Digi 50M1699 WLAN Module User Manual CC Wi i MX51 HRM

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Document ID	1406132
Application ID	2XDenfBrEVW8sYF5rOjaMA==
Document Description	User Manual Part4
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	248.64kB (3107959 bits)
Date Submitted	2011-01-18 00:00:00
Date Available	2011-03-04 00:00:00
Creation Date	2011-01-18 12:08:43
Producing Software	Acrobat Distiller 9.2.0 (Windows)
Document Lastmod	2011-01-18 12:08:47
Document Title	CC Wi-i.MX51 HRM.book
Document Creator	FrameMaker 9.0
Document Author:	jlee2

ConnectCore f or i .M X 5 1
By default, serial port 1 signals are configured as GPIO signals.
Serial Port 3, TTL Interface, X19
The serial (UART) port 3 interface is a TTL interface connected to a 2x5 pin, 2.54mm
connector, X19. The connector supports only TTL level signals.
The serial port 3 interface is connected to i.MX51 UART port 3.
Serial port 3 pins are allocated as shown:
Pin
Function
Defaults to
NC
NC
RXD
GPIO1_22
RTS#
KEY_COL4
TXD
GPIO1_23
CTS#
KEY_COL5
NC
NC
GND
10
+3.3V
By default, serial port 3 signals are configured to their respective GPIO or KEY_COL signals.
Serial port 3 is connected to the X19 connector and to the XBee module socket. Two jumpers
(J30 and J31) are used in the development board to select the connector where serial port 3
will be available. Refer to the “Jumpers” section of this document for more information.
By default serial port 3 CTS# signal is not connected to X19. A 0Ω resistor, R44, must be
manually populated to connect this signal to the X19 connector.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
USB Host Interface
USB Host
Connectors,
J8 & J10
USB Host Connectors, J8 and J10
The development board provides four standard type A receptacles for a USB host connection.
A 4-Port USB hub is used in the development board to convert the USB host port 1 of the
module into four USB host ports. The module supports low, full and high speed USB 2.0
connectivity.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
USB OTG Interface
USB OTG
Connector,
J11
USB OTG Connector, J11
The development board provides a standard mini-AB type receptacle for a USB OTG
connection. The module supports full and high speed USB2.0 connectivity.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
User Interface
User Interface
The development board provides two user buttons and two user LEDs connected to GPIO
signals of the i.MX51.
The user buttons and the user LEDs can be enabled or disabled by correctly setting the
corresponding jumpers.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
The table below shows the GPIO signal assigned to the user interface, and the jumpers used
to enable/disable the buttons and LEDs:
Signal
GPIO
Jumper
Comment
USER_BUTTON1
GPIO3_6
J28
10K pull-up to +2.775V on the development board
USER_LED1#
GPIO3_10
J16
USER_BUTTON2
GPIO1_1
J29
USER_LED2#
GPIO3_9
J9
© 2010 Digi International, Inc.
10K pull-up to +2.775V on the development board
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ConnectCore f or i .M X 5 1
Analog Video Interface
VGA Connector, X32
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Analog Video Connector, X32
The development board provides an Analog Video connector. This connector is a 15-pin
female connector, labeled X32. The Analog Video interface is connected to the Display 1
interface of the i.MX51 CPU.
The table below shows the pinout of the Analog Video connector.
Pin
Signal
VGA_RED
VGA_GREEN
VGA_BLUE
NC
GND
RED_RETURN
GREEN_RETURN
BLUE_RETURN
NC
10
GND
11
NC
12
NC
13
HSYNC#
14
VSYNC#
15
NC
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
WLAN Interface
Primary Antenna
Connectors, P12 & P14
Secondary Antenna
Connectors, P13 & P15
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Antenna Connectors (WLAN)
The development board provides the following connectors for the WLAN interface:
and P13: these two UFL connectors are used to connect the WLAN interface of the 
ConnectCore for i.MX51 to the development board. Two coaxial cables are used for 
this connection.
P12
and P15: these two RP-SMA connectors are used to connect two (primary and 
secondary) WLAN antennas
P14
The following picture shows the WLAN antenna connections.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Digi XBee
TM
Interface
Digi XBee
Connectors, X28 & X29
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Digi XBeeTM Module Connectors, X28 and X29
The development board provides two 10-pin, 2.0mm connectors, X28 and X29, supporting a
Digi XBee module.
The XBee serial port is shared with UART port 3 on the development board. Two jumpers (J30
and J31) are used in the development board to select the connector where serial port 3 will
be available. Refer to the “Jumpers” section of this document for more information.
The table below shows the pinout of the XBee module connectors.
Pin
Signal
Pin
Signal
X28-1
+3.3V
X29-1
IDENT
X28-2
XBEE_DOUT
X29-2
X28-3
XBEE_DIN
X29-3
X28-4
NC
X29-4
X28-5
XBEE_RESET#
X29-5
XBEE_RTS#
X28-6
X29-6
ASSOC
X28-7
X29-7
X28-8
X29-8
ON/SLEEP#
X28-9
XBEE_SLEEP_RQ
X29-9
XBEE_CTS#
X28-10
GND
X29-10
© 2010 Digi International, Inc.
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Module Specifications
his appendix provides ConnectCore for i.MX51 module specifications.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Mechanical Specifications

