angles between supply
and audio lines/circuits (microphone, ear-speaker,
speakerphone, etc.)
Tone Handling
The Application Software state machine must control
when to play tones and the volume setting. Custom
melodies can be defined in EEPROM.
• Ground plane considerations
In order to achieve the best audio performance
and to avoid the influence of power supply noise,
RF radiation, TDD noise and other noise sources,
it is important that the audio circuits on both FP
and PP applications boards are connected to the
GND_ANA pins (analog ground) on the
SC14CVMDECT with separate nets in the layout.
It is advised to provide the following audio circuits
with separate ground nets connected to the
GND_ANA pins:
7.3 HARDWARE DESIGN GUIDELINES
Within this section general design guidelines for
SC14CVMDECT FP and PP applications are given.
7.3.1
Circuit design Guidelines
For a reference schematic refer to the SC14CVMDECT
reference kit. With the reference kit package a noncost optimized reference design is presented.
• Microphone(s)
For a FP hardware design the following hardware parts
will be needed besides the SC14CVMDECT:
• Headset microphone and speaker
• Supply voltage
• Speakerphone (signal grounds)
• Battery charge
Depending on the layout it may also be necessary to
bypass a number of the audio signals listed above to
avoid humming, noise from RF radiation and TDD
noise with. It is also important to choose a microphone
of appropriate quality with a high RF immunity (with
built-in capacitor).
• LED and buttons
• Speakerphone
For a PP hardware design the following hardware parts
will be needed besides the SC14CVMDECT:
• ESD performance
Besides TDD noise, the ESD performance is
important for the end-application. In order to achieve
a high ESD performance supply lines should be
placed with a large distance from charging terminals,
display, headset connector and other electrical
terminals with direct contact to the ESD source.
On a two-layer PCB application it is important to
keep a simulated one layer ground. With a stable
ground ESD and TDD noise performance will always
improve.
• Power
• Battery Charger
• Audio:
• Microphone
• Earpiece
• Speaker
• Headset
7.3.2
PCB Design Guidelines
Cordless Voice Module
• Because of the presence of the digital radio
frequency burst with 100 Hz time division periods
(TDD noise), supply ripple and RF radiation, special
attention is needed for the power supply and ground
PCB layout.
• Power supply considerations
Both high and low frequency bypassing of the supply
line connections should be provided and placed as
close as possible to the SC14CVMDECT. In order to
get the best overall performance for both FP and PP
applications, a number of considerations for the PCB
has to be taken into account.
• The width of the power amplifier supply line is recommended to be between 0.8 and 1.2 mm due to
high current peaks during RF bursts.
Š 2011 SiTel Semiconductor B.V.
SC14CVMDECT
volume control.
Headset detection boundaries can be adjusted in
EEPROM. When headset indication is received from
the FP headset detection logic (future release), the
Application Software can decide if audio should be
switched to headset and sends a request to the FP.
Company Confidential
36
August 19, 2011 v1.2.1
SC14CVMDECT
8.0
Audio Level Adjustment
8.1 PP AUDIO LEVEL
For adjusting the audio levels in the PP (SLR/TOLR)
and (RLR/OLR) the related eeprom parameters can
be adjusted during production.
8.2 FP AUDIO LEVEL)
For adjusting the audio level in the FP (SLR/TOLR)
and (RLR/ROLR) he related eeprom parameters can
be adjusted during production.
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
Company Confidential
37
August 19, 2011 v1.2.1
SC14CVMDECT
9.0
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9%$7
-
-
.
/
/
/
/
/
/
/
*1'
Figure 26 Referencediagram
Š 2011 SiTel Semiconductor B.V.
Company Confidential
38
August 19, 2011 v1.2.1
SC14CVMDECT
10.0 Mechanical Dimensions
Cordless Voice Module
Figure 27 Package Outline Drawing
Š 2011 SiTel Semiconductor B.V.
Company Confidential
39
August 19, 2011 v1.2.1
partly surrounding the antennas, will normally cause a
significant degradation of the coverage.
11.1 MODULE PLACEMENT ON THE MAIN BOARD
In order to ensure FCC compliance, proper coverage
and to avoid detuning of the antennas, it required to
place the module free on the main board in relation to
other surrounding materials.
Place the module at the corner of the main-board as
shown in Figure 28.
If the module has to be placed away from the edge of
the main-board, then avoid conducting areas in front of
the antennas and make a cut-out in the main board
underneath the antennas as shown in the figure.