Length:
82 mm (3.228 inches)

Width:
50 mm (1.968 inches)

Height :
–
PCB:
1.40 mm (0.055 inches)
–
Top side part:
3.60 mm (0.142 inches)
–
Bottom side part:
2.20 mm (0.087 inches)
Environmental Specifications

Operating temperature:
600MHz variant:
-40ºC to +85ºC (-40ºF to +185ºF)
800MHz variant:
0ºC to +70ºC (32ºF to +158ºF)

Storage temperature:
© 2010 Digi International, Inc.
-40ºC to +125ºC (-40ºF to +257ºF)
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ConnectCore f or i .M X 5 1
Network Interface
Antenna specifications: 802.11 a/b/g antenna
Attributes
Attribute
Band 1
Band 2
Frequency
2.4 ~ 2.4835 GHz
5.15 ~ 6 GHz
Bandwidth
120MHz
875MHz
Wavelength
1/4 Wave
1/4 Wave
Impedance
50 Ohm
50 Ohm
VSWR
< 19 typ. Center
< 19 typ. Center
Connector
RP-SMA
RP-SMA
Gain
2.3dBi
3.6dBi
Dimension
See measurements in the drawing after this table
Part Number
ANT-DB1-RAF-RPS
D i m e n s i on s
Note: Dimensions are provided for reference purposes only. The actual antenna might vary.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Antenna Specification: 802.11b/g antenna
Attributes
Attribute
Property
Frequency
2.4 ~ 2.5GHz
Power Output
2W
DB Gain
2dBi
VSWR
< or = 2.0
Dimension
108.5 mm % 10.0mm
Weight
10.5g
Temperature Rating
-40 °to +80° C
Part Number
DG-ANT-20DP-BG
D i m e n s i on s
Note: Dimensions are provided for reference purposes only. The actual antenna might vary.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Ethernet 1

Standard:
IEEE 802.3/802.3u

Physical layer:
10/100Base

Data rate:
10/100 Mbps

Mode:
Full or half duplex
Ethernet 2

Standard:
IEEE 802.3/802.3u

Physical layer:
10/100Base

Data rate:
10/100 Mbps

Mode:
Full or half duplex
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
WLAN
Stan dar d
IEEE
802.11a/b/g/e/i/h/j standards
Single-stream
IEEE 802.11n
Frequency Band
2.400
- 2.500 GHz ( Low Band )
4.900
- 5.850 GHz ( High Band )
Data Rates
802.11n
:6.5, 13, 19.5, 26, 39,52 , 58.5, 65 Mbps
802.11a/g
:6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b
:1, 2, 5.5, 11 Mbps
Media Access Control
Dynamic
selection of fragment threshold, data rate and antenna depending on the
channel statistics
WPA,
WPA2 and WMM support
W i r e le s s M e d i u m
802.11b/g
: Direct Sequence-Spread Spectrum ( DSSS ) and Orthogonal Frequency
Divisional Multiplexing ( OFDM )
802.11a/n
: OFDM
DFS Cli ent
This
module supports the DFS Client only between 5.25 and 5.35GHz bands. It does
not support being DFS Master, or can it be connected to an Ad hoc network in these
bands.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Modulati on DSSS
Differential
Binary Shift Keying ( DBPSK ) @ 1 Mbps
Differential
Quadrature Phase Shift Keying ( DQPSK ) @2 Mbps
Complementary
Code Keying ( CCK ) @ 5.5 Mbps and 11 Mbps
BPSK
@ 6 and 9 Mbps
QPSK
@ 12 and 18 Mbps
16-Quadrature
64-QAM
Amplitude Modulation ( QAM ) @24 and 36 Mbps
@ 48 and 54 Mbps
Frequency Bands
2.412
to 2.472 GHz ( ETSI )
2.412
to 2.462 GHz ( FCC )
5.150
to 5.250 GHz ( ETSI ) ISM Band 1
5.250
to 5.350 GHz ( ETSI ) ISM Band 2 excluding TPC and DFS Client
5.470
to 5.725 GHz ( ETSI ) ISM Band 3 excluding TPC and DFS Client
5.150
to 5.250 GHz ( U-NII-1 )
5.250
to 5.350 GHz ( U-NII-2 )
5.470
to 5.725 GHz ( U-NII Worldwide )
5.725
to 5.825 GHz ( U-NII-3 )
A v a i l a b l e T r a n s m i t P o w e r S e t t i n g s ( Ty pic a l + - ( 2 dBm )@ 25 ° C)
( Maximum power settings will vary according to individual country regulations. )
IEEE
802.11b ( ~16mW ETSI ) ( ~37mW FCC 15.247 ) 
@ 1, 2, 5.5 and 11 Mbps
IEEE
802.11g ( ~ 10mW ETSI ) ( ~72mW FCC 15.247 )
@ 6, 12, 18, 24, 36 and 54Mbps
IEEE
802.11n 2.4GHz Band ( ~12.5mW ETSI ) ( ~83mW FCC 15.247 )
IEEE
802.11a & IEEE 802.11n
( ~15mW ETSI )
( 5.150 to 5.250 GHz ~17mW FCC 15.407 )
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
( 5.250 to 5.350 GHz ~17mW FCC 15.407 )
( 5.470 to 5.725 GHz ~22mW FCC 15.407 )
( 5.725 to 5.850 GHz ~28mW FCC 15.247 )
@ 6, 12, 18, 24, 36 and 54Mbps and
@ 6.5, 13, 19.5, 26, 39,52 , 58.5, 65 Mbps
R e c e i v e S e n s i ti v i t y
Data Rate (bg Mode)
Typical Sensitivity (+ / - 1.5 dBm)
1 Mbps
-94.0 dBm (< 8% PER)
2 Mbps
-89.0 dBm (< 8% PER)
11 Mbps
-86.0 dBm (< 8% PER)
6 Mbps
-89.0 dBm (< 10% PER)
54 Mbps
-74.0 dBm (< 10% PER)
645Mbps
-71.0 dBm (< 10% PER)
Data Rate (a Mode)
Typical Sensitivity ( + / - 1.5 dBm)
6 Mbps
-88.0 dBm (< 10% PER)
54 Mbps
-72.0 dBm (< 10% PER)
Data Rate (bg Mode)
Typical Sensitivity (+ / - 1.5 dBm)
65 Mbps
-69.0 dBm (< 10% PER)
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
Electrical Characteristics
Supply Voltages
Parameter
Symbol
Min
Typ
Max
Unit
Battery Input
VLIO
3.4
3.7
4.8
Charger Input
VCHRG
3.4
20
Coin cell Input for RTC
VCC_COINCELL
2.5
3.6
Supply Current
The following table provides current draw guidance utilizing the power management
capabilities of the module. The module variant used for the measurements works at 800MHz,
with 512 MB NAND Flach, 512 MB DDR2, dual Ethernet, WLAN, and accelerometer. A Windows
Embedded CE kernel with power management capabilities has been used to make the current