Keep a distance of at least 10 mm from the antenna
elements to conducting objects and at least 5 mm to
non-conducting objects.
SC14CVMDECT
11.0 Module integration
Keep solid ground on layer 2 out to the edges of the
main board as shown.
Keep in mind that electrical shielding objects, even
Figure 28 Module placement on the main board (top view)
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
Company Confidential
40
August 19, 2011 v1.2.1
SC14CVMDECT
12.0 UTAM membership waiver
Payment of the Up Front Membership Fee and Per
Radiating Device Fees is not required from a
manufacturer or distributor that uses an FCC-certified
module for which such fees have been paid. Such an
“FCC certified module” is defined as a device that
contains the complete UPCS-compliant radio modem
functionality from a supplier that has a valid UTAM
Affidavit. The hardware and firmware implementation
of the FCC certified module must not be modified by
the manufacturer or distributor in a way that would
invalidate its original FCC certification unless the
manufacturer of the device that will contain the module
secures its own FCC approval. Any applicant for FCC
approval seeking to use an FCC certified module must
give the FCC ID number of the certified module that it
will employ and attest that it is using a module for
which UTAM fees have been paid.
See also www.utam.org
Cordless Voice Module
Š 2011 SiTel Semiconductor B.V.
Company Confidential
41
August 19, 2011 v1.2.1
SC14CVMDECT
13.0 Soldering
13.1 SOLDERING PROFILE
The SC14CVMDECT should be soldered using a
standard reflow soldering profile and lead free solder
paste as shown below. Adjustments to the profile may
be necessary depending on process requirements.
Reflow profile – leadfree
Sn96.5-Ag3.0-Cu0.5
Temp. C°
t3
250°
T3
t4
220°C
Meltingpoint 217°C
200°
T2
190°C
T1
150°C
150°
100°
50°
t1
t2
0°
Time
t1: Max. Change in temperature
t2: Time in preheat (150°C < temp. < 190°C)
t3: Time in reflow zone (temp. > 220°C)
t4: Peak temperature
3°C/sec.
60 - 120 sec.
30 - 60 sec.
237°C¹5°C
T1 Preheat zone bottom
T2 Preheat zone top
T3 Reflow zone
150°C
190°C
220°C
Figure 29 Reflow profile
Cordless Voice Module
13.2 COPPER PAD AND SOLDER OPENING
Recommended Copper Pad and Solder Mask Opening
(NSMD).
Š 2011 SiTel Semiconductor B.V.
Company Confidential
42
August 19, 2011 v1.2.1
ma
sk
pen
ing
1.08
0xx1
..0800
. pa
Cu
8000
xx01..
.800
d 01
SC14CVMDECT
So
lde
mm
Copper pads
Solder Mask
Substrate
Figure 30 Copper pad and Solder mask opening
13.3 STENCIL
For the stencil a thickness of 0.122 mm is
recommended. Recommended opening is as shown
below.
Stencil
0.80x0.80
Opening in stencil 1.40
x 1,40mm
Cordless Voice Module
Figure 31 Stencil
Š 2011 SiTel Semiconductor B.V.
Company Confidential
43
August 19, 2011 v1.2.1
• Consult the dealer or an experienced radio/TV
technician for help.
14.1 FCC REQUIREMENTS REGARDING THE END
PRODUCT AND THE END USER.
This module is for use only in DECT / UPCS handsets
and base stations.
Privacy of communications may not be ensured when
using this phone.
A separation distance of at least 20 cm must be
maintained between the base station and all persons
(excluding extremities of hands, wrist and feet).
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
transmitter
14.2 PRECAUTIONS REGARDING UNINTENDED
COUPLING
The SC14CVMDECT does not have any electrical
Shielding, so by integration on the main board
precautions shall be taken in order to avoid any kind of
coupling from the main board to the RF part of the
module. If there is any doubt about this, a radio short
test should be performed.
The end product that the module is integrated into must
be marked as follows:
"Contains Transmitter Module FCC ID: Y82-SC14A /
IC: 9576A-SC14A"
The literature provided to the end user must include the
following wording:
FCC compliance statement
14.3 END APPLICATION APPROVAL
The module is intended to be used in an end
application. When the requirements in 14.2 are fulfilled,
no further test concerning the module is needed. Type
approval concerning the end product, except for the
module, should off cause be done. Please contact a
test-house in order to clarify what is needed.
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1)
this device may not cause harmful interference, and (2)
this device must accept any interference received,
including interference that may cause undesired
operation of the device.