consumption measurements. A different kernel (Linux or Windows CE) with a different driver
configuration will show different current consumption values.
The ConnectCore for 1.MX51 module can be powered from an external battery (VLIO) or from
a battery charger (VCHRG). Current drawn by the modules is different depending on the
supply voltage used. The following tables show the current drawn by the module from the
two power supplies.
The current drawn by the module is highly dependent on the number and type of interfaces
used. To make some current measurements three different interface configurations have
been defined:
Interface Configuration
Interfaces Used
Minimum
Console, Ethernet.
+3.3V of development board drawn from external power supply.
Typical
VGA, USB Host (two devices connected), Audio, Ethernet, Console.
+3.3V of development board drawn from module.
Maximum
Display1, Display2, Camera1, Camera2, USB OTG, USB Host (four devices
connected), Audio, Ethernet, Console, WLAN, SD Card, microSDTM Card.
+3.3V of development board drawn from module.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
The ConnectCore for 1.MX51 supports several power modes. The current drawn by the
module is highly dependent on the power modes. To make some current measurements five
different power modes have been defined:
Interface Configuration
Interfaces Used
Full Load
System running at 100% CPU load.
Normal
Normal operating state. User interacting with the device.
User Idle
After a long period of user inactivity some devices are turned off.
System Idle
In this state the user is not using the system, even passively, and devices that are
not actively doing work are turned off.
Suspend
This is the sleep state, no threads are running, the CPU is idle, the peripherals are
turned off, and the system can wake up only by means of hardware wake-source
interrupt.
The tables below show the current drawn by the module for the different power modes and
the different interface configurations.
Curre nt me as u re me n t in M i n i m um c o n f i g u r a t i on
Power Mode
Power Supply
Current Draw
Full load
+3.7V Battery
700mA
+5V supply to charger
680mA
+3.7V Battery
420mA
+5V supply to charger
410mA
+3.7V Battery
420mA
+5V supply to charger
410mA
+3.7V Battery
380mA
+5V supply to charger
390mA
+3.7V Battery
145mA
+5V supply to charger
170mA
ON
User Idle
System Idle
Suspend
© 2010 Digi International, Inc.
Comments
131
ConnectCore f or i .M X 5 1
Cu r r e n t m e a s u r e m e n t i n Ty p i c a l c on f i g u r a ti on
Power Mode
Power Supply
Current Draw
Full load
+3.7V Battery
1450mA
+5V supply to charger
1250mA
+3.7V Battery
1150mA
+5V supply to charger
950mA
+3.7V Battery
1075mA
+5V supply to charger
890mA
+3.7V Battery
350mA
+5V supply to charger
350mA
+3.7V Battery
145mA
+5V supply to charger
170mA
ON
User Idle
System Idle
Suspend
Comments
C u r r e n t m e a s u r e m e n t i n M a x i m u m c o n fi g u r a t i o n
Power Mode
Power Supply
Current Draw
Full load
+3.7V Battery
2100mA
+5V supply to charger
1850mA
+3.7V Battery
1900mA
+5V supply to charger
1700mA
+3.7V Battery
1800mA
+5V supply to charger
1650mA
+3.7V Battery
1600mA
+5V supply to charger
1250mA
+3.7V Battery
420mA
+5V supply to charger
490mA
ON
User Idle
System Idle
Suspend
© 2010 Digi International, Inc.
Comments
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ConnectCore f or i .M X 5 1
On-Module Power Supplies
The following table provides the on-module power supplies available in the module
connectors, used to supply the components integrated on a customer baseboard.
Supply
Source
Output Voltage
Load Capacity
Comments
+2.775V
PMIC
VIOHI LDO
+2.775V
100mA max
Used on module to power IPU, Peripheral
interfaces, Accelerometer, I2C, and
bootstraps
+1.8V
PMIC
Buick Switcher
+1.8V
800mA max
Used on module to power EMI, JTAG and
boot configuration
+3.3V
DC/DC
Converter
+3.3V
1A max
Used on module to power WLAN,
Ethernet and MII PHY
+3.15V
PMIC
VGEN2 LDO
+3.15V
350mA maz
Used on module to power NAND Flash
SD1 and fuse interface
SWBST
PMIC +5V
Boot Switcher
+5V
300mA max
I/O DC Parameters
This section includes the DC parameters of the following I/O types:
General
Low
Purpose I/O and High-Speed General Purpose I/O (GPIOxx/HSGPIOxx)
Voltage I/O (LVIO)
Ultra
High Voltage I/O (UHVIOxx)
WLAN
PMIC_GPO,
PMIC_PWRON, PMIC_STDBY, PMIC_INT, PMIC_PWDRV, PMIC_SE,
PMIC_CHRGLED, and PMIC_LED
Ethernet
Analog
ADC
(ETH)
RGB
subsystem (ADIN)
Digital
and analog USB (DIG_USB, AN)USB)
The I/O type associated to each I/O signal of the module is shown in the paragraph “Module
Pinout” of Chapter 1.
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
The following table shows the General Purpose I/O and High-Speed General Purpose I/O
(GPIOxx/HSGPIOxx) DC parameters. The “xx” reference signifies the supply voltage level.
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VDD
xx = 18
xx = 27
xx = 33
1.65
2.5
3.0
1.8
2.775
3.3
1.95
3.1
3.6
Voh
(Vol USB)
VDD-0.15
VDD-0.43
VDD+0.3
VDD+0.3
Vol
(Vol USB)
--
0.15
0.43
High-level output voltage
Low-level output voltage
High-level output current
Low-level output current
Ioh
- Low drive
- Medium drive
- High drive
- Max drive
-1.9
-3.7
-5.2
-5.6
Iol
- Low drive
- Medium drive
- High drive
- Max drive
1.9
3.7
5.2
5.6
mA
mA
High-level input voltage
VIH
0.7 x VDD
VDD
Low-level input voltage
VIL
0.3 x VDD
Input Current (no/pull)
Iin
µA
Input Current (22kΩ/pull-up)
Iin
161
µA
Input Current (47kΩ/pull-up)
Iin
76
µA
Input Current (100kΩ/pull-up)
Iin
36
µA
Input Current (100kΩ/pull-down)
Iin
36
µA
Keeper circuit resistance
17
kΩ
Output driver impedance
Rout
- Low drive
- Medium drive
- High drive
- Max drive
80
40
27
20
104
52
35
26
250
125
83
62
© 2010 Digi International, Inc.
Ω
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ConnectCore f or i .M X 5 1
The following table shows the LVIO DC parameters.
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VDD
1.65
1.8
1.95
High-level output voltage
Voh
VDD-0.15
Low-level output voltage
Vol
0.15
High-level output current
Ioh
- Low drive
- Medium drive
- High drive
- Max drive
-2.1
-4.2
-6.3
-8.4
Iol
- Low drive
- Medium drive
- High drive
- Max drive
2.1
4.2
6.3
8.4
Low-level output current
mA
mA
High-level input voltage
VIH
0.7 x VDD
VDD
Low-level input voltage
VIL
0.3 x VDD
Input Current (no/pull)
Iin
µA
Input Current (22kΩ/pull-up)
Iin
161
µA
Input Current (47kΩ/pull-up)
Iin
76
µA
Input Current (100kΩ/pull-up)
Iin
36
µA
Input Current (100kΩ/pull-down)
Iin
36
µA
Keeper circuit resistance
17
kΩ
Output driver impedance
Rout
- Low drive
- Medium drive
- High drive
- Max drive
80
40
27
20
150
75
51
38
250
125
83
62
© 2010 Digi International, Inc.
Ω
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ConnectCore f or i .M X 5 1
The following table shows the Ultra-High Voltage I/O (UHVIOxx) DC parameters. The “xx”
reference signifies the supply voltage level.
Parameter
Symbol
Supply Voltage
VDD
xx = 31
xx = 33
Min
Typ
Max
Unit
3.0
3.0
3.15
3.3
3.6
3.6
High-level output voltage
Voh
(USB, WLAN)
VDD-0.15
VDD-0.43
VDD-0.15
VDD-0.43
Low-level output voltage
Vol
(USB, WLAN)
0.15
0.43
--
Ioh
- Low drive
- Medium drive