Module transmetteur ID IC: 9576A-SC14A
14.4 SAFETY REQUIREMENTS
This section provides of an overview of the safety
requirements you must adhere to when working with
the Cordless Voice Module SC14CVMDECT.
Son fonctionnement est soumis aux deux conditions
Suivantes: (1) cet appareil ne doit pas causer
D'interfĂŠrences nuisibles et (2) appareil doit accepter
Toute interference recue, y compris les interferences
Qui peuvent pertuber le fonctionnement.
• The specific external power supply for the Cordless
Voice Module SC14CVMDECT has to fulfill the
requirements according to clause 2.5 (Limited power
source) of this standard EN 60950-1:2006.
Changes or modifications to the equipment not
expressly approved by the Party responsible for
compliance could void the user's authority to Operate
the equipment.
• Interconnection circuits shall be selected to provide
continued conformance to the requirements of
clause 2.2 for SELV (Safety Extra Low Voltage)
circuits according to EN 60950-1:2006 after making
connections.
NOTE: This equipment has been tested and found to
comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against
harmful interference in a residential installation.
• Interface type not subjected to over voltages (i.e.
does not leave the building).
This equipment generate, uses and can radiate radio
frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation.
• Requirements additional to those specified in this
standard may be necessary for:
• Equipment intended to be used in vehicles, on Board
ships or aircraft, in tropical countries or at altitudes
greater than 2000 m.
• Equipment intended for use where ingress of water
is possible.
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment and
receiver
• Installation by qualified personnel only!
• The product is a component intended for installation
and use in complete equipment. The final
acceptance of the component is dependent upon its
installation and use in complete equipment.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is
connected.
Company Confidential
44
August 19, 2011 v1.2.1
Cordless Voice Module
• Equipment intended for operation in special
environments (for example, extremes of
temperature, excessive dust, moisture or vibration,
flammable gases and corrosive or explosive
atmospheres).
If this equipment does cause harmful interference to
radio or television reception, which can be determined
by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or
more of the following measures:
Š 2011 SiTel Semiconductor B.V.
SC14CVMDECT
14.0 Notices to OEM
Datasheet Status
Product Status
Definition
Advance Information
Formative or in Design
This data sheet contains the design specifications for product development. Specifications may change in any manner
without notice.
Preliminary
First Production
This data sheet contains preliminary data. Supplementary
data will be published at a later date. SiTel Semiconductor
reserves the right to make changes at any time without
notice in order to improve design and supply the best possible product.
No Identification Noted
Full production
This data sheet contains final specifications. SiTel Semiconductor reserves the right to make changes at any time without notice in order to improve design and supply the best
possible product.
Obsolete
Not in Production
This data sheet contains specifications on a product that has
been discontinued by SiTel Semiconductor. The data-sheet
is printed for reference information only.
SC14CVMDECT
Product Status Definitions
SiTel Semiconductor reserves the right to make changes without notice to any products herein to improve reliability,
function or design. SiTel Semiconductor does not assume any liability arising out of the application or use of any
product or circuit described herein; neither does it convey any license under its patent rights, nor the right of others.
Life Support Policy
SiTel’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CIRTICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSIL OF SiTel SEMICONDUCTOR. As used herein:
1. Life support devices or systems are devices or
systems which,
(a) are intended for surgical implant into the
body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the
labelling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system, or to
affect its safety or effectiveness.
SiTel Semiconductor does not assume any responsibility for use of any circuit described, no circuit patent licenses are implied, and SiTel
reserves the right, at any time without notice, to change said circuitry or specifications.
RoHS Compliance
SiTel Semiconductor complies to DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE
COUNCIL of 27 January 2003 concerning Restriction of Hazardous Substances (RoHS).
Contacting SiTel Semiconductor
The Netherlands
SiTel Semiconductor B.V.
Phone: +31 73 640 88 22
North America
SiTel North America
Phone: +1 408 727 3200
Singapore
SiTel Semiconductor Singapore
Phone: +65 64845419
Japan
SiTel Semiconductor K. K.
Phone: +81 3 3769 8123
SiTel Semiconductor Japan
Short Range wireless & VoIP
Phone: +81 3 5408 4330
Š 2011 SiTel Semiconductor B.V.
Company Confidential
45
August 19, 2011 v1.2.1
Cordless Voice Module
SiTel Semiconductor statement on RoHS can be found on the customer portal http:/portal.SiTel-semiconductor.com.
RoHS certificates from our suppliers are available on request.
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FCC ID Filing: Y82-SC14A

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