- High drive
-5.1
-10.2
-15.3
Iol
- Low drive
- Medium drive
- High drive
5.1
10.2
15.3
High-level output current
Low-level output current
mA
mA
High-level input voltage
VIH
0.7 x VDD
VDD
Low-level input voltage
VIL
0.3 x VDD
Input Current (no/pull)
Iin
10
µA
Input Current (22kΩ/pull-up)
Iin
202
µA
Input Current (75kΩ/pull-up)
Iin
61
µA
Input Current (100kΩ/pull-up)
Iin
47
µA
Input Current (360kΩ/pull-down)
Iin
5.7
µA
Keeper circuit resistance
17
kΩ
Output driver impedance
Rout
- Low drive
- Medium drive
- High drive
114
57
38
135
67
45
206
103
69
Ω
© 2010 Digi International, Inc.
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ConnectCore f or i .M X 5 1
The following table shows the WLAN DC parameters.
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VDD
3.0
3.3
3.6
High-level output voltage
Voh
2.4
VDD
Low-level output voltage
Vol
0.4
High-level input voltage
VIH
5.5
Low-level input voltage
VIL
-0.3
0.8
Input Leakage Current
I1K
10
µA
Min
Typ
Max
Unit
The following table shows the PMIC_GPO DC parameters.
Parameter
Symbol
Supply Voltage
VDD
2.5
2.775
3.1
High-level output voltage
Voh
VDD-0.2
VDD
Low-level output voltage
Vol
0.2
Output driver impedance
Rout
200
500
Ω
Min
Typ
Max
Unit
The following table shows teh PMIC_PWRON DC parameters.
Parameter
Symbol
Supply Voltage
VDD
1.5
3.1
High-level input voltage
Vih
VDD
Low-level input voltage
Vil
0.3
Input pull-up impedance
Rup
200
kΩ
Min
Typ
Max
Unit
The following table shows the PMIC_STDBY DC parameters.
Parameter
Symbol
High-level output voltage
Voh
3.6
Low-level output voltage
Vol
0.3
Input pull-down impedance
Rdw
36
MΩ
© 2010 Digi International, Inc.
137
ConnectCore f or i .M X 5 1
The following table shows the PMIC_INT DC parameters.
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VDD
2.5
2.775
3.1
High-level output voltage
Voh
VDD-0.2
VDD
Low-level output voltage
Vol
0.2
Output driver impedance
Rout
200
500
Ω
The following table shows the PMIC_PWGTDRV DC parameters.
Parameter
Symbol
Min
Typ
Max
Unit
High-level output voltage
Voh
5.4
5.4
Low-level output voltage
Vol
0.1
Load Current
Iout
100
nA
Min
Typ
Max
Unit
21
mA
Min
Typ
Max
Unit
The following table shows the PMIC_LED DC parameters.
Parameter
Symbol
Input current
Iled
The following table shows the PMIC_SE DC parameters.
Parameter
Symbol
Supply Voltage
VDD
2.5
2.775
3.1
High-level output voltage
Voh
VDD
Low-level output voltage
Vol
0.3
Input pull-up impedance
Rup
100
kΩ
The following table shows the Ethernet DC parameters.
Parameter
Symbol
Min
Typ
Max
Unit
Differential Output Voltage High
100BASE-Tx
Vpph
950
1050
mV
Differential Output Voltage Low
100BASE-Tx
Vppl
-950
-1050
mV
© 2010 Digi International, Inc.
138
ConnectCore f or i .M X 5 1
Parameter
Symbol
Min
Typ
Max
Unit
Tx Differential Output Voltage
10BASE-T
Vout
2.2
2.5
2.8
Rx Differential Squelch Threshold
10BASE-T
Vds
300
420
585
mV
The following table shows the Analog RGB DC parameters.
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VDD
2.69
2.75
2.91
The following table shows the DC parameter of the ADC subsystem. The ADC subsystem is
used by the touch interface and by the three analog input signals (ADIN).
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage range
VI
2.4
Input Buffer offset
Voff
-5
mV
Conversion Current
Iin
mA
Source Impedance
Rin
kΩ
The following table shows the DC parameter of the digital USB.
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
VDD
2.25
2.5
2.75
High-level output voltage
Voh
VDD-0-.43
VDD
Low-level output voltage
Vol
0.43
High-level input voltage
VIH
0.7 x VDD
VDD
Low-level input voltage
VIL
0.3 x VDD
Current consumption
22
mA
The following table shows the DC parameter of the Analog USB.
Parameter
Symbol
Supply Voltage
VDD
Current consumption
© 2010 Digi International, Inc.
Min
Typ
Max
Unit
3.0
3.3
3.6
mA
139
Module Dimensions
his appendix shows the dimensions of the ConnectCore for i.MX51 module, dimensions
are in millimeters.
© 2010 Digi International, Inc.
140
ConnectCore f or i .M X 5 1
Top View
© 2010 Digi International, Inc.
141
ConnectCore f or i .M X 5 1
Bottom View
© 2010 Digi International, Inc.
142
ConnectCore f or i .M X 5 1
Side View
Connectors
The ConnectCore for i.MX51 module uses two Berg/FCI connectors. The following table shows
the reference number of the connectors used in the module and the reference number of the
connectors used in the development board. The mated height of the module and the
development board is 5mm.
Device
Berg/FCI Connector
ConnectCore for i.MX51 module
61082-181409LF
ConnectCore for i.MX51 development board
61083-184409LF
© 2010 Digi International, Inc.
143
Certifications
he ConnectCore for i.MX51 product complies with the following standards.
FCC Part 15 Class B
Radio Frequency Interface (RFI) (FCC 15.105)
The ConnectCore for i.MX51 module has been tested and found to comply with the limits for
Class B digital devices pursuant to Part 15 Subpart B, of the FCC rules. These limits are
designed to provide reasonable protection against harmful interference in a residential
environment. This equipment generates, uses, and can radiate radio frequency energy, and
if not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try and correct the interference by one or more of the
following measures:
Reorient
or relocate the receiving antenna.
Increase
the separation between the equipment and receiver.
Connect
the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult
the dealer or an experienced radio/TV technician for help.
Labeling Requirements (FCC 15.19)
This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
If the FCC ID is not visible when installed inside another device, then the outside of the
device into which the module is installed must also display a label referring to the enclosed
© 2010 Digi International, Inc.
144
ConnectCore W i‐ i .M X 5 1
module FCC ID. THis exterior label can use wording such as the following: “Contains
Transmitter Module FCC ID: MCQ-50M1699/ IC: 1846A-50M1699”.
RF Exposure
RF Exposure considerations require that a 20 cm separation distance between users and the
installed antenna location shall be maintained at all times when the module is energized.
OEM installers must consider suitable module and antenna installation locations in order to
assure this in 20cm separation, and end users be also be advised to the requirement.
Modifications (FCC 15.21)
Changes or modifications to this equipment not expressly approved by Digi may void the
user’s authority to operate this equipment.
Industry Canada
This digital apparatus does not exceed the Class B limits for radio noise emissions from digital
apparatus set out in the Radio Interference Regulations of the Canadian Department of
Communications.
Le present appareil numerique n’emet pas de bruits radioelectriques depassant les limites
applicables aux appareils numeriques de la class B prescrites dans le Reglement sur le
brouillage radioelectrique edicte par le ministere des Communications du Canada.
The maximum antenna gain permitted in the bands 5250-5350 MHz and 5470-5725 MHz to
comply with the e.i.r.p limit is, according to RSS-210 section A9.2(2)
250mW
1.0W
conducted power
max EIRP

This limit is met with the highest gain antenna listed, antennafactor ANT-DB1-RAF-RPS.
The maximum antenna gain permitted in the band 5725-5825 MHz to comply with the e.i.r.p
limit specified for non point-to-point operation is, according to RSS-210 section A9.2(3):
1W
conducted power
4.0W
max EIRP
This limit is met with the highest gain antenna listed,antennafactor ANT-DB1-RAF-RPS.
OEM installers and users are cautioned to take note that high-power radars are allocated as
primary users (meaning they have priority) of the bands 5250-5330 MHz and 5650-5850 MHz
and these radars could cause interference and /or damage to devices operating in these
frequency bands.
© 2010 Digi International, Inc..
145
ConnectCore W i‐ i .M X 5 1
Indoor/Outdoor
When the ConnectCore for i.MX51 module is installed in devices that can be used outdoors,
the channels in the band 5150-5250 MHz must be disabled to comply with US and Canadian
regulatory requirements. The OEM users are encouraged to inform end users of this
restriction as well.
Declaration of Conformity
(In accordance with FCC Dockets 96-208 and 95-19)
Manufacturer’s Name:
Digi International
Corporate Headquarters:
11001 Bren Road East
Minnetonka MN 55343
Manufacturing Headquarters:
10000 West 76th Street
Eden Prairie MN 55344
Digi International declares that the product:
Product Name
ConnectCore for i.MX51
Model Number:
50001699-xx
to which this declaration relates, meets the requirements specified by the Federal
Communications Commission as detailed in the following specifications:
Part
15, Subpart B, for Class B equipment
FCC
Docket 96-208 as it applies to Class B personal
Personal
computers and peripherals
The product listed above has been tested at an External Test Laboratory certified per FCC
rules and has been found to meet the FCC, Part 15, Class B, Emission Limits. Documentation
is on file and available from the Digi International Homologation Department.
© 2010 Digi International, Inc..
146
ConnectCore W i‐ i .M X 5 1
International EMC Standards
The ConnectCore for i.MX51 meets the following standards:
Standards
Emissions
ConnectCore for i.MX51
FCC Part 15 Subpart B
IS-003
Immunity
EN 55022
EN 55024
Safety
UL 60950-1
CSA C22.2, No. 60950-1
EN 60950-1
© 2010 Digi International, Inc..
147
Change Log
he following changes were made to this document in the revisions listed below.
Revision A
Initial
release.
Revision B
Updated
mechanical drawings (additional mounting holes, increased height of WLAN 
variant).
Revision C
Updated
document structure.
Updated
"About the module" chapter.
Updated
"About the Development board" chapter.
Updated
"module specifications" appendix.
Updated
mechanical drawings.
Updated
module pinout tables.
Updated
“power” section.
Updated
GPIO table.
Updated
development board figures.
Updated
“Switches and push-buttons,” “Jumper,” and “LEDs” sections.
Updated
development board interfaces.
Updated
several sub-sections to Appendix A.
Revision D
Added
electrical characteristics.
Updated
© 2010 Digi International, Inc.
the figures in Appendix B.
148
ConnectCore W i‐ i .M X 5 1
Renamed
“Appendix C: Change Log” to “Appendix D: Change Log.”
Added
Appendix C: Certifications.
Added
the Cable Specification: U.FL/W.FL to Chapter 2.
Added
the Antenna specifications: 802.11 a/b/g antenna and Antenna specifications:
802.11 b/g antenna sections to Appendix A.
Added
© 2010 Digi International, Inc..
several sub-sections to the WLAN section of Appendix A.
149

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